JP2020140894A - Connecting device and manufacturing method thereof - Google Patents

Abstract

To provide a connecting device capable of maintaining stable electrical connection and having high restoring force.SOLUTION: A connecting device according to the present invention that is arranged between a first member and a second member and electrically connects the first member and the second member includes a conductor having a first terminal portion in contact with the first member and a second terminal portion in contact with the second member, and at least two elastic bodies that are arranged between the first terminal portion and the second terminal portion and are elastically deformable, and the conductor is arranged so as to hold the elastic body, has flexibility, and is deformable together with the elastic body.SELECTED DRAWING: Figure 1

Description

The present invention relates to a connecting device and a method for manufacturing the connecting device.

In a connection device for electronic / electrical equipment such as a connector, a metal plate is generally punched to form a metal plate into a predetermined shape, and then at least a part of the metal plate is bent to form the metal plate. Manufactured by processing into a predetermined shape. The connection device is installed on a support board such as a printed circuit board on which a plurality of integrated circuit packages are installed, and another support board is brought into contact with the upper part of the connection device to obtain electrical connection between the support boards. It is used to maintain the contact state with the support substrate due to the springiness of the connecting device.

As such a connecting device, for example, a flat surface portion on which an IC package is installed and two independently compressible spring arms attached to the surface portion are provided, and the tip of each spring arm is a printed circuit board. An interconnect device having a contact portion that comes into direct contact with the device has been proposed (see, for example, Patent Document 1). The interconnect device can be manufactured by shaping a flat metal sheet into an appropriate shape and then folding it back so that a surface portion and a spring arm are formed.

In the interconnect device of Patent Document 1, when the surface portion is pressed by the IC package, the spring arm is compressed and bent, and both tip portions move in opposite directions toward the outside of the interconnect device. Each spring arm has its tip in contact with the printed circuit board while maintaining a contact force with the printed circuit board.

Japanese Unexamined Patent Publication No. 2000-299422

However, since the interconnect device of Patent Document 1 is formed by folding back a metal sheet into an appropriate shape, the position where the contact portion of the interconnect device contacts the printed circuit board and the surface portion are pressed against it. Errors are likely to occur in the stroke of the spring arm. Therefore, in the interconnect device, the contact pressure of the contact portion with the printed circuit board is difficult to be constant, and there is a possibility that the IC package and the printed circuit board cannot be stably and electrically connected.

Further, in the interconnect device of Patent Document 1, if the pressing force against which the surface portion is pressed by the IC package is too strong, the spring arm cannot be restored, and the shape of the interconnect device may not be sufficiently restored.

One aspect of the present invention is to provide a connecting device capable of stably maintaining an electrical connection and having a high restoring force.

One aspect of the connecting device according to the present invention is a connecting device that is arranged between the first member and the second member and electrically connects the first member and the second member, and is the first member. A conductor having a first terminal portion in contact with a member and a second terminal portion in contact with the second member, and at least elastically deformable, arranged between the first terminal portion and the second terminal portion. The conductor includes two elastic bodies, and the conductor is arranged so as to sandwich the elastic body, has flexibility, and is deformable together with the elastic body.

One aspect of the connecting device according to the present invention can stably maintain an electrical connection and have a high restoring force.

It is a perspective view which shows an example of the structure of the connection device which concerns on 1st Embodiment. It is a perspective view which shows an example of the structure which installed the connection device which concerns on 1st Embodiment between support substrates. It is sectional drawing which shows an example of the structure of a conductor. It is explanatory drawing which shows an example of the state which the connecting device is pressed. It is a perspective view of the conductor which shows an example of the state which provided the through hole in the conductor. It is a perspective view which shows an example of another configuration of a connection device. It is a perspective view which shows an example of another configuration of a connection device. It is a front view which shows an example of another structure of an elastic body. It is a front view which shows an example of another structure of an elastic body. It is a front view which shows an example of another structure of an elastic body. It is a front view which shows an example of another structure of an elastic body. It is a front view which shows an example of another structure of an elastic body. It is a front view which shows an example of another structure of an elastic body. It is a flowchart which shows an example of the manufacturing method of the connection apparatus which concerns on 1st Embodiment. It is a perspective view which shows an example of the structure of the connection device which concerns on 2nd Embodiment. It is a perspective view which shows an example of another configuration of a connection device. It is a flowchart which shows an example of the manufacturing method of the connection apparatus which concerns on 2nd Embodiment. It is a figure which shows the structure of the test body. It is a figure which shows the state which pushed in by applying a load to the connection device of a test body. It is a figure which shows the relationship between the pushing amount of a connecting device, and the load applied to a substrate. It is a figure which shows the relationship between the load applied to a substrate and contact resistance.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in order to facilitate understanding of the description, the same components are designated by the same reference numerals in each drawing, and duplicate description will be omitted. The scale of each member in the drawing may differ from the actual scale. In the present specification, a three-dimensional Cartesian coordinate system in three axial directions (X-axis direction, Y-axis direction, Z-axis direction) is used, and the direction orthogonal to the axial direction of the through hole of the elastic body is the X-axis direction and the elastic body. The axial direction of the through hole is the Y-axis direction, and the height direction of the connecting device is the Z-axis direction. The second terminal side of the conductor is the + Z axis direction, and the opposite direction is the −Z axis direction. In the following description, the + Z-axis direction may be referred to as up, and the −Z-axis direction may be referred to as down. Unless otherwise specified, the tilde "~" indicating a numerical range in the present specification means that the numerical values described before and after the tilde are included as the lower limit value and the upper limit value.

[First Embodiment]
<Connecting device>
The connection device according to the first embodiment will be described. FIG. 1 is a perspective view showing an example of the configuration of the connecting device according to the present embodiment, and FIG. 2 is a perspective view showing an example of the configuration in which the connecting device according to the present embodiment is installed between the support substrates. is there. As shown in FIG. 1, the connecting device 1A includes a conductor 10A, elastic bodies 20A and 20B, and an adhesive layer 30. As shown in FIG. 2, the connecting device 1A is arranged between the support substrate 2 which is the first member and the support substrate 3 which is the second member. The support boards 2 and 3 are printed circuit boards or the like on which a plurality of integrated circuit packages are installed. The connecting device 1A comes into contact with the conductive portion 21 of the support substrate 2 and the conductive portion 31 of the support substrate 3, and electrically connects the support substrate 2 and the support substrate 3. Hereinafter, each member constituting the conductive component 1A will be described.

(conductor)
As shown in FIG. 1, the conductor 10A is formed by bending a rectangular plate-shaped member having conductivity. The conductor 10A has a first terminal portion 11 in contact with the support substrate 2 (see FIG. 2) and a meandering portion 12 formed so as to be folded back in a substantially U shape a plurality of times (twice in FIG. 1) in the X-axis direction. And a second terminal portion 13 in contact with the support substrate 3 (see FIG. 2).

The first terminal portion 11 and the second terminal portion 13 are formed in a flat plate shape. The first terminal portion 11 and the second terminal portion 13 are provided so as to be substantially parallel to each other via the elastic bodies 20A and 20B.

The meandering portion 12 is composed of folded portions 121 and 122 formed in a substantially U shape. The upper end of the folded-back portion 121 is connected to the lower end of the folded-back portion 122, and the lower end of the folded-back portion 121 is connected to the first terminal portion 11. The upper end of the folded-back portion 122 is connected to the second terminal portion 13.

