JP2020064940A - Manufacturing method of multilayer ceramic electronic component - Google Patents

Abstract

To provide a manufacturing method of a multilayer ceramic electronic component capable of improving yield.SOLUTION: A manufacturing method of a multilayer ceramic electronic component according to an embodiment of the present invention includes a step of preparing a ceramic laminate including an electrode laminated region in which internal electrodes are laminated in a first direction via a ceramic sheet, and a first cover region including a first cover layer on the electrode laminated region and a first outer layer outside the first cover layer, and a second cover region that respectively cover the electrode laminated region from both sides in the first direction. The ceramic laminate is cut without dividing the first outer layer from the surface of the second cover region to the first outer layer. The first outer layer is removed, and then a multilayer chip is singulated from the ceramic laminate.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a method for manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor.

  BACKGROUND ART A monolithic ceramic electronic component such as a monolithic ceramic capacitor is generally manufactured by cutting a large-sized ceramic laminate having internal electrodes laminated into individual chips by a cutting device.

  Patent Document 1 describes a method of manufacturing a laminated ceramic electronic component in which a laminated body is attached to an adhesive sheet and cut to separate a plurality of laminated body chips into individual pieces. In the manufacturing method of the same document, from the viewpoint of preventing the generation of adhesive waste, a cutting half-cut groove is formed from one main surface side of a laminate having a region in which ceramic layers and internal conductors are alternately laminated, After forming the positioning groove on the other main surface, the other main surface is cut into a groove shape so as to reach the cutting half-cut groove based on the positioning groove, and the laminated body is divided into a plurality of individual laminated body chips.

JP, 2014-143357, A

  However, in the method described in Patent Document 1, when the groove on the other main surface side is slightly displaced from the cutting half-cut groove, a step due to each groove may be formed on the cut surface. As a result, a defective shape or a short circuit failure of the internal electrode exposed on the cut surface occurs, and the yield is likely to decrease.

  In view of the above circumstances, it is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component capable of improving the yield.

In order to achieve the above object, in a method for manufacturing a laminated ceramic electronic component according to an aspect of the present invention, an electrode laminated area in which internal electrodes are laminated in a first direction via a ceramic sheet, and the electrode laminated area are A ceramic laminate having a first cover region and a second cover region respectively covering from both sides in one direction, wherein the first cover region is a first cover layer on the electrode laminate region, and the first cover layer. And a first outer layer on the outside of the.
The ceramic laminated body is cut without dividing the first outer layer from the surface of the second cover region to the first outer layer.
By removing the first outer layer, laminated chips are singulated from the ceramic laminated body.

  In the above-mentioned manufacturing method, after the ceramic laminated body is cut with the first outer layer left, the entire first outer layer is removed, whereby the laminated chip is diced. That is, in the cutting step, since the ceramic laminated body is connected by the first outer layer, the posture of the divided portion can be stabilized. Therefore, it is possible to prevent the formation of scratches on the cut surface due to the contact between the cutting blade and the laminated chip. Furthermore, since the first outer layer reached by the tip portion of the cutting blade is removed in the cutting step, a step due to the tip portion is not formed, and scratches on the cutting surface can be more reliably prevented. As a result, the yield in the manufacturing process of the monolithic ceramic electronic component can be improved.

In the above manufacturing method, the ceramic laminate may be cut with a rotary blade.
By using the rotary blade, the orientation of the cut surface is stabilized, and the defective shape of the laminated chip can be prevented. Therefore, the yield in the manufacturing process of the monolithic ceramic electronic component can be further improved.

Further, the laminated chip has a cutting surface to expose the internal electrode,
A side margin portion may be formed on the cut surface of the layered chip.
That is, the side margin portion may be attached to the laminated chip later. As a result, the cross-sectional area of the internal electrodes can be increased and a large capacity can be realized. Further, by preventing the cut surface from being scratched, it is possible to prevent a short circuit defect of the internal electrode on the cut surface, and improve the yield.

