JPH0414858B2 - - Google Patents
Info
- Publication number
- JPH0414858B2 JPH0414858B2 JP61273121A JP27312186A JPH0414858B2 JP H0414858 B2 JPH0414858 B2 JP H0414858B2 JP 61273121 A JP61273121 A JP 61273121A JP 27312186 A JP27312186 A JP 27312186A JP H0414858 B2 JPH0414858 B2 JP H0414858B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- mold
- molding die
- resin
- molded article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 50
- 238000000465 moulding Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005034 decoration Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 24
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- -1 polybutylene terephthalate Polymers 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、射出成形と同時に成形物品の表面に
転写によつてパターン層を形成するようにした成
形同時加飾物品の製造法に関するものである。よ
り詳しくは、本発明は、密着性が良好なパターン
を成形物品の表面に形成すると共に、反りや捩じ
れのない成形精度の高い成形物品を得ることがで
きる成形同時加飾物品の製造法に関するものであ
る。従つて、本発明は、例えばパターン層が電気
回路パターン層である印刷配線板の製造法として
特に好適なものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for producing a decorated article at the same time as injection molding, in which a pattern layer is formed on the surface of the molded article by transfer at the same time as injection molding. be. More specifically, the present invention relates to a method for manufacturing an article decorated at the same time as molding, which can form a pattern with good adhesion on the surface of the molded article, and can obtain a molded article with high molding accuracy without warping or twisting. It is. Therefore, the present invention is particularly suitable as a method for manufacturing printed wiring boards in which the pattern layer is an electric circuit pattern layer, for example.
従来、成形同時加飾物品の製造法としては、パ
ターン層を有する加飾シートを成形用金型内の所
定の箇所にセツトし、型締めを行い、成形用金型
のキヤビテイ内に溶融樹脂を射出し、溶融樹脂の
冷却固化後型開きを行い、成形用金型から成形物
品を取り出すようにした方法があつた。この方法
を利用して印刷配線板を製造する方法が、特開昭
60−121792号公報に開示されてい。この発明は、
剥離性を有する基体シート上に電気回路パターン
が形成された加飾シートを射出成形用金型内に載
置し、その後、溶融した耐熱性の熱可塑性樹脂を
該金型内に射出することにより前記電気回路パタ
ーンを成形された基板上に設け、しかる後、前記
基体シートを剥離することを特徴とする印刷配線
板の製造方法である。
Conventionally, the method for manufacturing decorative articles at the same time as molding involves setting a decorative sheet with a pattern layer at a predetermined location in a mold, clamping the mold, and pouring molten resin into the cavity of the mold. There is a method in which the mold is opened after injection, the molten resin is cooled and solidified, and the molded article is taken out from the mold. A method for manufacturing printed wiring boards using this method was published in JP-A-Sho.
It is disclosed in Publication No. 60-121792. This invention is
A decorative sheet with an electrical circuit pattern formed on a removable base sheet is placed in an injection mold, and then a molten heat-resistant thermoplastic resin is injected into the mold. This method of manufacturing a printed wiring board is characterized in that the electric circuit pattern is provided on a molded substrate, and then the base sheet is peeled off.
しかし、前記した従来の成形同時加飾物品の製
造法には、次のような問題点があつた。即ち、成
形と同時に成形物品の表面にパターン層を転写に
よつて形成する樹脂形成技術においては、成形用
金型内にセツトされた加飾シートにつて、キヤビ
テイ内に射出された溶融樹脂の熱量が奪われるこ
とになる。その為、単なる樹脂形成の技術に比べ
て、溶融樹脂の流動性の悪くなることが避けられ
なかつた。成形物品の薄肉の場合、成型物品に立
ち上がりがある場合、成形樹脂の溶融樹脂が高い
場合、成形樹脂の溶融温度が高い場合、成形樹脂
内にフイラーを含有する場合などは、溶融樹脂の
流動性を一層阻害することになつていた。このよ
うな溶融樹脂の流動性の悪さは、次のような問題
点をもたらしていた。つまり、成形用金型のキヤ
ビテイ内が溶融樹脂で充填される際に、溶融樹脂
に加わる圧力が不均一となり、また加飾シートの
接着層が流される。その結果、成形物品とその表
面に転写されたパターン層との密着性が不十分に
なるという問題点があつた。この密着性を向上さ
せる目的で、成形後に熱処理が施されることがあ
るが、その効果が少ないだけでなく、成形時に生
じた潜在的な残留歪みがかかる熱処理によつて現
出する恐れがあつた。
However, the above-mentioned conventional method for manufacturing a molded and decorated article has the following problems. In other words, in the resin forming technology in which a pattern layer is formed on the surface of a molded article by transfer at the same time as molding, the amount of heat of the molten resin injected into the cavity is will be taken away. Therefore, it was inevitable that the fluidity of the molten resin would be poorer than in a simple resin forming technique. When the molded article is thin, when the molded article rises, when the molten resin of the molded resin is high, when the melting temperature of the molded resin is high, when the molded resin contains filler, etc., the fluidity of the molten resin may be affected. It was supposed to further impede the Such poor fluidity of the molten resin has brought about the following problems. That is, when the cavity of the mold is filled with molten resin, the pressure applied to the molten resin becomes uneven, and the adhesive layer of the decorative sheet is washed away. As a result, there was a problem in that the adhesion between the molded article and the pattern layer transferred to the surface of the molded article was insufficient. In order to improve this adhesion, heat treatment is sometimes performed after molding, but not only is the effect small, but there is a risk that the latent residual distortion that occurred during molding may be revealed by the heat treatment. Ta.
