KR20090030227A - Light emitting element or display element, and method of manufacturing the same - Google Patents

Abstract

A light emitting element or display element, and method of manufacturing the same are provided to easily perform the etching operation by performing etching after adhering the film to the glass substrates. The resin film or the resin layer(1) has the circular polarized light function. The resin film or the resin layer has the light diffusion function. The thickness of the glass substrates(2) is 100mum ~ 300mum. The bonding layer is formed between the light emitted diode laminate or the display device laminate(3), and the gas barrier film(4). The gas barrier film has the adhesive layer. The bonding layer is formed between the resin film and glass substrates. the thickness of the resin film or the resin layer is10mum ~ 1000mum. It is.

Description

LIGHT EMITTING ELEMENT OR DISPLAY ELEMENT, AND METHOD OF MANUFACTURING THE SAME

The present invention relates to a light emitting element or a display element and a method of manufacturing the same.

Conventionally, using a glass substrate and a gas barrier film for organic electroluminescent element is examined. For example, JP 2004-79432 A describes the use of a transparent gas barrier film using ultra-thin glass and a transparent resin layer as a sealing material for an organic EL device. Moreover, Unexamined-Japanese-Patent No. 2005-63976 describes the organic electroluminescent element which has a glass substrate and a panel protective film. Such an organic EL device prevents the ingress of moisture to the device by the cap.

However, when using a glass substrate, there exists a problem of being fragile. Moreover, when it is hard to be broken, it is necessary to thicken a glass substrate, and there exists a problem that the thickness of an element will become thick. In addition, as in JP 2005-63976 A, when a cap is used, a space is created between the light emitting device laminate or the display device laminate. This space also increases the thickness of the device. In addition, as an attempt to manufacture an element without using a glass substrate, it is also considered to substitute a gas barrier film without using a glass substrate, but there is a problem that dimensional accuracy deteriorates at the manufacturing stage of the element.

This invention aims at solving the said subject, Comprising: It aims at providing the light emitting element or display element which uses a glass substrate and is thin and hard to break.

As a result of earnestly examining by the present inventors under the said subject, it discovered that the said subject could be solved by the following means.

(1) A light emitting element or display element having a resin film or a resin layer, a glass substrate, a light emitting device laminate or a display device laminate, and a gas barrier film in that order.

(2) The light emitting element or display element according to (1), wherein the resin film or the resin layer has a circularly polarized light function.

(3) The light emitting element or display element according to (1), wherein the resin film or the resin layer has a light diffusing function.

(4) The light emitting element or display element according to any one of (1) to (3), wherein the glass substrate has a thickness of 100 µm to 300 µm.

(5) The light emitting element or display element according to any one of (1) to (4), which has an adhesive layer between the light emitting device laminate or the display device laminate and the gas barrier film.

(6) The light emitting element or display element according to any one of (1) to (5), wherein the gas barrier film has an adhesive layer.

(7) The light emitting element or display element according to any one of (1) to (6), which has an adhesive layer between the resin film and the glass substrate.

(8) The light emitting element or display element according to any one of (1) to (7), wherein the thickness of the resin film or the resin layer is 10 µm to 1000 µm.

(9) The light emitting element or display element according to any one of (1) to (8), having a smooth layer between the glass substrate and the light emitting device laminate or the display device laminate.

The light emitting element or display element in any one of (1)-(9) whose thickness of the said smooth layer is 0.5 micrometer-10 micrometers.

The light emitting element or display element in any one of (1)-(10) whose thickness variation of a glass substrate is 100 micrometers or less.

(12) The light emitting element or display element according to any one of (1) to (11), wherein the gas barrier film has at least one organic region and at least one inorganic region on the base film.

(13) The method for manufacturing the light emitting element or display element according to any one of (1) to (12), wherein the light emitting device laminate or the display device laminate is etched after the resin film and the glass substrate are attached. The manufacturing method characterized by the above-mentioned.

(14) The light emitting element or display element manufactured by the manufacturing method of (13).

The light emitting element or display element is a light emitting display element or display element as described in (1)-(12), (14) which is organic electroluminescent element.

According to the present invention, it has become possible to provide a thin and hard-to-break light emitting device or display device.

In particular, in the present invention, since the etching can be performed after the film is attached to the glass substrate, the etching operation becomes easy. That is, when the etching is to be performed on the glass substrate alone, since the glass substrate is easily broken, it is necessary to perform the etching precisely and carefully, but there is no such problem in the present invention. In addition, in the case of etching after assembling the device to some extent, it is easy to etch in the state of an empty cell like a liquid crystal display device, but an element that can be etched only after forming a light emitting device laminate like an organic EL element. In the case of, the light emitting device laminate is deteriorated, so there is also a problem of etching after assembling the device to some extent. The present invention is very useful in that both of these problems can be avoided.

EMBODIMENT OF THE INVENTION Below, the content of this invention is demonstrated in detail. In addition, in this specification, "-" is used by the meaning containing this as a lower limit and an upper limit of the numerical value described before and after. In addition, the organic electroluminescent element in this invention means an organic electroluminescent element.

`` Composition Layers and Materials of Light-Emitting Elements or Display Elements ''

The light emitting element or display element of this invention has a resin film or a resin layer, a glass substrate, a light emitting device laminated body or a display device laminated body, and a gas barrier film in that order. EMBODIMENT OF THE INVENTION Hereinafter, the light emitting element or display element of this invention is demonstrated according to drawing. It goes without saying that the light emitting element or display element of the present invention is not limited thereto.

1 is a schematic view of a light emitting device or a display device of the present invention, where 1 is a resin film or a resin layer, 2 is a glass substrate, 3 is a light emitting device laminate or a display device laminate, and 4 is a gas barrier. Each film is shown.

In the present invention, since the resin film or the resin layer 1 and the glass substrate 2 are used in combination, even if the glass substrate is made thin, they are not easily broken in operations such as etching. Moreover, by using the gas barrier film 4 as a sealing material, the thickness of an element can be made thinner than sealing using a cap etc. Here, the light emitting device laminate or the display device laminate is a portion which forms the core of the light emitting element or the display element, and is usually a laminate comprising a pair of electrode layers and an organic compound layer formed between the electrode layers.

