JP2020134286A - Electronic component conveyance device, electronic component inspection device, and holding unit set - Google Patents

Abstract

To provide an electronic component conveyance device capable of easily performing replacement work of a contact head when an IC device to be inspected is changed.SOLUTION: An electronic component conveyance device (conveyance device 10) for conveying an electronic component (IC device 90) includes: a movable arm 170; a first holding unit 180 that has first attachment parts 172 and 172b to be attached to the movable arm and holds a first electronic component; and a second holding unit 280 that is separate from the first holding unit, has second attachment parts 272 and 272b to be attached to the movable arm, and holds a second electronic component.SELECTED DRAWING: Figure 4

Description

The present invention relates to an electronic component transfer device, an electronic component inspection device, and a holding unit set.

Conventionally, an IC handler as an electronic component inspection device for inspecting the characteristics of an IC device is known. As described in Patent Document 1, for example, the IC handler is a contact that is a replacement kit including a plurality of holding portions that hold a plurality of IC devices and press the plurality of IC devices against a plurality of sockets. It includes a head and a movable arm for mounting and moving the contact head. The contact head is provided with a grip portion and a plurality of operating portions that are operated by power, and is used by being replaced with a contact head that adapts to changes in the IC device to be inspected. The contact head is sometimes called a socket layout kit or the like.

International Patent Application Laid-Open No. WO15 / 083240

However, in the IC handler described in Patent Document 1, when changing the IC device to be inspected, it is necessary to replace the contact head, which is a replacement kit including a plurality of holding portions, but there are a plurality of contact heads. Since it is provided with a gripping portion and a moving portion, it is heavy and has a problem that it is difficult for the user to perform the replacement work while holding it.

The electronic component transfer device of the present application is an electronic component transfer device that conveys electronic components, and includes a movable arm and a first holding portion that has a first attachment portion to be attached to the movable arm and holds the first electronic component. A second holding portion that is separate from the first holding portion, has a second mounting portion to be attached to the movable arm, and holds a second electronic component.

In the electronic component transfer device described above, the movable arm may include an air flow path connected to the first holding portion and the second holding portion.

In the electronic component transfer device described above, the air flow path may be branched and connected to the first holding portion and the second holding portion.

In the electronic component transfer device described above, the movable arm has a support base material for attaching the first holding portion and the second holding portion, and the air flow path is provided on the support base material. May be good.

In the electronic component transfer device described above, the first holding portion has a first flow path connected to the air flow path, and the second holding portion is a second flow connected to the first flow path. It may have a road.

The electronic component inspection device of the present application includes the electronic component transfer device according to any one of aspects 1 to 5, and an inspection unit that inspects the electronic component transported by the electronic component transfer device. ..

The holding portion set of the present application is a holding portion set that is attached to a movable arm of an electronic component conveying device that conveys electronic components, has a first attachment portion that is attached to the movable arm, and holds the first electronic component. It includes a first holding portion, a second holding portion that is separate from the first holding portion, has a second mounting portion that is attached to the movable arm, and holds a second electronic component.

In the above-mentioned holding portion set, the first holding portion has a first flow path connected to an air flow path provided in the movable arm, and the second holding portion has the first flow path. It may have a second flow path to be connected.

The perspective view which shows the schematic structure of the electronic component inspection apparatus provided with the electronic component transfer apparatus which concerns on this embodiment. The plan view which shows the schematic structure of the electronic component inspection apparatus provided with the electronic component transfer apparatus. The block diagram which shows the schematic structure of the electronic parts inspection apparatus. The front view which shows the schematic structure of the holding part set which concerns on 1st Embodiment. The right side view which shows the schematic structure of the holding part set which concerns on 1st Embodiment. The left side view which shows the schematic structure of the holding part set which concerns on 1st Embodiment. The layout of the air flow path provided in the movable arm. A partially enlarged view showing a mounting portion of the movable arm and the holding portion set. The right side view of FIG. 7A which shows the mounting part. The front view which shows the modification which concerns on the structure of an air flow path. The side view which shows the modification which concerns on the structure of an air flow path. Layout of the air flow path provided on the adapter plate. The front view which shows the schematic structure of the holding part set which concerns on 2nd Embodiment. The side view which shows the schematic structure of the holding part set which concerns on 2nd Embodiment. The front view which shows the schematic structure of the holding part set which concerns on 3rd Embodiment. The side view which shows the schematic structure of the holding part set which concerns on 3rd Embodiment.

Hereinafter, the display method of the electronic component transfer device, the display program of the electronic component transfer device, the electronic component transfer device, and the electronic component inspection device using the electronic component transfer device of the present invention will be described in detail based on the embodiments shown in the attached drawings. explain. It should be noted that the present embodiment described below does not unreasonably limit the content of the present invention described in the claims. Moreover, not all of the configurations described in the present embodiment are essential constituent requirements of the present invention.

1: Configuration of electronic component transfer device and electronic component inspection device First, with reference to FIGS. 1, 2, and 3, the electronic component transfer device according to the embodiment of the present invention and the electronic component transfer device are used. The configuration of the electronic component inspection device that was used will be described. FIG. 1 is a perspective view showing a schematic configuration of an electronic component inspection device including the electronic component transfer device according to the present embodiment. FIG. 2 is a plan view showing a schematic configuration of an electronic component inspection device including an electronic component transfer device. FIG. 3 is a block diagram showing a schematic configuration of an electronic component inspection device.

In FIGS. 1 and 2, for convenience of explanation, three axes orthogonal to each other, the X-axis, the Y-axis, and the Z-axis, are illustrated by arrows, and the tip side of the arrows is "+ (plus)". , The base end side is "-(minus)". Further, in the following, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". Further, in the following, for convenience of explanation, the upper + Z direction side in FIG. 1 is referred to as “upper”, and the lower −Z direction side is referred to as “lower”.

Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. In addition, the upstream side in the transport direction of electronic components may be simply referred to as the "upstream side", and the downstream side may be simply referred to as the "downstream side". Further, the term "horizontal" as used herein is not limited to a perfect horizontal position, and includes a state of being slightly tilted with respect to the horizontal direction (for example, an inclination angle of less than 5 °) unless the transportation of electronic components is hindered.

The inspection device 1 as an electronic component tester shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, and an LCD (Liquid Crystal Display). ), CIS (CMOS Image Sensor) and other devices for inspecting and testing the electrical characteristics of electronic components (hereinafter simply referred to as "test"). In the following, for convenience of explanation, a case where an IC device is used as an electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

The inspection device 1 as an electronic component inspection device includes a transfer device 10 as an electronic component handler that conveys an IC device 90 as an electronic component, an inspection unit 16, a display unit 41, and a sound output unit 45. A notification unit 40 including the above, an operation unit 42, and a control device 30 are provided. Further, the inspection device 1 includes a housing portion 5 including a cover for accommodating the transport device 10, the inspection portion 16, and the like, and a door portion 7 provided in the housing portion 5. The housing portion 5 is composed of a frame, a wall portion, a cover, and the like. Further, the door portion 7 may open and close a part of the housing portion 5, and includes a push-pull door, a slide door, a shutter, and the like that can open and close between the inside and the outside of the cover.

The transport device 10 is equipped with a housing member (not shown) on which the IC device 90 can be placed (Place) and placed (Set). In the following, placing the IC device 90 on it may be referred to as "mounting the IC device 90". The accommodating member has a concave pocket, and the IC device 90 is accommodated and placed in this pocket. The accommodating member is an example of a change kit, for example, a tray 200 used for a supply tray (not shown), a recovery tray 19, an electronic component supply section 14, an electronic component recovery section 18, a temperature control section 12, and the like. And the component holding plate (not shown) used for the rotating stage (not shown) and the like.

