JP2020108191A - Panel cooling structure - Google Patents

Panel cooling structure Download PDF

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JP2020108191A
JP2020108191A JP2018242295A JP2018242295A JP2020108191A JP 2020108191 A JP2020108191 A JP 2020108191A JP 2018242295 A JP2018242295 A JP 2018242295A JP 2018242295 A JP2018242295 A JP 2018242295A JP 2020108191 A JP2020108191 A JP 2020108191A
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board
panel
wall
heat exchanger
space
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陽平 山田
Yohei Yamada
陽平 山田
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Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
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Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
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Abstract

To provide a panel cooling structure that can contribute to the cooling performance, downsizing, etc. of a panel.SOLUTION: A panel cooling structure comprises: a box-shaped peripheral wall 2 that forms a panel space part 11; a partition wall 3 that is mounted on the central part side of a panel standing direction (z direction) in the panel space part 11, and that extends in a panel horizontal direction (xy directions); and a heat exchanger 4 that is arranged on the peripheral wall 2 opposite to the partition wall 3. The partition wall 3 is formed with a through portion 31 in either direction of the residual two directions (y direction) of the four panel horizontal directions except for the heat exchanger side relative direction (x direction). In the heat exchanger 4, both openings of an air inlet port 41 and an air outlet port 43 are situated deviated toward an opposite side direction to the through portion 31, and both of them are situated apart having a predetermined distance in the panel standing direction with the partition wall 3 as a boundary. One of both openings is open to a ceiling wall 21 side in the panel space part 11, and the other of both openings is open to a bottom wall 22 side in the panel space part 11.SELECTED DRAWING: Figure 2

Description

本発明は、種々の設備に適用されている電力変換装置等の機器を収容可能な盤に係るものであって、例えば当該盤の冷却構造に適用可能な技術に関するものである。 The present invention relates to a panel capable of accommodating equipment such as a power conversion device applied to various facilities, and relates to, for example, a technique applicable to a cooling structure for the panel.

種々の設備で適用されている電力変換装置等の機器は、設置環境によって、当該機器の損傷,腐食,劣化等の要因となり得る物質(例えば埃,粉塵,飛来塩分,微小粒子状物質,化学物質,湿気,腐食性ガス等;以下、単に要因物質と適宜称する)に曝される場合がある。 Devices such as power converters applied in various facilities are substances (such as dust, dust, flying salt, fine particulate matter, chemical substances) that can cause damage, corrosion, deterioration, etc. of the device depending on the installation environment. , Moisture, corrosive gas, etc.; hereinafter, simply referred to as causative substance).

このような場合には、例えば盤内において気密状態に保持可能な空間部(例えば筐体状の周壁で包囲されて気密状態に保持可能な空間部;以下、単に盤内空間部と適宜称する)に機器を適宜収容し、当該機器、例えば電力変換装置を構成する電子部品、変圧器やインダクタ等の受動部品、主要な発熱源である半導体電力変換素子部、を仕様に応じて要因物質から隔離することが望ましい。また、これらの機器においては、低耐熱性の機器部品等(例えば回路基板等)が含まれている場合や、その他の部品においても適切に、盤内空間部に冷却機能を設ける等により、当該盤内空間部の温度上昇を抑制することが望ましい。 In such a case, for example, a space portion that can be kept airtight in the board (for example, a space portion that is surrounded by a casing-like peripheral wall and that can be kept airtight; hereinafter, simply referred to as a board space portion) The device is properly accommodated in the device, and the device, for example, electronic components that make up the power conversion device, passive components such as transformers and inductors, and semiconductor power conversion element that is the main heat source, are isolated from the factor substances according to specifications. It is desirable to do. In addition, in the case where these devices include low heat-resistant device parts (such as a circuit board) or other parts, by appropriately providing a cooling function in the space inside the panel, It is desirable to suppress the temperature rise in the space inside the board.

例えば特許文献1では、盤内空間部の空気を循環しながら熱を吸熱して当該空気を冷却する熱交換器と、盤内空間部の内壁面(盤内空間部を包囲する周壁の内壁面)から外壁面に熱伝導した熱を吸熱するヒートパイプと、を備えた盤が開示されている。特許文献2では、盤内空間部に仕切壁(特許文献2では循環誘導部材)を備え、当該盤内空間部の空気が仕切壁に沿って循環できるようにした盤が開示されている。 For example, in Patent Document 1, a heat exchanger that absorbs heat and cools the air while circulating the air in the space inside the board, and the inner wall surface of the space inside the board (the inner wall surface of the peripheral wall that surrounds the space inside the board) ), a heat pipe that absorbs the heat conducted to the outer wall surface is disclosed. Patent Document 2 discloses a board in which a partition wall (circulation guiding member in Patent Document 2) is provided in the board space portion so that the air in the board space portion can circulate along the partition wall.

熱交換器においては、盤内空間部の空気を吸気する吸気口部と、当該吸気口から吸気した空気の熱を吸熱して当該空気を冷却する吸熱部と、当該吸熱部で冷却した空気(冷却された空気)を盤内空間部に戻す排気口部と、を有した構成が挙げられる。 In the heat exchanger, an air intake port that inhales the air in the space inside the panel, an endotherm that absorbs the heat of the air inhaled from the air intake to cool the air, and an air that is cooled by the endothermic part ( And an exhaust port for returning cooled air) to the space inside the panel.

特開2017−204901号公報JP, 2017-204901, A 特開2016−103876号公報JP, 2016-103876, A

特許文献2のように仕切壁を備えた盤冷却構造の場合、盤内空間部の空気を所望の循環流路で循環させることができ、当該空気の滞留を抑制することも可能となる。 In the case of the board cooling structure including the partition wall as in Patent Document 2, the air in the board internal space can be circulated in a desired circulation flow path, and the retention of the air can be suppressed.

しかしながら、当該仕切壁の存在により、循環する空気の圧力損失が生じ、冷却性能を十分に発揮できないおそれもある。例えば、循環流路を十分に大きく(例えば循環流路方向に直交する断面積を大きく)することにより、前述のような圧力損失を低減できることも考えられるが、盤の大型化等を招くおそれがある。 However, due to the presence of the partition wall, pressure loss of the circulating air may occur, and the cooling performance may not be sufficiently exhibited. For example, it is considered that the pressure loss as described above can be reduced by making the circulation flow channel sufficiently large (for example, the cross-sectional area orthogonal to the circulation flow channel direction), but there is a possibility that the size of the panel may be increased. is there.

