JP2020150271A - Mask for array - Google Patents

Abstract

To provide a mask for an array that is excellent in durability and can be used for a long period of time even when outer dimensions of protrusions are reduced with bumps being miniaturized and pitches being narrowed.SOLUTION: A mask for an array on which solder balls 2 are mounted at predetermined positions on a work 3 by transferring the solder balls 2 into through holes 12 corresponding to a predetermined arrangement pattern includes: a mask body 10 having the through holes 12; and protrusions 15 provided on a facing side of the mask body 10 facing the work 3. The protrusions 15 are formed of epoxy resin.SELECTED DRAWING: Figure 2

Description

The present invention relates to an arrangement mask for mounting a solder ball at a predetermined position on a work.

The solder bumps are formed by a printing process of applying flux on the electrodes of workpieces such as wafers, flexible substrates, and rigid substrates, an arrangement process of arranging solder balls on the flux, and heating to heat and melt the solder balls. Bumps are formed on the electrodes of the work through the process. Then, in the above-mentioned arrangement step, as a method of arranging the solder balls on the work, there is a transfer method using a mask. In the transfer method, the solder balls are inserted into the work by using an arrangement mask (hereinafter, appropriately simply referred to as “mask”) having holes for positioning corresponding to the arrangement pattern of the electrodes of the work. It is mounted on the electrode. Specifically, after aligning the mask with respect to the work so that the through holes and the electrodes match, the solder balls supplied on the mask are swept with a squeegee, brush, etc., and one for each through hole. Insert the solder balls one by one. Then, by fixing the solder balls to the flux, the solder balls are temporarily mounted at a predetermined position on the work.

As such a mask, there is one disclosed in Patent Document 1. The mask described in Patent Document 1 is provided with a large number of supporting protrusions on the lower surface of the mask body having through holes, and the protrusions of the protrusions are set to the same dimensions. As a result, when the mask is installed on the work, the lower ends of all the supporting protrusions are brought into contact with the upper surface of the work, and the facing gap between the mask body having a through hole and the work is secured. ing. Further, Patent Document 1 describes that the protrusions are made of resin or resist.

Japanese Unexamined Patent Publication No. 2006-324679

In recent years, with the miniaturization of electronic devices, the bumps have become smaller and the pitch has become narrower. As a result, the through-hole spacing dimension and the pattern area spacing dimension in the mask are narrowed, and it is necessary to reduce the external dimensions (width and depth) of the protrusions themselves arranged between the through-holes and the pattern area (outer circumference of the pattern area). is there. However, the conventional protrusions are formed by using the photosensitive layer of the coverlay film, and the coverlay film has flexibility so as to be compatible with a flexible printed substrate, so that the followability to the mask body is good. However, when the external dimensions of the protrusions became smaller, the strength of the protrusions became weaker, and when an impact was applied to the protrusions, the protrusions were damaged, resulting in poor durability (in the JIS standard scratch hardness test). Hardness is 2H). Further, if the external dimensions of the protrusions are reduced, the contact area of the protrusions with the mask body becomes smaller, and the protrusions are vulnerable to cleaning (solvent). Therefore, the protrusions are damaged or missing when the solder balls are mounted or the mask is cleaned. There was a risk that it would end up.

An object of the present invention is to provide an array mask which is excellent in durability and can be used for a long period of time even when the external dimensions of the protrusions are reduced as the bumps are miniaturized and the pitch is narrowed.

The present invention is an arrangement mask in which the solder balls 2 are mounted at predetermined positions on the work 3 by swinging the solder balls 2 into the through holes 12 corresponding to the predetermined arrangement pattern, and has the through holes 12. The mask body 10 is provided with a protrusion 15 provided on the side facing the work 3 of the mask body 10, and the protrusion 15 is made of a resin having excellent durability. The hardness of the protrusion 15 is preferably 5H or more. Further, the protrusion 15 is characterized in that it is formed of a mixture of barium sulfate and / or silicon dioxide in an acrylic resin.

Further, the present invention includes a mask main body 10 having a through hole 12 corresponding to a predetermined arrangement pattern, and a protrusion 15 provided on the facing surface side of the mask main body 10 with the work 3, and solder is provided in the through hole 12. This is a method for manufacturing an array mask in which the solder balls 2 are mounted at predetermined positions on the work 3 by transferring the balls 2. First, a pattern resist 41 having a resist body 41a is formed on the matrix 40. Next, the electrodeposition layer 42 is formed on the matrix 40 using the resist body 41a. Next, the resin body 44 is formed on the electrodeposition layer 42. The resin body 44 is formed by a photosensitive resin layer 43, and the photosensitive resin layer 43 is a mixture of an acrylic resin containing barium sulfate and silicon dioxide.

According to the array mask of the present invention, since the protrusions are formed of a resin having excellent durability, it is possible to prevent the protrusions from being damaged, deformed, or dropped even after repeated use.

It is a perspective view which shows the whole structure of the mask for arrangement and work of this invention. It is a longitudinal side view of the array mask which concerns on this invention. It is a top view of the array mask which concerns on this invention. It is a longitudinal side view of another embodiment of the array mask which concerns on this invention. It is a top view of another embodiment of the array mask which concerns on this invention. It is a longitudinal side view of another embodiment of the array mask which concerns on this invention. It is explanatory drawing of the manufacturing method of the array mask which concerns on this invention. It is explanatory drawing of the manufacturing method of the array mask which concerns on this invention. It is a longitudinal side view of another embodiment of the array mask which concerns on this invention. It is a partially enlarged plan view of the array mask which concerns on this invention.

1 to 3 show a mask for arranging solder balls according to the first embodiment of the present invention. This array mask (hereinafter, simply referred to as a mask) 1 is used in the process of arranging the solder balls 2 in the formation of solder bumps. In FIG. 2, reference numeral 3 indicates a work to which the solder ball 2 is mounted by the mask 1. The work 3 includes a wafer, a flexible substrate, and a rigid substrate. In the present embodiment, a plurality of semiconductor chips 5 are mounted on a base 4 of a glass epoxy substrate, wired by wire bond, and then transfer-molded. An electrode 6 as an input / output terminal is formed in a predetermined pattern on the upper surface of the work 3 so as to surround the semiconductor chip 5. The work 3 is cut into individual pieces after the bumps are formed to form individual LSI chips.

As shown in FIG. 1, the mask 1 includes a mask body 10 formed of a nickel alloy such as nickel or nickel cobalt, copper, iron, stainless steel, or other metal, and the mask body 10 surrounds the mask body 10. The frame body 11 can be mounted as described above. A large number of pattern regions including a large number of independent through holes 12 for inserting the solder balls 2 are formed in the central portion of the board surface of the mask body 10 corresponding to the semiconductor chips 5 and the electrodes 6. As shown in FIG. 2, the through hole 12 corresponds to an arrangement pattern corresponding to the arrangement position of the electrodes 6 of each semiconductor chip 5 on the work 3. The solder ball 2 has a radial dimension of 50 μm or less, and each through hole 12 is formed in a circular shape in a plan view having an inner diameter dimension slightly larger than the radial dimension of the ball 2. There is.

