JP2020027828A - Manufacturing device for electronic component - Google Patents

Abstract

To shorten the time required for completion and implement an inspection in the middle of manufacture.SOLUTION: A manufacturing device 100 for an electronic component comprises: a printing stage 42; a printing unit 41 for forming a print by discharging an ink that is a constitutive material of the electronic component, onto the printing stage 42 by an ink jet system; a drying unit 43 for drying the print; an imaging unit 44 for imaging the print from an upper side; and a control unit (inspection unit) 51 for confirming the presence/absence of a defect in the print on the basis of an image of the print picked up by the imaging unit 44. The printing stage 42 is configured movable between a printing position where the printing is performed by the printing unit 41 and a drying position where the drying is performed by the drying unit 43. When it is determined by the control unit 51 that there is a defect, at least one of the printing by the printing unit 41 and the drying by the drying unit 43 is implemented in order to correct a defective part.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component manufacturing apparatus.

  2. Description of the Related Art A technique of manufacturing a three-dimensional product by inkjet printing is known. Patent Literature 1 discloses a pattern forming apparatus that manufactures a color filter or the like by inkjet printing.

JP 2006-239570 A

  Here, when a product is manufactured by the pattern forming apparatus described in Patent Literature 1, it is necessary to repeat a process of printing a predetermined thickness and a process of drying. Therefore, after printing, the printed matter is taken out of the printing stage, transported to the drying chamber, and dried.After drying, the printed matter is taken out of the drying chamber, placed on the printing stage, aligned, and then again. It is necessary to repeat the printing process. Therefore, the manufacturing process becomes complicated, and it takes a long time to complete the product. Further, every time the alignment is performed, there is a possibility that a printing shift occurs.

  Further, in the pattern forming apparatus described in Patent Literature 1, since a defect cannot be detected during the manufacture of a product, the finished product needs to be inspected using another inspection apparatus.

  The present invention has been made to solve the above-described problems, and has an electronic component manufacturing apparatus capable of shortening the time required for completing an electronic component, suppressing printing displacement, and performing inspection during manufacturing. The purpose is to provide.

The electronic device manufacturing apparatus of the present invention includes:
A printing stage,
On the printing stage, a printing unit that forms a printed material by discharging ink that is a constituent material of an electronic component by an inkjet method,
A drying unit for drying the printed matter formed on the printing stage,
An imaging unit for imaging the printed matter from above,
An inspection unit that confirms the presence or absence of a defect in the printed matter based on an image of the printed matter captured by the imaging unit;
With
The printing stage is configured to be movable between a printing position where printing is performed by the printing unit and a drying position where drying is performed by the drying unit,
When the inspection unit determines that there is a defect in the printed matter, it is configured to perform at least one of printing by the printing unit and drying by the drying unit in order to correct the defective portion. Features.

The inspection unit confirms the presence or absence of a printing defect based on an image of the printed matter imaged by the imaging unit while the printing stage moves from the printing position to the drying position. Based on the image of the printed matter imaged by the imaging unit while moving from the drying position to the printing position, it is configured to confirm the presence or absence of a drying defect,
The printing unit is configured to perform printing for correcting a portion of the printing defect when the inspection unit determines that the printing defect is present,
The drying unit may be configured to perform drying again when the inspection unit determines that the drying defect exists, in order to correct the location of the drying defect.

The printing stage includes a first printing stage and a second printing stage,
The drying unit includes a first drying unit and a second drying unit,
The imaging unit includes a first imaging unit for imaging the printed matter on the first printing stage, and a second imaging unit for imaging the printed matter on the second printing stage,
While the printed matter on the first printing stage is being dried by the first drying unit, printing is performed on the second printing stage by the printing unit, and the second drying unit is provided. The printing unit may be configured to perform printing on the first printing stage while drying the printed matter on the second printing stage.

  The printing unit may further include a cleaning unit for cleaning the inkjet head of the printing unit.

  The printing apparatus may further include a thickness measurement sensor for measuring a thickness of a printed matter formed on the printing stage by printing by the printing unit.

