JP2020127952A - Laser machining device and laser machining method - Google Patents

Abstract

To subject a work-piece to groove formation machining by irradiation of laser beams.SOLUTION: A laser machining device 1 is configured to comprise machining heads 4 attached to a manipulator 3 of a robot 2, a control device 7 and a gas nozzle 8 for assist gas 9. The control device 7 comprises a function of controlling the manipulator 3 so that operation of moving the machining heads 4 in a longitudinal direction of a groove 103 to be formed in a work-piece 100 is executed as one pass in laser machining. The control device 7 further comprises an end part machining control function of tilting the machining heads 4 mutually oppositely in an x-shaft direction, when performing laser machining to a machining position first in an arrangement order and a machining position M-th in the order, of machining positions of M-pieces of pass arranged in the groove-width direction as the x-axis direction, when laser machining of one-layer M pass (M is three or more integers) is set.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laser processing apparatus and a laser processing method for irradiating a work with a laser beam to perform processing such as groove formation and cutting.

A method using a laser beam has been conventionally proposed as one of the methods for forming a groove in a work (object to be processed). This is done by irradiating a workpiece with a laser beam and using the assist gas that blows the molten material of the base material of the workpiece generated at the location where the laser beam is irradiated (hereinafter referred to as the laser beam irradiation location) from the assist gas nozzle. This is a method of forming a groove in a work by blowing it off and performing this treatment continuously along the planned groove formation position in the work (for example, refer to Patent Document 1).

In this method, the laser beam is applied through a condenser lens so that the laser beam is condensed from a direction orthogonal to the surface of the work so as to be slightly behind the surface of the work.

JP-A-5-131286

By the way, in laser processing in which a groove is formed by irradiating a work with a laser beam, usable laser beam output, work material properties such as material and melting temperature and internal structure, and processing speed and processing environment Depending on the conditions, the depth of the groove that can be formed in the work by one laser processing may not reach the planned groove depth.

As a countermeasure against this, the inventors of the present invention gradually increase the depth of the groove to be formed in the work by repeatedly performing the laser processing for forming the groove on the work in a plurality of passes to form the groove of a desired depth. Thought.

However, it is difficult to increase the depth of the groove formed in the work by the conventional method of forming the groove by the laser processing, even if the laser processing is repeatedly performed at one place on the work in a plurality of passes. It is the actual situation.

That is, in the conventional groove forming method by laser processing, the laser beam is focused slightly behind the surface of the work and the work is irradiated with the laser beam at or near the focus position where energy is concentrated. ing. Therefore, in the work, the range where the molten material is generated at the laser beam irradiation position is usually about several millimeters at the maximum. Further, since the laser beam is irradiated from the direction orthogonal to the surface of the work, the groove is formed from the opening of the groove on the surface of the work to the inside of the work along the direction perpendicular to the surface of the work. Is formed to extend to. Therefore, the cross-sectional shape of the groove formed in the work is such that the width of the groove in the opening on the surface of the work is about several millimeters and the dimension of the groove width gradually decreases from the opening to the bottom. It becomes a narrow V-shaped groove.

The shape of the groove is formed as a result of the melting by the laser beam irradiated through the opening of the groove on the surface of the work and the removal of the molten material by spraying the assist gas.

Therefore, according to the conventional groove forming method by laser processing, the same V-shaped groove formed on the workpiece in the first pass as the second pass through the opening is used as the second pass. Even if the beam is irradiated, it is difficult to further melt the bottom of the groove.

Moreover, in the laser processing of the second pass, it is difficult to shift the focus position of the laser beam to the inner side of the groove as compared with the first pass. This is because when the beam diameter of the laser beam before reaching the focus increases, the laser beam interferes with the side wall of the groove formed in the first pass.

Therefore, heretofore, a method of forming a groove by performing a plurality of passes of groove forming processing by irradiating a workpiece with a laser beam has not been particularly proposed.

Therefore, the present invention aims to provide a laser processing apparatus and a laser processing method capable of performing groove forming processing by irradiating a laser beam on a work in a plurality of passes to gradually increase the groove depth. To do.

The present invention, in order to solve the above problems, a robot provided with a manipulator, a machining head attached to the tip side of the manipulator, a laser oscillator connected to the machining head, a control device, and the machining head. A gas nozzle that blows an assist gas to the irradiation position of the laser beam from, and a groove detection device, the control device, a function for setting a groove formation planned position for the work, the machining head, the work The operation of moving along the longitudinal direction of the groove to be formed has a function of being set as one pass of laser processing and a function of setting laser processing of one layer M pass (M is an integer of 3 or more). The groove width direction of the groove to be formed is the x-axis direction, the longitudinal direction of the groove is the y-axis direction, and the depth direction of the groove is the z-axis direction. A path machining position setting function for setting M path machining positions arranged in the axial direction, a function for giving a command for executing the pass to each of the path machining positions to the manipulator, and an arrangement in the x-axis direction When performing the laser processing at the first pass processing position and the Mth pass processing position in the order, a laser having a configuration having an end processing control function for inclining the processing heads in opposite directions to each other in the x-axis direction. The processing equipment.

The control device adjoins the laser processing at the pass processing position having the first arrangement order in the x-axis direction with respect to the M path processing positions set side by side in the x-axis direction by the pass processing position setting function. The condition that the laser machining is performed after the laser machining at the second pass machining position in the x-axis direction and the laser machining at the M-th pass machining position in the x-axis direction is the adjacent x-axis. A machining sequence setting function for setting a machining sequence for performing laser machining so that the condition that the arrangement sequence in the direction is performed after the laser machining at the (M-1)th pass machining position is satisfied; When laser processing is performed at the second to the (M-1)th path processing positions in the axial direction, the processing head is controlled so that the laser beam irradiation direction is the z-axis and the y-axis. It may be configured to further include an intermediate portion processing control function of controlling the posture along a plane parallel to both.

The processing head may include a nozzle that irradiates the laser beam to the outside through an opening on the tip side, and further may have a configuration in which the focus of the laser beam is arranged at the position of the opening of the nozzle.

The processing head may include a nozzle that irradiates the laser beam to the outside through an opening on the tip side, and may further have a function of blowing a purge gas to the outside through the opening of the nozzle.

Further, the operation of moving the processing head that irradiates the laser beam along the longitudinal direction of the groove formed in the work is set as one pass of the laser processing in the control device by setting the planned groove formation position for the work. And a process in which laser processing of one layer M pass (M is an integer of 3 or more) is set in the control device, and the control device sets the groove width direction of the groove to be formed in the x-axis direction. A process of arranging M pass processing positions side by side in the x-axis direction at positions where the groove is to be formed in the workpiece, with the longitudinal direction of the groove as the y-axis direction and the depth direction of the groove as the z-axis direction. And the processing for giving a command for executing the pass to the manipulator at each of the pass machining positions, and the control device further arranges that the arrangement order in the x-axis direction is the first. When performing the laser processing at the pass processing position and the M-th pass processing position, a laser processing method is performed in which the processing heads are controlled so as to incline in opposite x-axis directions.

According to the laser processing apparatus and the laser processing method of the present invention, it is possible to perform groove forming processing by irradiating a work with a laser beam in a plurality of passes to gradually increase the groove depth.

