JP2020022525A - Microneedle patch manufacturing apparatus - Google Patents

Abstract

To provide a microneedle patch manufacturing apparatus capable of removing microbubbles produced during a manufacturing process of a microneedle patch.SOLUTION: The microneedle patch manufacturing apparatus 1 includes: a silicon mold to an upper surface of which a material for the microneedle patch is steadily fixed; a carrier 12 to an upper inside of which a silicon mold is steadily fixed; an upper block 13 which forms a chamber to be mated with the carrier; an air cylinder 14 coupled to an upper surface of the upper block to transmit power so that it can be lifted to separate from the carrier; and a pressurizing unit 15 coupled to a side of the upper block to pressurize the chamber or ventilate the pressurized chamber. The upper block rises and separates from the carrier after the pressurization and ventilation by the pressurizing unit, and the pressurization and ventilation by the pressurizing unit are repeated a plurality of times to remove air bubbles that have flowed into the material during the molding process of the material.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an apparatus for manufacturing a microneedle patch, and more particularly, to an apparatus for manufacturing a microneedle patch that can remove microbubbles generated in the process of manufacturing a microneedle patch.

  There is a problem that micro-bubbles are generated in the silicon mold during the manufacture of microneedle patches. To solve this problem, there is a method of applying vacuum pressure to expand the bubbles and lift them up on the surface of the silicon mold. .

  However, such a method has a disadvantage in that it takes a lot of time to fall by buoyancy when the expanded bubbles are attached to the handle of the silicon mold when floating.

  In addition, as shown in FIG. 1, when a vacuum pressure is applied, a phenomenon occurs in which oxygen dissolved in the drug springs out, and the product is dried with fine bubbles remaining. There is a point.

  In addition, air bubbles were removed by a method of applying pressure using a device such as a press or a roller. However, in such a case, a drug was brought into contact with the pressure device and there was a problem of secondary contamination. There is a problem that the cleanliness in the manufacturing process is adversely affected.

US Patent No. 8834423 (2014.9.16) US Registered Patent No. 83533861 (2013.1.15)

The present invention is directed to solving the above-described problems of the related art, and relates to an apparatus for manufacturing a microneedle patch that can effectively remove microbubbles generated during a manufacturing process of a microneedle patch. is there.
The present invention also relates to a microneedle patch manufacturing apparatus capable of shortening the manufacturing time of the microneedle patch and increasing the productivity.
The present invention also relates to a microneedle patch manufacturing apparatus capable of minimizing contamination of a microneedle patch with a drug.

  The technical problems to be solved by the present invention are not limited by the technical problems mentioned above, and the other technical problems which have not been mentioned are usually in the technical field to which the present invention belongs from the following description. Will be clearly understood by those with knowledge of

  As described above, the apparatus for manufacturing a microneedle patch according to the present invention includes a silicon mold that is seated on an upper surface in order to form a material for a microneedle patch, and the silicon mold that is seated inside an upper surface. A carrier to be formed, an upper block formed with the carrier to form a chamber in which the material and the silicon mold can be accommodated, and a lower block for the upper block to be formed with the carrier. An air cylinder connected to the upper surface of the upper block to transmit power so as to ascend to separate from the carrier, and pressurizing the chamber with the upper block and the carrier being aligned with each other. Or connected to the side surface of the upper block so that the pressurized chamber can be ventilated. The upper block is raised after being pressurized and ventilated by the pressurizing part in a state where the upper block descends and is formed so as to form the chamber together with the carrier, including the pressure part. The pressurizing unit may be repeatedly pressurized and ventilated a plurality of times so that air bubbles introduced into the material during the molding process of the material are removed from the carrier. .

  As described above, according to the apparatus for manufacturing a microneedle patch according to the present invention, a material and a drug for manufacturing the microneedle patch are put in a gas in a state where they are seated in a silicon mold, and a plurality of pressurization and ventilation are performed. Since the material containing the drug is formed in a repetitive manner, fine bubbles generated in the process of manufacturing the microneedle patch during the repeated pressurization and ventilation can be effectively removed. There is.

