JP2020061529A - Manufacturing method of electronic device and adhesive film - Google Patents

Abstract

To provide a manufacturing method of an electronic device, capable of simplifying a pick-up step and selectively picking-up an electronic component.SOLUTION: A manufacturing method of an electronic device, includes: a step of preparing a first structure 100 having two or more electronic components a adhered onto a first surface 10A of a first adhesive film 10; a step of reducing an adhesion force to each electronic component by bridging or expanding an adhesion resin layer of the first adhesive film by irradiating a radiation ray to a portion where an electronic component b which is scheduled to be picked-up from a second surface 10B side opposite to the first surface of the adhesive film; and a step of transferring the electric component from the first adhesive film to the second adhesive film by peeling the second adhesive film from the first structure after the second adhesive film 20 which can be peeled by applying a stress is crimped to a surface on the side where the electronic component in the first structure is adhered.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing an electronic device and an adhesive film.

In the manufacturing process of an electronic device, a process of selectively picking up a target electronic component from a plurality of individual electronic components (for example, semiconductor chips) is performed.
In such a pick-up process, for example, electronic components attached on an adhesive film are adsorbed and picked up one by one (see, for example, Patent Document 1).

JP, 2005-79151, A

In recent years, the size of individualized electronic components has become finer, so that the number and types of electronic components to be picked up in the pickup process are increasing.
Therefore, in the step of picking up the electronic component, it is required to selectively pick up the target electronic component from the plurality of individualized electronic components in a shorter time.

  The present invention has been made in view of the above circumstances, and provides a method of manufacturing an electronic device capable of simplifying a pickup process and selectively picking up an electronic component.

  The present inventors have earnestly studied to achieve the above object. As a result, by reducing the adhesive strength of the adhesive film at the site where the intended electronic component is attached by irradiation with radiation, the adhesive film that can be peeled off by applying stress is used. The present invention has been completed by finding that the pickup process can be simplified by picking up components and that electronic components can be selectively picked up.

  According to the present invention, the following electronic device manufacturing method and adhesive film are provided.

[1]
A step (A) of preparing a first structure including a first adhesive film and two or more electronic components (a) attached to the first surface of the first adhesive film;
From the second surface side opposite to the first surface of the first adhesive film, to the portion where the electronic component (b) to be picked up in the electronic component (a) is attached, A step (B) of reducing the adhesive force of the first adhesive film to the electronic component (b) by irradiating with radiation to crosslink or expand the adhesive resin layer constituting the first adhesive film; ,
After the second adhesive film that can be peeled off by applying stress is pressure-bonded to the surface of the first structure on which the electronic component (a) is attached, the second adhesive film is then attached. (C) of transferring the electronic component (b) from the first adhesive film to the second adhesive film by peeling the electronic component (b) from the first structure,
A method for manufacturing an electronic device including the.
[2]
In the method of manufacturing an electronic device according to the above [1],
A step (D1) of sealing the electronic component (b) attached to the second adhesive film with a sealing material after the step (C),
After the step (D1), a step (E1) of peeling the electronic component (b) from the second adhesive film by applying stress to the second adhesive film;
A method for manufacturing an electronic device, further comprising:
[3]
In the method of manufacturing an electronic device according to the above [1],
After the step (C), the method further comprises a step (E2) of peeling the electronic component (b) from the second adhesive film by applying stress to the second adhesive film,
In the step (E2), after the second adhesive film is pressure-bonded to the fixing material so that the side of the second adhesive film to which the electronic component (b) is attached is the fixing material side, A method for manufacturing an electronic device, comprising transferring the electronic component (b) from the second adhesive film to the fixing material by peeling the second adhesive film from the electronic component (b).
[4]
In the method for manufacturing an electronic device according to the above [3],
The manufacturing method of an electronic device further comprising a step (D2) of sealing the electronic component (b) fixed to the fixing material with a sealing material after the step (E2).
[5]
In the method of manufacturing an electronic device according to any one of [1] to [4] above,
The said 2nd adhesive film is a manufacturing method of the electronic device containing a resin layer which has a base and the some column-shaped convex part formed in the surface of the said base.
[6]
In the method for manufacturing an electronic device according to the above [5],
A method for manufacturing an electronic device, wherein the height of the columnar protrusions in the resin layer is 100 nm or more and 200 μm or less.
[7]
In the method of manufacturing an electronic device according to any one of [1] to [6] above,
The said 1st adhesive film is a manufacturing method of the electronic device containing a base material layer and an adhesive resin layer.
[8]
In the method for manufacturing an electronic device according to any one of [1] to [7] above,
In the step (C), the region of the first adhesive film to which the electronic component (a) is attached is expanded in the in-plane direction of the film to increase the interval between the adjacent electronic components (a). The manufacturing method of the electronic device which transfers the said electronic component (b) from the said 1st adhesive film to the said 2nd adhesive film in the state made to stand.
[9]
The second adhesive film used in the method for manufacturing an electronic device according to any one of [1] to [8],
An adhesive film comprising a resin layer having a base and a plurality of columnar protrusions formed on the surface of the base.
[10]
In the adhesive film according to the above [9],
An adhesive film in which the height of the columnar convex portion is 100 nm or more and 200 μm or less.

  According to the present invention, it is possible to provide a method of manufacturing an electronic device capable of simplifying a pickup process and selectively picking up an electronic component.

FIG. 6 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention. FIG. 6 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention. It is sectional drawing which showed typically an example of the structure of the 2nd adhesive film of embodiment which concerns on this invention.

  Embodiments of the present invention will be described below with reference to the drawings. In all the drawings, the same constituents will be referred to with the same numerals, and the description thereof will not be repeated. Moreover, the figure is a schematic view and does not match the actual dimensional ratio. Unless otherwise specified, “A to B” in the numerical range represents A or more and B or less. Moreover, in this embodiment, "(meth) acryl" means acryl, methacryl, or both acryl and methacryl.

  1 and 2 are flow charts showing an example of a method for manufacturing an electronic device according to the present invention.

