JP2020131639A - Ic card and method for manufacturing the same - Google Patents

Abstract

To reduce the total thickness of an IC card with a lenticular lens.SOLUTION: There is provided an IC card in which a core sheet including an IC chip and an antenna, a design printing sheet having an opening and a second transparent resin layer having a lenticular lens region formed with a plurality of lenses are stacked in this order, at least a partial image formation region in which a laser color development layer and a first transparent resin layer are stacked in the opening of the design printing sheet is fit.SELECTED DRAWING: Figure 1

Description

The present invention relates to an IC card with a lenticular lens in which an image is displayed through the lenticular lens.

In recent years, RFID has been used in various fields such as billing systems, security management systems, and distribution management systems, and the readers / writers (external devices), RFID tags, contactless IC cards, etc. used for these have not been contacted. Development of communication media is also being actively carried out.

Among them, non-contact IC cards are installed in the system because the memory of the IC chip stores confidential information that requires high security, such as personal information, account information, room entry / exit system information, and electronic money information. Such information is read and written by wireless communication with the reader / writer.

On the other hand, some contactless IC cards used for ID cards, cash cards, credit cards, etc. require confirmation of the identity of the card owner, and personal information such as the owner's face image and ID number can be obtained. It is displayed on the surface of the card. This display is also used as a means for enhancing security against counterfeiting. For example, a lenticular lens is provided on the surface of the display portion of the card to enhance authenticity determination and anti-counterfeiting.

Patent Document 1 discloses a card that uses a lenticular lens and a laser sensitive layer so that at least two different visible images of a personal identity associated with the cardholder can be seen from different viewing angles. ..

Japanese Patent Publication No. 2008-537244

When manufacturing an IC card with a lenticular lens, a transparent film on which a laser coloring layer and a lenticular lens are formed is generally laminated on a design printing sheet (see FIG. 8 showing a conventional technique).

However, since it is necessary to match the focal length of the lenticular lens with the image formed on the laser coloring layer, the thickness of the transparent film becomes thicker than that of the transparent film (oversheet) used for a normal IC card. Therefore, when the design printing sheet, laser coloring sheet (layer), and cover sheet (oversheet) are laminated on the core sheet in which the IC module and the antenna are enclosed, the total card thickness becomes about 1 mm, which is the JIS / ISO standard total thickness. It greatly exceeds 0.76 ± 0.08 mm. Therefore, in the conventional technique such as Patent Document 1, there is a problem that the card thickness becomes too large, and by extension, there is a problem that a card satisfying the JIS / ISO standard cannot be produced.

In view of the above problems, the present invention can provide the following aspects.

Aspect 1
A core sheet containing an IC chip and an antenna,
A design print sheet with an opening and
A second transparent resin layer having a lenticular lens region on which a plurality of lenses are formed is laminated in this order.
The IC card is characterized in that an image forming region in which a laser coloring layer and a first transparent resin layer are laminated is at least partially fitted in the opening of the design printing sheet.

Aspect 2
The IC card according to aspect 1, wherein at least a part of the lenticular lens region overlaps the image forming region.

Aspect 3
The IC card according to aspect 1 or 2, wherein the first transparent resin layer and the second transparent resin layer are made of substantially the same material.

Aspect 4
One of aspects 1 to 3 characterized in that a visible image is formed on the laser color-developing layer so that at least two different displays are displayed depending on the observation angle when observed through the lenticular lens region. IC card described in.

Aspect 5
The IC card according to any one of aspects 1 to 4, wherein the area of the image forming region is less than half the area of the design printing sheet with respect to the surface perpendicular to the thickness direction of the IC card.

Aspect 6
The core sheet further has a recess or hollow that overlaps at least a portion of the opening of the design print sheet.
The IC card according to any one of aspects 1 to 5, wherein a part of the image forming region is fitted and included in the recess or the hollow of the core sheet.

Aspect 7
Further, on the surface of the core sheet opposite to the surface on the side where the design printing sheet is located,
Back side design print sheet and
The IC card according to any one of aspects 1 to 6, which includes a second transparent resin layer on the back surface side.

Aspect 8
The back side design printing sheet has a back side opening.
The back surface side image forming region in which the back surface side laser coloring layer and the back surface side first transparent resin layer are laminated is at least partially fitted and included in the back surface side opening.
The IC card according to aspect 7, wherein the second transparent resin layer on the back surface side has a lenticular lens region on the back surface side on which a plurality of lenses are formed.

