JP2020017772A - Coil component - Google Patents

Abstract

To provide a coil component capable of improving connection reliability between one-side planar spiral wiring and other-side planar spiral wiring that are disposed in a lamination direction.SOLUTION: A coil component comprises: first planar spiral wiring; and a second planar spiral wiring which is positioned at an upper side of the first planar spiral wiring in a lamination direction and mutually connected with the first planar spiral wiring through a connection via. The second planar spiral wiring is wound in a direction that is different from a winding direction of the first planar spiral wiring, in a view in the lamination direction. The first planar spiral wiring and the second planar spiral wiring include innermost peripheral overlapped portions which are overlapped with each other in the view in the lamination direction, at an innermost peripheral side. In the coil component, at least both ends of the innermost peripheral overlapped portion of the first planar spiral wiring and at least both ends of the innermost peripheral overlapped portion of the second planar spiral wiring are mutually connected through the connection via.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a coil component. Specifically, the present invention relates to a laminated coil component.

  In a conventional laminated coil component, one planar spiral wiring wound in one direction and the other planar spiral wiring wound in a direction opposite to one direction are connected via connection vias in the laminating direction. Are connected to each other. Patent Literature 1 discloses a multilayer coil component in which the inner peripheral end of the one planar spiral wiring and the inner peripheral end of the other planar spiral wiring are connected to each other via one connection via. I have.

JP 2013-225718 A

  However, as shown in FIG. 9, the inner peripheral end of one planar spiral wiring 101 and the inner peripheral end of the other planar spiral wiring 102 are connected to each other via one connection via 103 along the stacking direction. Connection reliability may not be sufficient.

  Therefore, an object of one embodiment of the present invention is to provide a coil component capable of improving the connection reliability between one planar spiral wiring and the other planar spiral wiring arranged in the stacking direction.

In order to solve the above problem, in one embodiment of the present invention,
A first planar spiral interconnect, and a second planar spiral interconnect located above the first planar spiral interconnect in the stacking direction and interconnected with the first planar spiral interconnect via a connection via;
The second planar spiral wiring is wound in a direction different from the winding direction of the first planar spiral wiring when viewed from the lamination direction,
The first planar spiral wiring and the second planar spiral wiring each have, on the innermost peripheral side, an innermost peripheral overlapping portion overlapping each other when viewed from the laminating direction, and
At least both ends of the innermost peripheral overlapping portion of the first planar spiral wiring and at least both ends of the innermost peripheral overlapping portion of the second planar spiral wiring are connected to each other via the connection via. , A coil component is provided.

  In the coil component according to the above aspect, at least both ends of the innermost peripheral overlapping portion of the first planar spiral wiring overlapping with each other as viewed from the laminating direction are connected to at least both ends of the innermost peripheral overlapping portion of the second planar spiral wiring. They are interconnected via vias. Thereby, the innermost peripheral overlapping portions of the spiral wirings are connected to each other via two connection vias, so that the inner peripheral ends are connected to each other via a single connection via. Points increase. Therefore, the connection reliability between the first planar spiral wiring and the second planar spiral wiring can be improved without substantially changing the number of turns, the outermost diameter, the number of layers, and the like of these planar spiral wirings.

  In one embodiment, one end of each innermost peripheral overlapping portion of the first planar spiral wiring and the second planar spiral wiring is connected to the innermost peripheral overlapping portion of each of the first planar spiral wiring and the second planar spiral wiring. Is positioned at a portion that is half-turned from the other end.

  That is, compared to the conventional configuration in which the inner peripheral end of one planar spiral wiring and the inner peripheral end of the other planar spiral wiring are connected to each other via one connection via in the stacking direction. The innermost peripheral side of each planar spiral wiring is further wound by a quarter turn. Thus, the area of the innermost peripheral overlapping portion of each planar spiral wiring can be enlarged while securing a sufficient wiring interval. Therefore, it is possible to secure an area for connecting the innermost peripheral overlapping portions with a plurality of connection vias. Therefore, it is possible to improve the connection reliability between the first planar spiral wiring and the second planar spiral wiring.

  In one embodiment, between the both ends of the innermost peripheral overlapping portion of the first planar spiral wiring and between both ends of the innermost peripheral overlapping portion of the second planar spiral wiring via one or more connection vias. Are also connected. Thereby, besides both ends of the innermost peripheral overlapping portion of the first planar spiral wiring and both ends of the innermost peripheral overlapping portion of the second planar spiral wiring, between both ends of the innermost peripheral overlapping portion of the first planar spiral wiring The two ends of the innermost overlapped portion of the second planar spiral wiring are further connected to each other via connection vias. Therefore, the number of connection points between the first planar spiral wiring and the second planar spiral wiring can be further increased. Therefore, the connection reliability between the first planar spiral wiring and the second planar spiral wiring can be further improved.

  In one embodiment, the entire region of the innermost peripheral overlapping portion of the first planar spiral wiring and the entire region of the innermost peripheral overlapping portion of the second planar spiral wiring are interconnected via connection vias.

  That is, the connection via between the innermost peripheral overlapping portion of the first planar spiral wiring and the innermost peripheral overlapping portion of the second planar spiral wiring is filled. Therefore, the area for connecting the first planar spiral wiring and the second planar spiral wiring can be increased. Therefore, the connection reliability between the first planar spiral wiring and the second planar spiral wiring can be further improved.

  In one embodiment, the coil component further includes a magnetic core extending to the winding center of the first planar spiral wiring and the winding center of the second planar spiral wiring. When the magnetic core is made of a material having high magnetic permeability, the inductance of the coil component can be further increased.

