JP2020108866A - Game machine - Google Patents

Abstract

To provide a game machine capable of achieving an appropriate board configuration.SOLUTION: A game machine capable of performing a game comprises a power supply board, a control board, and the like, and the control board includes a stabilizing circuit for stabilizing a supply voltage and an audio circuit, performs divergence to a supply voltage for driving a specific electrical part and a supply voltage supplied to the audio circuit, and then supplies a supply voltage stabilized by the stabilizing circuit to the audio circuit. For the supply voltage for driving the specific electrical part, a diverged power supply path is connected with a noise elimination circuit, and a wiring length from the stabilizing circuit to the audio circuit is shorter than a wiring length until a supply voltage is inputted to the stabilizing circuit after one supply voltage is branched.SELECTED DRAWING: Figure 13

Description

The present invention relates to a gaming machine capable of playing a pachinko gaming machine or the like.

2. Description of the Related Art In a gaming machine such as a pachinko gaming machine, a technique relating to a signal line connecting electric components such as a CPU and a ROM has been proposed (for example, Patent Document 1).

JP, 2014-223336, A

According to the technique described in Patent Document 1, there is a possibility that an appropriate substrate configuration cannot be obtained, for example, signal synchronization is likely to be disturbed.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a gaming machine in which an appropriate substrate configuration can be provided.

(A) In order to achieve the above object, a gaming machine according to the claims of the present application is a gaming machine capable of playing a game, and includes a power supply board capable of supplying electric power to electric components, and power supply from the power supply board. A control circuit board for receiving the control circuit board; and a circuit board case capable of accommodating the control circuit board. The control circuit board has wiring connection means capable of detachably connecting signal wiring, a stabilizing circuit for stabilizing the power supply voltage, and a voice signal. An audio circuit capable of outputting a signal, the wiring connection means includes a signal terminal connectable to a signal transmission line of the signal wiring, and a pair of ground terminals, the pair of ground terminals, The cover member, which is surface-mounted on the control board at a position sandwiching both sides of the signal terminal, covers the pair of ground terminals and the tips of the signal terminals, and a power supply voltage of 1 After branching into a power supply voltage for driving a component and a power supply voltage for supplying the audio circuit, a power supply voltage stabilized by the stabilizing circuit is supplied to the audio circuit, and the specific electrical component is A power supply voltage for driving the specific electric component, including a current drive type circuit element, a power supply path after branching the power supply voltage of 1 is connected to a noise removing circuit, The wiring length to the audio circuit is shorter than the wiring length from the branch of the power supply voltage of 1 to the input to the stabilizing circuit.
(1) In order to achieve the above object, another gaming machine is a gaming machine capable of playing a game (for example, a pachinko gaming machine 1 or the like), and has a first pattern (for example, a first wiring pattern) forming a plurality of signal wirings. A pattern 42AK10 and the like and a second pattern (for example, the wiring second pattern 42AK11 and the like) are formed (see, for example, FIG. 25A), and a plurality of electric components (for example, the RAM 102 and the CPU 103) are formed by the plurality of signal wirings. A first shape in which a signal wiring constituted by one of the first pattern and the second pattern is a straight or substantially straight first shape Corresponding to a portion (for example, the first shape portion 42AK10L), the signal wiring formed by the other pattern of the first pattern and the second pattern becomes a second shape different from the first shape. Consists of the one pattern corresponding to the first shape part (eg, the first shape part 42AK11L) in the signal wiring including the two shape parts (eg, the second shape part 42AK11M) and the other pattern. The signal wiring to be included includes the second shape portion (for example, the second shape portion 42AK10M or the like).
With such a configuration, an appropriate substrate configuration can be achieved.

(2) In the gaming machine of (1) above, the first pattern and the second pattern may be formed such that the signal lines have the same or substantially the same wiring length.
With such a configuration, an appropriate substrate configuration can be achieved.

(3) In the gaming machine according to (1) or (2) above, the second shape portion is formed in a different direction between the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. (See FIG. 26, for example).
With such a configuration, an appropriate substrate configuration can be achieved.

(4) In the gaming machine according to any one of (1) to (3), the second shape portion is different between the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. It may be formed to have a wiring width (see, for example, FIG. 27).
With such a configuration, an appropriate substrate configuration can be achieved.

(5) In the gaming machine according to any one of (1) to (4), the second shape portion has a signal wiring formed by the first pattern and a signal wiring formed by the second pattern parallel to each other. Alternatively, a parallel wiring portion which is formed substantially in parallel may be included (see FIG. 28A, for example).
With such a configuration, an appropriate substrate configuration can be achieved.

(6) In the gaming machine according to any one of (1) to (5), the second shape portion of the signal wiring formed by the first pattern or the second pattern is formed by another pattern. A circuit component (for example, the circuit component 42AK1R or the like) mounted so as to be connected to the signal wiring may be provided (see, for example, FIGS. 29A and 29B).
With such a configuration, an appropriate substrate configuration can be achieved.

(7) In the gaming machine according to any one of (1) to (6) above, a wiring portion (for example, a first shape) different from the second shape portion in the signal wiring formed by the first pattern or the second pattern. The circuit component (for example, the circuit component 42AK2R or the like) mounted so as to be connected to the portion 42AK52L or the like may be provided (see, for example, FIG. 29A).
With such a configuration, an appropriate substrate configuration can be achieved.

It is a front view of a pachinko gaming machine in this embodiment. It is a block diagram showing various control boards and the like mounted on a pachinko gaming machine. It is a rear view of the gaming machine frame. It is an exploded perspective view of the state which looked at a substrate case. It is an exploded perspective view of the state which looked at a substrate case. It is a 6th view which shows a base member. It is a 6th view which shows a cover member. It is a perspective view of the state which looked at the receptacle. It is a rear view of the state which looked at the receptacle. It is sectional drawing of the state which looked at the receptacle. It is a figure which shows the transmission path corresponding to wiring. It is a figure which shows the transmission path of a power supply voltage. It is a figure which shows the relationship of wiring length, etc. It is a figure which shows the structural example of a filter circuit. It is a figure which shows the structural example of a noise prevention circuit. It is a figure which shows a power supply monitoring circuit. It is a figure which shows the structural example of the part in which the pattern of the wiring was formed. It is a figure showing the field and section for explaining the pattern of wiring. FIG. 19 is an enlarged view of the area shown in FIG. 18. It is a figure which shows the example of a setting corresponding to the pattern of wiring. FIG. 19 is an enlarged view of the area shown in FIG. 18. FIG. 19 is an enlarged view of the area shown in FIG. 18. It is sectional drawing which shows the structural example of a main board. It is a figure showing other examples of composition about a pattern of wiring. It is a figure which shows the structural example which concerns on the characteristic part 42AK. It is a figure which shows the structural example in which the 2nd shape part is formed in a different direction. It is a figure which shows the structural example in which several signal wiring is formed in the wiring width different. It is a figure which shows the structural example in which the 2nd shape part is formed correspondingly. It is a figure which shows the structural example mounted so that circuit components might be connected. It is a figure which shows the structural example which concerns on the characteristic part 43AK. It is a figure which shows the structural example which concerns on the characteristic part 44AK. It is an exploded perspective view of the board case, the board, and the heat sink of the gaming machine related to the characteristic portion 45AK as seen from the rear. It is the disassembled perspective view which looked at the board case, board, and heat sink of the game machine concerning the characteristic part 45AK from the front. It is sectional drawing which showed a mode that a heat sink and a board|substrate were attached to a board|substrate case in the attachment order ((a)-(b)). FIG. 35 is a cross-sectional view showing how to attach the heat sink and the substrate to the substrate case following FIG. 34 in the attachment order ((a) to (b)). It is a top view for explaining the relation between a heat sink and an electronic component. It is an explanatory view for explaining a flow of air in a substrate case. It is sectional drawing which showed a mode that a heat sink and a board were attached to the board case of the game machine which concerns on other Embodiment 1. It is sectional drawing which showed a mode that a heat sink and a board|substrate were attached to the board|substrate case of the game machine which concerns on other Embodiment 2.

FIG. 1 is a front view of a pachinko gaming machine 1 according to this embodiment. The pachinko gaming machine 1 includes a gaming board 2 and a gaming machine frame 3. In addition, the pachinko gaming machine 1 includes an outer frame that rotatably supports the gaming machine frame 3. The game board 2 is a gauge board that constitutes a game board surface. The gaming machine frame 3 is an underframe for fixing the gaming board 2. On the game board 2, a game area surrounded by guide rails and the like is formed. The game ball (game medium) launched from the launch device passes through the launch passage and is driven into the game area. A glass door frame having a glass window is rotatably provided in the gaming machine frame 3.

At a predetermined position on the game board 2, a first special symbol display device 4A, a second special symbol display device 4B, an image display device 5, a normal winning ball device 6A, a normal variable winning ball device 6B, a special variable winning ball device 7, The normal symbol display device 20, the first holding display device 25A, the second holding display device 25B, the general drawing holding display device 25C, the passage gate 41 and the like are provided. In addition, a windmill, a large number of obstacle nails, a general winning hole, an outlet, etc. may be provided on the game board surface in the game area. A game effect lamp 9 is provided in the periphery of the game area. Speakers 8L and 8R are provided at upper left and right positions of the gaming machine frame 3.

At the lower right position of the gaming machine frame 3, a hit ball operation handle (operation knob) is provided. The hit ball operation handle is operated by a player or the like in order to shoot the game ball toward the game area, and the resilience of the game ball is adjusted according to the operation amount (rotation amount). At a predetermined position of the gaming machine frame 3 below the game area, an upper plate (hit ball supply plate) for holding (reserving) game balls and a lower plate for holding (reserving) surplus balls from the upper plate are provided. Has been. A stick controller 31A is attached to a member forming the lower plate, and a push button 31B is provided to a member forming the upper plate.

On the screens of the first special symbol display device 4A, the second special symbol display device 4B, the image display device 5, etc., variable display of special symbols and decorative symbols is performed. These variable displays are based on the occurrence of the first start prize due to the game ball passing (entering) the first start winning opening formed on the normal winning ball device 6A, or on the normal variable winning ball device 6B. Execution becomes possible based on the occurrence of the second start winning due to the game ball passing (entering) the formed second starting winning opening. The first special symbol display device 4A and the second special symbol display device 4B are respectively configured by using, for example, 7-segment or dot-matrix LEDs (light emitting diodes), etc., and are identified in the special symbol game as an example of the variable display game. Special symbols (special symbols) that are information (special identification information) are variably displayed (variable display). The image display device 5 is configured by using, for example, an LCD (liquid crystal display device) or the like, and forms a display area for displaying various effect images. On the screen of the image display device 5, the variable display of the special symbol (first special symbol) by the first special symbol display device 4A in the special symbol game and the special symbol (second special symbol) by the second special symbol display device 4B Corresponding to each variable display, a decorative pattern that is identification information (decorative identification information) is variably displayed in a decorative pattern display area that is a plurality of variable display portions such as three. The variable display of the decorative pattern is also included in the variable display game. As an example, "left", "middle", and "right" decorative pattern display areas 5L, 5C, and 5R are arranged on the screen of the image display device 5.

A reserved storage display area 5H is arranged on the screen of the image display device 5. In the hold storage display area 5H, a hold display for displaying the number of variable display hold (special figure hold storage number) corresponding to the special figure game in a identifiable manner is performed. The hold display may be any display that can be displayed in correspondence with the hold storage of information regarding variable display. A hold display using the first hold display 25A and the second hold display 25B may be performed together with the hold storage display area 5H or instead of the hold storage display area 5H.

FIG. 2 is a block diagram showing a configuration example of various substrates and peripheral devices. The pachinko gaming machine 1 is equipped with various control boards such as a main board 11, a production control board 12, a sound control board 13, and a lamp control board 14 as shown in FIG. The pachinko gaming machine 1 is also equipped with a relay board 15, a driver board 19, a power supply board 92, and the like. In addition, various boards such as a payout control board, an information terminal board, a launch control board, an interface board, and a touch sensor board may be mounted. Various control boards are not only electronic circuit boards such as printed wiring boards on which conductor patterns are formed and electric components are mounted, but also electric components are mounted (mounted) on electronic circuit boards to realize specific electrical functions. It is a concept including an electronic circuit mounting board configured as described above.

The power supply board 92 is configured to be able to supply electric power from an AC power supply, which is an external power supply (commercial power supply), to electrical components including various control boards such as the main board 11 and the effect control board 12. The power supply board 92 includes, for example, a rectifier circuit for converting alternating current (AC) into direct current (DC), a power supply circuit for converting a predetermined direct current voltage into a specific direct current voltage (for example, direct current 12V, direct current 5V, etc.), and the like. Is prepared. The voltage generated by the power supply board 92 may be supplied to the main board 11, the effect control board 12, and the like via the drawer relay board.

A game control microcomputer 100, a switch circuit 110, a solenoid circuit 111, etc. are mounted on the main board 11. On the main board 11, signals acquired from various detection switches such as the gate switch 21, the starting opening switches (first starting opening switch 22A and second starting opening switch 22B), and the count switch 23 are passed through the switch circuit 110. It is transmitted to the game control microcomputer 100. The gate switch 21 detects a game ball (gate passing ball) that has passed through the passing gate 41. Based on the detection of the gate passing sphere by the gate switch 21, it is possible to perform the variable display of the normal symbol by the normal symbol display device 20. The first starting opening switch 22A detects a game ball that has passed (entered) through the first starting winning opening. The second starting port switch 22B detects a game ball that has passed (entered) the second starting winning port. The count switch 23 detects a game ball that has passed (entered) the special winning opening. When a game ball that has passed through various winning openings such as a first starting winning opening, a second starting winning opening, and a big winning opening is detected, the number of prize balls determined in advance corresponding to each winning opening As a game ball is paid out.

On the main board 11, a solenoid drive signal from the game control microcomputer 100 is transmitted to a solenoid 81 for an ordinary electric accessory and a solenoid 82 for a special winning opening door via a solenoid circuit 111. The solenoid 81 for the ordinary electric accessory is a state in which the game ball does not easily pass (or does not pass) and a state in which it easily passes (or passes) the second starting winning port formed in the normally variable winning ball device 6B. It can be changed to and. The solenoid 82 for the special winning opening door allows the special winning opening formed in the special variable winning ball device 7 to be changed between a state in which the game ball cannot pass and a state in which the game ball can pass. From the main board 11, a command signal for performing display control of the first special symbol display device 4A, the second special symbol display device 4B, the ordinary symbol display device 20, etc. is transmitted.

The game control microcomputer 100 mounted on the main board 11 is, for example, a one-chip microcomputer, and includes a ROM 101 for storing a game control program, fixed data, and the like, and a RAM 102 for providing a game control work area. , A CPU 103 that executes a game control program to perform a control operation, a random number circuit 104 that updates numerical data indicating a random number value independently of the CPU 103, and an I/O (Input/Output port) 105. It is equipped with. As an example, in the game control microcomputer 100, the CPU 103 executes a program read from the ROM 101 to execute processing for controlling the progress of a game in the pachinko gaming machine 1. In the game control microcomputer 100 mounted on the main board 11, various random number values used for controlling the progress of the game are controlled by, for example, a random number circuit 104 or a game random counter provided in a predetermined area of the RAM 102. The numerical data shown is counted (generated) so that it can be updated. The random number used to control the progress of the game is also called a game random number.

The effect control board 12 receives the control signal (effect control command) transmitted from the main board 11 via the relay board 15, and the image display device 5, the speakers 8L and 8R, the game effect lamp 9, and the effect motor. It is possible to control the production operation by the production electric parts such as 60 and the production LED 61. On the effect control board 12, a CPU 120 for effect control, a ROM 121, a RAM 122, a display controller 123, a random number circuit 124, an I/O 125, etc. are mounted.

The effect control CPU 120 mounted on the effect control board 12 uses the effect control program read from the ROM 121, fixed data, and the like to execute processing for controlling the effect operation by the effect electric parts. The display control unit 123 mounted on the effect control board 12 determines the control content of the display operation in the image display device 5 based on the display control command from the effect control CPU 120. For example, the display control unit 123 performs control for executing variable display of decorative designs and various effect displays by determining the switching timing of effect images displayed on the display screen of the image display device 5.

A controller sensor unit 35A and a push sensor 35B are connected to the production control board 12. The controller sensor unit 35A includes a tilt direction sensor and a trigger sensor. The tilt direction sensor can detect the tilt direction of the operating rod using a plurality of sensors when the stick operation of the stick controller 31A is performed on the operating rod. The trigger sensor can detect the presence/absence of push/pull operation with respect to the trigger button provided on the operation stick of the stick controller 31A. That is, the controller sensor unit 35A can detect a player's operation using the stick controller 31A, such as a tilting operation of the stick controller 31A with respect to the operating rod and a push-pull operation of the trigger button. The push sensor 35B can detect an operation of the player using the push button 31B, such as a pressing operation on the push button 31B. In the effect control board 12, for example, by using a random number circuit 124 or a random counter for effect provided in a predetermined area of the RAM 122, numerical data indicating various random number values used for controlling execution of effect can be updated and counted ( Is generated). The random number used to control the execution of the effect is also referred to as a random number for effect.

The effect control board 12 has a first board 12A and a second board 12B that is board-to-board connected to the first board 12A. The first substrate 12A is provided with a CPU 120 for effect control, a graphics processor of the display control unit 123, etc., and the second substrate 12B is an electrical component in which data unique to the model such as a ROM 121 and an image data memory is stored. Is installed. The graphics processor of the display control unit 123 may be a microprocessor in which the functions of the effect control CPU 120 are integrated, or may be a microprocessor configured as a chip separate from the effect control CPU 120.

The voice control board 13 is a control board for voice output control that is provided separately from the effect control board 12, and outputs sound from the speakers 8L and 8R based on commands and control data from the effect control board 12. A processing circuit or the like for executing audio signal processing for performing the processing is mounted. If the graphics controller or the like that constitutes the display control unit 123 mounted on the effect control board 12 can execute the audio signal processing, the audio control board 13 may be equipped with a bandpass filter, an amplifier circuit, or the like. Alternatively, the voice control board 13 may be omitted, and a bandpass filter, an amplifier circuit, etc. may be mounted on the board of the effect control board 12. The lamp control board 14 is a control board for lamp output control that is provided separately from the effect control board 12, and based on a command or control data from the effect control board 12, lighting or the like in the game effect lamp 9 or the like. It is equipped with a lamp driver circuit that turns off the lights. The driver board 19 is a control board for driving electric components provided separately from the performance control board 12, and based on commands and control data from the performance control board 12, various motors included in the performance motor 60. A driver circuit and the like for controlling the rotation of the LED, lighting control of various LEDs included in the effect LED 61, and the like are mounted. The output signal from the driver board 19 is transmitted to each motor included in the effect motor 60 and each LED included in the effect LED 61.

In the pachinko gaming machine 1, a predetermined game is played using a game ball as a game medium, and a predetermined game value can be added based on the game result. As an example of a game using a game ball, a predetermined value is determined based on a player performing a predetermined operation (for example, a rotation operation) on a hitting ball operation handle provided in a lower right position of the game machine frame 3 in the pachinko game machine 1. A game ball as a game medium is launched toward the game area by a launch motor or the like provided in the hit ball launching device. When the game ball flowing down the game area passes (enters) various winning openings, the game ball as a prize ball is paid out. When the variable display result of the special design or the decorative design is "big hit", the special winning opening is opened and the game ball is easily passed (entered), which is advantageous for the player. It becomes a big hit game state.

The advantageous state is not limited to the big hit game state, and may include a special game state such as a time saving state or a probability variation state. In addition, the upper limit number of round games that can be executed in the big hit game state is the first round number (for example, "15") that is larger than the second round number (for example, "7"), and can be executed in the time saving state. The maximum number of times of variable display is the first number (eg, “100”) that is greater than the second number (eg, “50”), and the jackpot probability in the probability variation state is higher than the second probability (eg, 1/50). 1 probability (for example, 1/20), and the number of consecutive chans, which is the number of times it is repeatedly controlled to the jackpot gaming state without being controlled to the normal state, is larger than the second consecutive chan number (for example, "5"). It may include that a gaming situation becomes more advantageous to the player, such as a part or all of the situation that one consecutive chan number (for example, "10") is reached.

In the main board 11, when power supply from the power supply board 92 is started, the CPU 103 of the game control microcomputer 100 is activated, and the CPU 103 starts execution of the game control main processing. In the game control main process, the CPU 103 performs necessary initialization after setting the interrupt prohibition. When the initial settings are completed, interrupts are enabled, and then loop processing starts. After that, the interrupt request signal is sent from the CTC to the CPU 103 every predetermined time (for example, 2 milliseconds), and the CPU 103 periodically executes the game control timer interrupt process.

The game control timer interrupt processing includes switch processing, main side error processing, information output processing, game random number update processing, special symbol process processing, normal symbol process processing, command control processing, and the like. In the switch processing, the states of detection signals input from various switches are determined. In the main-side error processing, an abnormality diagnosis of the pachinko gaming machine 1 is performed, and a warning can be issued if necessary. In the information output processing, predetermined data supplied to the hall management computer is output. In the game random number updating process, at least a part of the game random number is updated by software. In the special symbol process process, various processes are selected and executed in order to perform display control of the special symbol, opening/closing operation setting of the special winning opening, and the like in a predetermined procedure. In the normal symbol process process, various processes are selected and executed in order to perform display control of the normal symbol, tilting motion setting of the movable wing piece in the normal variable winning ball device 6B, and the like in a predetermined procedure.

In the special symbol process process, first, a start winning determination process is executed. After the start winning determination process is executed, the process selected according to the value of the special figure process flag is executed. The processes that can be selected at this time include special symbol normal process, variation pattern setting process, special symbol variation process, special symbol stop process, big hit opening pre-process, big hit opening middle process, big hit opening post process, big hit end process, etc. Just go.

In the starting winning determination process, it is determined whether or not the first starting winning and the second starting winning are generated, and if they are generated, the setting for updating the special figure reservation storage number is performed. In the special symbol normal processing, it is determined whether to start the execution of the special symbol game. Further, in the special symbol normal processing, it is determined whether or not the variable display result of the special symbol or the decorative symbol is "big hit". Furthermore, in the special symbol normal processing, the setting of the fixed special symbol in the special symbol game is performed in correspondence with the variable display result. In the fluctuation pattern setting process, the fluctuation pattern is determined based on the variable display result and the like. In the special symbol variation process, settings for varying the special symbol, settings for measuring the elapsed time from the start of variation, and the like are performed. In the special symbol stop processing, the variation of the special symbol is stopped, and the setting for stopping display (deriving) of the fixed special symbol that is the variable display result is performed.

In the big hit opening pre-processing, the variable display result corresponds to "big hit", and settings for opening the big winning opening in the big hit game state are performed. In the big hit open process, it is determined whether or not the special winning opening is returned from the open state to the closed state. In the jackpot opening post-processing, after returning the special winning opening to the closed state, it is determined whether or not the number of times of execution of the round has reached the upper limit value, and if not reached, the next round can be executed, and if it has been reached, Settings for ending the jackpot gaming state are made. In the big hit ending process, after waiting until the waiting time corresponding to the execution period of the ending effect for notifying the end of the big hit game state has elapsed, settings for starting the probability variation control and the time saving control are performed.

In the effect control board 12, when power supply from the power supply board 92 is started, the effect control CPU 120 starts execution of effect control main processing. In the effect control main processing, after a predetermined initialization is performed, every time a timer interrupt occurs, command analysis processing, effect control process processing, and effect random number updating processing are executed. In the command analysis process, the effect control command transmitted from the main board 11 is analyzed, and a flag corresponding to the analysis result is set. In the effect control process process, various processes are selected and executed in order to control the electric parts for effect in accordance with a predetermined procedure. In the production random number updating process, the count value for generating the production random numbers is updated by software.

In the effect control process process, first, a hold display update process is executed. After executing the hold display updating process, the process selected according to the value of the effect process flag is executed. At this time, the selectable process may include a variable display start waiting process, a variable display start setting process, a variable display effect process, a variable display stop process, a big hit display process, a big hit effect process, an ending effect process, and the like. ..

In the hold display update process, settings for updating the display of the hold storage display area 5H according to the number of special figure hold memories are performed. In the variable display start waiting process, it is determined whether to start the variable display of the special symbol or the decorative symbol. In the variable display start setting process, settings for starting the variable display of the decorative pattern are performed. In the variable display during effect processing, settings for controlling the electric parts for effect according to the effect control pattern are performed in correspondence with the variable display of the decorative pattern. In the variable display stop process, the control for deriving the fixed display of the variable display result by stopping the variable display of the decorative design is performed.

In the big hit display process, the variable display result corresponds to "big hit", and control for executing an effect (fanfare effect) for notifying the occurrence of the big hit is performed. In the big hit medium production process, settings for controlling the electric parts for production in accordance with the production control pattern are performed corresponding to the big hit game state. In the ending effect process, settings for controlling the execution of the ending effect are performed in response to the end of the big hit game state.

FIG. 3 is a rear view of the gaming machine frame 3 included in the pachinko gaming machine 1. A ball tank 150 and a terminal board 154 are provided on the upper rear surface of the gaming machine frame 3. Further, a supply passage 151, a payout device 152, and a prize ball passage 153 are also provided. On the back surface of the game board 2, a board case 400 for a game control board, a board case 800 for a production control board, and a cover body 301 are provided. The board case 400 houses the main board 11. The board case 800 houses the effect control board 12. The cover body 301 is made of a transparent synthetic resin or the like, and covers the substrate case 800 and the upper portion of the substrate case 400. At a lower position of the board case 400 for the game control board, a payout control board 91 and a power supply board 92 are provided so as to overlap with each other in the front and rear.

The structure of the board case 800 for the production control board will be described with reference to FIGS. 4 to 7. FIG. 4 is an exploded perspective view showing the substrate case 800 as viewed from diagonally above the left rear portion. FIG. 5 is an exploded perspective view showing the substrate case 800 as seen from diagonally above the right front portion. FIG. 6 is a six-sided view showing the base member 801. FIG. 7 is a six-sided view showing the cover member 802. The substrate case 800 is composed of a base member 801 and a cover member 802, and is assembled so as to sandwich the effect control substrate 12 from the front and rear. The base member 801 covers the front side of the effect control board 12, and the cover member 802 covers the back side of the effect control board 12.

The base member 801 is made of a transparent thermoplastic synthetic resin, and is composed of a base plate 801a formed in a vertically long and substantially rectangular shape, and side walls 801b to 801e vertically provided on the upper and lower sides and the left and right side edges toward the back side. , Is formed in a box shape that opens toward the back side. On the base plate 801a, bosses 803, 804, locking bars 805, locking hooks 806, locking holes 807, locked portions 808, screw holes 810 of one-way screws 809, mounting holes 811, board supporting ribs 812, 813, step portions 814a and 814b, and a rib 815 are provided.

