JP2015221449A5 - - Google Patents
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- Publication number
- JP2015221449A5 JP2015221449A5 JP2014106255A JP2014106255A JP2015221449A5 JP 2015221449 A5 JP2015221449 A5 JP 2015221449A5 JP 2014106255 A JP2014106255 A JP 2014106255A JP 2014106255 A JP2014106255 A JP 2014106255A JP 2015221449 A5 JP2015221449 A5 JP 2015221449A5
- Authority
- JP
- Japan
- Prior art keywords
- tip
- soldering
- heating
- cleaning device
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000010438 heat treatment Methods 0.000 claims description 29
- 238000004140 cleaning Methods 0.000 claims description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000001629 suppression Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 28
- 238000001514 detection method Methods 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 238000004040 coloring Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000002485 combustion reaction Methods 0.000 description 1
Description
本発明に係るクリーニング装置は、半田鏝の、半田に対して非濡れ性の鏝先に付いた付着物を除去するクリーニング装置であって、前記鏝先を加熱する加熱手段と、前記付着物の少なくとも一部が燃焼するように前記加熱手段を制御する加熱制御手段と、前記鏝先を囲むように形成された放熱抑制部材とを備えた構成とする。本構成によれば、鏝先の付着物をより効率良く除去することが可能となる。 The cleaning device according to the present invention is a cleaning device that removes deposits attached to the tip of the solder iron that is not wettable with respect to the solder, and includes a heating means for heating the tip, A heating control unit that controls the heating unit so that at least a part of the combustion unit burns, and a heat radiation suppression member that is formed so as to surround the tip of the tip are provided. According to this configuration, it is possible to more efficiently remove the deposit on the tip.
また、上記構成としてより具体的には、前記鏝先の温度を検出する温度検出手段をさらに備え、前記加熱制御手段は、前記温度検出手段の検出温度に基づいて前記加熱手段を制御する構成としてもよい。
More specifically, the above configuration further includes temperature detecting means for detecting the temperature of the tip, and the heating control means controls the heating means based on the temperature detected by the temperature detecting means. Also good.
Claims (18)
前記鏝先を加熱する加熱手段と、
前記付着物の少なくとも一部が燃焼するように前記加熱手段を制御する加熱制御手段と、
前記鏝先を囲むように形成された放熱抑制部材と
を備えたことを特徴とするクリーニング装置。 A cleaning device that removes deposits on the tip that is not wettable with solder,
Heating means for heating the tip;
Heating control means for controlling the heating means so that at least a part of the deposits burns ;
A cleaning device, comprising: a heat dissipation suppressing member formed so as to surround the tip .
前記鏝先を加熱した後、前記気体噴出手段から前記鏝先に向かって気体を噴出させ前記鏝先の付着物を除去する請求項１記載のクリーニング装置。 Further comprising gas ejection means,
The cleaning apparatus according to claim 1, wherein after the tip is heated, a gas is jetted from the gas jetting unit toward the tip to remove deposits on the tip.
前記加熱制御手段は、前記温度検出手段の検出温度に基づいて前記加熱手段を制御する請求項１から請求項５の何れかに記載のクリーニング装置。 A temperature detecting means for detecting the temperature of the tip;
The cleaning apparatus according to claim 1, wherein the heating control unit controls the heating unit based on a temperature detected by the temperature detection unit.
前記クリーニング装置によってクリーニングされる鏝先、および、半田付け用の、前記鏝先を加熱する半田付け用ヒーターを有する半田鏝と
を備え、
前記温度検出手段は、半田付け用に前記鏝先を加熱する際における前記鏝先の温度の検出手段としても用いられる半田付けシステム。 A cleaning device according to any one of claims 6 to 8 ,
A soldering iron having a soldering tip that is cleaned by the cleaning device, and a soldering heater for heating the soldering iron tip,
The temperature detection means is a soldering system that is also used as temperature detection means for the tip when the tip is heated for soldering.
