JP2020136512A - Wiring board and manufacturing method thereof - Google Patents

Abstract

To provide a wiring board and a manufacturing method thereof that do not require a large-sized base material when a large number of wirings or functional parts are desired to be installed.SOLUTION: A wiring board 10 includes: a stretchable base material 20 including a first surface 21 and a second surface 22 located on the opposite side of the first surface 21; wirings 52 located on the first surface side and the second surface side of the base material 20 and electrically connected to an electronic component 51; and one or a plurality of reinforcing members 30 that are provided on the base material 20 and reinforce the base material 20. When the base material 20 is viewed along the direction normal to the first surface 21 of the base material 20, the reinforcing member 30 overlaps the electronic components 51 provided on the first surface side and the second surface side of the base material 20.SELECTED DRAWING: Figure 1

Description

An embodiment of the present disclosure relates to a wiring board including a stretchable base material and wiring, and a method for manufacturing the same.

In recent years, research has been conducted on electronic devices having deformability such as elasticity. For example, there are known ones in which elastic silver wiring is formed on an elastic base material and one in which horseshoe-shaped wiring is formed on an elastic base material (see, for example, Patent Document 1). Further, Patent Document 2 discloses a method for manufacturing this kind of electronic device. The manufacturing method of Patent Document 2 employs a step of providing a circuit on a base material in a pre-stretched state, forming the circuit, and then relaxing the base material.

Japanese Unexamined Patent Publication No. 2013-187308 JP-A-2007-281406

In the above-mentioned devices, conventionally, wiring and electronic components have usually been provided only on either the front surface or the back surface of the stretchable base material.

However, in the above configuration, when the number of wirings and functional parts desired to be installed is large, it is necessary to increase the size of the base material, which may increase the overall size.

An object of the present disclosure is to provide a wiring board and a method for manufacturing a wiring board that can effectively solve such a problem.

One embodiment of the present disclosure is a wiring board, including a first surface and a second surface located on the opposite side of the first surface, a stretchable base material, a first surface side of the base material, and the like. The first of the base materials, which is located on the second surface side and includes wiring that is electrically connected to the functional component, and one or more reinforcing members that are provided on the base material and reinforce the base material. When the base material is viewed along the normal direction of the surface, the reinforcing member is a wiring board that overlaps with the functional components provided on the first surface side and the second surface side of the base material.

A support substrate provided between the wiring and the base material and extending in parallel with the base material may be further provided on at least one of the first surface side and the second surface side of the base material.

The functional component may be provided on the support substrate.

In the base material, a reinforcing member for a conductor, a through hole penetrating from the first surface to the second surface of the base material and penetrating the reinforcing member for the conductor, and a conductor located in the through hole. May be further provided, and the conductor may connect the wiring on the first surface side of the base material and the wiring on the second surface side of the base material.

The wiring may have a bellows-shaped portion including a plurality of peaks and a plurality of valleys alternately arranged in the direction in which the wiring extends.
In this case, the bellows-shaped portion of the wiring on the first surface side and the bellows-shaped portion of the wiring on the second surface side have a period of a distance between the adjacent peaks, and the peak and the valley. At least one of the amplitude, which is the distance between the parts and the first surface in the normal direction, and the phase, which is the deviation of the period, may be different from each other.

The base material may include a plurality of peaks arranged in the direction in which the wiring extends.

Further, one embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a first base material having elasticity, a first surface side of the first base material, and the like. One or more wirings located on at least one of the second surface sides and electrically connected to the functional component and one or more provided on the first base material to reinforce the first base material. A first wiring layer having a first side reinforcing member, a second base material including a first surface and a second surface located on the opposite side of the first surface, and having elasticity, and the second base material. It is located on at least one of the first surface side and the second surface side, and is provided on the second base material and the second side wiring that electrically connects to the functional component to reinforce the second base material. A second wiring layer having one or a plurality of second side reinforcing members is provided, and the first wiring layer and the second wiring layer are a second surface of the first base material and the second surface. The first surface of the base material is laminated so as to face each other, and the bonded first wiring layer and the second wiring layer are viewed along the normal direction of the first surface of the first base material. At that time, the first side reinforcing member overlaps with the functional component provided on at least one of the first surface side and the second surface side of the first base material, and the second side reinforcing member is said. It is a wiring board that overlaps with the functional component provided on at least one of the first surface side and the second surface side of the second base material.

The wiring board is a support substrate provided between the first side wiring and the first base material and extending in parallel with the first base material, and the first surface side and the second surface of the first base material. Further provision may be provided on at least one of the sides.

The wiring board is a support substrate provided between the second side wiring and the second base material and extending in parallel with the second base material, and the first surface side and the second surface of the second base material. Further provision may be provided on at least one of the sides.

The first side wiring is provided on the first surface side of the first base material, the second side wiring is provided on the second surface side of the second base material, and the first base material and the second base material are provided. A conductor reinforcing member is provided on at least one of the materials, and penetrates from the first surface of the first base material to the second surface of the second base material and also penetrates the conductor reinforcing member. A through hole is provided, and a conductor is provided in the through hole, and the conductor is the first side wiring on the first surface side of the first base material and the second surface of the second base material. The second side wiring on the side may be electrically connected.

The first side wiring and the functional component are not provided on the second surface side of the first base material, and the second side wiring and the functional component are not provided on the first surface side of the second base material. The second surface of the first base material and the first surface of the second base material may be bonded to each other by a magnet or a snap fit.

The first side wiring is provided on the first surface side of the first base material, the second side wiring and the functional component are provided on the first surface side of the second base material, and the first wiring layer The second wiring layer is bonded to the second wiring layer via an adhesive layer, and the second side wiring and the functional component provided on the first surface side of the second base material are covered with the adhesive layer. May be good.

The first base material is provided with a reinforcing member for a conductor, and a through hole is provided so as to penetrate from the first surface of the first base material to the adhesive layer and to penetrate the reinforcing member for a conductor.
A conductor is provided in the through hole, and the conductor is the first side wiring on the first surface side of the first base material and the second side on the first surface side of the second base material. It may be electrically connected to the wiring.

The first side wiring has a bellows-shaped portion including a plurality of peaks and a plurality of valleys arranged in a direction in which the first side wiring extends, and the second side wiring has a direction in which the second side wiring extends. It may have a bellows-shaped portion including a plurality of peaks and a plurality of valleys arranged in a row.
In this case, the bellows-shaped portion of the first-side wiring and the bellows-shaped portion of the second-side wiring have a period of a distance between the adjacent peaks, and the peak and the valley between the peaks and the valleys. At least one of the amplitude, which is the distance in the normal direction of the first surface of the first base material, and the phase, which is the deviation of the period, may be different from each other.

The first base material may include a plurality of peaks arranged in the direction in which the first side wiring extends, and the second base material may include a plurality of peaks arranged in the direction in which the second side wiring extends.

One embodiment of the present disclosure is a method of manufacturing a wiring substrate, in which tension is applied to a base material which has elasticity and is provided with one or more reinforcing members for reinforcement to obtain the base material. An extension step of stretching, an installation step of providing wiring electrically connected to a functional component on the first surface side and the second surface side of the base material stretched by the stretching step, and the tension from the base material. When the base material is viewed along the normal direction of the first surface of the base material after the shrinkage step, the reinforcing member is on the first surface side and the first surface of the base material. This is a method for manufacturing a wiring board that overlaps with the functional components provided on the two side surfaces.

One embodiment of the present disclosure is a method of manufacturing a wiring substrate, in which tension is applied to a first base material which has elasticity and is provided with one or more first side reinforcing members for reinforcement. , A functional component on at least one of a first stretching step of stretching the first base material and a first surface side and a second surface side of the first base material stretched by the first stretching step. The first forming step of forming the first wiring layer having the first base material, the first side reinforcing member, and the first side wiring by providing the first side wiring electrically connected to the first base material, and the elasticity. A second extension step of extending the second base material by applying tension to the second base material which has one or more second side reinforcing members for reinforcement and the second extension step. A second side wiring that electrically connects to the functional component is provided on at least one of the first surface side and the second surface side of the second base material in the stretched state, and the second base material and the said A second forming step of forming a second wiring layer having a second side reinforcing member and the second side wiring, and after removing the tension from the first base material and the second base material, the first unit The first wiring which is bonded together includes a step of laminating the first wiring layer and the second wiring layer in a state where the second surface of the material and the first surface of the second base material face each other. When the layer and the second wiring layer are viewed along the normal direction of the first surface of the first base material, the first side reinforcing member is the first surface side and the second surface of the first base material. The second side reinforcing member overlaps with the functional component provided on at least one of the sides, and the second side reinforcing member is provided on at least one of the first surface side and the second surface side of the second base material. This is a method of manufacturing a wiring board that overlaps with parts.

One embodiment of the present disclosure is a method of manufacturing a wiring substrate, in which tension is applied to a first base material which has elasticity and is provided with one or more first side reinforcing members for reinforcement. , A functional component on at least one of a first stretching step of stretching the first base material and a first surface side and a second surface side of the first base material stretched by the first stretching step. The first forming step of forming the first wiring layer having the first base material, the first side reinforcing member, and the first side wiring by providing the first side wiring electrically connected to the first base material, and the elasticity. A second extension step of extending the second base material by applying tension to the second base material which has one or a plurality of second side reinforcing members for reinforcement and the second extension step. A second side wiring that electrically connects to the functional component is provided on at least one of the first surface side and the second surface side of the second base material in the stretched state, and the second base material and the said The second forming step of forming the second wiring layer having the second side reinforcing member and the second side wiring, and the first base material with the first base material and the second base material stretched. From the step of laminating the first wiring layer and the second wiring layer in a state where the second surface and the first surface of the second base material face each other, and from the first base material and the second base material. When the first wiring layer and the second wiring layer laminated together with the shrinking step for removing the tension are viewed along the normal direction of the first surface of the first base material after the shrinking step, The first side reinforcing member overlaps with the functional component provided on at least one of the first surface side and the second surface side of the first base material, and the second side reinforcing member is the second unit. This is a method for manufacturing a wiring substrate that overlaps with the functional component provided on at least one of the first surface side and the second surface side of the material.

According to the embodiment of the present disclosure, it is possible to provide a plurality of functional components connected to the wiring at a high density to reduce the size, and the reliability of the electrical connection between the functional component and the wiring is high. An improved wiring board can be provided.

It is a top view which shows the wiring board which concerns on embodiment. It is sectional drawing which shows the case where the wiring board shown in FIG. 1 is cut along the line II-II. It is an enlarged view of FIG. It is an enlarged view of FIG. 3A. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board. It is sectional drawing which shows one modification of the wiring board.

Hereinafter, the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure is not construed as being limited to these embodiments. Further, in the present specification, terms such as "board", "base material", "sheet" and "film" are not distinguished from each other based only on the difference in names. For example, "base material" is a concept that includes members that can be called substrates, sheets, or films. Furthermore, as used herein, terms such as "parallel" and "orthogonal" and values of length and angle that specify the shape and geometric conditions and their degrees are bound by strict meaning. Instead, the interpretation will include the range in which similar functions can be expected. Further, in the drawings referred to in the present embodiment, the same parts or parts having similar functions are designated by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. In addition, the dimensional ratio of the drawing may differ from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

Hereinafter, one embodiment of the present disclosure will be described.

