JP2020150015A - Electronic component and manufacturing method therefor - Google Patents

Abstract

To enhance airtightness of an electronic component and also enhance vibration resistance.SOLUTION: An electronic component includes an exterior case having an accommodation portion in which a first case member (6) having a first opening portion (23) covering an upper surface side of a lead terminal (12) and a second case member (8) having a second opening portion (32) covering a lower surface side of the lead terminal are joined to each other to accommodate an element, and a lead terminal lead-out portion for confronting the first opening portion and the second opening portion with each other, pinching the lead terminal by the overlapping first opening portion and the second opening portion, and protruding the lead terminal to the outside of the accommodation portion. Further, there are provided inclined surfaces that narrow the opening width in a direction in which the side surfaces of the first opening portion and the second opening portions are spaced apart from a joint portion of the first case member and the second case member, the opening width on the joint portion side of the first opening portion and the second opening portion is wider than that of the lead terminal, and the narrowest portion of the opening width is equal to or less than the width of the lead terminal.SELECTED DRAWING: Figure 3

Description

The present invention relates to a technique for encapsulating an electronic component including an outer case in which a terminal is led out to the outside to house an element.

For electronic devices, for example, surface mounting in which electronic components are directly attached to a substrate is often adopted in order to reduce the size and height of the entire device. Some such surface mount type electronic components are formed by pulling out terminals from a case containing an element or the like and bending the terminals toward the substrate side of the case (for example, Patent Document 1). By bending the terminals in this way, the distance between the board and the electronic component body is not separated when the terminals are mounted on the board.

Japanese Unexamined Patent Publication No. 8-172019

By the way, for example, electronic components mounted on vehicles are required to have a high level of airtightness and vibration resistance as responsiveness to the usage environment. For example, an electronic component such as an inductor composed of a core and a lead terminal is provided with a lead terminal lead-out part in which an element is housed in a case and the lead terminal is projected to the outside of the case, but foreign matter is mixed or discharged between the inside and the outside of the case. In order to avoid this, it is preferable that the lead terminal and the lead terminal lead-out portion are in close contact with each other. In addition, in such an electronic component, when the lead terminal is bent toward the mounting surface side of the substrate, if there is a gap in the lead terminal lead-out portion, the lead terminal may be insufficiently bent. Such electronic components with insufficiently bent lead terminals may have a high mounting height, for example, and may not be able to come into contact with the substrate surface due to the restoring force (springback) of the lead terminals.
In addition, some outer cases of electronic components have an opening area or diameter smaller than the width and thickness of the lead terminal in advance in order to improve the airtightness of the lead terminal lead-out portion, but it is difficult to insert the lead terminal. In addition to the troublesome work, a part of the lead terminal may be folded back or inserted at an angle, which may cause a gap between the lead terminal lead-out portion and the lead terminal.
In addition, if the lead terminals are not sufficiently bent, the electronic components may bend due to vibrations from the mounted vehicle, etc., and the gap between the outer case and the lead terminals may increase. , May cause damage to electronic parts.

Patent Document 1 does not disclose or suggest such a problem, and the configuration disclosed in these documents cannot solve such a problem.
Therefore, an object of the present invention is to improve the airtightness of electronic components and the vibration resistance in view of the above problems.

In order to achieve the above object, one side surface of the electronic component of the present invention includes an element, a first case member having a first opening covering the upper surface side of the lead terminal of the element, and a lower surface side of the lead terminal. A second case member having a second opening for covering is joined, and an outer case including a storage portion for accommodating the element is provided inside the joint, and the outer case includes the first opening and the said outer case. A lead terminal in which the second opening faces the opening surfaces, the lead terminal is sandwiched between the first opening and the second opening that overlap each other, and the lead terminal is projected to the outside of the storage portion. A lead-out portion is provided, and the width of each opening is narrowed in a direction in which the first opening and the side surface of the second opening are separated from the joint between the first case member and the second case member. The opening width on the joint side of the first opening and the second opening is wider than that of the lead terminal, and the narrowest portion of the opening width is the lead terminal. It is less than or equal to the width.

In the electronic component, the lead terminal lead-out portion includes the first case member and the first case member and the side surfaces of the second opening from the outside of the exterior case or the inside of the storage portion. It is an inclined surface in which each opening width is gradually narrowed toward the joint portion of the second case member, and the widest portion of the opening width is larger than the width of the lead terminal and the opening width is widened. The narrowest portion may be equal to or less than the width of the lead terminal.