It is a schematic side view which shows 1st Embodiment of a laser processing apparatus. It is a side view which expands and shows a processing head. It is a cutting side view which further expands and shows the tip vicinity of the nozzle of a processing head. It is a figure for demonstrating the attitude|position of the processing head which laser-processes a workpiece. It is a figure for demonstrating the attitude|position of the processing head which laser-processes the bottom part of the groove already formed. FIG. 9 is a schematic diagram showing three pass processing positions which are set side by side in the groove width direction by a control device when performing laser processing for one layer and three passes in a groove formation direction. It is a figure for demonstrating setting of the irradiation direction of a laser beam by a processing head at the time of performing laser processing in the 1st and last pass processing positions in an arrangement sequence among each pass processing position. FIG. 6 is a schematic diagram showing four pass processing positions set side by side in the groove width direction when performing laser processing of one layer and four passes. FIG. 9 is a schematic diagram showing five pass processing positions set side by side in the groove width direction when performing laser processing of one layer and five passes.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic side view showing a first embodiment of a laser processing apparatus. FIG. 2 is a side view showing an enlarged processing head of the laser processing apparatus. FIG. 3 is a cut side view showing the vicinity of the tip of the nozzle in the processing head in a further enlarged manner.

FIG. 4 shows the posture of the processing head in the laser processing apparatus. FIG. 4A shows the positions of the grooves to be formed in the workpiece arranged in the groove width direction in order to perform laser processing of one layer and three passes. FIG. 4B is a diagram showing a state in which the laser processing is performed at the second pass processing position having the second arrangement order in the groove width direction among the three pass processing positions. FIG. 4B shows the first arrangement order in the groove width direction. FIG. 4C is a diagram showing a state when performing laser processing at the pass processing position, and FIG. 4C is a diagram showing a state when performing laser processing at the third pass processing position in the groove width direction. FIG. 5 shows the posture of the processing head in the laser processing apparatus. FIG. 5A shows a groove out of three pass processing positions set side by side in the groove width direction at the bottom of the groove formed in the work. FIG. 5B is a diagram showing a state in which the laser processing is performed at the second pass processing position in the width-direction arrangement order, and FIG. 5B shows when performing the laser processing at the first pass processing position in the groove-width arrangement order. FIG. 5C is a diagram showing a state when laser processing is performed at a pass processing position where the arrangement order in the groove width direction is the third. FIG. 6 is a schematic diagram showing three pass processing positions which are set by the controller at the planned groove formation positions in the workpiece when performing laser processing for one layer and three passes.

The laser processing apparatus of the present embodiment is shown by reference numeral 1 in FIG. 1, and includes a robot 2 having a manipulator 3, a processing head 4 attached as an end effector on the tip side of the manipulator 3, and an optical beam to the processing head 4. A laser oscillator 6 connected via a fiber 5, a control device 7, a gas nozzle 8 for injecting an assist gas 9, and a camera 10 as a groove detection device are provided.

For convenience of description, the surface of the workpiece 100 on which the groove 103 is formed by laser processing by the processing head 4 is referred to as a front surface 101, and the surface on the opposite side is referred to as a back surface 102.

Further, regarding the groove 103 to be formed in the work 100 and the groove 103 formed in the work 100, the groove width direction is referred to as the x-axis direction, as shown in FIG. In the x-axis, the direction from one end 104 in the groove width direction of the groove 103 to the other end 105 in the groove width direction is the positive direction of the x-axis. Therefore, based on the x-axis, the end of the groove 103 in the negative direction of the x-axis is the end 104, and the end of the groove 103 in the positive direction of the x-axis is the end 105. Further, the groove longitudinal direction in which the groove 103 extends along the surface 101 of the work 100 is referred to as the y-axis direction, as shown in FIG. Further, the depth direction of the groove 103 with respect to the surface 101 of the work 100 is referred to as the z-axis direction as shown in FIGS. 2 and 4A. Note that the x-axis direction, the y-axis direction, and the z-axis direction are directions that are determined depending on the posture of the work 100 and the groove 103 formed in the work 100, and are all provided in the world coordinate system or the robot 2. It is not based on the coordinate system. For example, when forming a curved groove 103 on the surface 101 of the work 100, the x-axis direction and the y-axis direction change at each position in the longitudinal direction of the groove 103. Further, the x-axis direction and the y-axis direction are not limited to the horizontal direction and the z-axis direction is not limited to the vertical direction depending on the inclination of the surface 101 of the work 100. Further, it goes without saying that the positive direction and the negative direction with respect to the x-axis, the y-axis, and the z-axis may be set oppositely.

Further, as shown in FIG. 2, the processing head 4 for irradiating the laser beam 11 blows the molten material 15 generated at the irradiation position of the laser beam 11 by the assist gas 9 blown from the gas nozzle 8 while the workpiece 100 is being blown. The operation of moving along the longitudinal direction of the groove 103 to be formed is called a laser processing pass. When this laser processing pass is performed once, a single groove is formed on the work 100 along the path along which the irradiation point of the laser beam 11 has moved, in which the base material of the work 100 has been removed. The groove formed by one pass of laser processing as described above is hereinafter referred to as a unit groove. The unit groove has a smaller width dimension in the x-axis direction and a smaller depth dimension in the z-axis direction than the groove 103 to be formed in the work 100.

The position of the irradiation position of the laser beam 11 by the processing head 4 is set to be smaller than the width dimension of the unit groove in the x-axis direction without changing the distance of the processing head 4 from the surface 101 of the workpiece 100. When the laser processing pass is performed a plurality of times while shifting the respective dimensions, the unit groove is formed in the work 100 in a state where a plurality of unit grooves are connected in the x-axis direction. This state is along the surface 101 of the work 100 in which the depth dimension in the z-axis direction of the work 100 is almost the same as that of the unit groove and the width dimension in which a plurality of the unit grooves are connected in the x-axis direction. The base material of the work 100 has been removed from the layered region. Therefore, in this state, the work 100 is in a state in which a groove having a cross-sectional shape corresponding to the layered region is formed from the surface 101.

Therefore, in the present specification, as described above, the irradiation position of the laser beam 11 by the processing head 4 in the x-axis direction is set to the predetermined position in the processing head 4 without substantially changing the distance from the surface 101 of the work 100. A laser machining pass is performed n times (n is an integer of 2 or more) while shifting the dimensions to form a groove having a cross-sectional shape corresponding to the layered region in the work 100, which is referred to as one-layer n-pass laser machining. .. Further, n is called the number of passes per layer. Further, the position where individual unit grooves are to be formed by laser processing of each pass before performing laser processing of one-layer n-pass on the work 100 is referred to as a path processing position individually corresponding to each pass.

The robot 2 has a movement range and an angle adjustment range of the processing head 4 by the manipulator 3, which moves the processing head 4 in a predetermined posture to be described later over the entire length of a portion where the groove 103 is formed in the work 100. It is set to include the operating range and the angle adjustment range.

The processing head 4 is internally provided with a condensing optical system (not shown) such as a lens and a condensing mirror for condensing the laser beam transmitted from the laser oscillator 6 via the optical fiber 5 as a laser beam 11. For convenience of illustration, the laser beam 11 is shown with hatching of dots (the same applies to FIGS. 3, 4A, 4B, and 5C, 5A, 5B, and 5C).

Further, as shown in FIG. 3, the processing head 4 is provided with a nozzle 12 for irradiating the laser beam 11 condensed by the condensing optical system to the outside through the opening 13 on the tip side.

In the processing head 4, it is preferable that the focal length of the focusing optical system is set such that the focus of the laser beam 11 focused by the focusing optical system is located at the position of the opening 13 of the nozzle 12. This is for the following reason.

