JP2020061491A - Mounting system, mounting method, and mounting program - Google Patents

Abstract

To hasten the inspection timing of the mounting state of a first target on the second target.SOLUTION: A mounting system 1 includes: a mounting unit 2; an imaging unit 3; and a correction unit 4. The mounting unit 2 is configured to move a capturing unit which has captured a first object towards a second object, and after mounting the first object at the target position on the second object, to move the capturing unit in a direction away from the second object. The imaging unit 3 is configured so as to, when the capturing unit moves in a direction away from the second object, pick up an image of a specific area that includes the first object mounted on the second object as a photogenic subject. The correction unit 4 is configured so as to, when the first object is mounted on a second object following the second object mounted with the first object, correct the operation of the mounting unit 2 on the basis of a piece of error information. The error information is a piece of information of an error between the target position and the mounting position where the first object is mounted on the second object, which is obtained from the imaging data of imaging unit 3.SELECTED DRAWING: Figure 2

Description

  The present disclosure relates to a mounting system, a mounting method, and a mounting program. More specifically, the present disclosure relates to a mounting system, a mounting method, and a mounting program for mounting a first object on a second object.

  Patent Document 1 describes an electronic component mounting apparatus capable of inspecting the positional deviation of mounted components and the presence / absence of mounted components.

  In the electronic component mounting apparatus described in Patent Document 1, the suction head sucks the component by the suction nozzle, moves to the position of the component recognition camera, the suction component is captured by the component recognition camera, and the image is processed by the image processing apparatus. And the suction deviation is calculated. After that, the suction head moves to the board, the suction deviation calculated above is corrected, and the component is mounted at a predetermined position on the board.

  Furthermore, in the electronic component mounting apparatus described in Patent Document 1, after the component is mounted on the board, the mark is picked up by the mark recognition camera, the image is processed by the image processing apparatus, and the mark position is recognized.

JP, 2005-166769, A

  In the electronic component mounting apparatus (mounting system) described in Patent Document 1, after the component (first object) is mounted on the substrate (second object), the mark recognition camera (imaging unit) is moved to mount the component. Is being imaged, and it is desired to accelerate the inspection timing.

  An object of the present disclosure is to provide a mounting system, a mounting method, and a mounting program that can accelerate the inspection timing of the mounting state of the first target in the second target.

  A mounting system according to an aspect of the present disclosure is a system that mounts the first object captured by a capturing unit that captures the first object on a second object positioned at a predetermined position. The mounting system includes a mounting unit, an imaging unit, and a correction unit. The mounting unit has the capturing unit. The mounting unit moves the capturing unit that has captured the first target object toward the second target object, and mounts the first target object toward a target position on the second target object. Then, the capturing unit is moved in a direction away from the second object. The imaging unit captures an image of a specific region including the first object mounted on the second object as a subject when the capturing unit moves in a direction away from the second object. The correction unit operates the mounting unit based on error information when mounting the first target object on the second target object next to the second target object on which the first target object is mounted. To correct. The error information is information about an error between the target position and the mounting position where the first object is mounted on the second object, which is obtained from the imaged data of the imaging unit.

  A mounting method according to an aspect of the present disclosure is a method of mounting the first object captured by a capturing unit that captures the first object on a second object positioned at a predetermined position. The mounting method includes a first process and a second process. In the first process, the second target is moved when the capturing unit after mounting the first target toward the target position on the second target is moved in a direction away from the second target. It is a process of causing an image capturing unit to capture an image of a specific area including the first object mounted on an object as an object. The second process is based on error information when mounting the first target object on the second target object next to the second target object on which the first target object is mounted. It is a process of correcting the mounting position of the first object in the two objects. The error information is information about an error between the target position and the mounting position where the first object is mounted on the second object, which is obtained from the imaged data of the imaging unit.

  A mounting program according to an aspect of the present disclosure is a program for causing one or more processors to execute the mounting method described above.

  According to the present disclosure, there is an advantage that the inspection timing of the mounting state of the first object in the second object can be advanced.

FIG. 1 is an external perspective view of a mounting unit in the mounting system according to the first embodiment. FIG. 2 is a block diagram showing the configuration of the above-described mounting system. FIG. 3A is a schematic diagram showing the configuration of the mounting system of the above. FIG. 3B is a schematic diagram showing the configuration of the mounting system according to the first modification of the first embodiment. FIG. 4 is an explanatory diagram illustrating a main part of the mounting system according to the first embodiment. FIG. 5: is a flowchart which shows the process of the mounting system same as the above. 6A and 6B are plan views schematically showing image pickup data of the image pickup unit in the mounting system of the above. FIG. 7 is a schematic diagram showing the configuration of the mounting system according to the second modification of the first embodiment. FIG. 8 is a plan view of a second target object as a mounting target of the mounting system according to the modified example 3 of the first exemplary embodiment. FIG. 9 is a block diagram showing the configuration of the mounting system according to the second embodiment. FIG. 10 is a flowchart showing the processing of the mounting system of the above. 11A and 11B are plan views schematically showing image pickup data of the image pickup unit in the mounting system of the above.

(Embodiment 1)
(1) Outline As shown in FIG. 1, the mounting system 1 according to the present embodiment is a system for mounting the first target object 100 on the second target object 200 positioned at a predetermined position. In the present embodiment, the second object 200 is, for example, a rectangular printed circuit board (hereinafter, also referred to as “substrate 200”). The board 200 has a mounting surface 201 on which the component 100 is mounted. Further, in the present embodiment, the first object 100 is, for example, an electronic component (hereinafter, also referred to as “component 100”) such as a capacitor, a resistor, an inductor, a transformer, an IC (Integrated Circuit), a connector, or a switch. . The component 100 is not limited to the electronic component described above, and may be another component as long as it can be mounted on the board 200.

  As shown in FIG. 2, the mounting system 1 according to this embodiment includes a mounting unit 2, an imaging unit 3, and a correction unit 4. The mounting unit 2 has a capturing unit 23, as shown in FIG. 1. In the present embodiment, the capturing unit 23 is, for example, a suction nozzle (hereinafter, also referred to as “suction nozzle 23”) that suctions the component 100. That is, the capturing unit 23 captures the component 100 by sucking the component 100. The mounting unit 2 moves the capturing unit 23 that has captured the first target object 100 toward the second target object 200, and mounts the first target object 100 toward the target position 202 on the second target object 200. To do. Further, the mounting unit 2 mounts the first target object 100 on the second target object 200 and then moves the capturing unit 23 in a direction away from the second target object 200. The “target position” in the present disclosure refers to a position in the second object 200 where the first object 100 should be mounted. In the present embodiment, the target position 202 is a position where the component 100 is bonded on the substrate 200 serving as the second object in order to realize the function of the component 100 serving as the first object.

  The image capturing unit 3 is, for example, a still camera that captures a still image. The image capturing unit 3 captures an image of the specific region 300 (see FIG. 3A) that includes the first target object 100 mounted on the second target object 200 as a subject. In the present embodiment, the image capturing unit 3 captures an image of the specific region 300 when the capturing unit 23 moves in a direction away from the second object 200.

