JP2020136526A - Transmission line, manufacturing method of transmission line, and manufacturing device for transmission line - Google Patents

Abstract

To provide a thin-shape transmission line which reduces crosstalk by being shielded over an entire circumference in a configuration in which copper-clad laminates are bonded to each other.SOLUTION: A transmission line 20 comprises a base 30 in which a first conductor 31 constituted of a transmission line conductor 32 and a ground conductor 33 proximate to an input end and an output end of the transmission line conductor 32 is sheet-shaped and formed on a first principal surface 34a of a first base material 34 consisting of a thermoplastic resin. The principal surface 34a in the first base material 34 and a coverlay 35, a surface in the base 30 at an opposite side of the first principal surface 34a and a first shield 40 at a side of a second principal surface 42a, the surface in the base 30 at the opposite side of the first principal surface 34a and the first shield 40 at the side of the second principal surface 42a, and the coverlay 35 and a second shield 45 at the side of the second principal surface 42a, are thermally compression-bonded with each other. A second conductor 41 and a third conductor 46 are ultrasonic-joined with each other, and disposed so as to enclose the transmission line conductor 32 with the second conductor 41 and the third conductor 46.SELECTED DRAWING: Figure 6

Description

The present invention relates to a transmission line, a method for manufacturing a transmission line, and an apparatus for manufacturing a transmission line.

In recent years, the development of high-density mounting technology in electronic devices has been remarkable, and the demand for thin transmission lines using copper-clad laminates (CCL) has been increasing more and more.

Conventionally, a step of forming signal wiring and ground wiring by insulatingly isolating each other from one side region or a central region of one main surface of an insulator layer made of a liquid crystal polymer, and the ground wiring on the other main surface of the insulator layer. The step of positioning and laminating the conductive foil having the conductive protrusions that can be connected to the above, and the step of pressurizing and integrating the laminated body and electrically connecting the conductive protrusions that penetrate the insulator layer to the ground wiring. In the step of specifically connecting the insulator layer, the non-formed region is bent along the outside of the formed region of each wiring, and the formed region surface and the non-formed region surface of each wiring are opposed to each other and integrated. A method for manufacturing a flat type shield cable having a step of forming a shield layer of a conductive foil on a surface has been proposed (Patent Document 1: Patent No. 3497110).

Further, a flexible dielectric element (liquid crystal polymer), a linear signal line provided on the dielectric element, and a line provided on the dielectric element and facing the signal line. An auxiliary ground conductor provided on the opposite side of the ground conductor with respect to the signal line in the normal direction of the main surface of the dielectric element and the ground conductor, which is viewed from the normal direction. When this happens, the two main parts that sandwich the signal line and extend along the signal line, and the bridge part that connects the two main parts and intersects the signal line. Auxiliary ground conductor including the above, and a via hole conductor that electrically connects the auxiliary ground conductor and the ground conductor are provided, and the signal line and the auxiliary ground conductor are provided in the normal direction. A high-frequency signal line having a configuration in which the distance between the signal line and the ground conductor is smaller than the distance between the signal line and the ground conductor has been proposed (Patent Document 2: Practical New Application Registration No. 3173143).

Then, ground conductors are arranged on both sides of the signal conductor on the same plane as the signal conductor, and these signal conductors and the ground conductor are covered with an electrically insulating thin film from both the upper and lower directions, and the surfaces provided with the conductive adhesive layers face each other. In this way, a signal transmission cable in which the outer side of the electrically insulating thin film is coated with a metal shielding layer has been proposed (Patent Document 3: Japanese Patent Application Laid-Open No. 2006-202714).

Japanese Patent No. 3497110 Utility Model Registration No. 3173143 Japanese Unexamined Patent Publication No. 2006-202714

The transmission line is required to have a thin structure that saves space while maintaining the shielding performance that suppresses external noise. In particular, reduction of crosstalk between transmission lines has become an issue. Further, manufacturers of transmission lines are required to produce transmission lines or their intermediates in a short production time capable of responding to a sudden increase in demand for mobile information terminals and the like.

Here, the intermediate of the transmission line refers to a semi-finished product in the previous stage of becoming a transmission line, and in particular, a semi-finished product having a structure that shields the entire circumference.

In response to the above problems, the transmission line of Patent Document 1 is difficult to be thinned when it is shielded over the entire circumference due to the structure in which the copper-clad laminate is bent. Further, since the transmission line of Patent Document 2 is not shielded on the side surface, the shielding performance is inferior to that of the structure that shields the entire circumference, and the crosstalk becomes large. In the transmission lines of Patent Documents 2 and 3, a conductive paste such as cream solder or a conductive adhesive is thermoset to connect the ground conductor and the shield conductor, so that the thermosetting time of the conductive paste is long. As a bottleneck, the production time (tact time) cannot be made shorter than the thermosetting time. Further, there is a similar problem when joining copper-clad laminates to each other using an adhesive. As a conventional technique, a method of striking vias between transmission lines to reduce crosstalk can be considered, but since a large number of vias are required to be processed, the manufacturing cost is high.

The present invention has been made in view of the above circumstances, and is a thin transmission line in which crosstalk is reduced by shielding over the entire circumference by a configuration in which copper-clad laminates arranged opposite to each other are joined to each other, and a thin transmission line or a thin transmission line thereof. By manufacturing the intermediates on a consistent production line and joining the copper-clad laminates together without using adhesives or conductive pastes, the production time (tact time) is greater than the heat curing time of conductive pastes and adhesives. It is an object of the present invention to provide a method for manufacturing a transmission line having a structure that can be shortened and an apparatus for manufacturing a transmission line.

As an embodiment, the problem is solved by a solution means as disclosed below.

In the transmission line of the present invention, the first main conductor of the first base material is a sheet-like first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, and is made of a thermoplastic resin. A base formed on a surface and at least a plurality of the transmission line conductors formed at a predetermined pitch among the first conductors, a sheet-like coverlay made of a thermoplastic resin covering each of the transmission line conductors, and a second conductor. The first shield formed on the second main surface of the second base material which is sheet-shaped and made of thermoplastic resin, and the second shield formed on the third base material whose third conductor is sheet-shaped and made of thermoplastic resin. The first main surface and the coverlay of the first base material, the surface of the base opposite to the first main surface, the side of the second main surface of the first shield, and the base. The surface opposite to the first main surface and the side of the second main surface of the first shield, and the coverlay and the side of the second main surface of the second shield are heat-bonded to each other. The second conductor and the third conductor, which are arranged so as to face each other, are ultrasonically joined to each other, and the second conductor and the third conductor are arranged so as to surround the transmission line conductor. It is characterized by.

According to this configuration, the second conductor of the first shield and the third conductor of the second shield, which are arranged so as to face each other across the base and the coverlay, are ultrasonically bonded to surround the transmission line conductor. It is a transmission line with a structure that shields over the circumference. Then, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, the structure can be made thinner by at least the thickness of the adhesive or the conductive paste. ..

