JP2020107780A - Laminated coil component - Google Patents

Abstract

To provide a coil component capable of suppressing a short circuit between conductor layers.SOLUTION: A coil component 1 includes an insulator layer extending along a crossing direction intersecting the lamination direction, a first conductor layer provided on one surface of the insulating layer in the lamination direction, a second conductor layer provided on the other surface of the insulating layer in the lamination direction, and a base portion 20 that covers a first conductor pattern, the insulator layer, and a second conductor pattern, and the first conductor pattern has a recess O recessed from the end E of the first conductor pattern in the intersecting direction, and at least a part of the recess O is defined by one surface of the insulating layer.SELECTED DRAWING: Figure 4

Description

The present invention relates to a laminated coil component.

Conventionally, a laminated coil component including a base portion formed of a magnetic material such as ferrite, a plurality of conductor layers embedded in the base portion, and an insulating layer disposed between the plurality of conductor layers is known. Has been. One example of the laminated coil component is a laminated inductor. Multilayer inductors are passive devices used in electronic circuits. The multilayer inductor is used for removing noise in a power supply line or a signal line, for example. Such a laminated coil component is described in Patent Document 1, for example.

JP, 2018-121023, A

The laminated coil component as described above is produced, for example, by laminating a plurality of green sheets. The green sheet is made of magnetic material such as ferrite. A corresponding conductor pattern is formed on each of the plurality of green sheets before stacking. After stacking the plurality of green sheets, a step of pressing the plurality of green sheets in the stacking direction is performed.

However, when a plurality of green sheets are pressure-bonded in the stacking direction, the conductor layer may be deformed. In such a case, the conductor layers adjacent to each other in the stacking direction may be short-circuited.

One of the objects of the present invention is to provide a coil component capable of suppressing a short circuit between conductor layers. Other objects of the present invention will be made clear through the entire description of the specification.

A laminated coil component according to an embodiment of the present invention includes an insulating layer extending along an intersecting direction intersecting the laminating direction, a first conductor layer provided on one surface of the insulating layer in the laminating direction, and an insulating layer. A second conductor layer provided on the other surface of the body layer in the stacking direction; and a base portion that covers the first conductor layer, the insulator layer, and the second conductor layer. Of the first conductor layer has a recessed portion, and at least a part of the recessed portion is defined by one surface of the insulator layer.

The first conductor layer of this laminated coil component has a recess that is recessed from the end of the first conductor layer in the intersecting direction, and at least part of the recess is defined by one surface of the insulator layer. Since the first conductor layer has such a recess, the distance in the stacking direction between the first conductor layer and the second conductor layer is large at the location where the recess is provided. Therefore, even if the first conductor layer and/or the second conductor layer is deformed, the possibility that the first conductor layer and the second conductor layer contact each other is reduced. Therefore, it is possible to suppress a short circuit between the conductor layers.

In one embodiment of the present invention, the 2nd conductor layer has a crevice dented from the end of the 2nd conductor layer concerned in the crossing direction, and at least one copy of the crevice is demarcated by the other side of an insulator layer. May be. According to this configuration, since the recess is also provided at the end of the second conductor layer in the intersecting direction, the distance between the first conductor layer and the second conductor layer is further increased at the location where the recess is provided. Has become. Therefore, it is possible to more reliably suppress the short circuit between the conductor layers.

In one embodiment of the present invention, each of the first conductor layer and the second conductor layer has a side surface facing the base portion, and at least a part of the concave portion is defined by the side surface when viewed in the intersecting direction. Good.

In one embodiment of the present invention, the base portion includes a first magnetic body layer that is in contact with the insulator layer and the second conductor layer, and a second magnetic body layer that is stacked on the first magnetic body layer. The filling rate of the magnetic particles in the first magnetic layer may be higher than the filling rate of the magnetic particles in the second magnetic layer. According to this structure, the first magnetic layer is less likely to flow than the second magnetic layer and the second conductor layer. Therefore, the first magnetic layer can prevent the second conductor layer from flowing and deforming in the intersecting direction when pressure is applied in the stacking direction. Therefore, it is possible to more reliably suppress the short circuit between the conductor layers.

A laminated coil component according to an embodiment of the present invention includes an insulating layer extending along an intersecting direction intersecting the laminating direction, a first conductor layer provided on one surface of the insulating layer in the laminating direction, and an insulating layer. A second conductor layer provided on the other surface of the body layer in the stacking direction, and a base portion that covers the first conductor layer, the insulator layer, and the second conductor layer, the base portion including the insulator layer and The first magnetic body layer is in contact with the second conductor layer, and the second magnetic body layer stacked on the first magnetic body layer is included. 2 Higher than the filling rate of magnetic particles in the magnetic layer.

