JP2020122673A - Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and substrate processing method - Google Patents

Abstract

To provide a substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method, by which a defect in a substrate can be detected with high accuracy.SOLUTION: A plurality of line beams irradiated to a substrate are respectively received by a plurality of line sensors 241 and 242, and a light receiving signal corresponding to a received light quantity is output. The line sensors 241 and 242 respectively have a plurality of light receiving areas arranged in an X direction, and output the light receiving signal corresponding to the received light quantity from each light receiving area. The line sensor 241 is arranged so as to be shifted in the X direction with respect to the line sensor 242 by a non-integer multiple of a length of one light receiving area in the X direction. The light receiving areas are virtually divided into a plurality of partial areas arranged in the X direction, and each pixel is constituted by a partial area where the line sensors 241 and 242 overlap each other when viewed in a direction orthogonal to the X direction. Imaging data indicating an image of the substrate is generated by calculating pixel values based on the light receiving signals of the plurality of light receiving areas respectively including the plurality of partial areas.SELECTED DRAWING: Figure 4

Description

The present invention relates to a substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method for inspecting a substrate.

Inspection of a substrate is performed in various processing steps for the substrate. For example, Patent Document 1 describes a substrate processing apparatus having a surface inspection processing unit. In the surface inspection processing unit, the radial region on the substrate is continuously irradiated with the illumination light, and the reflected light from the substrate is received by the CCD (charge coupled device) line sensor. In this state, when the substrate rotates once, the entire surface of the substrate is irradiated with the illumination light, and the brightness distribution of the reflected light on the entire surface of the substrate is based on the received light amount distribution of the CCD line sensor. Obtained as image data. The substrate is inspected based on the surface image data.

Patent Document 2 describes a substrate processing apparatus having a substrate inspection apparatus. In the board inspection apparatus, band-shaped light larger than the diameter of the board in one direction is emitted downward from the light projecting portion. In this state, the substrate to be inspected is moved in the other direction orthogonal to the one direction so as to pass below the light projecting unit. Thereby, the strip-shaped light is sequentially applied to each part of the substrate. Thereafter, the band-shaped light is sequentially reflected by each part of the substrate and received by the CCD line sensor. Image data representing an image of the entire surface of the substrate is generated based on the amount of light received by the CCD line sensor. The substrate is inspected based on the generated image data.

JP, 2011-66049, A JP, 2018-36235, A

The surface inspection processing unit described in Patent Document 1 (hereinafter referred to as a rotary substrate inspection device) may not be able to detect a defect near the center of the substrate. On the other hand, according to the board inspection apparatus of Patent Document 2 (hereinafter, referred to as a linear board inspection apparatus), it is possible to appropriately detect a defect near the center of the board.

However, in the rotary substrate inspection apparatus, an area corresponding to the radius of the substrate is imaged, whereas in the linear substrate inspection apparatus, an area corresponding to the diameter of the substrate is imaged. Therefore, when imaging is performed using the same CCD line sensor, the resolution of the image in the linear substrate inspection device is about half the resolution of the image in the rotary substrate inspection device. Therefore, the accuracy of detecting a defect on the substrate is reduced.

An object of the present invention is to provide a substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method capable of detecting a substrate defect with high accuracy.

(1) A substrate inspection apparatus according to a first aspect of the present invention includes a holding unit that holds a substrate to be inspected and N line lights (N is an integer of 2 or more) extending in parallel with each other in the first direction. The light projecting section and the holding section are arranged in the first direction so that the light projecting section emitting the light and the N line lights emitted by the light projecting section are applied to the surface of the substrate held by the holding section. A moving unit that relatively moves in the intersecting second direction, N line sensors that respectively receive N line lights emitted to the substrate and output a light reception signal corresponding to the amount of received light, and N line sensors. And an image data generation unit that generates image data showing an image of the substrate based on a light reception signal output from the line sensor, each line sensor having a plurality of light reception regions arranged in the first direction. A light receiving signal corresponding to the amount of light received is output from the light receiving area, and at least one line sensor of the N line sensors is connected to another line sensor by a non-integer multiple of the length of one light receiving area in the first direction. On the other hand, the light-receiving areas of the line sensors, which are arranged so as to be displaced in the first direction, are virtually divided into a plurality of partial areas arranged in the first direction, and the third direction orthogonal to the first direction. In the visual observation, each pixel is configured by N partial regions where N line sensors overlap each other, and the image data generation unit determines each pixel value based on the light reception signals of the N light receiving regions including the N partial regions. To calculate.

In this substrate inspection apparatus, N (N is an integer of 2 or more) line lights that are parallel to the first direction and extend parallel to each other are emitted by the light projecting unit. The light projecting unit and the holding unit intersect with each other in the first direction by the moving unit so that the N line lights emitted by the light projecting unit are applied to the surface of the inspection target substrate held by the holding unit. It is relatively moved in the second direction. The N line lights emitted to the substrate are received by the N line sensors, respectively.

Here, each line sensor has a plurality of light receiving regions arranged in the first direction. Further, at least one line sensor among the N line sensors is arranged so as to be displaced from the other line sensors in the first direction by a non-integer multiple of the length of one light receiving region in the first direction. It

Each light receiving area of each line sensor is virtually divided into a plurality of partial areas arranged in the first direction, and a light receiving signal corresponding to the amount of light received is output from each light receiving area of each line sensor. In the third direction view orthogonal to the first direction, each pixel value is calculated based on the light receiving signals of the N light receiving areas including the N overlapping partial areas of the N line sensors. Image data showing an image of the substrate is generated.

In this case, in the third directional view, each pixel is configured by N partial regions where N line sensors overlap. In the first direction, the length of at least some of the pixels is smaller than the length of each light receiving region of each line sensor. Therefore, the resolution of the image represented by the image data generated by the board inspection apparatus is higher than the resolution of the image represented by the image data generated based on the light reception signal from any one of the line sensors. Therefore, the defect of the substrate can be detected with high accuracy based on the image of the substrate having high resolution.

(2) The shift amount of at least one line sensor with respect to the other line sensor in the first direction may be smaller than the length of one light receiving region in the first direction. In this case, the image data can be generated using the entire light receiving area of each line sensor. As a result, it is possible to generate image data showing an image of the substrate having a higher resolution.

(3) The N line sensors may be arranged so as to be offset from each other in the first direction by 1/N of the length of one light receiving region in the first direction. In this case, the length of each pixel in the first direction can be easily made smaller than the length of each light receiving region of each line sensor. As a result, it is possible to easily generate image data showing an image of a substrate having high resolution.

(4) The image data generation unit is based on the light reception signals from the N line sensors based on the N line lights when the same line region or the line region within a certain range is irradiated on the substrate at different times. The image data may be generated by generating the image data. In this case, N line lights can be respectively received by the N line sensors with a simple configuration.

