JP2019045208A - Substrate inspection device and substrate processing device equipped with the same - Google Patents

Abstract

To provide a substrate inspection device with which it is possible to determine the presence of a defect in the surface state of a substrate with high accuracy, and a substrate processing device equipped with the same.SOLUTION: A substrate inspection device 200 comprises two imaging units 240A, 240B. A first region including one edge on one surface of a substrate W held by a rotation holding unit 250 is imaged by one imaging unit 240A, and first image data representing an image of the first region is generated. A second region including the other edge on one surface of the substrate W is imaged by the other imaging unit 240B, and second image data representing an image of the second region is generated. The presence of a defect in the surface state of the substrate W is determined on the basis of the plurality of generated image data. The substrate inspection device 200 may include, in place of the imaging units 240A, 240B, an imaging unit for imaging a third region of the substrate W ranging from one edge to the other edge and having an imaging plane having a length greater than or equal to the diameter of the substrate W.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate inspection apparatus that inspects a substrate and a substrate processing apparatus including the same.

  In the substrate processing apparatus, a substrate that is horizontally supported by a spin chuck is rotated. In this state, a coating solution such as a resist solution is discharged to the center of the upper surface of the substrate, whereby a coating film is formed on the entire surface of the substrate. The coating film is exposed and then developed to form a predetermined pattern on the coating film. Here, if the surface of the substrate is in a non-uniform state, the post-exposure state varies for each portion of the substrate, resulting in poor processing of the substrate. Therefore, the surface condition of the substrate may be inspected.

  Patent Document 1 describes an inspection apparatus that performs a macro inspection of a sample such as a semiconductor wafer. In the inspection apparatus, illumination light extending linearly in the X direction parallel to the surface of the sample is irradiated toward the sample placed on the stage, and light reflected from a linear region on the surface of the sample is irradiated. An image is formed on the light receiving surface of the detector (line sensor camera) by the imaging lens. By moving the stage in the Y direction perpendicular to the X direction and parallel to the surface of the sample, light reflected by a plurality of linear regions on the surface of the sample is imaged by the detector. Thereby, an image of the entire surface of the sample is generated. The quality of the sample is determined based on the luminance value of the generated image.

JP, 2015-127653, A

  In the inspection of the surface condition of the substrate, it is preferable that defects are detected with high accuracy. Therefore, it is desired to realize an inspection apparatus that can determine the presence or absence of defects in the surface state of the substrate with higher accuracy than before.

  The objective of this invention is providing the substrate inspection apparatus which can determine the presence or absence of the defect of the surface state of a board | substrate with high precision, and a substrate processing apparatus provided with the same.

  (1) A substrate inspection apparatus according to a first invention images a first region including a holding portion that holds a substrate and one end portion in a first diameter direction on one surface of the substrate held by the holding portion. A second region including a first imaging unit that generates first image data representing an image of the first region, and the other end portion in the first diameter direction on one surface of the substrate held by the holding unit A second imaging unit that generates second image data representing the image of the second region, and a determination for determining the presence or absence of a defect in the surface state of the substrate based on the first and second image data A part.

  In the substrate inspection apparatus, one end and the other end on one surface of the substrate are imaged by the first and second imaging units in the first diameter direction, respectively. In this case, compared to the case where one end and the other end of the substrate are simultaneously imaged using a single imaging unit, a decrease in accuracy of the portion of the image data corresponding to the one end and the other end of the substrate is suppressed. . Therefore, the presence or absence of a surface state defect including both end portions on one surface of the substrate can be determined with high accuracy.

  (2) The first and second imaging units are respectively arranged on one side and the other side of the first virtual plane extending in the second diameter direction orthogonal to the first diameter direction and perpendicular to one surface of the substrate. May be.

  In this case, it is possible to reduce the incident angle of light incident on the first imaging unit from one end of the substrate and the incident angle of light incident on the second imaging unit from the other end of the substrate. Accordingly, it is possible to suppress a decrease in accuracy of the first and second image data portions corresponding to the one end portion and the other end portion of the substrate.

  (3) The first and second imaging units may be arranged symmetrically with respect to the first virtual plane.

  In this case, the incident angle of light incident on the first imaging unit from one end of the substrate is equal to the incident angle of light incident on the second imaging unit from the other end of the substrate. Thereby, the accuracy of the first and second image data portions corresponding to the one end portion and the other end portion of the substrate becomes equal. As a result, the accuracy of the first image data corresponding to the first region of the substrate can be made equal to the accuracy of the second image data corresponding to the second region.

  (4) A second virtual plane that is parallel to the first diametrical direction and perpendicular to one surface of the substrate is defined, and the first and second imaging units are arranged along the second virtual plane. Each of the imaging plane and the second imaging plane, a midpoint between the first imaging plane and the second imaging plane is defined on the second virtual plane, and the first point from the one end of the substrate The first imaging unit is arranged such that the incident angle of light incident on the imaging surface is smaller than the incident angle of light traveling from one end to the midpoint of the second virtual surface, The second imaging unit may be arranged such that the incident angle of the light incident on the imaging surface of the second imaging unit is smaller than the incident angle of the light traveling from the other end to the midpoint of the second virtual surface.

  In this case, compared with the case where one imaging unit is arranged so that the imaging surface is located at the midpoint, and one end and the other end of the substrate are simultaneously imaged by the imaging unit, the one end and the other end of the substrate A decrease in the accuracy of the image data portion corresponding to is suppressed.

  (5) The first region may include a region extending from one end of the substrate to the center of the substrate, and the second region may include a region from the other end of the substrate to the center of the substrate.

  In this case, first and second image data including a region from one end portion to the other end portion in the first diameter direction of the substrate is generated by the first and second image data.

  (6) The first imaging unit has a linear first imaging region extending in parallel to the first diameter direction, and the second imaging unit is a linear second extending in parallel to the first diameter direction. In the substrate inspection apparatus, the first imaging region passes through the first region of the substrate held by the holding unit, and the second imaging region is held by the holding unit. You may further provide the moving part which moves a 1st and 2nd imaging part and a holding | maintenance part relatively so that it may pass through this area | region.

  In this case, first and second image data representing the entire surface of the substrate is generated by relative movement between the first and second imaging units and the holding unit. Therefore, a decrease in accuracy of the first and second image data is suppressed, and an increase in size of the first and second imaging units is suppressed.

