JP2020035824A - Bus bar assembly and manufacturing method therefor - Google Patents

Abstract

To provide a bus bar assembly which can miniaturize in the vertical direction while securing electrical isolation among a plurality of bus bars, with a low-cost damming structure of a sealing resin of a semiconductor element such as an LED to be mounted.SOLUTION: The bus bar assembly includes: a plurality of bus bars arranged in parallel in the same plane with the provision of a gap; and an insulating resin layer which includes a connector unit filled into the gap to connect a plurality of bus bars in an insulation state, and a first surface side lamination part provided on a first surface of a bus bar connection body composed of the plurality of bus bars connected by the connector unit. The insulating resin layer includes: a center opening on the first surface side to expose the first surface of the plurality of bus bars; a central coating region on the first surface side which surrounds the center opening on the first surface side; a peripheral edge opening on the first surface side which exposes the first surface of the bus bar connection body in a region which surrounds the central coating region on the first surface side; and a peripheral edge coating region on the first surface side which surrounds the peripheral edge opening on the first surface side.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a bus bar assembly in which a plurality of bus bars are electrically insulated and mechanically connected to each other, and a method of manufacturing the same.

  A busbar assembly including a plurality of busbars that are electrically insulated from each other and mechanically connected to each other has been proposed and used in various fields (see Patent Documents 1 and 2 below).

  For example, there has been proposed a laminated bus bar assembly in which one flat bus bar and another flat bus bar are vertically stacked in parallel with each other (see Patent Documents 1 and 2 below).

In this laminated bus bar assembly, the opposing plane of one tabular bus bar and the opposing plane of the other tabular bus bar are entirely opposed to each other with the insulating resin layer interposed therebetween. There is a problem that it is difficult to secure enough.
In particular, if the thickness of the insulating resin layer between the one flat bus bar and the other flat bus bar is reduced in order to reduce the size in the vertical direction, a leak current may flow between the two bus bars.

In addition, the above-described stacked bus bar assembly has a problem that it is difficult to improve the manufacturing efficiency.
That is, when manufacturing the laminated bus bar assembly, one flat bus bar and another flat bus bar which are separate from each other are locked in a state where they are vertically separated by a desired distance, and the locking state is set. It is necessary to mechanically connect the two in an electrically insulated state by an insulating resin layer as it is, and it has been difficult to improve the manufacturing efficiency.

  In Patent Document 1, as a method of manufacturing a laminated bus bar assembly, a step of preparing an upper mold and a lower mold that can be separated vertically and a method of forming the upper mold and the lower mold are provided. A step of stacking and arranging the first and second flat bus bars in the cavity while vertically separating them from each other and locking the bus bars; and forming a resin injection hole formed in the upper mold and the lower mold in the cavity. And a step of injecting an insulating resin into the substrate.

  However, in the manufacturing method described in Patent Document 1, when the first and second flat busbars are installed in the cavity, the outer peripheral surfaces of the first and second flat busbars and the upper mold are disposed. And a gap to be filled with the resin layer between the inner peripheral surface of the lower mold and the gap to be filled with the resin layer between the opposing planes of the first and second flat bus bars. In such a state, it is necessary to inject an insulating resin into the cavity while the first and second flat bus bars are fixed in position in the cavity.

Therefore, it is necessary to prepare the upper mold and the lower mold for each specification of the busbar assembly such as the shapes and dimensions of the first and second flat busbars and the thickness of the insulating resin layer.
There is also a problem that it becomes difficult to spread the insulating resin in the gap between the opposing planes of the first and second flat bus bars.

  On the other hand, Patent Literature 2 discloses a method of manufacturing a laminated bus bar assembly, which includes a step of preparing a plurality of flat bus bars and an electrodeposition coating using a heat-resistant and insulating paint. A step of depositing a heat-resistant and insulating coating film on each outer peripheral surface, a step of completely curing a coating film of one of the plurality of busbars, and a step of depositing another of the plurality of busbars. A step of semi-curing the coating film, and performing a pressure heating process by overlapping one bus bar with another bus bar, thereby shifting the coating film of the other bus bar from a semi-cured state to a completely cured state, A step of mechanically connecting the one bus bar and the other bus bar in a laminated state by a coating film that transitions from a cured state to a completely cured state. That.

The manufacturing method described in Patent Document 2 is useful in that the disadvantages in the manufacturing method described in Patent Document 1 can be solved, but it is necessary to deposit a coating film individually on each of a plurality of bus bars. is there.
In addition, since it is necessary to fix one bus bar and another bus bar in a state where the coating film of the other bus bar is semi-cured, there is a problem that it takes time and effort.

  Further, when a light emitting element such as an LED is mounted on the surface of the bus bar assembly and used as a light source unit, a sealing resin is provided on the surface of the bus bar assembly to protect the light emitting element such as an LED.

  For example, Patent Literature 3 below discloses a light source module in which a sub-mount substrate on which an LED is mounted and a wiring substrate provided with wiring for supplying power to the LED are fixed on an upper surface of a metal core substrate, A light source module is disclosed in which a ring-shaped plate having an opening surrounding the LED and the wiring of the submount substrate is fixed on the metal core substrate and the wiring substrate, and a sealing resin is filled in the opening of the ring-shaped plate. ing.

  By providing the ring-shaped plate member, the sealing resin for protecting the LED is dammed and the outflow of the sealing resin can be effectively prevented.

  However, it is necessary to prepare the ring-shaped plate material separately from the metal core substrate, the sub-mount substrate, and the wiring substrate, and further to fix the ring-shaped plate material to the metal core substrate and the wiring substrate, thereby reducing manufacturing costs. There is a problem that it is difficult to plan.

Japanese Patent No. 4432913 JP-A-2006-216766 JP 2006-269079 A

The present invention has been made in view of such a conventional technique, and is a bus bar assembly capable of achieving downsizing in a vertical direction while securing electrical insulation between a plurality of bus bars, and an LED to be mounted. It is a first object of the present invention to provide a bus bar assembly having an inexpensive structure for blocking a sealing resin of a semiconductor element such as a semiconductor device.
It is a second object of the present invention to provide a manufacturing method capable of efficiently manufacturing the bus bar assembly.

  In order to achieve the first object, a first aspect of the present invention is directed to a first embodiment of the present invention, wherein a plurality of busbars formed by a conductive plate-shaped member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface side laminated portion provided on a surface, wherein the first surface side laminated portion exposes the first surfaces of the plurality of bus bars at the center of the bus bar connected body in a plan view. A first surface side central opening, a first surface side central covering region covering the first surface of the bus bar connector in a region surrounding the first surface side central opening, and a region surrounding the first surface side central covering region A first surface of the bus bar connector A first surface side peripheral opening for exposed, to provide a bus bar assembly in the region surrounding the first surface side peripheral opening and a first surface side peripheral coating region covering the first surface of the bus bar connecting member.

  In order to achieve the first object, a second aspect of the present invention is directed to a plurality of busbars formed of a conductive plate-shaped member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface-side laminated portion provided on a surface, wherein the first surface-side laminated portion integrally integrates the first surfaces of the plurality of bus bars at a center in a plan view of the bus bar connected body. A bus bar assembly having a first surface side common central opening to be exposed on the first surface side and a first surface side peripheral edge covering region covering the first surface of the bus bar connector in a region surrounding the first surface side common central opening. provide.

  In order to achieve the first object, a third aspect of the present invention is directed to a third aspect of the present invention, wherein a plurality of busbars formed by a conductive plate-shaped member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface-side laminated portion provided on the surface, wherein the bus bar connected body is provided at the center in a plan view via the first surface-side central opening of the first surface-side laminated portion. A central portion including an exposed area where the bus bar is exposed, a surrounding portion surrounding the central portion in plan view, a surrounding portion covered by the first surface side laminated portion, and the surrounding portion in plan view. The surrounding edge portion, wherein the And a peripheral portion covered by side stacking unit, the surrounding portion provides a bus bar assembly which is a recess that opens to the side of the first surface.

