JP2020049754A - Substrate manufacturing method - Google Patents

Abstract

To provide a substrate manufacturing method by which when transferring a resin layer onto a substrate and forming a structure, lack of burr due to the resin layer which extends outside the substrate during transfer is suppressed.SOLUTION: This substrate manufacturing method includes: a process in which a sticking material 30, in which a component 32 is formed on a support 31, is prepared; a process in which the sticking material is bonded to the substrate on the component side so that the component 32 protrudes from an outer edge of a substrate 20; and a process in which the support is peeled and the component is transferred onto the substrate. A structure which becomes a starting point of breakage of a resin layer, for example, a groove 21 formed in the substrate 20 or a recess or the like formed in the resin layer is formed so that a region protruding from the substrate is separated from a region contacting the substrate when peeling the support.SELECTED DRAWING: Figure 3-1

Description

The present invention relates to a method for manufacturing a substrate having a resin structure.

In the recent semiconductor industry, there is a demand for a technology for manufacturing devices with higher dimensional accuracy than ever before. For example, in the ink jet industry, uniformity of ejected ink droplets is required in order to improve the image quality, and for that purpose, a technology for uniformly forming ink flow paths with high dimensional accuracy is required. .

  As one of the means, Patent Literature 1 describes a method of forming a nozzle forming member on a substrate by attaching a resin layer made of a photosensitive resin to the substrate. In this method, the resin layer is supported by the support until the resin layer is attached to the substrate, and after the resin layer is attached to the substrate, the support is separated. Thereafter, a flow path pattern is formed on the nozzle forming member on the substrate by photolithography or the like.

  A general factor that reduces the dimensional accuracy of the ink flow path is a variation in the film thickness due to the method of forming the nozzle forming member. Unlike the conventional spin coating and slit coating, the bonding method disclosed in Patent Literature 1 does not experience a reduction in film thickness uniformity due to spin airflow or solvent drying, and thus can suppress variations in film thickness.

JP 2006-137065 A

  It is preferable that the member such as the resin layer on the support is usually processed into the same shape as the substrate (wafer) to be attached. However, it is necessary to peel off the support after transferring the member on the support to the substrate, and it is preferable to provide a gripper for gripping the support. Therefore, the members on the support are processed to be larger than the shape (effective area) of the substrate. In that case, burrs based on the member may be formed outside the wafer region, and burrs missing during the process may lower the quality of the product.

  An object of the present invention is to provide a method for manufacturing a substrate in which such burrs are prevented from being lost during the process, and a method for manufacturing a substrate for a liquid discharge head to which the method for manufacturing a substrate is applied.

The method for manufacturing a substrate according to the present invention for solving the above-described problems includes:
A method for producing a substrate having a resin structure, comprising: a step of preparing an adhesive material having a resin layer formed on a support; and the step of preparing the adhesive material so that the resin layer protrudes from an outer edge of the substrate. A step of attaching to the substrate, peeling the support, transferring the resin layer on the substrate, and processing the transferred resin layer into a resin structure, Along the outer periphery of the substrate, when the support is peeled off, the starting point of the fracture of the resin layer is in the direction of the center of gravity of the substrate from the end of the flat portion of the substrate, and the resin formed by the transferred resin layer A structure is formed on the surface of the substrate to which the resin layer is adhered or on the resin layer so that the structure is formed outside the substrate in the region where the structure is formed.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the burr by the resin layer after a support body peeling process can be suppressed.

1A and 1B are a partially cutaway perspective view and a schematic cross-sectional view schematically illustrating a substrate for a liquid ejection head according to an embodiment of the present invention. It is a perspective view explaining the outline of a wafer-like substrate. FIGS. 3A to 3D are partially enlarged views (d ′) of process steps illustrating a method for manufacturing a substrate and a liquid discharge head substrate according to the first embodiment. FIGS. 7A to 7G are process cross-sectional views illustrating a method for manufacturing the substrate and the liquid ejection head substrate according to the first embodiment. FIGS. FIG. 2 is a plan view showing a groove formation region according to the first embodiment. FIG. 3 is a partial plan view illustrating the shape of the groove according to the first embodiment. FIG. 4 is a diagram illustrating a groove forming process according to the first embodiment. 7A to 7E are process cross-sectional views illustrating a method for manufacturing a substrate and a liquid ejection head substrate according to the second embodiment. It is process sectional drawing (a)-(d) explaining the example of the formation method of the recessed part of the resin layer which concerns on 2nd Embodiment. It is process sectional drawing (a)-(c) explaining another example of the formation method of the recessed part of the resin layer which concerns on 2nd Embodiment. It is process drawing (A) and (B) explaining another example of the formation method of the recessed part of the resin layer which concerns on 2nd Embodiment. 7A to 7E are process cross-sectional views illustrating a method for manufacturing a liquid ejection head substrate according to a second embodiment. 13A to 13E are process cross-sectional views illustrating a method for manufacturing a substrate and a liquid discharge head substrate according to the third embodiment. It is a top view explaining the relation between the substrate and convex member concerning a 3rd embodiment. It is a mimetic diagram explaining section shape of a convex member concerning a 3rd embodiment. It is process sectional drawing explaining the example of formation of the convex-shaped member which concerns on 3rd Embodiment. 14A to 14E are process cross-sectional views illustrating a method for manufacturing a substrate and a substrate for a liquid ejection head according to a fourth embodiment. It is a mimetic diagram showing the example of the pressing member concerning a 4th embodiment. It is a process sectional view explaining a manufacturing method of a substrate and a substrate for liquid discharge heads concerning a conventional technology.

  The method for manufacturing a substrate according to the present invention is applicable not only to a method for manufacturing a substrate for a liquid discharge head, but also to a method for manufacturing a micro machine such as an acceleration sensor. The substrate is preferably a wafer-shaped substrate, but the present invention can be applied to substrates of various shapes in which burrs are a problem when transferring a member by attaching an attaching material.

  Hereinafter, a method for manufacturing a substrate of the present invention will be described with reference to the drawings, taking an embodiment of a method for manufacturing a substrate for a liquid discharge head as an example.

  1A is a partially cutaway perspective view of a liquid ejection head substrate 10 in the form of a chip cut out from a wafer according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. ).

  An energy generating element 2 for foaming ink using a semiconductor manufacturing technique on a silicon substrate and a driving circuit (not shown) for driving the energy generating element 2 are formed on a base 1. Further, a liquid supply port 3 communicating with both surfaces of the base 1 is formed by silicon etching. Further, a discharge port 5 for discharging the ink supplied from the back side of the substrate by the nozzle forming member 4 is formed on the energy generating element 2. By driving the energy generating element 2 corresponding to each discharge port to foam the ink, the pressure can be used to discharge the ink to perform printing.

  As shown in FIG. 1B, the nozzle forming member 4 includes a flow path forming member 6 forming a wall of the liquid flow path 8 and a discharge port forming member 7 forming the discharge port 5. When the flow path forming member 6 and the discharge port forming member 7 are formed of resin, they are resin structures.

  Usually, as shown in FIG. 2, a plurality of such liquid discharge head substrates 10 in the form of chips are formed on a wafer-like substrate 20 constituting the base body (1), and are cut into chip forms after completion. .

[First Embodiment]
First, a first embodiment of the present invention will be described with reference to FIG. 3 (FIGS. 3-1 and 3-2). In the second embodiment, a groove is provided at the outer edge of the substrate, and the resin layer is broken starting from the groove to suppress the occurrence of burrs on the resin layer outside the substrate region.

  First, as shown in FIG. 3A, a substrate 20 having an energy generating element for generating energy used for discharging a liquid is prepared. On the surface of the substrate 20, in addition to the energy generating element, a surface membrane layer composed of wiring, an interlayer insulating film, and the like is formed, but is omitted here for simplicity.

  Next, an etching mask is formed on the front surface and the back surface of the substrate 20 using a photoresist or the like, and etching is performed, so that the liquid supply port 3 and the groove 21 are formed in the substrate 20. At this time, the size of the liquid supply port 3 is desirably formed smaller than the width of the groove 21 so that cohesive failure does not occur. In the present embodiment, the groove 21 is formed on the entire outer periphery of the substrate 20 as shown in FIG. 4A, but at least the outer edge of the substrate in which a peeling direction PD of the support, which will be described later, is from the inside to the outside of the substrate 20. Part may be formed. That is, as shown in FIG. 4B, the support 20 can be formed on a side that is half or more of the diameter of the substrate 20 with respect to the peeling direction PD in accordance with a step of peeling the support described later. Further, as shown in FIG. 4C, the groove may be divided and arranged in accordance with a region where burrs are likely to occur. Although not shown in the drawing, the groove can be formed not only in the invalid chip area on the outer edge of the substrate but also in the valid chip area. The structure shown in FIG. 3A is completed by the steps up to here. The step of forming the liquid supply port 3 may be performed after the formation of the discharge port described later.