Further, the transfer device 10 includes a holding unit set 100 (see FIGS. 4 and 5A and 5B) attached to the measuring robot 17 and the collecting robot 20 described later. The holding unit set 100 attached to the measuring robot 17 has a function of supplying and pressing the IC device 90 to the inspection unit 16. The holding unit set 100 attached to the collection robot 20 has a function of removing and collecting the IC device 90 after inspection from the inspection unit 16. The holding unit set 100 will be described in detail later. The holding unit set 100 may be referred to as a socket layout kit.

Although not shown, the component holding plate and the tray 200 (not shown) have a bottomed recess as a pocket for accommodating the IC device 90. The center position, number, arrangement pitch, contour dimension, depth and the like are set in this recess according to the size and shape of the IC device 90. The component holding plate and the tray 200 are replaced and used corresponding to the electronic components to be inspected.

Further, the transfer device 10 has an image acquisition device 51 as an image pickup unit and an image acquisition unit 50 including a lighting device 52 capable of capturing an image of a housing member such as a component holding plate or a tray 200.

The transport device 10 of the present embodiment is configured by removing the inspection unit 16 and the inspection control unit 312 of the control device 30 described later from the inspection device 1 having the configuration shown in the block diagram of FIG. ..

As shown in FIGS. 1 and 2, the inspection device 1 includes a tray supply area A1, a device supply area A2, an inspection area A3 provided with an inspection unit 16, a device recovery area A4, and a tray removal area A5. It is divided into.

Each of these areas is partitioned by a wall or a shutter (not shown). The device supply area A2 is a first room defined by a wall portion, a shutter, or the like. Further, the inspection area A3 is a second room defined by a wall portion, a shutter, or the like. Further, the device collection area A4 is a third room defined by a wall portion, a shutter, or the like. Further, the first chamber constituting the device supply area A2, the second chamber constituting the inspection region A3, and the third chamber constituting the device recovery region A4 can ensure airtightness and heat insulation, respectively. It is configured in. As a result, the humidity and temperature of the first room, the second room, and the third room can be maintained as much as possible. The first room and the second room are controlled to a predetermined humidity and a predetermined temperature, respectively, and are configured so that inspections can be performed in, for example, a normal temperature environment, a low temperature environment, and a high temperature environment. ..

In the inspection device 1, the IC device 90 passes through each area in order from the tray supply area A1 to the tray removal area A5, and an electrical inspection is performed in the inspection area A3 in the middle. In the electrical inspection of the present embodiment, for example, it is confirmed whether or not the IC device 90 is conductive, and whether or not the expected output can be obtained when a specific signal is input. To do. This makes it possible to determine whether or not the IC device 90 is broken or short-circuited. In addition, the inspection unit 16 may perform an inspection for confirming the operation of a circuit (not shown) included in the IC device 90.

Hereinafter, the inspection device 1 will be sequentially described for each area from the tray supply area A1 to the tray removal area A5 with reference to FIG.

1.1: Tray supply area The tray supply area A1 is an area in which a tray 200 as an accommodating member in which a plurality of uninspected IC devices 90 are arranged and held is supplied as a supply tray. A large number of trays 200 can be stacked in the tray supply area A1.

1.2: Device supply area The device supply area A2 is an area in which a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. The tray transport mechanisms 11A and 11B that form the transporter 80 that transports the tray 200 are provided so as to straddle the tray supply area A1 and the device supply area A2.

In the device supply area A2, a temperature control unit 12 having a component holding plate, a supply robot 13 as a transfer robot constituting a transfer unit 80 having a transfer arm (not shown), and a supply empty tray transfer mechanism 15 Is provided.

The temperature adjusting unit 12 holds the IC device 90 on the component holding plate, controls the held IC device 90 to be heated or cooled, and adjusts the IC device 90 to a temperature suitable for inspection. .. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y-axis direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjusting units 12 and held by the component holding plate provided in the temperature adjusting unit 12. To.

The supply robot 13 as a transfer robot constituting the transfer unit 80 is a transfer mechanism that transfers the IC device 90, and is movably supported in the X-axis direction, the Y-axis direction, and the Z-axis direction within the device supply area A2. Has been done. The supply robot 13 conveys the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature control unit 12, and the IC device between the temperature control unit 12 and the electronic component supply unit 14, which will be described later. It is responsible for the transportation of 90. The supply robot 13 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjusting unit 12.

The supply empty tray transport mechanism 15 constituting the transport unit 80 is a transport mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X-axis direction. Then, after this transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

1.3: Inspection area As shown in FIG. 2, the inspection area A3 is an area in which the IC device 90 is inspected. The inspection area A3 is provided with an electronic component supply unit 14, an inspection unit 16, a measurement robot 17, and an electronic component collection unit 18. In the present embodiment, the electronic component supply unit 14 and the electronic component collection unit 18 are configured to be movable independently, but they are connected or integrated so as to be movable in the same direction. It may have been done.

The electronic component supply unit 14 constituting the transfer unit 80 is a transfer mechanism that holds the IC device 90 controlled to a predetermined temperature on the component holding plate and conveys it to the vicinity of the inspection unit 16. The electronic component supply unit 14 can reciprocate between the device supply area A2 and the inspection area A3 along the X-axis direction. Further, in the configuration shown in FIG. 2, two electronic component supply units 14 are arranged in the Y-axis direction. The IC device 90 on the temperature adjusting unit 12 is conveyed to and held by one of the electronic component supply units 14. This transfer is performed by the supply robot 13. Further, in the electronic component supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the temperature of the IC device 90 to a temperature suitable for inspection.

The measuring robot 17 that constitutes the transport unit 80 and includes a transport arm (not shown) is a transport mechanism that transports the IC device 90, and is movably supported within the inspection area A3. A holding unit set 100 is attached to the measuring robot 17, and the IC device 90 on the electronic component supply unit 14 carried in from the device supply area A2 can be conveyed and placed on the inspection unit 16. .. Further, when inspecting the IC device 90, the measuring robot 17 presses the IC device 90 toward the inspection unit 16 by the holding unit set 100, whereby the IC device 90 is brought into contact with the inspection unit 16. As a result, as will be described later, the terminal of the IC device 90 and the probe pin of the inspection unit 16 are electrically connected. Further, the measuring robot 17 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjusting unit 12. In the present embodiment, the number of measuring robots 17 is one as shown in the figure, but two or more may be provided.

As shown in FIG. 4, the measuring robot 17 is positioned above the inspection unit 16 with the holding unit set 100 adsorbing and holding the uninspected IC device 90. Then, the holding unit set 100 descends while sucking and holding the IC device 90, and presses the IC device 90 against the inspection unit 16 to perform an inspection.

13.1: Holding unit set according to the first embodiment Here, with reference to FIGS. 4, 5A, and 5B, regarding the holding unit set according to the first embodiment attached to the measuring robot 17. explain. The holding portion set 100 shown in FIGS. 4, 5A, and 5B is attached to a movable arm 170 including a supporting portion 171 of the measuring robot 17 and the recovery robot 20. Note that FIG. 4 is a front view showing a schematic configuration of the holding portion set according to the first embodiment. Further, FIG. 5A is a side view showing a schematic configuration of the holding portion set according to the first embodiment. FIG. 5B is a left side view showing a schematic configuration of the holding portion set according to the first embodiment.

