JP2020097793A5 - - Google Patents

Claims (7)

It has a composition in which one or more of Ni and Co are contained in a total amount of 1.0 to 5.0% by mass, and Si is contained in an amount of 0.1 to 1.5% by mass, and the balance is Cu and unavoidable impurities.
Conductivity is 38% IACS or higher,
A value obtained from the nominal stress-nominal strain curve obtained by performing a tensile test on three types of test pieces cut out in each of the rolling parallel direction, the direction of 45 ° with respect to the rolling direction, and the rolling vertical direction. And, by substituting the value of the Cube azimuth area ratio obtained by the electron rear scattering diffraction (EBSD) method into the following equation (1), in each direction of the parameter Ax (x: 0 °, 45 °, 90 °). The arithmetic average value calculated by obtaining _{the values A 0 °} , A _{45 °} and A _{90 °} and substituting the obtained values A _{0 °} , A _{45 °} and A _{90 °} in each direction into the following equation (2). Aave. is Ri range der of 4.0~13.0GPa ·%, and the arithmetic average value Aave. and the parameters Bx (x where the value of the parameter Ax is calculated by substituting the following equation (3) : 0 °, 45 °, the copper alloy sheet wherein the respective directions of the value _{B 0 °,} B _{45 °} and _{B 90 °} are both characterized by Rukoto Do and 10% or less of 90 °).

However, _Sc : Cube azimuth area ratio (%), σ _n represents the nominal stress (GPa), ε _n represents the nominal strain (%), and EL represents the elongation at break (%).

Claimed that the composition further contains at least one component selected from the group consisting of Sn, Mg, Mn, Cr, Zr, Ti, Fe and Zn in an amount of 0.2 to 1.2% by mass or less in total. copper alloy sheet according to 1. A drawn product obtained by drawing the copper alloy plate material according to claim 1 or 2. A member for electrical / electronic parts manufactured by using the copper alloy plate material according to claim 1 or 2 or the drawn product according to claim 3. An electromagnetic wave shielding material produced by using the copper alloy plate material according to claim 1 or 2 or the drawn product according to claim 3. A heat-dissipating component manufactured by using the copper alloy plate material according to claim 1 or 2 or the drawn product according to claim 3. The method for producing a copper alloy plate according to claim 1 or 2.
Casting [process 1], homogenization treatment [process 2], hot rolling [process 3], face milling [process 4], cold rolling [process 5], solution heat treatment [process 6], Intermediate heat treatment [step 7], finish cold rolling [step 8], straightening [step 9], and temper tempering [step 10] are performed in sequence.
Wherein the maximum temperature T _R of the rolled upon material in the finish cold rolling [step 8], and controls the 75 ° C. or higher 100 ° C. or less,
The elongation rate δ of the material in the straightening [step 9] is set to 0.1 to 1.0%, and
_A copper alloy plate material characterized in that the material temperature TA (° C.) of the temper annealing [step 10] is controlled so as to satisfy the relationship of the inequality shown in the following equation (5) in relation to the elongation rate δ. Manufacturing method.
_{55 × δ + 450 ≧ T A} ≧ 55 × δ + 350 ··· (5)