JP2020049755A - Substrate and liquid ejection head substrate manufacturing method - Google Patents

Abstract

To provide a method of manufacturing a substrate in which burrs are suppressed from being omitted, and a method of manufacturing a substrate for a liquid ejection head to which the method of manufacturing the substrate is applied.SOLUTION: There is provided a method of manufacturing a substrate comprising: a step of preparing a sticking member 30 in which a member 32 is formed on a support 31; a step of sticking a member 32 side of the sticking member 30 to a substrate 20 so that the member 32 protrudes from the outer edge of the substrate 20; and a step of peeling the support 31 from the sticking member 30 attached to the substrate 20, which includes, before the support 31 is peeled off, a step of providing a separation boundary 33 near the end of the substrate 20 of the member 32 so that the region of the member 32 protruding from the substrate 20 is separated from the region in contact with the substrate 20, and which is characterized by that the peeling of the support 31 is performed so that the support 31 to be peeled finally passes through the separation boundary.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a substrate and a method for manufacturing a substrate for a liquid ejection head.

  In the recent semiconductor industry, there is a demand for a technology for manufacturing devices with higher dimensional accuracy than ever before. For example, in the ink jet industry, uniformity of ejected ink droplets is required in order to improve the image quality, and for that purpose, a technology for uniformly forming ink flow paths with high dimensional accuracy is required. .

  As one of the means, Patent Literature 1 describes a method of forming a nozzle forming member on a substrate by attaching a resin layer made of a photosensitive resin to the substrate. In this method, the resin layer is supported by the support until the resin layer is attached to the substrate, and after the resin layer is attached to the substrate, the support is separated. Thereafter, a flow path pattern is formed on the nozzle forming member on the substrate by photolithography or the like.

  A general factor that reduces the dimensional accuracy of the ink flow path is a variation in the film thickness due to the method of forming the nozzle forming member. Unlike the conventional spin coating and slit coating, the sticking method disclosed in Patent Document 1 does not experience a decrease in film thickness uniformity due to spin airflow or solvent drying, so that variations in film thickness can be suppressed.

JP 2006-137065 A

  It is preferable that the member such as the resin layer on the support is usually processed into the same shape as the substrate (wafer) to be attached. However, it is necessary to peel off the support after transferring the member on the support to the substrate, and it is preferable to provide a gripper for gripping the support. Therefore, members on the support are processed to be larger than the shape (effective area) of the substrate. In that case, burrs based on the member may be formed outside the wafer region, and burrs missing during the process may lower the quality of the product.

  An object of the present invention is to provide a method of manufacturing a substrate in which such burrs are prevented from being lost during a process, and a method of manufacturing a substrate for a liquid discharge head to which the method of manufacturing a substrate is applied.

  The present invention for solving the above-mentioned problem is a step of preparing an attaching member in which a member is formed on a support, and the member side of the attaching member is attached to the substrate so that the member protrudes from an outer edge of the substrate. A step of sticking, and a step of peeling the support from the sticking member stuck to the substrate, and before peeling the support, an area where the member protrudes from the substrate is in contact with the substrate. Providing a separation boundary near the end of the substrate of the member, and separating the support so that the support to be separated passes through the separation boundary last. It is characterized by performing.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the burr by the member after a support body peeling process can be suppressed.

1A and 1B are a partially cutaway perspective view and a schematic cross-sectional view schematically illustrating a substrate for a liquid ejection head according to an embodiment of the present invention. It is a perspective view explaining the outline of a wafer-like substrate. FIG. 5 is a process cross-sectional view illustrating the method for manufacturing the substrate and the liquid ejection head substrate according to the first embodiment. 5A and 5B are a plan view and a cross-sectional view illustrating a method of forming a separation boundary in the method for manufacturing a substrate according to the first embodiment. FIG. 4 is a schematic cross-sectional view illustrating another example of a method of forming a separation boundary in the method of manufacturing a substrate according to the first embodiment. FIG. 4 is a process cross-sectional view illustrating a method for forming a flow path forming member and a discharge port forming member in the method for manufacturing a liquid discharge head substrate according to the first embodiment. It is a process sectional view explaining a substrate and a manufacturing method of a substrate for liquid discharge heads concerning a 2nd embodiment. It is a process sectional view explaining the modification of the manufacturing method of the substrate concerning a 2nd embodiment. It is a process sectional view explaining another modification of the manufacturing method of the substrate concerning a 2nd embodiment. It is a process sectional view explaining the manufacturing method of the substrate concerning a 3rd embodiment. It is a process sectional view explaining the modification of the manufacturing method of the substrate concerning a 3rd embodiment. It is a process sectional view explaining a manufacturing method of a substrate and a substrate for liquid discharge heads concerning a conventional technology.

  The method for manufacturing a substrate according to the present invention is applicable not only to a method for manufacturing a substrate for a liquid discharge head, but also to a method for manufacturing a micro machine such as an acceleration sensor. The substrate is preferably a wafer-shaped substrate, but the present invention can be applied to substrates of various shapes in which burrs are a problem when transferring a member by attaching an attaching member.

  Hereinafter, a method for manufacturing a substrate of the present invention will be described with reference to the drawings, taking an embodiment of a method for manufacturing a substrate for a liquid discharge head as an example.

  1A is a partially cutaway perspective view of a liquid ejection head substrate 10 in the form of a chip cut out from a wafer according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. ).

  An energy generating element 2 for foaming ink using a semiconductor manufacturing technique on a silicon substrate and a driving circuit (not shown) for driving the energy generating element 2 are formed on a base 1. Further, a liquid supply port 3 communicating with both surfaces of the base 1 is formed by silicon etching. Further, a discharge port 5 for discharging the ink supplied from the back side of the substrate by the nozzle forming member 4 is formed on the energy generating element 2. By driving the energy generating element 2 corresponding to each discharge port to foam the ink, the pressure can be used to discharge the ink to perform printing.

  As shown in FIG. 1B, the nozzle forming member 4 includes a flow path forming member 6 forming a wall of the liquid flow path 8 and a discharge port forming member 7 forming the discharge port 5.

  Usually, as shown in FIG. 2, a plurality of such liquid-jet head substrates 10 in the form of chips are simultaneously formed on a wafer-like substrate 20 constituting the base body (1), and are cut into chip forms after completion. .

