JP2020023650A - Styrene-based resin composition and molded article - Google Patents
Styrene-based resin composition and molded article Download PDFInfo
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- JP2020023650A JP2020023650A JP2018149743A JP2018149743A JP2020023650A JP 2020023650 A JP2020023650 A JP 2020023650A JP 2018149743 A JP2018149743 A JP 2018149743A JP 2018149743 A JP2018149743 A JP 2018149743A JP 2020023650 A JP2020023650 A JP 2020023650A
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- Prior art keywords
- resin composition
- styrene
- composition according
- based resin
- monomer
- Prior art date
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- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 239000011342 resin composition Substances 0.000 title claims abstract description 56
- -1 ether compound Chemical class 0.000 claims abstract description 53
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 31
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 229920001890 Novodur Polymers 0.000 claims description 15
- 125000001424 substituent group Chemical group 0.000 claims description 13
- 238000007792 addition Methods 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 125000005842 heteroatom Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 12
- 238000006116 polymerization reaction Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 150000005215 alkyl ethers Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000012986 chain transfer agent Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000005469 granulation Methods 0.000 description 3
- 230000003179 granulation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 2
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 2
- VTPNYMSKBPZSTF-UHFFFAOYSA-N 1-ethenyl-2-ethylbenzene Chemical compound CCC1=CC=CC=C1C=C VTPNYMSKBPZSTF-UHFFFAOYSA-N 0.000 description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 2
- XKMDZVINHIFHLY-UHFFFAOYSA-N 1-ethenyl-3,5-dimethylbenzene Chemical compound CC1=CC(C)=CC(C=C)=C1 XKMDZVINHIFHLY-UHFFFAOYSA-N 0.000 description 2
- XHUZSRRCICJJCN-UHFFFAOYSA-N 1-ethenyl-3-ethylbenzene Chemical compound CCC1=CC=CC(C=C)=C1 XHUZSRRCICJJCN-UHFFFAOYSA-N 0.000 description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 2
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 2
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- DBWWINQJTZYDFK-UHFFFAOYSA-N 2-ethenyl-1,4-dimethylbenzene Chemical compound CC1=CC=C(C)C(C=C)=C1 DBWWINQJTZYDFK-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- PMZXJPLGCUVUDN-UHFFFAOYSA-N 4-ethenyl-1,2-dimethylbenzene Chemical compound CC1=CC=C(C=C)C=C1C PMZXJPLGCUVUDN-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- MOYAFQVGZZPNRA-UHFFFAOYSA-N Terpinolene Chemical compound CC(C)=C1CCC(C)=CC1 MOYAFQVGZZPNRA-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 238000004128 high performance liquid chromatography Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 2
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- ZUDLIFVTNPYZJH-UHFFFAOYSA-N 1,1,2,2-tetraphenylethylbenzene Chemical compound C1=CC=CC=C1C(C(C=1C=CC=CC=1)(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 ZUDLIFVTNPYZJH-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- MGEJLLSWJCYSHK-UHFFFAOYSA-N 1-butyl-2-prop-1-en-2-ylbenzene Chemical compound CCCCC1=CC=CC=C1C(C)=C MGEJLLSWJCYSHK-UHFFFAOYSA-N 0.000 description 1
- IXTPWSUCILMATH-UHFFFAOYSA-N 1-ethyl-2-prop-1-en-2-ylbenzene Chemical compound CCC1=CC=CC=C1C(C)=C IXTPWSUCILMATH-UHFFFAOYSA-N 0.000 description 1
- XKOIESNQSHAQIW-UHFFFAOYSA-N 1-hexyl-2-prop-1-en-2-ylbenzene Chemical compound CCCCCCC1=CC=CC=C1C(C)=C XKOIESNQSHAQIW-UHFFFAOYSA-N 0.000 description 1
- ZHKBLALOBMBJLL-UHFFFAOYSA-N 1-hexylperoxyhexane Chemical compound CCCCCCOOCCCCCC ZHKBLALOBMBJLL-UHFFFAOYSA-N 0.000 description 1
- OGMSGZZPTQNTIK-UHFFFAOYSA-N 1-methyl-2-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1C OGMSGZZPTQNTIK-UHFFFAOYSA-N 0.000 description 1
- ICNSPHUQRZZYDE-UHFFFAOYSA-N 1-octyl-2-prop-1-en-2-ylbenzene Chemical compound CCCCCCCCC1=CC=CC=C1C(C)=C ICNSPHUQRZZYDE-UHFFFAOYSA-N 0.000 description 1
- OFALFBSBJGMFDF-UHFFFAOYSA-N 1-pentyl-2-prop-1-en-2-ylbenzene Chemical compound CCCCCC1=CC=CC=C1C(C)=C OFALFBSBJGMFDF-UHFFFAOYSA-N 0.000 description 1
- ZMYIIHDQURVDRB-UHFFFAOYSA-N 1-phenylethenylbenzene Chemical group C=1C=CC=CC=1C(=C)C1=CC=CC=C1 ZMYIIHDQURVDRB-UHFFFAOYSA-N 0.000 description 1
- ABCFMLHXPWKTLP-UHFFFAOYSA-N 1-prop-1-en-2-yl-2-propylbenzene Chemical compound CCCC1=CC=CC=C1C(C)=C ABCFMLHXPWKTLP-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- RCEJCSULJQNRQQ-UHFFFAOYSA-N 2-methylbutanenitrile Chemical compound CCC(C)C#N RCEJCSULJQNRQQ-UHFFFAOYSA-N 0.000 description 1
- DZRLNYVDCIYXPG-UHFFFAOYSA-N 2-naphthalen-2-yloxynaphthalene Chemical compound C1=CC=CC2=CC(OC=3C=C4C=CC=CC4=CC=3)=CC=C21 DZRLNYVDCIYXPG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BQARUDWASOOSRH-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-yl hydrogen carbonate Chemical compound CC(C)(C)OOC(C)(C)OC(O)=O BQARUDWASOOSRH-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
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- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
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- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- YLLIGHVCTUPGEH-UHFFFAOYSA-M potassium;ethanol;hydroxide Chemical compound [OH-].[K+].CCO YLLIGHVCTUPGEH-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
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- 238000011002 quantification Methods 0.000 description 1
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- YOEYNURYLFDCEV-UHFFFAOYSA-N tert-butyl hydroxy carbonate Chemical compound CC(C)(C)OC(=O)OO YOEYNURYLFDCEV-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
本発明は、スチレン系樹脂組成物及び成形品に関するものである。 The present invention relates to a styrene resin composition and a molded product.
