JP2020009819A - Industrial robot - Google Patents

Industrial robot Download PDF

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JP2020009819A
JP2020009819A JP2018127166A JP2018127166A JP2020009819A JP 2020009819 A JP2020009819 A JP 2020009819A JP 2018127166 A JP2018127166 A JP 2018127166A JP 2018127166 A JP2018127166 A JP 2018127166A JP 2020009819 A JP2020009819 A JP 2020009819A
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support
sensor
wafer
industrial robot
support portion
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JP7191565B2 (en
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俊道 風間
Toshimichi Kazama
俊道 風間
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Nidec Sankyo Corp
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Nidec Sankyo Corp
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Abstract

To provide an industrial robot capable of detecting the mounting state of a conveyance object.SOLUTION: An industrial robot 1 includes a hand 5, and a detector 60 for detecting a conveyance object 2 on the hand 5, the hand 5 has a first support part 55, a second support part 56, and a third support part 57 capable of supporting three places of the reverse face of the conveyance object 2. The detector 60 has multiple reflection type optical sensors placed oppositely to the outer peripheral surface 22 of the conveyance object 2 supported by the first, second and third support parts 55, 56, 57, and a signal processing section 63 for determining the mounting state of the conveyance object 2 on the basis of the output signals from the multiple reflection type optical sensors, where the multiple reflection type optical sensors include a first sensor 61 provided on one side of a center line C passing the first support part 55, and between the second and third support parts 56, 57, and a second sensor 62 provided on the other side.SELECTED DRAWING: Figure 4

Description

本発明は、半導体ウエハ等の搬送対象物を搬送する産業用ロボットに関する。   The present invention relates to an industrial robot for transferring a transfer target such as a semiconductor wafer.

特許文献１に記載されたロボットは、半導体ウエハを搬送するロボットであり、半導体ウエハが載置されるハンド（エンドエフェクタ）の表面に、磁性体ウエハ支持ピンと、ウエハ支持ピンを支持する弾性体と、弾性体に隣設される磁気センサとを備える。半導体ウエハの重みによって、ウエハ支持ピンと磁気センサとの間に挟まれる弾性体が圧縮され、ウエハ支持ピンと磁気センサとのギャップが縮まり、磁気センサの出力が変化する。この磁気センサの出力の変化に基づいて、ハンド上の半導体ウエハの有無が検出される。   The robot described in Patent Literature 1 is a robot that transports a semiconductor wafer, and includes a magnetic wafer support pin and an elastic body that supports the wafer support pin on a surface of a hand (end effector) on which the semiconductor wafer is mounted. And a magnetic sensor provided adjacent to the elastic body. The elastic body sandwiched between the wafer support pins and the magnetic sensor is compressed by the weight of the semiconductor wafer, the gap between the wafer support pins and the magnetic sensor is reduced, and the output of the magnetic sensor changes. The presence or absence of the semiconductor wafer on the hand is detected based on the change in the output of the magnetic sensor.

特開２００５−２６８５５６号公報JP 2005-268556 A

特許文献１に記載された搬送ロボットでは、ハンド上の半導体ウエハの有無が検出されるだけである。半導体ウエハは、ハンドに載置されているだけであり、ハンド上で固定されていない。半導体ウエハの表面を保護する観点から、半導体ウエハは、磁性体ウエハ支持ピンを含む複数のウエハ支持ピンによって、ハンドの載置面との間に隙間をあけて支持されており、不安定である。半導体ウエハが適正にハンドに載置されていない場合に、搬送中の振動や障害物との衝突に起因して半導体ウエハがハンドから落下し、半導体ウエハが破損する虞がある。   In the transfer robot described in Patent Document 1, only the presence or absence of a semiconductor wafer on the hand is detected. The semiconductor wafer is only placed on the hand, and is not fixed on the hand. From the viewpoint of protecting the surface of the semiconductor wafer, the semiconductor wafer is supported by a plurality of wafer support pins including a magnetic wafer support pin with a gap between the semiconductor wafer and the hand mounting surface, and is unstable. . If the semiconductor wafer is not properly placed on the hand, the semiconductor wafer may fall from the hand due to vibration during transportation or collision with an obstacle, and the semiconductor wafer may be damaged.

本発明は、上述した事情に鑑みなされたものであり、搬送対象物の載置状態を検出可能な産業用ロボットを提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and has as its object to provide an industrial robot capable of detecting a placement state of an object to be conveyed.

本発明の一態様の産業用ロボットは、板状の搬送対象物を搬送する産業用ロボットであって、前記搬送対象物が載置されるハンドと、前記ハンド上の前記搬送対象物を検出する検出部と、を備え、前記ハンドは、載置面と、前記搬送対象物が前記載置面との間に隙間をあけ且つ前記載置面に沿って配置されるように、前記搬送対象物の三箇所を支持可能な第１支持部、第２支持部、及び第３支持部と、を有し、前記検出部は、前記第１支持部と前記第２支持部と前記第３支持部とによって支持された前記搬送対象物の外周面に対向して配置される複数の反射型光センサと、前記複数の反射型光センサの出力信号に基づいて、前記搬送対象物の載置状態を判定する信号処理部と、を有し、前記複数の反射型光センサは、前記第１支持部を通り且つ前記第２支持部と前記第３支持部との中間を通る中心線の一方側に設けられた第１センサと、他方側に設けられた第２センサとを含む。   An industrial robot according to one embodiment of the present invention is an industrial robot that transports a plate-like transport target, and detects a hand on which the transport target is placed and the transport target on the hand. And a detection unit, wherein the hand is configured such that the placement object and the transfer object are arranged along the placement surface with a gap between the placement surface and the placement surface. A first support portion, a second support portion, and a third support portion capable of supporting the three positions of the first support portion, the detection portion, the first support portion, the second support portion, and the third support portion. And a plurality of reflection-type optical sensors arranged to face the outer peripheral surface of the object to be transported, and a mounting state of the object to be transported based on output signals of the plurality of reflection-type optical sensors. A signal processing unit for determining, wherein the plurality of reflection-type optical sensors pass through the first support unit and It includes a first sensor provided on one side of the center line through the middle of the third supporting portion and the second supporting portion, and a second sensor provided on the other side.

本発明によれば、搬送対象物の載置状態を検出可能な産業用ロボットを提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the industrial robot which can detect the mounting state of an object to be conveyed can be provided.

