JP2017153166A - Electric apparatus housing board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric apparatus housing board capable of contributing to suppression of overheat of an electric apparatus or suppression of a temperature within the board by contributing to sufficiently presenting a cooling performance of a ventilator.SOLUTION: At a side of a board front face part 11 within a box-shaped board 1 that is configured by assembling multiple board frames, a housing chamber 20 is formed for housing multiple air-cooling apparatuses in a multistage state and at a side of a board back face part 12 within the board, a duct 6 is formed. An air cooling apparatus 4 comprising: a tubular apparatus case 43 extending from the side of the board front face part 11 to a side of the duct 6; a pyrogenic electronic component 41 in contact with an outer peripheral surface of the apparatus case 43; a ventilator 42 which is provided in an opening 43a of the apparatus case 43 at the side of the board front face part; a heat sink 44 protruding from an inner peripheral surface of the apparatus case 43; and a ventilation guide 45 in a shape protruding from the inner peripheral surface of the apparatus case 43 at a side of a board bottom part 15 and being tilted closer to the board back face part 12, is applied for each of the air-cooling apparatuses.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electrical equipment storage panel that is applied to, for example, various power facilities.

  Electrical equipment storage panels (for example, closed-type power distribution panels such as power conversion device panels; hereinafter simply referred to as panels) used in power facilities and the like, heat-generating electronic components such as power semiconductors (IGBT, etc.) Various devices such as an electric device (inverter or the like) having a low temperature and an electric device (capacitor, reactor, etc.) having a relatively low heat generating electronic component are housed.

  As a specific example of a board, in a box-like board formed by assembling a plurality of board frames (for example, a panel-like or columnar board frame), a storage room for storing electrical equipment is provided on the front side of the board in the board. And a structure in which a duct is formed on the back side of the panel in the panel, and a ventilator (intake fan or exhaust fan) is provided at the intake or exhaust port provided on the front of the panel or the ceiling of the panel. (For example, Patent Documents 1 and 2).

  When the ventilator is operated in such a configuration, the outside air is taken into the storage room, and the air in the storage room moves into the duct (moves by absorbing heat) together with the heat of the electrical equipment, and the air moved into the duct rises. Then, it is exhausted from the exhaust port to the outside of the panel. That is, by taking outside air into the panel and allowing it to ventilate, the electrical equipment is cooled to suppress overheating, thereby suppressing the temperature in the panel (such as a storage room).

  In particular, in an electrical device including a heat-generating electronic component, for example, there is one having a cooling function by a heat sink (such as a heat sink composed of a plurality of heat radiating fins), and the heat sink projects into a ventilation path in the duct (for example, a partition frame) It is known that the arrangement posture of the electric device is appropriately set so as to be in a state of protruding so as to pass through the communication portion. In such an arrangement posture, the air moving in the duct passes through the heat sink, and the cooling efficiency of the electric device is improved. In addition, there is also known a forced air cooling type (hereinafter simply referred to as an air cooling type device as appropriate) in which an electric device itself is provided with a cooling ventilator (for example, appropriately referred to as air cooling type device).

JP 2007-267478 A JP 2007-74865 A JP-A-3-256562

  If the heat sink is present in the ventilation path in the duct as described above, the wind speed at the front of the heat sink will be slowed down to cool the electrical equipment unless the ratio of the cross-sectional area of the heat sink to the cross-sectional area in the duct is sufficiently large. Efficiency may be reduced. For example, when heat sinks of a plurality of electrical devices are present in a duct, variations in temperature distribution in the duct (variations in cooling efficiency) are likely to occur. Differences may occur depending on the position of the heat sink with respect to the heat sink. Moreover, the exhaust efficiency from an exhaust port may become low and air permeability may be prevented.

  As described above, even if the ventilator is provided at the inlet or exhaust port of the panel, the cooling performance of the ventilator cannot be sufficiently exerted on the panel. There is a risk that it will be difficult to suppress overheating and to suppress the temperature inside the panel.

  The present invention has been made in view of the technical problems as described above, and contributes to sufficiently exhibiting the cooling performance of the ventilator, and can contribute to the suppression of overheating of electrical equipment and the temperature in the panel. It is to provide an electrical equipment storage panel.