The method for manufacturing an electronic device according to this embodiment includes at least the following three steps.
(A) A step of preparing a first structure 100 including a first adhesive film 10 and two or more electronic components (a) attached to a first surface 10A of the first adhesive film 10 (B) ) From the second surface 10B side opposite to the first surface 10A of the first adhesive film 10 to the portion where the electronic component (b) to be picked up in the electronic component (a) is attached A step of reducing the adhesive force of the first adhesive film 10 to the electronic component (b) by irradiating with radiation to crosslink or expand the adhesive resin layer forming the first adhesive film 10 (C) Stress The second adhesive film 20 that can be peeled off by applying pressure is pressure-bonded to the surface of the first structure 100 on which the electronic component (a) is attached, and then the second adhesive film 20 is attached. First structure 10 By peeling from the step of transferring the electronic component (b) from the first pressure-sensitive adhesive film 10 to the second adhesive film 20

According to the method of manufacturing an electronic device according to the present embodiment, radiation is applied to a portion of the electronic component (a) to which the electronic component (b) to be picked up is attached, and the electronic component (b) is irradiated. ), The second adhesive film 20 is used to transfer the electronic component (b) from the first adhesive film 10 to the second adhesive film 20. As a result, the pickup process can be simplified, and electronic components can be selectively picked up.
That is, in the method for manufacturing an electronic device according to the present embodiment, the target electronic component (b) is easily peeled off by radiation, and then the second adhesive film 20 is used to target the plurality of target electronic components (b). To pick up at the same time. Here, since the second adhesive film 20 can be peeled off by applying stress without irradiating energy rays such as heat and radiation, damage to the electronic component (b) due to heat and radiation etc. Can be suppressed. Further, when the electronic component (b) is peeled from the second adhesive film 20, the load applied to the electronic component (b) can be suppressed, and as a result, the electronic component (b) is prevented from being damaged by the load. be able to. Therefore, by using the method for manufacturing an electronic device according to the present embodiment, it is possible to suppress damage to the electronic component (b), and as a result, it is possible to obtain an electronic device having excellent reliability.
Further, since the second adhesive film 20 can be peeled off by applying stress, it is not necessary to crosslink, expand, foam or vaporize the second adhesive film. That is, since it does not cause an irreversible reaction with the second adhesive film, the second adhesive film 20 can be used repeatedly. Therefore, the second adhesive film 20 used once can be reused as it is, and for example, the frequency of replacing the second adhesive film 20 with a new film can be reduced.
As described above, according to the method of manufacturing the electronic device of the present embodiment, the pickup process can be simplified, and the electronic components can be selectively picked up.

1. First Adhesive Film The first adhesive film 10 used in the method for manufacturing an electronic device according to this embodiment will be described below.
The 1st adhesive film 10 which concerns on this embodiment is equipped with a base material layer and an adhesive resin layer, for example. Hereinafter, each layer which comprises the 1st adhesive film 10 which concerns on this embodiment is demonstrated.

<Base material layer>
The base material layer is a layer provided for the purpose of improving the handling properties, mechanical properties, heat resistance, and other properties of the first adhesive film 10.
The base material layer is not particularly limited, and examples thereof include a resin film.
As the resin forming the base material layer, a known thermoplastic resin can be used. For example, polyolefins such as polyethylene, polypropylene, poly (4-methyl-1-pentene) and poly (1-butene); polyesters such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate; nylon-6, nylon-66, poly. Polyamides such as methaxylene adipamide; polyacrylates; polymethacrylates; polyvinyl chloride; polyvinylidene chloride; polyimides; polyetherimides; polyamideimides; ethylene-vinyl acetate copolymers; polyacrylonitrile; polycarbonates; polystyrenes; ionomers; Polysulfone; Polyether sulfone; Polyether ether ketone; Polyphenylene sulfide; Polyphenylene ether; Polyester elastomer, Polyamide elastomer May be mentioned one selected from such or of two or more; chromatography, polyimide elastomers, elastomers such as polyethylene terephthalate and polybutylene terephthalate.
Among these, one or two or more selected from polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, polyimide, ethylene-vinyl acetate copolymer, from the viewpoint of excellent balance of transparency, mechanical strength, price, etc. Preferably, one or more selected from polyethylene terephthalate and polyethylene naphthalate are more preferable.

The base material layer may be a single layer or two or more types of layers.
The form of the resin film used for forming the base material layer may be a stretched film or a film stretched in a uniaxial direction or a biaxial direction.

The thickness of the substrate layer is preferably 10 μm or more and 1000 μm or less, more preferably 10 μm or more and 500 μm or less, and further preferably 20 μm or more and 300 μm or less from the viewpoint of obtaining good film characteristics.
The base material layer may be surface-treated in order to improve the adhesiveness with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coat treatment, or the like may be performed.

  The total light transmittance of the base material layer is preferably 85% or more, more preferably 90% or more. By doing so, transparency can be imparted to the base material layer. Then, by setting the total light transmittance of the base material layer to the lower limit value or more, by irradiating radiation from the base material layer side in the first adhesive film 10 according to the present embodiment, the adhesive resin layer Radiation can be effectively irradiated, and radiation irradiation efficiency can be improved. The total light transmittance of the base material layer can be measured according to JIS K7375.

<Adhesive resin layer>
The adhesive resin layer is a layer provided on one surface side of the base material layer, and is a layer that comes into contact with the electronic component (a) and adheres thereto.
The pressure-sensitive adhesive constituting the pressure-sensitive adhesive resin layer includes a radiation-crosslinking pressure-sensitive adhesive that is cross-linked to reduce its adhesive strength by irradiating with radiation, or swelling or foaming by irradiating with radiation, particularly ultraviolet light or infrared light. Alternatively, a radiation-peelable pressure-sensitive adhesive or the like that vaporizes to reduce the adhesive force may be used.

  The adhesive resin layer composed of the radiation-crosslinking adhesive is crosslinked by irradiation of radiation and the adhesive strength is significantly reduced, so that the electronic component is easily peeled from the first adhesive film 10. Examples of the radiation include ultraviolet rays, electron beams and infrared rays.

  Examples of the pressure-sensitive adhesive that constitutes the radiation-crosslinkable pressure-sensitive adhesive include (meth) acrylic pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, olefin-based pressure-sensitive adhesives, and styrene-based pressure-sensitive adhesives. Among these, a (meth) acrylic pressure-sensitive adhesive containing a (meth) acrylic polymer as a base polymer is preferable because the adhesive force can be easily adjusted.

Examples of the (meth) acrylic polymer contained in the (meth) acrylic pressure-sensitive adhesive include a homopolymer of a (meth) acrylic acid ester compound and a copolymer of a (meth) acrylic acid ester compound and a comonomer. Can be mentioned. Examples of the (meth) acrylic acid ester compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth). Examples thereof include acrylate, dimethylaminoethyl (meth) acrylate, glycidyl (meth) acrylate and the like. These (meth) acrylic acid ester compounds may be used alone or in combination of two or more.
Examples of the comonomer forming the (meth) acrylic copolymer include vinyl acetate, (meth) acrylonitrile, styrene, (meth) acrylic acid, itaconic acid, (meth) acrylic amide, and methylol (meth) acrylic. Examples thereof include amide and maleic anhydride. These comonomers may be used alone or in combination of two or more.

  The radiation-crosslinking pressure-sensitive adhesive contains, for example, the (meth) acrylic polymer, a crosslinkable compound (a component having a carbon-carbon double bond), and a photopolymerization initiator or a thermal polymerization initiator.

Examples of the crosslinkable compound include monomers, oligomers or polymers having a carbon-carbon double bond in the molecule and capable of being crosslinked by radical polymerization. Examples of such a crosslinkable compound include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and neo. Esters of (meth) acrylic acid such as pentyl glycol di (meth) acrylate and dipentaerythritol hexa (meth) acrylate with polyhydric alcohols; ester (meth) acrylate oligomers; 2-propenyldi-3-butenyl cyanurate, 2 -Hydroxyethyl bis (2- (meth) acryloxyethyl) isocyanurate, isocyanurates such as tris (2-methacryloxyethyl) isocyanurate, or isocyanurate compounds.
When the (meth) acrylic polymer is a radiation crosslinkable polymer having a carbon-carbon double bond in the side chain of the polymer, the crosslinkable compound may not be added.