In the conductor 10A, the elastic body 20A is sandwiched between the first terminal portion 11 and the meandering portion 12, and the elastic body 20B is sandwiched between the meandering portion 12 and the second terminal portion 13. That is, the conductor 10A is arranged between the support substrates 2 and 3 so as to sandwich the elastic bodies 20A and 20B.

The conductor 10A is arranged along a part of the outer circumferences of the elastic bodies 20A and 20B, and sandwiches the elastic bodies 20A and 20B in an exposed state. Since the conductor 10A has flexibility, it can meander. The conductor 10A includes a meandering portion 12, and is configured to be deformable together with the elastic bodies 20A and 20B.

As shown in FIG. 3, the conductor 10A has a film base material 101, adhesive layers 102a and 102b formed on both sides thereof, and conductive layers 103a and 103b, and the conductive layer is directed from one to the other. The 103a, the adhesive layer 102a, the film base material 101, the adhesive layer 102b, and the conductive layer 103b are laminated in this order. The conductor 10A can be used as a conductive film having a film base material 101, adhesive layers 102a and 102b, and conductive layers 103a and 103b. As shown in FIG. 1, elastic bodies 20A and 20B are provided on either one or both of the conductive layer 103a and the conductive layer 103b via the adhesive layer 30.

Examples of the film base material 101 include polyimide, polyethylene terephthalate, polybutylene terephthalate, polyethylene nitrile, polyphenylene sulfide, and the like. These may be used alone or in combination of two or more.

The thickness of the film base material 101 is preferably 10 μm to 100 μm, more preferably 20 μm to 75 μm, and even more preferably 25 μm to 50 μm. When the thickness of the film base material 101 is in the range of 10 μm to 100 μm, the film base material 101 can have sufficient strength and elasticity.

The adhesive layers 102a and 102b have a function of increasing the adhesive force between the film base material 101 and the conductive layers 103a and 103b. The adhesive layers 102a and 102b contain a triazine-based compound. The adhesive layers 102a and 102b are formed by using a molecular adhesive containing a triazine compound.

As the triazine-based compound, a triazine thiol compound can be used. As the triazine thiol compound, for example, a triazine ring having a thiol group (-SH group) or an alkali metal salt of a thiol group can be used. Any one of the functional groups may have another structure such as a dibutylamino group or an anirino group. Specific examples of the triazinethiol compound include, for example, 2-trietkiisylproopiramiino-4-thiol-6-thiol-1,3,5-triazine, 2-trietkiisylproopiramiino-4-azide. -6-Azido-1,3,5-triazine, 2-trietkiisylproopiramiino-4-aminoethylamino-6-aminoethylamino-1,3,5-triazine, 2-trihydroxylproopiramiino-4- Thiol-6-thiol-1,3,5-triazine, 2-trihydroxylproopiramiino-4-azido-6-azido-1,3,5-triazine, 2-trihydroxylproopiramiino-4- Aminoethyramino-6-aminoethyramino-1,3,5-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (4-methoxynaphthyl)- 4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (4-ethoxynaphthyl) -4,6-bis (trichloromethyl) 1,3,5-triazine, 2- (4-) Ethoxycarbonylnaphthyl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2,4,6-tris (monomonolomethyl) -1,3,5-triazine, 2,4,6-tris (Dichloromethyl) -1,3,5-triazine, 2,4,6-tris (trichloromethyl) -1,3,5-triazine, 2-methyl-4,6-bis (trichloromethyl) -1,3 , 5-Triazine, 2-n-propyl-4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (α, α, β-trichloroethyl) -4,6-bis (trichloromethyl) )-1,3,5-Triazine, 2-phenyl-4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (3,4-epoxyphenyl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (p-chlorophenyl) -4,6- Bis (trichloromethyl) -1,3,5-triazine, 2- [1- (p-methoxyphenyl) -2,4-butadienyl] -4,6-bis (trichloromethyl) -1,3,5-triazine , 2-Styril-4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (p-methoxystyryl) -4,6-bis (trichloromethyl)- 1,3,5-Triazine, 2- (pi-propyloxystyryl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (p-tolyl) -4,6- Bis (trichloromethyl) -1,3,5-triazine, 2- (4-methoxynaphthyl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2-phenylthio-4,6-bis (Trichloromethyl) -1,3,5-triazine, 2-benzylthio-4,6-bis (trichloromethyl) -1,3,5-triazine, 4- (o-bromo-p-N, N- (di) Ethoxycarbonylamino) -phenyl) -2,6-di (trichloromethyl) -1,3,5-triazine, 2,4,6-tris (dibromomethyl) -s-triazine, 2,4,6-tris ( Tribromomethyl) -1,3,5-triazine, 2-methyl-4,6-bis (tribromomethyl) -s-triazine, 2-methoxy-4,6-bis (tribromomethyl) -1,3 , 5-Triazine, 2,4,6-Trimercapto-1,3,5-Triazine, 2-dibutylamino-4,6-Dimercapto-s-Triazine, 2-Anilino-4,6-Dimercapto-s-Triazine , 2,4,6-Trimercapto-1,3,5-triazine monosodium salt, 2,4,6-trimercapto-1,3,5-triazinenatrim salt and the like. In addition, 1,3,5-triazine is also referred to as s-triazine. These may be used alone or in combination of two or more. Examples of commercially available products include "a-TES", "n-TES" and "p-TES" manufactured by Iokagaku Research Institute, Ltd.

The conductive layers 103a and 103b have a function of imparting conductivity to the conductor 10A. The conductive layers 103a and 103b are composed of two layers, a first conductive layer 103a1 and 103b1 and a second conductive layer 103a2 and 103b2.

Materials for forming the conductive layers 103a and 103b include various metals such as gold (Au), silver (Ag), copper (Cu), nickel (Ni), iron, aluminum, tin, lead, chromium and cobalt; Alloys: Carbon-based materials such as carbon black, graphite (graphite), carbon nanotubes, carbon fibers (carbon fibers), and fullerene can be mentioned. As the materials forming the conductive layers 103a and 103b, these may be used alone or in combination of two or more. Among these, silver or copper is preferably used as the material for forming the conductive layers 103a and 103b from the viewpoints of ensuring stable conductivity, reducing the manufacturing cost, and easiness of manufacturing. For example, the first conductive layers 103a1 and 103b1 are formed of one of the Cu layer (for example, Cu plating film and the like) and the Ag layer (for example, Ag plating film and the like), and the second conductive layers 103a2 and 103b2 are the Cu layer and the Ag layer. Can be formed on the other side of. Further, from the viewpoint of connection stability, it is preferable to use an Au layer for the outermost surface second conductive layers 103a2 and 103b2. At that time, for example, the first conductive layers 103a1 and 103b1 can be formed of a single layer of Cu layer or two layers of Ni layer / Cu layer.

The thickness of the conductive layers 103a and 103b is preferably 1 μm to 50 μm, more preferably 5 μm to 30 μm, and even more preferably 10 μm to 20 μm. When the thickness of the conductive layers 103a and 103b is within the range of 1 μm to 50 μm, sufficient conductivity can be ensured. Further, the thickness of the conductive layers 103a and 103b is more preferably determined according to the magnitude of the flowing current, and in some cases, it may be 50 μm or more.

