JP2020086408A5 - - Google Patents

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Publication number
JP2020086408A5
JP2020086408A5 JP2018225866A JP2018225866A JP2020086408A5 JP 2020086408 A5 JP2020086408 A5 JP 2020086408A5 JP 2018225866 A JP2018225866 A JP 2018225866A JP 2018225866 A JP2018225866 A JP 2018225866A JP 2020086408 A5 JP2020086408 A5 JP 2020086408A5
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JP
Japan
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layer
optical device
thickness
lenses
substrate
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JP2018225866A
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English (en)
Japanese (ja)
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JP2020086408A (ja
JP7301530B2 (ja
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Priority to JP2018225866A priority Critical patent/JP7301530B2/ja
Priority claimed from JP2018225866A external-priority patent/JP7301530B2/ja
Priority to US16/694,383 priority patent/US11332409B2/en
Publication of JP2020086408A publication Critical patent/JP2020086408A/ja
Publication of JP2020086408A5 publication Critical patent/JP2020086408A5/ja
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JP2018225866A 2018-11-30 2018-11-30 光学装置および機器 Active JP7301530B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018225866A JP7301530B2 (ja) 2018-11-30 2018-11-30 光学装置および機器
US16/694,383 US11332409B2 (en) 2018-11-30 2019-11-25 Optical apparatus and equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018225866A JP7301530B2 (ja) 2018-11-30 2018-11-30 光学装置および機器

Publications (3)

Publication Number Publication Date
JP2020086408A JP2020086408A (ja) 2020-06-04
JP2020086408A5 true JP2020086408A5 (cg-RX-API-DMAC7.html) 2022-01-06
JP7301530B2 JP7301530B2 (ja) 2023-07-03

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Family Applications (1)

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JP2018225866A Active JP7301530B2 (ja) 2018-11-30 2018-11-30 光学装置および機器

Country Status (2)

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US (1) US11332409B2 (cg-RX-API-DMAC7.html)
JP (1) JP7301530B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210081892A (ko) * 2019-12-24 2021-07-02 삼성전자주식회사 이미지 센서 및 그 제조방법
JP2022096525A (ja) * 2020-12-17 2022-06-29 ソニーセミコンダクタソリューションズ株式会社 撮像装置
US12191333B2 (en) * 2022-02-24 2025-01-07 Visera Technologies Company Limited Solid-state image sensor
CN114721182A (zh) * 2022-03-30 2022-07-08 上海天马微电子有限公司 显示面板及显示装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3620237B2 (ja) * 1997-09-29 2005-02-16 ソニー株式会社 固体撮像素子
US6221687B1 (en) * 1999-12-23 2001-04-24 Tower Semiconductor Ltd. Color image sensor with embedded microlens array
JP4208072B2 (ja) * 2003-12-05 2009-01-14 シャープ株式会社 半導体素子およびその製造方法
JP2006073885A (ja) * 2004-09-03 2006-03-16 Canon Inc 固体撮像装置、その製造方法、およびデジタルカメラ
JP2006147661A (ja) * 2004-11-16 2006-06-08 Matsushita Electric Ind Co Ltd 受光装置とその製造方法およびカメラ
JP4909530B2 (ja) 2005-05-12 2012-04-04 富士フイルム株式会社 固体撮像素子の製造方法および固体撮像素子
JP2008060320A (ja) 2006-08-31 2008-03-13 Sony Corp 固体撮像素子及びその製造方法
JP2008071959A (ja) 2006-09-14 2008-03-27 Sony Corp 固体撮像素子
JP2008091771A (ja) 2006-10-04 2008-04-17 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
JP2008108918A (ja) 2006-10-25 2008-05-08 Sony Corp 固体撮像素子
JP2008112944A (ja) 2006-10-31 2008-05-15 Sony Corp 固体撮像素子
JP5076679B2 (ja) 2007-06-28 2012-11-21 ソニー株式会社 固体撮像装置及びカメラモジュール
JP2009021415A (ja) * 2007-07-12 2009-01-29 Panasonic Corp 固体撮像装置およびその製造方法
US8395686B2 (en) * 2007-12-06 2013-03-12 Sony Corporation Solid-state imaging device, method of manufacturing the same, and camera
JP5086877B2 (ja) * 2008-04-11 2012-11-28 シャープ株式会社 固体撮像素子およびその製造方法、電子情報機器
US20140252521A1 (en) * 2013-03-11 2014-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. Image Sensor with Improved Dark Current Performance
JP2015176896A (ja) * 2014-03-13 2015-10-05 株式会社東芝 固体撮像装置用基板、固体撮像装置、固体撮像装置用基板の製造方法、および固体撮像装置の製造方法
JP2015230896A (ja) * 2014-06-03 2015-12-21 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP6369233B2 (ja) * 2014-09-01 2018-08-08 ソニー株式会社 固体撮像素子及びその信号処理方法、並びに電子機器
WO2016052220A1 (ja) * 2014-10-01 2016-04-07 ソニー株式会社 固体撮像素子および製造方法、並びに電子機器
JP6685653B2 (ja) * 2015-05-14 2020-04-22 キヤノン株式会社 固体撮像装置の製造方法
JP2017054966A (ja) * 2015-09-10 2017-03-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置

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