JP2020053546A - Wiring board and communication evaluation device - Google Patents

Wiring board and communication evaluation device Download PDF

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JP2020053546A
JP2020053546A JP2018181235A JP2018181235A JP2020053546A JP 2020053546 A JP2020053546 A JP 2020053546A JP 2018181235 A JP2018181235 A JP 2018181235A JP 2018181235 A JP2018181235 A JP 2018181235A JP 2020053546 A JP2020053546 A JP 2020053546A
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signal line
land portion
land
wiring board
conductor component
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JP7008005B2 (en
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直也 兎原
Naoya Ubara
直也 兎原
泰治 伊藤
Taiji Ito
泰治 伊藤
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Taiyo Yuden Co Ltd
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Abstract

To provide a wiring board and a communication evaluation device that can reduce the number of lands that can select a direction of a signal.SOLUTION: A wiring board 10 of the present invention includes: a first signal line 11 including a first land portion 110; a second signal line 12 including a second land portion 120; and a third signal line 13 including a third land portion 130. The third signal line is configured to be able to electrically connect to the first signal line or the second signal line by having a first end of a conductor component 50 mounted on the first land portion or the second land portion and having a second end of the conductor component mounted on the third land portion.SELECTED DRAWING: Figure 2

Description

本発明は、信号線の切り替えが可能な配線基板およびこれを備えた通信評価装置に関する。   The present invention relates to a wiring board capable of switching signal lines and a communication evaluation device including the same.

従来、配線基板上の複数の信号線の電気的な接続に０Ωジャンパー等のジャンパーチップ部品が用いられている。例えば特許文献１には、回路接続構成を変更するのに必要なランドの数を少なくするための技術が開示されている。   Conventionally, jumper chip components such as a 0Ω jumper have been used for electrical connection of a plurality of signal lines on a wiring board. For example, Patent Literature 1 discloses a technique for reducing the number of lands required for changing a circuit connection configuration.

特開平７−４５９３５号公報JP-A-7-45935

例えば、基板に信号の方向性を選択できるパターンを施す場合、ジャンパーチップ部品２つ分の２組のランドを設置し、どちらか一方の組のランドにジャンパーチップ部品を実装して方向性を選択する方法がとられる。しかしながらこの方法は、ランドパターンを余分に必要とするため、配線領域の縮小が図れない。また、不要なオープンスタブパターンを生じさせるため、ＲＦラインのような信号線では機器の特性劣化を招く原因にもなっている。   For example, when a pattern that can select the direction of the signal is applied to the substrate, two sets of lands for two jumper chip parts are installed, and the direction is selected by mounting the jumper chip parts on one of the lands. There is a way to do it. However, this method requires an extra land pattern, so that the wiring area cannot be reduced. In addition, since an unnecessary open stub pattern is generated, signal lines such as RF lines cause deterioration of device characteristics.

以上のような事情に鑑み、本発明の目的は、信号の方向性を選択できるランド数を低減することができる配線基板および通信評価装置を提供することにある。   In view of the circumstances described above, an object of the present invention is to provide a wiring board and a communication evaluation device that can reduce the number of lands from which the directionality of a signal can be selected.

上記目的を達成するため、本発明の一形態に係る配線基板は、第１のランド部を有する第１の信号線と、第２のランド部を有する第２の信号線と、第３のランド部を有する第３の信号線とを具備する。
前記第３の信号線は、前記第１のランド部または前記第２のランド部に導体部品の第１の端部が搭載され、前記第３のランド部に前記導体部品の第２の端部が搭載されることで、前記第１の信号線または前記第２の信号線と電気的に接続可能に構成される。 To achieve the above object, a wiring substrate according to one embodiment of the present invention includes a first signal line having a first land portion, a second signal line having a second land portion, and a third land portion. And a third signal line having a portion.
The third signal line has a first end portion of a conductor component mounted on the first land portion or the second land portion, and a second end portion of the conductor component mounted on the third land portion. Is mounted so as to be electrically connectable to the first signal line or the second signal line.

