JP2020150102A - Component loading device and component loading method - Google Patents

Abstract

To provide a component loading device and a component loading method capable of improving loading accuracy of each of loaded components while keeping high connection reliability between vertically adjacent loaded components.SOLUTION: A lower component which is loaded just before is imaged from an upper side (step ST2), and an upper component to be loaded is imaged from a lower side (step ST3). Thus, a post-loading position of the lower component is calculated and a pre-loading position of the upper component is calculated (step ST4). When a post-loading position of a reference loaded component (lowermost layer component 2A) which is positioned at a lower layer side than the lower component is read out of a storage section 14b (step ST5), an alignment amount of the upper component with respect to the lower component is set based on the post-loading position of the lower component, the pre-loading position of the upper component and the post-loading position of the reference loaded component (step ST6). The other loaded component is aligned according to the set alignment amount, and the upper component is loaded on the lower component (step ST7).SELECTED DRAWING: Figure 5

Description

The present invention relates to a component mounting device and a component mounting method for repeatedly executing an operation of mounting another mounted component on one mounted component.

Conventionally, there has been known a component mounting device that stacks a plurality of mounted components in the vertical direction by repeatedly executing an operation of mounting another mounted component on one mounted component. The mounted parts are provided with electrodes on the lower surface and the upper surface, respectively, and in the component mounting device, the lower surface side electrodes provided on the lower surface side of the mounted component (referred to as the upper component) to be mounted are mounted immediately before. The upper component is mounted on the lower component so as to come into contact with the upper surface electrode provided on the upper surface side of the mounted component (referred to as the lower component).

In such a component mounting device, the alignment mark provided on the upper surface side of the lower component is imaged from above to calculate the position, and the alignment mark provided on the lower surface side of the upper component is imaged from the lower side. The position of the upper component is calculated so that the alignment marks match each other so that the upper component is mounted on the lower component (for example, Patent Document 1 below). When the mounted parts are mounted in this procedure, a sufficiently large electrode contact area is secured between the mounted parts adjacent to the top and bottom, so that it is possible to manufacture a product with high electrical connection reliability. Is.

Re-table 2011/087003

However, as described above, when the upper parts are mounted based on the positional relationship with the lower parts, the misalignment of the upper parts with respect to the lower parts accumulates toward the upper layer side, and each mounting There is a problem that the mounting accuracy of parts (mounting accuracy based on the mounting parts of the lowest layer) may be significantly lowered.

Therefore, an object of the present invention is to provide a component mounting device and a component mounting method capable of improving the mounting accuracy of each mounted component while maintaining high connection reliability between vertically adjacent mounted components.

The component mounting device of the present invention is placed on the one mounted component so that the lower surface side electrode provided on the lower surface side of the other mounted component is in contact with the upper surface side electrode provided on the upper surface side of the one mounted component. A component mounting device that repeatedly executes the operation of mounting the other mounted components, the first imaging unit that images the one mounted component from above, and the second imaging unit that images the other mounted components from below. Based on the results of imaging by the imaging unit and the first imaging unit, the position of the one mounted component is calculated as the post-mounting position of the one mounted component, and the result of imaging by the second imaging unit is obtained. Based on the position calculation unit that calculates the position of the other mounted component as the pre-mounting position of the other mounted component, the post-mounting position of the one mounted component calculated by the position calculation unit, and the position calculation unit. Based on the calculated pre-mounting position of the other mounted component and the post-mounting position of the reference mounted component, which is a specific mounted component located on the lower layer side of the one mounted component, the other mounted component with respect to the one mounted component. After aligning the other mounted parts with respect to the one mounted component with the alignment amount setting unit for setting the alignment amount of the mounted parts and the alignment amount set by the alignment amount setting unit. , The mounting control unit for mounting the other mounting component on the one mounting component is provided.