  According to the electronic component manufacturing apparatus of the present invention, when it is determined that there is a defect by the inspection unit during the production of the electronic component, in order to correct the defective portion, the printing by the printing unit and the drying by the drying unit are performed. Since it is configured to perform at least one, it is not necessary to inspect the finished product using another inspection device. Further, when a defect is detected during the manufacturing of the electronic component, at least one of the printing process and the drying process is performed so as to correct the defect, so that the defective component can be suppressed from being included in the manufactured electronic component.

  Also, the steps performed by the conventional apparatus, that is, after printing, the step of taking out the printed matter from the printing stage and transporting it to the drying chamber, taking out the printed matter from the drying chamber and placing it on the printing stage, Since the step of performing alignment before printing is not required, the time required for completing the electronic component can be reduced. Further, since the step of performing the alignment is not required, the position between the printing stage and the printed matter does not shift, and the occurrence of the printing shift can be suppressed.

FIG. 2 is a perspective view illustrating an example of a multilayer ceramic capacitor manufactured by the electronic component manufacturing apparatus according to the present invention. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor shown in FIG. 1 along the line II-II. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor shown in FIG. 1 along the line III-III. FIG. 1 is a schematic diagram illustrating a configuration of an electronic component manufacturing apparatus according to an embodiment. It is a side view which shows an example of a structure of a 1st drying unit and a 2nd drying unit typically, (a) shows the state before drying processing, (b) shows the state during drying processing, respectively. It is a side view which shows the schematic structure of a wiping part typically. FIG. 7 is a view for explaining an example of a manufacturing process of the multilayer ceramic capacitor, showing a state in which an outer dielectric layer, and outer layers that become a part of a first external electrode and a second external electrode are formed after firing. It is. FIG. 8 is a diagram illustrating a step that is a part of the manufacturing process of the multilayer ceramic capacitor and is performed after the step illustrated in FIG. 7. FIG. 9 is a diagram illustrating a step that is a part of the manufacturing process of the multilayer ceramic capacitor and is performed after the step illustrated in FIG. 8.

  Hereinafter, embodiments of the present invention will be described, and features of the present invention will be specifically described. Hereinafter, a multilayer ceramic capacitor will be described as an example of an electronic component manufactured by the electronic component manufacturing apparatus according to the present invention. However, the electronic component is not limited to the multilayer ceramic capacitor, and may be another electronic component such as an inductor.

  FIG. 1 is a perspective view showing an example of a multilayer ceramic capacitor 10 manufactured by an electronic component manufacturing apparatus according to the present invention. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 shown in FIG. 1 along the line II-II. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 shown in FIG. 1 along the line III-III.

  As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 10 has a rectangular parallelepiped shape as a whole, and has a multilayer body 11 and a pair of external electrodes 14 (14a, 14b). The pair of external electrodes 14 (14a, 14b) are arranged to face each other as shown in FIG.

  Here, the direction in which the pair of external electrodes 14 face each other is defined as the length direction L of the multilayer ceramic capacitor 10, and the direction in which the internal electrodes 13 (13 a, 13 b) described later are stacked is defined as the thickness direction T. A direction orthogonal to both the L direction and the thickness direction T is defined as a width direction W.

  The laminated body 11 has a first end face 15a and a second end face 15b facing the length direction L, a first main face 16a and a second main face 16b facing the thickness direction T, and a width direction W. It has a first side face 17a and a second side face 17b facing each other.

  A first external electrode 14a is provided on the first end face 15a, and a second external electrode 14b is provided on the second end face 15b.

  The laminate 11 has rounded corners and ridges. Here, the corner portion is a portion where the three surfaces of the laminate 11 intersect, and the ridge line portion is a portion where the two surfaces of the laminate 11 intersect.

  As shown in FIGS. 2 and 3, the laminate 11 includes a dielectric layer 12, a first internal electrode 13a, and a second internal electrode 13b.

The dielectric layer 12 includes an outer dielectric layer 121 located outside the stacked body 11 in the thickness direction, and an inner dielectric layer 122 located between the first internal electrode 13a and the second internal electrode 13b. . The dielectric layer 12 includes a dielectric ceramic containing, for example, barium titanate (BaTiO ₃ ) as a main component. The thickness of the inner dielectric layer 122 is, for example, 1.5 μm. The number of the inner dielectric layers 122 is, for example, 400.