(5) The image data generation unit may calculate each pixel value by averaging the values of the light reception signals of the N light receiving regions. In this case, each pixel value can be easily calculated.

(6) The board inspection device may further include an inspection unit that inspects the board based on the image data generated by the image data generation unit. In this case, it is possible to inspect whether there is a defect on the substrate based on the image data.

(7) A substrate processing apparatus according to a second aspect of the present invention is a film forming unit that forms a processing film on a substrate, and first image data that represents an image of the substrate after the processing film is formed by the film forming unit. And a substrate inspection device according to the invention.

In this substrate processing apparatus, image data showing an image of the substrate after the processing film is formed by the film forming unit is generated by the substrate inspection apparatus. As a result, it is possible to generate image data showing an image of the substrate having high resolution. Therefore, the defect of the substrate can be detected with high accuracy based on the image of the substrate having high resolution.

(8) A substrate inspection method according to a third aspect of the present invention includes a step of emitting N (N is an integer of 2 or more) line lights parallel to the first direction and parallel to each other by a light projecting unit. The moving unit intersects the light projecting unit and the holding unit in the first direction so that the N line lights emitted by the light unit are irradiated onto the surface of the inspection target substrate held by the holding unit. 2 relative movement, a step of receiving N line lights irradiated onto the substrate by N line sensors, respectively, and outputting a light reception signal corresponding to the amount of received light, and N lines And a step of generating image data showing an image of the substrate based on a light receiving signal output from the sensor, each line sensor having a plurality of light receiving regions arranged in the first direction, and the amount of light received from each light receiving region. And outputs at least one line sensor of the N line sensors to the other line sensors by a non-integer multiple of the length of one light receiving region in the first direction. The light receiving areas of the line sensors, which are arranged so as to be displaced in the direction, are virtually divided into a plurality of partial areas lined up in the first direction, and are N in the third direction view orthogonal to the first direction. Each pixel is composed of N partial areas overlapping with each other of the line sensor, and in the step of generating image data, each pixel value is calculated based on the light receiving signals of the N light receiving areas including the N partial areas. Including that.

According to this method, it is possible to generate image data showing an image of a substrate having high resolution. Therefore, the defect of the substrate can be detected with high accuracy based on the image of the substrate having high resolution.

(9) The shift amount of at least one line sensor with respect to the other line sensor in the first direction may be smaller than the length of one light receiving region in the first direction. In this case, the image data can be generated using the entire light receiving area of each line sensor. As a result, it is possible to generate image data showing an image of the substrate having a higher resolution.

(10) The N line sensors may be arranged so as to be displaced from each other in the first direction by 1/N of the length of one light receiving region in the first direction. In this case, the length of each pixel in the first direction can be easily made smaller than the length of each light receiving region of each line sensor. As a result, it is possible to easily generate image data showing an image of a substrate having high resolution.

(11) The step of generating image data is a light reception signal from N line sensors based on N line lights when the same line region or a line region within a certain range is irradiated on the substrate at different times. Generating image data based on the. In this case, N line lights can be respectively received by the N line sensors with a simple configuration.

(12) The step of generating image data may include calculating each pixel value by averaging the values of the light reception signals of the N light receiving regions. In this case, each pixel value can be easily calculated.

(13) The board inspection method may further include a step of inspecting the board based on the generated image data. In this case, it is possible to inspect whether there is a defect on the substrate based on the image data.

(14) In the substrate processing method according to the fourth aspect of the present invention, the step of forming a processing film on the substrate by the film forming unit, and the image data indicating the image of the substrate after the formation of the processing film by the film forming unit is processed by the third method. Generating by the substrate inspection method according to the invention.

According to this substrate processing method, image data indicating an image of the substrate after the processing film is formed by the film forming unit is generated by the above-described substrate inspection method. As a result, it is possible to generate image data showing an image of the substrate having high resolution. Therefore, the defect of the substrate can be detected with high accuracy based on the image of the substrate having high resolution.

According to the present invention, it becomes possible to detect a defect in a substrate with high accuracy.

FIG. 1 is an external perspective view of a board inspection device according to an embodiment of the present invention. It is a typical side view which shows the internal structure of the board|substrate inspection apparatus of FIG. It is a figure for demonstrating arrangement|positioning of the line sensor of FIG. It is a figure for demonstrating arrangement|positioning of the line sensor of FIG. It is a block diagram which shows the functional structure of a control part. It is a figure which shows the process of the movement of the board|substrate in a 1st case. It is a figure which shows the process of the movement of the board|substrate in a 2nd case. It is a figure which shows the process of the movement of the board|substrate in a 3rd case. It is a figure which shows the process of the movement of the board|substrate in a 4th case. 6 is a flowchart showing an inspection process performed by the control unit of FIG. It is a schematic block diagram which shows the whole structure of the substrate processing apparatus provided with the substrate inspection apparatus of FIG. 1 and FIG. It is a figure which shows the other example of an imaging part.

A substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method according to embodiments of the present invention will be described below with reference to the drawings. In the following description, a substrate is a semiconductor substrate, an FPD (Flat Panel Display) substrate such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, A photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

(1) Configuration of Substrate Inspection Apparatus FIG. 1 is an external perspective view of the substrate inspection apparatus according to one embodiment of the present invention. FIG. 2 is a schematic side view showing an internal configuration of the board inspection apparatus 200 of FIG. As shown in FIG. 1, the board inspection apparatus 200 includes a housing section 210, a light projecting section 220, a reflecting section 230, an imaging section 240, a board holding device 250, a moving section 260, a direction detecting section 270, and a control section 280. ..

A slit-shaped opening 211 for loading and unloading the substrate W is formed on the side of the housing 210. The light projecting section 220, the reflecting section 230, the imaging section 240, the substrate holding device 250, the moving section 260, and the direction detecting section 270 are housed in the housing section 210. The control unit 280 includes, for example, a CPU (central processing unit) and a memory, or a microcomputer, and controls the operations of the light projecting unit 220, the imaging unit 240, the substrate holding device 250, the moving unit 260, and the direction detecting unit 270.

The light projecting unit 220 includes, for example, one or a plurality of light sources, and emits a plurality of strip-shaped line lights larger than the diameter of the substrate W obliquely downward from the emission surface. As shown in FIG. 2, in the present embodiment, the light projecting unit 220 emits two line lights L1 and L2 that are separated by a predetermined pitch and are parallel to each other. Each of the line lights L1 and L2 has a long horizontal cross section that extends in the X direction.

The reflector 230 includes, for example, a mirror. The imaging unit 240 includes a plurality of line sensors and one or more condenser lenses. In the present embodiment, the image pickup unit 240 includes two line sensors 241 and 242 that are separated from each other by a pitch and are parallel to each other. Each of the line sensors 241 and 242 has a plurality of pixels lined up in the X direction. Details of the arrangement of the line sensors 241 and 242 will be described later.