Aspect 9
The IC card according to aspect 7 or 8, which has a layered structure symmetrical with respect to the core sheet in the thickness direction of the IC card.

Aspect 10
The IC card according to any one of aspects 1 to 9, wherein the total thickness is 0.76 mm ± 0.08 mm.

Aspect 11
The process of preparing the core sheet containing the IC chip and antenna,
The process of preparing a laser coloring sheet in which the laser coloring layer and the first transparent resin layer are laminated, and
The process of preparing the design print sheet and
The process of preparing a resin sheet composed of a second transparent resin layer,
A step of subdividing the laser coloring sheet into a predetermined shape and
The process of forming an opening in the design printing sheet and
A step of superimposing and temporarily fixing the design printing sheet having an opening formed in the core sheet,
A step of inserting the subdivided laser coloring sheet into the opening of the design printing sheet to form an image forming region, and
A process of superimposing the resin sheet on the design printing sheet and temporarily fixing the resin sheet,
A step of hot-pressing and integrating the laminate of the core sheet, the design printing sheet, and the resin sheet, and at the same time forming a lenticular lens region in a region overlapping at least a part of the image forming region of the resin sheet. A method for manufacturing an IC card, which comprises.

Aspect 12
The IC card according to aspect 11, wherein the total length of the contour of the opening of the design printing sheet is 0.04 mm to 1.2 mm larger than the total length of the contour of the outer shape of the subdivided laser coloring sheet. Production method.

Aspect 13
The opening of the design printing sheet and the outer shape of the subdivided laser coloring sheet are both square.
The length of each side of the inner dimension of the opening of the design printing sheet is 0.01 mm to 0.3 mm larger than the length of each corresponding side of the outer shape of the subdivided laser coloring sheet. The method for manufacturing an IC card according to aspect 12.

According to the embodiment of the present invention, the total thickness of the IC card with a lenticular lens can be reduced.

Sectional drawing which shows an example of the IC card which concerns on a certain embodiment of this invention An enlarged cross-sectional view showing the lenticular lens region of the IC card of FIG. (A) Cross-sectional view showing an example of an IC card core sheet according to a certain embodiment of the present invention, (b) Cross-sectional view showing an example of an IC card design printing sheet according to a certain embodiment of the present invention. Sectional drawing which shows the manufacturing process example of the laser color development sheet which becomes the image formation region of the IC card which concerns on a certain Embodiment of this invention Sectional drawing which shows an example of the manufacturing process of the IC card which concerns on a certain embodiment of this invention. Sectional drawing which shows the IC card which concerns on another embodiment of this invention. Sectional drawing which shows the IC card which concerns on another embodiment of this invention. Sectional view showing IC card which concerns on prior art

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, for convenience, with respect to each layer constituting the IC card, the surface in the upward direction in the drawing is referred to as "front surface", and the surface on the opposite side is referred to as "back surface". In addition, the side with the front surface may be referred to as "upper" and the side with the back surface may be referred to as "lower".

In the IC card according to the embodiment of the present invention, a core sheet containing an IC chip and an antenna, a design printing sheet having an opening, and a second transparent resin layer having a lenticular lens region are laminated in this order. Includes items. Further, the opening portion of the design printing sheet includes, at least partially, an image forming region in which the laser coloring layer and the first transparent resin layer are laminated.

FIG. 1 shows a cross-sectional view of an IC card 10 according to an embodiment of the present invention. It should be noted that in FIG. 1 and other cross-sectional views shown in the present specification, the thickness of the IC card is extremely exaggerated for the sake of clarity.

The IC card 10 is formed by laminating a second transparent resin layer 61, a design printing sheet 41, a core sheet 20, a design printing sheet 42, and a second transparent resin layer 62 in the order seen from the top of FIG. It has a structure. Here, the design printing sheet 41 has an opening 43, and the first transparent resin layer 32 and the laser coloring layer 31 are laminated in the opening 43 in the order seen from the top of FIG. The structure is fitted.

The core sheet 20 includes an IC chip 21 and an antenna 22, and is responsible for the communication function of the IC card 10. The IC chip 21 may be in a modular form (that is, a modular circuit device incorporating an IC chip). The antenna 22 typically includes a conductive pattern (wiring). Generally, the core sheet 20 can be created by stacking a plurality of resin sheets and including the IC chip 21 and the antenna 22 in the resin sheet.