As an example, cut surfaces are formed on both sides in the longitudinal direction. According to this configuration, since both sides in the longitudinal direction are cut, the width dimension becomes constant.

In the method for manufacturing a transmission line of the present invention, a first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor is formed on a sheet-like first main surface made of a thermoplastic resin. A base in which at least a plurality of the transmission line conductors are formed at a predetermined pitch among the first conductors, a sheet-shaped coverlay covering each of the transmission line conductors, and a sheet-shaped thermoplastic resin as the second conductor. The first shield formed on the second main surface of the second base material made of the same material and the second shield formed on the third base material having a third conductor in the form of a sheet and made of a thermoplastic resin are used. 1. The unnecessary region between the transmission line conductor and the transmission line conductor is removed from the first heat crimping step in which the coverlay is heat-bonded to the main surface and the first intermediate body in which the coverlay is heat-bonded. The unnecessary region removing step of forming a plurality of through holes penetrating the first intermediate body and the surface opposite to the first main surface of the base with respect to the second intermediate body in which the plurality of through holes are formed. A second thermal crimping step in which the side of the second main surface of the first shield is thermally crimped, and an exposed surface of the second conductor and the exposed surface of the third conductor in a state where the first shield is thermally crimped. It is characterized by having a first joining step of ultrasonically joining the surfaces to each other.

According to this configuration, by feeding the base, the coverlay, the first shield, and the second shield at a predetermined pitch, the first thermocompression bonding step, the unnecessary region removal step, the second thermocompression bonding step, and the first joining step can be performed. Through this, a thin transmission line or an intermediate thereof that is shielded over the entire circumference to reduce crosstalk can be manufactured on a consistent production line. Then, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, the production time (tact time) is heat-cured by the conductive paste or the adhesive. It can be shorter than the time and the required components are minimized.

In the second thermocompression bonding step, the side of the second main surface of the first shield is thermocompression bonded to the surface of the base opposite to the first main surface of the base, and the cover. It is preferable that the side of the second main surface of the second shield is thermocompression bonded to the ray. According to this configuration, the side of the second main surface of the first shield is thermocompression bonded to the surface opposite to the first main surface of the base with respect to the second intermediate, and at the same time, the coverlay is attached to the second shield. Since the side of the two main surfaces is thermocompression bonded, it is possible to prevent the occurrence of wrinkles on the first shield and the second shield.

In the transmission line manufacturing apparatus of the present invention, the first conductor is a sheet-like first base material having a first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor at a predetermined pitch. A base feeder for supplying a base formed on the main surface and at least a plurality of the transmission line conductors formed at a predetermined pitch among the first conductors, and a sheet-shaped coverlay covering each of the transmission line conductors are supplied. The coverlay feeder, the first shield feeder that supplies the first shield formed on the second main surface of the second base material whose second conductor is sheet-shaped and made of thermoplastic resin, and the third conductor are sheet-shaped. A second shield feeder that supplies a second shield formed on a third base material made of a thermoplastic resin, a first thermal crimping machine that thermally crimps the coverlay to the first main surface, and the coverlay. An unnecessary region removing machine that removes unnecessary regions between the transmission line conductor and the transmission line conductor to form a plurality of through holes penetrating the first intermediate with respect to the heat-bonded first intermediate. A second thermal crimping machine that thermally crimps the side of the second main surface of the first shield to the surface of the base opposite to the first main surface of the second intermediate body in which a plurality of through holes are formed. It is characterized by comprising a first joining machine for ultrasonically joining the exposed surface of the second conductor and the exposed surface of the third conductor with each other in a state where the first shield is heat-bonded.

According to this configuration, the first thermocompression bonding machine, the punching machine, the second thermocompression bonding machine, and the first bonding machine operate in cooperation with each other, and the second conductor of the first shield is arranged so as to face each other with the base and the coverlay in between. And the third conductor of the second shield are ultrasonically bonded through a through hole. Therefore, a thin transmission line or an intermediate thereof that is shielded over the entire circumference to reduce crosstalk can be manufactured on a consistent manufacturing line. Then, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, the production time (tact time) is heat-cured by the conductive paste or the adhesive. It can be shorter than the time and can be produced in a short time.

According to the transmission line of the present invention, the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, so that the transmission line is shielded over the entire circumference. It is possible to realize a thin transmission line with reduced crosstalk. Further, according to the transmission line manufacturing method and the transmission line manufacturing apparatus of the present invention, a thin transmission line or an intermediate thereof that is shielded over the entire circumference to reduce crosstalk can be manufactured on a consistent manufacturing line.

FIG. 1 is a configuration diagram schematically showing an arrangement configuration of a transmission line manufacturing apparatus according to an embodiment of the present invention. FIG. 2A is a schematic plan view showing the base according to the present embodiment, FIG. 2B is a schematic plan view showing the first intermediate in which the coverlay according to the present embodiment is thermocompression bonded to the base, and FIG. 2C. Is a schematic plan view showing a second intermediate in which a through hole is formed according to the present embodiment. FIG. 3A is a schematic plan view showing a fourth intermediate in which the second shield according to the present embodiment is ultrasonically bonded, and FIG. 3B shows a sixth intermediate in which the window portion according to the present embodiment is formed. It is a schematic plan view. FIG. 4A is a schematic plan view showing a transmission line according to the present embodiment, and FIG. 4B is a schematic side view showing a transmission line according to the present embodiment. 5A is a schematic cross-sectional view showing the base according to the present embodiment, FIG. 5B is a schematic cross-sectional view showing the first intermediate in which the coverlay according to the present embodiment is thermocompression bonded to the base, and FIG. 5C. Is a schematic cross-sectional view showing a second intermediate in which a through hole is formed according to the present embodiment. FIG. 6A is a schematic cross-sectional view showing a fourth intermediate in which the second shield according to the present embodiment is ultrasonically bonded, and FIG. 6B is a schematic cross-sectional view showing a transmission line according to the present embodiment. FIG. 7A is a schematic cross-sectional view showing another example of the transmission line according to the present embodiment, and FIG. 7B is a schematic cross-sectional view showing another example of the transmission line according to the present embodiment. FIG. 8A is a diagram schematically showing a first thermocompression bonding machine according to the present embodiment, FIG. 8B is a diagram schematically showing an unnecessary region removing machine according to the present embodiment, and FIG. 8C is a diagram schematically showing the present embodiment. It is a figure which shows typically the 2nd thermocompression bonding machine. FIG. 9A is a diagram schematically showing an ultrasonic bonding machine according to the present embodiment, FIG. 9B is a diagram schematically showing a laser processing machine according to the present embodiment, and FIG. 9C is a diagram schematically showing an inspection according to the present embodiment. It is a figure which shows the machine schematically. FIG. 10 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus according to the embodiment of the present invention. FIG. 11 is a flowchart showing a manufacturing procedure of a transmission line according to an embodiment of the present invention.