The cover member 802 is made of a transparent thermoplastic synthetic resin and is composed of a base plate 821a formed in a vertically long and substantially rectangular shape, and side walls 821b to 811e which are vertically provided on the upper and lower sides and the left and right side sides toward the back side. , Is formed in a box shape that opens toward the back side. The base plate 821a has a screw hole 823 into which a screw 822 is screwed, a positioning protrusion 824, a screw hole 826 into which a screw 825 is screwed, a positioning protrusion 827, a locking hook 831, a locking piece 832, and a locking member. A portion 833, a mounting piece 834 in which a mounting hole 834a of the one-way screw 809 is formed, a switch opening 835 for exposing the volume adjusting switch 835a to the outside, and connector openings 836, 837 are provided.

The connector opening 836 is formed in a vertically long shape on the upper right side of the base plate 821a so as to expose the various board-side connectors KCN10 mounted on the first board 12A to the outside. The various board-side connectors KCN10 may include the receptacles KRE1 to KRE4. The receptacle KRE1 is a connector port for main board wiring. The receptacle KRE2 is a connector port for wiring the power board. The receptacle KRE3 is a connector port for driver board wiring. The receptacle KRE4 is a connector port for wiring the voice control board. The layout of the receptacles and the wiring to be connected may be arbitrarily changed according to the specifications of the pachinko gaming machine 1.

The main board wiring receptacle KRE1 has a configuration of a wiring connection device capable of detachably connecting a signal wiring (main board wiring) electrically connected to the main board 11. The power supply board wiring receptacle KRE2 has a configuration of a wiring connection device capable of detachably connecting signal wiring (power supply board wiring) electrically connected to the power supply board 92. The driver substrate wiring receptacle KRE3 has a configuration of a wiring connection device capable of detachably connecting signal wiring (driver substrate wiring) electrically connected to the driver substrate 19. The voice control board wiring receptacle KRE4 has a configuration of a wiring connection device capable of detachably connecting signal wiring (voice control board wiring) electrically connected to the voice control board 13.

8 to 10 show a configuration example of the receptacle KRE1. FIG. 8A is a perspective view showing a state of the left rear portion as viewed from diagonally below. FIG. 8(B) is a perspective view showing a state of the left rear portion as viewed from diagonally above. FIG. 9 is a rear view showing a state in which the vicinity of the receptacle KRE1 is viewed from the back side (rear side) outside the cover member 802. FIG. 10 is a cross-sectional view showing a state in which the vicinity of the receptacle KRE1 is viewed from the lower side. The receptacle KRE1 includes a housing in which the insertion opening OP1 is formed and terminals TA01 to TA03.

The insertion port OP1 is an opening into which a connector plug provided on the main board wiring can be inserted and mounted. The terminals TA01 to TA03 are made of, for example, a metal such as copper, and correspond to the plurality of terminals provided on the connector plug when the connector plug of the main board wiring is inserted into the insertion port OP1. It is a metal member that comes into contact with a terminal arranged at a position to be electrically conductive. In the receptacle KRE1, a pair of ground terminals, TA01 and TA03, are surface-mounted on the board of the production control board 12 at positions sandwiching both sides of the terminal TA02 which is a signal terminal. The main board wiring may be provided with a pair of ground lines serving as ground voltage lines at positions sandwiching both sides of the signal line serving as a signal transmission line. Alternatively, a coaxial cable may be used as the main board wiring, and the inner conductor of the coaxial cable may be electrically connected to the terminal TA02 and the outer conductor of the coaxial cable may be electrically connected to the terminals TA01 and TA03. Good.

In the receptacle KRE1, the terminals TA01 to TA03 are pulled out to the outside on a side surface PL1 which is a terminal arrangement surface, and can be bonded to a connection pad provided on the board of the effect control board 12 (first board 12A). The method of joining the terminal to the connection pad may be a metal joining method using solder or the like, or an adhesive joining method such as conductive resin joining or anisotropic conductive member joining. Fixing metal fittings SS01, SS02 are provided on the side of the side surface PL2 which is the back side of the side surface PL1.

In the cover member 802 of the substrate case 800, in the connector opening 836, the opening region 836a formed corresponding to the receptacle KRE1 has a narrower opening width than the opening regions formed corresponding to the other receptacles. May be formed. The terminals TA01 to TA03 of the receptacle KRE1 are each formed to have an exposed portion exposed from the substrate case 800 in the opening region 836a and a coated portion that is covered by the substrate case 800 and is not exposed. For example, in the terminals TA01 to TA03, the tip end portion that is joined to the corresponding connection pad may be included in the covering portion that is covered by the cover member 802 of the substrate case 800 and is not exposed.

In the cover member 802 of the substrate case 800, if the component housing portion 802a and the opening peripheral edge portion 840 forming the inner peripheral wall surface 836b that is the inner end surface of the opening region 836a are integrally formed via the sloped portion 821e1. Good. The component housing portion 802a is formed to be able to house at least a part of the electric components mounted on the board of the effect control board 12. In the opening region 836a, the distance between the inner peripheral wall surface 836b and the receptacle KRE1 is such that the distance between the inner peripheral wall surface 836b on the side far from the component housing portion 802a and the side surface PL2 of the receptacle KRE1 is the opening width W1 and the component housing portion 802a An opening width W2 is a distance between the inner wall surface 836b on the near side and a side surface PL1 which is a terminal arrangement surface of the receptacle KRE1. Then, the arrangement of the opening region 836a and the receptacle KRE1 may be adjusted so that the opening width W2 is wider than the opening width W1. In the terminals TA01 to TA03 of the receptacle KRE1, the tip end portions that are joined to the corresponding connection pads and are mounted on the surface at the mounting position are covered with the opening peripheral edge portion 840 that forms the inner peripheral wall surface 836b in the opening region 836a. The opening peripheral portion 840 of the cover member 802 and the substrate surface of the effect control substrate 12 form a space SP1 as a space in proximity to the mounting position of the receptacle KRE1.

The terminal TA01 is bonded to the dummy pad DP1 provided on the substrate of the effect control substrate 12. The terminal TA03 is joined to the dummy pad DP2 provided on the substrate of the effect control substrate 12. The terminals TA01 and TA03 are joined to the connection pad GPA1. The connection pad GPA1 may be connected to the wiring layer LY4 in which the wiring pattern for grounding is formed via the through hole provided in the effect control board 12. In the substrate cross section of the effect control substrate 12 shown in FIG. 10, the wiring layer LY2 is formed between the insulating layer LY1 and the insulating layer LY3, and the surface on which the receptacle KRE1 is mounted is protected by using, for example, polyimide. It is sufficient that the layer LY0 is formed. In this way, the wiring pattern in the effect control board 12 may be formed in the wiring layer LY2 provided between the insulating layer LY1 and the insulating layer LY3, which are inner layers in the board of the effect control board 12. Alternatively, the wiring pattern on the effect control board 12 may be formed on the surface of the effect control board 12. The terminal TA02 is joined to a connection pad electrically connected to a wiring pattern for signal transmission.

The fixing metal fitting SS01 included in the receptacle KRE1 is joined to the dummy pad DP3 provided on the substrate of the effect control substrate 12. The fixing metal fitting SS02 included in the receptacle KRE1 is joined to the dummy pad DP4 provided on the substrate of the effect control substrate 12. In this way, the fixing metal fittings SS01, SS02 are provided on the substrate of the production control board 12 on the side of the side surface PL2, which is the rear surface side of the side surface PL1 on which the terminals TA01 to TA03 are arranged, and the dummy pads DP3, DP4. To be joined to.

When the production control command is transmitted from the main board 11 to the production control board 12, the main board wiring for transmitting the command may have only one signal line serving as a signal transmission line. .. Correspondingly, in the receptacle KRE1 which is surface-mounted on the board of the effect control board 12, only the terminal TA02 which is a signal terminal may be provided. In this case, the area of the joint surface on the board of the effect control board 12 according to the lateral width and depth of the receptacle KRE1 is larger than the amount of protrusion of the effect control board 12 from the board surface according to the height of the receptacle KRE1. Since it tends to decrease, there is a possibility that sufficient bonding strength cannot be secured due to surface mounting of the receptacle KRE1. Therefore, in the receptacle KRE1, a pair of terminals TA01 and TA03, which are ground terminals, are surface-mounted on the board of the production control board 12 at positions sandwiching both sides of the terminal TA02, which is a signal terminal. As a result, it is possible to realize an appropriate board configuration that can sufficiently secure the bonding strength of the surface mounting of the receptacle KRE1. Moreover, since both sides of the terminal TA02 which is a signal terminal are sandwiched by the pair of terminals TA01 and TA03 which are ground terminals, it is possible to realize an appropriate substrate configuration which is hardly influenced by noise.

In the receptacle KRE1, the terminal TA01 is joined to the dummy pad DP1 provided on the substrate of the effect control substrate 12, and the terminal TA03 is joined to the dummy pad DP2 provided on the substrate of the effect control substrate 12. Further, the tips of the terminals TA01 to TA03 are arranged so as to be covered by the cover member 802 of the substrate case 800. Since the terminals TA01 and TA03 are bonded to the dummy pads DP1 and DP2 as described above, it is possible to realize an appropriate substrate structure that can sufficiently secure the bonding strength of the surface mounting of the receptacle KRE1. Since the tips of the terminals TA01 to TA03 are covered with the cover member 802 of the substrate case 800, an appropriate substrate configuration capable of protecting an important part in surface mounting such as a joint portion between the terminal and the substrate surface becomes possible. The terminal TA02 that serves as a signal terminal may be bonded to the dummy pad or may not be bonded to the dummy pad. By preventing the terminal TA02 serving as a signal terminal from being joined to the dummy pad, signal deterioration due to the influence of the conductor shape may be prevented.

In the receptacle KRE1, on the side of the side surface PL2, which is the rear surface side of the side surface PL1 on which the terminals TA01 to TA03 are arranged, the fixing metal fitting SS01 is joined and fixed to the dummy pad DP3 provided on the substrate of the performance control board 12. The metal fitting SS02 is joined to the dummy pad DP4 provided on the board of the effect control board 12. In this way, since the fixing metal fittings SS01, SS02 are bonded to the dummy pads DP3, DP4, it is possible to realize an appropriate substrate configuration that can sufficiently secure the bonding strength by the surface mounting of the receptacle KRE1. It should be noted that regardless of the method of joining the metal member such as the fixing metal fittings SS01 and SS02 on the substrate, for example, a fixing member made of a synthetic resin similar to the housing of the receptacle KRE1 may be adhered on the substrate. Any material can be used as long as it can bond the member onto the substrate.

The component housing portion 802a of the cover member 802 of the substrate case 800 is formed so as to be able to accommodate at least a part of the electric components mounted on the substrate of the effect control substrate 12, and the inner peripheral wall surface 836b and the receptacle KRE1 in the opening region 836a are formed. Is formed such that the opening width W2 on the side closer to the component housing portion 802a is wider than the opening width W1 on the far side. The side close to the component accommodating portion 802a is the side of the side surface PL1 that is the terminal placement surface on which the terminals TA01 to TA03 of the receptacle KRE1 are drawn out. On the other hand, the side farther from the component accommodating portion 802a is the side surface PL2 that is the rear surface side of the terminal arrangement surface in the receptacle KRE1. Therefore, the space between the inner peripheral wall surface 836b and the receptacle KRE1 in the opening region 836a is set such that the opening width W2 on the side corresponding to the side surface PL1 serving as the terminal placement surface corresponds to the side surface PL2 serving as the back surface of the terminal placement surface. It is formed wider than W1. Since the opening width is adjusted in this way, for example, an appropriate substrate configuration that enables easy attachment/detachment and alignment of the cover member 802 is possible. In addition, it is possible to provide an appropriate substrate configuration that can prevent damage caused by collision between the terminal arrangement surface of the receptacle KRE1 and the cover member 802 when the cover member 802 is attached or detached.

The terminals TA01 to TA03 of the receptacle KRE1 have an exposed portion that is not covered by the cover member 802 of the substrate case 800 and an exposed portion that is covered by the cover member 802 of the substrate case 800 and is not exposed in the opening region 836a. It In this manner, unlike the exposed portion, each of the terminals TA01 to TA03 is formed with a covered portion that is covered and not exposed, so that an important portion in surface mounting such as a joint portion between the terminal and the substrate surface can be protected. Appropriate substrate configurations are possible.

In the terminals TA01 to TA03 of the receptacle KRE1, the mounting position which is surface-mounted so as to be bonded to the corresponding connection pad on the board of the effect control board 12 is the opening of the cover member 802 forming the inner peripheral wall surface 836b in the opening area 836a. It is covered by the peripheral portion 840. Then, the opening peripheral portion 840 of the cover member 802 and the board surface of the effect control board 12 form a space SP1 close to the mounting position of the receptacle KRE1. In this way, since the opening peripheral edge portion 840 of the cover member 802 and the board surface of the effect control board 12 are positionally adjustable, an appropriate board structure capable of protecting the mounting position of the receptacle KRE1 becomes possible.

FIG. 11A shows a transmission path corresponding to the main board wiring. As shown in FIG. 11A, the signal SCD supplied to the terminal TA02 in the main board wiring receptacle KRE1 is input to the effect control CPU 120 via the input driver circuit 130. The terminals TA01 and TA03 of the receptacle KRE1 are grounded (connected to the ground line).

FIG. 11B shows the transmission path corresponding to the power supply board wiring. The power supply board wiring receptacle KRE2 includes terminals TA11 to TA30. Of these, the terminals TA11, TA12 and the terminals TA29, TA30 corresponding to the outside of the receptacle KRE2 are all grounded (connected to the ground line). In addition to the terminals TA11, TA12, TA29, and TA30, the terminals TA25 and TA26 are grounded (connected to the ground line). A power supply voltage VSL2 of DC 34V is supplied to the terminals TA13 and TA14 of the receptacle KRE2. A power supply voltage VDD2 of DC 12V is supplied to the terminals TA15 to TA20 of the receptacle KRE2. A power supply voltage VCC2 of DC 5V is supplied to the terminals TA21 to TA24 of the receptacle KRE2. A power supply voltage VDD3 of DC 12V is supplied to the terminals TA27 and TA28 of the receptacle KRE2.

The power supply voltage VSL2 of DC 34V supplied from the power supply board 92 to the effect control board 12 via the power supply board wiring connected to the receptacle KRE2 for power supply board wiring is directly output from the effect control board 12 as the power supply voltage VSL. , And is supplied to the driver substrate 19 via the driver substrate wiring connected to the driver substrate wiring receptacle KRE3. For example, in the power supply board wiring receptacle KRE2, the terminals TA13 and TA14 supplied with the power supply voltage VSL2 are connected to the power supply line LSL, and the power supply line LSL is connected to a predetermined terminal in the driver board wiring receptacle KRE3. .. As shown in FIG. 4, the power supply board wiring receptacle KRE2 is provided adjacent to the driver board wiring receptacle KRE3, and the power supply line LSL does not approach the main electric circuits or electric parts in the production control board 12. It may be arranged so as to pass through the end portion of the substrate 12.

FIG. 12 shows a transmission path of the power supply voltage VSL. In the power supply board 92, the transformer circuit 501, the DC voltage generation circuit 502, and the like are used to generate a power supply voltage VSL2 of DC 34V from a commercial power supply that is an external power supply. For example, in the transformer circuit 501, a power supply voltage of 24 V AC is generated. The DC voltage generation circuit 502 includes a rectifier circuit and a smoothing circuit, and rectifies and smoothes a 24V AC power supply voltage to generate a 34V DC power supply voltage VSL2. Since the power supply voltage VSL2 of the direct current 34V is not subjected to voltage control such as feedback control, the power supply voltage VSL2 of the direct current 34V also changes due to the change of the power supply voltage of the alternating current 24V. As described above, the power supply voltage VSL2 of DC 34V supplied to the terminals TA13 and TA14 of the receptacle KRE2 is a DC voltage having a large fluctuation range (ripple component) for which voltage control is not performed. On the other hand, DC 12V power supply voltage VDD2 supplied to the terminals TA15 to TA20 of the receptacle KRE2, DC 5V power supply voltage VCC2 supplied to the terminals TA21 to TA24 of the receptacle KRE2, and terminals TA27 and TA28 of the receptacle KRE2 are supplied. The DC power supply voltage VDD3 of 12V is controlled by the feedback control in the power supply board 92, and may be a DC voltage having less fluctuation width (ripple component) than the power supply voltage VSL of 34V DC. ..

In the effect control board 12, the power supply line LSL corresponding to the power supply voltage VSL of DC 34V does not include a stabilizing circuit such as a filter circuit for stabilizing the voltage. On the other hand, in the driver board 19, the power supply voltage VSL of DC 34V is input to the filter circuit 511 to stabilize the voltage. In the effect control board 12, a power supply line corresponding to a power supply voltage different from the power supply voltage VSL of DC 34V has a stabilizing circuit for stabilizing the voltage by a filter circuit or the like.

For example, in the receptacle KRE2 for wiring the power supply substrate, the terminals TA15 to TA20 to which the power supply voltage VDD2 of DC 12V is supplied are connected to the filter circuit 131a, and the terminals TA21 to TA24 to which the power supply voltage VCC2 of DC 5V is supplied are the filters. The terminals TA27 and TA28, which are connected to the circuit 131b and to which the power supply voltage VDD3 of DC 12V is supplied, are connected to the filter circuit 131c. The output part of the filter circuit 131a is connected to the power supply line LDS that supplies the power supply voltage VDS of DC 12V, the output part of the filter circuit 131b is connected to the power supply line LCC that supplies the power supply voltage VCC of 5V DC, and the output part of the filter circuit 131c is connected. The output section is connected to a power supply line LDC that supplies a power supply voltage VDC of 12V DC. Thus, the filter circuit 131a is interposed between the terminals TA15 to TA20 of the receptacle KRE2 and the power supply line LDS corresponding to the power supply voltage VDS of DC 12V, and the filter circuit 131b is connected to the terminals TA21 to TA24 of the receptacle KRE2 and the power supply voltage of DC 5V. The filter circuit 131c is interposed between the power supply line LCC corresponding to VCC and the terminals TA27 and TA28 of the receptacle KRE2 and the power supply line LDC corresponding to the power supply voltage VDC of 12V DC.

The power supply line LSL is provided to supply a power supply voltage VSL of DC 34V. The power supply line LDS is provided to supply a power supply voltage VDS of DC 12V. The power supply line LCC is provided to supply a power supply voltage VCC of DC 5V. The power supply line LDC is provided to supply a power supply voltage VDC of DC 12V. Therefore, the power supply line LSL in which the filter circuit is not provided is provided to supply a higher power supply voltage than any of the power supply lines LDS, LCC, and LDC in which the filter circuit is interposed.

The receptacle KRE2 has six terminals TA15 to TA20 supplied with a power supply voltage VDD2 of DC 12V, four terminals TA21 to TA24 supplied with a power supply voltage VCC2 of DC 5V, and two terminals supplied with a power supply voltage VDD3 of DC 12V. While the terminals TA27 and TA28 are provided, two terminals TA13 and TA14 to which the power supply voltage VSL2 of DC 34V is supplied are provided. Therefore, in the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the number of terminals TA15 to TA20, TA21 to TA24, TA27, and TA28 connected to the filter circuit is equal to that of the terminal TA13 not connected to the filter circuit. It is larger than the number of terminals of TA14. The number of terminals corresponding to each power supply voltage may be set according to the power supply capacity and the load current.

In the receptacle KRE2, the terminals TA15 to TA20 are supplied with a DC 12V power supply voltage VDD2, the terminals TA21 to TA24 are supplied with a DC 5V power supply voltage VCC2, and the terminals TA27 and TA28 are supplied with a DC 12V power supply voltage VDD3. Then, the power supply voltage VSL2 of DC 34V is supplied to the terminals TA13 and TA14. A filter circuit 131a is interposed between the terminals TA15 to TA20 of the receptacle KRE2 and the power supply line LDS supplying the power supply voltage VDS of DC 12V, and the terminals TA21 to TA24 of the receptacle KRE2 and the power supply voltage VCC of DC 5V are supplied. The filter circuit 131b is interposed between the power supply line LCC and the power supply line LCC, and the filter circuit 131c is interposed between the terminals TA27 and TA28 of the receptacle KRE2 and the power supply line LDC that supplies the power supply voltage VDC of 12V. On the other hand, no filter circuit is interposed between the terminals TA13 and TA14 of the receptacle KRE2 and the power supply line LSL which supplies the power supply voltage VSL of DC 34V. As described above, the power supply lines LDS, LCC, and LDC having the filter circuit can supply a plurality of kinds of power supply voltages such as DC 12V or DC 5V, and the power supply line LSL without the filter circuit has one type DC 34V. The power supply voltage can be supplied. In the receptacle KRE2, the terminals TA13 and TA14 are arranged outside the terminals TA15 to TA24 and the like. Alternatively, in the receptacle KRE2, of the terminals TA15 to TA24, TA27, and TA28, for example, terminals TA15 to TA24, which are arranged inside the terminals TA13 and TA14, are included.

In the receptacle KRE2, the terminals TA13 to TA24, TA27 and TA28 are arranged between the terminals TA11 and TA12 and the terminals TA29 and TA30. The terminals TA13 to TA24, TA27, and TA28 are terminals to which power supply voltage is supplied, and are power supply voltage terminals connected to various power supply voltages. On the other hand, the terminals TA11 and TA12 and the terminals TA29 and TA30 are terminals to which the power supply voltage is not supplied and are ground terminals connected to the ground voltage. Therefore, in the receptacle KRE2, the terminals TA13 to TA24, TA27, and TA28, which are power supply voltage terminals, are arranged between the terminals TA11 and TA12, which are ground terminals, and the terminals TA29 and TA30.

In the receptacle KRE2, the terminals TA13 and TA14 and the terminals TA15 to TA24 are arranged between the terminals TA11 and TA12 and the terminals TA25 and TA26, and the terminals TA25 and TA26 and the terminals TA29 and TA30 are connected to each other. TA27 and TA28 are arranged. The terminals TA13 and TA14 are terminals to which the power supply voltage VSL2 of DC 34V is supplied, and are power supply voltage terminals connected to the power supply voltage VSL2. The terminals TA15 to TA20 are terminals to which the power supply voltage VDD2 of DC 12V is supplied, and are power supply voltage terminals connected to the power supply voltage VDD2. The terminals TA21 to TA24 are terminals to which the power supply voltage VCC2 of DC 5V is supplied, and are power supply voltage terminals connected to the power supply voltage VCC2. The terminals TA27 and TA28 are terminals to which the power supply voltage VDD3 of DC 12V is supplied, and are power supply voltage terminals connected to the power supply voltage VDD3. Therefore, terminals TA13 and TA14 as power supply voltage terminals connected to the power supply voltage VSL2 of DC 34V and terminals TA15 to TA24, TA27, TA28 as power supply voltage terminals connected to power supply voltages other than the power supply voltage VSL2 of DC 34V. The terminals TA15 to TA24, which are a part of the above, are arranged between the terminals TA11 and TA12 and the terminals TA25 and TA26, which are ground terminals. In addition, among the terminals TA15 to TA24, TA27, and TA28 as the power supply voltage terminals connected to the power supply voltage other than the power supply voltage VSL2 of the direct current 34V, the terminals TA27 and TA28 which are a part of the other terminals serve as ground terminals. It is arranged between TA25 and TA26 and terminals TA29 and TA30.

The DC 12V power supply voltage VDD3 supplied to the terminals TA27 and TA28 is used by the step-down converter circuit 132 to generate a DC 1.05V power supply voltage. The power supply voltage of 1.05 V DC is supplied to a specific microprocessor such as the graphics processor of the display control unit 123. Therefore, in the receptacle KRE2, among the terminals TA13 to TA24, TA27, and TA28 connected to the power supply voltage, the terminals TA13 and TA14 connected to the power supply voltage VSL2 of DC 34V having a relatively large fluctuation range (ripple component) are , TA27 and TA28 connected to a power supply voltage VDD3 of DC 12V used to generate a power supply voltage supplied to a specific microprocessor such as a graphics processor of the display control unit 123.

In the effect control board 12, a case where the power supply voltage VSL2 of 34 V DC is stabilized and then output as the power supply voltage VSL can be considered. However, installation of the circuit element for stabilizing the power supply voltage VSL2 of 34V DC, which is not directly used in the production control board 12, invites an increase in the number of parts and the board volume, and also an increase in power loss and manufacturing cost. In addition, the installation of special circuit elements may make it difficult to reuse or standardize the effect control board 12. Therefore, the power supply voltage VSL2 of DC 34V for which the voltage control is not performed is directly output from the effect control board 12 as the power supply voltage VSL, and is input to the filter circuit 511 by the driver board 19 to stabilize the voltage. As a result, an appropriate board configuration that prevents an increase in the number of components and the board volume, power loss, and an increase in manufacturing cost becomes possible. Further, it is possible to realize an appropriate board configuration in which the production control board 12 can be easily reused or shared. In addition, the power supply line LSL is arranged away from the main electric circuits and electric components in the effect control board 12, so that an appropriate board configuration for preventing the adverse effect of noise due to the DC voltage having a large fluctuation range (ripple component) is provided. It will be possible.

In the effect control board 12, a power supply line LSL that supplies a power supply voltage VSL of DC 34V, a power supply line LDS that supplies a power supply voltage VDS of DC 12V, a power supply line LCC that supplies a power supply voltage VCC of DC 5V, and a power supply of DC 12V. Compared to any of the power supply lines LDS that supply the voltage VDS, a direct current of 34 V, which is a high power supply voltage, is supplied. Generally, a stabilizing circuit that stabilizes a high power supply voltage tends to have a larger volume and power loss of a circuit element than a stabilizing circuit that stabilizes a low power supply voltage, and the cost of the circuit element is high. It is easy to become a thing. Therefore, since there is no filter circuit in the power supply line LSL that supplies the power supply voltage VSL of DC 34V, which is a high power supply voltage, an appropriate board configuration that prevents an increase in board volume, power loss, and increase in manufacturing cost is possible. become.

In the receptacle KRE2, a power supply voltage VSL of 34V DC is supplied to the two terminals TA13 and TA14. On the other hand, in the receptacle KRE2, the power supply voltage VDD2 of DC 12V is supplied to the six terminals TA15 to TA20, the power supply voltage VCC2 of DC 5V is supplied to the four terminals TA21 to TA24, and the two terminals TA27 and TA28. Is supplied with a power supply voltage VDD3 of DC 12V. Therefore, in the effect control board 12, among the terminals to which the power supply voltage is supplied by the receptacle KRE2, the number of terminals TA15 to TA24, TA27, and TA28 connected to any of the filter circuits 131a to 131c is equal to the number of terminals of the filter circuit. This is larger than the number of terminals TA13 and TA14 that are not connected to. Since the number of terminals is set in this way, for example, an appropriate board that improves the degree of freedom in wiring design according to the application of the power supply voltage for which the voltage is stabilized in the effect control board 12, the power supply capacity, and the like. Allows configuration.

