WO2015068722A1 - Method for manufacturing cured film, method for manufacturing electronic component, and electronic component - Google Patents
Method for manufacturing cured film, method for manufacturing electronic component, and electronic component Download PDFInfo
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- WO2015068722A1 WO2015068722A1 PCT/JP2014/079320 JP2014079320W WO2015068722A1 WO 2015068722 A1 WO2015068722 A1 WO 2015068722A1 JP 2014079320 W JP2014079320 W JP 2014079320W WO 2015068722 A1 WO2015068722 A1 WO 2015068722A1
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- curable composition
- film
- cured
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- light irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
- B41J11/00214—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Definitions
- the present invention relates to a method for producing a cured product film in which a cured product film is formed using a curable composition having photocurability and thermosetting properties. Moreover, this invention relates to the manufacturing method and electronic component of an electronic component which applied the manufacturing method of the said hardened
- various other electronic components are mounted on an electronic component such as a substrate, and the electronic components are electrically connected by wiring.
- a resist pattern or a partition wall is formed between the wirings that electrically connect the electronic components in order to ensure insulation or to function as a protective film.
- An object of the present invention is to provide a method for producing a cured product film that can improve the formation accuracy of a fine cured product film and can improve the adhesion of the cured product film. It is another object of the present invention to provide an electronic component manufacturing method and an electronic component to which the cured film manufacturing method is applied.
- cured material film is a said 1st light irradiation part after the said 1st light irradiation process and before the said heating process.
- An irradiation process is further provided.
- the temperature of the curable composition being circulated is 40 ° C. or higher and 100 ° C. or lower.
- the viscosity at the time of discharging the curable composition is 3 mPa ⁇ s or more and 1500 mPa ⁇ s or less.
- the curable composition includes a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermosetting agent.
- the curable composition includes the photocurable compound, light and a thermosetting compound, the thermosetting compound, and the photopolymerization start. And a thermosetting agent.
- the said photocurable compound has a (meth) acryloyl group
- the said light and a thermosetting compound are a (meth) acryloyl group and cyclic ether.
- the thermosetting compound has a cyclic ether group.
- the curable composition has, as the photocurable compound, a monofunctional compound having one (meth) acryloyl group, and a (meth) acryloyl group. And a polyfunctional compound having 2 or more.
- the method includes a step of forming a cured product film on the electronic component body by the above-described method for producing a cured product film, the electronic component body, and the cured product film on the electronic component body.
- An electronic component manufacturing method for obtaining an electronic component comprising:
- an electronic component comprising an electronic component main body and a cured product film obtained by the above-described method for producing a cured product film on the electronic component main body.
- the method for producing a cured film according to the present invention includes the first light irradiation described above after the coating step of applying a liquid curable composition having photocurability and thermosetting using an inkjet apparatus. And the heating process described above, the ink jet apparatus further includes the ink tank, the discharge section, and the circulation flow path section. In the coating process, the curable composition is contained in the ink jet apparatus. After the product is moved from the ink tank to the discharge part, the curable composition that has not been discharged from the discharge part flows through the circulation flow path part and is moved to the ink tank. Since the coating is performed while circulating the composition, it is possible to increase the accuracy of forming a fine cured product film and to improve the adhesion of the cured product film.
- FIG. 1 (a) to 1 (e) are cross-sectional views for explaining each step of a method for producing a cured product film according to an embodiment of the present invention.
- FIG. 2 is a front cross-sectional view schematically showing an electronic component including a cured product film obtained by the method for producing a cured product film according to an embodiment of the present invention.
- FIG. 3 is a schematic configuration diagram showing an example of an ink jet apparatus used in the method for producing a cured film according to an embodiment of the present invention.
- FIG. 4 is a schematic configuration diagram showing another example of an ink jet apparatus used in the method for manufacturing a cured film according to an embodiment of the present invention.
- FIG. 5: is front sectional drawing which shows typically an electronic component provided with the hardened
- the method for producing a cured film according to the present invention includes a coating step of applying a liquid curable composition having photocurability and thermosetting using an inkjet apparatus. Moreover, the manufacturing method of the hardened
- the inkjet device is connected to the ink tank in which the curable composition is stored, the ink tank, and the curable composition is discharged.
- the discharge section has one end connected to the discharge section, the other end connected to the ink tank section, and a circulation flow path section through which the curable composition flows.
- the curable composition in the coating step, was not ejected from the ejection unit after being moved from the ink tank to the ejection unit in the inkjet apparatus.
- the curable composition is applied while circulating the curable composition by flowing through the circulation channel and moving to the ink tank.
- the curing is further performed in the inkjet device using the specific inkjet device.
- the curable composition is moved from the ink tank to the discharge portion, the curable composition that has not been discharged from the discharge portion is caused to flow through the circulation flow path portion and be moved to the ink tank. Since it applies, circulating a curable composition, the formation precision of a fine cured material film can be improved and the adhesiveness of a cured material film can be improved. In order to obtain the effects of the present invention, it is significant to apply the curable composition while circulating it.
- membrane which concerns on this invention, Preferably, on the said preliminary-hardened
- a thick cured product film can be formed with high accuracy.
- a cured film having a good predetermined shape can be formed without performing many steps such as an exposure step and a development step in photolithography. For this reason, the amount of waste can be reduced, the environmental load can be reduced, and the material cost for forming the electronic component can also be reduced.
- the electronic component body include semiconductor chips, semiconductor wafers after dicing (divided semiconductor wafers), capacitors, diodes, printed boards, flexible printed boards, glass epoxy boards, and glass boards.
- the electronic component body may have a cured product film on the surface.
- a cured product film may be formed on the cured product film.
- the curable composition 12 which has photocurability and thermosetting, and is liquid is apply
- the curable composition 12 is applied to the entire surface of the electronic component body 2.