(First Embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a configuration diagram schematically showing an example of the transmission line manufacturing apparatus 1 of the present embodiment, in which the left side in the figure is the upstream side and the right side in the figure is the downstream side. The transmission line manufacturing apparatus 1 includes a first thermocompression bonding machine 2, an unnecessary region removing machine 3, a second thermocompression bonding machine 4, a first bonding machine 5, a second bonding machine 6, and a laser processing machine 7, in order from the upstream side. An inspection machine 8, a split take-out machine 9, and a transfer machine 17 are arranged, and a controller 10 for controlling these is provided. In all the drawings for explaining the embodiment, members having the same function may be designated by the same reference numerals, and the repeated description thereof may be omitted.

A base feeder 11 and a tension adjuster 15 and a coverlay feeder 12 and a tension adjuster 15 are arranged on the upstream side of the first thermocompression bonding machine 2, respectively. A first shield feeder 13 and a tension adjuster 15, and a second shield feeder 14 and a tension adjuster 15 are arranged on the upstream side of the second thermocompression bonding machine 4. Here, the tension adjuster 15 has a tension roller as an example, and depending on the position of the tension roller, a sheet-shaped work (base 30, coverlay 35, first intermediate 51, first shield 40, second shield 45). The tension of is kept within a certain range.

A pitch feeder 16 is arranged on the upstream side of the second thermocompression bonding machine 4, and a pitch feeder 16 is arranged on the upstream side of the inspection machine 8. The pitch feeder 16 has a feed roller as an example, and keeps the feed pitch of the sheet-shaped workpieces (first intermediate 52, sixth intermediate 56) at a constant value depending on the feed amount of the feed roller.

FIG. 8A is a diagram schematically showing the first thermocompression bonding machine 2. As an example, the first thermocompression bonding machine 2 has a press plate having a built-in heater, and the base 30 and the coverlay 35 are sandwiched from above and below by the two press plates arranged to face each other, pressurized and heated. 1 It is a configuration that forms an intermediate 51.

FIG. 8B is a diagram schematically showing the unnecessary area removing machine 3. As an example, the unnecessary area removing machine 3 has a punching blade and a pedestal for receiving the punching blade, and the unnecessary area R1 is removed by punching the unnecessary area R1 of the first intermediate 51 with the punching blade to remove the unnecessary area R1. The structure is such that a through hole U1 penetrating the 51 is formed to form a second intermediate 52. As a configuration other than the above, as the unnecessary region removing machine 3, a laser processing machine that removes the unnecessary region R1 by laser irradiation can be applied.

FIG. 8C is a diagram schematically showing the second thermocompression bonding machine 4. The second thermocompression bonding machine 4 has a press plate having a built-in heater as an example, and pressurizes the first shield 40 and the second intermediate 52 by sandwiching the first shield 40 and the second intermediate 52 from above and below by the two press plates arranged so as to face each other. The structure is such that the first shield 40 is thermocompression bonded to the base 30 and the second shield 45 is thermocompression bonded to the coverlay 35 at the same time.

Here, the first thermocompression bonding machine 2 and the second thermocompression bonding machine 4 can have the same device configuration. This facilitates maintenance of the device.

FIG. 9A is a diagram schematically showing a first bonding machine 5 (first ultrasonic bonding machine) or a second bonding machine 6 (second ultrasonic bonding machine). As an example, the first joining machine 5 includes a main body portion having a built-in vibrating body, a head portion (horn) attached to the main body portion and ultrasonically vibrating by vibration transmitted from the vibrating body, and a receiving portion receiving the head portion. Has. In the first bonding machine 5 (first ultrasonic bonding machine), the first shield 40 is thermocompression bonded to the base 30 by the head portion and the receiving portion arranged to face each other, and the second shield 45 is bonded to the coverlay 35. The work in a thermocompression-bonded state is sandwiched from above and below, and the head portion is ultrasonically vibrated to form a fourth intermediate 54 by ultrasonic bonding.

Alternatively, the first bonding machine 5 (first ultrasonic bonding machine) has a second shield on a third intermediate body 53 in which the first shield 40 is thermocompression bonded to the base 30 by the head portion and the receiving portion arranged to face each other. The workpieces in which the 45s are overlapped are sandwiched from above and below, and the head portion is ultrasonically vibrated to form a fourth intermediate body 54 by ultrasonic bonding.

Here, the fourth intermediate 54 refers to a semi-finished product in a pre-stage that becomes the transmission line 20, and is in a state of being shielded over the entire circumference.

As an example, the second bonding machine 6 (second ultrasonic bonding machine) includes a main body portion having a built-in vibrating body and a head portion (horn) attached to the main body portion and ultrasonically vibrates by vibration transmitted from the vibrating body. It has a receiving portion that receives the head portion, and the fourth intermediate body 54 is sandwiched and sandwiched from above and below by the head portion and the receiving portion that are arranged so as to face each other, and the head portion is ultrasonically vibrated for ultrasonic bonding. The fifth intermediate 55 is formed by the above. Here, the first joining machine 5 and the second joining machine 6 can have the same device configuration. This facilitates maintenance of the device. Alternatively, the head portions that vibrate ultrasonic waves may be arranged so as to face each other so as to have the functions of both the first joining machine 5 and the second joining machine 6.

FIG. 9B is a diagram schematically showing the laser processing machine 7. The laser processing machine 7 has a configuration in which a predetermined region is removed by laser irradiation to partially expose the third conductor 46 to form the sixth intermediate 56.

FIG. 9C is a diagram schematically showing the inspection machine 8. The inspection machine 8 inspects whether the transmission line conductor 32 is broken or the continuity level is within the normal range by contacting the transmission line conductor 32 with contact pins protruding downward at predetermined intervals and energizing the transmission line conductor 32. It is a configuration to do. As a configuration other than the above, the inspection machine 8 inspects whether the transmission line conductor 32 is broken or the continuity level is within the normal range by capturing an image of the transmission line conductor 32 with a camera and analyzing the image. Or, the inspection machine 8 is configured to perform both an electrical characteristic inspection by energizing the transmission line conductor 32 and an appearance characteristic inspection by imaging the transmission line conductor 32 and analyzing the image. In some cases.

As shown in FIG. 1, a split take-out machine 9 for taking out the transmission line 20 from the sixth intermediate 56 is arranged on the downstream side of the inspection machine 8. As an example, the split take-out machine 9 has a punching blade and a pedestal for receiving the punching blade, and the transmission line 20 is separated by punching the in-line-inspected sixth intermediate 56 along a predetermined cut line by the punching blade. Then, the transmission line 20 is taken out. As a configuration other than the above, the split take-out machine 9 may have a configuration in which the in-line-inspected sixth intermediate 56 is screened along a predetermined cut line to separate the transmission line 20 and take out the transmission line 20. Yes, or the split take-out machine 9 may be configured to irradiate the in-line-inspected sixth intermediate 56 with a laser along a predetermined cut line to separate the transmission line 20 and take out the transmission line 20. ..