The first outer layer may be removed by cutting the entire surface orthogonal to the first direction with a substantially uniform thickness in the first direction.
As a result, the entire first outer layer is removed, and only the first cover layer remains in the first cover area, and the layered chip can be downsized.

The first outer layer may be 50 μm or more.
Thereby, the thickness of the first outer layer can be sufficiently secured, and the posture of the divided portion can be further stabilized in the cutting step. Further, the cutting thickness when removing the first outer layer can be easily controlled.

Further, the second cover region includes a second cover layer on the electrode laminated region and a second outer layer outside the second cover layer,
The second outer layer may be removed after cutting the ceramic laminate.
Accordingly, the first cover region and the second cover region can be formed with the same thickness, and the shape balance of the ceramic laminate can be stabilized.

The second outer layer may be removed by cutting the entire surface orthogonal to the first direction with a substantially uniform thickness in the first direction.
As a result, the entire second outer layer is removed, and only the second cover layer remains in the second cover area, so that the layered chip can be downsized.

  As described above, according to the present invention, it is possible to provide a method for manufacturing a monolithic ceramic electronic component capable of improving the yield.

1 is a perspective view of a monolithic ceramic capacitor according to an embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line AA ′ of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view of the monolithic ceramic capacitor taken along line BB ′. 6 is a flowchart showing a method for manufacturing the above-mentioned multilayer ceramic capacitor. FIG. 6 is a perspective view showing a manufacturing process of the multilayer ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. FIG. 6 is a perspective view showing a manufacturing process of the multilayer ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a side view which shows the manufacturing process of the said monolithic ceramic capacitor. FIG. 6 is a perspective view showing a manufacturing process of the multilayer ceramic capacitor. FIG. 6 is a perspective view showing a manufacturing process of the multilayer ceramic capacitor. FIG. 6 is a schematic side view showing a manufacturing process of a multilayer ceramic capacitor according to a comparative example of the present embodiment. It is a side view of a layered chip concerning a comparative example of this embodiment. It is a side view of the layered chip of this embodiment. FIG. 6 is a perspective view showing a manufacturing process of a monolithic ceramic capacitor according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the drawings, an X axis, a Y axis, and a Z axis which are orthogonal to each other are shown as appropriate. The X-axis, Y-axis, and Z-axis are common in all the drawings.

[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are diagrams showing a monolithic ceramic capacitor 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of a monolithic ceramic capacitor 10. FIG. 2 is a sectional view of the monolithic ceramic capacitor 10 taken along the line AA ′ in FIG. 1. FIG. 3 is a sectional view of the monolithic ceramic capacitor 10 taken along the line BB ′.

  The monolithic ceramic capacitor 10 includes a ceramic body 11, a first external electrode 14, and a second external electrode 15. The ceramic body 11 typically has two main surfaces facing the Z-axis direction, two end surfaces facing the X-axis direction, and two side surfaces facing the Y-axis direction. The ridges connecting the respective faces of the ceramic body 11 are rounded.

  The external electrodes 14 and 15 cover the end surface of the ceramic body 11 and face each other in the X-axis direction with the ceramic body 11 interposed therebetween. The external electrodes 14 and 15 extend from the end surface of the ceramic body 11 to the main surface and side surfaces. Thus, in the external electrodes 14 and 15, both the cross section parallel to the XZ plane and the cross section parallel to the XY plane are U-shaped. The shapes of the external electrodes 14 and 15 are not limited to those shown in FIG.

  The external electrodes 14 and 15 are formed of a good conductor of electricity. Examples of good electrical conductors that form the external electrodes 14 and 15 include copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). Metals or alloys containing as a main component are mentioned.

  The ceramic body 11 has a laminated chip 16 and a side margin portion 17. The laminated chip 16 has two end surfaces 16a facing the X-axis direction, two side surfaces 16b facing the Y-axis direction, and two main surfaces 16c facing the Z-axis direction. The side margin portions 17 respectively cover the two side surfaces 16b of the layered chip 16.