In order to achieve the above object, one aspect of the method for manufacturing an electronic component of the present invention is a first case having a first opening for interposing an element in a storage portion and covering the upper surface side of a lead terminal of the element. The member and the second case member having the second opening covering the lower surface side of the lead terminal are joined, and the lead terminal is brought into contact with the opening surface of the first opening and the second opening so as to face each other. Inclination in which the width of each opening is narrowed in the direction in which the first opening and the side surface of the second opening are separated from the joint between the first case member and the second case member while being sandwiched. Includes a process of projecting the lead terminal from the surfaced lead terminal lead-out portion to the outside of the accommodating portion.
The method for manufacturing an electronic component may include a process of crushing a flat surface portion of the lead terminal arranged in the lead terminal lead-out portion by joining the first case member and the second case member.

According to the present invention, any of the following effects can be obtained.
(1) The lead terminal is provided by a lead terminal lead-out portion that joins the first case member and the second case member and sandwiches the lead terminal between the facing first opening and the second opening. By setting the opening shape and opening area of the lead terminal lead-out portion corresponding to the width and thickness, the airtightness of the outer case can be improved.
(2) The first case member has a large diameter on the joint portion side of each of the first opening and the side surface of the second opening, and the diameter is gradually reduced in the direction away from the joint portion. Since the opening area and opening shape of the lead lead-out portion can be adjusted as the lead terminal is joined to the second case member, it is possible to prevent excessive pressurization of the lead terminal.
(3) The work of arranging the lead terminal with respect to the lead terminal lead-out portion of the outer case can be facilitated.
(4) By forming the side surface portions of the first opening and the second opening into an inclined shape and arranging inclined surfaces having different directions facing each other between the first case member and the second case member. , The shape and thickness of the side surface of the lead terminal lead-out portion can be easily adjusted.

It is a figure which shows the internal structure example of the electronic component which concerns on 1st Embodiment. It is a figure which shows an example of the manufacturing process of an electronic component. It is the figure which showed the outer case from the lead terminal lead-out part side. It is a figure which shows the internal structure example of the electronic component which concerns on 2nd Embodiment. It is a figure which shows the structural example of the electronic component which concerns on 3rd Embodiment. It is a figure which shows the state example of the manufacturing process of an electronic component. It is a figure which shows the appearance composition example of the electronic component which concerns on Example. It is an exploded perspective view which shows the structural example of an electronic component. It is a figure which shows the shape of the upper housing. It is a figure which shows the shape of the lower housing. It is a figure which shows the structural example of the opening formed by joining the housings. It is a figure which shows the structural example of the bottom side of an electronic component.

[First Embodiment]
FIG. 1 shows a configuration example of an electronic component according to the first embodiment. The configuration shown in FIG. 1 is an example, and the present invention is not limited to such a configuration.
In the electronic component 2, for example, as shown in FIG. 1A, the element is housed in the outer case 4. The outer case 4 is made of, for example, a thermoplastic resin material, and the upper case 6 and the lower case 8 are joined in the vertical direction. The upper case 6 is an example of the first case member of the present disclosure, and for example, a part or half of the upper side of the element can be housed inside. The lower case 8 is an example of the second case member of the present disclosure, and can accommodate a part or half of the lower side of the element. Then, by joining the upper case 6 and the lower case 8, the outer case 4 includes a storage portion 14 capable of accommodating the entire element inside.
The element includes, for example, a hollow core 10 made of a magnetic material or the like, and a lead terminal 12 penetrating the hollow portion of the core 10. The lead terminal 12 has, for example, a lead wire that can be energized and serves as a connection terminal to a substrate (not shown). This element includes, for example, a lead terminal 12 projecting from the core 10 in two directions.

Further, the outer case 4 has, for example, a lead terminal lead-out unit 16 according to the number of lead terminals 12. The lead terminal lead-out portion 16 is an example of means for leading the lead terminal 12 to the outside of the storage portion 14, and is formed at a joint portion between the upper case 6 and the lower case 8. The lead terminal lead-out unit 16 has a size and shape according to the width and thickness of the lead terminal 12 and the cross-sectional shape. Therefore, in the electronic component 2, one or both of the upper case 6 and the lower case 8 may be selected depending on the type, size, shape, and the like of the lead terminal used for the element. Further, in the outer case 4, for example, a part of the upper case 6 is arranged so as to be displaced outward from a part of the lower case 8 on or a surface where the lead terminal lead-out portion 16 is formed. Then, the flat portion of the lead terminal 12 comes into contact with the end surface of the upper case 6 or the end surface of the lower case 8 at a position where only a part of the lead terminal 12 overlaps or the entire surface portion overlaps, for example, along the arrangement direction of the lead terminal 12.