(Wiring board)
First, the wiring board 10 according to this embodiment will be described. 1 and 2 are a plan view and a cross-sectional view showing the wiring board 10, respectively. The cross-sectional view shown in FIG. 2 is a view when the wiring board 10 of FIG. 1 is cut along the lines II-II.

The wiring board 10 includes a base material 20, an electronic component 51, a wiring 52, and a reinforcing member 30. Hereinafter, each component of the wiring board 10 will be described.

〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 and a second surface 22 located on the opposite side of the first surface 21. The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, and more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. Further, by reducing the thickness of the base material 20 to 10 mm or less, the mounting comfort of the wiring board 10 can be ensured. If the thickness of the base material 20 is made too small, the elasticity of the base material 20 may be impaired.

The elasticity of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a normal non-extended state and can be restored when released from this extended state. The property that can be done. The non-extended state is the state of the base material 20 when no tensile stress is applied. In the present embodiment, the stretchable substrate can preferably be stretched by 1% or more from the non-stretched state without being destroyed, more preferably 20% or more, and further preferably 75%. It can be extended as described above. By using the base material 20 having such an ability, the wiring board 10 can have elasticity as a whole. Further, the wiring board 10 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a human arm. It is generally said that a product mounted under the armpit of a person needs to have an elasticity of 72% in the vertical direction and 27% in the horizontal direction. In addition, it is said that products attached to human knees, elbows, buttocks, ankles, and armpits need to have elasticity of 26% or more and 42% or less in the vertical direction. It is also said that products that are attached to other parts of the human body need to have less than 20% elasticity.

Further, it is preferable that the difference between the shape of the base material 20 in the non-stretched state and the shape of the base material 20 when the base material 20 is stretched from the non-stretched state and then returned to the non-stretched state is small. This difference is also referred to as a shape change in the following description. The shape change of the base material 20 is, for example, 20% or less, more preferably 10% or less, still more preferably 5% or less in terms of area ratio. By using the base material 20 having a small shape change, the bellows-shaped portion described later can be easily formed.

An example of a parameter representing the elasticity of the base material 20 is the elastic modulus of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the entire wiring board 10 can be made elastic. In the following description, the elastic modulus of the base material 20 is also referred to as a first elastic modulus. The first elastic modulus of the base material 20 may be 1 kPa or more.

As a method for calculating the first elastic modulus of the base material 20, a method of carrying out a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. It is also possible to adopt a method in which the elastic modulus of the sample of the base material 20 is measured by the nanoindentation method in accordance with ISO14577. A nanoindenter can be used as the measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample can be considered. Be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the materials constituting the base material 20 are analyzed, and the first elastic modulus of the base material 20 is calculated based on the existing database of the materials. It is also possible to adopt the method. The elastic modulus in the present application is an elastic modulus in an environment of 25 ° C.

Another example of a parameter representing the elasticity of the base material 20 is the flexural rigidity of the base material 20. The flexural rigidity is the product of the moment of inertia of area of the target member and the elastic modulus of the material constituting the target member, and the unit is N · m ² or Pa · m ⁴ . The moment of inertia of area of the base material 20 is calculated based on the cross section when the portion of the base material 20 that overlaps with the wiring 52 is cut by a plane orthogonal to the expansion / contraction direction of the wiring board 10.

Examples of the material constituting the base material 20 include an elastomer. Further, as the material of the base material 20, for example, a cloth such as a woven fabric, a knitted fabric, or a non-woven fabric can be used. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used, and specifically, polyurethane-based elastomers, styrene-based elastomers, nitrile-based elastomers, olefin-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, etc. Amid-based elastomers, 1,2-BR-based elastomers, fluoroelastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadienes, polyisobutylenes, polystyrene butadienes, polychloroprenes and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Further, the base material 20 may contain silicone. Silicone is excellent in heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.

[Electronic components]
The electronic component 51 corresponds to a functional component, and is provided on the first surface 21 side and the second surface 22 side of the base material 20. Further, a wiring 52 electrically connected to the electronic component 51 on the first surface 21 side is provided on the first surface 21 side of the base material 20, and a second surface is provided on the second surface 22 side of the base material 20. A wiring 52 that is electrically connected to the electronic component 51 on the 22 side is provided. Each electronic component 51 is connected to the wiring 52 by a connecting portion 51a located between the electronic component 51 and the wiring 52. In the example shown in FIG. 2, the connecting portion 51a is located between the surface of the electronic component 51 facing the base material 20 side and the surface of the base material 20, particularly the wiring 52 on the base material 20. The surface of the wiring 52 is a surface of the wiring 52 located on the side farther from the base material 20.

In this example, the connecting portion 51a is connected to the surface of the electronic component 51 facing the base material 20 side and is connected to the surface of the wiring 52. However, instead of the example shown in FIG. 2, the connecting portion 51a may be located on the side surface of the electronic component 51. Further, the connecting portion 51a may be connected to the side surface of the wiring 52. Such an electronic component 51 may be an active component, a passive component, or a mechanical component.

Examples of electronic components 51 include transistors, LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs, and LCDs, sound components such as sensors and buzzers, and vibrations that generate vibrations. Examples thereof include parts, cold and heat-generating parts such as Perche elements and heating wires that control cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors. Of the above examples of the electronic component 51, the sensor is preferably used. Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, biosensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, etc. Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and photometric sensors. Of these sensors, biosensors are particularly preferred. The biosensor can measure biometric information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.

〔wiring〕
The wiring 52 is a conductive member connected to the connecting portion 51a of the electronic component 51. As described above, the wiring 52 is provided on the first surface 21 side and the second surface 22 side of the base material 20, and is connected to the electronic component 51 provided on the same side, respectively. For example, as shown in FIG. 2, the end side portion of the wiring 52 is connected to the electronic component 51 via the connecting portion 51a. In the example shown in FIG. 1, a plurality of wirings 52 are provided on both sides of the electronic component 51, but the number of wirings 52 is not particularly limited.

As will be described later, in one embodiment, the wiring 52 is provided on the base material 20 in a state of being stretched by tension. In this case, when the tensile stress is removed from the base material 20 and the base material 20 contracts, the wiring 52 is deformed into a bellows shape and has a bellows-shaped portion 57 as shown in FIG. 3A. In FIG. 3A, each of the wiring 52 on the first surface 21 side and the wiring 52 on the second surface 22 side has a bellows-shaped portion 57.

The bellows-shaped portion 57 includes peaks and valleys in the normal direction of the first surface 21 of the base material 20. In FIG. 3A, reference numeral 53 represents a mountain portion appearing on the front surface of the wiring 52, and reference numeral 54 represents a mountain portion appearing on the back surface of the wiring 52. Further, reference numeral 55 represents a valley portion appearing on the front surface of the wiring 52, and reference numeral 56 represents a valley portion appearing on the back surface of the wiring 52. The front surface is a surface of the wiring 52 located on the side farther from the base material 20, and the back surface is a surface of the wiring 52 located on the side closer to the base material 20. Further, in FIG. 3A, reference numerals 26A and 27A represent peaks and valleys appearing on the first surface 21 of the base material 20. Reference numerals 26B and 27B represent peaks and valleys appearing on the second surface 22 of the base material 20. The wiring 52 is deformed in a bellows shape by deforming the base material 20 so that the mountain portion 26A and the valley portion 27A appear on the first surface 21 and the mountain portion 26B and the valley portion 27B appear on the second surface 22. It comes to have a bellows-shaped portion 57. The peaks 26A and 26B of the base material 20 correspond to the peaks 53 and 54 of the bellows-shaped portion 57 of the wiring 52, and the valleys 27A and 27B of the base material 20 correspond to the valleys 55 of the bellows-shaped portion 57 of the wiring 52. , 56 is supported.

In the following description, the direction in which the peaks and valleys of the bellows-shaped portion 57 repeatedly appear is also referred to as the first direction D1. In the example shown in FIG. 3A, the wiring 52 extends parallel to the first direction D1. Here, the wiring 52 has a bellows-shaped portion 57 at a position deviated from the electronic component 51 in the first direction D1. Further, the base material 20 has a rectangular shape including a long side parallel to the first direction D1. Although not shown, the wiring board 10 may include wiring 52 extending in a direction different from that of the first direction D1. Further, although not shown, when the base material 20 has a rectangular shape, the direction in which the long side extends may be different from the first direction D1. Note that FIG. 3A shows an example in which a plurality of peaks and valleys of the bellows-shaped portion 57 are lined up at regular intervals, but the present invention is not limited to this. Although not shown, the plurality of peaks and valleys of the bellows-shaped portion 57 may be arranged irregularly along the first direction D1. For example, the distance between two adjacent peaks in the first direction D1 does not have to be constant.

In FIG. 3A, reference numeral S1 represents the amplitude of the bellows-shaped portion 57 on the surface of the wiring 52 in the normal direction of the base material 20. The amplitude S1 is, for example, 1 μm or more, more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the elongation of the base material 20. Further, the amplitude S1 may be, for example, 500 μm or less.

The amplitude S1 measures, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 53 and the valleys 55 over a certain range in the length direction of the wiring 52, and averages them. It is calculated by finding it. The "constant range in the length direction of the wiring 52" is, for example, 10 mm. As the measuring instrument for measuring the distance between the adjacent peaks 53 and the valleys 55, a non-contact measuring instrument using a laser microscope or the like may be used, or a contact measuring instrument may be used. .. Further, the distance between the adjacent mountain portion 53 and the valley portion 55 may be measured based on an image such as a cross-sectional photograph. The calculation method of the amplitudes S2, S3, and S4 described later is also the same.

In FIG. 3A, reference numeral S2 represents the amplitude of the bellows-shaped portion 57 on the back surface of the wiring 52. The amplitude S2 is, for example, 1 μm or more, more preferably 10 μm or more, like the amplitude S1. Further, the amplitude S2 may be, for example, 500 μm or less. Further, in FIG. 3A, the reference numeral S3 represents the amplitude of the peak portion 26A and the valley portion 27A appearing on the first surface 21 of the base material 20 at the portion overlapping the bellows-shaped portion 57. When the back surface of the wiring 52 is located on the first surface 21 of the base material 20 as shown in FIG. 3A, the amplitude S3 of the peaks 26A and the valleys 27A of the first surface 21 of the base material 20 is the wiring 52. It is equal to the amplitude S2 of the bellows-shaped portion 57 on the back surface of.

In addition, in FIG. 3A, the amplitude S1 and the amplitude S2 of the bellows-shaped portion 57 on the first surface 21 side and the amplitude S3 of the peak portion 26A and the valley portion 27A of the first surface 21 of the base material 20 are shown. The preferred dimensional setting of the amplitude corresponding to the amplitude S1 and the amplitude corresponding to the amplitude S2 of the bellows-shaped portion 57 on the second surface 22 side of the base material 20 is the same as that of the amplitude S1 and the amplitude S2. Further, the preferred dimensional setting of the amplitude in the peak portion 26B and the valley portion 27B of the second surface 22 is the same as that of the amplitude S3. However, the shape of the bellows-shaped portion 57 on the first surface 21 side and the shape of the bellows-shaped portion 57 on the second surface 22 side may be the same or different. Similarly, the shapes of the peaks 26A and 27A of the first surface 21 and the shapes of the peaks 26B and 27B of the second surface 22 may be the same or different.