スチレン−(メタ)アクリル酸系共重合体樹脂は、一般のポリスチレンに比較して、耐熱性に優れており、主に電子レンジ加熱用の食品包装材料の素材として使用されている。具体的には、押出発泡シートや二軸延伸シートに成形された後、食品容器や蓋に賦形されて利用されている。また、透明性と耐熱性のバランスに優れるため、照明カバーや透過型ディスプレイ用光拡散板のような、光拡散剤を含有する光拡散性樹脂板にも適している。 Styrene- (meth) acrylic acid-based copolymer resin has excellent heat resistance as compared with general polystyrene, and is mainly used as a material for food packaging materials for microwave oven heating. Specifically, after being formed into an extruded foam sheet or a biaxially stretched sheet, it is used by being shaped into a food container or a lid. Further, since it has an excellent balance between transparency and heat resistance, it is also suitable for a light-diffusing resin plate containing a light-diffusing agent, such as a lighting cover or a light-diffusing plate for a transmissive display.
スチレン−(メタ)アクリル酸系共重合体樹脂の欠点として、シート等に加工する際の熱履歴によって、ポリマー中のカルボキシル基がポリマー分子間で縮合反応を起こして、ゲル状物質を生成する場合があることや、共重合体樹脂の製造工程においても同様の反応でゲル状物質を生成する場合があることが指摘されている。 As a drawback of styrene- (meth) acrylic acid-based copolymer resin, carboxyl group in polymer causes condensation reaction between polymer molecules due to heat history when processing into sheet etc. to generate gel-like substance It has been pointed out that a gel-like substance may be produced by a similar reaction in the process of producing a copolymer resin.
特許文献1には、ポリオキシエチレンアルキルエーテルを添加することによってゲル状物質の生成を抑制する技術が開示されている。 Patent Document 1 discloses a technique of suppressing the formation of a gel-like substance by adding a polyoxyethylene alkyl ether.
しかし、特許文献1の技術を採用しても、ゲル状物質の生成を完全に抑制することはできず、ゲル状物質の生成をさらに抑制することが望まれている。 However, even if the technique of Patent Document 1 is adopted, the generation of a gel-like substance cannot be completely suppressed, and it is desired to further suppress the generation of a gel-like substance.
本発明はこのような事情に鑑みてなされたものであり、ゲル状物質の生成を効果的に抑制可能なスチレン系樹脂組成物を提供するものである。 The present invention has been made in view of such circumstances, and provides a styrene-based resin composition that can effectively suppress the generation of a gel-like substance.
本発明によれば、スチレン系樹脂とエーテル化合物を含むスチレン系樹脂組成物であって、前記スチレン系樹脂は、スチレン系単量体と(メタ)アクリル酸系単量体を含む単量体混合物を共重合させて得られ、前記エーテル化合物は、一般式(1)で表される、スチレン系樹脂組成物が提供される。 According to the present invention, there is provided a styrene resin composition containing a styrene resin and an ether compound, wherein the styrene resin is a monomer mixture containing a styrene monomer and a (meth) acrylic acid monomer. And a styrene-based resin composition represented by the general formula (1) is provided as the ether compound.
本発明者が鋭意検討を行ったところ、一般式(1)で表されるエーテル化合物を添加することによって、ゲル状物質の生成を効果的に抑制可能であることを見出し、本発明の完成に到った。 The present inventors have conducted intensive studies and found that the addition of the ether compound represented by the general formula (1) can effectively suppress the formation of a gel-like substance. It has arrived.
1.スチレン系樹脂組成物
本発明のスチレン系樹脂組成物は、スチレン系樹脂Aとエーテル化合物Bを含む。以下、各成分について詳述する。
1. Styrene resin composition The styrene resin composition of the present invention contains a styrene resin A and an ether compound B. Hereinafter, each component will be described in detail.
<<スチレン系樹脂A>>
スチレン系樹脂Aは、スチレン系単量体と(メタ)アクリル酸系単量体を含む単量体混合物を共重合させて得られる。
<<< Styrene resin A >>>
The styrene resin A is obtained by copolymerizing a monomer mixture containing a styrene monomer and a (meth) acrylic acid monomer.
スチレン系単量体は、単環又は多環の芳香族ビニル系モノマーであり、例えば、スチレン、o−メチルスチレン、m−メチルスチレン、p−メチルスチレン、2,4−ジメチルスチレン、2,5−ジメチルスチレン、3,4−ジメチルスチレン、3,5−ジメチルスチレン、p−エチルスチレン、m−エチルスチレン、о−エチルスチレン、p−tert−ブチルスチレン、1−ビニルナフタレン、2−ビニルナフタレン、1,1−ジフェニルエチレン、イソプロペニルベンセン(α−メチルスチレン)、イソプロペニルトルエン、イソプロペニルエチルベンゼン、イソプロペニルプロピルベンゼン、イソプロペニルブチルベンゼン、イソプロペニルペンチルベンゼン、イソプロペニルヘキシルベンゼン、イソプロペニルオクチルベンゼン等の単独または2種以上の混合物であり、好ましくは、スチレン、o−メチルスチレン、m−メチルスチレン、p−メチルスチレン、2,4−ジメチルスチレン、2,5−ジメチルスチレン、3,4−ジメチルスチレン、3,5−ジメチルスチレン、p−エチルスチレン、m−エチルスチレン、о−エチルスチレン、p−tert−ブチルスチレンの単独または2種以上の混合物であり、より好ましくは、スチレンである。 The styrene monomer is a monocyclic or polycyclic aromatic vinyl monomer, for example, styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, 2,5 -Dimethylstyrene, 3,4-dimethylstyrene, 3,5-dimethylstyrene, p-ethylstyrene, m-ethylstyrene, o-ethylstyrene, p-tert-butylstyrene, 1-vinylnaphthalene, 2-vinylnaphthalene, 1,1-diphenylethylene, isopropenylbenzene (α-methylstyrene), isopropenyltoluene, isopropenylethylbenzene, isopropenylpropylbenzene, isopropenylbutylbenzene, isopropenylpentylbenzene, isopropenylhexylbenzene, isopropenyloctylbenzene, etc. of One or a mixture of two or more, preferably styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, 2,5-dimethylstyrene, 3,4-dimethylstyrene , 3,5-dimethylstyrene, p-ethylstyrene, m-ethylstyrene, o-ethylstyrene, p-tert-butylstyrene, or a mixture of two or more thereof, more preferably styrene.
(メタ)アクリル酸系単量体は、アクリル酸、メタクリル酸等のアクリル酸モノマーの一方又は両方であり、好ましくはメタクリル酸である。 The (meth) acrylic acid-based monomer is one or both of acrylic acid monomers such as acrylic acid and methacrylic acid, and is preferably methacrylic acid.