The lead terminal 12 has a predetermined thickness H1 and is formed in a foil shape or a flat plate shape having a predetermined width L1, for example, as shown in B of FIG. Further, in the electronic component 2, for example, the lead terminal 12 protruding from the lead terminal lead-out portion 16 to the outside of the outer case 4 is arranged along the wall surface of the lower case 8, and the tip end side thereof is folded toward the bottom side of the lower case 8. There is. The bottom portion of the lower case 8 is an example of a mounting portion 18 of the electronic component 2, and a flat portion on the tip end side of the folded lead terminal 12 or another portion is arranged flush with the bottom portion of the lower case 8. Alternatively, it protrudes from the bottom of the lower case 8. As a result, the electronic component 2 directly mounts the mounting portion 18 on, for example, a substrate (not shown).

<Manufacturing process of electronic component 2>
FIG. 2 shows an example of manufacturing processing of electronic components. The processing content and processing procedure shown in FIG. 2 are examples. This manufacturing process is an example of a method for manufacturing an electronic component of the present invention.
The manufacturing process of the electronic component 2 includes the following steps.
(a) As shown in A of FIG. 2, for example, the lower side of the core 10 is housed in the storage part of the lower case 8. Further, in the core 10, the upper case 6 is arranged from the upper side according to the position of the lower case 8, and the upper side is stored in the storage portion of the upper case 6. As a result, in the electronic component 2, the upper case 6 and the lower case 8 are joined to form the storage portion 14. At this time, the lead terminals 12 project to the left, right, front and back sides of the core 10, for example, and a part of the lead terminals 12 is sandwiched between the upper case 6 and the lower case 8. In the upper case 6 and the lower case 8 shown in FIG. 2A, for example, notches 23 and 32 (FIG. 3) having an opening width through which the lead terminal 12 can be inserted are formed in a part of the wall surface to be joined. ing. Then, the overlapping portion of the cutout portions 23 and 32 of the upper case 6 and the lower case 8 becomes the lead terminal lead-out portion 16 of the lead terminal 12. FIG. 2 shows, for example, a cross section of the upper case 6 and the lower case 8 at the positions of the cutouts 23 and 32.
(b) When the core 10 is housed in the outer case 4, the lead terminal 12 is partially bent downward with reference to the joint position between the upper case 6 and the lower case 8, for example, as shown in FIG. 2B. Be done. The lead terminal 12 is bent along the open end surface of the lower case 8, which is a part of the lead terminal lead-out portion 16, for example. At this time, the lead terminal 12 has an upper flat portion, which is a surface portion on the opposite side to the bending direction, in contact with the end surface portion of the upper case 6, or is pressed from the end surface portion thereof. That is, the flat portion of the lead terminal 12 is crushed by the upper case 6 and the lower case 8 in the lead terminal lead-out portion 16. As a result, the lead terminal 12 can be expected to have an effect of preventing bending inside the storage portion 14 because the lower surface side and the upper surface side of the lead terminal lead-out portion 16 are in close contact with the outer case 4 and serve as a fixed fulcrum.

Then, as shown in C of FIG. 2, for example, the electronic component 2 further bends the lead terminal 12 until the tip side reaches the bottom side of the lower case 8. As a result, the electronic component 2 is formed with a mounting portion 18 having a lead terminal 12 on the lower side.

<About the lead terminal lead-out unit 16>
FIG. 3 shows a stepwise example of a state in which the lead terminal lead-out portion 16 is formed between the upper case 6 and the lower case 8. In FIG. 3, the lead terminal 12 is omitted.
In FIG. 3A, the upper case 6 and the lower case 8 show the outer case 4 before joining. The side wall 20 of the upper case 6 has a notch 23 at a part on the end 24 side to be joined with the lower case 8, for example. The notch 23 is an example of the first opening of the present disclosure, is arranged so as to straddle the upper surface side of the lead terminal 12, and covers a part of the upper surface of the lead terminal 12. The side surface portion 22 of the notch portion 23 is inclined in the opening width direction, for example. The cutout portion 23 is formed by changing the opening width from the open end on the end portion 24 side of the side wall 20 toward the upper side. The cutout portion 23 has a wider opening width L3 on the open end side (L2 <L3) than, for example, an opening width L2 on the cutout surface side. The opening widths L2 and L3 of the cutout portion 23 have the relationship of the following equation (1) as compared with the width L1 of the lead terminal 12, for example.
L3> L1 ≧ L2 ・ ・ ・ (1)
That is, the opening width L3 on the joint portion side of the notch portion 23 is wider than the width L1 of the lead terminal 12, and the opening width L2 which is the narrowest portion of the notch portion 23 is the width L1 of the lead terminal 12. Is the same as or less than this.