前記配線基板は、前記第１のランド部と前記第３のランド部との間を接続する予備配線部をさらに具備してもよい。   The wiring board may further include a spare wiring portion connecting between the first land portion and the third land portion.

本発明の他の形態に係る配線基板は、第１のランド部を有する第１の信号線と、第２のランド部を有する第２の信号線と、第３のランド部を有する第３の信号線と、導体部品とを具備する。
前記導体部品は、前記第１のランド部または前記第２のランド部に搭載される第１の端子と、前記第３のランド部に搭載される第２の端子とを有し、前記第３の信号線と前記第１の信号線または前記第２の信号線とを電気的に接続する。 A wiring board according to another aspect of the present invention includes a first signal line having a first land portion, a second signal line having a second land portion, and a third signal line having a third land portion. It includes a signal line and a conductor component.
The conductor component includes a first terminal mounted on the first land portion or the second land portion, and a second terminal mounted on the third land portion. Are electrically connected to the first signal line or the second signal line.

本発明の一形態に係る通信評価装置は、アンテナと、コネクタと、配線基板と、導体部品とを具備する。
前記配線基板は、第１のランド部を有しアンテナに接続される第１の信号線と、第２のランド部を有し前記コネクタに接続される第２の信号線と、第３のランド部を有し測定対象に接続される第３の信号線と、を有する。
前記導体部品は、前記第１のランド部または前記第２のランド部に搭載される第１の端部と、前記第３のランド部に搭載される第２の端部とを有し、前記第３の信号線と前記第１の信号線または前記第２の信号線とを電気的に接続する。 A communication evaluation device according to one embodiment of the present invention includes an antenna, a connector, a wiring board, and a conductor component.
A first signal line having a first land portion and connected to the antenna; a second signal line having a second land portion connected to the connector; and a third land. And a third signal line connected to the object to be measured.
The conductor component has a first end mounted on the first land portion or the second land portion, and a second end mounted on the third land portion, A third signal line is electrically connected to the first signal line or the second signal line.

以上述べたように、本発明によれば、信号の方向性を選択できるランド数を低減することができる。   As described above, according to the present invention, it is possible to reduce the number of lands from which the directionality of a signal can be selected.

本発明の一実施形態に係る通信評価装置の概略構成図である。It is a schematic structure figure of a communication evaluation device concerning one embodiment of the present invention. 上記通信評価装置における各信号線の構成を示す平面図である。FIG. 3 is a plan view showing a configuration of each signal line in the communication evaluation device. 比較例に係る各信号線の構成を示す平面図である。FIG. 9 is a plan view illustrating a configuration of each signal line according to a comparative example. 本発明の第２の実施形態に係る各信号線の構成を示す平面図である。FIG. 9 is a plan view illustrating a configuration of each signal line according to a second embodiment of the present invention. 上記通信評価装置における各信号線の他の構成例を示す平面図である。It is a top view showing other examples of composition of each signal line in the above-mentioned communication evaluation device.

以下、図面を参照しながら、本発明の実施形態を説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の一実施形態に係る通信評価装置１００の概略構成図である。本実施形態の通信評価装置１００は、例えば測定対象として、ＢＬＥ（Bluetooth（登録商標） Low energy）モジュール等の無線モジュールＭの通信特性を評価する装置である。通信評価装置１００は、配線基板１０と、アンテナ２０と、ＲＦコネクタ３０と、コントローラ４０とを備える。   FIG. 1 is a schematic configuration diagram of a communication evaluation device 100 according to an embodiment of the present invention. The communication evaluation apparatus 100 of the present embodiment is an apparatus that evaluates the communication characteristics of a wireless module M such as a BLE (Bluetooth (registered trademark) Low energy) module as a measurement target, for example. The communication evaluation device 100 includes a wiring board 10, an antenna 20, an RF connector 30, and a controller 40.