  When the first target object 100 is mounted on the second target object 200 next to the second target object 200 on which the first target object 100 is mounted, the correction unit 4 determines the mounting unit 2 based on the error information. Correct the movement. That is, in the present embodiment, the correction process performed by the correction unit 4 performs the correction based on the error information calculated for the second target object 200 on which the first target object 100 is mounted. This is a feedback process performed on the second target object 200. The “error information” referred to in the present disclosure is information regarding an error between the target position 202 and the mounting position 203 (see FIG. 6A), which is obtained from the image pickup data D1 (see FIG. 6A) of the image pickup unit 3. Further, the “mounting position” referred to in the present disclosure refers to a position where the first object 100 is actually mounted on the second object 200. In the present embodiment, each of the target position 202 and the mounting position 203 is defined by absolute coordinates having the reference point P1 (see FIG. 1) set on the substrate 200 as the second object as the origin.

  As described above, in the mounting system 1 according to the present embodiment, the imaging unit 3 images the specific region 300 when the capturing unit 23 moves in the direction away from the second object 200. That is, the image capturing unit 3 captures the image of the specific region 300 during the returning operation in which the capturing unit 23 returns to the original position. Therefore, compared with the case where the imaging unit 3 is moved to a position where the specific region 300 can be imaged after the first object 100 is mounted, the inspection timing can be advanced.

(2) Configuration The configuration of the mounting system 1 according to this embodiment will be described below. In the following description, as shown in FIG. 1, the longitudinal direction of the substrate 200 as the second object is defined as the X direction, the lateral direction of the substrate 200 is defined as the Y direction, and the thickness direction of the substrate 200 is defined as the Z direction. However, these directions are not intended to limit the usage direction of the mounting system 1. Further, the arrows in the drawings are shown only for the purpose of description and do not have any substance.

  As shown in FIG. 2, the mounting system 1 according to this embodiment includes a mounting unit 2, an imaging unit 3, and a correction unit 4. As shown in FIG. 1, the mounting unit 2 has a head 21 and a drive mechanism 22. Further, the mounting unit 2 has a mounting control unit 24, as shown in FIG. The head 21 also has a suction nozzle (capturing unit) 23 that sucks the component 100.

  The head 21 holds the suction nozzle 23 in a movable state in the Z direction (thickness direction of the substrate 200). Therefore, when the component 100 is mounted on the substrate 200, the suction nozzle 23 can move in a direction toward the substrate 200 and a direction away from the substrate 200. Further, when sucking the component 100, the suction nozzle 23 can be moved in a direction toward a component supply unit (for example, a tape feeder) that supplies the component 100 and a direction away from the component supply unit. The suction nozzle 23 can switch between a suction state in which the component 100 is suctioned and a release state in which the suction state of the component 100 is released. The drive mechanism 22 is configured to slide the head 21 in each of the X direction and the Y direction by a built-in motor. The mounting unit 2 mounts the component 100 on the substrate 200 such that the component 100 sucked by the suction nozzle 23 overlaps the mounting position 203 provided on the substrate 200 (see FIG. 1).

  The head 21 is moved to the component supply unit by the drive mechanism 22 and causes the suction nozzle 23 to suck the component 100 while the substrate 200 to be mounted is positioned at a predetermined position. After that, the head 21 is moved by the drive mechanism 22 to a position facing the target position 202 on the substrate 200 in the Z direction. Then, the head 21 lowers the suction nozzle 23 in a direction approaching the substrate 200, and mounts the component 100 on the substrate 200 with the suction nozzle 23 lowered. After that, the head 21 raises the suction nozzle 23 in a direction away from the substrate 200. Hereinafter, the head 21 repeats the above operation until all the components 100 are mounted on the board 200 to be mounted.

  Here, the mounting unit 2 is configured to communicate with the host system 10 directly or indirectly via a network, a relay, or the like. In the present embodiment, as an example, the communication method between the mounting unit 2 and the host system 10 is wired communication that complies with a communication standard such as a wired LAN (Local Area Network). The protocol in the communication between the mounting unit 2 and the host system 10 is, for example, Ethernet (registered trademark) or EtherCAT (Ethernet for Control Automation Technology) (registered trademark). The host system 10 transmits to the mounting unit 2 control data for controlling the operation of the drive mechanism 22 and the suction nozzle 23. In the mounting unit 2, the mounting control unit 24 controls the operation of the drive mechanism 22 and the suction nozzle 23 according to the control data from the host system 10.

  The mounting control unit 24 mainly has a computer system having a processor and a memory. The functions of the mounting control unit 24 are realized by the processor of the computer system executing the program recorded in the memory of the computer system. The program may be recorded in a memory, may be provided through an electric communication line such as the Internet, or may be recorded and provided in a non-transitory recording medium such as a memory card.

  The image capturing unit 3 is, for example, a still camera that captures a still image, as described above. The imaging unit 3 is mechanically fixed to the mounting unit 2 and is electrically connected to each of the mounting unit 2 and the correction unit 4. Therefore, the imaging unit 3 can move together with the mounting unit 2 by the drive mechanism 22. The image capturing unit 3 is configured to capture an image of the specific region 300 (see FIG. 3A) according to an image capturing command input from the mounting control unit 24 when the suction nozzle 23 moves in a direction away from the substrate 200. The imaging unit 3 outputs the imaging data D1 (see FIG. 6A) including the specific area 300 to the correction unit 4.

  The specific area 300 is an area including the target position 202 on the substrate 200. Specifically, the specific area 300 is an area including a target position 202 on the board 200 where the component 100 is to be mounted and a mounting position 203 (see FIG. 6A) on the board 200 where the component 100 is mounted. That is, in the present embodiment, the specific area 300 includes both the target position 202 and the mounting position 203. Thereby, the correction unit 4 can calculate the error between the target position 202 and the mounting position 203 based on the imaged data D1 of the imager 3 (see FIG. 6A). In other words, the specific region 300 is fixed to a region including the suction nozzle 23 in a state where the component 100 is mounted on the substrate 200. That is, the specific region 300 is fixed to a region including the bottom dead center of the suction nozzle 23 in the Z direction, which is the moving direction of the suction nozzle 23. The “bottom dead center” in the present disclosure does not mean the lower limit position in the movable range of the suction nozzle 23, but the lower limit position of the suction nozzle 23 when the component 100 is mounted on the substrate 200.

  In addition, as shown in FIG. 3A, the image capturing unit 3 is configured to capture an image of the specific region 300 from an oblique direction with respect to the substrate 200. In other words, the image capturing unit 3 is configured to capture an image of the specific region 300 from a direction in which the angle θ1 with respect to the mounting surface 201 of the board 200 on which the component 100 is mounted is an acute angle. In other words, the imaging unit 3 is configured to image the specific region 300 from a direction in which an angle θ1 formed by the mounting surface 201 of the substrate 200 on which the component 100 is mounted and the optical axis OA1 of the imaging unit 3 is an acute angle. ing. In this way, the imaging unit 3 images the specific region 300 from an oblique direction, and only by moving the suction nozzle 23 from the bottom dead center, the specific region 300 is imaged so as to include the target position 202 and the mounting position 203. be able to. Therefore, the head 21 is moved in the X direction or the Y direction in order to move the image capturing unit 3 to a position where the specific region 300 can be captured, as compared with the case where the image capturing unit 3 captures the specific region 300 in the vertical direction. There is an advantage that processing is unnecessary.