  In one embodiment, the width dimension of the innermost peripheral overlapping portion of the first planar spiral wiring is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the first planar spiral wiring, and the innermost peripheral portion of the second planar spiral wiring. The width dimension of the peripheral overlapping portion is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the second planar spiral wiring. Thereby, the area of each winding center of the first planar spiral wiring and the second planar spiral wiring can be expanded. Therefore, it is possible to expand the magnetic core portion extending at the center of each winding of the first planar spiral wiring and the second planar spiral wiring. Therefore, the inductance of the coil component can be further increased.

  In one embodiment, the width dimension of the innermost peripheral overlapping part of the first planar spiral wiring is smaller than the width dimension of the part other than the innermost peripheral overlapping part of the first planar spiral wiring, and the innermost peripheral part of the first planar spiral wiring is the same. The outer edge of the peripheral overlapping portion and the outer edge of the portion other than the innermost peripheral overlapping portion of the first planar spiral wiring are continuous without irregularities. Further, the width dimension of the innermost peripheral overlapping portion of the second planar spiral wiring is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the second planar spiral wiring, and the innermost peripheral overlapping portion of the second planar spiral wiring is provided. And the outer edges of portions other than the innermost peripheral overlapping portion of the second planar spiral wiring are continuous without irregularities.

  Thereby, the inner edge of the innermost peripheral overlapping portion of the first planar spiral wiring and the second planar spiral wiring and the inner edge other than the innermost peripheral overlapping portion of the first planar spiral wiring and the second planar spiral wiring are respectively discontinuous. be able to. In other words, regions bulging outward can be formed on the inner edge side of the innermost peripheral overlapping portion of the first planar spiral wiring and the second planar spiral wiring. Therefore, when the coil component further includes a magnetic core extending to the winding center of the first planar spiral wiring and the winding center of the second planar spiral wiring, only the portion along the bulge of the region is provided. It is possible to increase the diameter of the magnetic core. As a result, the inductance of the coil component can be further increased.

  According to the coil component of the above aspect, the connection reliability between the first planar spiral wiring and the second planar spiral wiring can be improved.

FIG. 1 is a schematic cross-sectional view schematically showing a coil component according to one embodiment. FIG. 2 shows both ends of the innermost peripheral overlapping portion of the first planar spiral wiring overlapping each other in the line segment AA ′ shown in FIG. 1 when viewed from the laminating direction, and the innermost peripheral overlapping portion of the second planar spiral wiring. It is the schematic plan view which showed typically the form in which the both ends of the part were mutually connected via the connection via | veer. FIG. 3A is a schematic plan view schematically showing a form in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 3B is a schematic plan view schematically showing a form in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the second planar spiral wiring. FIG. 4A is a schematic plan view schematically showing a form in which a plurality of connection vias are arranged in the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 4B is a schematic plan view schematically showing a form in which a plurality of connection vias are arranged in the innermost peripheral overlapping portion of the second planar spiral wiring. FIG. 5A is a schematic plan view schematically showing a form in which connection vias are arranged in the entire area of the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 5B is a schematic plan view schematically showing a form in which connection vias are arranged in the entire area of the innermost peripheral overlapping portion of the second planar spiral wiring. FIG. 6A is a schematic plan view schematically showing a form in which the width dimension of the innermost peripheral overlapping portion of the first planar spiral wiring is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the first planar spiral wiring. is there. FIG. 6B is a schematic plan view schematically showing a form in which the width dimension of the innermost peripheral overlapping portion of the second planar spiral wiring is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the second planar spiral wiring. is there. FIG. 7A is a schematic plan view schematically showing another mode in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 7B is a schematic plan view schematically showing another mode in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the second planar spiral wiring. FIG. 8A is a schematic cross-sectional view schematically showing a state in which a first planar spiral wiring is formed on an insulating layer. FIG. 8B is a schematic cross-sectional view schematically showing a state where the second planar spiral wiring is formed on the insulating layer. FIG. 8C is a schematic cross-sectional view schematically showing a state in which an insulating layer covering the second planar spiral wiring is further formed. FIG. 8D is a schematic cross-sectional view schematically showing a state in which a through hole for providing a magnetic core is formed. FIG. 8E is a schematic cross-sectional view schematically showing a state in which the terminal is formed on the insulating layer. FIG. 8F is a schematic cross-sectional view schematically showing a state in which the magnetic core and the magnetic layer are formed. FIG. 8G is a schematic cross-sectional view schematically showing the finally obtained coil component. FIG. 9 is a schematic plan view schematically showing a conventional coil component.

  Hereinafter, coil components according to a plurality of embodiments which are one aspect of the present invention will be described with reference to the drawings.

  In this specification, the “stacking direction” refers to a direction in which the layers are stacked. The “first planar spiral wiring” and the “second planar spiral wiring” refer to a spirally wound wiring. In this specification, "the planar spiral wiring is wound in a different direction" means that one planar spiral wiring is wound clockwise, for example, from the outside to the inside (or from the inside to the outside). It is a state in which the other planar spiral wiring is wound counterclockwise. In addition, not only when the wiring completely overlaps in the line width direction but also when the wiring partially overlaps in the line width direction, the overlapping portion may be the innermost peripheral overlapping portion.

[First Embodiment]
First, a coil component 1 according to a first embodiment, which is one aspect of the present invention, will be described with reference to FIGS. 1 to 3B.

  FIG. 1 is a schematic sectional view schematically showing a coil component according to the first embodiment. FIG. 2 shows both ends of the innermost peripheral overlapping portion of the first planar spiral wiring overlapping each other in the line segment AA ′ shown in FIG. 1 when viewed from the laminating direction, and the innermost peripheral overlapping portion of the second planar spiral wiring. It is the schematic plan view which showed typically the form in which the both ends of the part were mutually connected via the connection via | veer. FIG. 3A is a schematic plan view schematically showing a form in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 3B is a schematic plan view schematically showing a form in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the second planar spiral wiring.