  The first internal electrode 13a extends to the first end face 15a of the multilayer body 11. Further, the second internal electrode 13b is drawn out to the second end face 15b of the multilayer body 11. The first internal electrodes 13a and the second internal electrodes 13b are alternately arranged in the thickness direction T via an inner dielectric layer 122.

  The first internal electrode 13a and the second internal electrode 13b contain, for example, metals such as Ni, Cu, Ag, Pd, and Au, and alloys of Ag and Pd. The first internal electrode 13a and the second internal electrode 13b may further include dielectric particles having the same composition as the ceramic contained in the dielectric layer 12. The thickness of the first internal electrode 13a and the second internal electrode 13b is, for example, 1 μm.

  The first external electrode 14a is formed on the entire first end face 15a of the multilayer body 11. The first external electrode 14a is electrically connected to the first internal electrode 13a.

  The second external electrode 14b is formed on the entire second end face 15b of the multilayer body 11. The second external electrode 14b is electrically connected to the second internal electrode 13b.

  The first external electrode 14a and the second external electrode 14b contain, for example, a metal such as Ni, Cu, Ag, Pd, and Au, and an alloy of Ag and Pd. The first external electrode 14a and the second external electrode 14b may further include a plating layer.

  FIG. 4 is a schematic diagram illustrating a configuration of an electronic component manufacturing apparatus according to one embodiment. The electronic component manufacturing apparatus 100 according to one embodiment includes a printing unit 41, a first printing stage 42, a first drying unit 43, a first imaging unit 44, a second printing stage 45, A second drying unit 46, a second imaging unit 47, a cleaning unit 48, a third imaging unit 49, a thickness measurement sensor 50, and a control unit 51 are provided.

  The printing unit 41 includes a plurality of inkjet heads for discharging ink, a plurality of ink tanks for storing ink, and the like. In the present embodiment, the printing unit 41 includes four inkjet heads and four ink tanks. However, the numbers of the ink jet heads and the ink tanks are not limited to four.

  The four ink tanks store the dielectric layer ink, the internal electrode ink, the external electrode ink, and the disappearing material ink. The dielectric layer ink is an ink for forming the dielectric layer 12 described above. The internal electrode ink is an ink for forming the first internal electrode 13a and the second internal electrode 13b described above. The external electrode ink is an ink for forming the first external electrode 14a and the second external electrode 14b described above. The disappearing material ink is an ink that disappears by baking, and is used to form rounded corners and ridges of the laminate 11.

  The four ink-jet heads respectively discharge the inks stored in the four ink tanks, that is, the ink for the dielectric layer, the ink for the internal electrode, the ink for the external electrode, and the ink for disappearing material by an ink-jet method.

  The speed of the ink droplet ejected from each inkjet head is, for example, 6 m / s. In addition, the ink ejection distance, that is, the distance from the bottom surface of each inkjet head to the surface on which the printed matter 30 is formed is preferably, for example, 0.5 mm or less. Further, the temperature of each inkjet head is preferably set to, for example, 25 ° C.

  The printing unit 41 is configured to be movable in the Y-axis direction and the Z-axis direction shown in FIG. The printing unit 41 forms the printed matter 30 by discharging ink onto the first printing stage 42 and the second printing stage 45. The ink may be directly discharged onto the first printing stage 42 and the second printing stage 45, or may be a substrate (not shown) mounted on the first printing stage 42 and the second printing stage 45. May be ejected on the surface. The substrate is, for example, a PET film. That is, in the present invention, the term “discharge ink on the printing stage” includes a case where ink is discharged onto a substrate on the printing stage.

  The printed material 30 constitutes an unfired structure that becomes the multilayer ceramic capacitor 10 after firing. A plurality of printed materials 30 can be formed on the base material on the first printing stage 42 and the second printing stage 45.

  The third imaging unit 49 is configured to be movable in the Y-axis direction. In order to recognize the positions of the first printing stage 42 and the second printing stage 45, the third imaging unit 49 Is imaged from above the print stage 45. For example, the first printing stage 42 and the second printing stage 45 are each provided with an alignment mark, and are based on the positions of the alignment marks in the captured images of the first printing stage 42 and the second printing stage 45. Thus, the positions of the first printing stage 42 and the second printing stage 45 can be recognized.

