JP2020119739A - Lamp device and lighting device - Google Patents

Lamp device and lighting device Download PDF

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Publication number
JP2020119739A
JP2020119739A JP2019009463A JP2019009463A JP2020119739A JP 2020119739 A JP2020119739 A JP 2020119739A JP 2019009463 A JP2019009463 A JP 2019009463A JP 2019009463 A JP2019009463 A JP 2019009463A JP 2020119739 A JP2020119739 A JP 2020119739A
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power supply
end side
radiator
light emitting
mounting surface
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正徳 福島
Masanori Fukushima
正徳 福島
山田　太一
Taichi Yamada
太一 山田
酒井　誠
Makoto Sakai
誠 酒井
浩貴 玉井
Hirotaka Tamai
浩貴 玉井
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

To provide a lamp device having a structure in which the number of material to be used can be reduced while heat radiation of a radiator is secured, and having excellent assemblability.SOLUTION: A lamp device 10 comprises a light emitting module 13, a radiator 12, a resin housing 11, and a power supply unit 16. The light emitting module 13 has a module substrate 45 and a light emitting element 46 mounted on the module substrate 45. The radiator 12 has: a mounting surface part 36 that mounts the light emitting module 13 on a surface on one end side; an opening part 38 provided at the center of the mounting surface part 36; and a radiation cylinder part 37 protruding from the periphery of the mounting surface part 36 toward the other end side. The resin housing 11 has: an outer cylindrical part 20 arranged outside the radiation cylinder part 37 of the radiator 12; an inner cylindrical part 21 arranged inside the radiation cylinder part 37 of the radiator 12; and a locking part 29 protruding from one end side of the inner cylinder part 21, inserted through the opening part 38, and locked to one end side of the mounting surface part 36. The power supply unit 16 is provided on the other end side of the resin housing 11.SELECTED DRAWING: Figure 1

Description

本発明の実施形態は、発光モジュールを用いたランプ装置、およびこのランプ装置を用いた照明装置に関する。 Embodiments of the present invention relate to a lamp device using a light emitting module and a lighting device using the lamp device.

従来、発光モジュールを用いたランプ装置は、電球形ランプがあるが、発光モジュールが発生する熱の放熱性を確保するために金属筐体を用いていることが多い。 Conventionally, a lamp device using a light emitting module has a light bulb shaped lamp, but a metal housing is often used in order to ensure heat dissipation of heat generated by the light emitting module.

また、外郭の絶縁性を確保するために樹脂筐体を用いたランプ装置もある。この場合、発光モジュールの熱を放熱するための金属製の放熱体を樹脂筐体の内側に配置している。 In addition, there is a lamp device that uses a resin casing to ensure the insulation of the outer shell. In this case, a metal radiator for radiating the heat of the light emitting module is arranged inside the resin casing.

しかし、放熱体を用いると、材料費がかさんだり、ランプ装置の質量が増加してしまい、さらに、組み立てに手間がかかる。 However, the use of the heat radiator increases the material cost, increases the mass of the lamp device, and further requires time and effort for assembly.

特開２０１５−２０１７号公報JP, 2015-2017, A

本発明は、放熱体の放熱性を確保しつつ材料使用量を削減した構造とするとともに組立性のよいランプ装置および照明装置を提供することである。 It is an object of the present invention to provide a lamp device and a lighting device which have a structure in which the amount of materials used is reduced while ensuring the heat dissipation of the heat radiator and which is easy to assemble.

実施形態のランプ装置は、発光モジュール、放熱体、樹脂筐体および給電部を備える。発光モジュールは、モジュール基板、およびモジュール基板に実装された発光素子を有する。放熱体は、一端側の面に発光モジュールを取り付ける取付面部、取付面部の中央に設けられた開口部、および取付面部の周辺部から他端側に向けて突設された放熱筒部を有する。樹脂筐体は、放熱体の放熱筒部の外側に配置される外筒部、放熱体の放熱筒部の内方に配置される内筒部、および内筒部の一端側から突設され開口部を挿通して取付面部の一端側に係止された係止部を有する。給電部は、樹脂筐体の他端側に設けられる。 The lamp device according to the embodiment includes a light emitting module, a radiator, a resin casing, and a power feeding unit. The light emitting module has a module substrate and a light emitting element mounted on the module substrate. The heat radiator has a mounting surface portion for mounting the light emitting module on a surface on one end side, an opening portion provided in the center of the mounting surface portion, and a heat radiating cylinder portion protruding from the peripheral portion of the mounting surface portion toward the other end side. The resin housing is provided with an outer cylindrical portion arranged outside the heat radiating cylinder portion of the heat radiator, an inner cylindrical portion arranged inside the heat radiating cylinder portion of the heat radiating body, and an opening protruding from one end side of the inner cylinder portion. There is a locking portion that is inserted through the portion and is locked to one end side of the mounting surface portion. The power feeding unit is provided on the other end side of the resin housing.

実施形態のランプ装置によれば、放熱体の放熱性を確保しつつ材料使用量を削減した構造とするとともに組立性を向上できる。 According to the lamp device of the embodiment, it is possible to improve the assemblability while having a structure in which the amount of material used is reduced while ensuring the heat dissipation of the heat radiator.

一実施形態を示すランプ装置の断面図である。It is sectional drawing of the lamp device which shows one Embodiment. 同上ランプ装置の図１に対して９０°回転した断面図である。It is sectional drawing which rotated 90 degrees with respect to FIG. 1 of a lamp device same as the above. 同上ランプ装置の分解斜視図である。It is an exploded perspective view of a lamp device same as the above. 同上ランプ装置の斜視図である。It is a perspective view of a lamp device same as the above. 同上ランプ装置を用いた照明装置の模式図である。It is a schematic diagram of the illuminating device which uses a lamp device same as the above.