  (7) A substrate inspection apparatus according to a second aspect of the present invention is a holding unit that holds a substrate, and a third part extending from one end to the other end in the first diameter direction on one surface of the substrate held by the holding unit. An imaging unit that captures an area and generates image data representing an image of the third area, and a determination unit that determines the presence or absence of a defect in the surface state of the substrate based on the image data generated by the imaging unit, The imaging unit has an arrangement of a plurality of pixels constituting an imaging surface having a length equal to or greater than the diameter of the substrate, and is arranged so that light perpendicular to the imaging surface is incident on the plurality of pixels from the third region. The

  In the substrate inspection apparatus, light perpendicular to the imaging surface is incident on a plurality of pixels from one end and the other end on one surface of the substrate in the first diameter direction, whereby one end and the other end of the substrate Is imaged. In this case, the incident angle of light from one end and the other end of the substrate toward the plurality of pixels is zero. As a result, the accuracy of the portion of the image data corresponding to the one end and the other end of the substrate is higher than that in the case where one end and the other end of the substrate are simultaneously imaged using a single imaging unit including a condenser lens. Reduction is suppressed. Therefore, the presence or absence of a surface state defect including both end portions on one surface of the substrate can be determined with high accuracy.

  (8) The imaging unit includes a linear third imaging region that extends in parallel with the first diameter direction and has a length equal to or greater than the diameter of the substrate. There may be further provided a moving unit that relatively moves the imaging unit and the holding unit so as to pass through the third region of the substrate held by.

  In this case, image data representing an entire image of one surface of the substrate is generated by relative movement between the imaging unit and the holding unit. Therefore, a decrease in the accuracy of the image data is suppressed, and an increase in the size of the imaging unit is suppressed.

  (9) The holding unit may be configured to be rotatable while holding the substrate.

  In this case, by rotating the substrate held by the holding unit, it is possible to determine the presence or absence of a surface state defect on one surface of the substrate while changing the orientation of the substrate. Thereby, it is possible to determine the presence or absence of defects in the surface state of the substrate with higher accuracy.

  (10) A substrate processing apparatus according to a third aspect of the present invention is a coating processing unit that forms a film on one surface of a substrate by supplying a processing liquid to one surface of the substrate, and a surface of the substrate on which the film is formed by the coating processing unit The above-described substrate inspection apparatus that inspects the state, and a transport device that transports the substrate between the coating processing unit and the substrate inspection apparatus.

  In the substrate processing apparatus, the surface state on one surface of the substrate on which the film is formed is inspected by the substrate inspection apparatus. Thereby, the presence or absence of a surface state defect including both end portions on one surface of the substrate on which the film is formed is detected with high accuracy. Therefore, the quality of the coating process for forming a film on one surface of the substrate can be determined with high accuracy. As a result, the occurrence of substrate processing defects is reduced.

  According to the present invention, it is possible to determine the presence or absence of defects in the surface state of a substrate with high accuracy.

It is an external appearance perspective view of the board | substrate inspection apparatus which concerns on 1st Embodiment. It is a typical side view which shows the structure inside the board | substrate inspection apparatus of FIG. FIG. 2 is a schematic plan view showing an internal configuration of the substrate inspection apparatus of FIG. 1. FIG. 2 is a schematic plan view illustrating an imaging region and an arrangement of an imaging unit in FIG. 1. FIG. 2 is a schematic plan view illustrating a reference example in which an entire surface of a substrate is imaged by one color camera in the substrate inspection apparatus of FIG. 1. It is a block diagram which shows the control system of the board | substrate inspection apparatus which concerns on 1st Embodiment. It is a top view for demonstrating an example of operation | movement of the board | substrate inspection apparatus at the time of the test | inspection of a board | substrate. It is an external appearance perspective view of the board | substrate inspection apparatus which concerns on 2nd Embodiment. It is a typical side view which shows the structure inside the board | substrate inspection apparatus of FIG. It is the typical rear view which looked at the imaging part provided in the board | substrate inspection apparatus of FIG. 8 from back. It is a block diagram which shows the control system of the board | substrate inspection apparatus which concerns on 2nd Embodiment. It is a typical block diagram which shows the whole structure of the substrate processing apparatus which concerns on 3rd Embodiment. It is a typical top view which shows the structure inside the board | substrate inspection apparatus which concerns on other embodiment.

  A substrate inspection apparatus and a substrate processing apparatus including the same according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate means a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, or the like. A film such as a resist film, an antireflection film, or a resist cover film is formed on one surface of the substrate to be inspected by the substrate inspection apparatus.

[1] First Embodiment (1) Configuration of Substrate Inspection Apparatus FIG. 1 is an external perspective view of a substrate inspection apparatus according to the first embodiment, and FIG. 2 is an internal view of the substrate inspection apparatus 200 of FIG. FIG. 3 is a schematic plan view showing the internal configuration of the substrate inspection apparatus 200 of FIG. As shown in FIG. 1, the substrate inspection apparatus 200 has a housing part 210. The casing unit 210 includes a rectangular bottom surface 211 and four rectangular side surfaces 212 to 215. The side surface portions 212 and 214 are located at both end portions in the longitudinal direction of the bottom surface portion 211, and the side surface portions 213 and 215 are located at both end portions in the width direction of the bottom surface portion 211, respectively. The casing unit 210 has a substantially rectangular upper opening. The housing part 210 may further include an upper surface part that closes the upper opening.

  Hereinafter, the width direction of the bottom surface portion 211 is referred to as the left-right direction, and the longitudinal direction of the bottom surface portion 211 is referred to as the front-rear direction. Further, in the left-right direction, a direction from the side surface portion 215 toward the side surface portion 213 is defined as rightward, and the opposite direction is defined as leftward. Furthermore, in the front-rear direction, the direction from the side surface portion 214 toward the side surface portion 212 is defined as the front, and the opposite direction is defined as the rear. A slit-like opening 216 for transporting the substrate W between the outside and the inside of the housing part 210 is formed in a part from the side part 212 to the front part of the side part 213.

  In the housing unit 210, a light projecting unit 220, a reflecting unit 230, two imaging units 240A and 240B, a substrate holding device 250, a moving unit 260, and a notch detecting unit 270 are housed.

  The light projecting unit 220 includes, for example, one or more light sources, and is attached to the inner surfaces of the side surface portions 213 and 215 of the housing unit 210 so as to extend in the left-right direction. As will be described later, a substrate W to be inspected is carried into the housing unit 210 from the opening 216, and the carried substrate W passes below the light projecting unit 220. The light projecting unit 220 emits light having a cross-sectional line extending in the left-right direction longer than the diameter of the substrate W obliquely downward and rearward.