A tray 18 for accommodating the transmission line 20 is arranged on the downstream side of the split take-out machine 9. The transmission line 20 manufactured on the above-mentioned consistent production line and in-line-inspected is conveyed by the transfer machine 17 in a vacuum-adsorbed state and stored in the tray 18.

According to this embodiment, a thin transmission line 20 that is shielded over the entire circumference to reduce crosstalk can be consistently manufactured on one production line. Then, since the transmission line 20 is manufactured by thermocompression bonding or ultrasonic bonding without using an adhesive or a conductive paste, the production time (tact time) should be shorter than the heat curing time of the conductive paste or the adhesive. And the required components are minimized.

As described above, the second thermocompression bonding machine 4 has a configuration in which the first shield 40 is thermocompression bonded to the base 30 and the second shield 45 is thermocompression bonded. According to this configuration, since the first shield 40 and the second shield 45 are thermocompression bonded at the same time, it is possible to prevent wrinkles from being formed on the first shield 40 and the second shield 45 during thermocompression bonding.

The above manufacturing apparatus is an example. The transmission line manufacturing apparatus 1 is not limited to the above embodiment. As a configuration other than the above, for example, a manufacturing facility, an inspection device, or the like on the downstream side of the joining machine 5 may be omitted. In this case, the production of the transmission line by the manufacturing apparatus 1 is completed in the state of the fourth intermediate 54 having a structure that shields the entire circumference. Then, it is stored in a transport container or tray in a reel state, a strip state, an individual packaging state, etc., and is shipped as a fourth intermediate 54, or the fourth intermediate 54 is post-processed on another production line. Or, the fourth intermediate 54 is assembled and processed on the assembly line of the electronic device to become the transmission line 20.

As a configuration other than the above, for example, a solder bonding machine is arranged in place of the second ultrasonic bonding machine 6, and the fourth intermediate body 54 is sandwiched from above and below by a head portion and a receiving portion arranged to face the solder bonding machine. In some cases, the fifth intermediate 55 is formed by solder bonding by sandwiching and supplying solder from the head portion and heating the solder. Alternatively, an adhesive bonding machine may be arranged in place of the second ultrasonic bonding machine 6 to form the fifth intermediate 55 by bonding using an adhesive or a conductive paste.

Further, as a configuration other than the above, for example, an etching processing machine is arranged instead of the laser processing machine 7, and a predetermined region is removed by etching to partially expose the third conductor 46 to form the sixth intermediate 56. May be.

Subsequently, another example of the transmission line manufacturing apparatus 1 according to the present invention will be described below.

FIG. 10 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus 1 of the above embodiment. In the example of FIG. 10, the first shield feeder 13 and the tension adjuster 15 are arranged on the upstream side of the second thermocompression bonding machine 4. Further, a second shield feeder 14 and a tension adjuster 15 are arranged on the upstream side of the first joining machine 5. In the case of this configuration, the first shield 40 is thermocompression bonded to the base 30 by the second thermocompression bonding machine 4 to become the third intermediate 53. Then, by the first joining machine 5, the second shield 45 is ultrasonically welded to the work in which the second shield 45 is overlapped with the third intermediate 53 to become the fourth intermediate 54.

According to this configuration, for example, when the size and heat capacity of the first shield 40 are larger than the size and heat capacity of the second shield 45, it is easy and reliable to thermocompression-bond the first shield 40 to the base 30. , It becomes easy and reliable to ultrasonically weld the second shield 45 to the base 30.

The configuration of FIG. 1 and the configuration of FIG. 10 can be selected according to the standard of the size and material of the transmission line 20 and the standard of the size and material of the component parts, and the configuration of FIGS. 1 and 2 can be manufactured. It is possible to add or omit equipment and inspection equipment as appropriate.

Subsequently, the transmission line 20 and the method for manufacturing the transmission line 20 according to the present invention will be described below.

FIG. 11 is a flowchart showing a manufacturing procedure of the transmission line 20. As an example, the transmission line 20 has a first thermocompression bonding step S1, an unnecessary region removal step S2, a second thermocompression bonding step S3, a first bonding step S4, a second bonding step S5, a laser processing step S6, an inspection step S7, and a division step. Manufactured in the order of S8.

The above manufacturing procedure is an example. In the manufacturing procedure of the transmission line 20, as a configuration other than the above, the first joining step S4 and the second joining step S5 can be performed at the same time, and the second joining step S5 can be omitted. In addition to the above, the laser processing step S6 can be omitted, the inspection step S7 can be omitted, and the division step S8 can be omitted. Then, the fourth intermediate 54, the fifth intermediate 55, the sixth intermediate 56, or the transmission line 20 are shipped in a state of being arranged on one sheet at a predetermined pitch in the longitudinal direction, and the electronic device in the next process is used. The sheet may be divided at the assembly line of the above, and the transmission line 20 may be taken out and used.

2A is a schematic plan view showing the base 30, FIG. 2B is a schematic plan view showing the first intermediate 51, and FIG. 2C is a schematic plan view showing the second intermediate 52. Further, FIG. 3A is a schematic plan view showing the fourth intermediate 54, and FIG. 3B is a schematic plan view showing the sixth intermediate 56. 4A is a schematic plan view showing the transmission line 20, and FIG. 4B is a schematic side view showing the transmission line 20.

5A is a schematic cross-sectional view showing the base 30 at the position of the transmission line conductor 32, similarly, FIG. 5B is a schematic cross-sectional view showing the first intermediate 51, and FIG. 5C is the second intermediate 52. It is a schematic cross-sectional view which shows. 6A is a schematic cross-sectional view showing the fourth intermediate 54, and FIG. 6B is a schematic cross-sectional view showing the transmission line 20 at the position of the transmission line conductor 32.

As shown in FIGS. 2A and 5A, the base 30 is made of a copper-clad laminate (CCL), and the transmission line conductor 32 is the first main surface 34a of the sheet-like first base material 34 at a predetermined pitch P1 in the longitudinal direction. Is formed in. The first conductor 31 is close to the linearly formed transmission line conductor 32 and the input end and the output end of the transmission line conductor 32, respectively, and the side close to the input end and the output end is "U-shaped" or "U-shaped" or " It is composed of a ground conductor 33 formed in a "U" shape. As an example, a connector is joined to the input end and the output end of the ground conductor 33 and the transmission line conductor 32 via solder or conductive paste (not shown). As a configuration other than the above, a plurality of ground conductors formed in a "U-shape" or "U-shape" in which the first conductor 31 is close to the input end and the output end of the transmission line conductor 32 on a one-to-one basis. It may consist of 33.