配線基板１０は、図示しない装置本体（筐体）に設置される。配線基板１０は、ガラスエポキシ基板等のリジッド性を有する基板で構成されるが、フレキシブル性を有する基板で構成されてもよい。   The wiring board 10 is installed in an apparatus main body (housing) not shown. The wiring substrate 10 is formed of a rigid substrate such as a glass epoxy substrate, but may be formed of a flexible substrate.

配線基板１０には無線モジュールＭが搭載される。配線基板１０は、無線モジュールＭをアンテナ２０およびＲＦコネクタ３０のいずれか一方に電気的に接続するための第１の信号線１１、第２の信号線１２および第３の信号線１３を有する。配線基板１０はさらに、無線モジュールＭとコントローラ４０との間を電気的に接続する第４の信号線１４を有する。   The wireless module M is mounted on the wiring board 10. The wiring board 10 has a first signal line 11, a second signal line 12, and a third signal line 13 for electrically connecting the wireless module M to one of the antenna 20 and the RF connector 30. The wiring board 10 further has a fourth signal line 14 for electrically connecting the wireless module M and the controller 40.

アンテナ２０は、無線モジュールＭの不要発射の強度（スプリアス測定）や通信距離等を評価するための送受信アンテナである。アンテナ２０は、第１の信号線１１および第３の信号線１３を介して無線モジュールＭと電気的に接続される。   The antenna 20 is a transmitting / receiving antenna for evaluating the intensity of unnecessary emission (spurious measurement) of the wireless module M, the communication distance, and the like. The antenna 20 is electrically connected to the wireless module M via the first signal line 11 and the third signal line 13.

ＲＦコネクタ３０も同様に、無線モジュールＭの通信特性を測定するためのものである。ＲＦコネクタ３０は、第２の信号線１２および第３の信号線１３を介して無線モジュールＭと電気的に接続される。ＲＦコネクタ３０は、典型的には、スペクトルアナライザ等の測定機器Ｗと接続され、通信モジュールＭの周波数やパワー等の無線特性を測定する。   Similarly, the RF connector 30 is for measuring the communication characteristics of the wireless module M. The RF connector 30 is electrically connected to the wireless module M via the second signal line 12 and the third signal line 13. The RF connector 30 is typically connected to a measurement device W such as a spectrum analyzer, and measures wireless characteristics of the communication module M, such as frequency and power.

コントローラ４０は、アンテナ２０またはＲＦコネクタ３０を介して行われる無線モジュールＭの通信特性を評価するための測定ユニットを含む。コントローラ４０は、第４の信号線１４を介して無線モジュールＭと電気的に接続される。   The controller 40 includes a measurement unit for evaluating the communication characteristics of the wireless module M performed via the antenna 20 or the RF connector 30. The controller 40 is electrically connected to the wireless module M via the fourth signal line 14.

通信評価装置１００は、第３の信号線１３と第１の信号線１１または第２の信号線１２とを電気的に接続する導体部品５０をさらに備える。導体部品５０は、例えば、０Ωジャンパー等のジャンパーチップ部品で構成され、第１の信号線１１と第３の信号線１３との間、あるいは、第２の信号線１２と第３の信号線１３との間に選択的に搭載される。これにより、アンテナ２０を用いた無線モジュールＭの通信特性評価と、ＲＦコネクタ３０を用いた無線モジュールＭの通信特性評価とが選択的に実施可能となる。   The communication evaluation device 100 further includes a conductor component 50 that electrically connects the third signal line 13 to the first signal line 11 or the second signal line 12. The conductor component 50 is formed of, for example, a jumper chip component such as a 0Ω jumper, and is provided between the first signal line 11 and the third signal line 13 or between the second signal line 12 and the third signal line 13. And is selectively mounted between them. Thereby, the evaluation of the communication characteristics of the wireless module M using the antenna 20 and the evaluation of the communication characteristics of the wireless module M using the RF connector 30 can be selectively performed.

