JP2020088196A - Wiring board and electronic device - Google Patents

Abstract

To provide a wiring board and the like that can increase the degree of parallelism between an electronic component to be mounted and an optical member.SOLUTION: A wiring board comprises: an insulating substrate 1 that is formed of ceramics and has a first surface 11 the center part of which is a mounting area for an electronic component; concave parts 1a that are provided in the first surface 11 of the insulating substrate 1; and connection pads 2 that are provided on bottom faces of the concave parts 1a. The first surface 11 includes a frame body that is joined to a wiring board 10 being a polished surface and an outer edge part of the first surface 11 and surrounds the mounting area and the connection pads 2.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a wiring board and an electronic device to which an electronic component such as an image sensor is mounted and optical members such as a lens and a lid are joined.

An electronic component such as an image pickup element, an optical member such as a lens arranged so as to overlap with these, an IR (Infrared Rays: Infrared) cut filter, an optical lid such as an AR (Anti-Reflection: antireflection) film, etc. There is an electronic device provided with. As such an electronic device, for example, an infrared imaging element is housed and mounted as an electronic component in a recess provided in the center of a wiring board, and an antireflection film or an infrared absorption film is provided so as to close the opening of the recess. There is one in which an electronic component is hermetically sealed by joining a lens-shaped lid optical member (see, for example, Patent Document 1). In addition, a frame is joined to a flat wiring substrate to form a substrate having a concave portion, an image pickup device is mounted as an electronic component in the frame, and an IR cut filter is adhered so as to cover the opening of the frame, and further outside thereof. There is one in which a lens holder is joined (see, for example, Patent Document 2).

JP, 2014-186006, A JP, 2014-132644, A

Along with the miniaturization of electronic devices, in particular, the reduction in thickness thereof, higher precision is required for the parallelism between the optical member and the electronic component. For that purpose, it is necessary to increase the parallelism between the surface on which the electronic component of the wiring board is mounted and the surface on which the optical member is mounted. It is possible to increase parallelism by polishing these two surfaces, but in the case of a wiring board having a recess as described in Patent Document 1, the surface on which other electronic components are mounted is the bottom of the recess. Therefore, it was difficult to polish. Further, even when the frame body is bonded to the flat wiring board as described in Patent Document 2, when the mounting surface of the electronic component is polished, the connection pad electrically connected to the electronic component is also polished. However, there is a problem that the connection pad is lost and it becomes impossible to connect the electronic component. In particular, when the wiring substrate is an insulating substrate made of ceramics and wiring is provided, the connection pads are made firmly by co-firing with the insulating substrate. There is a risk that the strength of the pad will decrease and the cost will increase.

A wiring board according to an aspect of the present disclosure includes an insulating substrate made of ceramics having a first surface whose central portion is a mounting area for electronic components, a concave portion provided on the first surface of the insulating substrate, and the concave portion. And a connection pad provided on the bottom surface of the first surface, and the first surface is a polishing surface.

An electronic device according to an aspect of the present disclosure includes a wiring board having the above configuration, an electronic component mounted in the mounting area of the wiring board and electrically connected to the connection pad, and the first wiring board. An optical member is provided which is joined to the outer edge of the surface and overlaps with the electronic component.

According to the wiring board of one aspect of the present disclosure, because of the above-described configuration, the parallelism between the mounting surface of the electronic component whose flatness has been increased by polishing and the optical member arranged thereon can be increased. , The wiring board in which the connection pads are firmly joined.

According to the electronic device of one aspect of the present disclosure, since the wiring board having the above configuration is included, the electronic device has a high degree of parallelism between the electronic component and the optical member and is excellent in optical characteristics.

It is a perspective view which shows an example of a wiring board, (a) is a perspective view from the 1st surface side, (b) is a perspective view from the 2nd surface side. (A) is a plan view of the wiring board shown in FIG. 1, and (b) is a cross-sectional view taken along line BB of (a). It is a perspective view which shows another example of a wiring board, (a) is a perspective view from the 1st surface side, (b) is a perspective view from the 2nd surface side. (A) is a plan view of the wiring board shown in FIG. 3, and (b) is a cross-sectional view taken along line BB of (a). An example of an electronic device is shown, (a) is a perspective view, (b) is sectional drawing in the BB line of (a). FIG. 10A is a perspective view, and FIG. 9B is a cross-sectional view taken along line BB of FIG. FIG. 10A is a perspective view, and FIG. 9B is a cross-sectional view taken along line BB of FIG. FIG.