The frame 11 is a flat plate made of a material such as aluminum, 42 alloy, Invar material, SUS430, etc., and has one square opening corresponding to the mask body 10 in the center of the board surface. , One mask body 10 is held by one frame body 11. The frame body 11 is a molded product thicker than the mask body 10, and is inseparably and integrally joined to the outer peripheral edge of the mask body 10. Here, the thickness dimension of the frame body 11 is set to, for example, about 0.05 to 1.0 mm, and is set to 0.5 mm in the present embodiment. The thickness of the mask body 10 is preferably 10 μm or more, and is set to 200 μm in this embodiment.

A downwardly projecting protrusion 15 is provided on the lower surface side of the mask body 10 (mask 1), that is, on the side facing the work 3. The protrusion 15 is made of an alkali-developed photosensitive resin and has a hardness of 3 or more. Specifically, the main component is acrylic resin (55 to 65%), and the other main components are barium sulfate (15 to 25%) and silicon dioxide (15 to 25%). Since this photosensitive resin has a hardness of 5 to 6H (according to the scratch hardness test of JIS standard), even if the external dimensions of the protrusion 15 are reduced, sufficient strength is maintained and the protrusion 15 is strong against impact. Can be done. Further, since this photosensitive resin is also excellent in adhesion, the external dimension (for example, width dimension) of the protrusion 15 can be set to 5 mm or less. Further, this photosensitive resin is resistant to solvents (cleaning) and has solvent resistance. Specifically, the mask body 10 made of a nickel-cobalt alloy has a protrusion 15 of the photosensitive resin. It is formed, and the external dimensions (for example, width dimensions) of the protrusion 15 are 0.2 to 3.0 mm (0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1.0 mm). Prepare masks of 2.0 mm and 3.0 mm (7 points in total), and use each mask as a cleaning agent (manufactured by Kaken Tech Co., Ltd.) for 6 to 24 hours (6 hours, 12 hours, 24 hours, total 3). It was confirmed that the protrusion 15 was not peeled off even after being immersed.

Here, as the arrangement position of the protrusion 15, as shown in FIGS. 2 and 3, the protrusion 15 (crosspiece 15a) may be provided between the pattern regions (outer circumference of the pattern region) so as to surround the pattern region. it can. Further, as shown in FIG. 4, a protrusion 15 (support 15b) can be provided at a position in the pattern region where the through hole 12 is not formed. The shape of the protrusions 15 provided so as to surround the pattern regions between adjacent pattern regions (outer circumference of the pattern regions) is not limited to the ones provided continuously as shown in FIG. 3, for example, as shown in FIG. In addition, it may be provided in fragments (support 15c), or the entire space between adjacent pattern regions (outer circumference of the pattern region) may have a convex shape. If such a protrusion 15 is provided, it is possible to secure an opposing gap between the mask main body 10 and the work 3 in contact with the upper surface of the work 3 during the arrangement work. As shown in FIGS. 2 and 4, each of the protrusions 15 (cross section 15a, support 15b, support 15c) is formed so as to be narrowed from the lower surface of the mask body 10 toward the tip of the protrusion 15 (for example, It is preferable that it has a trapezoidal shape or a chevron shape in cross-sectional view.

In addition to this, as shown in FIG. 6, a divergent shape in which the root dimension of the protrusion 15 increases toward the lower surface of the mask body 10 (a tip narrowing that narrows from the root to the tip of the protrusion 15). Shape), and further, the side surface may be formed in an arc shape. As a result, it is possible to prevent damage caused by stress concentration on the protrusion 15 particularly at the root portion 15, and even if the flux 17 adheres to the protrusion 15 when the mask 1 is placed on the work 3. Since the side surface of the protrusion 15 is an arc, it is possible to prevent the flux 17 from wrapping around into the through hole 12, so that the flux 17 may adhere to the through hole 12 and cause a mounting failure of the solder ball 2. It can be eliminated. The root portion 15 "end position of the protrusion 15 is preferably located near the through hole 12 on the lower surface of the mask body 10, and the lower surface 10a of the mask body and the inner surface 12a of the through hole. A form located at the intersection and a form located at a gap from the through hole 12 on the lower surface 10a of the mask body can be considered. Further, the side surface of the protrusion 15 may be either a convex arc or a concave arc. If the convex arc is used, the strength is good, and if the concave arc is used, the flux 17 is adhered to any position on the side surface of the protrusion 15. There is no portion close to the electrode 6, that is, a constant distance is maintained from the electrode 6 to which the flux 17 is attached, and the adhesion of the flux 17 to the protrusion 15 can be reduced. Further, the tip portion 15'and / or the root portion 15 "of the protrusion portion 15 may be formed in an arc shape (round shape), whereby the possibility that the flux 17 adheres to the protrusion portion 15 is reduced as much as possible. To do.

In the present mask 1, the ratio of the height of the protrusion 15 to the thickness of the mask body 10 is preferably 2: 1 or more, and this is satisfied when the thickness of the mask body 10 is within the range of 10 to 300 μm. Is more preferable. Further, the protrusion 15 preferably has a large aspect ratio (ratio of the height of the protrusion 15 to the tip dimension), and in the present embodiment, the aspect ratio is 3. Further, the root dimension L2 of the protrusion 15 is preferably 1.0 to 1.5 times the tip dimension L1 of the protrusion 15, and is set to 1.2 times in this embodiment. Further, it is preferable that the ratio of the tip dimension L1 of the protrusion 15 to the root dimension L2 and the width dimension L3 between the through holes 12 is 1: 1.2: 1.4 or more. Further, the dimension L4 from the pattern region to the root of the protrusion 15 (crosspiece 15a, support 15c) is preferably set to 0.01 mm or more, and is 0.02 mm in this embodiment. Under such conditions, the adhesion of flux can be prevented as much as possible. At this time, by satisfying the relationship between the ratio of the tip dimension L1 of the protrusion 15 and the root dimension L2 and the relationship of the dimension L4 from the pattern region to the root of the protrusion 15, damage prevention and flux of the protrusion 15 are satisfied. It is possible to achieve both prevention of adhesion. Furthermore, when the dimension from the pattern region to the center of the tip of the protrusion 15 (crosspiece 15a, support 15c) is L5, the ratio of L1, L2, and L5 is set to 1: 3: 2.5 or more. The above-mentioned compatibility effect can be maximized.