  The electrical equipment storage board according to the present invention is a creation that can solve the above-mentioned problems, and one aspect thereof is a box-shaped board formed by assembling a plurality of board frames, and is formed on the board front side in the board. A storage chamber in which a plurality of forced air-cooled electric devices are stored in multiple stages at intervals in the vertical direction, and a duct that is formed on the back side of the panel and communicates with the storage chamber. It is provided. The panel includes an air inlet formed in the front part of the panel and communicating with the storage chamber, and an exhaust port formed on the panel ceiling side of the panel and communicating with the inside of the duct. Each forced air-cooled electric device has a cylindrical shape extending from the front side of the panel to the duct side in the storage room, and has an opening on the front side of the panel and an opening on the back side of the panel, and an outer peripheral surface of the device case Exothermic electronic parts that are in contact with the fan, a ventilator that is provided in the opening on the front side of the panel and the outlet faces the opening on the back side of the panel through the inside of the equipment case, and protrudes from the inner peripheral surface of the equipment case And a ventilation guide having a shape that protrudes from the bottom side of the board on the inner peripheral surface of the device case and is inclined toward the back side of the board.

  In another aspect, a box-shaped board formed by assembling a plurality of board frames, an upper and lower stage partition wall that divides the inside of the board into an upper stage part and a lower stage part, and an upper stage part on the front side of the board An upper storage chamber in which a plurality of forced air-cooled electrical devices are formed and stored in multiple stages at intervals in the vertical direction, and is formed on the back side of the upper panel and communicates with the upper storage chamber And a lower stage storage chamber formed in the lower stage and communicating with the inside of the duct. The panel is formed on the upper stage side of the panel front side and communicates with the upper stage storage chamber, and on the lower stage side of the panel front side and communicates with the lower stage storage chamber. And an exhaust port which is formed on the panel ceiling side of the panel and communicates with the inside of the duct. Each forced air-cooled electrical device has a cylindrical shape that extends from the front side of the panel to the duct side in the upper stage storage chamber, and has an opening on the front side of the panel and an opening on the back side of the panel. An exothermic electronic component that is in contact with the outer peripheral surface, a ventilator that is provided in the opening on the front side of the panel and the outlet faces the opening on the rear side of the panel through the inside of the device case, and an inner peripheral surface of the device case And a ventilation guide having a shape that protrudes from the bottom side of the inner peripheral surface of the device case and is inclined toward the back side of the panel.

  On the board bottom side of the device case, a board bottom side opening may be provided at a position closer to the board back side opening than the ventilation guide. A vent guide having a shape protruding from the inner wall surface of the duct and inclined toward the board ceiling portion may be provided at a position on the inner wall surface of the duct facing the panel rear surface side opening. The heat sink may include a plurality of radiating fins protruding from the panel ceiling side in the device case, and the protruding direction end of each radiating fin may be opposed to the ventilation guide.

  As described above, according to the present invention, it is possible to contribute to sufficiently exhibiting the cooling performance of the ventilator in the electrical equipment storage panel, and it is possible to contribute to the suppression of overheating of the electrical equipment and the temperature in the panel.

The schematic perspective view for demonstrating an example of the board of this embodiment. The schematic which removed the board front part 11 and faced the inside of the board 1. FIG. The schematic diagram which removed the board side part 13a and faced the inside of the board 1. FIG. FIG. 6 is a schematic cross-sectional view of the air-cooled device 4 (a schematic cross-sectional view corresponding to a cross section taken along line XX in FIG. 5). FIG. 5 is a schematic view of the air-cooled device 4 in FIG. 4 as viewed from the panel back side opening 43b side (a view of the ventilation guide 45). The schematic sectional drawing for demonstrating the modification of the air-cooled apparatus 4 (schematic sectional drawing similar to the XX sectional view of FIG. 5). Schematic for demonstrating the modification of the duct 6 (Schematic which removed the board front part 11 and faced the inside of the board 1). Schematic for demonstrating the modification of the duct 6 (schematic sectional drawing equivalent to the YY sectional view of FIG. 7).

  The electrical equipment storage board of the embodiment of the present invention is a box-shaped board in which a plurality of board frames are assembled, and a plurality of air-cooled equipment is stored in multiple stages on the front side of the board in the board. A storage chamber is formed, and a duct is formed on the back side of the panel in the panel, and the air-cooled device ventilator is effectively used.

