JP2020116654A - Method for processing waveguide - Google Patents

Abstract

To provide a method for processing a waveguide which hardly causes defects such as cracking and chipping.SOLUTION: A method for processing a waveguide that cuts a cylindrical waveguide having a hollow part therein into a predetermined length using an annular cutting blade in which abrasive grains are fixed by a binding material includes: a resin filling step of filling the hollow part of the waveguide with a resin; a cutting step of allowing a rotated cutting blade to cut into the waveguide filled with the resin, and cutting the waveguide together with the resin; and a resin removal step of removing the resin filling the cut waveguide.SELECTED DRAWING: Figure 1

Description

The present invention relates to a waveguide processing method used when processing a hollow-structured waveguide.

For the transmission of microwaves, for example, a tubular waveguide formed of a conductive material in a hollow shape is used. The area inside the waveguide is usually filled with air. That is, unlike the coaxial cable in which the inner conductor is arranged inside the outer conductor formed in a tubular shape with the dielectric interposed therebetween, the inner conductor does not exist in the region inside the waveguide.

Therefore, if this waveguide is used, it becomes possible to appropriately transmit high-power microwaves that cannot be appropriately transmitted by the coaxial cable due to the resistance of the inner conductor. Further, by using this waveguide, it becomes possible to transmit a microwave having a high frequency, which causes a large loss in the dielectric between the inner conductor and the outer conductor, with a low loss.

By the way, when a waveguide having a predetermined length is divided into a plurality of short waveguides, an annular cutting blade in which abrasive grains such as diamond are fixed by a bonding material such as metal (see, for example, Patent Document 1). ) Is used. By rotating the cutting blade at a high speed and cutting it at the planned cutting position of the waveguide, it is possible to cut out a short waveguide having an arbitrary length.

JP, 2010-129623, A

By the way, since the waveguide is hollow, its rigidity is not necessarily high. Therefore, if the cutting blade rotated at high speed is directly cut into the waveguide, the waveguide bends or vibrates due to the force applied from the cutting blade, and defects such as cracks and chips are likely to occur. ..

The present invention has been made in view of such problems, and an object thereof is to provide a method of processing a waveguide in which defects such as cracks and chips are less likely to occur.

According to one aspect of the present invention, an annular cutting blade in which abrasive grains are fixed with a binder is used to cut a tubular waveguide having a hollow portion inside to a predetermined length. A method of processing, comprising a resin filling step of filling a resin into the hollow portion of the waveguide, and cutting the rotated cutting blade into the waveguide filled with the resin. There is provided a method of processing a waveguide, including a cutting step of cutting the resin together with the resin, and a resin removing step of removing the resin filled in the cut waveguide.

In the method of processing a waveguide according to an aspect of the present invention, after filling the hollow portion of the waveguide with resin, the rotating cutting blade is cut to cut the waveguide together with the resin. The resin filled in the waveguide makes it difficult for the waveguide to be deformed, and suppresses bending and vibration of the waveguide when the cutting blade is cut. That is, according to the method of processing a waveguide according to one aspect of the present invention, defects such as cracks and chips due to bending and vibration of the waveguide are less likely to occur.

FIG. 1(A) is a perspective view showing the appearance of a cylindrical waveguide, and FIG. 1(B) shows how a cylindrical waveguide is filled with resin in a resin filling step. FIG. 1C is a perspective view showing a cylindrical waveguide filled with resin. FIG. 2(A) is a side view showing how the waveguide is cut in the cutting step, and FIG. 2(B) is a side view showing the state shown in FIG. 2(A) from another direction. Is. FIG. 3(A) is a perspective view showing the appearance of a rectangular tube-shaped waveguide, and FIG. 3(B) fills the rectangular tube-shaped waveguide with resin in the resin filling step. FIG. 3C is a perspective view showing a state, and FIG. 3C is a perspective view showing a rectangular tube-shaped waveguide filled with resin.

An embodiment according to an aspect of the present invention will be described with reference to the accompanying drawings. The method of processing a waveguide according to this embodiment includes a resin filling step (see FIGS. 1B and 1C), a cutting step (see FIGS. 2A and 2B), and a resin. Includes a removal step.