In this mask 1, the mask body 10 and the protrusion 15 are integrally formed of separate members. However, if the mask body 10 is made of a magnetic material and the protrusion 15 is made of a non-magnetic material, the magnet can be formed. When the mask 1 is fixed to the work 3 by magnetic attraction, the magnetic force can be applied uniformly to the mask 1, so that the mask 1 does not inadvertently bend and can be mounted on the work in good contact. Therefore, the alignment accuracy of the through hole 12 with respect to the electrode 6 can be improved. Further, when the mask 1 is removed, the work 3 and the protrusion 15 are not directly magnetically coupled, so that the plate release can be improved. The mask 1 can be realized, for example, by forming the mask body 10 with a magnetic metal (nickel, iron, etc.).

Further, by forming the protrusion 15 with the photosensitive resin, the protrusion 15 has strength as the protrusion 15, has a strong adhesion to the mask body 10, and has high resistance to a solvent, and the protrusion 15 is a work. When it comes into contact with 3, the work 3 is less likely to be damaged. In order to exert such an effect remarkably, it is preferable that not only the protrusion 15 but also the entire portion in contact with the work 3 is made of resin in the mask 1.

Further, in the present mask 1, as shown in FIGS. 2, 4 and 6, a coating layer 50 can be provided on the lower surface of the mask body 10 and the inner surface of the through hole 12. The coating layer 50 preferably has water repellency, and the material thereof includes a fluororesin, a silicon resin, an emulsion, and the like. By providing the coating layer 50, the flux can be repelled even if the flux adheres to the lower surface of the mask main body 10 and the inner surface of the through hole 12, and the state in which the flux remains attached to the lower surface of the mask main body 10 and the inner surface of the through hole 12 can be maintained. Can be prevented. Further, by forming the coating layer 50 on the surface of the protrusion 15, it is possible to prevent the flux from adhering to the protrusion 15. Moreover, by forming the coating layer 50 on the lower surface of the mask body 10, the inner surface of the through hole 12, and the surface of the protrusion 15, even if the flux adheres to the inner surface of the through hole 12, the flux is repelled, and the lower surface of the mask body 10 and the surface of the protrusion 15 are repelled. It can flow on the work through the surface of the protrusion 15. In addition, it is possible to more reliably prevent the flux 17 from wrapping around into the through hole 12. Further, when the mask body 10 and the protrusion 15 are formed of different members, if the joint strength between the two is weak, the protrusion 15 may be inadvertently dropped, deformed, or damaged when the mask 1 is used. By forming the coating layer 50 so as to cover the lower surface of the mask body 10 and the entire surface of the protrusion 15, the coating layer 50 functions as a protective layer for the protrusion 15, so that the protrusion 15 is dropped or deformed. It can also contribute to the prevention of damage. If it is desired to specialize in preventing the protrusion 15 from falling off, deforming, or being damaged, a coating layer 50 is formed on the lower surface of the mask body 10 and the surface of the protrusion 15 by sputtering or electroless plating a metal such as Ni or Cu. It is good to provide it. Further, the coating layer 50 may be formed on the upper surface of the mask main body 10, in short, it may be formed on a portion where mounting failure of the solder balls is likely to occur when flux adheres, and the mask 1 is placed on the work. At that time, it is desirable to form the mask body 10 and the protrusion 15 facing the flux 17 applied on the electrode 6.

It should be noted that each drawing does not show the actual state of the mask 1, but schematically shows it. Further, the opening size of the through hole 12 and the thickness size of the mask body 10 and the like in each drawing are shown in such dimensions for convenience of drawing. Further, in FIGS. 3 and 5, the lower end surface (tip surface) of the protrusion 15 is shown by reference numeral 15, and the root of the protrusion 15 and the coating layer 50 are not shown.

The arrangement work of the solder balls 2 using the mask 1 is performed by the following procedure. This arrangement work is performed by a dedicated arrangement device (see FIG. 1 and the like in Patent Document 1). First, the flux 17 (see FIG. 2) is printed and applied on the electrode 6 of the work 3. Next, the mask 1 is aligned on the work 3 so that the through hole 12 and the electrode 6 are aligned, and then the mask 1 is fixed. Such alignment work is actually performed by aligning the outer peripheral edges of the frame 11 and the work 3. When the alignment work is completed, the lower end surface of the protrusion 15 comes into contact with the surface of the work 3 in the fixed state, so that the mask body 10 is as shown in FIGS. 2, 4, 6, and 9. The posture is maintained in a separated posture in which a gap facing the work 3 is secured. At this time, a magnet can be arranged below the work 3 and the mask 1 can be attracted to the work 3 by the magnetic action of the magnet.

Next, a large number of solder balls 2 are supplied onto the mask 1, the solder balls 2 are dispersed on the mask 1 using a squeegee brush, and the solder balls 2 are thrown into the through holes 12 one by one. As a result, the solder ball 2 is adhesively held on the electrode 6 by the flux 17 in a temporarily fixed shape. In the loading operation of the solder ball 2 using such a squeegee brush, even if a large squeegee brush pressure is applied to the mask 1, the mask 1 can be prevented from bending due to the protrusions 15, and the loading operation can proceed smoothly and efficiently. be able to. Further, by forming the protrusion 15 with the photosensitive resin containing the acrylic resin as a main component, the protrusion 15 can be made to have high strength, and even if the squeegee brush pressure is greatly applied to the protrusion 15, the protrusion 15 can be formed. Damage to the portion 15 can be prevented. Finally, the solder bumps are formed by heating and melting the solder balls 2 mounted on the work 3.

As described above, according to the mask 1 according to the present embodiment, since the protrusion 15 that forms the facing gap between the mask body 10 and the work 3 is provided, the protrusion 15 ensures the facing gap with the work 3. It is possible to efficiently proceed with the work of inserting the solder ball 2 into the through hole 12 without omission. By forming the protrusions 15 with the photosensitive resin containing the acrylic resin as a main component, even if the outer dimensions of the protrusions 15 are small, the strength of the protrusions 15 is strong, and the mask body 10 and the mask body 10 and the mask body 10. It is possible to improve the adhesive strength of the mask and to make a mask having strong solvent resistance. Since the solder balls are mounted using the mask having such a configuration, the mask is resistant to repeated use and can contribute to the formation of highly productive solder bumps.

A frame body 11 for reinforcement can be provided on the outer peripheral edge of the mask body 10, and if the mask body 10 is formed in a state in which stress in the direction of contracting inward acts on itself, the surroundings can be formed. The expansion of the mask body 10 due to the change in temperature can be absorbed by the tension in the contraction direction. This makes it possible to prevent the mask body 10 from being displaced with respect to the work 3. Further, since a uniform tension can be applied to the entire mask body 10, the solder balls 2 can be mounted on the work 3 with high positional accuracy.