  As shown in FIG. 2, the correction unit 4 is electrically connected to each of the mounting unit 2 and the image pickup unit 3. The correction unit 4 acquires the image pickup data D1 including the specific region 300 from the image pickup unit 3. The correction unit 4 calculates error information based on the image pickup data D1 acquired from the image pickup unit 3 and creates correction data based on this error information. Then, the correction unit 4 outputs the created correction data to the mounting unit 2 (strictly, the mounting control unit 24). The correction unit 4 has a calculation unit 41 and a selection unit 42.

  The selection unit 42 selects the component 100 used for calculating the error information in the correction unit 4 (strictly speaking, the calculation unit 41) based on the mounting data, the component data, and the like. In other words, the mounting system 1 further includes the selection unit 42 that selects the component 100 used for calculating the error information. The mounting data includes data on the target position 202 of the component 100 on the board 200 and information such as the type of the component 100. The component data includes information such as the shape of the component 100 and the size of the component 100. When selecting the component 100, the selection unit 42 excludes the component 100 that causes a large variation in the mounting position from the selection target. As a result, it is possible to accurately correct the positional deviation of the mounting position of the component 100. The calculator 41 calculates error information for the component 100 selected by the selector 42.

  The calculation unit 41 acquires the first position data and the second position data based on the imaging data D1 (see FIG. 6A) input from the imaging unit 3. The first position data is position data of the target position 202 where the component 100 is to be mounted on the board 200. The second position data is position data of the mounting position 203 where the component 100 is mounted on the board 200. Each of the first position data and the second position data is defined by absolute coordinates having a reference point P1 (see FIG. 1) set on the substrate 200 as an origin. In the present embodiment, each of the first position data and the second position data is data that defines a position on the XY plane, and is defined by a set of data in the X direction and data in the Y direction.

  Further, the calculation unit 41 calculates error data (error information) between the target position 202 and the mounting position 203 from the difference between the first position data and the second position data. Specifically, the calculation unit 41 calculates the first error data in the X direction from the difference between the X direction data in the first position data and the X direction data in the second position data. Further, the calculation unit 41 calculates the second error data in the Y direction from the difference between the Y direction data in the first position data and the Y direction data in the second position data.

  Then, the correction unit 4 creates the correction data using the first error data and the second error data calculated by the calculation unit 41. Specifically, the correction unit 4 creates the first correction data in the X direction by adding or subtracting the first error data to or from the X direction data in the first position data. Further, the correction unit 4 creates second correction data in the Y direction by adding or subtracting the second error data to or from the Y direction data in the first position data. The correction unit 4 outputs the first correction data and the second correction data (correction data) to the mounting control unit 24 of the mounting unit 2. The mounting control unit 24 corrects the mounting position 203 of the component 100 on the substrate 200 according to the correction data (first correction data and second correction data) from the correction unit 4 (including the suction nozzle 23. ) Control the operation of.

  By the way, it is preferable that the correction unit 4 calculates the error information before the mounting unit 2 mounts the component 100 on the next substrate 200. In other words, it is preferable that the correction data is created when the mounting unit 2 mounts the component 100 on the next substrate 200. According to this configuration, the mounting position 203 of the component 100 on the board 200 can be corrected toward the target position 202 at the timing of mounting the component 100 on the next board 200. Therefore, after mounting the component 100 on the board 200, the mounting position 203 of the component 100 can be corrected at an earlier timing than in the case where the mounting state of the component 100 is inspected by an inspection machine or the like. .

  Further, it is preferable that the correction unit 4 starts calculation of error information during mounting on the board 200. For example, since a plurality of components other than the component 100 are mounted on the board 200, the correction unit 4 preferably calculates the error information while the plurality of components are mounted on the board 200. According to this configuration, the correction unit 4 can create the correction data before the mounting of the component 100 on the next board 200 is started, and thus the correction data is generated for the next board 200. A correction process based on the above can be executed.

  The correction unit 4 mainly has a computer system having a processor and a memory. The functions of the correction unit 4 (including the calculation unit 41 and the selection unit 42) are realized by the processor of the computer system executing the program recorded in the memory of the computer system. The program may be recorded in a memory, may be provided through an electric communication line such as the Internet, or may be recorded and provided in a non-transitory recording medium such as a memory card.

  By the way, when the imaging unit 3 images the specific region 300 from the oblique direction with respect to the substrate 200 as in the present embodiment, it is not possible to distinguish between the first state and the second state, and the same imaging data D1 is obtained. Will get it. In the first state, like the upper side substrate 200 in FIG. 4, the substrate 200 is warped in the positive Z direction, but the component 100 is mounted at the target position 202 on the substrate 200. In the second state, unlike the lower substrate 200 in FIG. 4, the substrate 200 is not warped in the Z direction, but the component 100 is displaced in the positive Y direction with respect to the target position 202. . The alternate long and short dash line 400 in FIG. 4 represents an axis that passes through the center of the target position 202 and is parallel to the thickness direction (Z direction) of the substrate 200.

  As described above, when the imaging unit 3 images the specific region 300 from the diagonal direction with respect to the substrate 200, the correction unit 4 uses the position data D11 in the thickness direction of the substrate 200 when creating the correction data. Is preferred. In other words, the correction unit 4 corrects the imaging data D1 based on the position data D11 in the thickness direction of the substrate 200, and corrects the operation of the mounting unit 2 based on error information obtained from the corrected imaging data D1. Is preferred. According to this configuration, the first state and the second state can be distinguished by modifying the imaging data D1 based on the position data D11. Since the correction data is created based on the error information obtained from the corrected imaging data D1, the mounting position 203 of the component 100 can be accurately corrected even when the board 200 is warped in the Z direction. In the present embodiment, the position data D11 is height data of the substrate 200 in the Z direction (hereinafter, also referred to as “height data D11”).

  Here, the position data D11 may be acquired by, for example, a triangulation type laser measuring device to which triangulation is applied, or the tertiary data based on the imaging data obtained by causing the imaging unit 3 to function as a stereo camera. It may be acquired by original measurement. Further, the position data D11 may be acquired by three-dimensional measurement using the out-of-focus of the imaged data by the imaging unit 3. Further, for example, when an inspection machine for inspecting the board 200 is provided in the previous process of the mounting system 1, the position data D11 may be acquired from the inspection machine. Further, when the height sensor is provided in the previous process of the mounting system 1, the position data D11 may be acquired from the height sensor. In this embodiment, the position data D11 is acquired by the laser measuring device.

  In the present embodiment, the correction unit 4 has a plurality of correction tables. The plurality of correction tables have a one-to-one correspondence with the plurality of height data D11. That is, the correction unit 4 has a correction table for each of the plurality of height data D11. The correction unit 4 acquires a plurality of correction tables by performing, for example, a calibration using a glass plate (glass table) in which a plurality of scales are formed in a grid pattern for each of the plurality of height data D11. You can

(3) Operation Next, the operation of the mounting system 1 according to the present embodiment will be described with reference to FIGS. 5, 6A and 6B. 6A and 6B, the mounting position 203 is shown slightly larger than the component 100 so that the component 100 and the mounting position 203 can be distinguished, but the mounting position 203 is mounted with the component 100. The position, which is actually the same size.

