JP2020108910A - Water jet processing device and water jet processing method - Google Patents

Abstract

To inhibit deterioration of processing accuracy caused by mist adhering thereto.SOLUTION: A water jet processing device 1 includes: a chuck table 10 including a holding surface 11 which holds a workpiece 200; a working fluid injection nozzle 30 including an injection port which injects a working fluid 300 to the workpiece 200 held by the chuck table 10; and a water wall formation unit 40 which includes a water wall formation liquid injection part 60 disposed so as to enclose the injection port and discharges a water wall formation liquid 301 from the water wall formation liquid injection part 60 to the workpiece 200 to form a water wall 302.SELECTED DRAWING: Figure 8

Description

The present invention relates to a water jet processing device and a water jet processing method.

As a work piece, a package substrate is known in which a semiconductor device or the like is mounted on a resin or metal substrate on which electrodes are wired, and the semiconductor device is covered with a mold resin. When the package substrate is divided into individual device chips along the line to be processed, it becomes a package chip called CSP (Chip Size Package) or QFN (Quad Flat Non-Leaded Package).

In the package chip described above, the metal electrode is often exposed along the planned processing line. For this reason, when the line to be processed on the package substrate is cut with a cutting blade, metal burrs are generated, and the electrodes may be electrically connected to each other to cause a short circuit. Therefore, for the purpose of suppressing the occurrence of burrs, a dividing method has been proposed in which a pressurized machining fluid (also referred to as water jet) is jetted toward a machining scheduled line to cut the electrode (for example, Patent Document 1). 1).

JP 2012-109327 A

However, in the dividing method shown in Patent Document 1, the machining fluid jetted from the nozzle toward the workpiece flows along the workpiece and flows out to the surroundings, and also the collision on the workpiece and the friction at the time of outflow. It becomes a mist due to the influence of the above. The above-described division method may cause a problem such as a decrease in processing accuracy when the working fluid that becomes mist adheres to various parts of the processing device, for example, a gauge for measurement, electrical components, and the like.

The present invention has been made in view of the above problems, and an object thereof is to provide a water jet processing device and a water jet processing method capable of suppressing a decrease in processing accuracy due to adhesion of mist.

In order to solve the above-mentioned problems and to achieve the object, a water jet processing apparatus of the present invention has a holding means including a holding surface for holding a work piece, and a working liquid for the work piece held by the holding means. Forming a water wall from the water wall forming liquid ejecting part toward the workpiece, and including a machining liquid ejecting nozzle including an ejecting port for ejecting the water, and a water wall forming liquid ejecting part arranged so as to surround the ejecting port. And a water wall forming means for forming the water wall.

The water jet processing method of the present invention includes a holding step of holding a work piece having a working line with a holding means, and, after performing the holding step, ejecting a working liquid along the working line of the work piece. And a machining step of ejecting the machining liquid from the ejection port of the nozzle and forming a water wall from the water wall forming liquid ejection unit surrounding the ejection port toward the workpiece.

The water jet processing apparatus of the present invention has the effect of suppressing a decrease in processing accuracy due to the attachment of mist.

FIG. 1 is a perspective view showing a configuration example of a water jet processing device according to the first embodiment. FIG. 2 is a perspective view showing a device chip obtained by dividing a workpiece to be processed by the water jet processing apparatus according to the first embodiment. FIG. 3 is a cross-sectional view of a main part in which a half-cut groove of a workpiece to be processed by the water jet processing device according to the first embodiment is formed. FIG. 4 is a cross-sectional view of the working fluid jetting unit of the water jet working apparatus according to the first embodiment. FIG. 5 is a plan view of the machining fluid injection unit shown in FIG. FIG. 6 is a flowchart showing the flow of the water jet processing method according to the first embodiment. FIG. 7 is a cross-sectional view showing a holding step of the water jet processing method shown in FIG. FIG. 8 is a cross-sectional view showing processing steps of the water jet processing method shown in FIG.