[First Embodiment]
Next, a method for manufacturing the substrate for a liquid ejection head according to the first embodiment of the present invention will be described. FIGS. 3 (a) to 3 (h) showing a cross section taken along line AA 'shown in FIG. 2 show a process of manufacturing a substrate for a liquid ejection head in a wafer state before being cut into a chip form. The main configuration of the liquid discharge head substrate is a simplified configuration corresponding to the cross section of FIG. 1B.

  First, as shown in FIG. 3A, a wafer-like substrate 20 having an energy generating element for generating energy used for discharging a liquid is prepared. On the surface of the substrate 20, a surface membrane layer composed of wiring, an interlayer insulating film and the like is formed (not shown).

  A back surface etching mask is formed on the back surface of the substrate 20 using a photoresist or the like, and the liquid supply port 3 is formed by performing etching. The structure shown in FIG. 3A is completed by the steps up to here. The step of forming the liquid supply port 3 may be performed after the formation of a nozzle forming member described later.

  As shown in FIG. 3B, a sticking member 30 in which a member 32 is formed on a support 31 is prepared separately from the substrate 20. Examples of the support 31 include a resin film such as polyethylene terephthalate, polyimide, or polyamide. The thickness of the support 31 is preferably in the range of 10 μm to 200 μm, and is preferably 75 μm or more in order to prevent the resist from dropping on the liquid supply port 3. As the member 32, a member whose characteristics change such as a change in rigidity when given specific energy is used is used. For example, the member 32 may be an inorganic film, a resin film, a metal thin film, or the like. The member 32 is preferably a resin film. Hereinafter, an example in which a resin film is used as the member 32 will be described. As a method of forming the member 32 with a resin film, a spin coating method or a slit coating method may be used. The resin film is, for example, a photosensitive resin, a photocurable resin, a thermosetting resin, or the like. The thickness of the member 32 defines the height of the liquid channel, and is preferably, for example, 0.5 μm to 100 μm. The outer shape of the member 32 is larger than the outer shape of the substrate 20. The support 31 may have an outer shape equal to or larger than the outer shape of the member 32. After the attaching member 30 having the member formed on the support is formed into a predetermined shape, the end of the member is partially cut from the end of the support. Can be retracted. Further, as the member and the support, a concentric member and a support can be used if the substrate has a similar shape to the substrate, for example, if the substrate is a circular wafer. However, the member and the support need not be similar in shape to the substrate, and can be formed in various shapes without impairing the effects of the present invention.

  Next, as shown in FIG. 3C, the attaching member 30 is attached to the front surface of the substrate 20 on which the liquid supply port 3 is formed from the member 32 side. That is, in FIG. 3C, the member side of the attaching member is attached to the front surface of the substrate 20 such that the support side of the attaching member faces upward and the member side faces downward. At this time, the attachment is performed so that the member 32 protrudes from the outer edge of the substrate 20, that is, the outer edge (end) of the substrate. Generally, a wafer-shaped substrate, particularly a silicon substrate, has a bevel portion whose outer peripheral edge is chamfered to suppress cracking and chipping during the process, and extends from the edge of the substrate flat portion to the outer edge of the substrate. It has a shape with a changed thickness. The length of the bevel portion is standardized to some extent, and is generally around 0.5 mm. At the bevel portion, there is almost no attachment of the member, and there is a possibility that a member outside the end of the flat portion of the substrate remains as a burr. The length of the member protruding from the end of the substrate is not particularly limited, but if it is too long, the waste of the member increases, and therefore, the length is preferably 15 mm or less, more preferably 5 mm or less. When the liquid supply port 3 is formed after the formation of the nozzle member, the liquid supply port 3 is not formed in the substrate 20 at this time.

  Next, as shown in FIG. 3D, the support body 31 was partially pulled up from one end of the substrate 20 toward the center of the substrate 20, so that the member protruding from the substrate 20 was adhered to the substrate. A separation boundary 33 is formed at the boundary with the member by cohesive failure.

As shown in FIG. 4A, the distance of pulling up the support for forming the separation boundary 33 is a distance up to half (１ ／) the diameter of the substrate 20 with respect to the pulling direction 41 of the support 31. 42. At this time, the member 34 protruding from the substrate 20 may be separated from the substrate 20 together with the support 31. When the lifting distance 42 exceeds half of the diameter of the substrate 20 with respect to the direction 41, the force applied to the member is in a direction from the inside of the substrate 20 to the outside, the separation boundary due to cohesive failure is outside the substrate 20, and the member It will remain as burr. This means that if the support is peeled off from the direction 41 without forming a separation boundary, the member will remain as burrs from a region exceeding a distance of half the diameter of the substrate. Further, as shown in FIG. 4B, by pulling up the support 31 from a plurality of directions with respect to the substrate 20, the distance 42 is reduced. In FIG. 4B, the support 31 is divided into four parts to form a separation boundary part 33 in three directions of 41A, 41B and 41C. The separation boundary 33 due to cohesive failure may be formed around the entire edge of the substrate 20 by partially pulling up in the direction 43 as in the other directions. 4A, the separation boundary 33 is formed in a half area of the entire circumference of the substrate 20 as in FIG. 4A. The peeling can be performed from a direction intermediate between the direction 41C and the direction 43 in (b). In this manner, the support is formed in a region that is equal to or more than one-half of the entire circumference of the substrate, and the distance at which the support is pulled up when forming the separation boundary portion is equal to or less than half the diameter of the substrate.
The lifting of the support and the peeling of the support are preferably performed mechanically using a jig that grips one end of the support, and the lifting speed, the lifting distance, and the peeling speed can be appropriately set.

  In addition, as a method of forming the separation boundary portion 33, in addition to the lifting operation of the support body shown in FIG. 4, as shown in FIG. It can be formed by raising and lowering a stage 52 that supports the substrate 20. In this case, the separation boundary 33 can be formed around the entire edge of the substrate 20. These ascent and descent may be performed either once or ascending or descending, but it is preferable to perform ascending and descending once or more each. Alternatively, the separation boundary portion 33 can be formed by raising and lowering the end of the support in a state where the position of the substrate is fixed (without raising and lowering the stage). The elevating distance is set within a range where the support is not separated from the member on the substrate. As the stage 52 for supporting the substrate, a known wafer stage can be used, and a mechanism for sucking and holding the wafer on the stage by a vacuum chuck or the like can be provided. Further, it is not necessary for the gripper 51 to grip the entire periphery of the substrate. For example, as shown in FIG. 4 (b), the stage may be moved up and down by gripping the end of the support in four directions that divide the substrate into four parts, and the stage may be moved up and down by changing the gripping position. If so, it is also possible to hold at least one end and move up and down, change the holding position, and form a separation boundary around the entire periphery. Such a gripping tool can also be used when peeling the support.