- the droplets of the curable composition 12 are mixed with each other, and the state shown in FIG.
- the curable composition that has not been discharged from the discharge unit 22 is removed from the circulation flow path unit. 23 is moved to the ink tank 21. Thereby, in the application step, the curable composition is applied while being circulated.
- the reaction is allowed to proceed to increase the viscosity. It is also included.
- the light irradiation apparatus is not particularly limited, and examples thereof include a light emitting diode (UV-LED) that generates ultraviolet rays, a metal halide lamp, a high pressure mercury lamp, and an ultrahigh pressure mercury lamp. From the viewpoint of further improving the accuracy of forming the cured film, it is particularly preferable to use a UV-LED for the first light irradiation section.
- UV-LED light emitting diode
- the precured material film 12Y was heated and irradiated with light by the second light irradiation unit 14.
- the precured material film 12Y is cured to form the cured material film 3 (heating process). If the second light irradiation step is not performed after the multilayering step, the multilayer preliminary-cured material film 12X is heated after the multilayering step to cure the multilayer preliminary-cured material film 12X. Thus, a cured product film can be formed (heating step).
- the application step and the first light irradiation step are performed on the precured material film to laminate the precured material film.
- the coating step and the first light irradiation step may be performed.
- (meth) acrylate indicates acrylate or methacrylate.
- (meth) acryl refers to acryl or methacryl.
- Examples of the compound having the (meth) acryloyl group and the epoxy group include glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether.
- the urethane-modified (meth) acrylic epoxy compound is obtained, for example, by the following method.
- a polyol and a bifunctional or higher functional isocyanate are reacted, and the remaining isocyanate group is reacted with a (meth) acryl monomer having an acid group and glycidol.
- a (meth) acryl monomer having a hydroxyl group in a bifunctional or higher isocyanate and glycidol may be reacted without using a polyol.
- the urethane-modified (meth) acryl epoxy compound can be obtained by reacting glycidol with a (meth) acrylate monomer having an isocyanate group.
- the polyol is not particularly limited, and examples thereof include ethylene glycol, glycerin, sorbitol, trimethylolpropane, and (poly) propylene glycol.
- the total of the photocurable compound and the light and thermosetting compound in 100% by weight of the curable composition is preferably 40% by weight or more, more preferably 50% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less.
- the photo radical polymerization initiator is not particularly limited.
- the photo radical polymerization initiator is a compound for generating radicals upon light irradiation and initiating a radical polymerization reaction.
- Specific examples of the photo radical polymerization initiator include, for example, benzoin, benzoin alkyl ethers, acetophenones, aminoacetophenones, anthraquinones, thioxanthones, ketals, 2,4,5-triarylimidazole dimer, Examples include riboflavin tetrabutyrate, thiol compounds, 2,4,6-tris-s-triazine, organic halogen compounds, benzophenones, xanthones, and 2,4,6-trimethylbenzoyldiphenylphosphine oxide.
- the said radical photopolymerization initiator only 1 type may be used and 2 or more types may be used together.
- a titanocene compound such as CGI-784 (manufactured by Ciba Specialty Chemicals) having absorption in the visible light region may be used to promote the photoreaction.
- epoxy compound addition polyamine reaction product of epoxy compound and polyamine
- Michael addition polyamine reaction product of ⁇ , ⁇ unsaturated ketone and polyamine
- Mannich addition polyamine condensate of polyamine, formalin and phenol
- thiourea addition Adducts such as polyamine (reaction product of thiourea and polyamine) and ketone-capped polyamine (reaction product of ketone compound and polyamine [ketimine]) may also be used.
- guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, ⁇ -2,5-dimethylguanide, ⁇ , ⁇ -diphenyldiguanide, ⁇ , ⁇ -bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, Examples include ⁇ , ⁇ -hexamethylenebis [ ⁇ - (p-chlorophenol)] diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.
- Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, dodecyl succinic anhydride, chlorendic acid, pyromellitic anhydride, Examples include benzophenone tetracarboxylic acid anhydride, methylcyclohexene tetracarboxylic acid anhydride, trimellitic anhydride, and polyazeline acid anhydride.
- the curable composition may contain other components. Although it does not specifically limit as another component, Adhesion adjuvants, such as a coupling agent, a pigment, dye, a leveling agent, an antifoamer, a polymerization inhibitor, etc. are mentioned.
- curable composition A 60 parts by weight of trimethylolpropane triacrylate (TMPTA, manufactured by Daicel Ornex Co., Ltd.) as a photocurable compound, and acrylic acid adduct of bisphenol A type epoxy resin (UVACURE 1561, manufactured by Daicel Ornex Co., Ltd.) as a light and thermosetting compound 10 Parts by weight, 30 parts by weight of a bisphenol A type epoxy compound (EXA850CRP, manufactured by DIC) as a thermosetting compound, 30 parts by weight of a terpene acid anhydride compound (YH309, manufactured by Mitsubishi Chemical Corporation), and DBU as a curing accelerator -1 part by weight of octylate (UCAT SA102, manufactured by San Apro) and 5 parts by weight of 2-benzyl-2-dimethylamino-4-morpholinobutyrophenone (IRUGACURE 369, manufactured by BASF
- Example 1 Film formation A FR-4 substrate (Panasonic “R-1705” (plate thickness 0.8 mm)) and a catalyst (Rohm and Haas “Catalyst 44”) and a copper plating solution (Rohm and Haas) Manufactured by “Cuposit 253”) and a copper plating layer as a copper wiring was partially formed to obtain a substrate (copper-clad laminate).
- the cured product is subjected to the steps shown in FIGS. 1A to 1E (however, the conditions are set as shown in Table 3 below).
- a film was formed. While circulating the curable composition A, the coating step for coating and the first light irradiation step are performed once, the heating step is performed to form a cured film, and a printed wiring as an electronic component I got a plate. In the coating step, coating was performed while circulating the curable composition.