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the embodiments below. Further, the components described below include those that can be easily conceived by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

[Embodiment 1]
A water jet processing apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a water jet processing device according to the first embodiment. FIG. 2 is a perspective view showing a device chip obtained by dividing a workpiece to be processed by the water jet processing apparatus according to the first embodiment. FIG. 3 is a cross-sectional view of a main part in which a half-cut groove of a workpiece to be processed by the water jet processing device according to the first embodiment is formed.

(Workpiece)
The water jet processing device 1 according to the first embodiment is a device that processes the workpiece 200. In the first embodiment, the workpiece 200 is a package substrate including a CSP (Chip Size Package), a QFN (Quad Flat Non-leaded Package), or the like, as shown in FIG. The work piece 200 has a plurality of semiconductor devices 201 (shown in FIG. 2) in which circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations) are formed on a metal plate 202 formed in a predetermined pattern. A plurality of semiconductor devices 201 arranged on the metal plate 202 are sealed with a mold resin 203 or the like to form a substantially rectangular plate shape. Further, in the workpiece 200, the mold resin 203 is divided into a plurality of regions by the grid-shaped planned processing lines 204 shown in FIG. 1, and the semiconductor device 201 described above is arranged in each region.

The workpiece 200 is divided along the planned processing line 204 and divided into individual device chips 205 shown in FIG. Further, the workpiece 200 is provided with an electrode portion 206 shown in FIG. 3 which is connected to the semiconductor device 201 by a wire (not shown) and which is made of a metal such as a copper alloy in the processing scheduled line 204. The electrode portion 206 of the work piece 200 is cut at the central portion, exposed on the outer surface of the device chip 205, and functions as the electrode 207 (shown in FIG. 2) of the device chip 205.

As shown in FIG. 1, the workpiece 200 is integrated with the annular frame 211 by attaching the adhesive tape 210 on the mold resin 203 side and the annular frame 211 on the outer periphery of the adhesive tape 210. It is carried into the water jet processing apparatus 1 in the closed state. Further, in the first embodiment, as shown in FIG. 3, the workpiece 200 has the water jet machining apparatus 1 in which the half-cut groove 208 is formed by cutting along the machining planned line 204 from the metal plate 202 side. Be delivered to. Since the half cut groove 208 is formed in the workpiece 200 by cutting, a burr 209 protruding from the surface of the metal plate 202 is generated at the edge of the half cut groove 208 of the electrode portion 206, as shown in FIG. There is something to do. The burr 209 is removed from the workpiece 200 after the half-cut groove 208 is formed.

Further, in the workpiece 200, after the half-cut groove 208 is formed and the burrs 209 are removed, the bottom of the half-cut groove 208 is cut to be divided into individual device chips 205 shown in FIG. It

(Water jet processing equipment)
The water jet processing apparatus 1 according to the first embodiment is an apparatus for removing the burr 209 formed on the cut surface of the half-cut groove 208 of the workpiece 200. FIG. 4 is a cross-sectional view of a machining fluid jet unit of the water jet machining apparatus according to the first embodiment. FIG. 5 is a plan view of the machining fluid injection unit shown in FIG.

As shown in FIG. 1, the water jet processing apparatus 1 is a chuck table 10 that is a holding unit including a holding surface 11 that sucks and holds the workpiece 200, and a machining plan of the workpiece 200 held by the chuck table 10. A machining liquid ejecting unit 20 for ejecting the pressurized machining liquid 399 shown in FIG. 8 along the line 204, and an alignment unit for imaging the workpiece 200 held on the chuck table 10 and detecting the machining scheduled line 204. 50 and a control unit 100.

As shown in FIG. 1, the water jet machining apparatus 1 includes a machining feed unit 70 for machining and feeding the chuck table 10 in the X direction parallel to the holding surface 11, and a machining liquid ejecting unit 20 for parallel to the holding surface 11. In addition, at least the indexing and feeding unit 80 for indexing and feeding in the Y direction orthogonal to the X direction, and the moving unit 90 for moving the machining liquid ejecting unit 20 in the Z direction parallel to the vertical direction approaching or separating from the holding surface 11 are provided. ..

