JP2020126895A - Multilayer electronic component - Google Patents

Abstract

To provide a multilayer electronic component having high bending strength and thermal shock resistance.SOLUTION: In a multilayer electronic component including an element body having an inner layer part where an internal ceramic layer and an internal electrode layer are laminated alternately, and an outer layer part provided at the end of the inner layer part in the lamination direction, the internal ceramic layer contains an element α and an element β, where the element α is at least one selected from a group consisting of Ba, Sr and Ca, the element β consists of Ta or Ta and Nb, percentage content of the element α in the internal ceramic layer is 33.3-50.0 mol% in oxide equivalent, percentage content of the element β in the internal ceramic layer is 25.0-50.mol% in oxide equivalent, and when assuming the content of Ta in the internal ceramic layer is E0 in oxide equivalent, and the content of Ta in the external ceramic layer constituting the outer layer part is E1 in oxide equivalent, (E0-E1) satisfies a relationship of (E0-E1)>0.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laminated electronic component having a ceramic layer, for example, a laminated ceramic capacitor.

A monolithic ceramic capacitor is mounted on many electronic devices because of its high reliability and low cost. Specific electronic devices include information terminals such as mobile phones, home appliances, and automobile electrical components. Among them, the monolithic ceramic capacitors used for automobiles such as automobile electrical components are required to have higher bending strength and higher thermal shock resistance than the monolithic ceramic capacitors used for home electric appliances and information terminals. There is.

For example, Patent Document 1 discloses a dielectric ceramic composition having a main component having a tetragonal tungsten bronze structure represented by the general formula A ₃ (B1)(B2) ₄ O ₁₅ and a sub-component including Si and the like. ing. Note that A in the above general formula is at least one selected from Ba, Sr, Ca, and rare earth elements, and B1 and B2 include Zr and Nb.

JP, 2018-104209, A

The present invention has been made in view of the above problems, and an object thereof is to provide a laminated electronic component having high bending strength and high thermal shock resistance.

The laminated electronic component of the present invention for achieving the above object is as follows.

[1] A laminated electronic component including an element body having an inner layer portion in which inner ceramic layers and inner electrode layers are alternately laminated, and an outer layer portion provided at an end portion of the inner layer portion in the laminating direction. hand,
The internal ceramics layer contains an element α and an element β,
The element α is at least one selected from the group consisting of Ba, Sr and Ca,
The element β is composed of Ta or Ta and Nb,
The content rate of the element α in the internal ceramics layer is 33.3 mol% to 50.0 mol% in terms of oxide.
The content rate of the element β in the internal ceramics layer is 25.0 mol% to 50.0 mol% in terms of oxide,
When the oxide content of Ta in the internal ceramics layer is E0 and the oxide content of Ta in the external ceramics layer forming the outer layer portion is E1,
(E0-E1) is a laminated electronic component that satisfies the relationship of (E0-E1)>0.

The following modes are illustrated as specific modes of the above [1].

[2] The content of each element other than the element β in the internal ceramics layer in terms of oxide is substantially the same as the content of each element other than the element β in the outer ceramics layer in terms of oxide. The laminated electronic component according to the above [1].

[3] The laminated electronic component according to the above [1] or [2], wherein (E0-E1) satisfies the relationship of 5 mol%≦(E0-E1)≦15 mol%.

FIG. 1 is a sectional view of a monolithic ceramic capacitor according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail in the following order based on specific embodiments.
1. Multilayer ceramic capacitor 2. 2. Method of manufacturing monolithic ceramic capacitor Summary of this embodiment

1. Multilayer Ceramic Capacitor A multilayer ceramic capacitor will be described as an embodiment of the present invention. FIG. 1 shows a cross-sectional view of a general monolithic ceramic capacitor 2.

The monolithic ceramic capacitor 2 has an element body 4 and a pair of external electrodes 6 and 8. The element body 4 has an inner layer portion 13 and an outer layer portion 11. The inner layer portion 13 has an internal ceramics layer 10 and an internal electrode layer 12 which are substantially parallel to a plane including the X axis and the Y axis, and the internal ceramics layer 10 and the internal electrode layer 12 alternate along the Z axis direction. Are stacked on.