- the coating pattern was a flat film of 5 cm ⁇ 5 cm, and 20 films were formed.
- Example 2 to 10 and Comparative Examples 1 to 4 Film formation and fine pattern formation were performed in the same manner as in Example 1 except that the type of the curable composition and the production conditions were changed as shown in Table 3 below.
- Line width is 80 ⁇ 5 ⁇ m ⁇ : Not equivalent to ⁇
- line width is 80 ⁇ 10 ⁇ m ⁇ : Not equivalent to ⁇ and ⁇
- line width is 80 ⁇ 20 ⁇ m ⁇ : Does not correspond to OO, ⁇ and ⁇
- the line width is 80 ⁇ 30 ⁇ m
- XX The interval between the lines is lost, or the line width exceeds 80 ⁇ 30 ⁇ m
- thermosetting compound A 30 parts by weight of trimethylolpropane triacrylate (TMPTA, manufactured by Daicel Ornex) as a photocurable compound, 30 parts by weight of tricyclodecane dimethanol diacrylate (IRR-214K, manufactured by Daicel Ornex) as a photocurable compound, 10 parts by weight of an acrylic acid adduct of bisphenol A type epoxy compound (UVACURE 1561, manufactured by Daicel Ornex) as a light and thermosetting compound, and 30 parts by weight of bisphenol A type epoxy compound (EXA850CRP, manufactured by DIC) as a thermosetting compound 7.5 parts by weight of thermosetting agent A (synthesized in Synthesis Example 1) as a thermosetting agent, 1 part by weight of DBU-octylate (UCAT SA102, manufactured by San Apro) as a curing accelerator, and 2 parts as a photopolymerization initiator -Benzyl-2-dimethylamino-4 A curable composition A was
- Example 11 Film formation A FR-4 substrate (Panasonic “R-1705” (plate thickness 0.8 mm)) and a catalyst (Rohm and Haas “Catalyst 44”) and a copper plating solution (Rohm and Haas) Manufactured by “Cuposit 253”) and a copper plating layer as a copper wiring was partially formed to obtain a substrate (copper-clad laminate).
- the cured product is subjected to the steps shown in FIGS. 1A to 1E (however, the conditions are set as shown in Table 6 below).
- a film was formed. While the curable composition A is circulated, the coating step for coating and the first light irradiation step are repeated 10 times, and then the heating step is performed to form a cured product film, which is an electronic component.
- a printed wiring board was obtained. In the coating step, coating was performed while circulating the curable composition. The coating pattern was a flat film of 5 cm ⁇ 5 cm, and 20 films were formed.
- the cured product is subjected to the steps shown in FIGS. 1A to 1E (however, the conditions are set as shown in Table 6 below).
- a film was formed. While the curable composition A is circulated, the coating step for coating and the first light irradiation step are repeated 10 times, and then the heating step is performed to form a cured product film, which is an electronic component.
- a printed wiring board was obtained. In the coating step, coating was performed while circulating the curable composition. The coating pattern was coated so that the line width was 150 ⁇ m and the distance between the lines was 300 ⁇ m.
- Example 12 to 21 and Comparative Examples 5 to 8 Film formation and fine pattern formation were performed in the same manner as in Example 11 except that the type of the curable composition and the production conditions were changed as shown in Table 6 below.
- Line width is 150 ⁇ 30 ⁇ m ⁇ : Not equivalent to ⁇
- line width is 150 ⁇ 50 ⁇ m ⁇ : Not equivalent to ⁇ and ⁇
- line width is 150 ⁇ 80 ⁇ m ⁇ : Does not correspond to ⁇ , ⁇ and ⁇
- the line width is 150 ⁇ 120 ⁇ m XX: There is no gap between lines
- the substrate was observed with a stereoscopic microscope ("SMZ-10" manufactured by Nikon Corporation), and peeling was confirmed.
- SZ-10 stereoscopic microscope
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Abstract
Description
(光硬化性化合物)
上記光硬化性化合物としては、(メタ)アクリロイル基を有する硬化性化合物、ビニル基を有する硬化性化合物及びマレイミド基を有する硬化性化合物等が挙げられる。微細な硬化物膜及び厚みが厚い硬化物膜の形成精度をより一層高める観点からは、上記光硬化性化合物は、(メタ)アクリロイル基(1個以上)を有することが好ましい。上記光硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 (Curable compound)
(Photocurable compound)
Examples of the photocurable compound include a curable compound having a (meth) acryloyl group, a curable compound having a vinyl group, and a curable compound having a maleimide group. From the viewpoint of further improving the formation accuracy of a fine cured product film and a thick cured product film, the photocurable compound preferably has a (meth) acryloyl group (one or more). As for the said photocurable compound, only 1 type may be used and 2 or more types may be used together.
上記光及び熱硬化性化合物としては、各種の光硬化性官能基と各種の熱硬化性官能基とを有する化合物が挙げられる。微細な硬化物膜及び厚みが厚い硬化物膜の形成精度をより一層高める観点からは、上記光及び熱硬化性化合物は、(メタ)アクリロイル基と環状エーテル基とを有することが好ましく、(メタ)アクリロイル基とエポキシ基とを有することが好ましい。上記光及び熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 (Light and thermosetting compounds)
Examples of the light and thermosetting compounds include compounds having various photocurable functional groups and various thermosetting functional groups. From the viewpoint of further improving the formation accuracy of a fine cured film and a thick cured film, the light and thermosetting compound preferably have a (meth) acryloyl group and a cyclic ether group. ) It preferably has an acryloyl group and an epoxy group. As for the said light and a thermosetting compound, only 1 type may be used and 2 or more types may be used together.