In the component mounting method of the present invention, the upper surface side electrode provided on the upper surface side of one mounted component is placed on the one mounted component so that the lower surface side electrode provided on the lower surface side of the other mounted component is in contact with the upper surface side electrode. A component mounting method for repeatedly executing the operation of mounting the other mounted components, wherein the first mounted component is imaged from above and the other mounted component is imaged from below. Based on the result of imaging in the imaging step and the first imaging step, the position of the one mounted component is calculated as the position after mounting of the one mounted component, and the result of imaging in the second imaging step is obtained. Based on this, the position calculation step of calculating the position of the other mounted component as the pre-mounting position of the other mounted component, the post-mounting position of the one mounted component calculated in the position calculation step, and the position calculation step are calculated. The other mounted component with respect to the one mounted component based on the position before mounting of the other mounted component and the post-mounted position of the reference mounted component which is a specific mounted component located on the lower layer side of the one mounted component. After aligning the other mounted parts with respect to the one mounted component by the alignment amount setting step for setting the alignment amount and the alignment amount set in the alignment amount setting step, the other Includes a mounting process of mounting the mounted component of the above on the one mounted component.

According to the present invention, it is possible to improve the mounting accuracy of each mounted component while maintaining high connection reliability between the mounted components adjacent to the top and bottom.

Configuration diagram of the component mounting device according to the embodiment of the present invention Perspective view of a laminated structure manufactured by the component mounting device according to the embodiment of the present invention. A perspective view showing a state in which a mounted component is mounted by the component mounting device according to the embodiment of the present invention. A diagram calculated by a position calculation unit of a control device included in the component mounting device according to the embodiment of the present invention (a) a diagram for explaining a position after mounting of a lower component (b) a diagram for explaining a position before mounting of an upper component. A flowchart showing a procedure for mounting mounted components by the component mounting device according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a device for manufacturing a laminated structure 3 (FIG. 2) by laminating a plurality of mounted components 2 in the vertical direction.

In FIGS. 1 and 3, the component mounting device 1 includes a work stage 11, a mounting head 12, and a camera 13. A plurality of suction openings (not shown) are formed on the upper surface of the work stage 11, and a vacuum chuck mechanism (not shown) connected to these suction openings is provided inside the work stage 11. When the vacuum chuck mechanism vacuum sucks the work object from the suction opening while the work object is placed on the upper surface of the work stage 11, the work object is sucked and held on the upper surface of the work stage 11.

The mounting head 12 includes a nozzle 12a extending downward. The mounting head 12 raises and lowers the nozzle 12a by a nozzle drive mechanism (not shown) provided inside, and generates a vacuum suction force at the lower end of the nozzle 12a by a suction mechanism (not shown) provided inside. ..
The mounting head 12 moves horizontally in a certain area including the upper part of the work stage 11 by the operation of the head moving mechanism 12K (FIG. 1).

In FIGS. 1 and 3, the camera 13 has a first imaging unit 13a that directs the imaging field of view downward to image the lower region of the camera 13, and a second imaging unit 13a that directs the imaging field of view upward to image the upper region of the camera 13. It has an imaging unit 13b of the above. The first imaging unit 13a and the second imaging unit 13b use the same axis extending in the vertical direction as a common imaging optical axis. The camera 13 can sequentially or simultaneously image the first imaging unit 13a and the second imaging unit 13b located below the camera 13 and above the camera 13. The camera 13 moves horizontally in a certain area including the upper part of the work stage 11 by the operation of the camera moving mechanism 13K (FIG. 1).