The chuck table 10 has a disk shape in which the holding surface 11 that holds the workpiece 200 is made of porous ceramic or the like. The chuck table 10 is provided so as to be movable in the X direction by the machining feed unit 70 and rotatable about the axis parallel to the Z direction by the rotary drive source 12. The chuck table 10 is connected to a vacuum suction source (not shown) and sucks and holds the workpiece 200 by being sucked by the vacuum suction source. Around the chuck table 10, a plurality of clamp portions 14 that clamp the annular frame 211 are provided. Further, the chuck table 10 is arranged on the moving table 15 which is moved in the X direction by the processing feeding unit 70.

The processing feed unit 70 is provided on the apparatus body 2 and moves the moving table 15 in the X direction to feed the chuck table 10 in the X direction. The indexing feed unit 80 is provided on the apparatus main body 2, and moves the support column 81 in the Y direction to index and feed the machining liquid jetting unit 20 in the Y direction. The moving unit 90 moves the machining liquid ejecting unit 20 in the Z direction by moving the Z direction moving member 91 provided on the support column 81 and supporting the machining liquid ejecting unit 20 at the tip in the Z direction.

The processing feed unit 70, the indexing feed unit 80, and the moving unit 90 are a well-known ball screw that is rotatably provided around the axis, a well-known pulse motor that rotates the ball screw around the axis, and the chuck table 10 or A known guide rail that movably supports the machining liquid ejecting unit 20 in the X direction, the Y direction, or the Z direction is provided.

The machining fluid ejecting unit 20 ejects the pressurized machining fluid 300 (shown in FIG. 8) to form a burr 209 on the cut surface of the half-cut groove 208 formed on the machining scheduled line 204 of the workpiece 200. Is to be removed from the cut surface. As shown in FIGS. 1 and 4, the working liquid jetting unit 20 includes a working liquid jetting nozzle 30 and a water wall forming unit 40 which is a water wall forming means.

The machining liquid ejecting nozzle 30 is formed in a cylindrical shape in appearance and includes an ejection port 31 for ejecting the pressurized machining liquid 300 onto the workpiece 200 held by the chuck table 10, as shown in FIG. The machining liquid ejection nozzle 30 is provided with an ejection port 31 on a tip end surface 34 of a tip end portion 32 which is gradually tapered toward the workpiece 200 held by the chuck table 10. The tip surface 34 faces the workpiece 200 held on the chuck table 10 in the Z direction. The machining liquid ejecting nozzle 30 is attached to the tip of the Z direction moving member 91, and the ejection port 31 faces the workpiece 200 held on the chuck table 10 in the Z direction.

The machining fluid injection nozzle 30 directs the pressurized machining fluid 300 supplied from the machining fluid supply source 33 to the half-cut groove 208 formed in the machining scheduled line 204 of the workpiece 200 held on the chuck table 10. And ejects from the ejection port 31. In the first embodiment, in the machining liquid jet nozzle 30, the jet port 31 has a circular planar shape and an inner diameter of 0.3 mm, and the tip surface 34 where the jet port 31 is opened is 7 mm from the metal plate 202 of the workpiece 200. The machining fluid 300 is jetted at the distance above 10 mm. Further, in the first embodiment, the working fluid injection nozzle 30 is supplied with the working fluid pressurized to 70 MPa (gauge pressure) from the working fluid supply source 33, and the working fluid at a flow rate of 1.4 L/min from the injection port 31. Inject 300.

The water wall forming unit 40 includes a first ring-shaped member 41 and a second ring-shaped member 51. The first ring-shaped member 41 is formed in a thick annular shape and has an inner diameter equal to the outer diameter of the machining fluid injection nozzle 30 and is attached to the outer peripheral surface of the machining fluid ejection nozzle 30 by passing the machining fluid ejection nozzle 30 inside. Has been. Further, the facing surface 43 of the first ring-shaped member 41 facing the workpiece 200 held by the chuck table 10 is closer to the chuck table 10 than the tip end surface 34 where the jet port 31 of the machining liquid jet nozzle 30 is opened. It is arranged.