  When the member is a resin material, it is preferable that the substrate temperature be equal to or lower than the softening point temperature of the member 32 so that the member having formed the separation boundary portion due to such cohesive failure does not rejoin.

  Next, as shown in FIG. 3E, the support 31 is peeled off from the attaching member 30 attached to the substrate 20. At this time, as shown in FIGS. 4A and 4B, the support is pulled up in the direction 43 from the side where the separation boundary 33 is not formed. When the separation boundary 33 due to cohesive failure is formed all around the edge of the substrate 20, the support 31 can be peeled from any direction.

  By forming the separation boundary portion 33 in this way, as shown in FIG. 3F, it is possible to make a state in which no burr due to the member 32 remains at the end of the substrate 20.

  Next, the nozzle forming member 4 is formed using the member 32 formed on the substrate 20 in the above steps.

  First, as shown in FIG. 3G, the member 32 formed on the substrate 20 is processed into a desired shape, and the flow path forming member 6 is formed. The processing method is performed by exposing and developing when the member 32 is a photosensitive resin. When the member 32 is a thermosetting resin or a photocurable resin, the member 32 is etched using a resist mask or the like and processed into a desired shape.

  Next, as shown in FIG. 3 (h), the member serving as the discharge port forming member is transferred onto the substrate on which the flow path forming member 6 has been formed in the same manner as in FIGS. 3 (b) to 3 (f). After peeling, it is processed into a desired shape, and the discharge port 5 is formed. The processing method is performed by exposing and developing when the member 32 is a photosensitive resin, similarly to the formation of the flow path forming member 6.

  When the members forming the flow path forming member 6 and the discharge port forming member 7 are both photosensitive resins, development is not performed during exposure for the flow path forming member, and the discharge port 5 and the flow path are formed after the nozzle plate is formed. The parts may be developed at once. For example, as shown in FIG. 6, when a negative photosensitive resin (first resin layer 63) is used as the member 32, first, a mask 61 having a flow path wall pattern is used to expose the photosensitive resin 62 to exposure light 62. The flow path wall of the first resin layer 63 is exposed. As a result, a region corresponding to the flow path wall is formed as a latent image as the exposure unit 64. Next, as shown in FIG. 6B, a negative photosensitive resin (second resin layer 66) formed on a support 65 is attached on the first resin layer 63. At this time, the formulation of the photoinitiator (photoacid generator) to be blended in the second resin layer 66 is changed so that the sensitivity is higher than that of the first resin layer. Next, as shown in FIG. 6C, similarly to the first resin layer 63, after transferring the second resin layer 66, as shown in FIG. Exposure is performed using exposure light 68. The exposure light 68 performs exposure with lower energy (lower exposure amount) than the exposure light 62 used in FIG. Thereby, the unexposed portion of the first resin layer 63 is prevented from being exposed. Since the photosensitive resin of the second resin layer 66 has higher sensitivity than the photosensitive resin of the first resin layer 63, exposure can be performed with a small exposure amount. Thereafter, the structure shown in FIG. 3H is obtained by collectively developing.

  When the discharge port forming member 7 is a thermosetting resin or a photo-curing resin, etching is performed using a resist mask or the like to process into a desired shape. Note that, as described above, the liquid supply port 3 may be formed after this step. Thereafter, the substrate 20 is diced into chips to manufacture the liquid discharge head substrate 10 shown in FIG.

  According to the manufacturing method of the present embodiment, it is possible to suppress the burr of the member remaining outside the substrate region from being lost during the process.

[Second embodiment]
In the above embodiment, an example in which the separation boundary is formed by cohesive failure due to physical deformation of the support has been described. In the present embodiment, a method of forming a separation boundary by another method will be described with reference to FIG.

  First, as in FIGS. 3A to 3C, an attaching member in which the member 32 is formed on the support 31 is attached on the substrate 20. FIG. 7A shows a state of one end of the substrate of FIG. 3C. As the member 32, a photosensitive resin, a thermosetting resin, or a photocurable resin is used.

  Next, as shown in FIG. 7B, the first support member 31 is attached to the member 32 with the support 32 adhered to the member 32 at the boundary virtually provided near the end of the substrate. An energy 71 and a second energy 72 are provided. The first energy 71 and the second energy 72 differ in the degree of the effect of changing their properties, such as the rigidity of the member 32. The change in rigidity referred to here may be either when the rigidity increases or when the rigidity decreases. One of the first energy 71 and the second energy 72 given to the member 32 has zero energy, that is, the case where energy is not applied. As a method of applying energy to the member 32, for example, light or heat can be used. By this processing, a difference in rigidity is generated between the region 73 to which the first energy 71 is applied and the region 74 to which the second energy 72 is applied to the member 32, and the boundary between the region 73 and the separation boundary 75. Become.

  The separation boundary portion 75 may be formed in at least one half of the outer periphery of the substrate as in the first embodiment, or may be formed over the entire periphery.

  The separation boundary 75 is preferably within 30 mm from the end of the flat portion of the substrate 20 in the direction of the center of gravity of the substrate. The separation boundary may be formed outside the edge of the flat portion of the substrate 20 and further outside the edge of the substrate 20, but the separation boundary portion is formed inside the edge of the substrate, particularly the edge of the flat portion of the substrate 20. It is preferable to form it inside. More preferably, the distance from the end of the flat portion of the substrate 20 to the center of gravity of the substrate is within 20 mm.

  Note that, depending on the amount of the member protruding from the end of the substrate and the length of the bevel portion, the separation boundary is located more than 5 mm outside the end of the flat portion of the substrate 20 (more than -5 mm in the direction of the center of gravity of the substrate). In such a case, many members remain as burrs outside the substrate region. If the separation boundary is formed inside the end of the flat portion of the substrate 20 (0 mm or more in the direction of the center of gravity of the substrate), the occurrence of burrs extending from the substrate can be further suppressed.

  On the other hand, when the separation boundary portion is located within 30 mm from the edge of the flat portion of the substrate 20 in the direction of the center of gravity of the substrate, the contact area between the region 74 to which the second energy 72 is applied and the substrate surface increases. For this reason, it is difficult to determine the occurrence of cohesive failure when the support is peeled off at a specific location, and many burrs remain outside the substrate region. If the separation boundary is formed in a range from the end of the flat portion of the substrate 20 to 20 mm in the direction of the center of gravity of the substrate, cohesive failure when peeling off the support is formed in this range, and burrs are generated. Is almost nonexistent, and the lack of burrs can be suppressed.