以下、一実施形態を、図面を参照して説明する。 An embodiment will be described below with reference to the drawings.

図１ないし図４にランプ装置10を示す。ランプ装置10は、例えば一般照明に用いられる白熱電球用のソケットに装着して使用する電球形ランプである。なお、ランプ装置10は、図１および図２に示す仮想の中心軸ｚを中心として略円筒状に構成されている。そして、以下、中心軸ｚに沿った方向のグローブ側を一端側、給電部側を他端側と呼ぶ。 A lamp device 10 is shown in FIGS. The lamp device 10 is, for example, a light bulb shaped lamp that is used by being attached to a socket for an incandescent light bulb used for general lighting. The lamp device 10 is configured in a substantially cylindrical shape around the virtual center axis z shown in FIGS. 1 and 2. Then, hereinafter, the globe side in the direction along the central axis z is referred to as one end side, and the power feeding portion side is referred to as the other end side.

ランプ装置10は、樹脂筐体11を備えている。この樹脂筐体11の一端側から放熱体12、発光モジュール13およびグローブ14が組み込まれ、樹脂筐体11の他端側から電源部15および給電部16が組み込まれている。 The lamp device 10 includes a resin housing 11. The radiator 12, the light emitting module 13, and the globe 14 are incorporated from one end side of the resin casing 11, and the power supply unit 15 and the power feeding unit 16 are incorporated from the other end side of the resin casing 11.

そして、樹脂筐体11は、中心軸ｚを中心とする円筒状で、絶縁性を有する樹脂材料によって一体に形成されている。樹脂筐体11は、一端側の外筒部20および内筒部21、および他端側の結合筒部22を備えている。 The resin casing 11 has a cylindrical shape centered on the central axis z and is integrally formed of an insulating resin material. The resin casing 11 includes an outer tubular portion 20 and an inner tubular portion 21 on one end side, and a coupling tubular portion 22 on the other end side.

外筒部20は、円筒状で、内側が一端側へ向けて開口されている。外筒部20の外周面は、他端側が中心軸ｚと平行な直線状で、一端側が徐々に拡径するテーパ状に形成されている。外筒部20の内周面は、一端側から他端側に亘って略同一径で、放熱体12の少なくとも一部が接触する接触面23に設けられている。外筒部20の一端側の内周に嵌合溝24が設けられ、この嵌合溝24に臨む外筒部20の内周面に、複数の連結突起25が突設されている。そして、外筒部20の一端面は内筒部21の一端面よりも突出されている。 The outer tubular portion 20 is cylindrical and the inside thereof is open toward the one end side. The outer peripheral surface of the outer cylindrical portion 20 is formed in a linear shape in which the other end side is parallel to the central axis z and a tapered shape in which the one end side gradually expands in diameter. The inner peripheral surface of the outer tubular portion 20 has a substantially same diameter from one end side to the other end side, and is provided on a contact surface 23 with which at least a part of the radiator 12 comes into contact. A fitting groove 24 is provided on the inner periphery of one end side of the outer tubular portion 20, and a plurality of connecting protrusions 25 are provided on the inner peripheral surface of the outer tubular portion 20 facing the fitting groove 24. Then, one end surface of the outer tubular portion 20 is projected more than one end surface of the inner tubular portion 21.

内筒部21は、結合筒部22と連続した円筒状に形成され、外筒部20の内方に所定の間隙をあけて配置されているとともに、内側が一端側および他端側にそれぞれ開口されている。内筒部21の内側には、内筒部21の他端側から挿入される電源部15を保持するための一対の保持溝部26が設けられている。一対の保持溝部26は、互いに対向し、中心軸ｚと平行でかつ中心軸ｚに対してオフセットした位置に設けられている。各保持溝部26の一端側には、電源部15の挿入位置を位置決めするストッパ部27が設けられている。 The inner cylinder portion 21 is formed in a cylindrical shape continuous with the coupling cylinder portion 22, is arranged inside the outer cylinder portion 20 with a predetermined gap, and the inside is opened at one end side and the other end side, respectively. Has been done. A pair of holding groove portions 26 for holding the power supply portion 15 inserted from the other end side of the inner tubular portion 21 is provided inside the inner tubular portion 21. The pair of holding groove portions 26 face each other, and are provided at positions parallel to the central axis z and offset from the central axis z. A stopper portion 27 for positioning the insertion position of the power supply portion 15 is provided on one end side of each holding groove portion 26.

内筒部21の一端側には、放熱体12が当接する当接面28が設けられているとともに、内筒部21（樹脂筐体11）に放熱体12を係止する複数の係止部29が突設されている。本実施形態では、係止部29は、一対で、内筒部21の一対の保持溝部26の位置に対して交差（直交）する方向の両側位置に配置されている。係止部29は、スナップフィット構造に設けられている。すなわち、係止部29は、径方向に弾性変形可能な係止片30、およびこの係止片30の一端側の先端部から外径側に突出する爪部31を有している。係止片30の両側にはスリット状の溝部32が設けられ、係止片30の一端側が径方向に弾性変形可能とされている。爪部31は、一端側が傾斜面に設けられ、他端側が中心軸ｚに略直交する係止面に設けられている。そして、係止部29の一端側の先端部は、外筒部20の一端側よりも突出されている。 A contact surface 28 with which the heat radiator 12 contacts is provided on one end side of the inner tubular portion 21, and a plurality of locking portions that lock the heat radiator 12 to the inner tubular portion 21 (resin housing 11). 29 are projected. In the present embodiment, the pair of locking portions 29 are arranged at both side positions in the direction intersecting (perpendicular to) the positions of the pair of holding groove portions 26 of the inner tubular portion 21. The locking portion 29 is provided in a snap fit structure. That is, the locking portion 29 has a locking piece 30 that is elastically deformable in the radial direction, and a claw portion 31 that projects outward from the tip of the locking piece 30 on the one end side. Slit-shaped groove portions 32 are provided on both sides of the locking piece 30, and one end side of the locking piece 30 is elastically deformable in the radial direction. The claw portion 31 has one end side provided on the inclined surface and the other end side provided on the locking surface substantially orthogonal to the central axis z. The tip of the locking portion 29 on the one end side is projected more than the one end side of the outer tubular portion 20.