The light emitting element or display element in this invention may have a structural layer of that excepting the above, for example, between the light emitting device laminated body or the display device laminated body 3, and the gas barrier film 4, and / or resin The structure which has an adhesive layer between a film and the glass substrate 2 is mentioned. Under the present circumstances, when the adhesive layer is formed as a gas barrier film or a resin film, since a manufacturing process is simplified, it is preferable. Moreover, it is also preferable to form a smooth layer between the glass substrate 2 and the light emitting device laminated body or the display device laminated body 3. It is also preferable to form a passivation layer between the light emitting device laminate or the display device laminate 3 and the gas barrier film 4.

(Resin film or resin layer)

The resin film or resin layer in this invention has resin as a main component, may be a film-shaped thing, may apply | coat a resin composition, etc., and may form a layered thing. Although the material of a resin film or a resin layer is not specifically determined, For example, polyester resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, a transparent fluororesin, a polyimide resin, a fluorinated polyimide resin, poly Amide resin, polyamideimide resin, polyetherimide resin, cellulose acylate resin, polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyarylate resin, polyether sulfone resin, polysulfone number Thermo or photocurable resins, such as a thermoplastic resin, such as a paper, cycloolefin copolymer, a fluorene ring modified polycarbonate resin, an alicyclic modified polycarbonate resin, and an acryloyl compound, an acrylic resin, and an epoxy resin, etc. are mentioned. Moreover, in the case of a bottom emission type light emitting element or a display element, a resin film or a resin layer needs to be transparent, but in the case of a top emission type light emitting element or a display element, it is not necessary to be transparent.

Although the thickness of a resin film or a resin layer is not specifically determined, 10 micrometers-1000 micrometers are preferable, and 20 micrometers-200 micrometers are more preferable.

The resin film or the resin layer in the present invention may have a circularly polarized light function or a light diffusion function. By setting it as such a structure, thickness of an element can be made thinner than the case where it is set as a light emitting element or a display element of a bottom emission type. Here, in order to give a circularly polarized light function or a light-diffusion function, the method described in Unexamined-Japanese-Patent No. 8-321381, Unexamined-Japanese-Patent No. 9-127885, Unexamined-Japanese-Patent No. 7-142170, etc. is carried out, for example. It can be adopted.

(Glass substrate)

As the glass substrate in this invention, the glass substrate used for a display element or a light emitting element can be employ | adopted widely. In this invention, even if the thickness of a glass substrate is made thin by using together with a resin film or a resin layer, a glass substrate can be prevented from being easily broken. In particular, when the resin film or the resin layer and the glass substrate are attached and then etched, they are not easily broken even during etching, so that the production can be facilitated and only one side can be etched, so that the thickness variation of the glass substrate can be reduced. For example, in this invention, the thickness variation of a glass substrate can be 100 micrometers or less, and can also be 50 micrometers or less. It is preferable that thickness variation is 50% or less of average thickness.

The thickness of a glass substrate can be 100 micrometers-300 micrometers, for example, and can also be 100 micrometers-200 micrometers.

(Gas barrier film)

The gas barrier film in this invention is a film which has a barrier layer which has a function which interrupt | blocks oxygen and moisture in air | atmosphere. The barrier layer in the present invention may be any layer as long as it is a layer known to have gas barrier capability, but is preferably an organic inorganic laminated type in which an organic region and an inorganic region or an organic layer and an inorganic layer are laminated on each other. Hereinafter, the film which has an organic-inorganic laminated type barrier layer which laminated | stacked the organic area | region and the inorganic area | region, or the organic layer and the inorganic layer, may be called "organic inorganic laminated type gas barrier film."

The organic region and the inorganic region or the organic layer and the inorganic layer are usually laminated alternately. When comprised with an organic area | region and an inorganic area | region, what is called a gradient material layer which changes continuously in the film thickness direction may be sufficient. Examples of the warp material include a paper by Kim et al., Journal of Vacuum Science and Technology A Vol. 23 p971-977 (2005 American Vacuum Society) Journal of Vacuum Science and Technology A, Vol. 23, pp. 971-977 (published in 2005, American Vacuum Society), or published in US Patent Publication 2004-46497. As mentioned above, the continuous layer etc. which an organic layer and an inorganic layer do not have an interface are mentioned. For the sake of simplicity, the organic layer and the organic region are referred to as "organic layers" and the inorganic layer and inorganic region are referred to as "inorganic layers".

Although there is no restriction | limiting in particular about the number of layers which comprise a gas barrier film, Typically, two to 30 layers are preferable, and three to 20 layers are more preferable. In addition, a barrier layer may be formed only in the single side | surface of a base film, and may be formed in both surfaces.

(Substrate film)

The gas barrier film in this invention uses a plastic film normally as a base film. The plastic film to be used is not particularly limited as long as it is a film capable of holding a laminate such as an organic layer or an inorganic layer, and can be appropriately selected depending on the purpose of use and the like. Specifically as the plastic film, polyester resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene resin, transparent fluorine resin, polyimide, fluorinated polyimide resin, polyamide resin, polyamideimide resin , Polyetherimide resin, cellulose acylate resin, polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyarylate resin, polyether sulfone resin, polysulfone resin, cycloolefin copolymer, flu Thermoplastic resins, such as an orene ring modified polycarbonate resin, an alicyclic modified polycarbonate resin, a fluorene ring modified polyester resin, and an acryloyl compound, are mentioned.

The gas barrier film of the present invention is preferably made of a material having heat resistance. Specifically, the glass transition temperature (Tg) is preferably made of a transparent material having high heat resistance at 100 ° C or higher and / or 40 ppm / ° C or lower. Tg and the linear thermal expansion coefficient can be adjusted with an additive etc. As such a thermoplastic resin, for example, polyethylene naphthalate (PEN: 120 degreeC), polycarbonate (PC: 140 degreeC), alicyclic polyolefin (for example, Zeonoa 1600: 160 degreeC by Nippon Xeon Co., Ltd.) , Polyarylate (PAr: 210 ° C), polyethersulfone (PES: 220 ° C), polysulfone (PSF: 190 ° C), cycloolefin copolymer (COC: compound of JP 2001-150584: 162 ° C) , Polyimide (for example, Mitsubishi Gas Chemical Co., Ltd. neoprem: 260 ° C), fluorene ring-modified polycarbonate (BCF-PC: compound of JP 2000-227603: 225 ° C), alicyclic modified polycarbonate (IP-PC: the compound of Unexamined-Japanese-Patent No. 2000-227603: 205 degreeC), and the acryloyl compound (The compound of Unexamined-Japanese-Patent No. 2002-80616: 300 degreeC or more) are mentioned (The parenthesis shows Tg). In particular, when transparency is required, it is preferable to use an alicyclic polyolefin or the like.