本発明は、前述のような技術的課題に鑑みてなされたものであって、盤の冷却性能や小型化等に貢献可能な盤冷却構造を提供することにある。 The present invention has been made in view of the above technical problems, and it is an object of the present invention to provide a board cooling structure capable of contributing to the board cooling performance, downsizing, and the like.

この発明に係る電子機器筐体は、前記の課題の解決に貢献できるものであり、その一態様は、筐体状の周壁により包囲されて気密状態に保持可能な盤内空間部と、盤内空間部において、盤立設方向の中央部側で当該盤立設方向に交差した交差方向に延在し、当該盤内空間部を天井壁側と底壁側とに区分している仕切壁と、周壁のうち前記交差方向に位置する各側壁の何れかにおいて、仕切壁に対向して設けられた熱交換器と、を備えた盤冷却構造である。 An electronic device housing according to the present invention can contribute to solving the above-mentioned problems, and one aspect thereof is an internal space portion of a board that is surrounded by a peripheral wall of the housing and can be kept airtight, In the space portion, a partition wall that extends in the intersecting direction intersecting the board standing direction on the side of the center of the board standing direction and that divides the space inside the board into a ceiling wall side and a bottom wall side. And a heat exchanger provided so as to face the partition wall on any of the side walls of the peripheral wall located in the intersecting direction, the panel cooling structure.

この盤冷却構造において、仕切壁は、前記交差方向の四方のうち、互いに相対する熱交換器側方向および熱交換器反対側方向を除き、残りの互いに相対する二方向の何れか方向において、盤立設方向に貫通している貫通部が形成されているものとする。 In this board cooling structure, the partition wall is a board in any one of the two opposite directions except the heat exchanger side direction and the heat exchanger opposite direction which are opposite to each other among the four directions of the cross direction. It is assumed that a penetrating portion penetrating in the standing direction is formed.

熱交換器は、盤内空間部の空気を吸気する吸気口部と、吸気口部から吸気した空気の熱を吸熱して当該空気を冷却する吸熱部と、吸熱部で冷却した空気を盤内空間部に戻す排気口部と、を有しているものとする。 The heat exchanger is composed of an intake port for taking in the air in the space inside the panel, an endotherm for absorbing the heat of the air taken in from the intake port and cooling the air, and the air cooled by the endothermic part in the panel. And an exhaust port returning to the space.

そして、吸気口部および排気口部の両開口部は、前記二方向において貫通部側方向に相対する貫通部反対側方向に偏倚して位置、かつ仕切壁を境界にして互いに盤立設方向に所定距離を隔てて位置し、当該両開口部のうち一方が盤内空間部における天井壁側に開口し、当該両開口部のうち他方が盤内空間部における底壁側に開口していることを特徴とする。 Both openings of the intake port and the exhaust port are offset in the opposite direction of the penetrating part facing the penetrating part side direction in the two directions, and in the panel standing direction with the partition wall as a boundary. Located at a predetermined distance, one of the two openings is open to the ceiling wall side of the board space, and the other of the two openings is open to the bottom wall side of the board space. Is characterized by.

また、貫通部には、当該貫通部における空気の循環方向に通風可能な通風機が配置されていても良い。 Further, a ventilator capable of ventilating in the circulation direction of air in the penetrating portion may be arranged in the penetrating portion.

また、機器は、複数個の機器部品を備え、盤内空間部の天井壁側および底壁側の両者のうち吸気口部が開口している側に、比較的高耐熱性の機器部品が配置され、当該両者のうち排気口部が開口している側に、比較的低耐熱性の機器部品が配置されていても良い。 In addition, the equipment is equipped with multiple equipment parts, and relatively high heat resistance equipment parts are placed on the side where the intake port is open on both the ceiling wall side and the bottom wall side of the space inside the panel. However, a device component having a relatively low heat resistance may be disposed on the side of the both of which the exhaust port is open.

また、機器部品は、各側壁のうち熱交換器反対側方向の側壁の内壁面に支持されるものでも良い。 Further, the equipment component may be supported on the inner wall surface of the side wall of each side wall in the direction opposite to the heat exchanger.

また、仕切壁は、熱交換器側方向の周縁端部において、熱交換器反対側方向に窪んだ形状の切欠部が形成され、熱交換器は、側壁に対し厚さ方向に貫装されて、当該熱交換器の吸気口部および排気口部の両開口部間が盤内空間部に突出し、当該両開口部間が切欠部に受容されているものでも良い。 Further, the partition wall is formed with a cutout portion having a recessed shape in the direction opposite to the heat exchanger at the peripheral edge portion in the heat exchanger side direction, and the heat exchanger is penetrated in the thickness direction with respect to the side wall. The space between the openings of the intake port and the exhaust port of the heat exchanger may protrude into the space inside the panel, and the space between the openings may be received by the notch.

また、熱交換器は、周壁のうち盤正面側の側壁に設けられているものでも良い。 The heat exchanger may be provided on the side wall of the peripheral wall on the front side of the board.

また、吸気口部が盤内空間部における天井壁側に開口し、排気口部が盤内空間部における底壁側に開口しているものでも良い。 Further, the intake port may be opened to the ceiling wall side in the board internal space, and the exhaust port may be opened to the bottom wall side in the board internal space.

以上示したように本発明によれば、盤の冷却性能や小型化等に貢献可能となる。 As described above, according to the present invention, it is possible to contribute to the cooling performance and downsizing of the board.

本実施形態の盤冷却構造の一例を示す盤10の概略斜視図。The schematic perspective view of the board 10 which shows an example of the board cooling structure of this embodiment. 盤10の内部をそれぞれ盤正面側,右側面側,天井側から臨んだ場合の概略説明図((A)は側壁23,熱交換器4を取り除いて臨んだ図、(B)は側壁26,通風機32を取り除いて臨んだ図、(C)は天井壁21,機器5を取り除いて臨んだ図、(D)は(C)の熱交換器4の概略断面図)。Schematic explanatory views when the inside of the panel 10 is viewed from the front side, the right side, and the ceiling side, respectively ((A) is a side wall 23, a view with the heat exchanger 4 removed, (B) is a side wall 26, A view of the heat exchanger 4 with the ventilator 32 removed, (C) a view of the ceiling wall 21 and the device 5 removed, and (D) a schematic cross-sectional view of the heat exchanger 4 of (C). 仕切壁3の他例を示す概略説明図(図2(C)と同様に臨んだ図)。The schematic explanatory drawing which shows the other example of the partition wall 3 (The figure which faced similarly to FIG.2(C)). 仕切壁3と熱交換器4との両者間を示す概略説明図(図2(C)と同様に臨んだ図)。The schematic explanatory drawing which shows between both of the partition wall 3 and the heat exchanger 4 (drawing similar to FIG.2(C)).