In the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA15 to TA24, TA27, and TA28, which are connected to any of the filter circuits 131a to 131c in the effect control board 12, have the power supply voltage VDD2 of DC 12V. It includes terminals TA15 to TA20 capable of supplying power, terminals TA21 to TA24 capable of supplying a power source voltage VCC2 of DC 5V, and terminals TA27 and TA28 capable of supplying a power source voltage VDD3 of DC 12V. On the other hand, in the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA13 and TA14 that are not connected to the filter circuit in the production control board 12 can supply the power supply voltage VSL2 of DC 34V, and other types. The power supply voltage of is not supplied. Therefore, the number of types of power supply voltage that can be supplied differs depending on whether the power supply line has the filter circuit or the power supply line that does not have the filter circuit. More specifically, the power supply line including the filter circuit can supply a plurality of types of power supply voltages such as a power supply voltage VDD2 of DC 12V, a power supply voltage VCC2 of DC 5V, and a power supply voltage VDD2 of DC 12V. The power supply line not intervening with can supply one kind of power supply voltage of 34V DC power supply voltage VSL. In this way, since the number of types of power supply voltage that can be supplied differs depending on the power supply line, the wiring design can be freely set according to the use of the power supply voltage for which the voltage is stabilized in the production control board 12, for example. An appropriate substrate configuration that improves the degree of flexibility is possible.

Further, the terminals TA13 and TA14 connected to the power supply line in which the filter circuit is not interposed are arranged outside the terminals TA15 to TA24 connected to the power supply line in which the filter circuit is interposed. With such terminal arrangement, for example, an appropriate board configuration that improves the degree of freedom in wiring design according to the use of the power supply voltage for which the voltage is stabilized in the production control board 12 is possible. In addition, it is possible to realize an appropriate board configuration that shortens the wiring length for outputting the power supply voltage VSL2 of DC 34V supplied to the terminals TA13 and TA14 as the power supply voltage VSL as it is to the driver board 19.

In the receptacle KRE2, the terminals TA13 to TA24, TA27, TA28 are power supply voltage terminals connected to various power supply voltages. On the other hand, in the receptacle KRE2, the terminals TA11, TA12 and the terminals TA29, TA30 are all ground terminals connected to the ground voltage. The terminals TA13 to TA24, TA27, TA28 are arranged between the terminals TA11, TA12 and the terminals TA29, TA30. By arranging the terminals in this way, it is possible to realize an appropriate board configuration that is not easily affected by noise. In addition, it is possible to shield the power supply voltage and form an appropriate substrate structure that prevents the generation of noise.

In the receptacle KRE2, the terminals TA15 to TA24, TA27, and TA28 are first power supply voltage terminals connected to a power supply voltage different from the power supply voltage VSL2 of DC 34V. On the other hand, in the receptacle KRE2, the terminals TA13 and TA14 are second power supply voltage terminals connected to the power supply voltage VSL2 of DC 34V. Further, in the receptacle KRE2, the terminals TA11 and TA12 are first ground terminals connected to the ground voltage, the terminals TA25 and TA26 are second ground terminals connected to the ground voltage, and the terminals TA29 and TA30 are connected to the ground voltage. It becomes the third ground terminal. In the receptacle KRE2, the terminals TA13 and TA14 included in the second power supply voltage terminal and the terminals TA15 to TA24 included in the first power supply voltage terminal are the terminals TA11 and TA12 included in the first ground terminal, and the second TA2. Terminals TA27 and TA28, which are arranged between the terminals TA25 and TA26 included in the ground terminal and included in the first power supply voltage terminal, are included in the terminals TA25 and TA26 included in the second ground terminal and the third ground terminal. It is arranged between terminals TA29 and TA30. By arranging the terminals in this way, it is possible to realize an appropriate board configuration that is not easily affected by noise. In particular, the terminals TA25 and TA26 included in the second ground terminal are included in the terminals TA13 and TA14 included in the second power supply voltage terminal, the terminals TA15 to TA24 included in the first power supply voltage terminal, and the first power supply voltage terminal. By arranging it between TA27 and TA28, it is possible to realize an appropriate substrate configuration that is less susceptible to noise. In addition, it is possible to efficiently shield the power supply voltage and further form an appropriate substrate structure that prevents the generation of noise. In addition, terminals TA13 and TA14 connected to a power supply voltage VSL2 of DC 34V are connected to a power supply voltage VDD3 of DC 12V used to generate a power supply voltage to be supplied to a specific microprocessor such as a graphics processor of the display control unit 123. Since it is arranged away from the TA 27 and TA 28 which are connected to each other, it is possible to realize an appropriate board configuration in which a specific microprocessor is not easily affected by noise.

In the production control board 12, the power supply voltage VDL is branched at the branch point DB1 from the power supply voltage VDD2 supplied at the terminals TA15 to TA20 of the receptacle KRE2. After the power supply voltage VDL is branched at the branch point DB1 as described above, the power supply voltage VDS is stabilized by the filter circuit 131a. The power supply voltage VDL is a DC 12V power supply voltage used to drive a specific electric component such as a specific LED included in the production LED 61. The power supply voltage VDS is a 12V DC power supply voltage that is supplied to the amplifier circuit 521 and is used to output an audio signal. In this way, the filter circuit 131a stabilizes the power supply voltage VDS after branching the one power supply voltage VDD2 into the power supply voltage VDL and the power supply voltage VDS. The effect control board 12 may be provided with an amplifier circuit 521 so that the audio signals supplied to the speakers 8L and 8R can be output.

FIG. 13A shows a relationship between wiring lengths of wirings for supplying the power supply voltage VDS. In the effect control board 12, the power supply line LDS for supplying the power supply voltage VDS to the amplifier circuit 521 includes a wire having a wire length LL1 from the branch point DB1 to the input part of the filter circuit 131a and an output part of the filter circuit 131a. The wiring having the wiring length LL2 to the input portion of the amplifier circuit 521 may be included. The wiring length and the circuit arrangement in the effect control board 12 may be adjusted so that the wiring length LL2 is shorter than the wiring length LL1. As described above, the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 is shorter than the wiring length LL1 from the branch point DB1 of the power supply voltage VDS to the filter circuit 131a. The amplifier circuit 521 and the filter circuit 131a are not limited to those installed on the production control board 12, and may be installed on the voice control board 13.

FIG. 13B shows a transmission path of the power supply voltage VDS when the amplifier circuit 521 and the filter circuit 131 a are installed on the voice control board 13. In the power supply board 92, the power supply voltage VDD2 of DC 12V is generated from the commercial power supply which is an external power supply by using the transformer circuit 501, the DC voltage generation circuit 502, and the like. The power supply voltage VDD2 of DC 12V is supplied to the terminals TA15 to TA20 in the receptacle KRE2 for wiring the power supply substrate. In the performance control board 12, after the power supply voltage VDL is branched at the branch point DB1 from the power supply voltage VDD2 supplied from the terminals TA15 to TA20 of the receptacle KRE2, the power supply voltage VDS is directly output from the performance control board 12 as the power supply voltage VDS. The audio control board 13 may be supplied via the audio control board wiring connected to the audio board wiring receptacle KRE4. For example, in the power supply board wiring receptacle KRE2, the terminals TA15 to TA20 supplied with the power supply voltage VDD2 are connected to the power supply line LDS, and the power supply line LDS is connected to a predetermined terminal in the voice control board wiring receptacle KRE4. Just do it. In the effect control board 12, the power supply line LDS corresponding to the power supply voltage VDS of DC 12V may not have a stabilizing circuit such as a filter circuit for stabilizing the voltage. On the other hand, in the voice control board 13, the power supply voltage VDS of DC 12V is input to the filter circuit 131a to stabilize the voltage. The power supply voltage VDS thus stabilized may be supplied to the amplifier circuit 521.

The voice control board 13 may be provided with a voice control IC 522, a voice data ROM 523, and the like. The voice control IC 522 executes signal processing for generating a voice or a sound effect in accordance with a command (sound number data or the like) output from the production control CPU 120 of the production control board 12. The voice data ROM 523 stores control data according to the sound number data. The control data according to the sound number data is a collection of data that shows the output mode of the sound or the sound effect in a predetermined period (for example, the variable display period of the decorative pattern) in time series. It should be noted that various configurations provided on the voice control board 13 may be configured to be provided on the effect control board 12, and the voice control board 13 may not be provided.

The amplifier circuit 521 capable of amplifying the audio signal generated by the audio control IC 522 and outputting the amplified audio signal to the speakers 8L and 8R has a sound quality such that the output audio signal is distorted when the power supply voltage fluctuates. May be adversely affected. Therefore, the DC 12V power supply voltage VDS is supplied to the amplifier circuit 521 after being stabilized by the filter circuit 131a. In the production control board 12, one power supply voltage VDD2 is branched into a power supply voltage VDL for driving a specific electric component and a power supply voltage VDS for supplying to the amplification circuit 521, and then the filter circuit 131a is used. The stabilized power supply voltage VDS is supplied to the amplifier circuit 521. In this manner, by supplying the power supply voltage VDS stabilized by using the filter circuit 131a to the amplifier circuit 521, it is possible to realize an appropriate substrate configuration that stably operates the amplifier circuit 521.

In the power supply line LDS corresponding to the power supply voltage VDS to be supplied to the amplifier circuit 521, the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 has a wiring length LL2 to the filter circuit 131a after the power supply voltage VDL is branched at the branch point DB1. It is shorter than the wiring length LL1 until input. As described above, by shortening the wiring length until the power supply voltage VDS stabilized by using the filter circuit 131a is supplied to the amplifier circuit 521, the influence of noise is reduced and the amplifier circuit 521 is operated stably. It is possible to configure various substrates.

In the effect control board 12, the power supply voltage VCL is branched from the power supply voltage VCC2 supplied at the terminals TA21 to TA24 of the receptacle KRE2. After the power supply voltage VCL is branched, the power supply voltage VCC is stabilized by the filter circuit 131b. The power supply voltage VCL is a DC 5V power supply voltage used to drive a specific electric component such as a specific motor included in the performance motor 60 or a specific LED included in the performance LED 61. The power supply voltage VCC is a DC 5V DC power supply used to drive a predetermined electric circuit such as the effect control CPU 120. In this way, the filter circuit 131b stabilizes the power supply voltage VDD after the one power supply voltage VCC2 is branched into the power supply voltage VCL and the power supply voltage VDD.

In the effect control board 12, after stabilizing the power supply voltage VDD3 supplied at the terminals TA27 and TA28 of the receptacle KRE2 by the filter circuit 131c, the power supply voltage VDC is branched so that it can be supplied. The power supply voltage VDC is a DC 12V power supply voltage used to monitor the occurrence of power failure. The power supply voltage VDD3 is input to the step-down converter circuit 132 after being stabilized by the filter circuit 131c. The step-down converter circuit 132 is a circuit that converts a 1-input 2-output DC voltage. The step-down converter circuit 132 shown in FIG. 11 receives a power supply voltage VDD3 of DC 12V, which is stabilized by the filter circuit 131c, and converts it into a power supply voltage of DC 1.05V and a power supply voltage of DC 3.3V. Output. The output section of the step-down converter circuit 132 is connected to a power supply line L10 that supplies a power supply voltage of DC 1.05V and a power supply line L33 that supplies a power supply voltage of DC 3.3V. The power supply voltage of 1.05 V DC is used to drive a predetermined electric circuit such as a graphics processor included in the display control unit 123. The power supply voltage of DC 3.3V is used to drive a predetermined electric circuit such as the ROM 121 or the image data memory included in the display control unit 123. The power supply voltage of DC 3.3V is also input to the regulator circuit 133. The regulator circuit 133 may be a linear stabilized power supply circuit such as a series regulator such as an LDO (Low Drop-Out) regulator, and the power supply voltage of DC 3.3V is input to the power supply voltage of DC 1.5V. Converted to and output. The output part of the regulator circuit 133 is connected to a power supply line L15 that supplies a power supply voltage of DC 1.5V. The power supply voltage of DC 1.5V is used to drive a predetermined electric circuit such as the RAM 122.

FIG. 14 shows a configuration example of the filter circuits 131a to 131c. FIG. 14A shows a configuration example of the filter circuit 131a corresponding to the power supply voltage VDS. FIG. 14B shows a configuration example of the filter circuit 131b corresponding to the power supply voltage VCC. FIG. 14C shows a configuration example of the filter circuit 131c corresponding to the power supply voltage VDC.

The filter circuit 131a illustrated in FIG. 14A may be configured using the three-terminal capacitor 85a, the bypass capacitors C10 and C11, and the electrolytic capacitor C1. The bypass capacitors C10 and C11 are electrical components for noise prevention that prevent high frequency noise compared to the electrolytic capacitor C1, and are also called decoupling capacitors. The electrolytic capacitor C1 is an electrical component for noise prevention that prevents low-frequency noise as compared with the bypass capacitors C10 and C11. The input terminal (IN) of the three-terminal capacitor 85a serves as an input portion of the filter circuit 131a, and the power supply voltage VDD2 of DC 12V is supplied. The output terminal (OUT) of the three-terminal capacitor 85a serves as an output section of the filter circuit 131a, and supplies the power supply voltage VDS of DC 12V whose voltage is stabilized. The ground terminal (GND) of the three-terminal capacitor 85a is grounded (connected to the ground line). A 0.1 μF bypass capacitor C10, a 47 μF bypass capacitor C11, and a 1000 μF electrolytic capacitor C1 are connected between the output terminal of the three-terminal capacitor 85a and the ground terminal.

The filter circuit 131b shown in FIG. 14B may be configured using the three-terminal capacitor 85b, the bypass capacitors C12 and C13, and the electrolytic capacitor C2. The bypass capacitors C12 and C13 are electrical components for noise prevention that prevent high frequency noise compared to the electrolytic capacitor C2. The electrolytic capacitor C2 is an electric component for noise prevention that prevents low-frequency noise, as compared with the bypass capacitors C12 and C13. The input terminal (IN) of the three-terminal capacitor 85b serves as an input section of the filter circuit 131b, and the power supply voltage VCC2 of DC 5V is supplied. The output terminal (OUT) of the three-terminal capacitor 85b serves as an output section of the filter circuit 131b, and supplies the power supply voltage VCC of DC 5V whose voltage is stabilized. The ground terminal (GND) of the three-terminal capacitor 85b is grounded (connected to the ground line). A 0.1 μF bypass capacitor C12, a 47 μF bypass capacitor C13, and a 1000 μF electrolytic capacitor C2 are connected between the output terminal of the three-terminal capacitor 85b and the ground terminal.

The filter circuit 131c shown in FIG. 14C may be configured using the three-terminal capacitor 85c, the bypass capacitor C14, and the electrolytic capacitor C3. The bypass capacitor C14 is an electric component for noise prevention that prevents high frequency noise compared to the electrolytic capacitor C3. The electrolytic capacitor C3 is an electric component for noise prevention that prevents low-frequency noise as compared with the bypass capacitor C14. The input terminal (IN) of the three-terminal capacitor 85c serves as an input portion of the filter circuit 131c, and the power supply voltage VDD3 of DC 12V is supplied. The output terminal (OUT) of the three-terminal capacitor 85c serves as an output section of the filter circuit 131c, and supplies the power supply voltage VDC of 12V DC, the voltage of which is stabilized. The ground terminal (GND) of the three-terminal capacitor 85c is grounded (connected to the ground line). A bypass capacitor C14 of 0.1 μF and an electrolytic capacitor C3 of 1000 μF are connected between the output terminal of the three-terminal capacitor 85c and the ground terminal.

The filter circuits 131a to 131c function as a stabilizing circuit that stabilizes the voltage of each power supply path. For example, the filter circuit 131a stabilizes the power supply voltage VDS of DC 12V supplied by the power supply line LDS. The filter circuit 131b stabilizes the power supply voltage VCC of DC 5V supplied by the power supply line LCC. The filter circuit 131c stabilizes the DC 12V power supply voltage supplied by the power supply line LDC. In addition to the filter circuits 131a to 131c, the effect control board 12 may be provided with a noise prevention circuit that prevents noise from occurring in various power supply voltages.

FIG. 15 shows a configuration example of a noise prevention circuit provided on the effect control board 12. FIG. 15A shows a configuration example of the noise prevention circuit 135a corresponding to the LED DC 12V (DC 12V) which is the power supply voltage VDL. FIG. 15B shows a configuration example of the noise prevention circuit 135b corresponding to the power supply voltage VCL of LED/motor DC 5V (DC 5V). FIG. 15C shows a configuration example of the noise prevention circuit 135c corresponding to the IC power supply voltage VCC of 5V (DC 5V) and the IC power supply voltage of 3.3V DC of 3.3V (DC 3.3V). ing.

A noise prevention circuit 135a shown in FIG. 15A is configured using a capacitor C20 and a resistor R20 connected in series, a capacitor C21 and a resistor R21 connected in series, and a capacitor C22 and a resistor R22 connected in series. If you have. All of these configurations may be connected to the power supply line LDL that supplies the power supply voltage VDL and the ground terminal (ground line) that supplies the ground voltage. Each of the capacitors C20, C21, C22 may be a bypass capacitor of 0.1 μF. The resistors R20, R21 and R22 may all have a resistance value of 22Ω.

The noise prevention circuit 135b illustrated in FIG. 15B may be formed using a capacitor C23 and a resistor R23 connected in series and a capacitor C24 and a resistor R24 connected in series. All of these configurations may be connected to the power supply line LCL that supplies the power supply voltage VCL and the ground terminal (ground line) that supplies the ground voltage. Both the capacitors C23 and C24 may be 0.1 μF bypass capacitors. The resistors R23 and R24 may have a resistance value of 22Ω.

The noise prevention circuit 135c illustrated in FIG. 15C may be formed using capacitors C25 to C28. The capacitor C25 may be connected to the power supply line LCC that supplies the power supply voltage VCC and the ground terminal (ground line) that supplies the ground voltage. Capacitors C26, C27, and C28 may all be connected to a power supply line L33 that supplies a power supply voltage of DC 3.3V and a ground terminal (ground line) that supplies a ground voltage. Each of the capacitors C25 to C28 may be a 0.1 μF bypass capacitor.

In the noise prevention circuit 135a shown in FIG. 15A, resistors R20, R21, R22 are used in addition to the capacitors C20, C21, C22. In the noise prevention circuit 135b shown in FIG. 15B, resistors R23 and R24 are used in addition to the capacitors C23 and C24. On the other hand, in the noise prevention circuit 135c shown in FIG. 15C, the capacitors C25 to C28 are used and the resistors are not used. As described above, in the noise prevention circuits 135a and 135b, the resistors R20, R21, R22 and the resistors R23, R24 are used as circuit elements different from the noise prevention circuit 135c.

The power supply voltage VDL stabilized by the noise prevention circuit 135a shown in FIG. 15A is used to drive a specific electric component such as a specific LED included in the production LED 61. The power supply line LDL supplies a power supply voltage VDL for driving a specific electric component such as a specific LED included in the production LED 61. The power supply voltage VCL stabilized by the noise prevention circuit 135b shown in FIG. 15B drives a specific electric component such as a specific motor included in the performance motor 60 or a specific LED included in the performance LED 61. It is used to The power supply line LCL supplies a power supply voltage VCL for driving a specific electric component such as a specific motor included in the performance motor 60 or a specific LED included in the performance LED 61. The power supply voltage VCC and the DC 3.3V power supply voltage stabilized by the noise prevention circuit 135c shown in FIG. It is used to drive an electric circuit including the control circuit. The power supply line LCC supplies a power supply voltage VCC for driving an electric circuit including a specific control circuit, such as the effect control CPU 120. The power supply line L33 supplies a DC 3.3V power supply voltage for driving an electric circuit including a specific control circuit such as the ROM 121 or the image data memory of the display control unit 123. As described above, in the noise prevention circuits 135a and 135b corresponding to the power supply voltage for driving a specific electric component such as a motor or an LED, noise prevention corresponding to the power supply voltage for driving a specific electric circuit such as a CPU or a ROM is performed. Resistors R20, R21, R22 and resistors R23, R24 are used as circuit elements different from the circuit 135c.

In a load circuit using a current-driven circuit element such as a specific motor included in the performance motor 60 or a specific LED included in the performance LED 61, an excessive rush current is generated due to a transient phenomenon of the load circuit. , The electric parts may be damaged. Therefore, in the noise prevention circuit 135a, the resistor R20 is connected in series to the capacitor C20, the resistor R21 is connected in series to the capacitor C21, and the resistor R22 is connected in series to the capacitor C22. In the noise prevention circuit 135b, the resistor R23 is connected in series to the capacitor C23, and the resistor R24 is connected in series to the capacitor C24. When the power supply voltage VDL is stable, the capacitors C20, C21, C22 are in the charged state and the resistors R20, R21, R22 are in the non-conductive state, so that the power loss can be prevented. When the power supply voltage VCL is stable, the capacitors C23 and C24 are in the charging state and the resistors R23 and R24 are in the non-conducting state, so that the power loss can be prevented. On the other hand, in the semiconductor integrated circuit such as the effect control CPU 120, the ROM 121, or the image data memory of the display control unit 123, a voltage-driven circuit element such as a CMOS circuit is used, and the input impedance becomes relatively large. Therefore, inrush current due to the transient phenomenon of the circuit is unlikely to occur. Therefore, in the noise prevention circuit 135c, it is not necessary to use resistors while using the capacitors C25 to C28. In this way, by constructing a noise prevention circuit using different circuit elements according to the characteristics of the circuit or electric component to which the power supply voltage is to be supplied, it is possible to prevent an increase in the substrate volume and the manufacturing cost and to reduce the noise. An appropriate substrate configuration that prevents the occurrence can be achieved.

FIG. 16 shows a power supply monitoring circuit 140 that uses the power supply voltage VDC. In the effect control board 12, the power supply voltage VDC is used to monitor the occurrence of power failure. The power supply monitoring circuit 140 is a circuit that is configured by using, for example, a power failure monitoring reset module IC, and realizes a power supply monitoring unit that can output a power cut signal. For example, the power supply monitoring circuit 140 outputs an off state (high level) power cutoff signal when the power supply voltage VDC exceeds a predetermined value (for example, 10 V). On the other hand, when the period during which the power supply voltage VDC becomes equal to or lower than the predetermined value continues for the predetermined standby time or longer, the power-off signal in the ON state (low level) is output. The power-off signal output from the power monitoring circuit 140 is transmitted to the effect control CPU 120.

The power supply voltage VDC to be monitored for outputting the power supply disconnection signal is used to generate a power supply voltage of DC 1.05V, a power supply voltage of DC 3.3V, and a power supply voltage of DC 1.5V. The power supply voltage of 1.05 V DC is used to drive a predetermined electric circuit such as a graphics processor included in the display control unit 123. The power supply voltage of DC 3.3V is used to drive a predetermined electric circuit such as the ROM 121 or the image data memory included in the display control unit 123. The power supply voltage of DC 1.5V is used to drive a predetermined electric circuit such as the RAM 122. By monitoring the power supply voltage VDC used to generate the power supply voltage supplied to such an electric circuit, a power-off signal is output (turned on) before the operating state of the electric circuit becomes unstable. Therefore, malfunctions in various electric circuits can be prevented.

In the effect control board 12, the power supply voltage VDD3 supplied from the terminals TA27 and TA28 of the receptacle KRE2 is input to the step-down converter circuit 132 after being stabilized by the filter circuit 131c. The step-down converter circuit 132 uses the input voltage to generate a power supply voltage of direct current 1.05V and a power supply voltage of direct current 3.3V higher than direct current 1.05V. The power supply voltage of DC 3.3V is input to the regulator circuit 133. The regulator circuit 133 uses the input voltage to generate a power supply voltage of DC 1.5V. The power supply voltage of DC 1.5V is higher than 1.05V DC but lower than 3.3V DC. As described above, by using the step-down converter circuit 132 and the regulator circuit 133, the power supply voltage of DC 1.05V, the power supply voltage of DC 1.5V higher than DC 1.05V, and the DC voltage 3 higher than DC 1.5V. .3V power supply voltage can be generated, and the step-down converter circuit 132 outputs a DC 1.05V power supply voltage and a DC 3.3V power supply voltage, while the regulator circuit 133 outputs a DC 1.V. It outputs a power supply voltage of 5V.

After stabilizing the power supply voltage VDD3 by the filter circuit 131c, the branched DC 12V power supply voltage VDC is supplied to the power supply monitoring circuit 140 that monitors the occurrence of power failure. Therefore, the input voltage of the step-down converter circuit 132 is common with the power supply voltage VDC of 12V DC, and the input voltage of the step-down converter circuit 132 is the monitoring target of the power supply monitoring circuit 140. After branching power supply voltage VDC, a bypass capacitor having a predetermined capacity (for example, 47 μF) may be connected to the input side of step-down converter circuit 132.

Among the power supply voltages generated by using the step-down converter circuit 132 and the regulator circuit 133, the power supply voltage of DC 1.05V, which is the lowest voltage with the smallest voltage value, is a specific value such as a graphics processor of the display control unit 123. Supplied to the microprocessor. The power supply voltage of DC 1.05V is not limited to being supplied to the graphics processor of the display control unit 123, and may be supplied to, for example, the effect control CPU 120 or any other microprocessor.

Among the power supply voltages generated by using the step-down converter circuit 132 and the regulator circuit 133, the DC 3.3V power supply voltage having the highest voltage value and the high voltage is stored in, for example, the ROM 121 or the image data memory of the display control unit 123. Supplied. The ROM 121 only needs to be able to be activated before an electric component driven by a power supply voltage of DC 1.5V.

Among the power supply voltages generated by using the step-down converter circuit 132 and the regulator circuit 133, a power supply voltage of DC 1.5V higher than DC 1.05V and lower than DC 3.3V is supplied to the RAM 122, for example. The RAM 122 is a temporary storage memory that can be stored and read by a DDR (Double Data Rate) method, for example, and functions as a memory module such as SIMM (Single In-line Memory Module) or DIMM (Dual In-line Memory Module). Configure the substrate. The board forming the RAM 122 may be a separate board that is detachably connectable to the effect control board 12. In this case, the DC 1.5V power supply voltage is supplied to a board different from the effect control board 12.

When a 1-input/3-output step-down converter circuit is used instead of the step-down converter circuit 132 and the regulator circuit 133, a special dedicated circuit is required, which may increase the manufacturing cost. In addition, the amount of heat generated by a single circuit may increase, and the electric circuit may be damaged. Therefore, in the step-down converter circuit 132, the power supply voltage VDD3 stabilized by the filter circuit 131c (the same applies to the power supply voltage VDC) is input, and the power supply voltage of DC 1.05 V and the power supply voltage of DC 3.3 V are output. .. The regulator circuit 133 receives a power supply voltage of DC 3.3V and outputs a power supply voltage of DC 1.5V. As a result, it is possible to prevent an increase in manufacturing cost and to realize an appropriate substrate configuration that disperses heat generated in the electric circuit.

A power supply voltage VDC that is the same as or substantially the same as the voltage supplied to the step-down converter circuit 132 is supplied to the power supply monitoring circuit 140, and the occurrence of power failure is monitored. In this way, the power supply voltage VDC used to generate various power supply voltages by the step-down converter circuit 132 and the regulator circuit 133 is set as the monitoring target of the power supply monitoring circuit 140. Before the operating state of the electric circuit, which is important for executing the effect in (1), becomes unstable, an appropriate board configuration for detecting the occurrence of power failure can be realized.