Here, “substantially parallel” means that most of the parts are parallel, but may have some parts that are not parallel to each other. It means that it may be uneven or inclined.

In the drawing, the X axis, the Y axis, and the Z axis are perpendicular to each other.

The outer layer portion 11 is provided at an end portion of the inner layer portion 13 in the stacking direction (Z-axis direction).

The internal electrode layers 12 are laminated so that their ends are alternately exposed on the surfaces of the opposite end faces of the element body 4. The pair of external electrodes 6 and 8 are formed on both end surfaces of the element body 4 and are connected to the exposed ends of the alternately arranged internal electrode layers 12 to form a capacitor circuit.

The size of the element body 4 is not particularly limited, but X0 is 1.0 mm to 5.7 mm, Y0 is 0.5 mm to 5.0 mm, and Z0 is 0.5 mm to 3.0 mm. Here, X0 is a dimension along the X-axis direction, Y0 is a dimension along the Y-axis direction, and Z0 is a dimension along the Z-axis direction.

The thickness td of the internal ceramics layer 10 is not particularly limited, but is preferably 30 μm or less, more preferably 2 μm to 25 μm.

The number of laminated internal ceramic layers 10 is not particularly limited, but is preferably 20 or more, and more preferably 50 or more.

The thickness to of the outer layer portion 11 is not particularly limited, but is preferably 20 μm to 300 μm.

In the present embodiment, the internal ceramics layer 10 contains the element α and the element β, and the element α is at least one selected from the group consisting of Ba, Sr, and Ca.

Further, the element β is composed of Ta or Ta and Nb, and preferably the element β contains Ta in an amount of 4 atomic% or more and 100 atomic% or less.

The internal ceramics layer 10 may contain Zr, Ti or a rare earth element in addition to the elements α and β, or may contain an appropriate combination of Zr, Ti and a rare earth element. Examples of the rare earth element include La, Eu, Sm, Dy, Ce and the like.

The content rate of the element α in the internal ceramics layer 10 is 33.3 mol% to 50.0 mol% in terms of oxide. Thereby, bending strength and thermal shock resistance can be improved.

The thermal shock resistance means that the occurrence of cracks in the laminated ceramic capacitor 2 can be suppressed when the laminated ceramic capacitor 2 is subjected to a thermal shock test at −55° C. to 150° C.

The content rate of the element β in the internal ceramics layer 10 is 25.0 mol% to 50.0 mol% in terms of oxide. Thereby, bending strength and thermal shock resistance can be improved.

In the present embodiment, when the oxide content of Ta in the internal ceramics layer 10 is E0, and the oxide content of Ta in the external ceramics layer forming at least one outer layer portion 11 is E1. , (E0-E1) satisfy the relationship of (E0-E1)>0. This improves the thermal shock resistance. In both outer layer portions 11 shown in FIG. 1, (E0-E1) preferably satisfies the above relationship, and (E0-E1) satisfies the relationship of 5 mol%≦(E0-E1)≦15 mol%. Is preferred.

In the present embodiment, the content of each element other than the element β in the internal ceramics layer 10 in terms of oxide and the content of each element other than the element β in the outer ceramics layer constituting at least one outer layer portion 11 in terms of oxide are calculated. The content rates of are approximately the same. Thereby, the thermal shock resistance becomes better. From the above viewpoint, the content of each element other than the element β in the internal ceramics layer 10 in terms of oxide, and the content of each element other than the element β in the outer ceramics layer constituting both outer layer portions 11 in terms of oxide. It is preferable that the contents are substantially the same.

Here, “substantially the same amount” means the content of each element other than the element β in the internal ceramics layer 10 in terms of oxide, and the content of each element other than the element β in the outer ceramics layer constituting at least one outer layer portion 11. It refers to the case where the difference in the content of elements in terms of oxide is less than ±2 mol %. That is, for example, the “oxide species A” is an “oxide of an element other than the element β”, and the “content rate of the oxide species A of the inner ceramic layer 10 [mol %]-the content rate of the oxide species A of the outer ceramic layer [[ mol%]=±2 mol%”, the content of “elements other than element β in the internal ceramics layer 10 in terms of oxides and the oxide content of elements other than element β in the outer ceramics layer in terms of oxides” It is said that the content rate in is about the same amount.”