The substrate holding device 250 is, for example, a spin chuck, and includes a driving device 251 and a rotation holding unit 252. The drive device 251 is, for example, an electric motor and has a rotating shaft 253. The rotation holding unit 252 is attached to the tip of the rotation shaft 253 of the drive device 251, and is rotationally driven around the vertical axis while holding the substrate W to be inspected.

The moving unit 260 includes a pair of guide members 261 and a moving holding unit 262. The pair of guide members 261 are provided so as to extend in the Y direction in parallel with each other. The Y direction is orthogonal to the X direction on the horizontal plane. The moving holding unit 262 is configured to be movable in the Y direction along the pair of guide members 261 while holding the substrate holding device 250. The movement holding unit 262 moves in the Y direction while the substrate holding device 250 holds the substrate W, so that the substrate W passes below the light projecting unit 220 and the reflecting unit 230.

The direction detection unit 270 is, for example, a reflective photoelectric sensor including a light projecting element and a light receiving element, and emits light toward the outer peripheral portion of the substrate W while the substrate W to be inspected is rotated by the substrate holding device 250. In addition, the reflected light from the substrate W is received. The direction detection unit 270 detects the orientation flat of the substrate W based on the amount of received reflected light from the substrate W. A transmissive photoelectric sensor may be used as the direction detection unit 270.

An image pickup operation of the substrate W in the substrate inspection apparatus 200 of FIG. 1 will be described. The substrate W to be inspected is carried into the housing 210 through the opening 211 by the carrier device 120 of FIG. 11 described later, and is held by the substrate holding device 250. Subsequently, while the substrate W is rotated by the substrate holding device 250, the direction detection unit 270 emits light to the peripheral portion of the substrate W, and the reflected light is received by the direction detection unit 270. Thus, the orientation flat of the substrate W is detected and the orientation of the substrate W is determined. Based on the result of the determination, the substrate holding device 250 adjusts the rotational position of the substrate W so that the orientation flat of the substrate W faces a certain direction.

Next, while the line lights L1 and L2 are emitted obliquely downward from the light projecting unit 220, the substrate W is moved in one direction by the moving unit 260 so as to pass below the light projecting unit 220. As a result, the light projecting unit 220 sequentially irradiates the entire surface of the substrate W with the line light L1, and the light projecting unit 220 sequentially irradiates the entire surface of the substrate W with the line light L2. The line lights L1 and L2 reflected on the surface of the substrate W are further reflected by the reflecting section 230 and guided to the imaging section 240.

The line sensor 241 of the imaging unit 240 sequentially captures the surface of the substrate W by receiving the line light L1 reflected from the surface of the substrate W at a predetermined scan cycle. Similarly, the line sensor 242 of the imaging unit 240 sequentially captures the surface of the substrate W by receiving the line light L2 reflected from the surface of the substrate W at a predetermined scan cycle. The line sensors 241 and 242 output pixel data indicating a pixel value based on the light receiving signal corresponding to the light receiving amount of each pixel.

Based on the plurality of pixel data output from the line sensors 241 and 242 of the image pickup unit 240, the control unit 280 generates image data indicating the entire image on the surface of the substrate W. After that, the substrate W is returned to a predetermined position by the moving unit 260, and the substrate W is carried out of the housing unit 210 through the opening 211 by the transfer device 120 of FIG. The substrate W is inspected by the controller 280 based on the generated image data.

(2) Line Sensor FIGS. 3 and 4 are diagrams for explaining the arrangement of the line sensors 241 and 242 of FIG. In this embodiment, the line sensors 241 and 242 are, for example, CCD (charge coupled device) line sensors or CMOS (complementary metal oxide semiconductor) line sensors and have the same configuration.

The line sensor 241 and the line sensor 242 are arranged such that the center of each pixel of the line sensor 241 and the center of each pixel of the line sensor 242 are separated by a predetermined pitch in the direction orthogonal to the X direction. Further, in the line sensor 241 and the line sensor 242, each pixel of the line sensor 242 (excluding the pixel at one end) is overlapped with two adjacent pixels of the line sensor 241 in the direction orthogonal to the X direction. Are arranged in a state of being displaced from each other in the X direction.

In this example, each of the line sensors 241 and 242 includes n (n is an integer of 2 or more) pixels arranged in the X direction. The n pixels of the line sensor 241 are referred to as pixels _a 1 ~a _n. The n pixels of the line sensor 242 are referred to as pixels b _{1 to} b _n , respectively. The line sensor 242 is arranged with a shift with respect to the line sensor 241 pixels _a 1 _~a n in the X _direction, the b 1 ~b 1 only X direction half the length of _n. Thus, in the direction perpendicular to the X direction, the pixel _{a 2} overlaps with the pixel _b 1, _{b 2,} pixel _{a 3} overlaps with the pixel _b 2, _{b 3,} pixel _{a n} is the pixel _{b n-1, b n} Overlap.

As shown in FIG. 4, each pixel a _k , b _k (k is an integer of 1 to n) is virtually divided into two partial regions arranged in the X direction. Called half region in the X direction of each pixel a _k a partial area a _{k, 1,} referred to as the region of the other half and partial area a _{k, 2} in the X direction of each pixel a _k. Similarly, calling the half region in the X direction of each pixel b _k the partial region b _{k, 1,} referred to as the region of the other half and partial region b _{k, 2} in the X direction of each pixel b _k.

By performing calculation using the pixel values output from the partial regions a _k,1 , a _k,2 , b _k,1 , b _k,2 , one virtual line sensor (hereinafter, virtual line sensor) will be described. It is called a sensor.) LS can be introduced. In the present example, the above calculation includes averaging two pixel values respectively output from the two partial regions overlapping in the direction orthogonal to the X direction.

Specifically, the virtual line sensor LS includes 2n+1 pixels arranged in the X direction. The 2n+1 pixels of the virtual line sensor LS are referred to as pixels x _{1 to} x _2n+1 , respectively. Pixel values output from the partial regions a _{1,1 to} a _n,2 when the predetermined line-shaped region of the substrate W is irradiated with the line light L ₁ are A _{1,1 to} A _n,2 . Pixels output from the partial regions b _{1,1 to} b _n,2 when the line light L2 is applied to the same line-shaped region as the above-described line-shaped region of the substrate W or a line-shaped region in the vicinity thereof. The values are B _{1,1 to} B _n,2 . The pixel value A _k,1 and the pixel value A _k,2 are equal to each other, and the pixel value B _k,1 and the pixel value B _k,2 are equal to each other.