  After the mounting unit 2 mounts the component 100 on the substrate 200 by the suction nozzle 23, the imaging unit 3 captures an image of the specific region 300 at a timing when the suction nozzle 23 rises in a direction away from the substrate 200. The specific area 300 includes the target position 202 on the substrate 200 on which the component 100 is to be mounted, and the component 100 mounted on the substrate 200. That is, the specific area 300 includes the target position 202 on the board 200 and the mounting position 203 of the component 100 on the board 200.

  The calculation unit 41 of the correction unit 4 acquires the image pickup data D1 including the specific region 300 from the image pickup unit 3 (step S1). Further, the calculation unit 41 acquires the height data (position data) D11 of the substrate 200 from the laser measuring device (step S2). After that, the calculation unit 41 acquires the position data (first position data and second position data) of each of the target position 202 and the mounting position 203 based on the imaging data D1 (step S3). Then, the calculation unit 41 calculates error information from the first position data and the second position data (step S4). Specifically, the calculation unit 41 calculates the first error data from the difference between the X-direction data of the first position data and the X-direction data of the second position data. Further, the calculation unit 41 calculates the second error data from the difference between the Y-direction data in the first position data and the Y-direction data in the second position data.

  Then, the correction unit 4 creates correction data based on the first error data and the second error data calculated by the calculation unit 41 (step S5). At this time, the correction unit 4 corrects the first error data and the second error data by referring to the correction table corresponding to the height data D11 of the substrate 200 acquired in step S2 among the plurality of correction tables. Then, the correction unit 4 creates correction data using the corrected first error data and second error data. Specifically, the correction unit 4 creates the first correction data in the X direction by adding or subtracting the corrected first error data to or from the X direction data in the first position data. Furthermore, the correction unit 4 creates second correction data in the Y direction by adding or subtracting the corrected second error data to or from the Y direction data in the first position data. Then, the correction unit 4 outputs the first correction data and the second correction data (correction data) to the mounting unit 2.

  The mounting control unit 24 of the mounting unit 2 controls the operation of the head 21 (including the suction nozzle 23) according to the correction data (first correction data and second correction data) from the correction unit 4 (step S6). As a result, as shown in FIG. 6B, the mounting position 203 of the component 100 on the board 200 can be corrected so as to overlap the target position 202 on the board 200.

  However, in the mounting system 1 according to the present embodiment, since the correction process by the correction unit 4 is a feedback process, the correction process by the correction unit 4 cannot be performed on the board 200 on which the component 100 is already mounted. That is, after that, the correction process by the correction unit 4 can be executed only on the board 200 on which the component 100 is mounted.

   As described above, in the mounting system 1 according to the present embodiment, when the imaging unit 3 mounts the component 100 toward the target position 202 on the substrate 200 and then the suction nozzle 23 rises in the direction away from the substrate 200. Then, the specific region 300 is imaged. Therefore, after mounting the component 100 on the substrate 200, the inspection timing can be advanced as compared with the case where the head 21 is moved so that the imaging unit 3 is located at a position where the specific region 300 can be imaged. .

(4) Modified Example The first embodiment is only one of various embodiments of the present disclosure. The first embodiment can be variously modified according to the design and the like as long as the object of the present disclosure can be achieved. Further, the same function as that of the mounting system 1 may be embodied by a mounting method, a computer program, a non-transitory recording medium recording the computer program, or the like.

  The mounting method according to one aspect is a method of mounting the first object 100 captured by the capturing unit 23 that captures the first object 100 on the second object 200 positioned at a predetermined position. The mounting method includes a first process and a second process. The first process is the second target object when moving the capturing unit 23 after mounting the first target object 100 toward the target position 202 on the second target object 200 in a direction away from the second target object 200. This is a process of causing the image capturing unit 3 to capture an image of the specific region 300 including the first target object 100 mounted on the image display device 200. The second processing is performed based on the error information when the first target object 100 is mounted on the second target object 200 next to the second target object 200 on which the first target object 100 is mounted. This is a process of correcting the mounting position 203 of the first object 100 on the object 200. The error information is information about the error between the target position 202 and the mounting position 203 where the first object 100 is mounted on the second object 200, which is obtained from the imaged data D1 of the imaging unit 3.

  The mounting program according to one aspect is a program for causing one or more processors to execute the above-described mounting method.

  The modifications of the first embodiment are listed below. The modifications described below can be applied in appropriate combination.

  The mounting system 1 in the present disclosure includes, for example, a computer system in the mounting control unit 24, the correction unit 4, and the like. The computer system mainly includes a processor as a hardware and a memory. The function as the mounting system 1 in the present disclosure is realized by the processor executing the program recorded in the memory of the computer system. The program may be pre-recorded in the memory of the computer system, may be provided through an electric communication line, or may be recorded in a non-transitory recording medium such as a memory card, an optical disk, a hard disk drive, which can be read by the computer system. May be provided. The processor of the computer system is composed of one to a plurality of electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI). The plurality of electronic circuits may be integrated in one chip, or may be distributed and provided in the plurality of chips. The plurality of chips may be integrated in one device or may be distributed and provided in the plurality of devices.

  Further, it is not an essential configuration of the mounting system 1 that a plurality of functions in the mounting system 1 are integrated in one housing, and the constituent elements of the mounting system 1 are distributed and provided in the plurality of housings. May be. For example, the function of the mounting unit 2 and the function of the correction unit 4 may be provided separately in different housings. Furthermore, at least a part of the functions of the mounting system 1, for example, a part of the functions of the correction unit 4 may be realized by a cloud (cloud computing) or the like.

(4.1) Modification 1
In the first embodiment, as shown in FIG. 3A, the imaging unit 3 directly images the specific region 300, but as shown in FIG. 3B, the imaging unit 3A indirectly indirectly through the optical element 5. It may be configured to image the specific region 300. Hereinafter, the mounting system 1A according to the first modification will be described with reference to FIG. 3B. The mounting system 1A according to Modification 1 is similar to the mounting system 1 of the first embodiment except for the configuration of the optical element 5, and detailed description of the same components will be omitted.

  As shown in FIG. 3B, the mounting system 1A according to the first modification includes a mounting unit 2A, an imaging unit 3A, a correction unit 4 (see FIG. 2), and an optical element 5. In other words, the mounting system further includes the optical element 5 that outputs the image of the subject incident from the specific region 300 to the imaging unit 3A.

  In the first modification, the imaging unit 3A is housed in the housing of the head 21A of the mounting unit 2A so that the imaging direction is vertically downward.

  The optical element 5 is, for example, a lens having a reflecting surface 51 that is an inclined surface that forms an angle with the mounting surface 201 of the substrate 200. In the example shown in FIG. 3B, the optical element 5 is formed in a triangular shape when viewed from the X direction. The shape of the optical element 5 is not limited to the triangular shape, and may be any other shape as long as the image of the subject included in the specific area 300 (here, the component 100 or the like) can be output to the image capturing unit 3A. . That is, the shape of the optical element 5 is appropriately determined depending on the position of the imaging unit 3A, the position of the specific region 300, and the like.

  As described above, according to the mounting system 1A according to the modified example 1, even if the imaging unit 3A is not configured to image the specific region 300 in an oblique direction with respect to the substrate 200, by using the optical element 5. The specific region 300 can be imaged by the imaging unit 3A. Thereby, there is an advantage that the degree of freedom in the arrangement of the image capturing unit 3A is improved as compared with the case where the image capturing unit 3 directly captures the specific region 300.