The method for obtaining the composition of the internal ceramic layer 10 and the external ceramic layer is not particularly limited, but for example, it can be obtained for a cut surface obtained by cutting the multilayer ceramic capacitor 2 in parallel to the stacking direction (Z-axis direction). Specifically, for each of the inner ceramic layer 10 and the outer ceramic layer of the cut surface, each element is analyzed by scanning electron microscope-energy dispersive X-ray analysis (SEM-EDS), scanning transmission electron microscope-energy dispersive X-ray analysis ( STEM-EDS) or laser ablation ICP mass spectrometer (LA-ICP-MS) can be used to determine the composition.

The inner ceramic layer 10 and the outer ceramic layer according to the present embodiment preferably have a tungsten bronze type crystal structure. As a result, bending strength and thermal shock resistance can be enhanced, and an effect of improving insulation resistance can be obtained. Whether or not the internal ceramic layer 10 and the external ceramic layer have a tungsten bronze type crystal structure can be confirmed by X-ray diffraction (XRD) patterns of the internal ceramic layer 10 and the external ceramic layer.

The conductive material contained in the internal electrode layer 12 is not particularly limited, but Ni, Ni-based alloy, Cu or Cu-based alloy is preferable. Note that various trace components such as P may be contained in Ni, Ni-based alloy, Cu or Cu-based alloy in an amount of about 0.1% by mass or less. The internal electrode layer 12 may be formed by using a commercially available electrode paste. The thickness of the internal electrode layer 12 may be appropriately determined according to the application and the like.

The conductive material contained in the external electrodes 6 and 8 is not particularly limited, but inexpensive Ni, Cu, Au, Ag, Pd having high heat resistance, and alloys thereof can be used in the present embodiment. The thickness of the external electrodes 6 and 8 may be appropriately determined according to the application etc., but is usually preferably about 10 to 50 μm.

2. Manufacturing Method of Multilayer Ceramic Capacitor 2 Next, an example of a manufacturing method of the multilayer ceramic capacitor 2 shown in FIG. 1 will be described.

An internal ceramics layer paste that will become the internal ceramics layer 10 after firing is prepared. First, a calcined powder is prepared. As a starting material, it is possible to use a material powder of an oxide or a mixture thereof mainly composed of Sr, Ba, Ca, Ti, Zr, Nb, Ta, a rare earth element, or the like. In addition, various compounds that become the above-mentioned oxides or complex oxides by firing, such as carbonates, oxalates, nitrates, hydroxides, and organic metal compounds, can be appropriately selected and mixed and used. Specifically, SrO may be used as the raw material of Sr, or SrCO ₃ may be used. The average particle size of the raw material powder is preferably 1.0 μm or less. After weighing each component so as to have a predetermined composition ratio, wet mixing is performed for a predetermined time using a ball mill or the like.

After the obtained mixed powder is dried, it is heat-treated at 1000° C. or lower in the air to obtain a calcined powder.

Then, the obtained calcined powder is crushed to obtain a raw material for the internal ceramics layer. The raw material for the internal ceramics layer is, for example, a mixed powder having an average particle diameter of 0.5 μm to 2.0 μm.

The raw material for the internal ceramics layer obtained above is made into a coating material to prepare a paste for the internal ceramics layer. The paste for the internal ceramics layer may be an organic paint obtained by kneading the raw material for the internal ceramics layer and an organic vehicle, or may be an aqueous paint.

The organic vehicle is a binder dissolved in an organic solvent. The binder used for the organic vehicle is not particularly limited and may be appropriately selected from various ordinary binders such as ethyl cellulose and polyvinyl butyral. The organic solvent used is not particularly limited, and may be appropriately selected from various organic solvents such as terpineol, butyl carbitol, and acetone according to the method to be used such as the printing method and the sheet method.