The base portion of this laminated coil component includes a first magnetic layer that contacts the insulator layer and the second conductor layer, and a second magnetic layer that is laminated on the first magnetic layer. Since the filling rate of the magnetic particles in the first magnetic layer is higher than the filling rate of the magnetic particles in the second magnetic layer, the first magnetic layer includes the second magnetic layer and the second conductor layer. It is more difficult to flow than. Therefore, the first magnetic layer can prevent the second conductor layer from flowing and deforming in the intersecting direction when pressure is applied in the stacking direction. Therefore, it is possible to suppress a short circuit between the conductor layers.

In one embodiment of the present invention, the first magnetic layer may contact the first conductor layer. According to this structure, the first magnetic layer is in contact with the first conductor layer in addition to the insulator layer and the second conductor layer. Accordingly, the first magnetic layer can also prevent the first conductor layer from flowing and deforming in the intersecting direction when pressure is applied in the stacking direction. Therefore, it is possible to more reliably suppress the short circuit between the conductor layers.

One embodiment of the present invention relates to a circuit board provided with the above-mentioned laminated coil component.

One embodiment of the present invention relates to an electronic component provided with the above-mentioned circuit board.

According to the present invention, there is provided a coil component capable of suppressing a short circuit between conductor layers.

It is a perspective view of a coil component concerning one embodiment of the present invention. It is a disassembled perspective view of the coil component of FIG. It is a figure which shows typically the cross section of the laminated coil component along the II line of FIG. It is sectional drawing which expands and shows a part of laminated structure in the laminated body of the coil components of FIG. It is sectional drawing which expands and shows a part of laminated structure in the laminated body of the coil components which concerns on a modification. It is sectional drawing which expands and shows a part of laminated structure in the laminated body of the coil components which concerns on a modification. It is sectional drawing which expands and shows a part of laminated structure in the laminated body of the coil components which concerns on a modification.

Hereinafter, various embodiments of the present invention will be described with reference to the drawings as appropriate. It should be noted that the same reference numerals are given to constituent elements common to a plurality of drawings throughout the plurality of drawings. It should be noted that the drawings are not necessarily drawn to scale for convenience of explanation.

FIG. 1 is a perspective view of a coil component 1 according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the coil component 1 shown in FIG. FIG. 3 is a diagram schematically showing a cross section of the coil component 1 taken along the line II of FIG. In FIG. 3, each magnetic layer included in the laminated body 10 described later is omitted.

In these drawings, a laminated inductor used as a passive element in various circuits is shown as an example of the coil component 1. The laminated inductor is an example of a laminated coil component to which the present invention can be applied. The present invention can be applied to a power inductor incorporated in a power supply line and various laminated coil components other than the power inductor.

The coil component 1 in the illustrated embodiment has a laminated body 10 in which magnetic layers made of a magnetic material are laminated, conductor patterns C11 to C16 embedded in the laminated body 10, and one end of the conductor pattern C11 electrically. And an external electrode 22 electrically connected to one end of the conductor pattern C16. Each of the conductor patterns C11 to C16 is electrically connected to an adjacent conductor pattern via vias V1 to V5 described later, and the conductor patterns C11 to C16 thus connected form the coil conductor 25. The conductor pattern C11 is connected to the external electrode 21 via a lead conductor 23 described below, and the conductor pattern C16 is connected to the external electrode 22 via a lead conductor 24 described below.

As shown, in one embodiment of the invention, the laminate 10 is formed into a generally rectangular parallelepiped shape. The laminated body 10 has a first main surface 10e, a second main surface 10f, a first end surface 10a, a second end surface 10c, a first side surface 10b, and a second side surface 10d. The outer surface of the stack 10 is defined by these six surfaces. The first main surface 10e and the second main surface 10f are opposed to each other, the first end surface 10a and the second end surface 10c are opposed to each other, and the first side surface 10b and the second side surface 10d are opposed to each other. Facing each other. When the laminated body 10 is formed in a rectangular parallelepiped shape, the first main surface 10e and the second main surface 10f are parallel to each other, and the first end surface 10a and the second end surface 10c are parallel to each other. The first side surface 10b and the second side surface 10d are parallel to each other.