When using the gas barrier film of this invention in combination with a polarizing plate, it is preferable to make the barrier laminated body of a gas barrier film face inward of a cell, and to arrange | position the innermost (adjacent to an element). At this time, since the gas barrier film is disposed inside the cell rather than the polarizing plate, the retardation value of the gas barrier film becomes important. The use form of the gas barrier film in such an aspect laminates the gas barrier film and the circular polarizing plate (1/4 wavelength plate + (1/2 wavelength plate) + linear polarizing plate) using the base film whose retardation value is 10 nm or less. It is preferable to use a linear polarizing plate in combination with the gas barrier film using the base film whose retardation value is 100 nm-180 nm which can be used or it can be used as a quarter wavelength plate.

Examples of the base film having a retardation value of 10 nm or less include cellulose triacetate (Fuji Film Co., Ltd .: Fuji-Tac), polycarbonate (Teijin Chemical Co., Ltd .: Pure Ace, Kaneka: Elmek), cycloolefin polymer (JSR Co., Ltd .: Aton, Nippon Xeon Co., Ltd .: Zeonoa), cycloolefin copolymer (Mitsui Chemical Co., Ltd .: Apel (pellet), Polyplastic Co., Ltd .: Topas (pellet)), Polyarylate ( Unitika Co., Ltd .: U100 (pellet)), a transparent polyimide (Mitsubishi Gas Chemical Co., Ltd .: neoprem), etc. are mentioned.

Moreover, as a quarter wave plate, the film adjusted to the desired retardation value can be used by extending | stretching the said film suitably.

The gas barrier film of the present invention is transparent, that is, the light transmittance is usually 80% or more, preferably 85% or more, and more preferably 90% or more. The light transmittance can be calculated by subtracting the diffuse transmittance from the total light transmittance by measuring the total light transmittance and the amount of scattered light using the method described in JIS-K7105, that is, an integrated sphere light transmittance measuring apparatus.

Even when using the gas barrier film of this invention for a display use, transparency is not necessarily required when it is not installed in an observation side. Therefore, in such a case, an opaque material can also be used as a plastic film. Examples of the opaque material include polyimide, polyacrylonitrile, known liquid crystal polymers, and the like.

Since the thickness of the plastic film used for the gas barrier film of this invention is suitably selected according to a use, there is no suggestion in particular, but it is typically 1 micrometer-800 micrometers, Preferably it is 10 micrometers-200 micrometers. These plastic films may have functional layers, such as a transparent conductive layer and a primer layer. About a functional layer, Paragraph No. 0036 of Unexamined-Japanese-Patent No. 2006-289627-0038 are described in detail. Examples of functional layers other than these include a mat agent layer, a protective layer, an antistatic layer, a smoothing layer, an adhesion improving layer, a light shielding layer, an antireflection layer, a hard coat layer, a stress relaxation layer, an antifogging layer, an antifouling layer, a printed layer, I) an adhesive layer and the like.

(Inorganic layer)

The inorganic layer is usually a thin film layer made of a metal compound. The forming method of the inorganic layer can be used by any method as long as it is a method capable of forming a desired thin film. For example, a coating method, a sputtering method, a vacuum vapor deposition method, an ion plating method, a plasma CVD method, etc. are suitable, and specifically, it is disclosed by patent 3400324, Unexamined-Japanese-Patent No. 2002-322561, Unexamined-Japanese-Patent No. 2002-361774. The formation method as described in each publication can be employ | adopted.

The component contained in the inorganic layer is not particularly limited as long as it satisfies the above performance. For example, at least one metal selected from Si, Al, In, Sn, Zn, Ti, Cu, Ce, Ta, and the like is used. Oxides, nitrides, carbides, oxynitrides, oxidized carbides, nitrides, oxynitrides and the like can be used. Among these, oxides, nitrides or oxynitrides of metals selected from Si, Al, In, Sn, Zn and Ti are preferable, and metal oxides, nitrides or oxynitrides of Si or Al are particularly preferable. These may contain another element as a secondary component.

Although it does not specifically limit regarding the thickness of the said inorganic layer, It is preferable to exist in the range of 5 nm-500 nm, More preferably, it is 10 nm-200 nm. Moreover, you may laminate | stack two or more inorganic layers. In this case, each layer may be the same composition or a different composition may be sufficient as it. In addition, as described above, the interface with the organic layer is not clear as disclosed in US Patent Publication No. 2004-46497, and the layer may be a composition whose composition changes continuously in the film thickness direction.

(Organic layer)

In the present invention, the organic layer is usually a layer of a polymer. The organic layer may be formed by solution coating of a polymer or may be a hybrid coating method containing an inorganic substance as disclosed in JP-A-2000-323273 and JP-A-2004-25732. Moreover, you may form a polymer layer by polymerizing after depositing a precursor (for example, a monomer) of a polymer.

In the present invention, the polymer is preferably an organic layer composed of a polymer of a radical polymerizable compound and / or a cation polymerizable compound having an ether group as a functional group.

(Polymerizable compound)

The polymeric compound used by this invention is a compound which has an ethylenically unsaturated bond in a terminal or a side chain, and / or a compound which has an epoxy or oxetane in a terminal or a side chain. Among these, compounds having an ethylenically unsaturated bond at the terminal or side chain are preferred. As an example of the compound which has an ethylenically unsaturated bond in a terminal or a side chain, (meth) acrylate type compound (The acrylate and methacrylate are represented as (meth) acrylate), an acrylamide type compound, a styrene type compound, Maleic anhydride etc. are mentioned.

As a (meth) acrylate type compound, (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate, etc. are preferable.

As a styrene type compound, styrene, (alpha) -methylstyrene, 4-methylstyrene, divinylbenzene, 4-hydroxy styrene, 4-carboxy styrene, etc. are preferable.