In FIGS. 2 and 3, the laminated structure 3 manufactured by the component mounting device 1 is a so-called chip-on-chip type electronic component, which is placed on the lowermost mounted component 2 (referred to as the lowest layer component 2A). A plurality of mounted components 2 are laminated, and the uppermost mounted component 2 (referred to as the uppermost layer component 2B) is further laminated on the plurality of mounted components 2. Here, each mounted component 2 except for the lowermost layer component 2A and the uppermost layer component 2B is provided with a plurality of electrodes (lower surface side electrodes 21) on the lower surface side and a plurality of electrodes (upper surface side electrodes 22) on the upper surface side. Consists of equipped chip parts. One lower surface side electrode 21 and one upper surface side electrode 22 located above the lower surface side electrode 21 are composed of one member that penetrates the mounting component 2 in the thickness direction. Therefore, the position of the lower surface side electrode 21 and the position of the upper surface side electrode 22 coincide with each other when the mounted component 2 is viewed from above (or below).

The lowermost layer component 2A is composed of a chip component or a substrate having a plurality of electrodes (upper surface side electrodes 22) on the upper surface side. The lowermost layer component 2A does not have the lower surface side electrode 21 because there is no other mounted component 2 directly underneath (FIG. 2). The uppermost layer component 2B is composed of a chip component having a plurality of electrodes (bottom side electrodes 21) on the lower surface side. The uppermost layer component 2B does not have the upper surface side electrode 22 because there is no other mounted component 2 directly above it (FIG. 2).

In FIG. 1, the control device 14 included in the component mounting device 1 controls the holding operation of the work object by the above-mentioned vacuum chuck mechanism included in the work stage 11 and the moving operation of the mounting head 12 by the head moving mechanism 12K. Further, the control device 14 controls the suction operation of the mounting head 12 via the nozzle 12a, the moving operation of the camera 13 by the camera moving mechanism 13K, and the imaging operation of the camera 13.

The camera 13 is in a state in which one mounted component 2 (referred to as a lower component) mounted immediately before and another mounted component 2 (referred to as an upper component) to be mounted are arranged vertically facing each other. , It is moved by the camera moving mechanism 13K so as to advance between the lower part and the upper part. Then, the camera 13 that has advanced between the lower component and the upper component captures the lower component from above by the first imaging unit 13a, and transmits the image data obtained by the imaging to the control device 14. Further, the camera 13 images the upper component from below by the second imaging unit 13b, and transmits the image data obtained by the imaging to the control device 14.

In FIG. 1, the control device 14 includes a position calculation unit 14a, a storage unit 14b, an alignment amount setting unit 14c, and a mounting control unit 14d. The control device 14 that has received the image data from the camera 13 calculates the positions of the lower component and the upper component imaged by the camera 13 by performing image processing of the image data in the position calculation unit 14a.

FIG. 4A is a view of the upper surface of the lower component viewed from above, and FIG. 4B is a view of the upper component viewed from the bottom surface. In FIG. 4B, the view viewed from below is converted into the view viewed from above. Two alignment marks M1 and M2 corresponding to each other are provided on the upper surface side and the lower surface side of each mounted component 2 (see also FIG. 3). These two alignment marks M1 and M2 are provided on one diagonal line of the mounting component 2.

The position calculation unit 14a is a straight line L connecting the coordinates (X1, Y1) of the midpoints of the two alignment marks M1 and M2 and the two alignment marks M1 and M2 for the lower component imaged by the first imaging unit 13a. The slope Θ1 of is obtained (FIG. 4 (a)). Further, the position calculation unit 14a is a straight line connecting the coordinates (X2, Y2) of the midpoints of the two alignment marks M1 and M2 and the two alignment marks M1 and M2 for the upper component imaged by the second imaging unit 13b. The slope Θ2 of L is obtained (FIG. 4 (b)). Here, "X" and "Y" in FIGS. 4 (a) and 4 (b) are coordinates based on the common XY coordinates (orthogonal coordinates in the horizontal plane) defined in the component mounting device 1. Yes, "Θ" is the tilt angle from the X axis in the XY plane.

The position calculation unit 14a sets the position (X1, Y1, Θ1) of the lower component (X1, Y1, Θ1) of the lower component (one mounted component 2 mounted immediately before) based on the image taken from above to "mount the lower component". Calculated as "rear position". Further, the position calculation unit 14a determines the position (X2, Y2, Θ2) of the upper component (X2, Y2, Θ2) based on the image of the upper component (the other mounted component 2 to be mounted) from below. Is calculated as. The data of the positions (X1, Y1, Θ1) after mounting of the lower component calculated here are stored in the storage unit 14b.