The first ring-shaped member 41 includes a storage recess 44 that is recessed from the facing surface 43 and that stores the water wall forming liquid 301 (shown in FIG. 8) formed over the entire circumference of the first ring-shaped member 41. There is. In the first embodiment, the housing recess 44 is arranged at a position coaxial with the first ring-shaped member 41 in a plan view. The water wall forming liquid 301 is supplied from the water wall forming liquid supply source 45 to the accommodation recess 44. In the first embodiment, the accommodation recess 44 is supplied with city water as the water wall forming liquid 301 from the water wall forming liquid supply source 45, but in the present invention, the water wall forming liquid 301 is not limited to city water.

The second ring-shaped member 51 is formed in an annular shape thinner than the first ring-shaped member 41, and as shown in FIGS. 4 and 5, the inner diameter is smaller than the outer diameter from the tip end surface 34 of the machining fluid injection nozzle 30. Is also formed to have a larger outer diameter than that of the first ring-shaped member 41. The second ring-shaped member 51 is attached to the facing surface 43 of the first ring-shaped member 41. In the first embodiment, the second ring-shaped member 51 is arranged at a position coaxial with the machining liquid jet nozzle 30 and the first ring-shaped member 41.

Further, the water wall forming unit 40 includes a water wall forming liquid ejecting section 60, as shown in FIGS. 4 and 5. In the first embodiment, the water wall forming liquid ejecting unit 60 includes a plurality of through holes 61 that penetrate the second ring-shaped member 51 at a position overlapping the housing recess 44 and communicate the interior of the housing recess 44 with the outside. In the first embodiment, the plurality of through holes 61 are provided at equal intervals in the circumferential direction around the injection port 31, and are provided over the entire circumference in the circumferential direction around the injection port 31. It is arranged to surround. In this way, the water wall forming liquid ejection unit 60 is arranged so as to surround the ejection port 31.

Further, in the first embodiment, the water wall forming liquid ejecting section 60 has two rows of through holes 61 arranged in the radial direction centered on the ejection port 31, but in the present invention, the radial direction centered on the ejection port 31. The through holes 61 may be provided in one row. In the first embodiment, the outer diameter of the second ring-shaped member 51 is 120 mm, the inner diameter of the through hole 61 is 0.6 mm, and the through hole 61 extends from the center of the injection port 31 to the center of the through hole 61. Are arranged at a position where the distance is 17 mm and a position where the distance is 22 mm. In the first embodiment, the water wall forming liquid ejecting section 60 has the plurality of through holes 61, but in the present invention, the structure of the water wall forming liquid ejecting section 60 is limited to that of the first embodiment. Instead, for example, it may be a slit penetrating the second ring-shaped member 51 formed in a ring shape in plan view. When the water wall forming liquid ejecting unit 60 is a ring-shaped slit, it is desirable that the water wall-forming liquid ejecting unit 60 is arranged coaxially with the second ring-shaped member 51.

The water wall forming liquid injection unit 60 supplies the water wall forming liquid supply source 45 to the accommodation recess 44 in a state in which the water wall forming unit 40 is brought close to the metal plate 202 of the workpiece 200 held on the chuck table 10. The ejected water wall forming liquid 301 is discharged toward the workpiece 200 through the through hole 61 of the water wall forming liquid jetting unit 60, and the water wall forming liquid is supplied from the water wall forming liquid supply source 45 toward the workpiece 200. A water wall 302 (shown in FIG. 8) including 301 is formed. Further, in the first embodiment, the water wall forming liquid injection unit 60 is supplied with the water wall forming liquid 301 of 0.4 MPa (gauge pressure) from the water wall forming liquid supply source 45, and forms the water wall at a flow rate of 3 L/min. The liquid 301 is discharged.

The alignment unit 50 is fixed to the Z-direction moving member 91 so as to move integrally with the machining liquid ejecting unit 20. The alignment unit 50 includes a CCD (Charge Coupled Device) camera that images the workpiece 200 held on the chuck table 10 and detects the half-cut groove 208 formed in the planned machining line 204 of the workpiece 200. There is.

The alignment unit 50 captures an image for performing alignment for aligning the workpiece 200 and the machining liquid jet nozzle 30, and outputs the captured image to the control unit 100.

The control unit 100 controls each of the above-described components to cause the water jet processing device 1 to perform a processing operation on the workpiece 200. The control unit 100 is a computer. The control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. Have and. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in a storage device, and outputs a control signal for controlling the water jet processing device 1 via the input/output interface device to the water jet processing. Output to the above-mentioned components of the device 1.