  The thickness measuring sensor 50 is configured to be movable in the Y-axis direction. For example, the thickness measuring sensor 50 measures the thickness of the printed matter 30 by transmitting a laser beam to the printed matter 30 and receiving reflected light. When the thickness of the printed matter 30 measured by the thickness measurement sensor 50 is smaller than, for example, a predetermined thickness, the control unit 51 controls the printing unit 41 to perform printing again.

  The printing unit 41, the first drying unit 43, and the second drying unit 46 are arranged side by side in the X-axis direction shown in FIG. Specifically, the second drying unit 46 is disposed on the opposite side of the printing unit 41 from the first drying unit 43. Here, the position where printing is performed by the printing unit 41 is called a printing position, and the position where drying is performed by the first drying unit 43 and the position where drying is performed by the second drying unit 46 are called a drying position. .

  The first printing stage 42 is configured to be movable in the X-axis direction. More specifically, the first printing stage 42 is configured to be movable between a printing position and a drying position where drying is performed by the first drying unit 43. The first printing stage 42 is configured to be rotatable about its own center on the XY plane.

  5A and 5B are side views schematically illustrating an example of the configuration of the first drying unit 43. FIG. 5A illustrates a state before the drying processing, and FIG. 5B illustrates a state during the drying processing. Each is shown. However, in FIG. 5, the base material arranged between the first printing stage 42 and the printed material 30 is omitted.

  The first drying unit 43 is a unit for drying the printed matter 30 formed on the first printing stage 42, and is configured to be movable in a vertical direction (Z-axis direction). The first drying unit 43 includes a lid-shaped sealing portion 431, an infrared heater 432 arranged on the inner surface side of the sealing portion 431, and a pipe portion 433. One end of the pipe portion 433 is connected to the vicinity of the center of the sealing portion 431, and the other end is connected to an air suction device (not shown) to constitute a pressure reducing mechanism.

  When the printed matter 30 on the first printing stage 42 is dried, the first drying unit 43 descends until it comes into contact with the first printing stage 42 as shown in FIGS. 5A and 5B. When the first drying unit 43 descends until it comes into contact with the first printing stage 42, a closed space is formed inside the closed portion 431. Note that an elastic body, for example, an O-ring is provided on a peripheral edge of a lower end of the sealing portion 431 of the first drying unit 43.

  In a state where the sealed space is formed inside the sealed portion 431, the pressure in the sealed space is reduced by sucking air in the sealed space through the pipe portion 433, and the inside of the sealed space is heated by the infrared heater 432. Perform drying. However, drying may be performed by heating with an infrared heater 432 without depressurizing the inside of the sealed space, or drying may be performed by depressurizing the sealed space without heating with the infrared heater 432.

  In addition, the drying method of the printed matter 30 is not limited to the drying method described above. For example, hot air may be sent to the printed matter 30 to dry it. The printed matter 30 on the first printing stage 42 may be dried by adjusting the temperature so that the first printing stage 42 has a predetermined temperature. For example, a hot water supply pipe is provided at a position close to the first printing stage 42, and hot water at a predetermined temperature is supplied into the hot water supply pipe to adjust the temperature of the first printing stage 42 to a predetermined temperature. be able to.

  The first imaging unit 44 is arranged between the printing unit 41 and the first drying unit 43, and images the printed matter 30 on the first printing stage 42 from above.

  In the present embodiment, in order to produce an unfired structure that becomes the multilayer ceramic capacitor 10 after firing, when the printing unit 41 finishes printing one layer on the first printing stage 42, the first drying unit At 43, the printed matter is dried. By repeating printing and drying of one layer, an unfired structure is produced.

  After printing one layer, the first printing stage 42 passes through a position below the first imaging unit 44 while moving from the printing position to the drying position. The first imaging unit 44 images the printed matter formed by printing from above. Note that the first imaging unit 44 may capture an image while the first printing stage 42 is moving from the printing position to the drying position.

  Further, the first printing stage 42 passes through a position below the first imaging unit 44 during the movement from the drying position to the printing position after the drying process of the printed matter by the first drying unit 43. The first image capturing unit 44 captures an image of the dried printed matter from above. Note that the first imaging unit 44 may capture an image while the first printing stage 42 is moving from the drying position to the printing position.