Further, the side wall 26 of the lower case 8 has a notch 32. The cutout portion 32 is an example of the second opening of the present disclosure, is arranged so as to straddle the lower surface side of the lead terminal 12, and covers a part of the lower surface side of the lead terminal 12. The side surface portion 28 of the notch portion 32 is inclined from the open end side on the tip end side of the side wall 26 toward the end portion side of the notch portion 32, for example. The cutout portion 32 is formed, for example, by continuously or stepwise changing the opening width from the open end side toward the lower side. The notch portion 32 has, for example, an opening width L4 on the open end side wider than the opening width L5 on the end side of the notch (L4> L5). The opening width L4 and the opening width L5 of the notch portion 32 have the relationship of the following equation (2) as compared with the width L1 of the lead terminal 12, for example.
L4> L1 ≧ L5 ・ ・ ・ (2)
That is, the opening width L4 on the joint portion side of the notch portion 32 is wider than the width L1 of the lead terminal 12, and the opening width L5 which is the narrowest portion of the notch portion 32 is the width L1 of the lead terminal 12. Is the same as or less than this.

The outer case 4 is formed so that the opening surfaces of the notch portion 23 and the notch portion 32 face each other. The outer case 4 is joined by covering the lower case 8 with the upper case 6, for example. Then, when the upper case 6 and the lower case 8 are joined, the notch portion 23 and the notch portion 32 overlap each other in the front-rear direction, and the lead terminal lead-out portion 16 is formed.
When the upper case 6 is covered from the upper surface side of the outer case 4, for example, as shown in B of FIG. 3, the left and right end face portions of the lead terminal 12 (not shown) arranged in the lead terminal lead-out portion 16 are continuously formed. Alternatively, it comes into contact with the side surface portion 22 of the notch portion 23 that is gradually narrowed.

When the upper case 6 is further joined, the outer case 4 comes into contact with the joint end surface 30 formed on the outer side of the lower case 8 by the end portion 24 of the upper case 6 as shown in C of FIG. 3, for example. The joint end surface 30 functions as a stopper that limits the joint height and joint position of the upper case 6.
The formation position of the joint end surface 30 is determined by, for example, the notch depths of the notches 23 and 32 of the upper case 6 and the lower case 8, and the opening thickness of the lead terminal lead-out portion 16 is determined by the joint of the cases. That is, the lead terminal lead-out unit 16 determines the amount of pulling down of the upper case 6 according to the opening height H2 and the opening width L6, and can be brought into contact with the lead terminal 12 to be inserted. The opening width L6 is, for example, the same as or smaller than the width L1 of the lead terminal 12.

<Effect of the first embodiment>
According to such a configuration, one of the following effects can be obtained.
(1) By joining the upper case 6 and the lower case 8, the notches 23 and 32 overlap in the front-rear direction to form the lead terminal lead-out portion 16, so that the shape corresponding to the thickness H1 of the lead terminal 12 And the opening height can be increased, and the airtightness of the outer case 4 is enhanced.
(2) Both the notch 23 of the upper case 6 and the notch 32 of the lower case 8 have a wide open end side and a shape narrowed toward the end side, and also have a shape narrowed toward the end side. By making the width of the lead terminal 12 equal to or narrower than the width of the lead terminal 12, the opening shape and opening area corresponding to the width of the lead terminal 12 are taken as the upper case 6 and the lower case 8 are joined. Can be done.
(3) Since the opening width of the lead terminal lead-out portion 16 is narrowed according to the joining of the upper case 6 and the lower case 8, the inside of the narrow lead terminal lead-out portion 16 when the lead terminal 12 is installed with respect to the outer case 4. It is possible to prevent damage to the outer case 4 and the lead terminal 12 due to forcible insertion, or bending of the lead terminal 12 in the lead terminal lead-out portion 16.
(4) The flat portion of the lead terminal 12 is sandwiched between the notched portions 23 and 32 of the upper case 6 and the lower case 8 that are joined, so that the force and vibration received from the mounting surface side of the electronic component 2 are absorbed by the sandwiched portion. Therefore, the retention of the core 10 in the storage portion 14 can be ensured, and the vibration resistance of the electronic component 2 is enhanced.

[Second Embodiment]
FIG. 4 shows a configuration example of an electronic component according to the second embodiment. The configuration shown in FIG. 4 is an example, and the present invention is not limited to such a configuration. In FIG. 4, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals.
As shown in A of FIG. 4, for example, the electronic component 2 is formed by joining the upper case 6 and the lower case 8 to form the outer case 4. In the outer case 4, the lead terminal lead-out portion 16 is formed by superimposing the notches 23 and 32 on the front and back of the upper case 6 and the lower case 8.
As shown in B of FIG. 4, for example, the lead terminal lead-out portion 16 has a notch portion 23 and a notch portion 32 overlapping with respect to the joint center O of the upper case 6 and the lower case 8. The side surface of the opening portion of the lead terminal lead-out portion 16 is formed by joining the side surface portions 22 and the side surface portions 28 that are inclined from the end portions on the cutout portions 23 and 32 sides toward the joint central axis O. ..
Further, the lead terminal lead-out portion 16 includes, for example, an inclined surface portion 36 inclined so as to widen the opening width from the inside of the opening portion toward the outside of the outer case 4.