  The reflection unit 230 includes, for example, a mirror, and is attached to the inner surfaces of the side surface portions 213 and 215 of the housing unit 210 so as to extend rearward and laterally from the light projecting unit 220. As shown in FIG. 2, the light emitted obliquely downward and rearward by the light projecting unit 220 is reflected obliquely upward and backward by one surface (upper surface) of the substrate W. The reflector 230 reflects the light reflected by the substrate W backward.

  The imaging units 240 </ b> A and 240 </ b> B are attached on the bottom surface portion 211 of the housing unit 210 so as to be arranged in the left-right direction at a position behind the reflecting unit 230. Each of the imaging units 240A and 240B includes imaging elements 241A and 241B (see FIG. 4 described later) in which a plurality of pixels are arranged in a line and one or a plurality of condenser lenses. In this example, color CCD (charge coupled device) line sensors are used as the image sensors 241A and 241B. Note that color CMOS (complementary metal oxide semiconductor) line sensors may be used as the imaging elements 241A and 241B. The imaging units 240 </ b> A and 240 </ b> B receive light reflected by the reflecting unit 230 when the substrate W passes below the light projecting unit 220.

  As shown in FIG. 2, the substrate holding device 250 is a spin chuck, for example, and includes a driving device 251 and a rotation holding unit 252. The drive device 251 is an electric motor, for example, and has a rotating shaft 251a. The drive device 251 is provided with an encoder (not shown). The rotation holding unit 252 is attached to the tip of the rotation shaft 251a of the driving device 251 and is driven to rotate around the vertical axis while holding the substrate W to be inspected.

  As illustrated in FIG. 3, the moving unit 260 includes a plurality (two in this example) of guide members 261 and a movement holding unit 262. The plurality of guide members 261 are attached to the bottom surface portion 211 of the housing portion 210 so as to be aligned in the left-right direction and to extend in the front-rear direction. The movement holding unit 262 is configured to be movable in the front-rear direction along the plurality of guide members 261 while holding the substrate holding device 250. When the movement holding unit 262 moves in the front-rear direction while the substrate holding device 250 holds the substrate W, the substrate W passes under the light projecting unit 220.

  The notch detection unit 270 is a reflective photoelectric sensor including, for example, a light projecting element and a light receiving element, and is attached to the front upper part of the inner surface of the side surface part 215 of the housing part 210. When the peripheral edge of the substrate W to be inspected is positioned below the notch detector 270, the notch detector 270 emits light downward and receives reflected light from the substrate W. Here, when a notch is formed in the portion of the substrate W located below the notch detection unit 270, the amount of light received by the notch detection unit 270 is reduced. The notch detection unit 270 detects the presence / absence of a notch on the substrate W based on the amount of received reflected light from the substrate W rotated by the substrate holding device 250. Note that a transmissive photoelectric sensor may be used as the notch detection unit 270.

(2) Imaging Area and Arrangement of Imaging Units 240A and 240B FIG. 4 is a schematic plan view showing the imaging area and arrangement of the imaging units 240A and 240B in FIG. Here, a first virtual surface VS1 that extends in the front-rear direction through the center WC of the substrate W held by the substrate holding device 250 and is perpendicular to one surface of the substrate W is defined.

  The imaging units 240A and 240B are respectively arranged on one side and the other side of the first virtual surface VS1 so as to be symmetric with respect to the first virtual surface VS1. In this state, the imaging elements 241A and 241B of the imaging units 240A and 240B extend in the left-right direction.

  Each of the image pickup devices 241A and 241B has image pickup surfaces 242A and 242B each including a plurality of pixels. A second virtual surface VS2 orthogonal to the front-rear direction is defined behind the light projecting unit 220 and the reflecting unit 230. In this case, the imaging surfaces 242A and 242B are arranged on the second virtual surface VS2.

  The reflection unit 230 and the imaging units 240A and 240B are arranged such that the reflection unit 230 is positioned within the field of view of the imaging units 240A and 240B. Accordingly, the imaging units 240A and 240B have linear imaging areas AA and AB, respectively, below the light projecting unit 220 via the reflection unit 230. The imaging area AA of the imaging unit 240A extends in the left-right direction so as to cover at least the range from one end WE1 of the substrate W held by the substrate holding device 250 to the center WC in the left-right direction. On the other hand, the imaging region AB of the imaging unit 240B extends in the left-right direction so as to cover at least the range from the other end WE2 of the substrate W to the center WC in the left-right direction.

  In a state where light is emitted from the light projecting unit 220, the substrate W held by the substrate holding device 250 is moved by the moving unit 260 and passes below the light projecting unit 220. At this time, the imaging elements 241A and 241B of the imaging units 240A and 240B receive light reflected from one surface of the substrate W at a predetermined sampling period, thereby sequentially sequentially performing a plurality of regions in the front-rear direction on the one surface of the substrate W. Take an image. Each pixel constituting the image sensors 241A and 241B outputs pixel data corresponding to the amount of received light.

  Based on a plurality of pixel data output from the left imaging unit 240A, image data representing an image of an area including the left half extending from one end of the substrate W to the center is generated. Further, image data representing an image of an area including the right half extending from the other end of the substrate W to the center is generated based on the plurality of pixel data output from the right imaging unit 240B. By combining the two generated image data, image data representing the entire image of one surface of the substrate W is generated.

  Here, the reason for imaging the substrate W using the two imaging units 240A and 240B will be described. In general, each pixel provided in an image sensor of a color camera includes an R pixel that receives red light, a G pixel that receives green light, and a B pixel that receives blue light. The refractive index of light in the film formed on the substrate W varies depending on the wavelength. Also, the light transmittance and reflectance of the film on the substrate W may differ depending on the wavelength. For this reason, if the incident angles of light reflected on one surface of the substrate W and incident on the imaging surface of the color camera are different, the ratios of the received light amounts of the R pixel, G pixel, and B pixel are different. Thereby, the ratio of the R pixel value, the G pixel value, and the B pixel value of the image data differs depending on the incident angle of light on the imaging surface of the color camera. As a result, when the incident angle of light on the imaging surface of the color camera is different, the color of the image represented by the image data is different.

  Accordingly, if the incident angle of light incident on the imaging surface of the camera from the one end WE1 and the other end WE2 of the substrate W is significantly different from the incident angle of light incident on the imaging surface of the camera from the central portion of the substrate W, the substrate W The color of the image of the one end portion WE1 and the other end portion WE2 is different from the color of the image of the central portion of the substrate W.

  Here, a midpoint MP is defined at a position between the imaging surface 242A and the imaging surface 242B on the second virtual surface VS2. As a reference example, an example will be described in which the imaging surface of the color camera is arranged at the midpoint MP and the entire surface of the substrate W is imaged.