  The layered chip 16 has a capacitance forming portion 18, and a first cover portion 19 and a second cover portion 20 which are provided on both sides of the capacitance forming portion 18 in the Z-axis direction. The capacitance forming portion 18 has internal electrodes 12 and 13 stacked in the Z-axis direction with ceramic layers interposed therebetween.

  Each of the first internal electrode 12 and the second internal electrode 13 is formed in a sheet shape extending along the XY plane. The first inner electrode 12 extends in the X-axis direction to the one end surface 16 a and is connected to the first outer electrode 14. The second internal electrode 13 extends in the X-axis direction to the other end surface 16a and is connected to the second external electrode 15. Accordingly, when a voltage is applied between the first external electrode 14 and the second external electrode 15, a voltage is applied to the ceramic layer between the first internal electrode 12 and the second internal electrode 13, and the capacitance forming portion A charge corresponding to the voltage is stored in 18.

  The internal electrodes 12 and 13 are formed over the entire width of the capacitance forming portion 18 in the Y-axis direction, and are exposed on both side surfaces 16b of the multilayer chip 16. The positions of the ends of the internal electrodes 12 and 13 are aligned with each other within a range of 0.5 μm in the Y-axis direction.

  The internal electrodes 12 and 13 are formed of a good conductor of electricity. As a good electric conductor forming the internal electrodes 12 and 13, nickel (Ni) is typically mentioned. In addition to this, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), Examples of the metal or alloy include gold (Au) as a main component.

In the ceramic body 11, a dielectric ceramic having a high dielectric constant is used in order to increase the capacity of each ceramic layer between the internal electrodes 12 and 13. Examples of the dielectric ceramic having a high dielectric constant include a material having a perovskite structure containing barium (Ba) and titanium (Ti), which is represented by barium titanate (BaTiO ₃ ).

The ceramic layer includes strontium titanate (SrTiO ₃ ) system, calcium titanate (CaTiO ₃ ) system, magnesium titanate (MgTiO ₃ ) system, calcium zirconate (CaZrO ₃ ) system, calcium zirconate titanate (Ca (Ca (Ca Zr, Ti) O ₃ ) system, barium zirconate (BaZrO ₃ ) system, titanium oxide (TiO ₂ ) system, etc. may be used.

  The first cover portion 19, the second cover portion 20, and the side margin portion 17 are formed of insulating ceramics, but may include, for example, the dielectric ceramics used in the ceramic body 11. As a result, the internal stress that may occur between the cover portions 19 and 20, the side margin portion 17, and the capacitance forming portion 18 is suppressed.

  As shown in the manufacturing method below, the first cover portion 19 and the second cover portion 20 are formed by stacking unfired ceramic green sheets so as to be thicker than the design value after firing, and then forming an outer layer with a predetermined thickness. It is formed by being removed.

[Manufacturing Method of Multilayer Ceramic Capacitor 10]
FIG. 4 is a flowchart showing a method for manufacturing the monolithic ceramic capacitor 10. 5 to 14 are diagrams schematically showing a manufacturing process of the monolithic ceramic capacitor 10. Hereinafter, a method for manufacturing the monolithic ceramic capacitor 10 will be described along with FIG. 4 with reference to FIGS.

(Step S01: Fabrication of Ceramic Laminate 104)
In step S01, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 18 and the third ceramic sheet 103 for forming the cover portions 19 and 20 are laminated and pressure-bonded. Then, the ceramic laminated body 104 is produced.

  The ceramic sheets 101, 102, 103 shown in FIG. 5 are configured as unfired dielectric green sheets containing dielectric ceramics as a main component. An unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101. An unfired second internal electrode 113 corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102. Internal electrodes are not formed on the third ceramic sheet 103.

  Each of the internal electrodes 112, 113 has a plurality of strip-shaped electrode patterns that cross the cutting line Lx parallel to the X-axis direction and extend along the cutting line Ly parallel to the Y-axis direction. These internal electrodes 112 and 113 are formed by applying a conductive paste to the ceramic sheets 101 and 102 by a printing method or the like.