Next, in the lead terminal lead-out unit 16, a configuration example of a joint portion between the upper case 6 and the lower case 8 will be described. C of FIG. 4 is an arrow view of B of FIG.
In the outer case 4, for example, as shown in C of FIG. 4, the side wall 20 which is one side of the upper case 6 is arranged on the outer side of the outer case 4, and the side wall 26 which is one side of the lower case 8 is arranged on the inner side. ing.
In the outer case 4, for example, as shown in C of FIG. 4, the wall surfaces of the side wall 20 of the upper case 6 and the side wall 26 of the lower case 8 are arranged to face each other in the joining reference R, or are in surface contact with each other. In the outer case 4, the side wall 20 of the upper case 6 is the outer peripheral side of the outer case 4, and the side wall 26 of the lower case 8 is the inner peripheral side close to the storage portion 14 side.
The inclined surface portion 36 in the lead terminal lead-out portion 16 is formed on the side wall 20 of the upper case 6. As a result, the opening width of the lead terminal lead-out portion 16 gradually narrows from the opening width L7 on the outlet side, and the opening width L6 at the joining reference R is the narrowest.
Further, in the exterior case 4, for example, an inclined surface portion in which the side surface of the opening portion of the side wall 26 of the lower case 8 located on the inner peripheral side of the side wall 20 is inclined so as to expand toward the storage portion 14 side of the exterior case 4. 38 is provided. As a result, the lead terminal lead-out portion 16 has an opening width that widens from the opening width L6 at the joining reference R toward the storage portion side, and the opening width L8 inside the inclined surface portion 38 is the widest.
At this time, the relationship between the opening width L6, the opening width L7, the opening width L8 and the width L1 of the lead terminal 12 is as follows.
L7> L1 ≧ L6 ・ ・ ・ (3)
L8> L1 ≧ L6 ・ ・ ・ (4)
That is, the opening width L7 of the notch portion 23 and the opening width L8 of the notch portion 32 are wider than the width L1 of the lead terminal 12, and the opening on the joint portion side between the notch portion 23 and the notch portion 32. The width L6 is the same as or less than the width L1 of the lead terminal 12.
The opening width L7 of the side wall 20 and the opening width L8 of the side wall 26 may be formed to have the same size or different sizes. At this time, the inclined surface portions 36, 38 of the lead terminal lead-out portion 16 can have the opening width L7 and the opening width L8 equivalent by, for example, matching the inclination angles and inclinations.

Then, when the lead terminal 12 is installed in the outer case 4, for example, as shown in D of FIG. 4, the lead terminal 12 is provided in an opening portion wider than the lead terminal 12 and a lead-out portion from the storage portion 14. Let it pass. Further, the lead terminal 12 passes through the lead terminal lead-out portion 16 while being deformed by joining or contacting with a narrow portion at the central portion or a position close to the central portion. The narrow portion formed inside the lead terminal lead-out portion 16 in this way prevents a gap from being formed on the side portion side of the joined notch portions 23 and 32, for example, and the electronic component 2 It serves as a stopper that prevents foreign matter outside the surface or foreign matter generated in the storage portion 14 from passing through the lead terminal lead-out portion 16.

<Effect of the second embodiment>
According to such a configuration, one of the following effects can be obtained.
(1) The lead terminal lead-out portion 16 is formed by inclining the notches 23 and 32 of the upper case 6 and the lower case 8 so as to have different opening widths and by facing these notches 23 and 32. The width of the inside of the outer case 4 can be narrowed to prevent the passage of foreign matter between the storage portion 14 of the outer case 4 and the outer side of the outer case 4.
(2) The lead terminal lead-out portion 16 facilitates the installation and insertion work of the lead terminal 12 by widening the outer peripheral side of the outer case 4 and the opening portion adjacent to the storage portion 14, and leads out the lead terminal. It is possible to facilitate the removal of foreign matter adhering to the opening portion of the portion 16.

[Third Embodiment]
FIG. 5 shows a configuration example of an electronic component according to a third embodiment. The present invention is not limited to such a configuration. In FIG. 5, the same parts as those in FIGS. 1 to 4 are designated by the same reference numerals.
In the outer case 4, for example, as shown in A of FIG. 5, the upper case 6 and the lower case 8 are joined to form a storage portion 14 for accommodating an element of an electronic component inside. Further, on the side wall side of the exterior case 4, a lead terminal lead-out portion 16 for leading out the lead terminal 12 of the element to the outside is provided. Further, the lower case 8 is provided with, for example, a guide groove 40 adjacent to the opening portion of the lead terminal lead-out portion 16 and guiding the lead terminal 12 led out from the lead terminal lead-out portion 16 to the mounting portion 18 side at the bottom.