Further, when the internal ceramics layer paste is used as a water-based paint, an aqueous vehicle in which a water-soluble binder or dispersant is dissolved in water and the internal ceramics layer raw material may be kneaded. The water-soluble binder used in the water-based vehicle is not particularly limited, and for example, polyvinyl alcohol, cellulose, water-soluble acrylic resin or the like may be used.

An external ceramics layer paste that becomes an external ceramics layer after firing is prepared. The external ceramics layer paste can be obtained in the same manner as the internal ceramics layer paste except that the starting materials are weighed so that the composition of the external ceramics layer becomes a predetermined value after firing.

The internal electrode layer paste is prepared by kneading the above-mentioned organic vehicle with a conductive material made of various conductive metals or alloys described above. Oxides, organometallic compounds, resinates, or the like can be used instead of the conductive material. The above-mentioned oxide, organometallic compound and resinate become the above-mentioned conductive material after firing.

The external electrode paste may be prepared in the same manner as the above internal electrode layer paste.

The content of the organic vehicle in each paste described above is not particularly limited, and may be a normal content, for example, the binder is about 1% by mass to 5% by mass, and the solvent is about 10% by mass to 50% by mass. In addition, each paste may contain additives selected from various dispersants, plasticizers, dielectric materials, insulating materials, and the like, if necessary. The total content of these is preferably 10% by mass or less.

When the sheet method is used, an internal green sheet is formed using the internal ceramic layer paste, the internal electrode layer paste is printed on the internal green sheet, and then these are laminated to obtain an internal laminate. Next, an external ceramic green sheet is formed on the internal laminate by using the external ceramic layer paste, and pressure is applied in the laminating direction to obtain a green laminate. The green laminated body is cut into a predetermined shape to obtain a green chip.

Before firing, the green chip is subjected to binder removal processing. As the binder removal treatment condition, the temperature rising rate is preferably 5° C./hour to 300° C./hour, the holding temperature is preferably 180° C. to 500° C., and the temperature holding time is preferably 0.5 hour to 24 hours. The atmosphere for the binder removal processing is air or a reducing atmosphere. In the binder removal treatment, for example, a wetter or the like may be used to wet the N ₂ gas or the mixed gas. In this case, the water temperature is preferably about 5°C to 75°C.

The holding temperature during firing is preferably 1100°C to 1400°C.

The heating rate is preferably 200° C./hour to 5000° C./hour. The temperature holding time is preferably 0.5 hours to 2.0 hours, and the cooling rate is preferably 100°C/hour to 500°C/hour.

Moreover, as the atmosphere for firing, it is preferable to use a mixed gas of humidified N ₂ and H ₂ and fire at an oxygen partial pressure of 10 ⁻² to 10 ⁻⁹ Pa.

After firing, the obtained element body 4 is annealed if necessary. The annealing conditions may be known conditions. For example, it is preferable that the oxygen partial pressure during the annealing treatment is higher than the oxygen partial pressure during the firing, and the holding temperature is 1000° C. or lower.

Further, although the manufacturing method in which the binder removal treatment, the firing and the annealing treatment are independently performed is described above, they may be continuously performed.

The element body 4 obtained as described above is subjected to end face polishing by, for example, barrel polishing or sandblasting, and the external electrode paste is applied and baked to form the external electrodes 6 and 8. Then, if necessary, a coating layer is formed on the surfaces of the external electrodes 6 and 8 by plating or the like.

In this way, the laminated ceramic capacitor 2 is manufactured.

3. Summary of this Embodiment In the multilayer ceramic capacitor 2 of this embodiment, the content rate of the element α in the internal ceramics layer 10 is 33.3 mol% to 50.0 mol% in terms of oxide, and the element β in the internal ceramics layer 10 is Is in the range of 25.0 mol% to 50.0 mol% in terms of oxide, and (E0-E1) satisfies the relationship of (E0-E1)>0.