  According to the present invention, there is an advantage that the production time of the microneedle patch can be further shortened and the productivity can be improved, as compared with the conventional method of removing bubbles by vacuum pressure.

  Also, in contrast to the conventional method of directly pressing a material containing a drug with a device such as a press or a roller, in the present invention, pressure is applied by gas such as air without direct contact with a device, so that a microneedle is used. Advantageously, contamination of the patch with the drug can be minimized.

Photograph and explanatory view showing a state in which bubbles are removed using conventional vacuum pressure FIG. 2 is a perspective view showing a microneedle patch manufacturing apparatus according to the present invention. Front view showing a state in which an upper block is raised in a microneedle patch manufacturing apparatus according to the present invention. Front view showing a state in which an upper block is lowered in a microneedle patch manufacturing apparatus according to the present invention. Explanatory drawing showing a state of an upper block in a microneedle patch manufacturing apparatus according to the present invention. Explanatory diagram showing a process of repeating pressurization and ventilation by a pressurizing unit in a microneedle patch manufacturing apparatus according to the present invention. Explanatory drawing showing a state in which a carrier, a silicon mold and a sealing member are combined in a microneedle patch manufacturing apparatus according to the present invention. Explanatory drawing showing a state in which a carrier, a silicon mold, and a sealing member are separated in a microneedle patch manufacturing apparatus according to the present invention. Explanatory drawing showing a detailed state of a carrier in a microneedle patch manufacturing apparatus according to the present invention. Explanatory view showing a state in which a plurality of microneedle patch manufacturing apparatuses according to the present invention are arranged and a continuous pressing step is performed.

  Hereinafter, an embodiment of an apparatus for manufacturing a microneedle patch according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 2 is a perspective view showing a microneedle patch manufacturing apparatus according to the present invention, and FIG. 3 is a front view showing a state in which an upper block is raised in the microneedle patch manufacturing apparatus according to the present invention. FIG. 4 is a front view showing a state in which the upper block is lowered in the microneedle patch manufacturing apparatus according to the present invention. FIG. 5 is a drawing showing a state of the upper block in the microneedle patch manufacturing apparatus according to the present invention. FIG. 6 is a view illustrating a process of repeating pressurization and ventilation by a pressurizing unit in the microneedle patch manufacturing apparatus according to the present invention. FIG. 7 is a view illustrating a state in which a carrier, a silicon mold and a sealing member are combined in the apparatus for manufacturing a microneedle patch according to the present invention. FIG. FIG. 9 is a view showing a state where the mold and the sealing member are separated, FIG. 9 is a view showing a detailed state of a carrier in the apparatus for manufacturing a microneedle patch according to the present invention, and FIG. It is a figure showing signs that a plurality of arrangements are performed and a continuous pressurization process is performed.

  Referring to FIGS. 2 to 10, a microneedle patch manufacturing apparatus 1 according to the present invention includes a silicon mold 11 which is settled on an upper surface in order to form a microneedle patch material 2, and a silicon mold 11 on an inner surface of the upper surface. A carrier 12 on which a mold 11 is seated; an upper block 13 which is formed with the carrier 12 to form a chamber 10 in which the material 2 and the silicon mold 11 can be accommodated; An air cylinder 14 connected to the upper surface of the upper block 13 for transmitting power, such that the air cylinder 13 descends to be fitted with the carrier 12 and rises to be separated from the carrier 12; Pressurizing the chamber 10 with the block 13 and carrier 12 aligned with each other, or the pressurized chamber As can be ventilated 10 includes a pressing portion 15 connected to the side surface of the upper block 13.