In the base 30, a plurality of transmission line conductors 32 are arranged on a sheet-shaped first base material 34 at a predetermined pitch in the longitudinal direction, and in the state of FIG. 2A, between the transmission line conductor 32 and the transmission line conductor 32. There is an unnecessary area R1.

As an example, the first conductor 31 is made of copper foil. As an example, the first base material 34 is made of a thermoplastic resin. As an example, the first base material 34 is made of a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the sheet-shaped base 30 is attached to the base feeder 11 in a reel state and is supplied so that it can be continuously processed.

As an example, the first conductor 31 is a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. As an example, the first base material 34 is a liquid crystal polymer (LCP) having a thickness of 50 [μm] or more and 150 [μm] or less. As an example, the first conductor 31 is formed by pattern etching a copper-clad laminate (CCL).

As an example, as a pretreatment of the first thermocompression bonding step S1, the base 30 is irradiated with oxygen-containing plasma on the side surface (first main surface 34a) to which the first conductor 31 is bonded by a plasma irradiation device, and is an organic substance. Is removed and reformed. By irradiating the oxygen-containing plasma, the degree of adhesion is improved during the first thermocompression bonding. In addition to the above, a plasma irradiation device may be arranged on the upstream side of the first thermocompression bonding machine 2 to irradiate the first main surface 34a with oxygen-containing plasma (not shown).

The coverlay 35 is made of a thermoplastic resin as an example. The coverlay 35 comprises, for example, a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the coverlay 35 is attached to the coverlay feeder 12 in a reel state and is supplied so that it can be continuously processed.

As an example, the coverlay 35 is a liquid crystal polymer (LCP) having a thickness of 25 [μm] or more and 125 [μm] or less.

The first shield 40 is made of a copper-clad laminate (CCL) as an example, and the second conductor 41 is formed on the second main surface 42a of the sheet-shaped second base material 42. The second conductor 41 may be bonded to the entire surface of the second base material 42, or may be bonded in a mesh shape.

As an example, the second conductor 41 is made of copper foil. As an example, the second base material 42 is made of a thermoplastic resin. As an example, the second base material 42 is made of a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the first shield 40 is attached to the first shield feeder 13 in a reel state and is supplied so that it can be continuously processed.

As an example, the second conductor 41 is a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. As an example, the second base material 42 is a polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. As an example, the first shield 40 is used with the copper-clad laminate (CCL) as it is.

As an example, the first shield 40 irradiates the surface (second main surface 42a) on the side where the second conductor 41 is bonded with oxygen-containing plasma by a plasma irradiation device as a pretreatment of the second thermocompression bonding step S3. To remove organic substances and modify them. By irradiating with oxygen-containing plasma, the degree of adhesion is improved during the second thermocompression bonding. In addition to the above, a plasma irradiation device may be arranged on the upstream side of the second thermocompression bonding machine 4 to irradiate the second main surface 42a with oxygen-containing plasma (not shown).

As an example, the second shield 45 is made of a copper-clad laminate (CCL), and a third conductor 46 is formed on one side of a sheet-shaped third base material 47. The third conductor 46 may be bonded to the entire surface of the third base material 47, or may be bonded in a mesh shape.

As an example, the third conductor 46 is made of copper foil. The third base material 47 is made of a thermoplastic resin as an example. As an example, the third base material 47 is made of a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the second shield 45 is attached to the second shield feeder 14 in a reel state and is supplied so that it can be continuously processed.

As an example, the third conductor 46 is a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. As an example, the third base material 47 is a polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. As an example, the second shield 45 is used with the copper-clad laminate (CCL) as it is. As an example, the second shield 45 has the same material composition as the first shield 40.

As an example, the second shield 45 irradiates the surface on the side where the third conductor 46 is bonded with oxygen-containing plasma by a plasma irradiation device as a pretreatment of the first joining step S4 to remove organic substances and remove organic substances. Reform. By irradiating the oxygen-containing plasma, the degree of adhesion in the first joining step S4 is improved. In addition to the above, a plasma irradiation device may be arranged on the upstream side of the first joining machine 5 to irradiate the surface on the side to which the third conductor 46 is bonded with oxygen-containing plasma (not shown).

In the first thermocompression bonding step S1, the coverlay 35 is thermocompression bonded to the first main surface 34a of the first base material 34 as shown in FIGS. 2B and 5B. As an example, using the first base material 34 and the coverlay 35 as the same material, the heating temperature is below the melting point of the first base material 34 and the coverlay 35, and the deflection temperature under load or the deflection temperature under load is plus or minus 50. At a heating temperature within [° C.], heat distortion is performed while pressurizing at a predetermined pressure for a predetermined time to obtain the first intermediate 51.

As an example, the first thermocompression bonding step S1 has a heating temperature of 180 [° C.] or higher and 280 [° C.] or lower, a pressing force of 10 [MPa] or higher and 60 [MPa] or lower, and 240 [sec] or higher. Thermocompression bonding is performed with the following heating and pressurizing times. Thermocompression bonding is performed in the air as an example.

In the unnecessary region removing step S2, as shown in FIGS. 2C and 5C, the unnecessary region R1 between the transmission line conductor 32 and the transmission line conductor 32 is punched out from the first intermediate 51 to remove the first intermediate 51. A through hole U1 penetrating the 1 intermediate 51 is formed to form a second intermediate 52. As an example, the through hole U1 has a rectangular shape or a rectangular shape with rounded corners, and is formed at predetermined intervals P2 in the longitudinal direction. The predetermined interval P2 is preferably 2.5 [mm] or less. As a result, the effect of reducing crosstalk is enhanced. As an example, the length of the through hole U1 is set to 0.2 times or more and less than 1.0 times the total length of the transmission line conductor 32.

When the total length of the transmission line conductor 32 exceeds 500 [mm], the predetermined interval P2 is set to 1.5 [mm] or more as an example. This facilitates the joining of the second conductor 41 and the third conductor 46. When the total length of the transmission line conductor 32 is 500 [mm] or less, the predetermined interval P2 is set to less than 0.5 [mm] as an example. As a result, the effect of reducing crosstalk becomes higher. As an example, the predetermined interval P2 is set to 0.0 [mm]. As a result, the effect of reducing crosstalk is maximized.

In the second thermocompression bonding step S3, as shown in FIGS. 3A and 6A, the second main surface of the first shield 40 is on the surface of the base 30 opposite to the first main surface 34a with respect to the second intermediate 52. The side of the surface 42a is thermocompression bonded, and at the same time, the second shield 46 is thermocompression bonded to the first main surface 34a of the base 30. As an example, the first base material 34 and the second base material 42 are made of different materials, the second base material 42 and the third base material 47 are made of the same material, and the heating temperature is equal to or lower than the melting point of the first base material 34. In addition, thermocompression bonding is performed by heating while pressurizing at a predetermined pressure for a predetermined time at a heating temperature within plus or minus 50 [° C.] centered on the deflection temperature under load of the first base material 34 or the deflection temperature under load of the first base material 34. To do.