  Next, as shown in FIG. 3B, an adhesive material 30 in which a resin layer 32 serving as a resin structure is formed on a support 31 is prepared. Examples of the support 31 include polyethylene terephthalate, polyimide, and polyamide. The thickness of the support 31 is preferably in the range of 10 μm to 200 μm, and is preferably 75 μm or more in order to prevent the resist from dropping on the liquid supply port 3. Examples of a method for forming the resin layer 32 include a spin coating method and a slit coating method. The thickness of the resin layer 32 is appropriately selected according to the structure to be formed on the substrate. In the case of the nozzle forming member (flow path forming member and discharge port forming member) of the liquid discharge head, the thickness is 0.5 μm to 100 μm. Is preferred. The outer shape of the resin layer 32 in the adhesive material is formed to be larger than the outer shape of the substrate 20. At this time, the end of the support 31 does not need to coincide with the end of the resin layer 32. After the resin layer 32 is formed on the support 31 by coating, the outer periphery of the resin layer 32 is formed into a predetermined shape. Can be removed to make the resin layer 32 recede from the end of the support 31.

  Next, as shown in FIG. 3C, the adhesive material 30 is attached so that the resin layer 32 protrudes from the outer edge of the substrate 20 where the liquid supply port 3 is formed. At this time, the resin layer 32 is formed so as to cover the groove 21 over the outer edge of the substrate 20. When the liquid supply port 3 is formed after the formation of the nozzle forming member, the liquid supply port 3 is not formed in the substrate 20 at this time.

  Next, as shown in FIG. 3D, the support 31 is peeled off. At this time, at the time of peeling, a rupture portion 33 due to cohesive failure occurs in the groove 21 in the resin layer 32. This means that, as shown in FIG. 3 (d '), the relationship between the adhesive force F1 between the substrate and the resin layer and the adhesive force F2 between the support and the resin layer is usually F1> F2. On the other hand, F1 disappears in the groove 21 portion, but a bending stress M is generated due to the presence of an adhesive portion having an adhesive force F3 outside the groove 21. When the bending stress M is larger than the cohesive force of the resin layer 32, a fracture 33 occurs in the resin layer 32 due to cohesive failure. FIG. 3D is an enlarged view of the vicinity of the groove 21. The bending stress M is maximum near the end a of the groove on the substrate center of gravity side starting from the end b of the groove on the outer peripheral side of the substrate. Therefore, a broken portion due to cohesive failure occurs in the resin layer near the end a.

  As shown in FIG. 3E, when the support 31 is peeled to the end, the resin layer 34 outside the break 33 is peeled off together with the support. As a result, the resin layer does not remain as burrs outside the region of the substrate 20. In the case where the groove 21 is formed on the peeling start side of the support, that is, on the substrate end where the peeling direction is from the outside to the inside of the substrate, the resin layer due to cohesive failure at the end of the groove on the substrate center of gravity side. Fracture occurs. When no groove is formed, the resin layer breaks due to cohesive failure at the end of the flat portion of the substrate. In each case, the resin layer breaks near the side wall of the groove on the side of the center of gravity of the substrate, and the resin layer outside the substrate region is removed together with the support. Therefore, in the present invention, the formation of burrs can be suppressed by forming at least a groove in the second half of the separation of the support, in which the resin layer is likely to remain as burrs.

  At this time, as shown in FIG. 3C, when the width of the groove 21 is W, and the width of the bonding area between the outer edge portion and the resin layer from the groove to the end portion 20a of the flat portion of the substrate in the direction of the center of gravity of the substrate is X. , Width X is preferably 500 to 1500 μm, and groove width W is preferably 50 to 500 μm. When X is 500 μm or more, a sufficient adhesive force F3 can be maintained, and the bending stress M exerts a force sufficient for cohesive failure of the resin layer. On the other hand, when X is 1500 μm or less, the adhesive force F3 does not become too large, and the resin layer can be peeled off together with the support. Further, if W is 50 μm or more, a sufficient bending stress for causing cohesive failure can be secured. On the other hand, if W is 500 μm or less, the depression of the resin layer does not increase, and the occurrence of cohesive failure is stabilized. When the liquid supply port 3 is formed in the substrate 20, the distance Y from the end of the groove 21 in the direction of the center of gravity of the substrate to the opposite end of the liquid supply port 3 is preferably larger than 1500 μm, and more than 2000 μm. Is more preferred. If the distance Y is larger than 1500 μm, it is possible to prevent the resin layer from being simultaneously peeled when the support is peeled in this region. Note that the upper limit is not particularly set as long as a width at which a structure formed of a resin layer can be formed is secured at the end of the substrate in the effective chip area. Further, the depth H of the groove depends on the width W of the groove and the thickness of the substrate to be used, but is preferably 以上 or more of the width W and 以下 or less of the substrate thickness, and is が or less of the substrate thickness. More preferred.

  Regarding the shape of the groove 21 to be formed, in addition to the groove having a predetermined width as shown in FIG. 5A, at least the side walls on the side of the center of gravity of the substrate have irregularities (projections 21a1, 21a2 (FIG. 5B)). ) And the concave portions 21c (FIG. 5C) can also induce cohesive failure. Further, as shown in FIG. 5B, concave portions 21b1 and 21b2 may be provided on the outer peripheral side wall of the substrate, and the cohesive failure can be generated more efficiently by adjusting the angle of the convex portion in the direction of peeling. . In FIG. 5, the columns A and B in FIG. 5 correspond to the regions A and B shown in FIG. 4A, respectively.

  Next, using the resin layer transferred onto the substrate, discharge ports are formed by the following manufacturing method. First, as shown in FIG. 3F, the resin layer 32 transferred onto the substrate 20 is processed into a desired shape, and the flow path forming member 6 is formed. When the resin layer 32 is a photosensitive resin, the processing method is performed by exposing and developing. When the resin layer 32 is a non-photosensitive resin, etching is performed using a resist mask or the like, and processed into a desired shape.

  Next, an adhesive material (not shown) in which a resin layer serving as a discharge port forming member is formed on a support is prepared, and as shown in FIG. After peeling, processing is performed to form a discharge port forming member 7 having a discharge port 5. As in the case of forming the flow path forming member 6, when the resin layer is a photosensitive resin, the processing method is performed by exposing and developing. When the resin layer is a thermosetting resin or a photocurable resin, the resin layer is etched into a desired shape by using a resist mask or the like.

If both the resin layer forming the flow path forming member 6 and the resin layer forming the discharge port forming member 7 are photosensitive resins, particularly, a negative photosensitive resin, batch development can be performed. That is, the resin layer of the flow path forming member 6 is not subjected to development after exposure, and after the resin layer serving as the discharge port forming member 7 is exposed, the unexposed portion of the discharge port 5 and the area to be the flow path 8 are collectively developed. It does not matter. At this time, by changing the prescription of the photoacid generator to be mixed with the photosensitive resin serving as the discharge port forming member and making it more sensitive than the photosensitive resin for the flow path forming member, the lower layer is exposed when the upper layer is exposed. The unexposed portion can be prevented from being exposed.
As described above, the liquid supply port 3 may be formed in the substrate after this step.

  Finally, the substrate for a liquid ejection head of the present embodiment is manufactured by cutting out each chip from the substrate. According to the manufacturing method of the present embodiment, when the resin layer serving as the resin structure is attached to the substrate, the cohesive failure of the resin layer 32 can be induced by the groove 21. Accordingly, it is possible to suppress the occurrence of burrs in the resin layer outside the substrate region, and to suppress a decrease in product quality due to lack of burrs.

[Second embodiment]
Next, a second embodiment of the present invention will be described. In the second embodiment, a concave portion is provided on the side of the resin layer to be transferred, and a starting point of breakage of the resin layer is provided in the concave portion, thereby suppressing the generation of burrs on the resin layer outside the substrate region.