  Next, as shown in FIG. 7C, the support 31 is peeled off. At this time, cohesive failure occurs preferentially at the separation boundary 75 where the rigidity changes sharply. Therefore, the region 74 is removed while being attached to the support 31 together with the separation of the support 31. When peeling the support, similarly to the first embodiment, the support is peeled by adjusting the direction so as to pass through the separation boundary part 75 last. When the separation boundary is formed on the entire circumference, the separation may be performed from any direction.

  Through the above steps, the member 32 (region 73) can be disposed on the substrate 20 with almost no member remaining outside the substrate region.

  When the member 32 is made of a photosensitive resin, irradiation with light changes the solubility in a specific solvent (developer). Therefore, by adopting the following manufacturing method, members outside the substrate region can be removed before the support 31 is peeled off, and the generation of burrs can be suppressed more effectively.

When the member 32 is a positive photosensitive resin, the manufacturing method is as follows.
First, after the member 32 is attached to the substrate 20, as shown in FIG. 8A, a region other than the substrate end region is masked with a light-shielding mask 81 from the surface of the support 31 to form a substrate end region. The light 82 is applied only to the members of the above. At this time, the boundary of the masking region is preferably such that the distance D in the direction of the center of gravity of the substrate 20 is 0 mm to 20 mm starting from the end 20 a of the flat portion of the substrate 20. By this step, the region 83 irradiated with the light becomes soluble in the developing solution. Thereafter, as shown in FIG. 8B, the region 83 is brought into contact with a developing solution (not shown), and the region 83 is dissolved and removed. At this time, since the member 32 not irradiated with light is not exposed, it does not dissolve even when the developer reaches. Thereafter, the support 31 is peeled off from the member 32 as shown in FIG. In this case as well, a separation boundary may be formed in at least one half of the outer periphery of the substrate and removed, and the support may be peeled off such that the support 31 passes through the separation boundary last. It is more preferable to remove the members around the entire circumference, because the remaining members at the beginning of the separation of the support can be suppressed.

When the member 32 is a negative photosensitive resin, the manufacturing method is as follows.
First, after the member 32 is attached to the substrate 20, as shown in FIG. 9A, a region other than the region serving as the separation boundary 95 is masked with a light-shielding mask 91 from the surface of the support 31, and separated. The light 92 is emitted only to the member that becomes the boundary. It is preferable that a region to be irradiated with light has a distance D in the direction of the center of gravity of the substrate 20 from 0 mm to 20 mm and a width W of 100 μm or more, starting from the end 20 a of the flat portion of the substrate 20. By this step, the region irradiated with the light becomes the separation boundary 95 insoluble in the developer. The unexposed member 32 is divided into a first region 93 inside the separation boundary 95 and a second region 94 outside the separation boundary 95. Thereafter, as shown in FIG. 9B, the second region 94 is brought into contact with a developing solution (not shown) to be dissolved and removed. At this time, the separation boundary 95 does not dissolve even when the developer reaches. Then, the support 31 is peeled off as shown in FIG.

  Further, the step of applying energy to the member 32 can be performed before the member is attached to the substrate. When energy is applied after the member is attached to the substrate, stray light due to multiple reflection when energy is light, and heat transfer when energy is heat, the separation boundary formed by giving large and small energy becomes unclear. There are concerns. On the other hand, if energy is applied before the member is attached to the substrate, the member tends to have a rigidity contrast, so that cohesive failure of the member at the time of peeling the support is likely to occur, and the generation of burrs is more effectively performed. Can be suppressed.

  Thereafter, the flow path forming member 6 is formed as shown in FIG. 7D by a normal patterning method suitable for the member used. The processing method is performed by exposing and developing when the member is a photosensitive resin. When the member 32 is a thermosetting resin or a photocurable resin, the member 32 is etched using a resist mask or the like and processed into a desired shape. When a negative photosensitive resin is used, the separation boundary part 95 may be a part of the flow path forming member 6, or may be formed outside a dicing area when dicing each chip, and the dicing is performed by dicing. It may be removed.

  Further, by forming the ejection port forming member 7, a liquid ejection head substrate having the ejection port 5 and the flow path 8 can be obtained as shown in FIG. The discharge port forming member 7 can be formed similarly to the flow path forming member 6.

  When the members forming the flow path forming member 6 and the discharge port forming member 7 are both photosensitive resin, the discharge port 5 and the flow path 8 are connected as shown in FIG. 6 described as the first embodiment. It can be developed all at once.

  Through the above steps, the substrate for a liquid ejection head of the present embodiment is manufactured. According to the manufacturing method of the present embodiment, it is possible to suppress the members remaining outside the substrate region from being lost as burrs during the process.

[Third embodiment]
In the third embodiment, a modification of the second embodiment will be described. In the second embodiment, energy is applied from the support side. In the third embodiment, energy is applied from the substrate side.

  First, after the member 32 is attached to the substrate 20, as shown in FIG. 10A, the energy 101 protrudes from the back surface of the substrate 20 using the substrate 20 as a mask before the support 31 is separated. Irradiate the second region 103 of the member. In the second embodiment, it is necessary to use a mask for shielding energy. In this case, since it is necessary to adjust the positional relationship between the mask and the substrate, a process of forming an alignment mark and performing alignment based on the mark must be performed. However, when the substrate is used as a mask from the back side of the substrate in the present embodiment, alignment is not required, and energy can be selectively irradiated by self-alignment.

  This irradiation is performed only on the outer peripheral portion of the substrate by rotating the substrate, so that the energy is not irradiated to the first region 102 of the member 32 on the substrate through the liquid supply port 3. Due to this energy irradiation, the hardness of the second region 103 changes, and a separation boundary portion 104 is formed at the interface between the first region 102 and the second region 103. The change in hardness referred to here may be either a case where the hardness increases or a case where the hardness decreases, and may be a state in which cohesive failure occurs by causing a difference in hardness in the member.

  As a method of applying energy to the member, for example, light or heat can be used. In the case of using light, it is preferable to use a Si substrate having a high light-shielding property or a metal substrate such as AL as a substrate material. When heat is used, it is preferable to use a polyethylene foam or the like having excellent heat insulating properties.

  Next, as shown in FIG. 10B, the support 31 is peeled off. At this time, cohesive failure occurs preferentially at the separation boundary portion 104 where the rigidity changes sharply. Therefore, the second region 103 is removed while being attached to the support 31 together with the separation of the support 31. Through the above steps, the member can be formed on the substrate without leaving the member outside the substrate region.