  FIG. 5 is a schematic plan view showing a reference example in which the entire surface of the substrate W is imaged by one color camera in the substrate inspection apparatus 200 of FIG. The imaging surface 242C of the color camera 240C is disposed at the midpoint MP. Thereby, the incident angles γ of light incident on the imaging surface 242C of the color camera 240C from the one end WE1 and the other end WE2 of the substrate W can be made equal. However, in this case, the incident angle γ of light incident on the imaging surface 242C of the color camera 240C from the one end WE1 and the other end WE2 of the substrate W and the light incident on the imaging surface 242C of the color camera 240C from the center WC of the substrate W. The difference from the incident angle 0 becomes larger. Therefore, the color of the image of the one end portion WE1 and the other end portion WE2 of the substrate W is significantly different from the color of the image of the central portion of the substrate W.

  Therefore, in the present embodiment, as shown in FIG. 4, the incident angle α1 of the light incident on the imaging surface 242A from the one end WE1 of the substrate W and the incident angle of the light incident on the imaging surface 242A from the center WC of the substrate W. The imaging unit 240A is arranged on one side (left) of the first virtual plane VS1 so that α2 is smaller than the incident angle γ (FIG. 5) of light from the one end WE1 of the substrate W toward the midpoint MP. Yes. Further, the incident angle β1 of light incident on the imaging surface 242B from the other end WE2 of the substrate W and the incident angle β2 of light incident on the imaging surface 242B from the center WC of the substrate W are the midpoints from the other end WE2 of the substrate W. The imaging unit 240B is arranged on the other side (right) of the first virtual surface VS1 so as to be smaller than the incident angle γ (FIG. 5) of the light toward the MP.

  Thereby, the incident angle α1 of light incident on the imaging surface 242A of the imaging unit 240A from the one end WE1 of the substrate W is not significantly different from the incident angle α2 of light incident on the imaging surface 242A from the center WC of the substrate W. Therefore, in the image represented by the image data generated using the imaging unit 240A, the color of the one end portion WE1 of the substrate W and the color of the central portion of the substrate W are substantially equal. Further, the incident angle β1 of light incident on the imaging surface 242B of the imaging unit 240B from the other end WE2 of the substrate W is not significantly different from the incident angle β2 of light incident on the imaging surface 242B from the center WC of the substrate W. Therefore, in the image represented by the image data generated using the imaging unit 240B, the color of the other end portion WE2 of the substrate W and the color of the central portion of the substrate W are substantially equal.

  As a result, compared to the case where both ends of the substrate W are simultaneously imaged using the color camera 240C, a decrease in accuracy of the portion corresponding to the one end WE1 of the substrate W in the image data generated by the imaging unit 240A is suppressed. Thus, a decrease in accuracy of the portion corresponding to the other end portion WE2 of the substrate W in the image data generated by the imaging unit 240B is suppressed.

(3) Control System and Operation of Substrate Inspection Apparatus FIG. 6 is a block diagram showing a control system of the substrate inspection apparatus 200 according to the first embodiment. As shown in FIG. 6, the substrate inspection apparatus 200 includes a display unit 280 and a control device 400 in addition to the configuration shown in FIG.

  The control device 400 includes a CPU (central processing unit), a RAM (random access memory), and a ROM (read only memory), and includes a control unit 401, an image generation unit 402, a synthesis information storage unit 403, a synthesis unit 404, and an image. A determination storage unit 405 and a determination unit 406 are included. In the control device 400, each functional unit described above is realized by the CPU executing a computer program stored in the ROM or other storage medium. Note that some or all of the functional components of the control unit may be realized by hardware such as an electronic circuit.

  Regarding the substrate holding device 250 and the notch detection unit 270, the control unit 401 obtains an output signal from the encoder of the driving device 251 (FIG. 2) of the substrate holding device 250, and the rotation angle of the driving device 251 (the rotation angle of the substrate W). And the notch detection result by the notch detection unit 270 is acquired. The control unit 401 determines the orientation of the substrate W based on the rotation angle of the driving device 251 when the notch is detected, and controls the operation of the substrate holding device 250 based on the determination result.

  Regarding the light projecting unit 220, the moving unit 260, and the imaging units 240 </ b> A and 240 </ b> B, the control unit 401 projects the light projecting unit 220 and the moving unit 260 so that the entire surface of the substrate W held by the substrate holding device 250 is imaged. Also, the imaging units 240A and 240B are controlled.

  The image generation unit 402 generates image data representing an image of at least the left half region on one surface of the substrate W based on the plurality of pixel data output from the imaging unit 240A. Further, the image generation unit 402 generates image data representing an image of at least the right half region on one surface of the substrate W based on the plurality of pixel data output from the imaging unit 240B.

  In the synthesis information storage unit 403, synthesis information for synthesizing the two image data generated by the image generation unit 402 is stored in advance. The combined information is information indicating the positional relationship between the pixels of the imaging elements 241A and 241B of the imaging units 240A and 240B, and is created in advance before the actual inspection of the substrate W. The composite information is obtained by, for example, imaging a reference substrate on which a known pattern is formed by the imaging units 240A and 240B, performing pattern matching on images indicated by two image data obtained by imaging, and obtaining a positional relationship between the two images. Is generated.

  The combining unit 404 combines the two image data generated by the image generating unit 402 based on the combination information stored in the combination information storage unit 403. The image determination storage unit 405 stores the image data that has been combined by the combining unit 404. The determination unit 406 determines the presence / absence of a surface state defect on one surface of the substrate W based on the image data stored in the image determination storage unit 405. The image determination storage unit 405 further stores the determination result of the presence / absence of a defect by the determination unit 406. An image based on the image data and a determination result of whether or not the substrate W is defective are displayed on the display unit 280.

  7A to 7D are plan views for explaining an example of the operation of the substrate inspection apparatus 200 when inspecting the substrate W. FIG. In the initial state, as shown in FIG. 7A, the substrate holding device 250 is located at the front part in the housing part 210. In this state, the substrate W to be inspected is carried into the casing unit 210 through the opening 216 (FIG. 1) by a substrate transfer device (for example, the substrate transfer device 120 in FIG. 12 described later) and held by the substrate holding device 250. The

  Next, while the substrate W is rotated once by the substrate holding device 250, light is emitted to the peripheral edge of the substrate W by the notch detection unit 270, and the reflected light is received by the notch detection unit 270. Thereby, the notch of the substrate W is detected, and the orientation of the substrate W is determined. Thereafter, the substrate W is rotated by the substrate holding device 250 so that the substrate W faces a specific direction.