In the embodiment of FIG. 1, since the first main surface 10e is on the upper side of the stacked body 10, the first main surface 10e may be referred to as “upper surface” in the present specification. Similarly, the second main surface 10f may be referred to as a "lower surface". Since the coil component 1 is arranged such that the second main surface 10f faces a circuit board (not shown), the second main surface 10f may be referred to as a “mounting surface” in this specification. When referring to the vertical direction of the coil component 1, the vertical direction of FIG. 1 is used as a reference.

In the present specification, the “length” direction, the “width” direction, and the “thickness” direction of the coil component 1 are respectively the “L” direction and the “W” direction of FIG. 1 unless otherwise understood in the context. Direction and "T" direction.

In one embodiment of the present invention, the coil component 1 has a length dimension (dimension in the L-axis direction) of 0.2 to 6.0 mm, a width dimension (dimension in the W-axis direction) of 0.1 to 4.5 mm, It is formed so that the thickness dimension (dimension in the T-axis direction) is 0.1 to 4.0 mm. These dimensions are merely examples, and the coil component 1 to which the present invention can be applied can take arbitrary dimensions as long as it does not violate the gist of the present invention. In one embodiment, the coil component 1 is formed to have a low height. For example, the coil component 1 is formed so that its width dimension is larger than its thickness dimension.

FIG. 2 is an exploded perspective view of the coil component 1 of FIG. In FIG. 2, the external electrodes 21 and 22 are omitted for convenience of illustration. As illustrated, the laminated body 10 includes a base portion 20, an upper cover layer 18 provided on an upper surface of the base portion 20, and a lower cover layer 19 provided on a lower surface of the base portion 20. The base portion 20 includes laminated magnetic layers 11 to 16. In this laminated body 10, from the top to the bottom of FIG. 2, an upper cover layer 18, a magnetic body layer 11, a magnetic body layer 12, a magnetic body layer 13, a magnetic body layer 14, a magnetic body layer 15, a magnetic body layer. 16, the magnetic layer 17, and the lower cover layer 19 are laminated in this order.

The upper cover layer 18 includes four magnetic layers 18a to 18d. In the upper cover layer 18, a magnetic material layer 18a, a magnetic material layer 18b, a magnetic material layer 18c, and a magnetic material layer 18d are stacked in this order from bottom to top in FIG.

The lower cover layer 19 includes four magnetic layers 19a to 19d. In the lower cover layer 19, a magnetic body layer 19a, a magnetic body layer 19b, a magnetic body layer 19c, and a magnetic body layer 19d are stacked in this order from top to bottom in FIG.

As will be described later, corresponding conductor patterns C11 to C16 are embedded in each of the magnetic body layers 11 to 16. In the state before the magnetic layers 11 to 16 are stacked, the upper surfaces of the conductor patterns C11 to C16 are exposed from the upper surfaces of the magnetic layers 11 to 16 respectively. The conductor patterns C11 to C16 and the lead conductors 23 and 24 form a coil conductor 25. The coil conductor 25 has a coil axis A. Each of the conductor patterns C11 to C16 is formed so as to extend around the coil axis A. In the illustrated embodiment, the coil axis A extends in the T-axis direction and coincides with the stacking direction of the magnetic layers 11 to 16.

Insulating layers IS11 to IS16 corresponding to the conductor patterns C11 to C16 are embedded in each of the magnetic layers 11 to 16. The insulator layers IS11 to IS16 are arranged below the conductor patterns C11 to C16, respectively. Each of the insulator layers IS11 to IS16 is formed to be slightly larger than the conductor patterns C11 to C16 in the direction intersecting the T-axis direction (stacking direction). In the state before the magnetic layers 11 to 16 are stacked, each of the insulating layers IS11 to IS16 is exposed on the lower surface of the magnetic layers 11 to 16. As the insulating material forming the insulating layers IS11 to IS16, for example, oxides containing iron such as alumina, silica, zirconia, and iron oxide can be used.

In another embodiment of the present invention, the magnetic layers 11 to 16 may be stacked in the L-axis direction. In this case, by forming the conductor patterns C11 to C16 on the surfaces of the magnetic layers 11 to 16, the coil axis A faces the same L-axis direction as the laminating direction of the magnetic layers 11 to 16. .. In another embodiment of the present invention, the magnetic layers 11 to 16 may be stacked in the W axis direction. In this case, by forming the conductor patterns C11 to C16 on the surfaces of the magnetic layers 11 to 16, the coil axis A faces the same W-axis direction as the laminating direction of the magnetic layers 11 to 16. ..