  The coil component 1 according to the first embodiment can be used for electronic devices such as a smartphone and a car navigation system of an automobile. The coil component 1 according to the first embodiment includes a first planar spiral wiring 2 and a second planar spiral wiring 3 arranged in an insulating layer 12 as shown in FIG. Also, as shown in FIGS. 1 and 2, the magnetic core portion 13 is disposed so as to extend to the winding center of the first planar spiral wiring 2 and the winding center of the second planar spiral wiring 3. I have. As shown in FIG. 1, the magnetic core 13 is arranged such that both ends are connected to the magnetic layer 14. The first planar spiral wiring 2 and the second planar spiral wiring 3 are such that the second planar spiral wiring 3 is located above the first planar spiral wiring 2 along the stacking direction, and the first planar spiral wiring 2 and the second planar spiral wiring 3 The spiral wirings 3 are arranged so that the winding centers thereof overlap. Further, as shown in FIGS. 3A and 3B, the first and second planar spiral wirings 2 and 3 have lead portions 2a and 3a that are linearly drawn from the outer peripheral ends of the respective spiral shapes. Further, as shown in FIG. 1, the coil component 1 includes a pair of external terminals 39 as terminals for external connection. One of the external terminals 39 is electrically connected to a lead portion 3b electrically connected to the lead portion 2a of the first planar spiral wiring 2 via a connection via, and the other of the external terminals 39 is connected to a connection via. Is electrically connected to the lead portion 3a of the second planar spiral wiring 3 through the wire. Note that the second planar spiral wiring 3 and the lead portion 3b are arranged in the same layer, but are not connected in the layer.

  The second planar spiral wiring 3 (see FIG. 3B) is mutually connected to the first planar spiral wiring 2 (see FIG. 3A) via connection vias in the stacking direction. Each of the first planar spiral wiring 2 and the second planar spiral wiring 3 is wound over n rounds (n: natural number) and less than n + 1 rounds. In other words, the inner peripheral ends of the first planar spiral wiring 2 and the second planar spiral wiring 3 are located at positions that are more than n rounds (n: natural number) and less than n + 1 rounds. Specifically, in the coil component 1, the first planar spiral wiring 2 is wound 1.5 turns in a counterclockwise direction from the outside to the inside as shown in FIG. 3A. Further, in the coil component 1, the second planar spiral wiring 3 is wound 1.5 times clockwise from the outside to the inside as shown in FIG. 3B. In the portions 5 and 6 corresponding to a half circumference from the innermost ends 7 and 10 of the first planar spiral wiring 2 and the second planar spiral wiring 3, the first planar spiral wiring 2 and the magnetic core portion 13 And the distance between the second planar spiral wiring 3 and the magnetic core portion 13 are substantially equal to each other. Further, the first planar spiral wiring 2 and the second planar spiral wiring 3 have the same width over the entire circumference and each other.

  In this case, as shown in FIG. 2, the portion 5 of the first planar spiral wiring 2 and the portion 6 of the second planar spiral wiring 3 are located at the innermost peripheral side where they substantially overlap each other when viewed from the lamination direction. It is an inner circumference overlapping part. That is, in the coil component 1, the first planar spiral wiring 2 and the second planar spiral wiring 3 have innermost peripheral overlapping portions 5 and 6, respectively.

  As described above, in the first embodiment, one end of each of the innermost peripheral overlapping portions 5 and 6 of the first planar spiral wiring 2 and the second planar spiral wiring 3 is connected to the first planar spiral wiring 2 and the second planar spiral wiring 2. The innermost peripheral overlapping portions 5 and 6 of the two-plane spiral wiring 3 are positioned at a portion that is half-turned from the other end. That is, the inner peripheral end of one conventional planar spiral wiring 101 shown in FIG. 9 and the inner peripheral end of the other planar spiral wiring 102 are connected to each other via one connection via 103 in the laminating direction. In the coil component 1, the innermost peripheral sides of the first and second planar spiral wirings 2 and 3 are further wound by a quarter turn in comparison with the embodiment. At this time, it is possible to increase the area of the innermost peripheral overlapping portions 5 and 6 of the planar spiral wirings 2 and 3 after securing a sufficient wiring interval with the planar spiral wirings 2 and 3 one round outside. .

  In the first embodiment, as shown in FIG. 2, the first end 7 of the first planar spiral wiring 2 and the second planar spiral wiring which form one end of the innermost peripheral overlapping portions 5 and 6 are formed. 3 are connected to each other via the first connection via 4. Further, the second end 9 of the first planar spiral wiring 2 and the second end 10 of the second planar spiral wiring 3 forming the other end of the innermost peripheral overlapping portions 5 and 6 are connected to the second connection via. 11 are connected to each other. That is, both ends 7, 9 of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 and both ends 8, 10 of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 are two connection vias 4. , 11 are connected to each other. This increases the number of connection points as compared with the case where the inner peripheral ends are connected to each other via one connection via 103 as shown in FIG. Therefore, the first planar spiral wiring 2 and the second planar spiral wiring 2 and the second planar spiral wiring 2 can be compared with the conventional case where the inner peripheral ends of the planar spiral wirings 101 and 102 are connected to each other via one connection via 103. The connection reliability with the planar spiral wiring 3 can be improved.

