JP2020019927A - 接着剤組成物 - Google Patents
接着剤組成物 Download PDFInfo
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- JP2020019927A JP2020019927A JP2019077884A JP2019077884A JP2020019927A JP 2020019927 A JP2020019927 A JP 2020019927A JP 2019077884 A JP2019077884 A JP 2019077884A JP 2019077884 A JP2019077884 A JP 2019077884A JP 2020019927 A JP2020019927 A JP 2020019927A
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- JP
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- Prior art keywords
- adhesive
- adhesive composition
- peeling
- thermoplastic resin
- thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (3)
- 所定の加熱温度において相溶性を有して溶融するとともに互いに屈折率が異なるオレフィン系重合体と熱可塑性ポリウレタンまたは/および熱可塑性ポリエステルの重量比率が80/20〜20/80である熱可塑性樹脂と、平均粒径が0.3〜20μmで前記熱可塑性樹脂に非相溶性である微粒子と、溶媒と、からなることを特徴とする接着剤組成物。
- 前記微粒子の配合量が前記熱可塑性樹脂100重量部あたり0.5〜30重量部であることを特徴とする請求項1記載の接着剤組成物。
- 前記微粒子がゴムであることを特徴とする請求項1または2記載の接着剤組成物。
Priority Applications (1)
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JP2019077884A JP7115752B2 (ja) | 2019-04-16 | 2019-04-16 | 接着剤組成物 |
Applications Claiming Priority (1)
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JP2019077884A JP7115752B2 (ja) | 2019-04-16 | 2019-04-16 | 接着剤組成物 |
Related Parent Applications (1)
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JP2018144540A Division JP6545873B1 (ja) | 2018-07-31 | 2018-07-31 | 接着剤組成物の使用方法 |
Publications (2)
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JP2020019927A true JP2020019927A (ja) | 2020-02-06 |
JP7115752B2 JP7115752B2 (ja) | 2022-08-09 |
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JP2019077884A Active JP7115752B2 (ja) | 2019-04-16 | 2019-04-16 | 接着剤組成物 |
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JP (1) | JP7115752B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60212432A (ja) * | 1984-04-06 | 1985-10-24 | Otsuka Chem Co Ltd | 合成樹脂成型品と多孔質芯材との接着方法 |
JPH10178065A (ja) * | 1996-10-15 | 1998-06-30 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
WO2016171253A1 (ja) * | 2015-04-23 | 2016-10-27 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
-
2019
- 2019-04-16 JP JP2019077884A patent/JP7115752B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60212432A (ja) * | 1984-04-06 | 1985-10-24 | Otsuka Chem Co Ltd | 合成樹脂成型品と多孔質芯材との接着方法 |
JPH10178065A (ja) * | 1996-10-15 | 1998-06-30 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
WO2016171253A1 (ja) * | 2015-04-23 | 2016-10-27 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
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JP7115752B2 (ja) | 2022-08-09 |
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