前記クリーニング装置によってクリーニングされる鏝先を有する半田鏝と
を備え、
前記鏝先は、黒色又は前記付着物と同色の材料によって形成されている半田付けシステム。 A cleaning device according to claim 4;
A soldering iron having a tip that is cleaned by the cleaning device;
The soldering system is a soldering system in which the tip is made of black or a material having the same color as the deposit.
前記クリーニング装置によってクリーニングされる鏝先を有する半田鏝と
を備え、
前記鏝先は、黒色又は前記付着物と同色に着色がなされている半田付けシステム。 A cleaning device according to claim 4;
A soldering iron having a tip that is cleaned by the cleaning device;
The soldering system is a soldering system in which the tip is colored black or the same color as the deposit.
前記クリーニング装置によってクリーニングされる鏝先を有する半田鏝と
を備える半田付けシステム。 A cleaning device according to any one of claims 1 to 9 ,
A soldering system comprising a soldering iron having a tip that is cleaned by the cleaning device.
前記加熱制御手段は、前記鏝先をクリーニングする際、前記付着物の少なくとも一部が燃焼するように前記加熱手段と前記半田付け用ヒーターとを制御する請求項１４に記載の半田付けシステム。 The soldering iron comprises a soldering heater for heating the soldering tip for soldering,
15. The soldering system according to claim 14 , wherein the heating control unit controls the heating unit and the soldering heater so that at least a part of the deposit is burned when the tip is cleaned.
取り外された前記鏝先が、前記加熱手段による加熱が可能となる位置に配置される請求項１４に記載の半田付けシステム。 The tip is detachable from the main body of the solder iron,
The soldering system according to claim 14 , wherein the removed tip is disposed at a position where heating by the heating means is possible.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014106255A JP6388327B2 (en) | 2014-05-22 | 2014-05-22 | Cleaning device and soldering system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014106255A JP6388327B2 (en) | 2014-05-22 | 2014-05-22 | Cleaning device and soldering system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015221449A JP2015221449A (en) | 2015-12-10 |
| JP2015221449A5 true JP2015221449A5 (en) | 2017-04-20 |
| JP6388327B2 JP6388327B2 (en) | 2018-09-12 |
Family
ID=54784792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014106255A Active JP6388327B2 (en) | 2014-05-22 | 2014-05-22 | Cleaning device and soldering system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6388327B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6089193B2 (en) * | 2015-05-19 | 2017-03-08 | 株式会社アンド | Soldering equipment |
| JP6818262B2 (en) * | 2016-03-11 | 2021-01-20 | 株式会社アンド | Soldering equipment |
| JP6759992B2 (en) * | 2016-11-08 | 2020-09-23 | 株式会社デンソー | Manufacturing method of electronic control unit |
| CN107052604A (en) * | 2016-12-01 | 2017-08-18 | 深圳市环宇源科技有限公司 | A kind of electrokinetic cell welding equipment |
| JP6664019B1 (en) * | 2019-03-13 | 2020-03-13 | 昭立電気工業株式会社 | Iron tip cleaner for soldering iron |
| JP7498484B2 (en) * | 2020-06-25 | 2024-06-12 | 株式会社アンド | Soldering Equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4176778A (en) * | 1978-02-27 | 1979-12-04 | Fortune William S | Soldering tool holder |
| JPH08316627A (en) * | 1995-05-24 | 1996-11-29 | Fujitsu Ltd | Reflow bonding device |
| JPH11245028A (en) * | 1998-02-27 | 1999-09-14 | Omron Corp | Method and device for cleaning soldering iron head |
| JP2004344920A (en) * | 2003-05-21 | 2004-12-09 | Japan Unix Co Ltd | Iron tip cleaning device for soldering iron |
| JP2010075981A (en) * | 2008-09-26 | 2010-04-08 | Kenwood Corp | Soldering iron cleaning apparatus |
-
2014
- 2014-05-22 JP JP2014106255A patent/JP6388327B2/en active Active
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