内筒部21の一端側には、複数のねじ干渉防止用の切欠部33が設けられている。切欠部33は、保持溝部26と係止部29との間に配置されている。 A plurality of notches 33 for preventing screw interference are provided on one end side of the inner tubular portion 21. The cutout portion 33 is arranged between the holding groove portion 26 and the locking portion 29.

結合筒部22は、内筒部21と連続する円筒状に形成されており、外筒部20の他端側および内筒部21の他端側が一体に設けられている。結合筒部22の外周部には給電部16が螺着結合されている。結合筒部22の内面には、内筒部21の一対の保持溝部26が連続して形成されている。 The coupling cylinder part 22 is formed in a cylindrical shape continuous with the inner cylinder part 21, and the other end side of the outer cylinder part 20 and the other end side of the inner cylinder part 21 are integrally provided. The power feeding portion 16 is screwed and coupled to the outer peripheral portion of the coupling cylinder portion 22. A pair of holding groove portions 26 of the inner tubular portion 21 are continuously formed on the inner surface of the coupling tubular portion 22.

また、放熱体12は、例えばアルミニウム等の金属材料によって形成されている。放熱体12は、例えば１枚の円形の板金をプレス加工することによって一体に形成されている。放熱体12は、一端側の円板状の取付面部36、およびこの取付面部36の周辺部から他端側に向けて突出されている放熱筒部37を備えている。 The heat radiator 12 is formed of a metal material such as aluminum. The radiator 12 is integrally formed, for example, by pressing one circular sheet metal. The heat radiator 12 includes a disc-shaped mounting surface portion 36 on one end side, and a heat radiating cylinder portion 37 protruding from the peripheral portion of the mounting surface portion 36 toward the other end side.

取付面部36の中央領域には、開口部38が設けられている。開口部38の直径は、ランプ装置10（グローブ14）の最大直径の１／８以上である。本実施形態では、開口部38の直径は、取付面部36の直径の略１/２である。また、取付面部36の開口部38の内縁部には、開口部38を挿通して取付面部36の一端側に係止される樹脂筐体11の各係止部29がそれぞれ係合する複数の係合溝39が設けられている。取付面部36の各係合溝39の側部には、発光モジュール13を放熱体12に固定するための複数のねじ40が螺着する取付孔41が設けられている。各取付孔41の位置は、樹脂筐体11の内筒部21の各切欠部33の位置と対応されている。 An opening 38 is provided in the central region of the mounting surface portion 36. The diameter of the opening 38 is ⅛ or more of the maximum diameter of the lamp device 10 (the globe 14). In this embodiment, the diameter of the opening 38 is approximately ½ of the diameter of the mounting surface 36. In addition, a plurality of engaging portions 29 of the resin housing 11 that are inserted into the opening 38 of the mounting surface portion 36 and are engaged with the one end side of the mounting surface portion 36 are engaged with the inner edge portion of the opening portion 38. An engagement groove 39 is provided. A mounting hole 41 into which a plurality of screws 40 for fixing the light emitting module 13 to the heat radiator 12 are screwed is provided on a side portion of each engaging groove 39 of the mounting surface portion 36. The position of each mounting hole 41 corresponds to the position of each notch 33 of the inner cylinder 21 of the resin housing 11.

放熱筒部37の外周面は、一端側から他端側に亘って略同一径で、樹脂筐体11の接触面23の少なくとも一部に接触する接触面42が形成されている。 A contact surface 42 is formed on the outer peripheral surface of the heat radiating tube portion 37, which has substantially the same diameter from one end side to the other end side and is in contact with at least a part of the contact surface 23 of the resin housing 11.

また、発光モジュール13は、放熱体12の取付面部36の一端側の面に配置される。発光モジュール13は、モジュール基板45、このモジュール基板45に実装された複数の発光素子46および受電コネクタ47を備えている。 Further, the light emitting module 13 is arranged on the surface on one end side of the mounting surface portion 36 of the radiator 12. The light emitting module 13 includes a module board 45, a plurality of light emitting elements 46 mounted on the module board 45, and a power receiving connector 47.

モジュール基板45は、放熱体12の取付面部36と略同一径の円板状に形成されている。モジュール基板45の一端側の面に配線パターンが形成され、この配線パターン上に複数の発光素子46および受電コネクタ47が実装されている。モジュール基板45の中央領域には、樹脂筐体11の各係止部29が挿通して嵌り込む複数の孔部48が設けられ、モジュール基板45の各孔部48の側部に放熱体12の各取付孔41に螺着される各ねじ40が挿通する複数の挿通孔49が設けられ、さらに、受電コネクタ47が装着される装着孔50が設けられている。 The module substrate 45 is formed in a disc shape having substantially the same diameter as the mounting surface portion 36 of the radiator 12. A wiring pattern is formed on the surface on one end side of the module substrate 45, and the plurality of light emitting elements 46 and the power receiving connector 47 are mounted on the wiring pattern. A plurality of holes 48 into which the locking portions 29 of the resin housing 11 are inserted and fitted are provided in the central region of the module substrate 45, and the radiator 12 is provided on the side of each hole 48 of the module substrate 45. A plurality of insertion holes 49 through which the screws 40 screwed into the mounting holes 41 are inserted are provided, and a mounting hole 50 into which the power receiving connector 47 is mounted is also provided.