  First, as shown in FIG. 7A, an adhesive material 50 having a resin layer 52 on a support body 51 is prepared in the same manner as in the first embodiment, and a part of the material is treated to form an outer edge of the substrate. A concave portion 52a is formed at the outer edge of the resin layer corresponding to the portion. Here, an example in which the concave portion is formed on the entire periphery of the outer edge portion of the resin layer 52 is shown. It may be formed at the outer edge of the substrate in the direction. The method for forming the recess will be described later.

Next, as shown in FIG. 7B, an adhesive material 50 is attached to the substrate 20 on which the liquid supply port 3 is formed. At this time, the resin layer 52 is attached so as to protrude from the edge of the substrate 20. Note that, like the first embodiment, the liquid supply port 3 may not be formed at this stage, but may be formed in a later step. At this time, the inner end of the concave portion 52a is on the inner side of the substrate than the end 20a of the flat portion of the substrate 20. Further, the outer end of the recess 52a may be located outside the end 20a. However, in this case, in order to avoid that the broken portion 53 of the resin layer protrudes from the edge of the substrate in the subsequent steps, the recessed portion is formed so that the broken portion 53 is located on the inside of the substrate from the end 20a of the flat portion of the substrate 20. The position of 52a is set.
In addition, it is preferable to arrange the inner end of the concave portion 52a so as not to enter the inside of the substrate as much as possible from the viewpoint of the number of chips to be obtained. For example, it is preferable to limit the area to a chip invalid area that allows contact by the transfer robot of the manufacturing apparatus. Further, when the concave portion is present in the inner direction of the substrate, the contact area between the resin layer and the substrate on the outer side of the substrate becomes larger than the concave portion, and the force required for peeling is increased. There is.
The width of the recess in the direction of the center of gravity of the substrate depends on the range of the element formation region on the substrate, the thickness of the resin layer, the minimum thickness of the resin layer in the recess, and the method for forming the recess described later, but is set in the range of 500 μm to 5 mm. can do. The shape of the concave portion depends on the forming method. When the liquid supply port 3 is formed in the substrate 20, it is preferable to secure the adhesion of the resin layer from the liquid supply port 3 to the inner end of the concave portion. Therefore, similarly to the first embodiment, the distance from the liquid supply port 3 to the inner end of the concave portion is preferably larger than 1500 μm, and more preferably 2000 μm or more.

  Next, as shown in FIG. 7C, the support 51 is peeled in the peeling direction PD. When the concave portion 52a is formed on the entire circumference, cohesive failure occurs in the concave portion 52a even at the start of peeling, and a broken portion 53 is formed. If the concave portion 52a is not formed on the peeling start side, cohesive failure occurs near the edge of the flat portion of the substrate and near the boundary between the bonded surface and the non-bonded surface. Then, when the peeling of the support proceeds to the peeling terminal side of the support, cohesive failure occurs in the concave portion 52a on the terminal side, and the resin layer 54 outside the concave portion 52a is peeled and removed together with the support (FIG. 7 (d)). )).

  As shown in the figure, when the outer end of the concave portion is located on the inner side of the substrate from the end portion 20a of the flat portion of the substrate, the resin layer 54 in the region from the outer end of the resin layer to the concave portion is peeled off following the support 51. The elements that determine whether the data is held on the substrate 20 are as follows. The force relationship here is “adhesion between the resin layer and the support”, “adhesion between the resin layer and the substrate”, and “cohesion of the resin layer”. In the present embodiment, by forming a concave portion in the resin layer and reducing the “cohesive force of the resin layer” in the region from the outer end of the resin layer 52 to the concave portion 52a, the “adhesive force between the resin layer and the support” is reduced. Adjusts the force relationship to exceed the resultant force of the “adhesive force between the resin layer and the substrate” and the “cohesive force of the resin layer”. The resin layer 52 breaks at a break 53 in the concave portion 52a, and as shown in FIG. 7D, the resin layer 54 outside the substrate region is removed together with the support, and does not remain as burrs.

  After that, similarly to the first embodiment, the flow path forming member 6 and the discharge port forming member 7 are formed. The discharge port forming member 7 can also be formed using the same adhesive material having a concave portion formed at the end of the resin layer.

Also in the present embodiment, when the resin layer is attached to the substrate, the cohesive failure of the resin layer 52 can be induced by the concave portion 52a. Accordingly, it is possible to suppress the occurrence of burrs in the resin layer outside the substrate region, and to suppress a decrease in product quality due to lack of burrs.
Note that, in the drawing, the end of the support 51 is disposed outside the end of the resin layer 52. However, when a support fixing frame (not shown) is used for attaching the attaching material 50, the support 51 and the resin layer 52 are cut at one time along the outer periphery of the substrate 20 in order to separate from the support fixing frame. You may. In this case, the end of the support 51 matches the end of the resin layer 52.

<Method of forming recess>
Next, a method for forming the recess 52a will be described. As a method for forming the concave portion, there are a method in which the resin layer is formed on the support at the same time as the resin layer, and a method in which the resin layer is formed on the support and then processed into the concave portion. First, the former method of forming the resin layer on the support at the same time as forming the resin layer will be described.

  First, as shown in FIG. 8A, a support 51 having a release film 51b formed on a base material 51a is prepared. Examples of the material of the base material 51a include polyethylene terephthalate, polyimide, and polyamide. Examples of the material of the release film 51b include silicone resin, fluorine resin, amino resin, polyethylene, polyester, polypropylene, and titanium oxide. The thickness of the release film 51b is preferably from 10 nm to 10 μm, more preferably 100 nm or more from the viewpoint of the releasability of the resin layer, and 1 μm or less from the viewpoint of uniformity of the resin layer thickness. Is preferred. Examples of a method for forming the release film 51b include a spin coating method and a slit coating method. The thickness of the substrate 51a is preferably in the range of 10 μm to 200 μm. In order to suppress the resin layer from dropping into the liquid supply port 3, a thickness of 75 μm or more is preferable.

  Next, as shown in FIG. 8B, a concave portion base 51c is formed at a position where a concave portion is formed in the resin layer. As a method thereof, there is a method in which the surface free energy of the region serving as the concave portion base 51c is relatively lower than the surface free energy of the other region. As this method, there is a method of relatively increasing the surface free energy of the region other than the region serving as the concave portion base 51c by discharge treatment, light irradiation, formation of a water-repellent film, or the like.

  Examples of the discharge treatment include corona discharge and atmospheric pressure plasma treatment (glow discharge). These dissociate oxygen existing in the system by the discharge, and cut off a part of the bond of the resin constituting the release film 51b by the generated electrons. Further, hydrophilic groups such as a hydroxyl group, a carbonyl group and a carboxyl group are added to the cut portion by oxygen radicals or ozone generated by ionization. As a result, the surface free energy of the release film in the treated portion can be relatively increased. The material of the release film to be subjected to the discharge treatment is not limited by the method. In addition, by covering a region where the discharge treatment is desired to be avoided with a protective film or the like, a discharge effect can be selectively provided.

  The light irradiation aims at a photochemical reaction, and can change the surface free energy by causing a elimination reaction of a hydrophobic group or an addition reaction of a hydrophilic functional group on a release film. The material of the release film to be irradiated with light is required to have a functional group that can be cut by a photochemical reaction when a elimination reaction of a hydrophobic group occurs. For example, as one type of fluororesin, there is a condensate containing a perfluoropolyether group-containing silane compound having a structure containing a carbonyl group between a perfluoropolyether group and a hydrolyzable silyl group. This method can be used in this method because a short wavelength ultraviolet light is absorbed to break a bond in the vicinity of a carbonyl group and a hydrophobic perfluoropolyether group is eliminated.

  When an addition reaction occurs, it is required that a hydrophilic functional group can be formed by a photoreaction. Titanium oxide can be used in this method because it can introduce a hydroxyl group by absorbing ultraviolet light.

  In the case of these methods, an area where light irradiation is desired to be avoided can be selectively applied to a region by shielding the area with an exposure mask or the like, thereby giving an effect of light irradiation.

  When a water-repellent film is formed on the release film, a film made of a material having a lower surface free energy than that of the release film is formed in a region serving as a base of the concave portion. At this time, it can be formed selectively by a dispensing method. Examples of the material for the water-repellent film include a resin having a fluoroalkyl group.