  Next, in a state where light is emitted from the light projecting unit 220, the substrate W is moved backward by the moving unit 260 as indicated by a white arrow in FIG. At this time, when the substrate W passes below the light projecting unit 220, the entire surface of the substrate W is irradiated with light having a cross-sectional line extending in the left-right direction.

  When the imaging areas AA and AB (FIG. 4) of the imaging units 240A and 240B are at the light irradiation position on one surface of the substrate W, the light reflected from the substrate W is reflected by the reflecting unit 230 and is reflected by the imaging units 240A and 240A. It is led to 240B.

  Thereby, image data representing an image of the left half region on one surface of the substrate W is generated based on the plurality of pixel data output from the imaging unit 240A. In addition, image data representing an image of the right half region on one surface of the substrate W is generated based on the plurality of pixel data output from the imaging unit 240B. Thereafter, the generated two pieces of image data are combined to generate image data representing an entire image including a region from one end WE1 to the other end WE2 on one surface of the substrate W.

  Subsequently, as shown by a thick arrow in FIG. 7C, the substrate W is rotated 90 ° by the substrate holding device 250. Thereafter, in a state where light is emitted from the light projecting unit 220, the moving unit 260 moves the substrate W to the front initial position as indicated by a white arrow in FIG. At this time, when the substrate W passes again below the light projecting unit 220, image data indicating an entire image of one surface of the substrate W is generated, as in the operation of FIG.

  Based on the image data generated with the substrate W facing a specific direction, the determination unit 406 in FIG. Further, the determination unit 406 in FIG. 6 determines the presence / absence of a defect in the substrate W based on the image data generated in a state where the substrate W faces a different direction (90 ° in this example) from a specific direction.

(4) Effects of the First Embodiment (a) In the substrate inspection apparatus 200 according to the first embodiment, the left half region including the one end WE1 on one surface of the substrate W in the left-right direction is formed by the imaging unit 240A. The right half area including the other end WE2 is imaged by the imaging unit 240B. In this case, the accuracy of the portion of the image data corresponding to the one end WE1 and the other end WE2 of the substrate W as compared to the case where the one end WE1 and the other end WE2 of the substrate W are simultaneously imaged using one color camera. Is suppressed. Therefore, the presence or absence of a surface state defect including both end portions on one surface of the substrate W can be determined with high accuracy.

  (B) As described above, the imaging units 240A and 240B are arranged on one side and the other side of the first virtual surface VS1, respectively, so as to be bilaterally symmetric with respect to the first virtual surface VS1. This makes it possible to reduce the incident angle α1 of light incident on the imaging unit 240A from the one end WE1 of the substrate W and the incident angle β1 of light incident on the imaging unit 240B from the other end WE2 of the substrate W, respectively. ing. Thereby, it is possible to suppress a decrease in the accuracy of the image data portions corresponding to both ends of the substrate W. In addition, since the incident angles α1 and β1 are equal, the accuracy of the portions of the image data corresponding to the one end WE1 and the other end WE2 of the substrate W is equal. Therefore, the accuracy of the image data corresponding to the left half region of the substrate W can be made equal to the accuracy of the image data corresponding to the right half region of the substrate W.

  (C) In the substrate inspection apparatus 200 according to the present embodiment, the entire image of one surface of the substrate W is obtained by the relative movement of the light projecting unit 220, the reflecting unit 230, the imaging units 240A and 240B, and the substrate holding device 250. Is generated. Therefore, a decrease in accuracy of generated image data is suppressed, and an increase in size of the imaging units 240A and 240B is suppressed.

  (D) On one surface of the substrate W, a plurality of chips having different appearances depending on the orientation of the substrate W may be formed. In this case, when the orientation of the substrate W with respect to the light emitted from the light projecting unit 220 (FIG. 1) is different, the color or brightness of the image based on the generated image data may be different. Even in such a case, according to the substrate inspection apparatus 200 according to the present embodiment, when the substrate W is inspected, the substrate W held by the substrate holding apparatus 250 is rotated and the orientation of the substrate W is changed. Thereby, two types of image data corresponding to the orientation of the substrate W are generated, and the presence / absence of a defect is determined based on the respective image data. Therefore, when a defect exists on the surface of the substrate W, the possibility that the defect appears clearly in an image based on at least one of the two types of image data is improved. Thereby, it is possible to determine the presence or absence of defects in the surface state of the substrate W with higher accuracy.

[2] Second Embodiment (1) Configuration of Substrate Inspection Apparatus 200 Differences of the substrate inspection apparatus 200 according to the second embodiment from the substrate inspection apparatus 200 according to the first embodiment will be described. FIG. 8 is an external perspective view of the substrate inspection apparatus 200 according to the second embodiment, FIG. 9 is a schematic side view showing the internal configuration of the substrate inspection apparatus 200 of FIG. 8, and FIG. It is the typical rear view which looked at the image pick-up part 290 provided in the board | substrate inspection apparatus 200 from back.

  As shown in FIG. 8, the substrate inspection apparatus 200 according to the second embodiment includes a substrate W instead of the reflection unit 230 and the imaging units 240A and 240B of the substrate inspection apparatus 200 according to the first embodiment. One imaging unit 290 that images the entire surface is provided.

  The imaging unit 290 is a CIS (contact image sensor), and includes one imaging element 291 (FIG. 10) and a lens in which a plurality of pixels are arranged in a line. The imaging unit 290 is attached to the inner surfaces of the side surface portions 213 and 215 of the housing unit 210 so as to extend rearward and laterally from the light projecting unit 220.

  As shown in FIG. 10, the imaging element 291 has an imaging surface 292 configured by a plurality of pixels. Each of the plurality of pixels includes an R pixel, a G pixel, and a B pixel. The imaging surface 292 has a length equal to or larger than the diameter of the substrate W in the left-right direction, and is arranged to face downward. Thereby, the imaging unit 290 has a linear imaging area AC extending below the imaging surface 292 in the left-right direction by the diameter of the substrate W or more.

  In the substrate inspection apparatus 200 having the above-described configuration, when inspecting the substrate W, as shown in FIG. Light is irradiated. In this state, the substrate W held by the substrate holding device 250 is moved by the moving unit 260 and passes through the imaging area AC below the light projecting unit 220. At this time, the imaging device 291 of the imaging unit 290 receives light reflected from the one surface of the substrate W perpendicularly to the imaging surface 292 at a predetermined sampling period as shown in FIG. A plurality of areas in the front-rear direction are sequentially imaged. Each pixel constituting the image sensor 291 outputs pixel data corresponding to the amount of received light. Thereby, image data representing the entire image of one surface of the substrate W is generated based on the plurality of pixel data output from the imaging unit 290.