As shown in FIGS. 4, 5A, and 5B, the holding unit set 100 of the present embodiment has a function of holding and pressing the IC device 90 by vacuum suction, and is configured as a separate body. It includes a holding portion 180, a second holding portion 280, a third holding portion 380, and a fourth holding portion 480. The first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 each have a pair of pressing units, that is, two pressing units. Specifically, the pair of pressing units includes one first pressing unit 180a and the other second pressing unit 180b, such as the first holding unit 180 shown in FIG. 5A. Further, for example, as in the second holding unit 280 shown in FIG. 5B, one first pressing unit 280a and the other second pressing unit 280b are included.

The first pressing unit and the second pressing unit of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 have pneumatic cylinders, respectively. Here, since the first pressing unit and the second pressing unit in the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 have the same configuration, the following description will be made. The first holding portion 180 shown in FIG. 5A and the second holding portion 280 shown in FIG. 5B will be described as typical examples, and the description of the third holding portion 380 and the fourth holding portion 480 will be omitted.

The first holding portion 180 attaches the base substrate 181 and the first pressing unit 180a including one pneumatic cylinder 182a, the second pressing unit 180b including the other pneumatic cylinder 182b, and the base substrate 181 to the movable arm 170. It includes a pair of first mounting portions 172, 172b having a mounting function.

The first pressing unit 180a of the first holding portion 180 is connected to one of the pneumatic cylinders 182a connected to the base substrate 181 and the holding plate 184a and the holding plate 184a connected to the rod 183a of the pneumatic cylinder 182a. Includes a suction unit 185a. The second pressing unit 180b of the first holding portion 180 is connected to the other pneumatic cylinder 182b connected to the base substrate 181 and the holding plate 184b and the holding plate 184b connected to the rod 183b of the pneumatic cylinder 182b. Includes a suction unit 185b.

The first holding portion 180 holds the IC device 90 as the first electronic component, which is one electronic component, by vacuum suction in the suction portions 185a and 185b, with respect to one of the first mounting portions 172 and the base substrate 181. It is attached to the movable arm 170 by the other first attachment portion 172b located on the opposite side of the first attachment portion 172.

The second holding portion 280 has the same configuration as the first holding portion 180, and is arranged substantially similar to the first holding portion 180. The second holding portion 280 attaches the base substrate 281, the first pressing unit 280a including one pneumatic cylinder 282a, the second pressing unit 280b including the other pneumatic cylinder 282b, and the base substrate 281 to the movable arm 170. It includes a second mounting portion 272,272b to be mounted.

The first pressing unit 280a of the second holding portion 280 is connected to one of the pneumatic cylinders 282a connected to the base substrate 281 and the holding plate 284a and the holding plate 284a connected to the rod 283a of the pneumatic cylinder 282a. Includes a suction unit 285a. The second pressing unit 280b of the second holding portion 280 is connected to the other pneumatic cylinder 282b connected to the base substrate 281 and the holding plate 284b and the holding plate 284b connected to the rod 283b of the pneumatic cylinder 282b. Includes a suction unit 285b.

The second holding portion 280 vacuum sucks the IC device 90 as the same or different second electronic component as the first electronic component in the suction portions 285a and 285b, and in this example, the same second electronic component as the first electronic component. It is attached to the movable arm 170 by one second attachment portion 272 and the other second attachment portion 272b located on the opposite side of the second attachment portion 272 with respect to the base substrate 281.

The third holding portion 380 and the fourth holding portion 480 are arranged between the first holding portion 180 and the second holding portion 280. The third holding portion 380 and the fourth holding portion 480 have the same configuration as the first holding portion 180, and are arranged substantially similar to the first holding portion 180. Therefore, the description of the configuration relating to the third holding portion 380 and the fourth holding portion 480 will be a schematic description.

The third holding portion 380 holds the IC device 90 by vacuum suction, and is on the opposite side of the base substrate 381 with respect to one third mounting portion 372 and one third mounting portion 372 shown in FIG. It is attached to the movable arm 170 by the other third attachment portion (not shown) located.

The fourth holding portion 480 holds the IC device 90 by vacuum suction, and is located on the opposite side of the base substrate 481 with respect to the one fourth mounting portion 472 and the other fourth mounting portion 472 shown in FIG. It is attached to the movable arm 170 by the other fourth attachment portion (not shown) located.

Pneumatic cylinders constituting the pressing units of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480, for example, the pneumatic cylinders 182a and 182b of the first holding portion 180 and the like. The pneumatic cylinder 282a and the like of the first pressing unit 280a of the second holding portion 280 are operated by compressed air. As shown in FIGS. 5A, 5B and 6, this compressed air is supplied through an air flow path provided in the movable arm 170. Note that FIG. 6 is a plan view of the movable arm 170, and is a layout view of an air flow path provided in the movable arm.

1.3.2: Air flow path As shown in FIGS. 5A, 5B, and 6, the air flow path 175 is provided on the movable arm 170. The air flow path 175 is provided on the base substrate 181 on the pneumatic cylinders 182a, 282a and the like constituting the pressing units of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480, respectively. The first flow path 186 provided in the base substrate 281 and the second flow path 187 provided in the base substrate 281, the third flow path 188 provided in the base substrate 381, and the fourth flow path provided in the base substrate 481. It is connected via the flow path 189. The air flow path 175 is provided on the base substrate 181 at the inflow hole 176 connected to the compressed air source (not shown), the branch portion 178 that branches downstream of the inflow hole 176, and the downstream of the branch portion 178. One flow path 186, a second flow path 187 provided on the base substrate 281, a third flow path 188 provided on the base board 381, and a fourth flow path 189 provided on the base board 481 respectively. Includes supply holes 177 provided at opposite positions. The inflow hole 176 may be provided at any position on the movable arm 170, and is provided so as to overlap the branch portion 178 and the supply hole 177 when viewed in a plan view along the Z-axis direction as shown in FIG. Alternatively, it may be provided at the center of the movable arm 170 when viewed in a plan view along the Z-axis direction. Here, the center of the movable arm 170 means a portion where the support portion 171 is provided in FIG.

In this way, the transport device 10 connects the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 to the air flow path 175 provided in the movable arm 170. Can be done. In this way, the transport device 10 can be configured to have improved space efficiency by configuring the air flow path 175 in the movable arm 170. Further, the transport device 10 connects the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480, respectively, downstream of the air flow path 175 branched by the branch portion 178. can do. As described above, the transport device 10 is configured from the movable arm 170 to the first holding portion 180, the second holding portion 280, and the third holding portion by forming the air flow path 175 provided with the branch portion 178 in the movable arm 170. Compressed air can be supplied to the 380 and the fourth holding portion 480.

Here, a mounting portion for attaching the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 to the movable arm 170 will be described. Since the first mounting portion, the second mounting portion, the third mounting portion, and the fourth mounting portion, which are the respective mounting portions, have the same configuration, the first holding portion 180 is mounted on the movable arm 170. 1 Mounting portions 172 and 172b will be taken as typical examples, and will be described with reference to FIGS. 7A and 7B. FIG. 7A is a partially enlarged view showing a mounting portion of the movable arm and the holding portion set. FIG. 7B is a right side view of FIG. 7A showing the mounting portion. Since one first mounting portion 172, which is also called a snap latch, and the other first mounting portion 172b located on the opposite side of the first mounting portion 172 with respect to the base substrate 181 have the same configuration. Hereinafter, one of the first mounting portions 172 will be described as a representative example.