As the resin sheet used as the material of the core sheet 20, it is preferable to use a thermoplastic resin. More specifically, for example, PETG (non-crystalline PET copolymer), PVC (polyvinyl chloride), PC (polycarbonate), PET (polyethylene terephthalate), foamed PET, PEN (polyethylene terephthalate), ABS (acrylonitrile butadiene). -A thermoplastic resin such as styrene copolymer synthetic resin) can be used.

In the embodiment shown in FIG. 1, the core sheet 20 has a substantially smooth front surface and a back surface, on which design printing sheets 41 and 42 are laminated, respectively. In another embodiment, the core sheet 20 may be provided with a recess or a hollow on the front surface, the back surface, or both of the core sheet 20 as described later.

The IC chip 21 is generally a circuit device including a power supply circuit, a control circuit, a memory, and a transmission / reception circuit. The power supply circuit operates using the electric power received through the antenna 22 as a drive power source, and supplies power to other circuit blocks. The transmission / reception circuit is a circuit that transmits / receives a signal via the antenna 22. The control circuit is coupled to the transmission / reception circuit and the memory so that signals can be input / output, and mediates data transfer between the transmission / reception circuit and the memory. For example, the control circuit reads data from the memory according to the input signal from the transmission / reception circuit and transfers the data to the transmission / reception circuit, or writes data to the memory according to the input signal from the transmission / reception circuit. As is clear from the above description, the IC chip 21 is capable of communicating with an external communication device (external device), typically a reader / writer, via the antenna 22.

The antenna 22 can be set based on the frequency of the carrier wave used for the communication performed by the IC chip 21. In the example shown in FIG. 1, the antenna 22 is drawn as a spiral pattern that orbits inside the core sheet 20 a plurality of times. The antenna 22 can be formed by printing with a conductive ink such as silver paste or etching a metal foil such as copper foil. For example, the antenna 22 may be formed by arranging circular wires having a constant diameter (that is, wires having a circular cross section) so as to draw in a predetermined pattern.

In FIG. 1, design printing sheets 41 and 42 are laminated on the front and back surfaces of the core sheet 20, respectively. The design printing sheets 41 and 42 are layers for printing characters, figures, trademarks, etc. that are responsible for the aesthetic or functional design of the IC card 10. For example, the names or photographs of organizations or individuals who use the IC card 10 may be printed on the design printing sheets 41 and 42. Alternatively, in another embodiment, the design print sheets 41, 42 may be plain (only colored with a single color), or nothing is printed (the texture of the raw material remains). It doesn't matter if you do.

Examples of the resin material constituting the design printing sheets 41 and 42 include PETG (non-crystalline PET copolymer), PVC (polyvinyl chloride), PC (polycarbonate), PET (polyethylene terephthalate), foamed PET, and PEN (polyethylene terephthalate). ), ABS (acrylonitrile, butadiene, styrene copolymer synthetic resin) and other thermoplastic resins are preferable, but are not limited thereto.

In the embodiment shown in FIG. 1, the design printing sheet 41 located on the front surface side of the IC card 10 has an opening 43. In the opening 43, the first transparent resin layer 32 and the laser coloring layer are formed in the order seen from the top of FIG. 1 (that is, the order along the direction from the front surface to the back surface of the IC card 10). The laminated structure with 31 is fitted, and the laminated structure is also collectively referred to as an image forming region 30. The lenticular lens region 50 is provided in the upward direction of the image forming region 30 so as to overlap at least a part of the image forming region 30. As will be described in detail later, by arranging the image forming region 30 and the lenticular lens region 50 in this way, it is possible to display different images depending on the observation angle while suppressing the thickness of the IC card 10.

In another embodiment, the design printing sheet 41 on the front side may not have an opening and the design printing sheet 42 on the back side may have an opening on the back side, and an image is formed in the opening on the back side. The area may be fitted. In still another embodiment, the design printing sheets 41 and 42 may both have openings, and an image forming region may be fitted in each opening.

