JP2020100099A - Method for manufacturing resin molded product - Google Patents

Method for manufacturing resin molded product Download PDF

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JP2020100099A
JP2020100099A JP2018240992A JP2018240992A JP2020100099A JP 2020100099 A JP2020100099 A JP 2020100099A JP 2018240992 A JP2018240992 A JP 2018240992A JP 2018240992 A JP2018240992 A JP 2018240992A JP 2020100099 A JP2020100099 A JP 2020100099A
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molded product
resin molded
mold
tape
pattern
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JP7182161B2 (en
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揖斐 秀実
Hidemi Ibi
秀実 揖斐
磯部 智明
Tomoaki Isobe
智明 磯部
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Panasonic Intellectual Property Management Co Ltd
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Abstract

To provide a method for manufacturing a resin molded product capable of providing a surface pattern on the resin molded product easily and at low production cost.SOLUTION: A method for manufacturing a resin molded product supplies a thermosetting resin 25 into a mold 10 to mold. A design surface 20 of the mold 10 is a matte surface on which matte processing is given. After a heat-resistant adhesive tape 15 with a desired shape is adhered on the design surface 20, a thermosetting resin 25 is supplied into the mold 10 so as to straddle between a portion 22 where the matte surface is exposed and an outer surface 23 of the heat-resistant adhesive tape 15 adhered on the matte surface.SELECTED DRAWING: Figure 1

Description

本発明は樹脂成形品の製造方法に関する。 The present invention relates to a method for manufacturing a resin molded product.

従来では、表面に模様を施した樹脂成形品を金型にて成形するために、目的とする模様に対応した意匠面が形成された金型を用いる方法が採られている。例えば、特許文献1には、意匠面につや消し面領域と、鏡面仕上げ領域とを形成した金型を用いて、表面模様を有する樹脂成形品を成形することが記載されている。 Conventionally, in order to mold a resin molded product having a pattern on its surface with a mold, a method of using a mold having a design surface corresponding to a desired pattern has been adopted. For example, Patent Document 1 describes molding a resin molded product having a surface pattern using a mold in which a matte surface area and a mirror finish area are formed on a design surface.

特開平9−140485号公報JP, 9-140485, A

しかしながら、上記の方法では、模様の種類ごとに金型を製造する必要があり、多種の模様に対応した多種の樹脂成形品を製造する場合には、当然に生産性は低くなり、生産コストが高くなるおそれがある。 However, in the above method, it is necessary to manufacture a mold for each type of pattern, and when manufacturing various resin molded products corresponding to various patterns, the productivity is naturally low and the production cost is low. There is a risk of becoming higher.

本発明は、このような事情を考慮して提案されたもので、その目的は、簡易かつ低生産コストで樹脂成形品に表面模様を施すことができる、樹脂成形品の製造方法を提供することにある。 The present invention has been proposed in view of the above circumstances, and an object thereof is to provide a method for producing a resin molded product, which is capable of applying a surface pattern to the resin molded product easily and at low production cost. It is in.

上記目的を達成するために、本発明の樹脂成形品の製造方法は、熱硬化性樹脂を金型に供給して成形する樹脂成形品の製造方法において、前記金型の意匠面はマット加工がなされたマット面とされており、前記意匠面に所望の形状の耐熱性粘着テープを貼り付けたのち、前記熱硬化性樹脂を、前記マット面が露出した部位と、前記マット面に貼り付けた前記耐熱性粘着テープの外表面とに跨るように、前記金型内に供給することを特徴とする。 In order to achieve the above-mentioned object, the method for producing a resin molded product of the present invention is a method for producing a resin molded product in which a thermosetting resin is supplied to a mold for molding, and the design surface of the mold is matted. The heat-resistant adhesive tape having a desired shape is attached to the design surface, and then the thermosetting resin is attached to the exposed portion of the mat surface and the mat surface. It is characterized in that the heat-resistant adhesive tape is supplied into the mold so as to extend over the outer surface of the heat-resistant adhesive tape.

本発明の樹脂成形品の製造方法は上述した手順とされているため、簡易かつ低生産コストで樹脂成形品に表面模様を施すことができる。 Since the method for producing a resin molded product according to the present invention has the above-described procedure, it is possible to apply a surface pattern to the resin molded product easily and at low production cost.