本発明の実施形態を説明するための、産業用ロボットの一例の平面図であり、アームが縮んでいる状態の平面図である。It is a top view of an example of an industrial robot for explaining an embodiment of the present invention, and is a top view in the state where an arm was contracted. 図１の産業用ロボットの平面図であり、アームが伸びている状態の平面図である。FIG. 2 is a plan view of the industrial robot of FIG. 1, in a state where an arm is extended. 図１の産業用ロボットの正面図である。It is a front view of the industrial robot of FIG. 図１の産業用ロボットのハンドの平面図である。It is a top view of the hand of the industrial robot of FIG. 図４のV−V線断面図である。FIG. 5 is a sectional view taken along line VV of FIG. 4. 搬送対象物の載置状態の一例の模式図である。It is a schematic diagram of an example of a mounting state of a transport object. 図６のVII−VII線断面図である。FIG. 7 is a sectional view taken along line VII-VII of FIG. 6. 搬送対象物の載置状態の他の例の模式図である。It is a schematic diagram of another example of the mounted state of the transport object. 図８のIX−IX線断面図である。FIG. 9 is a sectional view taken along line IX-IX in FIG. 8. 搬送対象物の載置状態の他の例の模式図である。It is a schematic diagram of another example of the mounted state of the transport object. 図１０のXI−XI線断面図である。FIG. 11 is a sectional view taken along line XI-XI of FIG. 10. 搬送対象物の載置状態の他の例の模式図である。It is a schematic diagram of another example of the mounted state of the transport object.

（産業用ロボットの全体構成）
図１から図３は、本発明の実施形態を説明するための産業用ロボットの一例を示す。産業用ロボット１（以下、「ロボット１」とする。）は、板状の搬送対象物である半導体ウエハ２（以下、「ウエハ２」とする。）を搬送するためのロボットである。ロボット１は、例えば、複数のウエハ２が所定のピッチで積層されて収納されるカセット（図示省略）から複数のウエハ２を同時に搬出する。そして、ロボット１は、複数のウエハ２が所定のピッチで積層されて収納される半導体製造システムの加熱炉（図示省略）の中へカセットから搬出した複数のウエハ２を搬入する。また、ロボット１は、加熱炉から複数のウエハ２を同時に搬出して、搬出した複数のウエハ２をカセットの中へ搬入する。 (Overall configuration of industrial robot)
1 to 3 show an example of an industrial robot for explaining an embodiment of the present invention. The industrial robot 1 (hereinafter, referred to as “robot 1”) is a robot for transferring a semiconductor wafer 2 (hereinafter, referred to as “wafer 2”), which is a plate-like transfer target. For example, the robot 1 simultaneously unloads a plurality of wafers 2 from a cassette (not shown) in which the plurality of wafers 2 are stacked and stored at a predetermined pitch. Then, the robot 1 loads the plurality of wafers 2 unloaded from the cassette into a heating furnace (not shown) of the semiconductor manufacturing system in which the plurality of wafers 2 are stacked and stored at a predetermined pitch. The robot 1 simultaneously unloads a plurality of wafers 2 from the heating furnace and loads the unloaded plurality of wafers 2 into a cassette.

ロボット１は、複数のウエハ２が搭載されるウエハ搭載機構３と、ウエハ搭載機構３の基端側を回動可能に支持する第１アーム４と、カセット内あるいは加熱炉内のウエハ２の収納状態を検出するためのセンシング用ハンド５と、センシング用ハンド５の基端側を回動可能に支持する第２アーム６と、第１アーム４および第２アーム６の基端側を回動可能に支持するアーム支持部７と、アーム支持部７を昇降可能に支持する昇降機構８とを備える。   The robot 1 includes a wafer mounting mechanism 3 on which a plurality of wafers 2 are mounted, a first arm 4 that rotatably supports a base end side of the wafer mounting mechanism 3, and a storage of the wafer 2 in a cassette or a heating furnace. A sensing hand 5 for detecting a state, a second arm 6 rotatably supporting a base end of the sensing hand 5, and a base end of the first arm 4 and the second arm 6 are rotatable. And an elevating mechanism 8 that supports the arm support 7 so as to be able to move up and down.

ウエハ搭載機構３は、所定のピッチで上下方向に重なるように配置される複数の搬送用ハンドを有する。カセットに収納されるウエハ２のピッチと、加熱炉に収納されるウエハ２のピッチとが異なっている場合があり、ウエハ搭載機構３は、複数の搬送用ハンドのピッチを可変に構成されてもよい。   The wafer mounting mechanism 3 has a plurality of transfer hands arranged so as to vertically overlap at a predetermined pitch. In some cases, the pitch of the wafers 2 stored in the cassette and the pitch of the wafers 2 stored in the heating furnace are different, and even if the wafer mounting mechanism 3 is configured such that the pitch of the plurality of transfer hands is variable. Good.

センシング用ハンド５は、カセット等からウエハ２を搬出する前に、カセット内あるいは加熱炉内のウエハ２の収納状態（傾き、出っ張り等）を検出するためのものである。センシング用ハンド５はアーム支持部７と一体に上下動され、センシング用ハンド５の上下動に応じ、ウエハ２がセンシング用ハンド５に載置される。なお、センシング用ハンド５に載置されたウエハ２は、センシング用ハンド５によって、カセットと加熱炉との間で搬送されても良い。   The sensing hand 5 is for detecting the storage state (tilt, protrusion, etc.) of the wafer 2 in the cassette or the heating furnace before unloading the wafer 2 from the cassette or the like. The sensing hand 5 is moved up and down integrally with the arm support 7, and the wafer 2 is placed on the sensing hand 5 according to the up and down movement of the sensing hand 5. Note that the wafer 2 placed on the sensing hand 5 may be transferred between the cassette and the heating furnace by the sensing hand 5.

第１アーム４および第２アーム６は、２個の関節部を有し、全体として伸縮するように構成されている。第１アーム４の基端側と第２アーム６の基端側とは、アーム支持部７に支持されており、個別に伸縮する。アーム支持部７は、第１アーム４および第２アーム６を支持する第１支持部９と、第１支持部９を支持する第２支持部１０とを有する。第２支持部１０の内部には、第１支持部９を回動させるための旋回機構が収納されており、第１支持部９は、回動可能に第２支持部１０によって支持されている。   The first arm 4 and the second arm 6 have two joints, and are configured to expand and contract as a whole. The base end side of the first arm 4 and the base end side of the second arm 6 are supported by an arm support 7 and extend and contract individually. The arm support 7 includes a first support 9 that supports the first arm 4 and the second arm 6, and a second support 10 that supports the first support 9. A turning mechanism for turning the first support 9 is housed inside the second support 10, and the first support 9 is rotatably supported by the second support 10. .