  When the member 32 is a positive photosensitive resin, the manufacturing method is as follows. First, after attaching the member 32 to the substrate 20, as shown in FIG. 11A, light 111 is applied to the member in the substrate end region from the back surface of the substrate 20. By this step, the second region 113 irradiated with light becomes soluble in the developing solution. Thereafter, as shown in FIG. 11B, the second region 113 is brought into contact with a developing solution (not shown) to be dissolved and removed. At this time, the member 32 (first region 112) to which light has not been irradiated is not exposed to light, and therefore does not dissolve even when the developer reaches. Thereafter, the support 31 is peeled off from the member 32 as shown in FIG. By irradiating the light 111 while rotating the substrate, it is possible to suppress irradiation of the light to the first region 112 through the liquid supply port 3.

  After that, similarly to the above-described embodiment, the formation of the flow path forming member 6 and the formation of the discharge port forming member 7 are performed, and the liquid discharge head substrate according to the present embodiment is completed. According to the manufacturing method of the present embodiment, it is possible to suppress the members remaining outside the substrate region from being lost as burrs during the process.

  In the above, a method of manufacturing a liquid ejection head to which the method of manufacturing a substrate of the present invention is applied has been described as a method of forming the flow path forming member and the discharge port forming member, but the present invention is not limited to this. For example, the substrate manufacturing method of the present invention can also be applied to a case where a structure having a predetermined thickness, for example, a lid member for the liquid supply port 3 is formed on the back side of the base 1 shown in FIG.

  Hereinafter, a method for manufacturing a substrate for a liquid ejection head of the present invention will be specifically described with reference to examples.

(Example 1)
A method for manufacturing a substrate for a liquid ejection head based on the first embodiment of the present invention will be described with reference to FIG.

  First, as shown in FIG. 3A, a membrane layer (not shown) including an energy generating element and a liquid supply port 3 penetrating the substrate 20 were formed on a silicon wafer having a diameter of 200 mm as a substrate 20 by a known method. .

  Next, as shown in FIG. 3B, a polyethylene terephthalate (PET) film having a thickness of 100 μm was prepared as the support 31, and a member 32 was formed on the support by spin coating. As the member 32, a photosensitive resin, a photo-curable resin, and a thermosetting resin were used. The thickness of all the members 32 was 20 μm. After the member 32 was formed on the support 31 by spin coating, the member 32 was processed into a circular shape having a diameter of 210 mm by performing side rinsing using an organic solvent while rotating the support 31. After that, a baking treatment was performed at 100 ° C. for 20 minutes. Thus, the attaching member 30 was prepared.

  Next, as shown in FIG. 3C, the member 32 formed on the support 31 was arranged so as to face downward, and the sticking member 30 was stuck to the substrate 20 on which the liquid supply port 3 was formed. At this time, the attachment was performed so that the member 32 protruded from the end of the substrate 20 by 5 mm.

  Next, as shown in FIG. 3D, the support 31 was partially lifted to form a separation boundary 33 at the end of the substrate 20 of the member 32. The substrate 20 was cooled to room temperature (23 ° C.) lower than the softening point temperature of the member 32. At this time, as shown in FIG. 4A, the support 31 was pulled up in the direction 41, and the distance 42 was set to 95 to 100 mm.

  Next, as shown in FIG. 3E, the support 31 was peeled off from the attaching member 30. At this time, peeling was performed from the direction 43 as shown in FIG. In a region where the separation boundary portion 33 is not formed, the cohesive failure of the member 32 occurs in the process of partially lifting up the support body 31 as in FIG. 3D, and the member 34 protruding from the edge of the substrate 20. Was separated while almost adhered to the support 31. After the peeling exceeded the central portion of the substrate, the member outside the separation boundary portion 33 was separated while being attached to the support 31. As shown in FIG. 3F, the transfer of the member was completed in a state where the member did not protrude at the substrate end by peeling the support 31.

  Next, as shown in FIG. 3G, the member 32 was processed to form the flow path forming member 6. In the case where the member 32 is a photosensitive resin, processing was performed by exposing to light using a photomask and developing. When the member 32 is made of a photocurable resin or a thermosetting resin, a photoresist is applied on the member 32, and then exposed and developed to form a resist pattern, and the member 32 is dry-etched so that the member 32 is formed as a flow path forming member. 6 was processed.

  Next, as shown in FIG. 3H, a member to be a layer of the discharge port forming member 7 having the discharge port 5 was prepared in the same manner as the formation of the flow path forming member 6. The flow path forming member 6 is stuck on the prepared substrate, energy is applied to the member 32 at the end of the substrate from the support 31 side, and after removing the support 31, the member 32 is processed to form the discharge port forming member 7. The discharge port 5 was formed on the substrate.

  Finally, as shown in FIG. 3 (i), the substrate was divided into chips by dicing to obtain a liquid discharge head substrate 10. In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs on the member and remaining on the substrate could be confirmed.

(Example 2)
In the first embodiment, a part of the support 31 shown in FIG. 3D is partially lifted from three directions (41A, 41B, 41C) shown in FIG. A liquid ejection head substrate was manufactured in the same manner as in Example 1 except for the above. At this time, the support lifting distance 42 in each direction was set to 30 mm.

  In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs on the member and remaining on the substrate could be confirmed.

(Example 3)
FIG. 5 shows a method of forming a separation boundary according to this embodiment. The second embodiment is an example in which the support 31 is pulled up from a part of the substrate 20 at equal intervals from three directions to form a separation boundary 33, and finally, the support is peeled off in the direction 43. there were. In the third embodiment, a step of forming the separation boundary 33 on the outer peripheral portion of the substrate 20 by moving the stage up and down is performed. Therefore, the other configuration and the manufacturing method are the same as those of the second embodiment, and the description is omitted.

  In the same manner as in Example 1, the attaching member 30 from which the member 32 at the end of the support 31 was removed was formed. The end of the sticking member was gripped by the holding tool 51, and the substrate 20 placed on the stage 52 and the member 32 of the sticking member 30 were stuck (FIG. 5A).

  Next, as shown in FIGS. 5B-1 and 5B-2, the stage 52 is moved up and down several times so that the separation boundary 33 due to the cohesive failure of the member 32 is formed along the outer periphery of the substrate 20. Formed. At this time, the stage 52 was moved up and down by 10 mm.