The resin contained in the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d is made of an insulating material. In one embodiment, this insulating material is a resin material having excellent insulating properties. As this resin material, for example, polyvinyl butyral (PVB) resin, ethyl cellulose resin, polyvinyl alcohol resin, or acrylic resin can be used. The resin contained in the magnetic material layers 11 to 16, the magnetic material layers 18a to 18d, and the magnetic material layers 19a to 19d may be thermosetting resins having excellent insulating properties. .. Examples of the thermosetting resin include epoxy resin, polyimide resin, polystyrene (PS) resin, high-density polyethylene (HDPE) resin, polyoxymethylene (POM) resin, polycarbonate (PC) resin, polyvinylidene fluoride (PVDF) resin, Phenolic resin, polytetrafluoroethylene (PTFE) resin, or polybenzoxazole (PBO) resin can be used. The resin contained in each magnetic layer and each sheet may be the same as or different from the resin contained in another magnetic layer and another sheet.

When the magnetic material layers 11 to 16, the magnetic material layers 18a to 18d, and the magnetic material layers 19a to 19d are made of a resin material, these magnetic material layers include filler particles. May be included. The filler particles are, for example, ferrite material particles, soft magnetic metal particles, inorganic material particles such as SiO ₂ and Al ₂ O ₃ , or glass particles. The ferrite material particles applicable to the present invention are, for example, Ni—Zn ferrite particles or Ni—Zn—Cu ferrite particles. The soft magnetic metal particles applicable to the present invention are materials that exhibit magnetism in the non-oxidized metal portion, and are particles containing non-oxidized metal particles or alloy particles, for example. Examples of soft magnetic metal particles applicable to the present invention include alloy-based Fe-Si-Cr, Fe-Si-Al, or Fe-Ni, amorphous Fe-Si-Cr-BC, or Particles of Fe-Si-B-Cr, Fe, or mixed materials thereof are included.

The magnetic material layers 11 to 16, the magnetic material layers 18a to 18d, and the magnetic material layers 19a to 19d are formed by combining a large number of soft magnetic metal particles having an insulating coating formed on their surfaces. It may be formed. This insulating coating is, for example, an oxide coating formed by oxidizing the surface of the soft magnetic metal. The magnetic layer made of a large number of bonded soft magnetic metal particles may not contain a resin. Examples of soft magnetic metal particles applicable to the present invention include alloy-based Fe-Si-Cr, Fe-Si-Al, or Fe-Ni, amorphous Fe-Si-Cr-BC, or Particles of Fe-Si-B-Cr, Fe, or mixed materials thereof are included. A structure composed of soft magnetic metal particles that can be used as the magnetic material layers 11 to 16, the magnetic material layers 18a to 18d, and the magnetic material layers 19a to 19d is described in, for example, It is disclosed in Japanese Patent Publication No. 2013-153119.

The coil component 1 includes, in addition to the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d, any number of magnetic bodies as necessary. It can include layers. Part of the magnetic material layers 11 to 16, the magnetic material layers 18a to 18d, and the magnetic material layers 19a to 19d can be appropriately omitted.

The conductor patterns C11 to C16 and the insulating layers IS11 to IS16 are formed by being embedded in the corresponding magnetic layers 11 to 16, respectively. The conductor patterns C11 to C16 and the insulating layers IS11 to IS16 are formed by printing such as screen printing, plating, etching, or any other known method.

Vias V1 to V5 are formed at predetermined positions in the magnetic layers 11 to 15, respectively. The vias V1 to V5 are formed by forming through holes penetrating the insulating layers IS11 to IS16 in the T-axis direction at predetermined positions of the insulating layers IS11 to IS16 and embedding a metal material in the through holes. ..

The conductor patterns C11 to C16 and the vias V1 to V5 are formed so as to include a metal having excellent conductivity, and are made of, for example, Ag, Pd, Cu, Al, or an alloy thereof.

The specific materials described in the present specification are examples, and materials not exemplified in the present specification can be appropriately used as the material of the constituent elements of the coil component 1.