昇降機構８は、例えば、上下方向に延びて配置される送りねじ軸と、送りねじ軸を支持する支柱部とを含む直動ガイドを用いて構成され、第２支持部１０には、送りねじ軸に螺合するナット部材が設けられる。モータにより送りねじ軸が回転され、第２支持部１０が、送りねじ軸の回転に応じ、送りねじ軸に沿って上下移動される。これにより、アーム支持部７が昇降される。   The elevating mechanism 8 is configured using, for example, a linear motion guide that includes a feed screw shaft that is arranged to extend in the vertical direction and a column that supports the feed screw shaft. A nut member screwed to the shaft is provided. The feed screw shaft is rotated by the motor, and the second support unit 10 is moved up and down along the feed screw shaft according to the rotation of the feed screw shaft. Thereby, the arm support 7 is raised and lowered.

（センシング用ハンドの構成）
図４及び図５は、センシング用ハンド５の構成を示す。センシング用ハンド５は、第２アーム６によって回動可能に支持される基端部５１と、基端部５１から先端側に向かって二又に分岐した第１腕部５２及び第２腕部５３とを有し、全体としてＹ字形状を呈している。そして、センシング用ハンド５は、センシング用ハンド５に載置されたウエハ２の裏面２１が対向する載置面５４を有する。 (Configuration of hand for sensing)
4 and 5 show the configuration of the sensing hand 5. The sensing hand 5 includes a base end portion 51 rotatably supported by the second arm 6, a first arm portion 52 and a second arm portion 53 bifurcated from the base end portion 51 toward the distal end side. And has a Y-shape as a whole. The sensing hand 5 has a mounting surface 54 on which the back surface 21 of the wafer 2 mounted on the sensing hand 5 faces.

基端部５１の載置面５４には第１支持部５５が設けられており、第１腕部５２の先端の載置面５４には第２支持部５６が設けられており、第２腕部５３の先端の載置面５４には第３支持部５７が設けられている。第１支持部５５、第２支持部５６及び第３支持部５７は、ウエハ２が載置面５４との間に隙間をあけ且つ載置面５４に沿って配置されるように、ウエハ２の裏面２１の三箇所を支持可能である。   A first support portion 55 is provided on the mounting surface 54 of the base end portion 51, and a second support portion 56 is provided on the mounting surface 54 at the distal end of the first arm portion 52. A third support portion 57 is provided on the mounting surface 54 at the tip of the portion 53. The first support portion 55, the second support portion 56, and the third support portion 57 allow the wafer 2 to be disposed along the mounting surface 54 with a gap between the wafer 2 and the mounting surface 54. Three positions on the back surface 21 can be supported.

本例では、第１支持部５５、第２支持部５６及び第３支持部５７は、第１支持部５５と、第２支持部５６と、第３支持部５７とを結んで得られる三角領域Ｒの外接円の中心Ｏに向いた傾斜面５８をそれぞれ有し、各傾斜面５８は、載置面５４に近づくほどに中心Ｏに近づくように傾斜している。ウエハ２が適正に載置されている場合に、ウエハ２の裏面２１における外周部の縁２１ｅは、第１支持部５５、第２支持部５６及び第３支持部５７それぞれの傾斜面５８に接し、これらの傾斜面５８によって支持される。   In this example, the first support portion 55, the second support portion 56, and the third support portion 57 are a triangular region obtained by connecting the first support portion 55, the second support portion 56, and the third support portion 57. Each of the inclined surfaces 58 faces the center O of the circumscribed circle of R, and each inclined surface 58 is inclined such that the closer to the mounting surface 54, the closer to the center O. When the wafer 2 is properly mounted, the outer peripheral edge 21 e of the back surface 21 of the wafer 2 is in contact with the inclined surfaces 58 of the first support 55, the second support 56, and the third support 57. , Are supported by these inclined surfaces 58.

ウエハ２の裏面２１における外周部が、第１支持部５５、第２支持部５６及び第３支持部５７によって支持されることにより、ウエハ２の裏面２１における中央部は、載置面５４、第１支持部５５、第２支持部５６及び第３支持部５７と非接触となり、載置面５４等との接触に起因する損傷、汚染から保護される。ウエハ２の中央部には後に複数の半導体デバイスが形成されるが、裏面２１の中央部が清浄に保たれることにより、例えば半導体デバイスの所期の特性が得られる。   The outer peripheral portion of the back surface 21 of the wafer 2 is supported by the first support portion 55, the second support portion 56, and the third support portion 57, so that the central portion of the back surface 21 of the wafer 2 is The first support portion 55, the second support portion 56, and the third support portion 57 are not in contact with each other, and are protected from damage and contamination caused by contact with the mounting surface 54 and the like. A plurality of semiconductor devices will be formed later in the central portion of the wafer 2. By keeping the central portion of the back surface 21 clean, for example, desired characteristics of the semiconductor device can be obtained.

さらに、ウエハ２の裏面２１における外周部の縁２１ｅが、第１支持部５５、第２支持部５６及び第３支持部５７それぞれの傾斜面５８によって支持されることにより、ウエハ２の載置面５４に沿った移動が抑制される。これにより、搬送中の振動等に起因して、ウエハ２が第１支持部５５、第２支持部５６及び第３支持部５７のうち一つ以上の支持部から外れたり、ウエハ２がセンシング用ハンド５から落下したりすることが抑制される。また、ウエハ２が載置面５４に対して多少傾いた状態で第１支持部５５、第２支持部５６及び第３支持部５７それぞれの傾斜面５８に接していたとしても、例えば搬送中の振動等により、ウエハ２が載置面５４と略平行に配置され得る。   Further, the peripheral edge 21 e of the back surface 21 of the wafer 2 is supported by the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57, so that the mounting surface of the wafer 2 is Movement along 54 is suppressed. Accordingly, the wafer 2 may be disengaged from one or more of the first support portion 55, the second support portion 56, and the third support portion 57 due to a vibration or the like during transportation, or the wafer 2 may be used for sensing. Dropping from the hand 5 is suppressed. Even if the wafer 2 is in contact with the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57 in a state where the wafer 2 is slightly inclined with respect to the mounting surface 54, for example, The wafer 2 can be arranged substantially parallel to the mounting surface 54 by vibration or the like.