A wiring board and an electronic device according to embodiments of the present invention will be described with reference to the accompanying drawings. The distinction between upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when a wiring board or the like is actually used. FIG. 1 is a perspective view showing an example of a wiring board, FIG. 1(a) is a perspective view from the first surface side, and FIG. 1(b) is a perspective view from the second surface side. 2A is a plan view of the wiring board shown in FIG. 1, and FIG. 2B is a cross-sectional view taken along line BB of FIG. 2A. FIG. 3 is a perspective view showing another example of the wiring board, FIG. 3(a) is a perspective view from the first surface side, and FIG. 3(b) is a perspective view from the second surface side. 4A is a plan view of the wiring board shown in FIG. 3, and FIG. 4B is a cross-sectional view taken along the line BB of FIG. 4A. 5 to 7 each show an example of an electronic device, in each of which (a) is a perspective view and (b) is a cross-sectional view taken along line BB of (a). In these perspective views and plan views, the connection pads 2 and the external terminals 3 are shaded in a dot shape so as to be easily distinguished from others.

The wiring board 10 is, as in the example shown in FIGS. 1 and 2, an insulating substrate 1 made of ceramics having a first surface 11 whose central portion is a mounting region of the electronic component 20, and a first surface 11 of the insulating substrate 1. And a connection pad 2 provided on the bottom surface of the recess 1a. The first surface 11 is a polishing surface.

According to such a wiring board 10, the central portion of the first surface 11 of the insulating substrate 1 made of ceramics is the mounting area of the electronic component 20. Since the surface (first surface 11) including the mounting area of the electronic component 20 is a polished surface, the flatness of the first surface 11 is high. Therefore, when the optical member 30 is mounted on the first surface 11 including the mounting surface, the parallelism between the optical member 30 and the mounting surface can be increased. Further, the connection pad 2 electrically connected to the electronic component 20 mounted on the mounting surface is provided on the bottom surface of the recess 1 a provided on the first surface 11. Therefore, the connection pad 2 is not polished in the polishing process of the insulating substrate 1 when manufacturing the wiring substrate 10. Since the connection pad 2 can be produced by co-firing with the insulating substrate 1 made of ceramic, the connection pad 2 has a higher bonding strength and a lower cost wiring than in the case where the connection pad is formed after polishing. It becomes the substrate 10.

Further, as in the example shown in FIGS. 3 and 4, the wiring board 10 is provided with the frame body 5 that is joined to the outer edge portion of the first surface 11 of the insulating substrate 1 and surrounds the mounting region and the connection pad 2. You can In this case, the frame body 5 having a high parallelism between the upper surface and the lower surface is used, and the lower surface of the frame body 5 having high flatness by polishing is bonded to the first surface 11 of the insulating substrate 1. Therefore, the parallelism between the mounting surface of the electronic component 20 on the wiring board 10 and the upper surface of the frame body 5 which is the mounting surface (bonding surface) of the optical member 30 is high. Further, the mounting surface of the electronic component 20 and the connection pad 2 are surrounded by the frame body 5, and the electronic component 20 is housed in the recess formed by the first surface 11 of the wiring board 10 and the frame body 5. Therefore, contact with the outside is less likely to occur, and the protection of the electronic component 20 is improved. Further, for example, the optical member 30 such as a lid provided with an optical film is closed on the opening of the frame body 5 and bonded to the upper surface of the frame body 5, whereby the electronic component 20 can be easily hermetically sealed.