また、溶融樹脂を冷却固化させる際に、加飾シ
ートに接する面とそうでない面との間に冷却温度
に差が生じる。その結果、成形物品に反りや捩じ
れが発生し易やすいという問題点があつた。 Further, when the molten resin is cooled and solidified, there is a difference in cooling temperature between the surface that is in contact with the decorative sheet and the surface that is not. As a result, a problem arises in that the molded article is likely to warp or twist.
そこで、このような問題点の発生を防ぐ為に
は、極めてシビアーな成形条件を設定する必要が
あり、歩留り率が悪くならざるを得なかつた。 Therefore, in order to prevent the occurrence of such problems, it is necessary to set extremely severe molding conditions, which inevitably results in a poor yield rate.
本発明は、前記した従来法の問題点に鑑み、
種々研究を重ねた結果、遂に本発明を完成するに
至つたのである。即ち、本発明に係る成形同時加
飾物品の製造法は、次の諸工程を順次経ることを
特徴とするものである。
In view of the problems of the conventional method described above, the present invention
As a result of various studies, the present invention was finally completed. That is, the method for manufacturing a molding-and-decoration article according to the present invention is characterized by sequentially performing the following steps.
パターン層Ｐを有する加飾シート１を成形用
金型２内の所定の箇所にセツトする工程
成形用金型２を金型タツチの状態とする工程
成形用金型２のキヤビテイ３内に溶融樹脂４
を射出する工程
成形用金型２を型締めする工程
溶融樹脂４の冷却固化を待つて成形用金型２
の型開きを行う工程
成形用金型２から成形物品を取り出す工程
次に、本発明に係る成形同時加飾物品の製造法
の各工程について、図面を参照しながらさらに詳
しく説明する。 A process of setting the decorative sheet 1 having the pattern layer P at a predetermined location in the molding die 2 A process of bringing the molding die 2 into a mold-touch state A process of placing the molten resin in the cavity 3 of the molding die 2 4
The process of injecting the molding die 2 The process of clamping the molding die 2 Waiting for the molten resin 4 to cool and solidify, and then closing the molding die 2
Step of opening the mold Step of taking out the molded article from the molding die 2 Next, each step of the method for manufacturing a molding-and-decoration article according to the present invention will be described in more detail with reference to the drawings.
本発明の第１工程は、パターン層Ｐをする加飾
シート１を成形用金型２内の所定の箇所にセツト
する工程である。 The first step of the present invention is the step of setting the decorative sheet 1 forming the pattern layer P at a predetermined location within the molding die 2.