The guide groove 40 is formed at a predetermined depth along the wall surface of the side wall 26, for example, as shown in FIG. 5B. Further, the guide groove 40 is an inclined surface whose depth is continuously or stepwise increased from the opening portion of the lead terminal lead-out portion 16 toward the bottom side of the lower case 8. Further, a terminal groove 42 communicating with the guide groove 40 is formed at the bottom of the lower case 8. The terminal groove 42 may have at least a width and a length that can accommodate the tip portion of the lead terminal 12. Further, the terminal groove 42 may have an inclined ceiling portion so that the corner portion of the lower case 8 which is a communicating portion with the guide groove 40 has an acute angle, and the depth of the groove may be changed.

In the manufacturing process of the electronic component 2, for example, as shown in A of FIG. 6, the upper case 6 and the lower case 8 are joined to store the core 10 of the element in the storage unit 14, and the lead terminal lead-out unit 16 leads. The terminal 12 is projected. Next, a pressing force F in the bending direction is applied to the lead terminal 12 at a predetermined position, for example. The pressed lead terminal 12 is bent with the contact position P such as the end of the notch 32 which is the opening of the lead terminal lead-out portion 16 as a fulcrum.
The lead terminal 12 is arranged in the guide groove 40 bent at the opening side of the lead terminal lead-out portion 16, for example, as shown in B of FIG. Further, the lead terminal 12 is further bent in contact with the lower end portion of the lower case 8 on the tip side, and is housed in the terminal groove 42. At this time, the lead terminal 12 is bent at an angle perpendicular to or more than the projecting direction from the lead terminal lead-out portion 16, and is accommodated in the guide groove 40. Further, the lead terminal 12 bent toward the terminal groove 42 may have an amount of protrusion to the outside set according to a mounting form with a substrate or an electronic component (not shown) on which the electronic component 2 is mounted, for example, on a flat surface. At least a part of the lower case 8 is flush with the bottom surface of the lower case 8 or protrudes outward from the lower case 8.

<Effect of the third embodiment>
According to such a configuration, one of the following effects can be obtained.
(1) Since the same configurations as those of the first embodiment and the second embodiment are included, the same effects as those of these electronic components can be obtained.
(2) By bending the lead terminal 12 protruding from the lead terminal lead-out portion 16 along the guide groove 40 inclined in a direction equal to or more than a right angle from the protruding direction, or further bending toward the mounting portion 18 side of the outer case 4. , The outer case 4 can be bent along the peripheral surface, and the manufacturing accuracy of the electronic component 2 is improved.
(3) By bending the lead terminal 12 larger than a right angle by using the guide groove 40, the followability of the lead terminal 12 to the case exterior side is improved, and the pressing force F applied over time or in the manufacturing process is applied. Even if it is released, it is possible to prevent the lead terminal 12 from being separated from the side surface of the outer case 4 due to the restoring force.

FIG. 7 shows an example of the appearance configuration of the electronic component according to the embodiment.
As shown in FIG. 7, for example, the electronic component 50 is an inductor such as a coil, an inductance element, or the like, and includes a plurality of housings 52 and 54 to prevent foreign matter from being mixed in or discharged. .. The electronic component 50 includes an opening 56 for leading a lead terminal 62 for conducting with a substrate or the like to the outside. Further, the electronic component 50 is surface-mounted on a substrate or the like, and a lead terminal 62 is arranged through a guide groove 60 toward a mounting portion 58 provided on the bottom side of the housing 54. The lead terminal 62 has a bendable hardness, and a portion protruding from the opening 56 is bent along the guide groove 60 and arranged on the mounting portion 58 side.

As shown in FIG. 8, in the electronic component 50, for example, a housing 52 and a housing 54 are joined in the vertical direction, and an element is housed inside the housing 52. This element includes, for example, a lead terminal 62 which is a conductor and a core 64 which is a magnetic material. The core 64 is arranged around the lead terminal 62. The core 64 functions as a coil by interlinking with the lead terminal 62. The length of the lead terminal 62 is longer than that of the core 64, and both ends of the lead terminal 62 serve as terminals for the electronic component 50. As a result, when a current flows through both ends of the lead terminal 62, the coil generates a magnetic field, and a magnetic flux is generated in response to the magnetic field. A voltage is generated by this change in magnetic flux.
The core 64 is formed, for example, in a hollow cylindrical shape, a so-called toroidal shape. Further, the core 64 is formed in a circular shape or a shape close to the circular shape when viewed from the plane side. The lead terminal 62 is arranged in the central portion of the core 64.
The core 64 is a magnetic foil and includes a magnetic material such as silicon steel, a soft magnetic crystal material, a microcrystalline material, an amorphous metal or an amorphous alloy. The core 64 includes, for example, magnetic materials such as iron-based amorphous materials, cobalt-based amorphous materials, iron-based nanocrystal materials, iron-nickel-based alloys, and iron-silicon alloys. The core 64 is formed by winding, for example, a magnetic material. The lead terminal 62 is inserted into the winding of the core 64.
The core 64 may be mounted on a mounting portion (not shown) with respect to the storage portions 72, 74 of the housings 52, 54, for example, or may be fixedly held at a predetermined position with an adhesive or the like interposed therebetween.