本発明の実施形態の盤冷却構造は、単に盤内空間部の周壁に熱交換器を設けたり、当該盤内空間部において複数の方向に延在した形状の仕切壁を設けた構造(以下、単に従来構造と適宜称する)とは、全く異なるものである。 The board cooling structure of the embodiment of the present invention is simply a structure in which a heat exchanger is provided on the peripheral wall of the board internal space portion, or a partition wall having a shape extending in a plurality of directions in the board internal space portion is provided (hereinafter, (Simply called a conventional structure).

すなわち、本実施形態による盤冷却構造は、盤内空間部において、盤立設方向(後述の図1では矢印z方向)の中央部側で当該盤立設方向に交差した交差方向(以下、単に盤水平方向と適宜称する)に延在した仕切壁を備えることにより、当該盤内空間部を天井壁側と底壁側とに区分する。 That is, in the board cooling structure according to the present embodiment, in the space inside the board, an intersecting direction (hereinafter, simply referred to as a crossing direction) intersecting with the board standing direction on the center side of the board standing direction (the arrow z direction in FIG. 1 described later). By providing a partition wall extending in the horizontal direction of the board), the space inside the board is divided into a ceiling wall side and a bottom wall side.

また、仕切壁においては、盤水平方向の四方(後述の図1では矢印xy方向)のうち、互いに相対する熱交換器側方向および熱交換器反対側方向の両方向(後述の図1では矢印x方向;以下、単に熱交換器側相対方向と適宜称する)を除き、残りの互いに相対する二方向(後述の図1では矢印y方向;以下、単に貫通部側相対方向と適宜称する)の何れか方向において、盤立設方向に貫通した貫通部(例えば切欠部や貫通孔)が形成されたものとする。 Further, in the partition wall, of the four sides in the horizontal direction of the board (arrows xy directions in FIG. 1, which will be described later), both the heat exchanger side direction and the heat exchanger opposite side direction (arrows x in FIG. 1 described later) that face each other. Direction; hereinafter, simply referred to as relative direction on the heat exchanger side hereinafter), except for any of the remaining two directions that face each other (direction y in FIG. 1 to be described later; hereinafter referred to simply as relative direction on penetrating portion side) In the direction, it is assumed that a penetrating portion (for example, a notch portion or a through hole) penetrating in the board standing direction is formed.

そして、熱交換器においては、吸気口部および排気口部の両開口部が、貫通部側相対方向において貫通部反対側方向(貫通部側に相対する方向)に偏倚して位置、かつ仕切壁を境界にして互いに盤立設方向に所定距離を隔てて位置し、当該両開口部のうち一方が盤内空間部における天井壁側に開口して、当該両開口部のうち他方が盤内空間部における底壁側に開口している構成とする。 Further, in the heat exchanger, both openings of the intake port and the exhaust port are positioned in a direction opposite to the penetration part in the relative direction of the penetration part (direction facing the penetration part), and the partition wall At a predetermined distance in the board standing direction, one of the openings is open to the ceiling wall side of the board space, and the other of the openings is the board space. The opening is on the bottom wall side of the section.

本実施形態とは異なる盤冷却構造、例えば従来構造のように盤内空間部において盤立設方向および盤水平方向に延在した仕切壁(特許文献2では第1,第2部材からなる断面略T字形状の循環誘導部材)を備えている場合には、当該盤水平方向の四方のうち一方の側壁に設けられた熱交換器(特許文献2では収納盤の背面に設けられた熱交換器)を稼動させると、当該盤内空間部の空気が仕切壁に沿って循環し、当該空気の滞留を抑制できる可能性がある。しかしながら、従来構造のように複数の方向に延在した形状の仕切壁を適用する場合、循環する空気の圧力損失が生じ易く、冷却性能を十分に発揮できないおそれもある。 A partition cooling structure different from that of the present embodiment, for example, a partition wall extending in the panel upright direction and the panel horizontal direction in the space inside the panel like the conventional structure (in Patent Document 2, a cross-section of the first and second members is omitted. When it is provided with a T-shaped circulation guide member, a heat exchanger provided on one side wall of the four sides in the horizontal direction of the board (in Patent Document 2, a heat exchanger provided on the back surface of the storage board). ) Is operated, the air in the space inside the panel circulates along the partition wall, and it is possible that the retention of the air can be suppressed. However, when a partition wall having a shape extending in a plurality of directions as in the conventional structure is applied, pressure loss of the circulating air is likely to occur, and the cooling performance may not be sufficiently exhibited.

例えば、特許文献2に示す盤の場合、循環流路を十分に大きく(例えば循環流路方向に直交する断面積を大きく)する等により、前述のような圧力損失を低減できる可能性がある。しかしながら、特許文献2の盤の場合、熱交換器側相対方向において、単に熱交換器が配置されているだけでなく、複数(特許文献2の図4では2個)の循環流路が並んで重なっているため、当該熱交換器側相対方向に盤の大型化等を招くことが考えられる。 For example, in the case of the board disclosed in Patent Document 2, there is a possibility that the pressure loss as described above can be reduced by making the circulation flow channel sufficiently large (for example, the cross-sectional area orthogonal to the circulation flow channel direction is large). However, in the case of the panel of Patent Document 2, not only the heat exchangers are arranged in the relative direction on the heat exchanger side, but also a plurality of (two in FIG. 4 of Patent Document 2) circulation channels are arranged side by side. Since they are overlapped with each other, it is conceivable that the panels are increased in size in the relative direction of the heat exchanger side.