The wiring board 10 of the example shown in FIGS. 1 and 2 and the wiring board 10 of the examples shown in FIGS. 3 and 4 have the same number and size of the connection pads 2, but the first surface of the insulating substrate 1 is the same. The number and size of the recesses 1a provided in 11 are different. In the wiring board 10 of the example shown in FIGS. 1 and 2, the recess 1a is one size larger than the connection pad 2 in plan view, and 20 recesses 1a are provided corresponding to each of the 20 connection pads. ing. In other words, one connection pad 2 is provided on the bottom surface of each of the 20 recesses 1a. On the other hand, in the wiring board 10 of the example shown in FIGS. 3 and 4, of the connection pads 2 arranged in two rows of ten recesses 1a, two of the size corresponding to each row are provided. It is provided. Ten connection pads are arranged in a line on the bottom surface of each of the two recesses 1a. The shapes, sizes, arrangements and numbers of the recesses 1a and the connection pads 2 are not limited to these, and there is no particular limitation as long as the connection pads 2 are provided on the bottom surface of the recesses 1a.

External terminals 3 are provided on the surface of the insulating substrate 1 other than the first surface 11. In the example shown in FIGS. 1 and 2, the external terminal 3 is provided on the second surface 12 of the insulating substrate 1 opposite to the first surface 11. In the example shown in FIGS. 3 and 4, the external terminal 3 is provided from the second surface 12 of the insulating substrate 1 to the inner surface of the notch provided on the side surface of the insulating substrate 1. The external terminal 3 is a terminal electrode for electrically connecting to an external circuit. By providing the external terminal 3 as in the example shown in FIGS. 3 and 4, a fillet of a bonding material such as solder is formed from the side surface of the wiring board 10 to the electrodes of the external circuit board. The mounting strength and the mounting reliability of the electronic device 100) on the external circuit board become higher. On the other hand, when the external terminal 3 is provided only on the second surface 12, the bonding material such as solder does not spread greatly when the wiring board 10 (electronic device 100) is mounted on the external circuit board, which is smaller. It is the mounting area.

The connection pad 2 and the external terminal 3 are electrically connected by the internal wiring 4 provided inside the insulating substrate 1. That is, the wiring board 10 is formed by forming the connection pad 2, the internal wiring 4, and the external terminal 3 on the insulating substrate 1. As a result, the electronic component 20 mounted on the wiring board 10 and electrically connected to the connection pads 2 is electrically connected to an external circuit via the connection pads 2, the internal wiring 4, and the external terminals 3 of the wiring board 10. It

The electronic device 100 of the example illustrated in FIG. 5 is an example in which the electronic component 20 and the optical member 30 are mounted on the wiring board 10 of the example illustrated in FIGS. 1 and 2. As in this example, the wiring board 10 and the electronic component 20 mounted in the mounting area of the wiring board 10 and electrically connected to the connection pads 2 are joined to the outer edge portion of the first surface 11 of the wiring board 10. The electronic device 100 includes the optical member 30 that overlaps with the electronic component 20.

The electronic device 100 of the example illustrated in FIG. 6 is an example in which the electronic component 20 and the optical member 30 are mounted on the wiring board 10 including the frame body 5 as in the examples illustrated in FIGS. 3 and 4. As in this example, the wiring board 10 and the electronic component 20 mounted on the mounting area of the wiring board 10 and electrically connected to the connection pads 2 are bonded to the frame body 5 of the wiring board 10. The electronic device 100 may include the optical member 30 that overlaps the electronic component 20.

According to such an electronic device 100, the electronic device 100 including the wiring board 10 having the above-described configuration has a high degree of parallelism between the electronic component 20 and the optical member 30 and has excellent optical characteristics.

In the electronic device 100 of the example shown in FIG. 5, the electronic component 20 is mounted on the central portion of the first surface 11 (of the insulating substrate 1) of the wiring board 10 and fixed by a bonding material (not shown). The electrodes (not shown) of the electronic component 20 and the connection pads 2 of the wiring board 10 are electrically connected by the bonding wires as the connection members 21. The optical member 30 is joined and fixed to the outer edge of the first surface 11 by a joining member 31. The optical member 30 in this example has a shape in which two light-transmissive members 32 are held by a holding member 33 having a rectangular tubular shape. For example, the lower transparent member 32 (closer to the wiring substrate 10) is a lid for hermetically sealing the electronic component 20, and the upper transparent member 32 (farther from the wiring substrate 10) is It is a lens. Further, the lens may be movable up and down.