  In this example, the separation boundary 33 was formed along the entire outer periphery of the substrate, and the support 31 could be peeled from any position as shown in FIGS. 3 (e) and 3 (f).

(Example 4)
In the present embodiment, a negative photosensitive resin is used as the member 32, and a member (resin layer) serving as the flow path forming member 6 and the discharge port forming member 7 is laminated as shown in FIG. A method of forming the discharge port 5 and the flow path 8 by developing will be described.

As in the first embodiment, as shown in FIG. 3B, a first photosensitive resin layer as a member 32 (first resin layer 63) is formed on a 100 μm thick PET film as a support 31. Epoxy resin (trade name: N-695, manufactured by Dainippon Ink, softening point: 60 ° C.). Specifically, a solution obtained by dissolving the epoxy resin and a photoinitiator having a sensitivity to an exposure wavelength of 365 nm (trade name: CPI-210S, manufactured by San Apro Corporation) in a solvent (PGMEA) is subjected to a slit coating method. It was applied on a support 31. The addition amount of the photoinitiator was determined by adjusting the sensitivity so that the second resin layer serving as the discharge port forming member could be selectively subjected to exposure patterning at the time of forming the discharge port described later. Note that the thickness of the first resin layer 63 was 20 μm.
Then, after forming the separation boundary portion 33 in the same manner as in Examples 1 to 3, the support 31 was peeled off.

Next, as shown in FIG. 6A, the first resin layer 63 was irradiated with light 62 having an exposure wavelength of 365 nm at an exposure amount of 5000 J / m ² by an exposure machine through a photomask 61. Thereafter, by performing PEB (Post Exposure Bake) at 50 ° C. for 5 minutes, a latent image was formed so that the exposed portion 64 of the first resin layer 63 became the flow path forming member 6.

  Next, as in FIG. 3B, a sticking member having a second resin layer 66 (second negative photosensitive resin layer) on a PET film having a thickness of 100 μm as the support 65 was prepared. Specifically, an epoxy resin (trade name: 157S70, manufactured by Japan Epoxy Resin Co., softening point: 50 ° C.) and a photoinitiator having a sensitivity to an exposure wavelength of 365 nm (trade name: LW-S1, manufactured by San Apro Co.) Was dissolved in PGMEA and applied to the support 65 by a slit coating method. Thereafter, as shown in FIG. 6B, the second resin layer 66 and the first resin layer 63 were joined by a roll laminator such that they were in contact with each other. The joining was performed so that the thickness of the second resin layer 66 on the substrate 20 became 20 μm.

  As in the case of the first resin layer 63, after forming a separation boundary on the outer peripheral portion of the substrate of the second resin layer 66, the support 65 was peeled off, thereby forming the structure shown in FIG. 6C.

Next, as shown in FIG. 6D, light 68 having an exposure wavelength of 365 nm was irradiated onto the second resin layer 66 via a photomask 67 with an exposure machine at an exposure amount of 1000 J / m ² . Thereafter, by performing PEB at 90 ° C. for 4 minutes, a latent image was formed such that the exposed portion 69 of the second resin layer 66 became the discharge port forming member 7 and the unexposed portion became the discharge port 5.

Next, development was performed by dissolving the unexposed portions of the first resin layer 63 and the second resin layer 66 with PGMEA in a developing device. Further, a curing step at 200 ° C. for 1 hour was performed to form a flow path forming member 6 having a liquid flow path 8 and a discharge port forming member 7 having a discharge port 5 as shown in FIG.
In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs derived from the resin layer and remaining on the substrate was observed.

(Example 5)
A manufacturing method according to the second embodiment of the present invention will be described with reference to FIG.
First, a resin layer made of a photosensitive resin is formed as a member 32 on a support 31 in the same manner as in Example 1, and a member (resin layer) 32 formed on the support 31 is formed as shown in FIG. Was arranged to face downward, and was attached to the substrate 20 on which the liquid supply port 3 was formed. As the substrate 20, a silicon wafer having a diameter of 200 mm was used. Since the diameter of the member 32 was 210 mm, the member 32 was attached so as to protrude from the end of the substrate 20 by 5 mm (P in FIG. 7A).

  Next, as shown in FIG. 7B, energy was applied to the member 32 from the support 31 side. Energy was applied by UV light irradiation. Specifically, as shown in FIG. 8A, UV light was irradiated using a light shielding mask 81. At this time, the second region 74 was defined as a distance from the end of the member 32 to a distance D of 10 mm in the direction of the center of gravity of the substrate 20 from the end 20a of the flat portion of the substrate 20 as a starting point. By this processing, as shown in FIG. 7B, a separation boundary portion 75 where the rigidity changes sharply is formed at the boundary between the first region 73 and the second region 74.

  Next, as shown in FIG. 7C, the support 31 was peeled off. At this time, cohesive failure occurred at the separation boundary 75, the second region 74 was almost adhered to the support 31, and the resin layer remaining on the substrate 20 in a burr-like manner was slight.

  Next, as shown in FIG. 7D, the first region 73 on the substrate was exposed using a photomask (not shown) and developed to form the flow path forming member 6.

Next, as shown in FIG. 7E, similarly to the formation of the flow path forming member 6, a resin layer to be the discharge port forming member 7 having the discharge port 5 is manufactured, and the flow path forming member is already manufactured. Pasted on a substrate. After that, energy is applied to the resin layer at the end of the substrate from the support in the same manner as in the formation of the flow path forming member, and after the support is separated, the resin layer is processed to form the discharge port forming member 7 having the discharge port 5. Formed.
Thereafter, each chip was cut into chips in the same manner as in Example 1, and a substrate for a liquid discharge head was manufactured.

  In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs derived from the resin layer and remaining on the substrate was observed.

(Example 6)
The support was peeled off and the resin layer was transferred onto the substrate in the same manner as in Example 5 except that the distance D was changed as shown below. The length of the bevel portion (from the edge of the substrate to the edge of the flat portion of the substrate) was 0.5 mm, and therefore, 5.5 mm from the edge of the flat portion to the edge of the member.

  When the distance D is from 0 mm to 20 mm, the resin layer does not remain in the form of burrs, and it is possible to suppress the deterioration in quality due to the lack of burrs of the members and remaining on the substrate. On the other hand, in sample 1, since the separation boundary portion was not in contact with the substrate, burrs were generated at the peeling end side. In Sample 4, cohesive failure did not occur because the distance between the second region and the substrate was too long, and the second region was in close contact with the substrate and did not peel off with the support, leaving the entire surface as burrs. However, also in the case of Samples 1 and 4, the lack of burrs was small, and a decrease in quality could be suppressed as compared with the case where no countermeasure was taken as in Comparative Example 1 described later.