Next, a method of manufacturing the array mask 1 having such a configuration is shown in FIGS. 7 and 8. First, as shown in FIG. 7A, a mother die 40 is prepared. The mother die 40 may be any as long as it has conductivity, and stainless steel is used in this embodiment. Next, a photoresist layer was formed on the surface of the matrix 40, and each of the treatments of exposure, development, and drying was performed to dissolve and remove the unexposed portion, whereby the resist body 41a was formed as shown in FIG. 7 (b). The pattern resist 41 to have was formed on the master mold 40. Next, the master mold 40 is placed in a plating tank (electroforming tank) that has been bathed under predetermined conditions, and as shown in FIG. 7 (c), the resist of the master mold 40 is set to the same height as the resist body 41a. An electrodeposition metal was plated (electroformed) on a surface not covered with the body 41a to form an electrodeposition layer 42. In this embodiment, the electrodeposition layer 42 is formed by Ni—Co. After forming the electrodeposition layer 42, it is preferable to perform mechanical polishing such as belt polishing and / or electrolytic polishing on the surface of the electrodeposition layer 42. Then, as shown in FIG. 7D, the resist body 41a was dissolved and removed.

Next, as shown in FIG. 8A, a photosensitive resin layer 43 was formed on the surface of the electrodeposition layer 42. The main components of the photosensitive resin layer 43 are acrylic resin (55 to 65%), barium sulfate (15 to 25%), and silicon dioxide (15 to 25%). Next, exposure, development, and drying were performed to dissolve and remove the unexposed portion, whereby the resin body 44 was integrally formed on the electrodeposition layer 42 as shown in FIG. 8 (b). After the resin body 44 is formed or the photosensitive resin layer 43 is formed, it is preferable to perform a dropout prevention treatment such as baking. As a result, the adhesion between the resin body 44 and the electrodeposition layer 42 can be further strengthened. Finally, the mask 1 shown in FIG. 8C can be obtained by peeling the electrodeposited layer 42 and the resin body 44 formed on the surface thereof from the mother die 40. If the frame body 11 is attached to the mask 1 thus obtained, the array mask 1 as shown in FIG. 1 can be obtained.

Here, as shown in FIG. 8D, the coating layer 50 may be formed on the surface of the electrodeposition layer 42 on the side having the resin body 44 and on the surface of the resin body 44. In that case, the coating layer 50 may be formed before the electrodeposition layer 42 and the resin body 44 are peeled from the master mold 40. Further, the coating layer 50 is not limited to the surface of the electrodeposition layer 42 on the side having the resin body 44, and may be formed on the entire surface of the electrodeposition layer 42. Of course, the coating layer 50 may also be formed on the inner surface of the through hole 12.

According to the mask 1 manufacturing method as described above, the array mask can be manufactured with high accuracy by using the plating method (electroforming method) and lithography, so that the solder balls 2 can be placed on the work 3 with high positional accuracy. Can be installed. Further, if the protrusion 15 is formed in a constricted shape so as to become larger as it approaches the lower surface of the mask main body 10, the strength of the protrusion 15 can be firmly reinforced, and the protrusion 15 is coated with the flux 17 electrode 6. Since the electrodes 6 can be brought into contact with each other in a state of being separated from the mask body 10, it is possible to prevent the solder balls 2 from being improperly mounted due to the flux 17 applied to the electrodes 6 adhering to the mask body 10.

In the present mask 1, the shapes of the through holes 12 and the protrusions 15 may be straight or tapered. Here, the case where the through hole 12 and the protrusion 15 are tapered will be specifically described. First, in the through hole 12, the mask body 10 has a constricted tip toward the side facing the work 3. By providing the taper, it becomes easier to lure the solder ball 2 into the through hole 12, and by providing the taper in a protruding shape toward the facing surface side of the mask body 10 with the work 3, the mask body 10 and the work 3 It is possible to prevent the flux from adhering to the peripheral edge of the through hole 12 on the facing surface side of the above, and it is possible to prevent the solder balls 2 thrown into the through hole 12 from being inadvertently ejected. Further, in the protrusion 15, the mask can be firmly placed on the work 3 by providing a taper having a constricted tip toward the side of the mask body 10 facing the work 3. By providing a taper that extends toward the surface of the mask body 10 facing the work 3, the strength of the protrusions 15 is ensured even when the electrodes 6 of the work 3 are arranged at a narrow pitch. At the same time, the contact of the protrusion 15 on the work 3 can be firmly dealt with. Such a shape can be easily obtained by changing the photosensitivity and exposure conditions of the photoresist layers 31 and 36.

In the present mask 1, the protrusion 15 (post 15b) and the through hole 12 may be arranged so that the protrusion 15 (post 15b) surrounds one through hole 12, or one protrusion 15 may be arranged. It may be arranged so as to be surrounded by the through hole 12. Further, the shape of the protrusion 15 is not limited to the crosspiece 15a and the cylinder, and may be a polygon such as a rhombus or a hexagon, or a column or a pyramid of a circle or an ellipse. Further, in these shapes, as shown in FIG. 10, an elongated shape and / or a shape with rounded corners is preferable. By aligning the longitudinal direction and the major axis direction of these shapes with a certain direction (cleaning means moving direction) in this way, for example, when cleaning the back surface of the mask 1, the cleaning means (cloth, sponge, etc.) is projected on the protrusion 15. It is possible to eliminate as much as possible the possibility of damage to the cleaning means and the protrusion 15 due to being caught in the cleaning means, and it is possible to perform smooth cleaning. Therefore, it is desirable to align all the longitudinal directions and the major axis directions of the protrusions 15 in one direction. It should be noted that the elongated shape is limited to the lower end surface (tip surface) of the protrusion 15, and the surface of the root portion 15b of the protrusion 15 does not necessarily have to be elongated in terms of strength and the like. When the protrusion 15 is formed of the photosensitive resin containing the acrylic resin as a main component, the mask 1 is placed in the front-rear direction or the left-right direction (cleaning means moving direction or) between adjacent pattern regions (outer circumference of the pattern region). By arranging the rectangular protrusions 15 along any of the directions (in the direction perpendicular to this), the warp of the mask 1 can be suppressed as much as possible.

Further, in the present mask 1, the thickness of the coating layer 50 may be different between the inner surface of the through hole 12 and the surfaces of the mask body 10 and the protrusion 15. Specifically, when the thickness of the coating layer 50 on the inner surface of the through hole 12 is T1 and the thickness of the coating layer 50 on the surfaces of the mask body 10 and the protrusion 15 is T2 (see FIG. 9), T1> T2. For example, it is possible to more reliably prevent the flux from adhering to the inner surface of the through hole 12, which causes a defective mounting of the solder balls. Further, if the coating layer 50 is made of a slippery material (less friction), it will appear as a slippery region at the boundary between the upper surface of the mask body 10 and the inner surface of the through hole 12 by the thickness of T1, and the thickness of T1. The thicker the region, the larger the region. Therefore, when the solder balls 2 are brushed with a squeegee brush, the squeegee brush and the solder balls 2 can be smoothly moved, which is expected to improve productivity and work efficiency. If T1 <T2, when the protrusion 15 is separately formed on the lower surface of the mask body 10, the protrusion 15 can be more reliably prevented from falling off, deforming, or being damaged. There are various methods for forming the coating layer 50, such as a dipping method and a spraying method. When forming the coating layer 50, it is preferable to cover a portion other than the desired forming portion with a protective sheet. Further, when the coating layer 50 is to be formed thick, the portion to be thickened is locally sprayed, or the direction in which the mask 1 is immersed is different (for example, when the coating layer 50 is to be thickened on the lower surface of the mask body 10, the lower surface of the mask body 10 is formed. It is preferable to immerse the mask body 10 in parallel with the immersion surface, and if it is desired to make the inner surface of the through hole 12 thicker, it is preferable to immerse the mask body 10 in a state where the lower surface and the immersion surface are vertical).