  The carrier 12 is provided so as to be movable so that its position can be changed. The carrier 12 is transported so that it can be positioned directly below the upper block 13, and the upper block 13 is lowered and shaped, and the pressurizing unit 15 pressurizes and ventilates the carrier 12. . After the pressurization and ventilation are completed, the upper block 13 rises and separates from the carrier 12, and the carrier 12 can be transferred so as to be separated from directly below the upper block 13. .

  The microneedle patch manufacturing apparatus 1 includes a base plate 171 on which the carrier 12 is transferred and seated, and a base plate 171 that is spaced apart from the base plate 171. And a separation plate 172 defining a space into which the upper block 13 can be transferred, and the base plate 171 and the separation plate so that the separation plate 172 can be fixed to be separated from the base plate 171. A support portion 173 connecting the 172 and a guide hole 175 formed in the separation plate 172 so as to be able to move up and down in a vertical direction. Fixed and guides the upward and downward direction of the upper block 13 Further including that guide post 18.

  The base plate 171 has a rectangular flat plate shape and supports the rest of the microneedle patch manufacturing apparatus 1. A heating plate 174 for heating the carrier 12 and the silicon mold 11 is installed at the center of the upper surface of the base plate 171, that is, at a fulcrum where the carrier 12 is located.

  The separation plate 172 is also formed in the shape of a rectangular flat plate equal to the base plate 171, and serves to support the air cylinder 14, the guide post 18, the upper block 13, and the like.

  Then, in the microneedle patch manufacturing apparatus 1, the carrier 12 is transferred directly below the upper block 13, and the upper block 13 is lowered to form a state in which the carrier 12 and the chamber 10 can be formed. Then, after the pressurizing unit 15 pressurizes and ventilates, the upper block 13 rises and separates from the carrier 12, and the carrier 12 is detached from immediately below the upper block 13 by the material. The molding of No. 2 is performed. In addition, pressurization and ventilation by the pressurizing unit 15 are repeatedly performed a plurality of times so that air bubbles that have flowed into the material 2 during the molding process of the material 2 are removed.

  More specifically, the carrier 12 may be transferred and positioned on the upper surface of the base plate 171. That is, the carrier 12 may be transferred by a driving device such as a conveyor and positioned on the upper surface of the base plate 171. After the molding of the material 2 is completed, the material 2 can be transferred so as to be separated from the base plate 171.

  The silicon mold 11 is seated on the upper surface of the carrier 12 transferred to the upper surface of the base plate 171, and the silicon mold 11 is filled with a material 2 containing a chemical for manufacturing a microneedle patch. Become comfortable.

  While the upper block 13 is located at the uppermost end while the carrier 12 is transferred, the carrier 12 is positioned on the upper surface of the base plate 171, that is, at a fulcrum corresponding to the position directly below the upper block 13. Then, the carrier 10 is lowered and is matched with the carrier 12 to form the chamber 10 together with the carrier 12.

  At this time, a sealing member 19 is installed on the upper frame of the carrier 12 so that the chamber 10 can be tightly sealed while the carrier 12 is aligned with the upper block 13. You. FIGS. 7 and 8 show a state where the silicon mold 11 and the sealing member 19 are seated on the upper surface of the carrier 12.

  Also, as shown in FIG. 9, a large and shallow mold installation groove 120 is formed at the center of the upper surface of the carrier 12 so that the silicon mold 11 can be seated thereon. The upper surface frame of the carrier 12 is provided with a sealing groove 121 in which the sealing member 19 is seated and press-fitted so as to reinforce airtightness. A fixing protrusion 122 is formed in the mold installation groove 120 of the carrier 12 so that the silicon mold 11 can be more firmly fixed. That is, when the silicon mold 11 is installed on the upper surface of the carrier 12, the fixing protrusion 122 is inserted into the fixing hole 110 formed in the silicon mold 11, so that the silicon mold 11 is moved. It can be more firmly installed on the carrier 12.