  Next, as shown in FIG. 8C, a resin composition 52P, which is a material of the resin layer, is formed on the support 51. As the resin composition, a chemically amplified resist having thermosetting properties can be used. As the resin component of the resin composition, at least one selected from an epoxy resin, a silicone-based polymer compound, a vinyl-based polymer compound having a hydrogen atom at the α-position, and the like can be used. Among these, an epoxy resin is preferable as the resin component. Examples of the epoxy resin include a phenol novolak resin, a cresol novolak resin, and an epoxidized rubber such as an epoxidized polybutadiene. These may be used in combination of two or more. Further, the resin composition can include a photoacid generator. As the photoacid generator, a triarylsulfonium salt, an onium salt, or the like can be used. These may be used in combination of two or more. Further, the resin composition can include a solvent. As the solvent, propylene glycol monomethyl ether acetate (PGMEA), γ-butyrolactone, or the like can be used. These may be used in combination of two or more.

  Next, as shown in FIG. 8D, the resin layer 52 is formed by baking the resin composition 52P. The concave portion 52a is formed simultaneously with the drying of the resin composition in the course of the progress of the drying of the resin composition. This is adjusted in the pretreatment so that the energy stability obtained by exposing the concave portion base 51c exceeds the energy stability lost by breaking the resin composition applied on the concave portion base 51c. That is because At this time, the thickness of the resin layer 52 is preferably 0.5 μm to 100 μm.

  Alternatively, by forming a water-repellent film on a support in place of the surface treatment of the release film, the concave portion can be formed through a resin layer coating / drying step by the same effect. FIG. 9 shows a method of forming a concave portion by forming a water-repellent film.

  First, as shown in FIG. 9A, a water-repellent film 55 is applied and formed on a region serving as a base of a concave portion on the support body 51 by using a dispensing method or the like. The thickness of the water-repellent film 55 is formed to be half or less of the thickness of the resin layer. As the water-repellent film 55, a material such as a perfluoroalkylsilane compound can be used, and a water-repellent film is formed by baking after application.

  Subsequently, as shown in FIG. 9B, a resin composition 52P, which is a material of the resin layer, is formed on the support 51 as in FIG. 8C. The same material as described above can be used as the resin composition 52P.

  Next, as shown in FIG. 9C, the resin layer 52 is formed by baking the resin composition 52P. At this time, the concave portion 52a is formed by the fact that the water-repellent film 55 is convex and the resin composition 52P on the water-repellent film 55 is repelled. The surface of the water-repellent film 55 may be exposed in the concave portion 52a. When the support is peeled, a break occurs at the boundary between the water-repellent film 55 and the resin layer 52, and the water-repellent film 55 is removed together with the support 51.

  Next, a method for forming a resin layer on a support and then processing the resin layer into a concave portion will be described. Examples of this processing method include a solvent treatment as shown in FIG. 10A and a plastic processing as shown in FIG. 10B.

  In the solvent treatment, the resin layer 52 is redissolved in a region of the resin layer 52 forming the concave portion 52a by a dispensing method of discharging a solvent capable of dissolving the resin layer from the dispenser 61 or the like, and then dried again. Thereby, a concave portion 52a is formed. The shape of the concave portion is formed as a result of the resin solids in the resin layer being concentrated at the boundary with the non-dissolving region due to Marangoni convection generated in the process of drying the solvent. The solvent used here can be selected from the same category as the solvent of the resin composition. In the solvent treatment, a treatment for removing at least a part of the resin layer with a solvent may be used.

  In the plastic working, the depression 52a is formed by pushing the pressing member 62 into the region of the resin layer 52 where the depression 52a is formed. The pressing member may have a ring shape in a plane parallel to the support. In this case, the depressions can be collectively formed by a single pressing operation. Further, the pressing member may have a needle-like shape. In this case, the concave portion can be formed by pressing the support into the region where the concave portion is to be formed while rotating the support in the plane. Of the pressing member, it is preferable from the viewpoint of resin extrusion performance that the shape of a portion pressed into the resin layer is tapered in the pressing direction, but in order to prevent damage to the support, the tip is flat. Alternatively, it is more preferable that the shape is an R shape.

It is preferable that the thickness of the resin layer in the concave portion is 10 μm or less from the viewpoint of removing the resin layer 54 outside the substrate from the concave portion 52a when the support is peeled off. .
As described above, a part of the resin layer 52 is thinned to form a concave portion having an opening on the substrate side.

[Third embodiment]
In the third embodiment of the present invention, a convex member is provided on the surface of the substrate to which the resin layer is to be attached before the step of attaching the attachment material to the substrate, as a structure serving as a starting point of the breakage of the resin layer. By providing the protruding member, in the step of sticking the sticking material, the starting point of the break can be obtained by pushing the resin layer toward the support by the protruding member.

  FIG. 12 is a process chart for explaining the outline of the present embodiment. FIG. 12 shows a schematic diagram of a cross section at one end, particularly a schematic diagram of a cross section at the end side of the step of separating the support.

  First, as shown in FIG. 12A, the convex member 70 is arranged on the substrate 20 on which the liquid supply port 3 is formed. The convex member may be formed along the entire outer periphery of the substrate 20, and like the groove 21 of the first embodiment, the outer edge of the substrate where the peeling direction PD of the support is from the inner side to the outer side of the substrate 20. Part may be formed. Details of the convex member will be described later. Here, a case where a convex member having an annular structure (ring shape) is used according to the outer shape of a substrate (wafer) will be described.

  The convex member 70 has, for example, a ring shape as shown in FIG. 13, and its outer diameter is preferably between Dmm and (D−20) mm, where Dmm is the outer diameter of the substrate 20. That is, the distance from the end of the substrate to the outer end of the convex member 70 is set to 20 mm or less. Further, the width of the convex member in the direction of the center of gravity of the substrate, particularly, the width of the bottom surface in contact with the substrate 20 can be in the range of 500 μm to 20 mm. The optimum inner diameter of the convex member can be appropriately selected from the above ranges of the outer diameter and the bottom width in consideration of the element formation region. When the liquid supply port 3 is formed in the substrate 20, it is preferable to ensure the adhesion of the resin layer from the liquid supply port 3 to the inner wall of the convex member. In this case, as in the first embodiment, the distance from the liquid supply port 3 to the inner wall of the convex member is preferably larger than 1500 μm, and more preferably 2000 μm or more. FIG. 13A is a plan view before the overlapping of the convex members 70, and FIG. 13B is a plan view after the overlapping.

  The cross section of the convex member 70 in the direction of the center of gravity of the substrate preferably has a shape in which the widths of the upper end and the lower end are equal or the upper end width is smaller than the lower end width. As a shape in which the upper end width is smaller than the lower end width, for example, the shape shown in FIG. 14 can be exemplified. FIGS. 14A to 14D show examples of shapes whose cross sections are symmetrical. Further, it is preferable that the inclined portion from the upper end to the lower end has the same inclination on both sides, or the inclination of the side wall facing the outer periphery of the substrate 20 is steeper. FIGS. 14E to 14H show examples in which the outer peripheral side wall has a steep slope. When the width of the cross section of the convex member 70 is equal at the upper end and the lower end, the convex member 70 comes into surface contact with the resin layer 32 when the adhesive material 30 is attached. At that time, the resin layer 32 is moved by the pressure of the contact surface of the convex member 70. Since the movement of the resin layer 32 occurs in the side surface direction of the convex member 70, the in-plane distribution of the film thickness of the resin layer 32 tends to decrease. On the other hand, when the cross section of the convex member 70 has a smaller upper end width than a lower end width, the volume of the convex member 70 can be reduced, so that the movement amount of the resin layer 32 is reduced, and the in-plane distribution of the resin layer is reduced. The decrease can be suppressed. Further, when the side surface of the convex member 70 is steeper toward the outer peripheral side of the substrate 20, the resin layer 32 moves preferentially to the outside of the substrate 20 along the slope. A decrease in in-plane distribution can be further suppressed.

  The height of the convex member 70 is preferably between 0.5Z and 2.0Z, where Z is the thickness of the resin layer 32. If the height of the convex member 70 is less than half the height of the resin layer 32, the effect of preferentially causing cohesive failure of the resin layer 32 is not sufficiently exhibited. If the height of the convex member 70 is higher than 2.0Z, a gap may be generated between the substrate 20 and the resin layer 32 when the bonding material 30 is bonded. More preferably, the height of the convex member 70 is between 0.5Z and 1.0Z. In this range, the sticking material 30 can be stably stuck without pushing up the support 31. When the cross-sectional shape of the convex member 70 is sharp at the upper end as shown in FIGS. 14A and 14E, the height is preferably set so as not to contact the support 31.