単量体混合物は、スチレン系単量体と(メタ)アクリル酸系単量体のみを含んでもよく、本発明の効果を損なわない範囲で、これらと共重合可能なその他の単量体を含んでよい。その他の単量体としては、アクリロニトリル、メタクリロニトリル等のシアン化ビニルモノマー、アクリル酸ブチル、アクリル酸エチル、アクリル酸メチル、メタクリル酸メチル等のアクリル系モノマーや無水マレイン酸、フマル酸等のα,β−エチレン不飽和カルボン酸類、フェニルマレイミド、シクロヘキシルマレイミド等のイミド系モノマー類が挙げられる。 The monomer mixture may contain only a styrene-based monomer and a (meth) acrylic acid-based monomer, and may contain other monomers copolymerizable therewith as long as the effects of the present invention are not impaired. Is fine. Other monomers include acrylonitrile, vinyl cyanide monomers such as methacrylonitrile, acrylic monomers such as butyl acrylate, ethyl acrylate, methyl acrylate, methyl methacrylate, and α such as maleic anhydride and fumaric acid. And imide monomers such as .beta.-ethylenically unsaturated carboxylic acids, phenylmaleimide and cyclohexylmaleimide.
単量体混合物は、スチレン系単量体と(メタ)アクリル酸系単量体が主成分であることが好ましく、単量体混合物中のスチレン系単量体と(メタ)アクリル酸系単量体の合計の割合は、50質量%以上が好ましく、例えば50〜100質量%であり、具体的には例えば、50、55、60、65、70、75、80、85、90、95、100質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The monomer mixture preferably contains a styrene monomer and a (meth) acrylic acid monomer as main components, and the styrene monomer and the (meth) acrylic acid monomer in the monomer mixture. The total proportion of the body is preferably 50% by mass or more, for example, 50 to 100% by mass, and specifically, for example, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 %, And may be in the range between any two of the numerical values exemplified herein.
スチレン系樹脂組成物100質量%に対し、(メタ)アクリル酸系単量体に由来する構造単位の含有量が0.1〜30質量%であることが好ましい。(メタ)アクリル酸系単量体に由来する構造単位は、例えば(メタ)アクリル酸系単量体単位である。この値が小さすぎると耐熱性が不十分である場合があり、この値が大きすぎると、溶融時の流動性が低下して成形加工性が悪化する場合があるからである。この割合は、具体的には例えば、0.1、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20、25、30質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The content of the structural unit derived from the (meth) acrylic acid-based monomer is preferably 0.1 to 30% by mass based on 100% by mass of the styrene-based resin composition. The structural unit derived from the (meth) acrylic acid-based monomer is, for example, a (meth) acrylic acid-based monomer unit. If the value is too small, the heat resistance may be insufficient. If the value is too large, the fluidity at the time of melting may be reduced and the moldability may be deteriorated. This ratio is specifically, for example, 0.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, and 30% by mass, and may be in the range between any two of the numerical values exemplified here.
スチレン系樹脂Aの重量平均分子量(Mw)は、好ましくは、15万〜70万であり、15万〜40万であることが好ましい。具体的には例えば、5、10、15、20、25、30、35、40、45、50、55、60、65、70万であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。Mwが小さすぎると成形品の強度が不十分となり、Mwが大きすぎると成形性が低下する。スチレン系樹脂Aの重量平均分子量は、重合工程の反応温度、滞留時間、重合開始剤の種類及び添加量、連鎖移動剤の種類及び添加量、重合時に使用する溶媒の種類及び量等によって制御することができる。 The weight average molecular weight (Mw) of the styrene resin A is preferably 150,000 to 700,000, and more preferably 150,000 to 400,000. Specifically, for example, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 700,000, and a range between any two of the numerical values exemplified here. May be inside. If Mw is too small, the strength of the molded product will be insufficient, and if Mw is too large, the moldability will decrease. The weight average molecular weight of the styrenic resin A is controlled by the reaction temperature, residence time, type and amount of polymerization initiator, type and amount of chain transfer agent, type and amount of solvent used during polymerization, and the like in the polymerization step. be able to.
重量平均分子量(Mw)は、ゲルパーミエイションクロマトグラフィー(GPC)を用いて、次の条件で測定可能である。
GPC機種:昭和電工株式会社製Shodex GPC−101
カラム:ポリマーラボラトリーズ社製 PLgel 10μm MIXED−B
移動相:テトラヒドロフラン
試料濃度:0.2質量%
温度:オーブン40℃、注入口35℃、検出器35℃
検出器:示差屈折計
分子量は単分散ポリスチレンの溶出曲線より各溶出時間における分子量を算出し、ポリスチレン換算の分子量として算出したものである。
The weight average molecular weight (Mw) can be measured using gel permeation chromatography (GPC) under the following conditions.
GPC model: Shodex GPC-101 manufactured by Showa Denko KK
Column: PLgel 10 μm MIXED-B manufactured by Polymer Laboratories
Mobile phase: tetrahydrofuran Sample concentration: 0.2% by mass
Temperature: oven 40 ° C, inlet 35 ° C, detector 35 ° C
Detector: Differential refractometer The molecular weight is calculated as the molecular weight in terms of polystyrene by calculating the molecular weight at each elution time from the elution curve of monodisperse polystyrene.
<<エーテル化合物B>>
エーテル化合物Bは、一般式(1)で表される。
<<< ether compound B >>>
The ether compound B is represented by the general formula (1).
一般式(1)中のZ1〜Z5は、同一又は異なっており、水素原子であるか、又はヘテロ原子を有してもよい炭化水素基である。Z1〜Z5のうちの3つ又は4つが水素原子であり、残りがヘテロ原子を有してもよい炭化水素基であることが好ましい。 Z1 to Z5 in the general formula (1) are the same or different and are a hydrogen atom or a hydrocarbon group which may have a hetero atom. It is preferable that three or four of Z1 to Z5 are hydrogen atoms and the rest are hydrocarbon groups which may have a hetero atom.
上記ヘテロ原子としては、酸素、窒素、硫黄、フッ素などが挙げられる。炭化水素基は、炭素数が1〜30であることが好ましく、2〜20であることがさらに好ましい。この炭素数は、具体的には例えば、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20、21、22、23、24、25、26、27、28、29、30であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 Examples of the hetero atom include oxygen, nitrogen, sulfur, and fluorine. The hydrocarbon group preferably has 1 to 30 carbon atoms, and more preferably 2 to 20 carbon atoms. This carbon number is specifically, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 , 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 and may be in the range between any two of the numerical values exemplified here.