Further, the main component of the photosensitive resin layer 43 (protrusion portion 15) is acrylic resin, but the present invention is not limited to this, and polyethylene, polypropylene, polystyrene, polyurethane, polyvinyl chloride, polyvinyl acetate, ABS resin, and the like. AS resin, PET resin, EVA resin, fluororesin, polyamide, polyacetal, polycarbonate, polyphenylene ether, polyester, polyolefin, polyphenylen sulphide, polytetrafluoroethylene, polysulfone, polyether sulfone, acrylate polyarylate, liquid crystal polymer, poly Examples thereof include ether ether ketone, polyimide, polyamideimide and the like (so-called thermoplastic resin). Further, phenol resin, epoxy resin, melamine resin, urea resin, alkyd resin, polyurethane and the like (so-called thermosetting resin) may be used.

Further, the other photosensitive resin layer 43 (protrusion portion 15) is a photoradical reactive resin having at least one ethylenically unsaturated group and a carboxyl group in the molecule (hereinafter, referred to as component a). , A photopolymerizable monomer having at least one ethylenically unsaturated group and a tricyclodecane structure (hereinafter referred to as component b) and a silica filler (hereinafter referred to as component c) were contained in the molecule. There is something. First, as the component a, for example, an epoxy compound (hereinafter referred to as component a1) and an unsaturated monocarboxylic acid (hereinafter referred to as component a2) saturated or unsaturated polybasic anhydride (hereinafter referred to as component a3). ) Can be used, and examples of the component a1 include a bisphenol type epoxy compound, a novolak type epoxy compound, a biphenyl type epoxy compound, a polyfunctional epoxy compound, and the like, and the component a2 includes. For example, (meth) acrylic acid, crotonic acid, cinnamic acid, saturated or unsaturated polybasic anhydride and (meth) acrylates having one hydroxyl group in one molecule, or saturated or unsaturated dibasic acid. Examples thereof include a reaction product with a semiester compound with a saturated monoglycidyl compound, and examples of the component a3 include succinic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, and ethyltetrahydro. Phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, ethylhexahydrophthalic anhydride, itaconic anhydride, trimellitic anhydride and the like can be mentioned. Next, as the component b, for example, one or more selected from the group consisting of dimethylol tricyclodecane diacrylate, dimethylol tricyclodecane dimethacrylate, tricyclodecanediol diacrylate and tricyclodecanediol dimethacrylate, Examples include compounds having a urethane bond. Next, the component c preferably has an average particle size of 3 to 300 nm and a maximum particle size of 1 μm or less and is dispersed in the photosensitive resin layer 43. As this component c, a silane coupling agent can be used, for example, alkylsilane, alkoxysilane, vinylsilane, epoxysilane, aminosilane, acrylicsilane, methacrylsilane, mercaptosilane, sulfidesilane, isocyanatesilane, sulfasilane, styryl. Examples thereof include silane and alkylchlorosilane. The silane coupling agent is preferably of a type that reacts with the carboxyl group of component a. For example, by selecting epoxysilane, mercaptosilane, or isocyanatesilane, the bond between silica and resin is strengthened, and the strength as a layer is increased. At the same time, it becomes possible to reduce the coefficient of thermal expansion. Here, (meth) acrylic acid means acrylic acid or methacrylic acid, and (meth) acrylate means acrylate or methacrylate. Regarding the content of each component, the component a is preferably 30 to 80 parts by mass, more preferably 40 to 75 parts by mass, and further preferably 50 to 70 parts by mass with respect to 100 parts by mass of the total amount of the component a and the component b. It is a department. When the content of the component a is in this range, the strength of the protrusion 15 becomes better. The component b is preferably 20 to 70 parts by mass, more preferably 25 to 60 parts by mass, and most preferably 30 to 50 parts by mass with respect to 100 parts by mass of the total amount of the component a and the component b. When the content of the component b is in this range, the photosensitivity of the photosensitive resin layer 43 becomes better. The component c is preferably 20 to 70 parts by mass with respect to 100 parts by mass in total, and it can be expected that the coefficient of thermal expansion is reduced at 30 parts by mass or more and the coating film property is improved at 60 parts by mass or less. In addition to these components a to c, a photopolymerization initiator and an epoxy resin can be contained, and the content of these is 0 for the total 100 parts by mass of the component a and the component b. The range of 1 to 10 parts by mass is preferable, and the epoxy resin is preferably in the range of 3 to 50 parts by mass. As described above, by using the photosensitive resin layer 43 containing each of the above components, it is possible to obtain a protrusion 15 which is excellent in developability, heat resistance, HAST resistance and crack resistance and can suppress warpage to a small extent. In addition, in order to improve the adhesion to the mask body 10, a combination of the component b and a compound obtained by reacting a polyhydric alcohol with an α, β-unsaturated carboxylic acid or an additive (for example, melamine). , Dicyandiamide, triazine compound and its derivative, imidazole type, thiazole type, triazole type, silane coupling agent, etc.), and the amount of the component is 0.1 with respect to 100 parts by mass of the total amount of the component a to the component c. It is preferably 10% by mass.