The material of the wiring 52 may be any material that can follow the expansion and contraction of the base material 20 by utilizing the elimination and formation of the bellows-shaped portion 57. The material of the wiring 52 may or may not have elasticity by itself.
Examples of the material that can be used for the wiring 52 and does not have elasticity by itself include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52.
When the material itself used for the wiring 52 has elasticity, the elasticity of the material is similar to, for example, the elasticity of the base material 20. Examples of the material that can be used for the wiring 52 and has elasticity by itself include a conductive composition containing conductive particles and an elastomer. The conductive particles may be any particles that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Of these, silver particles are preferably used.

Preferably, the wiring 52 has a structure that is resistant to deformation. For example, the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when the deformation occurs. ..

As a material constituting the base material of the wiring 52, general thermoplastic elastomers and thermocurable elastomers can be used. For example, styrene-based elastomers, acrylic-based elastomers, olefin-based elastomers, urethane-based elastomers, silicone rubbers, etc. Elastomer rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Among them, resins and rubbers containing urethane-based and silicone-based structures are preferably used in terms of their elasticity and durability. Further, as a material constituting the conductive particles of the wiring 52, for example, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. Of these, silver particles are preferably used.

The thickness of the wiring 52 may be a thickness that can withstand the expansion and contraction of the base material 20, and is appropriately selected depending on the material of the wiring 52 and the like.
For example, when the material of the wiring 52 does not have elasticity, the thickness of the wiring 52 can be in the range of 25 nm or more and 50 μm or less, preferably in the range of 50 nm or more and 10 μm or less, and preferably 100 nm or more and 5 μm. It is more preferably within the following range.
When the material of the wiring 52 has elasticity, the thickness of the wiring 52 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable that it is within the range.
The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.

Further, an insulating film that integrally covers the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or the support substrate 40 described later and the wiring 52 provided on the base material 20 or the support substrate 40. It may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the electronic component 51. Such an insulating film can be formed by heat-curing a thermosetting insulating resin or the like. Alternatively, the insulating film may be composed of a UV curable resin by ultraviolet rays or a solvent-dried resin obtained by volatilizing a solvent in the solution by heat drying after application of a solution containing the resin. The thickness of the insulating film may be, for example, 10 μm or more and 500 μm or less. Further, the insulating film may be formed by screen printing or the like. Further, the connecting portion 51a may be made of, for example, a conductive adhesive, may be formed of a solder material, or may be a terminal integrated with the electronic component 51.

The method for forming the wiring 52 is appropriately selected depending on the material and the like. For example, a method of forming a metal film on a base material 20 or a support substrate 40 described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, or the like, and then patterning the metal film by a photolithography method can be mentioned. Alternatively, a method of patterning a metal film by a photolithography method after adhering and laminating a metal foil on a base material 20 or a support substrate 40 described later can be mentioned. When the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the above-mentioned conductive particles and elastomer is patterned on the base material 20 or the support substrate 40 by a general printing method. There is a method of printing. Of these methods, a printing method that has high material efficiency and can be manufactured at low cost can be preferably used.

The advantage that the bellows-shaped portion 57 is formed in the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 10, the base material 20 can be stretched by elastic deformation. Here, if the wiring 52 is similarly stretched by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. Further, it is also conceivable that the wiring 52 may be damaged such as cracks due to the elastic deformation of the wiring 52.

On the other hand, in the present embodiment, the wiring 52 has a bellows-shaped portion 57. Therefore, when the base material 20 is stretched, the wiring 52 can follow the stretch of the base material 20 by deforming the bellows-shaped portion 57 so as to reduce the undulations, that is, by eliminating the bellows shape. it can. Further, in the present embodiment, the wiring 52 is provided on the base material 20 in a state of being stretched by tension, and when the tensile stress is removed from the base material 20 and the base material 20 contracts, the wiring 52 has a bellows-shaped portion. Therefore, when the base material 20 is returned to the initial tensile state in which the wiring 52 is formed, the bellows-shaped portion is completely eliminated. Further, in the present embodiment, when a bending stress is applied to the wiring 52 in a state where the tensile stress is not applied to the base material 20, and the base material 20 is in the initial tensile state in which the wiring 52 is formed, the wiring 52 No deformation stress such as bending stress is applied. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing as the base material 20 stretches. As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as a crack.

[Reinforcing member]
The reinforcing member 30 is a mechanism provided on the wiring board 10 in order to alleviate the deformation of the base material 20 by reinforcing the base material 20. For example, a portion of the wiring 52 located around the electronic component 51 is likely to generate a large stress during expansion and contraction, and is likely to be caught under the electronic component 51, which may increase the risk of breakage. Here, according to the present embodiment, by providing the reinforcing member 30 on the base material 20, it is possible to control, particularly alleviate, the deformation of the peripheral portion of the electronic component 51 on the base material 20. As a result, it is possible to prevent the wiring 52 from being locally generated with a large stress and to prevent the wiring 52 from being caught under the electronic component 51, and it is possible to suppress disconnection between the wiring 52 and the electronic component 51. ..

In the examples shown in FIGS. 1 and 2, two reinforcing members 30 are provided on the base material 20, and one of the two reinforcing members 30 corresponds to the electronic component 51 on the first surface 21 side. The other reinforcing member 30 is provided corresponding to the electronic component 51 on the second surface 22 side. The reinforcing member 30 is flat. When the base material 20 is viewed along the normal direction of the first surface 21, the one reinforcing member 30 is an electronic component on the first surface 21 side provided corresponding to the wiring 52 on the first surface 21 side. The other reinforcing member 30 overlaps with 51, and overlaps with the electronic component 51 on the second surface 22 side provided corresponding to the wiring 52 on the second surface 22 side. In addition, "overlapping" means that the two components overlap when viewed along the normal direction of the first surface 21 of the base material 20.

The reinforcing member 30 shown in FIGS. 1 and 2 is provided inside the base material 20 and is not exposed to the outside. When the base material 20 is viewed along the normal direction of the first surface 21, the reinforcing member 30 that overlaps with the electronic component 51 on the first surface 21 side is a midpoint between the first surface 21 and the second surface 22. The reinforcing member 30 which is on the first surface 21 side and overlaps with the electronic component 51 on the second surface 22 side when the base material 20 is viewed along the normal direction of the first surface 21 is the first surface 21. It is on the second surface 22 side with respect to the midpoint between the second surface 22 and the second surface 22. However, the position of the reinforcing member 30 is not particularly limited. Further, the reinforcing member 30 has a rectangular shape in a plan view, and when the base material 20 is viewed along the normal direction of the first surface 21, the orientation of the reinforcing member 30 and the rectangular electronic component 51 in a plan view. And the reinforcing member 30 protrudes from the entire circumference of the electronic component 51 to include the entire electronic component 51. However, the shape of the reinforcing member 30 is not particularly limited, and when the base material 20 is viewed along the normal direction of the first surface 21, a part of the electronic component 51 protrudes from the reinforcing member 30. You may be.

As shown in FIG. 3A, in this example, the electronic component 51 and the reinforcing member 30 are provided on the base material 20 at positions deviated from the bellows-shaped portion 57 of the wiring 52 in the first direction D1. As will be described later, when the electronic component 51 and the reinforcing member 30 are provided in a state where the base material 20 is stretched by applying tension, the first surface 21 and the second surface of the base material 20 after the tension is removed. At the portion of the wiring 52 where the electronic component 51 and the reinforcing member 30 are located, the peaks 71, 81 and the peaks 71, 81 as shown in FIG. 3B, which have a larger period and a smaller amplitude than the peaks and valleys of the bellows-shaped portion 57, Valleys 72 and 82 may be formed. That is, peaks and valleys may be formed in both the portion of the base material 20 where the wiring 52 is located and the region where the electronic component 51 and the reinforcing member 30 are located. Such peaks 71, 81 and valleys 72, 82 tend to have a gradually larger period and a smaller amplitude as they approach the electronic component 51. When the electronic component 51 and the reinforcing member 30 are provided in a state where the base material 20 is stretched by applying tension, the electronic component 51 and the reinforcing member 30 on the first surface 21 of the base material 20 and the wiring 52 are positioned. In some cases, peaks and valleys may not be formed in the portion to be formed.

The reinforcing member 30 may have an elastic modulus larger than the first elastic modulus of the base material 20. The elastic modulus of the reinforcing member 30 is, for example, 0.1 GPa or more and 500 GPa or less, and more preferably 0.1 GPa or more and 100 GPa or less. By providing such a reinforcing member 30 on the base material 20, it is possible to prevent the portion of the base material 20 that overlaps with the reinforcing member 30 from expanding and contracting. As a result, the base material 20 can be divided into a portion where expansion and contraction is likely to occur and a portion where expansion and contraction is unlikely to occur. If the elastic modulus of the reinforcing member 30 is too low, it may be difficult to control expansion and contraction. Further, if the elastic modulus of the reinforcing member 30 is too high, the reinforcing member 30 may be damaged in structure such as cracks and cracks when the base material 20 expands and contracts. The elastic modulus of the reinforcing member 30 may be 1.1 times or more and 1,000,000 times or less of the first elastic modulus of the base material 20, and more preferably 100,000 times or less. In the following description, the elastic modulus of the reinforcing member 30 is also referred to as a second elastic modulus. In addition, "overlapping" means that the two components overlap when viewed along the normal direction of the first surface 21 of the base material 20.

The method for calculating the second elastic modulus of the reinforcing member 30 is appropriately determined according to the form of the reinforcing member 30. For example, the method of calculating the second elastic modulus of the reinforcing member 30 may be the same as or different from the method of calculating the elastic modulus of the base material 20 described above. The elastic modulus of the support substrate 40 described later is also the same. For example, as a method for calculating the elastic modulus of the reinforcing member 30 or the supporting substrate 40, a method of performing a tensile test in accordance with ASTM D882 using a sample of the reinforcing member 30 or the supporting substrate 40 can be adopted. ..

When the second elastic modulus of the reinforcing member 30 is larger than the first elastic modulus of the base material 20, a metal material can be used as the material constituting the reinforcing member 30. Examples of metal materials include copper, aluminum, stainless steel and the like. Further, a solder material may be used as the metal material. Further, as a material constituting the reinforcing member 30, a general thermoplastic elastomer, an acrylic-based, urethane-based, epoxy-based, polyester-based, epoxy-based, vinyl ether-based, polyene-thiol-based or silicone-based oligomer, polymer, etc. May be used. When the material constituting the reinforcing member 30 is these resins, the reinforcing member 30 may have transparency. Further, the reinforcing member 30 may have a light-shielding property, for example, a property of shielding ultraviolet rays. For example, the reinforcing member 30 may be black. Further, the color of the reinforcing member 30 and the color of the base material 20 may be the same. In the present embodiment, the thickness of the reinforcing member 30 is, for example, 1 μm or more and 100 μm or less, but is not particularly limited.