上記炭化水素基は、置換基を有してもよい脂肪族炭化水素基であることが好ましい。脂肪族炭化水素基としては、炭素数が1〜20のアルキル基、アリル基、ビニル基などが挙げられる。脂肪族炭化水素基の炭素数は、具体的には例えば、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。脂肪族炭化水素基の置換基としては、フェニル基などの芳香族炭化水素基が挙げられる。芳香族炭化水素基は、水酸基などの置換基で置換されていてもよい。脂肪族炭化水素基の1位の炭素に置換基が結合していることが好ましい。 The hydrocarbon group is preferably an aliphatic hydrocarbon group which may have a substituent. Examples of the aliphatic hydrocarbon group include an alkyl group having 1 to 20 carbon atoms, an allyl group, and a vinyl group. Specifically, the carbon number of the aliphatic hydrocarbon group is, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 and may be in the range between any two of the numerical values exemplified here. Examples of the substituent of the aliphatic hydrocarbon group include an aromatic hydrocarbon group such as a phenyl group. The aromatic hydrocarbon group may be substituted with a substituent such as a hydroxyl group. It is preferred that a substituent is bonded to the 1-position carbon of the aliphatic hydrocarbon group.
上記炭化水素基は、置換基を有してもよい芳香族炭化水素基であってもよい。芳香族炭化水素基としては、フェニル基、トリル基などが挙げられる。置換基としては、アルキルなどの脂肪族炭化水素基や水酸基などが挙げられる。 The hydrocarbon group may be an aromatic hydrocarbon group which may have a substituent. Examples of the aromatic hydrocarbon group include a phenyl group and a tolyl group. Examples of the substituent include an aliphatic hydrocarbon group such as alkyl and a hydroxyl group.
Z1〜Z5のうちの少なくとも2つが架橋されて脂環又は芳香環を形成していてもよい。 At least two of Z1 to Z5 may be crosslinked to form an alicyclic or aromatic ring.
Z1〜Z5の少なくとも1つは、好ましくは、置換基を有してもよい炭素数1〜20のアルキル基である。この置換基は、好ましくは、ヘテロ原子を有してもよい炭素数1〜20の炭化水素基であり、さらに好ましくは、芳香環を含み、さらに好ましくは、前記アルキル基に結合されているフェニル基であり、さらに好ましくは、1−フェニルエチル基である。 At least one of Z1 to Z5 is preferably an alkyl group having 1 to 20 carbon atoms which may have a substituent. This substituent is preferably a hydrocarbon group having 1 to 20 carbon atoms which may have a hetero atom, more preferably an aromatic ring, and more preferably phenyl bonded to the alkyl group. And more preferably a 1-phenylethyl group.
一般式(1)中のnは、アルキレンオキサイド構造の炭素数を表し、1〜10(好ましくは2〜4)の整数である。nは、具体的には例えば、1、2、3、4、5、6、7、8、9、10であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 N in the general formula (1) represents the number of carbon atoms in the alkylene oxide structure, and is an integer of 1 to 10 (preferably 2 to 4). n is, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, for example, and may be in a range between any two of the numerical values exemplified here. .
一般式(1)中のXは、Xはアルキレンオキサイド単位の平均付加数を表し、1〜100(好ましくは5〜50)の整数である。Xは、具体的には例えば、1、5、10、15、20、25、30、35、40、45、50、55、60、65、70、75、80、85、90、95、100であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 X in the general formula (1) represents the average number of addition of alkylene oxide units, and is an integer of 1 to 100 (preferably 5 to 50). X is specifically, for example, 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 And may be in the range between any two of the numerical values exemplified here.
エーテル化合物Bとしては、例えば、ポリオキシエチレンジスチレン化フェニルエーテル、ポリオキシエチレンスチレン化フェニルエーテル、ポリオキシエチレンオクチルフェニルエーテル、ポリオキシエチレンノニルフェニルエーテル、ポリオキシエチレンドデシルフェニルエーテル、ポリオキシエチレンフェニルエーテル、ポリオキシエチレンβナフチルエーテル、ポリオキシエチレンビスフェノールAエーテル、ポリオキシエチレンビスフェノールFエーテルなどが挙げられる。 Examples of the ether compound B include polyoxyethylene distyrenated phenyl ether, polyoxyethylene styrenated phenyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, polyoxyethylene dodecyl phenyl ether, and polyoxyethylene phenyl Ether, polyoxyethylene β-naphthyl ether, polyoxyethylene bisphenol A ether, polyoxyethylene bisphenol F ether and the like.
スチレン系樹脂組成物100質量%に対し、エーテル化合物Bの含有量は、0.001〜10質量%であることが好ましい。この値が小さすぎると、ゲル状物質の生成が十分に抑制されない場合があり、この値が大きすぎると、耐熱性が低下する場合がある。上記含有量は、具体的には例えば、0.001、0.01、0.05、0.1、0.2、0.3、0.4、0.5、0.6、0.7、0.8、0.9、1、2、3、4、5、6、7、8、9、10質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The content of the ether compound B is preferably 0.001 to 10% by mass based on 100% by mass of the styrene resin composition. If this value is too small, the formation of a gel-like substance may not be sufficiently suppressed, and if this value is too large, the heat resistance may decrease. The content is specifically, for example, 0.001, 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7. , 0.8, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10% by mass, within the range between any two of the numerical values exemplified herein. Is also good.
<<その他の添加剤>>
スチレン系樹脂組成物には、本発明の特性を損なわない範囲で、必要に応じて種々の添加剤を配合することができる。添加剤の種類はプラスチックに一般的に用いられるものであれば特に制限はないが、酸化防止剤、難燃剤、滑剤、加工助剤、ブロッキング防止剤、帯電防止剤、防曇剤、耐光性向上剤、軟化剤、可塑剤、無機補強剤、架橋剤、顔料、染料、その他或いはこれらの混合物が挙げられる。また、スチレン系樹脂組成物には、エーテル化合物として、エーテル化合物Bのみを含有させてもよく、エーテル化合物B以外のエーテル化合物(例:ポリオキシエチレンアルキルエーテル)を含有させてもよい。
<< Other additives >>
Various additives can be added to the styrene-based resin composition as needed as long as the properties of the present invention are not impaired. The type of additive is not particularly limited as long as it is generally used for plastics, but an antioxidant, a flame retardant, a lubricant, a processing aid, an antiblocking agent, an antistatic agent, an antifogging agent, and an improvement in light resistance. Agents, softeners, plasticizers, inorganic reinforcing agents, crosslinking agents, pigments, dyes, and the like, or mixtures thereof. Further, the styrene-based resin composition may contain only the ether compound B as the ether compound, or may contain an ether compound other than the ether compound B (eg, polyoxyethylene alkyl ether).