The other photosensitive resin layer 43 (protrusion portion 15) includes an acid-modified vinyl group-containing epoxy resin (hereinafter referred to as component A), a photopolymerization initiator (hereinafter referred to as component B), and a nitroxyl compound. (Hereinafter referred to as component C) and some of them are contained. First, examples of the component A include a resin obtained by modifying an epoxy resin with a vinyl group-containing monocarboxylic acid, and from a novolak type epoxy resin, a bisphenol A type epoxy resin or a bisphenol F type epoxy resin, and a salicylaldehyde type epoxy resin. It is preferable to use a resin obtained by reacting at least one epoxy resin selected from the above group with a vinyl group-containing monocarboxylic acid. Next, as the component B, for example, a benzoin compound, a benzophenone compound, an acetophenone compound, an anthracene compound, a thioxanthone compound, a ketal compound, a 2,4,5-triarylimidazole dimer, an acrydin derivative, a phosphine oxide compound and an oxime compound. , Anthracene compounds and the like. Next, examples of component C include compounds having a nitroxyl group, 4-hydroxy-2,2,6,6-tetramethylpiperidin-1-oxyl-free radical, 4-hydroxy-2,2. 6,6-Tetramethylpiperidin-1-oxylbenzoate free radical, 4-acetamide-2,2,6,6-tetramethylpiperidin-1-oxylfree radical, 4-amino-2,2,6,6-tetra Methylpiperidin-1-oxylfree radical, 4- (2-chloroacetamide) -2,2,6,6-tetramethylpiperidin-1-oxylfree radical, 4-cyano-2,2,6,6-tetramethyl Includes piperidine-1-oxyl-free radical, 4-methoxy-2,2,6,6-tetramethylpiperidin-1-oxyl-free radical, 2,2,6,6-tetramethylpiperidin-1-oxyl-free radical .. Regarding the content of each component, the component A is preferably 25 to 70% by mass, more preferably 30 to 70% by mass, still more preferably 35 to 65% by mass, based on the total solid content of the photosensitive resin layer 43. Is. When the content of the component A is within this range, the protrusion 15 having excellent heat resistance and chemical resistance tends to be obtained. The component B is preferably 0.5 to 30 parts by mass, more preferably 0.5 to 20 parts by mass, and further preferably 0.5 to 15 parts by mass, based on 100 parts by mass of the total amount of the component A. .. When the content of the component B is 0.5 parts by mass or more, the photosensitivity of the photosensitive resin layer 43 tends to be improved, and when the content is 30 parts by mass or less, the heat resistance of the protrusion 15 tends to be improved. The component C is preferably 0.005 to 10 parts by mass, more preferably 0.01 to 8 parts by mass, and further preferably 0.01 to 5 parts by mass, based on 100 parts by mass of the total amount of the component A. .. When the content of the component C is 10 parts by mass or less, the photosensitive resin layer 43 tends to have improved photosensitivity. As described above, by using the photosensitive resin layer 43 containing each of the above components, the exposure allowance can be widened, and the protrusion 15 having excellent developability, heat resistance, adhesion, and solvent resistance can be obtained. be able to. In addition to these components A to C, epoxy resins (for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenol type epoxy resin, bixylenol type epoxy resin, hydrogenated bisphenol A type epoxy) Resins, these dibasic acid-modified diglycidyl ether type epoxy resins, biphenylaralkyl type epoxy resins, tris (2,3-epoxypropyl) isocyanurate, etc.) can also be contained, and the content thereof is that of component A. Based on the total amount of 100 parts by mass, it is preferably 1 to 50 parts by mass, more preferably 5 to 50 parts by mass, still more preferably 10 to 50 parts by mass, and most preferably 20 to 40 parts by mass.

Further, as the other photosensitive resin layer 43 (protrusion portion 15), a polymerizable compound having an ethylenically unsaturated bond and an ethylenically unsaturated group (hereinafter referred to as component (1)) with a polyurethane compound having an ethylenically unsaturated group and a carboxyl group. Some compounds contain a compound (hereinafter referred to as component (2)), a photopolymerization initiator (hereinafter referred to as component (3)), and a phosphorus-containing compound (hereinafter referred to as component (4)). .. First, as the component (1), for example, an epoxy acrylate compound (hereinafter referred to as component (1) -1) obtained by reacting a diglycidyl compound with (meth) acrylic acid and a diisocyanate compound (hereinafter, component (1)). ) -2) and a diol compound having a carboxyl group (hereinafter referred to as component (1) -3) can be used, and as component (1) -1, for example, bisphenol A can be used. Examples thereof include a compound obtained by reacting a (meth) acrylic acid with a type epoxy compound, a bisphenol F type epoxy compound, a novolak type epoxy compound, an epoxy compound having a fluorene skeleton (glycidyl compound), and the like, and components (1) -2. Examples thereof include phenylenedi isocyanate, tolylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, diphenylmethane diisocyanate, naphthalenedi isocyanate, tridendiisocyanate, hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, isophorone diisocyanate, allylene sulfone ether diisocyanate, and ants. Examples thereof include Lucian diisocyanate, N-acyldiisocyanate, trimethylhexamethylene diisocyanate, 1,3-bis (isocyanismethyl) cyclohexane, norbornan-diisocyanatemethyl, and examples of the component (1) -3 include dimethylol propionic acid and diisocyanate. Examples thereof include methylolbutanoic acid, ethylene glycol and propylene glycol. Next, as the component (2), for example, a compound having the component (2) -1, or a reaction product of the compound having the component (2) -2 and the compound having the component (2) -3 is used. As the component (2) -1 and the component (2) -3, a divalent organic group is contained, and for example, an alkylene group having 1 to 10 carbon atoms (methylene group, ethylene group, propylene group, isopropylene group) can be used. , Butylene group, isobutylene group, pentylene group, neopentylene group, hexylene group, heptylene group, octylene group, 2-ethyl-hexylene group, nonylene group, decylene group) and arylene group (phenylene group) having 6 to 10 carbon atoms. As the component (2) -1 and the component (2) -2, for example, an alkylene group having 2 to 7 carbon atoms (ethylene group, propylene group, butylene group, pentylene group, hexylene group) is contained. As the component (2) -1 and the component (2) -3, a hydrogen atom or a methyl group is contained. Next, as the component (3), for example, benzophenone, N, N'-tetraalkyl-4,4'-diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone- Aromatic ketones such as 1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether; benzyl dimethyl ketal, etc. Benzyl derivative of; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o) -Fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole 2,4,5-Triarylimidazole dimer such as dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer; 9-phenylaclydin, 1,7-bis ( Acrydin derivatives such as 9,9'-acrydinyl) heptane; N-phenylglycine, N-phenylglycine derivatives, coumarin compounds and the like can be mentioned, but the component (3) preferably contains an aromatic ketone, among others. It preferably contains an α-aminoalkylphenone compound (eg, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1). Next, as the component (4), for example, a phosphinate containing a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a 3-butyl group, an n-pentyl group, a phenyl group and the like. Can be mentioned. Regarding the content of each component, the component (1) is preferably 5 to 90% by mass, more preferably 30 to 70% by mass, and further preferably 40 to 60% by mass. Further, when the amount of the component (2) is less than 5% by mass, the flexibility, warpage, and resilience tend to be inferior. Therefore, in a total amount of 100% by mass, preferably 5 to 40% by mass, more preferably 10 to 10% by mass. It is 30% by mass. The component (3) is preferably 0.01 to 20% by mass, more preferably 0.2 to 5% by mass, based on 100% by mass of the total amount of the component (1) and the component (2). The phosphorus content of the component (4) is preferably 1.5 to 5.0% by mass. As described above, by using the photosensitive resin layer 43 containing each of the above components, it is possible to obtain the protrusion 15 which is excellent in alkali developability, flexibility and tackiness and can suppress the occurrence of warpage. In addition to these components (1) to (4), a thermosetting agent (thermosetting compound such as epoxy resin, phenol resin, urea resin, melamine resin) can be contained, and the content thereof is determined. It is preferably 10 to 70% by mass, more preferably 20 to 60% by mass.