Alternatively, the second elastic modulus of the reinforcing member 30 may be equal to or less than the first elastic modulus of the base material 20. The second elastic modulus of the reinforcing member 30 is, for example, 10 MPa or less, and may be 1 MPa or less. The second elastic modulus of the reinforcing member 30 may be 1 times or less, or 0.8 times or less, the first elastic modulus of the base material 20.

When the second elastic coefficient of the reinforcing member 30 is equal to or less than the first elastic coefficient of the base material 20, general thermoplastic elastomers and thermosetting elastomers can be used as the material constituting the reinforcing member 30, for example. , Styrene-based elastomer, acrylic-based elastomer, olefin-based elastomer, urethane-based elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, and polychloroprene. In this case, the thickness of the reinforcing member 30 is, for example, 1 μm or more and 100 μm or less in the present embodiment, but is not particularly limited.

The elastic modulus of each of the plurality of reinforcing members 30 in this example may be different or the same.

The characteristic of the reinforcing member 30 may be expressed by flexural rigidity instead of the elastic modulus. The moment of inertia of area of the reinforcing member 30 is calculated based on the cross section when the reinforcing member 30 is cut by a plane orthogonal to the expansion / contraction direction of the wiring board 10. The bending rigidity of the reinforcing member 30 may be 1.1 times or more, more preferably 2 times or more, and further preferably 10 times or more the bending rigidity of the base material 20.

Alternatively, the bending rigidity of the reinforcing member 30 may be less than or equal to the bending rigidity of the base material 20. For example, the bending rigidity of the reinforcing member 30 may be 1 time or less or 0.8 times or less the bending rigidity of the base material 20.

The method of forming the reinforcing member 30 is not particularly limited. When the reinforcing member 30 is provided inside the base material 20 as in the present embodiment, for example, the reinforcing member 30 may be provided in the middle of the process of forming the layers constituting the base material 20 in multiple layers.

(Manufacturing method of wiring board)
Hereinafter, a method of manufacturing the wiring board 10 will be described with reference to FIGS. 4A to 4E.

First, as shown in FIG. 4A, a base material preparation step for preparing the base material 20 having elasticity is carried out. The base material 20 is provided at a position where the two reinforcing members 30 do not overlap each other.

Subsequently, as shown in FIG. 4B, an extension step of applying tensile stress T to the base material 20 to extend the base material 20 is carried out.

Subsequently, as shown in FIG. 4C, a step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 stretched by the tensile stress T is carried out. Further, as shown in FIG. 4D, a step of providing the electronic component 51 and the wiring 52 on the second surface 22 of the base material 20 stretched by the tensile stress T is carried out.

Then, as shown in FIG. 4E, a shrinkage step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 4E, the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed.

In the wiring board 10 described above, when the base material 20 is viewed along the normal direction of the first surface 21 of the base material 20, the reinforcing member 30 is on the first surface 21 side and the second surface of the base material 20. It overlaps with the electronic component 51 provided on the 22 side. This makes it possible to provide a plurality of electronic components 51 while suppressing the size of the base material 20. Further, by providing the reinforcing member 30 that overlaps with the electronic component 51 when the base material 20 is viewed along the normal direction of the first surface 21 of the base material 20, when the base material 20 expands and contracts, the electrons in the wiring 52 Stress is less likely to occur in the portion close to the component 51, and disconnection between the wiring 52 and the electronic component 51 is effectively suppressed. Therefore, it is possible to provide the electronic component 51 as a plurality of functional components connected to the wiring 52 at a high density to reduce the size, and to improve the reliability of the electrical connection between the electronic component 51 and the wiring 52. Can be improved.

Applications of such a wiring board 10 include healthcare field, medical field, nursing care field, electronics field, sports / fitness field, beauty field, mobility field, livestock / pet field, amusement field, fashion / apparel field, and security field. , Military field, distribution field, education field, building materials / furniture / decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc. For example, a product to be attached to a part of the body such as a human arm is configured by using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be stretched, for example, by attaching the wiring board 10 to the body in an stretched state, the wiring board 10 can be brought into close contact with a part of the body. Therefore, a good wearing feeling can be realized. Further, since it is possible to suppress a decrease in the resistance value of the wiring 52 when the wiring board 10 is stretched, it is possible to realize good electrical characteristics of the wiring board 10. In addition, since the wiring board 10 can be extended, it can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a human being. Examples of these products include vital sensors, masks, hearing aids, toothbrushes, plasters, wet cloths, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, chemical packs, bandages, disposable bioelectrodes, diapers, rehabilitation equipment, home appliances. , Display, signage, personal computer, mobile phone, mouse, speaker sportswear, wristband, earmuffs, gloves, swimwear, supporters, balls, gloves, rackets, clubs, bats, fishing rods, relay batons and jewelry, and their Grips, physical training equipment, floats, tents, swimwear, bibs, goal nets, goal tapes, chemical penetration beauty masks, electrical stimulation diet supplies, pocket furnaces, claws, tattoos, automobiles, airplanes, trains, ships, bicycles, strollers , Drones, wheelchairs, etc. seats, instrument panels, tires, interior, exterior saddles, handles, roads, rails, bridges, tunnels, gas and water pipes, wires, tetrapods, ropes, collars, leads, harnesses, for animals Tags, bracelets, belts, game equipment, haptics devices such as controllers, luncheon mats, tickets, dolls, stuffed animals, cheering goods, hats, clothes, glasses, shoes, insoles, socks, stockings, slippers, innerwear, mufflers, Earmuffs, bags, accessories, rings, watches, ties, personal ID recognition devices, helmets, packages, IC tags, PET bottles, stationery, books, pens, carpets, sofas, bedding, lighting, door knobs, handrails, vases, beds, Examples include mattresses, cushions, curtains, doors, windows, ceilings, walls, floors, wireless power antennas, batteries, vinyl houses, nets, robot hands, and robot exteriors.

It is possible to make various changes to the above-described embodiment. Hereinafter, a modified example will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same codes as those used for the corresponding parts in the above-described embodiment are used for the parts that can be configured in the same manner as in the above-described embodiment, and are duplicated. The explanation is omitted. Further, when it is clear that the action and effect obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

(Modification example of wiring board)
Hereinafter, some modifications of the wiring board 10 will be described with reference to FIGS. 5A to 15.

[First modification]
In the modified example shown in FIG. 5A, when one reinforcing member 30 provided inside the base material 20 looks at the base material 20 along the normal direction of the first surface 21, the electrons on the first surface 21 side are seen. It overlaps with the component 51 and also overlaps with the electronic component 51 on the second surface 22 side. In the example shown in FIG. 5A, the electronic component 51 on the first surface 21 side and the electronic component 51 on the second surface 22 side are arranged at the same position in the first direction D1. However, the electronic component 51 on the first surface 21 side and the electronic component 51 on the second surface 22 side may be arranged so as to be displaced in the first direction D1.

[Second modification]
In the modified example shown in FIG. 5B, the wiring board 10 is provided between the wiring 52 and the base material 20, and the support board 40 extending in parallel with the base material 20 is provided on the first surface 21 side and the second base material 20. It is provided on both sides of the surface 22. Further, the support board 40 is provided with the wiring 52 and the electronic component 51. That is, the wiring 52 and the electronic component 51 are supported on the support substrate 40. The wiring board 10 shown in FIG. 5B is formed by joining a support board 40 on which a wiring 52 and an electronic component 51 are mounted to a base material 20 in an elongated state. Further, the wiring board 10 shown in FIG. 5B includes the support substrate 40 on both the first surface 21 side and the second surface 22 side of the substrate 20, but the support substrate 40 may be provided on only one of them. ..

The support substrate 40 is a plate-shaped member configured to have lower elasticity than the substrate 20. The support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42. In the example shown in FIG. 5B, the support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side thereof, respectively. Further, the support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side thereof. For example, an adhesive layer containing an adhesive may be provided between the base material 20 and the support substrate 40. In this case, as the material constituting the adhesive layer, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer is, for example, 5 μm or more and 200 μm or less. Further, although not shown, the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by a method in which the non-adhesive surface is molecularly modified and molecularly bonded. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40.

Further, in the present modification, tension is applied to the base material 20 to extend the base material 20, and the support substrate 40 supporting the electronic component 51 and the wiring 52 is joined to the base material 20 thus extended. When the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the bellows-shaped portion 57 is formed on the support substrate 40 and the wiring 52. The characteristics and dimensions of the support substrate 40 are set so that such a bellows-shaped portion 57 can be easily formed. For example, the support substrate 40 has an elastic modulus larger than the first elastic modulus of the substrate 20. In the following description, the elastic modulus of the support substrate 40 is also referred to as a third elastic modulus.

The third elastic modulus of the support substrate 40 is, for example, 100 MPa or more, more preferably 1 GPa or more. Further, the third elastic modulus of the support substrate 40 may be 100 times or more and 100,000 times or less, preferably 1000 times or more and 50,000 times or less of the first elastic modulus of the base material 20. By setting the third elastic modulus of the support substrate 40 in this way, it is possible to prevent the period of the bellows-shaped portion 57 from becoming too small. In addition, it is possible to suppress the occurrence of local bending in the bellows-shaped portion 57.
If the elastic modulus of the support substrate 40 is too low, the support substrate 40 is likely to be deformed during the process of forming the reinforcing member 30, and as a result, it becomes difficult to align the reinforcing member 30 with respect to the electronic component 51 and the wiring 52. Further, if the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 at the time of relaxation, and the base material 20 is likely to be cracked or broken.

The thickness of the support substrate 40 is, for example, 500 nm or more and 10 μm or less, more preferably 1 μm or more and 5 μm or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming a member on the support substrate 40. If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 at the time of relaxation, and the target base material 20 cannot be expanded or contracted.

As the material constituting the support substrate 40, for example, polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, acrylic resin and the like can be used. Among them, polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.

The third elastic modulus of the support substrate 40 may be 100 times or less of the first elastic modulus of the base material 20. The method of calculating the third elastic modulus of the support substrate 40 is the same as that of the base material 20.

[Third modification example]
In the modified example shown in FIG. 5C, the base material 20 is provided with the conductor reinforcing member 32, which is a member different from the reinforcing member 30. In this example, the conductor reinforcing member 32 is provided inside the base material 20, but it may be provided on the first surface 21 or the second surface 22 of the base material 20. The material constituting the conductor reinforcing member 32 may be the same as the material constituting the reinforcing member 30, or may be different.

Further, a through hole 33 is provided which penetrates from the first surface 21 to the second surface 22 of the base material 20 and also penetrates the conductor reinforcing member 32, and the conductor 34 located in the through hole 33 is provided. .. Then, the conductor 34 connects the wiring 52 on the first surface 21 side and the wiring 52 on the second surface 22 side of the base material 20. The material of the conductor 34 may or may not be stretchable by itself. The conductor 34 may be formed of the same material as the material capable of forming the wiring 52, or a different material may be used.
In this example, two conductor reinforcing members 32 are provided for one through hole 33, but at least one or more conductor reinforcing members 32 may be provided for the through hole 33. FIG. 5D shows an example in which one conductor reinforcing member 32 is provided for one through hole 33.