発光素子46は、半導体発光素子であり、表面実装形ＬＥＤが用いられている。発光素子46は、モジュール基板45の孔部48や挿通孔49よりも外周側となるモジュール基板45の周辺部に沿って所定の間隔をあけて実装されている。そして、発光モジュール13が放熱体12の取付面部36の一端側の面に配置された状態で、モジュール基板45の周辺部に実装される発光素子46は、放熱体12の取付面部36上に位置され、つまりモジュール基板45を挟んで放熱体12の取付面部36に対向するように位置される。なお、発光素子46は、例えば有機ＥＬなどの他の発光素子を用いてもよい。 The light emitting element 46 is a semiconductor light emitting element, and a surface mount LED is used. The light emitting elements 46 are mounted at predetermined intervals along the peripheral portion of the module substrate 45, which is on the outer peripheral side of the hole portion 48 and the insertion hole 49 of the module substrate 45. Then, the light emitting element 46 mounted on the peripheral portion of the module substrate 45 is located on the mounting surface portion 36 of the heat radiator 12 in a state where the light emitting module 13 is arranged on the surface on one end side of the mounting surface portion 36 of the heat radiator 12. That is, the module board 45 is sandwiched between the mounting surface portion 36 of the radiator 12 and the mounting surface portion 36. The light emitting element 46 may be another light emitting element such as an organic EL.

受電コネクタ47は、発光素子46よりも内側となるモジュール基板45の中央領域に実装されている。受電コネクタ47は、モジュール基板45の装着孔50に装着される樹脂製のコネクタ本体51、およびこのコネクタ本体51に保持され電源部15の一対の給電ピンが差し込まれて電気的に接続される一対の受電端子52を備えている。 The power receiving connector 47 is mounted in the central area of the module substrate 45, which is inside the light emitting element 46. The power receiving connector 47 is made of a resin-made connector main body 51 mounted in the mounting hole 50 of the module substrate 45, and a pair which is held by the connector main body 51 and into which a pair of power supply pins of the power supply unit 15 are inserted to be electrically connected. The power receiving terminal 52 is provided.

また、グローブ14は、光透過性および光拡散性を有し、例えばポリカーボネイトなどの樹脂やガラスなどの材料で形成されている。グローブ14は、一端側が一般白熱電球と同様の球形に形成されているとともに他端側が開口されている。グローブ14の他端側には樹脂筐体11の外筒部20の嵌合溝24に嵌合される嵌合部55が設けられ、この嵌合部55の外周には外筒部20の連結突起25に係合する連結溝56が形成されている。 Further, the globe 14 has a light-transmitting property and a light-diffusing property, and is made of a material such as resin such as polycarbonate or glass. One end side of the globe 14 is formed in a spherical shape similar to a general incandescent light bulb, and the other end side is opened. The other end of the globe 14 is provided with a fitting portion 55 that fits into the fitting groove 24 of the outer tubular portion 20 of the resin housing 11, and the outer tubular portion 20 is connected to the outer periphery of the fitting portion 55. A connecting groove 56 that engages with the protrusion 25 is formed.

また、電源部15は、給電部16から入力する交流電源などの外部電源を発光素子46が発光する直流電源などの点灯電源に変換して発光モジュール13に供給する。電源部15は、電源基板60、この電源基板60に実装された複数の電源部品（電子部品）61および給電コネクタ62を備えている。なお、図面には、１つの電源部品61を示し、他の電源部品61は省略している。 Further, the power supply unit 15 converts an external power supply such as an AC power supply input from the power supply unit 16 into a lighting power supply such as a DC power supply that causes the light emitting element 46 to emit light and supplies the lighting power supply to the light emitting module 13. The power supply unit 15 includes a power supply board 60, a plurality of power supply components (electronic parts) 61 mounted on the power supply board 60, and a power feeding connector 62. In the drawing, one power supply component 61 is shown and the other power supply components 61 are omitted.

電源基板60は、中心軸ｚに沿った方向を長手方向とする略長方形状に形成されている。電源基板60は、樹脂筐体11の結合筒部22の他端側から一対の保持溝部26間に挿入され、内筒部21の内側に配置されている。すなわち、電源基板60は、内筒部21の内側に軸方向に沿って配置されているとともに、電源基板60の面に沿った方向が係止部29の位置に対して交差するように配置されている。そして、電源部15に設けられる外部電源入力部が図示しない入力用配線によって給電部16に電気的に接続され、電源部15に設けられる点灯電源出力部に給電コネクタ62に電気的に接続されている。 The power supply board 60 is formed in a substantially rectangular shape whose longitudinal direction is along the central axis z. The power supply board 60 is inserted between the pair of holding groove portions 26 from the other end side of the coupling cylinder portion 22 of the resin housing 11 and is arranged inside the inner cylinder portion 21. That is, the power supply board 60 is arranged inside the inner cylindrical portion 21 along the axial direction, and is arranged so that the direction along the surface of the power supply board 60 intersects with the position of the locking portion 29. ing. Then, the external power supply input section provided in the power supply section 15 is electrically connected to the power supply section 16 by an input wiring (not shown), and the lighting power supply output section provided in the power supply section 15 is electrically connected to the power supply connector 62. There is.