なお、ウエハ２の重心が、第１支持部５５と、第２支持部５６と、第３支持部５７とを結んで得られる三角領域Ｒ内に配置される限りにおいて、第１支持部５５、第２支持部５６及び第３支持部５７の位置は限定されないが、円形状のウエハ２が任意の直径に対して対称であることを考慮すれば、好ましくは、第２支持部５６と、第３支持部５７とは、三角領域Ｒの外接円の中心Ｏと第１支持部５５とを結ぶ中心線Ｃを挟んで互いに対称に配置される。これにより、ウエハ２を安定に支持できる。   Note that as long as the center of gravity of the wafer 2 is located within the triangular region R obtained by connecting the first support 55, the second support 56, and the third support 57, the first support 55, The positions of the second support portion 56 and the third support portion 57 are not limited. However, considering that the circular wafer 2 is symmetrical with respect to an arbitrary diameter, the second support portion 56 and the third support portion 57 are preferably The three support portions 57 are symmetrically arranged with respect to a center line C connecting the center O of the circumscribed circle of the triangular region R and the first support portion 55. Thus, the wafer 2 can be stably supported.

センシング用ハンド５は、センシング用ハンド５上のウエハ２を検出する検出部６０をさらに有し、検出部６０は、反射型光センサである第１センサ６１及び第２センサ６２と、第１センサ６１及び第２センサ６２の出力信号に基づいてウエハ２の載置状態を判定する信号処理部６３とを有する。ここで、反射型光センサとは、発光素子と受光素子とを含み、発光素子から出た光を対象物にて反射させ、その反射光を受光素子で検出し、検出した反射光強度に応じた信号を出力するものである。出力信号の信号値は、基本的には、発光素子及び受光素子と対象物の反射面との間の距離に関連しており、距離が大きくなるほどに信号値は小さくなる。また、信号値は、対象物の反射面に対する光の入射角度にも関連しており、入射角度が大きくなるほどに信号値は小さくなる。本例では、第１センサ６１を構成する発光素子および受光素子は、図４に示すＸＹ平面に対し直交する方向、すなわち、ウエハ２の厚み方向に重ねて配置されている。このように配置された発光素子から出た光Ｌは、ウエハ２の外周面２２にあたり、その反射光が受光素子に入射するようになっている（図７参照）。なお、発光素子と受光素子の配置は、これ以外に、図４に示すＸＹ平面上に発光素子と受光素子はＹ方向に並んで配置されていてもよい。   The sensing hand 5 further includes a detection unit 60 that detects the wafer 2 on the sensing hand 5, and the detection unit 60 includes a first sensor 61 and a second sensor 62, which are reflection-type optical sensors, and a first sensor. A signal processing unit 63 for determining a mounting state of the wafer 2 based on output signals of the second sensor 61 and the second sensor 62. Here, the reflection type optical sensor includes a light emitting element and a light receiving element, reflects light emitted from the light emitting element by an object, detects the reflected light with the light receiving element, and responds to the detected reflected light intensity. Output the signal. The signal value of the output signal is basically related to the distance between the light emitting element and the light receiving element and the reflection surface of the object, and the signal value decreases as the distance increases. The signal value is also related to the angle of incidence of light on the reflecting surface of the object, and the signal value decreases as the angle of incidence increases. In the present example, the light emitting element and the light receiving element constituting the first sensor 61 are arranged in a direction orthogonal to the XY plane shown in FIG. The light L emitted from the light emitting elements arranged as described above hits the outer peripheral surface 22 of the wafer 2 and the reflected light is incident on the light receiving element (see FIG. 7). The arrangement of the light emitting element and the light receiving element may be other than the above, and the light emitting element and the light receiving element may be arranged side by side in the Y direction on the XY plane shown in FIG.

ウエハ２が適正に載置されている場合、すなわちウエハ２の裏面２１における外周部の縁２１ｅが第１支持部５５、第２支持部５６及び第３支持部５７それぞれの傾斜面５８によって支持されている状態では、第１センサ６１及び第２センサ６２はウエハ２の外周面２２に対向し、第１センサ６１及び第２センサ６２それぞれの発光素子から出た光は、ウエハ２の外周面２２にて反射され、その反射光が第１センサ６１及び第２センサ６２それぞれの受光素子によって検出される。   When the wafer 2 is properly placed, that is, the outer peripheral edge 21 e of the back surface 21 of the wafer 2 is supported by the inclined surfaces 58 of the first support portion 55, the second support portion 56, and the third support portion 57. In this state, the first sensor 61 and the second sensor 62 face the outer peripheral surface 22 of the wafer 2, and light emitted from the light emitting elements of the first sensor 61 and the second sensor 62 And the reflected light is detected by the light receiving elements of the first sensor 61 and the second sensor 62, respectively.

第１センサ６１は中心線Ｃの一方側に設けられており、第２センサ６２は中心線Ｃの他方側に設けられている。これにより、ウエハ２が適正に載置されている場合のウエハ２の位置からのずれを、中心線Ｃと平行な第１方向Ｘと、載置面５４に平行且つ中心線Ｃに垂直な第２方向Ｙとの二方向に検出可能である。なお、円形状のウエハ２が任意の直径に対して対称であることを考慮すれば、好ましくは、第１センサ６１と第２センサ６２とは、中心線Ｃを挟んで互いに対称に配置され、例えば図４に示すように、中心線Ｃの両側に対称に延びている第１支持部５５の両側に隣設される。   The first sensor 61 is provided on one side of the center line C, and the second sensor 62 is provided on the other side of the center line C. As a result, the deviation from the position of the wafer 2 when the wafer 2 is properly mounted is changed in the first direction X parallel to the center line C and the first direction X parallel to the mounting surface 54 and perpendicular to the center line C. Detection can be performed in two directions Y and two directions. Considering that the circular wafer 2 is symmetrical with respect to an arbitrary diameter, preferably, the first sensor 61 and the second sensor 62 are arranged symmetrically with respect to the center line C, For example, as shown in FIG. 4, it is provided adjacent to both sides of the first support portion 55 extending symmetrically on both sides of the center line C.