Although the specific example of a (meth) acrylate type compound is shown below, this invention is not limited to these.

In addition to the above compounds, for example, the compounds described in US Patent No. 6083628 and US Patent No. 6214422 are also preferably used.

It is preferable that an organic layer is smooth and its film hardness is high. It is preferable that it is 10 nm or less, and, as for the smoothness of an organic layer, it is 10 nm or less as average roughness (Ra value) which is 10 micrometers in length and width, and it is more preferable. It is preferable to have hardness of HB or more as a pencil hardness, and, as for the film hardness of an organic layer, it is more preferable to have hardness of H or more.

Although it does not specifically limit about the film thickness of an organic layer, If it is too thin, it will become difficult to obtain uniformity of film thickness, If too thick, a crack will generate | occur | produce by external force and a barrier performance will fall. From this viewpoint, 10 nm-2000 nm are preferable and, as for the thickness of an organic layer, 100 nm-1000 nm are more preferable.

As a formation method of an organic layer, the conventional solution coating method, the vacuum film-forming method, etc. are mentioned. As the solution coating method, for example, the dip coating method, the air knife coating method, the curtain coating method, the roller coating method, the wire bar coating method, the gravure coating method, the slide coating method, or the hopper described in US Patent No. 2681294 It can apply | coat by the extrusion coat method which uses. Although it does not restrict | limit especially as a vacuum film-forming method, film-forming methods, such as vapor deposition and plasma CVD, are preferable.

Although it does not specifically limit as a monomer polymerization method, Heat polymerization, light (ultraviolet ray, visible ray) polymerization, electron beam polymerization, plasma polymerization, or a combination thereof is used preferably. In the case of carrying out the heat polymerization, the plastic film serving as the substrate needs to have a corresponding heat resistance. In this case, it is necessary that the glass transition temperature (Tg) of a plastic film is higher than at least heating temperature.

In the case of performing photopolymerization, a photoinitiator is used together. As an example of a photoinitiator, Irgacure series (for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907) marketed by Chiba Specialty Chemicals, Inc. , Irgacure 369, Irgacure 379, Irgacure 819, etc., Darocure series (e.g., Tarocure TPO, Tarocure 1173, etc.), Quantacure PD0, Satomer (Sartomer Ezacure series (for example, Ezacure TZM, Ezacure TZT, etc.) marketed by the company, etc. are mentioned.

The light to irradiate is ultraviolet-ray by a high pressure mercury lamp or a low pressure mercury lamp normally. 0.5J / cm <2> or more is preferable and 2J / cm <2> or more of irradiation energy is more preferable. Since acrylate and methacrylate are inhibited from polymerization by oxygen in the air, it is preferable to lower the oxygen concentration or oxygen partial pressure at the time of polymerization. When the oxygen concentration at the time of polymerization is reduced by the nitrogen substitution method, 2% or less is preferable and, as for oxygen concentration, 0.5% or less is more preferable. When the oxygen partial pressure at the time of polymerization is reduced by the pressure reduction method, it is preferable that voltage is 1000 Pa or less, and it is more preferable that it is 100 Pa or less. Moreover, it is especially preferable to perform ultraviolet-polymerization by irradiating an energy of 2J / cm <2> or more under the pressure reduction conditions of 100 Pa or less.

At this time, it is preferable that the polymerization rate of a monomer is 80% or more, It is more preferable that it is 85% or more, It is still more preferable that it is 90% or more. The polymerization rate here means the ratio of the polymerizable group which reacted among all the polymerizable groups (acryloyl group and methacryloyl group) in a monomer mixture.

(Adhesive layer)

An adhesive layer is a layer which has an adhesive as a main component, and it usually says that 70 weight% or more of an adhesive layer is an adhesive agent, and it is preferable that 80 weight%-90 weight% of an adhesive layer are adhesive agents.

As an adhesive agent, what is used as an adhesive agent of a light emitting element or a display element can be employ | adopted widely, Preferably it is an epoxy adhesive. Examples of the epoxy adhesive include thermosetting and ultraviolet curing. When a barrier film absorbs an ultraviolet-ray, thermosetting type is preferable. There are one-component and two-liquid mixture types in the thermosetting type, but both of them are preferably used in the present invention. In this invention, the adhesive which becomes colorless and transparent after hardening is preferable. As a commercial item, the Epotec series by Daizo Nichimori, the XNR-5000 series by Nagase Chemtex, the 3000 series by Three bond, etc. are mentioned.

Moreover, you may employ | adopt the gas barrier film with an adhesive layer in which the adhesive layer was formed in the surface of a gas barrier film. By employing such a gas barrier film, there is an advantage that the manufacturing process is simplified.

Although it does not specifically limit about the thickness of an adhesive layer, It is preferable that it is the range of 2 micrometers-100 micrometers, More preferably, it is 5 micrometers-20 micrometers.

(Smooth layer)

A smooth layer is a layer formed in order to smooth the surface, and can easily laminate | stack the next layer. As a smooth layer, the well-known thing used for a light emitting element and a display element can be employ | adopted. For example, it can form according to the manufacturing method of the primer coat layer of Paragraph No. 0011 of Unexamined-Japanese-Patent No. 2003-251731.

Although it does not specifically limit regarding the thickness of a smooth layer, It is preferable that it is the range of 0.5 micrometer-10 micrometers.

≪Display element or light emitting element≫

As a display element or light emitting element in this invention, a liquid crystal display element, an organic EL element, an inorganic EL element, a fluorescent display element, etc. are mentioned.

<Liquid crystal display element>

The reflective liquid crystal display device has a structure consisting of a lower substrate, a reflective electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, a transparent electrode, an upper substrate, a λ / 4 plate, and a polarizing film in order from the bottom. In the case of color display, it is preferable to further form a color filter layer between the reflective electrode and the lower alignment film, or between the upper alignment film and the transparent electrode.

The transmissive liquid crystal display device is composed of a backlight, a polarizing plate, a λ / 4 plate, a lower transparent electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, an upper transparent electrode, an upper substrate, a λ / 4 plate, and a polarizing film in order from the bottom. Has In the case of color display, it is preferable to further form a color filter layer between the lower transparent electrode and the lower alignment film, or between the upper alignment film and the upper transparent electrode.

