JP2020010019A - GaN系発光ダイオードの製造方法 - Google Patents
GaN系発光ダイオードの製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000011777 magnesium Substances 0.000 claims abstract description 52
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 51
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract description 24
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000012808 vapor phase Substances 0.000 claims abstract description 5
- 238000000151 deposition Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 239000000956 alloy Substances 0.000 claims description 22
- 229910045601 alloy Inorganic materials 0.000 claims description 22
- 230000008021 deposition Effects 0.000 claims description 17
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002019 doping agent Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000009738 saturating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 147
- 239000002243 precursor Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000002211 ultraviolet spectrum Methods 0.000 description 2
- 238000001429 visible spectrum Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
Description
−バッファ層5上に形成されたN型ドープAlGaN層4。
−層4上に形成された多重量子井戸層(multiple quantum well layer)3。
−層3上に形成されたP型ドープAlGaN層2。
−層2の上に形成されたN型ドープAlGaN層1。
−層21を部分的に除去する。
−非意図的ドープ型の層を形成するための条件を有するGaN層のエピタキシャル成長。
Claims (15)
- 基板(6)を気相エピタキシャル成長チャンバ内に維持しながら、以下のステップを連続して含む発光ダイオード(90)の製造方法。
−ゼロではない第1の濃度のアンモニアを有する雰囲気の前記チャンバ内において、マグネシウムでP型ドープされた第1のGaN合金層(20)をエピタキシャル堆積すること。
−マグネシウムが供給されていない前記チャンバ内の雰囲気中で前記第1の層(20)上へ犠牲GaN合金層(21)をエピタキシャル堆積すること。
−犠牲層(21)を除去するように、前記チャンバ内の雰囲気を、少なくとも前記第1の濃度の3分の1に等しいアンモニアの第2の濃度を有する状態に保つこと。
−前記第1の層(2)とのトンネル接合を形成するように、第2のN型ドープGaN合金層(1)をエピタキシャル堆積すること。 - 前記第1の堆積層(2)の前記合金がAlGaNである、請求項1に記載の製造方法。
- 前記第1の層(2)は、その厚さ方向にアルミニウム濃度勾配を有する、請求項2に記載の製造方法。
- 前記第1の堆積層(2)の厚さが50〜400nmである、請求項1〜3の何れか一項に記載の製造方法。
- 前記犠牲層(21)の合金は、前記第1の層(20)の合金とは異なる、請求項1〜4の何れか一項に記載の製造方法。
- 前記第2の堆積層(1)の前記合金がAlGaNである、請求項1〜5の何れか一項に記載の製造方法。
- 前記エピタキシャル成長チャンバ内に維持された前記基板(6)が多重量子井戸層(3)で覆われ、前記第1の層(2)が前記多重量子井戸層(3)上に堆積される、請求項1〜6の何れかに記載の製造方法。
- 前記第2の層(1)上に導電性電極を堆積するステップをさらに含む、請求項1〜7の何れか一項に記載の製造方法。
- 前記第1の層(2)上にInGaN層を堆積するステップをさらに含み、前記第2の層(1)が前記InGaN層上に堆積される、請求項1〜8の何れか一項に記載の製造方法。
- 犠牲層(21)を除去する際、前記チャンバ内において、少なくとも200Paに等しいアンモニア分圧が保たれる、請求項1〜9の何れか一項に記載の製造方法。
- 前記犠牲層(21)の除去が、二水素を含む前記チャンバ内の雰囲気で行われる、請求項1〜10の何れか一項に記載の製造方法。
- 前記犠牲層(21)の除去が、Cl2又はHClを含む前記チャンバ内の雰囲気で行われる、請求項1〜10の何れか一項に記載の製造方法。
- 前記第1の層(2)のエピタキシャル堆積ステップの前に、前記第1の層(2)が堆積される表面(3)の前記ドーパントによる飽和ステップが先行する、請求項1〜12の何れか一項に記載の製造方法。
- 前記犠牲層(21)を除去する前記ステップが、前記犠牲層から少なくとも20nmの厚さを除去する、請求項1〜13の何れか一項に記載の製造方法。
- 前記犠牲層(21)を除去する前記ステップが、前記第1の層(2)が現れるまで続けられる、請求項1〜14の何れか一項に記載の製造方法。
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FR1854602 | 2018-05-29 | ||
FR1854602A FR3082053B1 (fr) | 2018-05-29 | 2018-05-29 | Procede de fabrication d’une diode electroluminescente de type gan |
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FR (1) | FR3082053B1 (ja) |
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US20180277715A1 (en) * | 2017-03-24 | 2018-09-27 | Wisconsin Alumni Research Foundation | Group iii-v nitride-based light emitting devices having multilayered p-type contacts |
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EP3576165A1 (fr) | 2019-12-04 |
KR20190135944A (ko) | 2019-12-09 |
FR3082053A1 (fr) | 2019-12-06 |
KR102645592B1 (ko) | 2024-03-11 |
US10923620B2 (en) | 2021-02-16 |
FR3082053B1 (fr) | 2020-09-11 |
JP7382156B2 (ja) | 2023-11-16 |
US20190371963A1 (en) | 2019-12-05 |
EP3576165B1 (fr) | 2020-12-16 |
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