  Further, in the coil component 1, the innermost overlapping portions 5, 6 of the planar spiral wirings 2, 3 are connected to each other via two connection vias 4, 11, so that the planar spirals are connected along the conventional stacking direction. The innermost peripheral sides of the first and second spiral wirings 2 and 3 are arranged along each winding direction as compared with the case where the inner peripheral ends of the wirings 101 and 102 are connected to each other via one connection via 103. Have been extended. As a result, the planar spiral wirings 2 and 3 are doubled at the innermost overlapping portions 5 and 6 as viewed from the lamination direction. Further, the width dimension of the innermost peripheral overlapping portions 5 and 6 of the first and second planar spiral wirings 2 and 3 is the same as that of the portions other than the innermost peripheral overlapping portions 5 and 6 of the first and second spiral wirings 2 and 3. Equal to the width dimension. Thereby, the cross-sectional area of the innermost peripheral overlapping portions 5 and 6 of the first and second planar spiral wirings 2 and 3 is substantially increased. Therefore, the DC resistance value (Rdc) of the innermost peripheral overlapping portions 5 and 6 of the first planar spiral wiring 2 and the second planar spiral wiring 3 can be reduced. Therefore, the DC resistance value of the coil constituted by the first planar spiral wiring 2 and the second planar spiral wiring 3 can be reduced. Also, in the first embodiment, the innermost overlapping portions 5 and 6 can be formed without changing the number of turns of the coil as compared with FIG. Therefore, the connection reliability can be improved and the DC resistance value of the coil formed by the first planar spiral wiring 2 and the second planar spiral wiring 3 can be reduced without changing the number of turns. Further, in the first embodiment, as shown in FIG. 2, the position and the number of layers of the outermost peripheral portions of the planar spiral wirings 2 and 3 are not changed as compared with the configuration of FIG. The connection reliability can be improved without substantially changing the number of layers and the like, and the DC resistance value of the coil constituted by the first planar spiral wiring 2 and the second planar spiral wiring 3 can be reduced. That is, these effects can be obtained with substantially the same outer shape. As described above, the second planar spiral wiring 3 has a direction different from the winding direction of the first planar spiral wiring 2 (counterclockwise direction from the outside to the inside) as viewed from the stacking direction (the direction from the outside to the inside). Clockwise). As a result, the magnetic flux generated when a current flows through the first and second planar spiral wirings 2 and 3 has the same direction, and has a larger inductance (as compared to the single structure of the first planar spiral wiring 2 or the second planar spiral wiring 3 alone). L) can be obtained.

  The materials used for the coil component 1 will also be described. First, the material of the first planar spiral wiring 2 and the second planar spiral wiring 3 which are the components of the coil component 1 is not particularly limited, but Cu ( It may be made of a metal such as copper), Ag (silver), or Au (gold). The material of the insulating layer 12, which is a component of the coil component 1, is not particularly limited, but is made of an organic insulating material such as an epoxy resin, a bismaleimide, a liquid crystal polymer, and a polyimide. The organic insulating material may be composed of a combination of an inorganic filler material such as a silica filler and / or an organic filler material. For example, the material of the insulating layer 12, which is a component of the coil component 1, may be composed of a combination of an epoxy resin and a silica filler. The material of the magnetic core 13 and the magnetic layer 14, which are the components of the coil component 1, is not particularly limited, but may be an epoxy containing a metal magnetic material made of Fe, Si, Cr, or the like. It may be composed of a system resin. The magnetic core 13 and the magnetic layer 14 preferably contain 90% by weight or more of a metal magnetic material made of Fe, Si, Cr, or the like, from the viewpoint of improving the inductance value and the DC superimposition characteristics. Further, the material of the magnetic core 13 and the magnetic layer 14 is preferably a mixture of two or more types of metal magnetic materials having different particle size distributions from the viewpoint of improving the filling property.

  Next, an example of a method for manufacturing the coil component 1 will be described with reference to FIGS. 8A to 8G.

  First, an insulating sheet is thermocompression-bonded and heat-cured on both sides of a peelable and removable dummy substrate 31 (substrate with a metal foil) using a vacuum laminator, a press device, or the like, so that the dummy substrate 31 An insulating layer 32 is formed on both sides. Next, a power supply film is formed on the insulating layer 32 by electroless plating, sputtering, vapor deposition, or the like. Next, a photosensitive resist is applied to the power supply film, patterned by photolithography or the like, and then metal wiring is formed by electrolytic plating. After forming the metal wiring, the photosensitive resist is peeled off with a chemical solution and then the power supply film is removed by etching, thereby forming the first planar spiral wiring 2 on the insulating layer 32 as shown in FIG. 8A.

  Next, an insulating sheet is thermocompression-bonded and thermoset on the insulating layer 32 using a vacuum laminator, a press device, or the like so as to cover the first planar spiral wiring 2 to further form an insulating layer 33 as shown in FIG. 8B. I do. Next, the innermost end 7 of the first planar spiral wiring 2 along the laminating direction, the portion 9 corresponding to a position wound half a circle from the end, and the lead portion 2a of the first planar spiral wiring 2 Through holes that reach the respective outer end portions are formed in the insulating layer 33 by laser processing or the like. Next, a power supply film is formed in the through hole and on the insulating layer 33 by electroless plating, sputtering, vapor deposition, or the like. Next, a photosensitive resist is applied to the power supply film, patterned by photolithography or the like, and then metal wiring is formed by electrolytic plating. After the formation of the metal wiring, the photosensitive resist is peeled and removed with a chemical solution, and then the power supply film is removed by etching. Then, the second planar spiral wiring 3 connected to the first planar spiral wiring 2 and the lead portion 3b are formed in the insulating layer 33 and on the insulating layer.

  Next, an insulating sheet is provided on the insulating layer 33 so as to cover the second planar spiral wiring 3, and the insulating sheet is thermocompression-bonded and thermoset using a vacuum laminator, a press device, or the like, as shown in FIG. 8C. Then, an insulating layer 35 is further formed.

  Next, as shown in FIG. 8D, the structure including the first planar spiral wiring 2 and the second planar spiral wiring 3 is separated from the dummy substrate 31. Next, as shown in FIG. 8D, a through-hole 36 for providing the magnetic core 13 is formed in the structure having the first planar spiral wiring 2 and the second planar spiral wiring 3 by laser processing or the like.