The image forming region 30 includes a laser coloring layer 31 and a first transparent resin layer 32. In the manufacturing process of the IC card 10, the image forming region 30 is covered with the second transparent resin layer 61 having the lenticular lens region 50, and then undergoes laser printing processing through the lenticular lens region 50 to obtain an image ( It will be possible to display a "visible image") that is preferably visible to humans. Further, if the laser printing process is performed with two or more types of incident angles, the image forming region 30 can display two or more types of images that differ depending on the observation angle.

The area of the image forming region 30 is not particularly limited as long as it is less than the area of the surface (that is, "surface") perpendicular to the thickness direction of the IC card 10, but it is less than half in view of ease of manufacture. Preferably, it may be 1/3 or less, 1/5 or less, and 1/10 or less. Further, in some embodiments, the area of the image forming region 30 may be half or less, 1/3 or less, 1/5 or less, or 1/10 or less of the area of the design print sheet 41. The lower limit of the area of the image forming region 30 is not particularly limited, and it is sufficient that an area that is easy for the user of the IC card 10 to see or an area that can be recognized by some other means is secured.

The laser color-developing layer 31 is not particularly limited as long as it is a material that develops color when irradiated with laser light, and a material that utilizes foaming, condensation, carbonization, chemical change, etc. can be used, but a material that utilizes carbonization has a color contrast. , Durability is good and preferable. Specifically, as the material of the laser coloring layer 31, a substance obtained by adding a coloring agent to a resin as a main agent can be used. Such a resin may be carbonized by the heat generated by the color former. Further, as the color former, bismuth oxide, neodymium oxide, copper / molybdenum composite oxide, antimony-doped tin oxide-coated mica, antimony-doped tin oxide / titanium oxide / silicon dioxide-coated mica and the like are preferably mentioned, but are limited thereto. Will not be done. Preferably, the laser coloring layer 31 may be a substance that generates heat by absorbing the laser light and carbonizes the resin around the coloring agent to black.

The first transparent resin layer 32 plays a role of adjusting the focal length of the lenticular lens region 50 formed on the second transparent resin layer 61. Due to the presence of the first transparent resin layer 32, the focal length of the lenticular lens region 50 with respect to the image formed on the laser coloring layer 31 can be appropriately secured even if the thickness of the second transparent resin layer 61 is reduced.

The first transparent resin layer 32 is not particularly limited as long as it is transparent and can obtain the lens effect of the lenticular lens region 50. Examples of the material of the first transparent resin layer 32 include PETG (non-crystalline PET copolymer), PVC (polyvinyl chloride), PC (polyethylene), PET (polyethylene terephthalate), foamed PET, and PEN (polyethylene naphthalate). Thermoplastic resins such as ABS (acrylonitrile-butadiene-styrene copolymer synthetic resin) can be preferably mentioned, but the present invention is not limited thereto.

In the embodiment shown in FIG. 1, second transparent resin layers 61 and 62 are further provided as the uppermost layer on the front surface and the lowermost layer on the back surface of the IC card, respectively. The second transparent resin layers 61 and 62 also serve as a so-called oversheet that protects the IC card 10. The second transparent resin layer 61 further has a lenticular lens region 50 with an arrangement that at least partially overlaps the image forming region 30. As the material of the second transparent resin layers 61 and 62, the same material as that of the first transparent resin layer 32 can be used. From the viewpoint of easy adjustment of the focal length of the lenticular lens region 50 and suppression of warpage of the IC card 10, the first transparent resin layer 32 is the second transparent resin layer 61 and / or the second transparent resin layer 62. It is preferably made of substantially the same material as.

In the embodiment shown in FIG. 1, only the second transparent resin layer 61 on the front surface side has the lenticular lens region 50, but in another embodiment, the second transparent resin layer 61 on the front surface side has a lenticular lens. The second transparent resin layer 62 on the back surface side may have a lenticular lens region on the back surface side without having a region. In yet another embodiment, the second transparent resin layers 61, 62 may both have a lenticular lens region. Still in another embodiment, one or both of the second transparent resin layers 61, 62 may have a plurality of lenticular lens regions. Further, for example, a plurality of lenticular lens regions may exist so as to overlap a part of one image forming region. In other words, the number of lenticular lens regions and the number of image forming regions do not necessarily have to match.

The thickness of each layer of the IC card 10 can be arbitrarily set, but is preferably set as follows. That is, from the viewpoint of enabling the display of a plurality of types of images depending on the observation angle, the thickness of the second transparent resin layer 61 is preferably 0.10 mm or more. It should be noted that the slight thickness of the lenticular lens region 50 is practically negligible. The thickness of the second transparent resin layer 62 on the back surface side is preferably about the same as that of the second transparent resin layer 61 from the viewpoint of suppressing the warp of the IC card 10.