In one embodiment, the external electrode 21 is provided on the first end surface 10 a of the stacked body 10, and the external electrode 22 is provided on the second end surface 10 c of the stacked body 10. The external electrodes 21 and 22 may extend to the upper surface 10e, the lower surface 10f, the first side surface 10b, and the second side surface 10d of the stacked body 10 as illustrated. In this case, the external electrode 21 is provided so as to cover the entire first end surface 10a of the stacked body 10 and a part of each of the upper surface 10e, the lower surface 10f, the first side surface 10b, and the second side surface 10d. The external electrode 22 is provided so as to cover the entire second end surface 10c of the stacked body 10 and a part of each of the upper surface 10e, the lower surface 10f, the first side surface 10b, and the second side surface 10d. The shapes of the external electrode 21 and the external electrode 22 are not particularly limited and can be changed appropriately. For example, the external electrode 21 may have an L-shape that covers a part of each of the first end surface 10a and the lower surface 10f, or may have a plate shape that covers a part of the lower surface 10f. Similarly, the external electrode 22 may have an L-shape that covers a part of each of the second end surface 10c and the lower surface 10f, or may have a plate shape that covers a part of the lower surface 10f.

Next, with reference to FIG. 4, the laminated structure of the magnetic layers 11 to 16, the conductor patterns C11 to C16, and the insulator layers IS11 to IS16 in the laminated body 10 and the shapes of the conductor patterns C11 to C16 will be described in detail. To do. FIG. 4 is a cross-sectional view showing an enlarged part of the laminated structure of the laminated body 10. FIG. 4 shows a portion where the conductor patterns C12 to C15 are laminated.

As shown in FIG. 4, the laminated body 10 of the coil component 1 is at least in the intersecting direction (the direction along the WL plane in the present embodiment) intersecting the laminating direction (the T-axis direction in the present embodiment). An insulator layer extending along the first conductor pattern (first conductor layer) provided on one surface of the insulator layer in the laminating direction, and a first conductor pattern provided on the other surface of the insulator layer in the laminating direction. Two conductor patterns (second conductor layer). Both the first conductor pattern and the second conductor pattern extend along the tolerance direction. The insulator layer is laminated on the first conductor pattern, and the second conductor pattern is laminated on the insulator layer. In the laminated body 10, the conductor patterns C11 to C16 and the insulator layers IS11 to IS16 have substantially the same pattern when viewed in the laminating direction. That is, in the laminated body 10, a set of conductor patterns and insulating layers having substantially the same structure are repeatedly laminated. For example, when focusing on the conductor patterns C13 and C14, the conductor pattern C14 corresponds to the first conductor layer, and the conductor pattern C13 corresponds to the second conductor layer. When focusing on the conductor patterns C12 and C13, the conductor pattern C13 corresponds to the first conductor layer, and the conductor pattern C12 corresponds to the second conductor layer.

Each of the conductor patterns C11 to C16 has a recess O recessed from the end E of the conductor pattern in the intersecting direction. In the present specification, the “end E” of the conductor patterns C11 to C16 means that the conductor patterns C11 to C16 and the base portion 20 are in contact with each other at the position where the width of the conductor patterns C11 to C16 in the intersecting direction is the largest. Refers to a place. In the following description, the dimension of the portion where the width of the conductor patterns C11 to C16 in the intersecting direction is maximum (that is, the dimension in the intersecting direction at the end E) is the width W2, and the width of the conductor patterns C11 to C16 in the intersecting direction is the minimum. The width W1 will be described as the dimension of the area. In the embodiment shown in FIG. 4, each of the conductor patterns C11 to C16 has a recess O on both ends in the intersecting direction. In one embodiment, the recess O has a substantially rectangular shape and extends along the intersecting direction. As a result, in each of the conductor patterns C11 to C16, the dimension in the intersecting direction at the location where the recess O is formed is the width W1. The width W3 of each insulator layer IS11-IS16 is larger than the width W1, W2 of each conductor pattern C11-C16.

At least a part of the recess O is defined by an insulating layer located immediately below the conductor pattern having the recess O. For example, when focusing on the conductor patterns C13 and C14 and the conductor pattern C13 corresponds to the second conductor pattern, at least a part of the recess O of the conductor pattern C13 is formed by the insulator layer IS13 located immediately below the conductor pattern C13. It is demarcated. The base portion 20 is inserted in the recess O of each of the conductor patterns C11 to C16. As a result, the base portion 20 is interposed between the insulating layer and the conductor pattern at both ends of each of the conductor patterns C11 to C16 in the intersecting direction.