Although the kind of liquid crystal cell is not specifically limited, More preferably, TN (Twisted Nematic) type, STN (Super Twisted Nematic) type, HAN (Hybrid Aligned Nematic) type, VA (Vertically Alignment) type, ECB (Electrically Controlled) It is preferable that it is a Birefringence type, 0CB (Optically Compensated Bend) type, CPA (Continuous Pinwheel Alignment) type, and IPS (In-Plane Switching) type.

<Touch panel>

The touch panel is applicable to those described in JP-A-5-127822, JP-A-2002-48913 and the like.

<Organic EL element>

An organic electroluminescent element means an organic electroluminescent element. The organic EL device has a cathode and an anode on the opposite side of the substrate on which the resin film or the resin layer is formed, and has an organic compound layer including a light emitting layer between both electrodes. At least one of the anode and the cathode is transparent in view of the nature of the light emitting element.

As an aspect of lamination of the organic compound layer in this invention, the aspect laminated | stacked in order of a positive hole transport layer, a light emitting layer, and an electron carrying layer at the anode side is preferable. In addition, a charge block layer or the like may be provided between the hole transporting layer and the light emitting layer, or between the light emitting layer and the electron transporting layer. A hole injection layer may be provided between the anode and the hole transport layer, and an electron injection layer may be provided between the cathode and the electron transport layer. In addition, only one layer may be sufficient as a light emitting layer, and a light emitting layer may be divided into a 1st light emitting layer, a 2nd light emitting layer, and a 3rd light emitting layer. In addition, each layer may be divided into a plurality of secondary layers.

(anode)

The anode usually has a function as an electrode for supplying holes to the organic compound layer, and the shape, structure, size, and the like thereof are not particularly limited, and may be appropriately selected from known electrode materials according to the use and purpose of the light emitting device. have. As described above, the anode is usually formed as a transparent anode. The transparent anode has detailed description in Sadada Yutaka Supervision "New Development of Transparent Electrode Film" CMC Publication (1999). When using a plastic base material with low heat resistance as a board | substrate, the transparent anode formed into a film at low temperature below 150 degreeC using ITO or IZO is preferable.

(cathode)

The cathode may have a function as an electrode which injects electrons into an organic compound layer normally, and there is no restriction | limiting in particular about the shape, structure, size, etc. According to the use and the objective of a light emitting element, it can select suitably from well-known electrode materials. have.

As a material which comprises a negative electrode, a metal, an alloy, a metal oxide, an electrically conductive compound, a mixture thereof, etc. are mentioned, for example. As a specific example, rare earth metals, such as a group 2 metal (for example, Mg, Ca etc.), gold, silver, lead, aluminum, a lithium-aluminum alloy, magnesium-silver alloy, indium, ytterbium, etc. are mentioned. Although these may be used individually by 1 type, 2 or more types can be used together suitably from a viewpoint of making stability and electron injection property compatible.

Among these, as a material which comprises a cathode, the material which mainly uses aluminum is preferable.

The material mainly composed of aluminum refers to aluminum alone, aluminum and 0.01% by mass to 10% by mass of an alkali metal or a Group 2 metal alloy (for example, lithium-aluminum alloy, magnesium-aluminum alloy, etc.). In addition, the material of a cathode is described in detail in Unexamined-Japanese-Patent No. 2-15595 and Unexamined-Japanese-Patent No. 5-121172. A dielectric layer made of a fluoride, an oxide, or the like of an alkali metal or a group 2 metal may be inserted between the cathode and the organic compound layer in a thickness of 0.1 nm to 5 nm. This dielectric layer may be regarded as a kind of electron injection layer.

Although the thickness of a negative electrode can be suitably selected with the material which comprises a negative electrode, Although it cannot specify collectively, it is usually about 10 nm-about 5 micrometers, and 50 nm-1 micrometer is preferable.

In addition, the cathode may be transparent or opaque. In addition, the transparent cathode can be formed by thinly forming a material of the cathode with a thickness of 1 nm to 10 nm, and laminating transparent conductive materials such as ITO and IZO.

(Organic compound layer)

The organic EL device has at least one organic compound layer including a light emitting layer, and as another organic compound layer other than the organic light emitting layer, as described above, a hole transport layer, an electron transport layer, a charge block layer, a hole injection layer, an electron injection layer Each layer, such as these, is mentioned.

((Organic Light Emitting Layer))

The organic light emitting layer has a function of receiving holes from an anode, a hole injection layer, or a hole transport layer when an electric field is applied, receiving electrons from a cathode, an electron injection layer, or an electron transport layer, and providing a recombination field of holes and electrons to emit light. to be. The light emitting layer may be comprised only with a luminescent material, and the structure made into the mixed layer of a host material and a luminescent material may be sufficient. The light emitting material may be a fluorescent light emitting material or a phosphorescent light emitting material, and one type or two or more types of dopants may be used. The host material is preferably a charge transport material. The host material may be one type or two or more types, and the structure which mixed the electron-transport host material and the hole-transport host material is mentioned, for example. Moreover, the light emitting layer may contain a material which does not have charge transportability and which does not emit light. In addition, one layer or two or more layers may be sufficient as a light emitting layer, and each layer may light-emit in a different light emission color.

Examples of the fluorescent light emitting material include benzoxazole derivatives, benzoimidazole derivatives, benzothiazole derivatives, styrylbenzene derivatives, polyphenyl derivatives, diphenylbutadiene derivatives, tetraphenylbutadiene derivatives and naphthalimide derivatives. , Coumarin derivatives, condensed aromatic compounds, perinone derivatives, oxadiazole derivatives, oxazine derivatives, aldazine derivatives, pyralidine derivatives, cyclopentadiene derivatives, bisstyrylanthracene derivatives, quinacridone derivatives, pyrrolopyridine derivatives , Various metal complexes represented by metal complexes of thiadiazol pyridine derivatives, cyclopentadiene derivatives, styrylamine derivatives, diketopyrrolopyrrole derivatives, aromatic dimethylidine compounds, 8-quinolinol derivatives or metal complexes of pyrromethene derivatives Polymer compounds, such as polythiophene, polyphenylene, polyphenylene vinylene, an organosilane derivative, etc. And compounds of the like.