加飾シート１としては、成形と同時に成形物品
の表面にパターン層を転写によつて形成する樹脂
成形技術において一般的に使用されているものを
使用すればよい。このような加飾シート１として
は、転写シートとインサートシートとがある。転
写シートの基本的な層構成は、剥離性を有する基
体シート上にパターン層Ｐを設け、の上に必要に
よつて接着層を設けてなるものである。また、イ
ンサートシートの基本的な層構成は、基体シート
上に剥離層を設けることなく直接パターン層Ｐを
設け、反対面に必要によつて接着層を設けてなる
ものである。パターン層Ｐは成形物品の用途によ
つて種々のパターンとされ、例えば用途が印刷配
線板の場合には電気回路パターンが形成され、用
途が装飾板の場合には特定された絵柄パターンが
形成される。加飾シート１が転写シートの場合に
は、基体シートと反対の面が溶融樹脂と接する側
に位置するように固定される。また、加飾シート
１がインサートシートの場合には、接着層の面が
溶融樹脂と接する側に位置するように固定され
る。なお、加飾シート１を２枚使用し、成形物品
の表裏両面にパターン層Ｐを形成するようにして
もよい。 As the decorative sheet 1, those commonly used in resin molding technology in which a pattern layer is formed on the surface of a molded article by transfer at the same time as molding may be used. Such decorative sheets 1 include transfer sheets and insert sheets. The basic layer structure of the transfer sheet is such that a pattern layer P is provided on a base sheet having releasability, and an adhesive layer is provided thereon if necessary. Further, the basic layer structure of the insert sheet is such that the pattern layer P is provided directly on the base sheet without providing a release layer, and an adhesive layer is provided on the opposite side as necessary. The pattern layer P has various patterns depending on the purpose of the molded article. For example, when the purpose is a printed wiring board, an electric circuit pattern is formed, and when the purpose is a decorative board, a specified picture pattern is formed. Ru. When the decorative sheet 1 is a transfer sheet, it is fixed so that the surface opposite to the base sheet is located on the side that comes into contact with the molten resin. Moreover, when the decorative sheet 1 is an insert sheet, it is fixed so that the surface of the adhesive layer is located on the side that comes into contact with the molten resin. Note that two decorative sheets 1 may be used to form the pattern layer P on both the front and back surfaces of the molded article.
また、図面における成形用金型２は、下側の固
定型と上側の可動型とから構成されているが、必
要により下側がコア型であつてもよい。 Furthermore, although the molding die 2 in the drawings is composed of a lower fixed mold and an upper movable mold, the lower part may be a core mold if necessary.
第２工程は、成形用金型２を金型タツチの状態
とする工程である（第１図参照）。金型タツチと
は、成形用金型の移動によりキヤビテイが形成さ
れ、そこに溶融樹脂の充填が可能な状態であつ
て、しかも型締め力が０Kg／cm2の状態をいう。 The second step is a step of bringing the molding die 2 into the mold-touch state (see FIG. 1). Mold touch refers to a state in which a cavity is formed by the movement of a molding die, the cavity can be filled with molten resin, and the mold clamping force is 0 kg/cm 2 .
第３工程は、成形用金型２のキヤビテイ３内に
溶融樹脂４を射出する工程である。このキヤビテ
イ３は、成形物品の肉厚よりも厚くなつており、
次工程で型締めすることにより成形物品の肉厚と
同一とされる。溶融樹脂４としては、この種の樹
脂成形技術において使用されるABS樹脂、ポリ
カーボネート樹脂、ポリアクリル樹脂、ポリスチ
ロール樹脂、ポリアミド系・ポリエステル系・ウ
レタン系・スチレン系・オレフイン系の熱可塑性
エラストマー樹脂等の他に耐熱性や電気特性を持
つたポリエーテルサルホン、ポリエーテルイミ
ド、ポリエーテルエーテルケトン、ポリサルホ
ン、ポリアリレート、ポリブチレンテレフタレー
ト、ポリエチレンテレフタレート等の使用が可能
である。なお、この工程を実施するに当つての金
型や樹脂の温度は、成形樹脂の種や成形物品の形
状により異なるが、金型温度はおよそ40〜150℃
とされ、樹脂温度は200〜450℃の範囲とされる。 The third step is a step of injecting the molten resin 4 into the cavity 3 of the molding die 2. This cavity 3 is thicker than the wall thickness of the molded article,
By clamping the mold in the next step, the thickness is made the same as that of the molded article. Examples of the molten resin 4 include ABS resin, polycarbonate resin, polyacrylic resin, polystyrene resin, polyamide-based, polyester-based, urethane-based, styrene-based, and olefin-based thermoplastic elastomer resins used in this type of resin molding technology. In addition, it is possible to use polyethersulfone, polyetherimide, polyetheretherketone, polysulfone, polyarylate, polybutylene terephthalate, polyethylene terephthalate, etc., which have heat resistance and electrical properties. The temperature of the mold and resin when carrying out this process varies depending on the type of molding resin and the shape of the molded article, but the mold temperature is approximately 40 to 150 degrees Celsius.
The resin temperature is assumed to be in the range of 200 to 450°C.