  The content of the crosslinkable compound is preferably 5 to 900 parts by mass, more preferably 5 to 100 parts by mass, and further preferably 10 to 50 parts by mass with respect to 100 parts by mass of the (meth) acrylic polymer. When the content of the crosslinkable compound is in the above range, it becomes easier to adjust the adhesive force as compared with the case where the content is less than the above range, and the sensitivity to heat or light is too high compared to the case where the content is more than the above range. The storage stability is unlikely to decrease.

  The photopolymerization initiator may be any compound that can be cleaved by irradiation to generate a radical, for example, benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether; benzyl, benzoin, benzophenone. Aromatic ketones such as α-hydroxycyclohexyl phenyl ketone; aromatic ketals such as benzyl dimethyl ketal; polyvinyl benzophenone; thioxanthones such as chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone and diethylthioxanthone.

  Examples of the thermal polymerization initiator include organic peroxide derivatives and azo polymerization initiators. An organic peroxide derivative is preferable because nitrogen is not generated during heating. Examples of thermal polymerization initiators include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxyesters and peroxydicarbonates.

A crosslinking agent may be added to the adhesive. Examples of the cross-linking agent include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, and diglycerol polyglycidyl ether; tetramethylolmethane-tri-β-aziridinyl propionate. , Trimethylolpropane-tri-β-aziridinylpropionate, N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxamide), N, N'-hexamethylene-1,6-bis Examples thereof include aziridine compounds such as (1-aziridinecarboxamide); isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate and polyisocyanate.
The content of the cross-linking agent is 0.05 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the (meth) acrylic polymer from the viewpoint of improving the balance between the heat resistance and the adhesive force of the adhesive resin layer. Preferably there is.

Examples of the radiation-peelable pressure-sensitive adhesive include a radiation-gas-generating pressure-sensitive adhesive containing a component that generates gas upon irradiation with radiation, and a heat-foaming pressure-sensitive adhesive containing heat-expandable microspheres that can expand at a high temperature to reduce the adhesive strength. Is mentioned.
When the heat-expandable fine particles and the foaming agent expand due to heating, or when the adhesive component undergoes a crosslinking reaction due to heat, the surface state of the adhesive resin layer changes or the adhesive area decreases significantly. The adhesive force between the electronic component and the first adhesive film 10 can be reduced, and as a result, the electronic component (b) can be easily peeled from the first adhesive film 10.

  As the gas generating component used in the radiation gas generating adhesive, for example, an azo compound, an azide compound, a Meldrum's acid derivative or the like can be used. Inorganic foaming agents such as ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, various azides, etc., and water; trifluoromonofluoromethane, dichloromonofluoromethane, etc. Compounds; azo compounds such as azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate; paratoluenesulfonyl hydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis (benzenesulfonyl Hydrazine), allylbis (sulfonylhydrazide) and other hydrazine compounds; p-toluylenesulfonyl semicarbazide, 4,4′-oxybis (benzenesulfonyl semicarbazide) and other semicarbazide compounds; Triazole compounds such as -1,2,3,4-thiatriazole; N-nitroso compounds such as N, N'-dinitrosopentamethylenetetramine and N, N'-dimethyl-N, N'-dinitrosoterephthalamide An organic foaming agent such as a compound can also be used. The gas generating component may be added to the adhesive resin or may be directly bonded to the adhesive resin.

As the heat-expandable microspheres used for the heat-foamable pressure-sensitive adhesive, for example, a microencapsulated foaming agent can be used. Examples of such heat-expandable microspheres include microspheres in which a substance that is easily gasified and expanded by heating such as isobutane, propane, and pentane is included in an elastic shell. Examples of the material forming the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like. The heat-expandable microspheres can be produced by, for example, a coacervation method, an interfacial polymerization method, or the like.
The heat-expandable microspheres can be added to the adhesive resin.

As the pressure-sensitive adhesive constituting the radiation-peelable pressure-sensitive adhesive, generally known pressure-sensitive adhesives can be used, and examples thereof include (meth) acrylic pressure-sensitive adhesives, silicone pressure-sensitive adhesives, rubber pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives. , Polyvinyl ether-based adhesives and the like.
As the (meth) acrylic polymer used for the (meth) acrylic pressure-sensitive adhesive, for example, the same one as the (meth) acrylic polymer used for the above-mentioned radiation-crosslinkable pressure-sensitive adhesive can be used. .

  The thickness of the adhesive resin layer is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 3 μm or more and 50 μm or less.

The adhesive resin layer can be formed, for example, by applying an adhesive coating liquid on the base material layer.
As a method of applying the pressure-sensitive adhesive coating solution, conventionally known coating methods such as a roll coater method, a reverse roll coater method, a gravure roll method, a bar coat method, a comma coater method, and a die coater method can be adopted. The drying conditions of the applied pressure-sensitive adhesive are not particularly limited, but generally, it is preferable to dry the pressure-sensitive adhesive in the temperature range of 80 to 200 ° C. for 10 seconds to 10 minutes. More preferably, it is dried at 80 to 170 ° C. for 15 seconds to 5 minutes. In order to sufficiently accelerate the crosslinking reaction between the crosslinking agent and the pressure-sensitive adhesive, the pressure-sensitive adhesive coating solution may be heated at 40 to 80 ° C. for about 5 to 300 hours after completion of drying.

<Other layers>
The 1st adhesive film 10 which concerns on this embodiment may provide the adhesive layer (not shown) between each layer. With this adhesive layer, the adhesiveness between the layers can be improved.

  The total light transmittance of the first adhesive film 10 according to the present embodiment is preferably 85% or more, more preferably 90% or more. By doing so, transparency can be imparted to the first adhesive film 10. Then, by setting the total light transmittance of the first adhesive film 10 to the above lower limit value or more, when the first adhesive film 10 according to the present embodiment is irradiated with radiation from the base material layer side, the adhesive resin The layer can be more effectively irradiated with radiation, and the radiation irradiation efficiency can be improved. The total light transmittance of the first adhesive film 10 can be measured according to JIS K7375.

  The total thickness of the first adhesive film 10 according to the present embodiment is preferably 25 μm or more and 1100 μm or less, more preferably 100 μm or more and 900 μm or less, and further preferably, from the balance of mechanical characteristics and handleability. It is 200 μm or more and 800 μm or less.

2. Second Adhesive Film The second adhesive film 20 according to the present embodiment has an adhesive force enough to hold an electronic component, and is peeled off from the electronic component when a stress such as rotation, tension or warpage is applied. There is no particular limitation as long as it is a film that can be applied. FIG. 3 is a cross-sectional view schematically showing an example of the structure of the second adhesive film 20 of the embodiment according to the present invention.