In the modified example shown in FIG. 5C, the stress that may occur in the through hole 33 and the conductor 34 inside the through hole 33 due to the expansion and contraction of the base material 20 is suppressed, so that a good electrical connection of the conductor 34 can be ensured.

[Fourth modification]
In the modified example shown in FIG. 6, the wiring board 10 includes a first wiring layer 201, a second wiring layer 202, and an adhesive layer 203 for adhering the first wiring layer 201 and the second wiring layer 202. The first wiring layer 201 includes a second surface 212 located on the opposite side of the first surface 211 and the first surface 211, and is located on the first surface 211 side with the elastic first base material 210 and the electrons. It has a first-side wiring 521 that is electrically connected to the component 51, and one or a plurality of first-side reinforcing members 301 that are provided on the first base material 210 and reinforce the first base material 210. The second wiring layer 202 includes a second surface 222 located on the opposite side of the first surface 221 and the first surface 221 and has an elastic second base material 220 and a second surface 222 of the second base material 220. A second side wiring 522 that is located on the side and electrically connected to the electronic component 51, and one or more second side reinforcing members 302 that are provided on the second base material 220 and reinforce the second base material 220. Have.

The first wiring layer 201 and the second wiring layer 202 are bonded to each other by the adhesive layer 203 in a state where the second surface 212 of the first base material 210 and the first surface 221 of the second base material 220 face each other. .. Then, when the bonded first wiring layer 201 and the second wiring layer 202 are viewed along the normal direction of the first surface 211 of the first base material 210, the first side reinforcing member 301 is the first base material. It overlaps with the electronic component 51 provided on the first surface 211 side of 210, and the second side reinforcing member 302 overlaps with the electronic component 51 provided on the second surface 212 side of the second base material 220.

As the material constituting the adhesive layer 203, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer 203 is, for example, 5 μm or more and 200 μm or less. Further, the second surface 212 of the first base material 210 and the first surface 221 of the second base material 220 are activated by ultraviolet irradiation, EB (electron beam) irradiation, or the like, and then bonded to each other to form a molecular adhesive bond. A method of causing it to be used can also be used. In this case, the adhesive layer may not be provided between the second surface 212 of the first base material 210 and the first surface 221 of the second base material 220.

In this example, although not shown, the first side wiring 521 has a bellows-shaped portion similar to the bellows-shaped portion 57 shown in FIG. 3A, and a plurality of mountain portions arranged in the extending direction of the first side wiring 521. Etc. are included. The second side wiring 522 also has a bellows-shaped portion similar to the bellows-shaped portion 57 shown in FIG. 3A, and includes a plurality of mountain portions and the like arranged in the direction in which the second side wiring 522 extends. Further, corresponding to the shapes of the first side wiring 521 and the second side wiring 522, the first base material 210 includes a plurality of mountain portions arranged in the direction in which the first side wiring 521 extends, and is a second unit. The material 220 includes a plurality of peaks arranged in the direction in which the second side wiring 522 extends.

Hereinafter, the method for manufacturing the wiring board 10 shown in FIG. 6 will be described with reference to FIGS. 7 (a) to 7 (e).

First, as shown in FIG. 7A, a base material preparation step for preparing the first base material 210 and the second base material 220 having elasticity is carried out. The first base material 210 is provided with the first side reinforcing member 301, and the second base material 220 is provided with the second side reinforcing member 302.

Subsequently, as shown in FIG. 7B, an elongation step of applying a tensile stress T to the first base material 210 to extend the first base material 210 is carried out.

Subsequently, as shown in FIG. 7C, a step of providing the electronic component 51 and the first side wiring 521 on the first surface 211 of the first base material 210 in a state of being stretched by the tensile stress T is carried out, and the first step is carried out. 1 Wiring layer 201 is formed. Further, although not shown, a step of providing the electronic component 51 and the second side wiring 522 on the second surface 222 of the second base material 220 in a state of being stretched by the tensile stress T is also carried out, and the second wiring layer 202 is formed. Will be done.

Subsequently, as shown in FIG. 7D, a shrinkage step of removing the tensile stress T from the first base material 210 and the second base material 220 is carried out. As a result, as shown by an arrow C in FIG. 7 (e), the first base material 210 and the second base material 220 contract, and the first side wiring 521 and the second base material provided on the first base material 210 contract. The second side wiring 522 provided on the material 220 is also deformed. After that, the first wiring layer 201 and the second wiring layer 202 are bonded together with the second surface 212 of the first base material 210 and the first surface 221 of the second base material 220 facing each other.

In this example, by providing the adhesive constituting the adhesive layer 203 between the first wiring layer 201 and the second wiring layer 202, as shown in FIG. 7 (e), the first wiring layer 201 and the first wiring layer 201 and the second wiring layer 202 are provided. The two wiring layers 202 are bonded to each other via the adhesive layer 203. Here, when the bonded first wiring layer 201 and the second wiring layer 202 are viewed along the normal direction of the first surface 211 of the first base material 210, the first side reinforcing member 301 is the first unit. The second side reinforcing member 302 overlaps with the electronic component 51 provided on the first surface 211 side of the material 210, and the second side reinforcing member 302 overlaps with the electronic component 51 provided on the first surface 221 side of the second base material 220.

In the manufacturing method shown in FIG. 7, the first wiring layer 201 and the second wiring layer 202 are bonded together after the tensile stress T is removed from the first base material 210 and the second base material 220. The first wiring layer 201 and the second wiring layer 202 are laminated together with the first base material 210 and the second base material 220 stretched without removing the tensile stress T from the base material 210 and the second base material 220. May be good.

[Fifth variant]
In the modified example shown in FIG. 8, the wiring board 10 adheres the first wiring layer 201, the second wiring layer 202, and the first wiring layer 201 and the second wiring layer 202, as in the example shown in FIG. The adhesive layer 203 is provided. On the other hand, a support substrate 40 extending in parallel with the first base material 210 is provided between the first side wiring 521 of the first wiring layer 201 and the first base material 210, and the second side of the second wiring layer 202 is provided. A support substrate 40 extending parallel to the second substrate 220 is provided between the wiring 522 and the first substrate 210. Further, the support substrate 40 between the first side wiring 521 and the first base material 210 is provided with the first side wiring 521 and the electronic component 51, and the second side wiring 522 and the first base material 210 The support board 40 between them is provided with a second side wiring 522 and an electronic component 51.

The support substrate 40 may be attached to the stretched base material 20 in a state of supporting the wiring and the electronic component. The bonding mode and material of the support substrate 40 are the same as those of the support substrate 40 shown in FIG. 5B.

[6th modification]
In the modified example shown in FIG. 9, the wiring board 10 adheres the first wiring layer 201, the second wiring layer 202, and the first wiring layer 201 and the second wiring layer 202, as in the example shown in FIG. The adhesive layer 203 is provided. Then, in the first wiring layer 201, the first side wiring 521 and the electronic component 51 are provided on the first surface 211 side of the first base material 210, and in the second wiring layer 202, the second base material 220 is provided. The second side wiring 522 and the electronic component 51 are provided on the one side 221 side. Here, the second side wiring 522 and the electronic component 51 provided on the first surface 221 side of the second base material 220 are covered with the adhesive layer 203.

The thickness of the adhesive layer 203 may be as long as it can cover the electronic component 51, and may be, for example, 1 mm or more and 5 mm or less.

[7th modification]
In the modified example shown in FIG. 10, the wiring board 10 includes a conductor reinforcing member 32, a through hole 33, and a conductor 34 in addition to the configuration provided in the example shown in FIG.

The conductor reinforcing member 32 is provided inside the first base material 210 and inside the second base material 220. The two conductor reinforcing members 32 are provided so as to overlap each other in the normal direction of the first surface 211 of the first base material 210. The material constituting the conductor reinforcing member 32 may be the same as the material constituting the reinforcing member 30, or may be different.

The through hole 33 penetrates from the first surface 211 of the first base material 210 to the adhesive layer 203 and also penetrates the conductor reinforcing member 32 inside the first base material 210, and conducts the inside of the second base material 220. It reaches the surface of the body reinforcing member 32. In this example, the through hole 33 does not penetrate the conductor reinforcing member 32 inside the second base material 220, but it may penetrate. The conductor 34 is provided in the through hole 33, and the first side wiring 521 on the first surface 211 side of the first base material 210 and the second side on the first surface 221 side of the second base material 220. It is electrically connected to the wiring 522.

[8th modification]
In the modified example shown in FIG. 11A, the wiring board 10 includes the first wiring layer 201 and the second wiring layer 202, as in the example shown in FIG. 6, but does not include the adhesive layer 203, and the rivet 240 is used for the first wiring substrate 10. The first wiring layer 201 and the second wiring layer 202 are bonded together. Further, as shown in FIG. 11B, an adhesive layer 203 may be further provided between the first wiring layer 201 and the second wiring layer 202, and the wiring layers may be bonded to each other by the rivet 240 and the adhesive layer.

Further, the same conductor reinforcing member 32 as in the example of FIG. 10 is provided inside the first base material 210 and inside the second base material 220. The two conductor reinforcing members 32 are provided so as to overlap each other in the normal direction of the first surface 211 of the first base material 210.

The rivet 240 has a first flange portion 241 located on the first surface 211 side of the first base material 210, a second flange portion 242 located on the second surface 222 side of the second base material 220, and a first one. Through holes 330 that penetrate from the first surface 211 of the first base material 210 of the wiring layer 201 to the second surface 222 of the second base material 220 of the second wiring layer 202 and penetrate the two conductor reinforcing members 32. It has a shaft portion 243 provided inside. The rivet 240 is a conductor, is made of a conductive metal material, and has a first side wiring 521 on the first surface 211 side of the first base material 210 and a second side wiring 521 on the second surface 222 side of the second base material 220. It is electrically connected to the two-side wiring 522.
When the rivet 240 is provided, the rigidity of the rivet 240 makes it difficult for the portions around the through hole 330 in the first base material 210 and the second base material 220 to be deformed. Therefore, if a sufficient stress relaxation effect can be obtained by the rivet 240, the conductor reinforcing member 32 may not be provided.

In this example, the shaft portion 243 of the rivet 240 has a solid columnar shape, but a so-called electric eyelet having such a penetrating portion hollow may be used instead of the rivet 240.

[9th modification]
In the modified example shown in FIG. 12, the wiring board 10 adheres the first wiring layer 201, the second wiring layer 202, and the first wiring layer 201 and the second wiring layer 202, as in the example shown in FIG. The adhesive layer 203 is provided. In the first wiring layer 201, the first side wiring 521 and the electronic component 51 are provided on the first surface 211 side of the first base material 210, and in the second wiring layer 202, the first side wiring 521 and the electronic component 51 are provided. The second side wiring 522 and the electronic component 51 are provided on the first surface 221 side of the two base materials 220.