The thickness of the laser coloring layer 31 (and other laser coloring layer if present) is preferably about 0.5 mm to 0.10 mm from the viewpoint of ensuring the coloring density.

The thickness of the design printing sheets 41 and 42 is preferably about 0.05 mm to 0.20 mm from the viewpoint of concealing the parts enclosed in the IC card 10 and from the viewpoint of obtaining the positioning accuracy in the offset printing machine. ..

The thickness of the core sheet 20 is preferably about 0.30 mm to 0.60 mm because it is necessary to accommodate the parts enclosed in the IC card 10.

The total thickness of the IC card 10 is preferably 0.76 mm ± 0.08 mm in view of the provisions of JIS X6301: 2005 (or the corresponding ISO / IEC 7810: 2003). Further, the IC card 10 may have a layer other than that shown in FIG.

In some embodiments, in order to reduce the warp (deformation) of the IC card 10, it is preferable that the layer structure of the IC card 10 is symmetrical with respect to the thickness direction of the IC card 10 about the core sheet 20. The term "symmetrical" as used herein means that the second transparent resin layer 61, the design printing sheet 41, the core sheet 20, the design printing sheet 42, and the second transparent resin layer 62 are laminated in this order from the top. It should be noted that the image forming region 30 and the lenticular lens region 50 are not considered for convenience.

FIG. 2 is an enlarged view of a lenticular lens region 50 provided on the second transparent resin layer 61 included in the IC card 10 of FIG. The lenticular lens region 50 includes a plurality of lenses. The parameters related to the lens are defined by the following formula.
t = 1.5R
Here, P is the lens pitch, R is the lens radius, D is the lens depth, and t is the thickness of the transparent resin layer.

The thickness t of the transparent resin layer is the total thickness of the first transparent resin layer 32 and the second transparent resin layer 61 in the present embodiment. Therefore, the thickness of the second transparent resin layer 61 can be reduced. For example, if the lens pitch P = 103 μm, the lens radius R = 65 μm, and the lens depth D = 25 μm, a thickness t = 98 μm is required. Then, by setting the thickness of the first transparent resin layer 32 to 50 μm, the thickness of the second transparent resin layer 61 can be set to 48 μm. Therefore, the thickness of the IC card 10 can be reduced to a extent that cannot be realized by the IC card according to the conventional technique (about 75% of the conventional technique shown in FIG. 8) without impairing the function of the lenticular lens.

The lenticular lens region 50 may be formed as a part (that is, the same material) of the second transparent resin layer 61, or may be made of a different material. Through the lenticular lens region 50, the image formed on the laser coloring layer 31 can be observed, and preferably two or more different images can be observed depending on the observation angle.

The area of the lenticular lens region 50 can be arbitrarily set according to the area of the image forming region 30, but from the viewpoint of cost and design, it is preferably about 5 to 8% of the surface of the IC card 10. This is because the press plate for forming the lenticular lens region 50 and the laser printing process for forming an image are also costly, and if the area is too large, the cost burden increases. Another reason is that if the lenticular lens region 50 is too large, the displayability and design of the IC card 10 itself will be impaired.

Hereinafter, an example of a method for manufacturing the IC card 10 will be further described with reference to FIGS. 3 to 5.

FIG. 3A is a cross-sectional view showing an example of the core sheet 20 of the IC card 10. In the production of the core sheet 20 shown here, for example, first, a through-hole-shaped or recess-shaped space is provided in the resin sheet to be the support substrate. Then, the IC chip 21 (circuit device) is arranged in the vacant space. Further, a conductive pattern to be the antenna 22 is wired on the surface of the support substrate. As a wiring method, for example, a method of arranging the wires in a predetermined shape can be used in a manner of embedding in the surface of the support substrate by utilizing the principle of ultrasonic fusion. In this case, the surface of the support substrate is melted by ultrasonic fusion, and the wire is embedded in the surface of the support substrate. In ultrasonic fusion, it is preferable to use a wiring drawing device capable of embedding the wire in the surface of the support substrate while feeding out the wire. Next, the wire end of the conductive pattern and the circuit device are electrically connected in the space. For the connection, for example, solder, which is a typical example of a conductive material, can be used, and a short circuit can be made between the wire end portion and the connection terminal portion of the circuit device via the solder. After that, if necessary, another resin sheet, for example, a laminated film made of a thermoplastic resin material, is laminated on the front and back surfaces of the support substrate and brought into close contact with each other by a heating press to form a core sheet containing the IC chip 21 and the antenna 22. 20 can be produced.