  In the first modification, the optical element 5 reflects the image of the subject from the specific area 300 toward the image capturing section 3A. On the other hand, the optical element 5 only needs to output the image of the subject to the image capturing unit 3A, and may have a structure for refracting the image of the subject toward the image capturing unit 3A, for example. .

(4.2) Modification 2
In the first embodiment, the mounting unit 2 has one suction nozzle (capturing unit) 23, but as shown in FIG. 7, the mounting unit 2B has a plurality of (eight in FIG. 7) suction nozzles (capturing units). ) 23B may be included. Hereinafter, the mounting system 1B according to the second modification will be described with reference to FIG. In the following, the same components as those of the mounting system 1 according to the first embodiment will be denoted by the same reference numerals and detailed description thereof will be omitted.

  As shown in FIG. 7, a mounting system 1B according to Modification 2 includes a mounting unit 2B, an imaging unit 3, and a correction unit 4 (see FIG. 2).

  The mounting portion 2B has a head 21B, a drive mechanism 22 (see FIG. 1), and a plurality of suction nozzles 23B. The head 21B is, for example, a rotating body that can rotate around the rotation axis C1 (see arrow A1 in FIG. 7). That is, in Modification 2, the head 21B is a rotary head.

  The plurality of suction nozzles 23B are provided along the circumferential direction of the head 21B. That is, the plurality of suction nozzles 23B are located along the rotation direction of the rotating body (head 21B). In the present embodiment, the plurality of suction nozzles 23B are provided at equal intervals along the circumferential direction of the head 21B, but it is not essential that they be provided at equal intervals. For example, the intervals between the plurality of suction nozzles 23B may all be different, or some of them may be different.

  In the mounting system 1B according to the modified example 2, the number of the imaging units 3 is one. That is, in the mounting system 1B according to the modified example 2, one imaging unit 3 is also used for the plurality of suction nozzles 23B. In other words, the image capturing section 3 can capture a plurality of image data D1 corresponding to each of the plurality of suction nozzles 23B.

  As described above, according to the mounting system 1B of the second modification, one imaging unit 3 is also used for the plurality of suction nozzles 23B. Therefore, the image pickup data D1 corresponding to each of the plurality of suction nozzles 23B can be imaged by one image pickup unit 3.

  When the mounting unit 2B has a plurality of suction nozzles 23B as in the mounting system 1B according to the second modification, the correction unit 4 calculates the error information for each of the plurality of suction nozzles 23B. Is preferred. In this way, by calculating the error information for each of the plurality of suction nozzles 23B, it is possible to accurately correct the mounting deviation of the component 100 on the substrate 200 due to the suction nozzles 23B. In this case, the correction unit 4 may calculate error information for each shaft holding each suction nozzle 23B, instead of calculating error information for each suction nozzle 23B. With this configuration, it is possible to accurately correct the mounting deviation of the component 100 on the substrate 200 due to the shaft (including the suction nozzle 23B).

  The number of the suction nozzles 23B is not limited to eight, but may be two or more.

(4.3) Modification 3
In the first embodiment, the correction unit 4 creates one correction data (first position data and second position data) for the entire board 200 as a mounting target. On the other hand, for example, as shown in FIG. 8, when a plurality of (nine in FIG. 8) areas 211 to 219 are set on the substrate 200, the correction unit 4 sets the plurality of areas 211. It may be configured to generate the correction data for each .about.219. Hereinafter, the mounting system according to the modified example 3 will be described with reference to FIG. The mounting system according to the third modification is the same as the mounting system 1 according to the first embodiment except that the correction unit 4 calculates error information for each of the plurality of areas 211 to 219. Therefore, in the following description, detailed description of the configuration other than the correction unit 4 will be omitted.

  The correction unit 4 creates correction data for each of the plurality of areas 211 to 219 set for the substrate 200. In other words, the correction unit 4 calculates error information for each of the plurality of areas 211 to 219 set for the substrate 200. In this way, by calculating the error information for each of the plurality of areas 211 to 219, it is possible to accurately correct the mounting deviation of the component 100 on the board 200 due to the drive mechanism 22 or the like.

  The number of areas of the substrate 200 is not limited to nine, and may be two or more.

(4.4) Other Modifications Other modifications of the first embodiment will be listed below.

  In the first embodiment, the imaging unit 3 images the specific region 300 from the direction in which the angle θ1 of the second object 200 with respect to the mounting surface 201 is an acute angle, but, for example, the imaging unit 3 determines the specific region from the vertical direction. It may be configured to image 300. That is, the configuration in which the image capturing unit 3 captures the image of the specific region 300 from the oblique direction is not an essential configuration. In this case, for example, if the image capturing unit 3 is a camera equipped with a wide-angle lens, the specific region 300 can be captured even if the specific region 300 is captured in the vertical direction.

  In the first embodiment, the mounting system 1 corrects the positional deviation in the X and Y directions, that is, the positional deviation in the XY plane. However, for example, the positional deviation in the Z direction and the rotational deviation in the XY plane are corrected. It may be configured to correct.

  In the first embodiment, the capturing unit 23 is the suction nozzle, but the capturing unit 23 is not limited to the suction nozzle, and has a configuration of capturing (holding) by sandwiching (grasping) the component 100 like a robot hand, for example. Good.

  In the first embodiment, the first target object is the component 100 and the second target object is the substrate, but the first target object and the second target object may mount the first target object on the second target object. As long as it is set, and is not limited to the component 100 and the substrate 200.

  In the first embodiment, the correction unit 4 corrects the operation of the mounting unit 2 based on one piece of image pickup data D1 from the image pickup unit 3. However, the correction unit 4 uses the plurality of pieces of image pickup data from the image pickup unit 3. The operation of the mounting unit 2 may be corrected based on D1. In other words, the correction unit 4 determines the operation of the mounting unit 2 based on the plurality of error information obtained from the plurality of image pickup data D1 acquired when the mounting unit 2 mounts the plurality of components 100 on the board 200. You may correct. In this case, the correction unit 4 calculates, for example, an average value of a plurality of pieces of error information obtained from each of the plurality of image pickup data D1. Then, the correction unit 4 creates correction data based on this average value. As described above, by creating the correction data based on the average value of the plurality of error information, it is possible to improve the correction accuracy as compared with the case where the correction data is created based on one error information. In this case, the correction unit 4 may calculate the median value or the mode value of the plurality of error information, instead of calculating the average value of the plurality of error information.

  Further, in the first embodiment, the correction unit 4 starts the correction of the operation of the mounting unit 2 when the single image pickup data D1 from the image pickup unit 3 is acquired. The correction of the operation of the mounting unit 2 may be started when the number of acquisitions of the image pickup data D1 becomes equal to or larger than the specified value. In other words, the correction unit 4 performs the operation of the mounting unit 2 when the number of acquisitions of the imaging data D1 acquired when the mounting unit 2 mounts the plurality of components 100 on the substrate 200 becomes equal to or more than the specified value. The correction may be started. According to this configuration, the correction accuracy can be improved as compared with the case where the number of times of acquisition of the imaging data D1 is smaller than the specified value as in the first embodiment, for example. The specified value may be 2 or more.

  In the first embodiment, the selection unit 42 is included in the correction unit 4, but the selection unit may be included in the mounting unit 2 or the imaging unit 3, for example. That is, the selection unit is not limited to the configuration included in the correction unit 4.