図２（ａ），（ｂ）は、第１の信号線１１、第２の信号線１２および第３の信号線１３の詳細を示す平面図である。図２（ａ）は、第１の信号線１１と第３の信号線１３との間に導体部品５０が搭載された形態を示し、図２（ｂ）は、第２の信号線１２と第３の信号線１３との間に導体部品５０が搭載された形態を示している。   FIGS. 2A and 2B are plan views showing details of the first signal line 11, the second signal line 12, and the third signal line 13. FIG. FIG. 2A shows a form in which a conductor component 50 is mounted between the first signal line 11 and the third signal line 13, and FIG. 3 shows a form in which a conductor component 50 is mounted between the third signal line 13.

図２（ａ），（ｂ）に示すように、第１の信号線１１は、アンテナ２０とは反対側の端部に設けられた第１のランド部１１０を有し、第２の信号線１２は、ＲＦコネクタ３０とは反対側の端部に設けられた第２のランド部１２０を有する。そして、第３の信号線１３は、第１のランド部１１０および第２のランド部１２０に対してそれぞれ間隔をおいて配置された第３のランド部１３０を有する。   As shown in FIGS. 2A and 2B, the first signal line 11 has a first land portion 110 provided at an end opposite to the antenna 20 and a second signal line. 12 has a second land portion 120 provided at an end opposite to the RF connector 30. Further, the third signal line 13 has a third land portion 130 which is arranged at an interval from the first land portion 110 and the second land portion 120, respectively.

導体部品５０は、一方の端部（第１の端部）とその反対側の他方の端部（第２の端部）とを有する２極型の電子部品である。導体部品５０の一方の端部が第１のランド部１１０に、他方の端部が第３のランド部１３０にそれぞれ搭載されることで、第１の信号線１１と第３の信号線１３とが電気的に接続される（図２（ａ））。また、導体部品５０の一方の端部が第２のランド部１２０に、他方の端部が第３のランド部１３０にそれぞれ搭載されることで、第２の信号線１２と第３の信号線１３とが電気的に接続される（図２（ｂ））。導体部品５０は、クリームはんだや導電ペーストなどの接合材を用いて、第１〜第３のランド部１１０〜１３０に搭載される。   Conductive component 50 is a bipolar electronic component having one end (first end) and the other end (second end) on the opposite side. One end of the conductor component 50 is mounted on the first land 110, and the other end is mounted on the third land 130, so that the first signal line 11 and the third signal line 13 are connected to each other. Are electrically connected (FIG. 2A). In addition, one end of the conductor component 50 is mounted on the second land 120 and the other end is mounted on the third land 130, so that the second signal line 12 and the third signal line are mounted. 13 are electrically connected (FIG. 2B). The conductor component 50 is mounted on the first to third land portions 110 to 130 using a bonding material such as cream solder or conductive paste.

第１のランド部１１０、第２のランド部１２０および第３のランド部１３０は、典型的には、銅箔やアルミニウム箔などの金属箔で構成され、当該金属箔を所定形状にパターニングすることで各信号線１１〜１３と一体的に形成される。なおこれに限られず、各ランド部１１０〜１３０は、信号線１１〜１３とともに、めっき技術を用いて配線基板１０上の所定領域に選択的に形成されてもよい。ランド部１１０，１２０，１３０の形状は図示するような矩形状に形成されるが、形状はこれに限られず、導体部品５０の端部形状やその大きさに応じて任意に設定可能である。   The first land 110, the second land 120, and the third land 130 are typically made of a metal foil such as a copper foil or an aluminum foil, and the metal foil is patterned into a predetermined shape. Are formed integrally with the signal lines 11 to 13. The present invention is not limited to this, and the lands 110 to 130 may be selectively formed in a predetermined region on the wiring board 10 by using a plating technique together with the signal lines 11 to 13. The lands 110, 120, and 130 are formed in a rectangular shape as shown in the figure, but the shape is not limited to this, and can be set arbitrarily according to the end shape of the conductor component 50 and its size.