Although not shown, in the case of processing for cutting the work 100 by laser, a groove penetrating from the front surface 101 to the back surface 102 is formed in the work 100. Therefore, the molten material generated at the irradiation spot of the laser beam 11 on the work 100 can be blown off to the back surface 102 side of the work 100 through the already formed groove to be removed.

On the other hand, as shown in FIG. 2, in the case of processing in which the groove 103 not penetrating the back surface 102 is formed in the work 100, the molten material 15 blown off from the irradiation portion of the laser beam 11 is the surface of the work 100 from the groove 103. It will be discharged to the 101 side. Therefore, when performing the process of forming the groove 103 in the work 100, the environment on the surface 101 side of the work 100 in which the processing head 4 is arranged becomes an environment in which the blown molten material 15 may scatter.

In this environment, the opening 13 of the nozzle 12 of the processing head 4 may serve as a path for the scattered molten material 15 to enter the processing head 4. If the molten material 15 scattered into the processing head 4 intrudes, the optical system including the focusing optical system may be damaged.

Therefore, in the laser processing apparatus 1 of the present embodiment, in order to perform the processing for forming the groove 103 in the work 100, the scattered molten material 15 reaches the opening 13 of the nozzle 12 of the processing head 4, or It is important to take measures to prevent the scattered molten material 15 from entering the processing head 4 through the opening 13 of the nozzle 12.

Therefore, the processing head 4 in the present embodiment is configured such that the focal point of the laser beam 11 is arranged at the position of the opening 13 of the nozzle 12, so that the focal point of the laser beam 11 is arranged at a position other than the opening 13 of the nozzle 12. The opening area of the opening 13 of the nozzle 12 can be set smaller than that of the above configuration. As a result, the processing head 4 according to the present embodiment can suppress the possibility that the scattered molten material 15 enters the inside of the processing head 4 through the opening 13.

Note that the processing head 4 is limited to a configuration in which the focus of the laser beam 11 is arranged at the position of the opening 13 of the nozzle 12 as long as it can irradiate the workpiece 100 with the laser beam 11 with a set spot size. Of course not.

Furthermore, it is preferable that the processing head 4 is provided with a configuration in which at least the internal space of the nozzle 12 is supplied with the purge gas 14 from a purge gas supply unit (not shown). As the purge gas 14, for example, air is supplied to the internal space of the processing head 4 at a pressure of 0.6 to 0.7 MPa. As a result, the processing head 4 can have a function of blowing the purge gas 14 supplied from the purge gas supply unit to the outside through the opening 13 of the nozzle 12, as shown in FIG. Therefore, according to this configuration, since the processing head 4 can form the outward gas flow of the purge gas 14 in the opening 13 of the nozzle 12, the scattered molten material 15 enters the inside of the processing head 4 through the opening 13. The possibility can be further suppressed. It should be noted that the gas type of the purge gas 14 and the supply pressure are not limited to those in the above example, and may be appropriately changed.

Further, in the processing head 4, the larger the distance from the nozzle 12 to the irradiation position of the laser beam 11 on the work 100 (hereinafter, referred to as the nozzle-work distance), the larger the molten material scattered from the irradiation position of the laser beam 11 is. The possibility that 15 will reach the opening 13 of the processing head 4 is reduced.

Therefore, in the laser processing apparatus 1 of the present embodiment, the distance between the nozzle and the work is set to a certain dimension, as an example will be described later. As a result, the laser processing apparatus 1 according to the present embodiment can suppress the scattered molten material 15 from reaching the opening 13 of the nozzle 12 of the processing head 4 based on the size of the nozzle-work distance. it can.

Further, in the present embodiment, it is possible to suppress the influence of the gas flow of the purge gas 14 blown out from the nozzle 12 on the process of blowing the molten material 15 by the assist gas 9 performed at the irradiation position of the laser beam 11 on the work 100. As a purpose, the distance between the nozzle and the work is set to the certain dimension.

Note that the laser processing apparatus 1 of the present embodiment can suppress the possibility that the scattered molten material 15 reaches the opening 13 of the processing head 4 based on the size of the distance between the nozzle and the work, when the processing head 4 is processed. Needless to say, it is not limited to the configuration having the function of blowing the purge gas 14 from the opening 13 of the nozzle 12 to the outside.

In the present embodiment, since the focus of the laser beam 11 is arranged at the position of the opening 13 of the nozzle 12, the laser beam 11 emitted toward the outside from the nozzle 12 increases as the distance from the nozzle 12 increases. , The beam diameter gradually expands. The relationship between this distance and the beam diameter depends on the focal length of the processing head 4 by the focusing optical system and the like.

Therefore, in the present invention, for example, in a state where the nozzle-work distance is about 150 mm, the laser beam 11 is irradiated as a spot having a beam diameter of about 10 mm on the formation portion of the groove 103 by laser processing on the work 100. In addition, the focusing optical system of the processing head 4 is set. Further, in this state, the energy of the laser beam 11 is set so that the molten material 15 as the base material of the work 100 is generated at the irradiation position of the laser beam 11 on the work 100.

The holding of the predetermined nozzle-workpiece distance may be realized by the operation of the manipulator 3 that holds the processing head 4, and the operation of the manipulator 3 may be controlled by a command from the control device 7.

As a result, in the laser processing apparatus 1 of the present embodiment, when the laser beam 11 is emitted from the processing head 4 to the workpiece 100, the irradiation spot of the laser beam 11 on the workpiece 100 corresponds to the spot of the emitted laser beam 11. It is possible to form a molten pool of a desired size.

When performing processing for forming the groove 103 on the work 100, the laser processing apparatus 1 of the present embodiment moves the processing head 4 relative to the work 100 in the groove longitudinal direction by the operation of the manipulator 3, as described later. Then, the irradiation position of the laser beam 11 is moved along the planned formation position and the formation position of the groove 103 in the work 100.

At this time, in the laser processing apparatus 1 of the present embodiment, for example, when the relative movement direction of the processing head 4 with respect to the work 100 is the direction shown by the arrow D in FIGS. 1 and 2, the processing head 4 moves to the work 100. On the other hand, it is preferable that the processing head 4 is inclined so that the direction of irradiating the laser beam 11 is obliquely directed to the front side in the direction of the arrow D. Hereinafter, this tilted posture is referred to as the forward angle posture of the processing head 4. 1 and 2, the direction of the arrow D is the positive direction of the y-axis, but in the case of performing laser processing of a plurality of passes, it is the forward path of the processing head 4 that reciprocates along the longitudinal direction of the groove 103. Of course, laser processing of different passes may be sequentially performed on the return path, so that the direction of arrow D may of course be the negative direction of the y-axis.

The forward angle posture of the processing head 4 may be realized by the operation of the manipulator 3 that holds the processing head 4, and the operation of the manipulator 3 may be controlled by a command from the control device 7.

As a result, in the laser processing apparatus 1 of the present embodiment, the position of the processing head 4 with respect to the position where the laser beam 11 is irradiated to the work 100, that is, the position where the molten material 15 is scattered in the work 100 is set. It is possible to avoid the vertical orientation of the surface 101 of the 100.

Therefore, according to this configuration, in comparison with the configuration in which the position of the processing head 4 is arranged in the direction perpendicular to the surface 101 of the work 100 with respect to the position at which the laser beam 11 is irradiated on the work 100, the position in the work 100 is increased. It is possible to suppress the possibility that the molten material 15 scattered from the irradiation portion of the laser beam 11 reaches the opening 13 of the nozzle 12 of the processing head 4.