本発明の一実施形態に係る樹脂成形品の製造方法の説明図である。(a)(b)は、同製造方法に用いられる金型の意匠面に対する耐熱性粘着テープの貼り付け手順の一例を示す、意匠面の模式平面図である。It is explanatory drawing of the manufacturing method of the resin molded product which concerns on one Embodiment of this invention. (A) (b) is a model top view of a design surface which shows an example of the sticking procedure of a heat resistant adhesive tape with respect to the design surface of the metal mold|die used for the manufacturing method. (a)(b)は、同金型内へ樹脂成形品を注入した状態を示す模式縦断面図である。(a)は図1(b)のA−A線に対応した図、(b)は図1(b)のB−B線に対応した図である。(c)は図1(a)(b)に例示した金型により成形された樹脂成形品の模式的斜視図および部分拡大正面図である。(A) (b) is a model longitudinal cross-sectional view which shows the state which inject|poured the resin molded product in the mold. 1A is a diagram corresponding to line AA in FIG. 1B, and FIG. 1B is a diagram corresponding to line BB in FIG. 1B. FIG. 1C is a schematic perspective view and a partially enlarged front view of a resin molded product molded by the mold illustrated in FIGS. 1A and 1B. 同製造方法により製造された樹脂成形品の他の例を示す模式的斜視図および模式的正面図である。It is a typical perspective view and a typical front view showing other examples of a resin-molded article manufactured by the manufacturing method.

以下に、本発明の実施の形態について、添付図面を参照しながら説明する。まず、本製造方法の基本手順について説明する。 Embodiments of the present invention will be described below with reference to the accompanying drawings. First, the basic procedure of the manufacturing method will be described.

本製造方法は、熱硬化性樹脂を金型10に供給して成形する樹脂成形品の製造方法である。この金型10の意匠面20はマット加工(しぼ加工)がなされたマット面とされている。この製造方法は、意匠面20に所望の形状の耐熱性粘着テープ15を貼り付けたのち、熱硬化性樹脂25を、マット面が露出した部位22と、マット面に貼り付けたテープ15の外表面23とに跨るように、金型10内に供給する手順とされる。以下、耐熱性粘着テープ15はテープ15と略す。 This manufacturing method is a method for manufacturing a resin molded product in which a thermosetting resin is supplied to the mold 10 and molded. The design surface 20 of the mold 10 is a mat surface that has been subjected to mat processing (texturing). In this manufacturing method, a heat-resistant adhesive tape 15 having a desired shape is attached to the design surface 20, and then a thermosetting resin 25 is applied to the portion 22 where the mat surface is exposed and the tape 15 attached to the mat surface. The procedure is such that the mold 10 is supplied so as to straddle the surface 23. Hereinafter, the heat resistant adhesive tape 15 is abbreviated as the tape 15.

このように、本製造方法で用いる金型10は、本製造方法の手順を実行することにより、金型10の意匠面20がテープ15の貼り付けにより加工される。そして、その金型10を用いて樹脂成形することより、成形対象である樹脂成形品30の表面模様31に対応した模様面21が形成される。 As described above, in the mold 10 used in the present manufacturing method, the design surface 20 of the mold 10 is processed by attaching the tape 15 by executing the procedure of the present manufacturing method. Then, by performing resin molding using the mold 10, the pattern surface 21 corresponding to the surface pattern 31 of the resin molded product 30 which is the molding target is formed.

以下、本製造方法の詳細について説明する。なお、本製造方法は種々の形状の樹脂成形品30に対応したものであるが、図例では、図2(c)に示すように、製造対象である樹脂成形品30が平面視正方形状の板体としたものを例示する。また、本例では意匠面20は上型11のキャビティ面に形成されている。 Hereinafter, the details of this manufacturing method will be described. The present manufacturing method is applicable to the resin molded products 30 having various shapes, but in the illustrated example, as shown in FIG. 2C, the resin molded product 30 to be manufactured has a square shape in plan view. A plate body is exemplified. Further, in this example, the design surface 20 is formed on the cavity surface of the upper mold 11.