On the other hand, a part of the second side wiring 522 on the first surface 221 side of the second base material 220 is covered with the adhesive layer 203, and the other part is not covered with the adhesive layer 203. Further, the electronic component 51 on the first surface 221 side of the second base material 220 is also not covered with the adhesive layer 203.

[10th modification]
In the modified example shown in FIG. 13, the wiring board 10 includes the first wiring layer 201 and the second wiring layer 202 as in the example shown in FIG. 6, but does not include the adhesive layer 203, and the pair of magnets 250. The first wiring layer 201 and the second wiring layer 202 are bonded to each other. Specifically, the first side wiring 521 and the electronic component 51 are not provided on the second surface 212 side of the first base material 210, and the second side wiring 522 and the electronic component 51 are provided on the first surface 221 side of the second base material 220. Is not provided, and the second surface 212 of the first base material 210 and the first surface 221 of the second base material 220 are connected by the magnet 250, so that the first wiring layer 201 and the second wiring layer 202 are formed. It is pasted together.

One of the magnets 250 of the pair of magnets 250 is embedded in the first base material 210 so that the surface facing the second base material 220 side is flush with the second surface 212 of the first base material 210. There is. The other magnet 250 of the pair of magnets 250 is embedded in the second base material 220 so that the surface facing the first base material 210 side is flush with the first surface 221 of the second base material 220. There is.

Further, the same conductor reinforcing member 32 as in the example of FIG. 10 is provided inside the first base material 210 and inside the second base material 220. The conductor reinforcing member 32 inside the first base material 210 is located on the first surface 211 side of the first base material 210 with respect to the magnet 250 provided on the first base material 210, and is the method of the first surface 211. It overlaps the magnet 250 in the linear direction. The conductor reinforcing member 32 inside the second base material 220 is located on the second surface 222 side of the second base material 220 with respect to the magnet 250 provided on the second base material 220, and is the method of the second surface 222. It overlaps the magnet 250 in the linear direction.

Further, the first base material 210 penetrates from the first surface 211 to the portion of the second surface 212 where the magnet 250 is located, and also penetrates the conductor reinforcing member 32 inside the first base material 210. The first side through hole 331 is provided. In the first side through hole 331, a first side conductor 341 that is electrically connected to the first side wiring 521 and is in contact with the magnet 250 is provided. Further, the second base material 220 penetrates from the second surface 222 to the portion of the first surface 221 where the magnet 250 is located, and also penetrates the conductor reinforcing member 32 inside the second base material 220. A second side through hole 332 is provided. A second side conductor 342 that is electrically connected to the second side wiring 522 and is in contact with the magnet 250 is provided in the second side through hole 332.

Here, the surface of each magnet 250 is coated with a conductive material. As a result, in this example, the first side wiring 521 and the second side wiring 522 are electrically connected via the first side conductor 341, the pair of magnets 250, and the second side conductor 342.

The first wiring layer 201 and the second wiring layer 202 may be bonded to each other by using a button or the like that is coupled by snap-fitting instead of the magnet 250. Since such a member such as a button also has conductivity, the first side wiring 521 and the second side wiring 522 can be electrically connected.
Further, when the magnet 250 or the button is provided, the rigidity of the magnet 250 or the button makes it difficult for the portion around the through hole 330 in the first base material 210 and the second base material 220 to be deformed. Therefore, if a sufficient stress relaxation effect can be obtained by the magnet 250 or the button, the conductor reinforcing member 32 may not be provided.

[11th and 12th modified examples]
For example, in the wiring board 10 shown in FIG. 2, the reinforcing member 30 is provided inside the base material 20. Unlike this aspect, in the wiring board 10 according to the modified example shown in FIGS. 14 and 15, the reinforcing member 30 is exposed to the outside of the base material 20. The positions of the reinforcing members 30, 301, 302 may be inside the base material, or may be partially exposed to the outside of the base material.

(Other modified examples of wiring boards)
In the above-described embodiment and each modification, an example is shown in which the wiring board 10 includes an electronic component 51 mounted on the first surface 21 side of the base material 20. However, the present invention is not limited to this, and the wiring board 10 may not include the electronic component 51. For example, the bellows-shaped portion 57 may be formed on the base material 20 in which the electronic component 51 is not mounted. Further, the support substrate 40 in which the electronic component 51 is not mounted may be bonded to the base material 20. Further, the wiring board 10 may be shipped in a state where the electronic component 51 is not mounted.

Although some modifications to the above-described embodiments have been described, it is naturally possible to apply a plurality of modifications in combination as appropriate. Further, in the above-described embodiment and modification, the configuration in which the base material 20 and the wiring 52 have the bellows-shaped portion 57 so as to be expandable and contractible has been described. However, the arrangement configuration of the electronic component 51 and the reinforcing member 30 as described above include an elastic substrate in which elastic silver wiring is provided on an elastic base material having no bellows shape, and a base material having elasticity. It may also be applied to an elastic substrate having horseshoe-shaped wiring formed therein.
An elastic substrate in which elastic silver wiring is provided on an elastic base material having no bellows shape and an elastic substrate in which horseshoe-shaped wiring is formed on an elastic base material are, for example, stretchable at all. It may be produced by forming an elastic silver wiring or a horseshoe-shaped wiring on a base material that is not allowed to be allowed to be allowed to be provided, and then providing an electronic component 51 and a reinforcing member 30, but the manufacturing method thereof is not particularly limited.

Further, in the above-described embodiment, the example in which the wiring 52 extends parallel to the first direction D1 is shown, but the wiring 52 extends parallel to the first direction D1 and extends in a direction intersecting the first direction D1. Things may be included. At this time, a bellows-shaped portion may be formed on the wiring 52 extending in the direction intersecting the first direction D1. As an example, such a wiring board may be formed by extending the base material 20 in the biaxial direction in the direction intersecting the first direction D1 and forming the wiring 52 or the like in this state.

Further, in the examples shown in FIGS. 3A and 3B, the wiring 52 on the first surface 21 side and the wiring 52 on the second surface 22 side of the base material 20 each have a bellows-shaped portion 57, but the first surface. The bellows-shaped portion 57 of the wiring 52 on the 21 side and the bellows-shaped portion 57 of the wiring 52 on the second surface 22 side may be different from each other in terms of at least one of period, amplitude, and phase. In this case, even in the bellows-shaped portion on the base material 20 and the support substrate 40, at least one of the period, the amplitude, and the phase is different between the first surface 21 side and the second surface 22 side. FIG. 16 shows an example in which the bellows-shaped portion 57 of the wiring 52 on the first surface 21 side of the base material 20 and the bellows-shaped portion 57 of the wiring 52 on the second surface 22 side are different in any of the period, amplitude, and phase. It is shown. Further, also in the wiring board 10 including the first wiring layer 201 and the second wiring layer 202 shown in FIGS. 6, 8, 9, 10, 11, 11A, 11B, 12, and 13, the first wiring board 10 is also provided. The bellows-shaped portion of the side wiring 521 and the bellows-shaped portion of the second side wiring 522 may be different from each other with respect to at least one of the period, the amplitude, and the phase.

Examples of the present disclosure will be described below.

<Example 1>
In the first embodiment, as the wiring board 10, the wiring 52 is arranged on both sides of the base material 20 via the support board 40 as shown in FIG. 5B, and the reinforcing member 30 is further embedded in the base material 20 to be further reinforced. A member provided with a conductor reinforcing member 32 as shown in FIG. 5C, which is a member different from the member 30, was produced. Hereinafter, the manufacturing method of the wiring board 10 according to the first embodiment and each part constituting the wiring board 10 will be described.

(Wiring preparation process)
First, a PEN (polyethylene naphthalate) film having a thickness of 1 μm was prepared as a support substrate 40 for the wiring 52 to be installed on the first surface 21 side of the base material 20. Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by a thin-film deposition method. Subsequently, the copper layer was patterned using a photolithography method and an etching method to form the wiring 52. The wiring 52 was patterned to have a line width of 200 μm, and further, a part of the wiring 52 was patterned so as to be an electrode pair spaced at a distance of 500 μm. In addition, the elastic modulus of the support substrate 40 was measured by a tensile test based on ASTM D882. As a result, the elastic modulus of the support substrate 40 was 2.2 Gpa. Next, an LED chip having a size of 1.0 × 0.5 mm was mounted on the electrode pair using a conductive adhesive.

Next, a PEN film having a thickness of 1 μm was prepared as a support substrate 40 for the wiring 52 to be installed on the second surface 22 side of the base material 20. Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by a thin-film deposition method. Subsequently, the copper layer was patterned using a photolithography method and an etching method to form the wiring 52. The wiring 52 was patterned to have a line width of 200 μm, and further, a part of the wiring 52 was patterned so as to be an electrode pair spaced at a distance of 500 μm. Next, a chip resistor (500Ω) having a size of 1.0 × 0.5 mm was mounted on the electrode pair using a conductive adhesive.

(Preparation process of base material 20)
An adhesive sheet 8146-2 (manufactured by 3M) was prepared as an adhesive layer between the support substrate 40 and the substrate 20. Next, a two-component addition condensation polydimethylsiloxane (hereinafter referred to as PDMS) was applied onto the pressure-sensitive adhesive sheet so as to have a thickness of about 250 μm, and the mixture was cured.
Next, a polyimide film (manufactured by Ukosan Co., Ltd .: UPIREX thickness 125 μm) was installed as the reinforcing member 30 and the reinforcing member 32 for the conductor on the PDMS coated and cured as described above. In FIG. 5C, the reinforcing member 30 and the conductor reinforcing member 32 are arranged at different positions in the thickness direction of the base material 20, but in this embodiment, the reinforcing member 30 and the conductor reinforcing member 32 are arranged. Will be placed in the same position. Then, as the pattern shape of the installed reinforcing member 30 and the reinforcing member 32 for the conductor, those cut with a cutting plotter so as to be 5 mm square were used. Here, the elastic modulus of the polyimide film was measured by a tensile test based on ASTM D882. As a result, the elastic modulus was 7 Gpa.

Next, PDMS was further applied and cured to a thickness of about 250 μm so as to cover the reinforcing member 30 and the conductor reinforcing member 32 installed above.
Next, the same polyimide film as described above was further installed as the reinforcing member 30 and the reinforcing member 32 for the conductor on the PDMS installed so as to cover the reinforcing member 30 and the reinforcing member 32 for the conductor. Here, the reinforcing member 30 arranged in the lower layer (second surface 22 side) and the reinforcing member 30 arranged in the upper layer (first surface 21 side) are arranged at positions that do not overlap in the thickness direction of the base material 20, and further, the lower layer and the reinforcing member 30. The upper conductor reinforcing members 32 were arranged so as to overlap each other.
Next, PDMS was further applied so as to cover the reinforcing member 30 and the conductor reinforcing member 32 arranged above so as to have a thickness of about 250 μm, and after laminating the adhesive sheet 8146-2 on the coated surface, PDMS was applied. It was cured.