  That is, in each air-cooled device, a cylindrical device case that extends from the front side of the panel to the duct side, a heat-generating electronic component that is in contact with the outer peripheral surface of the device case, and an opening on the front side of the device case An installed ventilator, a heat sink protruding from the ceiling of the device case inner peripheral surface, and a ventilation guide protruding from the bottom of the device case inner peripheral surface and inclined toward the back of the panel. It is configured so that the outside air can be taken into the panel by operating the ventilator of each air-cooled device and the airflow generated by the operation of the ventilator can be used effectively to ventilate the inside of the panel. is there.

  According to the board of this embodiment, when the ventilator of each air-cooled device is operated, outside air is taken into the storage chamber from the inlet of the board, and air is blown out from the outlet of the ventilator. The blown air (hereinafter simply referred to as blown air as appropriate) absorbs the heat of the air-cooled device while passing through the heat sink of the air-cooled device, moves into the duct, and passes through the exhaust port on the panel ceiling side. Exhausted outside the panel.

  Since the air-cooled device is provided with the ventilation guide, the blown air blown out particularly from the ceiling side of the vent of the ventilator tends to pass through the device case along the surface of the heat sink. On the other hand, the blown air blown out from the bottom side of the blowout outlet tends to pass through the device case along the surface of the ventilation guide. Thereby, in the blowing air vector in the device case, an upward direction component is easily generated in addition to the blowing direction component.

  Further, the blown air tends to converge to the board ceiling side in the device case and the flow velocity tends to increase. In the case of this tendency, the pressure in the device case is reduced by Bernoulli's theorem, the outside air is easily taken into the device case from the intake port, and the flow rate of the blown air is increased.

  And since the heat sink is covered with the equipment case (that is, it does not protrude into the ventilation path in the duct), the updraft (hereinafter simply referred to as “duct updraft” as appropriate) is generated in the duct as compared with the conventional panel. It is easy to generate.

  Therefore, in the board according to the present embodiment, the heat transferred from the heat-generating electronic component to the heat sink is radiated as compared with the configuration in which the ventilator is simply provided at the inlet or exhaust of the board, for example, as in the conventional board. The exhaust efficiency from the exhaust port is increased and the air permeability is easily improved. That is, the cooling performance of the ventilator can be sufficiently exerted, and the overheating of the electric equipment and the temperature in the panel can be suppressed. In addition, compared to conventional panels, even if the specifications of the ventilator are reduced and the heat sink is downsized, it is possible to sufficiently suppress overheating of the electrical equipment and the temperature in the panel. Can contribute to cost reduction and cost reduction.

  In the board of this embodiment, for example, as shown in the board 1 described later, the storage room is divided into an upper stage storage room, a lower stage storage room, and the like, and a plurality of air-cooled devices are arranged in a multistage shape in the upper stage storage room. You may comprise so that it may accommodate. In this case, when the ventilator of each air-cooled device is operated, outside air is taken into the storage chamber from the intake port of the panel (for example, the upper stage intake port located on the upper stage storage chamber side) as described above, and the blown air Moves to the inside of the duct to generate a duct updraft, and the air in the lower storage compartment moves (air that has absorbed heat from the electrical equipment in the lower storage compartment), that is, the lower stage where no ventilator is installed. An air flow that sucks the air in the storage chamber into the duct (hereinafter simply referred to as a duct suction air flow as appropriate) is also generated. When the air in the lower-stage storage chamber moves into the duct due to the duct suction airflow, the lower-stage storage chamber has a negative pressure outside the panel, and is located on the board inlet (for example, on the lower-stage storage chamber side of the panel). Outside air is also taken in from the lower air inlet). In other words, as shown above, when each air-cooled equipment ventilator is operated, a duct ascending airflow or duct suction airflow is generated and the inside of the panel is ventilated, thereby simply cooling the air-cooled equipment. In addition, the electrical equipment in the lower storage compartment where the ventilator is not installed is also cooled.

  In addition, in the case of a configuration in which a panel bottom side opening is provided at a position on the panel back side opening side of the ventilation guide on the panel bottom side of the device case, air is easily sucked into the device case from the panel bottom side opening, There is a possibility that suppression of overheating of the above-described electrical equipment and suppression of the temperature inside the panel may be facilitated.

  Further, in the case of a configuration in which a ventilation guide having a shape protruding from the duct inner wall surface and inclined toward the panel ceiling side is provided at a position facing the panel rear surface side opening on the duct inner wall surface, downflow in the duct is suppressed. It is possible to suppress overheating of the above-described electrical equipment and the temperature inside the panel.