In the resin filling step, the tubular waveguide is filled with resin. In the cutting step, the resin-filled waveguide is cut with the rotated cutting blade to cut the waveguide together with the resin. In the resin removing step, the resin filled in the cut waveguide is removed. Hereinafter, the method of processing the waveguide according to this embodiment will be described in detail.

FIG. 1A is a perspective view showing the appearance of the waveguide 1 used in this embodiment. As shown in FIG. 1A, the waveguide 1 is formed of a conductive material into a cylindrical shape, and has a cylindrical hollow portion (space) 1a inside. The conductive material forming the waveguide 1 is, for example, a metal such as copper or aluminum. However, the conductive material is not particularly limited, and ceramics or the like to which conductivity is imparted may be used.

The thickness of the waveguide 1 is substantially uniform over the entire waveguide 1. That is, the cylindrical hollow portion 1 a is arranged substantially concentrically with the cylindrical waveguide 1. The outer diameter (diameter) a1 of the waveguide 1 is, for example, about 3 mm to 7 mm, typically 5 mm, and the inner diameter (diameter) a2 of the waveguide 1 is, for example, about 1 mm to 5 mm, typical. Is 3 mm.

The thickness of the waveguide 1 is represented by (outer diameter a1−inner diameter a2)/2. Therefore, for example, when the outer diameter a1 is 5 mm and the inner diameter a2 is 3 mm, the wall thickness is 1 mm. The length of the waveguide 1 (the length corresponding to the cylindrical height) is at least long enough to cut the waveguide 1 to obtain a plurality of short waveguides.

In the waveguide processing method according to the present embodiment, first, a resin filling step of filling the hollow portion 1a of the waveguide 1 with a resin is performed. FIG. 1B is a perspective view showing a state where the resin 1 is filled in the waveguide 1 in the resin filling step, and FIG. 1C is a perspective view showing the waveguide 1 filled with the resin 3. It is a figure.

As shown in FIG. 1B, in the resin filling step according to the present embodiment, a cylindrical resin (resin material) 3 is inserted into the hollow portion 1 a of the waveguide 1. As a result, as shown in FIG. 1C, the hollow portion 1a of the waveguide 1 is filled with the resin 3. The outer diameter a3 of the resin 3 is the same as the inner diameter of the waveguide 1 or slightly smaller than the inner diameter of the waveguide 1, and is, for example, about 1 mm to 5 mm, typically 3 mm.

It is desirable that the length of the resin 3 be approximately the same as or longer than the length of the waveguide 1. Thereby, the hollow portion 1a can be filled with the resin 3 over the entire length of the waveguide 1. However, the length of the resin 3 may be slightly shorter than that of the waveguide 1.

It should be noted that the resin 3 may be added with a filler or the like having an effect (dressing effect) of adjusting the sharpness of a cutting blade used in a subsequent cutting step. In this case, it is possible to maintain the cutting performance of the cutting blade during the cutting of the waveguide 1 and further reduce the possibility that defects such as cracks and chips will occur.

Further, in the resin filling step according to the present embodiment, the cylindrical resin 3 corresponding to the shape of the hollow portion 1a of the waveguide 1 is inserted into the hollow portion 1a of the waveguide 1, but a liquid material is used. The hollow portion 1a of the waveguide 1 can be filled with a resin by a method of introducing the resin into the hollow portion 1a and curing it. In this case, as the liquid material, for example, a thermosetting resin or a photocuring resin may be used.

After the resin filling step, a cutting step of cutting the resin-filled waveguide 1 together with the resin 3 is performed. FIG. 2(A) is a side view showing how the waveguide 1 is cut in the cutting step, and FIG. 2(B) is a side view showing the state shown in FIG. 2(A) from another direction. It is a figure. This cutting step is performed using, for example, the cutting device 2 shown in FIGS. 2(A) and 2(B).

The cutting device 2 includes a chuck table 4 for holding the waveguide 1. The chuck table 4 includes, for example, a cylindrical frame body (not shown) made of a metal material typified by stainless steel, and a holding plate (not shown) made of a porous material and arranged above the frame body. .. The frame is connected to a rotary drive source (not shown) such as a motor. The chuck table 4 is rotated by a force generated by the rotary drive source about a rotation axis that is substantially perpendicular to the upper surface of the holding plate (generally parallel to the vertical direction).