上記熱硬化性化合物としては、環状エーテル基を有する熱硬化性化合物、及びチイラン基を有する熱硬化性化合物等が挙げられる。微細な硬化物膜及び厚みが厚い硬化物膜の形成精度をより一層高める観点からは、上記熱硬化性化合物は、環状エーテル基を有する熱硬化性化合物であることが好ましく、エポキシ基を有する熱硬化性化合物(エポキシ化合物)であることがより好ましい。上記熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 (Thermosetting compound)
Examples of the thermosetting compound include a thermosetting compound having a cyclic ether group, a thermosetting compound having a thiirane group, and the like. From the viewpoint of further improving the formation accuracy of the fine cured product film and the thick cured product film, the thermosetting compound is preferably a thermosetting compound having a cyclic ether group, and a heat having an epoxy group. More preferably, it is a curable compound (epoxy compound). As for the said thermosetting compound, only 1 type may be used and 2 or more types may be used together.
上記光重合開始剤としては、光ラジカル重合開始剤及び光カチオン重合開始剤等が挙げられる。上記光重合開始剤は、光ラジカル重合開始剤であることが好ましい。上記光重合開始剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 (Photopolymerization initiator)
Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator. The photopolymerization initiator is preferably a photoradical polymerization initiator. As for the said photoinitiator, only 1 type may be used and 2 or more types may be used together.
上記熱硬化剤としては、有機酸、アミン化合物、アミド化合物、ヒドラジド化合物、イミダゾール化合物、イミダゾリン化合物、フェノール化合物、ユリア化合物、ポリスルフィッド化合物及び酸無水物等が挙げられる。上記熱硬化剤として、アミン-エポキシアダクトなどの変性ポリアミン化合物を用いてもよい。これら以外の熱硬化剤を用いてもよい。上記熱硬化剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 (Thermosetting agent)
Examples of the thermosetting agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. A modified polyamine compound such as an amine-epoxy adduct may be used as the thermosetting agent. Thermosetting agents other than these may be used. As for the said thermosetting agent, only 1 type may be used and 2 or more types may be used together.
上記硬化促進剤としては、第三級アミン、イミダゾール、第四級アンモニウム塩、第四級ホスホニウム塩、有機金属塩、リン化合物及び尿素系化合物等が挙げられる。 (Curing accelerator)
Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, urea compounds, and the like.
上記硬化性組成物は、他の成分を含んでいてもよい。他の成分としては特に限定されないが、カップリング剤等の接着助剤、顔料、染料、レベリング剤、消泡剤、及び重合禁止剤等が挙げられる。 (Other ingredients)
The curable composition may contain other components. Although it does not specifically limit as another component, Adhesion adjuvants, such as a coupling agent, a pigment, dye, a leveling agent, an antifoamer, a polymerization inhibitor, etc. are mentioned.
(硬化性組成物Aの調製)
光硬化性化合物としてトリメチロールプロパントリアクリレート(TMPTA、ダイセル・オルネクス社製)60重量部、光及び熱硬化性化合物としてビスフェノールA型エポキシ樹脂のアクリル酸付加物(UVACURE1561、ダイセル・オルネクス社製)10重量部、熱硬化性化合物としてビスフェノールA型エポキシ化合物(EXA850CRP、DIC社製)30重量部、熱硬化剤としてテルペン系酸無水化合物(YH309、三菱化学社製)30重量部、硬化促進剤としてDBU-オクチル酸塩(UCAT SA102、サンアプロ社製)1重量部、及び光重合開始剤として2-ベンジル-2-ジメチルアミノ-4-モルホリノブチロフェノン(IRUGACURE369、BASF社製)5重量部を均一に混合し、硬化性組成物Aを得た。 (Examples and comparative examples in which the multilayering process was not performed)
(Preparation of curable composition A)
60 parts by weight of trimethylolpropane triacrylate (TMPTA, manufactured by Daicel Ornex Co., Ltd.) as a photocurable compound, and acrylic acid adduct of bisphenol A type epoxy resin (UVACURE 1561, manufactured by Daicel Ornex Co., Ltd.) as a light and thermosetting compound 10 Parts by weight, 30 parts by weight of a bisphenol A type epoxy compound (EXA850CRP, manufactured by DIC) as a thermosetting compound, 30 parts by weight of a terpene acid anhydride compound (YH309, manufactured by Mitsubishi Chemical Corporation), and DBU as a curing accelerator -1 part by weight of octylate (UCAT SA102, manufactured by San Apro) and 5 parts by weight of 2-benzyl-2-dimethylamino-4-morpholinobutyrophenone (IRUGACURE 369, manufactured by BASF) as a photopolymerization initiator were uniformly mixed. , Curable composition Product A was obtained.
下記の表1に示す成分を下記の表2に示す配合量で配合したこと以外は上記硬化性組成物Aの調製と同様にして調製した。得られた硬化性組成物B~Gの粘度も、硬化性組成物Aの粘度と同様にして、後述の膜形成、及び微細パターン形成時の循環温度(吐出時の温度)で測定した。 (Preparation of curable compositions B to G)
The components shown in Table 1 below were prepared in the same manner as in the preparation of the curable composition A except that the components shown in Table 2 below were added. Similarly to the viscosity of the curable composition A, the viscosity of the obtained curable compositions B to G was also measured at a circulation temperature (temperature at the time of discharge) during film formation and fine pattern formation described later.
(1)膜形成
FR-4基板(パナソニック社製「R-1705」(板厚0.8mm))にキャタリスト(ロームアンドハース社製「キャタリスト44」)及び銅めっき液(ロームアンドハース社製「キューポジット253」)を配置し、銅配線である銅めっき層を部分的に形成して、基板(銅張積層板)を得た。 Example 1
(1) Film formation A FR-4 substrate (Panasonic “R-1705” (plate thickness 0.8 mm)) and a catalyst (Rohm and Haas “Catalyst 44”) and a copper plating solution (Rohm and Haas) Manufactured by “Cuposit 253”) and a copper plating layer as a copper wiring was partially formed to obtain a substrate (copper-clad laminate).