Also in the electronic device 100 of the example shown in FIG. 6, the electronic component 20 is mounted on the central portion of the first surface 11 (of the insulating substrate 1) of the wiring board 10 and fixed by a bonding material (not shown). The electrodes (not shown) of the electronic component 20 and the connection pads 2 of the wiring board 10 are electrically connected by the bonding wires as the connection members 21. The optical member 30 is joined and fixed to the upper surface of the frame body 5 by a joining member 31. The optical member 30 in this example is only one transparent member 32. The translucent member 32 is a lid, and hermetically seals the electronic component 20. The lid may partially or entirely function as a lens.

The electronic device 100 of the example shown in FIG. 7 is an example in which the translucent member 32 is further arranged on the electronic device 100 of the example shown in FIG. Similar to the example shown in FIG. 6, a flat plate-shaped optical member 30 is joined and fixed to the upper surface of the frame body 5 by a joining member 31. Further, a convex lens-shaped light-transmissive member 32 held by a holding member 33 is arranged thereon. The holding member 33 has a quadrangular outer shape and a circular inner shape, and is joined to the upper surface (outer edge portion thereof) of the lower transparent member 32 by a joining member 31. Also in this example, the electronic component 20 may be hermetically sealed by the lower light-transmissive member 32, and the lens may be vertically movable.

In the example shown in FIGS. 5 and 6, electronic components are mounted on the wiring board 10 between the connection pads 2 arranged in two rows. The electrodes (not shown) of the electronic component 20 and the connection pads 2 of the wiring board 10 are electrically connected as bonding members 21 by bonding wires. On the other hand, in the example shown in FIG. 7, the electronic component 20 is mounted so as to overlap the connection pad 2. The electrodes (not shown) of the electronic component 20 and the connection pads 2 of the wiring board 10 overlap each other, and these are electrically connected by a conductive connection member 21 such as solder or a conductive adhesive.

The insulating substrate 1 is a basic structural portion of the wiring substrate 10, and has functions such as ensuring mechanical strength of the wiring substrate 10 and ensuring insulation between wiring conductors such as a plurality of connection pads 2. is doing. The insulating substrate 1 has, for example, a quadrangular shape such as a square shape (in a plan view) when viewed from above. The quadrilateral shape means not only a strict quadrangle but also a shape in which the corners of the quadrangle are rounded, for example.

Regarding the dimensions of the insulating substrate 1, for example, the length of one side of the quadrangle is 3 mm to 25 mm, and the thickness is 0.25 mm to 2 mm.

The first surface 11 (upper surface) of the insulating substrate 1 has a recess 1a, and the connection pad 2 is provided on the bottom surface of the recess 1a. The shape and size of the recess 1a in plan view are not particularly limited. In the example shown in FIGS. 1 and 2, the size of the bottom surface of the recess 1 a is slightly larger than that of the connection pad 2, and the entire connection pad 2 is exposed. In the example shown in FIGS. 3 and 4, a plurality of connection pads 2 are provided on the bottom surface of the recess 1a, but all the connection pads 2 are entirely exposed. On the other hand, in the example shown in FIG. 7, the end portion of the connection pad 2 is located in the insulating substrate 1 and the central portion is exposed in the recess 1a. As described above, the relationship between the size of the recess 1 a and the connection pad 2 in plan view is that the size of the recess 1 a is such that the connection pad 2 can be connected to (the electrode of) the electronic component 20 by the connection member 21. The size may be such that it is exposed. Further, if the depth of the concave portion 1a is deep, the connectivity by the connecting member 21 may be deteriorated, so the depth from the first surface 11 to the surface of the connection pad 2 may be, for example, 0.03 mm to 1 mm. it can. This depth can be adjusted by polishing the first surface 11.

The insulating substrate 1 is made of a ceramic such as an aluminum oxide sintered body, a glass ceramic sintered body, a mullite sintered body, or an aluminum nitride sintered body. It is formed by laminating a plurality of insulating layers made of ceramics. Although the number of insulating layers is four in the examples shown in FIGS. 2 and 4 to 6, the number of insulating layers is not limited to these.