Examples of the phosphorescent material include a complex containing a transition metal atom or a lanthanoid atom.

Although it does not specifically limit as said transition metal atom, Preferably, ruthenium, rhodium, palladium, tungsten, rhenium, osmium, iridium, and platinum are mentioned, More preferably, they are rhenium, iridium, and platinum.

Examples of the lanthanoid atoms include lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and ruthetium. Among these lanthanoid atoms, neodymium, europium and gadolinium are preferable.

As the ligand of the complex, for example, G. Wilkinson et al., Comprehensive Coordination Chemistry, Pergamon Press, Inc., published in 1987, H. Yersin, `` Photochemistry and Photophysics of Coordination Compounds '', Springer-Verlag, Inc., 1987, Akio Yamamoto "Organic metal chemistry-foundation and application-", such as the ligand described in Shokabosa 1982 issue etc. are mentioned.

As the host material contained in the light emitting layer, for example, one having a carbazole skeleton, one having a diarylamine skeleton, one having a pyridine skeleton, one having a pyrazine skeleton, one having a triazine skeleton and arylsilane The material which has a skeleton, and the material illustrated by the term of the below-mentioned hole injection layer, a hole transport layer, an electron injection layer, and an electron carrying layer are mentioned.

(Hole injection layer, hole transport layer)

The hole injection layer and the hole transport layer are layers having a function of receiving holes from the anode or the anode side and transporting them to the cathode side. Specifically, the hole injection layer and the hole transport layer include carbazole derivatives, triazole derivatives, oxazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, Arylamine derivatives, amino substituted calcon derivatives, styryl anthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, silazane derivatives, aromatic tertiary amine compounds, styrylamine compounds, aromatic dimethylidine compounds, porphyrins It is preferable that it is a layer containing a compound, an organosilane derivative, carbon, and the like.

((Electron injection layer, electron transport layer))

The electron injection layer and the electron transport layer are layers having a function of receiving electrons from the cathode or cathode side and transporting them to the anode side. Specifically, the electron injection layer and the electron transport layer are triazole derivatives, oxazole derivatives, oxadiazole derivatives, imidazole derivatives, fluorenone derivatives, anthraquinodimethane derivatives, anthrone derivatives, diphenylquinone derivatives and thiopyrandi. Metal complexes and metalphthalocyanines of aromatic ring tetracarboxylic anhydrides, phthalocyanine derivatives and 8-quinolinol derivatives such as oxide derivatives, carbodiimide derivatives, fluorenylidene methane derivatives, distyrylpyrazine derivatives, naphthalene and perylene It is preferable that it is a layer containing various metal complexes, organosilane derivatives, etc. which are represented by the metal complex which makes benzoxazole and benzothiazole a ligand.

((Hole block layer))

The hole block layer is a layer having a function of preventing the holes transported from the anode side to the light emitting layer from escaping to the cathode side. In the present invention, a hole block layer can be formed as an organic compound layer adjacent to the light emitting layer and the cathode side. In addition, the electron transport layer and the electron injection layer may also function as the hole block layer.

As an example of the organic compound which comprises a hole block layer, aluminum complexes, such as BAlq, a triazole derivative, phenanthroline derivatives, such as BCP, etc. are mentioned.

Further, a layer having a function of preventing electrons transported from the cathode side to the light emitting layer from escaping to the anode side may be formed at a position adjacent to the light emitting layer and the anode side. The hole transport layer and the hole injection layer may also function as this function.

<TFT display element>

It can be set as a thin film transistor (TFT) image display element. As a manufacturing method of a TFT array, the method of Unexamined-Japanese-Patent No. 10-512104, etc. are mentioned. The substrate may also have a color filter for color display. The color filter may be produced using any method, and preferably, a photolithography method is used.

<Solar cell>

The gas barrier film of this invention can be used also as the sealing film of a solar cell element. Here, it is preferable to seal the gas barrier film of this invention so that an adhesive layer may become a side closer to a solar cell element. Although there is no restriction | limiting in particular as a solar cell element in which the gas barrier film of this invention is used preferably, For example, amorphous silicon system comprised from a single crystal silicon type | system | group solar cell element, a polycrystalline silicon type | system | group solar cell element, a single junction type, a tandem structure type, etc. III-V compound semiconductor solar cell elements such as solar cell elements, gallium arsenide (GaAs) or indium phosphorus (InP), II-VI compound semiconductor solar cell elements such as cadmium tellurium (CdTe), copper / indium / selenium Group I-III-VI compound semiconductor solar cell elements such as (so-called CIS system), copper / indium / gallium / selenium (so-called CIGS system), copper / indium / gallium / selenium / sulfur system (so-called CIGSS system) And dye-sensitized solar cell elements, organic solar cell elements and the like. Especially, in this invention, the said solar cell element is copper / indium / selenium system (so-called CIS system), copper / indium / gallium / selenium system (so-called CIGS system), copper / indium / gallium / selenium / sulfur type | system | group It is preferable that it is a I-III-VI compound semiconductor solar cell element, such as (so-called CIGSS system).

`` Example ''

An Example is given to the following and this invention is demonstrated to it further more concretely. The materials, usage amounts, ratios, treatment contents, treatment procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific example shown below.

<Production of Gas Barrier Film>

Gas barrier films (Samples No. 101 to 103) in which an inorganic layer and an organic layer were formed on a base film were manufactured according to the following procedure. The details of the structure of each gas barrier film are as described in Table 1. Polyethylene naphthalate (PEN, thickness 100 micrometers, Teijin Dupont Co., Ltd. product, Q65A) film was used for the base film.

[1] formation of inorganic layer (X)

An inorganic layer of aluminum oxide was formed using a reactive sputtering apparatus. Specific film forming conditions are shown below.

The vacuum chamber of the reactive sputtering apparatus was depressurized to an attainment pressure of 5 × 10 ⁻⁴ Pa with an oil rotary pump and a turbo molecular pump. Next, argon was introduced as a plasma gas, and electric power 2000W was applied from the plasma power supply. Oxygen gas of high purity was introduced into the chamber, the film forming pressure was adjusted to 0.3 Pa, and the film was formed for a certain time to form an inorganic layer of aluminum oxide. The obtained aluminum oxide film was 40 nm in film thickness, and was 3.01 g / cm <3> in film density.