  In the first embodiment, the calculation unit 41 of the correction unit 4 of the mounting system 1 calculates the error information, but the host system 10 may calculate the error information. That is, it is sufficient that the correction unit 4 corrects the operation of the mounting unit 2 based on the error information, the mounting system 1 may calculate the error information, and the host system 10 may calculate the error information. May be. When the host system 10 calculates the error information, the mounting system 1 transmits the first position data and the second position data to the host system 10. Then, the host system 10 calculates error information based on the first position data and the second position data received from the mounting system 1. After that, the host system 10 transmits the control data including the calculated error information to the mounting system 1. According to this configuration, the mounting system 1 only needs to create the correction data based on the error information, and the processing load on the mounting system 1 can be reduced.

  In the first embodiment, the reference point P1 set on the substrate 200 is the origin of the absolute coordinates, but it may be any position that is a reference in the mounting process of the mounting unit 2, and is not limited to the reference point P1 of the substrate 200. Alternatively, for example, the initial position of the drive mechanism 22 may be the origin of the absolute coordinates.

  In the first embodiment, the target position 202 on the substrate 200 is the mounting position 203 of the component 100, in other words, the application position of the bonding material applied on the substrate 200, but the target position is limited to the application position of the bonding material. Not done. For example, when the component 100 is a DIP component (lead component), the through hole on the substrate 200 into which the lead extending from the DIP component is inserted may be the target position. Further, the target position may be a land (pad) formed on the substrate 200.

(Embodiment 2)
Hereinafter, the mounting system 1C according to the second embodiment will be described with reference to FIGS. 9 to 11B. The mounting system 1C according to the second embodiment is implemented in that the mounting position (target position 202) of the component 100 is corrected according to the application position of the bonding material 7 before the component 100 is mounted on the substrate 200. This is different from the mounting system 1 according to the first embodiment. In the following description, the same components as those of the mounting system 1 according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

(1) Configuration As shown in FIG. 9, the mounting system 1C according to the present embodiment includes a mounting unit 2, an imaging unit 3, a correction unit 4, and a coating unit 6.

  The imaging unit 3 is configured to image the target coating position 204 (see FIG. 11A) and the actual coating position 205 (see FIG. 11A) before the mounting unit 2 mounts the component 100 on the substrate 200. There is. The “target coating position” in the present disclosure refers to a position on the substrate 200 where the conductive bonding material 7 should be coated. In this embodiment, the target coating position 204 is a land (electrode) formed on the mounting surface 201 of the substrate 200. Further, the “actual application position” in the present disclosure refers to a position where the bonding material 7 is actually applied on the substrate 200. The imaging unit 3 outputs the imaging data D2 (see FIG. 11A) including the target coating position 204 and the actual coating position 205 to the correction unit 4.

  In this embodiment, the correction unit 4 is configured to correct the operation of the mounting unit 2 based on the second error information. The “second error information” referred to in the present disclosure is information different from the first error information as the error information described in the first embodiment, and is the target coating position 204 obtained from the imaged data D2 of the imager 3. And information about the error between the actual coating position 205.

  The calculation unit 41 acquires the first position data and the second position data from the imaging data D2 of the imaging unit 3. The first position data is position data of the target coating position 204. The second position data is position data of the actual coating position 205. The calculator 41 calculates error data (second error information) from the difference between the first position data and the second position data. Specifically, the calculation unit 41 calculates the first error data in the X direction from the difference between the X direction data in the first position data and the X direction data in the second position data. Further, the calculation unit 41 calculates the second error data in the Y direction from the difference between the Y direction data in the first position data and the Y direction data in the second position data.

  Then, the correction unit 4 creates the correction data using the first error data and the second error data (second error information) calculated by the calculation unit 41. Specifically, the correction unit 4 creates the first correction data in the X direction by adding or subtracting the first error data to or from the data in the X direction in the first position data. Further, the correction unit 4 creates the second correction data in the Y direction by adding or subtracting the second error data to or from the Y direction data in the first position data. The correction unit 4 outputs the first correction data and the second correction data to the mounting control unit 24 of the mounting unit 2. Then, the mounting control unit 24 controls the operation of the head 21 (including the suction nozzle 23) so that the mounting position of the component 100 is corrected according to the correction data (first correction data and second correction data).

  As described above, the correction unit 4 is configured to correct the operation of the mounting unit 2 based on the second error information that is information about the error between the target coating position 204 and the actual coating position 205 of the bonding material 7. ing. That is, the correction process of the correction unit 4 is a feedforward process that corrects the mounting deviation of the component 100 based on the second error information regarding the application deviation of the bonding material 7.

  The coating unit 6 has a head and a drive mechanism. Further, the coating section 6 has a coating control section 61. The head has, for example, a discharge mechanism such as a dispenser that discharges the bonding agent 7 (see FIG. 11A). The drive mechanism is configured to slide the head in each of the X direction and the Y direction by a built-in motor. The bonding material 7 is, for example, a solder such as cream solder, a conductive paste, or the like.

  The coating unit 6 is configured to communicate with the host system 10 directly or indirectly via a network, a relay, or the like. In the present embodiment, as an example, the communication method between the coating unit 6 and the host system 10 is wire communication that complies with a communication standard such as a wire LAN. The protocol in the communication between the coating unit 6 and the host system 10 is, for example, Ethernet (registered trademark) or EtherCAT (registered trademark). The host system 10 transmits control data for controlling the operations of the drive mechanism and the ejection mechanism to the coating unit 6. In the coating unit 6, the coating control unit 61 controls the operation of the drive mechanism and the ejection mechanism according to the control data from the host system 10.

(2) Operation Next, the operation of the mounting system 1C according to the present embodiment will be described based on FIGS. 10, 11A and 11B. 11A and 11B, the actual coating position 205 is shown slightly larger than the bonding material 7 so that the bonding material 7 and the actual coating position 205 can be distinguished from each other. 7 is the applied position, which is actually the same size.

  The imaging unit 3 images the region including the target coating position 204 and the actual coating position 205 on the substrate 200 before the mounting unit 2 mounts the component 100 on the substrate 200. The imaging timing of the imaging unit 3 may be any timing from the application of the bonding material 7 by the application unit 6 to the mounting unit 2 mounting the component 100 on the substrate 200.

  The calculation unit 41 of the correction unit 4 acquires the image pickup data D2 from the image pickup unit 3 (step S11). Further, the calculation unit 41 acquires the height data (position data) D11 of the substrate 200 from the laser measuring device (step S12). After that, the calculation unit 41 acquires position data (first position data and second position data) of each of the target coating position 204 and the actual coating position 205 based on the imaged data D2 (step S13). Then, the calculation unit 41 calculates the second error information from the first position data and the second position data (step S14). Specifically, the calculator 41 calculates the difference between the X-direction data in the first position data and the X-direction data in the second position data (first error data), and the Y-direction data in the first position data and the second position data. The difference (second error data) between the position data and the Y-direction data is obtained.