FIG. 3B is a cross-sectional view showing an example of the design printing sheets 41 and 42. The design printing sheets 41 and 42 are printed as needed, and the opening 43 is punched out in the design printing sheet 41 forming the image forming region 30. A laser coloring sheet that later becomes an image forming region 30 is inserted into the opening 43. From the viewpoint of improving workability and finish after laminating, the punching size (that is, the total length of the contour of the opening 43) is 0.04 mm to 1 than the total length of the contour of the outer shape of the laser coloring sheet to be inserted later. It is preferable to increase the size by .2 mm. In some embodiments, the outer shape of the opening 43 and the laser coloring sheet may both be square, and the length of each side of the inner dimension of the opening at that time is the length of each side corresponding to the outer shape of the laser coloring sheet. It is preferably 0.01 mm to 0.3 mm larger than the length.

FIG. 4A is a cross-sectional view showing an example of the laser coloring sheet 70 which is the source of the image forming region 30. The laser coloring sheet 70 can be formed by laminating a resin sheet 72 to be the first transparent resin layer 32 and a laser coloring layer 71. The laser coloring layer 71 may be formed by coating, or may be heat-sealed by laminating if it is in the form of a sheet. The laser coloring sheet 70 thus obtained is punched into a predetermined shape with a biku blade or the like as shown in FIG. 4B to obtain a subdivided laser coloring sheet 73 as shown in FIG. 4C. The shape of the subdivided laser coloring sheet 73 is preferably adjusted in size as described above according to the shape of the opening 43.

FIG. 5 is a cross-sectional view showing an example of a manufacturing process of the IC card 10. After preparing the core sheet 20, the design printing sheets 41 and 42, and the subdivided laser coloring sheet 73 as described above, the design printing sheet 41 having the opening 43 formed is superposed on the core sheet 20 and temporarily fixed. Then, the subdivided laser coloring sheet 73 is inserted into the opening 43 to form the image forming region 30. Next, the second transparent resin layer 61 is superposed on the design printing sheet 41 and temporarily fixed, and the laminated body in which the core sheet 20, the design printing sheet 41 and the second transparent resin layer 61 are superposed is hot-pressed. Integrate. At the same time, the lenticular lens region 50 is formed in the region overlapping the image forming region 30 of the second transparent resin layer 61. In this example, the lenticular lens region 50 can be formed by using a press plate having a recess having a lens shape formed by laser cutting. As described above, in the IC card 10, since the laser coloring layer is formed only in the necessary portion, the amount of expensive laser coloring sheet used can be suppressed, and a significant cost reduction effect can be obtained.

FIG. 6 is a cross-sectional view showing the IC card 100 according to another embodiment. The IC card 100 is the same as the IC card 10 of FIG. 1, except that the core sheet 20 has a recess and the image forming region 30 is fitted in the recess. With such a configuration, the degree of freedom in adjusting the focal length for the lenticular lens region 50 can be further increased.

FIG. 7 is a cross-sectional view showing the IC card 200 according to still another embodiment. The IC card 200 is the same as the IC card 10 of FIG. 1, but the core sheet 20 has a hollow, and an image forming region 30 penetrating the core sheet 20 is provided so as to fill the hollow. Is different. Further, the design printing sheet 42 on the back surface side also has an opening, and the second transparent resin layer 62 on the back surface side also has a lenticular lens region 50, and the image forming region 30 is the first on the front surface side. It is also different from having the transparent resin layer 32, the laser coloring layer 31, and the first transparent resin layer 32 on the back surface side. According to such a configuration, not only the degree of freedom of adjusting the focal length for the lenticular lens region 50 can be further increased, but also images can be displayed on both the front and back surfaces.