A notch 66 is formed in a part of the side surface of the housing 52, for example. Further, the housing 54 is provided with a notch portion 68 at a portion facing the notch portion 66 at the time of joining with the housing 52, for example. In addition, the housing 54 is formed with a mounting portion 69 on which the end surface portion of the joined housing 52 is mounted, and a standing wall portion 70 having a predetermined height is provided inside the mounting portion 69. The vertical wall portion 70 is arranged inside the joined housing 52, and is formed to be at least equal to or shorter than the side surface height inside the housing 52. The housing 54 is formed with a storage portion 72 for accommodating the lower half of the core 64 or a portion equivalent thereto inside the vertical wall portion 70. The storage portion 72 may include, for example, a curved floor capable of holding the curved surface of the core 64 on the bottom surface, a mounting arm on which the core 64 is mounted, or the like.
The notch portion 68 on the housing 54 side is formed in, for example, a part of the standing wall portion 70.

<About the housing 52>
As shown in A of FIG. 9, for example, the housing 52 is formed with a storage portion 74 for storing the upper side of the core 64 inside. Further, in the housing 52, for example, a notch 66 is formed on the winding end surface side of the wound core 64 and on the protruding side side surface of the lead terminal 62. As shown in B of FIG. 9, the cutout portion 66 has a narrow opening width (L2) on the upper side of the housing of the cutout side surface 76 when viewed from the outer front side of the housing 52, and is on the open end side. It is inclined so that the opening width (L3) becomes wider (L3> L2). Further, as shown in C of FIG. 9, the cutout side surface 76 is inclined so that the opening width (L6) on the storage portion 74 side is narrow and the opening width (L7) on the outer side is wide. That is, the cutout side surface 76 of the cutout portion 66 is an inclined surface that is radially widened from the storage portion 74 side toward the open side outside the housing 52.

Further, in the housing 54, for example, as shown in A of FIG. 10 and B of FIG. 10, the notch portion 68 formed in the standing wall portion 70 is viewed from the outer front side of the standing wall portion 70, and the housing of the notched side surface 80 thereof. It is inclined so that the opening width (L4) on the lower part of the body is narrow and the opening width (L5) on the open end side is wide (L5> L4). As shown in FIG. 10C, the cutout side surface 80 is inclined so that the opening width (L8) on the storage portion 72 side is wide and the opening width (L6) on the outer side is narrow. As described above, the cutout side surface 80 of the cutout portion 68 is an inclined surface that is radially widened from the open side outside the housing 54 toward the storage portion 74 side.

<About opening 56>
When the housing 52 is installed on the upper part of the housing 54, the electronic component 50 has an opening surface of a notch 66 on the side surface of the housing 52 and a standing wall of the housing 54, for example, as shown in A of FIG. The opening surfaces of the notch 68 of the portion 70 are arranged so as to face each other, and the opening 56 of the housing is formed between the notch 66 and the notch 68. The opening shape and opening amount of the opening 56 are determined according to the joint position between the housing 52 and the housing 54. That is, the side surface of the housing 52 is lowered along the vertical wall portion 70 of the housing 54, so that the side surface of the housing 52 covers the cutout portion 68 of the housing 54 and narrows the opening height thereof. Then, on the side surface of the housing of the electronic component 50, an opening 56 having a width and a height at which the notch portion 68 and the notch portion 66 overlap is formed. Further, in the opening 56, the notched side surface 76 of the housing 52 and the notched side surface 80 of the housing 54 are arranged adjacent to each other. The notched side surfaces 76 and 80 are inclined surfaces with respect to the height direction and the horizontal direction. Therefore, the side surface of the opening 56 has a shape in which the cutout side surfaces 76 and 80 project toward the inside of the opening portion. As a result, as shown in B of FIG. 11, for example, the electronic component 50 can ensure the airtightness of the opening 56 by contacting the side surface side of the lead terminal 62 through which the opening 56 is inserted.

In addition, as shown in FIG. 12, for example, the tip end portion of the lead terminal 62 is arranged as the mounting portion 58 on the bottom portion of the electronic component 50, and a spare terminal 82 may be provided around the tip portion thereof. The spare terminal 82 is, for example, a means for increasing the contact area with respect to the mounting surface of a substrate (not shown). The spare terminal 82 may be electrically connected to, for example, the lead terminal 62.