The gas nozzle 8 is arranged rearward in the direction of arrow D from the irradiation position of the laser beam 11 on the workpiece 100 by the processing head 4 in a posture facing the irradiation position of the laser beam 11. In this posture, the gas nozzle 8 is attached to the processing head 4 via the support member 16. The base end side of the gas nozzle 8 is connected to a supply portion of the assist gas 9 (not shown) via an assist gas line 17. As a result, when the machining head 4 moves relative to the work 100 and the irradiation position of the laser beam 11 on the work 100 moves, the gas nozzle 8 moves while following the irradiation position of the laser beam 11. The assist gas 9 can be blown toward the location where the molten material 15 is generated by the irradiation. The gas type of the assist gas 9 and the spray amount are similar to those of the assist gas used in the processing method of forming a groove on a workpiece using a laser beam, which has been conventionally implemented or has been proposed. The seed and the spray amount may be appropriately set.

As a result, in the laser processing apparatus 1 according to the present embodiment, the molten material 15 generated at the irradiation position of the laser beam 11 on the work 100 is placed on the flow of the assist gas 9 sprayed from the gas nozzle 8 and, as shown in FIG. It can be removed by blowing it from 103 to the side preceding in the direction of arrow D. Therefore, also with this configuration, it is possible to suppress the possibility that the molten material 15 scattered from the irradiation portion of the laser beam 11 on the work 100 reaches the opening 13 of the nozzle 12 of the processing head 4.

Further, in the gas nozzle 8 in the present embodiment, the dimension in the direction perpendicular to both the direction of the arrow D in FIG. 2 and the longitudinal direction of the gas nozzle 8 is the nozzle width dimension. In FIG. 4A, the nozzle width dimension of the gas nozzle 8 is the width dimension of the gas nozzle 8 in the left-right direction in the figure. As shown in FIG. 4A, the nozzle width dimension of the gas nozzle 8 is set smaller than the groove width dimension of the groove 103 formed in the work 100. This is because the laser processing apparatus 1 of the present embodiment irradiates the laser beam 11 from the processing head 4 to the bottom of the groove 103 when the depth of the groove 103 formed in the work 100 becomes gradually deeper. This is so that the gas nozzle 8 can be inserted and arranged in the groove 103. In addition, in FIG. 4A, the gas nozzle 8 and the camera 10 attached to the processing head 4 are shown by broken lines for convenience (FIGS. 4B and 4C, 5A and 5B). The same applies to c)).

As long as the gas nozzle 8 is capable of spraying the assist gas 9 onto the molten material 15 generated at the irradiation position of the laser beam 11 on the work 100, the shape and arrangement of the gas nozzle 8 are limited to the illustrated shape and arrangement. Of course not.

The camera 10 has a function of capturing an image of the groove 103 formed in the work 100 and sending information of the captured groove 103 to the control device 7.

In the present embodiment, as shown in FIG. 1 and FIG. 2, the camera 10 is in a posture of taking an image of a region on the front side in the direction of arrow D with respect to the position where the laser beam 11 is irradiated from the processing head 4 to the work 100. Then, it is attached to the processing head 4 via the bracket 18. Therefore, in the camera 10 according to the present embodiment, by moving the camera 10 together with the processing head 4 by the operation of the manipulator 3, the photographing range of the camera 10 can be arranged toward the groove 103 formed in the work 100. .. The movement of the camera 10 due to the operation of the manipulator 3 may be controlled by a command given from the control device 7 to the manipulator 3.

Note that the camera 10 may be configured to be supported by a portion other than the processing head 4 as long as it can photograph the groove 103 formed in the workpiece 100 without being blocked by the operating processing head 4 and manipulator 3. Of course. In addition, the laser processing apparatus 1 of the present embodiment may of course be configured to include a plurality of cameras 10 in order to accommodate the length and arrangement of the grooves 103 formed in the work 100.

Next, a description will be given of the function of the control device 7 and a laser processing method performed by the laser processing device 1 of the present embodiment.

When performing the work of forming the groove 103 on the work 100 by using the laser processing apparatus 1 of the present embodiment, the control device 7 indicates, as shown in FIG. 4A, the groove 103 as indicated by the alternate long and short dash line on the work 100. It has the function of setting the planned formation location and the planned formation depth.

The controller 7 also has a function of setting whether to form the groove 103 by laser processing of one layer M pass (M is an integer of 3 or more). It should be noted that, depending on the ratio of the width dimension and the depth dimension of the unit groove formed by the one-pass laser processing, as the planned depth of the groove 103 increases, the number of passes M per layer becomes larger. The set value tends to increase.

By the way, the width dimension and the depth dimension of the unit groove formed in the work 100 by the one-pass laser processing are determined by the size of the spot of the laser beam 11 irradiated from the processing head 4 onto the work 100 and the irradiation of the laser beam 11. It is naturally determined from the conditions such as the energy absorbed by the work 100 and the properties of the base material of the work 100. As a result, in the laser processing apparatus 1 according to the present embodiment, it is necessary to form a plurality of unit grooves by connecting them in the x-axis direction based on the width dimension of the unit groove for each pass of the path processing position. The amount of displacement in the x-axis direction is clarified, and the groove width dimension in the x-axis direction of the groove 103 to be formed is determined based on the set value of the number M of passes per layer. Alternatively, in the laser processing apparatus 1 according to the present embodiment, the number of passes M per layer may be determined based on the desired groove width dimension in the x-axis direction of the groove 103 to be formed.

As an example, in the present embodiment, an example of a case where laser processing of one layer and three passes is set in the control device 7 will be described. In this case, as shown in FIG. 4A, the groove 103 formed in the work 100 by laser processing of one layer and three passes is a unit whose groove width dimension in the x-axis direction is formed by laser processing of one pass. Twice or more than twice the width of the groove. Therefore, when the beam diameter of the spot of the laser beam 11 irradiated from the processing head 4 to the work 100 is used as a reference, the beam diameter is set to twice or more the beam diameter. It

Although not shown, the control device 7 has a function of switching the irradiation of the laser beam 11 from the processing head 4 on and off, and a function of switching the injection of the assist gas 9 from the gas nozzle 8 on and off. There is.

The control device 7 has a function of giving a command to the manipulator 3 for holding the processing head 4 in the above-described advance angle posture when performing processing for forming the groove 103 on the work 100.

Further, the control device 7 sets an operation of moving the processing head 4 which irradiates the laser beam 11 along the longitudinal direction of the groove 103 formed in the work 100 as one pass of the laser processing. It has a function of giving a command for executing the path to the manipulator 3.

Further, the control device 7 includes a pass machining position setting function, a machining sequence setting function, an intermediate portion machining control function, a first edge machining control function and a second edge machining control as edge machining control functions. It has functions and.

As shown in FIG. 6, the pass machining position setting function is performed by the control device 7 on the basis of the setting of laser machining of one layer and three passes, as shown in FIG. This is a function of setting Pa2 and Pa3 side by side. At this time, the pass processing positions Pa1, Pa2, Pa3 are individually formed at the pass processing positions Pa1, Pa2, Pa3 so that the unit grooves Ga1, Ga2, Ga3, which are individually planned to be formed, are connected to each other in the x-axis direction. It is set so that the ends of Pa3 overlap each other. In this way, when the pass processing positions Pa1, Pa2, Pa3 are determined, the controller 7 causes the nozzles for forming the corresponding unit grooves Ga1, Ga2, Ga3 at the pass processing positions Pa1, Pa2, Pa3, respectively.・The distance between workpieces can be determined.