給電コネクタ62は、電源基板60の一端側に実装されている。給電コネクタ62は、樹脂製のコネクタ本体63、およびこのコネクタ本体63から一端側へ向けて突出する一対の給電ピン64を有している。一対の給電ピン64は、受電コネクタ47の一対の受電端子52に差し込まれて電気的に接続される。電源部15が樹脂筐体11に組み込まれた状態で、給電ピン64の一端側が係止部29よりも突出する。 The power supply connector 62 is mounted on one end side of the power supply board 60. The power supply connector 62 has a resin-made connector main body 63 and a pair of power supply pins 64 protruding from the connector main body 63 toward one end side. The pair of power feeding pins 64 are inserted into the pair of power receiving terminals 52 of the power receiving connector 47 to be electrically connected. With the power supply unit 15 incorporated in the resin casing 11, one end side of the power supply pin 64 projects beyond the locking unit 29.

また、給電部16は、樹脂筐体11の他端側であって結合筒部22の周囲に取り付けられている。給電部16は、例えばＥ１７やＥ２６などの一般照明に用いられる白熱電球用のソケットに接続可能な口金が用いられている。なお、給電部16は、口金に限らず、ランプ種類によっては一対のピンなどでもよい。 Further, the power feeding section 16 is attached to the other end side of the resin housing 11 and around the coupling cylinder section 22. As the power feeding unit 16, for example, a base that can be connected to a socket for an incandescent lamp used for general lighting such as E17 and E26 is used. The power supply unit 16 is not limited to the base and may be a pair of pins or the like depending on the type of lamp.

次に、ランプ装置10の組み立てについて説明する。 Next, assembly of the lamp device 10 will be described.

樹脂筐体11の他端側から電源部15を挿入する。このとき、電源基板60の両側部を内筒部21の保持溝部26に沿って挿入し、電源基板60の一端部をストッパ部27に押し当てて、電源部15を樹脂筐体11に位置決め配置する。 The power supply unit 15 is inserted from the other end side of the resin housing 11. At this time, both sides of the power supply board 60 are inserted along the holding groove portions 26 of the inner cylinder portion 21, one end of the power supply board 60 is pressed against the stopper portion 27, and the power supply portion 15 is positioned and arranged in the resin casing 11. To do.

樹脂筐体11の一端側から、樹脂筐体11の外筒部20の内側に放熱体12の放熱筒部37を挿入する。このとき、樹脂筐体11の内筒部21から突出する各係止部29の位置に放熱体12の各係合溝39の位置を合せて挿入することにより、各係止部29が取付面部36の各係合溝39を挿通し、各係止部29の爪部31が取付面部36を乗り越えて取付面部36の一端側の面に係止されるとともに、内筒部21の当接面28が取付面部36の他端側の面に当接し、樹脂筐体11に放熱体12が固定される。そして、樹脂筐体11の各係止部29が放熱体12の各係合溝39に挿通して嵌り込むことにより、樹脂筐体11に対して放熱体12の周方向の位置が位置決めされる。樹脂筐体11の外筒部20の内周面（接触面23）と放熱体12の放熱筒部37の外周面（接触面42）との少なくとも一部が接触する。また、放熱体12の取付面部36の一端側の面から、樹脂筐体11の各係止部29が突出されるとともに、電源部15の給電コネクタ62の給電ピン64が放熱体12の取付面部36の開口部38を通じて突出される。 The heat radiating cylinder portion 37 of the heat radiating body 12 is inserted from the one end side of the resin housing 11 into the outer cylinder portion 20 of the resin housing 11. At this time, by inserting the engaging grooves 39 of the radiator 12 in the positions of the engaging portions 29 protruding from the inner tubular portion 21 of the resin casing 11, the engaging portions 29 are attached to the mounting surface portions. The engaging groove 39 of 36 is inserted, the claw portion 31 of each locking portion 29 goes over the mounting surface portion 36 and is locked to the surface on one end side of the mounting surface portion 36, and the contact surface of the inner cylindrical portion 21. 28 abuts on the other end side surface of the mounting surface section 36, and the radiator 12 is fixed to the resin housing 11. Then, the locking portions 29 of the resin housing 11 are inserted into and fitted into the respective engaging grooves 39 of the heat radiator 12, whereby the circumferential position of the heat radiator 12 is positioned with respect to the resin housing 11. .. At least a part of the inner peripheral surface (contact surface 23) of the outer tubular portion 20 of the resin housing 11 and the outer peripheral surface (contact surface 42) of the heat radiating tubular portion 37 of the radiator 12 are in contact with each other. Further, each locking portion 29 of the resin housing 11 is projected from the surface on one end side of the mounting surface portion 36 of the heat radiator 12, and the power feeding pin 64 of the power feeding connector 62 of the power source portion 15 is mounted on the heat radiation body 12. It is projected through the opening 38 of 36.

放熱体12の取付面部36の一端側に発光モジュール13を配置する。このとき、発光モジュール13の受電コネクタ47を給電ピン64の位置を合せて、受電コネクタ47に給電ピン64を差し込み、さらに、モジュール基板45の各孔部48を各係止部29の位置に合せて、各孔部48に各係止部29を嵌め込む。 The light emitting module 13 is arranged on one end side of the mounting surface portion 36 of the radiator 12. At this time, the power receiving connector 47 of the light emitting module 13 is aligned with the power feeding pin 64, the power feeding pin 64 is inserted into the power receiving connector 47, and each hole 48 of the module substrate 45 is aligned with the position of each locking portion 29. Then, each locking portion 29 is fitted into each hole portion 48.