  In order to achieve the first object, a fourth aspect of the present invention is directed to a plurality of busbars formed of a conductive plate-like member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface-side laminated portion provided on the surface, wherein the bus bar connected body is provided at the center in a plan view via the first surface-side central opening of the first surface-side laminated portion. A central portion including an exposed region where the bus bar is exposed, and a peripheral portion surrounding the central portion in plan view, the peripheral portion being covered by the first surface side laminated portion, and the central portion includes a A bar that is a recess that opens to one side To provide a bar assembly.

In the third and fourth aspects, for example, the central portion may be the exposed region whose entire area is exposed via the first surface side central opening.
Alternatively, the central portion may include, in addition to the exposed region, a central covering region surrounding the exposed region in a plan view and covered by the first surface-side laminated portion.

In the various configurations of the first, third, and fourth aspects, for example, the first surface-side central opening may have a plurality of individual central openings that respectively expose the first surfaces of the plurality of busbars.
Alternatively, the first surface side central opening may have a common central opening that integrally exposes the first surfaces of the plurality of bus bars.

In various configurations of the bus bar assembly according to the present invention, preferably, the insulating resin layer may include a second surface side laminated portion provided on the second surface on the other side in the thickness direction of the bus bar connected body. .
The second surface side laminated portion includes a second surface side central opening that exposes the second surfaces of the plurality of bus bars, and a second surface covering the second surface of the bus bar connected body in a region surrounding the second surface side central opening. And a two-side peripheral coating area.
In this case, preferably, the second surface of the plurality of bus bars is provided with a convex region extending outward through the second surface side central opening.

  In order to achieve the second object, a fifth aspect of the present invention is directed to a fifth aspect of the present invention, wherein a plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface side laminated portion provided on a surface, wherein the first surface side laminated portion exposes the first surfaces of the plurality of bus bars at the center of the bus bar connected body in a plan view. A first surface side central opening, a first surface side central covering region covering the first surface of the bus bar connector in a region surrounding the first surface side central opening, and a region surrounding the first surface side central covering region The first surface of the bus bar connector A method of manufacturing a bus bar assembly, comprising: a first surface side peripheral opening to be protruded; and a first surface side peripheral covering region that covers the first surface of the bus bar connector in a region surrounding the first surface side peripheral opening. A step of preparing a conductive metal flat plate having a bus bar assembly forming region for forming the plurality of bus bars; and a first surface on one side in the thickness direction and a second surface on the other side in the thickness direction in the bus bar assembly forming region. A slit forming step of forming one or a plurality of slits penetrating through the gap and having the same width as the gap to define a plurality of busbar forming portions corresponding to the plurality of busbars, and the inside of the slit and the busbar assembly A coating step of coating the entire area on the first surface of the formation area with a coating containing an insulating resin, and a curing step of curing the coating applied in the coating step; The insulating resin layer of an unnecessary portion on the first surface of the busbar assembly forming region is peeled off, and the first surface side central opening, the first surface side central covering region, the first surface side peripheral opening, and the Provided is a method for manufacturing a bus bar assembly, the method including a peeling step of forming a one-side peripheral coating area and a cutting step of cutting the bus bar assembly from the conductive metal flat plate.

  In order to achieve the second object, a sixth aspect of the present invention is directed to a sixth aspect of the present invention, wherein a plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface side laminated portion provided on a surface, wherein the first surface side laminated portion exposes the first surfaces of the plurality of bus bars at the center of the bus bar connected body in a plan view. A first surface side central opening, a first surface side central covering region covering the first surface of the bus bar connector in a region surrounding the first surface side central opening, and a region surrounding the first surface side central covering region The first surface of the bus bar connector A method of manufacturing a bus bar assembly, comprising: a first surface side peripheral opening to be protruded; and a first surface side peripheral covering region that covers the first surface of the bus bar connector in a region surrounding the first surface side peripheral opening. A step of preparing a conductive metal flat plate having a bus bar assembly forming region for forming the plurality of bus bars; and a first surface on one side in the thickness direction and a second surface on the other side in the thickness direction in the bus bar assembly forming region. A slit forming step of forming one or a plurality of slits having the same width as the gap and defining a plurality of busbar forming portions corresponding to the plurality of busbars, and the inside of the slit and the busbar assembly A paint containing an insulating resin is applied to portions of the first surface of the formation region corresponding to the first surface side central coating region and the first surface side peripheral edge coating region. A coating step, a curing step of curing the paint applied in the coating step to form the connecting portion and the first surface side laminated portion, and a cutting step of cutting the bus bar assembly from the conductive metal plate. And a method for manufacturing a bus bar assembly.

  In order to achieve the second object, a seventh aspect of the present invention is a method according to a seventh aspect of the present invention, wherein a plurality of busbars formed of a conductive plate-like member and arranged on the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface-side laminated portion provided on a surface, wherein the first surface-side laminated portion integrally integrates the first surfaces of the plurality of bus bars at a center in a plan view of the bus bar connected body. A bus bar assembly having a first surface side common center opening to be exposed on the first surface side and a first surface side peripheral edge covering region covering a first surface of the bus bar connector in a region surrounding the first surface side common center opening. Manufacturing method A step of preparing a conductive metal flat plate having a bus bar assembly forming area for forming the plurality of bus bars; and providing the bus bar assembly forming area with a first surface on one side in the thickness direction and a second surface on the other side in the thickness direction. A slit forming step of penetrating and forming one or a plurality of slits having the same width as the gap to define a plurality of bus bar forming portions corresponding to the plurality of bus bars, and forming a slit in the slit and the bus bar assembly forming region A coating step of coating the entire surface of the first surface with a coating material containing an insulating resin, a curing step of curing the coating material applied in the coating step, and insulation of an unnecessary portion on the first surface of the busbar assembly forming region Removing the conductive resin layer to form the first surface side common center opening and the first surface side peripheral edge covering region; To provide a method of manufacturing a bus bar assembly comprising a cutting step of cutting the Li from the conductive metal plates.

  In order to achieve the second object, an eighth aspect of the present invention is directed to an eighth aspect of the present invention, wherein a plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface side laminated portion provided on a surface, wherein the plurality of busbars are exposed via a first surface side central opening of the first surface side laminated portion at the center in plan view. A central portion including an exposed region, a surrounding portion surrounding the central portion in plan view, a surrounding portion covered by the first surface side laminated portion, and a peripheral portion surrounding the surrounding portion in plan view. , Covered by the first surface side laminated portion And a surrounding portion, wherein the surrounding portion is a recessed portion that opens to the first surface side, wherein the conductive metal plate having a busbar assembly forming region forming the plurality of busbars is provided. Preparing, and forming, in the bus bar assembly forming area, one or a plurality of slits penetrating between the first surface on one side in the thickness direction and the second surface on the other side in the thickness direction and having the same width as the gap. A slit forming step for defining a plurality of busbar forming portions corresponding to the plurality of busbars, and a concave portion for forming a concave portion which opens to the first surface side in a portion corresponding to the surrounding portion before or after the slit forming step. A forming step, a coating step of coating a coating containing an insulating resin on the entire area of the inside of the slit and on the first surface of the bus bar assembly forming area, and coating in the coating step A curing step of curing the applied paint, a peeling step of forming the first surface side central opening in the insulating resin layer on the first surface of the bus bar assembly forming region, and a step of removing the bus bar assembly from the conductive metal flat plate. A method of manufacturing a bus bar assembly including a cutting step of cutting.