As the second adhesive film 20 according to the present embodiment, for example, as shown in FIG. 3, a resin including a resin layer 21 having a base portion 21B and a plurality of columnar convex portions 21A formed on the surface of the base portion 21B. A film (P) is mentioned.
Such a resin film (P) can physically adsorb the electronic component by, for example, the plurality of columnar convex portions 21A formed on the surface of the base portion 21B entering into the irregularities of the electronic component. Then, the resin film (P) has, for example, a shear stress (rotational stress), a horizontal tensile stress, a vertical tensile stress, or the like with respect to the plurality of columnar convex portions 21A that physically adsorbs the electronic component. By applying stress or applying stress by bending the adhesive film (P), the positions of the plurality of columnar convex portions 21A and the electronic component are displaced, and the electronic component is peeled from the resin film (P). can do.

  Further, since the resin film (P) does not use an adhesive component that contaminates the electronic component, by using the resin film (P) as the second adhesive film 20, the adhesive derived from the adhesive on the surface of the electronic component (b). It is possible to suppress the adhesion of organic components. Furthermore, the resin film (P) does not need to be crosslinked, expanded, foamed or vaporized. That is, when the resin film (P) is used, since it does not cause an irreversible reaction with the resin film (P), the resin film (P) can be repeatedly used. Therefore, the second adhesive film 20 using the resin film (P) that has been used once can be reused as it is, and for example, the frequency of exchanging the second adhesive film 20 with a new film can be reduced.

The “columnar shape” in the present embodiment is not limited to the shape of the surface cut in the direction perpendicular to the base portion 21B being a quadrangle, and may include other polygons such as a triangle, and an irregular shape. Further, not only those having the same size on the upper surface and the lower surface, but also those having a smaller size and a larger size on the lower surface than the upper surface are included. Not only the columnar shape, but also a substantially columnar shape, a polygonal columnar shape, a conical columnar shape, and the like are included in the “columnar shape” here. Further, a shape in which the upper surface and the lower surface have different shapes is also included in the “columnar shape” here.
The plurality of columnar convex portions 21A need not all have the same shape, and may be individually different depending on the purpose such as adhesion control. Further, the columnar convex portion 21A may have a fine concavo-convex structure on its side surface or upper surface. The columnar convex portion may be formed on one surface of the base portion or may be formed on both surfaces.

The plurality of columnar convex portions 21A preferably have a nail-like structure composed of columns and a tower top having a diameter larger than the column diameter. The projection shape of the tower top is preferably a circle, an ellipse, or a polygon.
The columnar shape of the plurality of columnar convex portions 21A is not particularly limited, and examples thereof include any shape such as a columnar shape, a conical shape, a tapered shape, an inverse tapered shape, a rectangular parallelepiped shape, and a polygonal columnar shape. Further, the pillar shape of the plurality of pillar-shaped convex portions 21A may have a central axis inclined with respect to the vertical direction.

In the resin film (P) according to the present embodiment, the height of the columnar convex portion 21A is appropriately set according to the size of the electronic component (a) and is not particularly limited, but is, for example, 100 nm or more and 200 μm or less. is there.
In the resin film (P) according to the present embodiment, when the height of the columnar convex portion 21A is equal to or more than the lower limit value, a gap is formed between the convex portions when the convex top portion is brought into contact with an electronic component, and It is easy for gas to pass between the parts and the base, and sufficient air permeability is obtained. Further, the resin film (P) according to the present embodiment has good moldability when the height of the columnar convex portions 21A is equal to or less than the above upper limit value.
All of the plurality of columnar convex portions 21A do not have to have the same height and may be individually different, but preferably all have the same height.

In the resin film (P) according to the present embodiment, the number (density) of the columnar convex portions 21A per unit area of the projected area on at least a part of the surface of the base portion 21B depends on the size of the electronic component (a). is not particularly limited because it is set appropriately Te is preferably 10 ⁴ / cm ² or more ^{10 10} present / cm ² or less, more it is 10 ⁴ / cm ² or more 10 ^nine / cm ² or less It is preferably 10 ⁵ lines / cm ² or more and 10 ⁷ lines / cm ² or less.
In the resin film (P) according to the present embodiment, when the number (density) of the columnar convex portions 21A per unit area of the projected area on at least a part of the surface of the base portion 21B is equal to or more than the lower limit value, as designed. It becomes easy to form the convex shape. Further, in the resin film (P) according to the present embodiment, when the number (density) of the columnar convex portions 21A per unit area of the projected area on at least a part of the surface of the base portion 21B is equal to or less than the upper limit value, It is possible to suppress the burden of contact with electronic components such as friction.
In the present embodiment, the “projected area of the surface of the base portion 21B” means the area of a projected image when the base portion 21B is placed on a horizontal plane and the base portion 21B is vertically projected toward the horizontal plane.

The diameter of the plurality of columnar protrusions 21A in the resin film (P) according to the present embodiment is appropriately set according to the size of the electronic component (a) and is not particularly limited, but the shape during storage or use From the viewpoint of retention, the thickness is preferably 100 nm or more and 200 μm or less, and more preferably 100 nm or more and 100 μm or less.
Further, in the resin film (P) according to this embodiment, the distance between the adjacent columnar convex portions 21A is preferably, for example, 100 nm or more and 500 μm or less.
Further, the aspect ratio (diameter / height) of the plurality of columnar convex portions 21A in the resin film (P) according to the present embodiment is preferably 10.0 or less from the viewpoint of moldability, and 5.0. The following is more preferable. Further, the aspect ratio (diameter / height) is preferably 1.0 or more and 2.0 or less, and more preferably 1.0 or more and 1.2 or less from the viewpoint of adhesiveness. For example, it is preferable that, on average, three or more columnar convex portions 21A are bonded to one electronic component because the positioning accuracy is good.

In the resin film (P) according to this embodiment, at least the base portion 21B and the plurality of columnar convex portions 21A include the resin (P). The resin film (P) may contain a known additive such as an inorganic filler or a metal filler depending on a desired purpose such as improvement of mechanical properties or thermal conductivity.
The resin (P) is not particularly limited, but examples thereof include a thermoplastic resin, a thermosetting resin, and a radiation curable resin.

  As the thermosetting resin, for example, thermosetting polyimide resin, maleimide resin, thermosetting (meth) acrylic resin, thermosetting urethane (meth) acrylate resin, thermosetting epoxy (meth) acrylate resin. Examples of the resin include a resin, a thermosetting polyester (meth) acrylate resin, a thermosetting epoxy resin, and a thermosetting oxetane resin, which are not particularly limited, and conventionally known resins can be used.

  Examples of the radiation curable resin include a radiation curable (meth) acrylic resin, a radiation curable urethane (meth) acrylate resin, a radiation curable epoxy (meth) acrylate resin, and a radiation curable polyester (meth) acrylate resin. Examples of the radiation-curable epoxy resin, radiation-curable oxetane resin, etc. are not particularly limited, and conventionally known ones can be used.