(2) Control System and Operation of Substrate Inspection Device FIG. 11 is a block diagram showing a control system of the substrate inspection device 200 according to the second embodiment. As shown in FIG. 11, the control system of the substrate inspection apparatus 200 according to the present embodiment relates to the first embodiment, except that it does not have the composite information storage unit 403 and the composite unit 404 of FIG. It has the same configuration as the substrate inspection apparatus 200.

  With respect to the substrate holding device 250 and the notch detection unit 270, the control unit 401 performs the same control as in the first embodiment. Further, the control unit 401 controls the light projecting unit 220, the moving unit 260, and the imaging unit 290 so that the entire surface of the substrate W held by the substrate holding device 250 is imaged. The image generation unit 402 generates image data representing an entire image of one surface of the substrate W based on the plurality of pixel data output from the imaging unit 290.

  Specifically, as in the example of FIGS. 7A and 7B, the control unit 401 transmits light from the light projecting unit 220 in a state where the substrate W held by the substrate holding device 250 faces a specific direction. , And the moving unit 260 is controlled so that the substrate W passes through the imaging area AC (FIG. 10) of the imaging unit 290. Therefore, the image generation unit 402 generates image data representing an entire image of one surface of the substrate W based on the plurality of pixel data output from the imaging unit 290.

  Next, as in the example of FIG. 7C, the control unit 401 controls the substrate holding device 250 so that the substrate W rotates 90 ° from a specific direction. Thereafter, the control unit 401 emits light from the light projecting unit 220, and the moving unit so that the substrate W passes through the imaging area AC (FIG. 10) of the imaging unit 290 again as in the example of FIG. 260 is controlled. Therefore, the image generation unit 402 generates image data representing an entire image of one surface of the substrate W based on the plurality of pixel data output from the imaging unit 290.

  Similar to the example of the first embodiment, the two generated image data are stored in the image determination storage unit 405. Based on the two stored image data, the determination unit 406 determines the presence or absence of a defect in the substrate W.

(3) Effects of the Second Embodiment (a) In the substrate inspection apparatus 200 according to the second embodiment, the imaging element 291 captures images from one end and the other end on one surface of the substrate W in the left-right direction. When light perpendicular to the surface 292 is incident on each of the plurality of pixels, one end and the other end of the substrate W are imaged. In this case, the incident angle of light from one end and the other end of the substrate W toward the plurality of pixels is zero. Thereby, compared to the case where one end and the other end of the substrate W are simultaneously imaged using a single color camera equipped with a condensing lens, the portion of the image data corresponding to the one end and the other end of the substrate W is reduced. Reduction in accuracy is suppressed. Therefore, the presence or absence of a surface state defect including both end portions on one surface of the substrate W can be determined with high accuracy.

  (B) In the substrate inspection apparatus 200 according to the present embodiment, the imaging surface 292 of the imaging unit 290 has a length equal to or larger than the diameter of the substrate W, and the relative movement between the imaging unit 290 and the substrate holding device 250 is performed. Thus, image data representing an entire image of one surface of the substrate W is generated. Therefore, a decrease in accuracy of generated image data is suppressed, and an increase in size of the imaging unit 290 is suppressed.

[3] Third Embodiment (1) Outline of Configuration and Operation of Substrate Processing Apparatus FIG. 12 is a schematic block diagram showing an overall configuration of a substrate processing apparatus 100 according to a third embodiment. As shown in FIG. 12, the substrate processing apparatus 100 is provided adjacent to the exposure apparatus 500 and includes the substrate inspection apparatus 200 according to the first or second embodiment, as well as the control apparatus 110 and the substrate transfer apparatus 120. A coating processing unit 130, a development processing unit 140, and a heat treatment unit 150.

  The control device 110 includes, for example, a CPU and a memory, or a microcomputer, and controls operations of the substrate transfer device 120, the coating processing unit 130, the development processing unit 140, and the heat treatment unit 150. Further, the control device 110 gives a command for inspecting the surface state of one surface of the substrate W to the control device 400 of FIG. 6 or FIG.

  The substrate transport device 120 transports the substrate W among the coating processing unit 130, the development processing unit 140, the heat treatment unit 150, the substrate inspection device 200, and the exposure device 500.

  The coating processing unit 130 includes a plurality of processing units PU. The processing unit PU is provided with a processing liquid nozzle 132 for supplying a processing liquid for forming a resist film on the substrate W rotated by the spin chuck 131. Each processing unit PU forms a resist film on one surface of the unprocessed substrate W (coating process). The exposure apparatus 500 performs an exposure process on the substrate W after the coating process on which the resist film is formed.

  The development processing unit 140 performs a development process on the substrate W by supplying a developer to the substrate W after the exposure process by the exposure apparatus 500. The heat treatment unit 150 heat-treats the substrate W before and after the coating process by the coating processing unit 130, the development process by the development processing unit 140, and the exposure process by the exposure apparatus 500.

  The substrate inspection apparatus 200 inspects the substrate W after the resist film is formed by the coating processing unit 130. For example, the substrate inspection apparatus 200 inspects the substrate W after the coating process by the coating processing unit 130 and before the exposure process by the exposure apparatus 500. In this case, the substrate transport apparatus 120 transports the substrate W determined to have no defect to the exposure apparatus 500. On the other hand, the substrate transport apparatus 120 does not transport the substrate W determined to be defective to the exposure apparatus 500. This prevents the exposure process from being performed on the substrate W on which the defect exists.

  Further, the substrate inspection apparatus 200 may inspect the substrate W after the coating processing by the coating processing unit 130, after the exposure processing by the exposure apparatus 500, and after the development processing by the development processing unit 140. Alternatively, the substrate inspection apparatus 200 may inspect the substrate W after the coating processing by the coating processing unit 130, after the exposure processing by the exposure device 500, and before the development processing by the development processing unit 140.

  In the substrate processing apparatus 100, the coating processing unit 130 may be provided with a processing unit that forms an antireflection film on the substrate W. In this case, the heat treatment unit 150 may perform an adhesion strengthening process for improving the adhesion between the substrate W and the antireflection film. In addition, the coating processing unit 130 may be provided with a processing unit for forming a resist cover film for protecting the resist film formed on the substrate W.

  When the antireflection film and the resist cover film are formed on one surface of the substrate W, the substrate inspection apparatus 200 may determine whether there is a surface state defect on the one surface of the substrate W after each film is formed. Good.