  In order to achieve the second object, a ninth aspect of the present invention is directed to a ninth aspect of the present invention, wherein a plurality of busbars formed of a conductive plate-like member and arranged in the same plane with a gap between each other, A connecting portion that is filled in a gap and mechanically connects the plurality of bus bars in an electrically insulated state; and a first bus bar connected body formed by connecting the plurality of bus bars by the connecting portion. An insulating resin layer including a first surface side laminated portion provided on a surface, wherein the plurality of busbars are exposed via a first surface side central opening of the first surface side laminated portion at the center in plan view. A central portion including the exposed region; and a peripheral portion surrounding the central portion in a plan view, the peripheral portion being covered by the first surface side laminated portion, and the central portion opens to the first surface side. Manufacturing of recessed busbar assemblies A step of preparing a conductive metal flat plate having a busbar assembly forming region for forming the plurality of busbars, and providing the busbar assembly forming region with a first surface on one side in the thickness direction and a first surface on the other side in the thickness direction. Forming one or a plurality of slits penetrating between two surfaces and having the same width as the gap to define a plurality of busbar formation sites corresponding to the plurality of busbars; Before or after, a recess forming step of forming a recess opening on the first surface side at a portion corresponding to the central portion, and a paint containing an insulating resin in the slit and on the entire first surface of the bus bar assembly forming region. A coating step of coating the coating, a curing step of curing the coating applied in the coating step, and an insulating resin layer on a first surface of the busbar assembly forming region. A peeling step of forming said first surface side central opening, to provide a method of manufacturing a bus bar assembly comprising a cutting step of cutting the bus bar assembly from the conductive metal plates.

  In various configurations of the manufacturing method according to the present invention, preferably, the conductive metal flat plate is arranged in series along a longitudinal direction of the slit, and has a plurality of the bus bar forming regions connected by a connecting region. It is assumed.

  According to the busbar assembly according to the present invention, a plurality of busbars formed of a conductive plate-shaped member and arranged in the same plane with a gap between them, and the plurality of busbars filled in the gap And a first surface provided on a first surface on one side in a plate thickness direction of a bus bar connection body in which the plurality of bus bars are connected by the connection portion. Since it is provided with the insulating resin layer including the laminated portion, downsizing in the vertical direction can be achieved while ensuring electrical insulation between the plurality of bus bars.

  Further, according to the bus bar assembly according to the first aspect of the present invention, the first surface side laminated portion includes a first surface side center that exposes the first surfaces of the plurality of bus bars at a center of the bus bar connected body in a plan view. An opening, a first surface side central covering region covering the first surface of the bus bar coupling body in a region surrounding the first surface side central opening, and a bus bar coupling body in a region surrounding the first surface side central covering region. A first surface side peripheral opening that exposes the first surface, and a first surface side peripheral covering region that covers the first surface of the bus bar connector in a region surrounding the first surface side peripheral opening; A step between the first surface side peripheral opening and the first surface side peripheral covering region seals a semiconductor element mounted on at least one of the plurality of bus bars exposed through the first surface side central opening. Wetting sealing resin to stop Because they act as Mel blocking structure, wherein the plurality of bus bars without producing a frame separate separately, it can be provided with a blocking structure of low cost sealing resin.

  Further, according to the busbar assembly according to the second aspect of the present invention, the first surface-side laminated portion integrally exposes the first surfaces of the plurality of busbars at the center of the busbar connector in a plan view. A surface-side common center opening, and a first-surface-side peripheral-covering region that covers the first surface of the busbar connector in a region surrounding the first-surface-side common center opening; Since the step between the opening and the first surface side peripheral edge covering region acts as a damming structure for damping the sealing resin, the frame is separate from the plurality of busbars and is not manufactured separately. Can be provided with a sealing resin damming structure.

  Further, according to the busbar assembly according to the third aspect of the present invention, in the busbar assembly, the plurality of busbars are exposed at the center in plan view through the first surface side central opening of the first surface side laminated portion. A central portion including the exposed region, a surrounding portion surrounding the central portion in plan view, a surrounding portion covered by the first surface side laminated portion, and a peripheral portion surrounding the surrounding portion in plan view. A peripheral portion covered by the first surface side laminated portion, and the surrounding portion is formed as a concave portion that opens to the first surface side and acts as a blocking structure for the sealing resin. The damping structure of the sealing resin can be provided at low cost without separately manufacturing a frame body separate from the bus bar.

  Further, according to the busbar assembly according to the fourth aspect of the present invention, in the busbar assembly, the plurality of busbars are exposed at the center in plan view via the first surface side central opening of the first surface side laminated portion. A central portion including the exposed region, and a peripheral portion surrounding the central portion in plan view, the peripheral portion being covered by the first surface-side laminated portion, wherein the central portion is located on the side of the first surface. Since the opening is formed as a concave portion and acts as a blocking structure for the sealing resin, it is possible to provide a blocking structure for the sealing resin at a low cost without separately manufacturing a frame body separate from the plurality of bus bars. it can.

  Further, according to the method of manufacturing a bus bar assembly according to the present invention, downsizing in the vertical direction can be achieved while reliably ensuring electrical insulation between the plurality of bus bars. The bus bar assembly can be accurately positioned at the relative position, and the bus bar assembly having the sealing resin damming structure can be efficiently manufactured thereon.

FIG. 1 is a perspective view of a bus bar assembly according to Embodiment 1 of the present invention. FIG. 2 is a plan view of the bus bar assembly according to the first embodiment. FIG. 3 is a bottom view of the bus bar assembly according to the first embodiment. FIG. 4 is a sectional view taken along the line IV-IV in FIG. FIG. 5 is a perspective view of an example of a semiconductor module in which a semiconductor element is mounted on the bus bar assembly according to the first embodiment. FIG. 6 is a longitudinal sectional view of the semiconductor module shown in FIG. 5, showing a state after the semiconductor element is sealed with a sealing resin. FIG. 7 is a plan view of a conductive metal flat plate used when manufacturing the bus bar assembly according to the first embodiment, and shows a state after a slit forming step. 8A is an enlarged view of a portion VIII in FIG. 7, and FIG. 8B is a cross-sectional view taken along a line VIII (b) -VIII (b) in FIG. 8A. FIG. 9 is a plan view of the conductive metal flat plate in a state after a curing step. FIG. 10A is an enlarged view of a portion X in FIG. 9, and FIG. 10B is a cross-sectional view along the line X (b) -X (b) in FIG. FIG. 11 is a plan view of the conductive metal flat plate in a state after a peeling step. FIG. 12A is an enlarged view of a portion XII in FIG. 11, and FIG. 12B is a cross-sectional view taken along a line XII (b) -XII (b) in FIG. FIG. 13 is a plan view of the conductive metal plate after the plating step. FIG. 14 is an enlarged view of a portion XIV in FIG. 13, and FIG. 14B is a cross-sectional view taken along a line XIV (b) -XIV (b) in FIG. 14A. FIG. 15 is a plan view of a bus bar assembly according to a first modification of the first embodiment. FIG. 16 is a perspective view of a bus bar assembly according to a second modification of the first embodiment. FIG. 17 is a perspective view of an example of a semiconductor module in which a semiconductor element is mounted on a bus bar assembly according to a second modification of the first embodiment. FIG. 18 is a longitudinal sectional view of the semiconductor module shown in FIG. 17 and shows a state after the semiconductor element is sealed with a sealing resin. FIG. 19 is a plan view of an example of a semiconductor module in which a semiconductor element is mounted on the bus bar assembly according to Embodiment 2 of the present invention. FIG. 20 is a bottom view of the semiconductor module shown in FIG. FIG. 21 is a sectional view taken along the line XXI-XXI in FIG. 19, and shows a state where the semiconductor element is sealed with a sealing resin. FIG. 22 is a longitudinal sectional view of an example of a semiconductor module in which a semiconductor element is mounted on a bus bar assembly according to a first modification of the second embodiment. FIG. 23 is a longitudinal sectional view of an example of a semiconductor module in which a semiconductor element is mounted on a bus bar assembly according to a second modification of the second embodiment. FIG. 24 is a longitudinal sectional view of an example of a semiconductor module in which a semiconductor element is mounted on a bus bar assembly according to a third modification of the second embodiment. FIG. 25 is a longitudinal sectional view of an example of a semiconductor module in which a semiconductor element is mounted on a bus bar assembly according to a third modification of the first embodiment.