一方、本実施形態による盤冷却構造の場合は、仕切壁が単に盤水平方向に延在している簡易な形状であるため、盤内空間部を循環する空気の圧力損失を抑制し易い。また、熱交換器の吸気口部および排気口部の両開口部において、仕切壁や貫通部の配置構成を基準にして適宜位置しており、盤内空間部の空気を十分に循環でき、当該空気の滞留を抑制し易くなる。ゆえに、盤の冷却性能,小型化等に貢献できる可能性がある。 On the other hand, in the case of the board cooling structure according to the present embodiment, since the partition wall has a simple shape that simply extends in the board horizontal direction, it is easy to suppress the pressure loss of the air circulating in the board internal space. In addition, at both openings of the intake port and the exhaust port of the heat exchanger, they are appropriately positioned with reference to the arrangement configuration of the partition wall and the penetrating part, and the air in the space inside the panel can be sufficiently circulated. It becomes easy to suppress the retention of air. Therefore, there is a possibility that it can contribute to the cooling performance and downsizing of the panel.

また、収容対象である機器においては、例えば盤水平方向の側壁(例えば観音開き構造で気密状態に保持可能な側壁側)から収容したり取り出すことが挙げられるが、従来構造のように仕切壁が盤立設方向に延在していると、当該収容や取り出しが妨げられ易く(例えば収容や取り出しの方向が限定され易く)、盤の取扱性が低くなってしまうおそれがある。一方、本実施形態のように単に盤水平方向に延在する仕切板を適用した構成によれば、盤水平方向からの機器の収容や取り出しが容易であり、取扱性に貢献できる可能性がある。 In the device to be housed, for example, it may be housed in or taken out from the side wall in the horizontal direction of the board (for example, the side wall that can be kept airtight in the double-door structure). If it extends in the upright direction, the accommodation and removal can be easily hindered (for example, the directions of accommodation and removal are likely to be limited), and the handleability of the board may be reduced. On the other hand, according to the configuration in which the partition plate that simply extends in the horizontal direction of the board is applied as in the present embodiment, it is easy to store and take out the device from the horizontal direction of the board, which may contribute to the handleability. ..

本実施形態の盤冷却構造は、前述のように盤水平方向に延在した仕切壁を備え、当該仕切壁や貫通部の配置構成等に合わせて熱交換器の吸気口部および排気口部が適宜配置されている構成であれば良く、種々の分野(例えば盤分野,冷却分野,電力変換装置分野等)の技術常識を適宜適用して設計変形することが可能であり、その一例として以下に示すものが挙げられる。 The panel cooling structure of the present embodiment is provided with the partition wall extending in the horizontal direction of the panel as described above, and the intake port and the exhaust port of the heat exchanger are provided in accordance with the layout configuration of the partition wall and the penetrating part. Any configuration can be adopted as long as it is properly arranged, and it is possible to apply design common sense in various fields (for example, panel field, cooling field, power conversion device field, etc.) as appropriate and modify the design. The ones shown are listed.

≪本実施形態による盤冷却構造の一例である盤10≫
図1,図2は、本実施形態の一例である盤10の構成を説明するものである。盤10は、当該盤10内部側に盤内空間部11を形成する筐体状の周壁2と、盤内空間部11の盤立設方向(図1では矢印z方向)の中央部側において盤水平方向に延在している仕切壁3と、周壁2において仕切壁3に対向して設けられた熱交換器4と、を主として備えている。そして、盤内空間部11に所望の機器5を収容して、当該盤内空間部11の気密状態を保持できるように構成されている。
<<Panel 10 which is an example of the board cooling structure according to the present embodiment>>
1 and 2 illustrate the configuration of a board 10 that is an example of this embodiment. The board 10 includes a housing-shaped peripheral wall 2 that forms a board internal space 11 inside the board 10 and a board on the center side of the board internal space 11 in the board standing direction (arrow z direction in FIG. 1). Mainly includes a partition wall 3 extending in the horizontal direction and a heat exchanger 4 provided on the peripheral wall 2 so as to face the partition wall 3. Then, the desired device 5 is housed in the board space 11 so that the board space 11 can be kept airtight.

<周壁2>
周壁2は、例えばパネル状の周壁部材や盤枠等を適宜筐体状に組み付けてなり、天井壁21と底壁22との間における盤水平方向の四方(図1では矢印xy方向)を側壁23〜26で包囲して、当該周壁2内に盤内空間部11を有した構成となっている。この周壁2においては、例えば側壁23〜26のうち少なくとも何れかを開閉可能な構造にして、盤内空間部11に対して機器5を取り出し自在に収容できる構成とすることが挙げられる。
<Peripheral wall 2>
The peripheral wall 2 is, for example, a panel-shaped peripheral wall member, a board frame, or the like that is appropriately assembled in a housing shape, and the four sides in the board horizontal direction between the ceiling wall 21 and the bottom wall 22 (arrow xy directions in FIG. 1) are side walls. It is surrounded by 23 to 26 and has a board space portion 11 in the peripheral wall 2. In this peripheral wall 2, for example, at least one of the side walls 23 to 26 can be opened/closed so that the device 5 can be housed in the board space 11 so that the device 5 can be freely taken out.

具体例としては、図1に示す盤10正面側の側壁23のように、複数の周壁部材(図1では2個の周壁部材23a,23b)を有したものとし、いわゆる観音開き状に開閉可能な構造にすることが挙げられる。このような側壁23によれば、当該側壁23が開状態の場合に、盤10正面側から盤内空間部11に機器5を収容したり取り出すこと等が可能となり、当該側壁23が閉状態に場合には、盤内空間部11の気密状態を保持することが可能となる。 As a specific example, like the side wall 23 on the front side of the board 10 shown in FIG. 1, a plurality of peripheral wall members (two peripheral wall members 23a and 23b in FIG. 1) are provided, which can be opened and closed in a so-called double-door shape. It can be cited as a structure. According to such a side wall 23, when the side wall 23 is in the open state, it is possible to house or take out the device 5 from the front side of the board 10 into the space 11 in the board, and the side wall 23 is closed. In this case, it is possible to maintain the airtight state of the board space portion 11.