  The control unit 51 has a function as an inspection unit for confirming the presence or absence of a defect based on the image of the printed matter captured by the first imaging unit 44. That is, the control unit 51 confirms the presence or absence of a printing defect based on the image of the printed matter imaged by the first imaging unit 44 while the first printing stage 42 moves from the printing position to the drying position. . The printing defect is, for example, a defect in which printing is not performed at a predetermined position.

  Further, the control unit 51 confirms the presence or absence of a drying defect based on the image of the printed matter captured by the first imaging unit 44 while the first printing stage 42 moves from the drying position to the printing position. . The drying defect is, for example, a case where the solvent contained in the ink remains in the printed matter when the drying is insufficient, and the image is captured differently from the case where the color tone and the brightness are completely dried.

  When detecting a printing defect, the control unit 51 returns the first printing stage 42 to the printing position, and controls the printing unit 41 to perform printing for correcting the defective portion. When detecting a drying defect, the control unit 51 returns the first printing stage 42 to the drying position, and controls the first drying unit 43 to dry the printed material again.

  The cleaning unit 48 is configured to be movable in the X-axis direction, and periodically cleans the inkjet head of the printing unit 41. The cleaning of the inkjet head is performed, for example, during the drying process by the first drying unit 43 and during the drying process by the second drying unit 46.

  The cleaning unit 48 includes a wiping unit 481 and a suction unit 482.

  FIG. 6 is a side view schematically illustrating a schematic configuration of the wiping unit 481. The wiping unit 481 includes a plurality of wiping rollers 61, an unwinding mechanism 62, a winding mechanism 63, and a wiping member 64. The number of wiping rollers 61 is the same as the number of inkjet heads 411 of the printing unit 41, and is four in the present embodiment.

  At the time of cleaning the printing unit 41, the position adjustment of the printing unit 41 and the cleaning unit 48 is performed so that the inkjet head 411 of the printing unit 41 is positioned vertically above the wiping unit 481 of the cleaning unit 48. More specifically, the position adjustment is performed such that the ink ejection surfaces of the four inkjet heads 411 are pressed against the four wiping rollers 61 via the wiping member 64. In this state, when the cleaning unit 48 moves in the direction of the arrow in FIG. 6 (X-axis direction), dirt such as ink adhered to the ink ejection surface of each inkjet head 411 is wiped by the wiping member 64. .

  Subsequently, the cleaning unit 48 moves in the X-axis direction such that the inkjet head 411 of the printing unit 41 is positioned vertically above the suction unit 482 of the cleaning unit 48. The suction unit 482 has four suction holes, and each suction hole sucks the ink ejection surface of each inkjet head 411, thereby sucking extra ink attached to the ink ejection surface.

  Further, the cleaning unit 48 has a cleaning mechanism for cleaning the suction unit 482. The suction unit 482 is washed by wiping the vicinity of the suction hole of the suction unit 482 with a wiper using, for example, a cleaning agent.

  The cleaning unit 48 only needs to be configured to clean the inkjet head of the printing unit 41, and the configuration is not limited to the above-described configuration.

  The second printing stage 45 is configured to be movable in the X-axis direction and opposite to the first printing stage 42 with respect to the printing unit 41. More specifically, the second printing stage 45 is configured to be movable between a printing position and a drying position where drying is performed by the second drying unit 46.

  The structure of the second drying unit 46 is the same as the structure of the first drying unit 43.

  The second imaging unit 47 is arranged between the printing unit 41 and the second drying unit 46, and takes an image of a printed matter on the second printing stage 45 from above. Specifically, the second imaging unit 47 moves the second printing stage 45 from the printing position to the drying position where the drying process is performed by the second drying unit 46 while the second printing stage 45 is moving. The printed matter formed on 45 is imaged. Further, the second imaging unit 47 moves the second printing stage 45 from the drying position where the drying process is performed by the second drying unit 46 to the printing position while the second printing stage 45 performs the second drying process. The printed matter on the printing stage 45 is imaged.