2.スチレン系樹脂組成物の製造方法
本発明のスチレン系樹脂組成物は、スチレン系樹脂Aにエーテル化合物Bを添加することによって製造可能である。スチレン系樹脂の重合方法としては、塊状重合法、溶液重合法、懸濁重合法、乳化重合法等公知のスチレン重合方法が挙げられる。品質面や生産性の面では、塊状重合法、溶液重合法が好ましく、連続重合であることが好ましい。溶媒として例えばベンゼン、トルエン、エチルベンゼン及びキシレン等のアルキルベンゼン類やアセトンやメチルエチルケトン等のケトン類、ヘキサンやシクロヘキサン等の脂肪族炭化水素等が使用できる。
2. Method for Producing Styrenic Resin Composition The styrenic resin composition of the present invention can be produced by adding an ether compound B to a styrenic resin A. Examples of the polymerization method for the styrene resin include known styrene polymerization methods such as a bulk polymerization method, a solution polymerization method, a suspension polymerization method, and an emulsion polymerization method. In terms of quality and productivity, bulk polymerization and solution polymerization are preferred, and continuous polymerization is preferred. As the solvent, for example, alkylbenzenes such as benzene, toluene, ethylbenzene and xylene, ketones such as acetone and methyl ethyl ketone, and aliphatic hydrocarbons such as hexane and cyclohexane can be used.
スチレン−(メタ)アクリル酸共重合樹脂の重合時に、必要に応じて重合開始剤、連鎖移動剤、架橋剤などの重合助剤、その他の重合助剤を使用することができる。重合開始剤としては、ラジカル重合開始剤が好ましく、公知慣用の例えば、1,1−ジ(t−ブチルパーオキシ)シクロヘキサン、2,2−ジ(t−ブチルパーオキシ)ブタン、2,2−ジ(4,4−ジ−t−ブチルパーオキシシクロヘキシル)プロパン、1,1−ジ(t−アミルパーオキシ)シクロヘキサン等のパーオキシケタール類、クメンハイドロパーオキサイド、t−ブチルハイドロパーオキサイド等のハイドロパーオキサイド類、t−ブチルパーオキシアセテート、t−アミルパーオキシイソノナノエート等のアルキルパーオキサイド類、t−ブチルクミルパーオキサイド、ジ−t−ブチルパーオキサイド、ジクミルパーオキサイド、ジ−t−ヘキシルパーオキサイド等のジアルキルパーオキサイド類、t−ブチルパーオキシアセテート、t−ブチルパーオキシベンゾエート、t−ブチルパーオキシイソプロピルモノカーボネート等のパーオキシエステル類、t−ブチルパーオキシイソプロピルカーボネート、ポリエーテルテトラキス(t−ブチルパーオキシカーボネート)等のパーオキシカーボネート類、N,N'−アゾビス(シクロヘキサン−1−カルボニトリル)、N,N'−アゾビス(2−メチルブチロニトリル)、N,N'−アゾビス(2,4−ジメチルバレロニトリル)、N,N'−アゾビス[2−(ヒドロキシメチル)プロピオニトリル]等が挙げられ、これらの1種あるいは2種以上を組み合わせて使用することができる。連鎖移動剤としては、脂肪族メルカプタン、芳香族メルカプタン、ペンタフェニルエタン、α−メチルスチレンダイマー及びテルピノーレン等が挙げられる。 At the time of polymerization of the styrene- (meth) acrylic acid copolymer resin, if necessary, a polymerization initiator such as a polymerization initiator, a chain transfer agent, a cross-linking agent, and other polymerization aids can be used. As the polymerization initiator, a radical polymerization initiator is preferable. For example, known and commonly used 1,1-di (t-butylperoxy) cyclohexane, 2,2-di (t-butylperoxy) butane, 2,2- Peroxyketals such as di (4,4-di-t-butylperoxycyclohexyl) propane and 1,1-di (t-amylperoxy) cyclohexane; cumene hydroperoxide; t-butyl hydroperoxide; Alkyl peroxides such as hydroperoxides, t-butyl peroxyacetate, t-amyl peroxy isononanoate, t-butyl cumyl peroxide, di-t-butyl peroxide, dicumyl peroxide, di-t -Dialkyl peroxides such as hexyl peroxide, t-butylperoxyacetate; , Peroxyesters such as t-butylperoxybenzoate and t-butylperoxyisopropyl monocarbonate, and peroxycarbonates such as t-butylperoxyisopropyl carbonate and polyethertetrakis (t-butylperoxycarbonate) , N, N'-azobis (cyclohexane-1-carbonitrile), N, N'-azobis (2-methylbutyronitrile), N, N'-azobis (2,4-dimethylvaleronitrile), N, N '-Azobis [2- (hydroxymethyl) propionitrile] and the like, and one or more of these can be used in combination. Examples of the chain transfer agent include aliphatic mercaptan, aromatic mercaptan, pentaphenylethane, α-methylstyrene dimer, terpinolene, and the like.
連続重合の場合、スチレン系樹脂組成物は、重合工程と、脱揮工程、造粒工程を備える方法によって製造可能である。 In the case of continuous polymerization, the styrene-based resin composition can be produced by a method including a polymerization step, a devolatilization step, and a granulation step.
まず重合工程にて公知の完全混合槽型攪拌槽や塔型反応器等を用い、目標の分子量、分子量分布、反応転化率となるよう、重合温度調整等により重合反応が制御される。 First, in a polymerization step, a polymerization reaction is controlled by adjusting a polymerization temperature or the like so as to obtain a target molecular weight, a molecular weight distribution, and a reaction conversion using a well-known complete mixing tank type stirring tank, a tower type reactor or the like.
重合工程を出た重合体を含む重合溶液は、脱揮工程に移送され、未反応の単量体及び重合溶媒が除去される。脱揮工程は加熱器付きの真空脱揮槽やベント付き脱揮押出機などで構成される。脱揮工程を出た溶融状態の重合体は造粒工程へ移送される。造粒工程では、多孔ダイよりストランド状に溶融樹脂を押出し、コールドカット方式や空中ホットカット方式、水中ホットカット方式にてペレット形状に加工される。 The polymerization solution containing the polymer that has left the polymerization step is transferred to a devolatilization step to remove unreacted monomers and a polymerization solvent. The devolatilization process includes a vacuum devolatilization tank with a heater, a devolatilization extruder with a vent, and the like. The polymer in the molten state that has exited the devolatilization step is transferred to the granulation step. In the granulation step, the molten resin is extruded into a strand shape from a porous die, and processed into a pellet shape by a cold cut method, an air hot cut method, or an underwater hot cut method.
エーテル化合物Bは、脱揮工程前、又は脱揮工程において、添加することが好ましい。具体的には、エーテル化合物Bは、以下の(1)〜(4)の何れかの方法で添加することが好ましい。
(1)原料の単量体混合物に添加する。
(2)重合工程中に添加する。
(3)重合工程終了後の重合溶液に添加する。
(4)脱揮工程が2段で構成され、1段目の樹脂温度が200℃未満の場合は、1段目と2段目の間に添加する。
It is preferable to add the ether compound B before or during the devolatilization step. Specifically, the ether compound B is preferably added by any of the following methods (1) to (4).
(1) It is added to the raw material monomer mixture.