The control unit 100 is connected to a display device including a liquid crystal display device that displays a processing operation state, an image, and the like, and an input device used when an operator registers processing content information and the like. The input device includes at least one of a touch panel provided on the display device and an external input device such as a keyboard.

(Water jet processing method)
Next, the water jet processing method according to the first embodiment will be described. FIG. 6 is a flowchart showing the flow of the water jet processing method according to the first embodiment. FIG. 7 is a cross-sectional view showing a holding step of the water jet processing method shown in FIG. FIG. 8 is a cross-sectional view showing processing steps of the water jet processing method shown in FIG.

The water jet processing method according to the first embodiment is a method for processing the workpiece 200, and is an apparatus for removing the burr 209 formed on the cut surface of the half-cut groove 208 of the workpiece 200. In the water jet processing method according to the first embodiment, first, the operator places the workpiece 200 having the half-cut groove 208 formed on the holding surface 11 of the chuck table 10 integrally with the annular frame 211. The water jet machining method starts when the operator registers the machining content information in the control unit 100 and the operator gives an instruction to start the machining operation. As shown in FIG. 6, the water jet processing method includes a holding step ST1 and a processing step ST2.

The holding step ST1 is a step of holding the workpiece 200 having the planned machining line 204 on the chuck table 10. In the holding step ST1, as shown in FIG. 7, the water jet processing device 1 sucks and holds the workpiece 200 on the holding surface 11 of the chuck table 10, and clamps the annular frame 211 by the clamp portion 14. In the holding step ST1, when the water jet processing device 1 suction-holds the workpiece 200 on the holding surface 11 of the chuck table 10, the process proceeds to the processing step ST2.

After performing the holding step ST1, the machining step ST2 ejects the machining liquid 300 from the ejection port 31 of the machining liquid ejection nozzle 30 along the machining planned line 204 of the workpiece 200, and water surrounding the ejection port 31. In this step, the water wall forming liquid 301 is discharged from the wall forming liquid ejecting unit 60 toward the workpiece 200 to form the water wall 302 surrounding the ejection port 31. In the processing step ST2, the water jet processing apparatus 1 moves the chuck table 10 toward the lower side of the alignment unit 50 by the processing feed unit 70, and the workpiece 200 held on the chuck table 10 below the alignment unit 50. Is positioned, the alignment unit 50 is made to capture an image, and alignment is performed.

Then, in the processing step ST2, the water jet processing apparatus 1 causes the moving unit 90 to bring the second ring-shaped member 51 of the processing liquid jetting unit 20 closer to the metal plate 202 of the workpiece 200 held on the chuck table 10, The distance 400 of the second ring-shaped member 51 from the metal plate 202 is set to a predetermined distance. The predetermined distance is a distance stored in advance in the control unit 100 and is determined by the surface tension of the water wall forming liquid 301 or the like. Further, the predetermined distance is a distance over which the water wall 302 can be formed between the metal plate 202 of the workpiece 200 and the second ring-shaped member 51 over the entire circumference of the injection port 31, and in the first embodiment, For example, it is 1 mm.

In the processing step ST2, the water jet processing apparatus 1 supplies the processing liquid 300 of the processing liquid jet nozzle 30 from the processing liquid supply source 33, and the water wall forming liquid 301 to the water wall forming unit 40 from the water wall forming liquid supply source 45. To supply. In the processing step ST2, the processing liquid is supplied by the processing feed unit 70, the indexing feed unit 80, the moving unit 90, and the rotary drive source 12 based on the processing content information while supplying the processing liquid 300 and the water wall forming liquid 301. The machining liquid jet nozzle 30 of the jetting unit 20 is moved relative to the workpiece 200 along the scheduled machining line 204 of the workpiece 200.

In the processing step ST2, in the water jet processing apparatus 1, the water wall forming unit 40 discharges the water wall forming liquid 301 from the through hole 61 of the water wall forming liquid ejecting unit 60, and the water wall forming liquid ejecting unit 60 performs processing. As shown in FIG. 8, both edges of the half-cut groove 208 formed in the machining scheduled line 204 from the machining liquid ejecting nozzle 30 while forming the water wall 302 around the entire circumference of the ejection port 31 toward the object 200. The burr 209 is removed by injecting the working fluid 300 pressurized toward.