As shown in FIG. 1, the conductor 10A is provided with a conductive portion 14 that conducts the conductive layer 103a and the conductive layer 103b constituting the conductor 10A at the second terminal portion 13 of the conductor 10A. The conductor 10A can ensure the continuity between the conductive layers 103a and 103b (see FIG. 3) formed on both surfaces of the film base material 101 (see FIG. 3) via the conductive portion 14. The conductive portion 14 may be provided in the meandering portion 12 or the second terminal portion 13, or may be provided in any two or more of the first terminal portion 11, the meandering portion 12, and the second terminal portion 13. May be good.

(Elastic body)
As shown in FIG. 1, the elastic bodies 20A and 20B are arranged between the first terminal portion 11 and the second terminal portion 13. The elastic bodies 20A and 20B are arranged on the support substrate 2 via the conductor 10A, and the elastic bodies 20A and 20B are laminated in the direction connecting the first terminal portion 11 and the second terminal portion 13. It is provided.

The elastic bodies 20A and 20B are formed in a tubular body.

The outer diameters of the elastic bodies 20A and 20B in the axial direction are preferably 2.5 mm to 10 mm, and more preferably 3 mm to 5 mm. The elastic bodies 20A and 20B can have sufficient durability as long as the outer diameter is within the range of 2.5 mm to 10 mm.

The inner diameters of the elastic bodies 20A and 20B in the axial direction are preferably 0.5 mm to 2 mm, and more preferably 1 mm to 1.5 mm. The elastic bodies 20A and 20B can have a sufficient amount of deflection as long as the inner diameter is within the range of 0.5 mm to 2 mm.

The elastic bodies 20A and 20B are made of elastically deformable members. As the material for forming the elastic bodies 20A and 20B, for example, an elastomer such as silicone rubber, chloroprene rubber, isoprene rubber, butyl rubber, fluororubber or urethane rubber can be used. The elastic bodies 20A and 20B may have conductivity by forming the above-mentioned materials by including a conductive material such as metal particles or a carbon-based material. As a result, the conductivity of the entire connecting device 1A can be improved by electrically connecting the elastic bodies 20A and 20B and the conductive layers 103a and 103b. Therefore, the connecting device 1A can pass a larger current.

When the elastic bodies 20A and 20B are formed of an elastomer, the rubber hardness of the elastic bodies 20A and 20B is preferably in the range of 40 to 70, and more preferably in the range of 50 to 60. The elastic bodies 20A and 20B can have sufficient strength as long as the rubber hardness is in the range of 40 to 70. The rubber hardness is a value defined by the Japanese Industrial Standards JIS K6301.

(Adhesive layer)
As shown in FIG. 1, the adhesive layer 30 is provided on the outer periphery of the elastic bodies 20A and 20B. Since the elastic bodies 20A and 20B are sandwiched between the conductors 10A, the adhesive layer 30 is located between the elastic bodies 20A and 20B and the conductor 10A, and is located along a part of the outer periphery of the elastic bodies 20A and 20B. The conductor 10A is fixed. In FIG. 1, the adhesive layer 30 is formed on the entire outer periphery of the elastic bodies 20A and 20B, but the adhesive layer 30 may be formed only between the elastic bodies 20A and 20B and the conductor 10A. , The elastic bodies 20A and 20B and the conductor 10A may be partially formed as long as they can be fixed to each other.

The adhesive layer 30 contains a triazine-based compound. The adhesive layer 30 can be formed by using the same material as the adhesive layers 102a and 102b of the conductor 10A described above.

Since the adhesive layer 30 is formed by using a molecular adhesive containing a triazine compound like the conductive layers 103a and 103b, the thickness of the adhesive layer 30 is about 1 nm to 100 nm. The adhesive layer 30 may be formed by using a general adhesive. The thickness of the adhesive layer 30 at that time is preferably 1 μm to 20 μm, more preferably 3 μm to 15 μm, and further preferably 5 μm to 10 μm.

As described above, the connecting device 1A includes a conductive conductor 10A and elastically deformable elastic bodies 20A and 20B. The conductor 10A is arranged so as to sandwich the elastic bodies 20A and 20B, has flexibility, and is configured to be deformable together with the elastic bodies 20A and 20B. The connecting device 1A combines the function of the conductor 10A to impart conductivity to the connecting device 1A and the function of the elastic bodies 20A and 20B to impart elasticity to the connecting device 1A, and the conductor 10A and the elastic bodies 20A and 20B are combined. It shares the role of exerting a conductive or elastic function. Therefore, the connecting device 1A can flexibly respond when a pressing force is applied from the outside or when the pressing force is removed.

As shown in FIG. 4, when the second terminal portion 13 of the conductor 10A is pressed toward the support substrate 2 side by the support substrate 3, the conductor 10A is deformed so as to bend. Since the elastic bodies 20A and 20B are cylindrical bodies and are arranged between the first terminal portion 11 and the second terminal portion 13, the elastic bodies 20A and 20B are also deformed so that the conductor 10A bends. It deforms to bend. Therefore, the conductor 10A can be deformed so as to bend along the outer circumferences of the elastic bodies 20A and 20B. Even if the elastic bodies 20A and 20B are pressed by the first terminal portion 11 of the conductor 10A, the repulsive force of the elastic bodies 20A and 20B exerts a repulsive force against the bending of the conductor 10A. The repulsive force of the elastic bodies 20A and 20B suppresses the bending of the conductor 10A. As a result, the pressing force applied to the second terminal portion 13 of the conductor 10A can be maintained, so that the contact pressure can be made constant. Therefore, the connecting device 1A can stably maintain the electrical connection between the support substrates 2 and 3.

Further, in the connecting device 1A, even if a large pressing force is applied to the first terminal portion 11 from the support substrate 3 toward the support substrate 2 side and the conductor 10A is bent and greatly deformed (for example, the amount of deformation is 50%). When the pressing force is removed, the repulsive force of the elastic bodies 20A and 20B can restore the conductor 10A to the state before being pressed. Therefore, the connecting device 1A has a high restoring force even when the deformation amount of the conductor 10A is large.

As shown in FIG. 4, the amount of deformation of the conductor 10A is determined by the first terminal portion 11 having a maximum distance L2 between the first terminal portion 11 and the second terminal portion 13 when the first terminal portion 11 is pressed. It is represented by the ratio (maximum distance L2 / maximum distance L1) of the first terminal portion 11 and the second terminal portion 13 to the maximum distance L1 when not pressed. The connecting device 1A can increase the maximum distance L1 / maximum distance L2 of the conductor 10A by 1.1 times or more.

Further, in the connecting device 1A, the conductor 10A is responsible for the conductivity and the elastic bodies 20A and 20B are responsible for the contact stability, so that the connecting device 1A is downsized and between the support substrate 2 and the support substrate 3. , Stable continuity can be ensured via the conductor 10A. Therefore, the connecting device 1A can have a structure in which the temperature rise of the connecting device 1A is 25 ° C. or lower even when a large current (for example, 7.5A) is passed.