FR-4基板(パナソニック社製「R-1705」(板厚0.8mm))にキャタリスト(ロームアンドハース社製「キャタリスト44」)及び銅めっき液(ロームアンドハース社製「キューポジット253」)を配置し、銅配線である銅めっき層を部分的に形成して、基板(銅張積層板)を得た。 (2) Fine pattern formation A FR-4 substrate (Panasonic “R-1705” (plate thickness 0.8 mm)) and a catalyst (Rohm and Haas “Catalyst 44”) and a copper plating solution (Rohm and Haas) “Cuposit 253” manufactured by the company was disposed, and a copper plating layer as a copper wiring was partially formed to obtain a substrate (copper-clad laminate).
硬化性組成物の種類、及び製造条件を下記の表3に示すように変更した以外は実施例1と同様にして、膜形成及び微細パターン形成を実施した。 (Examples 2 to 10 and Comparative Examples 1 to 4)
Film formation and fine pattern formation were performed in the same manner as in Example 1 except that the type of the curable composition and the production conditions were changed as shown in Table 3 below.
(1)膜形成を行った基板の評価(塗出抜けの確認)
実体顕微鏡(ニコン社製「SMZ-10」)にて膜の確認を行い、液の抜けの確認を行った。 (Evaluation)
(1) Evaluation of the substrate on which the film was formed (confirmation of missing coating)
The film was confirmed with a stereomicroscope (“SMZ-10” manufactured by Nikon Corporation), and liquid leakage was confirmed.
○:抜けのあるパターンが0/20
△:抜けのあるパターンが1/20以上、4/20以下
×:抜けのあるパターンが5/20以上 [Criteria for film formation]
○: The pattern with omission is 0/20
Δ: Missing pattern is 1/20 or more, 4/20 or less. X: Missing pattern is 5/20 or more.
光学顕微鏡(デジタルマイクロスコープVH―Z100、キーエンス社製)を用いてライン、ライン間の間隔を30点(塗布時に抜けのある部分は除く)測定した。 (2) Evaluation of substrate on which fine pattern was formed Using an optical microscope (digital microscope VH-Z100, manufactured by Keyence Corporation), the line and the interval between the lines were measured at 30 points (excluding the part where there was a drop during application). .
○○:ライン幅が80±5μm
○:○○に相当せず、ライン幅が80±10μm
△:○○及び○に相当せず、ライン幅が80±20μm
×:○○、○及び△に相当せず、ライン幅が80±30μm
××:ラインとラインの間隔がなくなっている、又はライン幅が80±30μmを超える [Judgment criteria for fine pattern formation]
○○: Line width is 80 ± 5μm
○: Not equivalent to ○○, line width is 80 ± 10μm
Δ: Not equivalent to ○○ and ○, line width is 80 ± 20 μm
×: Does not correspond to OO, ◯ and △, and the line width is 80 ± 30 μm
XX: The interval between the lines is lost, or the line width exceeds 80 ± 30 μm
膜形成を行った基板について、液槽式熱衝撃試験機(ESPEC社製「TSB-51」)を用いて、-50℃で5分間保持した後、125℃まで昇温し、125℃で5分間保持した後-50℃まで降温する過程を1サイクルとする冷熱サイクル試験を実施した。500サイクル後に基板を取り出した。 (3) Evaluation of adhesion of cured film on substrate on which film is formed (long-term reliability: evaluation of thermal cycle)
The substrate on which the film was formed was held at −50 ° C. for 5 minutes using a liquid bath thermal shock tester (“TSB-51” manufactured by ESPEC), then heated to 125 ° C. and then heated at 125 ° C. for 5 minutes. A cold cycle test was conducted in which the process of holding for a minute and then lowering to −50 ° C. was one cycle. The substrate was taken out after 500 cycles.
○:剥離していない
△:わずかに剥離している(使用上問題がない)
×:大きく剥離している(使用上問題があり) [Adhesion criteria]
○: not peeled △: slightly peeled (no problem in use)
×: Exfoliated greatly (there is a problem in use)
(合成例1)
攪拌器、温度計、滴下ロートを備えた3つ口セパラブルフラスコに、メチルセロソルブ50g、ジシアンジアミド15g、及び2,4-ジアミノ-6-[2’-ウンデシルイミダゾリル-(1’)]-エチル-s-トリアジン1gを加え、100℃に加熱してジシアンジアミドを溶解させた。溶解後、ブチルグリシジルエーテル130gを滴下ロートから20分かけて滴下し、1時間反応させた。その後60℃に温度を下げ、減圧にして溶媒を除去し、薄黄色の反応粘稠物(熱硬化剤A)を得た。 (Examples and comparative examples in which the multilayering process was performed)
(Synthesis Example 1)
In a three-necked separable flask equipped with a stirrer, thermometer and dropping funnel, 50 g of methyl cellosolve, 15 g of dicyandiamide, and 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl 1 g of -s-triazine was added and heated to 100 ° C. to dissolve dicyandiamide. After dissolution, 130 g of butyl glycidyl ether was added dropwise from the dropping funnel over 20 minutes and reacted for 1 hour. Thereafter, the temperature was lowered to 60 ° C., and the solvent was removed under reduced pressure to obtain a pale yellow reaction viscous product (thermosetting agent A).