As described above, in the present embodiment, the position calculation unit 14a sets the position of one mounted component 2 (lower component) as the position after mounting of the one mounted component 2 based on the result of imaging by the first imaging unit 13a. It is calculated as (X1, Y1, Θ1), and the position of the other mounted component 2 (upper component) is set to the position before mounting of the other mounted component (X2, Y2, based on the result of imaging by the second imaging unit 13b). It is calculated as Θ2).

The alignment amount setting unit 14c of the control device 14 was calculated by the position calculation unit 14a at the post-mounting position (X1, Y1, Θ1) of one mounting component 2 (lower component) calculated by the position calculation unit 14a. A reference mounting component (here, the most) that is arbitrarily set as a specific mounting component 2 located on the lower layer side of the other mounting component 2 (upper component) before mounting (X2, Y2, Θ2) and one mounting component 2. The alignment amount (ΔX, ΔY, ΔΘ) of the other mounted component 2 with respect to one mounted component 2 is set based on the post-mounted position (X0, Y0, Θ0) of the lower layer component 2A). The post-mounting position (X0, Y0, Θ0) of the reference mounting component is the center of the variation range (variation range in the plan view) of the actual mounting position of each mounting component 2. Here, as for the data of the position (X0, Y0, Θ0) after mounting of the lowest layer component 2A as the reference mounting component, the upper surface side of the reference mounting component (bottom layer component 2A) is imaged by the first imaging unit 13a. At that time, the data is stored in the storage unit 14b.

The alignment amount setting unit 14c is based on the position before mounting the upper component (X2, Y2, Θ2) and the position after mounting the lower component (X1, Y1, Θ1) calculated by the position calculation unit 14a, respectively. PX = X2-X1
PY = Y2-Y1
PΘ = Θ2-Θ1
(PX, PY, PΘ) consisting of (PX, PY, PΘ) is calculated as a misalignment amount (referred to as a first misalignment amount) between the position before mounting of the upper component and the position after mounting of the lower component.

Further, the alignment amount setting unit 14c is a reference mounting component (bottom layer component 2A) read from the storage unit 14b and the pre-mounting position (X2, Y2, Θ2) of the upper component calculated by the position calculation unit 14a. Based on the position after mounting (X0, Y0, Θ0), the difference between them was taken. QX = X2-X0
QY = Y2-Y0
QΘ = Θ2-Θ0
(QX, QY, QΘ) is calculated as a misalignment amount (referred to as a second misalignment amount) between the pre-mounting position of the upper component and the post-mounting position of the reference mounting component.

When the alignment amount setting unit 14c calculates the first position shift amount (PX, PY, PΘ) and the second position shift amount (QX, QY, QΘ) as described above, the first position shift amount is calculated. Is multiplied by the weight m and the second misalignment amount is multiplied by the weight n (m + m = 1, m> 0, n> 0) and the sum is taken. ΔX = mPX + nQX = m (X2-X1) + n (X2- X0)
ΔY = mPY + nQY = m (Y2-Y1) + n (Y2-Y0)
ΔΘ = mPΘ + nQΘ = m (Θ2-Θ1) + n (Θ2-Θ0)
(ΔX, ΔY, ΔΘ) consisting of (ΔX, ΔY, ΔΘ) is set as the alignment amount of the upper component with respect to the lower component. The alignment amount (ΔX, ΔY, ΔΘ) set by the alignment amount setting unit 14c is stored in the storage unit 14b.