Embodiment 1
Hereinafter, an embodiment of a bus bar assembly according to the present invention will be described with reference to the accompanying drawings.
1 to 3 show a perspective view, a plan view, and a bottom view, respectively, of a bus bar assembly 1A according to the present embodiment.
FIG. 4 is a sectional view taken along line IV-IV in FIG.

As shown in FIGS. 1 to 4, the bus bar assembly 1 </ b> A is a plurality of bus bars formed of a conductive plate member, and is arranged in the same plane with a gap 19 between the side surfaces. It has a plurality of bus bars and an insulating resin layer 30 fixed to the plurality of bus bars.
The bus bar assembly 1A according to the present embodiment has two bus bars of first and second bus bars 10a and 10b as the plurality of bus bars.

As shown in FIG. 4, the first and second busbars 10 a and 10 b have a first surface 11 on one side in the thickness direction and a second surface 12 on the other side in the thickness direction in a longitudinal cross-sectional view along the thickness direction. And opposing side surfaces 13 facing each other, and outer side surfaces 14 facing in opposite directions to each other.
The first and second bus bars 10a and 10b are formed of a conductive metal such as Cu.

FIG. 5 shows a perspective view of an example of a semiconductor module in which a semiconductor element 100 such as an LED is mounted on the bus bar assembly 1A.
In the semiconductor module, one of the first and second bus bars 10a and 10b functions as a positive electrode and the other functions as a negative electrode.
That is, as shown in FIG. 5, a semiconductor element 100 such as an LED is mounted on the first surface 11 of one of the first and second bus bars 10a and 10b (for example, the first bus bar 10a).

FIG. 6 shows a longitudinal sectional view of the semiconductor module.
As shown in FIG. 6, the semiconductor element 100 has first and second electrode layers 101 and 102 on the lower surface on one side in the thickness direction and the upper surface on the other side in the thickness direction, respectively. An element body 105 is provided between 101 and 102.

  In the semiconductor element 100, the first electrode layer 101 is fixed to the first surface 11 of the one bus bar (for example, the first bus bar 10a) in an electrically connected state, and the second electrode layer 102 is electrically connected by wire bonding or the like. It is electrically connected to the first surface 11 of the other bus bar (for example, the second bus bar 10b) via the member 110.

  Specifically, the semiconductor element 100 is die-bonded such that the first electrode layer 101 is electrically connected to a plating layer (not shown) provided on the first surface 11 of the one bus bar, and The second electrode layer 102 is electrically connected to a plating layer (not shown) provided on the first surface 11 of the other bus bar via a wire bonding 110.

Reference numeral 120 in FIG. 6 denotes a seal fixed to the first surface of the bus bar assembly 1A in order to protect components such as the semiconductor element 100 and the electrical connection member 110 mounted on the bus bar assembly 1A. It is a resin stopper layer 120.
The sealing resin layer 120 is made of, for example, a transparent resin such as polyimide, polyamide, or epoxy.

The busbar assembly 1A according to the present embodiment effectively prevents the resin from flowing out when the resin forming the sealing resin layer 120 is applied to the first surface of the busbar assembly 1A and cured. It has a damming structure.
This will be described later.

  The insulating resin layer 30 is formed of a resin having heat resistance and insulating properties, and for example, polyimide, polyamide, epoxy, or the like is preferably used.

  The insulating resin layer 30 is filled in the gap 19 between the opposing side surfaces 13 of the first and second bus bars 10a and 10b to mechanically insulate the first and second bus bars 10a and 10b from each other. 1st surface provided on the 1st surface in the thickness direction of the connecting part 31 which connects the said 1st and 2nd busbars 10a and 10b by the said connecting part 31, and the connection part 31 which connects electrically. And a laminated portion 40.

  According to the busbar assembly 1A having such a configuration, since the first and second busbars 10a and 10b are arranged in the same plane, the size can be reduced as much as possible in the vertical direction (thickness direction). it can.

  Further, since the first and second bus bars 10a and 10b are arranged so as to face each other on the opposite side surface 13, the first bus bar 10a and the second bus bar 10b are arranged opposite to each other in a stacked bus bar assembly in which a plurality of bus bars are vertically stacked. And the area where the second bus bars 10a and 10b face each other can be made as small as possible, thereby effectively preventing a leak current from flowing between the first and second bus bars 10a and 10b. Can be reduced.

  As shown in FIGS. 1, 2, 4, etc., the first surface side laminated portion 40 is configured to connect the first surface 11 of each of the first and second bus bars 10 a, 10 b at the center of the bus bar connector in plan view. A first and a second bus bar central openings 41a and 41b to be exposed, a central covering region 43 covering a first surface of the bus bar connector in a region surrounding the first and second bus bar central openings 41a and 41b, A peripheral opening 45 exposing a first surface of the bus bar connector in a region surrounding the central covering region 43; and a peripheral covering region 47 covering the first surface of the bus bar connector in a region surrounding the peripheral opening 45. ing.

  As shown in FIGS. 5 and 6, an area of the first surface 11 of the first bus bar 10 a exposed through the first bus bar central opening 41 a (hereinafter, referred to as a first bus bar side central exposure area) and the The first electrode layer 101 is electrically connected to one of the areas of the first surface 11 of the second bus bar 10b exposed through the second bus bar center opening 41b (hereinafter, referred to as a second bus bar side center exposed area). The semiconductor element 100 is mounted in a state where the semiconductor element 100 is connected.

  Then, the second electrode layer 102 of the semiconductor device 100 is electrically connected to the other of the first and second bus bar-side central exposed regions via the wire bonding 110.

  The peripheral opening 45 forms a concave portion (groove) that opens to the first surface side in cooperation with the central covering region 43 and the peripheral covering region 47, and the peripheral opening 45 and the peripheral covering region 47 are formed. The step between them forms a damming structure for the sealing resin 120.

  That is, in a bus bar assembly having first and second bus bars, and a semiconductor element mounted on one of the first and second bus bars, a resin forming a sealing resin layer surrounding the semiconductor element is applied. It is necessary to provide a damming structure for preventing the resin from flowing out when the resin is cured.

  For example, a frame is formed separately from the first and second busbars and has a shape surrounding the semiconductor element to be mounted in a plan view, and the frame is fixed to the first and second busbars. Conventional bus bar assemblies exist that form a damming structure.

  However, in this conventional configuration, the frame must be prepared separately from the first and second busbars, and further, an operation of fixing the frame to the first and second busbars is also required. .

  On the other hand, in the bus bar assembly 1A according to the present embodiment, the damming structure of the sealing resin layer 120 can be effectively provided without separately providing the frame.

  In the present embodiment, as shown in FIGS. 3 and 4, the insulating resin layer 30 further includes a second surface-side laminate provided on the second surface on the other side in the thickness direction of the bus bar connector. It has a part 50.

The second surface side laminated portion 50 includes a central opening 51 that exposes the second surface 12 of the first and second bus bars 10a and 10b at the center in a bottom view, and a bus bar connecting body in a region surrounding the central opening 51. And a peripheral covering region 53 that covers the second surface.
In the present embodiment, the central opening 51 has first and second busbar central openings 51a and 51b that expose the second surfaces of the first and second busbars 10a and 10b, respectively.

  In the present embodiment, as shown in FIGS. 1 to 4 and the like, the insulating resin layer 30 further has an outer peripheral surface side laminated portion 55 provided on the outer peripheral surface of the bus bar connector. .