  The control unit 51 checks the presence or absence of a defect based on the image of the printed matter captured by the second imaging unit 47. When the control unit 51 detects a printing defect of the printed matter, the control unit 51 returns the second printing stage 45 to the printing position, and controls the printing unit 41 to perform printing for correcting the defective portion. When the control unit 51 detects a drying defect of the printed matter, it returns the second printing stage 45 to the drying position and controls the second drying unit 46 to dry the printed matter again.

  In the present embodiment, when printing of one layer is performed by the printing unit 41 on the first printing stage 42, the first printing stage 42 captures the image by the first imaging unit 44 and performs the first drying. It moves to perform drying by the unit 43. When the first printing stage 42 moves away from the printing position, the second printing stage 45 moves to the printing position. Then, printing is performed by the printing unit 41 at the printing position.

  After that, when printing of one layer is completed by the printing unit 41 on the second printing stage 45, the second printing stage 45 picks up the image by the second image pickup unit 47 and drys the image by the second drying unit 46. Go to do. When the second printing stage 45 moves away from the printing position, the first printing stage 42 on which the drying process and the drying defect confirmation process have been performed moves to the printing position. Then, printing is performed by the printing unit 41 at the printing position.

  As described above, in the electronic component manufacturing apparatus 100 according to the present embodiment, while printing is being performed on the first printing stage 42, the drying process of the printed matter on the second printing stage 45 and the defect confirmation process Is performed, and while the printing is being performed on the second printing stage 45, the drying process of the printed matter on the first printing stage 42 and the checking process of the defect are performed.

  An example of a method of manufacturing the multilayer ceramic capacitor 10 by the above-described electronic component manufacturing apparatus 100 will be described with reference to FIGS. In the following, an example will be described in which an unsintered structure that becomes the multilayer ceramic capacitor 10 after firing is produced by performing printing on the first printing stage 42, but in the case where printing is performed on the second printing stage 45. The same is true for

  First, printing is performed by the printing unit 41 on the base material 70 on the first printing stage 42 using the disappearing material ink 71, the dielectric layer ink 72, and the external electrode ink 73 (FIG. 7). reference). The region where printing is performed using the disappearing material ink 71 is a region that is disappeared by a subsequent baking process in order to form rounded corners and ridges in the completed laminate 11. The disappearing material ink 71 is an ink that disappears during baking, and includes, for example, carbon. The region where printing is performed using the external electrode ink 73 is a region that forms part of the first external electrode 14a and the second external electrode 14b.

  When the printing of the first layer is performed, the first printing stage 42 moves, so that the first imaging unit 44 captures an image and confirms a printing defect based on the captured image. Drying by the unit 43 is performed. Further, after the drying process, imaging by the first imaging unit 44 and confirmation of a drying defect based on the captured image are performed. Hereinafter, this step is referred to as an imaging / inspection step.

  By repeating the above-described printing process and the imaging / inspection process, as shown in FIG. 7, after firing, the outer dielectric layer 121 and the outer layers that become a part of the first outer electrode 14a and the second outer electrode 14b are formed. 75 are formed.

  Subsequently, as shown in FIG. 8A, printing using ink 73 for external electrodes is performed on both ends of the surface of the outer layer 75. Here, for the sake of simplicity, the region that will later become the first external electrode 14a is referred to as the first external electrode region 73a, and the region that will later become the second external electrode 14b is the second external electrode region 73b. Call.

  Further, as shown in FIG. 8B, printing using the dielectric layer ink 72 on the surface of the outer layer 75 and between the first outer electrode region 73a and the second outer electrode region 73b. Is performed. Thereafter, the above-described imaging / inspection process is performed.

  Subsequently, as shown in FIG. 8C, printing using the internal electrode ink 74 is performed. At this time, the printing is performed such that one end of the printing layer using the internal electrode ink 74 is electrically connected to the first external electrode region 73a. Further, a gap 80 is provided between the other end of the print layer using the internal electrode ink 74 and the second external electrode region 73b. In this step, the layer printed with the internal electrode ink 74 is the layer that becomes the first internal electrode 13a after firing.

  Subsequently, as shown in FIG. 8D, printing using the dielectric layer ink 72 is performed so as to fill the gap 80 described above. Thereafter, the above-described imaging / inspection process is performed.