The machining sequence setting function is such that the following first and second sequence setting conditions are both satisfied for the three pass machining positions Pa1, Pa2, Pa3 set side by side in the x-axis direction by the pass machining position setting function. This is a function for setting the processing order for laser processing.

The first order setting condition is that the laser processing at the pass processing position Pa1 having the first arrangement order in the x-axis direction is performed after the laser processing at the adjacent path processing position Pa2 having the second arrangement order in the x-axis direction. The condition is to do.

The second order setting condition is that the laser processing at the pass processing position where the arrangement order in the x-axis direction is the last is performed after the laser processing at the pass processing position which is the penultimate arrangement order in the adjacent x-axis direction. That is the condition. In the case of the present embodiment, the second condition is that the laser processing at the pass processing position Pa3 having the third arrangement order in the x-axis direction is performed at the second path processing position Pa2 having the second arrangement order in the x-axis direction. The condition is that it is performed after the laser processing.

Therefore, in the present embodiment, these two order setting conditions are satisfied only when the processing order of the pass processing position Pa2 is the first. Therefore, the control device 7 sets the machining order in the order of, for example, the pass machining position Pa2, the pass machining position Pa1, and the pass machining position Pa3 by the machining sequence setting function. Of course, the processing order of the pass processing position Pa1 and the pass processing position Pa3 may be interchanged.

In the intermediate part machining control function, the control device 7 firstly performs the path machining position of the intermediate part excluding the first arrangement order in the x-axis direction and the third arrangement order, which is the last, in the present embodiment. The position Pa2 is specified. After that, when performing the laser processing at the pass processing position Pa2 specified as the intermediate path processing position, the control device 7 causes the processing head 4 to move in the irradiation direction of the laser beam 11 as shown in FIG. 4A. , Z-axis and y-axis (see FIG. 2).

Therefore, the control device 7 provides the posture of the machining head 4 controlled by the intermediate machining control function and the information on the nozzle-work distance required for forming the unit groove Ga2 at the pass machining position Pa2. Based on this, it is possible to determine the posture and movement path of the processing head 4 when performing laser processing for the path processing position Pa2. When giving a command for executing a pass targeting the pass machining position Pa2 to the manipulator 3, the control device 7 issues a command including information on the posture and the movement path of the machining head 4 determined as described above. It has a function to give to.

As a result, in the laser processing apparatus 1 according to the present embodiment, as shown in FIG. 4A, in the laser processing step of one layer and three passes, first, the path processing is performed at the position where the groove 103 is to be formed in the work 100. Laser processing can be performed on the position Pa2.

In this case, as shown in FIG. 4A, when the laser machining targeting the pass machining position Pa2 by the machining head 4 is performed on the work 100, the workpiece 100 corresponds to the pass machining position Pa2 at the planned formation position of the groove 103. The base material is removed in the hatched portion in the vicinity of the surface 101 and the unit groove Ga2 is formed.

In this state, in the laser processing apparatus 1 according to the present embodiment, the unit groove Ga2 formed on the work 100 can be detected by photographing with the camera 10.

Therefore, the control device 7 has a function of receiving the information of the unit groove Ga2 captured by the camera 10 and obtaining the negative end and the positive end of the x-axis of the unit groove Ga2 by image processing. ..

As shown in FIG. 4B, the first end part machining control function targets the path machining position Pa1 on the end 104 side in the negative direction of the x axis at the planned location of the groove 103 by the machining head 4. This is a function that the control device 7 executes when performing laser processing.

In the first end part machining control function, the control device 7 performs the machining head 4 when performing the laser machining at the pass machining position Pa1 having the first arrangement order in the x-axis direction, as shown in FIG. 4B. Is controlled such that the irradiation direction of the laser beam 11 is tilted in the negative direction of the x axis with respect to the plane parallel to both the z axis and the y axis (see FIG. 2). At this time, as shown in FIG. 7A, the control device 7 determines that the x coordinate of the end of the unit groove Ga2 in the negative direction of the x axis of the unit groove Ga2 obtained from the photographing information of the camera 10 (see FIG. 1) is x1. When the z-coordinate of the bottom of the unit groove Ga2 obtained from the depth dimension of the groove Ga2 is z1, the irradiation direction of the laser beam 11 by the machining head 4 shown by the chain double-dashed line is tilted toward the coordinates (x1, z1). It is preferable to arrange them. With this configuration, the control device 7 can easily realize the control for determining the inclined posture of the processing head 4.

Therefore, the control device 7 controls the tilting posture of the machining head 4 controlled by the first edge machining control function and the nozzle-workpiece distance required to form the unit groove Ga1 at the pass machining position Pa1. Based on this information, it is possible to determine the tilted posture and movement path of the processing head 4 when performing laser processing on the path processing position Pa1. When giving a command to the manipulator 3 for executing a pass targeting the pass machining position Pa1, the control device 7 sends a command including the information on the inclination posture and the movement path of the machining head 4 determined as described above, to the manipulator. It has a function to give to 3.

As a result, the laser processing apparatus 1 of the present embodiment can perform laser processing for the pass processing position Pa1 at the planned formation position of the groove 103 in the work 100, as shown in FIG. 4B.

In this case, as shown in FIG. 4B, when the laser machining targeting the pass machining position Pa1 by the machining head 4 is performed on the workpiece 100, the end of the groove 103 in the negative direction of the x-axis at the planned location of the groove 103. The base material is removed at a portion corresponding to the pass processing position Pa1 on the portion 104 side and in the hatched portion near the surface 101, and the unit groove Ga1 is formed first at the pass processing position Pa2. It is formed in a state of being connected to the unit groove Ga2 on the negative side of the x-axis.

As shown in FIG. 4C, the second end processing control function targets the path processing position Pa3 on the end 105 side in the positive direction of the x-axis by the processing head 4 at the location where the groove 103 is to be formed. This is a function that the control device 7 executes when performing laser processing.

In the second end part machining control function, the control device 7 determines, as shown in FIG. 4C, the pass machining position Pa3 having the third arrangement sequence which is the last pass machining position in the x-axis direction. When performing laser processing, the processing head 4 is controlled such that the irradiation direction of the laser beam 11 is tilted in the positive direction of the x axis with respect to the plane parallel to both the z axis and the y axis (see FIG. 2). At this time, as shown in FIG. 7B, the control device 7 determines that the x-coordinate of the end of the unit groove Ga2 in the positive direction of the x-axis of the unit groove Ga2 obtained from the photographing information of the camera 10 (see FIG. 1) is x2. When the z coordinate of the bottom of the unit groove Ga2 obtained from the depth dimension of the groove Ga2 is z1, the irradiation direction of the laser beam 11 by the machining head 4 indicated by the chain double-dashed line is inclined toward the coordinates (x2, z1). It is preferable to arrange them. With this configuration, the control device 7 can easily realize the control for determining the inclined posture of the processing head 4.