本実施形態において第３のランド部１３０は、単一のランドパターンで構成され、第１の信号線１１と第３の信号線１３との間を電気的に接続する形態（図２（ａ））と、第２の信号線１２と第３の信号線１３との間を電気的に接続する形態（図２（ｂ））とにおいて、導体部品５０が搭載される共通のランドとして機能する。   In the present embodiment, the third land portion 130 is formed of a single land pattern, and electrically connects the first signal line 11 and the third signal line 13 (FIG. 2A). ) And the form in which the second signal line 12 and the third signal line 13 are electrically connected (FIG. 2B), functions as a common land on which the conductor component 50 is mounted.

したがって、例えば図３（ａ），（ｂ）に示すように、第３の信号線１３が、第１の信号線１１との接続用のランド部１３１および第２の信号線１２との接続用のランド部１３２の２つのランド部を有するランド構造と比較して、信号の方向性を選択できるランド数を低減することができる。   Accordingly, for example, as shown in FIGS. 3A and 3B, the third signal line 13 has a land portion 131 for connection with the first signal line 11 and a land portion 131 for connection with the second signal line 12. In comparison with the land structure having two land portions of the land portion 132, the number of lands for which the signal directionality can be selected can be reduced.

また、図３（ｂ）に示すように、導体部品５０が第２の信号線１２のランド部１２０と第３の信号線１３のランド部１３２に跨って搭載された場合、ランド部１３１が不要なオープンスタブパターンとして働き、ＲＦコネクタ３０を用いた通信特性評価においては通信評価装置の特性劣化を招く原因となり、無線モジュールＭの通信特性を精度よく測定することができなくなる。   In addition, as shown in FIG. 3B, when the conductor component 50 is mounted across the land 120 of the second signal line 12 and the land 132 of the third signal line 13, the land 131 is unnecessary. It acts as a simple open stub pattern, and in the evaluation of communication characteristics using the RF connector 30, causes deterioration of the characteristics of the communication evaluation device, so that the communication characteristics of the wireless module M cannot be accurately measured.

これに対して本実施形態の配線基板１０においては、上述のように、第３の信号線１３のランド部１３０が第１の信号線１１との接続用および第２の信号線１２との接続用の共通のランド部として構成される。これにより、第１の信号線１１および第２の信号線１２のいずれか一方と接続された場合でも、比較例のように不要なスタブパターンが生じることはないため、通信モジュールＭの特性評価を高精度に行うことが可能となる。また、ランドパターンの数を低減させることができるため、配線基板１０上の配線領域を縮小、配線設計の自由度の向上などを図ることができる。   On the other hand, in the wiring board 10 of the present embodiment, as described above, the land portions 130 of the third signal lines 13 are used for connection with the first signal lines 11 and connection with the second signal lines 12. As a common land. Thus, even when the communication module M is connected to either the first signal line 11 or the second signal line 12, an unnecessary stub pattern does not occur unlike the comparative example. It can be performed with high accuracy. Further, since the number of land patterns can be reduced, the wiring area on the wiring board 10 can be reduced, and the degree of freedom in wiring design can be improved.

＜第２の実施形態＞
図４は、本発明の第２の実施形態に係る配線基板１０Ａの配線構造を示す概略平面図である。以下、第１の実施形態と異なる構成について主に説明し、第１の実施形態と同様の構成については同様の符号を付しその説明を省略または簡略化する。 <Second embodiment>
FIG. 4 is a schematic plan view showing a wiring structure of a wiring board 10A according to the second embodiment of the present invention. Hereinafter, configurations different from the first embodiment will be mainly described, and configurations similar to those of the first embodiment will be denoted by similar reference numerals, and description thereof will be omitted or simplified.