  Next, through holes are formed in the insulating layer 35 by laser processing or the like, which reach the outer ends of the lead portions 3b and the lead portions 3a of the second planar spiral wiring 3 along the stacking direction. Next, a power supply film is formed in the through hole and on the insulating layer 35 by electroless plating, sputtering, evaporation, or the like. Next, a photosensitive resist is applied to the power supply film and patterned by photolithography or the like, and then a terminal precursor is formed by a semi-additive method. After the terminal precursor is formed, the photosensitive resist is peeled and removed with a chemical solution, and then the power supply film is removed by etching, so that the lead portion 3b and the second planar spiral wiring 3 are pulled out via the connection via 37 as shown in FIG. 8E. The terminals 38 electrically connected to the portions 3 a are formed on the insulating layer 35.

  Next, an epoxy resin portion containing a metal magnetic material is provided in the through hole 36 and on the insulating layer 35 including the terminals 38, and the resin portion is subjected to thermocompression bonding and thermosetting using a vacuum laminator, a press device, or the like. Then, as shown in FIG. 8F, the magnetic core portion 13 and the magnetic material layer 14 are respectively formed.

  Next, processing such as grinding and polishing is performed so that the terminals 38 are exposed, and then processing such as dicing and scribing is performed. At this time, the terminal 38 is formed as an external terminal 39. Thus, the coil component 1 is finally obtained as shown in FIG. 8G.

[Second embodiment]
First, a coil component according to a second embodiment which is one aspect of the present invention will be described with reference to FIGS. 4A and 4B.

  FIG. 4A is a schematic plan view schematically showing a form in which a plurality of connection vias are arranged in the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 4B is a schematic plan view schematically showing a form in which a plurality of connection vias are arranged in the innermost peripheral overlapping portion of the second planar spiral wiring.

  In the second embodiment, similarly to the first embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 are each wound around n rounds (n: natural number) and less than n + 1 rounds. In other words, the inner peripheral ends of the first planar spiral wiring 2 and the second planar spiral wiring 3 are located at positions that are more than n rounds (n: natural number) and less than n + 1 rounds. Specifically, in the second embodiment, as in the first embodiment, the first planar spiral wiring 2 is wound 1.5 times in a counterclockwise direction from the outside to the inside as shown in FIG. 4A. Have been. Further, the second planar spiral wiring 3 is wound 1.5 times clockwise from the outside to the inside as shown in FIG. 4B. The second planar spiral wiring 3 shown in FIG. 4B is located above the first planar spiral wiring 2 shown in FIG. 4A along the stacking direction, and the winding of the first planar spiral wiring 2 and the second planar spiral wiring 3 is performed. They are arranged so that their centers overlap. In the portions 5 and 6 corresponding to a half circumference from the innermost ends 7 and 10 of the first planar spiral wiring 2 and the second planar spiral wiring 3, the first planar spiral wiring 2 and the magnetic core portion 13 And the distance between the second planar spiral wiring 3 and the magnetic core portion 13 are substantially equal to each other. Further, the first planar spiral wiring 2 and the second planar spiral wiring 3 have the same width over the entire circumference and each other. In this case, the portion 5 of the first planar spiral wiring 2 shown in FIG. 4A and the portion 6 of the second planar spiral wiring 3 shown in FIG. It is the innermost overlapping part that overlaps. That is, also in the coil component of the second embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 have innermost peripheral overlapping portions 5 and 6, respectively.

  In the second embodiment, as in the first embodiment, the first end 7 of the first planar spiral wiring 2 and the second planar spiral wiring 3 forming one end of the innermost overlapping portions 5 and 6 are formed. Are connected to each other via the first connection via 4. Further, the second end 9 of the first planar spiral wiring 2 and the second end 10 of the second planar spiral wiring 3 forming the other end of the innermost peripheral overlapping portions 5 and 6 are connected to the second connection via. 11 are connected to each other. In addition, in the second embodiment, between the first end 7 and the second end 9 of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2, and the innermost of the second planar spiral wiring 3. The portion between the first end 8 and the second end 10 of the peripheral overlapping portion 6 is further connected to each other via one or more connection vias. For example, as shown in FIGS. 4A and 4B, between the first end portion 7 and the second end portion 9 of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2, and between the innermost peripheral overlapping portion 5 of the second planar spiral wiring 3. A portion between the first end 8 and the second end 10 of the inner peripheral overlapping portion 6 may be further connected to each other via the third connection via 15 and the fourth connection via 16. That is, the innermost overlapping portions 5 and 6 of the planar spiral wirings 2 and 3 may be connected to each other via four connection vias. Thereby, the number of connection points can be further increased as compared with the first embodiment using two connection vias. Therefore, the connection reliability between the first planar spiral wiring 2 and the second planar spiral wiring 3 can be further improved. When the first connection via 4 and the second connection via 11 are provided, the third connection via 15 and the fourth connection via 16 are provided with through holes at positions corresponding to the third connection via 15 and the fourth connection via 16. May be provided in combination.

[Third embodiment]
Next, a coil component according to a third embodiment which is one aspect of the present invention will be described with reference to FIGS. 5A and 5B.

  FIG. 5A is a schematic plan view showing a mode in which connection vias are arranged in the entire area of the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 5B is a schematic plan view showing a form in which connection vias are arranged in the entire area of the innermost peripheral overlapping portion of the second planar spiral wiring.