(Lasting process)
The base material 20 in which the reinforcing member 30 and the conductor reinforcing member 32 prepared in the preparation step of the base material 20 were embedded was stretched 1.5 times in the uniaxial direction. Next, the chip components (LED chip, chip resistor) obtained in the above wiring preparation step and the support substrate 40 with the wiring 52 were attached to the first surface 21 side and the second surface 22 side of the base material 20. Specifically, the surface on which the components of the support substrate 40 are not mounted and the first surface 21 and the second surface 22 of the base material 20 are bonded to each other via an adhesive surface. After that, the elongation of the base material 20 was released. In the wiring 52 formed in this manner, a bellows-shaped portion is formed on the surface of the wiring 52 except for the region surrounded by the reinforcing member 30 and the reinforcing member 32 for the conductor, and the reinforcing member 30 and the reinforcing member 32 for the conductor 32 are formed. In the region surrounded by, a bellows-shaped portion having a smaller amplitude than that outside the region was generated. Here, the LED chip and the chip resistor are arranged so as to overlap the reinforcing member 30, and the wiring 52 is further arranged so as to overlap the conductor reinforcing member 32.

(Through hole formation and conduction process)
The wiring 52 and the conductor reinforcing member 32 were irradiated with an ultraviolet laser in the thickness direction of the base material 20 to provide a through hole 33 having a diameter of 2 mm with respect to the wiring 52 obtained in the above bonding step. Next, a conductive paste containing a binder resin and silver conductive particles was patterned on the through holes 33 by screen printing to form a conductor 34. Then, the front and back wirings 52 were conductively connected through the conductor 34 to obtain a wiring board 10.

<Example 2>
In the second embodiment, the wiring substrate 10 includes the first wiring layer 201, the second wiring layer 202, and the adhesive layer 203 for adhering the first wiring layer 201 and the second wiring layer 202 as shown in FIG. Was made. Further, a support substrate 40 is provided between the first side wiring 521 and the first base material 210 in the first wiring layer 201, and the second side wiring 522 and the second base material 220 in the second wiring layer 202 A support substrate 40 is provided between them. Hereinafter, the manufacturing method of the wiring board 10 according to the second embodiment and each part constituting the wiring board 10 will be described.

(Wiring preparation process)
First, a PEN film having a thickness of 1 μm was prepared as a support substrate 40 for the first side wiring 521 installed on the first surface 211 side of the first base material 210. Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by a thin-film deposition method. Subsequently, the copper layer was patterned using a photolithography method and an etching method to form the first side wiring 521. The first side wiring 521 was patterned to have a line width of 200 μm, and further, a part of the first side wiring 521 was patterned so as to be an electrode pair at intervals of 500 μm. Next, an LED chip having a size of 1.0 × 0.5 mm was mounted on the electrode pair using a conductive adhesive.

Next, a PEN film having a thickness of 1 μm was prepared as a support substrate 40 for the second side wiring 522 to be installed on the second surface 222 side of the second base material 220. Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by a thin-film deposition method. Subsequently, the copper layer was patterned using a photolithography method and an etching method to form a second side wiring 522. The second side wiring 522 was patterned to a line width of 200 μm, and further, a part of the second side wiring 522 was patterned so as to be an electrode pair spaced at a distance of 500 μm. Next, a chip resistor (500Ω) having a size of 1.0 × 0.5 mm was mounted on the electrode pair using a conductive adhesive.

(Preparation step of base material 210 and base material 220)
An adhesive sheet 8146-2 (manufactured by 3M) was prepared as an adhesive layer between the first base material 210 and the corresponding support substrate 40. Next, PDMS of two-component addition condensation was applied onto the pressure-sensitive adhesive sheet so as to have a thickness of about 250 μm, and cured.
Next, a polyimide film (manufactured by Ukosan Co., Ltd .: Upirex thickness 125 μm) was installed as a reinforcing member 301 on the PDMS coated and cured as described above. As the pattern shape of the installed first side reinforcing member 301, one cut with a cutting plotter so as to be 5 mm square was used.
Next, PDMS was further applied so as to cover the first side reinforcing member 301 installed above so as to have a thickness of about 250 μm, and cured to obtain a first base material 210.
Since the method for producing the second base material 220 is the same as that of the first base material 210 described above, the description thereof will be omitted.

(Lasting process)
The first base material 210 in which the first side reinforcing member 301 prepared in the preparation step of the first base material 210 was embedded was extended 1.5 times in the uniaxial direction. Next, the support substrate 40 with the chip component (LED chip) obtained in the above wiring preparation step was attached to the first surface 211 side of the first base material 210. Specifically, the surface on which the components of the support substrate 40 are not mounted and the first surface 221 of the first base material 210 are bonded to each other via an adhesive surface. Then, the elongation of the first base material 210 was released to obtain the first wiring layer 201. In the first side wiring 521 formed in this way, a bellows-shaped portion is formed on the surface of the first side wiring 521 except for the region surrounded by the first side reinforcing member 301, and the first side wiring 521 is surrounded by the first side reinforcing member 301. A bellows-shaped portion having a smaller amplitude than that outside the region was formed in the damaged region. Here, the LED chip was arranged so as to overlap the first side reinforcing member 301.

Next, the second base material 220 in which the second side reinforcing member 302 prepared in the preparation step of the second base material 220 was buried was stretched 1.5 times in the uniaxial direction. Next, the support substrate 40 with the chip component (chip resistor) obtained in the above wiring preparation step was attached to the second surface 222 side of the second base material 220. Specifically, the surface on which the components of the support substrate 40 are not mounted and the second surface 222 of the second base material 220 are bonded to each other via an adhesive surface. Then, the extension of the second base material 220 was released to obtain the second wiring layer 202. In the second side wiring 522 formed in this manner, a bellows-shaped portion is formed on the surface of the second side wiring 522 except for the region surrounded by the second side reinforcing member 302, and the second side wiring 522 is surrounded by the second side reinforcing member 302. A bellows-shaped portion having a smaller amplitude than that outside the region was formed in the damaged region. Here, the chip resistor is arranged so as to overlap the second side reinforcing member 302.

(Laying process of wiring layer)
A liquid PDMS having the same composition as that of the first base material 210 was bar-coated as an adhesive layer 203 on the side of the first wiring layer 201 prepared above on which the components were not mounted so that the coating film thickness was 30 μm. Next, the side of the second wiring layer 202 on which the components were not mounted was bonded, and the adhesive layer 203 was cured to obtain a wiring board 10.

<Example 3>
The wiring board 10 includes a first wiring layer 201, a second wiring layer 202, and an adhesive layer 203 for adhering the first wiring layer 201 and the second wiring layer 202 as shown in FIG. The second side wiring 522 and the electronic component 51 provided on the first surface 221 side of the base material 220 are covered with the adhesive layer 203, and for a conductor which is a member different from the first side reinforcing members 301 and 302. A product provided with the reinforcing member 32 was produced. In this embodiment, the support substrate 40 as shown in FIG. 8 is provided between the first side wiring 521 in the first wiring layer 201 and the first base material 210, and is provided on the second side in the second wiring layer 202. It is provided between the wiring 522 and the second base material 220. Hereinafter, the manufacturing method of the wiring board 10 and each part constituting the wiring board 10 according to the third embodiment will be described.

(Wiring preparation process)
First, in the same manner as in Example 2, a PEN film having a thickness of 1 μm was prepared as a support substrate 40 for the first side wiring 521 installed on the first surface 211 side of the first base material 210. Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by a thin-film deposition method. Subsequently, the copper layer was patterned using a photolithography method and an etching method to form the first side wiring 521. The first side wiring 521 was patterned to have a line width of 200 μm, and further, a part of the wiring 521 was patterned so as to be an electrode pair spaced at a distance of 500 μm. Next, an LED chip having a size of 1.0 × 0.5 mm was mounted on the electrode pair using a conductive adhesive.

Next, a PEN film having a thickness of 1 μm was prepared as a support substrate 40 for the second side wiring 522 to be installed on the second surface 222 side of the second base material 220. Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by a thin-film deposition method. Subsequently, the copper layer was patterned using a photolithography method and an etching method to form a second side wiring 522. The second side wiring 522 was patterned to a line width of 200 μm, and further, a part of the second side wiring 522 was patterned so as to be an electrode pair spaced at a distance of 500 μm. Next, a chip resistor (500Ω) having a size of 1.0 × 0.5 mm was mounted on the electrode pair using a conductive adhesive.

(Preparation step of base material 210 and base material 220)
An adhesive sheet 8146-2 (manufactured by 3M) was prepared as an adhesive layer between the first base material 210 and the corresponding support substrate 40. Next, PDMS of two-component addition condensation was applied onto the pressure-sensitive adhesive sheet so as to have a thickness of about 250 μm, and cured.
Next, a polyimide film (manufactured by Ukosan Co., Ltd .: UPIREX thickness 125 μm) was installed as the reinforcing member 301 and the reinforcing member 32 for the conductor on the PDMS coated and cured as described above. As the pattern shape of the installed first side reinforcing member 301 and the conductor reinforcing member 32, those cut with a cutting plotter so as to be 5 mm square were used.
Next, PDMS was further applied so as to cover the first side reinforcing member 301 and the conductor reinforcing member 32 installed above so as to have a thickness of about 250 μm, and cured to obtain a first base material 210.
Since the method for producing the second base material 220 is the same as that of the first base material 210 described above, the description thereof will be omitted.

(Lasting process)
The first base material 210 in which the first side reinforcing member 301 and the conductor reinforcing member 32 prepared in the preparation step of the first base material 210 were buried was stretched 1.5 times in the uniaxial direction. Next, the support substrate 40 with the chip parts obtained in the above wiring preparation step is attached to the first surface 211 side of the first substrate 210. Specifically, the surface on which the components of the support substrate 40 are not mounted and the first surface 211 of the first base material 210 are bonded to each other via an adhesive surface. Then, the elongation of the first base material 210 was released to obtain the first wiring layer 201. In the first side wiring 521 formed in this way, a bellows-shaped portion is formed on the surface of the first side wiring 521 except for the region surrounded by the first side reinforcing member 301 and the conductor reinforcing member 32. In the region surrounded by the one-side reinforcing member 301 and the conductor reinforcing member 32, a bellows-shaped portion having a smaller amplitude than that outside the region was generated. Here, the LED chip was arranged so as to overlap the first side reinforcing member 301. Further, the first side wiring 521 is arranged so as to overlap with the conductor reinforcing member 32.

Next, the second base material 220 in which the second side reinforcing member 302 and the conductor reinforcing member 32 prepared in the preparation step of the second base material 220 are embedded is stretched 1.5 times in the uniaxial direction. It was. Next, the support substrate 40 with the chip parts obtained in the above wiring preparation step was attached to the first surface 221 side of the second substrate 220. Specifically, the surface on which the components of the support substrate 40 are not mounted and the first surface 221 of the second base material 220 are bonded to each other via an adhesive surface. Then, the extension of the second base material 220 was released to obtain the second wiring layer 202. In the second side wiring 522 formed in this manner, a bellows-shaped portion is formed on the surface of the second side wiring 522 except for the region surrounded by the second side reinforcing member 302 and the conductor reinforcing member 32. In the region surrounded by the two-side reinforcing member 302 and the conductor reinforcing member 32, a bellows-shaped portion having a smaller amplitude than that outside the region was generated. Here, the chip resistor is arranged so as to overlap the second side reinforcing member 302. Further, the second side wiring 522 is arranged so as to overlap with the conductor reinforcing member 32.