（信号処理部６３の判定例）
信号処理部６３には、第１センサ６１及び第２センサ６２それぞれの出力信号が入力される。そして、信号処理部６３は、入力された二つの信号に基づいて、センシング用ハンド５上のウエハ２の載置状態が適正か否かを判定する。判定は、閾値を用いて行うことができ、例えば、第１センサ６１の出力信号と、第２センサ６２の出力信号との両方の出力信号の信号値が閾値以上である場合に、ウエハ２の載置状態を適正と判定し、少なくとも一方の出力信号の信号値が閾値未満である場合に、ウエハ２の載置状態を不適と判定することができる。なお、閾値は、ウエハ２の載置状態が適正である場合の出力信号値と、ウエハ２の載置状態が不適である場合の出力信号値とに基づいて適宜設定できる。 (Example of determination by signal processing unit 63)
Output signals from the first sensor 61 and the second sensor 62 are input to the signal processing unit 63. Then, the signal processing unit 63 determines whether the mounting state of the wafer 2 on the sensing hand 5 is appropriate based on the two input signals. The determination can be performed using a threshold value. For example, when the signal values of both the output signal of the first sensor 61 and the output signal of the second sensor 62 are equal to or larger than the threshold value, The mounting state is determined to be appropriate, and when the signal value of at least one of the output signals is less than the threshold value, the mounting state of the wafer 2 can be determined to be inappropriate. The threshold can be set as appropriate based on an output signal value when the mounting state of the wafer 2 is appropriate and an output signal value when the mounting state of the wafer 2 is inappropriate.

図６及び図７は、ウエハ２の載置状態が適正である例を示す。第１センサ６１及び第２センサ６２は、いずれもウエハ２の外周面２２に対向しており、第１センサ６１の光Ｌ及び第２センサ６２の光は、いずれも外周面２２に極めて小さい入射角度で入射する。また、第１センサ６１と外周面２２との間の距離、及び第２センサ６２と外周面２２との間の距離は、いずれも十分に小さい。この場合に、第１センサ６１の出力信号と、第２センサ６２の出力信号との両方の出力信号の信号値が閾値以上となる。したがって、信号処理部６３は、ウエハ２の載置状態を適正と判定する。   FIGS. 6 and 7 show an example in which the mounting state of the wafer 2 is proper. The first sensor 61 and the second sensor 62 both face the outer peripheral surface 22 of the wafer 2, and the light L of the first sensor 61 and the light of the second sensor 62 are both extremely small incident on the outer peripheral surface 22. Incident at an angle. Further, the distance between the first sensor 61 and the outer peripheral surface 22 and the distance between the second sensor 62 and the outer peripheral surface 22 are both sufficiently small. In this case, the signal values of both the output signal of the first sensor 61 and the output signal of the second sensor 62 are equal to or larger than the threshold. Therefore, the signal processing unit 63 determines that the mounting state of the wafer 2 is appropriate.

図８及び図９は、ウエハ２の載置状態が不適である例を示す。図８及び図９に示す例では、ウエハ２が第１方向Ｘに沿ってセンシング用ハンド５の先端側にずれている。ウエハ２は、先端側で第２支持部５６及び第３支持部５７に乗り上げ、基端側では第１支持部５５から離間して載置面５４に接している。この場合に、第１センサ６１及び第２センサ６２は、いずれもウエハ２の外周面２２から外れて表面２３に対向しており、第１センサ６１の光Ｌ及び第２センサ６２の光は、いずれも図７に示した外周面２２に対する入射角度よりも大きい角度で表面２３に入射する。また、第１センサ６１と表面２３との間の距離は、図６に示した第１センサ６１と外周面２２との間の距離よりも大きく、第２センサ６２と表面２３との距離もまた、図６に示した第２センサ６２と外周面２２との間の距離よりも大きくなっている。このため、第１センサ６１の出力信号と、第２センサ６２の出力信号との両方の出力信号の信号値が閾値未満となる。したがって、信号処理部６３は、ウエハ２の載置状態を不適と判定する。   FIGS. 8 and 9 show an example in which the mounting state of the wafer 2 is inappropriate. In the example shown in FIGS. 8 and 9, the wafer 2 is displaced along the first direction X toward the tip end of the sensing hand 5. The wafer 2 rides on the second support portion 56 and the third support portion 57 on the front end side, and is separated from the first support portion 55 on the base end side and is in contact with the mounting surface 54. In this case, the first sensor 61 and the second sensor 62 are both off the outer peripheral surface 22 of the wafer 2 and opposed to the surface 23, and the light L of the first sensor 61 and the light of the second sensor 62 are In each case, the light enters the surface 23 at an angle larger than the incident angle with respect to the outer peripheral surface 22 shown in FIG. Further, the distance between the first sensor 61 and the surface 23 is larger than the distance between the first sensor 61 and the outer peripheral surface 22 shown in FIG. 6, and the distance between the second sensor 62 and the surface 23 is also larger. 6 is larger than the distance between the second sensor 62 and the outer peripheral surface 22 shown in FIG. Therefore, the signal values of both the output signal of the first sensor 61 and the output signal of the second sensor 62 are less than the threshold. Therefore, the signal processing unit 63 determines that the mounting state of the wafer 2 is inappropriate.

図１０及び図１１は、ウエハ２の載置状態が不適である他の例を示す。図１０及び図１１に示す例では、ウエハ２が第１方向Ｘに沿ってセンシング用ハンド５の基端側にずれている。ウエハ２は、基端側で第１支持部５５に乗り上げ、先端側では第２支持部５６及び第３支持部５７から離間して載置面５４に接している。この場合に、第１センサ６１及び第２センサ６２は、いずれもウエハ２の外周面２２から外れて裏面２１に対向しており、第１センサ６１の光及び第２センサ６２の光は、いずれも図７に示した外周面２２に対する入射角度よりも大きい角度で裏面２１に入射する。また、第１センサ６１と裏面２１との間の距離は、図６に示した第１センサ６１と外周面２２との間の距離よりも大きく、第２センサ６２と裏面２１との距離もまた、図６に示した第２センサ６２と外周面２２との間の距離よりも大きくなっている。このため、第１センサ６１の出力信号と、第２センサ６２の出力信号との両方の出力信号の信号値が閾値未満となる。したがって、信号処理部６３は、ウエハ２の載置状態を不適と判定する。   FIGS. 10 and 11 show another example in which the mounting state of the wafer 2 is inappropriate. In the example shown in FIGS. 10 and 11, the wafer 2 is shifted in the first direction X toward the base end of the sensing hand 5. The wafer 2 rides on the first support portion 55 on the base end side, and is separated from the second support portion 56 and the third support portion 57 on the front end side and is in contact with the mounting surface 54. In this case, the first sensor 61 and the second sensor 62 are both off the outer peripheral surface 22 of the wafer 2 and opposed to the back surface 21, and the light of the first sensor 61 and the light of the second sensor 62 Also enters the back surface 21 at an angle larger than the incident angle with respect to the outer peripheral surface 22 shown in FIG. The distance between the first sensor 61 and the rear surface 21 is larger than the distance between the first sensor 61 and the outer peripheral surface 22 shown in FIG. 6, and the distance between the second sensor 62 and the rear surface 21 is also larger. 6 is larger than the distance between the second sensor 62 and the outer peripheral surface 22 shown in FIG. For this reason, the signal values of both the output signal of the first sensor 61 and the output signal of the second sensor 62 become less than the threshold value. Therefore, the signal processing unit 63 determines that the mounting state of the wafer 2 is inappropriate.