  Examples of the thermosetting or radiation-curable (meth) acrylic resin include acrylic acid, methyl acrylate, ethyl acrylate, n-butyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, and acrylic acid 2. -Dimethylaminoethyl, 2-hydroxyethyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, t-butyl methacrylate, 2-ethylhexyl methacrylate, 2-dimethylaminoethyl methacrylate, methacrylic acid Examples thereof include various acrylic acids such as 2-hydroxyethyl acid, various acrylic esters, various methacrylic acids, and homopolymers or copolymers of various methacrylic acid ester monomers, but are not limited thereto. Absent.

The thermosetting or radiation-curable urethane acrylate resin is obtained by reacting, for example, a polyisocyanate with a hydroxyl group-containing unsaturated compound, and / or a polyisocyanate, a polyol, an ethylenically unsaturated group and a hydroxyl group. It can be obtained by reacting with a hydroxyl group-containing unsaturated compound contained therein.
Examples of the polyisocyanate include polyisocyanate monomers such as aromatic polyisocyanate, araliphatic polyisocyanate, aliphatic polyisocyanate (excluding pentamethylene diisocyanate), and alicyclic polyisocyanate.
Examples of aromatic polyisocyanates include tolylene diisocyanate (TDI), phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,5-naphthalene diisocyanate (NDI), diphenylmethane diisocyanate (MDI), 4,4′- Examples thereof include aromatic diisocyanates such as toluidine diisocyanate (TODI) and 4,4′-diphenyl ether diisocyanate.
Examples of the araliphatic polyisocyanate include xylylene diisocyanate (1,2-, 1,3- or 1,4-xylylene diisocyanate or a mixture thereof) (XDI), tetramethylxylylene diisocyanate (TMXDI), ω, Aroaliphatic diisocyanates such as ω'-diisocyanate-1,4-diethylbenzene are exemplified.
Examples of the aliphatic polyisocyanate include trimethylene diisocyanate, 1,2-propylene diisocyanate, butylene diisocyanate (tetramethylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate), 1 , 6-hexamethylene diisocyanate (HDI), 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, and aliphatic diisocyanates such as 2,6-diisocyanate methylcaprate.
Examples of the alicyclic polyisocyanate include hydrogenated xylylene diisocyanate (H6XDI), 1,3-cyclopentane diisocyanate, 1,3-cyclopentene diisocyanate, cyclohexane diisocyanate, 3-isocyanatomethyl-3,5,5-trimethyl. Alicyclic diisocyanates such as cyclohexyl isocyanate (IPDI), methylcyclohexane diisocyanate (methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate), norbornane diisocyanate (NBDI) and the like can be mentioned.

  The thermosetting or radiation-curable epoxy acrylate resin can be obtained, for example, by reacting a conventionally known epoxy resin or oxetane resin exemplified later with acrylic acid or methacrylic acid.

  Examples of the heat-curable or radiation-curable epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, xylene novolac type epoxy resin, and triene novolac type epoxy resin. Examples thereof include glycidyl isocyanurate, alicyclic epoxy resin, dicyclopentadiene novolac type epoxy resin, and biphenyl novolac type epoxy resin. These epoxy resins may be used alone or in admixture of two or more.

  Examples of the heat-curable or radiation-curable oxetane resin include alkyl oxetane such as oxetane, 2-methyloxetane, 2,2-dimethyloxetane, 3-methyloxetane, and 3,3-dimethyloxetane, and 3-methyl-3-. Methoxymethyl oxetane, 3,3'-di (trifluoromethyl) perfluoxetane, 2-chloromethyl oxetane, 3,3-bis (chloromethyl) oxetane and the like can be mentioned. These oxetane resins may be used alone or in admixture of two or more.

  The "thermoplastic resin" in the present embodiment is generally called a thermoplastic resin, which softens and exhibits fluidity as the temperature rises, and becomes relatively hard and strong when cooled, but has rubber-like elasticity. Copolymer having not only a high molecular compound but also a polymer that forms a crystalline hard segment having a high melting point or a hard segment having a high cohesive force and an amorphous polymer that forms a soft segment having a low glass transition temperature It also includes a thermoplastic elastomer, which is a polymer compound composed of a coalesced body, softening and fluidizing with an increase in temperature, becoming a relatively hard and strong state when cooled, and having rubber-like elasticity.

Examples of the thermoplastic resin include olefin resins, urethane resins, amide resins, polyimide resins, ester resins, (meth) acrylic resins, styrene resins, carbonate resins, and the like. These thermoplastic resins may be used alone or in combination of two or more.
The thermoplastic resin is at least one selected from the group consisting of olefin resins, urethane resins, amide resins, polyimide resins, ester resins, (meth) acrylic resins, styrene resins and carbonate resins. Preferably there is.
Olefin-based resins, urethane-based resins, and amide-based resins are soft elastic resins and are preferable because they can follow the uneven surface of the electronic component.
A carbonate-based resin is preferable because it can be used for a long time because it has a wide operating temperature range and excellent light resistance.

The olefin resin is not particularly limited, and conventionally known ones can be used. The "olefin resin" in the present embodiment means an olefin homopolymer, a copolymer of two or more olefins, a polymer blend or a polymer alloy of two or more olefins, or an olefin and another monomer. Means a copolymer of
Examples of the olefin resin include low density polyethylene, ultra low density polyethylene, linear low density polyethylene, medium density polyethylene, and high density polyethylene. As the olefin resin, for example, ethylene and various vinyl compounds such as α-olefin having 3 to 12 carbon atoms, styrene, vinyl acetate, (meth) acrylic acid, (meth) acrylic acid ester, and ionomer are used. Examples thereof include ethylene-based polymers such as copolymers. Further, as the olefin resin, for example, propylene homopolymer, block-type propylene / ethylene copolymer, random-type propylene / ethylene copolymer, block-type propylene / ethylene / butylene copolymer, random-type Examples include, but are not limited to, propylene-based polymers such as propylene / ethylene / butylene copolymers, α-olefin polymers having 4 or more carbon atoms such as polybutene and polymethylpentene, and cyclic olefin copolymers. It is not something that will be done.
As a commercially available product of the olefin-based resin, for example, "Toughmer (registered trademark)" series (for example, A4085S, XM-7070, A20085) manufactured by Mitsui Chemicals, Inc. can be used.

In the present embodiment, the olefin-based resin is preferably an olefin-based elastomer from the viewpoint of stretchability and conformability to electronic parts.
As the olefin elastomer, for example, at least polyolefin forms a crystalline hard segment having a high melting point, and another polymer (eg, polyolefin, other polyolefin, polyvinyl compound, etc.) is amorphous and has a low glass transition temperature. The thing which forms the segment is mentioned.
Examples of the polyolefin forming the hard segment include, but are not limited to, polyethylene, polypropylene, polybutene, and the like.

  As a commercially available product of the olefin-based elastomer, for example, the "Notio (registered trademark)" series (for example, PN 3560, PN 2060) manufactured by Mitsui Chemicals, Inc. can be used.