The power supply voltage of 1.05 V DC output from the step-down converter circuit 132 is supplied to a specific microprocessor such as the graphics processor of the display control unit 123. By outputting the power supply voltage of 1.05V DC from the step-down converter circuit 132, when the power is cut off, the power supply voltage of 1.05V DC is output until a longer time than the configuration output from the regulator circuit 133 elapses. Can be maintained. Thereby, when the power is cut off, an appropriate board configuration, such as a graphics processor of the display control unit 123, for continuing the operation of an electric circuit important for executing the effect in the pachinko gaming machine 1 as much as possible is provided. It will be possible.

The DC 3.3V power supply voltage output from the step-down converter circuit 132 is supplied to, for example, the ROM 121, and is activated before an electric component such as the RAM 122 driven by the DC 1.5V power supply voltage output from the regulator circuit 133. It will be possible. As a result, when the power is turned on, for example, an appropriate board configuration that allows the effect control CPU 120 to immediately read the stored data in the ROM 121 becomes possible.

The power supply voltage of DC 1.5 V output from the regulator circuit 133 may be supplied to a component configured as a substrate different from the effect control substrate 12, such as the RAM 122. In this manner, by causing the regulator circuit 133 different from the step-down converter circuit 132 to output the power supply voltage of DC 1.5V supplied to the board different from the effect control board 12, it is possible to prevent the manufacturing cost from increasing. An appropriate substrate configuration that disperses the heat generated in the electric circuit becomes possible.

(Explanation regarding the characteristic part 30AK)
FIG. 17 shows a configuration example of a portion in which a wiring pattern connecting the CPU 103 and the RAM 102 is formed on one substrate surface (front surface) of the main substrate 11 regarding the characteristic portion 30AK of the present embodiment. On the main board 11, a wiring pattern forming a plurality of signal wirings is formed in order to connect a plurality of electric components such as the RAM 102 and the CPU 103 by a plurality of signal wirings. The CPU 103 is an electric component configured to be able to execute a predetermined process regarding game control in the pachinko gaming machine 1, and the RAM 102 is an electrical component configured to be able to store information related to the execution of the process by the CPU 103.

One or a plurality of ground conductors are arranged in the periphery of the wiring patterns forming the plurality of signal wirings or in the area between the signal wirings. The ground conductor functions as a reference ground and a characteristic impedance adjusting ground, and is maintained at the ground voltage. In the configuration example shown in FIG. 17, as the plurality of ground conductors, the ground conductors 30AK10G and 30AK11G are arranged in a region around the plurality of signal wirings, and the ground conductor 30AK20G is arranged in a region between the plurality of signal wirings. .. As described above, one or a plurality of ground conductors may be provided in a blank area which is a blank area in which the wiring patterns forming the plurality of signal wirings are not provided. Accordingly, it is possible to prevent or suppress electromagnetic interference due to electromagnetic noise emitted from a plurality of signal wirings and electromagnetic noise between signal wirings.

Note that the plurality of ground conductors are not limited to being arranged in both areas around the signal wirings and between the signal wirings, and the ground conductors are provided only in one area around the plurality of signal wirings or between the signal wirings. It may be arranged. Alternatively, such a ground conductor may not be arranged.

FIG. 18 shows regions and sections for explaining the wiring pattern forming the plurality of signal wirings shown in FIG. 17 in more detail. A region 30AK01R shown in FIG. 18 is a region at the end on the side where a plurality of signal wirings are connected to the CPU 103. The region 30AK10R shown in FIG. 18 is a region in which a plurality of signal wirings are all linear or substantially linear and are parallel or substantially parallel to each other, and the region 30AK11R and the region 30AK12R shown in FIG. This is a region in which the signal wiring of the part has a second shape that is different from the linear shape and the substantially linear shape and is not parallel or substantially parallel to the other signal wiring. In the section 30AK0SC shown in FIG. 18, a short distance pattern in which some of the plurality of signal wirings are connected at the shortest distance or the shortest distance and a signal wiring not included in the short distance pattern are longer than the short distance pattern. And long-distance patterns to be connected with are arranged.

FIG. 19 is an enlarged view of the area 30AK01R shown in FIG. In the region 30AK01R shown in FIG. 19, the wiring patterns forming the plurality of signal wirings include patterns 30AK10D to 30AK13D, patterns 30AK10CK, patterns 30AK10CS, patterns 30AK10RS, and patterns 30AK10A to 30AK14A.

FIG. 20 shows a setting example of the signal type, the presence/absence of signal synchronization, and the presence/absence of a meandering shape, corresponding to the wiring pattern shown in FIG. The signal type shown in FIG. 20 indicates the content (use) of the electric signal transmitted by the signal wiring formed by the pattern of each wiring. The signal synchronization shown in FIG. 20 indicates whether or not there is synchronization with an electric signal transmitted through another signal wiring. The meandering shape shown in FIG. 20 indicates whether or not the pattern of each wiring connecting between the RAM 102 and the CPU 103 is provided with a portion having a meandering shape different from the linear shape and the substantially linear shape. The meandering shape is also referred to as a meander shape, a zigzag shape, or a folded shape, and by repeatedly bending the signal wiring with respect to the extending direction of the signal wiring in a predetermined section, for example, in a direction orthogonal or substantially orthogonal to the extending direction. Any shape may be used as long as it is folded back and forth.

In the setting example shown in FIG. 20, each of the wiring patterns 30AK10D to 30AK13D constitutes a signal wiring for transmitting a data signal. The data signal transmitted through each signal wiring is transmitted in synchronization with a signal transmitted through another signal wiring such as a clock signal and a data signal transmitted through another signal wiring. The wiring pattern 30AK10CK constitutes a signal wiring for transmitting a clock signal. The clock signal is transmitted in synchronization with signals transmitted through other signal lines, such as data signals, address signals, and chip select signals. The wiring pattern 30AK10CS constitutes a signal wiring for transmitting a chip select signal. The chip select signal is transmitted in synchronization with a signal such as a clock signal transmitted through another signal line. The wiring pattern 30AK10RS constitutes a signal wiring for transmitting a reset signal. The reset signal is transmitted asynchronously with the signal transmitted through the other signal wiring. Each of the wiring patterns 30AK10A to 30AK14A constitutes a signal wiring for transmitting an address signal. The address signal transmitted through each signal wiring is transmitted in synchronization with a signal transmitted through another signal wiring such as a clock signal and an address signal transmitted through another signal wiring.

The wiring patterns 30AK10D to 30AK13D that form the signal wiring for transmitting the data signal among the data signal, the clock signal, the chip select signal, and the address signal that are transmitted in synchronization with the signal transmitted by the other signal wiring A wiring pattern 30AK10D having no meandering shape is included. At least a part of the wiring pattern forming the signal wiring for transmitting the data signal, the clock signal, the chip select signal, and the address signal different from the data signal transmitted by the signal wiring formed by the wiring pattern 30AK10D has a linear shape. And has a meandering shape as a shape different from the substantially linear shape.

The signal wiring for transmitting the data signal formed by the wiring pattern 30AK10D is between the connection terminals in the RAM 102 and the CPU 103 as compared with the signal wiring for transmitting the other data signal, the clock signal, the chip select signal, and the address signal. The distance is getting longer. Therefore, at least a part of the wiring pattern constituting the signal wiring for transmitting the data signal, the clock signal, the chip select signal, and the address signal different from the data signal transmitted by the signal wiring formed by the wiring pattern 30AK10D is formed. Due to the meandering shape, the wiring length of each signal wiring becomes the same or substantially the same. On the other hand, it is not necessary to provide the wiring pattern 30AK10D with a meandering shape.

As described above, among the signal wirings for transmitting the synchronization signal, the signal wirings in which the distance between the connection terminals in the plurality of electric components is longer than the distance between the other connection terminals is, for example, a wiring portion having a meandering shape. The wiring pattern may be formed so as not to include a wiring portion having a shape different from the linear shape and the substantially linear shape. Conversely speaking, the signal wiring formed by the wiring pattern that has a linear shape or a substantially linear shape but does not include a linear shape such as a meandering shape and a shape different from the substantially linear shape has a meandering shape. The distance between the connection terminals of the plurality of electric components is longer than that of the signal wiring formed by the wiring pattern including a straight line shape and a shape different from the substantially straight line shape. Alternatively, among the signal wirings for transmitting the synchronization signal, the signal wirings in which the distance between the connection terminals in the plurality of electric components is longer than the distance between the other connection terminals is, for example, a wiring portion having a meandering shape. The wiring pattern may be formed so as not to include a wiring portion having a shape different from the shape parallel and substantially parallel to the signal wiring. Conversely, the signal wiring formed by the wiring pattern that is parallel or substantially parallel to the other signal wiring but does not include a shape different from the parallel and substantially parallel shapes such as the meandering shape is the meandering shape. The distance between the connection terminals of the plurality of electric components is longer than that of the signal wiring formed by the wiring pattern including the shape different from the shape parallel and substantially parallel to the other signal wiring. This makes it possible to prevent or suppress the occurrence of delay time differences (skew) between the signals transmitted by the plurality of signal wirings by making the wiring lengths of the signal wirings the same or substantially the same. By reducing the delay time difference between the signals transmitted through the plurality of signal wirings, the reliability of the signals transmitted through the plurality of signal wirings can be improved.

The wiring pattern 30AK10RS is not provided with a meandering shape. The wiring pattern 30AK10RS constitutes a signal wiring for transmitting a reset signal which is an asynchronous signal. When transmitting an asynchronous signal such as a reset signal, it is not necessary to consider a delay time difference from a signal transmitted through another signal wiring. Therefore, unlike the wiring pattern 30AK10RS forming the signal wiring for transmitting the reset signal, the wiring pattern forming the signal wiring for transmitting the asynchronous signal does not have a meandering shape. If the meandering shape is not provided in the wiring pattern, an increase in the area of the substrate on which the wiring pattern is arranged can be suppressed, and the size of the substrate can be reduced.

As a wiring pattern having no meandering shape, a wiring pattern forming a dummy wiring maintained at the ground voltage may be arranged. For example, in the signal wiring formed by the wiring pattern 30AK10RS, the reset voltage may be transmitted and the ground voltage may be maintained. The wiring pattern 30AK10RS includes wiring patterns 30AK10D to 30AK13D that form a signal wiring for transmitting a data signal, wiring patterns 30AK10CK that forms a signal wiring for transmitting a clock signal, and a chip select signal. It is arranged between a group of patterns composed of wiring patterns 30AK10CS forming the signal wiring and a group of patterns composed of wiring patterns 30AK10A to 30AK14A forming the signal wiring for transmitting an address signal. There is. By using a signal wiring arranged between other signal wirings, such as the wiring pattern 30AK10RS, as a dummy wiring maintained at the ground voltage, it is possible to prevent or suppress electromagnetic interference due to electromagnetic noise in a plurality of signal wirings. .. As a wiring pattern having no meandering shape, a wiring pattern maintained at the power supply voltage may be arranged instead of the dummy wiring maintained at the ground voltage or together with the dummy wiring maintained at the ground voltage. For example, in the signal wiring formed by the wiring pattern 30AK10RS, the reset signal may be maintained instead of being transmitted at the power supply voltage. If the wiring pattern maintained at the power supply voltage is arranged close to the wiring patterns forming other signal wirings, electromagnetic noise may occur due to electromagnetic coupling between the respective signal wirings. Therefore, when arranging the wiring pattern that is maintained at the power supply voltage, the distance from the signal wiring is set to be longer than that when arranging the wiring pattern that is maintained at the ground voltage. A pattern may be formed. As a result, it is possible to prevent or suppress electromagnetic interference due to electromagnetic noise in the signal wiring.

FIG. 21 is an enlarged view of the region 30AK10R shown in FIG. Wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed in the region 30AK10R. These wiring patterns are formed in the region 30AK10R such that the plurality of signal wirings are all linear or substantially linear and parallel or substantially parallel to each other. In this manner, in the region 30AK10R, the wiring patterns forming the plurality of signal wirings are all formed to have a linear shape or a substantially linear shape, and the plurality of signal wirings have a shape parallel or substantially parallel to each other. A wiring pattern is formed.

FIG. 22 is an enlarged view of the region 30AK11R shown in FIG. Similar to the region 30AK10R, wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed in the region 30AK11R. In the region 30AK11R, these wiring patterns are formed so that at least one signal wiring has a linear shape or a substantially linear shape, while other signal wirings have a shape different from the linear shape and the substantially linear shape. Is formed. In a region 30AK11R shown in FIG. 22, for example, a wiring pattern 30AK10CK forming a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS forming a signal wiring for transmitting a chip select signal have a plurality of bent portions. Although included, each is formed to have a linear shape or a substantially linear shape. In the region 30AK11R shown in FIG. 22, the wiring pattern 30AK10RS forming the signal wiring for transmitting the reset signal is formed to have a linear shape or a substantially linear shape that does not include a bent portion. On the other hand, in the region 30AK11R shown in FIG. 22, the wiring patterns 30AK10A to 30AK14A forming the signal wiring for transmitting the address signal have a meandering shape formed by a plurality of bent portions, and have a linear shape and a substantially linear shape. Are formed to have different shapes.

In the portion where the meandering shape is formed, the signal wiring may be bent in a direction orthogonal to the original extending direction by, for example, interposing a plurality of bent portions. In each of the bent portions, the signal wiring may be bent so as to form an angle (obtuse angle) larger than a right angle to form a wiring pattern in which the extending direction of the signal wiring is changed. In this case, the signal wiring is bent such that the bending amount at each bent portion is smaller than the right angle. In the portion where the meandering shape is formed, the signal wiring can be extended in the first extending direction and the second extending direction which is orthogonal or substantially orthogonal to the first extending direction, and the first extending direction is provided. A plurality of bent portions may be provided between the wiring pattern forming the signal wiring in the direction and the wiring pattern forming the signal wiring in the second extending direction. In this way, the extending direction of the signal wiring is changed via the plurality of bent portions in which the bending amount of the signal wiring is smaller than the predetermined angle. By reducing the amount of bending, the pattern width of the wiring at the bent portion is prevented from changing significantly, the characteristic impedance of the transmission line is prevented from changing suddenly, and electromagnetic waves caused by electromagnetic noise in multiple signal wirings are prevented. Interference is prevented or suppressed.

In each signal wiring, a plurality of bent portions may be arranged so that the position of the bent portion is a distance longer than a predetermined length from the position of the bent portion in the other signal wiring. The predetermined length may be a predetermined length from the viewpoint of board design, such as a fixed length included in the range of 2 mm to 5 mm. At the bent portion of the signal wiring, electromagnetic noise is likely to occur due to changes in characteristic impedance and the like. The bent portion formed by the wiring pattern forming one signal wiring included in the plurality of signal wirings is close to the bent portion formed by the wiring pattern forming another signal wiring included in the plurality of signal wirings. When arranged, the signal transmitted through each signal wiring may be easily affected by electromagnetic noise. Therefore, a bent portion formed by a wiring pattern forming one signal wiring included in the plurality of signal wirings and a bent portion formed by a wiring pattern forming another signal wiring included in the plurality of signal wirings are formed. The electromagnetic interference due to the electromagnetic noise in the plurality of signal wirings can be prevented or suppressed by arranging the plurality of signal wirings at intervals such that the distance is longer than the predetermined length.

In the region 30AK11R, at least one signal wiring is formed to have a shape different from parallel and substantially parallel. In the region 30AK11R shown in FIG. 22, for example, a wiring pattern 30AK10CK that forms a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS that forms a signal wiring for transmitting a chip select signal each have a plurality of patterns. The signal wirings are formed so as to have a parallel or substantially parallel shape as a whole through the bent portion. On the other hand, in the region 30AK11R shown in FIG. 22, the wiring patterns 30AK10A to 30AK14A that form the signal wiring for transmitting the address signal are formed in a meandering shape by a plurality of bent portions, so that they are mutually formed as a whole. The signal wiring is formed to have a shape different from parallel or substantially parallel.

In the region 30AK11R shown in FIG. 22, at least one signal wiring of the plurality of signal wirings has a meandering shape or the like different from the parallel and substantially parallel shapes. In this region 30AK11R, in the space region 30AK0SP adjacent to the pattern of the wiring forming the signal wiring, at least a conductor is not provided on the same substrate as the signal wiring. The space region 30AK0SP is, for example, close to the wiring patterns 30AK10A to 30AK13A in which the meandering shape is provided in the region 30AK11R among the wiring patterns 30AK10A to 30AK14A forming the signal wiring for transmitting the address signal. Since no conductor is provided in the space region 30AK0SP, it is possible to prevent or suppress electromagnetic interference due to electromagnetic noise in a plurality of signal wirings. When a conductor is provided in the area close to the meandering wiring pattern, electromagnetic waves may be emitted from the signal wiring, and electromagnetic noise may occur due to electromagnetic coupling between the signal wiring and the conductor. May occur. Therefore, the conductor is not provided in a region close to the wiring pattern provided with the meandering shape, such as the space region 30AK0SP, thereby preventing or suppressing electromagnetic interference due to electromagnetic noise in a plurality of signal wirings. To be

FIG. 23 is a cross-sectional view showing a configuration example of the main board 11 formed as a multilayer wiring board. The main substrate 11 shown in FIG. 23 has a multi-layer structure formed by stacking synthetic resins, and various wiring patterns can be formed on the surface of each layer or the inner layer. A plurality of electronic components such as the RAM 102 and the CPU 103 are electrically connected via the wiring pattern formed on the main substrate 11 having such a multilayer structure. The multilayer structure of the main substrate 11 shown in FIG. 23 includes a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back surface layer 30AK2S.

A surface layer 30AK1S is provided on the surface of the main substrate 11 that is one of the substrate surfaces, and wiring patterns 30AK10P and patterns 30AK11P that form the signal wiring are formed. A back surface layer 30AK2S is provided on the back surface that is the other board surface of the main board 11, and wiring patterns 30AK20P that form signal wirings are formed. The wiring pattern 30AK10P formed on the surface layer 30AK1S of the main substrate 11 is connected to the wiring pattern 30AK20P formed on the back surface layer 30AK2S through the through hole 30AK1H penetrating the surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11. It is electrically connected. The wiring pattern 30AK11P formed on the surface layer 30AK1S of the main board 11 is connected to the wiring pattern 30AK20P formed on the back surface layer 30AK2S via the through holes 30AK2H penetrating the surface layer 30AK1S and the back surface layer 30AK2S of the main board 11. It is electrically connected. In this way, the main substrate 11 is provided with the wiring patterns 30AK10P and 30AK11P that form the signal wiring in the surface layer 30AK1S provided on the surface serving as one substrate surface, and the back surface serving as the other substrate surface. The back surface layer 30AK2S is provided with through holes 30AK1H and through holes 30AK2H capable of being electrically connected to the wiring patterns 30AK20P forming the signal wiring.

The wiring lengths of the signal wirings included in the plurality of signal wirings that connect the RAM 102 and the CPU 103 shown in FIG. 23 are as follows: Not only the wiring length of the signal wiring formed by the pattern 30AK20P but also the lengths of the through holes 30AK1H and 30AK2H are the same or substantially the same. In the main substrate 11 having the multilayer structure shown in FIG. 23, the signal lengths of the signal wirings including the lengths of the through holes 30AK1H and the through holes 30AK2H are set to be the same or substantially the same, and signals transmitted by a plurality of signal wirings are It is possible to prevent or suppress the occurrence of a delay time difference. By reducing the delay time difference of the signals transmitted by the plurality of signal wirings in the multilayer wiring board such as the main substrate 11, the reliability of the signals transmitted by the plurality of signal wirings can be improved.

In the main substrate 11 having the multilayer structure shown in FIG. 23, a ground layer 30AK1L is provided as a conductor layer adjacent to the surface layer 30AK1S. One or more ground conductors are arranged on the ground layer 30AK1L, and the ground conductors are maintained at the ground voltage. In at least one of the patterns 30AK10P and 30AK11P of the wirings forming the signal wiring in the surface layer 30AK1S, a plurality of signal wirings are parallel and substantially parallel in at least one of the patterns, which is different from the linear shape and the substantially linear shape such as the meandering shape. It may be formed so as to include a region having a shape different from the above shape. No signal is transmitted in the ground layer 30AK1L as a conductor layer adjacent to the surface layer 30AK1S. Since signals are not transmitted in the conductor layer adjacent to the surface layer 30AK1S on which the wiring patterns 30AK10P and 30AK11P are formed, the signals transmitted by the plurality of signal wirings formed by the wiring patterns 30AK10P and 30AK11P are electromagnetic waves. It becomes difficult to be affected by noise, and the influence of electromagnetic noise on other signal wirings can be prevented or suppressed.

In the back surface layer 30AK2S of the main substrate 11 having the multilayer structure shown in FIG. 23, a wiring pattern 30AK20P that constitutes a signal wiring has a shape different from a linear shape and a substantially linear shape, such as a meandering shape, and a plurality of signal wirings are parallel and substantially parallel. It may be formed to include a region having a shape different from the parallel shape. No signal is transmitted in the power supply layer 30AK4L as a conductor layer adjacent to the back surface layer 30AK2S. One or more power supply conductors are arranged on the power supply layer 30AK4L, and the power supply conductors are maintained at the power supply voltage. Since signals are not transmitted in the conductor layer adjacent to the back surface layer 30AK2S on which the wiring pattern 30AK20P is formed, signals transmitted by a plurality of signal wirings configured by the wiring pattern 30AK20P are less susceptible to electromagnetic noise. Therefore, it is possible to prevent or suppress the influence of electromagnetic noise on other signal wirings. In a multilayer wiring board such as the main board 11, since no signal is transmitted in a conductor layer adjacent to a layer in which a plurality of signal wirings are provided, prevention or suppression of electromagnetic interference due to electromagnetic noise in the plurality of signal wirings Is planned.

In the wiring layer 30AK3L of the main substrate 11 having the multi-layer structure shown in FIG. 23, the wiring pattern forming the signal wiring has a shape different from a linear shape and a substantially linear shape such as a meandering shape, and a plurality of signal wirings are parallel and substantially parallel. It may be formed so as to include a region having a shape different from this shape. No signal is transmitted in the power supply layer 30AK2L or the power supply layer 30AK4L as the conductor layer adjacent to the wiring layer 30AK3L. In a multilayer wiring board such as the main board 11, a conductor layer adjacent to the wiring layer 30AK3L in which a plurality of signal wirings are provided does not transmit a signal, so that electromagnetic interference due to electromagnetic noise in the plurality of signal wirings is prevented or Suppression is achieved. However, in the case where the wiring layer 30AK3L, which is an inner conductor layer provided on the multilayer wiring board, is formed so that the pattern of the wirings forming the signal wiring includes a region having a meandering shape or the like, When a failure such as disconnection occurs, it may be difficult to confirm the state of the signal wiring in the wiring layer 30AK3L from the outside of the substrate. On the other hand, areas such as the front surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 in which the wiring pattern forming the signal wiring has a meandering shape or the like on one substrate surface or the other substrate surface of the main substrate 11 are provided. In the case where it is formed so as to include, it becomes possible to form an appropriate board configuration in which it is easy to confirm the state of the signal wiring in the front surface layer 30AK1S or the back surface layer 30AK2S from the outside of the board when a failure occurs due to disconnection of the signal wiring. Become.

The through holes penetrating the front surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 are not limited to the through holes 30AK1H and the through holes 30AK2H shown in FIG. 23, and more through holes are provided and signals in a plurality of signal wirings are provided. It may be used to make the wiring lengths the same or substantially the same. In the wiring patterns forming the plurality of signal wirings, the signal wirings are arranged only in the surface layer 30AK1S of the main board 11 without interposing through holes such as the through holes 30AK1H and 30AK2H. The formed pattern may be included. The signal wiring such as the signal wiring for transmitting the data signal configured by the wiring pattern 30AK10D, in which the distance between the connection terminals of the plurality of electric components is longer than the distance between the other connection terminals, the through hole 30AK1H and the through hole The signal wiring may be arranged only in the surface layer 30AK1S of the main substrate 11 without passing through a through hole such as the hole 30AK2H. Conversely speaking, the signal wiring formed by the wiring pattern formed in one conductor layer such as the front surface layer 30AK1S without the interposition of the through holes includes the through holes in the plurality of conductor layers such as the front surface layer 30AK1S and the back surface layer 30AK2S. The distance between the connection terminals of the plurality of electric components is longer than that of the signal wiring formed by the wiring pattern formed so as to be electrically connectable via the.

When a plurality of signal wirings are provided adjacent to each other, a small blank area is formed like the space area 30AK0SP shown in FIG. It is also conceivable to provide a through hole in this blank area and to have a through hole electrode in which a conductive material such as copper is embedded so as to be electrically connected to another conductor layer such as the ground layer 30AK1L. In a configuration in which a conductor such as a through-hole electrode is provided in the blank area, a large number of through-hole electrodes may be arranged in order to stabilize the electric field distribution in the blank area, for example. In this case, not only the front surface layer 30AK1S of the main substrate 11 but also the back surface layer 30AK2S are provided with structures corresponding to through-hole electrodes such as bumps, which restricts the design of the wiring pattern on the substrate. Inconvenience may occur. In addition, in the ground layer 30AK1L and the power supply layers 30AK2L, 30AK4L, which are inner conductor layers provided on the multilayer wiring board, when the through-hole electrode is provided, the conductor layer pattern is removed around the through-hole electrode. As a result, the pattern in the inner conductor layer such as the ground layer 30AK1L, the power supply layers 30AK2L, and 30AK4L may be divided, and it may be difficult to design the pattern in the conductor layer. Further, in place of the through-hole electrode, a conductor such as a dummy pad is provided in a blank area and is not connected to other conductor layers, the conductor is affected by electromagnetic noise from the outside, This conductor may affect the plurality of signal wirings by electromagnetic noise, which may cause adverse effects such as electromagnetic interference. On the other hand, it is possible to prevent or suppress the occurrence of these inconveniences due to the fact that the conductor is not provided in the space region 30AK0SP that is close to the wiring pattern forming the signal wiring.

Other than the space region 30AK0SP shown in FIG. 22, a blank region formed when a plurality of signal wirings are provided adjacent to each other is different from the constituent material of the substrate such as a screw hole for fixing the substrate. The structure in which the material is used may not be provided. If a screw hole for fixing the board is provided, when the board is fixed by screwing, the constituent material of the screw is affected by electromagnetic noise from the outside, and other signal wiring is also adversely affected such as electromagnetic interference. May cause inconvenience. In addition, a structure using a synthetic resin or a dielectric material having a dielectric constant different from that of the insulating layer included in the substrate, or a structure using a synthetic resin or a metal material having an electric conductivity different from that of the conductor layer included in the substrate is used. , If these structures are provided in a blank area close to multiple signal lines, these structures may be affected by electromagnetic noise from the outside, or these structures may affect multiple signal lines by electromagnetic noise. As a result, there is a possibility that an inconvenience that adversely affects electromagnetic interference may occur. On the other hand, in the blank area such as the space area 30AK0SP, which is close to the wiring pattern forming the signal wiring, a structure using a material different from the constituent material of the substrate is not provided, which causes these disadvantages. This can be prevented or suppressed.