Further, the frame body is supported by a machining feed mechanism (not shown). The chuck table 4 is moved by this machining feed mechanism in a machining feed direction substantially parallel to the upper surface of the holding plate. Further, the lower surface side of the holding plate is connected to a suction source via a flow path (not shown) provided inside the frame.

A cutting unit 6 is arranged above the chuck table 4. The cutting unit 6 includes a spindle 8 that serves as a rotation axis that is substantially parallel to the upper surface of the holding plate. An annular cutting blade 10 in which abrasive grains such as diamond are fixed by a binding material such as metal is attached to one end of the spindle 8.

A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 8, and the cutting blade 10 mounted on one end side of the spindle 8 rotates by the force generated by the rotary drive source. The spindle 8 is supported by an elevating mechanism (not shown) and an indexing feed mechanism (not shown). The cutting unit 6 is moved in the vertical direction substantially perpendicular to the upper surface of the holding plate by this elevating mechanism, and is moved in the indexing feeding direction substantially perpendicular to the vertical direction and the machining feeding direction by the indexing feeding mechanism.

In the cutting step, first, the waveguide 1 is held by the chuck table 4. Specifically, as shown in FIGS. 2A and 2B, the waveguide 1 is attached to the adhesive surface side of the adhesive tape 11 having a size that covers the upper surface of the holding plate. Then, the non-adhesive surface of the adhesive tape 11 is brought into contact with the upper surface of the holding plate, and the negative pressure of the suction source is applied to the holding plate. As a result, the waveguide 1 is held on the chuck table 4 via the adhesive tape 11.

A plate-like member that defines the position of the waveguide 1 with respect to the adhesive tape 11 may be attached to a position of the adhesive tape 11 adjacent to the waveguide 1. This makes it possible to prevent the position shift of the waveguide 1 during processing. As the plate-shaped member, for example, a carbon member that does not hinder the processing of the waveguide 1 by the cutting blade 10 is used.

After holding the waveguide 1 on the chuck table 4, the rotating cutting blade 10 is cut into the waveguide 1. Specifically, first, the direction of the chuck table 4 (direction around the rotation axis) is adjusted by a rotary drive source so that the length direction of the waveguide 1 and the machining feed direction of the chuck table 4 are substantially perpendicular to each other. ..

Next, the relative position between the chuck table 4 and the cutting unit 6 is adjusted by the machining feed mechanism and the index feed mechanism, and the cutting blade is placed at a predetermined position away from the planned cutting position of the waveguide 1 in the machining feed direction. Position 10. Further, the height of the cutting unit is adjusted by the elevating mechanism, and the lower end of the cutting blade 10 is positioned at a position lower than the upper surface (adhesive surface) of the adhesive tape 11 and higher than the upper surface of the chuck table 4.

After that, the chuck table 4 is moved in the machining feed direction while rotating the cutting blade 10. As a result, as shown in FIGS. 2A and 2B, the rotated cutting blade 10 can be cut into the planned cutting position, and the waveguide 1 can be cut together with the resin 3. When the above-mentioned plate-shaped member is attached to the adhesive tape 11, this plate-shaped member is also cut.

In the present embodiment, the first planned cutting position is set at a position at a distance l from the end of the waveguide 1 so that a waveguide having a desired short length can be cut out from the waveguide 1. There is. The length of the short waveguide cut out from the waveguide 1 is, for example, 1 mm to 10 mm, typically 5 mm. When the above-described operation is repeated and the waveguide 1 is cut along all the planned cutting positions set in the waveguide 1, the cutting step ends.

In the waveguide processing method according to the present embodiment, the hollow portion 1a of the waveguide 1 is filled with the resin 3 as described above. Since the waveguide 3 is reinforced by the resin 3 and is less likely to be deformed, cutting the cutting blade 10 into the waveguide 1 and cutting the resin 3 together causes defects such as cracks and chips. The waveguide 1 can be cut while suppressing the bending and vibration of the waveguide 1.