Next, a method of manufacturing the bus bar assembly 1A will be described.
The method of manufacturing the bus bar assembly includes the steps of preparing a conductive metal flat plate 200 having a bus bar assembly forming region 210 having the same thickness as the first and second bus bars 10a and 10b; And a slit forming step of forming a slit 215 penetrating between the first surface 211 on one side and the second surface 212 on the other side in the thickness direction.
As described above, the bus bar assembly 1A according to the present embodiment has the first and second bus bars 10a and 10b as the plurality of bus bars. Therefore, one slit 215 is formed in the bus bar assembly forming area 210.
For example, when manufacturing a bus bar assembly in which three bus bars are arranged in parallel, two slits are formed.

FIG. 7 is a plan view of the conductive metal plate 200 after the completion of the slit forming step.
8A is an enlarged view of a portion VIII in FIG. 7, and FIG. 8B is a cross-sectional view taken along a line VIII (b) -VIII (b) in FIG. 8A.

The slit 215 forms the gap 19 between the opposing side surfaces 13 of the first and second bus bars 10a and 10b in the bus bar assembly 1A, and has the same width as the gap 19.
The width of the gap 40 is determined according to the specifications of the bus bar assembly 1A.

As shown in FIGS. 8A and 8B, in the present embodiment, the conductive metal plate 200 is formed with a pair of busbars facing each other via the slit 215 in the state after the slit forming step. The portions 220a and 220b are connected portions 225 of the conductive metal flat plate 200 located on one side in the longitudinal direction of the slit 215 from the slit 215, and connected portions located on the other side in the longitudinal direction of the slit 215 from the slit 215. It is configured to be kept connected to each other via 226.
With such a configuration, the slit 215 can be formed with high accuracy.

  In the present embodiment, as shown in FIG. 7, the conductive metal flat plate 200 includes a plurality of busbars arranged in series along the X direction in the XY plane where the conductive metal flat plate 200 is located. It has a bus bar row 205 including an assembly forming region 210 and a connecting region 230 connecting between the bus bar assembly forming regions 210 adjacent in the X direction, and performs processing on the plurality of bus bar assembly forming regions 210. It can be done at the same time.

The connection region 230 also functions as the connection portions 225 and 226.
In the embodiment shown in FIG. 7, the bus bar row 205 has five bus bar assembly forming regions 210 arranged in series along the X direction.

In this embodiment, the conductive metal plate 200 has a pair of gripping pieces 207 connected to one side and the other side in the longitudinal direction of the bus bar row 205, respectively. An alignment hole 208 is provided.
It is also possible to arrange the plurality of busbar rows 205 in parallel in the Y direction, and to integrally hold the plurality of busbar rows 205 arranged in parallel in the Y direction by the pair of gripping pieces 207, 207.
According to such a modified configuration, more busbar assemblies 1A can be manufactured simultaneously.

  The manufacturing method may be configured such that the slit 215 is filled with the insulating resin layer 30 after the slit forming step, and the insulating resin layer 30 is provided on the first surface of the bus bar assembly forming region 210. A coating step of applying a coating containing a conductive resin; and a curing step of forming the insulating resin layer 30 by curing the coating applied in the coating step.

FIG. 9 shows a plan view of the conductive metal plate 200 at the time when the curing step is completed.
10A is an enlarged view of a portion X in FIG. 9, and FIG. 10B is a cross-sectional view taken along line X (b) -X (b) in FIG. 10A.

The coating step is performed by, for example, electrodeposition coating using an electrodeposition coating material containing an insulating resin having heat resistance and insulating properties such as polyimide, polyamide, and epoxy.
Alternatively, the coating step can be performed by electrostatic powder coating using the insulating resin powder.
Alternatively, when the filling property of the resin into the slit 215 can be sufficiently ensured, the coating step can be performed by spray coating.

  As shown in FIG. 10 (b), in the present embodiment, the coating step includes, in addition to the connecting portion 31 and the first surface side laminated portion 40, the second surface 212 of the bus bar assembly forming region 210. The second surface side laminated portion 50 is formed thereon, and the outer peripheral surface side laminated portion 55 is formed on the outer surface of the bus bar assembly forming region 210.

  The curing step is performed by heating the coating applied in the coating step at an appropriate temperature.

The manufacturing method has a peeling step of peeling the insulating resin layer 30 in an unnecessary area after the curing step.
The peeling step is configured to provide the first and second bus bar central openings 41a and 41b and the peripheral edge opening 45.

FIG. 11 is a plan view of the conductive metal plate 200 at the time when the peeling step is completed.
FIG. 12A is an enlarged view of a portion XII in FIG. 11, and FIG. 12B is a cross-sectional view taken along line XII (b) -XII (b) in FIG.

  The peeling step can be performed by various methods as long as an unnecessary portion of the insulating resin layer 30 can be peeled, and is suitably performed by, for example, laser processing, shot blasting, or cutting processing.

  As shown in FIG. 12B, in the present embodiment, the peeling step includes the first and second bus bar central openings 41 a and 41 b of the first surface side laminated portion 40, the peripheral edge opening 45, The processing includes forming the first and second bus bar center openings 51a and 51b of the second surface side laminated portion 50.

  The manufacturing method further includes a plating step of forming a plating layer 60 on the exposed regions of the pair of busbar forming portions 220a and 220b after the peeling step.

FIG. 13 is a plan view of the conductive metal flat plate 200 after the completion of the plating step.
FIG. 14A is an enlarged view of a portion XIV in FIG. 13, and FIG. 14B is a cross-sectional view taken along line XIV (b) -XIV (b) in FIG.

  In the manufacturing method, further, after the plating step, the pair of busbar forming portions 220a and 220b facing each other with the slit 215 filled with the insulating resin layer 30 being separated from the conductive metal flat plate 200. There is a cutting step of cutting and taking out the bus bar assembly 1A.

  In the present embodiment, as described above, the pair of busbar forming portions 220a and 220b opposed to each other across the slit 215 is one side of the conductive metal flat plate 200 in the longitudinal direction of the slit 215 from the slit 215. Are connected to each other via a connection portion 225 located at the other side of the slit 215 and a connection portion 226 located at the other longitudinal side of the slit 215 from the slit 215.

  In this case, as shown in FIG. 14, in the cutting step, the conductive metal flat plate 200 is cut along a cutting line 251 set so as to straddle the slit 125 in the width direction on one longitudinal side of the slit 215. A process of cutting in the thickness direction, and a process of cutting the conductive metal flat plate 200 in the thickness direction along a cutting line 252 set so as to straddle the slit 215 in the width direction on the other longitudinal side of the slit 215. Is included.

  According to the manufacturing method having such a configuration, the bus bar assembly 1A according to the present embodiment can be manufactured efficiently.

  That is, in the manufacturing method, while the relative positions of the pair of busbar forming portions 220a, 220b forming the first and second busbars 10a, 10b remain fixed, the pair of busbar forming portions 220a, 220b are kept. The slit 215 is filled with the connecting portion 31 and the first surface side laminated portion 40 is provided on the first surface of the pair of bus bar forming portions 220a and 220b, and thereafter, the first surface side laminated portion 40 is provided. Unnecessary portions of the laminated section 40 are removed.

  In this state, the pair of busbar forming portions 220a and 220b are cut from the first conductive metal plate 200 while being mechanically connected by the connecting portion 31, thereby manufacturing the busbar assembly 1A. .

  Therefore, the first and second bus bars 10a and 10b are bus bar assemblies 1A in which the first and second bus bars 10a and 10b are accurately positioned at desired relative positions while ensuring electrical insulation between the first and second bus bars 10a and 10b. Thus, the bus bar assembly 1A having the blocking structure for the sealing resin 120 can be efficiently and inexpensively manufactured.