(Laying process of wiring layer)
As the adhesive layer 203 so as to bury the parts on the side where the parts of the second wiring layer 202 prepared above are mounted, a liquid PDMS having the same composition as the first base material 210 is applied to the bar so as to have a coating film thickness of 500 μm. The coat was applied. Next, the side of the first wiring layer 201 on which the parts were not mounted was bonded, and the adhesive layer 203 was cured. Here, the conductor reinforcing member 32 of the first wiring layer 201 and the conductor reinforcing member 32 of the second wiring layer 202 are arranged so as to overlap each other.

(Through hole formation and conduction process)
The first side wiring 521, the second side wiring 522, and the conductor reinforcing member 32 are irradiated with an ultraviolet laser in the thickness direction of the base material 20 with respect to the laminated body obtained in the laminating step of the wiring layer, and have a diameter of 2 mm. A through hole 33 is provided. Next, a conductive paste containing a binder resin and silver conductive particles was patterned on the through holes 33 by screen printing to form a conductor 34. Then, the first side wiring 521 and the second side wiring 522 were conductively connected through the conductor 34 to obtain a wiring board 10.

10 ... Wiring substrate 20 ... Base material 201 ... First wiring layer 202 ... Second wiring layer 203 ... Adhesive layer 21 ... First surface 22 ... Second surface 210 ... First base material 211 ... First surface 212 ... Second surface 220 ... 2nd base material 221 ... 1st surface 222 ... 2nd surface 240 ... Rivets 241 ... 1st flange part 242 ... 2nd flange part 243 ... Shaft part 250 ... Magnets 26A, 26B ... Mountain part 27A, 27B ... Tani part 30 ... Reinforcing member 301 ... First side reinforcing member 302 ... Second side reinforcing member 32 ... Conductor reinforcing member 33, 330 ... Through hole 331 ... First side through hole 332 ... Second side through hole 34 ... Conductor 341 ... 1st side conductor 342 ... 2nd side conductor 40 ... Support substrate 41 ... 1st surface 42 ... 2nd surface 51 ... Electronic parts 52 ... Wiring 521 ... 1st side wiring 522 ... 2nd side wiring 53 ... Yamabe 54 ... Yamabe 55 ... Tanibe 56 ... Tanibe 57 ... Bellows-shaped part

Claims (20)

An elastic substrate including a first surface and a second surface located on the opposite side of the first surface,
Wiring located on the first surface side and the second surface side of the base material and electrically connecting to the functional component,
A reinforcing member provided on the base material and reinforcing the base material is provided.
When the base material is viewed along the normal direction of the first surface of the base material, the reinforcing member overlaps with the functional components provided on the first surface side and the second surface side of the base material. substrate. 1. A support substrate provided between the wiring and the base material and extending in parallel with the base material is further provided on at least one of the first surface side and the second surface side of the base material. The wiring board described in. The wiring board according to claim 2, wherein the functional component is provided on the support board. In the base material, a reinforcing member for a conductor, a through hole penetrating from the first surface to the second surface of the base material and penetrating the reinforcing member for the conductor, and a conductor located in the through hole. Is further provided,
The wiring board according to any one of claims 1 to 3, wherein the conductor connects the wiring on the first surface side of the base material and the wiring on the second surface side of the base material. The wiring board according to any one of claims 1 to 4, wherein the wiring has a bellows-shaped portion including a plurality of peaks and a plurality of valleys alternately arranged in a direction in which the wiring extends. The bellows-shaped portion of the wiring on the first surface side and the bellows-shaped portion of the wiring on the second surface side have a period of a distance between the adjacent peaks, and the peak and the valley. The wiring substrate according to claim 5, wherein at least one of the amplitude, which is the distance in the normal direction of the first surface, and the phase, which is the deviation of the period, is different from each other. The wiring board according to any one of claims 1 to 6, wherein the base material includes a plurality of mountain portions arranged in a direction in which the wiring extends. At least one of a first base material having elasticity and having a first surface and a second surface located on the opposite side of the first surface and the first surface side and the second surface side of the first base material. A first-side wiring that is located in the above and electrically connected to a functional component, and one or a plurality of first-side reinforcing members that are provided on the first base material and reinforce the first base material. 1 wiring layer and
At least one of a second base material having elasticity and having a first surface and a second surface located on the opposite side of the first surface and the first surface side and the second surface side of the second base material. A second side wiring that is located in the above and electrically connected to a functional component, and one or a plurality of second side reinforcing members provided on the second base material and reinforcing the second base material. With 2 wiring layers,
The first wiring layer and the second wiring layer are bonded to each other with the second surface of the first base material and the first surface of the second base material facing each other.
When the laminated first wiring layer and the second wiring layer are viewed along the normal direction of the first surface of the first base material, the first side reinforcing member is the first base material. The second side reinforcing member overlaps with the functional component provided on at least one of the first surface side and the second surface side, and the second side reinforcing member is at least one of the first surface side and the second surface side of the second base material. A wiring board that overlaps with the functional component provided in any of them. A support substrate provided between the first side wiring and the first base material and extending in parallel with the first base material is provided at least on the first surface side and the second surface side of the first base material. The wiring board according to claim 8, further comprising any one. A support substrate provided between the second side wiring and the second base material and extending in parallel with the second base material is provided at least on the first surface side and the second surface side of the second base material. The wiring board according to claim 8 or 9, further comprising any of the above. The first side wiring is provided on the first surface side of the first base material, and the second side wiring is provided on the second surface side of the second base material.
A reinforcing member for a conductor is provided on at least one of the first base material and the second base material.
A through hole is provided which penetrates from the first surface of the first base material to the second surface of the second base material and also penetrates the reinforcing member for the conductor.
A conductor is provided in the through hole,
8 to 8 to claim, wherein the conductor electrically connects the first side wiring on the first surface side of the first base material and the second side wiring on the second surface side of the second base material. The wiring board according to any one of 10. The first side wiring and the functional component are not provided on the second surface side of the first base material, and the second side wiring and the functional component are not provided on the first surface side of the second base material.
The wiring board according to any one of claims 8 to 11, wherein the second surface of the first base material and the first surface of the second base material are bonded to each other by a magnet or a snap fit. The second side wiring and the functional component are provided on at least the first surface side of the second base material.
The first wiring layer and the second wiring layer are bonded to each other via an adhesive layer.
The wiring board according to any one of claims 8 to 10, wherein the second side wiring and the functional component provided on the first surface side of the second base material are covered with the adhesive layer. A reinforcing member for a conductor is provided on the first base material, and a reinforcing member for a conductor is provided.
Through holes are provided that penetrate from the first surface of the first base material to the adhesive layer and also penetrate the reinforcing member for the conductor.
A conductor is provided in the through hole,
13. According to claim 13, the conductor electrically connects the first side wiring on the first surface side of the first base material and the second side wiring on the first surface side of the second base material. The described wiring board. The first side wiring has a bellows-shaped portion including a plurality of peaks and a plurality of valleys arranged in a direction in which the first side wiring extends, and the second side wiring has a direction in which the second side wiring extends. The wiring board according to any one of claims 8 to 14, which has a bellows-shaped portion including a plurality of peak portions and a plurality of valley portions arranged in the same manner. The bellows-shaped portion of the first-side wiring and the bellows-shaped portion of the second-side wiring have a period of a distance between the adjacent peaks, and the first unit between the peak and the valley. The wiring substrate according to claim 15, wherein at least one of the amplitude, which is the distance in the normal direction of the first surface of the material, and the phase, which is the deviation of the period, is different from each other. The first base material includes a plurality of ridges arranged in a direction in which the first side wiring extends, and the second base material includes a plurality of ridges arranged in a direction in which the second side wiring extends. The wiring board according to any one of 8 to 16. It is a method of manufacturing a wiring board.
An extension step in which tension is applied to a base material having elasticity and provided with one or more reinforcing members for reinforcement to extend the base material.
An installation step of providing wiring electrically connected to a functional component on the first surface side and the second surface side of the base material in a state of being stretched by the stretching step.
It comprises a shrinking step of removing the tension from the substrate.
When the base material is viewed along the normal direction of the first surface of the base material after the shrinkage step, the reinforcing member is provided on the first surface side and the second surface side of the base material. A method of manufacturing a wiring board that overlaps with. It is a method of manufacturing a wiring board.
A first stretching step of stretching the first base material by applying tension to the first base material which has elasticity and is provided with one or more first side reinforcing members for reinforcement.
A first-side wiring that electrically connects to a functional component is provided on at least one of the first surface side and the second surface side of the first base material that has been stretched by the first stretching step. A first forming step of forming a first wiring layer having one base material, the first side reinforcing member, and the first side wiring.
A second stretching step of stretching the second base material by applying tension to the second base material which has elasticity and is provided with one or more second side reinforcing members for reinforcement.
A second-side wiring that electrically connects to a functional component is provided on at least one of the first surface side and the second surface side of the second base material in a state of being stretched by the second stretching step. A second forming step of forming a second wiring layer having two base materials, the second side reinforcing member, and the second side wiring, and
After removing the tension from the first base material and the second base material, the first wiring layer is in a state where the second surface of the first base material and the first surface of the second base material face each other. The process of laminating the second wiring layer and the second wiring layer is provided.
When the laminated first wiring layer and the second wiring layer are viewed along the normal direction of the first surface of the first base material, the first side reinforcing member is the first base material. The second side reinforcing member overlaps with the functional component provided on at least one of the first surface side and the second surface side, and the second side reinforcing member is at least one of the first surface side and the second surface side of the second base material. A method for manufacturing a wiring board that overlaps with the functional component provided in any one of them. It is a method of manufacturing a wiring board.
A first stretching step of stretching the first base material by applying tension to the first base material which has elasticity and is provided with one or more first side reinforcing members for reinforcement.
A first-side wiring that electrically connects to a functional component is provided on at least one of the first surface side and the second surface side of the first base material that has been stretched by the first stretching step. A first forming step of forming a first wiring layer having one base material, the first side reinforcing member, and the first side wiring.
A second stretching step of stretching the second base material by applying tension to the second base material which has elasticity and is provided with one or more second side reinforcing members for reinforcement.
A second-side wiring that electrically connects to a functional component is provided on at least one of the first surface side and the second surface side of the second base material in a state of being stretched by the second stretching step. A second forming step of forming a second wiring layer having two base materials, the second side reinforcing member, and the second side wiring, and
The first wiring layer and the first wiring layer are in a state where the second surface of the first base material and the first surface of the second base material face each other while the first base material and the second base material are stretched. The process of laminating the second wiring layer and
A shrinkage step of removing the tension from the first base material and the second base material is provided.
When the bonded first wiring layer and the second wiring layer are viewed along the normal direction of the first surface of the first base material after the shrinkage step, the first side reinforcing member is the first. It overlaps with the functional component provided on at least one of the first surface side and the second surface side of the base material, and the second side reinforcing member is formed on the first surface side and the second surface side of the second base material. A method for manufacturing a wiring board that overlaps with the functional component provided in at least one of them.