JP2020047649A5 - - Google Patents

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Publication number
JP2020047649A5
JP2020047649A5 JP2018172974A JP2018172974A JP2020047649A5 JP 2020047649 A5 JP2020047649 A5 JP 2020047649A5 JP 2018172974 A JP2018172974 A JP 2018172974A JP 2018172974 A JP2018172974 A JP 2018172974A JP 2020047649 A5 JP2020047649 A5 JP 2020047649A5
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Japan
Prior art keywords
mold
composition
substrate
molding apparatus
molding
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JP2018172974A
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English (en)
Japanese (ja)
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JP7191606B2 (ja
JP2020047649A (ja
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JP2018172974A 2018-09-14 2018-09-14 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法 Active JP7191606B2 (ja)

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JP2018172974A JP7191606B2 (ja) 2018-09-14 2018-09-14 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法

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JP2018172974A JP7191606B2 (ja) 2018-09-14 2018-09-14 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法

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JP2020047649A JP2020047649A (ja) 2020-03-26
JP2020047649A5 true JP2020047649A5 (cg-RX-API-DMAC7.html) 2021-09-24
JP7191606B2 JP7191606B2 (ja) 2022-12-19

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JP2018172974A Active JP7191606B2 (ja) 2018-09-14 2018-09-14 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法

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JP (1) JP7191606B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11034057B2 (en) * 2019-08-15 2021-06-15 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
JP7532234B2 (ja) * 2020-12-10 2024-08-13 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3957166B2 (ja) * 2002-05-09 2007-08-15 Ｔｄｋ株式会社 スタンパ剥離方法および装置、ならびに多層記録媒体
TW200504928A (en) * 2003-06-20 2005-02-01 Matsushita Electric Industrial Co Ltd Manufacturing method of semiconductor device
JP5782784B2 (ja) * 2011-03-31 2015-09-24 大日本印刷株式会社 インプリント方法およびそれを実施するためのインプリント装置
JP6012944B2 (ja) * 2011-09-22 2016-10-25 オリンパス株式会社 光学素子の製造方法および表面加工装置
JP6447613B2 (ja) * 2016-11-01 2019-01-09 本田技研工業株式会社 乗員保護装置

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