(2) Add during the polymerization step.
(3) Add to the polymerization solution after the polymerization step.
(4) When the devolatilization step is composed of two stages, and the resin temperature of the first stage is lower than 200 ° C., it is added between the first stage and the second stage.
3.スチレン系樹脂組成物の用途
本発明のスチレン系樹脂組成物は、射出成形、押出成形、圧縮成形、ブロー成形等、目的に応じた成形方法で成形品にすることができ、その形状は制限されるものではない。例えば板状成形品であれば、導光板等に加工することができる。
3. Uses of styrene resin composition The styrene resin composition of the present invention can be formed into a molded product by a molding method according to the purpose, such as injection molding, extrusion molding, compression molding, blow molding, and the shape thereof is limited. Not something. For example, if it is a plate-like molded product, it can be processed into a light guide plate or the like.
以下、実施例を挙げて本発明を具体的に説明するが、本発明はこれら実施例に限定されるものではない。 Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.
1.測定方法
(1)メタクリル酸単位含有量の測定
スチレン系樹脂組成物0.5gを秤量し、トルエン/エタノール=8/2(体積比)の混合溶液に溶解後、水酸化カリウム0.1mol/Lエタノール溶液にて中和滴定を行い、終点を検出し、水酸化カリウムエタノール溶液の使用量より、メタクリル酸単位の質量基準の含有量を算出した。
1. Measurement method (1) Measurement of methacrylic acid unit content 0.5 g of a styrene resin composition was weighed and dissolved in a mixed solution of toluene / ethanol = 8/2 (volume ratio), and then 0.1 mol / L of potassium hydroxide. Neutralization titration was performed with an ethanol solution, the end point was detected, and the content of methacrylic acid unit on a mass basis was calculated from the amount of the potassium hydroxide ethanol solution used.
(2)エーテル化合物の含有量の測定
スチレン系樹脂組成物5gを秤量し、THFに溶解する。溶解後、メタノール及び少量の塩酸でポリマー分を再沈処理し、ろ過により再沈物を除去。ろ液を濃縮し、最終的に10mlメタノール溶液の濃縮液とし、高速液体クロマトグラフィー(HPLC)により、エーテル化合物の定量を行った。なお、定量はエーテル化合物濃度既知のメタノール溶液を3点作成し、検量線を作成することにより行った。
HPLC機種:日本ウォーターズ社製 allianceシステム2695セパレーションモジュール
検出器:示差屈折計(RI)
カラム:東ソー社製 TSKgel ODS−120T 4.6mm(ID)×15cm(L)
移動相:メタノール/水=80/20(体積比)にリン酸0.2質量%添加
流量:1.0ml/分
カラムオーブン温度:40℃
検出器温度:30℃
(2) Measurement of the content of the ether compound 5 g of the styrene resin composition is weighed and dissolved in THF. After dissolution, the polymer component was reprecipitated with methanol and a small amount of hydrochloric acid, and the reprecipitate was removed by filtration. The filtrate was concentrated, and finally a 10 ml methanol solution was concentrated, and the ether compound was quantified by high performance liquid chromatography (HPLC). The quantification was performed by preparing three methanol solutions with known ether compound concentrations and preparing a calibration curve.
HPLC model: Alliance system 2695 separation module manufactured by Nippon Waters Detector: Differential refractometer (RI)
Column: Tosoh TSKgel ODS-120T 4.6 mm (ID) x 15 cm (L)
Mobile phase: methanol / water = 80/20 (volume ratio) phosphoric acid 0.2% by mass added Flow rate: 1.0 ml / min Column oven temperature: 40 ° C.
Detector temperature: 30 ° C
(3)ビカット軟化温度の測定
JIS K−7206により、昇温速度50℃/hr、試験荷重50Nで求めた。
(3) Measurement of Vicat Softening Temperature The Vicat softening temperature was determined according to JIS K-7206 at a heating rate of 50 ° C./hr and a test load of 50 N.
(4)MEK不溶分の測定
<加熱前>
スチレン系樹脂組成物1gを秤量し、メチルエチルケトン35ミリリットルを加え溶解し、その溶液を遠心分離機(コクサン社製H−2000B(ローター:H))にて、10000rpmで30分間遠心分離して不溶分を沈降せしめ、デカンテーションにより上澄み液を除去して不溶分を得、セーフティーオーブンにて90℃で2時間予備乾燥し、更に真空乾燥機にて120℃で1時間減圧乾燥し、20分間デシケータ中で冷却した後、乾燥した不溶分の質量Gを測定して、不溶分の質量%を算出した。
(4) Measurement of MEK insoluble content <Before heating>
1 g of the styrene-based resin composition was weighed, and 35 ml of methyl ethyl ketone was added and dissolved. Was settled, and the supernatant was removed by decantation to obtain an insoluble content, which was pre-dried in a safety oven at 90 ° C. for 2 hours, further dried in a vacuum dryer at 120 ° C. for 1 hour, and dried in a desiccator for 20 minutes. After cooling, the mass G of the dried insoluble matter was measured, and the mass% of the insoluble matter was calculated.
<加熱後>
スチレン系樹脂組成物1gを秤量し、真空下、230℃のオーブンで3時間の熱処理を行った。その後、上記の加熱前と同様の方法によって不溶分を測定して、不溶分の質量%を算出した。
ゲル状物質は、スチレン系樹脂中のカルボキシル基がポリマー分子間で縮合反応を起こして生成するものと考えられ、メチルエチルケトンには不溶な成分である。
<After heating>
1 g of the styrene resin composition was weighed and heat-treated in an oven at 230 ° C. for 3 hours under vacuum. Thereafter, the insoluble content was measured by the same method as before the heating, and the mass% of the insoluble content was calculated.
The gel-like substance is considered to be formed by the condensation reaction of the carboxyl group in the styrene resin between polymer molecules, and is a component insoluble in methyl ethyl ketone.
(5)HAZEの測定
スチレン系樹脂組成物のペレットを、東芝機械社製射出成形機(IS130FII−3A)を用いて、シリンダー温度250℃、金型温度50℃にて射出成形した。得られた試験片(厚さ2mm、寸法40mm×40mm)を用い、JIS K−7105に準拠し、ヘーズメーター(日本電色工業社製NDH5000)を用いてHAZE(単位:%)測定を行った。
(5) Measurement of HAZE Pellets of the styrene resin composition were injection-molded at a cylinder temperature of 250 ° C. and a mold temperature of 50 ° C. using an injection molding machine (IS130FII-3A) manufactured by Toshiba Machine Co., Ltd. Using the obtained test piece (thickness: 2 mm, dimensions: 40 mm × 40 mm), HAZE (unit:%) was measured using a haze meter (NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K-7105. .