This improves the bending strength and thermal shock resistance of the monolithic ceramic capacitor 2. It is considered that this is because the Young's modulus and the coefficient of linear expansion of the outer layer portion 11 increase due to the small Ta of the outer layer portion 11. That is, by increasing the Young's modulus and the coefficient of linear expansion of the outer layer portion 11, the external stress received from the substrate or the like is relaxed, and the load on the element body 4 is reduced. As a result, the bending strength is improved, and cracks are suppressed, so that the thermal shock resistance is improved.

Since the multilayer ceramic capacitor 2 of the present embodiment can achieve high reliability, it can be used not only for information terminals such as mobile phones and home appliances, but also for in-vehicle use.

In addition, in the present embodiment, the content of each element other than the element β in the internal ceramics layer 10 of the multilayer ceramic capacitor 2 in terms of oxide, and the content of each element other than the element β in the outer ceramics layer in terms of oxide. The rates are about the same.

This improves the bonding strength between the inner layer portion 13 and the outer layer portion 11. As a result, the thermal shock resistance is further improved.

Further, in the present embodiment, (E0-E1) satisfies the relationship of 5 mol%≦(E0-E1)≦15 mol%.

This further improves the bending strength and thermal shock resistance.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

For example, in the above embodiment, the outer layer portion 11 is provided at both ends of the inner layer portion 13 in the stacking direction (Z-axis direction), but the outer layer portion 11 is provided in one of the inner layer portion 13 in the stacking direction (Z-axis direction). It may be provided only at the end.

The laminated electronic component of the present invention is not limited to the laminated ceramic capacitor 2 and can be applied to other laminated electronic components. Other laminated electronic components include, for example, bandpass filters, inductors, laminated three-terminal filters, piezoelectric elements, PTC thermistors, NTC thermistors, and varistors.

Hereinafter, the present invention will be described in more detail with reference to Examples of the present invention, but the present invention is not limited to these Examples.

As the starting material for each sample inner ceramic layer paste-tables 1 _{5, SrCO 3, BaCO 3,} CaCO 3, TiO 2, ZrO 2, Nb 2 O 5, Ta 2 O 5, La 2 O 3, Eu Powders of ₂ O ₃ , Sm ₂ O ₃ , Dy ₂ O ₃ and Ce ₂ O ₃ were prepared. These were weighed so as to have the oxide conversion composition of the internal ceramics layer 10 of each sample number in Tables 1 to 5, and wet mixed for 24 hours by a ball mill using ethanol as a dispersion medium. The obtained mixture was dried and heat-treated in the atmosphere at a holding temperature of 900° C. for a holding time of 2 hours to obtain a calcined powder.

The calcined powder obtained by the above method was crushed to obtain a raw material for the internal ceramics layer. The resulting internal ceramics layer raw material: 100 parts by mass, polyvinyl butyral resin: 10 parts by mass, dibutyl phthalate (DOP) as a plasticizer: 5 parts by mass, and alcohol as a solvent: 100 parts by mass in a ball mill. The mixture was mixed into a paste to prepare an internal ceramic layer paste.

The external ceramics layer paste was prepared in the same manner as the internal ceramics layer paste, except that the starting materials were weighed so that the composition of the external ceramics layer was predetermined after firing.

3 parts by weight of 100 parts by mass of Ni particles, 30 parts by mass of an organic vehicle (8 parts by mass of ethyl cellulose resin dissolved in 92 parts by mass of butyl carbitol), and 8 parts by mass of butyl carbitol were used as raw materials for the internal electrode layer 12. This roll was kneaded and made into a paste to obtain an internal electrode layer paste.

Then, an internal green sheet was formed using the produced internal ceramic layer paste, the internal electrode layer paste was printed on the internal green sheet, and these were laminated to obtain an internal laminate. Next, an appropriate number of external green sheets were formed on the internal laminate using the external ceramic layer paste, and pressure was applied in the laminating direction to obtain a green laminate. The green laminate was cut into a predetermined shape to obtain a green chip.

Next, the obtained green chip was subjected to binder removal processing, firing, and annealing processing to obtain the element body 4. The conditions for binder removal processing, firing and annealing are as follows. A wetter was used to humidify each atmosphere gas.