(2) Effects of the Third Embodiment In the substrate processing apparatus 100 according to the present embodiment, the surface state on one surface of the substrate W on which a film such as a resist film, an antireflection film, a resist cover film, etc. is formed. Inspected by the substrate inspection apparatus 200 according to the first or second embodiment. Thereby, the presence or absence of a surface state defect including both end portions on one surface of the substrate W on which the film is formed is detected with high accuracy. Therefore, the quality of the coating process for forming a film on one surface of the substrate W can be determined with high accuracy. As a result, the occurrence of processing defects on the substrate W is reduced.

[4] Other Embodiments (1) In the substrate inspection apparatus 200 according to the first embodiment, two imaging units 240A and 240B that image the left half and the right half on one surface of the substrate W in the left-right direction are provided. Although provided, the present invention is not limited to this.

  The board | substrate W used as a test object should just be imaged by the two imaging parts 240A and 240B from which the one end part and other end part on the one surface in the left-right direction differ from each other. Therefore, the substrate inspection apparatus 200 may include three imaging units that respectively capture a plurality of regions on one surface of the substrate W in the left-right direction, may include four imaging units, or five or more. You may have an imaging part.

  FIG. 13 is a schematic plan view showing an internal configuration of a substrate inspection apparatus 200 according to another embodiment. As shown in FIG. 13, in the substrate inspection apparatus 200 of this example, a new imaging unit 240D is provided between the imaging units 240A and 240B according to the first embodiment. In this case, the imaging unit 240A images one end on one surface of the substrate W and its peripheral region, the imaging unit 240B images the other end on one surface of the substrate W and its peripheral region, and the imaging unit 240D The center region on one surface of the substrate W is imaged. Thereby, the incident angle of the light which injects into the imaging surface of each imaging part 240A, 240B, 240D from each part of the board | substrate W can be made smaller. Therefore, the presence or absence of a surface state defect including both end portions on one surface of the substrate W can be determined with higher accuracy.

  (2) In the substrate inspection apparatus 200 according to the first embodiment, the imaging units 240A and 240B have the imaging areas AA and AB extending in one direction, respectively, but the present invention is not limited to this. The imaging units 240A and 240B may have a planar imaging area. That is, a color CCD area sensor or a CMOS area sensor in which a plurality of pixels are arranged in a matrix may be used as the imaging elements 241A and 241B.

  In this case, for example, by providing a plurality of imaging units so that the entire surface of the substrate W is covered by the plurality of imaging regions, it is necessary to relatively move the plurality of imaging units and the substrate holding device 250 in the front-rear direction. Disappears. Thereby, the time required for the inspection of the substrate W can be shortened.

  (3) In the substrate inspection apparatus 200 according to the second embodiment, the imaging unit 290 includes the imaging area AC extending in one direction, but the present invention is not limited to this. The imaging unit 290 may have a planar imaging area. That is, a color CCD area sensor or CMOS area sensor in which a plurality of pixels are arranged in a matrix may be used as the imaging unit 290.

  In this case, for example, by configuring the imaging unit 290 so that the entire surface of the substrate W is covered by the imaging region of the imaging unit 290, the imaging unit 290 and the substrate holding device 250 are relatively moved in the front-rear direction. There is no need. Thereby, the time required for the inspection of the substrate W can be shortened.

  (4) In the substrate inspection apparatus 200 according to the first embodiment, the image data generated by the left imaging unit 240A and the image data generated by the right imaging unit 240B are combined and combined. Although the presence or absence of the defect of the board | substrate W is determined based on data, this invention is not limited to this.

  The image data generated by the left imaging unit 240A and the image data generated by the right imaging unit 240B may not be combined. Even in such a case, the presence / absence of a defect in the region including the left half of the substrate W can be determined based on the image data generated by the left imaging unit 240A. In addition, the presence or absence of a defect in the region including the right half of the substrate W can be determined based on the image data generated by the right imaging unit 240B.

  (5) In the first embodiment, the light projecting unit 220 and the imaging units 240A and 240B are configured as separate bodies, but the light projecting unit 220 and the imaging units 240A and 240B may be configured integrally. . Moreover, in the said 2nd Embodiment, although the light projection part 220 and the imaging part 290 are comprised as a different body, the light projection part 220 and the imaging part 290 may be comprised integrally.

  (6) In the first embodiment, the substrate inspection apparatus 200 is provided with the reflection unit 230, but the present invention is not limited to this. When the imaging units 240A and 240B are configured to directly receive the band-like light from the substrate W, the reflection unit 230 may not be provided.

  (7) In the first embodiment, the moving unit 260 is configured to move the substrate holding device 250 in the front-rear direction with respect to the light projecting unit 220, the reflecting unit 230, and the imaging units 240A and 240B. However, the present invention is not limited to this. The moving unit 260 projects the light projecting unit 220, the reflecting unit 230, and the imaging unit 240A with respect to the substrate holding device 250 so that the imaging areas AA and AB of the imaging units 240A and 240B pass through the left half and the right half of the substrate W. , 240B may be configured to move in the front-rear direction.

  In the second embodiment, the moving unit 260 is configured to move the substrate holding device 250 in the front-rear direction with respect to the light projecting unit 220 and the imaging unit 290, but the present invention is not limited to this. Not. The moving unit 260 is configured to move the light projecting unit 220 and the imaging unit 290 in the front-rear direction with respect to the substrate holding device 250 so that the imaging area AC of the imaging unit 290 passes through the entire surface of the substrate W. May be.

  (8) In the above embodiment, when the substrate W is inspected, image data is generated by imaging the substrate W facing a specific direction, and then the image is further changed by changing the orientation of the substrate W by 90 °. Although data is generated, the change angle of the orientation of the substrate W and the number of changes of the orientation of the substrate W are not limited to the above example. When inspecting the substrate W, for example, the orientation of the substrate W may be changed by 45 ° or may be changed by 60 °. Further, the number of changes in the orientation of the substrate W may be three or more.

  Alternatively, the orientation of the substrate W may not be changed. Further, when the substrate W can be inspected in a state where the orientation of the substrate W is in an arbitrary direction, the substrate holding device 250 may be configured to hold the substrate W in a non-rotatable manner. Thereby, the configuration of the substrate holding device 250 is simplified.

[5] Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to examples.

  In the above embodiment, the substrate holding device 250 and the control unit 401 are examples of holding units, the diameter direction of the substrate W parallel to the left-right direction is an example of the first diameter direction, and the substrate is parallel to the front-rear direction. The diameter direction of W is an example of the second diameter direction, one end WE1 of the substrate W is an example of one end on one surface of the substrate W, and the other end WE2 of the substrate W is the other on one surface of the substrate W. This is an example of an end, and the center WC of the substrate W is an example of the center of the substrate W.