Alternatively, in the second thermocompression bonding step S3, the side of the second main surface 42a of the first shield 40 is thermocompression bonded to the surface of the base 30 opposite to the first main surface 34a. As an example, using the first base material 34 and the second base material 42 as different materials, the heating temperature is equal to or lower than the melting point of the first base material 34, and the deflection temperature under load of the first base material 34 or the first base material 34. Thermocompression bonding is performed by heating while pressurizing at a predetermined pressure for a predetermined time at a heating temperature within plus or minus 50 [° C.] centered on the deflection temperature under load.

As an example, the second thermocompression bonding step S3 has a heating temperature of 180 [° C.] or higher and 280 [° C.] or lower, a pressing force of 10 [MPa] or higher and 60 [MPa] or lower, and 240 [seconds] or higher. Thermocompression bonding is performed for the following heating and pressurizing times. Thermocompression bonding is performed in the air as an example.

Following the second thermocompression bonding step S3, the first bonding step S4 ultrasonically bonds the exposed surface of the third conductor 46 to the exposed surface of the second conductor 41. As an example, using the same material as the second conductor 41 and the third conductor 46, the frequency is 15 [kHz] or more and 200 while pressing the horn with a pressing force of 500 [N] or more and 2500 [N] or less. By applying ultrasonic vibration of [kHz] or less, ultrasonic bonding is performed to obtain a fourth intermediate 54.

As described above, the fourth intermediate 54 manufactured on a consistent production line is shipped as the fourth intermediate 54 having a structure that shields over the entire circumference, or the fourth intermediate 54 is on another production line. The fourth intermediate 54 is assembled and processed on the assembly line of the electronic device to become the transmission line 20.

In the example of FIG. 11, the second joining step S5 is performed following the first joining step S4. In the second bonding step S5, the end of the third conductor 46 is ultrasonically bonded to the end of the ground conductor 33 with respect to the fourth intermediate 54. Here, the ends of the ground conductor 33 are the respective ends on the side of the transmission line conductor 32. Further, the ends of the third conductor 46 are both ends. As an example, using the same material as the second conductor 41 and the third conductor 46, the frequency is 15 [kHz] or more and 200 while pressing the horn with a pressing force of 500 [N] or more and 2500 [N] or less. By applying ultrasonic vibration of [kHz] or less, ultrasonic bonding is performed to obtain a fifth intermediate 55.

In the example of FIG. 11, the laser processing step S6 is performed following the second joining step S5. In the laser processing step S6, as shown in FIG. 3B, the surface of the third conductor 46 opposite to the ground conductor 33 is partially exposed by laser irradiation with respect to the fifth intermediate 55. Window portions V1 are formed at intervals to form a sixth intermediate 56. As an example, the window portion V1 has a quadrangular shape or a rounded quadrangular shape, and a plurality of window portions V1 are formed at predetermined intervals. Laser irradiation is performed at a predetermined output for a predetermined time. For laser irradiation, known equipment and known construction methods can be applied. The laser processing step S6 may be omitted.

In the example of FIG. 11, the inspection step S7 is performed following the laser processing step S6. In the inspection step S7, the contact pin of the inspection machine 8 is brought into contact with the transmission line conductor 32 to energize the sixth intermediate 56 so that the transmission line conductor 32 is not broken and the continuity level is within the normal range. Inspect that. For continuity inspection, known equipment and known construction methods can be applied. The inspection step S7 is not performed here, but may be performed on another production line.

In the example of FIG. 11, the inspection step S7 is followed by the division step S8. In the division step S8, the transmission line 20 is separated and taken out by punching the in-line-inspected sixth intermediate 56 along a predetermined cut line by the punching blade of the division take-out machine 9. Known equipment and known construction methods can be applied to the split removal. The division step S8 is not performed here, but may be performed on another production line.

Then, as described above, the transmission line 20 manufactured on the consistent production line and in-line-inspected is conveyed by the transfer machine 17 in a vacuum-adsorbed state and stored in the tray 18.

As an example, FIGS. 4A and 6B are a two-core transmission line 20 in which two transmission line conductors 32 are arranged in parallel. As a configuration other than the above, as shown in FIG. 7A, there is a case where the transmission line 20 has a three-core structure in which three transmission line conductors 32 are arranged in parallel. Alternatively, as shown in FIG. 7B, the transmission line 20 may have a multi-core structure in which four or more transmission line conductors 32 are arranged in parallel.

According to the present embodiment, by feeding the base 30, the coverlay 35, the first shield 40, and the second shield 45 at a predetermined pitch P1, the first thermocompression bonding step S1, the unnecessary area removal step S2, and the second thermocompression bonding are performed. Through step S3 and first joining step S4, a thin transmission line 20 that is shielded over the entire circumference to reduce crosstalk can be manufactured on a consistent line. Then, since the second conductor of the first shield 40 and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, the production time (tact time) is set to the heat of the conductive paste or the adhesive. It can be shorter than the curing time and the required components are minimized.

Further, according to this configuration, in a state where the second conductor 41 and the third conductor 46 are ultrasonically bonded, the ground conductor 33 which is arranged close to the input end and the output end of the transmission line conductor 32 is simultaneously made into the third conductor. It can be ultrasonically bonded to 46. Since the first shield 40 and the second shield 45 are an integral structure, it is possible to prevent wrinkles and stress distortion when the ground conductor 33 is ultrasonically bonded to the third conductor 46 at the same time. According to this configuration, since the third conductor 46 is an integral structure with the second shield 45, a part of the third conductor 46 on the opposite side of the joint surface with the ground conductor 33 is lasered. The windows V1 to be exposed can be easily formed at predetermined intervals.

By the transmission line manufacturing apparatus 1 and the transmission line manufacturing method of the above-described embodiment, it is possible to manufacture a thin transmission line 20 having excellent shielding performance and reduced crosstalk between transmission lines and having a space-saving structure.

In the transmission line 20 of the present embodiment, the first conductor 31 composed of the transmission line conductor 32 and the ground conductor 33 adjacent to the input end and the output end of the transmission line conductor 32 is in the form of a sheet and is made of a thermoplastic resin. A sheet-like thermoplastic resin that covers the base 30 formed on the first main surface 34a of the material 34 and at least a plurality of transmission line conductors 32 of the first conductor 31 formed at a predetermined pitch P1 and each transmission line conductor 32. A coverlay 35 made of a coverlay 35, a first shield 40 formed on a second main surface 42a of a second base material 42 having a sheet-like second conductor 41 and made of a thermoplastic resin, and a sheet-like third conductor 46 having heat. A second shield 45 formed on a third base material 47 made of a plastic resin is provided, and the first main surface 34a and coverlay 35 of the first base material 34 and the opposite side of the first main surface 34a of the base 30 are provided. The surface and the side of the second main surface 42a of the first shield 40, the surface opposite to the first main surface 34a in the base 30, the side of the second main surface 42a of the first shield 40, and the coverlay 35 and the second shield. The side of the second main surface 42a of 45 is heat-bonded to each other, and the second conductor 41 and the third conductor 46 arranged to face each other are ultrasonically bonded to each other, and the second conductor 41 and the third conductor are third. It is arranged so as to surround the transmission line conductor 32 with the conductor 46.