If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows. That is, first, a ceramic green sheet to be an insulating layer is manufactured. Raw material powders such as aluminum oxide and silicon oxide are formed into a sheet shape together with an appropriate organic binder and an organic solvent to produce a plurality of square sheet-shaped ceramic green sheets. Next, these ceramic green sheets are laminated to produce a laminated body. The recess 1a can be formed by providing a through hole in the ceramic green sheet using a mold or the like. In the example shown in FIGS. 2 and 4 to 6, the recess 1a is formed in one insulating layer, but it may be formed in two or more insulating layers. When a cutout is provided on the side surface of the insulating substrate 1 from the second surface 12 of the insulating substrate 1 as in the example shown in FIGS. The notch can be formed by providing the through hole. After that, the laminated body is fired at a temperature of 1300 to 1600° C. to form a ceramic substrate. The insulating substrate 1 can be manufactured by polishing and flattening at least one surface (the surface that becomes the first surface 11) of this ceramic substrate. Polishing of the ceramic substrate can be performed by using a conventionally known method such as mechanical polishing using a grindstone or the like, chemical mechanical polishing using a polishing agent (abrasive grains) and a polishing liquid. The flatness of the first surface 11 of the insulating substrate 1 after polishing is about 10 μm to 20 μm.

The wiring substrate 10 including the insulating substrate 1 can also be manufactured as a multi-piece substrate in which a plurality of substrate regions to be the wiring substrate 10 are arranged on a mother substrate. A mother board including a plurality of board regions can be divided for each board region to more efficiently manufacture a plurality of wiring boards 10. In this case, a dividing groove may be provided along the boundary of the substrate region of the mother substrate. In addition, after mounting the electronic component 20 on each substrate region of the multi-cavity substrate, this may be divided to obtain a plurality of electronic devices 100.

Wiring conductors such as connection pads 2, external terminals 3, and internal wirings 4 are provided on the surface and inside of the insulating substrate 1. The connection pad 2 is a conductor layer provided on the bottom surface of the recess 1a. In the example shown in FIGS. 2 and 4 to 6, the internal wiring is composed of a conductor layer between insulating layers and a through conductor penetrating the insulating layer. The external terminal 3 is a conductor layer provided on the second surface 12 of the insulating substrate 1 in the examples shown in FIGS. 1 and 2, and is insulated from the second surface 12 of the insulating substrate 1 in the examples shown in FIGS. It is a conductor layer provided over the inner surface of the notch provided in the side surface of the substrate 1. Further, as in the example shown in FIG. 7, the external terminal 3 may be configured by a conductor layer provided on the second surface 12 of the insulating substrate 1 and a conductor filled in the cutout. The conductor filled in the notch is also a through conductor, and has a shape that is obtained by vertically dividing the through conductor in the vertical direction.

The wiring conductor mainly contains, as a conductor material, a metal material such as a metal such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel or cobalt, or an alloy containing these metals. The wiring conductor is provided on the insulating substrate 1 as a so-called metallized metal in which powder of such a metal material is co-fired with the insulating layer.

When the connection pad 2 of the wiring conductor, the conductor layer of the external terminal 3 and the conductor layer of the internal wiring 4 are, for example, a metallization layer of tungsten, a metal prepared by mixing tungsten powder with an organic solvent and an organic binder. The paste can be formed by printing the paste on a predetermined position of the ceramic green sheet to be the insulating substrate 1 by a method such as a screen printing method and firing the paste. The through conductor of the internal wiring 4 is formed by forming a through hole at a predetermined position on the ceramic green sheet prior to printing the above metal paste and filling the same metal paste as the above into the through hole. can do. It can be formed in the same manner even when the portion inside the notch of the external terminal 3 is the filling conductor.