  Next, in a state where the upper block 13 and the carrier 12 are aligned and the chamber 10 is shielded, a gas such as air or the like is generated in the chamber 10 by the pressurizing unit 15 connected to the upper block 13. The pressure inside the chamber 10 is increased by the inflow.

  At this time, the upper block 13 is connected to the pressurizing unit 15 so that gas supplied for pressurization from the pressurizing unit 15 can flow into the chamber 10. A pressure channel 130 is formed. The pressurizing flow path 130 extends from the side surface of the upper block 13 to the center of the upper block 13 and guides the gas flowing from the pressurizing portion 15 to the center of the upper block 13. A channel 131 and a vertical channel 132 formed to extend downward from the horizontal channel 131 to the chamber 10 and guide the gas flowing into the horizontal channel 131 to the chamber 10. Accordingly, the gas introduced into the upper block 13 by the pressurizing unit 15 is supplied to the chamber 10 through the pressurizing channel 130, so that the pressure in the chamber 10 can be increased.

  The pressurizing unit 15 includes a pressurizing pipe 151 connected to the upper block 13 and guiding the gas to be supplied to the upper block 13. And a valve 152 installed on the side to regulate the flow of gas through the pressure pipe 151.

  When the pressure of the chamber 10 is increased by the pressurizing unit 15, the material 2 and the silicon mold 11 receive pressure due to the gas pressure inside the chamber 10, and fine bubbles included in the material 2 are generated. The material is naturally removed while being separated from the material 2. After the fine bubbles of the material 2 have been removed to some extent, the internal pressure of the chamber 10 is reduced while the high-pressure gas inside the chamber 10 is exhausted to the outside by the pressurizing unit 15, that is, the ventilation process is performed. become.

  The pressurization and ventilation processes by the pressurizing unit 15 are repeatedly performed in the order of primary pressurization, primary ventilation, secondary pressurization, secondary ventilation, and tertiary pressurization. At this time, during the first pressurization, the second pressurization, and the third pressurization, the pressure inside the chamber 10 is increased to reach 2 to 3 bar.

  The number of repetitions of the pressurizing and ventilating processes and the pressure value of the chamber 10 during pressurizing may be determined by the number of times in order to find an appropriate condition for effectively removing the fine bubbles contained in the material 2. This was seen as the optimal pressurization condition in removing fine bubbles contained in the material 2.

  After all the pressurization and ventilation processes are completed, that is, after the molding of the material 2 is completed, the chamber 10 is opened while the upper block 13 is raised, and the carrier 12 is opened. Is transferred, and the material 2 on which the molding is completed can be discharged from the base plate 171.

  On the other hand, as shown in FIG. 10, a plurality of the microneedle patch manufacturing apparatuses 1 are arranged on a conveyor line that is continuously transferred, and the plurality of carriers 12 that are transferred along the conveyor are the plurality of carriers. The pressurizing and ventilating processes may be repeatedly performed more times while sequentially passing through the microneedle patch manufacturing apparatus 1. Thereby, there is an advantage that the air bubbles remaining in the silicon mold 11 and the material 2 can be more completely removed.

  According to the present invention, the material 2 for manufacturing the microneedle patch and the drug are placed in the silicon mold 11 and gas is introduced into the silicon mold 11 to repeatedly pressurize and ventilate the drug. Since the material 2 containing the material is formed, there is an advantage that fine bubbles generated in the manufacturing process of the microneedle patch can be effectively removed through the repeated pressurization and ventilation processes.

  In particular, the primary pressurization, the primary pressurization, the secondary pressurization, the secondary pressurization, and the tertiary pressurization are repeatedly performed, and the chamber is used at the time of the primary pressurization, the secondary pressurization, and the tertiary pressurization. Since the pressurizing and ventilating processes are performed under optimal conditions so that the internal pressure of 10 reaches 2-3 bar, the effect of removing fine bubbles can be further maximized.