図１２は、ウエハ２の載置状態が不適である他の例を示す。図１２に示す例では、ウエハ２が第２方向Ｙに沿って中心線Ｃの第２支持部５６側にずれている。ウエハ２は、先端側で第２支持部５６に乗り上げ、第３支持部５７から離間して載置面５４に接しているが、基端側では第１支持部５５の傾斜面５８に接している。ウエハ２の載置面５４に対する傾きは、図６及び図７に示したウエハ２の傾き、及び図８及び図９に示したウエハ２の傾きに比べて小さく、第１支持部５５の両側に隣設されている第１センサ６１及び第２センサ６２は、いずれもウエハ２の外周面２２に対向している。そして、中心線Ｃの第２支持部５６側にある第１センサ６１とウエハ２の外周面２２との間の距離は、図６に示した第１センサ６１と外周面２２との間の距離と同程度に小さく、第１センサ６１の出力信号の信号値は閾値以上となる。しかし、中心線Ｃの第３支持部５７側にある第２センサ６２とウエハ２の外周面２２との間の距離は、図６に示した第２センサ６２と外周面２２との間の距離よりも大きくなっており、第２センサ６２の出力信号の信号値は閾値未満となる。上述した判定例によれば、信号処理部６３は、ウエハ２の載置状態を不適と判定する。   FIG. 12 shows another example in which the mounting state of the wafer 2 is inappropriate. In the example shown in FIG. 12, the wafer 2 is shifted along the second direction Y toward the second support portion 56 on the center line C. The wafer 2 rides on the second support portion 56 on the distal end side, is separated from the third support portion 57 and is in contact with the mounting surface 54, but is in contact with the inclined surface 58 of the first support portion 55 on the proximal end side. I have. The inclination of the wafer 2 with respect to the mounting surface 54 is smaller than the inclination of the wafer 2 shown in FIGS. 6 and 7 and the inclination of the wafer 2 shown in FIGS. The first sensor 61 and the second sensor 62 provided adjacent to each other face the outer peripheral surface 22 of the wafer 2. The distance between the first sensor 61 on the second support portion 56 side of the center line C and the outer peripheral surface 22 of the wafer 2 is the distance between the first sensor 61 and the outer peripheral surface 22 shown in FIG. The signal value of the output signal of the first sensor 61 is equal to or larger than the threshold value. However, the distance between the second sensor 62 on the third support portion 57 side of the center line C and the outer peripheral surface 22 of the wafer 2 is the distance between the second sensor 62 and the outer peripheral surface 22 shown in FIG. And the signal value of the output signal of the second sensor 62 is smaller than the threshold value. According to the above-described determination example, the signal processing unit 63 determines that the mounting state of the wafer 2 is inappropriate.

センシング用ハンド５上のウエハ２の載置状態が適正であると判定された場合に、ロボット１は、第１アーム４を伸ばし、アーム支持部７を昇降させ、ウエハ搭載機構３によってカセット等からウエハ２を搬出する。一方、センシング用ハンド５上のウエハ２の載置状態が不適であると判定された場合に、ロボット１は、例えば動作を停止する。   When it is determined that the mounting state of the wafer 2 on the sensing hand 5 is appropriate, the robot 1 extends the first arm 4 and raises and lowers the arm support portion 7, and the wafer mounting mechanism 3 moves the robot 1 from a cassette or the like. The wafer 2 is unloaded. On the other hand, when it is determined that the mounting state of the wafer 2 on the sensing hand 5 is inappropriate, the robot 1 stops, for example, the operation.

このように、反射型光センサである第１センサ６１及び第２センサ６２をウエハ２の外周面に対向するように配置することにより、例えば図８及び図９に示した載置状態、図１０及び図１１に示した載置状態のように、ウエハ２が一つ又は二つの支持部に乗り上げることによってウエハ２が傾いた状態を検出できる。また、第１センサ６１と第２センサ６２とを中心線Ｃの両側に配置することにより、図１２に示した載置状態のように、ウエハ２が中心線Ｃの片側にずれている状態を検出できる。こうして、ウエハ２の載置状態を検出することにより、ウエハ２が不適な載置状態で搬送されることを防止でき、ウエハ２の落下、落下に起因する破損を未然に回避できる。   As described above, by disposing the first sensor 61 and the second sensor 62, which are reflection-type optical sensors, so as to face the outer peripheral surface of the wafer 2, for example, the mounting state shown in FIGS. As shown in FIG. 11, the tilted state of the wafer 2 can be detected when the wafer 2 rides on one or two support portions. Further, by disposing the first sensor 61 and the second sensor 62 on both sides of the center line C, the state in which the wafer 2 is shifted to one side of the center line C as in the mounting state shown in FIG. Can be detected. By detecting the mounted state of the wafer 2 in this way, it is possible to prevent the wafer 2 from being transported in an inappropriately mounted state, and it is possible to prevent the wafer 2 from being dropped or damaged due to the drop.

好ましくは、第１センサ６１と、第２センサ６２とは、中心線Ｃを挟んで互いに対称となる位置に設けられる。これにより、ウエハ２が中心線Ｃに対してどちらの側にずれても等しく載置状態を検出することができる。また、好ましくは、第１センサ６１と、第２センサ６２とは、第１支持部５５の両側に隣設される。これにより、ウエハ２が第１支持部５５を含む一つ又は二つの支持部に乗り上げ、又は第１支持部５５を含む一つ又は二つの支持部から外れることによって傾いた状態を確実に検出することができる。   Preferably, the first sensor 61 and the second sensor 62 are provided at positions symmetrical to each other with the center line C interposed therebetween. Thus, the mounted state can be detected equally regardless of which side the wafer 2 is shifted with respect to the center line C. Preferably, the first sensor 61 and the second sensor 62 are provided adjacent to both sides of the first support portion 55. This reliably detects a tilted state when the wafer 2 rides on one or two support parts including the first support part 55 or deviates from one or two support parts including the first support part 55. be able to.