各ねじ40をモジュール基板45の各挿通孔49を通じて放熱体12の取付面部36の各取付孔41に螺着し、モジュール基板45を放熱体12の取付面部36に締め付けて固定する。このとき、１つのねじ40を締め付ける際に、モジュール基板45に回転力が加わって動くと、受電コネクタ47に接続されている給電コネクタ62の給電ピン64に負荷が加わり、電気的な接続に影響が生じるおそれがあるが、モジュール基板45の各孔部48に樹脂筐体11の各係止部29が嵌り込んでいて、モジュール基板45の動きが規制されているため、給電ピン64に負荷が加わるのを防止でき、電気的な接続の信頼性を確保できる。 Each screw 40 is screwed into each mounting hole 41 of the mounting surface portion 36 of the radiator 12 through each insertion hole 49 of the module substrate 45, and the module substrate 45 is tightened and fixed to the mounting surface portion 36 of the radiator 12. At this time, when the one screw 40 is tightened and the module substrate 45 moves due to a rotational force, a load is applied to the power feeding pin 64 of the power feeding connector 62 connected to the power receiving connector 47, which affects the electrical connection. However, since the respective locking portions 29 of the resin housing 11 are fitted in the respective hole portions 48 of the module board 45 and the movement of the module board 45 is restricted, a load is applied to the power supply pin 64. It is possible to prevent it from being added and to ensure the reliability of the electrical connection.

なお、樹脂筐体11に放熱体12を取り付け、この放熱体12に発光モジュール13をねじ40で固定した後、樹脂筐体11に電源部15を組み込んでもよい。この場合、電源部15の電源基板60の両側部を樹脂筐体11の内筒部21の保持溝部26に沿って挿入することにより、給電コネクタ62の給電ピン64が受電コネクタ47の受電端子52に自動的に差し込まれて電気的に接続され、組立性がよい。 The radiator 12 may be attached to the resin casing 11, the light emitting module 13 may be fixed to the radiator 12 with the screw 40, and then the power supply unit 15 may be incorporated in the resin casing 11. In this case, by inserting both sides of the power supply board 60 of the power supply section 15 along the holding groove section 26 of the inner cylindrical section 21 of the resin housing 11, the power supply pin 64 of the power supply connector 62 is made to connect to the power reception terminal 52 of the power reception connector 47. It is automatically plugged in and electrically connected, and it is easy to assemble.

そして、樹脂筐体11の嵌合溝24に接着剤を充填する。接着剤の一部は、樹脂筐体11の外筒部20と放熱体12の放熱筒部37との間の隙間に入り込み、これら外筒部20と放熱筒部37とを機械的に固定するとともに熱的に接続する。 Then, the fitting groove 24 of the resin casing 11 is filled with an adhesive. A part of the adhesive enters the gap between the outer tube portion 20 of the resin housing 11 and the heat radiating tube portion 37 of the radiator 12 to mechanically fix the outer tube portion 20 and the heat radiating tube portion 37. And thermally connect with.

樹脂筐体11の嵌合溝24にグローブ14の嵌合部55を挿入し、樹脂筐体11の複数の連結突起25に嵌合部55の連結溝56を係合する。さらに、樹脂筐体11の嵌合溝24とグローブ14の嵌合部55との間に接着剤が回り込み、これら樹脂筐体11とグローブ14とを接着固定する。 The fitting portion 55 of the globe 14 is inserted into the fitting groove 24 of the resin housing 11, and the connecting grooves 56 of the fitting portion 55 are engaged with the plurality of connecting protrusions 25 of the resin housing 11. Further, an adhesive agent wraps around between the fitting groove 24 of the resin housing 11 and the fitting portion 55 of the globe 14 to bond and fix the resin housing 11 and the globe 14 together.

樹脂筐体11の結合筒部22に給電部16を取り付けるとともに、給電部16と電源部15とを電気的に接続し、ランプ装置10の組み立てが完了とする。 The power supply section 16 is attached to the coupling cylinder section 22 of the resin housing 11, and the power supply section 16 and the power supply section 15 are electrically connected, and the assembly of the lamp device 10 is completed.

なお、ランプ装置10の組立順序は、このような順序に限定されるものではない。 The order of assembling the lamp device 10 is not limited to such an order.

次に、図４には、ランプ装置10を使用する照明装置70の断面図を示す。照明装置70は、例えばダウンライトであり、器具本体71、この器具本体71内に設けられたソケット72および反射体73を備えている。ランプ装置10の給電部16がソケット72に接続される。 Next, FIG. 4 shows a sectional view of a lighting device 70 using the lamp device 10. The lighting device 70 is, for example, a downlight, and includes a tool body 71, a socket 72 provided in the tool body 71, and a reflector 73. The power supply unit 16 of the lamp device 10 is connected to the socket 72.

そして、外部電源がソケット72を通じてランプ装置10に供給されると、電源部15が外部電源を所定の点灯電源に変換して発光モジュール13に供給する。これにより、発光モジュール13の複数の発光素子46が発光し、これら発光素子46からの光がグローブ14を透過して外部へ出射される。 When the external power source is supplied to the lamp device 10 through the socket 72, the power source unit 15 converts the external power source into a predetermined lighting power source and supplies it to the light emitting module 13. As a result, the plurality of light emitting elements 46 of the light emitting module 13 emit light, and the light from these light emitting elements 46 passes through the globe 14 and is emitted to the outside.

発光素子46が発生する熱は、主に、モジュール基板45から放熱体12の取付面部36に伝達され、この取付面部36の周辺部から放熱筒部37に伝達され、この放熱筒部37から樹脂筐体11の外筒部20に伝達され、外筒部20の外周面から空気中に放熱される。 The heat generated by the light emitting element 46 is mainly transferred from the module substrate 45 to the mounting surface portion 36 of the radiator 12, the heat is transferred from the peripheral portion of the mounting surface portion 36 to the heat radiating cylinder portion 37, and the heat radiating cylinder portion 37 is used for resin. The heat is transmitted to the outer tubular portion 20 of the housing 11 and radiated from the outer peripheral surface of the outer tubular portion 20 into the air.