<仕切壁3>
仕切壁3は、例えばパネル状の部材であって、盤内空間部11における盤立設方向の中央部側で盤水平方向に延在するように配置されている。この仕切壁3により、当該盤内空間部11が天井壁21側と底壁22側とに区分されている。仕切壁3の支持構成は、特に限定されるものではないが、例えば周壁2の内壁面2a(図2に示すように盤10背面側の側壁25等の内壁面2a)に支持する構成が挙げられる。
<Partition wall 3>
The partition wall 3 is, for example, a panel-shaped member, and is arranged so as to extend in the board horizontal direction at the central portion side of the board internal space portion 11 in the board standing direction. The partition wall 3 divides the board space portion 11 into a ceiling wall 21 side and a bottom wall 22 side. The supporting structure of the partition wall 3 is not particularly limited, but may be, for example, a structure of supporting it on the inner wall surface 2a of the peripheral wall 2 (the inner wall surface 2a such as the side wall 25 on the rear side of the board 10 as shown in FIG. 2). To be

仕切壁3においては、盤10左右側面方向(貫通部側相対方向に相当)の何れか方向の周縁部に、盤立設方向に貫通した形状の貫通部31が形成される。図2に示す仕切壁3の場合、盤10左側面側の側壁24に対向している周縁部に、貫通部31が形成されている。このような貫通部31により、盤内空間部11の天井壁21側と底壁22側とが貫通し、当該盤内空間部11の空気が貫通部31を通過して循環することとなる。 In the partition wall 3, a penetrating portion 31 having a shape penetrating in the board standing direction is formed at a peripheral edge in any of the left and right side surfaces of the board 10 (corresponding to the relative direction of the penetrating portion side). In the case of the partition wall 3 shown in FIG. 2, a penetrating portion 31 is formed in the peripheral portion facing the side wall 24 on the left side surface of the board 10. With such a penetrating portion 31, the ceiling wall 21 side and the bottom wall 22 side of the board internal space portion 11 penetrate, and the air in the board internal space portion 11 circulates through the penetrating portion 31.

貫通部31の態様は、前述のように盤内空間部11の空気が通過できる構成であれば良く、図2に示すような形状に限定されるものではない。貫通部31の具体的な他例としては、図3(A)に示すような切欠き形状の貫通部31aや、図3(B)に示すような貫通孔形状の貫通部31bものが挙げられる。 The form of the penetrating part 31 is not limited to the shape shown in FIG. 2 as long as the structure allows the air in the board space part 11 to pass therethrough. Specific examples of the penetrating part 31 include a notch-shaped penetrating part 31a as shown in FIG. 3(A) and a penetrating hole-shaped penetrating part 31b as shown in FIG. 3(B). ..

また、貫通部31においては、例えば図2に示すように通風機32等を適宜配置しても良い。これにより、盤内空間部11の空気が貫通部31を通過し易くなり、循環が促進されることとなる。そして、当該空気の循環における圧力損失が抑制され、当該循環における逆流も抑制されることとなる。 Further, in the penetrating portion 31, a ventilator 32 or the like may be appropriately arranged as shown in FIG. 2, for example. As a result, the air in the internal space 11 of the board easily passes through the penetrating portion 31, and the circulation is promoted. Then, the pressure loss in the circulation of the air is suppressed, and the backflow in the circulation is also suppressed.

通風機32の具体例としては、回転式ファン・ブレードを備え、当該ブレードの回転によって回転軸方向に通風可能な構成が挙げられる。このような通風機32の場合、ブレードの回転軸方向が盤立設方向となり、当該ブレードの回転による通風方向は当該盤立設方向の一方側(盤内空間部11の天井壁21側または底壁22側)となる。 As a specific example of the air blower 32, there is a configuration in which a rotary fan blade is provided and ventilation is possible in the rotation axis direction by rotation of the blade. In the case of such a ventilator 32, the rotation axis direction of the blade is the board standing direction, and the ventilation direction by the rotation of the blade is one side of the board standing direction (the ceiling wall 21 side or the bottom of the board space 11). It becomes the wall 22 side).

この通風機32の通風方向は、熱交換器4による空気の循環方向に合わせて適宜設定(すなわち、後述の熱交換器4の吸気口部41,排気口部43の開口位置に合わせて適宜設定)することが可能である。通風機32の通風量においては、ブレードの形状,回転数等に応じて変化することとなる。 The ventilation direction of the fan 32 is appropriately set according to the circulation direction of air by the heat exchanger 4 (that is, appropriately set according to the opening positions of the intake port 41 and the exhaust port 43 of the heat exchanger 4 described later. ) Is possible. The amount of ventilation of the fan 32 changes depending on the shape of the blade, the number of revolutions, and the like.

<熱交換器4>
熱交換器4は、盤内空間部11の空気を吸気する吸気口部41と、吸気口部41から吸気した空気の熱を吸熱して当該空気を冷却する吸熱部42と、吸熱部42で冷却した空気(冷却された空気)を盤内空間部11に戻す排気口部43と、を有した構成となっている。
<Heat exchanger 4>
The heat exchanger 4 includes an intake port portion 41 that intakes the air in the board space 11, an endothermic portion 42 that absorbs the heat of the air inhaled from the intake port portion 41 and cools the air, and an endothermic portion 42. An exhaust port portion 43 that returns cooled air (cooled air) to the board internal space portion 11 is provided.

吸気口部41および排気口部43の両者は、熱交換器4の盤内空間部11側において、互いに離反した位置に設けられている。また、吸熱部42は、熱交換器4内で吸気口部41および排気口部43の両者間を貫通している空洞部に設けられ、当該吸熱部42で吸熱した熱を、放熱部(例えば外気を通気させて放熱する構成の放熱部)44等により盤10外周側に適宜放熱できるように構成されている。 Both the intake port portion 41 and the exhaust port portion 43 are provided at positions separated from each other on the side of the space 11 inside the panel of the heat exchanger 4. Further, the heat absorbing portion 42 is provided in a hollow portion that penetrates between both the intake port portion 41 and the exhaust port portion 43 in the heat exchanger 4, and absorbs the heat absorbed by the heat absorbing portion 42 to a heat radiating portion (for example, A heat radiating portion (44) configured to ventilate the outside air to radiate heat is configured to appropriately radiate heat to the outer peripheral side of the board 10.

そして、以上のように構成された熱交換器4は、吸気口部41および排気口部43の両者が仕切壁3を境界にして互いに盤立設方向に所定距離を隔てて位置する姿勢で、側壁23における貫通部反対側方向に偏倚した位置(図1,図2では周壁部材23bにおいて仕切壁3に対向している位置)に設けられている。 In the heat exchanger 4 configured as described above, both the intake port portion 41 and the exhaust port portion 43 are positioned with a predetermined distance in the panel standing direction with the partition wall 3 as a boundary, The side wall 23 is provided at a position offset in the direction opposite to the penetrating portion (a position facing the partition wall 3 in the peripheral wall member 23b in FIGS. 1 and 2).