[2] formation of organic layers (Y, Z)

The organic layer was carried out using two types of film formation method (organic layer Y) by solvent coating under normal pressure and film formation method (organic layer Z) by flash deposition method under reduced pressure. Specific film forming contents are shown below.

Film formation of organic layer (Y)

As photopolymerizable acrylate, 9 g of tripropylene glycol diacrylate (TPGDA, manufactured by Daicel Cytec) and 0.1 g of a photopolymerization initiator (Ciba Specialty Chemicals, Irgacure 907) are dissolved in 190 g of methyl ethyl ketone and applied. It was made into the liquid. This coating liquid was applied onto the base film using a wire bar, and the illuminance was 350 mW / cm 2, irradiation dose using an air-cooled metal halide lamp (manufactured by Eye Graphics Co., Ltd.) of 160 W / cm under a nitrogen purge having an oxygen concentration of 0.1% or less. The organic layer Y was formed by irradiating 500mJ / cm <2> ultraviolet-rays. The film thickness was about 500 nm.

Film Formation of Organic Layer (Z)

As the photopolymerizable acrylate, 9.7 g of butylethylpropanediol diacrylate (BEPGA, manufactured by Kyoi Chemical Co., Ltd.), and 0.3 g of a photopolymerization initiator (Lamberti spa, EZACURE-TZT) were mixed to obtain a deposition liquid. This deposition liquid was deposited on a substrate by flash deposition under the condition that the internal pressure of the vacuum chamber was 3 Pa. Subsequently, under conditions of the same degree of vacuum, ultraviolet rays having an irradiation amount of 2 J / cm 2 were irradiated to form an organic layer Z. The film thickness was about 1200 nm. Formation of the organic layer Z was performed using the organic-inorganic laminated film-forming apparatus Guardian 200 (made by Vitex Systems).

[3] production of gas barrier films

The gas barrier film was manufactured by sequentially forming the said inorganic layer and organic layer in the base film according to the structure of each sample of Table 1. In addition, the manufacturing method was implemented in the following two types.

[3-1] Method of repeating organic layer formation by solvent coating and inorganic layer formation under reduced pressure (lamination A)

The organic layer and the inorganic layer were alternately laminated on the substrate. When laminating an inorganic layer on an organic layer, after forming an organic layer by solvent coating, it put into a vacuum chamber, and pressure-reduced, it hold | maintained for a fixed time in the state whose vacuum degree is ^10-3 Pa or less, and formed the inorganic layer. In addition, when laminating | stacking an organic layer on an inorganic layer, the organic layer was formed by solvent coating immediately after forming an inorganic layer.

[3-2] A method for consistently forming an organic layer and an inorganic layer under reduced pressure (lamination B)

The organic layer and the inorganic layer were laminated | stacked using the organic inorganic laminated film-forming apparatus Guardian 200 mentioned above. In this apparatus, both the organic layer and the inorganic layer form a film under a reduced pressure environment, and since the film formation chambers of the organic layer and the inorganic layer are connected, the film can be continuously formed under a reduced pressure environment. Therefore, it is not opened to the atmosphere until the barrier layer is completed.

<Production of Organic EL Device>

(Comparative Example 1)

[1] manufacture of back-emitting organic electroluminescent element substrate

The electroconductive glass substrate (surface resistance value 10 (ohm) / square) which has an ITO film | membrane was wash | cleaned with 2-propanol, and UV-ozone treatment was performed for 10 minutes. The following organic compound layers were sequentially deposited on the substrate (anode) by vacuum deposition.

(1st hole transport layer)

Copper phthalocyanine: film thickness 10 nm

(2nd hole transport layer)

N, N'-diphenyl-N, N'- dinaphthylbenzidine: film thickness 40 nm

(Light Emitting Layer and Electron Transport Layer)

Tris (8-hydroxyquinolinato) aluminum: film thickness 60nm

Finally, 1 nm of lithium fluoride and 100 nm of metallic aluminum were sequentially deposited to form a cathode, and a 3 µm thick silicon nitride film was deposited thereon by a parallel plate CVD method to produce an organic EL device.

[2] installation of gas barrier films on organic EL devices

A gas barrier film and an organic EL element substrate are bonded together using a thermosetting adhesive (Epotec 310, Daizo Nichimori Co., Ltd.) so that the gas barrier layer side is the side of the organic EL element, and at 65 ° C. for 3 hours. The adhesive was cured by heating. Thus sealed organic EL elements (Samples No. 201 to 203) were produced for each of 20 elements.

(Comparative Example 2)

[1] fabrication of top-emitting organic EL device substrate

The electroconductive glass substrate (surface resistance value 10 (ohm) / square) which has an ITO film | membrane was wash | cleaned with 2-propanol, and UV-ozone treatment was performed for 10 minutes. The following organic compound layers were sequentially deposited on the substrate (anode) by vacuum deposition.

(1st hole transport layer)

Copper phthalocyanine: film thickness 10 nm

(2nd hole transport layer)

N, N'-diphenyl-N, N'- dinaphthylbenzidine: film thickness 40 nm

(Light Emitting Layer and Electron Transport Layer)

Tris (8-hydroxyquinolinato) aluminum: film thickness 60nm

(Electron injection layer)

Lithium Fluoride: Film Thickness 1nm

(Transparent cathode and protective layer)

Silver: A 10 nm-thick film and 100 nm of ITO were vapor-deposited on it, and it was made into a transparent cathode, and the 3-micrometer-thick silicon nitride film was affixed on it by parallel plate CVD method, and the organic electroluminescent element was produced.

[2] installation of gas barrier films on organic EL devices

In the same manner as in Comparative Example 1, the gas barrier film was adhered to the organic EL device, and organic EL devices (Samples No. 301 to 303) were produced for each of 20 devices.

(Example 1)

In the comparative example 1, the glass substrate was replaced with the following board | substrates, and the others were carried out similarly, and the organic electroluminescent element (sample No.401-403) was produced by 20 elements each.

Board Adjustment

A glass substrate (thickness: 400 μm) and polyethylene naphthalate (PEN, thickness 100 μm, Teijin DuPont Co., Ltd., Q65A) film were thermosetting adhesive (Epotec 310, Daizo Nichimori Co., Ltd.) It adhere | attached, it heated at 65 degreeC for 3 hours, and hardened the adhesive agent. The obtained PEN film glass substrate laminated body was immersed in the hydrofluoric acid solution, and it lifted when glass was etched to the thickness of about 200 micrometers.