樹脂成形品30の原材料としては、フェノール樹脂やエポキシ樹脂などの熱硬化性樹脂25が用いられる。熱硬化性樹脂25には光輝性の顔料が含有されてもよいが、これには限られない。光輝性の顔料としては、薄片状雲母の表面に二酸化チタン層を形成させたものや、ガラスフレークに金属、金属酸化物をコートしたものなどが用いられる。 As a raw material for the resin molded product 30, a thermosetting resin 25 such as a phenol resin or an epoxy resin is used. The thermosetting resin 25 may contain a bright pigment, but is not limited thereto. As the glittering pigment, there are used those in which a titanium dioxide layer is formed on the surface of flaky mica, and those in which glass flakes are coated with a metal or a metal oxide.

本製造方法に用いる金型10の意匠面20は、図1(a)に示すように、加工前には、その意匠面20の全体がマット面(意匠面20)とされている。 As shown in FIG. 1A, the design surface 20 of the mold 10 used in the present manufacturing method is a matte surface (design surface 20) as a whole before processing.

なお、図1(a)(b)に示した意匠面20の模式平面図では、マット面がクロスハッチングで模式的に示してある。また、樹脂成形品30の表面模様31のうちのマット面に対応した地模様部32についても、図2(c)に示した模式的斜視図においてクロスハッチングで模式的に示してある。また、図2(a)(b)に示した金型10の模式的縦断面図では、マット面が連続凹凸であるように模式的に示してある。 In the schematic plan view of the design surface 20 shown in FIGS. 1A and 1B, the mat surface is schematically shown by cross hatching. Further, the ground pattern portion 32 corresponding to the matte surface of the surface pattern 31 of the resin molded product 30 is also schematically shown by cross hatching in the schematic perspective view shown in FIG. Further, in the schematic vertical sectional views of the mold 10 shown in FIGS. 2A and 2B, the mat surface is schematically shown as having continuous irregularities.

処理手順としては、まず、図1(a)に示した金型10の加工前の意匠面20に対し、所望の模様に対応してテープ15が貼り付けられる。具体的には、成形する樹脂成形品30の表面模様31が図2(c)に示すようなクロス模様であれば、その表面模様31に対応した模様面21が、図1(b)のようにテープ15を縦横に貼り付けること加工、形成される。 As the processing procedure, first, the tape 15 is attached to the unprocessed design surface 20 of the mold 10 shown in FIG. Specifically, if the surface pattern 31 of the resin molded product 30 to be molded is a cross pattern as shown in FIG. 2C, the pattern surface 21 corresponding to the surface pattern 31 is as shown in FIG. 1B. The tape 15 is processed and formed by attaching the tape 15 vertically and horizontally.

テープ15としてはセロハンテープが好適に用いられる。セロハンテープは難膨潤性であり、溶融状態の熱硬化性樹脂25で膨潤して粘着性が低下する可能性が低いため、樹脂成形に適している。また、セロハンテープは成形温度が100℃程度でも変形しないため、同一模様の複数の樹脂成形品30の繰り返し成形に利用できる。成型温度をさらに高温(例えば、120℃程度)にする場合、ポリイミド製のテープを用いればよい。また、粘着剤付きのアルミテープを用いてもよい。 Cellophane tape is preferably used as the tape 15. Cellophane tape is difficult to swell, and is unlikely to swell with the thermosetting resin 25 in a molten state to reduce its adhesiveness, and is therefore suitable for resin molding. Further, since the cellophane tape does not deform even at a molding temperature of about 100° C., it can be used for repeatedly molding a plurality of resin molded products 30 having the same pattern. When the molding temperature is further increased (for example, about 120° C.), a polyimide tape may be used. Alternatively, an aluminum tape with an adhesive may be used.

また、テープ15の貼り付けにより形成される、樹脂成形品30のテープ模様部33(図2(c)参照)を、全体的に凹凸なく平坦に形成するためには、図1(b)に示すようなテープ15貼り付けを行えばよい。つまり、テープ15の縦横のクロス部分が突出しないように、縦横に配するテープ15のすくなくとも一方が分断された状態に貼り付けられればよい。もちろん、厚みの薄いテープ15を用いる場合などには、縦横に配するテープ15が重なるように貼り付けしてもよい。 Further, in order to form the tape pattern portion 33 (see FIG. 2C) of the resin molded product 30 formed by pasting the tape 15 flat without any unevenness, in FIG. The tape 15 as shown may be attached. That is, in order to prevent the vertical and horizontal cross portions of the tape 15 from protruding, at least one of the vertical and horizontal tapes 15 may be attached in a separated state. Of course, when using a thin tape 15, the tapes 15 arranged vertically and horizontally may be attached so as to overlap each other.