Further, since the connecting device 1A can increase the repulsive force while increasing the amount of bending, it can return to the original state even if a large pressing force is applied. In the case of a connecting device formed by folding a metal plate, it is necessary to increase the size of the connecting device, for example, in order to restore the original shape even when a large pressing force is applied. In the present embodiment, even if a large pressing force is applied to the connecting device 1A and the conductor 10A is greatly deformed (for example, the amount of deformation is 50%), the repulsive force of the elastic bodies 20A and 20B removes the pressing force. The conductor 10A can be restored to the state before being pressed. Therefore, the connecting device 1A can maintain a large restoring force while reducing the size.

The connecting device 1A is provided so that the elastic bodies 20A and 20B are laminated in the direction connecting the first terminal portion 11 and the second terminal portion 13. As a result, when the second terminal portion 13 of the conductor 10A is pressed toward the first terminal portion 11, the elastic bodies 20A and 20B can be bent, so that the amount of deformation of the elastic bodies 20A and 20B, respectively. The range of motion (stroke) between the first terminal portion 11 and the second terminal portion 13 can be increased by the amount of the above.

Since the connecting device 1A has the first terminal portion 11 and the second terminal portion 13 facing each other via the elastic bodies 20A and 20B, the second terminal portion 13 of the conductor 10A is pressed by the support substrate 3. At that time, the elastic bodies 20A and 20B can be bent in the same direction.

In the connecting device 1A, the first terminal portion 11 and the second terminal portion 13 are formed in a flat plate shape. As a result, the first terminal portion 11 and the second terminal portion 13 can come into surface contact with the support substrates 2 and 3, so that they can be stably electrically connected to the support substrates 2 and 3. Further, by forming the first terminal portion 11 and the second terminal portion 13 in a flat plate shape, even if the second terminal portion 13 of the conductor 10A is pressed by the support substrate 3, the first terminal portion 11 and the second terminal portion 11 and the second terminal portion 13 are formed. It becomes easy to maintain the parallel state with the portion 13. Therefore, the support substrate 3 can be connected while being maintained substantially parallel to the support substrate 2.

In the connecting device 1A, the conductors 10A are fixedly arranged along a part of the outer periphery of the elastic bodies 20A and 20B, and the elastic bodies 20A and 20B are arranged adjacent to each other via the conductors 10A, and are elastic. A part of the outer circumference of the bodies 20A and 20B is exposed. Even if a large pressing force is applied to the second terminal portion 13 of the conductor 10A, the pressing force is absorbed by the elastic bodies 20A and 20B, and the pressing force acting on the conductor 10A can be reduced. Therefore, it is possible to reduce the occurrence of cracks in the conductor 10A and to stably secure the continuity.

The connecting device 1A has elastic bodies 20A and 20B in a cylindrical shape. As a result, when the first terminal portion 11 of the conductor 10A is pressed toward the support substrate 2 side by the support substrate 3, the elastic bodies 20A and 20B can be easily bent, and the elastic bodies 20A and 20B can be easily deformed. Furthermore, the restoring force can be maintained for a long period of time even with repeated deformation. Further, the connecting device 1A makes it easy to deform the elastic bodies 20A and 20B so that the second terminal portion 13 of the conductor 10A does not have to increase the pressure pressed by the support substrate 3, but the second terminal portion 13 Can be easily moved, and the stroke between the first terminal portion 11 and the second terminal portion 13 can be increased. Therefore, the connecting device 1A can increase the distance between the support substrate 2 and the support substrate 3.

In the connecting device 1A, the conductor 10A is a conductive film having an insulating film base material 101 and conductive layers 103a and 103b formed on both sides of the film base material 101. As a result, the conductor 10A can easily sandwich the elastic bodies 20A and 20B while covering the circumferences of the elastic bodies 20A and 20B, so that the elastic bodies 20A and 20B can be easily sandwiched and held, and the elastic bodies 20A and 20B can be held. Even if 20A and 20B are elastically deformed, it is possible to reduce damage to the conductor 10A.

The connecting device 1A enhances the adhesive force between the film base material 101 and the conductive layers 103a and 103b by providing the conductor 10A with the adhesive layers 102a and 102b between the film base material 101 and the conductive layers 103a and 103b. be able to. As a result, even if the conductor 10A is repeatedly deformed, the peeling of the film base material 101 and the conductive layers 103a and 103b can be suppressed.

By including the adhesive layer 30 between the elastic bodies 20A and 20B and the conductor 10A, the connecting device 1A can increase the adhesive force between the elastic bodies 20A and 20B and the conductor 10A. As a result, even if the conductor 10A is repeatedly deformed, the peeling of the elastic bodies 20A and 20B and the conductor 10A can be suppressed.

In the connecting device 1A, when the elastic bodies 20A and 20B are formed of an elastomer, the rubber hardness of the elastic bodies 20A and 20B can be 40 to 70. When the elastic bodies 20A and 20B are made of an elastomer, if the rubber hardness of the elastic bodies 20A and 20B is 40 to 70, the elastic bodies can exhibit a high restoring force.

In the connecting device 1A, the elastic bodies 20A and 20B may be formed by using a material having conductivity, and the elastic bodies 20A and 20B may have conductivity. Since the elastic bodies 20A and 20B have conductivity, in addition to the conduction by the conductor 10A, the support substrate 2 and the support substrate 3 can be made conductive via the elastic bodies 20A and 20B. As a result, the connecting device 1A can flow a larger current between the support substrate 2 and the support substrate 3.

In the present embodiment, the conductor 10A is formed of one conductive film, but may be formed by laminating a plurality of conductive films.

In the present embodiment, the conductor 10A may be configured by laminating the film base material 101 and the conductive layers 103a and 103b without interposing the adhesive layers 102a and 102b.

In the present embodiment, the conductive layers 103a and 103b may be a single layer or may be composed of three or more layers. When the conductive layer 103a is formed of a single layer, processing can be performed more easily. As the conductive layer 103a, for example, a thin film such as a Cu plating film composed of a Cu layer or an Ag plating film composed of an Ag layer is preferable. It is preferable to use it for. For example, Cu foil may be used as the Cu layer.

In the present embodiment, as shown in FIG. 5, the conductor 10A is provided with a through hole 13a penetrating the second terminal portion 13 in the second terminal portion 13, and the conductive layer 103a is formed on the inner wall surface of the through hole 13a. It may have a through hole (conducting portion) 14 that electrically connects to the conductive layer 103b. As a result, the conductive layers 103a and the conductive layers 103b formed on both sides of the film base material 101 are electrically connected via the conductive portion 14, and the conductivity between the first terminal portion 11 and the second terminal portion 13 is conductive. Will increase. Further, the connecting device 1A can form the through hole 13a at an arbitrary place of the conductor 10A other than the second terminal part 13, and form the conductive part 14 at an arbitrary place. Thereby, the form of the conductor 10A sandwiching the elastic bodies 20A and 20B can be designed more freely. Further, the conductivity between the first terminal portion and the second terminal portion is different from that of the conductor in which the conductive layer is formed on only one surface, the conductor 10A is conductive on the other surface of the film base material 101. The layer 103a or the conductive layer 103b increases. Therefore, the conductor 10A can reduce the resistance between the first terminal portion 11 and the second terminal portion 13 without increasing the thickness of the conductive layers 103a and 103b. Therefore, the connecting device 1A can pass a larger current between the first terminal portion 11 and the second terminal portion 13. It is more preferable that the conductor 10A has a conductive portion 14 in both the first terminal portion 11 and the second terminal portion 13.