The material of the protruding member 70 may be any material having a higher hardness than the resin layer 32 so that the resin layer 32 of the adhesive material 30 can be pressed. The material of the convex member 70 is preferably a material that does not easily release compounds or ions that affect the curability and processability of the resin layer 32. For example, a cured resin or a metal material can be selected. Further, it is preferable that the adhesion between the convex member 70 and the resin layer 32 is smaller than the adhesion between the substrate 20 and the resin layer 32. If the convex member 70 is a metal material, the surface may be subjected to a release treatment and used.
As a method of forming the convex member 70 on the substrate 20, there is also a method shown in FIG. First, as shown in FIG. 15A, for example, a photosensitive resin layer (negative photosensitive resin layer) 71 on the substrate 20 is exposed using a mask 72 to form an exposed region 70L. Then, an area other than the exposure area 70L is developed to make the exposure area a convex member 70 as shown in FIG.

  After the convex member 70 is arranged on the substrate 20 in this manner, the adhesive material 30 is attached on the substrate 20 (FIG. 11B). At this time, the resin layer 32 moves due to the depression of the convex member 70, and the thickness of the resin layer 32 on the upper surface of the convex member 70 becomes thinner than other regions. When the height of the convex member 70 is in the range of 1.0Z to 2.0Z, the upper surface of the convex member 70 may come into contact with the support 31. That is, the resin layer is broken by the convex member 70. Also in this case, the convex member 70 is regarded as a starting point of the breakage of the resin layer 32.

  Next, as shown in FIG. 11C, the support 31 is peeled in the peeling direction PD. Here, since the ring-shaped convex member 70 is used, cohesive failure of the resin layer 32 occurs on the peeling start side from the convex member 70 as a starting point, so that the resin layer 32 becomes thinner at the upper part of the convex member 70 where the resin layer thickness is reduced. Break. Similarly, in the latter half of the peeling, the cohesive failure of the resin layer 32 starts from the convex member 70 and breaks.

  After that, similarly to the first embodiment, the flow path forming member 6 and the discharge port forming member 7 are formed. The convex member 70 can be processed before removing the transferred resin layer 32 before processing it into a desired structure. Further, when the convex member 70 is formed of a resin material, it is easy to cut the convex member 70 when cutting each chip from the substrate (wafer). Further, since the region where the convex member 70 is formed is outside the element formation region, it can be discarded together with the substrate outside the element formation region when dividing chips.

  Also in the present embodiment, when the resin layer is attached to the substrate, the cohesive failure of the resin layer 32 can be induced by the convex member 70. Accordingly, it is possible to suppress the occurrence of burrs in the resin layer outside the substrate region, and to suppress a decrease in product quality due to lack of burrs.

[Fourth embodiment]
The fourth embodiment of the present invention is characterized in that, as a structure serving as a starting point of the fracture of the resin layer, after the step of attaching the adhesive material to the substrate, the resin layer is pushed in from the support side to form a concave portion. .

  First, as shown in FIG. 16A, an adhesive material 30 having a resin layer 32 formed on a support 31 is attached on a substrate 20 having a liquid supply port 3 formed thereon. The resin layer 32 has an outer shape larger than the outer shape of the substrate 20, and is attached so that the resin layer 32 protrudes from an end of the substrate 20. When the liquid supply port 3 is formed after the formation of the nozzle forming member, the liquid supply port 3 is not formed in the substrate 20 at this time.

  Next, as shown in FIG. 16B, the resin layer 32 is pushed in from the support 31 side in a state where the resin layer 32 and the substrate 20 are attached to form a concave portion. At this time, the pressing member 80 is pressed along the outer periphery of the substrate 20 via the support 31 by using a member (referred to as a pressing member) for pressing the support 31 at a predetermined pressure. The pressed resin layer 32 is in a crushed state as shown in FIG. 16 (c), and the resin layer 32 has a concave portion 81 formed therein. The thickness t of the resin layer 32 in the recess 81 is smaller than the thickness of the resin layer 32 in other regions. When the thickness of the resin layer 32 other than the concave portion is Z, the pressure of the pressing member 80 is adjusted to be 0.5Z or less. The resin layer 32 may be broken by the pressing member 80, and in this case, the concave portion 81 can be said to be a starting point of the break of the resin layer.

  Next, as shown in FIG. 16D, the support 31 is peeled off. At this time, in the concave portion 81 in which the thickness of the resin layer 32 is small, rigidity is inferior to other regions, so that cohesive failure occurs preferentially. Therefore, the resin layer 34 extending outside the substrate region is removed while being adhered to the support 31 together with the separation of the support 31. That is, by intentionally providing a region where the resin layer 32 becomes thinner near the end portion of the substrate 20 by the pressing member 80, it is possible to control a portion where the resin layer 32 causes cohesive failure. Through the above steps, the resin layer 32 can be transferred onto the substrate 20 without leaving the resin layer outside the substrate region as shown in FIG.

  Note that FIG. 16 shows a mode in which a ring-shaped member that rotates vertically is pressed against a predetermined portion of the support body 31 as the pressing member 80 and the substrate 20 is rotated to be pushed along the outer peripheral portion of the substrate. I have. The pressing member 80 is not limited to such a ring-shaped member. For example, a member 81 in which a sphere is rotatably held like a tip portion (tip) of a ballpoint pen as shown in FIG. 17A or a sphere as shown in FIG. It can also be pushed in using a bearing-shaped member 82. The tips of these pushing members have an R shape, and can move while pushing on the support. In the ring-shaped convex member 70 used in the third embodiment, a member formed outside the substrate such as a metal material can be used as the pressing member 80. The distal end of the ring-shaped pressing member 80 that comes into contact with the support 31 does not have a sharp structure as shown in FIGS. 14A and 14E, but has the structure shown in FIGS. 14B to 14D and 14F. It is preferable that the tip has a flat surface or an R shape as in (h). In addition, from the viewpoint of promoting the movement of the resin layer 32 toward the outer peripheral side of the substrate, the cross section in the direction of the center of gravity of the substrate as shown in FIGS. Is preferably an asymmetric structure.

  The position where the concave portion 81 is formed can be formed at the same position as the position where the convex member 70 is formed as described in the third embodiment.

  Also in the present embodiment, the cohesive failure of the resin layer 32 can be induced by the pressing member 80. Accordingly, it is possible to suppress the occurrence of burrs in the resin layer outside the substrate region, and to suppress a decrease in product quality due to lack of burrs. Also in the present embodiment, the region to be pressed by the pressing member 80 is formed along the entire outer periphery of the substrate, and is formed at least in the second half region of the peeling step in which the peeling direction of the support is from the inside to the outside of the substrate. Just do it.

  Hereinafter, a method for manufacturing a substrate for a liquid ejection head of the present invention will be specifically described with reference to the drawings.

The manufacturing process according to the first embodiment of the present invention will be described with reference to FIGS.
(Example A1)
First, as shown in FIG. 6A, silicon etching is performed on the back surface of the substrate 20 (a silicon substrate having a diameter of 200 mm) using a photoresist as an etching mask 41, and a non-through hole 3a is formed for each chip in the element formation region. did. Thereafter, as shown in FIG. 6B, silicon etching was performed on the surface of the substrate 20 using a photoresist as an etching mask 42 to form the liquid supply port 3 and the groove 21. At this time, the groove 21 is formed over the entire outer periphery of the substrate 20 as shown in FIG. 4A, and has a depth of 200 μm and a width of 250 μm. Further, the shape of the groove 21 was a comb-like shape shown in FIG. 5B so that cohesive failure easily occurred.

  Next, as shown in FIG. 3B, an adhesive material 30 was prepared in which a resin layer 32 was formed by spin coating on a support 31 made of polyethylene terephthalate (PET) and having a thickness of 100 μm. The resin layer 32 was made of a negative photosensitive resin and had a thickness of 100 μm. After the resin layer 32 was formed on the support 31 by spin coating, the resin layer 32 was processed into a circular shape with a diameter of 210 mm by side rinsing using an organic solvent while the support 31 was rotated. After that, a baking treatment was performed at 100 ° C. for 20 minutes.