(Example 7)
Next, another example of the second embodiment of the present invention will be described. The seventh embodiment is different from the fifth embodiment only in the type of the member 32 (resin layer) and the processing method thereof. .

In this embodiment, a photocurable resin was used as the resin layer, and UV light irradiation was used as a means for applying energy. Since the photocurable resin cannot be processed by exposure and development, after the support 31 is peeled off, a photoresist is applied on the resin layer, and then exposed and developed to form a resist pattern, and the resin layer is dry-etched to form a resist pattern. It was processed into the shape of the flow path forming member 6.
In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs derived from the resin layer and remaining on the substrate was observed.

(Example 8)
Next, still another example of the second embodiment of the present invention will be described. Example 8 is different from Example 5 only in that the type of the member 32 (resin layer) and the processing method are different, and the other configuration and manufacturing method are the same as in Example 5, and therefore will be described. Is omitted.

In this example, a thermosetting resin was used as the resin layer, and contact with a heat source was used as a means for applying energy. Since the thermosetting resin cannot be processed by exposure and development, the resin layer was processed into the shape of the flow path forming member 6 after peeling off the support 31 in the same manner as in Example 5.
In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs derived from the resin layer and remaining on the substrate was observed.

(Example 9)
This embodiment is different from the fifth embodiment only in that the type of the member 32 (resin layer) and the process before the support is separated are different, and the other configuration and the manufacturing method are the same as in the fifth embodiment. Description is omitted because there is.

  In the same manner as in Example 5, a member made of a positive photosensitive resin was attached to the substrate. Thereafter, as shown in FIG. 8A, the member 32 was irradiated with ultraviolet light 82 having a wavelength of 365 nm via the light-shielding mask 81 via the support 31. At this time, the resin layer protruding from the flat portion of the substrate 20 and the second region 83 including the resin layer located at a distance D of 10 mm in the direction of the center of gravity of the substrate 20 with the end 20a of the flat portion of the substrate 20 as a starting point, Irradiation was performed.

  Next, as shown in FIG. 8B, the second region 83 was dissolved and removed using a developing solution (tetramethylammonium hydroxide: TMAH). The unexposed member inside the separation boundary 85 can be left without being dissolved in the developer. The unexposed member absorbs the developing solution and the subsequent cleaning solution and swells, thereby changing the viscosity of the member and the adhesive force with the substrate or the support. Peeling from the part may occur. In such a case, it is preferable that after the removal of the second region, a drying step is provided to eliminate swelling of the member, and then the support is peeled off.

Thereafter, as shown in FIG. 8C, the support 31 was peeled off.
In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs derived from the resin layer and remaining on the substrate was observed.

(Example 10)
Except for using a negative photosensitive resin as the member 32 (resin layer), the resin layer was attached and the support was peeled off in the same manner as in Example 5. The other configuration and the manufacturing method are the same as those of the ninth embodiment, and the description is omitted.

  As shown in FIG. 9A, starting from the end 20a of the flat portion of the substrate 20 and using a light-shielding mask 91, a resin in an area of 5 mm to 10 mm (D = 5 mm, W = 5 mm) in the direction of the center of gravity of the substrate. Light (ultraviolet light) 92 was applied to a region 95 including the layer. Thereafter, baking treatment was performed at 90 ° C. for 2 minutes. As a result, a first region 93 inside the substrate from the region 95 and a second region 94 outside the substrate from the region 95 remain as unexposed portions.

  Next, as shown in FIG. 9B, the unexposed second region 94 was brought into contact with the developing solution to dissolve and remove the resin layer soluble in the developing solution. PGMEA was used as a developer. By this processing, the resin layer protruding from the substrate 20 was removed before the support 31 was peeled off. In addition, since the region 95 that is insoluble in the developer by the irradiation of ultraviolet light is provided, even if the developer permeates between the support 31 and the substrate 20, the progress can be prevented by the region 95. .

  Thereafter, as shown in FIG. 9C, the support 31 was peeled off. In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs derived from the resin layer and remaining on the substrate was observed.

(Example 11)
An example according to the third embodiment of the present invention will be described with reference to FIG. The configuration after the support is peeled off is the same as that of the fifth embodiment, and the description is omitted.

  A member 32 was formed on the support 31 in the same manner as in Example 5, and the member 32 was attached so that the member 32 protruded 5 mm from the end of the substrate 20 (see FIG. 7A).

  Next, as shown in FIG. 10A, energy 101 was applied to the member protruding from the edge of the substrate from the back surface of the substrate using the substrate as a mask. In this embodiment, a photosensitive resin or a photocurable resin is used as a member, and energy is applied to the member by irradiation with ultraviolet light. The region to which the energy was applied was limited to a distance of 5 mm from the edge of the substrate in the direction of the center of gravity of the substrate (the end of the flat portion of the substrate) so as not to cover the supply port. At the time of irradiation, the substrate was rotated and irradiated only to the outer peripheral portion. By this processing, a separation boundary portion 104 where the hardness changes sharply was formed in the resin layer. The first region 102 was formed inside the separation boundary portion 104, and the second region 103 was formed outside the separation boundary portion 104.

  Next, as shown in FIG. 10B, the support 31 was peeled off. At this time, the cohesive failure of the resin layer occurs preferentially at the separation boundary portion 104, and the second region 103 is almost attached to the support 31 and removed. It was slight. Also, when heat is applied as energy using a thermosetting resin as a member, or when light is irradiated using a photosensitive resin as a member, the member can be transferred with almost no burrs.

(Example 12)
The twelfth embodiment is different from the eleventh embodiment only in that the type of the resin layer and the processing method thereof are different, and the other configuration and the manufacturing method are the same as those of the eleventh embodiment, so that the description is omitted.

  A positive photosensitive resin was used as the resin layer. Thereafter, light (ultraviolet light) 111 having a wavelength of 365 nm was irradiated onto the resin layer protruding from the edge of the substrate from the back side of the substrate using the substrate as a mask (FIG. 11A). Thereafter, baking treatment was performed at 90 ° C. for 2 minutes. As a result of this processing, a separation boundary portion 114 was formed at the boundary between the first region 112 of the unexposed portion and the second region 113 of the exposed portion.