In the present embodiment, two elastic bodies 20A and 20B are provided, but three or more elastic bodies 20A and 20B may be provided. For example, as shown in FIG. 6, the three elastic bodies 20A, 20B and 20C may be provided so as to be sandwiched between the conductors 10A.

In this case, since the surface of the first terminal portion 11 in contact with the support substrate 2 is the surface in which the second terminal portion 13 is in contact with the support substrate 3, the adhesive provided on the surface of the first terminal portion 11 not in contact with the support substrate 2. The layer and the conductive layer may be omitted.

In the present embodiment, the two elastic bodies 20A and 20B may be formed in a columnar body such as a cylinder or a prism, or one or more notches are formed along the axial direction when viewed from the axial direction. It may be a tubular body. For example, as shown in FIG. 7, the elastic bodies 20A and 20B are provided so that notches 201 are alternately formed on the side surfaces of the adjacent elastic bodies 20A and 20B in the axial view of the elastic bodies 20A and 20B. May be.

In the present embodiment, the outer shapes of the two elastic bodies 20A and 20B in the axial direction may be formed in an elliptical shape as shown in FIG. 8, or may be formed in a rectangular shape as shown in FIG. You may be. As shown in FIG. 10, it may be formed in a hexagonal shape.

In the present embodiment, the two elastic bodies 20A and 20B may have different sizes in the axial view. For example, as shown in FIG. 11, the size of the elastic body 20A in the axial direction may be formed larger than the size of the elastic body 20B in the axial direction.

In the present embodiment, the two elastic bodies 20A and 20B may have different inner diameters of the cylinder. For example, as shown in FIG. 12, the inner diameter of the elastic body 20A may be formed larger than the inner diameter of the elastic body 20B.

In the present embodiment, the two elastic bodies 20A and 20B may be arranged so as to be adjacent to each other in the X-axis direction via the conductor 10A, as shown in FIG.

In the present embodiment, the adhesive layer 30 may be formed on the surfaces of the elastic bodies 20A and 20B that are in contact with at least the conductor 10A.

<Manufacturing method of connecting device>
A method of manufacturing the connecting device according to the first embodiment will be described. FIG. 14 is a flowchart showing an example of a manufacturing method of the connecting device according to the present embodiment. As shown in FIG. 14, the method for manufacturing the connecting device according to the present embodiment includes an elastic body cleaning step S11, a conductor forming step S12, an adhesive layer forming step S13, and an installation step S14.

In the elastic body cleaning step S11, the surfaces of the elastic bodies 20A and 20B are washed with water, alcohol, acetone, or the like. As a result, dirt, foreign matter, etc. adhering to the surfaces of the elastic bodies 20A and 20B are removed.

In the conductor forming step S12, the conductor 10A that sandwiches a part of the outer circumferences of the elastic bodies 20A and 20B in an exposed state is formed. The conductor forming step S12 includes a surface treatment step S121 and a conductive layer forming step S122.

In the surface treatment step S121, after cleaning the surface of the insulating film base material 101, a molecular adhesive containing a triazine compound is applied to both surfaces of the film base material 101 and dried. As a result, the adhesive layers 102a and 102b are formed on both side surfaces of the film base material 101.

In the conductive layer forming step S122, the first conductive layers 103a1 and 103b1 are formed on the surfaces of the adhesive layers 102a and 102b formed in the surface treatment step S111. After that, the second conductive layers 103a2 and 103b2 are formed on the surfaces of the first conductive layers 103a1 and 103b1. As a result, the conductor 10A is formed.

As a method for forming the first conductive layers 103a1 and 103b1 and the second conductive layers 103a2 and 103b2, a method of forming a metal plating film by an electroless plating method, an electroplating method, or the like can be used. For example, the first conductive layers 103a1 and 103b1 and the second conductive layers 103a2 and 103b2 are each formed by electroless plating to have a predetermined thickness (for example, 1 μm to 5 μm), and then electroplated. , Can be of any thickness. Further, for the first conductive layers 103a1 and 103b1 and the second conductive layers 103a2 and 103b2, a method using sputtering or vapor deposition can also be used.

In the adhesive layer forming step S13, the outer periphery of the elastic bodies 20A and 20B is cleaned with the outer peripheral surfaces of the elastic bodies 20A and 20B as in the case of the adhesive layers 102a and 102b, and then a molecular adhesive containing a triazine compound is applied. By drying, the adhesive layer 30 is formed.

In the installation step S14, the conductor 10A is sandwiched in a state where a part of the outer circumferences of the elastic bodies 20A and 20B is exposed to produce the connecting device 1A. The installation step S14 includes a wrapping step S141 and a cutting step S142.

In the encapsulation step S141, the elastic bodies 20A and 20B are sandwiched between the first terminal portion 11 and the second terminal portion 13 of the conductor 10A, and the elastic bodies 20A and 20B are passed through the conductor 10A to the first. The conductor 10A is arranged side by side in the direction connecting the terminal portion 11 and the second terminal portion 13, and the conductor 10A is fixed by the adhesive layer 30 along a part of the outer circumferences of the elastic bodies 20A and 20B.

In the cutting step S142, the elastic bodies 20A and 20B and the conductor 10A are divided into a plurality of pieces along the axial direction of the elastic bodies 20A and 20B.

As a result, a plurality of connecting devices 1A according to the present embodiment can be obtained.

In the manufacturing method of the connecting device according to the present embodiment shown in FIG. 14, the adhesive layers 102a and 102b are formed on both surfaces of the film base material 101 in the surface treatment step S111, but the adhesive layers 102a and 102b are unnecessary. The surface treatment step S111 may not be provided.

In the method of manufacturing the connecting device according to the present embodiment shown in FIG. 14, the adhesive layer 30 may be formed only on the surfaces of the elastic bodies 20A and 20B in contact with at least the conductor 10A in the adhesive layer forming step S13.

In the method of manufacturing the connecting device according to the present embodiment shown in FIG. 14, when the adhesive layer 30 is unnecessary, the adhesive layer forming step S13 may not be required.

[Second Embodiment]
<Connecting device>
The connecting device according to the second embodiment will be described. The connecting device according to the present embodiment is formed by forming the conductor 10A of the connecting device 1A according to the first embodiment so as to cover the side surfaces of the elastic bodies 20A and 20B.

FIG. 15 is a perspective view showing an example of the configuration of the connecting device according to the second embodiment. As shown in FIG. 15, in the connecting device 1B, the elastic bodies 20A and 20B are arranged adjacent to each other to form an aggregate of elastic bodies (elastic core), and the conductor 10B is a side surface of the elastic core. It is provided in a state of being narrowly held while wrapping it so as to cover it. The conductor 10B has a through hole 13a in a region in contact with the support substrate 3, and the conductive layer 103a (see FIG. 3) and the conductive layer 103b (see FIG. 3) forming the conductor 10B on the inner wall surface of the through hole 13a. It has a through hole (conducting portion) 14 that electrically connects to and.