（信号処理部６３の他の判定例）
信号処理部６３が行うウエハ２の載置状態の判定は、上述した例に限定されない。例えば、第１センサ６１の出力信号と、第２センサ６２の出力信号との少なくとも一方の出力信号の信号値が閾値以上である場合に、ウエハ２の載置状態が適正と判定され、両方の出力信号の信号値が閾値未満である場合に、ウエハ２の載置状態が不適と判定されてもよい。本例によれば、図１２に示した、載置面５４に対する傾きが比較的小さいウエハ２の載置状態は適正と判定される。このように、適正と見做すことができるウエハ２の載置状態の幅を広げることができ、例えばロボット１が頻繁に動作を停止する場合に有用である。 (Another determination example of the signal processing unit 63)
The determination of the mounting state of the wafer 2 performed by the signal processing unit 63 is not limited to the above-described example. For example, when the signal value of at least one of the output signal of the first sensor 61 and the output signal of the second sensor 62 is equal to or greater than a threshold value, the mounting state of the wafer 2 is determined to be appropriate, and both of them are determined. When the signal value of the output signal is less than the threshold value, the mounting state of the wafer 2 may be determined to be inappropriate. According to this example, the mounting state of the wafer 2 having a relatively small inclination with respect to the mounting surface 54 shown in FIG. 12 is determined to be appropriate. As described above, the width of the mounted state of the wafer 2 that can be regarded as appropriate can be widened, which is useful when, for example, the robot 1 frequently stops operating.

以上、説明したとおり、本明細書に開示された産業用ロボットは、板状の搬送対象物を搬送する産業用ロボットであって、前記搬送対象物が載置されるハンドと、前記ハンド上の前記搬送対象物を検出する検出部と、を備え、前記ハンドは、載置面と、前記搬送対象物が前記載置面との間に隙間をあけ且つ前記載置面に沿って配置されるように、前記搬送対象物の裏面の三箇所を支持可能な第１支持部、第２支持部、及び第３支持部と、を有し、前記検出部は、前記第１支持部と前記第２支持部と前記第３支持部とによって支持された前記搬送対象物の外周面に対向して配置される複数の反射型光センサと、前記複数の反射型光センサの出力信号に基づいて、前記搬送対象物の載置状態を判定する信号処理部と、を有し、前記複数の反射型光センサは、前記第１支持部を通り且つ前記第２支持部と前記第３支持部との中間を通る中心線の一方側に設けられた第１センサと、他方側に設けられた第２センサとを含む。この構成によれば、搬送対象物の外周面に対向するように配置された反射型光センサによって、搬送対象物が一つ又は二つの支持部に乗り上げる（一つ又は二つの支持部から外れる）ことによって傾いた状態を検出できる。また、中心線の両側に配置された反射型光センサによって、搬送対象物が、中心線に対して中心線と直交する方向にずれている状態を検出できる。このように、搬送対象物の載置状態を検出することにより、搬送対象物が不適な載置状態で搬送されることを防止でき、搬送対象物の落下、落下に起因する破損を未然に回避できる。   As described above, the industrial robot disclosed in this specification is an industrial robot that transports a plate-like transport target, and a hand on which the transport target is placed and a hand on the hand. A detection unit that detects the object to be transported, wherein the hand is arranged along the mounting surface with a gap between the mounting surface and the mounting surface. As described above, the first support unit, the second support unit, and the third support unit capable of supporting three places on the back surface of the transport target object, and the detection unit includes the first support unit and the third support unit. A plurality of reflection-type optical sensors disposed opposite to an outer peripheral surface of the object to be transported supported by the second support unit and the third support unit, and based on output signals of the plurality of reflection-type optical sensors, A signal processing unit for determining a placement state of the object to be conveyed; and A first sensor provided on one side of a center line passing through the first support portion and passing between the second support portion and the third support portion, and a second sensor provided on the other side. And According to this configuration, the object to be transported rides on one or two support portions (disengages from one or two support portions) by the reflection-type optical sensor arranged to face the outer peripheral surface of the object to be transported. Thus, the tilted state can be detected. Further, the reflection type optical sensors arranged on both sides of the center line can detect a state in which the object to be conveyed is shifted from the center line in a direction orthogonal to the center line. As described above, by detecting the placement state of the transport target, it is possible to prevent the transport target from being transported in an improper placement state, and to prevent the transport target from being dropped or damaged due to the fall. it can.

また、本明細書に開示された産業用ロボットは、前記第１センサと、前記第２センサとは、前記中心線を挟んで互いに対称となる位置に設けられている。この構成によれば、搬送対象物が中心線に対してどちらの側にずれても等しく載置状態を検出できる。   Further, in the industrial robot disclosed in the present specification, the first sensor and the second sensor are provided at positions symmetrical to each other with the center line interposed therebetween. According to this configuration, the mounted state can be detected equally regardless of which side the object to be transferred is shifted with respect to the center line.

また、本明細書に開示された産業用ロボットは、前記第１センサと、前記第２センサとは、前記第１支持部に隣設されている。この構成によれば、搬送対象物が第１支持部を含む一つ又は二つの支持部に乗り上げ、又は第１支持部を含む一つ又は二つの支持部から外れることによって傾いた状態を確実に検出できる。   In the industrial robot disclosed in the specification, the first sensor and the second sensor are provided adjacent to the first support. According to this configuration, it is ensured that the object to be transported rides on one or two support parts including the first support part, or deviates from one or two support parts including the first support part, and reliably tilts the object. Can be detected.

また、本明細書に開示された産業用ロボットは、前記第１支持部、前記第２支持部、及び前記第３支持部は、前記搬送対象物の前記裏面の外周部を支持する。この構成によれば、搬送対象物の裏面を保護できる。   In the industrial robot disclosed in this specification, the first support, the second support, and the third support support an outer peripheral portion of the back surface of the transport target. According to this configuration, the back surface of the transport target can be protected.