As shown in FIGS. 4A, 4B and 6B, according to the present embodiment, the second conductor 41 of the first shield 40 and the third of the second shield 45 arranged so as to face each other with the base 30 and the coverlay 35 interposed therebetween. The thin transmission line 20 is shielded over the entire circumference so as to surround the transmission line conductor 32 in a state of being ultrasonically bonded to the conductor 46 to reduce crosstalk. Then, since the second conductor 41 of the first shield 40 and the third conductor 46 of the second shield 45 are ultrasonically bonded without using an adhesive or a conductive paste, at least by the thickness of the adhesive or the conductive paste. Can be made into a thin structure. In addition, the manufacturing cost can be significantly reduced as compared with the conventional method of striking vias between transmission lines to reduce crosstalk.

As an example, the end of the ground conductor 33 and the end of the third conductor 46 are ultrasonically bonded to each other. According to this configuration, external noise can be prevented by the shielding effect on the input end and the output end of the transmission line conductor 32.

Further, a plurality of window portions V1 are formed on the third base material 47 at predetermined intervals, and a part of the third conductor 46 is exposed by the window portions V1 so as to be externally connectable. According to this configuration, as an example, it is easy to improve the shielding performance by externally connecting a part of the third conductor 46 exposed by the window portion V1 to the housing and the ground wiring of the mobile information terminal. ..

As shown in FIG. 6B, cut surfaces are formed on both sides in the longitudinal direction. According to this configuration, the width dimension becomes constant by cutting both sides in the longitudinal direction.

As described above, the present invention is not limited to the above-described embodiment. In the above example, the sheet-shaped base 30 is supplied in a reel state, but the present invention is not limited to this, and the sheet-shaped base 30 is stacked in a magazine in the form of a sheet of a predetermined size and supplied from the magazine to the production line by a supply roller or the like. It is also possible. Similarly, the coverlay 35, the first shield 40, and the second shield 45 can be stacked in a magazine in the form of a sheet of a predetermined size and supplied from the magazine to the production line by a supply roller or the like.

1 Transmission line manufacturing equipment 2 1st thermocompression bonding machine 3 Unnecessary area removing machine 4 2nd thermocompression bonding machine 5 Bonding machine (1st ultrasonic bonding machine)
6 Bonding machine (2nd ultrasonic bonding machine)
7 Laser processing machine 8 Inspection machine 9 Split take-out machine 10 Controller 11 Base feeder 12 Coverlay feeder 13 1st shield feeder 14 2nd shield feeder 15 Tension adjuster 16 Pitch feeder 17 Transfer machine 18 Tray 20 Transmission Line 30 Base 31 First conductor 32 Transmission line conductor 33 Ground conductor 34 First base material 34a First main surface 35 Coverlay 40 First shield 41 Second conductor 42 Second base material 42a Second main surface 45 Second shield 46 3rd conductor 47 3rd base material 51 1st intermediate 52 2nd intermediate 53 3rd intermediate 54 4th intermediate 55 5th intermediate 56 6th intermediate P1 Pitch R1 Unnecessary area U1 Through hole V1 Window

Transmission line of the present invention, the first main in the first substrate sheet in which the first conductor composed of a ground conductor in proximity to the input and output ends of the transmission line conductor and the transmission line conductor is formed of a thermoplastic resin a base at least the transmission line conductors of said first conductor is formed with a plurality at a predetermined pitch is formed in a plane, the coverlay sheet made of a thermoplastic resin covering each said transmission line conductors, second conductors second shield but formed on the first shield and the third base material sheet of the third conductor is formed of a thermoplastic resin formed on the second major surface of the second substrate sheet formed of a thermoplastic resin with the door, wherein the first major surface of the first substrate is configured to coverlay was against wear, a second conductor of the first shield on the opposite side of the first main surface of said first substrate a structure in which contact wearing surface, a configuration in which the third contact the conductor surface wear of the second shield on the opposite side of the bonding surface between the first substrate of the coverlay, the second conductor surface A plurality of the transmission line conductors are shielded by a structure in which the third conductor surface is joined to the surface of the conductor and the second conductor and the third conductor are arranged so as to surround the transmission line conductors. It is characterized by having a thin structure .

As an example , the second conductor of the first shield and the third conductor of the second shield, which are arranged so as to face each other across the base and the coverlay, are ultrasonically bonded and surround the transmission line conductor over the entire circumference. It becomes a transmission line with a shielded structure. Then, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using an adhesive or a conductive paste, the structure can be made thinner by at least the thickness of the adhesive or the conductive paste. ..

The method for manufacturing a transmission line of the present invention is to use a sheet-like first base material in which the first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor is made of a thermoplastic resin . A base formed on the first main surface and at least a plurality of the transmission line conductors formed at a predetermined pitch among the first conductors, a sheet-shaped coverlay covering each of the transmission line conductors, and the second conductor heat. a first shield which is formed on the second main surface of the second substrate sheet formed of a thermoplastic resin, and a second shield third conductors are formed on the third base material sheet made of a thermoplastic resin In order to form a thin structure in which a plurality of the transmission line conductors are shielded, the coverlay is heat-bonded to the first main surface of the first base material, and the coverlay is heat-bonded. With respect to the first intermediate body, the unnecessary area removing region between the transmission line conductor and the transmission line conductor is removed to form a plurality of through holes penetrating the first intermediate body in the thickness direction. The second conductor surface of the first shield is heat-bonded to the surface of the first base material opposite to the first main surface of the second intermediate body in which a plurality of through holes are formed, and the coverlay is formed. The second heat-bonding step of heat-bonding the third conductor surface of the second shield to the surface opposite to the bonding surface with the first base material and the second conductor surface of the first shield were heat-bonded. In a state in which the third conductor surface of the second shield is heat-bonded to the surface of the coverlay opposite to the adhesive surface with the first base material, the third conductor surface is heat-bonded to the second conductor surface . It is characterized by having a first joining step of ultrasonically joining the conductor surfaces .

According to this configuration, it is possible to prevent the occurrence of wrinkles of the first shield and the second shield.