  In addition, the heat sink includes a plurality of heat radiation fins protruding from the board ceiling side in the device case, and when the protruding direction end of each heat radiation fin faces the ventilation guide, It will move so as to converge to the base side, the heat from the heat sink base side becomes easy to be dissipated, and there is a possibility that suppression of overheating of the above-mentioned electric equipment and suppression of the temperature in the panel will be easier. .

  If the board of this embodiment is a structure which can operate the ventilator of each air-cooled apparatus as above-mentioned and can ventilate the inside of a board, it will be of various fields (for example, field of closed type switchboards, such as a power converter board). It is possible to modify the design by appropriately applying common technical knowledge, and examples thereof include the following.

≪Example of electrical equipment storage board according to this embodiment≫
FIGS. 1-5 demonstrates the board 1 by this embodiment applicable, for example as a power converter device board. In the panel 1, a plurality of panel or columnar panel frames are assembled in a substantially box shape, and the inside of the panel 1 is a panel front part 11, a panel back part 12, panel side parts 13a and 13b, a panel ceiling part 14, and a panel. The structure is surrounded by the bottom 15. In the board 1, the upper stage part 2 and the lower stage part 3 are partitioned by an upper and lower stage partition wall 16 that extends in the horizontal direction at the center part in the board 1.

  An air-cooled device 4 (details will be described later) such as an inverter having a heat generating electronic component 41 such as a power semiconductor or the like (an IGBT or the like) or a ventilator 42 is provided on the panel front portion 11 side of the upper stage 2. An upper storage chamber 20 is formed for storing an electrical device 5a such as a capacitor having a non-exothermic (or relatively low exothermic) electronic component (not shown). In the upper stage storage chamber 20 in the drawing, a storage section partition wall 22 extending in the vertical direction and partitioning the upper stage storage chamber 20 is provided, and is located on the panel side surface portion 13a side of the upper stage storage chamber 20 and is air-cooled. It is divided into a region 22a for storing the electronic device 4 and a region 22b for housing the electrical device 5a located on the panel side surface 13b side of the upper stage storage chamber 20. The housing partition wall 22 can prevent the heat generated from the air-cooled device 4 from being transferred to the electrical device 5a.

  Further, in the region 22a in the figure, a plurality of (three in the figure) air-cooled devices 4 can be horizontally stored in the region 22a in order to accommodate a plurality of air-cooled devices 4 spaced in the vertical direction. A plurality of (three in the figure) flat plate-like support portions 22c extending in a plurality of stages are provided. As described above, the support portion 22c is not limited to a flat plate shape, and various configurations can be appropriately applied as long as the support portion 22c can support the air-cooled equipment 4 housed in the region 22a. Also good. For example, a configuration in which a slide rail (not shown) extending in the storage direction of the air-cooled device 4 in the region 22a is provided, and the air-cooled device 4 can be slidably guided and supported in the region 22a. Further, the lowermost air-cooled device 4 in the region 22a in the figure may be supported on the upper and lower stage partition walls 16, but is supported by the support portion 22c and separated from the upper and lower stage partition walls 16 as shown in the figure. By doing so, a ventilation path (for example, a ventilation path through a panel bottom side opening 46 described later) can be formed between the upper and lower partition walls 16.

  A duct 6 that extends in a vertical direction between the upper and lower partition walls 16 and the panel ceiling portion 14 and communicates with the inside of the upper portion storage chamber 20 is formed on the panel rear surface portion 12 side of the upper portion 2. . In the case of the duct 6 in the figure, the duct 6 has a shape having a duct ceiling portion 6a that is bent and extended toward the panel front surface portion 11 side on the panel ceiling portion 14 side. In addition, a duct partition wall 6b is provided between the duct 6 and the upper stage storage chamber 20, and a position facing each air-cooled device 4 in the duct partition wall 6b (opposite a later-described panel back side opening 43b). The communication port 6c is drilled (for example, drilled as shown in FIG. 8 described later) at a position where the same is performed. By such a duct partition wall 6b, it is possible to suppress air that has moved from the upper stage storage chamber 20 to the duct 6 (air that has absorbed heat from the air-cooled device 4 or the like) so as not to return to the upper stage storage chamber 20. . As long as the communication port 6c communicates so as not to prevent the movement of air between the upper stage storage chamber 20 and the duct 6 as described above, various forms can be appropriately applied. As a specific example, it may have a shape in which one or more holes such as a circular shape and a rectangular shape are formed, or a shape similar to that of a later-described panel back side opening 43b (a rectangular shape in FIG. 8 described later). ). In addition, in the duct partition wall 6b in the figure, the communication port 6c is formed on the region 22a side of the duct partition wall 6b. However, the duct partition wall 6b may also be provided on the region 22b side of the duct partition wall 6b as necessary. A communication port (not shown) may be provided as appropriate.