  Subsequently, as shown in FIG. 9A, printing using the external electrode ink 73 is performed on the surfaces of the first external electrode region 73a and the second external electrode region 73b. Then, as shown in FIG. 9B, printing using the dielectric layer ink 72 is performed between the first external electrode region 73a and the second external electrode region 73b. Thereafter, the above-described imaging / inspection process is performed.

  Subsequently, as shown in FIG. 9C, printing using the internal electrode ink 74 is performed. At this time, the printing is performed such that one end of the printing layer using the internal electrode ink 74 is electrically connected to the second external electrode region 73b. Further, a gap 81 is provided between the other end of the print layer using the internal electrode ink 74 and the first external electrode region 73a. In this step, the layer printed using the internal electrode ink 74 is a layer that becomes the second internal electrode 13b after firing.

  Subsequently, as shown in FIG. 9D, printing using the dielectric layer ink 72 is performed so as to fill the gap 81 described above. Thereafter, the above-described imaging / inspection process is performed.

  By repeating the steps described with reference to FIGS. 8A to 9D a predetermined number of times, after firing, the first internal electrode 13a, the internal dielectric layer 122, and the second internal electrode 13b are formed. A part that becomes a part of the first external electrode 14a and the second external electrode 14b is formed.

  Subsequently, an outer layer is formed on the upper layer portion by the process described with reference to FIG.

  Through the above-described steps, a green structure is manufactured.

  Subsequently, the unfired structure is degreased at 280 ° C., for example, to remove organic components, and further fired. The firing temperature is, for example, 1300 ° C. By firing, the disappearing material ink disappears, and the multilayer ceramic capacitor 10 is obtained.

  According to the electronic component manufacturing apparatus 100 in the above-described embodiment, the control unit 51 determines whether or not there is a defect based on the image of the printed matter captured by the first imaging unit 44 (second imaging unit 47). When it is confirmed and determined that there is a defect, at least one of the printing process by the printing unit 41 and the drying process by the first drying unit 43 (the second drying unit 46) is performed to correct the defective portion. Is configured. That is, since the presence or absence of a defect can be confirmed during the manufacturing of the electronic component, it is not necessary to inspect the finished product using another inspection device. Further, when a defect is detected during the manufacturing of the electronic component, at least one of the printing process and the drying process is performed so as to correct the defect, so that the defective component can be suppressed from being included in the manufactured electronic component.

  Further, according to the electronic component manufacturing apparatus 100 in one embodiment, the steps performed by the conventional apparatus, that is, the steps of taking out the printed matter from the printing stage after carrying out printing and transporting the printed matter to the drying chamber, Since the step of taking out the printed material from the chamber, placing it on the printing stage, and performing positioning before printing is not required, the time required until the electronic component is completed can be reduced. In addition, since the printed material remains mounted on the printing stage, a step of performing alignment is not required, so that the occurrence of printing displacement can be suppressed.

  The control unit 51 is imaged by the first imaging unit 44 (second imaging unit 47) while the first printing stage 42 (second printing stage 45) moves from the printing position to the drying position. In addition to confirming the presence or absence of a printing defect based on the image of the printed matter obtained, the first imaging unit 44 (the second printing stage 45) moves to the printing position from the drying position to the printing position. It is configured to confirm the presence or absence of a drying defect based on the image of the printed material captured by the second imaging unit 47). When it is determined that there is a printing defect, the printing unit 41 performs printing for correcting the defective portion, and when it is determined that there is a drying defect, the first drying unit 43 (the second drying unit 43). 46) is configured to perform the drying process again in order to correct the defective portion. With such a configuration, printing or drying for correcting the defect can be performed according to the type of the defect, so that the presence of the defective product in the manufactured electronic component can be more effectively suppressed. .

  The electronic component manufacturing apparatus 100 according to the embodiment described above includes two printing stages, two drying units, and two imaging units, and the first drying unit 43 dries printed matter on the first printing stage 42. Is performed on the second printing stage 45 by the printing unit 41 while the printing on the second printing stage 45 is performed by the second drying unit 46. , The printing unit 41 performs printing on the first printing stage 42. With such a configuration, the productivity of electronic components can be improved.