The urethane resin is not particularly limited, and conventionally known resins can be used. The urethane resin is basically obtained by a polymerization addition reaction using a polyol compound and a polyisocyanate compound as raw materials.
Examples of the polyol compound include polyhydric alcohols such as ethylene glycol, propylene glycol, tetramethylene glycol and glycerin; polyether polyols such as diethylene glycol, polyethylene glycol, dipropylene glycol and polypropylene glycol; polyester polyols and the like.
Examples of the polyisocyanate compound include, but are not limited to, ethylene diisocyanate, tolylene diisocyanate, and hexamethylene diisocyanate.

The amide-based resin is not particularly limited, and conventionally known resins can be used. The amide resin can be obtained by polycondensation of a diamine compound and a dicarboxylic acid compound, polycondensation of an aminocarboxylic acid compound, ring-opening polymerization of lactams, and the like.
As the diamine compound, for example, ethylenediamine, 1,2-propanediamine, hexamethylenediamine, octamethylenediamine, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, piperazine, 2,5-dimethylpiperazine, 4, 4'-diaminophenyl ether, xylylenediamine, etc. are mentioned.
As the dicarboxylic acid compound, for example, oxalic acid, malonic acid, succinic acid, adipic acid, acetone dicarboxylic acid, sebacic acid, fumaric acid, maleic acid, itaconic acid, citraconic acid, phthalic acid, isophthalic acid, terephthalic acid, 2- Examples thereof include butyl terephthalic acid, tetrachloroterephthalic acid, acetylenedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, and ω-poly (ethyleneoxy) dicarboxylic acid.
Examples of the aminocarboxylic acid compound include glycine, alanine, phenylalanine, ω-aminohexanoic acid, ω-aminodecanoic acid, ω-aminoundecanoic acid and the like.
Examples of lactams include, but are not limited to, ω-caprolactam, azetidinone, and pyrrolidone.

The amide resin also includes a polyamide elastomer.
The "polyamide-based elastomer" in the present embodiment is composed of a copolymer having a polymer that forms a hard segment that is crystalline and has a high melting point, and a polymer that forms a soft segment that is amorphous and has a low glass transition temperature. A polymer having an amide bond (-CONH-) in the main chain of a polymer forming a segment.
As the polyamide-based elastomer, for example, at least polyamide forms a crystalline hard segment having a high melting point, and another polymer (eg, polyester, polyether, etc.) forms an amorphous amorphous soft segment having a low glass transition temperature. Some of them are listed.
Specific examples of the polyamide-based elastomer include amide-based thermoplastic elastomer (TPA) defined in JIS K6418: 2007, but are not limited thereto.

The polyimide resin is not particularly limited, and conventionally known resins can be used.
Examples of the polyimide-based resin include, but are not limited to, polyimide, polyether imide and polyamide imide.

The ester resin is not particularly limited, and conventionally known resins can be used.
Examples of the ester-based resin include, but are not limited to, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, and polylactic acid.

  The (meth) acrylic resin is not particularly limited, and for example, a conventionally known homopolymer or copolymer exemplified by the thermosetting type or the radiation curing type can be used.

The styrene-based resin is not particularly limited, and conventionally known resins can be used, but polystyrene-based elastomer is preferable.
As the polystyrene-based elastomer, for example, at least polystyrene forms a hard segment, and other polymers (eg, polybutadiene, polyisoprene, polyethylene, hydrogenated polybutadiene, hydrogenated polyisoprene) are amorphous and have a low glass transition temperature. The soft segment may be formed, but the invention is not limited thereto.

  Specific examples of the polystyrene elastomer include styrene-butadiene copolymer [SB (polystyrene-polybutadiene), SBS (polystyrene-poly (butylene) block-polystyrene), SEBS (polystyrene-poly (ethylene / butylene) block). -Polystyrene)], styrene-isoprene copolymer [SIS (polystyrene-polyisoprene block-polystyrene)], styrene-propylene copolymer [SEP (polystyrene- (ethylene / propylene) block), SEPS (polystyrene-poly ( Ethylene / propylene) block-polystyrene), SEEPS (polystyrene-poly (ethylene-ethylene / propylene) block-polystyrene), SEB (polystyrene (ethylene / butylene) block)] It can be exemplified, but the invention is not limited thereto.

  As a commercially available product of the polystyrene-based elastomer, for example, "Tuftec" series manufactured by Asahi Kasei (for example, H1041, H1043, H1051, H1052, H1053, H1062, etc.) can be used.

The carbonate resin is not particularly limited, and conventionally known resins can be used.
Examples of the carbonate-based resin include bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4 Examples thereof include, but are not limited to, -hydroxyphenyl) butane.

  The columnar convex portion 21A is preferably formed by an ultraviolet imprint method or a thermal imprint method. According to the ultraviolet imprinting method or the thermal imprinting method, since the fine shape of the mold is accurately transferred, the shape as designed can be obtained, resulting in excellent moldability.

The resin film (P) according to this embodiment is a layer of a resin different from the resin contained in the base portion 21B and the columnar convex portion 21A on the surface of the surface of the base portion 21B where the columnar convex portion 21A is not formed. May have. Further, the resin film (P) according to the present embodiment has a resin different from the resin contained in the base portion 21B and the columnar convex portion 21A on the surface opposite to the surface on which the columnar convex portion 21A is formed. It may have a layer.
Examples of the different resin layers include a support and an adhesive layer.
The type of resin may be any type as long as it is different from the resin contained in the base portion 21B and the columnar convex portion 21A, and can be appropriately selected. The type of resin may be a thermosetting resin, a thermoplastic resin, or a radiation curable resin.

As shown in FIG. 3, the resin film (P) according to the present embodiment may further include a base material layer 23 in addition to the resin layer 21.
The base material layer is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the second adhesive film 20.
The base material layer 23 is not particularly limited, but for example, a resin film can be used.
As the resin forming the base material layer 23, a known thermoplastic resin can be used. For example, polyolefins such as polyethylene, polypropylene, poly (4-methyl-1-pentene) and poly (1-butene); polyesters such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate; nylon-6, nylon-66, poly. Polyamides such as methaxylene adipamide; polyacrylates; polymethacrylates; polyvinyl chloride; polyvinylidene chloride; polyimides; polyetherimides; polyamideimides; ethylene-vinyl acetate copolymers; polyacrylonitrile; polycarbonates; polystyrenes; ionomers; Polysulfone; Polyether sulfone; Polyether ether ketone; Polyphenylene sulfide; Polyphenylene ether; Polyester elastomer, Polyamide elastomer May be mentioned one selected from such or of two or more; chromatography, polyimide elastomers, elastomers such as polyethylene terephthalate and polybutylene terephthalate.
Among these, one or two or more selected from polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, polyimide, ethylene-vinyl acetate copolymer, from the viewpoint of excellent balance of transparency, mechanical strength, price, etc. Preferably, one or more selected from polyethylene terephthalate and polyethylene naphthalate are more preferable.