In the section 30AK0SC shown in FIG. 18, one of the wiring patterns 30AK10D to 30AK13D forming a plurality of signal wirings for transmitting a data signal has a shape different from a linear shape and a substantially linear shape such as a meandering shape. Is formed so as to include a portion of the signal wiring having a shape different from the shape parallel and substantially parallel to the other signal wiring. On the other hand, at least the pattern 30AK10D and the pattern 30AK11D are formed in the section 30AK0SC so as not to include a meandering shape but to have a linear shape or a substantially linear shape such that the signal wirings thereof are parallel or substantially parallel to each other. .. Therefore, the patterns 30AK10D and 30AK11D are patterns in which the signal wiring connects the section 30AK0SC in the shortest or substantially the shortest. On the other hand, the patterns 30AK12D and 30AK13D are patterns in which the signal wiring connects the section 30AK0SC at a longer distance than the patterns 30AK10D and 30AK11D.

In the section 30AK0SC, in a portion where the signal wiring formed by the pattern 30AK13D has a shape different from a linear shape such as a meandering shape and a substantially linear shape, the signal wiring formed by the other patterns 30AK10D to 30AK12D has a linear shape or It is formed to have a substantially linear shape. As described above, in a portion where the signal wiring formed by one wiring pattern among the wiring patterns forming the plurality of signal wirings has a shape different from the linear shape such as the meandering shape and the substantially linear shape, The signal wiring formed by the wiring pattern may be formed in a linear shape or a substantially linear shape. In a portion where the signal wiring configured by one wiring pattern has a shape different from the linear shape such as the meandering shape and the substantially linear shape, the signal wiring configured by the other wiring pattern has the linear shape or the substantially linear shape. It may be formed so as not to overlap with the portion. The wiring pattern is formed so that the portions that are different from the linear shape such as the meandering shape and the substantially linear shape do not overlap with each other for a plurality of signal wirings, and the increase in the area of the board on which the wiring pattern is arranged is suppressed. As a result, the size of the substrate can be reduced.

FIG. 24 shows another example of formation of a wiring pattern in which portions where a plurality of signal wirings have a meandering shape do not overlap. Also in the region 30AK20R shown in FIG. 24, in a portion where the signal wiring formed by one wiring pattern among the wiring patterns forming the plurality of signal wirings has a meandering shape, signals formed by other wiring patterns The wiring is formed to have a linear shape or a substantially linear shape. Then, when the first meandering portion, which is the portion in which the first signal wiring formed by the pattern of the first wiring has the meandering shape, ends, the second wiring formed by the pattern of the second wiring different from the pattern of the first wiring A wiring pattern forming a plurality of signal wirings is formed so that the second meandering portion, which is a portion in which the signal wirings have a meandering shape, is started. In the first meandering portion, the wiring patterns including the patterns of the second wirings forming the second signal wirings as the wirings of the signal wirings other than the first signal wirings are the signal wirings formed by the respective patterns. Need only be formed to have a parallel or substantially parallel shape. In the second meandering portion, the wiring patterns including the first wiring pattern forming the first signal wiring as the wiring patterns forming the signal wiring other than the second signal wiring are signal wirings formed by the respective patterns. Need only be formed to have a parallel or substantially parallel shape. Since the second meandering portion is started after the first meandering portion ends, the first meandering portion is arranged so as not to overlap with the second meandering portion. Thereby, even when a portion having a shape different from a linear shape such as a meandering shape and a substantially linear shape is provided for a large number of signal wirings, an increase in the substrate area on which the wiring pattern is arranged is suppressed as much as possible The size of the substrate can be reduced.

(Explanation regarding the characteristic part 42AK)
FIG. 25 shows a configuration example of a portion in which a plurality of signal wirings configured by a wiring pattern are formed in the characteristic portion 42AK of the present embodiment. The wiring pattern shown in FIG. 25 may be any pattern as long as it configures a plurality of signal wirings for connecting a plurality of electric components such as the RAM 102 and the CPU 103 on the main board 11. In the configuration example shown in FIG. 25, a wiring pattern that forms two signal wirings is shown as a wiring pattern that forms a plurality of signal wirings. 25A shows a case where the wiring interval W1 is W1<W2 narrower than the wiring interval W2, and FIG. 25B shows a case where the wiring interval W1 is wider than the wiring interval W2>W1>W2. The wiring interval W1 is a wiring interval according to a wiring pattern in a portion where the same signal wiring has a meandering shape. The wiring interval W2 is a wiring interval depending on the patterns of the wirings that are different from each other and that are adjacent to each other in parallel or substantially in parallel.

The wiring patterns forming the two signal wirings shown in FIG. 25A include a wiring first pattern 42AK10 and a wiring second pattern 42AK11. The first wiring pattern 42AK10 and the second wiring pattern 42AK11 are arranged such that each of the signal wirings includes a wiring portion 42AK1Z and a wiring portion 42AK2Z in accordance with the shape of the signal wiring formed by the wiring patterns. Is formed.

In the wiring portion 42AK1Z, the signal wiring constituted by the wiring first pattern 42AK10 forms the second shape portion 42AK10M, and the signal wiring constituted by the wiring second pattern 42AK11 forms the first shape portion 42AK11L. .. In the wiring portion 42AK2Z, the signal wiring constituted by the wiring first pattern 42AK10 forms the first shape portion 42AK10L, and the signal wiring constituted by the wiring second pattern 42AK11 forms the second shape portion 42AK11M. .. The first shape portions 42AK10L and 42AK11L are formed such that the signal wiring has a linear or substantially linear first shape. The second shape portions 42AK10M and 42AK11M are formed to have a second shape different from the linear shape and the substantially linear shape, such as the meandering shape of the signal wiring. The second shape portions 42AK10M and 42AK11M are not limited to the meandering shape, and may be any shape different from the linear shape and the substantially linear shape.

As described above, in the plurality of signal wirings configured by the wiring first pattern 42AK10 and the wiring second pattern 42AK11, the signal wiring configured by the wiring second pattern 42AK11 in the wiring portion 42AK1Z has a linear shape or Corresponding to the first shape portion 42AK11L that is the substantially linear first shape, the signal wiring configured by the first pattern 42AK10 of the wiring has a second shape such as a meandering shape different from the first shape portion 42AK11L. The second shape portion 42AK10M is included. That is, in the wiring portion 42AK1Z, the signal wiring configured by the wiring first pattern 42AK10 includes the second shaping portion 42AK11M corresponding to the first shape portion 42AK11L in the signal wiring configured by the wiring second pattern 42AK11. I'm out.

Further, regarding the plurality of signal wirings configured by the wiring first pattern 42AK10 and the wiring second pattern 42AK11, the signal wiring configured by the wiring first pattern 42AK10 in the wiring portion 42AK2Z has a linear shape or a substantially straight line. In correspondence with the first shape portion 42AK10L that is the first shape, the signal wiring configured by the second pattern 42AK11 of the wiring has a second shape such as a meandering shape different from the first shape portion 42AK10L. The shape portion 42AK11M is included. That is, in the wiring portion 42AK2Z, the signal wiring configured by the second wiring pattern 42AK11 includes the second shaping portion 42AK11M corresponding to the first shaped portion 42AK10L in the signal wiring configured by the wiring first pattern 42AK10. I'm out.

In the second shape portion 42AK10M and the second shape portion 42AK11M in which the signal wiring shown in FIG. 25A has a second shape such as a meandering shape, the second shape portion 42AK10M is included in the wiring portion 42AK1Z, and the second shape portion 42AK11M. Are formed so as to be included in the wiring portion 42AK2Z. As a result, the second shape portion 42AK10M and the second shape portion 42AK11M do not overlap each other in their arrangement. In addition, the signal lines are formed to have the same or substantially the same wiring length. Since the signal wiring configured by the wiring first pattern 42AK10 and the wiring second pattern 42AK11 is formed so as to include the second shaped portion 42AK10M and the second shaped portion 42AK11M, the wiring pattern is formed. It is possible to reduce the size of the board by suppressing an increase in the area of the board on which the board is arranged.

The wiring pattern forming the two signal wirings shown in FIG. 25B includes a wiring third pattern 42AK12 and a wiring fourth pattern 42AK13. The third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 include the signal wirings 42AK3Z and 42AK4Z according to the shapes of the signal wirings formed by the wiring patterns. Is formed.

The signal wiring formed by the wiring third pattern 42AK12 and the wiring fourth pattern 42AK13 is the first linear or substantially linear signal wiring formed by the wiring fourth pattern 42AK13 in the wiring portion 42AK3Z. Corresponding to the first shape portion 42AK13L having a shape, the signal wiring configured by the third pattern 42AK12 of the wiring has a second shape portion 42AK12M having a second shape such as a meandering shape different from the first shape portion 42AK13L. Contains. That is, in the wiring portion 42AK3Z, the signal wiring configured by the wiring third pattern 42AK12 includes the second shaping portion 42AK12M corresponding to the first shape portion 42AK13L in the signal wiring configured by the wiring fourth pattern 42AK13. I'm out.

Further, regarding the signal wiring formed by the wiring third pattern 42AK12 and the wiring fourth pattern 42AK13, in the wiring portion 42AK4Z, the signal wiring formed by the wiring third pattern 42AK12 has a linear shape or a substantially linear shape. Corresponding to the first shape portion 42AK12L having the first shape, the signal wiring formed by the fourth pattern 42AK13 of wiring has a second shape portion such as a meandering shape different from the first shape portion 42AK12L. Includes 42AK13M. That is, in the wiring portion 42AK4Z, the signal wiring configured by the wiring fourth pattern 42AK13 includes the second shaping portion 42AK13M corresponding to the first shaped portion 42AK12L in the signal wiring configured by the wiring third pattern 42AK12. I'm out.

In the second shape portion 42AK12M and the second shape portion 42AK13M in which the signal wiring shown in FIG. 25B has a second shape such as a meandering shape, the second shape portion 42AK12M is included in the wiring portion 42AK3Z, and the second shape portion 42AK13M. Are formed so as to be included in the wiring portion 42AK4Z. As a result, the second shape portion 42AK12M and the second shape portion 42AK13M do not overlap each other in their arrangement. In addition, the signal lines are formed to have the same or substantially the same wiring length. Since the signal wiring constituted by the wiring third pattern 42AK12 and the wiring fourth pattern 42AK13 is formed so as to include the second shaped portion 42AK12M and the second shaped portion 42AK13L, the wiring pattern is formed. It is possible to reduce the size of the board by suppressing an increase in the area of the board on which is arranged.

In the configuration example shown in FIG. 25A, each signal wiring is formed so that the wiring distance W2 is wider than the wiring distance W1. For example, in the second shape portion 42AK10M and the second shape portion 42AK11M, the same signal wiring folded back by the bending portion forms a meandering shape that reciprocates at the wiring interval W1, whereas the first wiring pattern 42AK10 is formed. When the signal wiring to be formed and the signal wiring formed by the second wiring pattern 42AK11 are parallel or substantially parallel to each other, the wiring distance W2 between the adjacent signal wirings is set to be wider than the wiring distance W1. Signal wiring is formed. In this way, since the wiring distance W2 between adjacent signal wirings is wider than the wiring distance W1 in the same signal wiring, the adverse effect due to a short circuit or the like generated in one signal wiring is caused in another signal wiring. It is possible to prevent or suppress the influence on the transmitted signal.

In the configuration example shown in FIG. 25B, each signal wiring is formed so that the wiring distance W2 is narrower than the wiring distance W1. For example, in the second shape portion 42AK12M and the second shape portion 42AK13M, the same signal wiring folded back by the bent portion forms a meandering shape that reciprocates at the wiring interval W1, whereas it is configured by the third wiring pattern 42AK12. When the signal wiring to be formed and the signal wiring formed by the wiring fourth pattern 42AK13 are parallel or substantially parallel to each other, the wiring interval W2 between the adjacent signal wirings is set to be narrower than the wiring interval W1. Signal wiring is formed. In this way, the wiring distance W2 between adjacent signal wirings is narrower than the wiring distance W1 in the same signal wiring, so that one signal wiring and another signal wiring are more than a short circuit inside one signal wiring. A short circuit between and is more likely to occur. A short circuit that occurs between one signal wiring and another signal wiring can be easily detected by using a test point provided on each signal wiring. For example, a test probe is brought into contact with a test point provided on each signal wiring to inspect the electrical characteristics of the signal wiring, so that a short circuit generated between one signal wiring and another signal wiring can be detected. ..

As shown in FIG. 25A, on the one hand, the signal wiring formed by the wiring second pattern 42AK11 corresponds to the wiring portion 42AK1Z forming the first shape portion 42AK11L, and the wiring first pattern 42AK10. The signal wiring constituted by forms the second shape portion 42AK10M. On the other hand, the signal wiring constituted by the wiring first pattern 42AK10 corresponds to the wiring portion 42AK1Z forming the first formation portion 42AK10L, and the signal wiring constituted by the wiring second pattern 42AK11 has the second shape. The portion 42AK11M is formed. As shown in FIG. 25B, on the other hand, the signal wiring formed by the wiring fourth pattern 42AK13 corresponds to the wiring portion 42AK3Z forming the first shape portion 42AK13L, and the third wiring pattern 42AK12. The signal wiring constituted by forms the second shape portion 42AK12M. On the other hand, the signal wiring formed by the wiring third pattern 42AK12 corresponds to the wiring portion 42AK4Z forming the first shape portion 42AK12L, and the signal wiring formed by the wiring fourth pattern 42AK13 has the second shape. The portion 42AK13M is formed. The correspondence relationship between the signal wirings formed by the wiring patterns is a predetermined arbitrary relationship such as a vertical relationship, a horizontal relationship, or a range less than a predetermined distance when viewed from a direction perpendicular to a substrate surface such as the main substrate 11. The relationship may be satisfied if the signal wiring is within the position range of 1 above, and is not satisfied if the signal wiring is not within such a position range.

In the example shown in FIGS. 25A and 25B, the signal wiring formed by another wiring pattern corresponds to the first shape portion of the signal wiring formed by one wiring pattern and the second signal wiring is formed by the second wiring pattern. The wiring portion forming the shape and the signal wiring formed by the pattern of one wiring corresponding to the first shape portion in the signal wiring formed by the pattern of another wiring form the second shape. In the wiring portion, each signal wiring is formed such that the wiring distance W1 is common and the wiring distance W2 is also common. More specifically, the signal wiring formed by the first wiring pattern 42AK10 corresponds to the first shape portion 42AK11L in the signal wiring formed by the second wiring pattern 42AK11 shown in FIG. 25A. The signal wiring formed by the second pattern 42AK11 of the wiring corresponds to the wiring portion 42AK1Z forming the two-shaped portion 42AK10M and the first shape portion 42AK10L in the signal wiring formed by the first pattern 42AK10 of the wiring. In the wiring portion 42AK2Z forming the second shape portion 42AK11M, the signal wirings are formed such that the wiring distance W1 is common (constant) and the wiring distance W2 is also common (constant). This facilitates the wiring pattern design on the substrate surface. Further, since the difference in shape between the plurality of signal wirings is suppressed, it is possible to suppress the variation in the characteristic impedance of each signal wiring and to homogenize the signal quality in the plurality of signal wirings.

It is to be noted that the wiring portion in which the signal wiring formed by the pattern of another wiring forms the second shape corresponding to the first shape portion of the signal wiring formed by the pattern of one wiring, and With respect to the wiring portion in which the signal wiring configured by the pattern of one wiring forms the second shape corresponding to the first shape portion in the signal wiring configured by the pattern, one of the wiring spacing W1 and the wiring spacing W2 is set. Alternatively, the signal wirings may be formed so that they are different from each other. For example, in the wiring section 42AK1Z and the wiring section 42AK2Z shown in FIG. 25A, the wiring interval W2 is common, but the wiring interval W1 is wider in the wiring section 42AK2Z than in the wiring section 42AK1Z. Wiring may be formed. In such a case, it is possible to flexibly design the wiring pattern on the substrate surface.

FIG. 26 shows a configuration example in which the second shape portions of a plurality of signal wirings formed by wiring patterns are formed in different directions. In the configuration example shown in FIG. 26A, a wiring pattern forming three signal wirings is shown as a wiring pattern forming a plurality of signal wirings. In the configuration example shown in FIG. 26B, a wiring pattern forming four signal wirings is shown as a wiring pattern forming a plurality of signal wirings.

The wiring patterns forming the three signal wirings shown in FIG. 26A include a wiring first pattern 42AK20, a wiring second pattern 42AK21, and a wiring third pattern 42AK22. The signal wiring formed by the first wiring pattern 42AK20 includes a portion forming the second shape portion 42AK20M. The signal wiring formed by the wiring second pattern 42AK21 includes a portion forming the second shape portion 42AK21M. The signal wiring formed by the third wiring pattern 42AK22 includes a portion forming the second shape portion 42AK22M. The second shape portion 42AK20M and the second shape portion 42AK21M have a meandering shape that turns back and forth in the first direction, such as the left-right direction. On the other hand, the second shape portion 42AK22M has a meandering shape that turns back and forth in a second direction different from the first direction, such as the vertical direction. It should be noted that each of the second shape portions is not limited to the meandering shape and may be formed in any shape different from the linear shape and the substantially linear shape.

As described above, the second shape portion 42AK20M in the signal wiring formed by the first wiring pattern 42AK20 is common (parallel) to the second shape portion 42AK21M in the signal wiring formed by the second wiring pattern 42AK21. Formed in the direction. On the other hand, the second shaped portion 42AK22M in the signal wiring formed by the third wiring pattern 42AK22 has the second shaped portion 42AK20M formed by the first wiring pattern and the second shaped portion 42AK formed by the second wiring pattern. The shape portion 42AK21M is formed in a second direction different from the first direction. Since the second shape portions are formed in different directions in the plurality of signal wirings, wiring pattern design on the substrate surface can be performed easily and flexibly. In addition, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

The wiring patterns forming the four signal wirings shown in FIG. 26B include a wiring fourth pattern 42AK23, a wiring fifth pattern 42AK24, a wiring sixth pattern 42AK25, and a wiring seventh pattern 42AK26. .. The signal wiring formed by the fourth wiring pattern 42AK23 includes a portion that forms two second shaped portions 42AK23M1 and 42AK23M2. The signal wiring formed by the fifth wiring pattern 42AK24 includes a portion that forms one second shape portion 42AK24M. The signal wiring formed by the sixth wiring pattern 42AK25 includes a portion forming one second shape portion 42AK25M. The signal wiring formed by the seventh wiring pattern 42AK26 includes a portion forming two second shaped portions 42AK26M1 and 42AK26M2. Of the plurality of second shaped portions shown in FIG. 26B, the second shaped portions 42AK23M1, 42AK25M, and 42AK26M2 have a meandering shape that turns back and forth in the first direction, such as the up-down direction. On the other hand, the second shape portions 42AK23M2, 42AK24M, 42AK26M1 have a meandering shape that turns back and forth in a second direction different from the first direction, such as the left-right direction.

As shown in FIG. 26B, the plurality of signal wirings formed by the wiring pattern include a signal wiring including a portion forming one second shape portion and a portion forming a plurality of second shape portions. There may be signal wiring including. Alternatively, the plurality of signal wirings configured by the wiring pattern may include only a portion in which each signal wiring forms one second shape portion. Alternatively, the plurality of signal wirings configured by the wiring pattern may include a portion in which each signal wiring forms a plurality of second shaped portions. The second shape portion 42AK23M1 in the signal wiring formed by the fourth wiring pattern 42AK23 shown in FIG. 26B is the second shape portion 42AK25M in the signal wiring formed by the sixth wiring pattern 42AK25 and the seventh wiring portion It is formed in the first direction that is common (parallel) to the second shape portion 42AK26M2 in the signal wiring formed by the pattern 42AK26. The second shape portion 42AK23M2 in the signal wiring formed by the wiring fourth pattern 42AK23 is formed by the second shape portion 42AK24M in the signal wiring formed by the wiring fifth pattern 42AK24 and the wiring seventh pattern 42AK26. Is formed in the second direction common (parallel) to the second shaped portion 42AK26M1 in the signal wiring. On the other hand, the second shape portions 42AK23M2, 42AK24M, 42AK26M1 are formed in a second direction different from the first direction in which the second shape portions 42AK23M1, 42AK25M, 42AK26M2 are formed.

The signal wiring formed by the fourth pattern 42AK23 of wiring includes a second shaped portion 42AK23M1 formed in the first direction and a second shaped portion 42AK23M2 formed in the second direction. The signal wiring formed by the seventh wiring pattern 42AK26 includes a second shaped portion 42AK26M1 formed in the second direction and a second shaped portion 42AK26M2 formed in the first direction. As described above, even one signal wiring configured by the same wiring pattern may include a plurality of second shaped portions formed in different directions. Further, the signal wiring formed by the pattern of one wiring is different from the second shaped portion formed in the common (parallel) direction with the second shaped portion of the signal wiring formed by the pattern of another wiring. You may include the 2nd shape part formed in the direction. Since the second shape portions are formed in different directions in one or a plurality of signal wirings, it is possible to easily and flexibly design the wiring pattern on the substrate surface. In addition, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

FIG. 27 shows a configuration example in which a plurality of signal wirings configured by wiring patterns are formed with different wiring widths. In the configuration example shown in FIG. 27, a wiring pattern that forms four signal wirings is shown as a wiring pattern that forms a plurality of signal wirings. 27A shows a case where the wiring width is different for the entire signal wiring, and FIG. 27B shows a case where the wiring width is different for a part of the signal wiring.

The wiring patterns that form the four signal wirings illustrated in FIG. 27A include a wiring first pattern 42AK30, a wiring second pattern 42AK31, a wiring third pattern 42AK32, and a wiring fourth pattern 42AK43. .. The signal wiring formed by the first wiring pattern 42AK30 includes a portion forming the second shape portion 42AK30M. The signal wiring formed by the second wiring pattern 42AK31 includes a portion forming the second shape portion 42AK31M. The signal wiring formed by the third wiring pattern 42AK32 includes a portion forming the second shape portion 42AK32M. The signal wiring formed by the wiring fourth pattern 42AK33 includes a portion forming the second shape portion 42AK33M.

The signal wiring formed by the first wiring pattern 42AK30 is formed to have the same or substantially the same width as the signal wiring formed by the second wiring pattern 42AK31. The signal wiring formed by the wiring third pattern 42AK32 is formed to have the same or substantially the same width as the signal wiring formed by the wiring fourth pattern 42AK33. On the other hand, the signal wiring formed by the first wiring pattern 42AK30 and the signal wiring formed by the second wiring pattern 42AK31 are the signal wiring formed by the third wiring pattern 42AK32 and the fourth wiring wiring pattern 42AK33. The signal wiring is formed so as to have a wider wiring width than the signal wiring configured by. Thus, the first wiring pattern 42AK30 and the second wiring pattern 42AK31 form a signal wiring having a wide wiring width, and the third wiring pattern 42AK32 and the fourth wiring pattern 42AK33 form a narrow wiring width. doing.

Even if an electric signal of a common type such as a first type of differential signal is transmitted between the signal wiring formed of the first wiring pattern 42AK30 and the signal wiring formed of the second wiring pattern 42AK31. Good. In addition, the signal wiring configured by the wiring third pattern 42AK32 and the signal wiring configured by the wiring fourth pattern 42AK33 have a common type such as a second type differential signal different from the first type. Of electrical signals may be transmitted. On the other hand, the signal wiring formed by the wiring first pattern 42AK30 and the signal wiring formed by the wiring second pattern 42AK31, and the signal wiring formed by the wiring third pattern 42AK32 and the fourth wiring wiring fourth pattern 42AK33. Electrical signals of different types may be transmitted to the signal wiring configured by. In this way, the plurality of signal wirings configured by the wiring pattern may be formed so as to have different wiring widths depending on the type of the electric signal to be transmitted. Alternatively, a plurality of signal wirings configured by wiring patterns may be formed to have the same or substantially the same wiring width when the types of electric signals to be transmitted are common. It should be noted that the plurality of signal wirings configured by the wiring pattern may include signal wirings formed to have different wiring widths even when the types of transmitted electric signals are common. Alternatively, the plurality of signal wirings configured by the wiring pattern include signal wirings formed to have the same or substantially the same wiring width even when the types of transmitted electric signals are different. Good. Since the plurality of signal wirings are formed to have different wiring widths, the characteristic impedance of each signal wiring can be easily adjusted and appropriate transmission can be performed according to the type of electric signal.

The wiring patterns forming the four signal wirings shown in FIG. 27B include a wiring fifth pattern 42AK34, a wiring sixth pattern 42AK35, a wiring seventh pattern 42AK36, and a wiring eighth pattern 42AK37. .. The signal wiring formed by the fifth wiring pattern 42AK34 includes a portion forming the second shape portion 42AK34M. The signal wiring formed by the sixth wiring pattern 42AK35 includes a portion forming the second shape portion 42AK35M. The signal wiring formed by the seventh wiring pattern 42AK36 includes a portion forming the second shape portion 42AK36M. The signal wiring formed by the eighth pattern 42AK37 of wiring includes a portion forming the second shape portion 42AK37M.

The signal wiring configured by the fifth wiring pattern 42AK34 and the signal wiring configured by the sixth wiring pattern 42AK35 are configured such that a portion of the wiring width is different from the wiring width of the other portion. For example, the second shape portion 42AK34M in the signal wiring formed by the fifth wiring pattern 42AK34 is formed to have a wider wiring width than other portions of the same signal wiring. The second shape portion 42AK35M in the signal wiring formed by the sixth wiring pattern 42AK35 is formed to have a wider wiring width than other portions of the same signal wiring. As described above, the fifth wiring pattern 42AK34 constitutes a signal wiring having a wide wiring width in the second shaped portion 42AK34M, and a signal wiring having a narrow wiring width in the portion other than the second shaped portion 42AK34M. The sixth wiring pattern 42AK35 constitutes a signal wiring having a wide wiring width in the second shaped portion 42AK35M, and a signal wiring having a narrow wiring width in the portion other than the second shaped portion 42AK35M. It is to be noted that the second shape portion is not limited to a signal wiring having a wide wiring width, and the first shape portion having a linear shape or a substantially linear shape constitutes a signal wiring having a wide wiring width. Good.

The signal wiring formed by the fifth wiring pattern 42AK34 is formed such that the wiring width of the second shaped portion 42AK34M is wider than that of the other portions, so that the same signal wiring has different wiring widths. The signal wiring configured by the sixth wiring pattern 42AK35 is formed so that the wiring width of the second shaped portion 42AK35M is wider than that of the other portions, so that the same signal wiring has different wiring widths. On the other hand, the signal wiring constituted by the wiring seventh pattern 42AK36 and the signal wiring constituted by the wiring eighth pattern 42AK37 are formed such that the wiring widths are the same or substantially the same in the same signal wiring. There is. By forming a part of one or a plurality of signal wirings with different wiring widths, it is possible to easily adjust the characteristic impedance of each signal wiring and to perform appropriate transmission according to the type of electric signal. Become.