図2(a)(b)に示すように、上記のようにテープ15による加工がなされてなる模様面21を有した上型11と、下型12との間にできる空間に熱硬化性樹脂25が注入され、熱硬化性樹脂25が硬化して樹脂成形品30が成形される。図2(a)(b)に示すように、熱硬化性樹脂25は、模様面21におけるマット面が露出した部位22と、模様面21における貼り付けられたテープ15の外表面23とに跨るように供給される。 As shown in FIGS. 2A and 2B, a thermosetting resin is provided in a space formed between the upper mold 11 and the lower mold 12 having the pattern surface 21 processed by the tape 15 as described above. 25 is injected, the thermosetting resin 25 is cured, and the resin molded product 30 is molded. As shown in FIGS. 2A and 2B, the thermosetting resin 25 extends over the portion 22 of the pattern surface 21 where the matte surface is exposed and the outer surface 23 of the tape 15 attached on the pattern surface 21. As supplied.

このようにして、図2(c)に示すような樹脂成形品30が成形される。この樹脂成形品30の表面には、テープ模様部33と、そのクロス状のテープ模様部33により分離された地模様部32とよりなる表面模様31が形成される。図2(c)の部分拡大正面図に示すように、地模様部32は微細な凹凸が表れ、テープ模様部33は平坦な面として表れる。なお、図2(c)の拡大正面図に示すように、テープ模様部33は、テープ15の厚みにより、周囲の地模様部32よりも凹んだ状態となることもある。 In this way, the resin molded product 30 as shown in FIG. 2C is molded. A surface pattern 31 including a tape pattern portion 33 and a ground pattern portion 32 separated by the cross-shaped tape pattern portion 33 is formed on the surface of the resin molded product 30. As shown in the partially enlarged front view of FIG. 2C, the ground pattern portion 32 has fine irregularities, and the tape pattern portion 33 has a flat surface. As shown in the enlarged front view of FIG. 2C, the tape pattern portion 33 may be recessed from the surrounding ground pattern portion 32 depending on the thickness of the tape 15.

また、テープ15の貼り付け方次第では、図3に示すように、地模様部32およびテープ模様部33のそれぞれが不規則形状の表面模様31を有した樹脂成形品30を成形することもできる。その他、テープ模様部33を枠部分に形成としたものや、テープ模様部33を点在模様としたものなど種々の表面模様のものも、本製造方法により成形することができる。 Further, depending on how to attach the tape 15, as shown in FIG. 3, it is also possible to mold the resin molded product 30 in which each of the ground pattern portion 32 and the tape pattern portion 33 has an irregular surface pattern 31. In addition, various surface patterns such as the tape pattern portion 33 formed in the frame portion and the tape pattern portion 33 in the dotted pattern can be formed by the present manufacturing method.

以上のように、本製造方法によれば、金型10の意匠面20へのテープ15の貼り付けをするだけで、簡単に表面模様31を有した樹脂成形品30を成形することができる。テープ15は簡易に貼り剥がしができるので、同じ金型10を用いて異なる表面模様31の樹脂成形品30を成形することができる。つまり、外形が同じで表面模様31が種々異なる樹脂成形品30を製造したい場合でも、表面模様31におうじて複数の金型10を準備する必要がなく、そのため少量多種生産の場合にも低生産コスト化を図ることができる。もちろん、テープ15を外したのちに、元の意匠面20のままで樹脂成形をすることもできる。 As described above, according to the present manufacturing method, the resin molded product 30 having the surface pattern 31 can be easily formed only by attaching the tape 15 to the design surface 20 of the mold 10. Since the tape 15 can be easily peeled off, the resin mold 30 having different surface patterns 31 can be molded using the same mold 10. In other words, even when it is desired to manufacture resin molded products 30 having the same outer shape but different surface patterns 31, it is not necessary to prepare a plurality of molds 10 for the surface patterns 31, and therefore low production is possible even in the case of small-volume multi-production. Cost can be reduced. Of course, after removing the tape 15, resin molding can be performed with the original design surface 20 as it is.