In the connecting device 1B, the first terminal portion 11 is a region in contact with the support substrate 2, and the second terminal portion 13 is a region in contact with the support substrate 3.

If the conductor 10B is wrapped so as to cover the side surfaces of the elastic body 20A and the elastic body 20B, the conductor 10B does not have to be formed along all the side surfaces of the elastic body 20A and the elastic body 20B, and is elastic with the elastic body 20A. It is formed so that a gap is formed in a portion adjacent to the body 20B.

Similar to the connecting device 1A according to the first embodiment, the connecting device 1B has a function of the conductor 10B imparting conductivity to the connecting device 1B and the elastic bodies 20A and 20B imparting elasticity to the connecting device 1B. By combining the functions, the conductor 10B and the elastic bodies 20A and 20B share the role of exerting the conductive or elastic function. Therefore, the connecting device 1B can flexibly respond when a pressing force is applied from the outside or when the pressing force is removed. Therefore, the connecting device 1B can maintain the pressing force applied to the second terminal portion 13 of the conductor 10B, so that the contact pressure can be made constant. Therefore, the connecting device 1B can also stably maintain the electrical connection between the support substrates 2 and 3.

Further, in the connecting device 1B, similarly to the connecting device 1A according to the first embodiment, a large pressing force is applied to the first terminal portion 11 from the support substrate 3 toward the support substrate 2, and the conductor 10B is flexed. Even if the conductor 10B is greatly deformed (for example, the amount of deformation is 50%), the conductor 10B can be restored to the state before being pressed by the repulsive force of the elastic bodies 20A and 20B when the pressing force is removed. Therefore, the connecting device 1B also has a high restoring force even when the amount of deformation of the elastic core is large.

Similar to the connecting device 1A according to the first embodiment, the connecting device 1B can increase the maximum distance L1 / maximum distance L2 of the conductor 10A by 1.1 times or more.

Further, in the connecting device 1B as well as the connecting device 1A, the conductor 10B is responsible for the conductivity and the elastic bodies 20A and 20B are responsible for the contact stability, so that the connecting device 1B is downsized and supported by the support substrate 2. Stable conduction can be ensured between the substrate 3 and the substrate 3 via the conductor 10B. Therefore, the connecting device 1B can also have a structure in which the temperature rise of the connecting device 1B is 25 ° C. or lower even when a large current (for example, 7.5A) is passed.

Further, the connecting device 1B is pushed even if a large pressing force is applied and the conductor 10B is bent and greatly deformed (for example, the amount of deformation is 50%), as in the connecting device 1A according to the first embodiment. When the pressure is removed, the conductor 10B can be restored to the state before being pressed by the repulsive force of the elastic bodies 20A and 20B, so that a large restoring force can be maintained while reducing the size.

Similar to the connecting device 1A according to the first embodiment, the connecting device 1B is provided with elastic bodies 20A and 20B stacked in a direction connecting the first terminal portion 11 and the second terminal portion 13. There is. When the second terminal portion 13 of the conductor 10B is pressed, the elastic bodies 20A and 20B can be bent, so that the elastic bodies 20A and 20B are bent by the amount of the bending of the elastic bodies 20A and 20B, respectively. The stroke between the terminal portion 13 and the terminal portion 13 can be increased.

Since the connecting device 1B is provided with the first terminal portion 11 and the second terminal portion 13 facing each other via the elastic bodies 20A and 20B, the first terminal portion 11 of the conductor 10B is pressed by the support substrate 2. When this is done, the elastic bodies 20A and 20B can be bent in the same direction.

The connecting device 1B is provided in a state in which the conductors 10B are sandwiched while the elastic bodies 20A and 20B are arranged adjacent to each other and are wrapped so as to cover the side surfaces of the elastic core. When a large pressing force is applied to the second terminal portion 13 of the conductor 10B, the conductor 10B is easily bent, so that cracking of the conductor 10B can be reduced and the conduction can be stably ensured.

The connecting device 1B has the elastic bodies 20A and 20B having a cylindrical shape, similarly to the connecting device 1A according to the first embodiment. Therefore, when the first terminal portion 11 of the conductor 10B is pressed toward the support substrate 2 side by the support substrate 3, the elastic bodies 20A and 20B are easily bent, and the elastic core can be easily deformed. Furthermore, the restoring force can be maintained for a long period of time even with repeated deformation. Further, the connecting device 1B makes it easy to deform the elastic bodies 20A and 20B so that the second terminal portion 13 of the conductor 10B does not have to increase the pressure pressed by the support substrate 3, but the second terminal portion 13 Can be easily moved, and the stroke between the first terminal portion 11 and the second terminal portion 13 can be increased. Therefore, even in the connecting device 1B, the distance between the support substrate 2 and the support substrate 3 can be lengthened.

Similar to the connecting device 1A according to the first embodiment, the connecting device 1B uses the conductor 10B on both sides of the insulating film base material 101 (see FIG. 3) and the film base material 101 (see FIG. 3). It is a conductive film having conductive layers 103a and 103b (see FIG. 3) formed in. The connecting device 1B has a conductive portion 14 that electrically connects the conductive layer 103a and the conductive layer 103b to the second terminal portion 13 that is in contact with the support substrate 3. As a result, the conductor 10B can easily sandwich the elastic bodies 20A and 20B while covering the circumferences of the elastic bodies 20A and 20B, so that the elastic bodies 20A and 20B can be easily sandwiched and held, and the elastic bodies 20A and 20B can be held. Even if 20A and 20B are elastically deformed, it is possible to reduce damage to the conductor 10B.

The connecting device 1B may not include the conductive portion 14, but may include a conductive layer (conductive layer 103a or conductive layer 103b) only on one side of the film base material 101 (see FIG. 3). At that time, the conductive layer is formed on the side opposite to the support substrate 2 and the support substrate 3.

Further, the connecting device 1B has the adhesive layer 102a and the adhesive layer 102a between the film base material 101 (see FIG. 3) and the conductive layers 103a and 103b (see FIG. 3), similarly to the connecting device 1A according to the first embodiment. It has 102b (see FIG. 3). Therefore, even if the conductor 10A is repeatedly deformed, the peeling of the film base material 101 and the conductive layers 103a and 103b can be suppressed.

Similar to the connecting device 1A according to the first embodiment, the connecting device 1B includes the adhesive layer 30 between the elastic bodies 20A and 20B and the conductor 10B, so that the conductor 10B is repeatedly deformed. Even if it is added, the peeling of the elastic bodies 20A and 20B and the conductor 10B can be suppressed.

Similar to the connecting device 1A according to the first embodiment, when the elastic bodies 20A and 20B are formed of an elastomer, the rubber hardness of the elastic bodies 20A and 20B can be 40 to 70. When the elastic bodies 20A and 20B are made of an elastomer, the elastic bodies can exhibit a high restoring force if the rubber hardness of the elastic bodies 20A and 20B is 40 to 70.

Similar to the connecting device 1A according to the first embodiment, the connecting device 1B is formed by forming the elastic bodies 20A and 20B using a material having conductivity, and the elastic bodies 20A and 20B have conductivity. May be good. In this case, since the connecting device 1B can conduct current between the support substrate 2 and the support substrate 3 via the elastic bodies 20A and 20B in addition to the conduction by the conductor 10A, the support substrate 2 and the support substrate 3 A larger current can flow between them. The elastic bodies 20A and 20B and one of the conductive layer 103a or the conductive layer 103b are electrically connected.