2.実施例・比較例
以下に示す方法で、実施例・比較例を実施した。
2. Examples and Comparative Examples Examples and comparative examples were carried out by the following methods.
<実施例1>
内容積39リットルの完全混合型撹拌槽である第1反応器と内容積39リットルの完全混合型撹拌槽である第2反応器を直列に接続して重合工程を構成した。スチレン71質量%、メタクリル酸12質量%、エチルベンゼン17質量%の混合溶液からなる原料溶液を作成した。
<Example 1>
The polymerization step was constituted by connecting in series a first reactor which was a complete mixing type stirring tank having an internal volume of 39 liters and a second reactor which was a complete mixing type stirring tank having an internal volume of 39 liters. A raw material solution composed of a mixed solution of 71% by mass of styrene, 12% by mass of methacrylic acid, and 17% by mass of ethylbenzene was prepared.
この原料溶液を毎時12.6kgの割合で第1反応器へ連続的に供給し、各反応器を満液状態で流通した。なお、第1反応器入口で、原料溶液中のスチレンとメタクリル酸の合計量に対して、1,1−ビス(t−ブチルパーオキシ)シクロヘキサン(日本油脂社製パーヘキサC)を質量基準で250ppm混合した。また、第1反応器入口で、エーテル化合物[B−1]を連続的に添加した。各反応器の反応温度は、第1反応器で130℃、第2反応器で140℃となるよう調整した。 This raw material solution was continuously supplied to the first reactor at a rate of 12.6 kg per hour, and each reactor was circulated in a full state. At the inlet of the first reactor, 1,1-bis (t-butylperoxy) cyclohexane (Nippon Oil & Fat Co., Ltd., Perhexa C) was 250 ppm by mass based on the total amount of styrene and methacrylic acid in the raw material solution. Mixed. At the inlet of the first reactor, the ether compound [B-1] was continuously added. The reaction temperature of each reactor was adjusted to 130 ° C. in the first reactor and 140 ° C. in the second reactor.
続いて、第2反応器より連続的に取り出した共重合体樹脂を含む溶液を直列に2段設置した予熱器付き真空脱揮槽に導入し、未反応モノマー及びエチルベンゼンを分離した後、ストランド状に押し出しして冷却した後、切断してペレットとすることによってスチレン系樹脂組成物を得た。なお、1段目の予熱器付き真空脱揮槽について、予熱器の温度を175℃、真空脱揮槽の圧力を500mmHg、真空脱揮槽のジャケット温度を185℃に設定した。2段目の予熱器付き真空脱揮槽について、予熱器の温度を240℃、真空脱揮槽の圧力を8mmHg、真空脱揮槽のジャケット温度を240℃に設定した。1段目の真空脱揮槽内の樹脂温度は168℃、2段目の真空脱揮槽内の樹脂温度は231℃であった。 Subsequently, the solution containing the copolymer resin continuously taken out from the second reactor was introduced into a vacuum devolatilization tank with a preheater provided in two stages in series, and after separating unreacted monomer and ethylbenzene, a strand was formed. The mixture was extruded and cooled, and then cut into pellets to obtain a styrene resin composition. The temperature of the preheater was set at 175 ° C., the pressure of the vacuum devolatilization tank was set at 500 mmHg, and the jacket temperature of the vacuum devolatilization tank was set at 185 ° C. for the first-stage vacuum devolatilization tank. The temperature of the preheater was set to 240 ° C, the pressure of the vacuum devolatilization tank was set to 8 mmHg, and the jacket temperature of the vacuum devolatilization tank was set to 240 ° C for the second stage vacuum devolatilization tank with a preheater. The resin temperature in the first-stage vacuum devolatilization tank was 168 ° C, and the resin temperature in the second-stage vacuum devolatilization tank was 231 ° C.
得られたスチレン系樹脂組成物について、各種物性を測定した。その結果を表1に示す。 Various physical properties were measured for the obtained styrene-based resin composition. Table 1 shows the results.
表1中の構成成分の詳細は、以下の通りである。
エーテル化合物B
B−1:ポリオキシエチレンジスチレン化フェニルエーテル(花王社製、エマルゲンA−90、エチレンオキサイド単位の平均付加数18)
B−2:ポリオキシエチレンジスチレン化フェニルエーテル(花王社製、エマルゲンA−60、エチレンオキサイド単位の平均付加数12)
B−3:ポリオキシエチレンジスチレン化フェニルエーテル(花王社製、エマルゲンA−500、エチレンオキサイド単位の平均付加数50)
B−4:ポリオキシエチレンスチレン化フェニルエーテル(青木油脂工業社製、KTSP−16、エチレンオキサイド単位の平均付加数16)
B−5:ポリオキシエチレンノニルフェニルエーテル(青木油脂工業社製、ブラウノンN−513、エチレンオキサイド単位の平均付加数13)
ポリオキシエチレンアルキルエーテル(ポリオキシエチレンラウリルエーテル)(花王社製、エマルゲン109P、エチレンオキサイド単位の平均付加数9)
Details of the components in Table 1 are as follows.
Ether compound B
B-1: polyoxyethylene distyrenated phenyl ether (manufactured by Kao Corporation, Emulgen A-90, average addition number of ethylene oxide units 18)
B-2: polyoxyethylene distyrenated phenyl ether (manufactured by Kao Corporation, Emulgen A-60, average addition number of ethylene oxide units 12)
B-3: polyoxyethylene distyrenated phenyl ether (manufactured by Kao Corporation, Emulgen A-500, average addition number of ethylene oxide units 50)
B-4: Polyoxyethylene styrenated phenyl ether (manufactured by Aoki Yushi Kogyo KK, KTSP-16, average addition number of ethylene oxide units 16)
B-5: polyoxyethylene nonyl phenyl ether (manufactured by Aoki Yushi Kogyo KK, Brownon N-513, average addition number of ethylene oxide units 13)
Polyoxyethylene alkyl ether (polyoxyethylene lauryl ether) (manufactured by Kao Corporation, Emulgen 109P, average addition number of ethylene oxide units 9)
<実施例2〜9>
エーテル化合物Bの種類及び/又は添加量を表1に示すように変更した以外は、実施例1と同様の方法でスチレン系樹脂組成物を製造し、各種物性の測定を行った。
<Examples 2 to 9>
A styrene resin composition was produced in the same manner as in Example 1 except that the type and / or the amount of the ether compound B were changed as shown in Table 1, and various physical properties were measured.
<実施例10>
原料溶液をスチレン77.1質量%、メタクリル酸5.9質量%、エチルベンゼン17質量%の混合溶液に変更した以外は、実施例1と同様の方法でスチレン系樹脂組成物を製造し、各種物性の測定を行った。
<Example 10>
Except that the raw material solution was changed to a mixed solution of 77.1% by mass of styrene, 5.9% by mass of methacrylic acid, and 17% by mass of ethylbenzene, a styrene resin composition was produced in the same manner as in Example 1, and various physical properties were obtained. Was measured.