  Then, the correction unit 4 creates correction data based on the first error data and the second error data calculated by the calculation unit 41 (step S15). At this time, the correction unit 4 corrects the first error data and the second error data by referring to the correction table corresponding to the height data D11 of the substrate 200 acquired in step S12 among the plurality of correction tables. Then, the correction unit 4 creates correction data using the corrected first error data and second error data. Specifically, the correction unit 4 creates the first correction data in the X direction by adding or subtracting the corrected first error data to or from the X direction data in the first position data. Furthermore, the correction unit 4 creates second correction data in the Y direction by adding or subtracting the corrected second error data to or from the Y direction data in the first position data. Then, the correction unit 4 outputs the first correction data and the second correction data (correction data) to the mounting unit 2.

  The mounting control unit 24 of the mounting unit 2 controls the operation of the head 21 (including the suction nozzle 23) according to the correction data (first correction data and second correction data) from the correction unit 4 (step S16). As a result, as shown in FIG. 6B, the mounting position 203 of the component 100 on the board 200 can be corrected so as to overlap the target position 202 on the board 200.

  Further, the correction data created in step S15 is used when the bonding material 7 is applied to the next substrate 200, so that the actual application position 205 of the bonding material 7 is changed to the target application position as shown in FIG. 11B. It can be corrected so as to overlap with 204.

  As described above, in the mounting system 1C according to the present embodiment, the imaging unit 3 sets the area including the target coating position 204 and the actual coating position 205 before the mounting unit 2 mounts the component 100 on the board 200. Imaging. Then, the correction unit 4 corrects the operation of the mounting unit 2 based on the second error information obtained from the image pickup data D2 of the image pickup unit 3. Therefore, the mounting deviation of the component 100 on the board 200 can be corrected based on the application deviation of the bonding material 7.

  The various configurations (including modified examples) described in the second embodiment can be appropriately combined with the various configurations (including modified examples) described in the first embodiment.

(Summary)
As described above, the mounting system (1) according to the first aspect places the first target object (100) captured by the capturing unit (23) that captures the first target object (100) at a predetermined position. It is a system mounted on the positioned second object (200). The mounting system (1) includes a mounting unit (2), an imaging unit (3), and a correction unit (4). The mounting section (2) has a capturing section (23). The mounting unit (2) moves the capturing unit (23) that has captured the first target object (100) toward the second target object (200), and moves to the target position () on the second target object (200). After mounting the first target object (100) toward the second target object (202), the capturing unit (23) is moved in a direction away from the second target object (200). The imaging unit (3) uses the first target object (100) mounted on the second target object (200) as a subject when the capturing unit (23) moves in a direction away from the second target object (200). An image of the specific region (300) including the image is captured. The correction unit (4) mounts the first target object (100) on the second target object (200) next to the second target object (200) on which the first target object (100) is mounted. , The operation of the mounting unit (2) is corrected based on the error information. The error information is obtained from the image pickup data (D1) of the image pickup unit (3) and the mounting position (203) where the first target (100) is mounted on the target position (202) and the second target (200). This is information about the error between and.

  According to this aspect, the imaging unit (3) mounts the first target object (100) toward the target position (202) on the second target object (200), and then, from the second target object (200). The specific region (300) is imaged when the capturing unit (23) is moved in a direction away from it. Therefore, compared with the case where the imaging unit (3) is moved after the first object (100) is mounted and the specific region (300) is imaged, the inspection timing can be advanced.

  In the mounting system (1) according to the second aspect, in the first aspect, the specific region (300) is a capturing unit in a state where the first object (100) is mounted on the second object (200). It is fixed to the area including (23).

  According to this aspect, the area including the mounting position (203) of the first object (100) with respect to the second object (200) can be imaged by the imaging unit (3).

  In the mounting system (1) according to the third aspect, in the first or second aspect, the imaging unit (3) includes a mounting surface of the second object (200) on which the first object (100) is mounted ( The specific region (300) is imaged from a direction in which the angle (θ1) with respect to 201 is an acute angle.

  According to this aspect, there is an advantage that the process of moving the imaging unit (3) in the direction parallel to the mounting surface (201) is not required unlike the case of imaging the specific region (300) from the vertical direction.

  In the mounting system (1) which concerns on a 4th aspect, in any one of the 1st-3rd aspect, a correction | amendment part (4) WHEREIN: The mounting part (2) is the 2nd object (200) next. Error information is calculated before mounting one object (100).

  According to this configuration, the mounting position (203) of the first target object (100) can be corrected with respect to the next second target object (200).

  In the mounting system (1) according to the fifth aspect, in any one of the first to fourth aspects, the correction unit (4) starts calculation of error information during mounting on the second object (200). To do.

  According to this aspect, it is possible to calculate the error information until the first target object (100) is mounted on the next second target object (200).

  In the mounting system (1) which concerns on a 6th aspect, in the 1st-5th aspect, the correction | amendment part (4) WHEREIN: The mounting part (2) has several 1st target objects with respect to a 2nd target object (200). The operation of the mounting unit (2) is corrected based on a plurality of pieces of error information obtained from a plurality of image pickup data (D1) acquired when mounting (100).

  According to this aspect, it is possible to improve the correction accuracy as compared with the case where the mounting position (203) of the first object (100) in the second object (200) is corrected based on one error information. it can.

  In the mounting system (1) according to the seventh aspect, in any one of the first to sixth aspects, in the correction unit (4), the mounting unit (2) has a plurality of the second objects (200). When the number of acquisitions of the imaging data (D1) acquired when mounting one object (100) becomes equal to or more than a specified value, the correction of the operation of the mounting unit (2) is started.

  According to this aspect, it is possible to improve the correction accuracy as compared with the case where the number of times the imaged data (D1) is acquired is less than the specified value.

  In the mounting system (1B) which concerns on an 8th aspect, in any one of the 1st-7th aspect, the mounting part (2B) has a some catching part (23B). The correction unit (4) calculates error information for each of the plurality of capture units (23B).

  According to this aspect, it is possible to accurately correct the mounting deviation of the first object (100) due to the capturing unit (23B).

  The mounting system (1) which concerns on a 9th aspect is further provided with the selection part (42) which selects the 1st target object (100) utilized for calculation of error information in any one of the 1st-8th aspects.

  According to this aspect, it is possible to select the first object (100) used for calculating the error information.

  In the mounting system (1) according to the tenth aspect, in any one of the first to ninth aspects, the correction unit (4) includes a plurality of areas (211 to 211) set for the second object (200). Error information is calculated for each 219).

  According to this aspect, it is possible to accurately correct the mounting deviation of the first object (100) caused by the mounting system (1).

  In the mounting system (1C) according to the eleventh aspect, in any one of the first to tenth aspects, in the imaging unit (3), the mounting unit (2) is the first target with respect to the second target (200). Before mounting the object (100), the target application position (204) and the actual application position (205) are imaged. The target application position (204) is a position where the conductive bonding material (7) should be applied on the second object (200). The actual application position (205) is a position where the bonding material (7) is applied on the second object (200). The correction unit (4) corrects the operation of the mounting unit (2) based on the second error information different from the first error information as the error information. The second error information is information regarding an error between the target coating position (204) and the actual coating position (205) obtained from the imaged data of the image pickup unit (3).

  According to this aspect, it is possible to correct the mounting deviation of the first object (100) in the second object (200) based on the application deviation of the bonding material (7).

  A mounting system (1A) according to a twelfth aspect is the mounting system (1A) according to any one of the first to eleventh aspects, wherein an optical element (5) that outputs an image of a subject incident from a specific region (300) to an imaging unit (3). Further prepare.