(Binder removal processing)
Temperature rising rate: 100°C/hour Holding temperature: 400°C
Temperature holding time: 8.0 hours Atmosphere gas: A mixed gas of humidified N ₂ and H _2.

(Baking)
Temperature rising rate: 500°C/hour Holding temperature: 1200°C to 1350°C
Temperature holding time: 2.0 hours Cooling rate: 100° C./hour Atmosphere gas: Moistened mixed gas of N ₂ and H ₂ Oxygen partial pressure: 10 ⁻⁵ to 10 ⁻⁹ Pa

(Annealing treatment)
Holding temperature: 800 ℃ ~ 1000 ℃
Temperature holding time: 2.0 hours Temperature rising/falling rate: 200° C./hour Atmosphere gas: Humidified N ₂ gas

After polishing the end surface of the obtained element body 4, a paste obtained by mixing the external electrodes 6 and 8 with a predetermined amount of Cu powder, glass frit and vehicle was applied to the end surface of the element body 4 and then at 750° C. Formed by baking. After that, a Ni plating layer and a Sn plating layer were sequentially formed on the surfaces of the external electrodes 6 and 8 to obtain a multilayer ceramic capacitor sample having the same shape as the multilayer ceramic capacitor 2 shown in FIG. In each of the obtained multilayer ceramic capacitor samples, the thickness Z0 of the element body 4 in any stacking direction (Z-axis direction) was 1.2 mm, the thickness td of the internal ceramics layer 10 was 10 μm, and the thickness to of the outer layer portion 11 was 100 μm. Met.

Each of the obtained multilayer ceramic capacitor samples was subjected to elemental analysis of the internal ceramic layer 10 and the external ceramic layer, and the bending strength and thermal shock resistance were evaluated by the methods shown below. The results are shown in Tables 1-5.

Elemental analysis A multilayer ceramic capacitor sample was cut parallel to the stacking direction (Z-axis direction). Samples were sampled from three points on the inner ceramic layer 10 on the cut surface and measured by a scanning electron microscope-energy dispersive X-ray analysis (SEM-EDS) to obtain the average content of each element.

In addition, in the outer layer portion 11 of the above-mentioned cut surface, from the surface of the outer layer portion 11 toward the inner layer portion 13, a portion of 1/4 to in the stacking direction (Z-axis direction) is defined as P1, and from P1 toward the inner layer portion 13. , Where P1 is a portion of 1/4 to in the stacking direction (Z-axis direction) and P3 is a portion of 1/4 to in the stacking direction (Z-axis direction) from P2 toward the inner layer portion 13, P1, P2 and It sampled from P3, it measured by the scanning electron microscope-energy dispersive X-ray analysis (SEM-EDS), and the average value of each element was calculated|required. Based on these values, the items relating to the compositions of the internal ceramic layer 10 and the external ceramic layer in Tables 1 to 5 are described.

In Tables 4 and 5, in each sample, the content rate of the element α in the internal ceramics layer 10 is 33.3 mol% to 50.0 mol% in terms of oxide, and the content of the element β in the internal ceramics layer 10 is The rate was 25.0 mol% to 50.0 mol% in terms of oxide.

X-Ray Diffraction From the X-ray diffraction pattern, it was confirmed that the internal ceramic layers 10 and the external ceramic layers of the multilayer ceramic capacitor samples other than Sample 25 had a tungsten bronze type crystal structure.

-Bending strength With respect to 20 samples, the bending strength in the center part of the sample in the X-axis direction was measured using a measuring device (trade name: 5543, manufactured by Instron). The jig distance between two points supporting the test piece at the time of measurement was 400 μm, the measurement speed was 0.5 mm/min, and average values of the obtained values are shown in Tables 1 to 5.

-Heat resistance 20 samples were held at -55°C for 30 minutes in a gas tank, and then held at 150°C in a gas tank for 30 minutes. These cycles were repeated 1000 cycles, 1500 cycles, and 2000 cycles. When no cracks were generated after 2000 cycles, the value was A. When no crack was generated until 1500 cycles, but one or more samples were cracked after 2000 cycles, it was designated as B. When no cracks were generated after 1000 cycles but one or more samples were cracked after 1500 cycles, it was designated as C. The crack of the sample was filled with resin in the state of the substrate on which the sample was mounted, polished, and confirmed with a microscope.