Further, as the other photosensitive resin layer 43 (protrusion portion 15), a polymer having a carboxyl group (hereinafter referred to as component <1>) and a photopolymerizable compound having an ethylenically unsaturated bond (hereinafter referred to as component <1>). 2>) and a phosphorus-containing flame retardant (hereinafter referred to as component <3>) are contained. First, as the component <1>, for example, acrylic resin, polyurethane, vinyl group-containing epoxy resin, epoxy resin, phenoxy resin, polyester, polyamide, polyimide, polyamideimide, polyesterimide, polycarbonate, melamine resin, polyphenylene sulfide, polyoxy. A benzoyl or the like having a carboxyl group in the molecule can be used, but in particular, it has an epoxy acrylate compound obtained by reacting a diglycidyl compound with (meth) acrylic acid, a diisocyanate compound, and a carboxyl group. A polyurethane compound obtained by reacting with a diol compound is preferable (see the above component (1) for specific examples of each compound). In addition to this, the component <1> is saturated or unsaturated with an esterified product of an epoxy compound (hereinafter referred to as component <1> -1) and an unsaturated monocarboxylic acid (hereinafter referred to as component <1> -2). An addition reaction product to which a saturated polybasic acid anhydride (hereinafter referred to as component <1> -3) is added can also be used, and examples of the component <1> -1 include a bisphenol type epoxy compound and a novolak type epoxy compound. , Salicylaldehyde-phenol or cresol type epoxy compound, and the components <1> -2 include, for example, (meth) acrylic acid, crotonic acid, cinnamic acid, saturated or unsaturated polybasic acid anhydride in one molecule. (Meta) acrylates having one hydroxyl group or a reaction product of a semiester compound of a saturated or unsaturated dibasic acid and an unsaturated monoglycidyl compound (for example, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid). Acids, maleic acids, and succinic acids are reacted with hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, tris (hydroxyethyl) isocyanurate di (meth) acrylate, and glycidyl (meth) acrylate in an equimolar ratio. The obtained reaction product) is mentioned, and examples of the component <1> -3 include anhydrides such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, maleic acid, succinic acid, and trimellitic acid. In addition to this, as the component <1>, a vinyl-based copolymer compound obtained by using (meth) acrylic acid and (meth) acrylic acid alkyl ester as a copolymerization component can also be used. Next, as the component <2>, for example, a bisphenol A-based (meth) acrylate compound; a compound obtained by reacting a polyhydric alcohol with α, β-unsaturated carboxylic acid; and a glycidyl group-containing compound α, β- Compound obtained by reacting unsaturated carboxylic acid; urethane monomer or urethane oligomer such as (meth) acrylate compound having urethane bond, nonylphenoxypolyoxyethylene acrylate; γ-chloro-β-hydroxypropyl-β'-(meth) ) Phtrate compounds such as acryloyloxyethyl-o-phthalate, β-hydroxyalkyl-β'-(meth) acryloyloxyalkyl-o-phthalate; (meth) acrylic acid alkyl ester, ethylene oxide (EO) modified nonylphenyl Examples include (meth) acrylate. Next, as the component <3>, for example, a phosphinate containing a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a 3-butyl group, an n-pentyl group and a phenyl group can be used. Can be mentioned. Regarding the content of each component, the component <1> is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, based on the total amount of the solid organic compound in the photosensitive resin layer 43. The component <2> is preferably 5 to 80% by mass, more preferably 10 to 80% by mass. The phosphorus content of the component <3> is preferably 1.5 to 5.0% by mass. As described above, by using the photosensitive resin layer 43 containing each of the above components, it is possible to obtain the protrusion 15 having excellent alkali developability and flexibility. In addition to these components <1> to <3>, photopolymerization initiators (aromatic ketone, benzoin ether, benzyl derivative, 2,4,5-triarylimidazole dimer, aclysine derivative, N-phenylglycine). , N-phenylglycine derivatives, coumarin compounds, etc.) and thermosetting agents (thermosetting compounds such as epoxy resin, phenol resin, urea resin, melamine resin, etc.) can also be contained. The polymerization initiator is preferably 0.1 to 10% by mass, more preferably 0.2 to 5% by mass, and the thermosetting agent is preferably 5 to 60% by mass, more preferably 10 to 50% by mass. is there.

The other photosensitive resin layer 43 (projection 15) includes a binder polymer having (meth) acrylic acid and (meth) acrylic acid alkyl ester as structural units (hereinafter referred to as component [1]) and urethane. Some contain a modified epoxy acrylate resin (hereinafter referred to as component [2]) and a colorant (hereinafter referred to as component [3]). First, the component [1] is obtained by radically polymerizing, for example, (meth) acrylic acid and (meth) acrylic acid alkyl ester, and the (meth) acrylic acid alkyl ester is, for example, (meth) acrylic acid. Methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid propyl ester, (meth) acrylic acid butyl ester, (meth) acrylic acid pentyl ester, (meth) acrylic acid hexyl ester, (meth) acrylic acid heptyl ester , (Meta) acrylic acid octyl ester, (meth) acrylic acid-2-ethylhexyl ester, (meth) acrylic acid nonyl ester, (meth) acrylic acid decyl ester, (meth) acrylic acid undecyl ester, (meth) acrylic acid Dodecyl ester can be mentioned. Next, as the component [2], for example, an ethylenically unsaturated group obtained by reacting a glycidyl compound with (meth) acrylic acid, an epoxy acrylate compound having two or more hydroxyl groups, a diisocyanate compound, and a carboxyl group. A compound obtained by reacting with a diol compound having the above can be used (see the above component (1) for specific examples of each compound). Next, as the component [3], for example, a titanium black to which a red pigment is added is used. Regarding the content of each component, the component [1] is preferably 5 to 30% by mass in the total amount excluding the colorant. In addition, the component [2] is preferably 5 to 30% by mass in the total amount excluding the colorant. The component [3] is preferably 0.5 to 5% by mass, and 20 to 40% by mass of the colorant is preferably a red pigment. As described above, by using the photosensitive resin layer 43 containing each of the above components, it is possible to obtain a protrusion 15 having resolvability and adhesion and capable of preventing the occurrence of undercut after curing. In addition to these components [1] to [3], a photopolymerizable compound (a compound having an ethylenically unsaturated bond) and a photopolymerization initiator (aromatic ketone, benzoin, benzyl derivative, 2,4,5- Triarylimidazole dimer, aclysine derivative, N-phenylglycine, N-phenylglycine derivative, coumarin compound, oxime ester compound, etc., thermosetting agent (epoxy resin, phenol resin, urea resin, melamine resin, etc.) A sex compound or a blocked isocyanate compound) can also be contained, and the content thereof is preferably 5 to 30% by mass of the photopolymerizable compound and preferably 0.1 to 5 by mass of the photopolymerization initiator. It is by mass%, and the thermosetting agent is preferably 5 to 30% by mass, more preferably 10 to 25% by mass.