  Next, as shown in FIG. 3C, the adhesive material 30 was attached to the substrate 20 having the groove 21 formed on the resin layer 32 side. Since the diameter of the resin layer 32 was 210 mm, the attachment was performed so that the resin layer 32 protruded 5 mm from the end of the substrate 20. Thereafter, as shown in FIG. 3D, when the support 31 is peeled off at a speed of 10 mm / s, a fracture 33 due to cohesive failure occurs in the resin layer 32 on the groove 21 provided on the outer periphery of the substrate 20. did. As shown in FIG. 3E, when the substrate surface was observed after the support was peeled off, no burrs of the resin layer were observed outside the region of the substrate 20.

Next, as shown in FIG. 3F, the transferred resin layer was processed by exposing and developing, thereby forming a flow path forming member 6 as a resin structure. Next, as shown in FIG. 3G, a discharge port forming member 7 having the discharge port 5 was formed in the same manner as the formation of the flow path forming member 6.
In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs of the resin layer 32 and remaining on the substrate was confirmed.

(Example A2)
In Example A1, the groove 21 is formed on the entire circumference, but may be formed in accordance with the peeling direction of the support 31.
First, a non-penetrating port 3a shown in FIG. Thereafter, as shown in FIG. 6B, silicon etching was performed on the surface of the substrate 20 using a photoresist as an etching mask 42 to form the liquid supply port 3 and the groove 21. At this time, as shown in FIG. 6 (c1), the groove 21 is formed in a half region of the substrate 20, which is the latter half with respect to the support peeling direction PD, and has a depth of 200 μm and a width of 250 μm. Further, the shape of the groove 21 was comb-shaped so that cohesive failure easily occurred, and the tip was formed along the peeling direction (FIGS. 6C2 and 6C3). Except for this, it was the same as Example 1.
Even in the liquid ejection head substrate manufactured as described above, no quality deterioration due to the lack of burrs of the resin layer and remaining on the substrate could be confirmed.

Next, an example according to the second embodiment of the present invention will be described.
Example B1 is a method of increasing the surface free energy of the region other than the region serving as the base of the concave portion by the discharge treatment. Embodiments B2 and B3 are methods of increasing the surface free energy of the region other than the region serving as the base of the concave portion by light irradiation. Example B4 is a method of lowering the surface free energy of a region serving as a base of a concave portion by forming a water-repellent film. Embodiments B5 and B6 are characterized in that the recess is formed after the formation of the resin layer. Among them, Example B5 is characterized by forming a concave portion by a solvent treatment, and Example B6 is characterized by forming a concave portion by plastic working.

(Example B1)
As shown in FIG. 8A, a release film 51b made of a silicone resin having a thickness of 200 nm is formed on a base material 51a made of a PET film having a thickness of 100 μm by a slit coating method, thereby forming a support. 51 were produced.
Next, as shown in FIG. 8B, a corona discharge treatment is performed in a state where a protective film (not shown) is adhered only to a region of the release film 51b to be the concave base 51c. By peeling off the film, a concave portion base 51c was formed. The concave portion base 51c was formed in a ring shape having an outer diameter of 98 mm in radius and an inner diameter of 96 mm in radius from the center of the support 51.

  Next, as shown in FIG. 8C, a resin composition 52P was spread on a support 51 fixed to a support fixing frame (not shown) by a spin coating method. Furthermore, by performing side rinse using propylene glycol monomethyl ether acetate (PGMEA) while rotating the support 51, the resin composition 52P was processed into a circular shape having a diameter of 204 mm. The resin composition 52P was prepared from epoxy resin (manufactured by Dainippon Ink, "N-695" (trade name)) as a resin, "CPI-210S" (trade name) manufactured by San-Apro as a photoacid generator, and PGMEA as a solvent. Was used.

  Next, the support 51 on which the resin composition was formed was poured into a hot plate at 100 ° C. for 20 minutes to evaporate the solvent, and the resin 51 was placed on the resin layer 52 and the concave base 51 c as shown in FIG. A recess 52a was formed. The thickness of the resin layer 52 after drying was 5 μm. The thickness of the thinnest portion of the concave portion 52a was 0 μm (the concave portion base 51c was exposed).

  Next, as shown in FIG. 7B, an adhesive material 50 was attached to the substrate 20 on which the liquid supply port 3 was formed by a roll laminator. At this time, the resin layer 32 was attached so that the end portion protruded 1 mm from the end portion of the substrate. The inner end of the concave portion 52a is located 5 mm inside from the end of the substrate 20 and the outer end of the concave portion 52a is located 1 mm inside from the end of the substrate 20, and the concave portion 52a is formed as a closed space on the outer periphery excluding the substrate notch portion. Was. At this time, the resin layer 52 is attached to the substrate 20 while being crushed by the roller via the support body 51, so that the resin flows, and the resin is also supplied to the concave portion 52a from the periphery. Therefore, the film thickness of the thinnest region of the concave portion 52a after attachment was 2 μm.

Next, the adhesive material 50 was cut at a position 1 mm away from the end of the substrate 20.
Next, as shown in FIGS. 7C and 7D, the support 51 was peeled off. At this time, a fracture 53 was formed in the region of the concave portion 52a due to cohesive failure of the resin layer 52. The resin layer 52 outside the substrate from the fractured portion 53 was removed following the support 51. On the other hand, the resin layer 52 on the inner side of the substrate from the broken portion 53 was transferred onto the substrate 20 and remained.

Next, as shown in FIG. 11A, the transferred resin layer 52 was selectively exposed to exposure light of 10,000 J / m ² using a photomask 63 using an i-line stepper. Thereafter, baking was performed at 50 ° C. for 5 minutes to form a latent image 6L serving as a channel wall.

  Next, as shown in FIG. 11B, a pasting material 57 formed in the same manner as the above-mentioned pasting material 50 was pasted on the resin layer 52. The adhesive material 57 is composed of an epoxy resin (epoxy resin “157S70” (trade name) manufactured by Japan Epoxy Resin) as a resin composition, “LW-S1” (trade name) manufactured by San-Apro as a photoacid generator, and PGMEA as a solvent. Formed using the composition. Further, at the time of attaching the attaching material 57, the attachment was performed such that the end of the resin layer 59 protruded from the end of the substrate 20 by 1 mm. The inner end of the recess 59a was located 7 mm inside from the end of the resin layer 52, and the outer end was located 3 mm inside from the resin layer 52. The recess 59a was formed as a closed space. At this time, the thickness of the thinnest region of the concave portion 59a after the attachment was 2 μm.

  Next, as shown in FIG. 11C, the support body 58 was peeled off, and the resin layer 59 was transferred onto the resin layer 52 while remaining. At this time, the resin layer 59 was broken by the cohesive failure at the concave portion 59a, and the outer side of the concave portion 59a of the resin layer 59 was removed following the support 58.

Next, as shown in FIG. 11D, the resin layer 59 was selectively exposed to exposure light of 1000 J / m ² by a photomask 64 using an i-line stepper. Thereafter, baking was performed at 90 ° C. for 5 minutes to form a latent image 7L serving as a discharge port forming member. The latent image 7L included a portion serving as a discharge port as an unexposed area.

Next, as shown in FIG. 11E, unexposed portions of the resin layer 52 and the resin layer 59 were collectively developed using PGMEA. Thereafter, it is put into an oven at 200 ° C. for 60 minutes to cure the latent images 6L and 7L, whereby the flow path forming member 6 serving as the wall of the flow path 8 and the discharge port forming member 7 having the discharge port 5 formed therein are formed. Been formed.
Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing.
When a visual inspection of the liquid discharge head substrate was performed, no foreign matter derived from burrs could be found.

  In this method, a step which needs to be performed by another device different from the resin layer formation is added in order to perform a site-selective treatment on the release film. However, since the process is not added after the formation of the resin layer, the concave portion is formed by suppressing the attachment of foreign substances to the formed resin layer and the deterioration of the quality of the resin layer due to the splash of the solvent, as compared with the method of performing the additional process after the formation of the resin layer. Is an advantage.

(Example B2)
As in Example B1, a support 51 was formed by forming a release film 51b made of a fluorine-based resin having a thickness of 200 nm on a base material 51a made of a PET film having a thickness of 100 μm by slit coating. did. As the fluororesin, a condensate containing a perfluoropolyether group-containing silane compound was used. This hydrolyzable silane compound has a structure containing a carbonyl group between a perfluoropolyether group and a hydrolyzable silyl group.