As described above, in the present embodiment, the alignment amount setting unit 14c is the position before mounting of the other mounting component 2 (X2, Y2, Θ2) and the position after mounting of one mounting component 2 (X1, Y1, Θ1). ) And the first misalignment amount (PX, PY, PΘ) and the post-mounting position (X2, Y2, Θ2) of other mounted components and the post-mounting position (X0, Y0, Θ0) of the reference mounting component. The alignment amount (ΔX, ΔY, ΔΘ) is set based on the second misalignment amount (QX, QY, QΘ) between them.

Here, by changing the values of the weights m and n in the alignment amount (ΔX, ΔY, ΔΘ), the contribution of the first misalignment amount in the alignment amount (ΔX, ΔY, ΔΘ) can be obtained. The ratio of the second misalignment to the contribution can be changed. Specifically, when the value of m is made larger than the value of n, the contribution of the first misalignment amount becomes large, and the target to be mounted is mainly immediately before the mounting component 2 (upper component) to be mounted. It becomes the mounted part 2 (lower part). Therefore, the contact area between the electrodes between the vertically adjacent mounted components 2 becomes large, and the reliability of the electrical connection between the vertically adjacent mounted components 2 is enhanced.

On the other hand, when the value of n is made larger than the value of m, the contribution due to the second misalignment amount becomes large, and the target to be brought closer to the mounting component 2 (upper component) to be mounted is mainly the reference mounting component. For this reason, it is possible to keep the variation in the mounting position of each mounted component 2 within a certain range centered on the position after mounting the reference mounted component, improve the mounting accuracy of each mounted component 2, and the laminated type. The overall stability of the structure 3 can be enhanced. When the weights m and n are set equally (m = n = 0.5), the alignment amounts (ΔX, ΔY, ΔΘ) are the “first misalignment amount” and the “second misalignment amount”. It is set to an intermediate value of, and both effects can be obtained in a well-balanced manner.

By controlling the head moving mechanism 12K and the mounting head 12, the mounting control unit 14d of the control device 14 controls the mounting head 12 to use the alignment amount (ΔX, ΔY, ΔΘ) set by the alignment amount setting unit 14c, and the other mounted component 2 Align (upper part). Then, on top of that, another mounting component 2 (upper component) is mounted on one mounting component 2 (lower component). As a result, the lower surface side electrode 21 of the upper component comes into contact with the upper surface side electrode 22 of the lower component, and the lower component and the upper component are electrically connected.

Next, a procedure (component mounting method) for stacking the mounted components 2 by the component mounting device 1 will be described with reference to the flowchart of FIG. The control device 14 attracts the upper component, which is the mounting component 2 to be mounted, to the nozzle 12a by the mounting head 12, and causes the lower component (the lowest layer component 2A when the mounting component 2 is mounted first). Move it upward (step ST1). Then, after the camera 13 is advanced between the lower component and the upper component, the lower component is imaged by the first imaging unit 13a (step ST2, the first imaging step), and the second imaging is performed. The upper component is imaged by the part 13b (step ST3, the second imaging step). Imaging of the lower component in step ST2 and imaging of the upper component in step ST3 may be performed at the same time.

The control device 14 images the lower component in step ST2, images the upper component in step ST3, and based on the obtained result (image data), the position after mounting the lower component (X1, Y1, Θ1). And, the position (X2, Y2, Θ2) before mounting of the upper component is calculated. Then, the calculated results are stored in the storage unit 14b (step ST4, position calculation step).

When the control device 14 stores the calculated data of the lower component mounting position (X1, Y1, Θ1) and the upper component pre-mounting position (X2, Y2, Θ2) in the storage unit 14b, the control device 14 is the reference mounting component. The data at the position (X0, Y0, Θ0) after mounting (here, the lowest layer component 2A) is read from the storage unit 14b (step ST5). When step ST5 is performed for the first time, the data of the reference mounting component post-mounting position (X0, Y0, Θ0) read from the storage unit 14b is calculated and stored in the immediately preceding step S4 after mounting the lowest layer component 2A. It will be the same as the position data.