Next, an example of a method of manufacturing the coil component 1 will be described. First, an upper laminated body to be the upper cover layer 18, an intermediate laminated body, and a lower laminated body to be the lower cover layer 18 are formed. The upper laminated body is formed by laminating a plurality of magnetic material sheets to be the magnetic material layers 18a to 18d. Similarly, the lower laminated body is formed by laminating a plurality of magnetic material sheets to be the magnetic material layers 19a to 19d. The magnetic sheet is obtained, for example, by applying the slurry to the surface of a plastic base film, drying the slurry, and cutting the dried slurry into a predetermined size. The slurry is produced, for example, by adding a solvent to a resin material containing filler particles. As the resin in which the filler particles are dispersed, for example, a resin material having excellent insulating properties such as polyvinyl butyral (PVB) resin and epoxy resin can be used.

The intermediate laminate is formed by laminating a plurality of sheets including an insulator layer, a conductor pattern, and a magnetic layer. When manufacturing each sheet, first, an insulator layer corresponding to the shape of the conductor pattern C included in the sheet is formed on the base film by screen printing or the like. At this time, a through hole which penetrates the insulating layer in the stacking direction and in which a via is formed is formed. Then, a corresponding conductor pattern is printed on the insulator layer. As a result, the metal material forming the conductor pattern is embedded in the through hole, and the via is formed. Then, a magnetic layer is formed in the region where the conductor pattern is not formed. After each of the sheets including the conductor patterns C11 to C16 is formed, the base film is removed, and the sheets including the conductor pattern C16 to the sheet including the conductor pattern C11 are sequentially laminated.

Next, the intermediate laminated body produced as described above is sandwiched between the upper laminated body and the lower laminated body from above and below, and the upper laminated body and the lower laminated body are thermocompression bonded to the intermediate laminated body to obtain a main body laminated body. Next, by using a cutting machine such as a dicing machine or a laser processing machine, the main body laminated body is singulated into a desired size to obtain a chip laminated body corresponding to the laminated body 10. Next, the chip laminated body is degreased, and the degreased chip laminated body is heat-treated. Next, the external electrodes 21 and 22 are formed by applying a conductor paste to both ends of the heat-treated chip laminated body. Through the above steps, the coil component 1 is obtained.

As described above, the conductor patterns C11 to C16 of the coil component 1 have the recess O recessed from the end E of the conductor pattern C11 to C16 in the intersecting direction, and at least a part of the recess O has the conductor pattern C11 to C11. It is defined by an insulator layer located directly below C16. The manufacturing process of the coil component 1 includes a step of thermocompression bonding a plurality of layers in the stacking direction as described above. This step may cause deformation and/or displacement of the conductor patterns C11 to C16. In contrast, since the conductor patterns C11 to C16 have the recess O, the first conductor pattern (for example, the conductor pattern C14) and the second conductor pattern (this In some cases, the distance in the stacking direction from the conductor pattern C13) is large. Therefore, even if the first conductor pattern and/or the second conductor pattern is deformed, the conductor patterns adjacent to each other in the stacking direction (that is, the first conductor pattern and the second conductor pattern) The likelihood of contact is reduced. Therefore, it is possible to suppress a short circuit between the conductor patterns C11 to C16.

Further, in the coil component 1, the width W3 of each of the insulator layers IS11 to IS16 is larger than the widths W1 and W2 of each of the conductor patterns C11 to C16. Accordingly, even if the conductor patterns C11 to C16 are displaced in the process of thermocompression bonding a plurality of layers in the stacking direction, the conductor patterns C11 to C16 adjacent to each other in the stacking direction may come into contact with each other. Has been reduced.

Next, with reference to FIG. 5, a coil component 1A according to a modification will be described. Similar to the coil component 1, the coil component 1</b>A according to the modification has a laminated body 10 in which a coil conductor 25 is embedded, an external electrode 21 electrically connected to one end of the coil conductor 25, and the coil conductor 25. And an external electrode 22 electrically connected to the other end of the. The laminated body 10 includes at least a first conductor pattern (first conductor layer) extending along an intersecting direction intersecting the laminating direction, an insulator layer laminated on the first conductor pattern, and the insulator. A second conductor pattern (second conductor layer) that is stacked on the layer and extends along the intersecting direction. In the embodiment of FIG. 5, the laminated body 10 has conductor patterns C11 to C16, insulator layers IS11 to IS16, and a base portion 20.