  As shown in FIG. 5, the ceramic sheets 101 and 102 are alternately laminated in the Z-axis direction to form an electrode laminated region 105 in which the internal electrodes 112 and 113 are laminated in the Z-axis direction. Further, the ceramic sheets 103 are laminated on the upper and lower surfaces in the Z axis direction of the electrode laminated area 105, so that the first cover area 106 and the second cover area 107 that cover the electrode laminated area 105 from both sides in the Z axis direction are formed. .

FIG. 6 is a schematic side view of the ceramic laminate 104.
The first cover region 106 includes a first cover layer 106a on the electrode laminated region 105 and a first outer layer 106b outside the first cover layer 106a. The first cover layer 106a corresponds to the first cover portion 19 after firing. The first outer layer 106b is removed in the process described below.

  The first cover layer 106a is formed to have a thickness in the Z-axis direction of 20 μm or more and 50 μm or less, for example. The first outer layer 106b is formed so that the thickness in the Z-axis direction is 50 μm or more and 200 μm or less, for example. As a result, the laminated ceramic capacitor 10 after firing can be downsized, and the posture of the divided electrode laminated region 105 can be more reliably stabilized in the cutting step of step S03 described later.

  The thickness of the first cover layer 106a and the first outer layer 106b in the Z-axis direction can be adjusted by the number of laminated ceramic sheets 103. That is, the first cover layer 106a and the first outer layer 106b have a configuration in which different numbers of ceramic sheets 103 are stacked.

  The second cover region 107 includes a second cover layer 107a on the electrode laminated region 105 and a second outer layer 107b outside the second cover layer 107a. The second cover layer 107a corresponds to the second cover portion 20 after firing. The second outer layer 107b is removed in a step described later. Each of the second cover layer 107a and the second outer layer 107b is composed of a laminated body of the ceramic sheets 103.

  The second cover layer 107a and the second outer layer 107b are configured to have the same thickness as the first cover layer 106a and the first outer layer 106b, for example. That is, the second cover layer 107a is formed to have a thickness in the Z-axis direction of 20 μm or more and 50 μm or less, for example. The second outer layer 107b is formed to have a thickness in the Z-axis direction of 50 μm or more and 200 μm or less, for example.

  The ceramic sheets 101, 102, 103 are pressure-bonded by uniaxial pressure or the like to be integrated. In the present embodiment, the first cover area 106 and the second cover area 107 are configured to have substantially the same thickness in the Z axis direction. Therefore, even when the ceramic sheet 103 is heated and contracted by heat during the pressure bonding, the contraction rates of the first cover region 106 and the second cover region 107 are similar, and it is possible to prevent a shape defect such as warpage of the ceramic laminate 104.

(Step S02: Attaching the first tape T1)
In step S02, as shown in FIG. 7, the peelable first tape T1 is attached to the surface of the first outer layer 106b. As the first tape T1, for example, a foaming peeling tape whose adhesiveness disappears when heated to a predetermined temperature or higher, a UV peeling tape whose adhesiveness disappears by ultraviolet irradiation, and the like can be used. The thickness of the first tape T1 in the Z-axis direction is not particularly limited, but may be, for example, 50 μm or more and 200 μm or less. By attaching the first tape T1 to the first outer layer 106b, the posture of the divided electrode laminated region 105 can be further stabilized in the cutting step of step S03.

(Step S03: Cutting of ceramic laminate 104 (half cut))
In step S03, as shown in FIG. 8, the ceramic laminate 104 is cut without dividing the first outer layer 106b until the surface of the second cover region 107 reaches the first outer layer 106b. That is, in this step, the second cover area 107 of the ceramic laminate 104 to the first cover layer 106a of the first cover area 106 is half-cut. In addition, the half-cut here refers to a mode in which at least a part of the first cover layer 106a is left and cut.