  According to this aspect, there is an advantage that the degree of freedom in the arrangement of the image pickup unit (3) is improved as compared with the case where the specific region (300) is imaged only by the image pickup unit (3).

  In the mounting system (1B) according to the thirteenth aspect, in any one of the first to twelfth aspects, the mounting section (2B) includes a rotating body (21B) and a plurality of capturing sections (23B). The plurality of capturing units (23B) are located along the rotation direction of the rotating body (21B). The number of imaging units (3) is one, and it is also used for a plurality of capturing units (23B).

  According to this aspect, it is possible to acquire a plurality of image pickup data (D1) corresponding to each of the plurality of capture units (23B) with one image pickup unit (3).

  In the mounting system (1) according to the fourteenth aspect, in the first to thirteenth aspects, the correction unit (3) uses the imaging data (based on the position data (D11) in the thickness direction of the second object (200) ( D1) is corrected, and the operation of the mounting unit (2) is corrected based on the error information obtained from the corrected image pickup data (D1).

  According to this aspect, it is possible to accurately correct the mounting deviation of the first object (100) due to the position data (D11) in the thickness direction of the second object (200).

  In the mounting method according to the fifteenth aspect, the first object (100) captured by the capturing unit (23) that captures the first object (100) is positioned at a predetermined position on the second object (200). ) Is to be implemented. The mounting method includes a first process and a second process. The first process is a direction in which the capturing unit (23) after mounting the first target object (100) toward the target position (202) on the second target object (200) moves away from the second target object (200). This is processing for causing the image capturing unit (3) to capture an image of the specific region (300) that includes the first target object (100) mounted on the second target object (200) as a subject when moving the target object to the second target object (200). The second process has an error in mounting the first target object (100) on the second target object (200) next to the second target object (200) on which the first target object (100) is mounted. It is a process of correcting the mounting position (203) of the first target object (100) in the next second target object (200) based on the information. The error information is obtained from the image pickup data (D1) of the image pickup unit (3) and the mounting position (203) where the first target (100) is mounted on the target position (20) and the second target (200). This is information about the error between and.

  According to this aspect, the imaging unit (3) mounts the first target object (100) toward the target position (202) on the second target object (200), and then, from the second target object (200). The specific region (300) is imaged when the capturing unit (23) is moved in a direction away from it. Therefore, compared with the case where the imaging unit (3) is moved after the first object (100) is mounted and the specific region (300) is imaged, the inspection timing can be advanced.

  The mounting program according to the sixteenth aspect is a program for causing one or more processors to execute the mounting method according to the fifteenth aspect.

  According to this aspect, the imaging unit (3) mounts the first target object (100) toward the target position (202) on the second target object (200), and then, from the second target object (200). The specific region (300) is imaged when the capturing unit (23) is moved in a direction away from it. Therefore, compared with the case where the imaging unit (3) is moved after the first object (100) is mounted and the specific region (300) is imaged, the inspection timing can be advanced.

  Not limited to the above-described aspect, various configurations (including modified examples) of the mounting system (1) according to the first and second embodiments can be embodied by a mounting method or a program.

  The configurations according to the second to fourteenth aspects are not essential for the mounting system (1) and can be omitted as appropriate.

1, 1A, 1B Mounting system 2, 2A, 2B Mounting unit 3 Imaging unit 4 Correction unit 5 Optical element 21B Rotating body 23, 23B Suction nozzle (capturing unit)
42 selection unit 100 parts (first object)
200 substrates (second target)
201 mounting surface 202 target position 203 mounting position 204 target coating position 205 actual coating positions 211 to 219 area 300 specific region D1 imaging data D11 position data θ1 angle

Claims (16)

A mounting system for mounting the first object captured by a capturing unit that captures the first object on a second object positioned at a predetermined position,
The first target object is moved toward the target position on the second target object by moving the capture part that has the capture part and has captured the first target object toward the second target object. A mounting unit that moves the capturing unit in a direction away from the second object after mounting,
An image capturing unit that captures an image of a specific region including the first target mounted on the second target as a subject when the capturing unit moves in a direction away from the second target;
A correction unit that corrects the operation of the mounting unit based on error information when mounting the first target object on the second target object next to the second target object on which the first target object is mounted. And
The error information is information regarding an error between the target position and the mounting position where the first object is mounted on the second object, which is obtained from the imaged data of the imaging unit.
Mounting system. The specific area is fixed to an area including the capturing unit in a state where the first object is mounted on the second object,
The mounting system according to claim 1. The imaging unit images the specific region from a direction in which an angle with respect to a mounting surface of the second object on which the first object is mounted is an acute angle,
The mounting system according to claim 1. The correction unit calculates the error information before the mounting unit mounts the first target object on the next second target object,
The mounting system according to claim 1. The correction unit starts calculation of the error information during mounting on the second object,
The mounting system according to claim 1. The correction unit performs the mounting based on a plurality of the error information obtained from a plurality of the imaging data acquired when the mounting unit mounts the plurality of first objects on the second object. To correct the movement of parts,
The mounting system according to claim 1. When the number of acquisitions of the imaging data acquired when the mounting unit mounts the plurality of first objects on the second object becomes equal to or more than a specified value, the correction unit is configured to mount the mounting unit. Start to correct the operation of
The mounting system according to claim 1. The mounting unit has a plurality of the capturing units,
The correction unit calculates the error information for each of the plurality of capture units,
The mounting system according to claim 1. A selection unit that selects the first object to be used for calculating the error information,
The mounting system according to claim 1. The correction unit calculates the error information for each of a plurality of areas set for the second object,
The mounting system according to claim 1. The image capturing unit, before the mounting unit mounts the first target object on the second target object, a target coating position at which a conductive bonding material should be coated on the second target object; 2 Image of the actual application position where the bonding material is applied on the object,
The correction unit corrects the operation of the mounting unit based on second error information different from the first error information as the error information,
The second error information is information regarding an error between the target coating position and the actual coating position, which is obtained from the image pickup data of the image pickup unit.
The mounting system according to claim 1. Further comprising an optical element that outputs the image of the subject incident from the specific region to the imaging unit,
The mounting system according to claim 1. The mounting unit is
A rotating body,
A plurality of the capturing portions located along the rotation direction of the rotating body,
The number of the imaging units is one, and it is also used for the plurality of capturing units,
The mounting system according to claim 1. The correction unit corrects the imaging data based on position data in the thickness direction of the second object, and corrects the operation of the mounting unit based on the error information obtained from the corrected imaging data.
The mounting system according to any one of claims 1 to 13. A mounting method for mounting the first object captured by a capturing unit that captures the first object on a second object positioned at a predetermined position,
When the capturing unit after mounting the first object toward the target position on the second object is moved in a direction away from the second object, the mounting on the second object is performed. A first process for causing the image capturing unit to capture an image of a specific region including the first object as a subject;
When mounting the first target object on the second target object next to the second target object on which the first target object is mounted, the first target object is mounted on the second target object based on error information. A second process for correcting the mounting position of one object,
The error information is information regarding an error between the target position and the mounting position where the first object is mounted on the second object, which is obtained from the imaged data of the imaging unit.
How to implement. On one or more processors,
For executing the mounting method according to claim 15,
Implementation program.

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