The difference between the coil component 1A according to the modified example and the coil component 1 is that each of the conductor patterns C11 to C16 further has another recess O'in addition to the recess O, as shown in FIG. .. At least a part of the recess O'is defined by the insulating layer located immediately above the conductor pattern having the recess O'. For example, paying attention to the conductor patterns C13 and C14, and when the conductor pattern C14 corresponds to the first conductor pattern, at least a part of the recess O′ of the conductor pattern C14 is located on the insulator layer IS13 immediately above the conductor pattern C14. Is defined by The base portion 20 is inserted in the recess O'of each of the conductor patterns C11 to C16. As described above, each of the conductor patterns C11 to C16 according to the modification has the other recess O′, so that the first conductor pattern (for example, the conductor pattern C14) is provided at the place where the recess O′ is provided. , The distance in the stacking direction from the second conductor pattern (in this case, the conductor pattern C13) is further increased. Therefore, it is possible to more reliably suppress a short circuit between the conductor patterns C11 to C16.

Next, with reference to FIG. 6, a coil component 1B according to a modification will be described. Similar to the coil component 1, the coil component 1B according to the modified example has a laminated body 10 in which a coil conductor 25 is embedded, an external electrode 21 electrically connected to one end of the coil conductor 25, and the coil conductor 25. And an external electrode 22 electrically connected to the other end of the. The laminated body 10 includes conductor patterns C11 to C16, insulator layers IS11 to IS16, and a base portion 20.

The coil component 1B according to the modification is different from the coil component 1 in that the side surfaces S of the conductor patterns C11 to C16 are inclined with respect to the stacking direction when viewed from the intersecting direction. The side surface S of the conductor patterns C11 to C16 faces the base portion 20. In the coil component 1B, at least a part of the concave portions O of the conductor patterns C11 to C16 is defined by the side surface S of the conductor patterns C11 to C16. Since the side surfaces S of the conductor patterns C11 to C16 are inclined in this way, the shape of the recess O viewed from the crossing direction is triangular. Even in such a case, since the conductor patterns C11 to C16 have the recess O, the first conductor pattern (for example, the conductor pattern C14) and the second conductor pattern are provided at the place where the recess O is provided. The conductor pattern (in this case, the conductor pattern C13) has a large distance in the stacking direction. Therefore, the possibility that the conductor patterns adjacent to each other in the stacking direction (that is, the first conductor pattern and the second conductor pattern) are reduced, and the short circuit between the conductor patterns C11 to C16 can be suppressed. ..

In the example shown in FIG. 6, the side surfaces S of the conductor patterns C11 to C16 are inclined so that the upper width of the conductor patterns C11 to C16 is wide. The patterns C11 to C16 may be inclined so that the width on the lower side becomes wider. Further, the shape of the recess O viewed from the intersecting direction is not limited to a rectangular shape, a triangular shape, or the like, and may be a wedge shape, for example.

Next, a coil component 1C according to a modified example will be described with reference to FIG. Similar to the coil component 1, the coil component 1C according to the modified example has a laminated body 10 in which a coil conductor 25 is embedded, an external electrode 21 electrically connected to one end of the coil conductor 25, and the coil conductor 25. And an external electrode 22 electrically connected to the other end of the. The laminated body 10 includes at least a first conductor pattern (first conductor layer) extending along an intersecting direction intersecting the laminating direction, an insulator layer laminated on the first conductor pattern, and the insulator. A second conductor pattern (second conductor layer) that is stacked on the layer and extends along the intersecting direction. In the embodiment of FIG. 5, the laminated body 10 has conductor patterns C11 to C16, insulator layers IS11 to IS16, and a base portion 20.

The difference between the coil component 1C and the coil component 1 is that the conductor patterns C11 to C16 do not have the recesses O, and that the base portion 20 has the first conductor layer 26 and the second magnetic layer 27. Is. The first conductor layer 26 is a layer that contacts the insulator layer and the second conductor pattern. For example, when focusing on the conductor patterns C13 and C14, the first magnetic layer 26 contacts the conductor pattern C13 corresponding to the second conductor pattern and the insulator layer IS13. The second magnetic layer 27 is laminated on the first magnetic layer 26. The filling rate of magnetic particles in the first magnetic layer 26 is higher than the filling rate of magnetic particles in the second magnetic layer 27. As an example, the filling rate of the magnetic particles in the first magnetic layer 26 is about 70% to 90%, and the filling rate of the magnetic particles in the second magnetic layer 27 is about 65% to 85%. The filling rate of the magnetic particles can be changed by adjusting the amount of the binder contained in the material forming the first magnetic layer 26 or the second conductor layer 27. The smaller the amount of binder, the higher the packing rate of the magnetic particles, and the larger the amount of binder, the lower the packing rate of the magnetic particles.