図1,図2に示す熱交換器4の場合、周壁部材23bに対して厚さ方向に貫装され、当該熱交換器4における吸気口部41および排気口部43の両者側が盤内空間部11側に突出し、当該熱交換器4における放熱部44側が盤10外周側に突出した状態となっている。 In the case of the heat exchanger 4 shown in FIGS. 1 and 2, the peripheral wall member 23b is penetrated in the thickness direction, and both sides of the intake port portion 41 and the exhaust port portion 43 of the heat exchanger 4 are inside the panel space portion. 11 side, and the heat radiating portion 44 side of the heat exchanger 4 is in a state of protruding to the outer peripheral side of the board 10.

このような場合には、仕切壁3および熱交換器4の両者間において、衝突や干渉等が起こらないようにすることが好ましい。例えば図4に示すように、仕切壁3において、熱交換器4に対向している周縁端部(熱交換器側方向の周縁端部)に、熱交換器反対側方向に窪んだ形状の切欠部33を形成することが挙げられる。 In such a case, it is preferable that collision and interference do not occur between the partition wall 3 and the heat exchanger 4. For example, as shown in FIG. 4, in the partition wall 3, a peripheral edge portion facing the heat exchanger 4 (a peripheral edge portion in the heat exchanger side direction) has a notch having a shape recessed in the opposite direction to the heat exchanger. Forming the part 33 may be mentioned.

このような切欠部33によれば、熱交換器4の吸気口部41および排気口部43の両者間を当該切欠部33で受容し、仕切壁3および熱交換器4の両者間の衝突や干渉等を抑制できる。また、盤内空間部11を天井壁21側と底壁22側とに区分し易くなる。 According to the cutout portion 33, the space between the intake port portion 41 and the exhaust port portion 43 of the heat exchanger 4 is received by the cutout portion 33, and collision between the partition wall 3 and the heat exchanger 4 is prevented. Interference can be suppressed. In addition, it becomes easy to divide the board space portion 11 into the ceiling wall 21 side and the bottom wall 22 side.

また、図1,図2に示す熱交換器4の場合、吸気口部41が盤内空間部11における天井壁21側に開口し、排気口部43が盤内空間部11における底壁22側に開口している。この場合、通風機32は、天井壁21側方向に通風できるように通風方向を適宜設定(ブレードの回転軸の向きや回転方向等を適宜設定)することとなる。 In addition, in the case of the heat exchanger 4 shown in FIGS. 1 and 2, the intake port portion 41 is open to the ceiling wall 21 side in the panel internal space portion 11, and the exhaust port portion 43 is the bottom wall 22 side in the panel internal space portion 11. It is open to. In this case, the ventilator 32 appropriately sets the ventilation direction (the orientation of the blade rotation axis, the rotation direction, etc.) so that the ventilation can be performed toward the ceiling wall 21 side.

<機器5>
盤内空間部11に収容される機器5は、特に限定されるものではなく、種々の態様が挙げられる。例えば図2に示すように、比較的高耐熱性の機器部品(例えば電力変換装置の場合には、発熱性の半導体スイッチング素子(IGBT等)やリアクトル等)51と、比較的低耐熱性の機器部品(例えば電力変換装置の場合には、コンデンサや抵抗器等)52と、を備えている場合には、当該機器部品51,52を盤内空間部11において適宜分離して配置できる構成が挙げられる。
<Device 5>
The device 5 housed in the in-board space 11 is not particularly limited, and various modes can be mentioned. For example, as shown in FIG. 2, a device component having a relatively high heat resistance (for example, a heat generating semiconductor switching element (IGBT or the like, a reactor or the like in the case of a power converter) 51 and a device having a relatively low heat resistance. When a component (for example, a capacitor or a resistor in the case of a power conversion device) 52 is provided, a configuration in which the device components 51 and 52 can be appropriately separated and arranged in the inboard space 11 is given. To be

図2の場合、盤内空間部11の天井壁21側に、比較的高耐熱性の機器部品51が配置され、当該盤内空間部11の底壁22側に、比較的低耐熱性の機器部品52が配置されている。このような配置構成の場合、例えば盤内空間部11の天井壁21側の空気(例えば機器部品51からの発熱を吸熱した空気)においては、当該天井壁21側に開口している吸気口部41によって吸気し易い。これにより、盤内空間部11の天井壁21側の空気において、盤内空間部11の底壁22側への逆流を抑制でき、機器部品52の保護に貢献できることとなる。 In the case of FIG. 2, a device component 51 having a relatively high heat resistance is arranged on the ceiling wall 21 side of the board internal space 11, and a device having a relatively low heat resistance is provided on the bottom wall 22 side of the board internal space 11. A component 52 is arranged. In the case of such an arrangement configuration, for example, in the air on the ceiling wall 21 side of the in-panel space 11 (for example, the air that has absorbed the heat generated from the device component 51), the intake port portion that is open to the ceiling wall 21 side. 41 makes it easy to inhale. Thereby, in the air on the ceiling wall 21 side of the in-board space 11, the backflow to the bottom wall 22 side of the in-board space 11 can be suppressed, which can contribute to the protection of the device component 52.

また、図2の機器部品51,52の場合、各側壁23〜26のうち熱交換器反対側方向に位置する側壁25の内壁面2aに対し、当該内壁面2aに沿って延在するように支持(例えば平板状の基板に実装して内壁面2aに、着脱自在に適宜支持)されている。このような機器部品51,52の支持構成によれば、盤10において、熱交換器側相対方向の寸法の縮小化や圧力損失の抑制に貢献できる可能性がある。 In addition, in the case of the device parts 51 and 52 of FIG. 2, the side wall 23 of each of the side walls 23 to 26 located on the side opposite to the heat exchanger is extended along the inner wall surface 2a of the side wall 25. It is supported (for example, mounted on a flat plate-like substrate and appropriately supported on the inner wall surface 2a in a detachable manner). With such a support configuration of the device parts 51 and 52, there is a possibility that the panel 10 can contribute to reduction of the size in the heat exchanger side relative direction and suppression of pressure loss.