  In addition, the imaging unit 240A and the image generation unit 402 are examples of the first imaging unit, the imaging unit 240B and the image generation unit 402 are examples of the second imaging unit, and the substrate W imaged by the imaging unit 240A. An area including the left half is an example of the first area, and an area including the right half of the substrate W imaged by the imaging unit 240B is an example of the second area, and is generated based on the output of the imaging unit 240A. The image data is an example of the first image data, the image data generated based on the output of the imaging unit 240B is an example of the second image data, the determination unit 406 is an example of the determination unit 406, The substrate inspection apparatus 200 is an example of a substrate inspection apparatus.

  The first virtual surface VS1 is an example of the first virtual surface, the second virtual surface VS2 is an example of the second virtual surface, and the imaging surface 242A of the imaging unit 240A is the first imaging surface. In this example, the imaging surface 242B of the imaging unit 240B is an example of the second imaging surface, the midpoint MP is an example of the midpoint, the imaging area AA is an example of the first imaging area, and the imaging area AB Is an example of the second imaging region, and the moving unit 260 is an example of the moving unit.

  In addition, the imaging unit 290 and the image generation unit 402 are examples of the imaging unit, and the entire region of one surface of the substrate W imaged by the imaging unit 290 is an example of the third region, and is based on the output of the imaging unit 290. The image data generated in this way is an example of image data representing the image of the third area, the imaging area AC is an example of the third imaging area, the coating processing unit 130 is an example of the coating processing unit, and the substrate The transport apparatus 120 is an example of a transport apparatus, and the substrate processing apparatus 100 is an example of a substrate processing apparatus.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  The present invention can be effectively used for inspection of the surface of various substrates.

DESCRIPTION OF SYMBOLS 100 ... Substrate processing apparatus, 110, 400 ... Control apparatus, 120 ... Substrate conveyance apparatus, 130 ... Coating processing part, 131 ... Spin chuck, 132 ... Processing liquid nozzle, 140 ... Development processing part, 150 ... Heat processing part, 200 ... Substrate Inspection device, 210 ... casing part, 211 ... bottom face part, 212 to 215 ... side face part, 216 ... opening part, 220 ... light projecting part, 230 ... reflecting part, 240A, 240B, 240D, 290 ... imaging part, 240C ... Color camera, 241A, 241B, 291 ... Imaging device, 242A, 242B, 242C, 292 ... Imaging surface, 250 ... Substrate holding device, 251 ... Driving device, 251a ... Rotating shaft, 252 ... Rotating holding portion, 260 ... Moving portion, 261 ... Guide member, 262 ... Movement holding part, 270 ... Notch detection part, 280 ... Display part, 401 ... Control part, 402 ... Image generation part, 40 ... Composition information storage unit, 404 ... Composition unit, 405 ... Image determination storage unit, 406 ... Determination unit, 500 ... Exposure device, AA, AB, AC ... Image pickup area, MP ... Middle point, PU ... Processing unit, VS1, VS2 ... virtual plane, W ... substrate

Claims (10)

A holding unit for holding the substrate;
A first region that captures a first region including one end portion in a first diameter direction on one surface of the substrate held by the holding unit, and generates first image data representing an image of the first region. An imaging unit;
The second region including the other end portion in the first diameter direction on the one surface of the substrate held by the holding unit is imaged, and second image data representing the image of the second region is generated. A second imaging unit;
A substrate inspection apparatus comprising: a determination unit that determines presence or absence of a defect in a surface state of the substrate based on the first and second image data. The first and second imaging units are respectively disposed on one side and the other side of a first virtual surface extending in a second diameter direction orthogonal to the first diameter direction and perpendicular to the one surface of the substrate. The substrate inspection apparatus according to claim 1. The substrate inspection apparatus according to claim 2, wherein the first and second imaging units are arranged symmetrically with respect to the first virtual plane. A second imaginary plane is defined that is parallel to the first diametrical direction and perpendicular to the one surface of the substrate;
The first and second imaging units each have a first imaging surface and a second imaging surface arranged along the second virtual plane,
A midpoint between the first imaging plane and the second imaging plane is defined on the second virtual plane,
The first angle so that an incident angle of light incident on the first imaging surface from the one end portion of the substrate is smaller than an incident angle of light traveling from the one end portion to the midpoint of the second virtual surface. An imaging unit is arranged,
The first angle so that an incident angle of light incident on the second imaging surface from the other end portion of the substrate is smaller than an incident angle of light traveling from the other end portion to the midpoint of the second virtual surface. The board | substrate inspection apparatus as described in any one of Claims 1-3 by which 2 imaging parts are arrange | positioned. The said 1st area | region contains the area | region from the said one end part of a board | substrate to the center of a board | substrate, and the said 2nd area | region contains the area | region from the said other end part of a board | substrate to the center of a board | substrate. The board inspection apparatus according to claim 1. The first imaging unit has a linear first imaging region extending parallel to the first diameter direction,
The second imaging unit has a linear second imaging region extending parallel to the first diameter direction,
The substrate inspection apparatus includes:
The first imaging region passes through the first region of the substrate held by the holding unit, and the second imaging region passes through the second region of the substrate held by the holding unit. The substrate inspection apparatus according to claim 5, further comprising a moving unit that relatively moves the first and second imaging units and the holding unit. A holding unit for holding the substrate;
An imaging unit that captures an image of a third region from one end to the other end in the first diameter direction on one surface of the substrate held by the holding unit, and generates image data representing an image of the third region When,
A determination unit that determines the presence or absence of defects in the surface state of the substrate based on the image data generated by the imaging unit;
The imaging unit has an array of a plurality of pixels constituting an imaging surface having a length equal to or longer than the diameter of the substrate, and light perpendicular to the imaging surface is incident on the plurality of pixels from the third region, respectively. The board inspection device is arranged as follows. The imaging unit includes a linear third imaging region extending in parallel with the first diameter direction and having a length equal to or greater than the diameter of the substrate.
The substrate inspection apparatus includes:
The moving part which moves the image pick-up part and the holding part relatively so that the third image pick-up area may pass the third area of the substrate held by the holding part. The board | substrate inspection apparatus of description. The said holding | maintenance part is a board | substrate inspection apparatus as described in any one of Claims 1-8 comprised so that rotation was possible while hold | maintaining a board | substrate. A coating treatment unit that forms a film on one surface of the substrate by supplying a treatment liquid to one surface of the substrate;
The substrate inspection apparatus according to any one of claims 1 to 9, which inspects a surface state of a substrate on which a film is formed by the coating processing unit,
A substrate processing apparatus comprising: a transport device that transports a substrate between the coating processing unit and the substrate inspection apparatus.

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