  As shown in FIG. 9, in the present embodiment, the ceramic laminate 104 is cut along the X-axis direction and the Y-axis direction using a cutting device having a rotary blade P. Such a cutting device advances the rotary blade P in the X-axis direction or the Y-axis direction while cutting the ceramic laminated body 104 from the side surface of the ceramic laminated body 104 (see the white arrow in FIG. 9). As a result, the internal stress of the ceramic laminate 104 generated by the entry of the rotary blade P can be reduced. Therefore, it is possible to prevent the rotary blade P from advancing obliquely with respect to the X-axis direction and the Y-axis direction due to this internal stress, and it is possible to prevent the defective shape of the individual laminated chips.

  Although the rotation direction of the rotary blade P is not limited, for example, the portion located in the traveling direction can be set to the direction from the upper side to the lower side in the Z-axis direction, that is, from the second cover area 107 to the first cover area 106 (FIG. (See 9 thick arrow). As a result, the cutting waste can be discharged rearward in the traveling direction of the rotary blade P, and the scattering of the cutting waste can be prevented.

(Step S04: Removal of Second Outer Layer 107b)
In step S04, as shown in FIG. 10, the second outer layer 107b facing upward in the Z-axis direction is removed. The second outer layer 107b is removed by cutting the entire XY plane orthogonal to the Z-axis direction with a substantially uniform thickness using, for example, the cutting device used in step S03 or a cutting device such as a grinder. Thus, the thickness of the second cover region 107 side in the Z-axis direction is adjusted to the thickness corresponding to the second cover portion 20 after firing.

(Step S05: Attaching the second tape T2 and peeling the first tape T1)
In step S05, as shown in FIG. 11, the peelable second tape T2 is attached to the surface of the second cover layer 107a, and the first tape T1 is peeled from the first outer layer 106b. As the second tape T2, for example, a foam peeling tape whose adhesiveness disappears when heated to a predetermined temperature or higher, a UV peeling tape whose adhesiveness disappears by ultraviolet irradiation, and the like can be used. When a foam release tape is used as the second tape T2, for example, a tape whose adhesive force disappears at a temperature (foaming temperature) higher than that of the first tape T1 can be used. Thereby, by heating at a temperature equal to or higher than the foaming temperature of the first tape T1 and equal to or lower than the foaming temperature of the second tape T2, only the first tape T1 can be selectively peeled.

(Step S06: Removal of the first outer layer 106b)
In step S06, as shown in FIG. 12, the first outer layer 106b is removed. In this step, for example, after inverting the ceramic laminate 104 in the Z-axis direction so that the first outer layer 106b faces upward in the Z-axis direction, the entire first outer layer 106b is removed in the same manner as the removal of the second outer layer 107b in step S04. Remove. That is, the first outer layer 106b is removed by cutting the entire XY plane orthogonal to the Z-axis direction with a substantially uniform thickness. As a result, the thickness of the first cover region 106 side in the Z-axis direction is adjusted to the thickness corresponding to the first cover portion 19 after firing, and the plurality of laminated chips 116 are separated from the ceramic laminate 104. It

  FIG. 13 is a perspective view of the laminated chip 116. The laminated chip 116 has a side surface 116b which is a cutting surface facing in the Y-axis direction and an end surface 116a which is a cutting surface facing in the X-axis direction. Ends of the unfired internal electrodes 112 and 113 are exposed from the side surface 116b.

(Step S07: Formation of Side Margin 117)
In step S07, the side margin portion 117 is formed on the side surface 116b of the layered chip 116. The side margin portion 117 is formed by attaching a ceramic sheet, applying a ceramic paste, or the like. As a result, an unfired ceramic element body 111 as shown in FIG. 14 is produced.

(Step S08: firing)
In step S08, the ceramic body 111 of the multilayer ceramic capacitor 10 shown in FIGS. 1 to 3 is manufactured by firing the ceramic body 111 obtained in step S07. The firing temperature can be determined based on the sintering temperature of the ceramic body 111. The firing can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

(Step S09: External Electrode Formation)
In step S09, the external electrodes 14 and 15 are formed on both ends in the X-axis direction of the ceramic body 11 obtained in step S08. As an example, first, a conductive paste is applied to both ends of the ceramic body 11 in the X-axis direction, and the conductive paste is baked to form a base film. Next, one or a plurality of plating films are formed by immersing the ceramic body 11 on which the base film is formed in a plating solution and performing electrolytic plating.
As a result, the monolithic ceramic capacitor 10 as shown in FIGS.