FIG. 28 shows a configuration example in which the second shape portions of a plurality of signal wirings configured by wiring patterns are formed correspondingly. In the configuration example shown in FIG. 28, a wiring pattern that forms two signal wirings is shown as a wiring pattern that forms a plurality of signal wirings. 28A shows a case where two signal wirings meander in substantially parallel, and FIG. 28B shows a case where two signal wirings meander in a direction away from each other.

The wiring pattern forming the two signal wirings shown in FIG. 28A includes a wiring first pattern 42AK40 and a wiring second pattern 42AK41. The first wiring pattern 42AK40 and the second wiring pattern 42AK41 have a meandering shape that folds back and forth in a common (parallel) direction, such as the vertical direction. In this meandering shape, when the signal wiring formed by the first wiring pattern 42AK40 is bent and protrudes in the direction approaching the signal wiring formed by the second wiring pattern 42AK41 with respect to the extending direction DR1, The signal wiring formed by the second wiring pattern 42AK41 is bent and protrudes in a direction away from the signal wiring formed by the first wiring pattern 42AK40 in the extending direction DR1. After that, when the signal wiring formed by the wiring first pattern 42AK40 is bent and restored in a direction away from the signal wiring formed by the wiring second pattern 42AK41 in the extending direction DR1, the wiring The signal wiring formed by the second pattern 42AK41 is bent and returned in a direction approaching the signal wiring formed by the first pattern 42AK40 of the wiring in the extending direction DR1. In the meandering shape, when the signal wiring formed by the first wiring pattern 42AK40 is bent and protrudes in the direction away from the signal wiring formed by the second wiring pattern 42AK41 with respect to the extending direction DR1. In addition, the signal wiring formed by the second wiring pattern 42AK41 is bent and protrudes in a direction approaching the signal wiring formed by the first wiring pattern 42AK40 in the extending direction DR1. After that, when the signal wiring formed by the wiring first pattern 42AK40 is bent and returned in a direction approaching the signal wiring formed by the wiring second pattern 42AK41 with respect to the extending direction DR1, the wiring The signal wiring formed by the second pattern 42AK41 is bent and returned in a direction away from the signal wiring formed by the first pattern 42AK40 of the wiring in the extending direction DR1. In this manner, the first wiring pattern 42AK40 and the second wiring pattern 42AK41 form a meandering signal wiring that folds back and forth substantially in parallel while maintaining substantially the same wiring interval. The shape is not limited to the meandering shape, and may be any shape other than the linear shape and the substantially linear shape.

As described above, the signal wiring formed by the wiring first pattern 42AK40 is formed in parallel or substantially parallel to the signal wiring formed by the wiring second pattern 42AK41, and has a linear shape and a shape different from the substantially linear shape. Is formed. By forming the second shape portion having a shape different from the straight line shape and the substantially straight line shape while being parallel or substantially parallel in the plurality of signal wirings, the wiring pattern design on the substrate surface is easy and flexible. Can be done. In addition, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

The wiring pattern forming the two signal wirings shown in FIG. 28B includes a wiring third pattern 42AK42 and a wiring fourth pattern 42AK43. The third wiring pattern 42AK42 and the fourth wiring pattern 42AK43 have a meandering shape that folds back and forth in a common (parallel) direction such as the vertical direction. In this meandering shape, when the signal wiring configured by the wiring third pattern 42 is bent and protrudes in the direction away from the signal wiring configured by the wiring fourth pattern 42AK43 in the extending direction DR1, The signal wiring formed by the wiring fourth pattern 42AK43 is bent and protrudes in the extending direction DR1 in a direction away from the signal wiring formed by the wiring third pattern 42AK42. When the signal wiring configured by the wiring third pattern 42AK42 is bent and returned from the protrusion due to these protrusions in a direction approaching the signal wiring configured by the wiring fourth pattern 42AK43 in the extending direction DR1 In addition, the signal wiring formed by the wiring fourth pattern 42AK43 is bent and returned in a direction approaching the signal wiring formed by the wiring third pattern 42AK42 with respect to the extending direction DR1. In this way, the third wiring pattern 42AK42 and the fourth wiring pattern 42AK43 form a meandering signal wiring that reciprocates back and forth, that is, projecting in the direction away from each other while changing the wiring spacing and then returning in the approaching direction. There is.

As described above, the signal wiring formed by the wiring third pattern 42AK42 is formed in a common (parallel) direction with the signal wiring formed by the wiring fourth pattern 42AK43, and is different from the linear shape and the substantially linear shape. It is formed to have a shape. The second shape portion having a shape different from the linear shape and the substantially linear shape is formed such that the plurality of signal wirings are bent in the away direction, protruded, bent in the approaching direction, and returned to form a substrate surface. The wiring pattern design can be performed easily and flexibly. In addition, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

FIG. 29 shows a configuration example in which circuit components are mounted so as to be connected to a plurality of signal wirings configured by wiring patterns. In the configuration example shown in FIG. 29A, a wiring pattern that forms four signal wirings is shown as a wiring pattern that forms a plurality of signal wirings. The wiring patterns forming these four signal wirings include a wiring first pattern 42AK50, a wiring second pattern 42AK51, a wiring third pattern 42AK52, and a wiring fourth pattern 42AK53. The signal wiring constituted by the second pattern 42AK51 of wiring includes a portion forming the first shaped portion 42AK51L and a portion forming the second shaped portion 42AK51M. The signal wiring formed by the wiring third pattern 42AK52 includes a portion forming the first shaped portion 42AK52L and a portion forming the second shaped portion 42AK52M.

In the second shape portion 42AK51M of the signal wiring formed by the second wiring pattern 42AK51 shown in FIG. 29A, the circuit component 42AK1R connected to the signal wiring formed by the first wiring pattern 42AK50 is connected to the wiring. The second pattern 42AK51 is mounted so as to be connected to the signal wiring. The circuit component 42AK1R may be, for example, a circuit element such as a resistance element. The circuit component 42AK1R may include a passive element such as a capacitor or a coil in part or in whole together with the resistance element or in place of the resistance element. The circuit component 42AK1R may partially or entirely include an active element such as a diode, a transistor such as a bipolar transistor or a MOS transistor, or a thyristor in place of or together with the passive element such as a resistance element, a capacitor, or a coil. .. The circuit component 42AK1R may constitute a functional circuit such as a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK1R supplies a specific power supply voltage to the signal wiring configured by the second wiring pattern 42AK51 when the signal wiring configured by the first wiring pattern 42AK50 is maintained at the specific power supply voltage. It may function as a pull-up resistor that enables it. Alternatively, the circuit component 42AK1R can supply the ground voltage to the signal wiring configured by the second wiring pattern 42AK51 when the signal wiring configured by the first wiring pattern 42AK50 is maintained at the ground voltage. May function as a pull-down resistor. Alternatively, the circuit component 42AK1R may be a functional circuit capable of switching the resistance element between a pull-up resistance and a pull-down resistance by the polarity switching unit.

FIG. 29B is an enlarged view showing a connecting portion of the circuit component 42AK1R. In the second shape portion 42AK51M shown in FIG. 29B, three folded portions in which the signal wiring formed by the second wiring pattern 42AK51 is folded back through the folded portion are shown. These three folded portions include a first folded portion 42AK51M1, a second folded portion 42AK51M2, and a third folded portion 42AK51M3. The circuit component 42AK1R is mounted in the second folded portion 42AK51M2 so as to be connected to the signal wiring configured by the second wiring pattern 42AK51 and the signal wiring configured by the first wiring pattern 42AK50. There is. In the second folded-back portion 42AK51M2 shown in FIG. 29B, the same signal wiring folded back through the bent portion is formed to reciprocate at a wiring interval W3. On the other hand, in the first folded-back portion 42AK51M1 and the third folded-back portion 42AK51M3, the same signal wiring that is folded back through the folded portion forms a shape that reciprocates at the wiring interval W4. Further, the distance between the first folded portion 42AK51M1 and the second folded portion 42AK51M2 and the distance between the second folded portion 42AK51M2 and the third folded portion 42AK51M3 are also formed to be the wiring distance W4. The signal wiring is formed such that the wiring distance W3 is wider than the wiring distance W4. In this way, the wiring interval W3 in the second folded portion 42AK51M2 on which the circuit component 42AK1R is mounted is wider than the wiring interval W4 in the portion of the second shaped portion 42AK51M where the circuit component 42AK1R is not mounted. It can be easily mounted and the transmission characteristics and the like in the signal wiring can be appropriately adjusted.

The wiring interval W3 in the second folded portion 42AK51M2 on which the circuit component 42AK1R is mounted is not limited to be wider than the wiring interval W4 in the portion of the second shaped portion 42AK51M where the circuit component 42AK1R is not mounted, and the wiring interval is not limited to this. W3 may be the same as or substantially the same as the wiring interval W4, or the wiring interval W3 may be formed to be narrower than the wiring interval W4. Further, the circuit component 42AK1R is not limited to the one mounted so as to be connected to the signal wiring formed by the second pattern 42AK52 of the wiring at the second folding portion 42AK51M2, and may be the first folding portion 42AK51M1 or the third folding portion. The part 42AK51M3 may be mounted so as to be connected to the signal wiring formed by the second wiring pattern 42AK52.

Thus, the second shape portion 42AK51M in the signal wiring formed by the second wiring pattern 42AK51 shown in FIG. 29A and the like is connected to the signal wiring formed by the first wiring pattern 42AK50. The circuit component 42AK1R mounted on the. By mounting the circuit component on the second shape portion, it is possible to appropriately adjust the transmission characteristics and the like in the signal wiring. In addition, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

In the first shape portion 42AK52L in the signal wiring formed by the third wiring pattern 42AK52 shown in FIG. 29A, the circuit component 42AK2R connected to the signal wiring formed by the fourth wiring pattern 42AK53 The third pattern 42AK52 is mounted so as to be connected to the signal wiring. The circuit component 42AK2R may be, for example, a circuit element such as a resistance element. The circuit component 42AK2R may include a passive element such as a capacitor or a coil in part or in whole together with the resistance element or in place of the resistance element. The circuit component 42AK2R may partially or entirely include an active element such as a diode, a transistor such as a bipolar transistor or a MOS transistor, or a thyristor in place of or together with the passive element such as a resistance element, a capacitor, or a coil. .. The circuit component 42AK2R may constitute a functional circuit such as a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK2R supplies a specific power supply voltage to the signal wiring configured by the third wiring pattern 42AK52 when the signal wiring configured by the fourth wiring pattern 42AK53 is maintained at the specific power supply voltage. It may function as a pull-up resistor that enables it. Alternatively, the circuit component 42AK2R can supply the ground voltage to the signal wiring formed by the third wiring pattern 42AK52 when the signal wiring formed by the fourth wiring pattern 42AK53 is maintained at the ground voltage. May function as a pull-down resistor. Alternatively, the circuit component 42AK2R may be a functional circuit in which the resistance element can be switched between a pull-up resistor and a pull-down resistor by the polarity switching unit.

As described above, the first shape portion 42AK52L different from the second shape portion 42AK52M in the signal wiring formed by the wiring third pattern 42AK52 shown in FIG. 29A is formed by the wiring fourth pattern 42AK53. The circuit component 42AK2R is mounted so as to be connected to the signal wiring. By mounting the circuit component on a portion different from the second shape portion, it is possible to appropriately adjust the transmission characteristics and the like in the signal wiring. In addition, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

Each signal wiring may be formed such that the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is mounted is different from the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is not mounted. For example, each signal wiring may be formed such that the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is mounted is wider than the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is not mounted. In this way, the plurality of signal wirings configured by the wiring pattern may be formed so as to have a wiring width different from that of the portion where the circuit component is not mounted, corresponding to the portion where the circuit component is mounted. By forming different wiring widths corresponding to the portions where the circuit components are mounted, it is possible to easily adjust the characteristic impedance of each signal wiring and perform appropriate transmission by the signal wiring.

When signal wiring having the first shape portions 42AK10L, 42AK11L, 42AK12L, 42AK13L and the second shape portions 42AK10M, 42AK11M, 42AK12M, 42AK13M as shown in FIG. 25A and FIG. 25B is formed, The plurality of signal wirings configured by the wiring pattern may have the second shape portions formed in different directions as shown in FIG. 26, for example, as a whole or a part of the signal wirings as shown in FIG. It may be formed to have different wiring widths, for example, as shown in FIG. 28, the second shape portions may be formed so as to correspond to a direction substantially parallel to or away from each other. For example, as shown in FIG. A circuit component connected to a portion different from the two-shaped portion may be mounted, or a part or all of these may be formed in combination.

(Explanation regarding the characteristic part 43AK)
FIG. 30 shows a configuration example of the characteristic portion 43AK of the present embodiment, in which the second shape portion of the plurality of signal wirings configured by the wiring pattern is provided with the test point serving as the specific conductor portion for connection confirmation. ing. In the configuration example shown in FIG. 30, as a wiring pattern forming a plurality of signal wirings, a wiring pattern forming two signal wirings is shown. The wiring patterns forming these two signal wirings include a wiring first pattern 43AK10 and a wiring second pattern 43AK11. The signal wiring configured by the first pattern 43AK10 of wiring includes a portion forming the first shaped portion 43AK10L and a portion forming the second shaped portion 43AK10M. The signal wiring constituted by the second pattern 43AK11 of wiring includes a portion forming the first shaped portion 43AK11L and a portion forming the second shaped portion 43AK11M. The first shape portions 43AK10L and 43AK11L are formed such that the signal wiring has a linear or substantially linear first shape. The second shape portions 43AK10M and 43AK11M are formed so as to have a second shape different from the linear shape and the substantially linear shape, such as the meandering shape of the signal wiring. The second shape portions 43AK10M and 43AK11M are not limited to the meandering shape, and may be any shape different from the linear shape and the substantially linear shape.

At least a part of the plurality of signal wirings configured by the wiring first pattern 43AK10 and the wiring second pattern 43AK11, for example, the wiring first pattern 42AK10 and the wiring second pattern 42AK11 illustrated in FIG. 25, or similar to the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 shown in FIG. 25B. For example, the signal wiring configured by the wiring second pattern 43AK11 corresponds to the first shape portion 43AK11L having the first linear or substantially linear shape, and the signal wiring configured by the wiring first pattern 43AK10. However, it suffices that the second shape portion 43AK10M having a meandering shape or the like different from the first shape portion 43AK11L is included. In addition, the signal wiring formed by the wiring first pattern 43AK10 corresponds to the first shape portion 43AK10L having the linear shape or the substantially linear shape, and the signal wiring formed by the wiring second pattern 43AK11 is the first wiring. It suffices that the second shape portion 43AK10M having a meandering shape or the like different from the shape portion 43AK10L is included.

A test point 43AK10TP is provided as a specific conductor portion for connection confirmation in the second shape portion 43AK10M in the signal wiring formed by the wiring first pattern 43AK10. A test point 43AK11TP is provided as a specific conductor portion for connection confirmation in the second shape portion 43AK11M in the signal wiring formed by the second wiring pattern 43AK11. The test points 43AK10TP and 43AK11TP may be formed using a metal material such as solder or copper foil. The test points 43AK10TP and 43AK11TP have a diameter W6 when formed in a circular shape, for example, rather than a wiring width W5 in the signal wiring formed by the wiring first pattern 43AK10 and the signal wiring formed by the wiring second pattern 43AK11. , Is formed to be large (wide). The test points 43AK10TP and 43AK11TP are not limited to being formed in a circular shape, and may be formed in any shape such as a square shape or a strip shape. Whatever shape the test points 43AK10TP and 43AK11TP have, any shape may be used as long as the average shape is larger (wider) than the wiring width of the signal wiring. By providing the test points 43AK10TP and 43AK11TP, it may be possible to suppress the variation in the characteristic impedance in the plurality of signal wirings. As a result, the signal quality of the plurality of signal wirings is homogenized.

For example, by bringing a test probe into contact with the test point 43AK10TP and the test point 43AK11TP, a short circuit is caused between the signal wiring formed by the first wiring pattern 43AK10 and the signal wiring formed by the second wiring pattern 43AK11. It can be inspected for the occurrence. In addition to the test points 43AK10TP and 43AK11TP, a test point serving as a specific conductor portion for connection confirmation may be provided. As an example, the signal wiring formed of the first wiring pattern 43AK10 may be provided with test points other than the test points 43AK10TP. A test probe is brought into contact with this test point and the test point 43AK10TP provided on the second shape portion 43AK10M, thereby inspecting the signal wiring formed by the first pattern 43AK10 of the wiring for the occurrence of disconnection. be able to. It may be configured to be able to inspect whether or not a short circuit or disconnection has occurred, or, instead of these inspections, for example, an oscilloscope may be used to confirm or inspect a signal waveform.

As described above, the test points 43AK10TP are provided on the second shape portion 43AK10M in which the signal wiring shown in FIG. 30 has a second shape such as a meandering shape, and the test points 43AK11TP are provided on the second shape portion 43AK11M. By providing the test points in the second shape portion of the signal wiring, the wiring pattern is appropriately arranged, and various structures are appropriately arranged, so that the increase of the board area is suppressed and the board is downsized. be able to. The test points 43AK10TP and 43AK11TP are made of a metal material and are formed to be wider than the signal line width. By forming the test point so as to be larger (wider) than the wiring width of the signal wiring, it is possible to easily contact the test probe and inspect the electrical characteristics of the signal wiring. Further, by appropriately disposing the wiring patterns and various structures, it is possible to suppress an increase in the substrate area and to reduce the size of the substrate.

When the test points 43AK10TP and 43AK11TP as shown in FIG. 30 are provided, the plurality of signal wirings formed by the wiring patterns have the second shape portions formed in different directions as shown in FIG. 26, for example. Alternatively, for example, as shown in FIG. 27, the whole or a part of the signal wiring may be formed to have different wiring widths. For example, as shown in FIG. 28, the second shape portions may be formed so as to be substantially parallel or apart from each other. 29, for example, as shown in FIG. 29, a circuit component connected to the second shape portion or a portion different from the second shape portion may be mounted, and a part or all of these may be formed in combination. Good.

(Explanation regarding the characteristic part 44AK)
FIG. 31 relates to the characteristic portion 44AK of the present embodiment, in the main board 11 configured as a multilayer wiring board, the signal wiring including the second shape is provided on one surface and the specific conductor portion for connection confirmation is provided on the other surface. The example of a structure when a test point is provided is shown. At least a part of the characteristic portion 44AK shown in FIG. 31 may be formed in the same manner as the configuration example shown in FIG. For example, the characteristic part 44AK may have a multi-layer structure formed by stacking synthetic resins. The multilayer structure of the main substrate 11 shown in FIG. 31 includes a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, and a back surface layer 44AK2S.

A surface layer 44AK1S is provided on one surface of the main substrate 11, and a wiring pattern 44AK10P and a pattern 44AK11P that form the signal wiring are formed. A back surface layer 44AK2S is provided on the back surface that is the other board surface of the main board 11, and a wiring pattern 44AK20P that forms a signal wire is formed. The wiring pattern 44AK10P formed on the surface layer 44AK1S of the main substrate 11 is connected to the wiring pattern 44AK20P formed on the back surface layer 44AK2S via the through holes 44AK1H penetrating the surface layer 44AK1S and the back surface layer 44AK2S of the main board 11. It is electrically connected. The wiring pattern 44AK11P formed on the surface layer 44AK1S of the main substrate 11 is connected to the wiring pattern 44AK20P formed on the back surface layer 44AK2S via the through hole 44AK2H penetrating the surface layer 44AK1S and the back surface layer 44AK2S of the main board 11. It is electrically connected. In this way, the main substrate 11 is provided with the wiring patterns 44AK10P and 44AK11P that form the signal wiring in the surface layer 44AK1S provided on the surface serving as one substrate surface, and on the back surface serving as the other substrate surface. The back surface layer 44AK2S is provided with through holes 44AK1H and through holes 44AK2H capable of electrically connecting to the wiring pattern 44AK20P forming the signal wiring.

The wiring pattern 44AK10P formed on the surface layer 44AK1S includes portions for forming the first shape portion and the second shape portion, similar to the wiring first pattern 43AK10 and the wiring second pattern 43AK11 shown in FIG. 30, for example. A plurality of signal wirings may be formed so as to include the signal wirings. The signal wiring constituted by the wiring first pattern 43AK10 and the wiring second pattern 43AK11 shown in FIG. 30 has the signal wiring constituted by the wiring second pattern 43AK11 having a linear or substantially linear first shape. Corresponding to the first shaped portion 43AK11L, the signal wiring configured by the first pattern 43AK10 of the wiring may include the second shaped portion 43AK10M having a meandering shape different from the first shaped portion 43AK11L. In addition, the signal wiring formed by the wiring first pattern 43AK10 corresponds to the first shape portion 43AK10L having the linear shape or the substantially linear shape, and the signal wiring formed by the wiring second pattern 43AK11 is the first wiring. It suffices that the second shape portion 43AK10M having a meandering shape or the like different from the shape portion 43AK10L is included.

The test point 44AK10TP shown in FIG. 31 corresponds to the test point 43AK10TP provided on the second shaped portion 43AK10M and the test point 43AK11TP provided on the second shaped portion 43AK11M shown in FIG. 30, and the wiring pattern 44AK10P. It suffices if it is provided in the signal wiring constituted by. The test point 44AK10TP may be connected to a different conductor layer such as the wiring pattern 44AK20P formed on the back surface layer 44AK2S via the through hole 44AK1H. The test point 44AK10TP is not limited to the wiring pattern 44AK20P formed on the back surface layer 44AK2S, and any arbitrary pattern different from the surface layer 44AK1S provided with the test point 44AK10TP, such as a wiring pattern formed on the wiring layer 44AK3L. Any material may be used as long as it is connected to the conductor layer. By connecting the conductor layer different from the layer on which the test point is provided and the test point through the through hole, it is possible to easily inspect the electrical characteristics of the signal wiring and the conductor layer. Further, by appropriately disposing the wiring patterns and various structures, it is possible to suppress an increase in the substrate area and to reduce the size of the substrate.

Also in the wiring pattern 44AK11P formed on the surface layer 44AK1S, a plurality of signal wirings may be formed so as to include a portion forming the first shape portion and the second shape portion. As described above, the plurality of signal wirings configured by the wiring pattern 44AK11P are configured to include the second shape portion different from the linear shape and the substantially linear shape on one surface of the substrate, such as the surface layer 44AK1S of the main substrate 11. Has been formed. On the other hand, a test point 44AK11TP is provided on the back surface layer 44AK2S. The test point 44AK11TP may be provided, for example, on a signal wiring formed by the wiring pattern 44AK20P, and may be connected to a different conductor layer such as the wiring pattern 44AK11P formed on the surface layer 44AK1S via the through hole 44AK2H. .. By providing the test points 44AK10TP and 44AK11P, it may be possible to suppress variations in the characteristic impedance in the plurality of signal wirings. As a result, the signal quality of the plurality of signal wirings is homogenized. By providing the signal wiring including the second shape portion on one surface of the substrate and providing the test points on the other surface of the substrate, it is possible to easily perform the electrical characteristic inspection of the signal wiring and the conductor layer. Further, by appropriately disposing the wiring patterns and various structures, it is possible to suppress an increase in the substrate area and to reduce the size of the substrate.

For example, a test probe may be brought into contact with the test point 44AK10TP so that it is possible to inspect whether or not a short circuit has occurred in a plurality of signal wirings configured by the wiring pattern 44AK10P. Further, for example, by contacting the test probe to the test points 44AK10TP and 44AK11TP, the presence or absence of disconnection in the signal wiring formed by the wiring pattern 44AK20P formed in the back surface layer 44AK2S and the through hole 44AK1H is checked. It should be possible to inspect. In addition, presence/absence of disconnection in the plurality of signal wirings configured by the wiring pattern 44AK10P, presence/absence of occurrence of short circuit or disconnection in the plurality of signal wirings configured by the wiring pattern 44AK11P, and configuration by the wiring pattern 44AK20P There may be provided a test point capable of inspecting the presence or absence of a short circuit in the plurality of signal wirings, the presence or absence of a short circuit in the through hole 44AK1H, and the presence or absence of a short circuit or disconnection in the through hole 44AK2H.

The test point, which is the specific conductor part for connection confirmation, is not limited to the one provided with a dedicated electrode pad for contacting the test probe, and for example, circuit components etc. can be connected for adjusting the characteristic impedance in signal wiring. Any electrode pad such as an electrode pad provided in the above may be used. The specific conductor portion such as the test point is a conductor layer different from the layer in which the plurality of signal wirings and the test points are provided among the plurality of layers included in the multilayer wiring board due to the through holes provided in the multilayer wiring board. By being electrically connected to each other, it is possible to appropriately perform an electrical characteristic test on the multilayer wiring board. For example, a specific conductor portion such as a test point is provided on the other substrate surface different from the one substrate surface on which the wiring pattern is formed, for example, the substrate surface on the back surface side, so that the electrical characteristic inspection in the multilayer wiring substrate can be performed appropriately. Can be done. Further, by appropriately disposing the wiring patterns and various structures, it is possible to suppress an increase in the substrate area and to reduce the size of the substrate.

When the test points 44AK10TP and 44AK11TP as shown in FIG. 31 are provided, the plurality of signal wirings formed by the wiring patterns have the second shape portions formed in different directions as shown in FIG. 26, for example. Alternatively, for example, as shown in FIG. 27, the whole or a part of the signal wiring may be formed to have different wiring widths, and for example, as shown in FIG. 29, for example, as shown in FIG. 29, a circuit component connected to the second shape portion or a portion different from the second shape portion may be mounted, and a part or all of these may be formed in combination. Good.

(Explanation regarding the characteristic part 45AK)
Hereinafter, with reference to the drawings, the board case 45AK10 of the gaming machine related to the characteristic portion 45AK, the board 45AK50 and the heat sink 45AK40 housed in the board case 45AK10 will be described in detail. FIG. 32 is an exploded perspective view of the board case 45AK10, the board 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention seen from the rear. FIG. 33 is an exploded perspective view of the board case 45AK10, the board 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention as seen from the front. In the following description, in order to facilitate understanding, the front-back direction shown in FIG. 32 and the like is defined, and the vertical and horizontal directions when the board case 45AK10 and the like is viewed from the front are defined as the vertical and horizontal directions of the board case 45AK10 and the like. explain.

The substrate case 45AK10 is configured by combining a front case 45AK20 forming a front side and a rear case 45AK30 forming a rear side. Inside the board case 45AK10, a housing space for housing a board 45AK50 on which electronic components such as a CPU, a ROM, and a connector are mounted, and a heat sink 45AK40 are formed.

The front case 45AK20 is made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in a plan view. The front case 45AK20 has a box shape with an open rear. Two protrusions 45AK21 that protrude upward are formed on the upper edge of the front case 45AK20. Further, at the lower edge of the front case 45AK20, two projecting portions 45AK22 projecting downward are formed.