光硬化性化合物としてトリメチロールプロパントリアクリレート(TMPTA、ダイセル・オルネクス社製)30重量部、光硬化性化合物としてトリシクロデカンジメタノールジアクリレート(IRR-214K、ダイセル・オルネクス社製)30重量部、光及び熱硬化性化合物としてビスフェノールA型エポキシ化合物のアクリル酸付加物(UVACURE1561、ダイセル・オルネクス社製)10重量部、熱硬化性化合物としてビスフェノールA型エポキシ化合物(EXA850CRP、DIC社製)30重量部、熱硬化剤として熱硬化剤A(合成例1で合成)7.5重量部、硬化促進剤としてDBU-オクチル酸塩(UCAT SA102、サンアプロ社製)1重量部、及び光重合開始剤として2-ベンジル-2-ジメチルアミノ-4-モルホリノブチロフェノン(IRUGACURE369、BASF社製)5重量部を均一に混合し、硬化性組成物Aを得た。 (Preparation of curable composition A)
30 parts by weight of trimethylolpropane triacrylate (TMPTA, manufactured by Daicel Ornex) as a photocurable compound, 30 parts by weight of tricyclodecane dimethanol diacrylate (IRR-214K, manufactured by Daicel Ornex) as a photocurable compound, 10 parts by weight of an acrylic acid adduct of bisphenol A type epoxy compound (UVACURE 1561, manufactured by Daicel Ornex) as a light and thermosetting compound, and 30 parts by weight of bisphenol A type epoxy compound (EXA850CRP, manufactured by DIC) as a thermosetting compound 7.5 parts by weight of thermosetting agent A (synthesized in Synthesis Example 1) as a thermosetting agent, 1 part by weight of DBU-octylate (UCAT SA102, manufactured by San Apro) as a curing accelerator, and 2 parts as a photopolymerization initiator -Benzyl-2-dimethylamino-4 A curable composition A was obtained by uniformly mixing 5 parts by weight of morpholinobyllophenone (IRUGACURE 369, manufactured by BASF).
下記の表4に示す成分を下記の表5に示す配合量で配合したこと以外は上記硬化性組成物Aの調製と同様にして調製した。得られた硬化性組成物B~Hの粘度も、硬化性組成物Aの粘度と同様にして測定した。 (Preparation of curable compositions B to H)
The components shown in the following Table 4 were prepared in the same manner as in the preparation of the curable composition A except that the components shown in the following Table 5 were added. The viscosity of the obtained curable compositions B to H was also measured in the same manner as the viscosity of the curable composition A.
(1)膜形成
FR-4基板(パナソニック社製「R-1705」(板厚0.8mm))にキャタリスト(ロームアンドハース社製「キャタリスト44」)及び銅めっき液(ロームアンドハース社製「キューポジット253」)を配置し、銅配線である銅めっき層を部分的に形成して、基板(銅張積層板)を得た。 (Example 11)
(1) Film formation A FR-4 substrate (Panasonic “R-1705” (plate thickness 0.8 mm)) and a catalyst (Rohm and Haas “Catalyst 44”) and a copper plating solution (Rohm and Haas) Manufactured by “Cuposit 253”) and a copper plating layer as a copper wiring was partially formed to obtain a substrate (copper-clad laminate).
FR-4基板(パナソニック電工社製「R-1705」(板厚0.8mm))にキャタリスト(ロームアンドハース社製「キャタリスト44」)及び銅めっき液(ロームアンドハース社製「キューポジット253」)を配置し、銅配線である銅めっき層を部分的に形成して、基板(銅張積層板)を得た。 (2) Fine pattern formation An FR-4 substrate (“R-1705” manufactured by Panasonic Electric Works Co., Ltd. (plate thickness 0.8 mm)) and a catalyst (“Catalyst 44” manufactured by Rohm and Haas)) and a copper plating solution (Rohm and A “Cuposit 253” manufactured by Haas Co., Ltd.) was placed, and a copper plating layer as a copper wiring was partially formed to obtain a substrate (copper-clad laminate).
硬化性組成物の種類、及び製造条件を下記の表6に示すように変更した以外は実施例11と同様にして、膜形成及び微細パターン形成を実施した。 (Examples 12 to 21 and Comparative Examples 5 to 8)
Film formation and fine pattern formation were performed in the same manner as in Example 11 except that the type of the curable composition and the production conditions were changed as shown in Table 6 below.
(1)膜形成を行った基板の評価(塗出抜けの確認)
実体顕微鏡(ニコン社製「SMZ-10」)にて膜の確認を行い、液の抜けの確認を行った。 (Evaluation)
(1) Evaluation of the substrate on which the film was formed (confirmation of missing coating)
The film was confirmed with a stereomicroscope (“SMZ-10” manufactured by Nikon Corporation), and liquid leakage was confirmed.
○:抜けのあるパターンが0/20
△:抜けのあるパターンが1/20以上、4/20以下
×:抜けのあるパターンが5/20以上 [Criteria for film formation]
○: The pattern with omission is 0/20
Δ: Missing pattern is 1/20 or more, 4/20 or less. X: Missing pattern is 5/20 or more.
光学顕微鏡(デジタルマイクロスコープVH―Z100、キーエンス社製)を用いてライン、ライン間の間隔を30点(塗布時に抜けのある部分は除く)測定した。 (2) Evaluation of substrate on which fine pattern formation (thickness pattern formation) was performed Using an optical microscope (Digital Microscope VH-Z100, manufactured by Keyence Corporation), 30 lines (intervals between lines) (Except for some parts)
○○:ライン幅が150±30μm
○:○○に相当せず、ライン幅が150±50μm
△:○○及び○に相当せず、ライン幅が150±80μm
×:○○、○及び△に相当せず、ライン幅が150±120μm
××:ラインとラインの間隔とがなくなっている [Criteria for fine pattern formation (thick pattern formation)]
○○: Line width is 150 ± 30μm
○: Not equivalent to ○○, line width is 150 ± 50μm
Δ: Not equivalent to ○○ and ○, line width is 150 ± 80 μm
×: Does not correspond to ○○, ○ and △, and the line width is 150 ± 120 μm
XX: There is no gap between lines
膜形成を行った基板について、液槽式熱衝撃試験機(ESPEC社製「TSB-51」)を用いて、-50℃で5分間保持した後、125℃まで昇温し、125℃で5分間保持した後-50℃まで降温する過程を1サイクルとする冷熱サイクル試験を実施した。500サイクル後に基板を取り出した。 (3) Evaluation of adhesion of cured film on substrate on which film is formed (long-term reliability: evaluation of thermal cycle)
The substrate on which the film was formed was held at −50 ° C. for 5 minutes using a liquid bath thermal shock tester (“TSB-51” manufactured by ESPEC), then heated to 125 ° C. and then heated at 125 ° C. for 5 minutes. A cold cycle test was conducted in which the process of holding for a minute and then lowering to −50 ° C. was one cycle. The substrate was taken out after 500 cycles.