(Example 2)

In the comparative example 1, the glass substrate was replaced with the following board | substrates, and the others were carried out similarly, and the organic electroluminescent element (Samples No. 501-503) was produced by 20 elements each.

Board Adjustment

The epoxy resin was apply | coated so that thickness might be 0.1 mm on the glass substrate (thickness: 400 micrometers), and it heated and hardened | cured at 150 degreeC for 1 hour. The obtained epoxy resin layer and glass substrate laminated body were immersed in the hydrofluoric acid solution, and it lifted when glass was etched to the thickness of about 200 micrometers.

(Example 3)

In Comparative Example 2, the glass substrate was replaced with the one used in Example 1, and elsewhere, the organic EL elements (Samples No. 601 to 603) were manufactured by 20 elements each.

(Example 4)

In Comparative Example 2, the glass substrate was replaced with the one used in Example 2, and elsewhere, the organic EL elements (Samples No. 701 to 703) were manufactured by 20 elements each.

(Example 5)

In the comparative example 1, the glass substrate was replaced with the following board | substrates, and the others were carried out similarly, and the organic electroluminescent element (sample No. 801-803) was produced by 20 elements each.

Board Adjustment

A glass substrate (thickness: 400 µm) and a circularly polarized film (thickness 280 µm, manufactured by Mikan Imaging Co., Ltd.) were bonded to each other using a thermosetting adhesive (Epotec 310, Daizo Nichimori Co., Ltd.). And the adhesive was hardened by heating at 65 degreeC for 3 hours. The obtained circularly polarizing film and glass substrate laminate was immersed in a hydrofluoric acid solution and lifted when the glass was etched to a thickness of about 200 μm.

(Example 6)

In the comparative example 1, the glass substrate was replaced with the following board | substrates, and else it carried out similarly, and the organic electroluminescent element (sample No.901-903) was manufactured by 20 elements each.

Board Adjustment

The glass substrate (thickness: 400 micrometers) and the light-diffusion film (thickness 100 micrometers, FUJIFILM manufacture, UA film) are bonded together using the thermosetting adhesive (EPOTEC 310, Daizo Nichimori Co., Ltd.), The adhesive was cured by heating at 65 ° C. for 3 hours. The obtained light-diffusion film glass substrate laminated body was immersed in the hydrofluoric acid liquid, and it lifted when glass was etched to the thickness of about 200 micrometers.

(Test Example 1)

With respect to each of the obtained samples, the glass was broken in the organic EL elements of Comparative Examples 1 and 2 as a result of checking whether the glass having a size of 2 cm in height dropped from the height of 50 cm to the bottom surface of the concrete and cracking. In the organic EL device of Examples 1 to 6, the glass did not break.

(Test Example 2)

Moreover, as a result of measuring the thickness deviation with respect to the organic electroluminescent element of Comparative Example 1, Comparative Example 2, and Example 1-Example 6 according to the following method, the organic EL element of Comparative Example 1 and Comparative Example 2 has a thickness variation It was confirmed that it is 100 micrometers or more and the thickness variation of the organic electroluminescent element of Examples 1-6 is 50 micrometers or less.

Measurement method of thickness deviation:

The difference between the thickness of the four points of the corner portion of the organic EL element having a size of 2 cm in width (the point on the diagonal of the organic EL element and the position of 0.1 mm from the corner) and the thickness of the point where the two diagonal lines intersect. It was set as the deviation.

The same effect was obtained even if the acrylate used in an organic layer was substituted by the bisphenol-type acrylate compound illustrated above.

In the manufacturing method of this invention, the handling property at the time of manufacture of a device manufacturer improves, and there exists an advantage that a yield improves.

1 is a schematic view showing an example of a light emitting element or a display element of the present invention.

In the figure, 1 represents a resin film, 2 represents a glass substrate, 3 represents a light emitting device laminate or a display device laminate, and 4 represents a gas barrier film.

Claims (15)

A light emitting element or display element which has a resin film or a resin layer, a glass substrate, a light emitting device laminated body or a display device laminated body, and a gas barrier film in that order. The method of claim 1, The said resin film or said resin layer has a circularly polarizing function, The light emitting element or display element characterized by the above-mentioned. The method of claim 1, The said resin film or said resin layer has a light-diffusion function, The light emitting element or display element characterized by the above-mentioned. The method of claim 1, The thickness of the said glass substrate is 100 micrometers-300 micrometers, The light emitting element or display element characterized by the above-mentioned. The method according to any one of claims 1 to 4, The light emitting element or display element which has an adhesive layer between the said light emitting device laminated body or the said display device laminated body, and the said gas barrier film. The method according to any one of claims 1 to 4, The gas barrier film has an adhesive layer, characterized in that the light emitting element or display element. The method according to any one of claims 1 to 4, An adhesive layer is provided between the said resin film and the said glass substrate, The light emitting element or display element characterized by the above-mentioned. The method according to any one of claims 1 to 4, The thickness of the said resin film or the said resin layer is 10 micrometers-1000 micrometers, The light emitting element or display element characterized by the above-mentioned. The method according to any one of claims 1 to 4, The light emitting element or display element which has a smooth layer between the said glass substrate and the said light emitting device laminated body or the said display device laminated body. The method of claim 9, The thickness of the smooth layer is a light emitting element or display element, characterized in that 0.5㎛ ~ 10㎛. The method according to any one of claims 1 to 4, The thickness variation of the said glass substrate is 100 micrometers or less, The light emitting element or display element characterized by the above-mentioned. The method according to any one of claims 1 to 4, And the gas barrier film has at least one organic region and at least one inorganic region on a base film. The method according to any one of claims 1 to 4, It is an organic electroluminescent element, The light emitting element or display element characterized by the above-mentioned. As a manufacturing method of the light emitting element or display element in any one of Claims 1-13, After attaching a resin film and a glass substrate, a part of the said glass substrate is etched, and a light emitting device laminated body or a display device laminated body is formed on the said glass substrate after etching. A light emitting device or a display device produced by the manufacturing method of claim 14.

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