  In the lower tier 3, a lower tier storage chamber 30 is formed for housing an electric device 5b such as a reactor having a non-exothermic (or relatively low exothermic) electronic component (not shown). The storage chamber 30 communicates with the inside of the duct 6 through a communication port 60 that is drilled (for example, drilled as shown in FIG. 8 described later) on the panel back surface 12 side of the upper and lower partition walls 16. As long as the communication port 60 communicates so as not to hinder the movement of air between the lower stage storage chamber 30 and the duct 6 as described above, various forms can be appropriately applied. Specific examples thereof include a form in which one or more holes having a slit shape, a circular shape, a rectangular shape or the like are formed.

  The panel front portion 11 has a door structure that can be opened and closed through, for example, a hinge or the like (not shown), and the air-cooled device 4 and the electric devices 5a and 5b are respectively provided in the upper-stage storage chamber 20 and the lower-stage storage chamber 30. It is possible to store the air-cooled device 4 and the stored air-cooled device 4 and the electric devices 5a and 5b. An upper stage storage chamber 20 (an area 22a of the upper stage storage chamber 20 in the figure) communicates with the upper stage storage chamber 20 (in the figure, the area 22a of the upper stage storage chamber 20) on the upper stage 2 side (in the drawing, the region 22a side of the upper stage portion). An upper air inlet 21 for taking outside air into 20 is formed. A lower-stage intake port 31 that communicates with the lower-stage storage chamber and takes in outside air into the lower-stage storage chamber 30 is formed on the lower-stage section 3 side of the panel front portion 11. The panel ceiling portion 14 of the panel 1 is formed with an exhaust port 61 that communicates with the inside of the duct 6 and exhausts the air in the duct 6 to the outside of the panel 1.

  The above-described upper-stage intake port 21, lower-stage intake port 31, and exhaust port 61 are formed so as not to hinder the movement of air (intake of outside air into the panel 1 or exhaust of air in the duct 6). As long as it is possible, various forms can be appropriately applied, and as a specific example, FIG. 1 shows a form in which a plurality of slit-shaped holes are formed, but in addition, a circular shape is depicted. , A form in which one or more rectangular holes are formed. Further, the upper air inlet 21 is formed so as to be opposed to the ventilator 42 of each air-cooled device 4 (in FIG. 1, a plurality of slit-like holes are formed at positions opposed to the ventilators 42. Respectively). Further, at the outer peripheral sides of the upper stage intake port 21 and the lower stage intake port 31, so as not to disturb the intake of outside air and to suppress intrusion of solar radiation, wind and rain, dust, etc. (for example, intrusion from the horizontal direction). In addition, a shielding cover (for example, a cover in which an outside air intake port is formed on the lower side in the vertical direction; not shown) may be provided. Further, on the outer peripheral side of the exhaust port 61, the air exhaust in the duct 6 is not hindered and the intrusion of solar radiation, wind and rain, dust, etc. (for example, the intrusion from the upper side in the horizontal direction or the vertical direction) is suppressed. Also, a shielding cover (for example, a cover in which a discharge port is formed in the horizontal direction; not shown) may be provided.

  It should be noted that the portion where the exhaust port 61 is formed is not limited to the panel ceiling portion 14, and may be configured to communicate with the inside of the duct 6 and exhaust the air in the duct 6 to the outside of the panel 1 as described above. Can be set as appropriate. As a specific example, it may be formed on the panel ceiling part 14 side of at least one of the panel front part 11, the panel back part 12, and the panel side parts 13a and 13b.

  The air-cooled device 4 mainly includes, for example, a device case 43, a heat generating electronic component 41, a ventilator 42, a heat sink 44, a ventilation guide 45, and the like as described below, and heat generated from the heat generating electronic component 41 is applied to the heat sink 44. Heat is transferred, and the air blown from the ventilator 42 is blown onto the heat sink 44 to be cooled.

  The device case 43 is formed, for example, by appropriately molding a heat conductive material (aluminum or the like), for example, and has a cylindrical shape (in the figure, a rectangular cross section in the drawing) extending from the panel front surface 11 side to the duct 6 side. A panel front side opening 43a is formed on the panel front part 11 side of the device case 43 so as to face the upper stage inlet 21 and take in blown air described later. A panel back surface side opening 43b facing the duct 6 (facing the communication port 6c in the figure) and exhausting air to be described later is formed on the panel back surface 12 side (namely, the duct 6 side).