(Example 1)
[Preparation of core sheet]
Three PETGs (product name: PG-WHI-FG) manufactured by Mitsubishi Chemical Corporation with a thickness of 0.15 mm were bonded together, and an IC module and an antenna were enclosed therein to prepare a core sheet with a thickness of 0.45 mm. A MOA4 module (product name Mifare1k) manufactured by NXP was used as the IC module, and a self-bonded coated copper wire AB15 (φ0.115 mm) manufactured by Electric Zora was used as the antenna wire. The antenna wire was formed while being embedded in the PETG sheet by ultrasonic waves using a wiring drawing device, and solder was used to connect the antenna wire and the IC module. The sheets were laminated by using a multi-stage heat-cooling press manufactured by Burkure Co., Ltd. under the processing conditions of a temperature of 135 ° C., a pressure of 50 N / cm ² , and a processing time of 20 minutes.

[Making a design print sheet]
Two PETGs (product name PG-WHI-FG) manufactured by Mitsubishi Chemical Corporation with a thickness of 0.10 mm were prepared for the front surface and the back surface, and the design design was printed by offset printing. A through hole (opening) was formed in the image forming region portion of the design printing sheet for the front surface by punching with a biku blade having a size of 12.1 mm × 17.1 mm and a corner of R1.5.

[Making a laser coloring sheet]
Mitsubishi Chemical's PETG (product name PG-MCT) with a thickness of 0.05 mm and Mitsubishi Chemical's laser coloring film (product name DPI-TR) with a thickness of 0.06 mm are laminated and integrated into a single sheet. I made a sheet. The sheet was punched with a big blade having a size of 12.0 mm × 17.0 mm and a corner of R1.5 to prepare a subdivided laser coloring sheet.

[Preparation of image formation region]
The design printing sheet was temporarily fixed to the front and back of the core sheet with an ultrasonic sealer. A laser coloring sheet was inserted into the through hole of the design printing sheet in which the through hole was formed, and fixed to the core sheet with an ultrasonic sealer.

[Preparation of lenticular lens area]
A design printing sheet was temporarily fixed to the front and back of the core sheet. An oversheet having a thickness of 0.05 mm, which is the outermost layer of the card, was temporarily fixed to the front and back of the sheet. Transparent PETG (product name PG-MCT) manufactured by Mitsubishi Chemical Corporation was used for the oversheet.

Next, the collated (temporarily fixed) sheets were laminated with a vacuum laminator MP600 manufactured by Meiki Co., Ltd., and the bonded sheets were integrally molded by heat and pressure. It was processed under the conditions of a temperature of 135 ° C., a pressure of 7.5 MPa, and a time of 5 minutes. A special press plate manufactured by 4PLATE was used to form the lenticular lens. The lenticular lens portion has a recess formed by laser cutting the press plate, and resin is pressed into this portion so that a lens shape is formed. The recess has a lens pitch P = 103 μm, a lens radius R = 65 μm, and a lens depth D = 25 μm.

Each of the above steps was performed on a sheet capable of collectively manufacturing a plurality of IC cards. After each step, the sheet was cut into a predetermined shape to obtain an IC card. The total thickness of the IC card was 0.05 + 0.10 + 0.45 + 0.10 + 0.05 = 0.75 mm.

[Verification by laser printing]
Two types of images were recorded in the lenticular lens region of the produced IC card by using a desktop laser issuing machine POWRE PERSO DLE manufactured by Ruler Mat, which was shifted from the vertical direction by 15 degrees to the left and right. As a result, it was confirmed that the two types of images are good variable print images that can be visually recognized only from different angles.

(Comparative Example 1)
Each layer was formed in the same manner as in Example 1 to obtain an IC card. However, the thickness of the oversheet was set to 0.10 mm, and no opening was provided in any of the design printing sheets. Further, a laser coloring layer having a thickness of 0.06 mm is placed between the front side oversheet and the front side design printing sheet, and another design printing sheet having a thickness of 0.06 mm is placed between the back side oversheet and the back side design printing sheet. , Each sandwiched. The total thickness of the IC card was 0.10 + 0.06 + 0.10 + 0.45 + 0.10 + 0.06 + 0.10 = 0.97 mm.

(Comparative Example 2)
Each layer was formed in the same manner as in Comparative Example 1 to obtain an IC card. However, the thickness of the back side oversheet was set to 0.05 mm, and the design printing sheet was not sandwiched between the back side oversheet and the back side design printing sheet to form an asymmetric layer structure. The total thickness of the IC card was 0.10 + 0.06 + 0.10 + 0.45 + 0.10 + 0.05 = 0.86 mm.