さらに、テープ15として難膨潤性のものなどの劣化、変形しにくいものを用いれば、同一模様で多数の樹脂成形品30の成形にも利用でき、それによってもさらに低コスト化に寄与することができる。また、難膨潤性のテープ15を用いれば樹脂成形品30の表面模様の品質も一定する。 Furthermore, if a tape that is difficult to deteriorate or deform such as a tape 15 that is difficult to swell is used, it can be used for molding a large number of resin molded products 30 with the same pattern, which also contributes to cost reduction. it can. In addition, the quality of the surface pattern of the resin molded product 30 becomes constant by using the tape 15 which is difficult to swell.

また、光輝性の顔料が含有された熱硬化性樹脂25を用いれば、成形された樹脂成形品30の表面模様31のうちのテープ模様部33は光の反射により光沢が顕著に表出し、めりはりのある表面模様31に仕上げることができる。また、地模様部32の乱反射による独特の意匠を表現することもできる。 Further, when the thermosetting resin 25 containing the luster pigment is used, the tape pattern portion 33 of the surface pattern 31 of the molded resin molded product 30 shows a remarkable gloss due to the reflection of light. It is possible to finish the surface pattern 31 with a stickiness. It is also possible to express a unique design due to the irregular reflection of the ground pattern portion 32.

10 金型
11 上型
12 下型
15 耐熱性粘着テープ(テープ)
20 意匠面
21 模様面
22 マット面が露出した部位
23 耐熱性粘着テープの外表面
25 熱硬化性樹脂
30 樹脂成形品


10 Mold 11 Upper mold 12 Lower mold 15 Heat resistant adhesive tape (tape)
20 Design surface 21 Pattern surface 22 Area where matte surface is exposed 23 Outer surface of heat-resistant adhesive tape 25 Thermosetting resin 30 Resin molded product


Claims (4)

熱硬化性樹脂を金型に供給して成形する樹脂成形品の製造方法において、
前記金型の意匠面はマット加工がなされたマット面とされており、
前記意匠面に所望の形状の耐熱性粘着テープを貼り付けたのち、
前記熱硬化性樹脂を、前記マット面が露出した部位と、前記マット面に貼り付けた前記耐熱性粘着テープの外表面とに跨るように、前記金型内に供給することを特徴とする、樹脂成形品の製造方法。
In a method for producing a resin molded product, which comprises molding a thermosetting resin by supplying it to a mold,
The design surface of the mold is a matte surface that has been matted.
After sticking a heat-resistant adhesive tape of the desired shape on the design surface,
The thermosetting resin is supplied into the mold so as to straddle a portion where the mat surface is exposed and an outer surface of the heat resistant adhesive tape attached to the mat surface. Manufacturing method of resin molded product.
請求項1において、
前記耐熱性粘着テープが難膨潤性を有するテープであることを特徴とする、樹脂成形品の製造方法。
In claim 1,
A method for producing a resin molded product, wherein the heat-resistant adhesive tape is a tape having difficulty in swelling.
請求項1または2において、
前記耐熱性粘着テープがセロハンのテープであることを特徴とする、樹脂成形品の製造方法。
In claim 1 or 2,
A method for producing a resin molded product, wherein the heat-resistant adhesive tape is a cellophane tape.
請求項1〜3のいずれか1項において、
前記熱硬化性樹脂に光輝性の顔料が含有されていることを特徴とする、樹脂成形品の製造方法。


In any one of Claims 1-3,
A method for producing a resin molded product, wherein the thermosetting resin contains a bright pigment.


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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51142072A (en) * 1975-05-31 1976-12-07 Matsushita Electric Works Ltd Manufacture of uneven surfaced decorated plate
JP2003261126A (en) * 2002-03-01 2003-09-16 Toyo Seikan Kaisha Ltd Plastic container and production method for the container
JP2012187729A (en) * 2011-03-08 2012-10-04 Polyplastics Co Method for producing injection molding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51142072A (en) * 1975-05-31 1976-12-07 Matsushita Electric Works Ltd Manufacture of uneven surfaced decorated plate
JP2003261126A (en) * 2002-03-01 2003-09-16 Toyo Seikan Kaisha Ltd Plastic container and production method for the container
JP2012187729A (en) * 2011-03-08 2012-10-04 Polyplastics Co Method for producing injection molding

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