<実施例11>
原料溶液をスチレン63.5質量%、メタクリル酸19.5質量%、エチルベンゼン17質量%の混合溶液に変更した以外は、実施例3と同様の方法でスチレン系樹脂組成物を製造し、各種物性の測定を行った。
<Example 11>
Except that the raw material solution was changed to a mixed solution of 63.5% by mass of styrene, 19.5% by mass of methacrylic acid, and 17% by mass of ethylbenzene, a styrene-based resin composition was produced in the same manner as in Example 3, and various physical properties were obtained. Was measured.
<比較例1〜3>
エーテル化合物を添加しない以外は、実施例1,10,11と同様の方法でスチレン系樹脂組成物を製造し、各種物性の測定を行った。
<Comparative Examples 1 to 3>
Except not adding the ether compound, styrene resin compositions were produced in the same manner as in Examples 1, 10, and 11, and various physical properties were measured.
<比較例4〜6>
エーテル化合物Bの代わりに、ポリオキシエチレンアルキルエーテルを添加した以外は、実施例1,4,10と同様の方法でスチレン系樹脂組成物を製造し、各種物性の測定を行った。
<Comparative Examples 4 to 6>
Styrene resin compositions were produced in the same manner as in Examples 1, 4, and 10 except that polyoxyethylene alkyl ether was added instead of the ether compound B, and various physical properties were measured.
3.考察
全ての実施例は、加熱によるMEK不溶分の増大が非常に小さかった。MEK不溶分は、主にゲル状物質であるので、ゲル状物質の生成が抑制されたことが実証された。
また、実施例1,4,10と比較例4〜6を比較すると、エーテル化合物Bの代わりに、ポリオキシエチレンアルキルエーテルを添加した場合には、ビカット軟化温度の低下が著しかった。
3. Discussion In all of the examples, the increase in MEK-insoluble content due to heating was very small. Since the MEK-insoluble matter is mainly a gel-like substance, it was demonstrated that the formation of the gel-like substance was suppressed.
When Examples 1, 4, and 10 were compared with Comparative Examples 4 to 6, when the polyoxyethylene alkyl ether was added instead of the ether compound B, the Vicat softening temperature was significantly reduced.
本発明のスチレン系樹脂組成物を用いることで、ゲルが極めて少ない樹脂組成物および成形品を製造することが出来、外観に優れた成形品を得ることが出来る。また、製造工程におけるゲル発生を従来よりも抑えることが出来、生産効率を上げることが出来る。 By using the styrenic resin composition of the present invention, a resin composition and a molded product having extremely low gel can be produced, and a molded product having excellent appearance can be obtained. Further, the generation of gel in the manufacturing process can be suppressed more than before, and the production efficiency can be increased.
Claims (11)
前記スチレン系樹脂は、スチレン系単量体と(メタ)アクリル酸系単量体を含む単量体混合物を共重合させて得られ、
前記エーテル化合物は、一般式(1)で表される、スチレン系樹脂組成物。
(式中のZ1〜Z5は、同一又は異なっており、水素原子であるか、又はヘテロ原子を有してもよい炭化水素基である。Z1〜Z5のうちの少なくとも2つが架橋されて脂環又は芳香環を形成していてもよい。nは、アルキレンオキサイド構造の炭素数を表し、1〜10の整数である。Xはアルキレンオキサイド単位の平均付加数を表し、1〜100の整数である。) A styrene-based resin composition containing a styrene-based resin and an ether compound,
The styrene resin is obtained by copolymerizing a monomer mixture containing a styrene monomer and a (meth) acrylic acid monomer,
The styrene-based resin composition, wherein the ether compound is represented by the general formula (1).
(Wherein Z1 to Z5 in the formula are the same or different and are each a hydrogen atom or a hydrocarbon group which may have a hetero atom. At least two of Z1 to Z5 are crosslinked to form an alicyclic ring. N represents the number of carbon atoms of the alkylene oxide structure, and is an integer of 1 to 10. X represents the average number of additions of the alkylene oxide unit, and is an integer of 1 to 100. .)
前記スチレン系樹脂組成物100質量%に対し、前記(メタ)アクリル酸系単量体に由来する構造単位の含有量が0.1〜30質量である、スチレン系樹脂組成物。 The styrenic resin composition according to claim 1,
A styrene-based resin composition, wherein the content of the structural unit derived from the (meth) acrylic acid-based monomer is 0.1 to 30% by mass based on 100% by mass of the styrene-based resin composition.
前記スチレン系樹脂組成物100質量%に対し、前記エーテル化合物の含有量が0.001〜10質量%である、スチレン系樹脂組成物。 A styrenic resin composition according to claim 1 or claim 2,
A styrene-based resin composition, wherein the content of the ether compound is 0.001 to 10% by mass based on 100% by mass of the styrene-based resin composition.
Z1〜Z5の少なくとも1つが、置換基を有してもよい炭素数1〜20のアルキル基である、スチレン系樹脂組成物。 A styrenic resin composition according to any one of claims 1 to 3, wherein
A styrene resin composition, wherein at least one of Z1 to Z5 is an alkyl group having 1 to 20 carbon atoms which may have a substituent.
前記置換基は、ヘテロ原子を有してもよい炭素数1〜20の炭化水素基である、スチレン系樹脂組成物。 The styrenic resin composition according to claim 4,
The styrene resin composition, wherein the substituent is a hydrocarbon group having 1 to 20 carbon atoms which may have a hetero atom.
前記置換基は、芳香環を含む、請求項5に記載のスチレン系樹脂組成物。 The styrenic resin composition according to claim 5, wherein
The styrenic resin composition according to claim 5, wherein the substituent includes an aromatic ring.
前記置換基の芳香環は、前記アルキル基に結合されているフェニル基である、スチレン系樹脂組成物。 The styrenic resin composition according to claim 6,
The styrene-based resin composition, wherein the aromatic ring of the substituent is a phenyl group bonded to the alkyl group.
前記置換基は、1−フェニルエチル基である、スチレン系樹脂組成物。 The styrenic resin composition according to claim 7,
The styrene resin composition, wherein the substituent is a 1-phenylethyl group.
前記アルキレンオキサイド構造の炭素数nが2〜4である、スチレン系樹脂組成物。 A styrenic resin composition according to any one of claims 1 to 8, wherein
A styrene-based resin composition wherein the alkylene oxide structure has 2 to 4 carbon atoms.
前記アルキレンオキサイド単位の平均付加数が5〜50である、スチレン系樹脂組成物。 A styrenic resin composition according to any one of claims 1 to 9, wherein
A styrene resin composition, wherein the average addition number of the alkylene oxide unit is 5 to 50.
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