The base material layer may be a single layer or two or more types of layers.
The form of the resin film used for forming the base material layer may be a stretched film or a film stretched in a uniaxial direction or a biaxial direction.

The thickness of the substrate layer is preferably 10 μm or more and 1000 μm or less, more preferably 10 μm or more and 500 μm or less, and further preferably 20 μm or more and 300 μm or less from the viewpoint of obtaining good film characteristics.
The base material layer may be surface-treated in order to improve the adhesiveness with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coat treatment, or the like may be performed.

The thickness of the resin film (P) according to this embodiment is preferably 200 nm to 5 mm from the viewpoints of economy, moldability, handleability after molding, and the like.
In the resin film (P) according to the present embodiment, the thickness of the base portion 21B is preferably 100 nm to 5 mm, more preferably 1 μm to 5 mm, and more preferably 10 μm, from the viewpoint of moldability, handleability after molding, and the like. More preferably, it is -5 mm.

  The resin film (P) according to this embodiment can be produced, for example, with reference to paragraphs 0053 to 0062 of JP-A-2005-202609 and the description of the examples.

3. Method of Manufacturing Electronic Device Next, each step of the method of manufacturing the electronic device according to the present embodiment will be described.

(Process (A))
First, a first structure 100 including the first adhesive film 10 and two or more electronic components (a) attached to the first surface 10A of the first adhesive film 10 is prepared.

Such a first structure 100 is obtained by, for example, attaching the electronic component before singulation onto the first surface 10A (adhesive resin layer) of the first adhesive film 10 and then applying the electronic component 2 It can be manufactured by dicing the above electronic component (a).
Hereinafter, a method for manufacturing the first structure 100 will be described.

First, the electronic component before being separated is attached onto the adhesive resin layer of the first adhesive film 10.
Examples of electronic components to be attached to the first adhesive film 10 include semiconductor chips, semiconductor panels, semiconductor packages, semiconductor wafers, mold wafers, mold panels, mold array packages, and semiconductor substrates.
Further, examples of the semiconductor substrate include a silicon substrate, a sapphire substrate, a germanium substrate, a germanium-arsenic substrate, a gallium-phosphorus substrate, a gallium-arsenic-aluminum substrate, a gallium-arsenic substrate, and a lithium tantalate substrate.

  The electronic component attached to the first adhesive film 10 may be an electronic component for any purpose, for example, an electronic component for logic (for example, for communication, high frequency signal processing, etc.), for memory. , Electronic components for sensors, electronic components for power supplies, and the like. These may be used alone or in combination of two or more.

Here, the conditions for adhering the electronic component before being singulated onto the adhesive resin layer of the first adhesive film 10 are not particularly limited, but for example, the temperature is 25 to 80 ° C., the pressure is 0.05 to It can be 0.5 MPa.
The operation of sticking the first adhesive film 10 to the electronic component before being separated into pieces may be performed manually, but it is generally called an automatic sticking machine to which the roll-shaped first adhesive film 10 is attached. It can be performed by a device.

Then, the electronic component attached to the first adhesive film 10 is diced, and the electronic component is diced into two or more electronic components (a) to obtain the first structure 100.
Dicing of electronic components can be performed by a known method using a dicing blade (dicing saw), laser light, or the like.
"Dicing" here means
(A) An operation of dividing an electronic component by providing a cut having the same depth as the thickness of the electronic component with respect to the electronic component to obtain a plurality of individualized electronic components (hereinafter, also referred to as “full-cut dicing”) Say), and
(B) An operation of providing a plurality of electronic components by irradiating a laser beam with an altered region that does not lead to cutting of the electronic components (hereinafter, also referred to as “stealth dicing”) is included. Be done. In the case of stealth dicing, the electronic component is divided by the expansion of the first adhesive film 10 after laser light irradiation, and two or more individual electronic components (a) are obtained.
The electronic component (a) in the step (A) includes both a plurality of divided electronic components obtained by full-cut dicing and a plurality of electronic components obtained by stealth dicing and before being divided.

(Process (B))
Next, from the side of the second surface 10B opposite to the first surface 10A of the first adhesive film 10, the part to which the electronic component (b) to be picked up in the electronic component (a) is attached ( By irradiating the irradiation site 15) shown in FIG. 1 with radiation to crosslink or expand the adhesive resin layer constituting the first adhesive film 10, the first adhesive film 10 for the electronic component (b) is obtained. Reduce the adhesive strength of.
Here, when all the electronic components (a) are picked up at once, the entire second surface 10B of the first adhesive film 10 opposite to the first surface 10A may be irradiated with radiation.

By performing the step (B), the target electronic component (b) can be easily peeled from the first adhesive film 10. Further, it is possible to prevent the surface of the electronic component (b) from being contaminated by the adhesive component of the adhesive resin layer that constitutes the first adhesive film 10.
The radiation is applied from the second surface 10B side opposite to the first surface 10A of the first adhesive film 10.
Examples of the radiation include ultraviolet rays, electron beams, infrared rays and the like. Among these, ultraviolet rays or infrared rays are preferable.
When ultraviolet rays or infrared rays are used as the radiation, the irradiation with ultraviolet rays can be performed using, for example, a high pressure mercury lamp, an LED or a laser, and preferably using a laser. Infrared irradiation can be performed using, for example, an LED or a laser, and is preferably performed using a laser.

(Process (C))
Next, after the second adhesive film 20 is pressure-bonded to the surface of the first structure 100 on which the electronic component (a) is attached, the second adhesive film 20 is peeled off from the first structure 100. Thus, the electronic component (b) is transferred from the first adhesive film 10 to the second adhesive film 20. That is, in the step (C), the second adhesive film 20 is used to simultaneously pick up two or more electronic components (b) from the first adhesive film 10. By doing so, a plurality of electronic components (b) can be picked up at the same time, so that the electronic component pickup process can be simplified.
The method of pressing the second adhesive film 20 onto the surface of the first structure 100 on which the electronic component (a) is attached is not particularly limited, but, for example, between the support base 30 and the pressure head 40. A method of applying pressure after arranging in

In the step (C), the region of the first adhesive film 10 to which the electronic component (a) is attached is expanded in the in-plane direction of the film to enlarge the interval between the adjacent electronic components (a). Then, it is preferable to transfer the electronic component (b) from the first adhesive film 10 to the second adhesive film 20.
By doing so, the interval between the adjacent electronic components (a) is expanded, and it becomes easier to pick up the electronic components (b) from the first adhesive film 10. Further, due to the shear stress between the electronic component (b) and the first adhesive film 10 caused by the expansion of the first adhesive film 10 in the in-plane direction, the electronic component (b) and the first adhesive film 10 adhere to each other. Since the force is reduced, it becomes easier to pick up the electronic component (b) from the first adhesive film 10.