Here, it is assumed that the pixel values output from the pixels x _{1 to} x _2n+1 of the virtual line sensor LS are X _{1 to} X _2n+1 . In this case, the pixel value X ₂ output from the pixel x ₂ overlapping the partial area a _1,2 and the partial area b _1,1 is calculated by the average of the pixel value A _1,2 and the pixel value B _1,1. It The pixel value X ₃ output from the pixel x ₃ overlapping the partial area a _2,1 and the partial areas b _1,2 is calculated by the average of the pixel value A _2,1 and the pixel value B _1,2 . The pixel value X ₄ output from the pixel x ₄ overlapping the partial area a _2,2 and the partial area b _2,1 is calculated by the average of the pixel value A _2,2 and the pixel value B _2,1 .

Similarly, the pixel value X _m (m is an integer of 1 to 2n+1) output from each pixel x _m is calculated by the following formula (1). In formula (1), when calculating the pixel value X ₁ , any value (for example, a dummy value) may be used as the pixel value B _0,2 . Similarly, when calculating the pixel value X _2n+1 , any value may be used as the pixel value A _n+1,1 .

The lengths of the line sensors 241 and 242 in the X direction are slightly larger than the diameter of the substrate W. Therefore, normally, the line light L1 reflected by the substrate W does not enter the pixel a ₁ at the end of the line sensor 241, and the pixel b _n at the end of the line sensor 242 reflects by the substrate W. The line light L2 does not enter. That is, the partial areas a ₁ , ₁ , b _{n, 2} at the end portions do not contribute to the inspection of the substrate W, and the pixels x ₁ , x _2n+1 at both ends of the virtual line sensor LS which respectively overlap these partial areas are also substrate W. Does not contribute to the inspection. Therefore, the pixel values X ₁ and X _2n+1 output from the pixels x ₁ and x _2n+1 may be arbitrary values.

According to the above configuration, the virtual line sensor LS has substantially the same length as the line sensor 241 or the line sensor 242 in the X direction. On the other hand, the number of pixels x _{1 to} x _2n+1 of the virtual line sensor LS is about twice the number of pixels a _{1 to} a _n of the line sensor 241 or the number of pixels b _{1 to} b _n of the line sensor 242. .. Therefore, the resolution of the image by the virtual line sensor LS can be approximately doubled as the resolution of the image by the line sensor 241 or the line sensor 242 in a pseudo manner. Thereby, the defect of the substrate W can be detected with high accuracy using an image having a high resolution.

(3) Control Unit FIG. 5 is a block diagram showing the functional configuration of the control unit 280. As shown in FIG. 5, the control unit 280 includes a device control unit 1, pixel data acquisition units 2 and 3, an image data generation unit 4, a sample image data acquisition unit 5, and an inspection unit 6 as functional units. The functional unit of the control unit 280 is realized by, for example, the CPU of the control unit 280 executing a computer program stored in the memory. Note that part or all of the functional units of the control unit 280 may be realized by hardware such as an electronic circuit.

The device control unit 1 controls the operation of the imaging unit 240 so that the line sensors 241 and 242 respectively receive the line lights L1 and L2 at a predetermined scan cycle Δt. Further, the apparatus control unit 1 controls the operation of the moving unit 260 so that the substrate W moves in the Y direction at a predetermined speed v. Further, the device control unit 1 also controls the operations of the light projecting unit 220, the substrate holding device 250, and the direction detecting unit 270 of FIG. The pixel data acquisition unit 2 acquires pixel data from the line sensor 241. The pixel data acquisition unit 3 acquires pixel data from the line sensor 242.

The image data generation unit 4 uses the pixel values A _k,1 , A _k,2 acquired by the pixel data acquisition unit ₂ and the pixel values B _k,1 , B _k,2 acquired by the pixel data acquisition unit 3 as described above. By applying the formula (1), the image data indicating the image of the substrate W is acquired. Specifically, the substrate values are calculated by using the pixel values A _k,1 , A _k,2 at a predetermined time point and the pixel values B _k,1 , B _k,2 at other time points. The line image data indicating the image of the predetermined line-shaped area is generated. Image data is generated by combining a plurality of line image data parallel to the X direction.

Here, the correspondence between the pixel values A _k,1 , A _k,2 and the pixel values B _k,1 , B _k,2 used to generate each line image data is determined by the scan cycle Δt of the imaging unit 240 and the movement. It depends on the speed v of movement of the substrate by the section 260. The correspondence between the pixel values A _k,1 , A _k,2 and the pixel values B _k,1 , B _k,2 according to the scan cycle Δt and the speed v will be described later.

The sample image data acquisition unit 5 acquires sample image data representing an image of a sample substrate having no external defect. The sample substrate may be, for example, a substrate W that has been inspected in advance with high accuracy and determined to have no defect in the inspection. The sample image data may be acquired by the board inspection apparatus 200 or may be acquired by another apparatus. Further, design data generated in advance may be used as the sample image data. The inspection unit 6 inspects whether or not the substrate W has a defect by comparing the image data generated by the image data generation unit 4 with the sample image data acquired by the sample image data acquisition unit 5.

(4) Operation of Image Data Generation Unit The pitch in the Y direction between the linear regions of the substrate W corresponding to the pitch p0 between the line sensors 241 and 242 in FIG. 2 is called the pixel pitch p1. When the reflection unit 230 horizontally reflects the line lights L1 and L2 toward the line sensors 241 and 242, the pixel pitch p1 is calculated by the following equation (2). In Expression (2), θ is the irradiation angle of the line lights L1 and L2 onto the substrate W.

Further, as described above, the imaging unit 240 of FIG. 2 operates at the scan cycle Δt, and the substrate W moves in the Y direction at the speed v. In this case, when the movement pitch of the substrate W in the Y direction in each scan cycle Δt is p2, the movement pitch p2 is given by the following equation (3). The operation of the image data generation unit 4 in FIG. 5 differs depending on the relationship between the pixel pitch p1 and the movement pitch p2. Hereinafter, the operation of the image data generation unit 4 corresponding to the relationship between the pixel pitch p1 and the movement pitch p2 will be described.

(A) First Case FIG. 6 is a diagram showing a process of moving the substrate W in the first case. In the first case, the pixel pitch p1 and the movement pitch p2 are equal. As shown in FIG. 6A, at time t1, a line-shaped region (hereinafter, simply referred to as a region. The same also applies to a line-shaped region described later) R1 of the substrate W is irradiated with the line light L1 and reflected. The line light L1 thus obtained is received by the line sensor 241.