本実施形態の配線基板１０Ａは、第１の信号線１１と、第２の信号線１２と、第３の信号線１３と、予備配線部１５とを備える。予備配線部１５は、第１のランド部１１０と第３のランド部１３０との間を電気的に接続し、第１の信号線１１と第３の信号線１３との間を接続する配線経路を構成する。   The wiring board 10A of the present embodiment includes a first signal line 11, a second signal line 12, a third signal line 13, and a spare wiring unit 15. The spare wiring unit 15 electrically connects the first land unit 110 and the third land unit 130 and connects the first signal line 11 and the third signal line 13 to each other. Is configured.

以上のように構成される本実施形態の配線基板１０Ａにおいては、第１のランド部１１０と第３のランド部１３０との間を接続する予備配線部１５を備えているため、第１のランド部１１０と第３のランド部１３０とに導体部品で搭載することなく、第１の信号線１１と第３の信号線１３とを電気的に接続することができる。   Since the wiring board 10A of the present embodiment configured as described above includes the spare wiring portion 15 that connects between the first land portion 110 and the third land portion 130, the first land The first signal line 11 and the third signal line 13 can be electrically connected without being mounted on the portion 110 and the third land portion 130 with a conductor component.

一方、第２の信号線１２と第３の信号線１３とを接続する場合は、第１の実施形態と同様に、第２のランド部１２０と第３のランド部１３０との間に導体部品５０が搭載される。この際、予備配線部１５は、カッターによる機械的切断、レーザ光による溶断などによって、第１のランド部１１０と第３のランド部１３０との間の電気的接続が遮断される。このように予備配線部１５を後加工によって少なくとも一部を除去することで、第２の信号線１２と第３の信号線１３とを接続する信号経路を構築することができる。   On the other hand, when the second signal line 12 and the third signal line 13 are connected, as in the first embodiment, a conductor component is placed between the second land 120 and the third land 130. 50 are mounted. At this time, the electrical connection between the first land portion 110 and the third land portion 130 of the spare wiring portion 15 is cut off by mechanical cutting by a cutter, fusing by a laser beam, or the like. By removing at least a part of the spare wiring portion 15 by post-processing in this way, a signal path connecting the second signal line 12 and the third signal line 13 can be constructed.

以上、本発明の実施形態について説明したが、本発明は上述の実施形態にのみ限定されるものではなく種々変更を加え得ることは勿論である。   As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and it is needless to say that various changes can be made.

例えば以上の実施形態では、通信評価装置における信号経路の選択に上述した構成の配線基板１０，１０Ａを用いたが、これに限られず、発光素子や発振素子など、あらかじめ基板上に搭載される電気・電子部品に対する信号経路の選択、切り替えなどに本発明は適用可能である。   For example, in the above embodiment, the wiring boards 10 and 10A having the above-described configuration are used for selecting a signal path in the communication evaluation device. However, the present invention is not limited to this. The present invention is applicable to selection and switching of signal paths for electronic components.

また以上の実施形態では、導体部品５０として０Ω抵抗などのジャンパーチップ部品を例に挙げて説明したが、これに限られず、抵抗素子、容量素子、インダクタ素子などの受動部品が導体部品として用いられてもよい。   In the above embodiment, the jumper chip component such as a 0 Ω resistor is described as an example of the conductor component 50. However, the present invention is not limited to this, and passive components such as a resistor, a capacitor, and an inductor are used as the conductor. You may.

さらに、第１の信号線、第２の信号線および第３の信号線の相対位置関係は上述の例に限られず、例えば図５に示すように、第１の信号線および第２の信号線が第３の信号線に対して直交する位置関係であってもよい。   Further, the relative positional relationship between the first signal line, the second signal line, and the third signal line is not limited to the above-described example. For example, as shown in FIG. 5, the first signal line and the second signal line May be orthogonal to the third signal line.