From Table 1 to Table 5, the content rate of the element α in the internal ceramics layer 10 is 33.3 mol% to 50.0 mol% in terms of oxide, and the content rate of the element β in the internal ceramics layer 10 is in terms of oxide. Is 25.0 mol% to 50.0 mol% and (E0-E1) satisfies the relationship of (E0-E1)>0 (Sample Nos. 21 to 25, 31 to 66), the elements in the internal ceramics layer 10 are It can be confirmed that the bending strength and thermal shock resistance are higher than when the content rate of α is 66.7 mol% in the oxide conversion (Sample No. 1) or 71.4 mol% (Sample No. 2). It was

From Table 1 to Table 5, the content rate of the element α in the internal ceramics layer 10 is 33.3 mol% to 50.0 mol% in terms of oxide, and the content rate of the element β in the internal ceramics layer 10 is in terms of oxide. Is 25.0 mol% to 50.0 mol% and (E0-E1) satisfies the relationship of (E0-E1)>0 (Sample Nos. 21 to 25, 31 to 66), the elements in the internal ceramics layer 10 are It was confirmed that the bending strength and thermal shock resistance were higher than those in the case where the β content was 14.3 mol% in terms of oxide (Sample No. 3).

From Table 2 to Table 5, the content rate of the element α in the internal ceramics layer 10 is 33.3 mol% to 50.0 mol% in terms of oxide, and the content rate of the element β in the internal ceramics layer 10 is in oxide conversion. Is 25.0 mol% to 50.0 mol% and (E0-E1) satisfies the relationship of (E0-E1)>0 (sample numbers 21 to 25, 31 to 66), (E0-E1) is It was confirmed that the bending strength and the thermal shock resistance were higher than in the case where the relationship of (E0-E1)>0 was not satisfied (Sample Nos. 11 to 18).

From Table 3 to Table 5, the content of each element other than the element β in the internal ceramics layer 10 in terms of oxide and the content of each element other than the element β in the outer ceramics layer in terms of oxide are respectively shown. When the amounts are substantially the same (Sample Nos. 35 to 62), the content of each element other than the element β in the internal ceramics layer 10 in terms of oxide and the content of each element other than the element β in the outer ceramics layer in terms of oxide are converted. It can be confirmed that the thermal shock resistance is higher than that in the case where the content ratios in Table 2 are not substantially equal to each other (Sample Nos. 21 to 25, 31 to 34, 63 to 66).

2... Multilayer ceramic capacitor 4... Element bodies 6, 8... External electrode 10... Internal ceramics layer 11... Outer layer part 12... Inner electrode layer 13... Inner layer part

Claims (3)

A laminated electronic component comprising an element body having an inner layer portion in which inner ceramic layers and inner electrode layers are alternately laminated, and an outer layer portion provided at an end of the inner layer portion in the laminating direction,
The internal ceramics layer contains an element α and an element β,
The element α is at least one selected from the group consisting of Ba, Sr and Ca,
The element β is composed of Ta or Ta and Nb,
The content rate of the element α in the internal ceramics layer is 33.3 to 50.0 mol% in terms of oxide,
The content rate of the element β in the internal ceramics layer is 25.0 to 50.mol% in terms of oxide,
When the oxide content of Ta in the internal ceramics layer is E0 and the oxide content of Ta in the external ceramics layer forming the outer layer portion is E1,
(E0-E1) is a laminated electronic component that satisfies the relationship of (E0-E1)>0. The content of each element other than the element β in the internal ceramics layer in terms of oxide and the content of each element other than the element β in the outer ceramics layer in terms of oxide are substantially the same. Item 1. The laminated electronic component according to item 1. The multilayer electronic component according to claim 1, wherein the (E0-E1) satisfies the relationship of 5 mol%≦(E0-E1)≦15 mol%.

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