In the transmission line manufacturing apparatus of the present invention, the first conductor composed of the transmission line conductor and the ground conductor adjacent to the input end and the output end of the transmission line conductor is a sheet-like first conductor made of a thermoplastic resin at a predetermined pitch. A base feeder that supplies a base formed on the first main surface of the base material and at least a plurality of the transmission line conductors formed at a predetermined pitch among the first conductors, and a sheet-like material that covers each of the transmission line conductors. a coverlay feeder for supplying the coverlay, the second conductor first shield supply which supplies a first shield which is formed on the second main surface of the second substrate sheet formed of a thermoplastic resin, the The coverlay is heat-bonded to a second shield feeder that supplies a second shield formed on a sheet-shaped third base material whose three conductors are made of a thermoplastic resin, and a first main surface of the first base material. With respect to the first heat crimping machine and the first intermediate body to which the coverlay is heat crimped, an unnecessary region between the transmission line conductor and the transmission line conductor is removed to move the first intermediate body in the thickness direction. With respect to the unnecessary region removing machine having a configuration in which a plurality of through holes are formed and the second intermediate body in which the plurality of through holes are formed, the first surface on the surface opposite to the first main surface of the first substrate . a second conductive surface of the shield is configured to thermocompression bonding, and, a third conductive surface of the second shield on the opposite side of the bonding surface between the first substrate of the coverlay configuration thermocompression bonding A second thermal crimping machine and the second conductor surface of the first shield are thermally crimped, and the second shield is placed on the surface of the coverlay opposite to the bonding surface with the first base material. The third conductor surface is heat-bonded, and the second conductor surface is provided with a first joining machine having a configuration in which the third conductor surface is ultrasonically bonded , and the plurality of transmission line conductors are shielded from each other. It is characterized by having a structure .

According to the transmission line of the present invention, it is possible to realize a thin transmission line that is shielded over the entire circumference to reduce crosstalk. Further, according to the transmission line manufacturing method and the transmission line manufacturing apparatus of the present invention, a thin transmission line or an intermediate thereof that is shielded over the entire circumference to reduce crosstalk can be manufactured on a consistent manufacturing line.

Claims (12)

A first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor is formed on the first main surface of a first base material made of a sheet-like thermoplastic resin and described above. A base in which at least a plurality of the transmission line conductors are formed at a predetermined pitch among the first conductors, a coverlay made of a sheet-like thermoplastic resin covering each of the transmission line conductors, and a sheet-like thermoplastic resin as the second conductor. A first shield formed on the second main surface of the second base material made of the same material, and a second shield formed on the third base material having a third conductor in the form of a sheet and made of a thermoplastic resin.
The first main surface of the first base material and the coverlay, the surface opposite to the first main surface of the base and the side of the second main surface of the first shield, and the first main surface of the base. The surface opposite to the surface and the side of the second main surface of the first shield, and the coverlay and the side of the second main surface of the second shield are thermocompression bonded to each other.
The second conductor and the third conductor arranged to face each other are ultrasonically bonded to each other, and the second conductor and the third conductor are arranged so as to surround the transmission line conductor. Characterized transmission line. The transmission line according to claim 1, wherein cut surfaces are formed on both sides in the longitudinal direction. The transmission line according to claim 1 or 2, wherein the end portion of the ground conductor and the end portion of the third conductor are ultrasonically bonded to each other. Claims 1 to 1, wherein a plurality of window portions are formed on the third base material at predetermined intervals, and a part of each of the third conductors is exposed by the window portions so as to be externally connectable. The transmission line according to any one of 3. A first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor is formed on a sheet-like first main surface made of a thermoplastic resin, and among the first conductors. A base in which at least a plurality of the transmission line conductors are formed at a predetermined pitch, a sheet-shaped coverlay covering each of the transmission line conductors, and a second main base material having a sheet-like second conductor and made of a thermoplastic resin. Using a first shield formed on the surface and a second shield formed on a third base material whose third conductor is a sheet and made of a thermoplastic resin,
A first thermocompression bonding step in which the coverlay is thermocompression bonded to the first main surface,
An unnecessary region in which an unnecessary region between the transmission line conductor and the transmission line conductor is removed from the first intermediate in which the coverlay is thermocompression bonded to form a plurality of through holes penetrating the first intermediate. With the removal step,
A second thermocompression bonding step in which the side of the first main surface of the first shield is thermocompression bonded to the surface of the base opposite to the first main surface of the second intermediate in which a plurality of through holes are formed. When,
A transmission line characterized by having a first bonding step of ultrasonically bonding the exposed surface of the second conductor and the exposed surface of the third conductor to each other in a state where the first shield is thermocompression bonded. Production method. In the second thermocompression bonding step, the side of the second main surface of the first shield is thermocompression bonded to the surface of the base opposite to the first main surface of the base, and the cover. The method for manufacturing a transmission line according to claim 5, wherein the side of the second main surface of the second shield is thermocompression bonded to the ray. It is characterized by having a second bonding step of ultrasonically bonding the end of the third conductor to the end of the ground conductor in a state where the second conductor and the third conductor are ultrasonically bonded to each other. The method for manufacturing a transmission line according to claim 5 or 6. The transmission line according to claim 7, further comprising a laser processing step of exposing a part of each of the third conductors by laser irradiation in a state where the ground conductor and the third conductor are ultrasonically bonded. Manufacturing method. A first conductor composed of a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor is formed on the first main surface of a sheet-shaped first base material at a predetermined pitch, and the first conductor is formed. Among the conductors, a base feeder for supplying a base in which at least a plurality of the transmission line conductors are formed at a predetermined pitch, a coverlay feeder for supplying a sheet-shaped coverlay covering each of the transmission line conductors, and a second conductor A first shield feeder that supplies a first shield formed on the second main surface of a second base material that is sheet-shaped and made of thermoplastic resin, and a third base material that has a third conductor that is sheet-shaped and made of thermoplastic resin. A second shield feeder that supplies the second shield formed in
A first thermocompression bonding machine that thermocompression-bonds the coverlay to the first main surface,
An unnecessary region in which an unnecessary region between the transmission line conductor and the transmission line conductor is removed from the first intermediate in which the coverlay is thermocompression bonded to form a plurality of through holes penetrating the first intermediate. With a remover
A second thermocompression bonding machine that thermocompression-bonds the side of the second main surface of the first shield to the surface of the base opposite to the first main surface of the second intermediate in which a plurality of through holes are formed. When,
A transmission line comprising a first joining machine that ultrasonically bonds the exposed surface of the second conductor and the exposed surface of the third conductor to each other in a state where the first shield is thermocompression bonded. Manufacturing equipment. The second thermocompression bonding machine thermocompression-bonds the side of the second main surface of the first shield to the surface of the base opposite to the first main surface of the base, and the cover. The transmission line manufacturing apparatus according to claim 9, further comprising a configuration in which the side of the second main surface of the second shield is thermocompression bonded to the ray. It is characterized by providing a second bonding machine that ultrasonically bonds the end of the third conductor to the end of the ground conductor in a state where the second conductor and the third conductor are ultrasonically bonded to each other. The transmission line manufacturing apparatus according to claim 9 or 10. The transmission line according to claim 11, further comprising a laser processing machine that exposes a part of each of the third conductors by laser irradiation in a state where the ground conductor and the third conductor are ultrasonically bonded. Manufacturing equipment.