  The exothermic electronic component 41 is an exothermic electronic component such as a power semiconductor or the like (IGBT or the like) and is in contact with the outer peripheral surface of the device case 43 (in the drawing, the panel ceiling portion 14 side on the outer peripheral surface of the device case 43). The heat generated from the heat-generating electronic component 41 is provided so as to be transferred to the device case 43 (heat sink 44). The installation position of the heat-generating electronic component 41 can be set as appropriate as long as it is in contact with the outer peripheral surface of the device case 43 as described above. However, as shown in FIG. For example, the heat generated from the heat-generating electronic component 41 may be set so as to be easily transferred to the heat sink 44.

  The ventilator 42 includes, for example, a rotary fan blade (two blades in the drawing), and is arranged in such a manner that the air outlet 42a faces the panel back side opening 43b through the device case 43. It is provided in the board front part side opening 43a so that it may become. In the case of the ventilator 42 in the figure, the front side of the panel is arranged such that the panel bottom 15 side of the outlet 42a protrudes toward the panel bottom 15 side from the protruding direction end 44b of the heat sink 44 (radiating fin 44a). Although provided in the side opening 43a, the arrangement posture can be appropriately set as long as the blown air can be blown into the device case 43 and moved into the duct 6. In addition, the ventilator 42 can be appropriately driven, for example, via a power source or a control device (not shown), for example, when the heat generated from the heat-generating electronic component 41 exceeds a predetermined temperature. To drive.

  For example, as shown in FIG. 5, the heat sink 44 includes a plurality of heat radiating fins 44 a, and the heat radiating fins 44 a are connected to the inner peripheral surface of the device case 43 (in the drawing, the ceiling on the inner peripheral surface of the device case 43. Projecting from the portion 14 side), arranged at a predetermined pitch from each other at a distance, and extending along the axial direction of the device case 43. As long as the heat radiation fin 44a is configured to dissipate the heat of the heat radiation fin 44a by the blown air without hindering the movement of the air blown in the device case 43, various forms can be appropriately applied. For example, the shape and number of the radiating fins 44a can be appropriately set according to the mode of the air-cooled device 4 (for example, the shape of the device case 43, the heat generated from the heat-generating electronic component 41, the cooling function of the ventilator 42, etc.). Can be mentioned. In the case of the radiating fin 44a in the figure, a gap 44c is formed between the projecting direction end 44b of the radiating fin 44a and the panel bottom 15 side on the inner peripheral surface of the device case 43, but the dimension of the gap 44c is also the same. It may be set appropriately.

  The ventilation guide 45 is provided on the side of the panel bottom 15 on the inner peripheral surface of the device case 43, protrudes from the panel bottom 15 side of the inner peripheral surface of the device case 43 toward the axis of the device case 43, and back of the panel It has a shape that is inclined to the 12 side (upwardly inclined toward the panel back surface portion 12 side). Depending on the shape, position, and the like of the ventilation guide 45, the movement of the blown air in the device case 43 is guided (deflected), but the shape and position can be set as appropriate. As an example, a flat plate shape as shown in the figure is provided on the board front side opening 43 a side of the board bottom 15 side on the inner peripheral surface of the device case 43.

  According to the board 1 as described above, the inside of the board 1 is vented as shown below (for example, vented as indicated by a dotted arrow in the figure). First, when the ventilator 42 of each air-cooled device 4 is operated, outside air is taken into the upper stage storage chamber 20 (region 22a in the drawing) from the upper stage inlet 21 of the panel 1 and from the outlet 42a of the ventilator 42. Each blown air is blown out.

  This blown air is taken into the device case 43 from the panel front side opening 43a, and this will be explained by the dotted line arrow in the figure, and is particularly blown out from the panel ceiling 14 side of the vent 42a. The blown air passes through the device case 43 along the surface of the heat sink 44 (between the heat radiation fins 44a, etc.), and the blown air blown out from the bottom 15 of the air outlet 42a It passes through the device case 43 along the surface. Thereby, in the blowing air vector in the device case 43, an upward direction component is easily generated in addition to the blowing direction component.