このとき、放熱体12の放熱筒部37が略同一径の円筒状に形成されているため、給電部16側が径小となる場合に比べて、体積が大きく、発光素子46の熱を受収する熱容量が増加し、さらに、放熱筒部37の外周面の表面積が大きく、放熱筒部37から外筒部20に効率よく熱が伝わり、しかも、放熱筒部37の外側に配置される樹脂筐体11の外筒部20の表面積も大きく、樹脂筐体11からの放熱性も向上する。 At this time, since the heat radiating cylinder portion 37 of the heat radiating body 12 is formed in a cylindrical shape having substantially the same diameter, the heat radiating element 46 has a larger volume and receives the heat of the light emitting element 46 as compared with the case where the power feeding portion 16 side has a small diameter. The heat capacity increases, the surface area of the outer peripheral surface of the heat radiating cylinder part 37 is large, heat is efficiently transferred from the heat radiating cylinder part 37 to the outer cylinder part 20, and moreover, the resin housing is arranged outside the heat radiating cylinder part 37. The surface area of the outer cylindrical portion 20 of 11 is large, and the heat dissipation from the resin housing 11 is also improved.

このように構成された本実施形態のランプ装置10は、放熱体12の取付面部36の中央に開口部38を設けているため、放熱体12の材料使用量を削減でき、しかも、樹脂筐体11の内筒部21に設けた係止部29が開口部38を挿通して放熱体12の取付面部36に係止することができ、組立性を向上できる。したがって、放熱体12の放熱性を確保しつつ材料使用量を削減した構造とするとともに組立性を向上できるランプ装置10を提供できる。 In the thus configured lamp device 10 of the present embodiment, since the opening 38 is provided at the center of the mounting surface portion 36 of the heat radiator 12, the amount of material used for the heat radiator 12 can be reduced, and moreover, the resin housing can be used. The locking portion 29 provided on the inner cylindrical portion 21 of 11 can be inserted into the opening portion 38 and locked to the mounting surface portion 36 of the radiator 12, thereby improving the assembling property. Therefore, it is possible to provide the lamp device 10 which has a structure in which the amount of material used is reduced while ensuring the heat dissipation of the heat radiator 12 and which can improve the assembling property.

さらに、放熱体12の放熱筒部37は、略同一径の円筒状に形成されているため、給電部16側を小径に形成する場合に比べて、放熱体12の製造を容易にできる。しかも、放熱筒部37の表面積が大きくなり、放熱筒部37から樹脂筐体11の外筒部20への熱の伝達性を向上できる。さらに、放熱筒部37の外側に配置される樹脂筐体11の外筒部20の表面積も大きくなるため、樹脂筐体11からの放熱性も向上できる。 Further, since the heat radiating cylinder portion 37 of the heat radiating body 12 is formed in a cylindrical shape having substantially the same diameter, the heat radiating body 12 can be manufactured more easily than when the power feeding portion 16 side is formed to have a small diameter. Moreover, the surface area of the heat radiating cylinder portion 37 is increased, and the heat transfer property from the heat radiating cylinder portion 37 to the outer cylinder portion 20 of the resin housing 11 can be improved. Furthermore, since the surface area of the outer tubular portion 20 of the resin housing 11 arranged outside the heat radiating tubular portion 37 also becomes large, the heat radiation from the resin housing 11 can be improved.

また、放熱体12の取付面部36の一端側の面に配置されるモジュール基板45は、取付面部36に係止する係止部29が嵌り込む孔部48を有するため、樹脂筐体11に対するモジュール基板45の位置決めおよび不要な動きを規制できる。しかも、取付面部36に係止する係止部29がモジュール基板45の孔部48に嵌り込むことにより、係止部29が取付面部36から外れないように保持することができる。 Further, since the module substrate 45 arranged on the one end side surface of the mounting surface portion 36 of the heat radiator 12 has the hole portion 48 into which the locking portion 29 that locks to the mounting surface portion 36 is fitted, the module substrate 45 is mounted on the resin housing 11. Positioning of the substrate 45 and unnecessary movement can be restricted. Moreover, the locking portion 29 that locks to the mounting surface portion 36 fits into the hole portion 48 of the module substrate 45, so that the locking portion 29 can be held so as not to come off the mounting surface portion 36.

さらに、モジュール基板45の周辺部に実装される発光素子46は、放熱体12の取付面部36上に位置され、つまりモジュール基板45を挟んで放熱体12の取付面部36に対向するように位置されるため、発光素子46が発生する熱をモジュール基板45を通じて放熱体12の取付面部36に効率よく伝達することができ、取付面部36の中央に開口部38を設けていても、発光素子46の放熱性を確保できる。 Further, the light emitting element 46 mounted on the peripheral portion of the module board 45 is positioned on the mounting surface section 36 of the heat radiator 12, that is, is positioned so as to face the mounting surface section 36 of the heat radiator 12 with the module board 45 interposed therebetween. Therefore, the heat generated by the light emitting element 46 can be efficiently transmitted to the mounting surface portion 36 of the radiator 12 through the module substrate 45, and even if the opening portion 38 is provided at the center of the mounting surface portion 36, Heat dissipation can be secured.

さらに、モジュール基板45の周辺部に発光素子46を実装し、発光素子46よりも内周側（内径側）にねじ40や受電コネクタ47などを配置しているため、発光素子46の発光によってねじ40や受電コネクタ47などの影がグローブ14に生じるのを防止できる。 Further, the light emitting element 46 is mounted on the periphery of the module substrate 45, and the screw 40, the power receiving connector 47, and the like are arranged on the inner peripheral side (inner diameter side) of the light emitting element 46. It is possible to prevent shadows such as 40 and the power receiving connector 47 from being generated on the globe 14.