<Effect of Examples>
According to such a configuration, the following effects can be obtained.
(1) By joining the housings 52 and 54 and overlapping the notch portions 66 and 68, an opening 56 can be formed according to the thickness and outer diameter shape of the lead terminal 62, and the housing can be hermetically sealed. Is enhanced.
(2) An opening for leading out the lead terminal 62 by inclining the notches 66 and 68 of the housings 52 and 54 so as to have different opening widths and by facing these notches 66 and 68. The width of the inside of the portion 56 can be narrowed, and the passage of foreign matter between the housing portions 72 and 74 can be prevented from passing through.
(3) The lead terminal 62 protruding from the opening 56 is bent along a guide groove 60 inclined in a direction equal to or more than a right angle from the protruding direction, and further bent toward the mounting portion 58 of the outer case to form a housing. Bending along the peripheral surface of the body 54 becomes possible, and the manufacturing accuracy of the electronic component 50 is improved.
(4) By bending the lead terminal 62 more than a right angle by using the guide groove 60, the followability of the lead terminal 62 to the case exterior side is improved, and the pressing force applied over time and in the manufacturing process is released. However, it is possible to prevent the lead terminal 62 from being separated from the side surface of the housing due to the restoring force.
(5) By sandwiching the lead terminal 62 by the notches 66 and 68 of the housings 52 and 54, vibration from the mounting surface side of the electronic component 50 can be blocked or reduced, and the core in the storage portions 72 and 74 can be blocked or reduced. Vibration resistance to 64 is enhanced.

As described above, the most preferable embodiment of the present invention has been described. The present invention is not limited to the above description. Various modifications and modifications can be made by those skilled in the art based on the gist of the invention described in the claims or disclosed in the form for carrying out the invention. Needless to say, such modifications and modifications are included in the scope of the present invention.

In the present invention, the opening surfaces of the openings formed in a plurality of case members for accommodating the elements of electronic components are opposed to each other, and the lead terminals are sandwiched between these openings so that the lead terminals are led out from the outer case. It is useful because it can improve the airtightness of the part and the vibration resistance of electronic parts.

2,50 Electronic components 4 Exterior case 6 Upper case 8 Lower case 10, 64 Core 12, 62 Lead terminal 14 Storage part 16 Lead terminal lead-out part 18, 58 Mounting part 20 Side wall 22 Side part 23, 32, 66, 68 Notch Part 24 End part 26 Side wall 28 Side part 30 Joint end surface 36 Inclined surface part 38 Inclined surface part 40, 60 Guide groove 42 Terminal groove 52, 54 Housing 56 Opening 69 Mounting part 70 Standing wall part 72, 74 Storage part 76, 80 Notched side 82 Spare terminal

Claims (4)

With the element
A first case member having a first opening covering the upper surface side of the lead terminal of the element and a second case member having a second opening covering the lower surface side of the lead terminal are joined and joined. An exterior case with a storage unit for storing the element inside,
The outer case is
The first opening and the second opening face each other, and the lead terminal is sandwiched between the first opening and the second opening that overlap each other, and the lead terminal is sandwiched and placed outside the storage portion. A lead terminal lead-out unit for projecting the lead terminal is provided.
An inclined surface that narrows the opening width in the direction in which the first opening and the side surface of the second opening are separated from the joint portion between the first case member and the second case member. Yes, the opening width on the joint side of the first opening and the second opening is wider than the lead terminal, and the narrowest portion of the opening width is equal to or less than the width of the lead terminal. An electronic component that features. In the lead terminal lead-out portion, the first case member and the second case member have side surfaces of the first opening and the second opening from the outside of the exterior case or the inside of the storage portion. It is an inclined surface in which each opening width is gradually narrowed toward the joint portion of the above, the widest portion of the opening width is larger than the width of the lead terminal, and the narrowest portion of the opening width is the said. The electronic component according to claim 1, wherein the width is equal to or less than the width of the lead terminal. A second case member having a first opening covering the upper surface side of the lead terminal of the element and a second opening having a second opening covering the lower surface side of the lead terminal with the element interposed in the accommodating portion. Join the case member and
The lead terminal is sandwiched between the first opening and the opening surface of the second opening so as to face each other, and the side surfaces of the first opening and the second opening are the same as the first case member. The lead terminal is projected to the outside of the storage portion from a lead terminal lead-out portion having an inclined surface whose opening width is narrowed in a direction away from the joint portion of the second case member.
A method of manufacturing an electronic component, including processing. The electron according to claim 3, further comprising a process of crushing a flat surface portion of the lead terminal arranged in the lead terminal lead-out portion by joining the first case member and the second case member. How to manufacture parts.

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