  Further, in the device case 43 in the figure, the heat radiation fins 44 a of the heat sink 44 protrude from the panel ceiling portion 14 side in the device case 43, and the protruding direction end portion 44 b faces the ventilation guide 45. Therefore, the blown air tends to move to converge on the panel ceiling portion 14 side (the heat sink 44 root side) between the heat radiating fins 44a and the flow velocity tends to increase. In the case of this tendency, the pressure in the device case 43 decreases due to Bernoulli's theorem, and it becomes easy for outside air to be taken into the device case 43 from the upper air inlet 21 and the flow rate of the blown air increases. Further, the duct upward airflow described later is easily generated by the upward direction component as described above.

  As described above, the blown air that passes through the device case 43 absorbs the heat of the heat sink 44 (heat transferred from the heat-generating electronic component 41) and becomes relatively hot air in the panel 1. Buoyancy will occur. The blown air moves into the duct 6 through the panel back side opening 43b (in the figure, the panel back side opening 43b and the communication port 6c), and then generates a duct ascending current in the duct 6. The air is exhausted out of the panel 1 through the exhaust port 61 on the panel ceiling 14 side.

  Further, a duct suction airflow is generated in the lower-stage storage chamber 30 by the duct ascending air as described above, and the air in the lower-stage storage chamber 30 (air that has absorbed heat generated from the electrical device 5b) is a communication port. It moves into the duct 6 via 60. Further, when the air in the lower storage chamber 30 moves into the duct 6 due to the duct suction airflow as described above, the lower storage chamber 30 has a negative pressure outside the panel 1 and the lower intake port 31 Thus, outside air is taken into the lower stage storage chamber 30.

  As a result, the panel 1 not only cools the air-cooled device 4 but also cools the electrical device 5b in the lower storage chamber 30 where the ventilator 42 is not installed (even if the electrical device 5b has heat generation). It will be cooled).

  Therefore, according to the board 1, while the cooling performance of the ventilator 42 can fully be exhibited, suppression of the overheating of the air-cooled equipment 4 and the electric equipment 5a, 5b and the temperature in the board 1 can be achieved.

<< Variation 1 of panel 1 >>
FIG. 6 shows an example in which the design of the air-cooled device 4 of the panel 1 is changed as appropriate. In addition, the detailed description is abbreviate | omitted suitably by attaching | subjecting the same code | symbol to the thing similar to FIGS. In the ventilator 42 of the air-cooled device 4 in FIG. 6, a panel bottom side opening 46 is provided at a position closer to the panel rear side opening 43 b than the ventilation guide 45 in the panel bottom 15 side on the inner peripheral surface of the device case 43. It has been.

  By providing the panel bottom side opening 46 as described above, air is sucked into the device case 43 from the panel bottom side opening 46, and an upward direction component of the blown air vector is easily generated. Therefore, there is a possibility that it is easier to suppress overheating of the air-cooled device 4 and the electric devices 5a and 5b and to suppress the temperature in the panel.

  As long as the shape, position, and the like of the panel bottom side opening 46 are a form in which air is sucked into the device case 43 from the panel bottom side opening 46 as described above, the shape and position can be set as appropriate. .

<< Variation 2 of panel 1 >>
7 and 8 show an example in which the design of the duct 6 of the panel 1 is appropriately changed. Note that the same components as those in FIGS. 1 to 6 are denoted by the same reference numerals, and the detailed description thereof is omitted as appropriate. In the duct 6 of FIGS. 7 and 8, a shape that protrudes from the inner wall surface of the duct 6 and is inclined toward the panel ceiling 14 side (vertical upper side) at a position facing each panel back surface side opening 43 b on the inner wall surface of the duct 6. The ventilation guides 62 are respectively provided. The shape and position of the ventilation guide 62 are appropriately set as long as the blown air that has passed through the device case 43 and moved into the duct 6 can be guided (deflected) upward in the vertical direction. It is possible. In the case of the ventilation guide 62 in FIGS. 7 and 8, it extends from the panel side surface part 13a side to the panel side surface part 13b side on the inner wall surface of the duct 6 and bridges between the panel back surface part 12 and the duct partition wall 6b. It is the shape of the flat plate extended in the direction, Comprising: It becomes the shape which went up toward the said board | substrate side part 13b side.