Twenty-four IC cards according to Example 1, Comparative Example 1, and Comparative Example 2 were prepared, and the warp was measured according to JIS X6301: 2005 to calculate the average value. The results are shown in the table below.

In Example 1, not only the thickness could be reduced, but also the warp could be kept within the range specified by the JIS / ISO standard. On the other hand, in Comparative Example 1, a large thickness was required to secure the focal length of the lenticular lens. Further, in Comparative Example 2, the warp deviated from the range specified by the JIS / ISO standard.

10 IC card 20 Core sheet 21 IC chip 22 Antenna 30 Image formation area 31 Laser coloring layer 32 First transparent resin layer 41, 42 Design printing sheet 43 Opening 50 Wrenchular lens area 61, 62 Second transparent resin layer 70 Laser Color development sheet 71 Laser color development layer 72 Resin sheet 73 Subdivided laser color development sheet 100 IC card 200 IC card

Claims (13)

A core sheet containing an IC chip and an antenna,
A design print sheet with an opening and
A second transparent resin layer having a lenticular lens region on which a plurality of lenses are formed is laminated in this order.
The IC card is characterized in that an image forming region in which a laser coloring layer and a first transparent resin layer are laminated is at least partially fitted in the opening of the design printing sheet. The IC card according to claim 1, wherein at least a part of the lenticular lens region overlaps the image forming region. The IC card according to claim 1 or 2, wherein the first transparent resin layer and the second transparent resin layer are made of substantially the same material. Any of claims 1 to 3, wherein a visible image is formed on the laser color-developing layer so that at least two displays different depending on the observation angle are formed when observing through the lenticular lens region. The IC card described in item 1. The IC card according to any one of claims 1 to 4, wherein the area of the image forming region is less than half the area of the design printing sheet with respect to the surface perpendicular to the thickness direction of the IC card. The core sheet further has a recess or hollow that overlaps at least a portion of the opening of the design print sheet.
The IC card according to any one of claims 1 to 5, wherein a part of the image forming region is fitted and included in the recess or the hollow of the core sheet. Further, on the surface of the core sheet opposite to the surface on the side where the design printing sheet is located,
Back side design print sheet and
The IC card according to any one of claims 1 to 6, which includes a second transparent resin layer on the back surface side. The back side design printing sheet has a back side opening.
The back surface side image forming region in which the back surface side laser coloring layer and the back surface side first transparent resin layer are laminated is at least partially fitted and included in the back surface side opening.
The IC card according to claim 7, wherein the second transparent resin layer on the back surface side has a lenticular lens region on the back surface side on which a plurality of lenses are formed. The IC card according to claim 7 or 8, which has a layered structure symmetrical with respect to the core sheet in the thickness direction of the IC card. The IC card according to any one of claims 1 to 9, wherein the total thickness is 0.76 mm ± 0.08 mm. The process of preparing the core sheet containing the IC chip and antenna,
The process of preparing a laser coloring sheet in which the laser coloring layer and the first transparent resin layer are laminated, and
The process of preparing the design print sheet and
The process of preparing a resin sheet composed of a second transparent resin layer,
A step of subdividing the laser coloring sheet into a predetermined shape and
The process of forming an opening in the design printing sheet and
A step of superimposing and temporarily fixing the design printing sheet having an opening formed in the core sheet,
A step of inserting the subdivided laser coloring sheet into the opening of the design printing sheet to form an image forming region, and
A process of superimposing the resin sheet on the design printing sheet and temporarily fixing the resin sheet,
A step of hot-pressing and integrating the laminate of the core sheet, the design printing sheet, and the resin sheet, and at the same time forming a lenticular lens region in a region overlapping at least a part of the image forming region of the resin sheet. A method for manufacturing an IC card, which comprises. The IC card according to claim 11, wherein the total length of the contour of the opening of the design printing sheet is 0.04 mm to 1.2 mm larger than the total length of the contour of the outer shape of the subdivided laser coloring sheet. Manufacturing method. The opening of the design printing sheet and the outer shape of the subdivided laser coloring sheet are both square.
The length of each side of the inner dimension of the opening of the design printing sheet is 0.01 mm to 0.3 mm larger than the length of each corresponding side of the outer shape of the subdivided laser coloring sheet. The method for manufacturing an IC card according to claim 12.