The control device 14 includes the position after mounting the lower component (X1, Y1, Θ1) and the position before mounting the upper component (X2, Y2, Θ2) calculated and stored in step ST4, and the reference mounting read in step ST5. Based on the post-mounting position (X0, Y0, Θ0) of the component (bottom layer component 2A), the alignment amount (ΔX, ΔY, ΔΘ) of the upper component with respect to the lower component is set according to the above procedure (step). ST6. Alignment amount setting process). Then, the control device 14 aligns the upper component with respect to the lower component with the set alignment amount (ΔX, ΔY, ΔΘ), and then mounts the upper component on the lower component (step ST7). . Mounting process).

In the mounting of the upper component in this mounting process, the alignment amount (ΔX, ΔY, ΔΘ) is the amount of misalignment between the position before mounting the upper component and the position after mounting the lower component (first misalignment amount). Therefore, the contact area between the electrodes (the upper surface side electrode 22 of the lower component and the lower surface side electrode 21 of the upper component) is not excessively small, and sufficient electrical connection reliability between the mounted components 2 is sufficient. Can be secured. In addition, the alignment amount (ΔX, ΔY, ΔΘ) includes the amount of misalignment (second misalignment) between the position before mounting the upper component and the position after mounting the reference mounting component (bottom layer component 2A). Since it is taken into consideration, each mounted component 2 does not separate from the standard mounted component each time it is stacked, and there is a variation from the standard mounted component (bottom layer component 2A) when mounting the mounted component 2. As the size becomes smaller, the mounting accuracy of the mounted component 2 is improved.

When the upper component is mounted on the lower component, the control device 14 determines whether or not all the mounted components 2 to be mounted are mounted (that is, whether the top layer component 2B is mounted) (step ST8). .. As a result, if the top layer component 2B is not mounted, the process returns to step ST1, and if the top layer component 2B is mounted, a series of operations is completed.

As described above, in the component mounting device 1 (component mounting method) in the present embodiment, the upper component (other mounted component 2) to be mounted is mounted on the lower component (one mounted component 2) immediately before. On the other hand, the alignment amount for alignment is set based on the position after mounting the lower component, the position before mounting the upper component, and the position after mounting the reference mounted component. That is, as an element for setting the alignment amount, not only the positional relationship between the upper component and the lower component related to the electrical connectivity between the two vertically adjacent mounted components 2, but also each mounted component 2 The positional relationship between the upper component and the reference mounted component position, which is related to keeping the variation within a certain range, is taken into consideration. When the upper component is mounted on the lower component with the alignment amount set in this way, the connection reliability between the vertically adjacent mounted components 2 is high, and the mounting accuracy of each mounted component 2 is also very high. Become.

As described above, in the component mounting device 1 (component mounting method) in the present embodiment, the lower component (one mounted component 2) on which the upper component (other mounted component 2) to be mounted is mounted immediately before is mounted. ), The amount of alignment for the lower component is the position after mounting the lower component, the position before mounting the upper component, and the specific mounting component 2 located on the lower layer side of the lower component. Since the setting is based on the position after mounting, it is possible to improve the mounting accuracy of each mounted component 2 while maintaining high connection reliability between the vertically adjacent mounted components 2.

Although the embodiments of the present invention have been described so far, the present invention is not limited to those described above, and various modifications and the like are possible. For example, in the above-described embodiment, the lowest layer mounted component (bottom layer component 2A) is used as the reference mounted component (specific mounted component 2), but the standard mounted component is more than one mounted component 2 to be mounted. It does not have to be the lowest layer component 2A as long as it is the mounted component 2 located on the lower layer side.

Further, the procedure in which the position calculation unit 14a calculates the post-mounting position of one mounted component 2 and the pre-mounting position of the other mounted component 2 shown in the above-described embodiment is an example, and is limited to the above-described one. Not done. Further, the procedure for setting the alignment amount of the other mounted component 2 with respect to the mounted component 2 by the alignment amount setting unit 14c shown in the above-described embodiment is an example, and is not limited to the above-described one.

