JP2020040084A5 - - Google Patents

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Publication number
JP2020040084A5
JP2020040084A5 JP2018168746A JP2018168746A JP2020040084A5 JP 2020040084 A5 JP2020040084 A5 JP 2020040084A5 JP 2018168746 A JP2018168746 A JP 2018168746A JP 2018168746 A JP2018168746 A JP 2018168746A JP 2020040084 A5 JP2020040084 A5 JP 2020040084A5
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JP
Japan
Prior art keywords
soldering
hot air
land
heat source
auxiliary heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018168746A
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Japanese (ja)
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JP6958519B2 (en
JP2020040084A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2018168746A priority Critical patent/JP6958519B2/en
Priority claimed from JP2018168746A external-priority patent/JP6958519B2/en
Priority to PCT/JP2019/035220 priority patent/WO2020054619A1/en
Publication of JP2020040084A publication Critical patent/JP2020040084A/en
Publication of JP2020040084A5 publication Critical patent/JP2020040084A5/ja
Application granted granted Critical
Publication of JP6958519B2 publication Critical patent/JP6958519B2/en
Active legal-status Critical Current
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Claims (5)

基板（１００）のスルーホール（１０１）に設けられたランド（１０２）内に電子部品の端子（１１０）をはんだ付けする装置（１０）であって、
はんだ付けの実行前に予め前記ランドおよび前記端子を局所的に加熱する補助熱源（１６，１７）として、
熱風を供給する熱風供給部（１６）と、
近赤外線を照射する近赤外線照射部（１７）と、
を備え、
前記熱風供給部が供給する熱風を前記ランドおよび前記端子に指向させる熱風指向制御部（１６Ａ）、および、前記近赤外線照射部が照射する近赤外線を前記ランドおよび前記端子に指向させる近赤外線指向制御部（１７Ａ）のうち少なくとも何れか一方を備えるはんだ付け装置。 A device (10) for soldering terminals (110) of electronic components into lands (102) provided in through holes (101) of a substrate (100).
As an auxiliary heat source (16, 17) that locally heats the land and the terminal before performing soldering ,
Hot air supply unit (16) that supplies hot air,
A near-infrared irradiation unit (17) that irradiates near-infrared rays,
Equipped with a,
A hot air directional control unit (16A) that directs hot air supplied by the hot air supply unit to the land and the terminal, and a near infrared ray directional control that directs the near infrared rays emitted by the near infrared irradiation unit to the land and the terminal. A soldering apparatus including at least one of the parts (17A) . 筒状に形成されたスリーブ（１１）をさらに備え、
前記スリーブの内部に供給されるはんだを加熱して溶融させることにより、前記ランドに前記端子をはんだ付けする請求項１に記載のはんだ付け装置。 Further provided with a tubular sleeve (11)
By heating and melting the solder supplied to the inside of the sleeve, soldering apparatus according to claim 1 for soldering the terminal to the land. 前記スリーブは、移動可能に構成されており、
前記スリーブが、はんだ付けを実行するはんだ付け実行位置に移動したことに応じて、前記補助熱源の駆動を停止する制御部（２０）をさらに備える請求項２に記載のはんだ付け装置。 The sleeve is configured to be movable
The soldering apparatus according to claim 2 , further comprising a control unit (20) that stops driving the auxiliary heat source when the sleeve moves to a soldering execution position where soldering is performed. 前記補助熱源による加熱温度を制御する制御部（２０）をさらに備える請求項１から３の何れか１項に記載のはんだ付け装置。 The soldering apparatus according to any one of claims 1 to 3 , further comprising a control unit (20) for controlling a heating temperature by the auxiliary heat source. 前記補助熱源によって加熱された空気を排出する排気部（３０）をさらに備える請求項１から４の何れか１項に記載のはんだ付け装置。 The soldering apparatus according to any one of claims 1 to 4 , further comprising an exhaust unit (30) for discharging air heated by the auxiliary heat source.
JP2018168746A 2018-09-10 2018-09-10 Soldering equipment Active JP6958519B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018168746A JP6958519B2 (en) 2018-09-10 2018-09-10 Soldering equipment
PCT/JP2019/035220 WO2020054619A1 (en) 2018-09-10 2019-09-06 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018168746A JP6958519B2 (en) 2018-09-10 2018-09-10 Soldering equipment

Publications (3)

Publication Number Publication Date
JP2020040084A JP2020040084A (en) 2020-03-19
JP2020040084A5 true JP2020040084A5 (en) 2020-10-01
JP6958519B2 JP6958519B2 (en) 2021-11-02

Family

ID=69778266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018168746A Active JP6958519B2 (en) 2018-09-10 2018-09-10 Soldering equipment

Country Status (2)

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JP (1) JP6958519B2 (en)
WO (1) WO2020054619A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024038112A1 (en) 2022-08-17 2024-02-22 Institut National de la Santé et de la Recherche Médicale Improved anti-albumin nanobodies and their uses

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156896A (en) * 1984-12-28 1986-07-16 三菱電機株式会社 Solding method
JP2005322806A (en) * 2004-05-10 2005-11-17 Koyo Seiko Co Ltd Splicing machine
JP2007073661A (en) * 2005-09-06 2007-03-22 Fujifilm Corp Laser soldering method and laser soldering device
JP2012134269A (en) * 2010-12-21 2012-07-12 Ricoh Microelectronics Co Ltd Solder removal method and device using the same
JP2014146630A (en) * 2013-01-28 2014-08-14 Fuji Electric Co Ltd Method of manufacturing semiconductor device, and soldering iron
JP6761930B2 (en) * 2016-07-29 2020-09-30 株式会社アンド Soldering equipment

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