On the other hand, as shown in FIGS. 7A and 7B, the first mounting portion 172 includes a hook portion 76 fixed to the side surface 170a of the movable arm 170, the movable portion 77, and the same direction as the side surface 170a of the movable arm 170. Includes a main body 78 fixed to the side surface 181a of the facing base substrate 181. Here, the movable portion 77 and the main body portion 78 are integrally formed, and the hook portion 76 is formed as a separate body. The movable portion 77 comes into contact with the hook portion 76 and moves in the direction in which the movable arm 170 and the base substrate 181 are aligned by the moving operation of the main body portion 78, so that the base substrate 181 can be attached to the movable arm 170. By using the first mounting portions 172 and 172b having such a configuration in pairs, the base substrate 181, that is, the first holding portion 180 can be easily mounted on the movable arm 170.

1.3.3: Deformation example of arrangement of air flow path In the above-described embodiment, the configuration in which the air flow path 175 is provided on the movable arm 170 has been illustrated and described, but the present invention is not limited to this. Hereinafter, a modified example of the arrangement of the air flow path will be described with reference to FIGS. 8, 9, and 10. FIG. 8 is a front view showing a modified example relating to the configuration of the air flow path. FIG. 9 is a side view showing a modified example relating to the configuration of the air flow path. FIG. 10 is a layout diagram of an air flow path provided on the adapter plate.

As shown in FIGS. 8 and 9, the air flow path 595 according to the modified example is provided on the adapter plate 590 as a support substrate of the movable arm 570 including the support portion 571. The adapter plate 590 is located between the movable arm 570 and the base substrates 181,281, 381, 481 of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480, respectively. Have been placed.

The air flow path 595 is provided on the base substrate 181 on the pneumatic cylinders 182a, 282a and the like constituting the pressing units of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480. The first flow path 186 provided in the base substrate 281 and the second flow path 187 provided in the base substrate 281, the third flow path 188 provided in the base substrate 381, and the fourth flow path provided in the base substrate 481. It is connected via the flow path 189. Since the configurations of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 are the same as those in the first embodiment described above, detailed description thereof will be omitted here. To do.

As shown in FIGS. 9 and 10, the air flow path 595 is connected to a compressed air source (not shown) and is connected to a through hole 576 provided in the movable arm 570. The air flow path 595 is provided on the base substrate 181 at the inflow hole 596 connected to the through hole 576 of the movable arm 570, the branch portion 598 that branches downstream of the inflow hole 596, and the downstream of the branch portion 598. Facing the first flow path 186, the second flow path 187 provided on the base substrate 281, the third flow path 188 provided on the base board 381, and the fourth flow path 189 provided on the base board 481. Includes a supply hole 597 provided at the position where it is used.

In this modification, each of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 is attached to the adapter plate 590. The first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 are attached to the adapter plates 590, respectively, by attaching the first attachment portions 172 and 172b in the same manner as in the above-described embodiment. This is done by each of the illustrated mounting parts.

According to this modification, since the air flow path 595 is provided on the adapter plate 590 as the support base material, the arrangement pitch of the first holding portion 180 and the second holding portion 280 is set for each adapter plate 590, for example. It is possible to form the arrangement pitch of the combined air flow path 595. As a result, even when it is necessary to change the mounting pitch of the first holding portion 180 and the second holding portion 280 to the movable arm 570, the adapter plate 590 is combined with the replacement of the first holding portion 180 and the second holding portion 280. By exchanging, the mounting pitch of the first holding portion 180 and the second holding portion 280 can be easily changed without changing the movable arm 570.

Further, if the adapter plate 590 is used, various inspection sites can be prepared without changing the movable arm 570 side by preparing adapter plates 590 corresponding to various inspection sites such as 2 inspection sites and 4 inspection sites. The replacement kit corresponding to the above can be easily replaced.

In this embodiment and the modified example, as the mounting portion for mounting the first holding portion 180 to the movable arm 170 or the adapter plate 590, the above-described configuration also called a snap latch has been shown and described, but other mounting portions have been described. For example, a hook (Hook), a bolt (Bolt), a screw (screw), and the like can be used.

Further, although not shown, the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 of the holding portion set 100 are electrically connected to, for example, heater wiring. A connector and a connection part for vacuum piping are provided.

Returning to FIG. 2, the electronic component collection unit 18 constituting the transfer unit 80 is a transfer mechanism that holds the IC device 90 that has been inspected by the inspection unit 16 and conveys it to the device collection area A4. The electronic component collection unit 18 can reciprocate between the inspection area A3 and the device collection area A4 along the X-axis direction. Further, in the configuration shown in FIG. 2, two electronic component collection units 18 are arranged in the Y-axis direction, similarly to the electronic component supply unit 14. The IC device 90 on the inspection unit 16 is transported to and placed on one of the electronic component collection units 18. This transfer is performed by the measurement robot 17 described above.

As shown in FIG. 4, the measuring robot 17 transports the inspected IC device 90 from the inspection unit 16 to the upper part of the electronic component collection unit 18 in a state where the inspection unit set 100 sucks and holds the inspected IC device 90, for example. The holding unit set 100 is lowered and placed on the electronic component collecting unit 18.

1.4: Inspection unit The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and is a holding unit that holds the IC device 90 when inspecting the IC device 90. The inspection unit 16 is provided with a plurality of inspection sockets (not shown) including a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. The inspection socket applied to the inspection of the IC device 90 can be selected and used from a plurality of inspection sockets. In addition, each inspection socket may be called a test site.

Then, the IC device 90 is connected by electrical contact between the terminal of the IC device 90 and the probe pin of the inspection socket, and the IC device 90 is electrically inspected via the probe pin. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the temperature of the IC device 90 to a temperature suitable for inspection.

1.5: Device collection area As shown in FIG. 2, the device collection area A4 is an area in which the IC device 90 for which the inspection has been completed is collected. The device collection area A4 is provided with a collection tray 19, a collection robot 20 as a transfer robot provided with a transfer arm 131, and a collection empty tray transfer mechanism 21. In addition, three empty trays 200 are also prepared in the device collection area A4.

The collection tray 19 is one of the electronic component mounting portions on which the IC device 90 is mounted. The collection trays 19 are fixed in the device collection area A4, and in this configuration, three collection trays 19 are arranged side by side in the X-axis direction. Further, the empty tray 200 is also an electronic component mounting portion on which the IC device 90 is mounted, and three are arranged side by side in the X-axis direction. Then, the IC device 90 on the electronic component collection unit 18 that has moved to the device collection area A4 is conveyed and held in one of the collection tray 19 and the empty tray 200. As a result, the IC device 90 is collected and sorted for each inspection result. The collection robot 20 separates the IC device 90 based on the inspection result. The recovery robot 20 separates the IC device 90 according to a command from the control device 30 described later.

The recovery robot 20 as a transfer robot constituting the transfer unit 80 is a transfer mechanism that transports the IC device 90, and is movably supported in the X-axis direction, the Y-axis direction, and the Z-axis direction within the device recovery area A4. Has been done. The recovery robot 20 can transport the IC device 90 from the electronic component recovery unit 18 to the recovery tray 19 or the empty tray 200. The recovery robot 20 has a plurality of shuttles, and has a plurality of holding units (not shown) for holding the IC device 90 corresponding to each shuttle. Each holding unit is provided with a plurality of suction heads (not shown), and can be held by sucking the IC device 90.

The collection empty tray transport mechanism 21 constituting the transport unit 80 is a transport mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. Then, after this transfer, the empty tray 200 is arranged at a position where the IC device 90 is collected. That is, the empty tray 200 after transportation can be one of the three empty trays 200 described above.