１０，１０Ａ…配線基板
１１…第１の信号線
１２…第２の信号線
１３…第３の信号線
１５…予備配線部
２０…アンテナ
３０…ＲＦコネクタ
４０…コントローラ 10, 10A ... wiring board 11 ... first signal line 12 ... second signal line 13 ... third signal line 15 ... spare wiring section 20 ... antenna 30 ... RF connector 40 ... controller

Claims (4)

第１のランド部を有する第１の信号線と、
第２のランド部を有する第２の信号線と、
第３のランド部を有し、前記第１のランド部または前記第２のランド部に導体部品の第１の端部が搭載され前記第３のランド部に前記導体部品の第２の端部が搭載されることで、前記第１の信号線または前記第２の信号線と電気的に接続可能に構成された第３の信号線と
を具備する配線基板。 A first signal line having a first land portion;
A second signal line having a second land portion;
A third land portion, a first end portion of the conductor component is mounted on the first land portion or the second land portion, and a second end portion of the conductor component is mounted on the third land portion. And a third signal line configured to be electrically connectable to the first signal line or the second signal line. 請求項１に記載の配線基板であって、
前記第１のランド部と前記第３のランド部との間を接続する予備配線部をさらに具備する
配線基板。 The wiring board according to claim 1,
A wiring board, further comprising a spare wiring portion connecting between the first land portion and the third land portion. 第１のランド部を有する第１の信号線と、
第２のランド部を有する第２の信号線と、
第３のランド部を有する第３の信号線と、
前記第１のランド部または前記第２のランド部に搭載される第１の端子と、前記第３のランド部に搭載される第２の端子とを有し、前記第３の信号線と前記第１の信号線または前記第２の信号線とを電気的に接続する導体部品と
を具備する配線基板。 A first signal line having a first land portion;
A second signal line having a second land portion;
A third signal line having a third land portion;
A first terminal mounted on the first land portion or the second land portion, and a second terminal mounted on the third land portion; A conductor component for electrically connecting the first signal line or the second signal line. アンテナと、
コネクタと、
第１のランド部を有しアンテナに接続される第１の信号線と、第２のランド部を有し前記コネクタに接続される第２の信号線と、第３のランド部を有し測定対象に接続される第３の信号線と、を有する配線基板と、
前記第１のランド部または前記第２のランド部に搭載される第１の端部と、前記第３のランド部に搭載される第２の端部とを有し、前記第３の信号線と前記第１の信号線または前記第２の信号線とを電気的に接続する導体部品と
を具備する通信評価装置。 Antenna and
Connectors and
A first signal line having a first land portion and connected to the antenna; a second signal line having a second land portion connected to the connector; and a third land portion having a measurement. A wiring board having a third signal line connected to the target;
The third signal line having a first end mounted on the first land portion or the second land portion and a second end mounted on the third land portion; And a conductor component for electrically connecting the first signal line or the second signal line.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582958A (en) * 1991-09-19 1993-04-02 Fuji Electric Co Ltd Circuit forming method in printed board
JP2000332371A (en) * 1999-05-19 2000-11-30 Nec Yonezawa Ltd Printed substrate
JP2002281132A (en) * 2001-03-14 2002-09-27 Kyocera Corp Portable communications equipment
JP2005327794A (en) * 2004-05-12 2005-11-24 Alps Electric Co Ltd Circuit board
JP2006345179A (en) * 2005-06-08 2006-12-21 Alps Electric Co Ltd Communication device having inspection terminal
JP2013004663A (en) * 2011-06-15 2013-01-07 Mitsubishi Electric Corp Printed board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582958A (en) * 1991-09-19 1993-04-02 Fuji Electric Co Ltd Circuit forming method in printed board
JP2000332371A (en) * 1999-05-19 2000-11-30 Nec Yonezawa Ltd Printed substrate
JP2002281132A (en) * 2001-03-14 2002-09-27 Kyocera Corp Portable communications equipment
JP2005327794A (en) * 2004-05-12 2005-11-24 Alps Electric Co Ltd Circuit board
JP2006345179A (en) * 2005-06-08 2006-12-21 Alps Electric Co Ltd Communication device having inspection terminal
JP2013004663A (en) * 2011-06-15 2013-01-07 Mitsubishi Electric Corp Printed board

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