  Note that part of the processing in step S09 may be performed before step S08. For example, before step S08, an unfired electrode material is applied to both end surfaces of the unfired ceramic element body 111 in the X-axis direction, and in step S08, the unfired ceramic element body 111 is fired at the same time as the unfired electrode material. The material may be baked to form the underlying layers of the external electrodes 14 and 15. Alternatively, the unbindered electrode material may be applied to the binder-removed ceramic body 111 and these may be simultaneously fired.

  In the above manufacturing method, the ceramic laminated body 104 has the first outer layer 106b outside the first cover layer 106a, and the ceramic laminated body 104 is half-cut without dividing the first outer layer 106b. That is, the presence of the first outer layer 106b makes it possible to fix the electrode laminated region 105 being cut and stabilize the posture. As a result, it is possible to prevent the cut surface (side surface 116b) from being scratched due to the contact with the rotary blade P, and to prevent the laminated chip 116 from being defective in shape due to the displacement of the cutting position.

  FIG. 15: is a typical side view which shows the process of cutting the ceramic laminated body 204 which concerns on the comparative example of this embodiment. The ceramic laminated body 204 has the same electrode laminated region 105 as the ceramic laminated body 104, and a first cover layer 206a and a second cover layer 207a that cover the electrode laminated region 105 from both sides in the Z-axis direction. Has no outer layer. The ceramic laminated body 204 is cut with the second cover layer 207a facing upward in the Z-axis direction and the first cover layer 206a attached to the tape T3.

  The tape T3 is composed of, for example, a peelable foam tape, and has an adhesive layer T31 containing a foaming agent that foams at a temperature of a predetermined temperature or higher, and a film layer T32 serving as a base material. When the ceramic laminated body 204 is cut, the first cover layer 206a attached to the adhesive layer T31 is completely cut off, so that the film layer T32 is cut to the middle by a cutting blade.

  As a result, the laminated chip 216 is supported only by the divided adhesive layer T31. The laminated chip 216 has a rectangular parallelepiped shape and a high center of gravity, and in addition, the adhesive layer T31 that is a support portion is soft and easily deformed. Therefore, the posture of the laminated chip 216 becomes unstable due to the entry of the cutting blade, and the cutting surface easily contacts the cutting blade.

  As a result, as shown in the side view of FIG. 16, a large number of scratches H due to the contact with the cutting blade are formed on the side surface 216b of the laminated chip 216 which is the cutting surface. Such a scratch H causes a defective shape of the laminated chip 216. In addition to this, when the internal electrodes 112 and 113 are exposed from the side surface 216b, a short circuit defect may occur. Therefore, the yield in the cutting process is reduced.

  On the other hand, according to the present embodiment, since the posture and position of each laminated chip 116 are completely fixed by the first outer layer 106b during cutting, it is possible to prevent the cutting surface from coming into contact with the cutting blade. As a result, as shown in FIG. 17, the side surface 116b having almost no scratches can be realized, and a decrease in yield due to a defective shape or a defective short circuit can be suppressed.

  Further, the first outer layer reached by the tip portion of the rotary blade P during cutting is removed in step S06. As a result, a step due to the tip portion is not formed on the end surface 116a and the side surface 116b, which are cut surfaces, and scratches can be more reliably prevented.

  Further, in the present embodiment, it is possible to fix each laminated chip 116 in the cutting process without significantly increasing the man-hours and introducing equipment. As a result, it is possible to easily improve the yield in the cutting process while maintaining the productivity.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the present invention.

  In the above-described embodiment, the manufacturing method in which the side margin portion 117 is attached to the laminated chip 116 afterwards has been described, but the present invention is not limited to this. For example, as shown in FIG. 18, the side margin portion 117 is formed by forming internal electrodes 112 and 113 including a plurality of rectangular patterns on the ceramic sheets 101 and 102 and cutting a margin portion around the internal electrodes 112 and 113. The ceramic element body 111 having the above may be diced as a laminated chip. Also in this case, it is possible to prevent the defective shape of the laminated chip 116 due to the scratches on the cut surface and the unstable posture.