  Next, as shown in FIG. 11B, the substrate end region was brought into contact with the developing solution, and the second region 113 soluble in the developing solution was dissolved and removed. As the developer, TMAH was used because it is a positive photosensitive resin. Next, as shown in FIG. 11C, the support 31 was peeled off from the member. After that, processing was performed in the same manner as in the other examples to produce a liquid discharge head substrate.

  In the liquid ejection head substrate manufactured as described above, almost no deterioration in quality due to the lack of burrs on the member and remaining on the substrate could be confirmed.

(Comparative Example 1)
After attaching the attaching member 30 having the member 32 formed on the support 31 as shown in FIG. 12A to the substrate 20, the support 31 was peeled off as shown in FIG. 12B. From the start of peeling to half of the substrate, the member was cohesively fractured as shown in FIG. 12B and peeled together with the support. However, as shown in FIG. 12C, in a region where the exfoliation exceeded half of the substrate, a crack due to cohesive failure was directed to the outside of the substrate, and burrs 121 remained at the end of the substrate.

  As shown in FIG. 12 (d), many burrs 122 of the member transferred were confirmed in the transferred member. Further, when the flow path forming member 6 and the discharge port forming member 7 are formed as shown in FIG. 12F and cut into chips, there is a problem as shown in FIG. The liquid ejection head substrate 10 'was formed.

  The method of manufacturing a substrate for a liquid ejection head has been described above, but the method of manufacturing a substrate of the present invention can be applied to a method of manufacturing various structures including a step of transferring a member of an attaching member onto a substrate. .

DESCRIPTION OF SYMBOLS 1 Substrate 2 Energy generating element 3 Liquid supply port 4 Nozzle forming member 5 Discharge port 6 Flow path forming member 7 Discharge port forming member 8 Flow path 10 Liquid discharge head substrate 20 Substrate 30 Adhering member 31 Supporting member 32 (resin layer)
33 Separation Boundary

Claims (23)

A step of preparing a sticking member in which the member is formed on a support,
Affixing the member side of the attaching member to the substrate so that the member protrudes from an outer edge of the substrate,
Removing the support from the attachment member attached to the substrate;
Including
Prior to peeling the support, a step of providing a separation boundary near the end of the substrate of the member, so that a region of the member protruding from the substrate is separated from a region in contact with the substrate,
The method of manufacturing a substrate, wherein the support is separated so that the separated support finally passes through the separation boundary.   The method according to claim 1, wherein the substrate is a wafer-shaped substrate.   The method according to claim 2, wherein the member is a resin layer.   4. The method of manufacturing a substrate according to claim 2, wherein the separation boundary portion is formed in a half or more of the entire circumference of the substrate. 5.   The method according to claim 2, wherein the separation boundary is formed by cohesive failure of the member.   The separation boundary portion is formed by pulling up the support after the step of sticking the sticking member to the substrate, and a distance of the pulling up is equal to or less than half of a diameter of the substrate in a pulling-up direction. The manufacturing method of the substrate described in the above.   6. The separation boundary part according to claim 5, wherein the substrate is moved up and down with the end of the support fixed, or the end of the support is moved up and down with the position of the substrate fixed. Substrate manufacturing method.   The member is a resin layer whose characteristics are changed by the application of energy, and a region where the first energy is applied to the member, with a boundary line virtually provided near an end of the substrate as a boundary, Forming a region to which the second energy is applied, wherein the separation boundary portion is a region to which any one of the first and second energies is applied or a region to which the first and second energies are applied. 3. The method of manufacturing a substrate according to claim 2, wherein the substrate is formed at a boundary between the regions.   The method according to claim 8, wherein a first region is formed inside the substrate and a second region is formed outside the substrate with the separation boundary as a boundary.   The member is a resin layer whose stiffness changes by applying energy, and separates the first region and the second region by cohesive failure starting from the separation boundary when the support is peeled off. The method for manufacturing a substrate according to claim 9.   The method for manufacturing a substrate according to claim 8, wherein the first energy and the second energy include one of heat and light.   The method of manufacturing a substrate according to any one of claims 8 to 11, wherein the boundary is defined within a range of 30 mm or less in a direction of a center of gravity of the substrate, starting from an end of a flat portion of the substrate.   13. The method of manufacturing a substrate according to claim 12, wherein the boundary line is defined in a range of 0 mm to 20 mm in a direction of a center of gravity of the substrate, starting from an end of a flat portion of the substrate.   10. The method according to claim 9, wherein the member is a photosensitive resin whose solubility in a specific solvent changes by irradiating light, and including a step of removing the second region with a solvent before the step of peeling the support. The manufacturing method of the substrate described in the above.   The member is a positive photosensitive resin, and the second region is irradiated with light from an end of the member to a distance of up to 20 mm in a direction of a center of gravity of the substrate starting from an end of a flat portion of the substrate. The method of manufacturing a substrate according to claim 14, wherein the substrate is formed.   The member is a negative photosensitive resin, and the separation boundary portion has a width of 100 μm or more in a range of 0 to 20 mm in a center of gravity direction of the substrate from an end of the member to an end of a flat portion of the substrate. The method for manufacturing a substrate according to claim 14, wherein the substrate is formed by irradiating light.   17. The method for manufacturing a substrate according to claim 8, wherein the application of the energy is applied to the member through the support.   The method for manufacturing a substrate according to any one of claims 8 to 16, wherein the application of the energy is performed before the attaching member is attached to the substrate.   The member is a resin layer whose characteristics are changed by the application of energy, applies energy from the direction of the substrate to form a second region in a member protruding from the substrate, and forms a member on the substrate in a first region. 3. The method according to claim 2, wherein the separation boundary is formed at a boundary between the first region and the second region.   20. The method for manufacturing a substrate according to claim 19, wherein the energy applied to the member includes any of heat and light.   21. The characteristic according to claim 19, wherein the characteristic that changes by the application of the energy is a hardness of the resin layer, and the first region and the second region are separated by cohesive failure starting from the separation boundary. Substrate manufacturing method.   20. The method for manufacturing a substrate according to claim 19, wherein the member is a positive photosensitive resin, and the method includes a step of removing the second region with a solvent before the step of peeling the support.   A base, an energy generating element for discharging a liquid formed on the front surface of the base, a liquid flow path for disposing the liquid on the energy generating element, and a liquid communicating with the liquid flow path. And a liquid supply port that penetrates through the front and back surfaces of the base and supplies liquid to the liquid flow path, comprising: A liquid discharge, wherein at least a part of a wall of a liquid flow path or a member forming the discharge port is formed of a member formed by the method for manufacturing a substrate according to any one of claims 1 to 22. A method for manufacturing a head substrate.

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