Further, the exposed surface of the metallized layer to be the connection pad 2 and the external terminal 3 may be further coated with a plating layer such as nickel and gold by a plating method such as an electrolytic plating method or an electroless plating method. In this case, when the wiring board 10 or the electronic device 100 is manufactured in the form of a multi-piece board as described above, if the wiring conductors in the plurality of board regions are electrically connected to each other, the plurality of wiring boards 10 may be formed. It is also possible to collectively apply the plating layer to the wiring conductors.

When the wiring board 10 has the frame body 5, the frame body 5 may be bonded to the outer edge portion of the first surface 11 of the insulating substrate 1 with the bonding material 51. The frame 5 is made of ceramics at the same time as or other than the insulating substrate 1, iron-nickel (Fe-Ni) alloy, iron-nickel-cobalt (Fe-Ni-Co) alloy, metal such as iron (Fe), epoxy. , A resin such as a liquid crystal polymer. In the case of resin, it may contain a ceramic filler for adjusting the thermal expansion coefficient. It is preferable to use a material having a small difference in thermal expansion coefficient from the ceramic of the insulating substrate 1 as described above.

The bonding material 51 is, for example, glass or a resin adhesive. Glass can be used in terms of airtightness and hygroscopicity.

The frame body 5 is a frame body having the same size and shape as the outer shape of the insulating substrate 1. The height of the frame body 5 is such that the electronic component 20 and the connection member 21 such as wire bonding can be accommodated in the recessed space formed by the frame body 5 and the first surface 11 of the insulating substrate 1. For example, it can be 0.5 mm to 3 mm. The frame 5 has a high degree of parallelism between the upper surface and the lower surface, for example, a degree of parallelism of 50 μm or less.

When the frame body 5 is made of ceramics, for example, the ceramic green sheet can be punched, fired, and polished to form the frame body 5 with high parallelism. Alternatively, it can also be produced by molding the ceramic powder into a frame shape with a die press, firing it, and then polishing it. When the frame body 5 is made of metal, a metal plate whose upper and lower surfaces are parallel can be punched to have a predetermined shape, and polishing can be performed to increase parallelism. When the frame body 5 is made of resin, it can be formed into a predetermined shape by molding it into a frame shape with a mold, and further parallelism can be increased by further polishing. In order to prevent corrosion of the frame body 5 or to join the frame body 5 to the optical member 30 by solder, the surface of the frame body 5 is plated with nickel and gold by a plating method such as an electrolytic plating method or an electroless plating method. A plating layer such as the above may be further applied.

The optical member 30 is bonded by mounting the frame body 5 on the insulating substrate 1 having the first surface 11 flatly polished via the bonding material 51 and bonding the frame body 5 by heating. The parallelism between the upper surface of the frame body 5 and the first surface 11 on which the electronic component 20 is mounted is high. When the frame body 5 is joined, it is possible to join the frame body 5 by adjusting the load so that the first surface 11 of the insulating substrate 1 and the frame body 5 are parallel to each other.

By mounting the electronic component 20 on the mounting area of the wiring board 10 and mounting (joining) the optical member 30 on the outer edge portion of the first surface 11 of the insulating substrate 1 or on the frame body 5. It becomes the electronic device 100.

The electronic component 20 is, for example, an image pickup device such as a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

The electronic component 20 is fixed, for example, by bonding the lower surface of the electronic component 20 to a mounting region of the first surface 11 (upper surface) of the insulating substrate 1 with a bonding material (not shown). As a joining material for joining and fixing the electronic component 20 to the wiring board 10, a brazing material containing solder, a resin adhesive such as glass or epoxy resin can be used. When the joining material is a brazing material containing solder, a joining metal film can be provided in the mounting region of the wiring board 10 by plating, a thin film, or the like.

Electrodes (not shown) arranged on the surface of the electronic component 20 and the connection pads 2 are connected by the connection member 21, and the electronic component 20 and the wiring board 10 are electrically connected. In the electronic device 100 of the example shown in FIGS. 5 and 6, the electrode on the upper surface of the electronic component 20 and the connection pad 2 are electrically connected by a bonding wire made of, for example, gold (Au) as the connection member 21. ing. In the electronic device 100 of the example shown in FIG. 7, as the connection member 21, a conductive bonding material such as solder or a conductive adhesive is used to electrically connect the electrode on the lower surface of the electronic component 20 and the connection pad 2. ing. When the connecting member 21 is a bonding wire, the electronic component 20 is fixed to the first surface 11 of the insulating substrate 1 and then connected. When the connecting member 21 is a conductive bonding material, if a material containing a bonding component similar to the bonding material that fixes the electronic component 20 is used, the electronic component 20 can be fixed to the first surface 11 of the insulating substrate 1. Connection can be made at the same time.

