JP2020053523A5 - - Google Patents

Download PDF

Info

Publication number
JP2020053523A5
JP2020053523A5 JP2018180392A JP2018180392A JP2020053523A5 JP 2020053523 A5 JP2020053523 A5 JP 2020053523A5 JP 2018180392 A JP2018180392 A JP 2018180392A JP 2018180392 A JP2018180392 A JP 2018180392A JP 2020053523 A5 JP2020053523 A5 JP 2020053523A5
Authority
JP
Japan
Prior art keywords
transistor
layer
conductive layer
forming
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018180392A
Other languages
English (en)
Japanese (ja)
Other versions
JP7278046B2 (ja
JP2020053523A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018180392A priority Critical patent/JP7278046B2/ja
Priority claimed from JP2018180392A external-priority patent/JP7278046B2/ja
Publication of JP2020053523A publication Critical patent/JP2020053523A/ja
Publication of JP2020053523A5 publication Critical patent/JP2020053523A5/ja
Application granted granted Critical
Publication of JP7278046B2 publication Critical patent/JP7278046B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018180392A 2018-09-26 2018-09-26 半導体装置の作製方法 Active JP7278046B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018180392A JP7278046B2 (ja) 2018-09-26 2018-09-26 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018180392A JP7278046B2 (ja) 2018-09-26 2018-09-26 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2020053523A JP2020053523A (ja) 2020-04-02
JP2020053523A5 true JP2020053523A5 (https=) 2021-10-21
JP7278046B2 JP7278046B2 (ja) 2023-05-19

Family

ID=69994285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018180392A Active JP7278046B2 (ja) 2018-09-26 2018-09-26 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP7278046B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230247873A1 (en) * 2020-07-03 2023-08-03 Semiconductor Energy Laboratory Co., Ltd. Display apparatus, display module, and electronic device
CN117178314A (zh) * 2021-04-22 2023-12-05 株式会社半导体能源研究所 显示装置及显示装置的制造方法
KR102908920B1 (ko) 2021-10-28 2026-01-09 삼성디스플레이 주식회사 전자 장치
KR102866806B1 (ko) 2021-12-27 2025-09-29 엘지디스플레이 주식회사 표시 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585955B (zh) * 2008-11-28 2017-06-01 半導體能源研究所股份有限公司 光感測器及顯示裝置
WO2013133143A1 (en) * 2012-03-09 2013-09-12 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device
US10020336B2 (en) * 2015-12-28 2018-07-10 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device using three dimentional (3D) integration

Similar Documents

Publication Publication Date Title
JP2012178579A5 (https=)
JP2013080935A5 (https=)
JP2015179248A5 (https=)
JP2020053523A5 (https=)
JP2011077512A5 (ja) 発光装置の作製方法
JP2013033998A5 (https=)
JP2014220488A5 (https=)
WO2016064134A3 (en) Light emitting device and method of fabricating the same
JP2010062546A5 (https=)
JP2013175738A5 (ja) 発光装置の作製方法
JP2017103467A5 (ja) 表示装置の作製方法
JP2016006871A5 (https=)
JP2017199669A5 (https=)
JP2011076080A5 (https=)
JP2015135976A5 (ja) 半導体装置の作製方法
JP2015165494A5 (https=)
JP2011044696A5 (ja) 半導体装置の作製方法
JP2011085923A5 (ja) 発光装置の作製方法
JP2016015485A5 (ja) 撮像装置及び電子機器
JP2015216369A5 (https=)
JP2015056554A5 (https=)
JP2013254947A5 (ja) 表示装置
US20170170252A1 (en) Organic light emitting diode display and manufacturing method thereof
JP2015128163A5 (https=)
JP2014178698A5 (ja) 素子基板