  Further, the second cover region 107 does not have to have the second outer layer, and may have at least the second cover layer 107a. In this case, the step of removing the second outer layer 107b in step S04 becomes unnecessary.

  Further, the step of attaching the first tape T1 in step S02, the step of attaching the second tape T2 in step S05, and the step of peeling off the first tape T1 are not essential. For example, cutting without using these tapes T1 and T2. The ceramic laminate 104 may be fixed and cut by a vacuum chuck mechanism of the apparatus or the like.

  In the above-mentioned step S03, although the aspect which cuts the ceramic laminated body 104 by the rotary blade P was shown, you may use a push-cut blade. Also in this case, since the ceramic laminated body 104 can be fixed at the time of cutting, the defective shape of the laminated chip 116 can be effectively prevented.

  Further, in the above-described embodiment, the monolithic ceramic capacitor has been described as an example of the monolithic ceramic electronic component, but the present invention is applicable to all monolithic ceramic electronic components in which internal electrodes forming a pair are alternately arranged. Examples of such a monolithic ceramic electronic component include a piezoelectric element and the like.

DESCRIPTION OF SYMBOLS 10 ... Multilayer ceramic capacitor 11 ... Ceramic body 12, 13 ... Internal electrodes 14, 15 ... External electrode 16 ... Multilayer chip 17 ... Side margin part 19 ... First cover part 20 ... Second cover part 104 ... (unfired) Ceramic laminate 105 ... Electrode laminate region 106 ... First cover region 106a ... First cover layer 106b ... First outer layer 107 ... Second cover region 107a ... Second cover layer 107b ... Second outer layer 116 ... (unfired) laminate Chip 117 ... (unfired) side margin

Claims (7)

A ceramic laminate having an electrode laminated region in which internal electrodes are laminated in a first direction via a ceramic sheet, and a first cover region and a second cover region that respectively cover the electrode laminated region from both sides in the first direction. Wherein the first cover area includes a first cover layer on the electrode laminated area and a first outer layer outside the first cover layer, and a ceramic laminated body is prepared.
Cutting the ceramic laminate without dividing the first outer layer from the surface of the second cover region to the first outer layer,
A method for manufacturing a monolithic ceramic electronic component, wherein a monolithic chip is singulated from the ceramic laminate by removing the first outer layer. A method for manufacturing a monolithic ceramic electronic component according to claim 1,
A method for manufacturing a monolithic ceramic electronic component, comprising cutting the ceramic laminate with a rotary blade. A method for manufacturing a monolithic ceramic electronic component according to claim 1 or 2, wherein
The laminated chip has a cut surface at which the internal electrodes are exposed,
A method of manufacturing a laminated ceramic electronic component, wherein a side margin portion is formed on the cut surface of the laminated chip. It is a manufacturing method of the multilayer ceramic electronic component according to any one of claims 1 to 3,
A method for manufacturing a monolithic ceramic electronic component, wherein the first outer layer is removed by cutting the entire surface orthogonal to the first direction with a substantially uniform thickness in the first direction. A method for manufacturing a monolithic ceramic electronic component according to any one of claims 1 to 4,
The first outer layer has a thickness of 50 μm or more. A method for manufacturing a monolithic ceramic electronic component according to any one of claims 1 to 5, comprising:
The second cover region includes a second cover layer on the electrode laminated region and a second outer layer outside the second cover layer,
A method of manufacturing a laminated ceramic electronic component, wherein the second outer layer is removed after cutting the ceramic laminated body. A method for manufacturing a monolithic ceramic electronic component according to claim 6, wherein
The method for manufacturing a monolithic ceramic electronic component, wherein the second outer layer is removed by cutting the entire surface orthogonal to the first direction in a substantially uniform thickness in the first direction.

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