また、本明細書に開示された産業用ロボットは、前記第１支持部、前記第２支持部及び前記第３支持部は、前記第１支持部と前記第２支持部と前記第３支持部とを結んで得られる三角領域の外接円の中心に向いた傾斜面であって、前記載置面に近づくほどに前記中心に近づく傾斜面を有しており、前記傾斜面によって前記搬送対象物の前記裏面の外周部の縁に接する。この構成によれば、搬送に伴う振動等に起因する搬送対象物のずれを抑制できる。また、僅かなずれであれば、傾斜面によって自動的に適正位置に戻すこともできる。   Further, in the industrial robot disclosed in the specification, the first support, the second support, and the third support may include the first support, the second support, and the third support. The inclined surface facing the center of the circumscribed circle of the triangular area obtained by connecting the object and the inclined surface approaching the center as approaching the mounting surface, the object to be transported by the inclined surface In contact with the edge of the outer peripheral portion of the back surface. According to this configuration, it is possible to suppress a shift of the transfer target object due to a vibration or the like accompanying the transfer. In addition, if there is a slight displacement, it can be automatically returned to the proper position by the inclined surface.

また、本明細書に開示された産業用ロボットは、前記搬送対象物として半導体ウエハを搬送する。   Further, the industrial robot disclosed in the present specification transfers a semiconductor wafer as the transfer target.

１ 産業用ロボット
２ 半導体ウエハ（搬送対象物）
３ ウエハ搭載機構
４ 第１アーム
５ センシング用ハンド
６ 第２アーム
７ アーム支持部
８ 昇降機構
９ 第１支持部
１０ 第２支持部
２１ ウエハの裏面
２１ｅ ウエハの裏面における外周部の縁
２２ ウエハの外周面
２３ ウエハの表面
５１ センシング用ハンドの基端部
５２ センシング用ハンドの第１腕部
５３ センシング用ハンドの第２腕部
５４ センシング用ハンドの載置面
５５ 第１支持部
５６ 第２支持部
５７ 第３支持部
５８ 傾斜面
６０ 検出部
６１ 第１センサ（反射型光センサ）
６２ 第２センサ（反射型光センサ）
６３ 信号処理部
Ｃ 中心線
Ｏ 中心
Ｌ 光
Ｒ 三角領域
Ｘ 第１方向
Ｙ 第２方向 1 industrial robot 2 semiconductor wafer (transfer object)
Reference Signs List 3 Wafer mounting mechanism 4 First arm 5 Sensing hand 6 Second arm 7 Arm support unit 8 Elevating mechanism 9 First support unit 10 Second support unit 21 Wafer back surface 21e Edge of outer peripheral portion on wafer back surface 22 Wafer outer periphery Surface 23 Wafer surface 51 Base end portion of sensing hand 52 First arm portion 53 of sensing hand Second arm portion 54 of sensing hand Mounting surface 55 of sensing hand 55 First support portion 56 Second support portion 57 Third support portion 58 Inclined surface 60 Detection portion 61 First sensor (reflective optical sensor)
62 second sensor (reflective optical sensor)
63 signal processing unit C center line O center L light R triangular area X first direction Y second direction

Claims (6)

板状の搬送対象物を搬送する産業用ロボットであって、
前記搬送対象物が載置されるハンドと、
前記ハンド上の前記搬送対象物を検出する検出部と、
を備え、
前記ハンドは、
載置面と、
前記搬送対象物が前記載置面との間に隙間をあけ且つ前記載置面に沿って配置されるように、前記搬送対象物の裏面の三箇所を支持可能な第１支持部、第２支持部、及び第３支持部と、
を有し、
前記検出部は、
前記第１支持部と前記第２支持部と前記第３支持部とによって支持された前記搬送対象物の外周面に対向して配置される複数の反射型光センサと、
前記複数の反射型光センサの出力信号に基づいて、前記搬送対象物の載置状態を判定する信号処理部と、
を有し、
前記複数の反射型光センサは、前記第１支持部を通り且つ前記第２支持部と前記第３支持部との中間を通る中心線の一方側に設けられた第１センサと、他方側に設けられた第２センサとを含む産業用ロボット。 An industrial robot for transporting a plate-like transport object,
A hand on which the transport target is placed,
A detection unit that detects the transport target on the hand,
With
The hand is
Mounting surface,
A first support unit that can support three places on the back surface of the transport target so that the transport target is disposed along the mounting surface with a gap between the transport target and the second mounting surface; A support portion, and a third support portion;
Has,
The detection unit,
A plurality of reflection-type optical sensors arranged to face an outer peripheral surface of the object to be transported supported by the first support, the second support, and the third support;
Based on output signals of the plurality of reflection-type optical sensors, a signal processing unit that determines a mounting state of the transport target,
Has,
The plurality of reflection-type optical sensors include a first sensor provided on one side of a center line passing through the first support portion and passing between the second support portion and the third support portion, and a first sensor provided on the other side. An industrial robot including a second sensor provided. 請求項１記載の産業用ロボットであって、
前記第１センサと、前記第２センサとは、前記中心線を挟んで互いに対称となる位置に設けられている産業用ロボット。 The industrial robot according to claim 1, wherein
An industrial robot, wherein the first sensor and the second sensor are provided at positions symmetrical to each other with respect to the center line. 請求項２記載の産業用ロボットであって、
前記第１センサと、前記第２センサとは、前記第１支持部に隣設されている産業用ロボット。 The industrial robot according to claim 2,
The industrial robot, wherein the first sensor and the second sensor are provided adjacent to the first support. 請求項１から３のいずれか一項記載の産業用ロボットであって、
前記第１支持部、前記第２支持部、及び前記第３支持部は、前記搬送対象物の前記裏面の外周部を支持する産業用ロボット。 The industrial robot according to any one of claims 1 to 3,
An industrial robot in which the first support, the second support, and the third support support an outer peripheral portion of the back surface of the transport target. 請求項４記載の産業用ロボットであって、
前記第１支持部、前記第２支持部及び前記第３支持部は、前記第１支持部と前記第２支持部と前記第３支持部とを結んで得られる三角領域の外接円の中心に向いた傾斜面であって、前記載置面に近づくほどに前記中心に近づく傾斜面を有しており、前記傾斜面によって前記搬送対象物の前記裏面の外周部の縁に接する産業用ロボット。 The industrial robot according to claim 4, wherein
The first support, the second support, and the third support are located at the center of a circumscribed circle of a triangular area obtained by connecting the first support, the second support, and the third support. An industrial robot having an inclined surface facing toward the center as approaching the placement surface, wherein the inclined surface is in contact with an edge of an outer peripheral portion of the back surface of the transport target by the inclined surface. 請求項４又は５記載の産業用ロボットであって、
前記搬送対象物は半導体ウエハである産業用ロボット。 The industrial robot according to claim 4, wherein:
An industrial robot in which the object to be transferred is a semiconductor wafer.
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