また、電源部15の電源基板60は、内筒部21の内側に軸方向に沿って配置されているとともに、電源基板60の面に沿った方向が内筒部21の係止部29の位置に対して交差する位置に配置されているため、係止部29を電源基板60の配置に影響なく設けることができるとともに、放熱体12の取付面部36に係止される係止部29の係止動作に影響ない配置とすることができる。 Further, the power supply substrate 60 of the power supply unit 15 is arranged inside the inner tubular portion 21 along the axial direction, and the direction along the surface of the power supply substrate 60 is the position of the locking portion 29 of the inner tubular portion 21. Since the locking portion 29 is provided at a position intersecting with, the locking portion 29 can be provided without affecting the arrangement of the power supply board 60, and the locking portion 29 that is locked to the mounting surface portion 36 of the radiator 12 can be engaged. It can be arranged so as not to affect the stopping operation.

なお、放熱体12の取付面部36の開口部38の外径は、発光モジュール13の発光素子46の実装位置に対応する範囲内で、もっと大きくてもよく、例えば係合溝39の外径側と同じ位置まで大きくしてもよい。この場合、内筒部21の一端側の端面は取付面部36に当接せず、樹脂筐体11に対する放熱体12の挿入位置を規制しないが、放熱体12の放熱筒部37の他端側の先端部を樹脂筐体11に当て、樹脂筐体11に対する放熱体12の挿入位置を規制するようにしてもよい。 The outer diameter of the opening 38 of the mounting surface portion 36 of the heat radiator 12 may be larger within a range corresponding to the mounting position of the light emitting element 46 of the light emitting module 13, for example, the outer diameter side of the engaging groove 39. May be enlarged to the same position as. In this case, the end surface on the one end side of the inner tubular portion 21 does not contact the mounting surface portion 36 and does not regulate the insertion position of the radiator 12 with respect to the resin housing 11, but the other end side of the radiator tubular portion 37 of the radiator 12 The tip portion of may be applied to the resin casing 11 to regulate the insertion position of the radiator 12 with respect to the resin casing 11.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the scope of equivalents thereof.

10 ランプ装置
11 樹脂筐体
12 放熱体
13 発光モジュール
15 電源部
16 給電部
20 外筒部
21 内筒部
29 係止部
36 取付面部
37 放熱筒部
38 開口部
45 モジュール基板
46 発光素子
48 孔部
60 電源基板
61 電源部品
70 照明装置
72 ソケット 10 lamp device
11 Resin case
12 Heat sink
13 Light emitting module
15 power supply
16 power supply
20 Outer cylinder
21 Inner tube
29 Locking part
36 Mounting surface
37 Radiator tube
38 opening
45 module board
46 Light emitting element
48 holes
60 power board
61 power supply parts
70 lighting equipment
72 socket

Claims (4)

モジュール基板、およびこのモジュール基板に実装された発光素子を有する発光モジュールと；
一端側の面に前記発光モジュールを取り付ける取付面部、この取付面部の中央に設けられた開口部、および前記取付面部の周辺部から他端側に向けて突設された放熱筒部を有する放熱体と；
前記放熱体の前記放熱筒部の外側に配置される外筒部、前記放熱体の前記放熱筒部の内方に配置される内筒部、およびこの内筒部の一端側から突設され前記開口部を挿通して前記取付面部の一端側に係止された係止部を有する樹脂筐体と；
前記樹脂筐体の他端側に設けられる給電部と；
を具備することを特徴とするランプ装置。 A module substrate, and a light emitting module having a light emitting element mounted on the module substrate;
A radiator having a mounting surface portion for mounting the light emitting module on a surface on one end side, an opening portion provided in the center of the mounting surface portion, and a heat dissipation tube portion protruding from the peripheral portion of the mounting surface portion toward the other end side. When;
An outer cylinder portion arranged outside the heat radiation cylinder portion of the heat radiator, an inner cylinder portion arranged inside of the heat radiation cylinder portion of the heat radiator, and projecting from one end side of the inner cylinder portion. A resin housing having a locking portion which is inserted through the opening and is locked to one end side of the mounting surface portion;
A power supply unit provided on the other end side of the resin casing;
A lamp device comprising: 前記モジュール基板は、前記係止部が嵌り込む孔部を有する
ことを特徴とする請求項１記載のランプ装置。 The lamp device according to claim 1, wherein the module substrate has a hole into which the locking portion is fitted. 電源基板、およびこの電源基板に実装された電源部品を有する電源部を具備し、
前記電源基板は、前記内筒部の内側に軸方向に沿って配置されているとともに、前記電源基板の面に沿った方向が前記係止部の位置に対して交差する位置に配置されている
ことを特徴とする請求項１または２記載のランプ装置。 A power supply board, and a power supply unit having a power supply component mounted on the power supply board,
The power supply board is arranged inside the inner cylindrical portion along the axial direction, and is arranged at a position where a direction along the surface of the power supply board intersects with the position of the locking portion. The lamp device according to claim 1, wherein the lamp device is a lamp device. 請求項１ないし３いずれか一記載のランプ装置と；
前記ランプ装置の前記給電部を接続するソケットと；
ことを特徴とする照明装置。 A lamp device according to any one of claims 1 to 3;
A socket for connecting the power supply unit of the lamp device;
A lighting device characterized by the above.
JP2019009463A 2019-01-23 2019-01-23 Lamp device and lighting device Pending JP2020119739A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019009463A JP2020119739A (en) 2019-01-23 2019-01-23 Lamp device and lighting device

Publications (1)

Publication Number Publication Date
JP2020119739A true JP2020119739A (en) 2020-08-06

Family

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Family Applications (1)

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Country Link
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