  In the third embodiment, as in the first embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 are each wound around n rounds (n: natural number) and less than n + 1 rounds. In other words, the inner peripheral ends of the first planar spiral wiring 2 and the second planar spiral wiring 3 are located at positions that are more than n rounds (n: natural number) and less than n + 1 rounds. Specifically, in the third embodiment, as in the first embodiment, the first planar spiral wiring 2 is wound 1.5 times counterclockwise from the outside toward the inside as shown in FIG. 5A. Have been. The second planar spiral wiring 3 is wound 1.5 times clockwise from the outside to the inside as shown in FIG. 5B. The second planar spiral wiring 3 shown in FIG. 5B is located above the first planar spiral wiring 2 shown in FIG. 5A along the stacking direction, and the winding of the first planar spiral wiring 2 and the second planar spiral wiring 3 is performed. They are arranged so that their centers overlap. In the portions 5 and 6 corresponding to a half circumference from the innermost end of the first planar spiral wiring 2 and the second planar spiral wiring 3, the distance between the first planar spiral wiring 2 and the magnetic core 13 is determined. Are positioned so that the distance between the second planar spiral wiring 3 and the magnetic core 13 is substantially equal. Further, the first planar spiral wiring 2 and the second planar spiral wiring 3 have the same width over the entire circumference and each other. In this arrangement, the portion 5 of the first planar spiral wiring 2 shown in FIG. 5A and the portion 6 of the second planar spiral wiring 3 shown in FIG. It is an inner circumference overlapping part. That is, also in the coil component of the third embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 have innermost peripheral overlapping portions 5 and 6, respectively.

  On the other hand, in the third embodiment, unlike the first embodiment, the entire area of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 shown in FIG. 5A and the second planar spiral wiring 3 shown in FIG. The entire region of the innermost overlapping portion 6 is connected to each other continuously via the connection via 30. The connection via 30 is made of the same material as the first connection via 4 and the second connection via 11, and electrically connects the first planar spiral wiring 2 and the second planar spiral wiring 3. That is, the space between the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 and the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 is filled with the connection via 30. In other words, the entire area of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 is connected to the connection via 30 with a “face” instead of a “point”, and the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 is connected. And the connection via 30 are connected not by “point” but by “plane”. Therefore, the area for connecting the first planar spiral wiring 2 and the second planar spiral wiring 3 can be increased. Therefore, the connection reliability between the first planar spiral wiring 2 and the second planar spiral wiring 3 can be further improved. The connection via 30 may be provided, for example, after forming a through hole having a shape extending on the innermost peripheral overlapping portion 5 of the spiral wiring 2. Specifically, in the manufacturing method of the above-described first embodiment, the through-hole reaching the innermost end of the first planar spiral wiring 2 and a portion corresponding to a position wound half a turn from the end is described. Instead of forming the through hole, a through hole reaching almost the entire surface between the two ends of the first planar spiral wiring 2 is formed in the insulating layer 33 by laser processing or the like. Next, the material of the connection via 30 is filled in the through hole. At the same time, after forming the metal wiring, the photosensitive resist is peeled and removed with a chemical solution, and the power supply film is removed by etching. Finally, the entire region of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 and the second region The second planar spiral wiring 3 is formed on the insulating layer so that the entire area of the innermost peripheral overlapping portion 6 of the planar spiral wiring 3 is connected to each other continuously via the connection via 30.

  Next, a coil component according to a fourth embodiment which is one aspect of the present invention will be described with reference to FIGS. 6A and 6B.

[Fourth embodiment]
FIG. 6A is a schematic plan view schematically showing a form in which the width dimension of the innermost peripheral overlapping portion of the first planar spiral wiring is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the first planar spiral wiring. is there. FIG. 6B is a schematic plan view schematically showing a form in which the width dimension of the innermost peripheral overlapping portion of the second planar spiral wiring is smaller than the width dimension of the portion other than the innermost peripheral overlapping portion of the second planar spiral wiring. is there.

  In the fourth embodiment, as in the first embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 are each wound over n rounds (n: natural number) and less than n + 1 rounds. In other words, the inner peripheral ends of the first planar spiral wiring 2 and the second planar spiral wiring 3 are located at positions that are more than n rounds (n: natural number) and less than n + 1 rounds. Specifically, in the fourth embodiment, as in the first embodiment, the first planar spiral wiring 2 is wound 1.5 times counterclockwise from the outside toward the inside as shown in FIG. 5A. Have been. The second planar spiral wiring 3 is wound 1.5 times clockwise from the outside to the inside as shown in FIG. 5B. The second planar spiral wiring 3 shown in FIG. 5B is arranged so as to be located above the first planar spiral wiring 2 along the stacking direction, and is formed by winding the first planar spiral wiring 2 and the second planar spiral wiring 3. They are arranged so that their centers overlap. In the portions 5 and 6 corresponding to a half circumference from the innermost ends 7 and 10 of the first planar spiral wiring 2 and the second planar spiral wiring 3, the first planar spiral wiring 2 and the magnetic core portion 13 And the distance between the second planar spiral wiring 3 and the magnetic core portion 13 are substantially equal to each other. Further, the first planar spiral wiring 2 and the second planar spiral wiring 3 have the same width dimension in the half circumference. In this case, the portion 5 shown in FIG. 6A and the portion 6 shown in FIG. 6B are innermost peripheral overlapping portions that substantially overlap each other when viewed from the laminating direction on the innermost peripheral side. That is, also in the fourth embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 have innermost peripheral overlapping portions 5 and 6, respectively.

  On the other hand, in the fourth embodiment, unlike the first embodiment, as shown in FIG. 6A, the width dimension of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 is the innermost of the first planar spiral wiring 2. It is smaller than the width dimension of the portion other than the peripheral overlapping portion 5. Specifically, as shown in FIG. 6A, the width dimension of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 is larger than the width dimension of the portion other than the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2. The outer edge 17 of the small innermost overlapping portion 5 of the first planar spiral wiring 2 and the outer edge 18 of the portion other than the innermost overlapping portion 5 of the first planar spiral wiring 2 are continuous without any irregularities. In this case, the inner edge 19 of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 and the inner edge 20 other than the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 can be made discontinuous. That is, a region 21 bulging outward can be formed in the insulating layer 12 on the inner edge 20 side of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2. Note that the “outer edge” and “inner edge” referred to in this specification respectively refer to an outer edge and an inner edge when each planar spiral wiring is viewed from the lamination direction.