Further, in the present embodiment, the elastic core may be formed so that the number of elastic bodies to be stacked decreases toward the direction (Z-axis direction) connecting the first terminal portion 11 and the second terminal portion 13. Good. For example, in the case of an elastic core using three elastic bodies, as shown in FIG. 16, the two elastic bodies 20A and 20B are arranged so that their side surfaces are adjacent to each other in the X-axis direction, and the elastic bodies 20A and 20B are arranged so as to be adjacent to each other. Elastic bodies 20C may be stacked between 20B. As a result, a plurality of elastic bodies can be stably arranged in combination, and the elastic bodies can be stably deformed. The elastic core may be configured by appropriately combining five elastic bodies, six elastic bodies, and more elastic bodies.

Further, in FIG. 16, the outer diameter of the elastic bodies 20C in the axial direction is larger than the outer diameter of the elastic bodies 20A and 20B in the axial direction, but is the same as the outer diameter of the elastic bodies 20A and 20B in the axial direction. It may be small or small.

<Manufacturing method of connecting device>
A method of manufacturing the connecting device according to the present embodiment will be described. FIG. 17 is a flowchart showing an example of a manufacturing method of the connecting device according to the present embodiment. As shown in FIG. 17, the method for manufacturing the connecting device according to the present embodiment includes an elastic body cleaning step S21, a conductor forming step S22, an adhesive layer forming step S23, and an installation step S24. The connection device 1B shown in FIG. 16 will be described as an example.

In the elastic body cleaning step S21, two elastic bodies 20A and 20B are arranged so that their side surfaces are adjacent to each other in the X-axis direction, and then the elastic bodies 20C are stacked between the elastic bodies 20A and 20B to form an elastic core. To make. Then, the surface of the elastic core is washed with water, alcohol, acetone or the like. As a result, dirt, foreign matter, etc. adhering to the surfaces of the elastic bodies 20A, 20B, and 20C are removed.

In the conductor forming step S22, the conductor 10B is formed by sandwiching a part of the outer periphery of the elastic core in an exposed state. The conductor forming step S22 includes a surface treatment step S221 and a conductive layer forming step S222.

In the surface treatment step S221, after cleaning the surface of the insulating film base material 101, the conductor forming step S12 of the method for manufacturing the connecting device according to the first embodiment shown in FIG. 14 is performed on both sides of the film base material 101. Similarly, a molecular adhesive containing a triazine compound is applied and dried. As a result, the adhesive layers 102a and 102b are formed on both side surfaces of the film base material 101.

In the conductive layer forming step S222, on the surfaces of the adhesive layers 102a and 102b formed in the surface treatment step S221, the first is the same as the conductor forming step S12 of the method for manufacturing the connecting device according to the first embodiment shown in FIG. The conductive layers 103a1 and 103b1 are formed. After that, the second conductive layers 103a2 and 103b2 are formed on the surfaces of the first conductive layers 103a1 and 103b1. As a result, the conductor 10B is formed.

The first conductive layers 103a1 and 103b1 and the second conductive layers 103a2 and 103b2 are electroless plating and electroplating as in the conductor forming step S12 of the method for manufacturing a connecting device according to the first embodiment shown in FIG. It can be formed by using a method such as a plating method for forming a metal plating film.

In the adhesive layer forming step S23, after cleaning the outer peripheral surface of the elastic core, a molecular adhesive containing a triazine compound is applied to the outer periphery of the elastic core and dried to bond the adhesive layers 102a and 102b. The layer 30 is formed.

In the installation step S24, the conductor 10B is wound along the side surface of the elastic core to sandwich the outer circumference of the elastic core, and the connecting device 1B is manufactured. The installation step S24 includes a wrapping step S241 and a cutting step S242.

In the wrapping step S241, the conductor 10B is wound along the side surface of the elastic core composed of the three elastic bodies 20A, 20B and 20C and fixed by the adhesive layer 30.

In the cutting step S242, the elastic bodies 20A, 20B and 20C and the conductor 10B are combined with the elastic body 20A, as in the cutting step S142 of the installation step S14 of the method for manufacturing the connecting device according to the first embodiment shown in FIG. It is divided into a plurality of pieces along the axial direction of 20B and 20C.

As a result, a plurality of connection devices 1B according to the present embodiment can be obtained.

In the method of manufacturing the connecting device according to the present embodiment shown in FIG. 17, in the surface treatment step S211, adhesive layers 102a (see FIG. 3) and 102b (see FIG. 3) are formed on both sides of the film base material 101 (see FIG. 3). If the adhesive layers 102a (see FIG. 3) and 102b (see FIG. 3) are not required, the surface treatment step S211 may be omitted.

In the method of manufacturing the connecting device according to the present embodiment shown in FIG. 17, even if the adhesive layer 30 is formed only on the surfaces of the elastic bodies 20A, 20B and 20C in contact with the conductor 10B in the adhesive layer forming step S23. Good.

In the method of manufacturing the connecting device according to the present embodiment shown in FIG. 17, when the adhesive layer 30 is unnecessary, the adhesive layer forming step S23 may not be required.

Hereinafter, embodiments will be described in more detail with reference to Examples and Comparative Examples, but the embodiments are not limited to these Examples and Comparative Examples.

<Example 1>
[Making a connecting device]
A Cu layer was laminated by 5 μm on both the front surface and the back surface of a substrate made of polyimide, and an Ag layer was laminated by 5 μm to form a conductive layer composed of a Cu layer and an Ag layer, thereby producing a conductive substrate. The conductive substrate was folded back twice to prepare a conductor. A connecting device was manufactured by sandwiching the two elastic bodies between the conductors so that the cylindrical elastic bodies (outer diameter 3 mm, inner diameter 1 mm) formed of the two silicone rubbers were laminated via the conductors. ..

[Evaluation of load and contact resistance during pushing]
Two substrates having an Ag layer formed on the surface side in contact with the conductive layer of the connecting device were prepared. Then, after installing the connecting device on the Ag layer of one substrate, the connecting device was sandwiched so that the Ag layer of the other substrate was in contact with the connecting device to prepare a test piece. FIG. 18 shows the prepared test piece. As shown in FIG. 18, the test body 50 includes a conductor 511 formed by folding back twice, a connecting device 51 including two elastic bodies 512A and 512B, and two substrates 52 and 53 sandwiching the conductor 511. And have. The substrates 52 and 53 have Ag layers 521 and 531 on the surfaces in contact with the connecting device 51, respectively. As shown in FIG. 19, when the upper substrate 53 of the test body 50 was pushed in by applying a load up to 4N, the degree of bending of the test body 50 (the amount of pushing of the connecting device) and the contact resistance at that time were measured. .. FIG. 20 shows the relationship between the pushing amount of the connecting device and the load applied to the substrate. Further, FIG. 21 shows the relationship between the load applied to the substrate and the contact resistance.

As shown in FIGS. 20 and 21, when the upper substrate of the test piece was pushed in with a load of up to 4N, the connecting device was pushed in to about 1.8 mm. When a load of 4N was applied to the substrate 53, it was pushed in by about 1.8 mm in a state where two elastic bodies having an outer diameter of 3 mm were laminated. Therefore, when a load of 4N was applied to the substrate 53, the connecting device was high. It was confirmed that it can bend about 30% (= 1.8 / (2 × 3) × 100) in the longitudinal direction.