As shown in FIG. 6B, the substrate W moves in the Y direction by the movement pitch p2 at the time point t2 after the scan cycle Δt at the time point t1. At this time point, the region R2 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R3 is irradiated with the line light L1, and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 6C, the substrate W further moves in the Y direction by the movement pitch p2 at the time point t3 after the scan cycle Δt at the time point t2. At this point, the region R4 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R5 is irradiated with the line light L1, and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 6D, the substrate W further moves in the Y direction by the movement pitch p2 at time t4 after the scan cycle Δt at time t3. At this point, the region R6 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R7 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 6E, at the time point t5 after the scan cycle Δt at the time point t4, the substrate W further moves in the Y direction by the movement pitch p2. At this point, the region R8 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R9 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241. By repeating the same operation, the entire surface of the substrate W is irradiated with the line lights L1 and L2, and the reflected line lights L1 and L2 are received by the line sensors 241 and 242, respectively.

In this case, since the pixel pitch p1 is equal to the movement pitch p2, the region R1 irradiated with the line light L1 at the time point t1 and the region R2 irradiated with the line light L2 at the time point t2 are the same. Similarly, the regions R3 and R4 are the same, the regions R5 and R6 are the same, and the regions R7 and R8 are the same.

That is, the area irradiated with the line light L1 at a predetermined time point corresponds to the area irradiated with the line light L2 at the time point after the scan cycle Δt at that time point. Therefore, the image data generation unit 4 determines the pixel values A _k,1 , A _k,2 acquired by the pixel data acquisition unit 2 at a predetermined time point and the pixel data acquisition unit 3 at a time point after the scan cycle Δt at that time point. Image data is generated based on the pixel values B _k,1 , B _k,2 acquired by.

(B) Second Case FIG. 7 is a diagram showing a process of moving the substrate W in the second case. In the second case, the movement pitch p2 is larger than the pixel pitch p1. As shown in FIG. 7A, at time t1, the region R11 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 7B, the substrate W moves in the Y direction by the movement pitch p2 at time t2 after the scan cycle Δt at time t1. At this time point, the region R12 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R13 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 7C, the substrate W further moves in the Y direction by the movement pitch p2 at the time point t3 after the scan cycle Δt at the time point t2. At this point, the region R14 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R15 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 7D, the substrate W further moves in the Y direction by the movement pitch p2 at the time point t4 after the scan cycle Δt at the time point t3. At this point, the region R16 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R17 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 7E, at time t5 after the scan cycle Δt at time t4, the substrate W further moves in the Y direction by the movement pitch p2. At this point, the region R18 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R19 is irradiated with the line light L1, and the reflected line light L1 is received by the line sensor 241. By repeating the same operation, the entire surface of the substrate W is irradiated with the line lights L1 and L2, and the reflected line lights L1 and L2 are received by the line sensors 241 and 242, respectively.

In this case, the region R12 irradiated with the line light L2 at the time point t2 is not the same as the region R11 irradiated with the line light L1 at the time point t1, but is closest to the region R11 than the other regions. Similarly, region R14 is closest to region R13, region R16 is closest to region R15, and region R18 is closest to region R17.

That is, the area irradiated with the line light L1 at a predetermined time point corresponds to the area irradiated with the line light L2 at the time point after the scan cycle Δt at that time point. Therefore, the image data generation unit 4 determines the pixel values A _k,1 , A _k,2 acquired by the pixel data acquisition unit 2 at a predetermined time point and the pixel data acquisition unit 3 at a time point after the scan cycle Δt at that time point. Image data is generated based on the pixel values B _k,1 , B _k,2 acquired by.

(C) Third Case FIG. 8 is a diagram showing a process of moving the substrate W in the third case. In the third case, the movement pitch p2 is smaller than the pixel pitch p1 and the pixel pitch p1 is M times the movement pitch p2 (M is an integer of 2 or more). In the example of FIG. 8, the magnification M is 2. As shown in FIG. 8A, at time t1, the region R21 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 8B, the substrate W moves in the Y direction by the movement pitch p2 at time t2 after the scan cycle Δt at time t1. At this point, the region R22 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R23 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 8C, the substrate W further moves in the Y direction by the movement pitch p2 at the time point t3 after the scan cycle Δt at the time point t2. At this point, the region R24 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R25 is irradiated with the line light L1, and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 8D, the substrate W further moves in the Y direction by the movement pitch p2 at time t4 after the scan cycle Δt at time t3. At this point, the region R26 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R27 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 8E, the substrate W further moves in the Y direction by the movement pitch p2 at time t5 after the scan cycle Δt at time t4. At this point, the region R28 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R29 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241. By repeating the same operation, the entire surface of the substrate W is irradiated with the line lights L1 and L2, and the reflected line lights L1 and L2 are received by the line sensors 241 and 242, respectively.

In this case, since the pixel pitch p1 is twice the movement pitch p2, the region R21 irradiated with the line light L1 at the time t1 and the region R24 irradiated with the line light L2 at the time t3 are the same. .. Similarly, the region R23 and the region R26 are the same, and the region R25 and the region R28 are the same.

That is, the area irradiated with the line light L1 at a predetermined time point corresponds to the area irradiated with the line light L2 at a time point after the M scan cycle Δt (M×Δt) at that time point. Therefore, the image data generation unit 4 determines the pixel values A _k,1 , A _k,2 acquired by the pixel data acquisition unit 2 at a predetermined time point and the pixel data acquisition unit at a time point after the M scan cycle Δt at that time point. The image data is generated based on the pixel values B _k,1 , B _k,2 acquired in 3.

(D) Fourth Case FIG. 9 is a diagram showing a process of moving the substrate W in the fourth case. In the fourth case, the movement pitch p2 is smaller than the pixel pitch p1 and the pixel pitch p1 is M times the movement pitch p2 (M is a non-integer larger than 1). In the example of FIG. 9, the magnification M is 1.2. As shown in FIG. 9A, at time t1, the region R31 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 9B, the substrate W moves in the Y direction by the movement pitch p2 at a time point t2 after the scan cycle Δt at the time point t1. At this point in time, the region R32 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R33 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 9C, the substrate W further moves in the Y direction by the movement pitch p2 at the time point t3 after the scan cycle Δt at the time point t2. At this point, the region R34 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R35 is irradiated with the line light L1, and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 9D, the substrate W further moves in the Y direction by the movement pitch p2 at time t4 after the scan cycle Δt at time t3. At this point, the region R36 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R37 is irradiated with the line light L1 and the reflected line light L1 is received by the line sensor 241.

As shown in FIG. 9E, at time t5 after the scan cycle Δt at time t4, the substrate W further moves in the Y direction by the movement pitch p2. At this point, the region R38 is irradiated with the line light L2, and the reflected line light L2 is received by the line sensor 242. At the same time, the region R39 is irradiated with the line light L1, and the reflected line light L1 is received by the line sensor 241. By repeating the same operation, the entire surface of the substrate W is irradiated with the line lights L1 and L2, and the reflected line lights L1 and L2 are received by the line sensors 241 and 242, respectively.