In the processing step ST2, the water jet processing apparatus 1 injects the pressurized processing liquid 300 to both edges of the half-cut grooves 208 formed in all the planned processing lines 204, and applies the pressure from the processing liquid injection nozzle 30. After the jetting of the machining fluid 300 and the ejection of the water wall forming fluid 301 from the through holes 61 are stopped to retract the chuck table 10 from below the machining fluid jetting unit 20, the chuck table 10 is suction-held and clamped. The clamp of the portion 14 is released, and the processing operation of the water jet processing apparatus 1, that is, the water jet processing method according to the first embodiment is completed.

The water jet processing apparatus 1 according to the first embodiment includes a water wall forming unit 40 including a water wall forming liquid ejecting section 60 surrounding the ejection port 31 of the machining liquid ejecting nozzle 30. For this reason, the water jet machining apparatus 1 is composed of the machining fluid 300 generated by the machining fluid 300 ejected from the ejection port 31 colliding with the workpiece 200, and travels on the workpiece 200 to flow out to the surroundings. The mist to be used can be confined in the water wall 302. Further, in the water jet machining apparatus 1, when the machining fluid 300 that collides with the work piece 200 flows out to the surroundings from the machining point, which is the position where it collides with the work piece 200, the water wall 302 blocks the outflow and the outflow speed is increased. It is possible to reduce the generation of mist. Therefore, the water jet processing device 1 has an effect that it is possible to suppress a decrease in processing accuracy due to the attachment of mist and a possibility of device damage.

Further, in the water jet processing method according to the first embodiment, in the processing step ST2, the water wall 302 is formed over the entire circumference of the injection port 31 and the processing liquid 300 is injected from the injection port 31, so the mist is treated with water. It can be confined in the wall 302 and the generation of mist can be suppressed. Therefore, the water jet processing method has an effect that it is possible to suppress a decrease in processing accuracy due to the attachment of mist of the water jet processing device 1 and a risk of device damage.

The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention. In the first to third embodiments, the workpiece 200 is a package substrate configured by arranging a plurality of semiconductor devices on a printed circuit board and sealing them with a mold resin or the like, but in the present invention, the workpiece is processed. The object 200 may be a package substrate including a metal substrate on which LEDs (Light Emitting Diode) devices are arranged. Further, in the present invention, the workpiece 200 is provided with semiconductor devices in a region partitioned in a lattice by a plurality of processing-scheduled lines 204 formed on the surface, and a processing element 204 is provided with a TEG (Test Element Group). A disk-shaped semiconductor wafer or optical device wafer having a base material such as silicon, sapphire, or gallium may also be used. In short, in the present invention, the work piece 200 may be any one as long as the metal is provided in the planned processing line 204 in which the half cut groove 208 is formed.

1 Water Jet Processing Device 10 Chuck Table (Holding Means)
11 Holding Surface 30 Machining Liquid Jet Nozzle 31 Jet 40 Water Wall Forming Unit (Water Wall Forming Means)
60 Water Wall Forming Liquid Injection Unit 200 Workpiece 204 Machining Line 300 Processing Liquid 301 Water Wall Forming Liquid 302 Water Wall ST1 Holding Step ST2 Processing Step

Claims (2)

A water jet processing device,
Holding means including a holding surface for holding the workpiece,
A machining liquid jet nozzle including a jet port for jetting a machining liquid onto the workpiece held by the holding means;
Water jet processing including a water wall forming liquid ejecting section arranged to surround the ejection port, and a water wall forming means for forming a water wall from the water wall forming liquid ejecting section toward the workpiece. apparatus. A water jet processing method,
A holding step of holding a workpiece having a processing scheduled line by a holding means,
After performing the holding step, the working liquid is jetted from the jet port of the machining liquid jet nozzle along the scheduled machining line of the workpiece, and the workpiece is also jetted from the water wall forming liquid jet section surrounding the jet port. And a processing step of forming a water wall toward the water jet.

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