Therefore, the control device 7 controls the tilting posture of the machining head 4 controlled by the second edge machining control function, and the nozzle-workpiece distance required to form the unit groove Ga3 at the pass machining position Pa3. Based on this information, it is possible to determine the tilted posture and movement path of the processing head 4 when performing laser processing on the path processing position Pa3. When giving a command for executing a pass targeting the pass machining position Pa3 to the manipulator 3, the control device 7 issues a command including the information on the inclination posture and the movement path of the machining head 4 determined as described above, to the manipulator. It has a function to give to 3.

As a result, the laser processing apparatus 1 according to the present embodiment can perform laser processing on the pass processing position Pa3 at the planned formation position of the groove 103 in the work 100, as shown in FIG. 4C.

In this case, as shown in FIG. 4C, when the laser machining targeting the pass machining position Pa3 by the machining head 4 is performed on the workpiece 100, the end of the groove 103 in the positive direction of the x axis at the planned formation position of the groove 103. The base material is removed at the portion corresponding to the pass processing position Pa3 on the portion 105 side and in the hatched portion in the vicinity of the surface 101, and the unit groove Ga3 is previously formed at the pass processing position Pa2. It is formed in a state of being connected to the unit groove Ga2 on the positive side of the x-axis.

As a result, in the laser processing apparatus 1 of the present embodiment, laser processing for the path processing position Pa2, the path processing position Pa1, and the path processing position Pa3 is sequentially performed by the processing head 4 as the laser processing for one layer and three passes. It can be carried out.

Therefore, when the processing of the laser processing of one layer and three passes for the respective pass processing positions Pa1, Pa2, Pa3 is completed, the work 100 is provided with the groove 103 indicated by the alternate long and short dash line as shown in FIG. From the surface 101, the groove 103 having the groove width dimension desired for the groove 103 in the x-axis direction but not reaching the desired depth is formed from the surface 101. In the case of the present embodiment, when performing the laser processing at the pass processing position Pa1, the irradiation direction of the laser beam 11 by the processing head 4 is directed to the coordinates (x1, z1), and the laser processing at the pass processing position Pa3 is performed. It is preferable to direct the irradiation direction of the laser beam 11 by the processing head 4 to the coordinates (x2, z1) when performing. However, strictly speaking, even if the target is the same, if the angle of the inclined posture of the processing head 4 is different, the position of the work 100 irradiated with the laser beam 11 changes. Therefore, in the case of the present embodiment, the groove width dimension of the groove 103 formed in the work 100 is affected by the angle of the inclined posture of the processing head 4 when performing the laser processing at the pass processing position Pa1 and the pass processing position Pa3. It depends on how you received it.

Further, the groove 103 irradiates the pass processing position Pa1 with the laser beam 11 in a state where the irradiation direction is tilted in the negative direction of the x-axis, and the pass processing position Pa3 receives the laser beam 11 in the irradiation direction. Since the irradiation is performed while tilting in the positive direction of the x-axis, the formed groove 103 has substantially the same groove width dimension in the x-axis direction from the surface 101 of the work 100 to the bottom of the groove 103. In this state, in the laser processing apparatus 1 of the present embodiment, the groove 103 formed in the work 100 can be photographed and detected by the camera 10.

Therefore, the control device 7 has a function of receiving the information of the groove 103 photographed by the camera 10 and calculating the negative end and the positive end of the x-axis at the bottom of the groove 103 by image processing. .. Next, as shown in FIG. 5A, the control device 7 has a function of restarting the laser processing of one layer and three passes similar to the above with respect to the bottom of the groove 103 formed up to that point. ing.

As a result, the laser processing apparatus 1 of the present embodiment, as shown in FIGS. 5A, 5</b>B, and 5</b>C, has the structure shown in FIG. 4A at the bottom of the groove 103 already formed from the surface 101 of the work 100. )(B)(c), three pass processing positions Pa1, Pa2, Pa3 are set side by side in the x-axis direction, and the laser beam 11 is set for each pass processing position Pa1, Pa2, Pa3. It is possible to perform laser processing of one layer and three passes for irradiation. Therefore, at the bottom of the groove 103 already formed, the base material in the layered region can be further removed to perform processing for forming the deeper groove 103. At this time, the groove width dimension in the x-axis direction of the groove 103 already formed in the work 100 is more than twice the beam diameter of the spot of the laser beam 11 with which the work head 4 irradiates the work 100. .. Therefore, in the already formed groove 103, the laser beam 11 is irradiated from the opening of the groove 103 on the surface 101 of the work 100 to the pass processing position Pa1 set at the bottom of the groove 103, and the irradiation direction is the negative direction of the x axis. There is no problem in irradiating the laser beam 11 with the laser beam 11 tilted in the positive direction of the x-axis, and without irradiating the laser beam 11 to the pass processing position Pa3.

Therefore, the laser processing apparatus 1 of the present embodiment can perform the processing of gradually increasing the depth of the groove 103 by further performing the laser processing of the one-layer three-pass on the bottom portion of the existing groove 103. ..

The control device 7 may repeatedly perform the laser machining of the single layer and three passes by the machining head 4 until the depth of the groove 103 formed in the work 100 reaches the planned depth. As a result, the groove 100 having the set width and depth is formed in the work 100 at the place where the groove 103 is to be formed.

As described above, the laser processing apparatus 1 according to the present embodiment forms the groove 103 having a groove width dimension that is at least twice the beam diameter of the spot of the laser beam 11 by laser processing of one layer and three passes. By subjecting the bottom of the formed groove 103 to laser processing of one layer and three passes, a deeper groove 103 can be formed.

Further, the laser processing apparatus 1 according to the present embodiment plans the formation of the groove 103 extending from the front surface 101 to the back surface 102 on the work 100, and performs laser processing of one layer and three passes on the planned location of the groove 103. You may make it perform the process repeatedly performed. According to this method, the laser processing apparatus 1 of the present embodiment can perform the processing of cutting the work 100 at the position where the groove 103 is formed.

In the laser processing apparatus 1 of the present embodiment, the control device 7 has the first end processing control function and the end processing control function based on the second end processing control function so that the arrangement order in the x-axis direction is the first. When performing laser processing at the pass processing position Pa1 and the third pass processing position Pa3, the processing head 4 can be controlled to be in a posture in which the processing heads 4 are inclined in opposite directions to each other in the x-axis direction. For example, the control device 7 controls the processing head 4 so that the irradiation direction of the laser beam 11 is tilted in the negative direction of the x-axis when performing the laser processing at the pass processing position Pa1 where the arrangement order in the x-axis direction is the first. When performing laser processing at the pass processing position Pa3 that is the third in the x-axis direction, the processing head 4 is controlled so that the irradiation direction of the laser beam 11 is tilted in the positive direction of the x-axis. Therefore, in the laser processing apparatus 1 of the present embodiment, the space inside the groove 103 already formed in the work 100 is used to interfere with the base material of the work 100 forming both side walls of the groove 103. Instead, the laser beam 11 can be irradiated from the processing head 4 to the pass processing positions Pa1, Pa2, Pa3 set at the bottom of the groove 103. Therefore, the laser processing apparatus 1 of the present embodiment can generate new molten material 15 at the bottom of the groove 103 formed in the work 100 by sequentially repeating the laser processing of one layer and three passes. By blowing the molten material 15 with the assist gas 9 blown from the gas nozzle 8, it is possible to perform a process of sequentially increasing the depth of the groove 103.

[Application Example of First Embodiment]
In the said 1st Embodiment, the example in case the laser processing of 1 layer 3 pass was set to the control apparatus 7 was demonstrated. On the other hand, the control device 7 may have a function such that the number of passes per layer is set to be larger, such as one-layer four-pass and one-layer five-pass.