1.6: Tray removal area The tray removal area A5 is an area in which the tray 200 in which a plurality of IC devices 90 in the inspected state are arranged is collected and removed. A large number of trays 200 can be stacked in the tray removal area A5. The tray transport mechanisms 22A and 22B for transporting the trays 200 one by one are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the inspected IC device 90 is placed from the device collection area A4 to the tray removal area A5. The tray transport mechanism 22B transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the device collection area A4.

Although not shown, the first room, the second room, and the third room in each of the areas A1 to A5 as described above have a temperature sensor for detecting the temperature in the room and a relative humidity in the room. A humidity sensor for detecting and an oxygen concentration sensor for detecting the oxygen concentration in the room are provided. In the present embodiment, the temperature sensor, the humidity sensor, and the oxygen concentration sensor are provided in each of the first, second, and third chambers, but the temperature sensor, the humidity sensor, and the oxygen concentration are provided. The location where the sensor is provided is arbitrary.

Although not shown, the inspection device 1 has a dry air supply mechanism. The dry air supply mechanism is configured to be able to supply low humidity air, a gas such as nitrogen (hereinafter, also referred to as dry air) to the first chamber, the second chamber, and the third chamber. Therefore, by supplying dry air as needed, it is possible to prevent dew condensation and freezing of the IC device 90.

In the above-described embodiment, the inspection device 1 is configured to be capable of inspecting in a normal temperature environment, a low temperature environment, and a high temperature environment, but is not limited to this, and is not limited to the above three environments. The inspection may be performed under at least one of these environments. It may not include configurations for low temperature environments such as walls, shutters, hygrometers, oxygen densitometers, and dry air.

1.7: Control device As shown in FIG. 3, the control device 30 has a function of controlling each unit of the inspection device 1, and includes a control unit 31 and a storage unit 32.

The control unit 31 includes a processor (Processor) that operates based on the information stored in the storage unit 32, for example, a CPU (Central Processing Unit), and is composed of a drive control unit 311, an inspection control unit 312, and an imaging control unit. It has 313 and an image processing unit 314. The storage unit 32 includes, for example, a ROM (read only memory) and a RAM (Random Access Memory).

The control unit 31 has a function of driving each unit constituting the inspection device 1, displaying inspection results, image data, and the like on the display unit 41, a function of performing processing according to an input from an operation unit 42 executed by the user, and the like. ing.

The drive control unit 311 includes tray transfer mechanisms 11A and 11B, temperature control unit 12, supply robot 13, supply empty tray transfer mechanism 15, electronic component supply unit 14, inspection unit 16, measuring robot 17, electronic component collection unit 18, and collection. It controls the driving of the robot 20, the collection empty tray transfer mechanism 21, and the tray transfer mechanisms 22A and 22B.

The inspection control unit 312 can inspect the IC device 90 arranged in the inspection unit 16 based on the inspection program stored in the storage unit 32, for example.

The image pickup control unit 313 controls the drive of the image acquisition unit 50 for taking images of the tray 200 as an accommodating member, the component holding plate, and the like. Further, the image pickup control unit 313 processes the signal from the image pickup device 51, converts the image of the tray 200 and the component holding plate acquired by the image acquisition unit 50 into data, and generates it as image data.

For example, when the IC device 90 flows, the image processing unit 314 generates display data such as information related to the tray 200 and the component holding plate and alarm information, and displays the display data as image information on the display unit 41.

The storage unit 32 stores programs for the control unit 31 to perform various processes, for example, a display program of the transport device, an inspection program, data, and the like. The storage unit 32 is set as a setup recipe based on inspection conditions related to various electronic components, component data related to various electronic components, inspection conditions related to the IC device 90 in this embodiment, component data, and inspection conditions and component data. A list of holding unit sets 100 applicable to the relevant component is stored. Further, the storage unit 32 has, as inspection conditions related to the IC device 90, for example, a terminal arrangement including the outer shape, outer size, pitch between terminals, number of terminals, etc. of the IC device 90, and inspection specifications of the IC device 90, a test site, and the like. Memorize inspection programs, etc.

1.8: Notification unit As shown in FIGS. 1 and 3, the notification unit 40 includes a display unit 41 capable of displaying an image and a sound output unit 45 capable of outputting voice, buzzer sound, and the like. The notification unit 40 can perform notification information instructed by the control device 30 as, for example, an image display such as characters or illustrations on the display unit 41, or a sound output such as a voice, a chime, or a buzzer on the sound output unit 45.

The display unit 41 displays the driving status and inspection results of each unit, the arrangement image of the tray 200 and the component holding plate, and the like. The display unit 41 can be composed of, for example, a liquid crystal display panel, a display panel such as an organic EL, or the like. The user can set various processes, conditions, and the like of the inspection device 1 and check the results through the display unit 41. In addition, the user can confirm the arrangement image, the instruction image, the notification information, and the like by displaying images such as characters and illustrations.

The sound output unit 45 is composed of a speaker (not shown) or the like, and can output alarm information or the like as sound information such as voice, chime, or buzzer sound and notify the sound output unit 45.

1.9: Operation unit The operation unit 42 is an input device such as a keyboard and a mouse, and outputs an operation signal corresponding to an operation by an operator to the control unit 31. Therefore, the operator can instruct the control unit 31 of various processes and the like by using the keyboard and the mouse. In the present embodiment, the keyboard and mouse are used as the operation unit 42, but the operation unit 42 is not limited to this, and may be, for example, an input device such as a trackball or a touch panel.

1.10: Image acquisition unit The image acquisition unit 50 has a function of acquiring an image of a tray 200 or a component holding plate arranged in an electronic component mounting unit. As shown in FIG. 2, the image acquisition unit 50 is provided in the device supply area A2 and the device collection area A4 in the supply robot 13 and the collection robot 20 as transfer robots. That is, the image acquisition unit 50 is provided at a position where images of the tray 200 and the component holding plate arranged in the electronic component mounting unit can be acquired. For example, the image acquisition unit 50 can be attached to the transfer arm 131 of the supply robot 13 and the recovery robot 20.

The image acquisition unit 50 includes an image pickup device 51 as an image pickup unit and an illumination device 52. The lighting device 52 may be not only continuous lighting but also intermittently strong light (flash) as long as the exposure time can be controlled.

The image pickup device 51 as an image pickup unit has an image pickup element that receives light from a tray 200 or a component holding plate arranged in an electronic component mounting section and converts it into an electric signal. The image pickup device 51 is not particularly limited, but for example, a camera (CCD camera) using a CCD (Charge Coupled Device) image sensor as an image pickup element, and a camera using a CMOS (Complementary Metal Oxide Semiconductor) image sensor as an image pickup element. Examples of the image pickup element include an electronic camera (digital camera) such as a camera using a CMOS image sensor. Further, by analyzing the image data by using, for example, a differential interference method, a Fourier transform method, or the like, it is possible to emphasize fine shapes and hard-to-see shapes and improve the shape detection sensitivity. In addition, it is possible to emphasize fine scratches and hard-to-see scratches and improve the scratch detection sensitivity.

Further, although not shown, the image pickup apparatus 51 preferably includes an optical system such as an optical lens and an autofocus mechanism. Thereby, for example, a clear image can be obtained even when the heights (heights in the Z-axis direction) of the tray 200 and the component holding plate with respect to the image pickup apparatus 51 are different.