Similar to the front case 45AK20, the rear case 45AK30 is also made of, for example, a thermoplastic synthetic resin, and is formed in a substantially rectangular shape in a plan view. The rear case 45AK30 has a base plate 45AK30a forming a rear surface, an upper wall 45AK30b standing upright from the base plate 45AK30a, a right wall 45AK30c, a lower wall 45AK30d, and a left wall 45AK30e. As a result, the rear case 45AK30 is in the shape of a box with its front open, and its housing is deeper than that of the front case 45AK20. The upper wall 45AK30b of the rear case 45AK30 is formed with two locking portions 45AK31 having insertion holes 45AK31a into which the protrusions 45AK21 formed in the front case 45AK20 are inserted. Further, on the lower wall 45AK30d of the rear case 45AK30, two locking portions 45AK38 (FIG. 33) to which the protrusion 45AK22 formed on the front case 45AK20 is hooked are formed.

When the front case 45AK20 and the rear case 45AK30 are combined, first, the protruding portion 45AK21 of the front case 45AK20 is inserted into the insertion hole 45AK31a of the rear case 45AK30. Then, the lower portion of the front case 45AK20 is pressed against the rear case 45AK30, and the protruding portion 45AK22 of the front case 45AK20 is hooked on the locking portion 45AK38 of the rear case 45AK30. As a result, the front case 45AK20 and the rear case 45AK30 are combined, and a housing space for the substrate 45AK50 and the like is formed inside.

Further, in the rear case 45AK30, a plurality of air holes 45AK32 are formed in the upper wall 45AK30b, and a plurality of air holes 45AK33 (FIG. 33) are formed in the lower wall 45AK30d. As a result, an air passage along the vertical direction is secured in the substrate case 45AK10. Further, on the base plate 45AK30a of the rear case 45AK30, four insertion convex portions 45AK36 for positioning the substrate 45AK50, screw holes 45AK37a to 45AK37e for screwing the substrate 45AK50, and four corners of the heat sink 45AK40 are suppressed. Four positioning parts 45AK34 for positioning and six support parts 45AK35 for contacting and supporting the heat sink 45AK40 positioned by the four positioning parts 45AK34 are formed.

The insertion protrusions 45AK36 are formed at the four corners of the base plate 45AK30a. Each of the insertion protrusions 45AK36 is a cylindrical protrusion that is inserted into an insertion hole 45AK50a formed in the substrate 45AK50.

Each of the four positioning portions 45AK34 has an angled shape, and is arranged so as to be able to abut the corner portion of the heat sink 45AK40 on the orthogonal planes.

As shown in the enlarged view of FIG. 33, the support portion 45AK35 is arranged in the cutout 45AK30f of the base plate 45AK30a, and has a protruding portion 45AK35a that protrudes forward of the base plate 45AK30a. The support portion 45AK35 is in a cantilever state in which only one end is supported by the base plate 45AK30a. Therefore, when the rearward stress is applied to the protrusion 45AK35a, the supporting portion 45AK35 is elastically deformed and displaced rearward. On the other hand, when the rearward stress does not act on the projecting portion 45AK35a, the supporting portion 45AK35 returns to the front and returns to the original state.

The heat sink 45AK40 is formed by processing, for example, aluminum having excellent heat conductivity. The heat sink 45AK40 includes a rectangular base plate 45AK41 and five rectangular fins 45AK42 provided upright on the base plate 45AK41. Each of the fins 45AK42 extends in the vertical direction and is arranged in parallel in the horizontal direction.

The board 45AK50 is, for example, a printed board on which various electronic components such as a CPU, a ROM, and a connector are mounted. The board 45AK50 has four insertion holes 45AK50a provided at positions corresponding to the insertion protrusions 45AK36 formed on the rear case 45AK30 and screw insertion holes 45AK55a through which screws 45AK81a to 45AK81e for fixing the board 45AK50 are inserted. .About.45AK55e are formed.

Further, the board 45AK50 is provided with a heat generating electronic component 45AK60, and a non-heat generating electronic component 45AK51 and electronic component 45AK52. The electronic component 45AK60, the electronic component 45AK51, and the electronic component 45AK52 have a rectangular shape. In particular, the electronic component 45AK60 has a substantially square shape. Further, among the non-heat generating electronic components, the electronic component 45AK52 has a height (thickness) higher than that of the electronic component 45AK51. That is, in FIG. 32, the electronic component 45AK52 projects rearward more than the electronic component 45AK51. Here, the heat-generating electronic component refers to an electronic component that generates heat to the extent that heat dissipation measures are required to prevent malfunction of the electronic component. On the other hand, a non-heat-generating electronic component refers to an electronic component that generates heat only to the extent that no heat dissipation measure is required or generates no heat at all.

Among the non-heat generating electronic components, the electronic component 45AK51 having a low height is arranged above the heat generating electronic component 45AK60. Among the non-heat generating electronic components, the tall electronic component 45AK52 is arranged on the right side of the heat generating electronic component 45AK60. Further, the orientations of the non-heat generating electronic component 45AK51 and the electronic component 45AK52 are arranged such that each side is parallel to the side of the rectangular substrate 45AK50 when seen in a plan view. On the other hand, the heat-generating electronic component 45AK60 is arranged such that each side thereof is not parallel to the side of the rectangular substrate 45AK50 when seen in a plan view. A heat conductive sheet 45AK70 is attached to the heat-generating electronic component 45AK60, which is interposed between the electronic component 45AK60 and the heat sink 45AK40 and transmits heat to the heat sink 45AK40. The heat conductive sheet 45AK70 covers almost the entire electronic component 45AK60.

The heat-conducting sheet 45AK70 can be adopted from a well-known heat-conducting sheet of a type in which both sides are adhered, or a flexible heat-conducting sheet mainly made of silicone, non-silicone, or ceramic. The heat conductive sheet 45AK70 is interposed between the electronic component 45AK60 and the heat sink 45AK40 to bond them together.

(About attachment of heat sink 45AK40 and substrate 45AK50)
Next, a procedure for attaching the heat sink 45AK40 and the substrate 45AK50 to the substrate case 45AK10 will be described. FIG. 34 is a cross-sectional view showing how the heat sink 45AK40 and the substrate 45AK50 are attached to the substrate case 45AK10 in the attachment order ((a) to (b)). Further, FIG. 35 is a cross-sectional view showing a manner of attaching the heat sink 45AK40 and the substrate 45AK50 to the substrate case 45AK10 in the attachment order ((a) to (b)) subsequent to FIG. The diagrams shown in FIGS. 34 and 35 are cross-sectional views taken along the line AA in FIG. 33.

As shown in FIG. 34A, first, the rear case 45AK30 is placed on a table or the like, and the heat sink 45AK40 is installed on the rear case 45AK30. As shown in FIG. 34B, the heat sink 45AK40 is mounted with the four corners aligned with the positioning portion 45AK34 formed on the base plate 45AK30a, so that the fins 45AK42 extend in the vertical direction. As a result, the heat sink 45AK40 can be positioned with respect to the rear case 45AK30. At this time, the fins 45AK42b and the fins 45AK42d of the heat sink 45AK40 are in contact with the protruding portions 45AK35a of the support portions 45AK35.

Subsequently, as shown in FIG. 34B, the substrate 45AK50 in which the heat conductive sheet 45AK70 is attached to the electronic component 45AK60 is installed in the rear case 45AK30. At that time, the insertion convex portion 45AK36 formed in the rear case 45AK30 is inserted into the insertion hole 45AK50a formed in the substrate 45AK50 shown in FIG. 33, and the board 45AK50 is placed in the rear case 45AK30 as shown in FIG. To place. By thus inserting the insertion protrusion 45AK36 into the insertion hole 45AK50a, the board 45AK50 is positioned with respect to the rear case 45AK30.

Subsequently, as shown in FIG. 35(a), screws 45AK81a to 45AK81e (only the screw 45AK81e is shown in FIG. 35(a)) are inserted into the substrate 45AK50 and tightened in the corresponding screw holes 45AK37a to 45AK37e. As a result, the heat sink 45AK40 and the substrate 45AK50 supported by the support portion 45AK35 are pressed toward the rear case 45AK30. As a result, as shown in FIG. 35(b), the support portion 45AK35 is elastically deformed, and its tip is displaced rearward by the distance L. The support portion 45AK35 thus elastically deformed presses the abutting heat sink 45AK40 forward. On the other hand, the screws 45AK81a to 45AK81e press the substrate 45AK50 pressed forward through the heat sink 45AK40. As a result, the heat sink 45AK40 and the heat conductive sheet 45AK70 are in close contact with each other, and the electronic component 45AK60 and the heat conductive sheet 45AK70 are in close contact with each other. With such a configuration, the heat generated from the electronic component 45AK60 is transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70 and is radiated from the heat sink 45AK40.

(About the effect of the characteristic part 45AK)
The effects of the gaming machine related to the characteristic part 45AK will be described with reference to the drawings. FIG. 36 is a plan view for explaining the relationship between the heat sink 45AK40 and the electronic component 45AK60. Further, FIG. 37 is an explanatory diagram for explaining the flow of air in the substrate case 45AK10. Since FIG. 36 is a view of the heat sink 45AK40 as seen from the fin 45AK42 side, the electronic component 45AK60 is shown by a broken line which is a hide-and-seek line. Further, a heat conductive sheet 45AK70 is interposed between the heat sink 45AK40 and the electronic component 45AK60 to conduct heat. However, for the sake of convenience, the heat conductive sheet 45AK70 is omitted from the illustration, and the heat sink 45AK60 is entirely covered by the heat sink 45AK60. It is assumed that heat is conducted to the 45AK40. The electronic component 45AK61 indicated by the chain double-dashed line is a comparative example shown for comparison with the electronic component 45AK60.

As shown in FIG. 36, in a plan view, the rectangular electronic component 45AK60 is arranged such that its sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink. That is, the electronic component 45AK60 can be arranged by rotating the electronic component 45AK61 whose respective sides are arranged in parallel with the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ around the center point O. The predetermined angle θ is, for example, about 45°. Since the electronic component 45AK60 has a substantially square shape, the diagonal line of the electronic component 45AK60 faces the vertical and horizontal directions. By arranging the electronic component 45AK60 in such a manner, the vertex 45AK60f of the electronic component 45AK60 is located on the right side of the fin 45AK42b (left side in the drawing), and the vertex 45AK60e of the electronic component 45AK60 is located on the left side of the fin 45AK42d (right side in the drawing). Can be placed. On the other hand, in the electronic component 45AK61 of the comparative example, which is arranged so as to be aligned with the heat sink 45AK40, all parts are located on the right side of the fin 45AK42b (left side in the drawing) or on the left side of the fin 45AK42d (right side in the drawing). ) Is not located. As a result, the electronic component 45AK60 can transfer a large amount of heat to the fins 45AK42b and the fins 45AK42d, and can effectively use the fins 45AK42b and the fins 45AK42d when radiating heat. As a result, it is possible to enhance the heat radiation effect of the heat generated from the electronic component 45AK60. Although the arrangement of the electronic component 45AK60 with respect to the heat sink 45AK40 has been described above, this is technically equivalent even if it is described as the arrangement of the heat sink 45AK40 with respect to the electronic component 45AK60.

Further, the heat generated from the electronic component 45AK60 is not only transferred to the heat sink 45AK40 and radiated, but also a part of the heat is directly radiated upward from the electronic component 45AK60. Thus, the amount of heat radiated directly upward from the electronic component 45AK60 increases as the length of the electronic component 45AK60 in the left-right direction increases. Here, as shown in FIG. 36, the lateral width W1 of the electronic component 45AK60 is larger than the lateral width W2 of the electronic component 45AK61 which is a comparative example. Therefore, the arrangement of the electronic component 45AK60 allows more heat generated from the electronic component 45AK60 to be radiated directly upward. As a result, it is possible to enhance the heat radiation effect of the heat generated from the electronic component 45AK60.

Further, as shown in FIG. 37, an air hole 45AK33 for inflowing air is formed in a lower portion of the rear case 45AK30, and an air hole 45AK32 for discharging air is formed in an upper portion of the rear case 45AK30. .. As a result, an air passage along the vertical direction is secured in the substrate case 45AK10. The air (arrow Y1) flowing in from the air hole 45AK33 moves upward. The air that has moved upward passes through between the fins 45AK42 formed on the heat sink 45AK40 (arrow Y2). At this time, the heat of the heat sink 45AK40 is removed and the air is warmed. The warmed air passes between the low-height electronic components 45AK51 arranged above the heat sink 45AK40 (arrow Y3), or passes behind the low-height electronic components 45AK51 (arrow Y4) and goes upward. And move. The air that has moved upwards is discharged from the air hole 45AK32 formed in the upper portion of the rear case 45AK30 (arrow Y5). As described above, by disposing the electronic component 45AK51 having a low height above the heat sink 45AK40, air can be passed not only between the electronic components 45AK51 but also behind the electronic component 45AK51. On the other hand, the high electronic component 45AK52 is arranged on the right side (the left side in the drawing) of the heat sink 45AK40 without being arranged above and below the heat sink 45AK40. As a result, it is possible to enhance the effect of radiating the heat generated from the electronic component 45AK60 without blocking the flow of air moving from the lower side to the upper side.

Further, since the longitudinal direction of the electronic components 45AK51 is aligned with the vertical direction, a large distance can be secured between the electronic components 45AK51. As a result, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without obstructing the flow of air moving upward.

Further, the heat sink 45AK40 is arranged so that the fins 45AK42 arranged in parallel in the left-right direction face the vertical direction. Thereby, the air moving from the lower side to the upper side can be passed between the fins 45AK42 along the vertical direction. This makes it possible to enhance the effect of radiating the heat generated from the electronic component 45AK60 without impeding the flow of air moving upward.

Further, the heat conductive sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conductive sheet having both surfaces adhered. Therefore, the heat conductive sheet 45AK70 can be adhered to the electronic component 45AK60 and the heat sink 45AK40 without a gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70.

Further, the rear case 45AK30 is provided with a support portion 45AK35 that presses the heat sink 45AK40 against the heat-generating electronic component 45AK60. As a result, the heat sink 45AK40 and the electronic component 45AK60 press the heat conductive sheet 45AK70, and closely contact the heat conductive sheet 45AK70. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70.

Further, as shown in FIGS. 32 and 33, the board 45AK50 is attached to the rear case 45AK30 by a plurality of screws 45AK81a to 45AK81e. Among the plurality of screws 45AK81a to 45AK81e, the screw 45AK81d and the screw 45AK81e are inserted into the screw insertion hole 45AK55d and the screw insertion hole 45AK55e in the vicinity of the electronic component 45AK60, and fastened to the rear case 45AK30. As described above, by tightening the screws 45AK81d and the screws 45AK81e to the rear case 45AK30 near the electronic component 45AK60, the heat sink 45AK40 adhered to the electronic component 45AK60 can be reliably pressed toward the rear case 45AK30. As a result, the heat sink 45AK40 and the electronic component 45AK60 can be reliably bonded to each other.

Further, the support portion 45AK35 is arranged in the cutout 45AK30f of the base plate 45AK30a, and a slight gap t (FIG. 34(a)) is provided between the support portion 45AK35 and the cutout 45AK30f. .. The heat transmitted to the heat sink 45AK40 can be released from the gap t to the outside of the substrate case 45AK10. Thereby, the heat generated from the electronic component 45AK60 can be efficiently dissipated.

When the substrate 45AK50 is not installed on the rear case 45AK30, the support portion 45AK35 is flush with the base plate 45AK30a of the rear case 45AK30 except for the protruding portion 45AK35a. On the other hand, when the substrate 45AK50 is installed on the rear case 45AK30, the support portion 45AK35 bends backward and is displaced from the base plate 45AK30a. As described above, heat generated in the gap t can be easily released due to the displacement between the support portion 45AK35 and the base plate 45AK30a. Thereby, the heat generated from the electronic component 45AK60 can be efficiently dissipated.

(Explanation about other features)
For example, the wiring pattern shown in FIG. 17 and the like for connecting a plurality of electric components by a plurality of signal wirings is provided on the control board instead of or on the control board such as the main board 11 and the effect control board 12. , A connecting member between boards for connecting a plurality of control boards, a connecting member between board circuits for connecting a control board and another electric component, a connecting member between circuits for connecting a plurality of electric parts, and the like, It may be provided in a plurality of connecting members which combine some or all of these connecting members. A part or all of the connection member may be configured as a rigid printed wiring board, or a part or all of the connection member may be configured as a flexible printed wiring board. In such a connecting member, a parallel wiring portion having a first shape in which a plurality of signal wirings are parallel or substantially parallel, and at least one signal wiring of the plurality of signal wirings have a second shape which is not parallel to other signal wirings. A wiring pattern may be formed so as to include the specific wiring portion. Further, the wiring pattern may be formed such that the wiring lengths of the signal wirings included in the plurality of signal wirings are the same or substantially the same. As a result, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the size of the structure can be reduced.

The connecting member may have a shape that includes a bent portion, such as an L-shape, or may have a linear shape that does not include the bent portion. When the connecting member has a shape including the bent portion, the bent portion may have an angular shape having a predetermined angle or an arc shape having a predetermined curvature. The wiring pattern may be formed on both surfaces of the connecting member, or may be formed on one surface of the connecting member. When the connecting member is configured as a multilayer printed wiring board, the wiring pattern may be formed on the surface layer of the connecting member or may be formed on the inner layer of the connecting member. When such a connecting member is used, the plurality of signal wirings are formed so as to include the parallel wiring portion and the specific wiring portion, thereby suppressing an increase in the area of the connecting member on which the wiring pattern is arranged. The size of the structure can be reduced.

When the connection member is configured to include a flexible flex portion such as a flex-rigid wiring board and an inflexible rigid portion, the connection member is connected to the signal wiring at a rigid portion different from the flex portion. A circuit component configured as described above may be provided. As a result, it is possible to prevent the dropping of the circuit components. Further, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the size of the structure can be reduced.

When the connection member is configured to include a flexible flex portion such as a flexible printed wiring board or a flex-rigid wiring board, for example, between the front surface as one surface and the back surface as the other surface, A penetrating portion such as a through hole or a via that can electrically connect the signal wiring may be provided. In this case, the flex portion may not be provided with the penetrating portion. Alternatively, the penetrating portion may not be provided in the bent portion of the flex portion that is bent at the time of connection. This can reduce the possibility of disconnection of the signal wiring. Further, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the size of the structure can be reduced.

The wiring pattern for electrically connecting the first component and the second component by a plurality of signal wirings has a plurality of signal wirings connected at a first wiring interval when the first component is connected to the second component. When connected to each other, a plurality of signal wirings may be formed so as to be connected at a second wiring space different from the first wiring space. Such a wiring pattern may be formed such that the plurality of signal wirings include a space adjusting unit that adjusts the first wiring space and the second wiring space. Further, the wiring pattern may be formed so that the wiring lengths of the signal wirings included in the plurality of signal wirings are the same or substantially the same. As a result, the wiring interval can be adjusted and a plurality of components can be appropriately connected. Further, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the size of the structure can be reduced.

Each of the first component and the second component may be a wiring connection component such as a receptacle or a connector, or may be an electrical component such as a processor or a memory, or one may be a wiring connection component and the other may be an electrical component. It may be a component. Thereby, when various parts are connected, the wiring interval can be adjusted, and a plurality of parts can be appropriately connected. Further, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the size of the structure can be reduced.

(Explanation about deformation and application)
The present invention is not limited to the above embodiment, and various modifications and applications are possible. For example, the pachinko gaming machine 1 does not have to have all the technical features shown in the above-mentioned embodiment, and it is possible to solve at least one problem in the related art, and the part described in the above-mentioned embodiment It may be provided with the structure of. For example, any one of the features shown in the above-described embodiments may be provided as long as it has at least one feature that enables an appropriate substrate configuration. Further, even if the configuration is not described in the above embodiment, at least one problem included in the same or similar problems as in the case of having the configuration described in the above embodiment is solved, or With the configuration described in the above-described embodiment, or in the above-described embodiment, as long as at least one objective or operation-effect included in the same or similar effect as in the case of including the configuration described in It may be provided instead of the configuration described.

In the above-described embodiment, at least one signal wiring of the plurality of signal wirings that electrically connects the plurality of electric components has a shape different from the linear shape and the substantially linear shape, and is parallel to the other signal wirings. As a shape different from the substantially parallel shape, it has been described as including a portion having a meandering shape, a meander shape, a zigzag shape, and a folded shape. On the other hand, a shape different from a straight line shape or a substantially straight line shape, or a shape different from a shape parallel or substantially parallel to other signal wiring is different from a meandering shape such as a curved shape or a spiral shape, and the wiring length of the signal wiring is different. Any shape that can be extended or adjusted can be used. By including at least one signal wiring of the plurality of signal wirings electrically connecting the plurality of electric components, the portion having a shape capable of extending the wiring length, It suffices that the wiring lengths are the same or substantially the same, and the delay time difference between signals transmitted through a plurality of signal wirings can be prevented or suppressed.

The plurality of electrical components electrically connected by the plurality of signal wirings are not limited to the RAM 102 and the CPU 103 mounted on the main board 11, and may be any electrical component provided in a gaming machine such as the pachinko gaming machine 1. .. For example, as a plurality of electric parts, the production control CPU 120 and the RAM 122 mounted on the production control board 12 are electrically connected by a plurality of signal wirings, and at least one of the plurality of signal wirings has a linear shape and The wiring pattern may be formed so as to have a shape different from the substantially linear shape and different from the shapes parallel and substantially parallel to the other signal wirings. In this case, the effect control CPU 120 is an electrical component configured to be able to execute a predetermined process regarding the effect control in the pachinko gaming machine 1, and the RAM 122 can store information related to the execution of the process by the effect control CPU 120. It is an electrical component configured in. Alternatively, instead of the RAM 102 in the above-mentioned embodiment, an electric component such as a ROM 101 capable of storing information regarding execution of processing by the CPU 103 may be used. Alternatively, it may be an electric component such as a graphics processor included in the display control unit 123 instead of the effect control CPU 120, which is capable of executing a process related to an effect different from that of the effect control CPU 120. Furthermore, instead of the RAM 122, an electric component such as a ROM 121 capable of storing information regarding execution of processing by the effect control CPU 120 may be used. Further, instead of the RAM 122, an electric data component such as an image data memory capable of storing information regarding execution of processing by the effect control CPU 120 or the graphics processor of the display control unit 123 may be used.

The effect control board 12 may be configured as a multilayer wiring board, like the main board 11 in the above-described embodiment. The plurality of signal wirings in the above-described embodiment are electrically connected to a plurality of processing devices such as a production control CPU 120 mounted on the production control board 12 and a graphics processor included in the display control unit 123. The wiring pattern may be formed. Alternatively, the plurality of signal wirings have a wiring pattern formed so that a plurality of electric components such as a graphics processor included in the display control unit 123 and an input/output port for a video signal are electrically connected. May be A wiring pattern is formed so that an arbitrary electric circuit different from the plural electric parts, such as a filter circuit or a buffer circuit, is interposed in the plural signal wires to which the plural electric parts are connected. It may be one. In the plurality of signal wirings, for example, digital video signals indicating respective levels (RGB values) of R (red), G (green), and B (blue) display colors in the image display device 5 are transmitted by a parallel signal method. May be done. Alternatively, in a plurality of signal wirings, signals relating to game control and effect control may be transmitted by a parallel signal system such as an LVDS (Low Voltage Differential Signal) system. In these parallel signal systems, synchronized signal transmission may be required in a plurality of signal wirings. Therefore, as in the above-described embodiment, by forming a wiring pattern so that a portion having a meandering shape or the like is provided, the wiring length of each signal wiring included in a plurality of signal wirings is the same or substantially the same. As a result, the delay time difference between signals transmitted through a plurality of signal lines can be reduced.

The signals are not limited to signals transmitted by the parallel signal system, and for example, video signals supplied to the image display device 5, speakers 8L and 8R, game effect lamps 9, effect motors 60, and effect LEDs 61 for effects. When the control signal supplied to the electric component is transmitted by the serial signal method, the signal wiring for transmitting the clock signal and the signal wiring for transmitting the data signal are the plurality of wirings in the above embodiment. It may be included in the signal wiring. Further, when the video signal and the control signal are transmitted by the serial signal method, the signal wiring for transmitting the signal by the differential signal transmission method may be included in the plurality of signal wirings in the above-described embodiments.

For example, a signal wiring having a distance between connection terminals of a plurality of electric components longer than other signal wirings, such as a signal wiring formed by the wiring pattern 30AK10D, has a shape different from the linear shape and the substantially linear shape. The wiring pattern may be formed so as to include a portion having a shape different from the shape parallel and substantially parallel to the other signal wiring. Even for a signal wiring in which the distance between the connection terminals of the plurality of electric components is shorter than that of the other signal wiring, the wiring length may be longer than the other signal wiring depending on the design of the wiring pattern on the substrate. In such a case, the selection of the signal wiring that includes a portion having a meandering shape or the like of the plurality of signal wirings and the signal wiring that does not include such a portion depends on the design of the wiring pattern on the substrate. It may be arbitrarily changed depending on the situation.

The plurality of signal wirings configured by the wiring pattern are not limited to those having the same or substantially the same wiring length, and are formed by combining with any configuration capable of adjusting the delay time difference (skew). May be For example, of the plurality of signal wirings, the relative dielectric constant of the dielectric arranged corresponding to one signal wiring is made different from the relative dielectric constant of the insulator arranged corresponding to the other signal wiring. According to the above, in combination with a configuration in which the delay time difference (skew) in each signal wiring can be adjusted by changing the signal propagation speed, at least one signal wiring has a linear shape and a substantially linear first shape. May include a second shape portion having a different second shape.

In the above embodiment, as shown in FIG. 37, the electronic components arranged with the sides inclined in the vertical and horizontal directions are the heat-generating electronic component 45AK60 and the electronic component 45AK62 provided around the electronic component 45AK60. .. However, it is also possible to dispose only the heat-generating electronic component 45AK60 in a slanted position and to dispose the other electronic components in a slanted position. Further, the electronic components 45AK60 may be arranged so as to be inclined.

Further, the inclination angle of the heat sink with respect to the heat-generating square electronic component is not limited to 45°. That is, the degree of the inclination angle is not particularly limited as long as the heat sink is arranged so as to sufficiently secure the range in contact with the electronic component in the fin arrangement direction.

The shape of the heat-generating electronic component does not have to be substantially square, and may be rectangular. Even if rectangular electronic components are used, heat generated by the electronic components can be reduced by arranging the heat sink so that the direction in which the fins are aligned matches the direction in which the diagonal lines of the electronic components extend. The heat radiation effect of can be enhanced.

The heat conductive sheet attached to the heat-generating electronic component may be provided in a range sufficient to conduct the heat generated from the electronic component. For example, it may be provided in a range that covers the entire electronic component, or may be provided only in a range that generates heat (only a partial range of the electronic component). In addition, it is preferable that the heat conductive sheet has a size that does not come into contact with the wiring of the substrate even when it is provided to cover the entire electronic component.