第４工程は、成形用金型２を型締めする工程で
ある（第２図参照）。この工程が本発明において
最も重要な点である。前工程により成形用金型２
のキヤビテイ３内にまんべんなく行き渡るように
溶融樹脂が射出された後、直ちに型締めを行なう
ことによつて溶融樹脂４を圧縮し、目的とする成
形物品を得る。このとき、溶融樹脂４の射出用ノ
ズル５の先端は、当然のことながら閉じられてい
る（図示せず）。型締力は、成形樹脂の種類や成
形物品の形状により異なる。また、型締力の加え
方として始めは弱く、次に強い力が加わるように
２段階以上の段階をつけて圧縮することも可能で
ある。 The fourth step is a step of clamping the molding die 2 (see FIG. 2). This step is the most important point in the present invention. Molding mold 2 due to the previous process
After the molten resin is injected evenly into the cavity 3, the mold is immediately clamped to compress the molten resin 4 and obtain the desired molded article. At this time, the tip of the nozzle 5 for injecting the molten resin 4 is naturally closed (not shown). The mold clamping force varies depending on the type of molding resin and the shape of the molded article. Furthermore, it is also possible to apply mold clamping force in two or more stages, such that a weak force is applied at first and then a strong force is applied.
第５工程は、溶融樹脂４の冷却固化を待つて成
形用金型２の型開きを行う工程である。また、第
６工程は、成形用金型２から成形物品を取り出す
工程である。これらの工程は、従来のこの種の樹
脂成形技術におけると同じである。なお、加飾シ
ート１が転写シートである場合には、基体シート
を剥離する工程が必要である。加飾シートがイン
サートシートである場合には、インサートシート
は成形物品と一体化される。 The fifth step is a step in which the molding die 2 is opened after the molten resin 4 is cooled and solidified. Further, the sixth step is a step of taking out the molded article from the molding die 2. These steps are the same as in conventional resin molding techniques of this type. Note that when the decorative sheet 1 is a transfer sheet, a step of peeling off the base sheet is required. When the decorative sheet is an insert sheet, the insert sheet is integrated with the molded article.
〔実施例〕 次に、本発明を実施例に基づき説明する。〔Example〕 Next, the present invention will be explained based on examples.
実施例 １
厚さ25μmのポリエチレンテレフタレートフイ
ルムからなる基体シート上に、エポキシ樹脂から
なる剥離層を形成し、次いでフエノール樹脂から
なるバインダーを含む熱硬化型銅ペーストを用い
て電気回路パターン層を形成し、これを硬化させ
た。次いで、その上にポリイミド系樹脂からなる
インキを用いて接着層を形成し、転写シートを作
成した。Example 1 A release layer made of epoxy resin was formed on a base sheet made of polyethylene terephthalate film with a thickness of 25 μm, and then an electric circuit pattern layer was formed using a thermosetting copper paste containing a binder made of phenolic resin. , this was cured. Next, an adhesive layer was formed thereon using ink made of a polyimide resin to prepare a transfer sheet.
この転写シートを、成形用金型内に位置合わせ
をしてセツトし、金型タツチの状態で、成形用金
型のキヤビテイ内にポリエチレンテレフタレート
樹脂を下記条件で射出した。 This transfer sheet was aligned and set in a mold, and with the mold touching, polyethylene terephthalate resin was injected into the cavity of the mold under the following conditions.
射出条件（日本製鋼所製射出成型機：JT70−
40V使用）
金型温度 100℃
シリンダー温度 NH：260℃，H2：275℃，
H1：265℃
射出圧力 580Kg／cm2
射速度 99％
次いで、800Kg／cm2で型締めを行い、ポリエチ
レンテレフタレート樹脂の冷却固化を待つて型開
きを行い、成形物品を取り出した。その後、基体
シートを剥離してポリエチレンテレフタレート樹
脂の印刷配線板を得た。 Injection conditions (Japan Steel Works injection molding machine: JT70−
40V used) Mold temperature 100℃ Cylinder temperature NH: 260℃, H2: 275℃,
H1: 265° C. Injection pressure: 580 Kg/cm 2 Injection speed: 99% Next, the mold was clamped at 800 Kg/cm 2 , and after waiting for the polyethylene terephthalate resin to cool and solidify, the mold was opened and the molded article was taken out. Thereafter, the base sheet was peeled off to obtain a printed wiring board made of polyethylene terephthalate resin.