The other photosensitive resin layer 43 (protrusion portion 15) includes a polymerizable prepolymer having a carboxyl group and an ethylenically unsaturated group (hereinafter referred to as component A) and dicyandiamide or a derivative thereof (hereinafter referred to as component a). And an amphoteric surfactant (hereinafter referred to as component c). First, as component A, for example, a polybase is added to a resin produced by a reaction between an epoxy resin (hereinafter referred to as component A1) and a monocarboxylic acid having an ethylenically unsaturated group (hereinafter referred to as component A2). An epoxy acrylate compound obtained by reacting an acid anhydride (hereinafter referred to as component A3) can be used, and as component A1, for example, a novolak type epoxy resin, a trisphenol methane type epoxy resin, and a bisphenol A type can be used. Epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin can be mentioned, and component A2 includes, for example, acrylic acid and acrylic acid. Quantities, methacrylic acid, β-flufuryl acrylic acid, β-styryl acrylate, cinnamic acid, crotonic acid, α-cyano cinnamic acid, sorbic acid, semi-ester compounds (acrylate with hydroxyl group or monoglycidyl ether with vinyl group) Alternatively, a reaction product of a monoglycidyl ester having a vinyl group and a dibasic acid anhydride having a saturated or unsaturated hydrocarbon group) can be mentioned, and component A3 has, for example, a saturated or unsaturated hydrocarbon group. Epoxy anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydroepoxy phthalic acid, hexahydroepoxy phthalic acid, methylhexahydroan phthalic acid, ethylhexahydroepoxy phthalic acid, Epoxy anhydride can be mentioned. In addition to this, the component A includes an epoxy acrylate compound having two or more hydroxyl groups and two or more ethylenically unsaturated groups (hereinafter referred to as component A4) and a diisocyanate compound (hereinafter referred to as component A5). ) And a diol compound having a carboxyl group (hereinafter referred to as component A6) can be used, and a polyurethane compound (urethane-modified epoxy acrylate compound) obtained by reacting the component A4 can be used. Examples thereof include reaction products of (bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, epoxy resin having a fluorene skeleton) and (meth) acrylic acid, and component A5 includes, for example, isocyanate. It has a group and has phenylenediocyanate, tolylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, diphenylmethane diisocyanate, naphthalenedi isocyanate, tridendiisocyanate, hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, isophorone diisocyanate, allylene sulfonate ether diisocyanate, ally. Lucian diisocyanate, N-acyldiisocyanate, trimethylhexamethylene diisocyanate, 1,3-bis (isocyanatemethyl) cyclohexane, and norbornan-diisocyanate methyl are mentioned, and examples of component A6 include dimethylolpropionic acid and dimethylolbutanoic acid. Can be mentioned. Next, examples of the component a include dicyandiamide, acryloyl dicyandiamide, and methacryloyl dicyandiamide. Next, as the component c, for example, N-lauryl-N, N-dimethyl-N-carboxymethylammonium, N-stearyl-N, N-dimethyl-N-carboxymethylammonium, N-lauryl-N, N- Betaine-type surfactants such as dihydroxyethyl-N-carboxymethylammonium, N-lauryl-N, N, N-tris (carboxymethyl) ammonium, 2-alkyl-N-carboxymethyl-N-hydroxyethyl imidazolium and the like. One or two selected from the group consisting of imidazolium salt-type surfactants, imidazoline-type surfactants such as imidazoline-N-sodium ethyl sulfonate and imidazoline-N-sodium ethyl sulfate, aminocarboxylic acids, and aminosulfates. The above compounds can be mentioned. Regarding the content of each component, the component A is preferably 10 to 60% by mass, more preferably 15 to 50% by mass, and further preferably 20 to 40% by mass. The component a is preferably 0.01 to 10% by mass, more preferably 0.5 to 5% by mass, and further preferably 0.1 to 3% by mass. The component c is preferably 0.01 to 10% by mass, more preferably 0.5 to 5% by mass, and further preferably 0.1 to 3% by mass. As described above, by using the photosensitive resin layer 43 containing each of the above components, the heat resistance is excellent, the generation of development residue can be suppressed, and the protrusion 15 can be formed. In addition to these components a to c, photopolymerizable compounds (reaction products of polyhydric alcohols and α, β-unsaturated carboxylic acids, 2,2-bis (4-((meth) acrylicoxypolyethoxy). ) Phenyl) propane, 2,2-bis (4-((meth) acryloxypolypropoxy) phenyl) propane, 2,2-bis (4-((meth) acrylicipolybutoxy) phenyl) propane, 2,2 -Bisphenol A-based (meth) acrylate compound such as 4-((meth) acryloxipolyethoxypolypropoxy) phenyl) propane; reaction product of α, β-unsaturated carboxylic acid with a compound having a glycidyl group; Urethane monomers such as (meth) acrylate compounds with urethane bonds; nonylphenoxypolyethyleneoxyacrylate; γ-chloro-β-hydroxypropyl-β'-(meth) acryloyloxyethyl-o-phthalate and β-hydroxyalkyl-β' -Phenylate compounds such as (meth) acryloyloxyalkyl-o-phthalate; (meth) acrylic acid alkyl esters), photopolymerization initiators (substituted or unsubstituted polynuclear quinones, α-ketaldonyl alcohols, ethers) , Α-Hydrocarbon-substituted aromatic acyloins, aromatic ketones, thioxanthones, acylphosphine oxides, α-aminoalkylphenyls, etc.) can also be contained, and the content thereof is photopolymerizable. The compound is preferably 10 to 60% by mass, more preferably 15 to 50% by mass, still more preferably 20 to 40% by mass, and the photopolymerization initiator is preferably 0.1 to 10% by mass, more preferably. It is 0.5 to 7% by mass, more preferably 1 to 5% by mass.

1 Mask 2 Solder ball 3 Work 6 Electrode 10 Mask body 12 Through hole 15 Protrusion 15a Crosspiece 15b Strut 15c Strut 15'Tip 15 "Root 40 Mother type 41 Pattern resist 41a Resist body 42 Electrodeposition layer 43 Photosensitive resin layer 44 Resin body 50 Coating layer

Claims (3)

An arrangement mask in which the solder balls (2) are mounted at predetermined positions on the work (3) by transferring the solder balls (2) into the through holes (12) corresponding to the predetermined arrangement pattern.
A mask main body (10) having the through hole (12) and a protrusion (15) provided on the facing surface side of the mask main body (10) with the work (3) are provided.
The protrusion (15) is an array mask, characterized in that it is made of an epoxy resin. The array mask according to claim 1, wherein the protrusion (15) is formed of a resin containing an epoxy acrylate compound. The array mask according to claim 2, wherein the protrusion (15) is formed of a resin containing (meth) acrylic acid and an epoxy compound.