Therefore, in the application example of the first embodiment, the configuration for the one-layer three-pass shown in the first embodiment is also applied to the case of the one-layer four-pass, five-pass, or more multi-pass. As applicable, M is an arbitrary integer of 3 or more, and is generalized to the case of one-layer M pass. Specifically, the function provided in the control device 7 when the laser processing of the one-layer M pass is set in the control device 7 will be described.

The control device 7 has a pass machining position setting function, a machining sequence setting function, an intermediate part machining control function, a first end part machining control function and a second end part machining control function as end part machining control functions. , Is provided.

The pass machining position setting function is a function that the control device 7 sets and sets M pass machining positions in the x-axis direction on the workpiece 100 based on the setting of the laser machining of one layer M pass. At this time, each pass processing position is set so that the unit grooves to be formed individually are connected to each other in the x-axis direction.

The processing order setting function performs laser processing on the M number of path processing positions set side by side in the x-axis direction by the path processing position setting function such that the following first and second order setting conditions are both satisfied. This is a function to set the processing order.

The first order setting condition is that the laser processing at the first pass processing position in the x-axis direction is performed after the laser processing at the adjacent second pass processing position in the x-axis direction. It is a condition.

The second order setting condition is that the arrangement order in the x-axis direction is the last, that is, the laser processing at the M-th pass processing position is the second from the last in the adjacent x-axis direction, that is, the arrangement order is (M The condition is to carry out after the laser processing at the (-1)th pass processing position.

In the machining sequence setting function, if the first and second sequence setting conditions are satisfied, other machining sequences are arbitrarily set from the viewpoint of, for example, improving the efficiency of the operation of the machining head 4 by the manipulator 3. You can do it.

For example, as shown in FIG. 8, in the case of one layer and four passes, four pass processing positions Pb1, Pb2, Pb3 and Pb4 are set side by side in the x-axis direction. In this case, the machining sequence setting function of the control device 7 determines that the machining sequence of the pass machining position Pb1 is after the pass machining position Pb2 and the machining sequence of the pass machining position Pb4 is after the pass machining position Pb3. Other processing orders may be set arbitrarily.

For example, the pass processing position Pb2 and the pass processing position Pb3 may be processed first. In this case, one of the pass machining position Pb2 and the pass machining position Pb3, whichever comes first in the machining sequence, is set as the first machining sequence. Specifically, regarding the processing order in the case of the one-layer four-pass, if only the codes of the respective path processing positions are shown side by side, Pb2, Pb1, Pb3, Pb4, Pb2, Pb3, Pb1, Pb4, Pb2, Pb3. It is set to any one of Pb4, Pb1, Pb3, Pb2, Pb1, Pb4, Pb3, Pb2, Pb4, Pb1 and Pb3, Pb4, Pb2, Pb1.

Further, for example, as shown in FIG. 9, in the case of one layer and five passes, five pass processing positions Pc1, Pc2, Pc3, Pc4 and Pc5 are set side by side in the x-axis direction. In this case, the machining sequence setting function of the control device 7 determines that the machining sequence of the pass machining position Pc1 is after the pass machining position Pc2 and the machining sequence of the pass machining position Pc5 is after the pass machining position Pc4. Other processing orders may be set arbitrarily.

In the case of one layer and five passes, the conditions of the machining order of the pass machining position Pc1 and the pass machining position Pc2, and the conditions of the machining order of the pass machining position Pc4 and the pass machining position Pc5 are the same as those in the case of the one layer four pass described above. The conditions are the same for the machining order of the pass machining position Pb1 and the pass machining position Pb2, and for the machining sequence of the pass machining position Pb3 and the pass machining position Pb4. Therefore, in the case of the one-layer five-pass, the way of arranging the processing orders for the four pass processing positions Pc1, Pc2, Pc4, and Pc5 excluding the pass processing position Pc3 is the same as the processing order for the one-layer four-pass described above. Similarly, 6 kinds of settings are possible. That is, the method of arranging the processing order of the path processing positions Pc1, Pc2, Pc4, and Pc5 in the case of one-layer five-pass is shown only by the symbols of the respective path processing positions, Pc2, Pc1, Pc4, Pc5, Pc2, Pc4, It can be set to any one of Pc1, Pc5, Pc2, Pc4, Pc5, Pc1, Pc4, Pc2, Pc1, Pc5, Pc4, Pc2, Pc5, Pc1 and Pc4, Pc5, Pc2, Pc1. .. By the way, regarding the pass machining position Pc3, there is no particular condition relating to the setting of the machining order. Therefore, the machining sequence of the pass machining position Pc3 is set so that the machining sequence is the first with respect to each of the six machining sequence arrangements for the pass machining positions Pc1, Pc2, Pc4, and Pc5 described above. The setting may be inserted so as to be the second, the third, or the fourth, or the setting may be added so as to be the fifth. Therefore, in the case of one layer and five passes, any one of the pass machining position Pc2, the pass machining position Pc3, and the pass machining position Pc4 is set to the first machining order.

In the intermediate part machining control function, the control device 7 controls the pass machining position of the intermediate part excluding the first arrangement order in the x-axis direction and the second arrangement order, that is, the second arrangement order in the x-axis direction. When laser processing is performed at the (M-1)th pass processing position, the processing head 4 is irradiated with the laser beam 11 in the z-axis and y-axis directions (see FIG. 2) in the same manner as shown in FIG. 4A. ) Is a function to control the posture along a plane parallel to both.

The first end part machining control function, when the control device 7 performs the laser machining at the pass machining position where the arrangement order in the x-axis direction is the first, the machining head 4 is moved in the same manner as shown in FIG. 4B. The function of controlling the irradiation direction of the laser beam 11 is such that the laser beam 11 is inclined in the negative direction of the x-axis with respect to the plane parallel to both the z-axis and the y-axis (see FIG. 2). At this time, as in the case shown in FIG. 7A, the control device 7 controls the x of the end portion in the negative direction of the x-axis of the unit groove formed at the second pass machining position in the arrangement order in the x-axis direction. Based on the coordinates and the z-coordinate of the bottom of the unit groove, the inclined posture of the processing head 4 is determined so that the irradiation direction of the laser beam 11 by the processing head 4 is directed to a position having the x-coordinate and the z-coordinate. It is preferable.

The second end part machining control function, when the control device 7 performs the laser machining at the pass machining position where the arrangement order in the x-axis direction is the Mth, the machining head 4 is moved in the same manner as shown in FIG. The function of controlling the irradiation direction of the laser beam 11 is such that the laser beam 11 is inclined in the positive direction of the x-axis with respect to the plane parallel to both the z-axis and the y-axis (see FIG. 2). At this time, as in the case of the laser processing at the pass processing position Pa3 shown in FIG. 7B, the control device 7 forms the (M-1)th pass processing position in the x-axis direction. Irradiation of the laser beam 11 by the processing head 4 at a position having the x-coordinate and the z-coordinate based on the x-coordinate of the end of the unit groove in the positive direction of the x-axis and the z-coordinate of the bottom of the unit groove. It is preferable to determine the inclined posture of the processing head 4 so that the direction is oriented.

As a result, in the laser processing apparatus 1 of the present application example, the control device 7 uses the first end processing control function and the second end processing control function to control the arrangement order in the x-axis direction. When performing laser processing at the first pass processing position and the Mth pass processing position, the processing heads 4 can be controlled so as to incline in opposite directions in the x-axis direction.