<その他>
以上示したように盤10を構成する各種要素のうち、当該盤10外周側に突出するような部分(例えば熱交換器4や、特許文献2の図2に示す操作パネル等;以下、単に盤突出要素と適宜称する)が存在する場合、それら盤突出要素は、各側壁23〜26のうち例えば一つに対して適宜配置することが好ましい。
<Other>
As shown above, among the various elements constituting the panel 10, a portion projecting to the outer peripheral side of the panel 10 (for example, the heat exchanger 4 or the operation panel shown in FIG. 2 of Patent Document 2; If present, the disc projecting elements are preferably arranged appropriately, for example on one of the side walls 23-26.

例えば、盤10正面側の側壁23に対して盤突出要素を適宜配置した場合、他の側壁24〜26の外壁面を略平面状にすることが容易となる。これにより、盤10において、例えば設備の設置スペースに対して設置(例えば設置スペースの内壁面に沿って設置)し易くなる。複数個の盤10を設置する場合には、貫通部側相対方向に連ねて配列し易くなる。 For example, when the board protruding element is appropriately arranged on the side wall 23 on the front side of the board 10, it becomes easy to make the outer wall surfaces of the other side walls 24 to 26 substantially flat. This facilitates installation on the board 10 in, for example, the installation space of the facility (for example, installation along the inner wall surface of the installation space). When a plurality of boards 10 are installed, it becomes easy to arrange them in a row in the relative direction on the penetration portion side.

また、盤10においては、特許文献2のような循環流路が重なっている構成とは全く異なるため、熱交換器側相対方向の一方側である側壁23に盤突出要素を配置した構成であっても、当該熱交換器側相対方向の寸法(奥行き寸法等)を十分抑制することが可能である。 Further, since the board 10 is completely different from the structure in which the circulation flow paths are overlapped as in Patent Document 2, the board protruding element is arranged on the side wall 23 which is one side in the heat exchanger side relative direction. However, it is possible to sufficiently suppress the dimension (depth dimension, etc.) in the heat exchanger side relative direction.

盤10を構成する各種要素においては、種々の材料からなるものが適用可能である。具体例として、周壁2に適用される周壁部材や盤枠等においては、金属製(ステンレス製等)や合成樹脂製(炭素繊維強化プラスチック製等)のものが挙げられる。 The various elements that make up the board 10 may be made of various materials. As a specific example, the peripheral wall member and the board frame applied to the peripheral wall 2 may be made of metal (stainless steel or the like) or synthetic resin (carbon fiber reinforced plastic or the like).

また、盤内空間部11の気密保持に必要な材料(シール材等)を、適宜適用(例えば、周壁部材や盤枠等の組み付け箇所や、側壁23における熱交換器4の貫装箇所等に適宜適用)することも挙げられる。 Further, a material (sealing material or the like) necessary for maintaining the airtightness of the space 11 in the panel is appropriately applied (for example, to a mounting position of a peripheral wall member, a panel frame, or the like, a penetration position of the heat exchanger 4 on the side wall 23, or the like). Appropriate application) is also included.

<盤内空間部11の空気の循環例>
盤10において熱交換器4を稼動させると、例えば図2(A)(B)の矢印d1〜d5で示すように、盤内空間部11の空気が循環されることとなる。まず、吸熱部42で冷却された空気は、熱交換器4の排気口部43から盤内空間部11の底壁22側に対し、熱交換器反対側方向で排出される。この排出された空気は、盤内空間部11の底壁22側において貫通部側方向に移動しながら、当該盤内空間部11の底壁22側の熱(機器部品52等から発生した熱)を吸熱する。
<Example of air circulation in the space 11 in the panel>
When the heat exchanger 4 is operated in the panel 10, the air in the internal space 11 of the panel is circulated as indicated by arrows d1 to d5 in FIGS. First, the air cooled in the heat absorbing part 42 is discharged from the exhaust port part 43 of the heat exchanger 4 to the bottom wall 22 side of the internal space 11 in the direction opposite to the heat exchanger. The discharged air moves toward the penetrating side on the bottom wall 22 side of the board internal space 11 and heats the bottom wall 22 side of the board internal space 11 (heat generated from the device parts 52 and the like). Absorbs heat.

次に、盤内空間部11の底壁22側の空気は、貫通部31を介して、当該盤内空間部11の天井壁21側に移動した後、貫通部反対側方向に移動しながら、当該盤内空間部11の天井壁21側の熱(機器部品51等から発生した熱)を吸熱する。そして、盤内空間部11の天井壁21側の空気は、熱交換器4の吸気口部41によって吸気され、吸熱部42で冷却されることとなる。 Next, the air on the bottom wall 22 side of the board internal space portion 11 moves to the ceiling wall 21 side of the board internal space portion 11 through the penetrating portion 31, and then while moving in the direction opposite to the penetrating portion, The heat (heat generated from the device parts 51 and the like) on the side of the ceiling wall 21 of the in-board space 11 is absorbed. Then, the air on the ceiling wall 21 side of the in-board space portion 11 is taken in by the intake port portion 41 of the heat exchanger 4 and cooled by the heat absorbing portion 42.

以上のように盤内空間部11の空気を循環することにより、当該盤内空間部11が適宜冷却されて、温度上昇が抑制されることとなる。 By circulating the air in the board internal space 11 as described above, the board internal space 11 is appropriately cooled, and the temperature rise is suppressed.

以上、本発明において、記載された具体例に対してのみ詳細に説明したが、本発明の技術思想の範囲で多彩な変更等が可能であることは、当業者にとって明白なことであり、このような変更等が特許請求の範囲に属することは当然のことである。 In the above, the present invention has been described in detail only with respect to the specific examples described, but it is obvious to those skilled in the art that various modifications can be made within the scope of the technical idea of the present invention. It goes without saying that such changes belong to the scope of the claims.

例えば、仕切壁3においては、盤内空間部11における盤立設方向の中央部側で盤水平方向に延在し、当該盤内空間部11が天井壁21側と底壁22側とに区分でき、当該盤内空間部11の天井壁21側と底壁22側とを貫通する貫通部31が形成された構成であれば良く、種々の態様を適用することが可能である。 For example, in the partition wall 3, the board inner space portion 11 extends in the board horizontal direction at the center side in the board standing direction, and the board inner space portion 11 is divided into a ceiling wall 21 side and a bottom wall 22 side. It suffices that the configuration be such that the penetrating portion 31 that penetrates the ceiling wall 21 side and the bottom wall 22 side of the board internal space portion 11 is formed, and various aspects can be applied.