In this case, since the pixel pitch p1 is 1.2 times (about 1 time) the movement pitch p2, the region R32 irradiated with the line light L2 at the time point t2 is irradiated with the line light L1 at the time point t1. Although not the same as the region R11, it is closest to the region R11 than other regions. Similarly, region R34 is closest to region R33, region R36 is closest to region R35, and region R38 is closest to region R37.

That is, when the value obtained by rounding off the magnification M is M′, the area irradiated with the line light L1 at a predetermined time point and the line light L2 at the time point after the M′ scan cycle Δt (M′×Δt). Corresponds to the area irradiated with. Therefore, the image data generation unit 4 acquires the pixel values A _k,1 , A _k,2 acquired by the pixel data acquisition unit 2 at a predetermined time point and the pixel data acquisition time point after the M′ scan cycle Δt at that time point. Image data is generated based on the pixel values B _k,1 , B _k,2 acquired by the unit 3.

(5) Inspection Processing FIG. 10 is a flowchart showing the inspection processing performed by the control unit 280 of FIG. The inspection process will be described below with reference to FIGS. First, the sample image data acquisition unit 5 acquires sample image data (step S1). The sample image data acquisition unit 5 may store the sample image data in advance, or may acquire the sample image data from a storage device (not shown) or the like. Next, the device control unit 1 controls the operation of each unit of the substrate inspection device 200 (step S2).

Subsequently, the pixel data acquisition unit 2 acquires the pixel values A _{1,1 to An,2} from the line sensor 241 (step S3). In addition, the pixel data acquisition unit 3 acquires the pixel values B _{1,1 to} B _n,2 from the line sensor 242 (step S4). Image data generating unit 4, step S3, pixel values acquired in _{S4 A 1,1 ~A n, 2,} B 1,1 ~B n, 2 of the corresponding pixel value _{A k,} 1, _{A k , 2} and the pixel values B _k,1 , B _k,2 are generated (step S5).

After that, the inspection unit 6 compares the sample image data acquired in step S1 with the image data generated in step S5 (step S6). Here, the inspection unit 6 determines whether the difference between the values of all the pixels between the sample image data and the image data is less than or equal to a predetermined threshold value (step S7).

When the deviations of the values of all the pixels are equal to or less than the threshold value, the inspection unit 6 determines that the substrate W shown by the image is normal (step S8), and proceeds to step S10. On the other hand, when the deviation of the values of any of the pixels exceeds the threshold value, the inspection unit 6 determines that the substrate W shown by the image is abnormal (step S9), and proceeds to step S10.

In step S10, the inspection unit 6 determines whether all the substrates W have been inspected (step S10). When all the substrates W have not been inspected, the inspection unit 6 returns to step S2. Steps S2 to S10 are repeated until all the substrates W have been inspected. When all the substrates W have been inspected, the inspection unit 6 ends the inspection process.

(6) Substrate Processing Apparatus FIG. 11 is a schematic block diagram showing the overall configuration of a substrate processing apparatus including the substrate inspection apparatus 200 of FIGS. 1 and 2. As shown in FIG. 11, the substrate processing apparatus 100 is provided adjacent to the exposure apparatus 300, includes a substrate inspection apparatus 200, and includes a control device 110, a transfer device 120, a film forming unit 130, a developing unit 140, and a heat treatment unit. It comprises 150.

The control device 110 includes, for example, a CPU and a memory, or a microcomputer, and controls the operations of the transport device 120, the film forming unit 130, the developing unit 140, and the heat treatment unit 150. Further, the control device 110 gives a command for inspecting the substrate W to the control unit 280 of the substrate inspection device 200 in FIG.

The transport device 120 transports the substrate W between the film forming unit 130, the developing unit 140, the heat treatment unit 150, the substrate inspection apparatus 200, and the exposure apparatus 300. The film forming unit 130 forms a resist film on the surface of the substrate W by applying a resist solution to the surface of the substrate W (film forming process). The substrate W after the film forming process is subjected to the exposure process in the exposure apparatus 300. The developing unit 140 performs a developing process on the substrate W by supplying a developing solution to the substrate W after the exposure process by the exposure device 300. The thermal processing section 150 performs thermal processing on the substrate W before and after the film forming processing by the film forming section 130, the developing processing by the developing section 140, and the exposure processing by the exposure apparatus 300.

The substrate inspection apparatus 200 performs an inspection process on the substrate W after the resist film is formed by the film forming unit 130. For example, the substrate inspection apparatus 200 inspects the substrate W after the film forming process by the film forming unit 130 and the developing process by the developing unit 140. Alternatively, the substrate inspection apparatus 200 may inspect the substrate W after the film forming processing by the film forming unit 130 and before the exposure processing by the exposure apparatus 300. Further, the substrate inspection apparatus 200 may inspect the substrate W after the film forming process by the film forming unit 130 and after the exposure process by the exposure device 300 and before the developing process by the developing unit 140.

The film forming unit 130 may be provided with a processing unit that forms an antireflection film on the substrate W. In this case, the heat treatment section 150 may perform an adhesion strengthening process for improving the adhesion between the substrate W and the antireflection film. Further, the film forming unit 130 may be provided with a processing unit that forms a resist cover film for protecting the resist film formed on the substrate W.

When the antireflection film and the resist cover film are formed on the surface of the substrate W, the substrate W may be inspected by the substrate inspection device 200 after forming each film. In the substrate processing apparatus 100 according to the present embodiment, the substrate W on which a film such as a resist film, an antireflection film or a resist cover film is formed is inspected by the substrate inspection device 200 with high reliability.

In this example, the substrate inspection apparatus 200 is provided in the substrate processing apparatus 100 that processes the substrate W before and after the exposure processing, but the substrate inspection apparatus 200 may be provided in another substrate processing apparatus. For example, the substrate inspection apparatus 200 that performs the cleaning process on the substrate W may be provided with the substrate inspection apparatus 200, or the substrate inspection apparatus 200 that performs the etching process on the substrate W may be provided with the substrate inspection apparatus 200. Alternatively, the board inspection apparatus 200 may be used alone.

(7) Effect In the substrate inspection apparatus 200 according to the present embodiment, the two light beams L1 and L2 that are parallel to the X direction and extend in parallel with each other are emitted by the light projecting unit 220. The substrate holding device 250 is moved by the moving part 260 in the Y direction so that the two line lights L1 and L2 emitted by the light projecting part 220 are applied to the surface of the substrate W to be inspected held by the substrate holding device 250. Be moved to. The two line lights L1 and L2 applied to the substrate W are received by the two line sensors 241 and 242, respectively.

Here, each of the line sensors 241 and 242 has a plurality of pixels arranged in the X direction. Further, the line sensor 241 is arranged so as to be displaced in the X direction with respect to the line sensor 242 by ½ of the length of one pixel in the X direction. One virtual line sensor LS is introduced by the two line sensors 241 and 242.