(About other embodiment 1)
FIG. 38 is a cross-sectional view showing how a heat sink and a board are attached to the board case of the gaming machine according to the other embodiment 1. In addition, in the following description regarding other modes, the points different from the above modes will be mainly described. The same members as those in the above embodiment are designated by the same reference numerals, and the description thereof will be omitted. As shown in FIG. 38, the rear case 45AK130 is provided with a spring 45AK135 that abuts and supports the fins 45AK42 of the heat sink 45AK40, instead of the support portion 45AK35 shown in FIG. The spring 45AK135 is a compression coil spring, but a leaf spring such as a spring washer can be used instead. Further, the rear case 45AK130 is formed with a plurality of air holes 45AK138 for releasing the heat of the heat sink 45AK40 to the outside. The heat sink 45AK40 and the rear case 45AK130 of the board 45AK50 are attached in the same manner as in the above embodiment. That is, the heat sink 45AK40 is placed in alignment with the positioning portion 45AK134. At this time, the fin 45AK42 is placed on the spring 45AK135. Subsequently, the board 45AK50, in which the heat conductive sheet 45AK70 is attached to the electronic component 45AK60, is inserted into the insertion convex portion 45AK136 to perform alignment, and is placed on the heat sink 45AK40. Then, the screw 45AK81e is inserted into the board 45AK50 and fastened to the screw hole 45AK37e. As a result, the spring 45AK135 is pressed by the fin 45AK42 and contracts, and also presses the fin 45AK42 toward the substrate 45AK50. Thereby, the heat conductive sheet 45AK70 can be brought into close contact with the heat sink 45AK40 and the electronic component 45AK60.

(About other embodiment 2)
Further, FIG. 39 is a cross-sectional view showing how a heat sink and a board are attached to a board case of a gaming machine according to another embodiment 2. As shown in FIG. 39, the rear case 45AK230 is not provided with a member for supporting the fin 45AK242 such as the support portion 45AK35 (FIG. 33) or the spring 45AK135 (FIG. 38) unlike the above embodiment. The rear case 45AK230 has a plurality of air holes 45AK238 for radiating the heat of the heat sink 45AK240 to the outside.

The board 45AK250 is formed with a screw insertion hole 45AK252 for inserting the screw 45AK251. Further, the heat sink 45AK240 is formed with a screw hole 45AK243 for tightening the screw 45AK251. The heat sink 45AK240 and the substrate 45AK250 can be integrated by inserting the screw 45AK251 into the screw insertion hole 45AK252 formed in the substrate 45AK250 and tightening the screw 45AK251 in the screw hole 45AK243 formed in the heat sink 45AK240. At this time, the heat sink 45AK240 is pulled toward the substrate 45AK250 by sufficiently tightening the screw 45AK251. As a result, the heat conductive sheet 45AK270 can be brought into close contact with the heat sink 45AK240 and the electronic component 45AK260.

The receptacle KRE1 is not limited to being surface-mounted on the board of the effect control board 12, but may be surface-mounted on any board such as the board of the main board 11. The various power supply voltages are not limited to those supplied to the production control board 12, and may be supplied to any control board such as the main board 11 or the payout control board. Various electric circuits and electric parts are not limited to those arranged on the production control board 12, and may be arranged on any control board such as the main board 11 or the payout control board.

The present invention can be applied not only to the pachinko gaming machine 1 but also to a slot machine or the like. The slot machine is, for example, an arbitrary gaming machine that performs a predetermined game such as a variable display of symbols that are a plurality of types of identification information, and can give a predetermined game value based on the game result, and more specifically, The game can be started by setting a predetermined bet number (the number of medals or the number of credits) for one game, and a variable display device that variably displays a plurality of types of identification information (designs) that can be identified by each ( One game is ended by displaying and displaying the display results of a plurality of reels, etc., and a prize is awarded according to the display result (for example, cherry prize, watermelon prize, bell prize, replay prize, BB prize, RB prize, etc.). Is a gaming machine that is capable of generating. In such a slot machine, hardware resources including a game control microcomputer for performing game control and software for performing a predetermined process cooperate with each other, so that the pachinko game shown in the above-described embodiment is executed. It may be configured to include all or some of the features of the machine 1.

In addition, the device configuration and various operations of the gaming machine can be arbitrarily changed and modified without departing from the spirit of the present invention. In addition, the gaming machine of the present invention is not limited to a pay-out type gaming machine that pays out a predetermined number of game media as a prize based on the occurrence of a prize, and encloses the game medium to score points based on the occurrence of a prize. It can also be applied to an enclosed game machine that gives The slot machine is not limited to one in which the bet amount is set by using medals and credits as a gaming value, and only a slot machine in which a bet number is set by using a gaming ball as a gaming value or only credits as a gaming value. It may be a fully creditable slot machine in which the bet amount is set by using.

The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.

(Explanation regarding problem solving means and effects)
As described above, in the gaming machine such as the pachinko gaming machine 1 according to the present application, in the wiring connection device such as the receptacle KRE1, the terminals TA01 serving as the pair of ground terminals are sandwiched between the terminals TA02 serving as the signal terminals. , TA03 are surface-mounted on the board of the effect control board 12, an appropriate board configuration is possible.

The terminals TA01 and TA03 are bonded to the dummy pads DP1 and DP2, and the tip end portions of the terminals TA01 to TA03 are covered with the cover member 802 of the substrate case 800, so that an appropriate substrate configuration is possible.

The receptacle KRE1 is provided with fixing metal fittings SS01 and SS02 joined to the dummy pads DP3 and DP4 on the side surface PL2, so that an appropriate substrate configuration can be achieved.

The gap between the inner peripheral wall surface 836b and the receptacle KRE1 in the opening region 836a is formed such that the opening width W2 on the side closer to the component housing portion 802a is wider than the opening width W1 on the side far from the component housing portion 802a, so that an appropriate substrate configuration can be realized. Become.

The terminals TA01 to TA03 of the receptacle KRE1 have an exposed portion that is not covered by the cover member 802 of the substrate case 800 and an exposed portion that is covered by the cover member 802 of the substrate case 800 and is not exposed in the opening region 836a. By doing so, an appropriate substrate configuration becomes possible.

The mounting position where the terminals TA01 to TA03 of the receptacle KRE1 are surface-mounted is covered by the opening peripheral portion 840, and the opening peripheral portion 840 and the board surface of the effect control board 12 form a space SP1 close to the mounting position. Appropriate substrate configurations are possible.

Alternatively, the effect control board 12 outputs the power supply voltage VSL2 of 34V DC as it is as the power supply voltage VSL, and the driver board 19 inputs the voltage to the filter circuit 511 to stabilize the voltage, thereby enabling an appropriate board configuration. ..

Since there is no filter circuit in the power supply line LSL that supplies the power supply voltage VSL of DC 34V, an appropriate substrate configuration can be achieved.

In the receptacle KRE2, the number of terminals TA15 to TA24, TA27, TA28 connected to any of the filter circuits 131a to 131c is larger than the number of terminals TA13, TA14 not connected to the filter circuit, which is suitable. Substrate configuration is possible.

The terminals TA15 to TA24, TA27, and TA28 connected to any of the filter circuits 131a to 131c can supply a plurality of types of power supply voltages, and the production control board 12 has only one type of terminals TA13 and TA14 that are not connected to the filter circuit. Since the power supply voltage can be supplied and the terminals TA13 and TA14 are arranged outside the terminals TA15 to TA24 and the like, an appropriate substrate configuration can be achieved.

The terminals TA13 to TA24, TA27, TA28, which are power supply voltage terminals, are arranged between the terminals TA11, TA12, which are ground terminals, and the terminals TA29, TA30, which are ground terminals, so that an appropriate substrate configuration can be achieved. become.

In the receptacle KRE2, the terminals TA13 and TA14 included in the second power supply voltage terminal and the terminals TA15 to TA24 included in the first power supply voltage terminal are the terminals TA11 and TA12 included in the first ground terminal, and the second ground terminal. The terminals TA27 and TA28 included in the first power supply voltage terminal, the terminals TA25 and TA26 included in the second ground terminal, and the terminal TA29 included in the third ground terminal. , TA30, an appropriate substrate configuration is possible.

Alternatively, in the effect control board 12, after dividing one power supply voltage VDD2 into a power supply voltage VDL for driving a specific electric component and a power supply voltage VDS for supplying to the amplification circuit 521, the filter circuit 131a is connected. By supplying the stabilized power supply voltage VDS to the amplifier circuit 521, an appropriate substrate configuration becomes possible.

By setting the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 to be shorter than the wiring length LL1 from when the power supply voltage VDL is branched at the branch point DB1 to when the power supply voltage VDL is input to the filter circuit 131a, an appropriate substrate configuration can be obtained. It will be possible.

Alternatively, in the noise prevention circuits 135a and 135b, by using a resistor which is a circuit element different from that of the noise prevention circuit 135c, an appropriate substrate configuration can be realized.

The noise prevention circuits 135a and 135b are provided in correspondence with the power supply voltage for driving a specific electric component such as a motor or an LED, and the noise prevention circuit 135c has a power supply voltage for driving a specific electric circuit such as a CPU or a ROM. By being provided correspondingly, an appropriate substrate configuration becomes possible.

Alternatively, in the step-down converter circuit 132, the power supply voltage VDD3 stabilized by the filter circuit 131c is input to output a power supply voltage of DC 1.05V and a power supply voltage of DC 3.3V, and the regulator circuit 133 supplies DC By inputting the power supply voltage of 3.3V and outputting the power supply voltage of DC 1.5V, an appropriate substrate configuration can be realized.

The power supply voltage VDC that is the same as or substantially the same as the voltage supplied to the step-down converter circuit 132 is supplied to the power supply monitoring circuit 140, so that an appropriate substrate configuration can be achieved.

The power supply voltage of 1.05 V DC output from the step-down converter circuit 132 is supplied to a specific microprocessor such as a graphics processor of the display control unit 123, so that an appropriate board configuration can be achieved.

The DC 3.3V power supply voltage output from the step-down converter circuit 132 is supplied to, for example, the ROM 121, and is activated before an electric component such as the RAM 122 driven by the DC 1.5V power supply voltage output from the regulator circuit 133. By being possible, an appropriate substrate configuration is possible.

The power supply voltage of 1.5 V DC output from the regulator circuit 133 is supplied to a component different from the effect control substrate 12, such as the RAM 122, so that an appropriate substrate configuration becomes possible.

(Explanation on Problem Solving Means and Effects of Characteristic Section 30AK)
For example, a pachinko gaming machine 1 or the like, which is a gaming machine that can be played. For example, as shown in FIG. 17, a pattern forming a plurality of signal wirings is formed, and a plurality of electrical wirings such as a RAM 102 and a CPU 103 are formed by the plurality of signal wirings. A pattern is provided with a substrate such as a main substrate 11 to which components are connected, and the pattern has a plurality of signal wirings such as a region 30AK10R and a parallel wiring portion having a first shape in which a plurality of signal wirings are parallel or substantially parallel. At least one signal wiring of the wirings includes a specific wiring portion having a second shape that is not parallel to other signal wirings, and the signal wirings included in the plurality of signal wirings have the same or substantially the same wiring length. Become. As a result, an appropriate board configuration that reduces the delay time difference between the signals transmitted through the plurality of signal wirings becomes possible.

For example, the signal wiring that does not include the second shape, such as the signal wiring that is formed by the wiring pattern 30AK10D, has a distance between the connection terminals of the plurality of electric components that is, for example, the signal wiring that is formed by the wiring patterns 30AK11D to 30AK13D. It may be longer than the signal wiring including the shape. As a result, an increase in the area of the board on which the wiring pattern is arranged is suppressed, and an appropriate board configuration for downsizing the board is possible.

For example, the conductor may not be provided in a predetermined region such as the space region 30AK0SP, which is close to the signal wiring having the second shape. As a result, it is possible to realize an appropriate substrate configuration in which electromagnetic interference due to electromagnetic noise in the plurality of signal wirings is prevented or suppressed.

The substrate is provided with through holes, such as through holes 30AK1H and 30AK2H, which can electrically connect signal wiring provided on one surface of the substrate and signal wiring provided on the other surface of the substrate. The wiring lengths of the signal wirings included in may be the same or substantially the same for the signal wirings connected by the through holes, including the lengths of the through holes. As a result, an appropriate substrate configuration that reduces the delay time difference between the signals transmitted by the plurality of signal wirings becomes possible.

The substrate includes a plurality of layers such as a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back surface layer 30AK2S, and a signal wiring having a second shape among the plurality of layers is provided. Signal transmission may not be performed in a conductor layer such as the ground layer 30AK1L adjacent to the layer. As a result, it is possible to realize an appropriate substrate configuration in which electromagnetic interference due to electromagnetic noise in the plurality of signal wirings is prevented or suppressed.

As the plurality of electric components, a processing unit capable of executing a predetermined process, such as the CPU 103, and a storage unit capable of storing information regarding the execution of the process, such as the RAM 102, may be connected. As a result, it is possible to realize an appropriate board configuration that reduces the difference in delay time of signals transmitted by a plurality of signal wirings connected to the processing means and the storage means as a plurality of electric components.

Alternatively, for example, a pachinko gaming machine 1 or the like, which is a gaming machine that can be played, for example, as shown in FIG. 17, a pattern forming a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are formed. Of the main board 11 to which the electric components of FIG. The signal wiring may include a specific wiring portion having a second shape different from the first shape, and the wiring lengths of the signal wirings included in the plurality of signal wirings may be the same or substantially the same. As a result, an appropriate substrate configuration that reduces the delay time difference between the signals transmitted by the plurality of signal wirings becomes possible.

Alternatively, for example, a pachinko gaming machine 1 or the like, which is a gaming machine that can be played, for example, as shown in FIG. 17, a pattern forming a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are formed. The main shape of the main board 11 to which the electric components are connected, and the pattern has a first shape in which at least one signal wiring of a plurality of signal wirings includes a linear shape or a substantially linear shape, for example, a wiring pattern 30AK10D. And a second pattern in which other signal wirings not included in the first pattern among the plurality of signal wirings, such as wiring patterns 30AK11D to 30AK13D, have a second shape different from the first shape. In the first pattern and the second pattern, the wiring lengths of the signal wirings included in the plurality of signal wirings may be the same or substantially the same. As a result, an appropriate substrate configuration that reduces the delay time difference between the signals transmitted by the plurality of signal wirings becomes possible.

Alternatively, for example, a pachinko gaming machine 1 or the like, which is a gaming machine that can be played, for example, as shown in FIG. 17, a pattern forming a plurality of signal wirings is formed, and a plurality of signal wirings such as a RAM 102 and a CPU 103 are formed. The main board 11 or the like to which the electric components of FIG. 1 are connected, and the pattern is a wiring of at least one of the plurality of signal wirings that connects a predetermined section such as the section 30AK0SC at the shortest or substantially the shortest distance. Wiring patterns 30AK12D, 30AK13D, etc. in which the first patterns such as the patterns 30AK10D, 30AK11D and other signal wirings not included in the first pattern among the plurality of signal wirings connect a predetermined section at a distance longer than the first pattern In the first pattern and the second pattern, the wiring length of each signal wiring included in the plurality of signal wirings may be the same or substantially the same. As a result, an appropriate substrate configuration that reduces the delay time difference between the signals transmitted by the plurality of signal wirings becomes possible.

The first pattern may have a longer distance between the connection terminals in the plurality of electric components than the second pattern. As a result, an increase in the area of the board on which the wiring pattern is arranged is suppressed, and an appropriate board configuration for downsizing the board is possible.

For example, the conductor may not be provided in a predetermined region close to the second pattern, such as the space region 30AK0SP. As a result, it is possible to realize an appropriate substrate configuration in which electromagnetic interference due to electromagnetic noise in the plurality of signal wirings is prevented or suppressed.

The substrate includes a plurality of layers such as a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back surface layer 30AK2S. Signal transmission may not be performed in a conductor layer such as the ground layer 30AK1L that is adjacent to the layer provided. As a result, it is possible to realize an appropriate substrate configuration in which electromagnetic interference due to electromagnetic noise in the plurality of signal wirings is prevented or suppressed.

(Explanation on Problem Solving Means and Effects of Characteristic Section 42AK)
For example, as shown in FIG. 25A, a game machine such as a pachinko game machine 1 that can be played, and as a pattern that configures a plurality of signal wirings, for example, a first wiring pattern 42AK10 and a second wiring pattern. The first pattern and the second pattern are provided with a substrate such as a main substrate 11 in which a first pattern and a second pattern such as the pattern 42AK11 are formed, and a plurality of electric components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings. One of the first pattern and the second pattern corresponds to the first shape portion having a linear or substantially straight first shape, such as the first shape portion 42AK10L. The signal wiring configured by the pattern includes a second shape portion having a second shape different from the first shape such as the second shape portion 42AK11M, and is configured by the other pattern such as the first shape portion 42AK11L. Corresponding to the first shaped portion of the signal wiring, the signal wiring configured by one pattern, such as the second shaped portion 42AK10M, includes the second shaped portion. As a result, an increase in the area of the board on which the wiring pattern is arranged is suppressed, and an appropriate board configuration for downsizing the board is possible.

The first pattern and the second pattern may be formed such that the signal lines have the same or substantially the same wiring length. As a result, an appropriate substrate configuration that reduces the delay time difference between the signals transmitted by the plurality of signal wirings becomes possible.

For example, as shown in FIG. 26, the second shape portion may be formed in different directions for the signal wiring configured by the first pattern and the signal wiring configured by the second pattern. As a result, it is possible to easily and flexibly design the wiring pattern on the substrate surface, suppress an increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

For example, as shown in FIG. 27, the second shape portion may be formed to have different wiring widths for the signal wiring configured by the first pattern and the signal wiring configured by the second pattern. As a result, the characteristic impedance of each signal wiring can be easily adjusted, and appropriate transmission according to the type of electric signal can be performed.

For example, as shown in FIG. 28A, the second shape portion is a parallel wiring portion in which the signal wiring formed by the first pattern and the signal wiring formed by the second pattern are formed in parallel or substantially in parallel. May be included. As a result, it is possible to easily and flexibly design the wiring pattern on the substrate surface, suppress an increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

For example, as shown in FIGS. 29A and 29B, the second shape portion of the signal wiring formed by the first pattern or the second pattern is connected to the signal wiring formed by another pattern. A circuit component such as the circuit component 42AK1R mounted as described above may be provided. This makes it possible to properly adjust the transmission characteristics of the signal wiring, suppress the increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

For example, as shown in FIG. 29A, it is mounted so as to be connected to a wiring portion such as a first shaped portion 42AK52L different from the second shaped portion in the signal wiring formed by the first pattern or the second pattern. A circuit component such as the circuit component 42AK2R may be provided. This makes it possible to properly adjust the transmission characteristics of the signal wiring, suppress the increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

(Explanation on Problem Solving Means and Effects of Characteristic Section 43AK)
For example, a pachinko gaming machine 1 or the like, which is a gaming machine that can be played, and as a pattern that configures a plurality of signal wirings, as shown in FIG. 30, for example, a first wiring pattern 43AK10 and a second wiring pattern 43AK11. A first pattern and a second pattern are formed, and a plurality of signal wirings are connected to a plurality of electric components such as the RAM 102 and the CPU 103, such as a main substrate 11, and one of the first pattern and the second pattern is provided. The signal wiring constituted by the pattern of the first pattern part 43AK10L, 43AK11L or the like corresponds to the first shape part having a straight or substantially straight first shape, and the other one of the first pattern and the second pattern is formed. The signal wiring formed by the pattern includes a second shape portion having a second shape different from the first shape, such as the second shape portions 43AK10M and 43AK11M. For example, in the second shape portion such as the test points 43AK10P and 43AK11P. A specific conductor portion for connection confirmation is provided. Accordingly, the wiring pattern can be appropriately arranged, various structures can be appropriately arranged, an increase in the substrate area can be suppressed, and the substrate can be downsized.

The specific conductor portion is formed using a metal material such as solder or copper foil, and has a signal pattern of the first pattern or the second pattern, for example, wiring width W5<diameter W6 shown in FIG. It may be formed to be wider than the wiring width. As a result, the electrical characteristics of the signal wiring can be easily inspected, the wiring pattern is properly arranged, and various structures are properly arranged to suppress an increase in the board area and reduce the board size. Can be planned.

The substrate includes a plurality of layers such as a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, and a back surface layer 44AK2S shown in FIG. It may be connected to a conductor layer different from the layer in which the conductor portion is provided, for example, through holes such as through holes 44AK1H and 44AK2H. Thereby, the electrical characteristics of the signal wiring and the conductor layer can be easily inspected, the wiring pattern is appropriately arranged, and various structures are appropriately arranged, so that the increase of the board area is suppressed and the board area is suppressed. Can be miniaturized.

(Explanation on Problem Solving Means and Effects of Characteristic Section 44AK)
For example, a pachinko gaming machine 1 or the like, which is a gaming machine that can be played, and as a pattern that configures a plurality of signal wirings, as shown in FIG. 30, for example, a first wiring pattern 43AK10 and a second wiring pattern 43AK11. A first pattern and a second pattern are formed, and a plurality of signal wirings are connected to a plurality of electric components such as the RAM 102 and the CPU 103, such as a main substrate 11, and one of the first pattern and the second pattern is provided. The signal wiring constituted by the pattern of the first pattern part 43AK10L, 43AK11L or the like corresponds to the first shape part having a straight or substantially straight first shape, and the other one of the first pattern and the second pattern is formed. The signal wiring formed by the pattern includes a second shape portion having a second shape different from the first shape such as the second shape portions 43AK10M and 43AK11M, and one surface of the substrate such as the surface layer 44AK1S shown in FIG. 31. Is provided with a signal wiring including a second shape portion such as a signal wiring formed by the wiring patterns 44AK10P and 44AK11P. For example, on the other surface of the substrate such as the back surface layer 44AK2S, for example, at the test point 44AK11TP, for connection confirmation. Is provided. Thereby, the electrical characteristics of the signal wiring and the conductor layer can be easily inspected, the wiring pattern is appropriately arranged, and various structures are appropriately arranged, so that the increase of the board area is suppressed and the board area is suppressed. Can be miniaturized.

(Explanation on Problem Solving Means and Effects of Characteristic Part 45AK)
As shown in FIG. 36, in a plan view, the rectangular electronic component 45AK60 is arranged such that its sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink. As a result, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

The electronic component 45AK60 can be arranged by rotating the electronic component 45AK61 arranged so that each side is parallel to the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ about the center point O. The predetermined angle θ is, for example, about 45°. As a result, it is possible to enhance the heat radiation effect of the heat generated from the electronic component 45AK60.

The heat sink 45AK40 is arranged so that the fins 45AK42 arranged in parallel in the left-right direction face the vertical direction. As a result, the air moving from the lower side to the upper side can be passed between the fins 45AK42 along the vertical direction, and the heat generated from the electronic component 45AK60 can be generated without obstructing the flow of the air moving in the upward direction. The heat radiation effect of can be enhanced.

The heat conductive sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conductive sheet having both surfaces adhered. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

The rear case 45AK30 is provided with a support portion 45AK35 for pressing the heat sink 45AK40 against the heat-generating electronic component 45AK60. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transferred to the heat sink 45AK40 via the heat conductive sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

1 ... Pachinko gaming machine 11 ... Main board 12 ... Production control board 13 ... Voice control board 19 ... Driver board 120 ... Production control CPU
121... ROM
122... RAM
123... Display control parts 131a to 131c, 511... Filter circuit 132... Step-down converter circuit 133... Regulator circuit 140... Power supply monitoring circuit 521... Amplification circuit 800... Board case 802... Cover members KRE1 to KRE4... Receptacles 30AK10G, 30AK11G, 30AK20G. Ground conductors 30AK01R, 30AK10R, 30AK11R, 30AK12R,
30AK20R... Area 30AK0SC... Sections 30AK10D to 30AK13D, 30AK10CK, 30AK10CS,
30AK10RS, 30AK10A to 30AK14A, 30AK10P,
30AK11P, 30AK20P... Wiring pattern 30AK1S... Front surface layer 30AK2S... Back surface layer 30AK1L... Ground layer 30AK2L, 30AK4L... Power supply layer 30AK3L... Wiring layer 30AK1H, 30AK2H... Through hole 42AK10-42AK13, 42AK20-42AK20-42AK20
42AK30 to 42AK37, 42AK40 to 42AK43
42AK50 to 42AK53, 43AK10, 43AK11,
44AK10P, 44AK11P, 44AK20P... Wiring patterns 42AK10L to 42AK13L, 42AK51L, 42AK52L... First shape portions 42AK10M to 42AK13M, 42AK20M to 42AK22M,
42AK23M1, 42AK23M2, 42AK24M, 42AK25M,
42AK26M1, 42AK26M2, 42AK30M to 42AK37M,
42AK51M, 42AK52M... 2nd shape part 42AK51M1-42AK51M3... Folding part 42AK1Z-42AK4Z... Wiring part 42AK1R, 42AK2R... Circuit parts 43AK10, 43AK11... Wiring pattern 43AK10L, 43AK11L... 11M 2nd part 43A10. , 43AK11TP... Test points 44AK10P, 44AK11P, 44AK20P... Wiring pattern 44AK1S... Surface layer 44AK2S... Back surface layer 44AK1L... Ground layer 44AK2L, 44AK4L... Power supply layer 44AK3L... Wiring layer 44AK1H, 44AK2K... TP44A10... Substrate case 45AK20 ... Front case 45AK30 ... Rear case 45AK32, 45AK33 ... Air hole 45AK34 ... Positioning part 45AK35 ... Support part 45AK36 ... Insertion convex part 45AK37 ... Screw hole 45AK40 ... Heat sink 45AK42 ... Fin 45AK50 ... Board 45AK60 ... Electronic component 45AK70 ... Sheet 45AK81a to 45AK81b... Screw

Claims (1)

A gaming machine capable of playing,
A power supply board capable of supplying electric power to electric parts,
A control board that receives power from the power supply board;
A board case capable of accommodating the control board,
The control board is
Wiring connection means capable of detachably connecting signal wiring,
A stabilization circuit that stabilizes the power supply voltage,
And an audio circuit capable of outputting an audio signal,
The wiring connection means,
A signal terminal connectable to the signal transmission line of the signal wiring,
Including a pair of ground terminals,
The pair of ground terminals are surface-mounted on the control board at positions sandwiching both sides of the signal terminal,
The cover member as the substrate case covers the tips of the pair of ground terminals and the signal terminals,
After branching the power supply voltage of 1 into a power supply voltage for driving a specific electric component and a power supply voltage for supplying to the audio circuit, the power supply voltage stabilized by the stabilizing circuit is supplied to the audio circuit. Supply,
The specific electrical component includes a current-driven circuit element,
A power supply voltage for driving the specific electric component is connected to a noise removing circuit at a power supply path after branching the first power supply voltage,
The wiring length from the stabilizing circuit to the audio circuit is shorter than the wiring length from the branch of the power supply voltage of 1 to the input to the stabilizing circuit.
A gaming machine characterized by that.