JP2020092258A - 熱伝導性の接続要素および接続要素の使用法 - Google Patents
熱伝導性の接続要素および接続要素の使用法 Download PDFInfo
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- JP2020092258A JP2020092258A JP2019199773A JP2019199773A JP2020092258A JP 2020092258 A JP2020092258 A JP 2020092258A JP 2019199773 A JP2019199773 A JP 2019199773A JP 2019199773 A JP2019199773 A JP 2019199773A JP 2020092258 A JP2020092258 A JP 2020092258A
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- connecting element
- heat
- thermally conductive
- conductive connecting
- component
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- 239000000835 fiber Substances 0.000 claims abstract description 33
- 239000002717 carbon nanostructure Substances 0.000 claims abstract description 29
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 10
- 238000009826 distribution Methods 0.000 claims abstract description 10
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 230000001419 dependent effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000009529 body temperature measurement Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D1/00—Woven fabrics designed to make specified articles
- D03D1/0088—Fabrics having an electronic function
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/24—Thermal properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018218830.0 | 2018-11-05 | ||
| DE102018218830.0A DE102018218830B4 (de) | 2018-11-05 | 2018-11-05 | Wärmeleitendes Verbindungselement, dessen Verwendung, Kühlanordnung und Wärmeverteilungsanordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2020092258A true JP2020092258A (ja) | 2020-06-11 |
Family
ID=70469906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019199773A Pending JP2020092258A (ja) | 2018-11-05 | 2019-11-01 | 熱伝導性の接続要素および接続要素の使用法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2020092258A (de) |
| CN (1) | CN111148402A (de) |
| DE (1) | DE102018218830B4 (de) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10327530A1 (de) * | 2003-06-17 | 2005-01-20 | Electrovac Gesmbh | Vorrichtung mit wenigstens einer von einem zu kühlenden Funktionselement gebildeten Wärmequelle, mit wenigstens einer Wärmesenke und mit wenigstens einer Zwischenlage aus einer thermischen leitenden Masse zwischen der Wärmequelle und der Wärmesenke sowie thermische leitende Masse, insbesondere zur Verwendung bei einer solchen Vorrichtung |
| JP3948000B2 (ja) * | 2003-08-26 | 2007-07-25 | 松下電器産業株式会社 | 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム |
| EP2112249A1 (de) | 2005-05-26 | 2009-10-28 | Nanocomp Technologies, Inc. | Systeme und Verfahren zum Wärmemanagement elektronischer Bauteile |
| DE102008012645A1 (de) | 2008-03-05 | 2009-09-10 | Robert Bosch Gmbh | Gehäuse mit Kühler für Leistungselektronik |
| JP2011033479A (ja) * | 2009-07-31 | 2011-02-17 | Mitsubishi Materials Corp | 温度センサ |
| JP5788731B2 (ja) * | 2011-07-29 | 2015-10-07 | 帝人デュポンフィルム株式会社 | 高熱伝導性粘着テープ基材用二軸延伸熱可塑性樹脂フィルムおよびそれからなる高熱伝導性粘着テープ |
| CN103178027B (zh) | 2011-12-21 | 2016-03-09 | 清华大学 | 散热结构及应用该散热结构的电子设备 |
| DE102013219688B3 (de) | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung |
| JP6070525B2 (ja) * | 2013-12-06 | 2017-02-01 | 株式会社デンソー | 熱輸送装置 |
| DE102015202300A1 (de) | 2015-02-10 | 2016-08-11 | Robert Bosch Gmbh | Wärmetransferblech |
| DE102016209858A1 (de) | 2016-06-06 | 2017-12-07 | Robert Bosch Gmbh | Elektronische Baugruppe, insbesondere für Elektrofahrzeuge oder Hybridfahrzeuge |
| DE102016220553A1 (de) | 2016-10-20 | 2018-04-26 | Robert Bosch Gmbh | Leistungsmodul |
-
2018
- 2018-11-05 DE DE102018218830.0A patent/DE102018218830B4/de active Active
-
2019
- 2019-11-01 JP JP2019199773A patent/JP2020092258A/ja active Pending
- 2019-11-04 CN CN201911066439.3A patent/CN111148402A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE102018218830B4 (de) | 2022-09-29 |
| CN111148402A (zh) | 2020-05-12 |
| DE102018218830A1 (de) | 2020-05-07 |
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