  By providing the ventilation guide 62 as described above, the blown air that has passed through the device case 43 and moved into the duct 6 is guided (deflected) upward along the ventilation guide 62 in the vertical direction. The air is exhausted out of the panel 1 through the exhaust port 61 on the panel ceiling 14 side while generating a duct ascending airflow. Thereby, for example, the panel back side opening 43b (communication port 6c in the figure) of the device case 43 and the position (position on the panel back side 12 side) facing the panel back side opening 43b on the inner wall surface of the duct 6 Even if the distance between is not sufficiently secured, the downflow in the duct 6 is suppressed, and the above-described air-cooled equipment 4 and electrical equipment 5a, 5b are suppressed from overheating and in the panel. Temperature suppression may be easier.

  Although the present invention has been described in detail only for the specific examples described above, it is obvious to those skilled in the art that various modifications can be made within the scope of the technical idea of the present invention. It is natural that such changes and the like belong to the scope of the claims.

1 ... board 11, 12, 13a, 13b, 14, 15 ... board frame (board front, board rear, board side, board ceiling, board bottom)
16, 60 ... Communication port 2 ... Upper stage 20, 30 ... Storage room (upper stage storage room, lower stage storage room)
21, 31 ... Inlet (upper stage inlet, lower stage inlet)
DESCRIPTION OF SYMBOLS 3 ... Lower part 4 ... Air-cooled apparatus 41 ... Exothermic electronic component 42 ... Ventilator 43 ... Equipment case 44 ... Heat sink 43a, 43b, 46 ... Opening (panel front part side opening, panel back part side opening, board bottom part opening )
44b ... Projection direction end 45 ... Ventilation guide 6 ... Duct 61 ... Exhaust port 62 ... Ventilation guide

Claims (5)

A box-shaped board in which a plurality of board frames are assembled;
A storage chamber formed on the front side of the panel in the panel, in which a plurality of forced air-cooled electric devices are stored in multiple stages at intervals in the vertical direction;
A duct formed on the back side of the panel and communicating with the storage chamber,
The board
An air inlet formed in the front of the panel and communicating with the storage chamber;
An exhaust port formed on the panel ceiling side of the panel and communicating with the inside of the duct,
Each forced air-cooled electrical device
A tubular case extending from the front side of the panel to the duct side in the storage room, and having a panel front side opening and a panel back side opening,
An exothermic electronic component in contact with the outer peripheral surface of the device case;
A ventilator that is provided in the panel front side opening, and the air outlet faces the panel back side opening through the inside of the device case;
A heat sink protruding from the inner peripheral surface of the device case,
A ventilation guide having a shape protruding from the bottom side of the panel on the inner peripheral surface of the device case and inclined toward the back side of the panel,
Electrical equipment storage board characterized by that. A box-shaped board in which a plurality of board frames are assembled;
Upper and lower partition walls partitioning the inside of the panel into upper and lower stages,
An upper stage storage chamber that is formed on the front panel side of the upper stage, and in which a plurality of forced air-cooled electric devices are stored in multiple stages at intervals in the vertical direction;
A duct formed on the back side of the upper portion of the board and communicating with the upper portion storage chamber;
A lower portion storage chamber formed in the lower step portion and communicating with the inside of the duct,
The board
An upper intake port formed on the upper step side of the front of the panel and communicating with the upper storage chamber;
A lower air inlet formed on the lower side of the front of the panel and communicating with the lower housing,
An exhaust port formed on the panel ceiling side of the panel and communicating with the inside of the duct,
Each forced air-cooled electrical device
In a cylindrical shape extending from the front side of the panel to the duct side in the upper stage storage chamber, an equipment case having a front panel side opening and a back panel side opening,
An exothermic electronic component in contact with the outer peripheral surface of the device case;
A ventilator that is provided in the panel front side opening, and the air outlet faces the panel back side opening through the inside of the device case;
A heat sink protruding from the inner peripheral surface of the device case,
A ventilation guide having a shape protruding from the bottom side of the panel on the inner peripheral surface of the device case and inclined toward the back side of the panel,
Electrical equipment storage board characterized by that.   The electrical equipment storage board according to claim 1, wherein a board bottom side opening is provided at a position on the board back side opening side of the ventilation guide on the board bottom side of the equipment case.   The ventilation guide of the shape which protruded from the said duct inner wall surface, and was inclined to the board ceiling part side is provided in the position facing the panel back part side opening in a duct inner wall surface. Electrical equipment storage board according to crab.   The heat sink includes a plurality of heat radiation fins projecting from the panel ceiling side in the device case, and the projecting direction end of each heat radiation fin faces the ventilation guide. Electrical equipment storage board in any one.

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