Each pixel of each line sensor 241 and 242 is virtually divided into a plurality of partial regions arranged in the X direction, and each pixel of each line sensor 241 and 242 outputs a light reception signal corresponding to the amount of light received. In the direction view orthogonal to the X direction, each pixel value of the virtual line sensor LS is calculated based on the light reception signals of two pixels each including two partial regions where the two line sensors 241 and 242 overlap. Thereby, image data showing an image of the substrate W is generated.

In this case, each pixel of the virtual line sensor LS is constituted by two overlapping partial areas of the two line sensors 241 and 242 when viewed in the direction orthogonal to the X direction. In the X direction, the length of each pixel of the virtual line sensor LS is smaller than the length of each pixel of each line sensor 241 and 242. Therefore, the resolution of the image represented by the image data generated by the board inspection apparatus 200 is higher than the resolution of the image represented by the image data generated based on the light reception signal from the line sensor 241 or the line sensor 242. Therefore, the defect of the substrate W can be detected with high accuracy based on the image of the substrate W having high resolution.

Further, since the shift amount of the line sensor 242 with respect to the line sensor 241 in the X direction is smaller than the length of one pixel in the X direction, image data can be generated using all the pixels of each line sensor 241 and 242. it can. Thereby, image data showing an image of the substrate W having a higher resolution can be generated.

(8) Other Embodiments (a) In the above embodiment, the appearance inspection of the substrate W is performed as the inspection of the substrate W, but the present invention is not limited to this. Other inspections may be performed as the inspection of the substrate W. For example, based on the image data, it may be tested whether the distance (edge width) between the outer peripheral portion of the substrate W and the outer peripheral portion of the film formed on the substrate W is appropriate. In this case, the edge width can be properly detected by using the image data. As a result, the accuracy of determining whether or not the edge width is appropriate can be improved.

Further, in this configuration, since the sample image data is not used during the inspection process, the control unit 280 does not include the sample image data acquisition unit 5. Furthermore, steps S1 and S7 during the inspection process are not executed, and it is determined in step S7 whether the edge width is appropriate. When the edge width is proper, the substrate W is determined to be normal, and when the edge width is not proper, the substrate W is determined to be abnormal.

(B) In the above embodiment, the control unit 280 includes the inspection unit 6, but the present invention is not limited to this. When the substrate W is inspected by an external device of the substrate inspection apparatus 200 based on the image data generated by the substrate inspection apparatus 200, the control unit 280 does not have to include the inspection unit 6.

(C) In the above-described embodiment, as each pixel value of the virtual line sensor LS, an average of pixel values of two overlapping partial areas of the line sensors 241 and 242 in the direction view orthogonal to the X direction is calculated. The present invention is not limited to this. As each pixel value of the virtual line sensor LS, the sum of the pixel values of the above two partial areas may be calculated. Alternatively, when the line light L1 and the line light L2 have different intensities, the pixel values of the above-mentioned two partial regions are set as the pixel values of the virtual line sensor LS according to the intensities of the line lights L1 and L2. A weighted sum may be calculated.

(D) In the above-described embodiment, the line sensor 242 is arranged in a state of being displaced from the line sensor 241 by ½ of the length of each pixel in the X direction in the X direction. Not limited to. The line sensor 242 may be arranged in a state shifted from the line sensor 241 in the X direction by a non-integer multiple of the length of each pixel in the X direction.

For example, the line sensor 242 may be arranged in a state of being displaced from the line sensor 241 in the X direction by 1.5 times the length of each pixel in the X direction. In this case, the pixel a ₁ at the end of the line sensor 241 does not have to be used for generating image data. Similarly, the pixel b _n at the end of the line sensor 242 may not be used for generating image data.

(E) In the above embodiment, the substrate W is irradiated with the two line lights L1 and L2, and the imaging unit 240 includes two line sensors 241 and 242 corresponding to the line lights L1 and L2, respectively. The invention is not limited to this. The substrate W may be irradiated with N line lights (N is an integer of 2 or more), and the imaging unit 240 may include N line sensors corresponding to the N line lights. In this case, the N line sensors are preferably arranged so as to be displaced from each other in the X direction by 1/N of the length of one pixel in the X direction.

FIG. 12 is a diagram showing another example of the imaging unit 240. In the example of FIG. 12, the substrate W is irradiated with three line lights. Therefore, the imaging unit 240 includes three line sensors 241 to 243 respectively corresponding to the three line lights. The line sensor 243 has the same configuration as the line sensors 241 and 242. Here, as in the example of FIGS. 3A and 3B, the line sensors 241 to 243 are arranged so as to be offset from each other in the X direction by one-third of the length of one pixel in the X direction. It is preferable.

Specifically, in the imaging unit 240 of FIG. 3A, the line sensor 242 is arranged in a state of being displaced from the line sensor 241 in the X direction by a third of the length of each pixel in the X direction. To be done. The line sensor 243 is shifted from the line sensor 242 in the X direction by one-third of the length of each pixel in the X direction, that is, three minutes of the length of each pixel in the X direction with respect to the line sensor 241. No. 2 is displaced in the X direction.

The imaging unit 240 of FIG. 3B has the same configuration as the imaging unit 240 of FIG. 3A, except that the line sensors 241 to 243 are arranged in a different order in the direction orthogonal to the X direction. In the example of FIGS. 3A and 3B, the virtual line sensor LS is obtained by averaging or summing the pixel values of the three partial regions where the line sensors 241 to 243 overlap each other in the direction view orthogonal to the X direction. Each pixel value of can be calculated.

On the other hand, the arrangement of the line sensors 241 to 243 is not limited to the examples of FIGS. 3(a) and 3(b). In the imaging unit 240 of FIG. 3C, the line sensors 241 and 242 are arranged without being displaced from each other in the X direction. The line sensor 243 is arranged in a state of being displaced from the line sensor 241 or the line sensor 242 by ½ of the length of each pixel in the X direction in the X direction.

In the imaging unit 240 of FIG. 3D, the line sensor 242 is arranged in the state of being displaced in the X direction by the length of each pixel in the X direction with respect to the line sensor 241. The line sensor 243 is arranged in a state of being displaced from the line sensor 241 and the line sensor 242 in the X direction by ½ of the length of each pixel in the X direction.

In the example of FIGS. 3C and 3D, the virtual line sensor LS is obtained by performing the weighted sum of the pixel values of the three partial areas where the line sensors 241 to 243 overlap each other in the direction view orthogonal to the X direction. Each pixel value of can be calculated. In this case, the weight of the pixel value corresponding to the line sensor 241 is 0.25, the weight of the pixel value corresponding to the line sensor 242 is 0.25, and the pixel corresponding to the line sensor 243 is, for example. The value weight is 0.5, for example.