  Next, in order to form the concave portion base 51c in the same region as in Example B1, by irradiating the release film with UV including a broad wavelength of 270 nm or less while shielding the region to be the concave portion base 51c with an exposure mask. Then, a concave portion base 51c was formed.

Thereafter, the resin layer 52 having the concave portion 52a is formed on the support body 51 by the same method as in Example B1, and the transfer of the resin layer 52, the formation of the latent image 6L, and the use of the adhesive material 57 formed in the same manner as described above are performed. The transfer of the resin layer 59 and the formation of the latent image 7L were performed. Then, the flow path 8 and the discharge port 5 are formed by batch development, the latent images 6L and 7L are cured, and the substrate having the flow path forming member 6 and the discharge port forming member 7 as shown in FIG. Formed.
Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing. When a visual inspection of the liquid discharge head substrate was performed, no foreign matter derived from burrs could be found.

(Example B3)
The support 51 was manufactured by forming a release film 51b made of titanium oxide having a thickness of 500 nm on a substrate 51a made of a PET film having a thickness of 100 μm by a sputtering method.
Next, in order to form the concave portion base 51c in the same region as in Example B1, by irradiating UV including a wavelength of 365 nm while shielding the region to be the concave portion base 51c with an exposure mask, the region other than the concave portion base 51c is irradiated. The water-repellent film was made hydrophilic. After that, the process was advanced from FIG. 2E to FIG. 3A by the same method as in the first embodiment.
Thereafter, the resin layer 52 having the concave portion 52a is formed on the support body 51 by the same method as in Example B1, and the transfer of the resin layer 52, the formation of the latent image 6L, and the use of the adhesive material 57 formed in the same manner as described above are performed. The transfer of the resin layer 59 and the formation of the latent image 7L were performed. Then, the flow path 8 and the discharge port 5 are formed by batch development, the latent images 6L and 7L are cured, and the substrate having the flow path forming member 6 and the discharge port forming member 7 as shown in FIG. Formed.
Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing. When a visual inspection of the liquid discharge head substrate was performed, no foreign matter derived from burrs could be found.

(Example B4)
In the same manner as in Example B1, a support 51 having a water repellent layer 51b provided on a substrate 51a (the substrate 51a and the water repellent layer 51b were omitted) was produced. Thereafter, as shown in FIG. 9A, a perfluoroalkylsilane compound (“Optool DSX” (trade name) manufactured by Daikin Industries, Ltd.) was applied to the region serving as the base of the concave portion by using a dispensing method. Baking was performed at 90 ° C. for 3 minutes to form a water-repellent film 55, thereby forming a base for the concave portion, and thereafter, using the same method as in Example B1, the steps shown in FIGS. Was carried out to produce an adhesive material in which the resin layer 52 having the concave portion 52a was formed.
Thereafter, the resin layer 52 having the concave portion 52a is formed on the support body 51 by the same method as in Example B1, and the transfer of the resin layer 52, the formation of the latent image 6L, and the use of the adhesive material 57 formed in the same manner as described above are performed. The transfer of the resin layer 59 and the formation of the latent image 7L were performed. Then, the flow path 8 and the discharge port 5 are formed by batch development, the latent images 6L and 7L are cured, and the substrate having the flow path forming member 6 and the discharge port forming member 7 as shown in FIG. Formed.
Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing. When a visual inspection of the liquid discharge head substrate was performed, no foreign matter derived from burrs could be found.

(Example B5)
After the resin layer 52 is formed on the support 51, as shown in FIG. 10A, PGMEA is discharged from the dispenser 61 to a region where the concave portion 52a of the resin layer 52 is formed while rotating the support 51, and the resin layer 52 is formed. 52 was dissolved. Next, the concave portion 52a was formed by evaporating the solvent by throwing it again on a hot plate at 80 ° C. for 20 minutes. The film thickness of the thinnest portion of the concave portion 52 was 1 μm.
Thereafter, in the same manner as in Example B1, the resin layer 52 having the concave portion 52a is formed on the support body 51, the transfer of the resin layer 52, the formation of the latent image 6L, and the attaching material 57 formed in the same manner as described above are performed. The used resin layer 59 was transferred and a latent image 7L was formed. Then, the flow path 8 and the discharge port 5 are formed by batch development, the latent images 6L and 7L are cured, and the substrate having the flow path forming member 6 and the discharge port forming member 7 as shown in FIG. Formed.
Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing. When a visual inspection of the liquid discharge head substrate was performed, no foreign matter derived from burrs could be found.

(Example B6)
After forming the resin layer 52 on the support body 51, as shown in FIG. 10B, the pressing member 62 was pressed into the region where the concave portion 52a was formed, thereby forming the concave portion 52a. The film thickness of the thinnest portion of the concave portion 52a was 1 μm.
Thereafter, in the same manner as in Example B1, the resin layer 52 having the concave portion 52a is formed on the support body 51, the transfer of the resin layer 52, the formation of the latent image 6L, and the attaching material 57 formed in the same manner as described above are performed. The used resin layer 59 was transferred and a latent image 7L was formed. Then, the flow path 8 and the discharge port 5 are formed by batch development, and the latent images 6L and 7L are cured, and the substrate having the flow path forming member 6 and the discharge port forming member 7 as shown in FIG. Formed.
Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing. When a visual inspection of the liquid discharge head substrate was performed, no foreign matter derived from burrs could be found.

Next, an example according to the third embodiment of the present invention will be described.
(Example C1)
First, as shown in FIG. 12A, the convex member 70 was disposed on the substrate 20 on which the liquid supply port 3 was formed. As the substrate 20, a silicon wafer having a diameter of 200 mm was used. As shown in FIG. 13, a SUS ring-shaped member having an outer diameter of 190 mm, an inner diameter of 180 mm, and a height of 100 μm was used as the convex member 70.

  Next, as shown in FIG. 12 (b), the adhesive material 30 was arranged such that the resin layer 32 formed on the support 31 faced downward, and was attached to the substrate 20. The adhesive material 30 was prepared such that a resin layer 32 having a thickness of 100 μm was formed on a support made of a PET film having a thickness of 100 μm, and the diameter of the resin layer became 210 mm by side rinsing. At this time, the attachment was performed so that the resin layer 32 protruded from the end of the substrate 20 by 5 mm. When attaching the attachment material 30 to the substrate, the height of the convex member 70 is the same as the thickness of the resin layer 32. For this reason, the resin layer 32 is split or crushed by the member 70 by the convex member 70, and as shown in FIG. Thus, a resin layer 32 on the substrate and a resin layer 34 on the outer peripheral portion were separated. When all the supports were peeled, the resin layer 34 was peeled off while being attached to the support 31, and the resin layer 32 was transferred to the substrate side. The ring-shaped convex member 70 was removed after the support was peeled off.

  Next, as shown in FIG. 12D (the convex member 70 remains in FIG. 12D, but is removed before this step as described above), a photomask is applied to the resin layer 32. Exposure was carried out and processed by development processing to form a flow path forming member 6. Further, as shown in FIG. 12E, similarly to the formation of the flow path forming member 6, a resin layer is pasted on the flow path forming member, and the resin layer is processed to form the discharge port forming member having the discharge port 5. 7 was formed.

  Thereafter, the substrate for a liquid discharge head was formed by cutting into individual chips by dicing. When a visual inspection of the liquid ejection head substrate was performed, almost no burrs-derived foreign matter was found.

(Example C2)
A substrate for a liquid ejection head was manufactured in the same manner as in Example C1, except that members having the cross-sectional shapes shown in FIG. 14 were used as the convex members 70.
In the substrate for a liquid ejection head manufactured as described above, almost no deterioration in quality due to the lack of burrs of the resin layer and remaining on the substrate was confirmed.

Next, an example according to the fourth embodiment will be described.
(Example D1)
An adhesive material was prepared by forming a resin layer 32 having a thickness of 100 μm using a negative photosensitive resin on a support 31 made of a PET film having a thickness of 100 μm. The resin layer 32 was processed into a circular shape having a diameter of 210 mm by side rinsing.
First, as shown in FIG. 16A, the adhesive material 30 was arranged such that the resin layer 32 was directed downward, and was attached to the substrate 20. As the substrate 20, a silicon wafer having a diameter of 200 mm was used. Since the diameter of the resin layer 32 was 210 mm, the attachment was performed so that the resin layer 32 protruded 5 mm from the end of the substrate 20.