熱交換器4においては、吸気口部41,吸熱部42,排気口部43を備え、側壁23〜26の何れかに適宜配置されて、盤内空間部11の空気を循環して冷却できる構成であれば良く、種々の態様を適用することが可能である。 The heat exchanger 4 includes an intake port portion 41, a heat absorbing portion 42, and an exhaust port portion 43, and is appropriately arranged on any of the side walls 23 to 26 to circulate and cool the air in the board space portion 11. However, various modes can be applied.

10…盤
11…盤内空間部
2…周壁
21…天井壁
22…底壁
23〜26…側壁
3…仕切壁
31…貫通部
32…通風機
4…熱交換器
41…吸気口部
42…吸熱部
43…排気口部
5…機器
10... Board 11... Board space 2... Peripheral wall 21... Ceiling wall 22... Bottom wall 23-26... Side wall 3... Partition wall 31... Penetration part 32... Ventilator 4... Heat exchanger 41... Intake port part 42... Endothermic Part 43... Exhaust port part 5... Equipment

Claims (7)

筐体状の周壁により包囲されて気密状態に保持可能な盤内空間部と、
盤内空間部において、盤立設方向の中央部側で当該盤立設方向に交差した交差方向に延在し、当該盤内空間部を天井壁側と底壁側とに区分している仕切壁と、
周壁のうち前記交差方向に位置する各側壁の何れかにおいて、仕切壁に対向して設けられた熱交換器と、
を備え、
仕切壁は、前記交差方向の四方のうち、互いに相対する熱交換器側方向および熱交換器反対側方向を除き、残りの互いに相対する二方向の何れか方向において、盤立設方向に貫通している貫通部が形成され、
熱交換器は、
盤内空間部の空気を吸気する吸気口部と、
吸気口部から吸気した空気の熱を吸熱して当該空気を冷却する吸熱部と、
吸熱部で冷却した空気を盤内空間部に戻す排気口部と、を有し、
吸気口部および排気口部の両開口部は、
前記二方向において貫通部側方向に相対する貫通部反対側方向に偏倚して位置、かつ仕切壁を境界にして互いに盤立設方向に所定距離を隔てて位置し、
当該両開口部のうち一方が盤内空間部における天井壁側に開口し、当該両開口部のうち他方が盤内空間部における底壁側に開口していることを特徴とする盤冷却構造。
A space inside the board that is surrounded by a casing-like peripheral wall and can be kept airtight,
A partition that extends in the cross direction intersecting with the panel standing direction at the center side of the panel standing direction in the panel interior space and divides the panel interior space into a ceiling wall side and a bottom wall side. A wall,
In any of the side walls located in the intersecting direction of the peripheral wall, a heat exchanger provided to face the partition wall,
Equipped with
The partition wall, in the four directions of the intersecting direction, except the heat exchanger side direction opposite to each other and the heat exchanger opposite side direction, in any of the remaining two mutually opposite directions, penetrates in the panel standing direction. A penetrating part is formed,
Heat exchanger
An intake port that takes in air from the space inside the board,
An endothermic portion that absorbs the heat of the air taken in from the intake port and cools the air,
An exhaust port for returning the air cooled by the heat absorbing part to the space inside the panel,
Both the inlet and outlet openings are
Positioned in a direction opposite to the penetrating portion opposite to the penetrating portion side direction in the two directions, and located at a predetermined distance from each other in the board standing direction with the partition wall as a boundary,
A board cooling structure, wherein one of the openings is open to the ceiling wall side of the board space, and the other of the openings is open to the bottom wall side of the board space.
貫通部には、当該貫通部における空気の循環方向に通風可能な通風機が配置されていることを特徴とする請求項1記載の盤冷却構造。 The board cooling structure according to claim 1, wherein a ventilator capable of ventilating in a circulation direction of air in the penetrating portion is arranged in the penetrating portion. 機器は、複数個の機器部品を備え、
盤内空間部の天井壁側および底壁側の両者のうち吸気口部が開口している側に、比較的高耐熱性の機器部品が配置され、当該両者のうち排気口部が開口している側に、比較的低耐熱性の機器部品が配置されることを特徴とする請求項1または2記載の盤冷却構造。
The device includes a plurality of device parts,
On both the ceiling wall side and the bottom wall side of the space inside the panel, on the side where the intake port is open, a relatively high heat-resistant equipment component is placed, and the exhaust port part of both is open. The panel cooling structure according to claim 1 or 2, wherein a device component having relatively low heat resistance is arranged on the side where the heat is applied.
機器部品は、各側壁のうち熱交換器反対側方向の側壁の内壁面に支持されることを特徴とする請求項1〜3の何れかに記載の盤冷却構造。 The board cooling structure according to any one of claims 1 to 3, wherein the equipment component is supported by an inner wall surface of a side wall of each side wall in a direction opposite to the heat exchanger. 仕切壁は、熱交換器側方向の周縁端部において、熱交換器反対側方向に窪んだ形状の切欠部が形成され、
熱交換器は、側壁に対し厚さ方向に貫装されて、当該熱交換器の吸気口部および排気口部の両開口部間が盤内空間部に突出し、当該両開口部間が切欠部に受容されていることを特徴とする請求項1〜4の何れかに記載の盤冷却構造。
The partition wall is provided with a cutout portion having a recessed shape in a direction opposite to the heat exchanger, at a peripheral edge portion in the heat exchanger side direction,
The heat exchanger is penetrated in the thickness direction with respect to the side wall, a space between both openings of the intake port and the exhaust port of the heat exchanger projects into the space inside the panel, and a notch portion between the both openings. 5. The board cooling structure according to claim 1, wherein the board cooling structure is received by.
熱交換器は、周壁のうち盤正面側の側壁に設けられていることを特徴とする請求項1〜5の何れかに記載の盤冷却構造。 The board cooling structure according to any one of claims 1 to 5, wherein the heat exchanger is provided on a side wall of the peripheral wall on the front side of the board. 吸気口部が盤内空間部における天井壁側に開口し、排気口部が盤内空間部における底壁側に開口していることを特徴とする請求項1〜6の何れかに記載の盤冷却構造。 The panel according to any one of claims 1 to 6, wherein the intake port section is open to the ceiling wall side in the panel internal space section, and the exhaust port section is open to the bottom wall side in the panel internal space section. Cooling structure.
JP2018242295A 2018-12-26 2018-12-26 Panel cooling structure Pending JP2020108191A (en)

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