  Note that, in the manufacturing method, the entire surface of the first surface of the bus bar forming region 210 is coated with an insulating resin by the coating process, and the insulating resin is hardened by the curing process to form the first portion of the bus bar forming region 210. After the insulating resin layer 30 is formed on the entire surface, unnecessary portions of the insulating resin layer 30 are peeled by the peeling step.

  Instead of this, in addition to filling the gap between the slits 215 with the coating, the coating is performed such that the coating is applied only to a necessary area of the first surface of the bus bar forming area 210. Deformation is also possible.

Such a modified manufacturing method includes, for example, masking a region corresponding to the first and second bus bar central openings 41 a and 41 b and the first surface side peripheral edge opening 45 on the first surface of the bus bar forming region 210. In this state, the coating can be performed by applying the paint to the first surface of the bus bar forming region 210.
In the modified manufacturing method, the peeling step is omitted.

  Further, in the present embodiment, the first surface side laminated portion 40 individually exposes the first surfaces of the first and second bus bars 10a and 10b at the center of the bus bar connected body in a plan view. It has central openings 41a and 41b for the first and second bus bars, but instead of the central openings 41a and 41b for the first and second bus bars, the first and second bus bars are arranged at the center in plan view of the connected bus bar. It is also possible to provide a common central opening 41 for integrally exposing the first surfaces of the bus bars 10a, 10b.

FIG. 15 is a plan view of a bus bar assembly 1B according to a modification including the common center opening 41.
The second surface side laminated portion 50 also integrally exposes the second surfaces of the first and second bus bars 10a and 10b instead of the first and second bus bar central openings 51a and 51b. It can be modified to have a common central opening (not shown).

It is also possible to make a modification so as to delete the central covering region 43 in the first surface side laminated portion 40.
FIG. 16 is a perspective view of a busbar assembly 1C according to a second modification of the present embodiment, from which the central covering region 43 has been deleted.
FIG. 17 is a perspective view of an example of a semiconductor module in which a semiconductor element 100 such as an LED is mounted on the bus bar assembly 1C.
FIG. 18 is a longitudinal sectional view of the semiconductor module.
In the drawings, the same members as those in the present embodiment are denoted by the same reference numerals.

The second modified example 1C has a first surface side laminated portion 40C instead of the first surface side laminated portion 40 as compared with the first embodiment 1A.
The first surface side laminated portion 40C includes a common central opening 41 that integrally exposes the first surfaces 11 of the first and second bus bars 10a and 10b at the center in plan view of the bus bar connected body, and A peripheral covering area 47 covering the first surface of the bus bar connector so as to surround the common center opening 41;
Also in the second modification, the same effect as in the present embodiment can be obtained.

Embodiment 2
Hereinafter, another embodiment of the bus bar assembly according to the present invention will be described with reference to the accompanying drawings.
In the drawings of the present embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be appropriately omitted.

19 and 20 are a plan view and a bottom view, respectively, of a semiconductor module in which the semiconductor element 100 and the wire bonding 110 are mounted on the bus bar assembly 2A according to the present embodiment.
FIG. 21 is a cross-sectional view taken along the line XXI-XXI in FIG. 19 and shows a state where the sealing resin 120 is provided.

  The busbar assembly 1A according to the first embodiment is configured such that the insulating resin layer 30 does not exist in a predetermined region on the first surface, and a step caused by the presence or absence of the insulating resin layer 30 is sealed. It is used as a damping recess (groove) of the resin 120.

  On the other hand, the bus bar assembly 2A according to the present embodiment is configured such that the first surface of the peripheral portion of the bus bar connected body is located at the reference position in the plate thickness direction and the portion adjacent to the peripheral portion radially inward of the peripheral portion. By forming the first surface on the other side in the axial direction from the reference position in the plate thickness direction, a damming recess (groove) of the sealing resin 120 is formed.

  Specifically, as shown in FIGS. 19 to 21, the busbar assembly 2A includes first and second busbars 10a and 10b arranged in the same plane with a gap 19 therebetween, and the first and second busbars 10a and 10b. And an insulating resin layer 35 fixed to the second bus bars 10a and 10b.

The insulating resin layer 35 has the connecting part 31 and the first surface side laminated part 70.
The first surface side laminated portion 70 includes a central opening 41 that exposes the first surface 11 of the first and second busbars 10a and 10b at the center in a plan view, and a busbar connection body in a region surrounding the central opening 41. And a peripheral covering area 47 that covers the first surface.

As shown in FIGS. 19 and 21, in the present embodiment, the center opening 41 has a first bus bar center opening 41a and a second bus bar center opening 41b.
Alternatively, the central opening 41 may be modified to have a common central opening that integrally exposes the first surfaces of the first and second bus bars 10a and 10b.

Note that, in the bus bar assembly 2A, the insulating resin layer 35 has the second surface side laminated portion 50 as in the first embodiment.
In the present embodiment, the second surface side laminated portion 50 has the first and second bus bar center openings 51a and 51b, but instead, the second surface side laminated portion 50 The first and second bus bars 10a and 10b may be modified to have a common central opening that integrally exposes the second surfaces of the first and second bus bars 10a and 10b.

  As shown in FIG. 21, in the present embodiment, the first surface of the first and second busbars 10 a and 10 b is connected to the busbar connector via the central opening 41 of the first surface-side laminated portion 70. A central portion 80 including the exposed exposed region 82, a surrounding portion 85 surrounding the central portion 80 in plan view, and the surrounding portion 85 covered by the first surface side laminated portion 70; A concave portion that surrounds the surrounding portion 85 and has a peripheral portion 90 that is covered by the first surface-side laminated portion 70, and the surrounding portion 85 opens upward (the first surface side); Have been.

  According to the bus bar assembly 2 </ b> A according to the present embodiment having such a configuration, a step between the surrounding portion 85 and the peripheral edge portion 90 forms a damming structure for the sealing resin 120.

In the present embodiment, as shown in FIGS. 19 and 21, the central portion 80 surrounds the exposed region 82 in plan view, in addition to the exposed region 82, and It has a central covering area 84 covered by 70.
Alternatively, as in a modification 2B shown in FIG. 22, the entire region of the central portion 80 can be the exposed region 82.

  The bus bar assembly 2A according to the present embodiment includes a step of preparing a conductive metal flat plate having a bus bar assembly forming region for forming the first and second bus bars 10a and 10b; A slit forming step of forming a slit penetrating between the first surface on one side and the second surface on the other side in the thickness direction and having the same width as the gap 19, before or after the slit forming step, A central portion 80 including an exposed region 82 exposed through the surface-side central opening 41, a surrounding portion 85 surrounding the central portion 80 in plan view, and a peripheral portion 90 surrounding the surrounding portion 85 in plan view are defined. Forming a recess that opens to the first surface side in a portion corresponding to the surrounding portion 85 in the busbar assembly formation region, A coating step of coating a coating containing an insulating resin in the slit and the entire area on the first surface of the busbar assembly forming area; a curing step of curing the coating applied in the coating step; Efficiently manufactured by a manufacturing method including a peeling step of forming the first surface side central opening 41 in the insulating resin layer 35 on the first surface and a cutting step of cutting the bus bar assembly from the conductive metal plate. can do.

  The recess forming step is preferably performed by, for example, press working, etching working or cutting working.

  In the manufacturing method, in addition to the filling of the paint in the slit, the coating step is configured to apply the paint to the entire first surface of the busbar assembly forming region. Alternatively, in addition to filling the slit with the paint, the coating step may apply the paint only to a region other than the first surface side central opening 41 on the first surface of the bus bar assembly forming region. In addition, it is also possible to deform. In this case, the peeling step is omitted.

  In addition, the manufacturing method includes the coating step after the slit forming step and the concave part forming step. This is to effectively prevent unintended peeling of the insulating resin layer 35. is there.