Therefore, since the laser processing apparatus 1 of the present application example can perform laser processing of one layer M pass, it can be used in the same manner as the laser processing apparatus 1 of the first embodiment to obtain the same effect. ..

The laser processing apparatus and the laser processing method according to the present disclosure are not limited to the above-described embodiments and application examples.

The number of joints, the shape, and the size of the manipulator 3 of the robot 2 illustrated in FIG. 1 and the shape and the size of the processing head 4 that is the end effector are for convenience of illustration and are not limited to those illustrated.

Further, if the robot 2 has a function of moving the processing head 4 in the above-described predetermined tilted posture over the entire length of the groove 103 formed in the work 100, the direction in which the groove 103 formed in the work 100 extends, The arrangement of the robot 2 may be set arbitrarily. Further, for example, the robot 2 may be of a type in which a base to which the manipulator 3 is attached is movable.

The groove width dimension of the groove 103 formed in the work 100 is explained as a ratio of the spot diameter of the laser beam 11 with which the work 100 is irradiated to the beam diameter is two times or more in the case of the one-layer three-pass method. Is.

The larger the groove width of the groove 103, the more the laser processing of one layer M pass (M is an integer of 3 or more) is performed on the bottom of the groove 103 while avoiding interference with the sidewall of the groove 103. However, since the amount of the base material of the workpiece 100 to be removed to form the groove 103 is large, more energy and time are required.

On the other hand, the smaller the groove width dimension of the groove 103, the smaller the amount of the base material of the workpiece 100 to be removed to form the groove 103, but the bottom of the groove 103 is the target of the 1-layer M pass. When irradiating the laser beam 11 for laser processing, it becomes difficult to avoid interference with the side wall of the groove 103.

Therefore, the set value of the groove width dimension of the groove 103 is set such that the laser beam 11 emitted from the processing head 4 does not interfere with the side wall of the groove 103 and the laser processing of the single-layer M pass set at the bottom of the groove 103 is performed. It is needless to say that the dimensions may be changed to those other than the above, as long as the condition of being practicable is satisfied. Even in this case, from the viewpoint of suppressing the energy and time required for forming the groove 103, it is preferable to make the groove width dimension of the groove 103 as small as possible.

In each of the above-described embodiments and application examples, the groove detecting device has exemplified the camera 10, but the groove 103 formed on the work 100 or the bottom of the groove 103, or the end of the unit groove in the negative direction of the x-axis. A groove detection device of any type other than the camera 10, such as a visual sensor or a 3D scanner, may be adopted as long as it can detect the end portion in the positive direction. Therefore, the control device 7 may be provided with a function of appropriately performing the process of specifying the position of the groove 103 or the unit groove formed on the work 100 according to the format of the information received from the groove detection device. Also with this configuration, the laser processing apparatus and the laser processing method of the present disclosure can obtain the same effects as those of the above-described embodiment.

Of course, various changes can be made without departing from the scope of the present invention.

Further, as still another application of the laser processing apparatus and the laser processing method of the present disclosure, it is possible to form a groove by sequentially repeating laser processing of one layer and two passes at a position where the groove is to be formed in the work. Is. In this case, the control device in the laser processing apparatus of the present disclosure first sets two path processing positions in the x-axis direction at the planned groove formation positions in the workpiece. After that, when performing laser processing at the pass processing position where the arrangement order in the x-axis direction is the first, the control device controls the processing head so that the irradiation direction of the laser beam is in both the z-axis and the y-axis (see FIG. 2). When performing the laser processing at a posture inclining to the negative direction of the x axis with respect to the parallel plane and performing the laser processing at the second path processing position in the arrangement direction of the x axis, the laser beam irradiation direction is set to the z axis. The posture may be controlled so as to be inclined in the positive direction of the x-axis with respect to a plane parallel to both the y-axis and the y-axis (see FIG. 2).

2 robot, 3 manipulator, 4 processing head, 6 laser oscillator, 7 control device, 9 assist gas, 8 gas nozzle, 10 camera (groove detection device), 100 workpiece, 103 groove, 104 end, 105 end, Pa1, Pa2 , Pa3 pass machining position, Pb1, Pb2, Pb3, Pb4 pass machining position, Pc1, Pc2, Pc3, Pc4, Pc5 pass machining position

Claims (5)

A robot with a manipulator,
A processing head attached to the tip side of the manipulator,
A laser oscillator connected to the processing head,
A control device,
A gas nozzle that blows an assist gas to the irradiation position of the laser beam from the processing head,
A groove detection device,
The control device is
With the function to set the planned groove formation point for the work,
An operation in which the operation of moving the processing head along the longitudinal direction of the groove formed in the work is set as one pass of laser processing;
A function to set laser processing of one layer M pass (M is an integer of 3 or more),
The groove width direction of the groove to be formed is the x-axis direction, the longitudinal direction of the groove is the y-axis direction, and the depth direction of the groove is the z-axis direction. A path processing position setting function that sets M path processing positions arranged side by side,
A function for giving a command for executing the pass to each of the pass machining positions to the manipulator,
When performing the laser processing with respect to the first pass processing position and the Mth pass processing position in the x-axis direction, the end processing control function of inclining the processing heads in the x-axis opposite directions to each other. A laser processing device characterized in that it is equipped. The control device is
Regarding the M pass machining positions set side by side in the x-axis direction by the pass machining position setting function, the laser machining at the pass machining position having the first arrangement order in the x-axis direction is performed in the adjacent x-axis direction. The condition that the laser processing is performed after the laser processing at the second pass processing position in the arrangement order and the laser processing at the Mth pass processing position in the x-axis direction is that the adjacent arrangement order in the x-axis direction is A processing order setting function for setting a processing order for performing laser processing so that the condition that the laser processing is performed after the laser processing at the (M-1)th pass processing position is both satisfied;
When performing laser processing at the second to the (M−1)th pass processing positions in the x-axis direction, the processing head is controlled so that the laser beam irradiation direction is the z-axis and the y-direction. The laser processing apparatus according to claim 1, further comprising an intermediate portion processing control function of controlling an attitude along a plane parallel to both axes. The processing head includes a nozzle that irradiates the laser beam to the outside through an opening on the tip side, and further has a configuration in which the focus of the laser beam is arranged at the position of the opening of the nozzle. The laser processing apparatus described in. The processing head includes a nozzle that irradiates the laser beam to the outside through an opening on the tip side, and further has a function of blowing a purge gas to the outside through the opening of the nozzle. The laser processing apparatus according to the item. The operation of moving the processing head that irradiates the laser beam along the longitudinal direction of the groove formed in the work is defined as one pass of laser processing.
In the control device, a process for setting a groove formation planned location for the work,
A process in which laser processing of one layer M pass (M is an integer of 3 or more) is set in the control device;
The control device sets the groove width direction of the groove to be formed as the x-axis direction, the longitudinal direction of the groove as the y-axis direction, and the depth direction of the groove as the z-axis direction, where the groove is to be formed in the workpiece. And processing for setting M pass processing positions side by side in the x-axis direction,
The control device performs a process of giving a command for executing the pass to the manipulator at each pass processing position,
Further, when performing the laser processing at the first pass processing position and the Mth pass processing position in the x-axis direction, the controller tilts the processing heads in opposite x-axis directions. A laser processing method characterized by performing a process for controlling the laser processing.

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