After the cutting step, a resin removing step for removing the resin filled in the cut short waveguide is performed. Specifically, for example, the resin is extruded from the hollow portion of the waveguide with a rod-shaped member thinner than the inner diameter a2 of the waveguide after cutting. As a result, the resin filled in the cut short waveguide can be removed. There is no particular limitation on the method of removing the resin from the waveguide. For example, the resin can be removed from the waveguide by melting the resin with heat.

As described above, in the method of processing a waveguide according to the present embodiment, after the hollow portion 1a of the waveguide 1 is filled with the resin 3, the rotating cutting blade 10 is cut to form the waveguide 1. Since the resin 3 is cut together, the resin 3 filled in the hollow portion 1a makes it difficult for the waveguide 1 to be deformed, and the bending and vibration of the waveguide 1 when the cutting blade 10 is cut are suppressed. That is, according to the waveguide processing method of the present embodiment, defects such as cracks and chips due to bending and vibration of the waveguide 1 are less likely to occur.

It should be noted that the present invention is not limited to the description of the above embodiment and can be implemented with various modifications. For example, in the above-described embodiment, the case of processing the cylindrical waveguide 1 is illustrated, but a rectangular tube-shaped waveguide can also be processed by the same method. FIG. 3(A) is a perspective view showing the appearance of the waveguide 5 having a rectangular tube shape, and FIG. 3(B) shows that the resin 7 is applied to the rectangular tube-shaped waveguide 5 in the resin filling step. FIG. 3C is a perspective view showing a state of being filled, and FIG. 3C is a perspective view showing a rectangular tube-shaped waveguide 5 filled with a resin 7.

As shown in FIG. 3A, the waveguide 5 according to the modified example is formed in a rectangular tube shape and has a prismatic hollow portion (space) 5a inside. The thickness of the waveguide 5 is substantially uniform over the entire waveguide 5. The cross section of the waveguide 5 in a direction perpendicular to the length direction (direction corresponding to the height direction of the rectangular tube) is rectangular.

The length b1 of the first side of the outer rectangle forming the cross section of the waveguide 5 is, for example, about 3 mm to 7 mm, typically 6 mm. The length c1 of the second side is, for example, about 3 mm to 7 mm, typically 4 mm.

The length b2 of the first side of the inner rectangle forming the cross section of the waveguide 5 is, for example, about 1 mm to 5 mm, typically 4 mm. The length c2 of the second side of the rectangle is, for example, about 1 mm to 5 mm, typically 2 mm. The wall thickness of the waveguide 5 is represented by (length b1-length b2)/2 or (length c1-length c2)/2.

As shown in FIGS. 3B and 3C, the resin 7 with which the waveguide 5 is filled is formed in a prism shape corresponding to the hollow portion 5a. That is, the length b3 of the first side of the rectangle forming the cross section of the resin 7 is, for example, about 1 mm to 5 mm, typically 4 mm, and the length of the second side of the rectangle forming the cross section of the resin 7 c3 is, for example, about 1 mm to 5 mm, typically 2 mm.

By using this resin 7, the rectangular tube-shaped waveguide 5 can be appropriately processed by the same procedure as in the above-described embodiment. Of course, the hollow portion 5a of the waveguide 5 can be filled with resin by a method of introducing a liquid material into the hollow portion 5a and curing it. It should be noted that when the rectangular tube-shaped waveguide 5 is processed, the position of the waveguide 5 does not easily shift even if a plate-shaped member that defines the position of the waveguide 5 is not used.

In addition, the structures, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

1, 5 Waveguide 1a, 5a Hollow part 3, 7 Resin 11 Adhesive tape 2 Cutting device 4 Chuck table 6 Cutting unit 8 Spindle 10 Cutting blade

Claims (1)

Abrasive grains using an annular cutting blade fixed with a binder, a method of processing a waveguide to cut a tubular waveguide having a hollow portion inside to a predetermined length,
A resin filling step of filling the hollow portion of the waveguide with a resin,
A cutting step of cutting the waveguide with the resin by cutting the resin-filled waveguide with the rotating cutting blade;
A resin removing step of removing the resin filled in the cut waveguide, the method for processing a waveguide.

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