  Here, the printing unit 41 performs a flushing process of periodically discharging the ink from the inkjet head in order to suppress drying of the ink and the like. As described above, the electronic component manufacturing apparatus 100 according to the embodiment includes the first print stage 42 and the second print stage 45, and performs printing alternately to reduce the print standby time of the printing unit 41. Therefore, wasteful ink consumption due to the flushing process can be suppressed.

  In addition, since the electronic component manufacturing apparatus 100 according to the embodiment includes the cleaning unit 48 that cleans the inkjet head of the printing unit 41, print quality can be maintained even when printing is performed for a long time. In addition, since the cleaning of the ink jet head is performed during the drying process by the first drying unit 43 (the second drying unit 46), the cleaning can be performed by effectively using the print standby time, and the productivity is reduced. The print quality can be maintained without causing the print quality to be reduced.

  Further, the electronic component manufacturing apparatus 100 according to one embodiment includes a thickness measurement sensor for measuring the thickness of a printed matter formed on the first printing stage 42 (the second printing stage 45) by printing by the printing unit 41. Since the product 50 is provided, it is possible to detect a defect in which the thickness of the printed matter is different from the predetermined thickness during the manufacture of the product. Therefore, when the thickness of the printed matter is smaller than the predetermined thickness, printing can be performed again, and when the thickness of the printed matter is larger than the predetermined thickness, the defective product can be discarded. Can be improved.

  The present invention is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention.

  In the above-described embodiment, an example has been described in which two printing stages, two drying units, and two imaging units are provided. However, a configuration in which one printing unit, two drying units, and one imaging unit are provided may be used.

Reference Signs List 10 multilayer ceramic capacitor 11 laminate 12 dielectric layer 13a first internal electrode 13b second internal electrode 14a first external electrode 14b second external electrode 41 printing unit 42 first printing stage 43 first drying unit 44 First imaging unit 45 Second printing stage 46 Second drying unit 47 Second imaging unit 48 Cleaning unit 49 Third imaging unit 50 Thickness measurement sensor 51 Control unit 61 Wiping roller 62 Unwinding mechanism 63 Winding Mechanism 64 Wiping member 100 Electronic component manufacturing apparatus

Claims (5)

A printing stage,
On the printing stage, a printing unit that forms a printed material by discharging ink that is a constituent material of an electronic component by an inkjet method,
A drying unit for drying the printed matter formed on the printing stage,
An imaging unit for imaging the printed matter from above,
An inspection unit that confirms the presence or absence of a defect in the printed matter based on an image of the printed matter captured by the imaging unit;
With
The printing stage is configured to be movable between a printing position where printing is performed by the printing unit and a drying position where drying is performed by the drying unit,
When the inspection unit determines that there is a defect in the printed matter, it is configured to perform at least one of printing by the printing unit and drying by the drying unit in order to correct the defective portion. Characteristic electronic component manufacturing equipment. The inspection unit confirms the presence or absence of a printing defect based on an image of the printed matter imaged by the imaging unit while the printing stage moves from the printing position to the drying position. Based on the image of the printed matter imaged by the imaging unit while moving from the drying position to the printing position, it is configured to confirm the presence or absence of a drying defect,
The printing unit is configured to perform printing for correcting a portion of the printing defect when the inspection unit determines that the printing defect is present,
The drying unit according to claim 1, wherein when the inspection unit determines that the drying defect is present, the drying unit performs drying again to correct a location of the drying defect. An electronic component manufacturing apparatus according to the above. The printing stage includes a first printing stage and a second printing stage,
The drying unit includes a first drying unit and a second drying unit,
The imaging unit includes a first imaging unit for imaging the printed matter on the first printing stage, and a second imaging unit for imaging the printed matter on the second printing stage,
While the printed matter on the first printing stage is being dried by the first drying unit, printing is performed on the second printing stage by the printing unit, and the second drying unit is provided. The printing unit is configured to perform printing on the first printing stage while drying of the printed matter on the second printing stage is performed by the printing unit. 3. The apparatus for manufacturing an electronic component according to 1 or 2.   The apparatus according to claim 1, further comprising a cleaning unit that cleans an inkjet head of the printing unit.   The apparatus according to claim 1, further comprising a thickness measurement sensor for measuring a thickness of the printed matter formed on the printing stage by printing by the printing unit. .

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