The lighting device 52 is a light source device that is driven when the tray 200 or the component holding plate is imaged by the imaging device 51 and irradiates an imaged object such as the tray 200 or the component holding plate with light. With this lighting device 52, it is possible to suppress darkening of the image due to insufficient light amount and obtain a clearer image.

In the present embodiment, the lighting device 52 forms an annular shape and is arranged around the image pickup device 51. As a result, the tray 200 and the component holding plate can be uniformly irradiated with light. The shape and arrangement of the lighting device 52 are not limited to the above-mentioned configuration.

The image acquisition unit 50 having such a configuration irradiates an imaged object such as a tray 200 or a component holding plate arranged in the electronic component mounting unit by the lighting device 52 with light, and the image pickup device 51 holds the tray 200 or the component. Image the board. The signal from the image pickup apparatus 51 is taken into the image pickup control unit 313 of the control unit 31 described above. The image pickup control unit 313 processes the signal from the image pickup device 51 and generates an image of the tray 200 and the component holding plate as two-dimensional image data.

According to the transfer device 10 having the configuration as described above and the inspection device 1 using the transfer device 10, the following effects can be obtained.
The transfer device 10 has a holding portion set 100 attached to a movable arm 170 of the measuring robot 17 and the collecting robot 20. The holding unit set 100 has a function of holding and pressing the IC device 90 by vacuum suction, and is configured as a separate body, that is, the first holding part 180, the second holding part 280, the third holding part 380, and the third holding part set 100. 4 The holding portion 480 is provided. The first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 each have a pair of mounting portions, for example, the first holding portion 180 has a first mounting portion 172,172b. , Can be attached to the movable arm 170 separately depending on the attachment portion. As a result, the user does not have to carry out the replacement work while holding the heavy replacement kit with his / her hand and arm, which is composed of a plurality of holding parts and the like as in the conventional case. Since the relatively light first holding portion 180 or the second holding portion 280 or the like can be held by the hands and arms, respectively, the replacement work can be performed, so that the replacement work can be facilitated.

Further, since the transport device 10 has a narrow space in the area where the replacement kit is replaced, such as the first holding portion 180 and the second holding portion 280, the replacement work is performed with the replacement kit having a large volume as in the conventional case. hard. However, in the replacement work using the first holding portion 180 and the second holding portion 280 of the present embodiment, the first holding portion 180 and the second holding portion 280 can be replaced separately using the respective mounting portions. It can be easily replaced even in a small space.

Further, the arrangement of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 is not limited to the above-mentioned arrangement, and may be any arrangement. .. Further, the number of holding portions may be 2 or more, and the same effect can be obtained.

Further, in the above description, the configuration in which two pressing units are arranged in each of the first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 has been described as an example. , Not limited to this. The first holding portion 180, the second holding portion 280, the third holding portion 380, and the fourth holding portion 480 may have a configuration in which one or more pressing units are arranged.

2: Holding unit set according to the second embodiment Next, the configuration of the holding unit set according to the second embodiment will be described with reference to FIGS. 11 and 12. FIG. 11 is a front view showing a schematic configuration of a holding portion set according to the second embodiment. FIG. 12 is a side view showing a schematic configuration of the holding portion set according to the second embodiment.

As shown in FIGS. 11 and 12, the holding unit set 100b according to the second embodiment has a function of holding and pressing the IC device (not shown) by vacuum suction, as in the first embodiment. It includes a first holding portion 680, a second holding portion 780, a third holding portion 880, and a fourth holding portion 980, which are separately formed. The first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 each have a pair of pressing units, that is, two pressing units. Specifically, the pair of pressing units includes one first pressing unit 680a and the other second pressing unit 680b, such as the first holding unit 680 shown in FIG.

Pneumatic cylinders are attached to the first pressing unit and the second pressing unit of the first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980, respectively, as in the first embodiment. Have. Here, since the first pressing unit and the second pressing unit in the first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 have the same configuration, the following description will be made. The first holding portion 680 shown in FIG. 12 will be described as a representative example, and the description of the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 will be omitted.

The first holding portion 680 has a base substrate 681, a first pressing unit 680a including one pneumatic cylinder 782a, a second pressing unit 680b including the other pneumatic cylinder 782b, and a base substrate 681 supporting portion 671. Includes a pair of first mounting portions 172,172b having a function of mounting on the movable arm 670.

The first pressing unit 680a of the first holding portion 680 is connected to one of the pneumatic cylinders 782a connected to the base substrate 681, the holding plate 784a connected to the rod 783a of the pneumatic cylinder 782a, and the holding plate 784a. Includes a suction unit 785a. The second pressing unit 680b of the first holding portion 680 is connected to the other pneumatic cylinder 782b connected to the base substrate 681, the holding plate 784b connected to the rod 783b of the pneumatic cylinder 782b, and the holding plate 784b. Includes a suction unit 785b.

The first holding portion 680 holds the IC device 90 in the suction portions 785a and 785b by vacuum suction, and is located on the opposite side of the one first mounting portion 172 and the base substrate 681 on the opposite side of the one first mounting portion 172. It is attached to the movable arm 670 by the other first attachment portion 172b.

The second holding portion 780, the third holding portion 880, and the fourth holding portion 980 have the same configuration as the first holding portion 680, and are arranged substantially similar to the first holding portion 680. Therefore, the description of the configuration of the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 will be omitted. The second holding portion 780 places the base substrate 781 on one second mounting portion 272 and the other second mounting portion (not shown) located on the opposite side of the one second mounting portion 272 with respect to the base board 781. It is attached to the movable arm 670 by a pair of attachment portions. The third holding portion 880 places the base substrate 881 on one third mounting portion 372 and the other third mounting portion (not shown) located on the opposite side of the one third mounting portion 372 with respect to the base board 881. It is attached to the movable arm 670 by a pair of attachment portions. The fourth holding portion 980 attaches the base board 981 to one fourth mounting portion 472 and the other fourth mounting portion (not shown) located on the opposite side of the one fourth mounting portion 472 with respect to the base board 981. It is attached to the movable arm 670 by a pair of attachment portions.

Pneumatic cylinders constituting the pressing units of the first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980, for example, the pneumatic cylinders 782a and 782b of the first holding portion 680 and the like. Works with compressed air. As shown by the broken lines in FIGS. 11 and 12, the compressed air is the base substrate 681,781,881 of the first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980. It is supplied from the air flow path 775 provided in 981 via each air introduction port 786.

The air flow path 775 is connected to a compressed air source (not shown) and is connected to a through hole 676 provided in the movable arm 670. The air flow path 775 includes a first flow path 775a, a second flow path 775b, a third flow path 775c, and a fourth flow path 775d provided on the respective base substrates 681,781,881,981. 681,781,881,981 are connected to each other by being brought into contact with each other. The air flow path 775 is provided in the base substrate 981, the inflow hole 682 connected to the through hole 676 of the movable arm 670, and the first flow path 775a branched from the inflow hole 682 and provided in the base substrate 681. The second flow path 775b provided on the base board 781, the third flow path 775c provided on the base board 881, and the fourth flow path 775d provided on the base board 981, one of which is the first flow path. Includes a supply hole 683 that is connected to the 775a, the second flow path 775b, the third flow path 775c, and the fourth flow path 775d, the other connecting to the air inlet 786 of each pneumatic cylinder.