Provided are a component mounting device and a component mounting method capable of improving the mounting accuracy of each mounted component while maintaining high connection reliability between vertically adjacent mounted components.

1 Parts mounting device 2 Mounted parts 2A Bottom layer parts (bottom layer mounted parts)
13a First imaging unit 13b Second imaging unit 14a Position calculation unit 14c Alignment amount setting unit 14d Mounting control unit 21 Bottom side electrode 22 Top surface side electrode

Claims (8)

The other mounted component is mounted on the one mounted component so that the lower surface side electrode provided on the lower surface side of the other mounted component contacts the upper surface side electrode provided on the upper surface side of the one mounted component. It is a component-mounted device that repeatedly executes operations.
A first imaging unit that images the one mounted component from above,
A second imaging unit that images the other mounted components from below,
The position of the one mounted component is calculated as the post-mounting position of the one mounted component based on the result of imaging by the first imaging unit, and the other is based on the result of imaging by the second imaging unit. A position calculation unit that calculates the position of the mounted component of the above as the position before mounting of the other mounted component,
The position after mounting of the one mounted component calculated by the position calculation unit, the position before mounting of the other mounted component calculated by the position calculating unit, and the specific mounting located on the lower layer side of the one mounted component. An alignment amount setting unit that sets the alignment amount of the other mounted component with respect to the one mounted component based on the post-mounting position of the reference mounted component which is a component.
After aligning the other mounted component with respect to the one mounted component with the alignment amount set by the alignment amount setting unit, the other mounted component is mounted on the one mounted component. A component mounting device equipped with a mounting control unit. The component mounting device according to claim 1, wherein the specific mounted component is a mounted component of the lowest layer. The alignment amount setting unit includes a first displacement amount between the pre-mounting position of the other mounted component and the post-mounting position of the one mounted component, and the pre-mounting position of the other mounted component and the reference mounting. The component mounting device according to claim 1 or 2, wherein the alignment amount is set based on a second misalignment amount with respect to the position after mounting the component. The component mounting device according to claim 3, wherein the alignment amount can be set by changing the ratio of the contribution due to the first misalignment amount and the contribution due to the second misalignment amount. The other mounted component is mounted on the one mounted component so that the lower surface side electrode provided on the lower surface side of the other mounted component contacts the upper surface side electrode provided on the upper surface side of the one mounted component. It is a component mounting method that repeatedly executes operations.
The first imaging step of imaging the one mounted component from above, and
A second imaging step of imaging the other mounted components from below, and
The position of the one mounted component is calculated as the post-mounting position of the one mounted component based on the result of imaging in the first imaging step, and the other is based on the result of imaging in the second imaging step. The position calculation process of calculating the position of the mounted component of the above as the position before mounting of the other mounted component, and
With the post-mounting position of the one mounted component calculated in the position calculation process, the pre-mounting position of the other mounted component calculated in the position calculation process, and the specific mounted component located on the lower layer side of the one mounted component. An alignment amount setting process for setting the alignment amount of the other mounted component with respect to the one mounted component based on the post-mounting position of a certain reference mounted component.
After aligning the other mounted component with respect to the one mounted component with the alignment amount set in the alignment amount setting step, the other mounted component is mounted on the one mounted component. Parts mounting method including mounting process. The component mounting method according to claim 5, wherein the specific mounted component is a mounted component of the lowest layer. In the position calculation step, the alignment amount is determined by the first misalignment amount between the pre-mounting position of the other mounted component and the post-mounting position of the one mounted component and before mounting of the other mounted component. The component mounting method according to claim 5 or 6, which is set based on a second misalignment amount between the position and the post-mounting position of the reference mounting component. The component mounting method according to claim 7, wherein the alignment amount can be set by changing the ratio of the contribution due to the first misalignment amount and the contribution due to the second misalignment amount.

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