  Similarly, as shown in FIG. 6B, the width dimension of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 is smaller than the width dimension of a portion other than the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3. Specifically, as shown in FIG. 6B, the width dimension of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 is larger than the width dimension of the portion other than the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3. The outer edge 22 of the small innermost overlapping portion 6 of the second planar spiral wiring 3 and the outer edge 23 of the portion other than the innermost overlapping portion 6 of the second planar spiral wiring 3 are continuous without irregularities. In this case, the inner edge 24 of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 and the inner edge 25 other than the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 can be made discontinuous. That is, a region 26 bulging outward can be formed in the insulating layer 12 on the inner edge 24 side of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3. Therefore, when the second planar spiral wiring 3 is arranged above the first planar spiral wiring 2 along the stacking direction, the winding center part 27 of the first planar spiral wiring 2 and the second planar spiral wiring 3 The range of the magnetic core portion 29 extending the winding center portion 28 can be increased by an amount corresponding to the bulge of the regions 21 and 26. Therefore, the inductance (L) of the coil component can be further increased. Note that the sum of the width dimension of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 and the width dimension of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3 is the maximum of the planar spiral wirings 2 and 3. It is preferable that the width be equal to or larger than the width dimension of portions other than the inner peripheral overlapping portions 5 and 6. In this case, a decrease in the DC resistance value can be suppressed as compared with FIG. Further, it is preferable that the width dimension of the innermost peripheral overlapping portion 5 of the first planar spiral wiring 2 is equal to the width dimension of the innermost peripheral overlapping portion 6 of the second planar spiral wiring 3. In this case, the range of the magnetic core portion 29 is not limited by the width dimension of any of the innermost peripheral overlapping portions 5 and 6.

  Finally, a coil component according to a fifth embodiment, which is one aspect of the present invention, will be described with reference to FIGS. 7A and 7B.

[Fifth Embodiment]
FIG. 7A is a schematic plan view schematically showing another mode in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the first planar spiral wiring. FIG. 7B is a schematic plan view schematically showing another mode in which connection vias are arranged at both ends of the innermost peripheral overlapping portion of the second planar spiral wiring.

  In the fifth embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 are each wound n times. Specifically, in the fifth embodiment, each of the first planar spiral wiring 2 and the second planar spiral wiring 3 is wound once. As shown in FIG. 7A, the first planar spiral wiring 2 is wound one turn counterclockwise from the outside toward the inside. As shown in FIG. 7B, the second planar spiral wiring 3 is wound one turn clockwise from the outside toward the inside. Note that, similarly to the first to third embodiments, the magnetic core portion 13 is disposed so as to extend the winding center portion of the first planar spiral wiring 2 and the winding central portion of the second planar spiral wiring 3. ing. The first planar spiral wiring 2 and the second planar spiral wiring 3 are such that the second planar spiral wiring 3 is located above the first planar spiral wiring 2 along the stacking direction, and the first planar spiral wiring 2 and the second planar spiral wiring 3 The spiral wirings 3 are arranged so that the winding centers thereof overlap. Portions 5 and 6 corresponding to a half turn from the innermost peripheral ends 9 and 8 of the first planar spiral wiring 2 and the second planar spiral wiring 3 are formed by the first planar spiral wiring 2 and the magnetic core 13. And the distance between the second planar spiral wiring 3 and the magnetic core 13 are substantially equal. Further, the first planar spiral wiring 2 and the second planar spiral wiring 3 have the same width over the entire circumference and each other.

  In this arrangement, the portion 5 of the first planar spiral wiring 2 shown in FIG. 7A and the portion 6 of the second planar spiral wiring 3 shown in FIG. Is the innermost peripheral overlapping portion. That is, also in the fifth embodiment, the first planar spiral wiring 2 and the second planar spiral wiring 3 have innermost overlapping portions 5 and 6, respectively.

  In other words, in the fifth embodiment, one end of each of the innermost peripheral overlapping portions 5 and 6 of the first planar spiral wiring 2 and the second planar spiral wiring 3 is connected to the first planar spiral wiring 2 and the second planar spiral wiring 2. Each of the innermost peripheral overlapping portions 5 and 6 of the planar spiral wiring 3 is positioned at a portion that is half-turned from the other end. That is, the inner peripheral end of one conventional planar spiral wiring 101 and the inner peripheral end of the other planar spiral wiring 102 are connected to each other via one connection via 103 along the laminating direction. In comparison, the innermost peripheral sides of the first and second planar spiral wirings 2 and 3 are further wound by a quarter turn. Therefore, the area of the innermost peripheral overlapping portions 5 and 6 of the planar spiral wirings 2 and 3 can be enlarged while securing a sufficient wiring interval.