As described above, in the holding portion set 100b according to the second embodiment, since the air flow path 775 is configured in each of the base substrates 681,781,881,981, the first holding portion 680 and the second holding portion Even when the arrangement of the 780, the third holding portion 880, and the fourth holding portion 980, for example, the mounting pitch and the number of arrangements changes, the configuration of the movable arm 670 does not need to be changed. As described above, in the holding portion set 100b according to the second embodiment, the arrangement of the first holding portion 680, the second holding portion 780, and the like can be easily changed without changing the movable arm 670.

Further, the arrangement of the first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 is not limited to the above-mentioned arrangement, and may be any arrangement. .. Further, the number of holding portions may be 2 or more, and the same effect can be obtained.

Further, in the above description, the configuration in which two pressing units are arranged in each of the first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 has been described as an example. , Not limited to this. The first holding portion 680, the second holding portion 780, the third holding portion 880, and the fourth holding portion 980 may have a configuration in which one or more pressing units are arranged.

3: Holding unit set according to the third embodiment Next, the configuration of the holding unit set according to the third embodiment will be described with reference to FIGS. 13 and 14. FIG. 13 is a front view showing a schematic configuration of the holding portion set according to the third embodiment. FIG. 14 is a side view showing a schematic configuration of the holding portion set according to the third embodiment.

As shown in FIGS. 13 and 14, the holding unit set 100c according to the third embodiment has a function of holding and pressing the IC device (not shown) by vacuum suction, as in the first embodiment. It includes a first holding portion 1180, a second holding portion 1280, a third holding portion 1380, and a fourth holding portion 1480, which are separately formed. The first holding unit 1180, the second holding unit 1280, the third holding unit 1380, and the fourth holding unit 1480 each have a pair of pressing units, that is, two pressing units. Specifically, the pair of pressing units includes one first pressing unit 1180a and the other second pressing unit 1180b, such as the first holding unit 1180 shown in FIG.

Pneumatic cylinders are provided in the first pressing unit and the second pressing unit of the first holding portion 1180, the second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480, respectively, as in the first embodiment. Have. Here, since the first pressing unit and the second pressing unit in the first holding portion 1180, the second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 have the same configuration, the following description will be made. The first holding portion 1180 shown in FIG. 14 will be described as a representative example, and the description of the second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 will be omitted.

The first holding portion 1180 attaches the base substrate 1181, the first pressing unit 1180a including one pneumatic cylinder 182a, the second pressing unit 1180b including the other pneumatic cylinder 182b, and the base substrate 1181 to the movable arm 1170. It includes a pair of first mounting portions 172, 172b having a mounting function.

The first pressing unit 1180a of the first holding portion 1180 is connected to one pneumatic cylinder 182a connected to the base substrate 1181, a holding plate 184a connected to a rod 183a of the pneumatic cylinder 182a, and a holding plate 184a. Includes a suction unit 185a. The second pressing unit 1180b of the first holding portion 1180 is connected to the other pneumatic cylinder 182b connected to the base substrate 1181, the holding plate 184b connected to the rod 183b of the pneumatic cylinder 182b, and the holding plate 184b. Includes a suction unit 185b.

The base substrate 1181 of the first holding portion 1180 is provided from the main body portion 1182 on both sides of the main body portion 1182 on the pneumatic cylinder 182a and 182b side and on the arrangement side of the movable arm 1170 in the arrangement direction of the pneumatic cylinders 182a and 182b. Includes a protrusion 1183 formed in a shape.

The movable arm 1170 has a base 1172 provided on the support portion 1171 side and a bottom portion 1173 and a side wall portion provided in a concave shape on both ends of the pneumatic cylinders 182a and 182b in the arrangement direction on the arrangement side of the first holding portion 1180. Includes a hook portion made of 1174. The hook portion may be configured by attaching a so-called sheet metal processed product, for example, a portion corresponding to the bottom portion 1173 and the side wall portion 1174 formed by bending a metal plate to the movable arm 1170.

The first holding unit 1180 holds the IC device 90 in the suction units 185a and 185b by vacuum suction. Then, the first holding portion 1180 is held by the movable arm 1170 by bringing the eaves-shaped protrusion 1183 into contact with the bottom portion 1173 of the hook portion of the movable arm 1170. The first holding portion 1180 is held by the hook portion as described above, and is movable by the first mounting portion 172 and the first mounting portion 172b located on the opposite side of the first mounting portion 172. Attached to 1170.

The second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 have the same configuration as the first holding portion 1180, and are arranged substantially similar to the first holding portion 1180. Therefore, the description of the configuration of the second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 will be omitted. The second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 are arranged at predetermined positions by sliding along the hook portion of the movable arm 1170.

The second holding portion 1280 slides along the hook portion of the movable arm 1170, and in a state where the fixing position in the sliding direction is determined by the positioning portion 1010, the base substrate 1281 is attached to one of the second mounting portions 272 and It is attached to the movable arm 1170 by a pair of attachments of the other second attachment (not shown). The fourth holding portion 1480 slides along the hook portion of the movable arm 1170, and is set in a state where the base substrate 1488 is in contact with the base substrate 1281 of the second holding portion 1280. The third holding portion 1380 slides along the hook portion of the movable arm 1170, and is set in a state where the base substrate 1381 is in contact with the base substrate 1418 of the fourth holding portion 1480. The first holding portion 1180 slides along the hook portion of the movable arm 1170, and is set in a state where the base substrate 1181 is in contact with the base substrate 1381 of the third holding portion 1380. In this state, the holding portion set 100c according to the third embodiment is attached to the movable arm 1170 by the one first mounting portion 172 and the first mounting portion 172b located on the opposite side of the one first mounting portion 172. Is configured.

According to the holding portion set 100c of the third embodiment, mounting portions are provided on the third holding portion 1380 and the fourth holding portion 1480 set between the first holding portion 1180 and the second holding portion 1280. It can be easily attached to the movable arm 1170 individually without any problem.

Further, in the above description, the configuration in which two pressing units are arranged in each of the first holding portion 1180, the second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 has been described as an example. , Not limited to this. The first holding portion 1180, the second holding portion 1280, the third holding portion 1380, and the fourth holding portion 1480 may have a configuration in which one or more pressing units are arranged.

Although the transport device 10 as the electronic component transport device and the inspection device 1 as the electronic component inspection device of the present invention have been described above based on the illustrated embodiment, the present invention is not limited to this, and each part of the present invention is not limited to this. The configuration can be replaced with any configuration having a similar function. Further, any other constituents may be added to the present invention.

The contents derived from the above-described embodiments will be described below as each aspect.

[Aspect 1] The electronic component transfer device according to this aspect is an electronic component transfer device that conveys electronic components, and has a movable arm and a first attachment portion to be attached to the movable arm, and holds the first electronic component. A second holding portion that is separate from the first holding portion, has a second mounting portion that is attached to the movable arm, and holds a second electronic component.

According to this aspect, the electronic component transfer device has a first mounting portion in the first holding portion for holding the first electronic component, and has a second mounting portion in the second holding portion for holding the second electronic component. Therefore, the user can attach the first holding portion and the second holding portion to the movable arm separately. As a result, the user does not hold a heavy replacement kit in which a plurality of conventional holding parts are integrated, but instead is configured as a separate body, so that the first holding part or the second holding part having a relatively light weight is used. The replacement work can be performed while holding the parts by hands and arms, respectively, and the replacement work can be facilitated.
Further, in the electronic component transfer device, since the space for replacing the first holding portion and the second holding portion is narrow, it is difficult to perform the replacement work with a large replacement kit, but the first holding portion and the second holding portion are replaced. By being able to replace them separately, it is possible to facilitate replacement even in such a narrow space.

[Aspect 2] In the electronic component transfer device according to the above aspect, the movable arm may include an air flow path connected to the first holding portion and the second holding portion.