得られた印刷配線板は、パターン層の剥離もな
く、密着は強固であつた。また、150℃にて30分
間熱処理を施しても、印刷配線板は反り、捩じれ
を生じなかつた。 In the obtained printed wiring board, there was no peeling of the pattern layer, and the adhesion was strong. Furthermore, even when heat treated at 150° C. for 30 minutes, the printed wiring board did not warp or twist.
実施例 ２
厚さ25μmのポリイミドフイルムからなる基体
シート上に、エポキシ樹脂からなる熱硬化型銀ペ
ーストを用いて電気回路パターン層を形成し、こ
れを硬化させた。次いで、その反対面にポリウレ
タン系樹脂からなるインキを用いて接着層を形成
し、インサートシートを作成した。Example 2 An electric circuit pattern layer was formed on a base sheet made of polyimide film having a thickness of 25 μm using a thermosetting silver paste made of epoxy resin, and the layer was cured. Next, an adhesive layer was formed on the opposite surface using ink made of a polyurethane resin to prepare an insert sheet.
このインサートシートを、実施例１と同様に成
形用金型内にセツトし、ポリエチレンテレフタレ
ート樹脂を用いて射出成形してインサート成形物
品を得た。 This insert sheet was set in a molding die in the same manner as in Example 1, and injection molded using polyethylene terephthalate resin to obtain an insert molded article.
このインサート成形物品は、加飾シートの剥離
もなく、密着性が良好であつた。また、150℃に
て30分間熱処理を施しても、インサート成形物品
は反り、捩じれを生じなかつた。 This insert-molded article had good adhesion without peeling of the decorative sheet. Further, even when heat-treated at 150°C for 30 minutes, the insert-molded article did not warp or twist.
本発明は以上の構成よりなるから、次の諸効果
を得ることができる。即ち、金型タツチの状態で
溶融樹脂を射出し、型締めによつて加圧するの
で、樹脂の流動性の悪さをカバーすることができ
る。つまり、射出時のキヤビテイが冷却固化時の
それよりも広いので、その分樹脂の流動性は改善
される。その結果、溶融樹脂のキヤビテイへの射
出を低圧で行うことが可能となるので、樹脂成形
の条件に余裕ができる。その為、成形物品が薄肉
の場合、成形物品に立ち上がりがある場合、成形
樹脂の溶融粘度が高い場合、成形樹脂の溶融温度
が高い場合、成形樹脂内にフイラーを含有する場
合などに好適である。また、均一に加圧されるの
で、成形物品の表面とパターン層との密着を強に
行わせることができる。また、溶融樹脂に均一な
圧力をかけることができるので、成形物品に反り
や捩じれがない成形精度の高い成形物品を得るこ
とができる。さらに、成形物品の表面とパターン
層との密着性を向上させる為に成形後に熱処理を
施しても、残留ひずみによる反りや捩じれを生じ
ない。
Since the present invention has the above configuration, the following effects can be obtained. That is, since the molten resin is injected while the mold is in contact and pressurized by clamping the mold, poor fluidity of the resin can be compensated for. In other words, since the cavity during injection is wider than that during cooling and solidification, the fluidity of the resin is improved accordingly. As a result, it becomes possible to inject the molten resin into the cavity at low pressure, allowing for more flexibility in resin molding conditions. Therefore, it is suitable when the molded article is thin, when the molded article has a rise, when the melt viscosity of the molded resin is high, when the melting temperature of the molded resin is high, when a filler is contained in the molded resin, etc. . Further, since the pressure is applied uniformly, it is possible to strongly adhere the surface of the molded article and the pattern layer. Further, since uniform pressure can be applied to the molten resin, a molded article with high molding accuracy can be obtained without warping or twisting. Furthermore, even if heat treatment is performed after molding to improve the adhesion between the surface of the molded article and the pattern layer, warping or twisting due to residual strain will not occur.
第１図は本発明に係る成形同時加飾物品の製造
法に用いる成形用金型の金型タツチの状態を示す
断面説明図、第２図は本発明に係る成形同時加飾
物品の製造法に用いる成形用金型の型締め状態を
示す断面説明図を示す。
図中、Ｐ……パターン層、１……加飾シート、
２……成形用金型、３……キヤビテイ、４……溶
融樹脂。
FIG. 1 is an explanatory cross-sectional view showing the state of the mold touch of a mold used in the method for producing a simultaneously molded and decorated article according to the present invention, and FIG. 2 is a method for manufacturing a simultaneously molded and decorated article according to the present invention. Fig. 2 is an explanatory cross-sectional view showing a mold clamping state of a mold used for molding. In the figure, P...pattern layer, 1...decoration sheet,
2... Molding die, 3... Cavity, 4... Molten resin.