That is, in theory, after the coating step and the curing step, the slit forming step and the concave part forming step can be performed. In this case, however, the slit forming step and the concave part forming step may be performed. At this time, there is a possibility that the insulating resin layer is unintentionally peeled off.
In consideration of this point, it is preferable to perform the coating step after the slit forming step and the concave part forming step.

Further, in the present embodiment, the surrounding portion 85 is formed as a concave portion. Alternatively, the surrounding portion 85 may be modified such that the central portion 80 is formed as a concave portion.
FIG. 23 shows a vertical sectional view of such a modified example 2C.

  As shown in FIG. 23, in the bus bar assembly 2 </ b> C according to the modified example, the bus bar connected body is disposed at the center in a plan view via the first surface side central opening 41 of the first surface side laminated portion 70. A central portion 80 including an exposed region 82 where the first surfaces of the second busbars 10a and 10b are exposed, and a peripheral portion 90 surrounding the central portion 80 in a plan view. The central portion 80 is a concave portion that opens upward.

  In Modification 2C, the step between the central portion 80 and the peripheral edge portion 90 forms a damming structure for the sealing resin 120.

  In the modified example 2C, the entire area of the central portion 80 is the exposed region 82. However, instead of this, as in modified example 2D shown in FIG. It is also possible to configure so as to have a region 82 and a central covering region 84 that surrounds the exposed region 82 in plan view and is covered by the first surface side laminated portion 70.

  The bus bar assembly 2C according to the modified example includes a step of preparing a conductive metal flat plate having a bus bar assembly forming region for forming the first and second bus bars 10a and 10b; Forming a slit penetrating between the first surface and the second surface on the other side in the thickness direction and having the same width as the gap 19, before or after the slit forming step, The central portion 80 of the busbar assembly forming region is defined so that a central portion 80 including an exposed region 82 exposed through the central opening 41 and a peripheral portion 90 surrounding the central portion 80 in plan view are defined. Forming a concave portion that opens to the first surface side at a portion corresponding to A coating step of coating a coating containing an insulating resin on the entire surface of the surface, a curing step of hardening the coating applied in the coating step, and an insulating resin layer on a first surface of the bus bar assembly forming region. It can be efficiently manufactured by a manufacturing method including a peeling step of forming the first surface side central opening 41 and a cutting step of cutting the bus bar assembly 2C from the conductive metal flat plate.

  In each of the above-described embodiments and modifications, the second surface 12 of the first and second bus bars 10a and 10b is flush with each other. 10b, a convex region 15 extending outward from the central opening 51 of the second-surface-side laminated portion 50 can be provided.

  FIG. 25 is a longitudinal sectional view of a semiconductor module including a bus bar assembly 1D according to a modified example in which the convex region 15 is added to the bus bar assembly 1A according to the first embodiment.

  The convex region 15 is configured such that the second surface 12 is flush with the outer surface of the second surface side laminated portion 50 or is located outside the outer surface of the second surface side laminated portion 50. Is done.

  According to such a modification 1D, when the wire bonding 110 and the like are attached by ultrasonic welding, the ultrasonic welding jig is securely brought into close contact with the convex regions 15 of the first and second bus bars 10a and 10b. Thus, ultrasonic welding can be performed efficiently.

  When the convex region 15 is provided, the outer surface of the convex region 15 is the lowermost surface on the second surface side of the bus bar assembly 1D. Therefore, when the second surface side of the bus bar assembly 1D is to be installed at a predetermined location with the installation surface as the installation surface, the installation surface of the bus bar assembly 1D (the outer surface of the convex region 15) and the semiconductor element 100 in the bus bar assembly 1D. The parallelism between the mounting surface (the first surface 11 of one of the first and second busbars 10a and 10b) can be favorably maintained.

  That is, in the bus bar assembly in which the outer surface of the second surface side laminated portion 50 is the lowermost surface on the second surface side, the installation surface is the insulating resin layer 30 (second surface side laminated portion 50). In addition, the parallelism between the mounting surface and the mounting surface of the semiconductor element 100 (the first surface 11 of the first and second bus bars 10a and 10b) is likely to vary.

  On the other hand, in the modified example 1D, since the convex regions 15 of the first and second bus bars 10a and 10b form an installation surface, a space between the installation surface and the mounting surface of the semiconductor element 100 is formed. Good parallelism can be maintained.

  In particular, when the semiconductor element 100 is an LED, the optical axis is adjusted in a state of a semiconductor module in which the semiconductor element 100 is mounted on the bus bar assembly 1D. However, the mounting surface of the bus bar assembly 1D and the semiconductor element 100 If the degree of parallelism with the mounting surface is well maintained, the optical axis adjustment can be performed efficiently.

When the convex region 15 is provided, the distance D between the opposing side surfaces between the convex regions 15 of the first and second bus bars 10a and 10b is configured to be larger than the width of the gap 19. Is preferred.
With such a configuration, it is possible to effectively prevent the occurrence of a leak current between the convex regions 15 while obtaining the effect of increasing the efficiency of ultrasonic welding.

  Further, in each of the embodiments and the modified examples, the case where the two bus bars of the first and second bus bars 10a and 10b are arranged in parallel has been described as an example, but the present invention is limited to such a configuration. However, this also includes the case where three or more bus bars are arranged in parallel.

1A to 2D Bus bar assembly 10a, 10b First and second bus bar 15 Convex region 19 Gap 30 Insulating resin layer 31 Connecting portion 40, 40C First surface side laminated portion 41 First surface side common central opening 41a, 41b First And the second busbar central opening 43, the first surface side central covering region 45, the first surface side peripheral edge opening 47, the first surface side peripheral covering region 50, the second surface side laminated portion 51, the second surface side central opening 80, the central portion 82, and the exposed region. 84 central covering region 85 surrounding portion 90 peripheral portion 200 conductive metal plate 210 bus bar forming region 230 connecting region 215 slit

Claims (16)