○:剥離していない
△:わずかに剥離している(使用上問題がない)
×:大きく剥離している(使用上問題があり) [Adhesion criteria]
○: not peeled △: slightly peeled (no problem in use)
×: Exfoliated greatly (there is a problem in use)
2…電子部品本体
3…多層の硬化物膜(加熱後)
3A,3B,3C…硬化物膜(加熱後)
11,11X…インクジェット装置
12…硬化性組成物
12A,12B,12C…第1の光照射部により光が照射された予備硬化物膜
12X…多層の予備硬化物膜
12Y…第2の光照射部により光が照射された多層の予備硬化物膜
13…第1の光照射部
14…第2の光照射部
21…インクタンク
22…吐出部
23,23X…循環流路部
23A…バッファタンク
23B…ポンプ
31…電子部品
32…硬化物膜 DESCRIPTION OF
3A, 3B, 3C ... cured product film (after heating)
DESCRIPTION OF
Claims (16)
- インクジェット装置を用いて、光硬化性及び熱硬化性を有しかつ液状である硬化性組成物を塗布する塗布工程と、
前記塗布工程後に、第1の光照射部から前記硬化性組成物に光を照射して、前記硬化性組成物の硬化を進行させて、予備硬化物膜を形成する第1の光照射工程と、
前記第1の光照射工程後に、光が照射された前記予備硬化物膜を加熱して、光が照射された前記予備硬化物膜を硬化させて、硬化物膜を形成する加熱工程とを備え、
前記インクジェット装置が、前記硬化性組成物が貯留されるインクタンクと、前記インクタンクと接続されておりかつ前記硬化性組成物が吐出される吐出部と、一端が前記吐出部に接続されており、他端が前記インクタンク部に接続されており、かつ内部を前記硬化性組成物が流れる循環流路部とを有し、
前記塗布工程において、前記インクジェット装置内で、前記硬化性組成物を前記インクタンクから前記吐出部に移動させた後に、前記吐出部から吐出されなかった前記硬化性組成物を、前記循環流路部内を流して前記インクタンクに移動させることにより、前記硬化性組成物を循環させながら、塗布する、硬化物膜の製造方法。 An application step of applying a liquid curable composition having photocurability and thermosetting using an inkjet device;
A first light irradiation step of forming a preliminary-cured product film by irradiating the curable composition with light from a first light irradiation unit after the coating step to advance the curing of the curable composition; ,
A heating step of heating the preliminary-cured material film irradiated with light after the first light irradiation step to cure the preliminary-cured material film irradiated with light to form a cured product film; ,
The ink jet device includes an ink tank in which the curable composition is stored, a discharge unit that is connected to the ink tank and discharges the curable composition, and one end connected to the discharge unit. The other end is connected to the ink tank portion, and has a circulation flow path portion through which the curable composition flows.
In the application step, after the curable composition is moved from the ink tank to the discharge unit in the ink jet apparatus, the curable composition that has not been discharged from the discharge unit is placed in the circulation channel unit. The cured product film is applied by circulating and moving the curable composition by circulating it to the ink tank. - 前記第1の光照射工程後かつ前記加熱工程前に、前記第1の光照射部とは別の第2の光照射部から、前記第1の光照射部から光が照射された前記予備硬化物膜に光を照射して、前記予備硬化物膜の硬化をさらに進行させる第2の光照射工程をさらに備える、請求項1に記載の硬化物膜の製造方法。 After the first light irradiation step and before the heating step, the preliminary curing in which light is irradiated from the first light irradiation unit from a second light irradiation unit different from the first light irradiation unit The manufacturing method of the hardened | cured material film | membrane of Claim 1 further equipped with the 2nd light irradiation process of irradiating light to a physical film and further progressing hardening of the said precured material film.
- 前記第1の光照射工程後かつ前記加熱工程前に、前記第1の光照射工程後の前記予備硬化物膜上にて、前記塗布工程と前記第1の光照射工程とを行い、前記予備硬化物膜上に他の予備硬化物膜を形成することにより、多層の予備硬化物膜を形成する多層化工程をさらに備える、請求項1に記載の硬化物膜の製造方法。 After the first light irradiation step and before the heating step, the application step and the first light irradiation step are performed on the preliminary-cured material film after the first light irradiation step, The manufacturing method of the hardened | cured material film | membrane of Claim 1 further equipped with the multilayering process which forms a multi-layered precured material film by forming another preliminary | backup cured material film on a cured | curing material film.
- 前記多層化工程後かつ前記加熱工程前に、前記第1の光照射部とは別の第2の光照射部から、前記多層の予備硬化物膜に光を照射して、前記多層の予備硬化物膜の硬化をさらに進行させる第2の光照射工程をさらに備える、請求項3に記載の硬化物膜の製造方法。 After the multilayering step and before the heating step, the multilayer preliminary-cured material film is irradiated with light from a second light-irradiation unit different from the first light-irradiation unit, and the multilayer preliminary curing is performed. The manufacturing method of the hardened | cured material film of Claim 3 further equipped with the 2nd light irradiation process which further advances hardening of a physical film.