Claims (1)
同時加飾物品の製造法。 パターン層Ｐを有する加飾シート１を成形用
金型２内の所定の箇所にセツトする工程 成形用金型２を金型タツチの状態とする工程 成形用金型２のキヤビテイ３内に溶融樹脂４
を射出する工程 成形用金型２を型締めする工程 溶融樹脂４の冷却固化を待つて成形用金型２
の型開きを行う工程 成形用金型２から成形物品を取り出す工程。 ２ 加飾シート１が転写シートである特許請求の
範囲第１項に記載の成形同時加飾物品の製造法。 ３ 加飾シート１がインサートシートである特許
請求の範囲第１項に記載の成形同時加飾物品の製
造法。 ４ 加飾シート１が２枚であつて、それらが成型
物品の表裏両面に位置するように成型用金型内に
セツトされる特許請求の範囲第１項に記載の成形
同時加飾物品の製造法。[Scope of Claims] 1. A method for manufacturing a molding-and-decoration article, characterized by sequentially performing the following steps. A process of setting the decorative sheet 1 having the pattern layer P at a predetermined location in the molding die 2 A process of bringing the molding die 2 into a mold-touch state A process of placing the molten resin in the cavity 3 of the molding die 2 4
The process of injecting the molding die 2 The process of clamping the molding die 2 Waiting for the molten resin 4 to cool and solidify, and then closing the molding die 2
Step of opening the mold Step of taking out the molded article from the molding die 2. 2. The method for manufacturing a molding and decorating article according to claim 1, wherein the decorative sheet 1 is a transfer sheet. 3. The method for producing a molded and decorated article according to claim 1, wherein the decorative sheet 1 is an insert sheet. 4. Production of an article decorated at the same time as molding according to claim 1, wherein two decorative sheets 1 are set in a mold for molding so that they are located on both the front and back sides of the molded article. Law.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27312186A JPS63126712A (en) | 1986-11-17 | 1986-11-17 | Manufacture of mold with simultaneous in-mold decoration |
| DE3689772T DE3689772T2 (en) | 1985-12-28 | 1986-12-26 | TRANSFER MATERIAL FOR PRINTED CIRCUIT BOARD, AND PREPARED PRINTED CIRCUIT BOARD FOR USE OF THIS TRANSFER MATERIAL AND METHOD FOR THE PRODUCTION THEREOF. |
| PCT/JP1986/000654 WO1987004315A1 (en) | 1985-12-28 | 1986-12-26 | Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof |
| EP87900284A EP0253892B1 (en) | 1985-12-28 | 1987-07-21 | Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27312186A JPS63126712A (en) | 1986-11-17 | 1986-11-17 | Manufacture of mold with simultaneous in-mold decoration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63126712A JPS63126712A (en) | 1988-05-30 |
| JPH0414858B2 true JPH0414858B2 (en) | 1992-03-16 |
Family
ID=17523421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27312186A Granted JPS63126712A (en) | 1985-12-28 | 1986-11-17 | Manufacture of mold with simultaneous in-mold decoration |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63126712A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08336860A (en) * | 1995-06-14 | 1996-12-24 | Idemitsu Petrochem Co Ltd | Manufacture of partially laminated molding, mold and manufacturing device therefor |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0531755A (en) * | 1991-07-17 | 1993-02-09 | Kouno Plast Kogyo Kk | Manufacture of three-dimensional molded material surface processed with decorative film |
| JP3379546B2 (en) * | 1993-04-13 | 2003-02-24 | 三菱瓦斯化学株式会社 | Manufacturing method of patterned molded products |
| JP5442927B2 (en) * | 2006-08-18 | 2014-03-19 | Ｓａｂｉｃイノベーティブプラスチックスジャパン合同会社 | Molding method for producing multilayer molded products |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60212312A (en) * | 1984-04-06 | 1985-10-24 | Toyota Motor Corp | Manufacture of laminated molding |
-
1986
- 1986-11-17 JP JP27312186A patent/JPS63126712A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60212312A (en) * | 1984-04-06 | 1985-10-24 | Toyota Motor Corp | Manufacture of laminated molding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08336860A (en) * | 1995-06-14 | 1996-12-24 | Idemitsu Petrochem Co Ltd | Manufacture of partially laminated molding, mold and manufacturing device therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63126712A (en) | 1988-05-30 |
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