  In this state, in the fifth embodiment, as shown in FIG. 7A and FIG. 7B, the first end 7 of the first planar spiral wiring 2 forming one end of the innermost peripheral overlapping portions 5 and 6 is formed. The second planar spiral wiring 3 and the first end 8 are connected to each other via the first connection via 4. Further, the second end 9 of the first planar spiral wiring 2 and the second end 10 of the second planar spiral wiring 3 forming the other end of the innermost peripheral overlapping portions 5 and 6 are connected to the second connection via. 11 are connected to each other. In other words, the innermost overlapping portions 5 and 6 of each planar spiral wiring are connected to each other via the two connection vias. Thereby, the connection reliability between the first planar spiral wiring 2 and the second planar spiral wiring 3 can be improved. Further, in the fifth embodiment, as compared with the conventional configuration in which the inner peripheral ends of the planar spiral wirings 101 and 102 are connected to each other via one connection via 103 along the conventional laminating direction as shown in FIG. The innermost peripheral sides of the first and second planar spiral wirings 2 and 3 are extended in the respective winding directions. As a result, the planar spiral wirings 2 and 3 are doubled at the innermost overlapping portions 5 and 6 as viewed from the lamination direction. Further, the width dimension of the innermost peripheral overlapping portions 5 and 6 of the first and second planar spiral wirings 2 and 3 is the same as that of the portions other than the innermost peripheral overlapping portions 5 and 6 of the first and second spiral wirings 2 and 3. Equal to the width dimension. Thereby, the cross-sectional area of the innermost peripheral overlapping portions 5 and 6 of the first and second planar spiral wirings 2 and 3 is substantially increased. Therefore, the DC resistance of the innermost peripheral overlapping portions 5 and 6 of the first planar spiral wiring 2 and the second planar spiral wiring 3 can be reduced. Therefore, the DC resistance value of the coil constituted by the first planar spiral wiring 2 and the second planar spiral wiring 3 can be reduced.

  As described above, the coil component according to one embodiment of the present invention and the method of manufacturing the same have been described. However, the present invention is not limited thereto, and various modifications may be made without departing from the scope of the invention defined in the appended claims. It will be appreciated that changes will be made by those skilled in the art. For example, the above-described embodiments may be appropriately combined as needed. At this time, the combination may be such that a part of each embodiment is combined.

DESCRIPTION OF SYMBOLS 1 Coil component 2 1st plane spiral wiring 2a 1st plane spiral wiring lead-out part 3 2nd plane spiral wiring 3a 2nd plane spiral wiring 3d lead-out part 4 1st connection via 5 innermost of 1st plane spiral wiring Peripheral overlapping part 6 Inner peripheral overlapping part of second planar spiral wiring 7 First end of first planar spiral wiring at innermost peripheral overlapping part (corresponding to inner peripheral end of first planar spiral wiring)
8 First end of second planar spiral wiring at innermost overlapping part 9 Second end of first planar spiral wiring at innermost overlapping part 10 Second end of second planar spiral wiring at innermost overlapping part Part (corresponding to the inner peripheral end of the second planar spiral wiring)
DESCRIPTION OF SYMBOLS 11 Second connection via 12 Insulating layer 13 Magnetic core part 14 Magnetic layer 15 Third connection via 16 Fourth connection via 17 Outer edge of innermost peripheral overlapping portion of first planar spiral wiring 18 Innermost peripheral of first planar spiral wiring Outer edge of portion other than overlapping portion 19 Inner edge of innermost peripheral overlapping portion of first planar spiral wiring 20 Inner edge of portion other than innermost peripheral overlapping portion of first planar spiral wiring 21 Region 22 Innermost peripheral of second planar spiral wiring Outer edge of overlapping portion 23 Outer edge of portion other than innermost peripheral overlapping portion of second planar spiral wiring 24 Inner edge of innermost peripheral overlapping portion of second planar spiral wiring 25 Part other than innermost peripheral overlapping portion of second planar spiral wiring 26 Region 27 Winding center 28 Winding center 29 Magnetic core 30 Connection via 31 Dummy substrate 32 Insulating layer 33 Insulating layer 35 Insulating layer 36 Through hole 37 Connection A 38 pin 39 external terminal 101 while the spiral interconnect 102 other spiral interconnect 103 connected via

Claims (3)

A first planar spiral interconnect, and a second planar spiral interconnect located above the first planar spiral interconnect in the stacking direction and interconnected with the first planar spiral interconnect via a connection via;
The second planar spiral wiring is wound in a direction different from the winding direction of the first planar spiral wiring when viewed from the lamination direction,
The first planar spiral wiring and the second planar spiral wiring each have, on the innermost peripheral side, an innermost peripheral overlapping portion overlapping each other when viewed from the laminating direction,
At least both ends of the innermost peripheral overlapping portion of the first planar spiral wiring and at least both ends of the innermost peripheral overlapping portion of the second planar spiral wiring are connected to each other via the connection via. ,
A width dimension of the innermost peripheral overlapping portion of the first planar spiral wiring is smaller than a width dimension of a portion other than the innermost peripheral overlapping portion of the first planar spiral wiring; and a width dimension of the second planar spiral wiring. A width dimension of an inner peripheral overlapping portion is smaller than a width dimension of a portion other than the innermost peripheral overlapping portion of the second planar spiral wiring; and an outer edge of the innermost peripheral overlapping portion of the first planar spiral wiring. And an outer edge of a portion other than the innermost peripheral overlapping portion of the first planar spiral wiring is continuous without unevenness, and an outer edge of the innermost peripheral overlapping portion of the second planar spiral wiring and the second planar spiral A coil component, wherein an outer edge of a portion of the wiring other than the innermost peripheral overlapping portion is continuous without irregularities.   An inner edge of the innermost peripheral overlapping portion of the first planar spiral wiring and an inner edge of the first planar spiral wiring other than the innermost peripheral overlapping portion provide a portion forming an uneven shape, and the second planar spiral wiring has 2. The coil component according to claim 1, wherein an inner edge of the innermost peripheral overlapping portion and an inner edge of the second planar spiral wiring other than the innermost peripheral overlapping portion provide a portion having an uneven shape. 3.   An inner edge of the innermost peripheral overlapping portion of the first planar spiral wiring and an inner edge of the first planar spiral wiring other than the innermost peripheral overlapping portion provide a step-shaped portion, and a portion of the second planar spiral wiring is provided. 3. The coil component according to claim 1, wherein a portion forming a step is provided by an inner edge of the innermost peripheral overlapping portion and an inner edge of the second planar spiral wiring other than the innermost peripheral overlapping portion. 4.

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