Further, when the upper substrate of the test piece was pushed in by applying a load up to 4N, the contact resistance became about 7mΩ when the load was about 0.5N, which was stable.

Therefore, it can be said that the connecting device of one embodiment can stably maintain the electrical connection and has a high restoring force even when a load of up to 4N is applied and is greatly pushed.

<Example 2>
[Example 2-1]
(Making a connecting device)
A connecting device was produced in the same manner as in Example 1 above.
(Evaluation of temperature rise)
Two substrates having an Ag layer formed on the surface side in contact with the conductive layer of the connecting device were prepared. Then, after installing the connecting device on the Ag layer of one substrate, the connecting device was sandwiched so that the Ag layer of the other substrate was in contact with the connecting device. After that, a spacer having a height of about 4.8 mm was installed between the two substrates, and the amount of deflection of the connecting device was set to about 1.2 mm. The contact resistance of the elastic body was 6.2 mΩ. The contact resistance is a resistance value that is the sum of the resistance of the elastic body and the contact resistance. The outside air temperature was about 24 ° C. Currents were passed through the Ag layer of the substrate at 5.0 A, 7.5 A and 10.0 A, respectively. The measurement results are shown in Table 1.

[Examples 2-2 and 2-3]
In Example 2-1 the current flow through the Ag layer of the substrate was changed to 7.5A and 10.0A in the same manner as in Example 2-1. Table 1 shows the measurement results in which currents were passed through the Ag layer of the substrate at 7.5 A and 10.0 A, respectively.

[Example 2-4]
In Example 2-1 the same procedure as in Example 2-1 was carried out except that the thickness of the Ag layer of the conductive layer of the connecting device was changed to 7.5 μm. Table 1 shows the measurement results in which a current was passed through the Ag layer of the substrate at 5.0 A.

[Examples 2-5 and 2-6]
In Example 2-4, the current flowing through the Ag layer of the substrate was changed to 7.5A and 10.0A, but the same as in Example 2-4. Table 1 shows the measurement results in which currents were passed through the Ag layer of the substrate at 7.5 A and 10.0 A, respectively.

As shown in Table 1, the temperature rise of the connecting device was 25 ° C. or less even when a current of 7.5 A was passed through the connecting device 51. It is considered that this is because the conductor 511 provided on the outer periphery of the elastic bodies 512A and 512B can stably secure the conduction. Generally, the connecting device is required to have a temperature rise of 25 ° C. or less before and after energization so as not to adversely affect electronic components and the like arranged on a substrate in contact with the connecting device. It was confirmed that if the connecting device according to the present embodiment is used, it can be used even if a current of 7.5 A is passed.

Although the embodiments have been described above, the above embodiments are presented as examples, and the present invention is not limited to the above embodiments. The above-described embodiment can be implemented in various other forms, and various combinations, omissions, replacements, changes, etc. can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

1A, 1B connection device 2 Support board (first member)
3 Support board (second member)
10A, 10B Conductor 101 Film base material 103a, 103b Conductive layer 103a1, 103b1 First conductive layer 103a2, 103b2 Second conductive layer 11 First terminal part 12 Meandering part 121, 122 Folded part 13 Second terminal part 13a Through hole 14 Through hole (conducting part)
20A, 20B, 20C Elastic body 30, 102a, 102b Adhesive layer L1, L2 Maximum distance

Claims (16)

A connecting device that is arranged between the first member and the second member and electrically connects the first member and the second member.
A conductor having a first terminal portion in contact with the first member and a second terminal portion in contact with the second member.
It is provided with at least two elastic bodies that are arranged between the first terminal portion and the second terminal portion and are elastically deformable.
A connecting device characterized in that the conductor is arranged so as to sandwich the elastic body, has flexibility, and is deformable together with the elastic body. The connecting device according to claim 1, wherein at least two elastic bodies are provided so as to be laminated in a direction connecting the first terminal portion and the second terminal portion. The conductor is fixedly arranged along a part of the outer circumference of the elastic body.
The connecting device according to claim 1 or 2, wherein the elastic bodies are arranged adjacent to each other via the conductors, and a part of the outer periphery of the elastic bodies is exposed. The plurality of elastic bodies are arranged adjacent to each other to form an elastic core.
The connecting device according to claim 1 or 2, wherein the conductor holds the elastic core while wrapping the elastic core. Claims 1 to 4 are characterized in that the elastic body is a columnar body, a tubular body, or a tubular body in which one or more notches are formed along the axial direction when viewed from the axial direction. The connecting device according to any one of the above. Any one of claims 1 to 5, wherein the conductor is a conductive film having an insulating film base material and a conductive layer formed on at least one surface of the film base material. The connecting device described in the section. The connection device according to claim 6, wherein the film substrate is formed with the conductive layers on both surfaces and through holes for electrically connecting the conductive layers. .. The connecting device according to claim 6 or 7, wherein the conductive film has an adhesive layer containing triazine between the film base material and the conductive layer. The connecting device according to any one of claims 1 to 8, wherein the elastic body has conductivity. The connecting device according to any one of claims 1 to 9, wherein an adhesive layer containing a triazine-based compound is contained between the elastic body and the conductor. The elastic body is made of an elastomer.
The connecting device according to any one of claims 1 to 10, wherein the rubber hardness is 40 to 70. The connecting device according to any one of claims 1 to 11, wherein the first terminal portion and the second terminal portion are formed in a flat plate shape. A conductor arranged between the first member and the second member and having a first terminal portion in contact with the first member and a second terminal portion in contact with the second member, the first member and the second member. It is a method of manufacturing a connecting device that electrically connects members.
It comprises an installation step of arranging at least two elastically deformable elastic bodies between the first terminal portion and the second terminal portion of the conductor.
A method for manufacturing a connecting device, wherein the conductor is arranged so as to sandwich the elastic body, has flexibility, and is deformable together with the elastic body. The production of the connecting device according to claim 13, further comprising an adhesive layer forming step of forming an adhesive layer containing triazine on at least the surface of the elastic body in contact with the conductor before the installation step. Method. When the conductor is a conductive film having an insulating film base material and a conductive layer formed on at least one surface of the film base material.
A surface treatment step of forming an adhesive layer containing triazine on at least the surface of the film substrate in contact with the conductive layer.
After the surface treatment step, a conductive layer forming step of forming the conductive layer on the film substrate, and a conductive layer forming step.
The method for manufacturing a connecting device according to claim 13 or 14, characterized in that. When the elastic body is a columnar body, a tubular body, or a tubular body in which one or more notches are formed along the axial direction when viewed from the axial direction.
The installation process is
A wrapping step in which at least two elastic bodies are arranged side by side in a direction connecting the first terminal portion and the second terminal portion, and the conductor is fixed along a part of the outer circumference of the elastic body. ,
A cutting step of dividing the plurality of elastic bodies and the conductor fixed to the elastic body into a plurality of pieces in the axial direction of the elastic body.
The method for manufacturing a connecting device according to any one of claims 13 to 15, wherein the connecting device is manufactured.

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