  According to the present invention, the production time of the microneedle patch can be shortened more than the conventional method of removing air bubbles by vacuum pressure, and thus there is an advantage that the productivity can be increased.

  Also, in contrast to the conventional method of directly pressing the material 2 containing a drug with a device such as a press or a roller, in the present invention, the pressure is made by gas such as air without direct contact with the device. Advantageously, contamination of the patch with the drug can be minimized.

  Thus, within the scope of the basic technical concept of the present invention, it is needless to say that those skilled in the art can make many other modifications, and the scope of the present invention is attached. According to the claims.

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus of microneedle patch 10 Chamber 11 Silicon mold 12 Carrier 13 Upper block 14 Air cylinder 15 Pressurizing part 18 Guide post 19 Sealing member 110 Fixing hole 120 Mold setting groove 121 Sealing groove 122 Fixing projection 130 Pressurizing channel 131 Horizontal flow path 132 Vertical flow path 151 Pressurized piping 152 Valve 171 Base plate 172 Separation plate 173 Support section 174 Heating plate 175 Guide hole

Claims (6)

A silicon mold that is seated on the upper surface to form the microneedle patch material,
A carrier on which the silicon mold is seated on the inner side of the upper surface,
An upper block that is formed with the carrier to form a chamber in which the material and the silicon mold can be accommodated;
An air cylinder coupled to an upper surface of the upper block to transmit power so that the upper block can be lowered to form with the carrier and lifted to separate from the carrier;
A pressurizing unit connected to a side surface of the upper block so as to pressurize the chamber while the upper block and the carrier are aligned with each other or to ventilate the pressurized chamber; , Including
The upper block is lifted and separated from the carrier after being pressurized and ventilated by the pressurizing unit in a state where the upper block descends and is formed so as to form the chamber with the carrier. ,
An apparatus for manufacturing a microneedle patch, wherein pressurization and ventilation by the pressurizing unit are repeatedly performed a plurality of times so as to remove bubbles introduced into the material during a process of forming the material. The carrier is provided so as to be movable so that the position can be changed,
The carrier is transferred so that it can be positioned directly below the upper block, and the upper block is lowered and shaped, and the pressurizing unit is pressurized and ventilated,
2. The microneedle patch according to claim 1, wherein after the pressurization and ventilation are completed, the upper block rises and separates from the carrier, and the carrier is transferred so as to be separated from immediately below the upper block. Manufacturing equipment. The pressurization and ventilation processes by the pressurization unit are performed in the following order: primary pressurization, primary ventilation, secondary pressurization, secondary ventilation, and tertiary pressurization.
3. The apparatus of claim 2, wherein the first pressurization, the second pressurization, and the third pressurization are performed so that the internal pressure of the chamber reaches 2 to 3 bar. 4. And a sealing member installed on an upper frame of the lower block so that the chamber can be tightly sealed with the lower block being aligned with the upper block. 3. The microneedle patch manufacturing apparatus according to 3. The upper block has a pressurized flow path that connects the pressurizing unit and the chamber so that gas supplied for pressurizing from the pressurizing unit can flow into the chamber.
The pressurized flow path,
A horizontal flow path that extends from the side surface of the upper block to the center of the upper block and guides gas flowing from the pressurizing unit to the center of the upper block;
A vertical flow path formed to extend downward from the horizontal flow path to the chamber, and guiding a gas flowing into the horizontal flow path to the chamber; and a vertical flow path. manufacturing device. A base plate on which the carrier is transferred and seated,
A separation plate positioned above the base plate to form a space in which the carrier, the lower block, and the upper block can be transferred between the base plate and the base plate;
A support unit that connects the base plate and the separation plate so that the separation plate can be fixed while being separated from the base plate;
A lower portion is fixed to an upper surface of the upper block and guides the upper block in a vertical direction by penetrating along a guide hole formed in the separation plate. The manufacturing apparatus of the microneedle patch according to claim 5, further comprising: a guide post.

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