For example, in the example shown in FIG. 6, the optical member 30 is a translucent material that transmits the light received by the electronic component 20, and when the light is visible light, it is a plate material made of glass, for example. In the example shown in FIG. 7, a holding member 33, which holds another transparent member 32, is joined to the transparent member 32 by a joining member 31, unlike the example shown in FIG. In this example, the lower transparent member 32 has a flat plate shape similar to that shown in FIG. 6, and the upper transparent member 32 has a convex lens shape. The upper transparent member 32 may be made of resin as well as glass. The optical member 30 of the example shown in FIG. 5 is one in which two holding members 33 hold two translucent members 32. The structure of the translucent member 32 is the same as the example shown in FIG.

The translucent member 32 (lid and lens) may have an IR cut filter formed of a thin film or the like, an antireflection film, an optical film such as a light shielding film on the surface thereof.

The holding member 33 of the optical member 30 has a tubular or tubular shape that holds the translucent member 32 and has an opening through which the light transmitted through the translucent member 32 reaches (the light receiving portion of) the electronic component 20. It is a thing. The lower surface of the holding member 33 is a joint surface with the wiring board 10 and is flat. The translucent member 32 is held parallel to this lower surface. Thereby, the electronic component 20 and the translucent member 32 of the optical member 30 are joined in parallel. The holding member 33 is made of metal or resin, for example.

The optical member 30 is bonded to the outer edge portion of the first surface 11 of the insulating substrate 1 or the upper surface of the frame body 5 with a bonding member 31. For the joining member 31, a resin adhesive, glass, or a metal joining material such as solder can be used. At this time, a metal film for bonding is provided at the bonding portion of the optical member 30 as needed. When the joining member 31 is glass or solder, the melting point is lower than the melting points of the joining material 51 for joining the frame body 5, the joining material for joining the electronic component 20, the connecting member 21 for joining the electronic component 20 and the connection pad, and the like. Can be used.

In the above description, the image pickup element of the electronic component 20 has been described in the case of a visible light image pickup element used in a digital camera or the like, but the image pickup element is not limited to this, and an infrared image pickup element used in a surveillance camera or the like. Is also included. In this case, the light transmitted by the translucent member 32 is infrared light, and the material of the translucent member 32 can be, for example, Ge, Si, ZnSe, ZnS or the like. Alternatively, the electronic device 100 may be equipped with two light emitting elements and light receiving elements as the electronic component 20.

1... Insulating substrate 1a... Recess 11... 1st surface 12... 2nd surface 2... Connection pad 3... External terminal 4... Internal wiring 5... Frame body 51 ... bonding material 10 ... wiring board 20 ... electronic component 21 ... connection member 30 ... optical member 31 ... bonding member 32 ... translucent member 33 ... holding member 100 ...Electronic devices

Claims (4)

An insulating substrate made of ceramics having a first surface whose central portion is a mounting area for electronic components;
A recess provided on the first surface of the insulating substrate;
A connection pad provided on the bottom surface of the recess,
A wiring board in which the first surface is a polished surface. The wiring board according to claim 1, further comprising a frame body which is joined to an outer edge portion of the first surface and surrounds the mounting region and the connection pad. The wiring board according to claim 1,
An electronic component mounted on the mounting area of the wiring board and electrically connected to the connection pad;
An electronic device comprising an optical member that is joined to an outer edge portion of the first surface of the wiring board and that overlaps with the electronic component. The wiring board according to claim 2,
An electronic component mounted on the mounting area of the wiring board and electrically connected to the connection pad;
An electronic device comprising: an optical member that is joined to the frame body of the wiring board and overlaps with the electronic component.

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