According to this aspect, the electronic component transfer device can connect the first holding portion and the second holding portion to the air flow path provided in the movable arm. As described above, the electronic component transfer device can be configured to have improved space efficiency by configuring the air flow path in the movable arm.

[Aspect 3] In the electronic component transfer device according to the above aspect, the air flow path may be branched and connected to the first holding portion and the second holding portion.

According to this aspect, the electronic component transfer device can connect the first holding portion and the second holding portion downstream of the branched air flow path. In this way, the electronic component transfer device can supply air from the movable arm to the first holding portion and the second holding portion by forming the branched air flow path in the movable arm, and improve the space efficiency. The air flow path can be configured.

[Aspect 4] In the electronic component transfer device according to the above aspect, the movable arm has a support base material to which the first holding portion and the second holding portion are attached, and the air flow path is the support base material. It may be provided in.

According to this aspect, since the air flow path is provided on the support base material, the arrangement pitch of the air flow path is formed for each support base material according to the arrangement pitch of the first holding portion and the second holding portion. can do. As a result, even when it is necessary to change the mounting pitch of the first holding portion and the second holding portion with respect to the movable arm, the supporting base material can be replaced in accordance with the replacement of the first holding portion and the second holding portion. , The mounting pitch can be easily changed.

[Aspect 5] In the electronic component transfer device according to the above aspect, the first holding portion has a first flow path connected to the air flow path, and the second holding portion is the first flow path. It may have a second flow path connected to.

According to this aspect, the electronic component transfer device includes a first flow path of the first holding portion connected to the air flow path and a second flow path of the second holding portion connected to the first flow path. There is. In this way, the electronic component transfer device can supply air through the first flow path of the first holding portion and the second flow path of the second holding portion, and constitutes an air flow path with improved space efficiency. Can be done.

[Aspect 6] The electronic component inspection device according to this aspect includes the electronic component transfer device according to any one of aspects 1 to 5, and an inspection unit that inspects the electronic component transported by the electronic component transfer device. And have.

According to this aspect, in the electronic component inspection apparatus, the user can attach the first holding portion and the second holding portion to the movable arm separately. As a result, the user does not hold a heavy replacement kit in which a plurality of holding parts are integrally formed as in the conventional case, but a first holding part or a first holding part having a relatively light weight because the holding parts are separately configured. The replacement work can be performed while holding the second holding portion by the hand and the arm, respectively, and the replacement work can be facilitated.

[Aspect 7] The holding portion set according to this aspect is a holding portion set that is attached to a movable arm of an electronic component conveying device that conveys electronic components, and has a first attachment portion that is attached to the movable arm. Includes a first holding portion for holding electronic components and a second holding portion that is separate from the first holding portion, has a second mounting portion to be attached to the movable arm, and holds a second electronic component. ..

According to this aspect, the first holding portion and the second holding portion, which are separate bodies, are attached to the movable arm by the first attachment portion or the second attachment portion, which are the respective attachment portions. As a result, the user does not hold a heavy replacement kit in which a plurality of holding parts are integrally formed as in the conventional case, but a first holding part or a first holding part having a relatively light weight because the holding parts are separately configured. The replacement work can be performed while holding the second holding portion by the hand and the arm, respectively, and the replacement work can be facilitated.

[Aspect 8] In the holding portion set according to the above aspect, the first holding portion has a first flow path connected to an air flow path provided in the movable arm, and the second holding portion is , It may have a second flow path connected to the first flow path.

According to this aspect, the holding portion set includes a first flow path of the first holding portion connected to the air flow path and a second flow path of the second holding portion connected to the first flow path. .. In this way, the holding portion set can supply air through the first flow path of the first holding portion and the second flow path of the second holding portion, and can form an air flow path with improved space efficiency. it can.

1 ... Inspection device as an electronic component inspection device, 5 ... Housing section, 7 ... Door section, 10 ... Transport device as an electronic component transport device, 11A, 11B ... Tray transport mechanism, 12 ... Temperature control unit, 13 ... Transport Supply robot as a robot, 14 ... Electronic component supply unit, 15 ... Supply empty tray transfer mechanism, 16 ... Inspection unit, 17 ... Measurement robot as device transfer head, 18 ... Electronic component collection unit, 19 ... Collection tray, 20 ... Recovery robot as a transfer robot, 21 ... Recovery empty tray transfer mechanism, 22A, 22B ... Tray transfer mechanism, 30 ... Control device, 31 ... Control unit, 32 ... Storage unit, 40 ... Notification unit, 41 ... Display unit, 42 ... Operation unit, 45 ... Sound output unit, 50 ... Image acquisition unit, 51 ... Imaging device as imaging unit, 52 ... Lighting device, 80 ... Conveying unit, 90 ... IC device as first electronic component or second electronic component , 100 ... Holding part set, 131 ... Conveying arm, 170 ... Movable arm, 171 ... Support part, 172, 172b ... First mounting part, 180 ... First holding part, 180a ... First pressing unit, 180b ... Second pressing Unit, 181 ... base substrate, 182a, 182b ... pneumatic cylinder, 183a, 183b ... rod, 184a, 184b ... holding plate, 185a, 185b ... suction part, 186 ... first flow path, 187 ... second flow path, 188 ... 3rd flow path, 189 ... 4th flow path, 200 ... Tray as an accommodating member, 272 ... Second mounting part, 280 ... Second holding part, 280a ... 1st pressing unit, 281 ... Base substrate, 282a ... Empty Pressure cylinder, 283a ... rod, 284a ... holding plate, 285a ... suction unit, 311 ... drive control unit, 312 ... inspection control unit, 313 ... imaging control unit, 314 ... image processing unit, 372 ... third mounting unit, 380 ... 3rd holding part, 472 ... 4th mounting part, 480 ... 4th holding part, A1 ... tray supply area, A2 ... device supply area, A3 ... inspection area, A4 ... device recovery area, A5 ... tray removal area.

Claims (8)

An electronic component transfer device that transports electronic components.
Movable arm and
A first holding portion having a first mounting portion to be attached to the movable arm and holding a first electronic component,
A second holding portion that is separate from the first holding portion, has a second mounting portion to be attached to the movable arm, and holds the second electronic component,
The electronic component transfer device equipped with. The movable arm
It is provided with an air flow path connected to the first holding portion and the second holding portion.
The electronic component transfer device according to claim 1. The air flow path
Branched and connected to the first holding portion and the second holding portion,
The electronic component transfer device according to claim 2. The movable arm
It has a support base material to which the first holding portion and the second holding portion are attached.
The air flow path is provided on the support base material.
The electronic component transfer device according to claim 2 or 3. The first holding portion has a first flow path connected to the air flow path, and has a first flow path.
The second holding portion has a second flow path connected to the first flow path.
The electronic component transfer device according to any one of claims 2 to 4. The electronic component transfer device according to any one of claims 1 to 5.
An inspection unit that inspects the electronic components transported by the electronic component transfer device, and
Equipped with electronic component inspection equipment. A set of holding parts that can be attached to the movable arm of an electronic component transport device that transports electronic components.
A first holding portion having a first mounting portion to be attached to the movable arm and holding a first electronic component,
A second holding portion that is separate from the first holding portion, has a second mounting portion to be attached to the movable arm, and holds the second electronic component,
Holding set including. The first holding portion has a first flow path connected to an air flow path provided in the movable arm.
The second holding portion has a second flow path connected to the first flow path.
The holding unit set according to claim 7.

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