(Process (D))
Further, the method for manufacturing an electronic device according to the present embodiment may further include a step (D) of sealing the electronic component (b) with a sealing material.
The step (D) is, for example, a step (D1) of sealing the electronic component (b) attached to the second adhesive film 20 with a sealing material after the step (C), or a step (E2) described later. ), A step (D2) of sealing the electronic component (b) fixed to the fixing material 50 with a sealing material, and the like.

Here, in the step (D), the electronic component (b) is sealed with a sealing material. For example, the electronic component (b) can be sealed by covering the electronic component (b) with a sealing material and curing the sealing material by heating.
The form of the encapsulant is not particularly limited, and examples thereof include granular form, sheet form, and liquid form.

The sealing material is not particularly limited, but for example, an epoxy resin-based sealing material using an epoxy resin can be used. A liquid epoxy resin-based encapsulant is preferred because it enables even more uniform encapsulation of the electronic component (b).
As such an epoxy resin-based encapsulant, for example, T693 / R4000 series, T693 / R1000 series, T693 / R5000 series manufactured by Nagase Chemtex Co., Ltd. can be used.

  Examples of the sealing method include transfer molding, injection molding, compression molding and cast molding. After the electronic component is sealed with the sealing material, the sealing material is hardened by heating to obtain an electronic device in which the electronic component (b) is sealed.

(Process (E))
In the method for manufacturing an electronic device according to the present embodiment, a step (E) of peeling the electronic component (b) from the second adhesive film 20 by applying stress to the second adhesive film 20 is further performed. You can

  In the step (E), the stress applied to the second adhesive film 20 is not particularly limited as long as it is a stress capable of peeling the electronic component (b) from the second adhesive film 20, but, for example, shear stress ( (Rotational stress), horizontal tensile stress, vertical tensile stress, and the like. Further, the second adhesive film 20 can also be warped by applying a stress to the second adhesive film 20. By using such stress, the electronic component (b) can be peeled from the second adhesive film 20 while suppressing the load applied to the electronic component (b), and thus the reliability of the obtained electronic device is improved. Can be improved.

  The step (E) includes, for example, a step (E1) of peeling the electronic component (b) from the second adhesive film 20 by applying stress to the second adhesive film 20 after the step (D1), After the step (C), a step (E2) of peeling the electronic component (b) from the second adhesive film 20 by applying stress to the second adhesive film 20 can be mentioned.

Here, in the step (E2), as shown in FIG. 2, the second adhesive film 20 is placed so that the side to which the electronic component (b) of the second adhesive film 20 is attached becomes the fixing material 50 side. The electronic component (b) can be transferred from the second adhesive film 20 to the fixing material 50 by peeling the second adhesive film 20 from the electronic component (b) after pressure-bonding to the fixing material 50.
The fixing material 50 is not particularly limited, but is, for example, an adhesive film used as a dicing tape, a back grinding tape, or the like; used for temporarily fixing electronic components in the manufacturing process of a fan-out type WLP or a fan-out type PLP. A known adhesive film; a supporting substrate such as a quartz substrate, a glass substrate, a silicon substrate, or a SUS substrate; a semiconductor mounting substrate or the like can be used.

(Other processes)
The method of manufacturing the electronic device according to the present embodiment may have other steps than the above. As other steps, known steps in the method of manufacturing an electronic device can be used.

  For example, after performing the step (E1) or the step (D2), a step of forming a wiring layer or a bump on the electronic component, a step of mounting the electronic component on a mounting board (printed circuit board or the like), a mounting step of the electronic component, a wire You may further perform the arbitrary process etc. which are generally performed in the manufacturing process of an electronic device, such as a bonding process, a resin molding process, a CVD process, a reflow process, a plating process, a rewiring layer formation process, and an inspection process.

  Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted.

  It should be noted that the present invention is not limited to the above-described embodiment, and modifications, improvements, etc. within the scope of achieving the object of the present invention are included in the present invention.

a electronic component b electronic component 10 first adhesive film 10A first surface 10B second surface 13 radiation 15 irradiation site 20 second adhesive film 21 resin layer 21A convex portion 21B base portion 23 base material layer 30 support base 40 pressure head 50 fixing material 100 first structure

Claims (10)

A step (A) of preparing a first structure including a first adhesive film and two or more electronic components (a) attached to the first surface of the first adhesive film;
From the second surface side opposite to the first surface of the first adhesive film, to the portion of the electronic component (a) where the electronic component (b) to be picked up is attached, A step (B) of reducing the adhesive force of the first adhesive film to the electronic component (b) by irradiating with radiation to crosslink or expand the adhesive resin layer forming the first adhesive film; ,
After the second adhesive film that can be peeled off by applying stress is pressure-bonded to the surface of the first structure on which the electronic component (a) is attached, the second adhesive film is then attached. (C) transferring the electronic component (b) from the first adhesive film to the second adhesive film by peeling the electronic component (b) from the first structure,
A method for manufacturing an electronic device including the. The method of manufacturing an electronic device according to claim 1,
A step (D1) of sealing the electronic component (b) attached to the second adhesive film with a sealing material after the step (C),
After the step (D1), a step (E1) of peeling the electronic component (b) from the second adhesive film by applying stress to the second adhesive film;
A method for manufacturing an electronic device, further comprising: The method of manufacturing an electronic device according to claim 1,
After the step (C), the method further comprises a step (E2) of peeling the electronic component (b) from the second adhesive film by applying stress to the second adhesive film,
In the step (E2), after the second adhesive film is pressure-bonded to the fixing material so that the side of the second adhesive film to which the electronic component (b) is attached is the fixing material side, A method for manufacturing an electronic device, comprising transferring the electronic component (b) from the second adhesive film to the fixing material by peeling the second adhesive film from the electronic component (b). The method of manufacturing an electronic device according to claim 3,
After the step (E2), a method of manufacturing an electronic device further including a step (D2) of sealing the electronic component (b) fixed to the fixing material with a sealing material. The method of manufacturing an electronic device according to claim 1, wherein
The said 2nd adhesive film is a manufacturing method of the electronic device containing the resin layer which has a base and the some column-shaped convex part formed in the surface of the said base. The method of manufacturing an electronic device according to claim 5,
A method for manufacturing an electronic device, wherein the height of the columnar protrusions in the resin layer is 100 nm or more and 200 μm or less. The method of manufacturing an electronic device according to claim 1, wherein
The first adhesive film is a method of manufacturing an electronic device including a base material layer and an adhesive resin layer. The method of manufacturing an electronic device according to claim 1, wherein
In the step (C), the region of the first adhesive film to which the electronic component (a) is attached is expanded in the in-plane direction of the film to increase the interval between the adjacent electronic components (a). The manufacturing method of the electronic device which transfers the said electronic component (b) from the said 1st adhesive film to the said 2nd adhesive film in the state made to stand. It is the said 2nd adhesive film used for the manufacturing method of the electronic device as described in any one of Claims 1 thru | or 8, Comprising:
An adhesive film comprising a resin layer having a base and a plurality of columnar protrusions formed on the surface of the base. The adhesive film according to claim 9,
An adhesive film in which the height of the columnar convex portion is 100 nm or more and 200 μm or less.

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