As described above, the base portion 20 of the coil component 1C includes the first magnetic body layer 26 that is in contact with the insulator layer and the second conductor pattern, and the second magnetic body that is stacked on the first magnetic body layer 26. And a layer 27. Since the filling rate of the magnetic particles in the first magnetic layer 26 is higher than the filling rate of the magnetic particles in the second magnetic layer 27, the first magnetic layer 26 includes the second magnetic layer 27 and the second magnetic layer 27. It is less likely to flow than the conductor patterns C11 to C16. Therefore, the first magnetic layer 26 can prevent the second conductor pattern from flowing and deforming in the intersecting direction when pressure is applied in the stacking direction in the manufacturing process. Therefore, it is possible to suppress a short circuit between the conductor patterns C11 to C16.

The first magnetic layer 26 may also contact the first conductor pattern (the conductor pattern C14 when the conductor patterns C13 and C14 are focused). In this case, the first magnetic layer 26 can also prevent the first conductor pattern from flowing and deforming in the intersecting direction when pressure is applied in the stacking direction. Therefore, it is possible to more reliably suppress a short circuit between the conductor patterns C11 to C16.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and various modifications can be made. For example, the base portion 20 of the coil component 1, 1A, 1B described above may also include the first magnetic layer 26 and the second magnetic layer 27, similarly to the coil component 1C. In this case, the first magnetic layer 26 may enter the recess O and/or the recess O'of the coil component 1, 1A, 1B.

Further, in the above-described embodiment, a description has been given of the form in which each of the conductor patterns C11 to C16 of the coil component has only the recess O and the form in which each of the conductor patterns C11 to C16 has the recess O and the recess O′. Each of the conductor patterns C11 to C16 of the coil component may have only the recess O'.

The dimensions, materials, and arrangements of the components described herein are not limited to those explicitly described in the embodiments, and the components may be included in the scope of the present invention. Can be modified to have different dimensions, materials, and configurations. In addition, components that are not explicitly described in this specification may be added to the described embodiments, or some of the components described in each embodiment may be omitted.

1, 1A, 1B, 1C... Coil component, 20... Base part, 26... First magnetic layer, 27... Second magnetic layer, C11 to C16... Conductor pattern (first conductor layer, second magnetic layer) , IS11 to IS16... Insulator layer, O, O′... Recesses.

Claims (8)

An insulator layer extending along a crossing direction intersecting the stacking direction,
A first conductor layer provided on one surface of the insulator layer in the stacking direction,
A second conductor layer provided on the other surface of the insulator layer in the stacking direction,
A base portion that covers the first conductor layer, the insulator layer, and the second conductor layer;
The first conductor layer has a recessed portion that is recessed from an end portion of the first conductor layer in the intersecting direction,
A laminated coil in which at least a part of the recess is defined by the one surface of the insulator layer. The second conductor layer has a recessed portion that is recessed from an end of the second conductor layer in the intersecting direction,
The laminated coil according to claim 1, wherein at least a part of the recess is defined by the other surface of the insulator layer. Each of the first conductor layer and the second conductor layer has a side surface facing the base portion,
The laminated coil component according to claim 1, wherein at least a part of the recess is defined by the side surface when viewed from the intersecting direction. The base portion includes a first magnetic layer that is in contact with the insulating layer and the second conductor layer, and a second magnetic layer that is stacked on the first magnetic layer.
The laminated coil component according to any one of claims 1 to 3, wherein a filling rate of magnetic particles in the first magnetic layer is higher than a filling rate of magnetic particles in the second magnetic layer. An insulator layer extending along a crossing direction intersecting the stacking direction,
A first conductor layer provided on one surface of the insulator layer in the stacking direction,
A second conductor layer provided on the other surface of the insulating layer in the laminating direction and laminated to extend along the intersecting direction;
A base portion that covers the first conductor layer, the insulator layer, and the second conductor layer;
The base portion includes a first magnetic layer that is in contact with the insulating layer and the second conductor layer, and a second magnetic layer that is stacked on the first magnetic layer.
The laminated coil component, wherein the filling rate of the magnetic particles in the first magnetic layer is higher than the filling rate of the magnetic particles in the second magnetic layer. The laminated coil component according to claim 5, wherein the first magnetic layer contacts the first conductor layer. A circuit board comprising the laminated coil component according to claim 1. An electronic component comprising the circuit board according to claim 7.

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