- 前記循環流路部が、前記循環流路部内に、前記硬化性組成物が仮貯留されるバッファタンクを含む、請求項1~4のいずれか1項に記載の硬化物膜の製造方法。 The method for producing a cured product film according to any one of claims 1 to 4, wherein the circulation channel section includes a buffer tank in which the curable composition is temporarily stored in the circulation channel section.
- 前記第1の光照射工程後の前記予備硬化物膜上又は前記予備硬化物膜間にて、前記塗布工程と、前記第1の光照射工程とを行う、請求項1~5のいずれか1項に記載の硬化物膜の製造方法。 The coating step and the first light irradiation step are performed on the preliminary-cured material film or between the preliminary-cured material films after the first light irradiation step. The manufacturing method of hardened | cured material film as described in a term.
- 循環されている前記硬化性組成物の温度が40℃以上、100℃以下である、請求項1~6のいずれか1項に記載の硬化物膜の製造方法。 The method for producing a cured film according to any one of claims 1 to 6, wherein the temperature of the curable composition being circulated is 40 ° C or higher and 100 ° C or lower.
- 前記インクジェット装置がピエゾ方式のインクジェットヘッドを用いるインクジェット装置であり、
前記塗布工程において、ピエゾ素子の作用によって、前記硬化性組成物を塗布する、請求項1~7のいずれか1項に記載の硬化物膜の製造方法。 The inkjet device is an inkjet device using a piezoelectric inkjet head;
The method for producing a cured product film according to any one of claims 1 to 7, wherein in the coating step, the curable composition is applied by an action of a piezo element. - 前記硬化性組成物の吐出時の粘度が3mPa・s以上、1500mPa・s以下である、請求項1~8のいずれか1項に記載の硬化物膜の製造方法。 The method for producing a cured film according to any one of claims 1 to 8, wherein the viscosity at the time of discharging the curable composition is 3 mPa · s or more and 1500 mPa · s or less.
- 前記硬化性組成物が、光硬化性化合物と、熱硬化性化合物と、光重合開始剤と、熱硬化剤とを含む、請求項1~9のいずれか1項に記載の硬化物膜の製造方法。 The production of the cured film according to any one of claims 1 to 9, wherein the curable composition comprises a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermosetting agent. Method.
- 前記硬化性組成物が、前記光硬化性化合物と、光及び熱硬化性化合物と、前記熱硬化性化合物と、前記光重合開始剤と、前記熱硬化剤とを含む、請求項10に記載の硬化物膜の製造方法。 The said curable composition contains the said photocurable compound, light and a thermosetting compound, the said thermosetting compound, the said photoinitiator, and the said thermosetting agent. A method for producing a cured film.
- 前記光硬化性化合物が、(メタ)アクリロイル基を有し、
前記光及び熱硬化性化合物が、(メタ)アクリロイル基と環状エーテル基とを有し、
前記熱硬化性化合物が、環状エーテル基を有する、請求項11に記載の硬化物膜の製造方法。 The photocurable compound has a (meth) acryloyl group,
The light and thermosetting compound has a (meth) acryloyl group and a cyclic ether group,
The manufacturing method of the hardened | cured material film | membrane of Claim 11 in which the said thermosetting compound has a cyclic ether group. - 前記硬化性組成物が、前記光硬化性化合物として、(メタ)アクリロイル基を1個有する単官能化合物と、(メタ)アクリロイル基を2個以上有する多官能化合物とを含む、請求項10~12のいずれか1項に記載の硬化物膜の製造方法。 The curable composition comprises, as the photocurable compound, a monofunctional compound having one (meth) acryloyl group and a polyfunctional compound having two or more (meth) acryloyl groups. The manufacturing method of the hardened | cured material film of any one of these.
- 前記硬化性組成物が、光及び熱硬化性化合物を含み、
前記硬化性組成物100重量%中、前記光硬化性化合物と前記光及び熱硬化性化合物との合計の含有量が40重量%以上、90重量%以下である、請求項10~13のいずれか1項に記載の硬化物膜の製造方法。 The curable composition comprises light and a thermosetting compound;
The total content of the photocurable compound and the light and thermosetting compound in 100% by weight of the curable composition is 40% by weight or more and 90% by weight or less. 2. A method for producing a cured product film according to item 1. - 電子部品本体上に、請求項1~14のいずれか1項に記載の硬化物膜の製造方法によって硬化物膜を形成する工程を備え、
電子部品本体と、前記電子部品本体上に前記硬化物膜とを備える電子部品を得る、電子部品の製造方法。 A step of forming a cured product film on the electronic component main body by the method for producing a cured product film according to any one of claims 1 to 14,
The manufacturing method of an electronic component which obtains an electronic component provided with an electronic component main body and the said hardened | cured material film on the said electronic component main body. - 電子部品本体と、
前記電子部品本体上に、請求項1~14のいずれか1項に記載の硬化物膜の製造方法により得られる硬化物膜とを備える、電子部品。 An electronic component body;
An electronic component comprising: a cured product film obtained by the method for producing a cured product film according to any one of claims 1 to 14 on the electronic component body.
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US14/778,859 US11220604B2 (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
KR1020217040716A KR102400772B1 (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
KR1020167029034A KR20160124256A (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
EP14859434.4A EP3067124B1 (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
KR1020157019456A KR20160014572A (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
CN201480007000.2A CN104981299B (en) | 2013-11-06 | 2014-11-05 | The manufacturing method of cured film, the manufacturing method of electronic component and electronic component |
KR1020207029519A KR102339967B1 (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
KR1020167001225A KR20160011707A (en) | 2013-11-06 | 2014-11-05 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
US17/548,454 US20220098419A1 (en) | 2013-11-06 | 2021-12-10 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
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