Next, as shown in FIGS. 16B and 16C, the resin layer 32 was pushed into the thin film by the pressing member 80 of the vertical ring via the support 31 to form the concave portion 81. The pressing member 80 and the pressing portion are made of a SUS material. The thickness of the resin layer in the pushed-in portion was about 20 μm.
Next, as shown in FIG. 16D, when the support 31 is peeled off, the resin layer 34 on the outer peripheral side of the substrate is removed from the thinned portion of the resin layer 32 while remaining on the support, As shown in FIG. 16 (e), the resin layer 32 was transferred to the outside of the substrate without any flash of the resin layer.
The other configuration is the same as that of the first embodiment, and the description is omitted.

(Example D2)
The transfer of the resin layer was performed in the same manner as in Example D1, except that the ring-shaped convex member used in Example C1 was used as the pressing member.
Also in this case, the resin layer 32 was transferred without any flash of the resin layer outside the substrate.

(Comparative Example 1)
As shown in FIG. 18A, the adhesive material 30 having the resin layer 32 formed on the support 31 was attached to the substrate 20, and then the support 31 was peeled off as shown in FIG. 18B. From the start of peeling to half of the substrate, the member was cohesively broken as shown in FIG. 18B and peeled together with the support. However, as shown in FIG. 18C, in a region where peeling exceeded half of the substrate, a crack due to cohesive failure was directed to the outside of the substrate, and burrs 121 remained at the end of the substrate.

  As shown in FIG. 18 (d), many burrs 122 of the member transferred were confirmed in the transferred member. Further, when the flow path forming member 6 and the discharge port forming member 7 are formed as they are as shown in FIG. 18F and cut into chips, there is a problem as shown in FIG. The liquid ejection head substrate 10 'was formed.

Reference Signs List 10 substrate for liquid discharge head 1 element substrate 2 energy generating element 3 liquid supply port 4 nozzle forming member 5 discharge port 6 flow path forming member 7 discharge port forming member 8 flow path 20 substrate 21 groove 30, 50, 57 sticking material 31, 51, 58 Support 32, 52, 59 Resin layer 51c Base of concave portion 52a Depressed portion 33, 53 Break portion 34, 54 Outer substrate resin layer 70 Convex member 80 Press member

Claims (29)

A method of manufacturing a substrate having a resin structure,
A step of preparing an adhesive material having a resin layer formed on a support,
Affixing the attaching material to the substrate on the resin layer side so that the resin layer protrudes from an outer edge of the substrate,
Peeling the support, transferring the resin layer on the substrate,
Processing the transferred resin layer into a resin structure;
Including
Along the outer periphery of the substrate, when the support is peeled off, the starting point of the breakage of the resin layer is in the direction of the center of gravity of the substrate from the end of the flat portion of the substrate, and the transfer layer is formed of the transferred resin layer. A method for manufacturing a substrate, comprising: forming a structure on the resin layer-attached surface of the substrate or on the resin layer such that the structure is formed outside the substrate in a region where the resin structure is formed.   The method according to claim 1, wherein the substrate has a wafer shape.   The structure, along the outer periphery of the substrate, leaving an adhesive region where the resin layer adheres from the end of the flat portion of the substrate toward the substrate center of gravity, and the inside of the adhesive region in the substrate center of gravity direction. 3. The method of manufacturing a substrate according to claim 1, wherein the resin layer is a groove formed on a surface of the substrate, and the resin layer is broken near a side wall of the groove on the side of the center of gravity of the substrate.   The method according to claim 3, wherein the width of the groove is formed to be 50 to 500 μm.   The method for manufacturing a substrate according to claim 3, wherein the groove is formed such that a width of the bonding region in a direction of the center of gravity of the substrate is 500 to 1500 μm.   The method of manufacturing a substrate according to claim 3, wherein the groove is formed in an entire outer periphery of the substrate.   The method for manufacturing a substrate according to any one of claims 3 to 6, wherein the groove has irregularities at least on a side wall on the side of the center of gravity of the substrate.   The method of manufacturing a substrate according to claim 1, wherein the structure is a concave portion in which a part of the resin layer is thinned and the substrate side is open, and the resin layer is broken in the concave portion.   The concave portion is formed to have a thickness of 0.5Z or less when the thickness of the resin layer other than the concave portion is Z when the region where the resin layer is thinnest is Z after the adhesive material is attached to the substrate. A method for manufacturing a substrate according to claim 8.   The said recessed part is formed in the area | region which can adhere a resin layer except the adhesion area | region which the said resin layer adheres toward the board | substrate center of gravity direction from the edge part of the flat part of the said board | substrate. Substrate manufacturing method.   The step of preparing the adhesive material is performed by applying a material of the resin layer on the support on which a release film is formed, and the concave portion is formed before the material of the resin layer is applied. 11. The method according to claim 8, wherein a concave portion base is formed in a region where the resin layer is formed, and the resin layer material is formed by flowing the resin layer material on the concave portion base when drying the resin layer material. 12. Substrate manufacturing method.   The support has a release film on a substrate, and the concave portion base has a surface free energy of the release film which is relatively lower than a surface free energy of the release film in the other region. The method for manufacturing a substrate according to claim 11, wherein the substrate is formed by the following process.   13. The method of manufacturing a substrate according to claim 12, wherein the treatment of the release film is formed by a reaction of adding a hydrophilic functional group to a surface of the release film other than a region serving as a base of the concave portion.   13. The method of manufacturing a substrate according to claim 12, wherein the treatment of the release film is formed by a reaction of removing a hydrophobic group from a surface of the release film other than a region serving as a base of the concave portion.   The method of manufacturing a substrate according to claim 12, wherein the treatment of the release film is formed by a reaction of adding a hydrophobic group to a surface of the release film in a region where the concave portion is formed.   The method of manufacturing a substrate according to claim 11, wherein the concave base is a water-repellent film formed on the support.   In the step of preparing the adhesive material, after forming the resin layer on the support at a predetermined thickness, the concave portion is formed by treating the resin layer serving as the concave portion. The method for manufacturing a substrate according to any one of the above items.   The treatment of the resin layer serving as the concave portion is a treatment of dissolving the resin layer with a solvent capable of dissolving the resin layer, and then drying the resin layer to move a solid content in the resin layer. Substrate manufacturing method. The structure is a convex member provided on the resin layer attachment surface of the substrate before the step of attaching the attachment material to the substrate,
3. The method according to claim 1, wherein in the step of attaching the attaching material, the resin layer is pressed toward the support by the convex member. 4.   20. The method of manufacturing a substrate according to claim 19, wherein a distance from an end of the substrate to an outer end of the convex member is within 20 mm.   21. The method of manufacturing a substrate according to claim 19, wherein the convex member has an annular structure along the entire outer periphery of the substrate.   22. The substrate according to claim 19, wherein a cross section of the convex member in a direction of a center of gravity of the substrate has a width at a lower end portion in contact with the substrate larger than a width at an upper end portion. Method.   23. The method of manufacturing a substrate according to claim 22, wherein the inclination angle of the side wall of the convex member on the outside with respect to the center of gravity of the substrate is larger than the inclination angle of the side wall on the inside.   24. The substrate according to claim 19, wherein the height of the convex member is between 0.5Z and 2.0Z, where Z is the thickness of the resin layer of the adhesive material. Production method.   25. The method of manufacturing a substrate according to claim 19, further comprising, after the step of peeling the support and transferring the resin layer onto the substrate, removing the convex member. Method.   The structure is a concave portion formed by pushing the resin layer from the support side after the step of attaching the adhesive material to the substrate.When the support is peeled, the resin layer is formed in the concave portion. The method for manufacturing a substrate according to claim 1, wherein the substrate is broken.   27. The method of manufacturing a substrate according to claim 26, wherein the recess is formed using a member that presses the support at a predetermined pressure.   28. The method of manufacturing a substrate according to claim 26, wherein the concave portion is formed along the entire outer periphery of the substrate.   The method of manufacturing a substrate according to any one of claims 26 to 28, wherein the thickness of the resin layer in the recess is 0.5Z or less, where Z is the thickness of the resin layer other than the recess.