A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. Prepared,
The first-surface-side laminated portion includes a first-surface-side central opening that exposes first surfaces of the plurality of busbars in a center of the busbar connector in a plan view, and a busbar in a region surrounding the first-surface-side central opening. A first surface-side central covering region that covers the first surface of the connector, a first surface-side peripheral opening that exposes the first surface of the busbar connector in a region surrounding the first surface-side central covering region, A busbar assembly, comprising: a first surface side peripheral covering region that covers a first surface of the busbar connection body in a region surrounding the one surface side peripheral opening. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. Prepared,
The first-surface-side laminated portion includes a first-surface-side common central opening that integrally exposes the first surfaces of the plurality of bus bars at a center of the busbar connected body in a plan view, and a first-surface-side common central opening. A busbar assembly comprising: a first-surface-side peripheral-covering region that covers a first surface of the busbar connector in a surrounding region. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. Prepared,
The bus bar connected body includes a central portion including an exposed region in which the plurality of bus bars are exposed through a first surface side central opening of the first surface side laminated portion at a center in a plan view, and the central portion in a plan view. A surrounding part, which is a surrounding part that is covered by the first surface-side laminated part, and a peripheral part that surrounds the surrounding part in plan view, and is a peripheral part that is covered by the first surface-side laminated part. Including
A bus bar assembly, wherein the surrounding portion is a concave portion that opens toward the first surface. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. Prepared,
The bus bar connected body includes a central portion including an exposed region in which the plurality of bus bars are exposed through a first surface side central opening of the first surface side laminated portion at a center in a plan view, and the central portion in a plan view. A surrounding edge portion, and a peripheral portion covered by the first surface side laminated portion;
The bus bar assembly according to claim 1, wherein the central portion is a concave portion that opens toward the first surface.   5. The bus bar assembly according to claim 3, wherein the central portion is the exposed region that is entirely exposed through the first surface side central opening. 6.   The said central part has the center covering area which surrounds the said exposed area in planar view and was covered with the said 1st surface side laminated part in addition to the said exposed area. Busbar assembly as described in   The bus bar according to claim 1, wherein the first surface side central opening has a plurality of individual central openings that respectively expose the first surfaces of the plurality of bus bars. Assembly.   7. The bus bar according to claim 1, wherein the first surface side central opening has a common central opening that integrally exposes the first surfaces of the plurality of bus bars. Assembly. The insulating resin layer has a second surface side laminated portion provided on the second surface on the other side in the thickness direction of the bus bar connected body,
The second surface side laminated portion includes a second surface side central opening that exposes the second surfaces of the plurality of bus bars, and a second surface covering the second surface of the bus bar connected body in a region surrounding the second surface side central opening. The bus bar assembly according to any one of claims 1 to 8, further comprising a two-side peripheral covering area.   The bus bar assembly according to claim 9, wherein a convex region extending outward through the second surface side central opening is provided on a second surface of the plurality of bus bars. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. The first surface side laminated portion includes a first surface side central opening that exposes the first surfaces of the plurality of bus bars at a center of the bus bar connector in a plan view, and a region surrounding the first surface side central opening. A first surface side center covering region that covers the first surface of the bus bar connector, a first surface side peripheral opening that exposes the first surface of the bus bar connector in a region surrounding the first surface side center covering region, The first surface side peripheral opening A method of manufacturing a first surface side peripheral coating region and to have a bus bar assembly having a covering a first side of the bus bar connecting member in the region surrounding,
A step of preparing a conductive metal flat plate having a bus bar assembly forming area for forming the plurality of bus bars,
In the busbar assembly forming region, one or more slits penetrating between the first surface on one side in the thickness direction and the second surface on the other side in the thickness direction and having the same width as the gap are formed, and A slit forming step of defining a plurality of busbar forming portions corresponding to the busbars,
A coating step of coating a coating containing an insulating resin on the entire area on the first surface of the slit and the busbar assembly forming area,
A curing step of curing the paint applied in the coating step,
An unnecessary portion of the insulating resin layer on the first surface of the busbar assembly forming region is peeled off, and the first surface side central opening, the first surface side central covering region, the first surface side peripheral opening, and the A peeling step of forming a one-side peripheral coating area,
A cutting step of cutting the bus bar assembly from the conductive metal flat plate. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. The first surface side laminated portion includes a first surface side central opening that exposes the first surfaces of the plurality of bus bars at a center of the bus bar connector in a plan view, and a region surrounding the first surface side central opening. A first surface side center covering region that covers the first surface of the bus bar connector, a first surface side peripheral opening that exposes the first surface of the bus bar connector in a region surrounding the first surface side center covering region, The first surface side peripheral opening A method of manufacturing a first surface side peripheral coating region and to have a bus bar assembly having a covering a first side of the bus bar connecting member in the region surrounding,
A step of preparing a conductive metal flat plate having a bus bar assembly forming area for forming the plurality of bus bars,
In the busbar assembly forming region, one or more slits penetrating between the first surface on one side in the thickness direction and the second surface on the other side in the thickness direction and having the same width as the gap are formed, and A slit forming step of defining a plurality of busbar forming portions corresponding to the busbars,
A coating step of applying a coating containing an insulating resin to a portion corresponding to the first surface side central coating region and the first surface side peripheral coating region in the slit and the first surface of the bus bar assembly forming region,
A curing step of curing the paint applied in the coating step to form the connection portion and the first surface side laminated portion;
A cutting step of cutting the bus bar assembly from the conductive metal flat plate. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. A first surface side common center opening for integrally exposing first surfaces of the plurality of bus bars at a center of the bus bar connected body in a plan view; and a first surface side common center. A method of manufacturing a bus bar assembly, comprising: a first surface side peripheral edge covering region covering a first surface of the bus bar connected body in a region surrounding an opening;
A step of preparing a conductive metal flat plate having a bus bar assembly forming area for forming the plurality of bus bars,
In the busbar assembly forming region, one or more slits penetrating between the first surface on one side in the thickness direction and the second surface on the other side in the thickness direction and having the same width as the gap are formed, and A slit forming step of defining a plurality of busbar forming portions corresponding to the busbars,
A coating step of coating a coating containing an insulating resin on the entire area on the first surface of the slit and the busbar assembly forming area,
A curing step of curing the paint applied in the coating step,
An exfoliating step of exfoliating an unnecessary portion of the insulative resin layer on the first surface of the bus bar assembly forming region to form the first surface side common central opening and the first surface side peripheral coating region;
A cutting step of cutting the bus bar assembly from the conductive metal flat plate. A plurality of busbars formed of a conductive plate-like member and arranged in the same plane with a gap between them, and the first and second busbars filled in the gap and electrically insulated from each other An insulating resin including a first surface side laminated portion provided on a first surface on one side in a plate thickness direction of a bus bar connected body formed by connecting the plurality of bus bars by the connecting portion; A central portion including an exposed area where the plurality of busbars are exposed through the first surface side central opening of the first surface side laminated portion at the center in plan view, and surrounding the central portion in plan view. A surrounding part, which is a surrounding part covered by the first surface side laminated part, and a peripheral part surrounding the surrounding part in plan view, the peripheral part covered by the first surface side laminated part. And the surrounding part is on the side of the first surface. A method of manufacturing a bus bar assembly which is a Ku recess,
A step of preparing a conductive metal flat plate having a bus bar assembly forming area for forming the plurality of bus bars,
In the busbar assembly forming region, one or more slits penetrating between the first surface on one side in the thickness direction and the second surface on the other side in the thickness direction and having the same width as the gap are formed, and A slit forming step of defining a plurality of busbar forming portions corresponding to the busbars,
Before or after the slit forming step, a concave part forming step of forming a concave part that opens to the first surface side at a site corresponding to the surrounding part,
A coating step of coating a coating containing an insulating resin on the entire area on the first surface of the slit and the busbar assembly forming area,
A curing step of curing the paint applied in the coating step,
A peeling step of forming the first surface-side central opening in the insulating resin layer on the first surface of the bus bar assembly formation region;
A cutting step of cutting the bus bar assembly from the conductive metal flat plate. A plurality of busbars formed by a conductive plate-like member and arranged in the same plane with a gap between them, and a plurality of busbars filled in the gap and electrically insulated from each other mechanically; And an insulating resin layer including a first surface side laminated portion provided on a first surface on one side in a thickness direction of a bus bar connected body in which the plurality of bus bars are connected by the connecting portion. A central portion including an exposed region in which the plurality of busbars are exposed through the first surface side central opening of the first surface side laminated portion at the center in plan view, and a peripheral portion surrounding the central portion in plan view. A bus bar assembly including a peripheral portion covered by the first surface side laminated portion, wherein the central portion is a concave portion that opens to the first surface side;
A step of preparing a conductive metal flat plate having a bus bar assembly forming area for forming the plurality of bus bars,
In the busbar assembly forming region, one or more slits penetrating between the first surface on one side in the thickness direction and the second surface on the other side in the thickness direction and having the same width as the gap are formed, and A slit forming step of defining a plurality of busbar forming portions corresponding to the busbars,
Before or after the slit forming step, a concave part forming step of forming a concave part that opens to the first surface side at a position corresponding to the central part,
A coating step of coating a coating containing an insulating resin on the entire area on the first surface of the slit and the busbar assembly forming area,
A curing step of curing the paint applied in the coating step,
A peeling step of forming the first surface-side central opening in the insulating resin layer on the first surface of the bus bar assembly formation region;
A cutting step of cutting the bus bar assembly from the conductive metal flat plate.   The conductive metal plate according to any one of claims 11 to 15, wherein the conductive metal flat plate is arranged in series along a longitudinal direction of the slit, and has a plurality of the busbar forming regions connected by a connecting region. A method for producing a bus bar assembly according to any one of the above.

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