(9) Correspondence between each component of the claims and each element of the embodiment Hereinafter, an example of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is as follows. It is not limited to the example. As each constituent element of the claims, various other elements having the configurations or functions described in the claims may be used.

In the above embodiment, the substrate W is an example of the substrate, the substrate holding device 250 is an example of the holding unit, and the X direction and the Y direction are examples of the first and second directions, respectively. The line lights L1 and L2 are examples of line lights, the light projecting unit 220 is an example of a light projecting unit, the moving unit 260 is an example of a moving unit, and the line sensors 241 to 243 are examples of line sensors.

The image data generation unit 4 is an example of the image data generation unit, the pixels a _{1 to} a _n , b _{1 to} b _n are examples of the light receiving region, and the partial regions a _{1,1 to} a _n,2 ,b _{1, 1 to} b _n,2 are examples of partial regions, and pixels x _{1 to} x _2n+1 are examples of pixels. The substrate inspection apparatus 200 is an example of the substrate inspection apparatus, the inspection unit 6 is an example of the inspection unit, the film forming unit 130 is an example of the film forming unit, and the substrate processing apparatus 100 is an example of the substrate processing apparatus.

DESCRIPTION OF SYMBOLS 1... Device control part, 2... Pixel data acquisition part, 3... Pixel data acquisition part, 4... Image data generation part, 5... Sample image data acquisition part, 6... Inspection part, 100... Substrate processing device, 110... Control device , 120... Conveying device, 130... Film forming part, 140... Developing part, 150... Thermal processing part, 200... Substrate inspection device, 210... Housing part, 211... Opening part, 220... Light projecting part, 230... Reflecting part, 240... Imaging unit, 241-243, 250... Substrate holding device, 251... Driving device, 252... Rotation holding unit, 253... Rotation shaft, 260... Moving unit, 261... Guide member, 262... Moving holding unit, 270... Direction Detection unit, 280... Control unit, 300... Exposure device, a _{1 to} a _n , b _{1 to} b _n , x _{1 to} x _2n+1 ... Pixel, a ₁ , _{1 to} a _{n, 2} , b ₁ , _{1 to} b _{n , 2} ... Partial region, p0... Pitch, p1... Pixel pitch, p2... Moving pitch, L1, L2... Line light, LS... Virtual line sensor, R1 to R9, R11 to R19, R21 to R29, R31 to R39... Region , W... Substrate

Claims (14)

A holding unit that holds the board to be inspected,
A light projecting unit that emits N (N is an integer of 2 or more) line lights that are parallel to the first direction and extend parallel to each other;
The light projecting unit and the holding unit are crossed in the first direction so that the N line lights emitted by the light projecting unit are irradiated onto the surface of the substrate held by the holding unit. A moving unit that relatively moves in the second direction,
N line sensors that respectively receive the N line lights emitted to the substrate and output a light reception signal corresponding to the amount of received light;
An image data generation unit that generates image data indicating an image of the substrate based on the light reception signals output from the N line sensors,
Each line sensor has a plurality of light receiving regions arranged in the first direction, and outputs a light receiving signal corresponding to the amount of light received from each light receiving region,
At least one line sensor of the N line sensors is arranged so as to be displaced in the first direction with respect to other line sensors by a non-integer multiple of the length of one light receiving region in the first direction. Was
Each light receiving area of each line sensor is virtually divided into a plurality of partial areas arranged in the first direction, and the N line sensors overlap each other in a third direction view orthogonal to the first direction. Each pixel is composed of N partial regions,
The substrate inspection apparatus, wherein the image data generation unit calculates each pixel value based on the light receiving signals of N light receiving areas including the N partial areas. The substrate inspection apparatus according to claim 1, wherein a shift amount of the at least one line sensor with respect to the other line sensor in the first direction is smaller than a length of one light receiving region in the first direction. 3. The substrate inspection according to claim 1, wherein the N line sensors are arranged so as to be displaced from each other in the first direction by 1/N of a length of one light receiving region in the first direction. apparatus. The image data generation unit is based on received light signals from the N line sensors based on the N line lights when the same line region or a line region within a certain range is irradiated on the substrate at different times. The board inspection apparatus according to any one of claims 1 to 3, wherein the board inspection apparatus generates image data. The board inspection device according to claim 1, wherein the image data generation unit calculates each pixel value by averaging values of light reception signals of the N light receiving regions. The substrate inspection apparatus according to claim 1, further comprising an inspection unit that inspects the substrate based on the image data generated by the image data generation unit. A film forming unit for forming a processing film on the substrate,
A substrate processing apparatus comprising: the substrate inspection apparatus according to claim 1, which generates image data indicating an image of the substrate after the processing film is formed by the film forming unit. A step of emitting N (N is an integer of 2 or more) line lights parallel to the first direction and parallel to each other by the light projecting unit;
The light projecting unit and the holding unit are moved by the moving unit so that the N line lights emitted by the light projecting unit are applied to the surface of the inspection target substrate held by the holding unit. Moving relative to a second direction intersecting the direction of
Receiving the N line lights irradiated on the substrate by the N line sensors and outputting a light reception signal corresponding to the amount of received light;
Generating image data showing an image of the substrate based on the received light signals output from the N line sensors,
Each line sensor has a plurality of light receiving regions arranged in the first direction, and outputs a light receiving signal corresponding to the amount of light received from each light receiving region,
At least one line sensor of the N line sensors is arranged so as to be displaced in the first direction with respect to other line sensors by a non-integer multiple of the length of one light receiving region in the first direction. Was
Each light receiving area of each line sensor is virtually divided into a plurality of partial areas arranged in the first direction, and the N line sensors overlap each other in a third direction view orthogonal to the first direction. Each pixel is composed of N partial regions,
The substrate inspecting method, wherein the step of generating the image data includes calculating each pixel value based on light reception signals of N light receiving regions including the N partial regions. 9. The substrate inspection method according to claim 8, wherein a shift amount of the at least one line sensor with respect to the other line sensor in the first direction is smaller than a length of one light receiving region in the first direction. The board inspection according to claim 8 or 9, wherein the N line sensors are arranged so as to be displaced from each other in the first direction by 1/N of a length of one light receiving region in the first direction. Method. The step of generating the image data includes receiving light signals from the N line sensors based on the N line lights when the same line region or a line region within a certain range is irradiated on the substrate at different times. The board inspection method according to claim 8, further comprising: generating image data based on the above. The substrate inspection according to any one of claims 8 to 11, wherein the step of generating the image data includes calculating each pixel value by averaging values of light reception signals of the N light receiving regions. Method. The board inspection method according to claim 8, further comprising a step of inspecting the board based on the generated image data. Forming a treatment film on the substrate by the film forming unit,
A substrate processing method, comprising: generating image data showing an image of the substrate after the processing film is formed by the film forming unit by the substrate inspection method according to any one of claims 8 to 13.

Images