JP2020009328A - Rfid tag, rfid roll, and method for manufacturing the same - Google Patents

Abstract

To provide an RFID tag and an RFID roll which can operate on a metal as well and can suppress generation of cracking in an antenna, and a method for providing the tag and the roll.SOLUTION: The present invention relates to a method for manufacturing an RFID tag 1 to be attached on a target object, and the method includes: attaching one surface of an IC 30 and one surface of an antenna layer 20 to one surface of an adhesive layer 10; cutting a cover layer 60 on the other surface of the adhesive layer 10 in half; and bending the cover layer 60 and the antenna layer 20 along the half-cut position, thereby causing the antenna layer 20 to be held in the cover layer 60.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an RFID tag, an RFID roll, and a method for manufacturing the same.

  Conventionally, an RFID tag in which an antenna is connected to an IC chip has been known. The RFID tag can output information stored in an IC chip to a reader in a non-contact manner. There are several types of such RFID tags, for example, an active type that has its own power supply, and a passive type that drives a radio wave such as a UHF band or a microwave emitted from a reader as energy.

  Among them, passive type RFID tags are inexpensive and therefore are used for various purposes such as distribution and article management. For example, as a passive-type RFID tag, an RFID tag in which an IC and an antenna are separated from each other without bonding is known. According to such an RFID tag, there is no need to use a conductive adhesive for bonding the IC and the antenna. Thermal curing is often used for curing the conductive adhesive. Therefore, in an RFID tag that does not use a conductive adhesive, an antenna (for example, an antenna substrate that is a film material) does not require heat resistance. Therefore, the thickness of the antenna can be reduced, and thus the thickness of the RFID tag can be reduced.

  By the way, attempts have been made to use an RFID tag attached to a metal. As such an RFID tag, an RFID tag in which an antenna is bent to form a double-sided antenna has been proposed (for example, see Patent Document 1).

Japanese Patent No. 6288317

  The RFID tag described in Patent Literature 1 forms a double-sided antenna by bending an antenna formed in a planar shape. In this manner, by using the antenna as a double-sided antenna, the RFID tag can transmit and receive data to and from the reader even when the RFID tag is attached to a metal.

  On the other hand, in the RFID tag described in Patent Literature 1, the IC is fixed to the antenna with a conductive adhesive. Therefore, the antenna needs to have a predetermined thickness or more. When the antenna is bent, the outer peripheral surface is pulled by the bending stress by the circumference obtained by adding the thickness to the inner surface. Therefore, it is considered that this may cause cracks in the antenna. Further, the IC is fixed on the antenna, and a print label is arranged on the surface of the IC and the antenna. Therefore, it is conceivable that the swelling of the IC becomes an obstacle when printing on the label.

  Therefore, an object of the present invention is to provide an RFID tag, an RFID roll, and a method for manufacturing the same, which operate even when attached to a metal and can suppress generation of cracks in an antenna.

  The present invention relates to a method for manufacturing an RFID tag to be attached to an object, wherein an attaching step of attaching one surface of an IC and an antenna layer to one surface of an adhesive layer, and the other surface of the adhesive layer A half-cutting step of half-cutting the cover layer affixed thereon, and a bending step of bending the cover layer and the antenna layer along a half-cut position to sandwich the antenna layer by the cover layer, The present invention relates to a method for manufacturing an RFID tag including:

  Further, in the method for manufacturing an RFID tag, of the cover layers divided by a half-cut position, a peeling step of peeling the cover layer close to the IC, and a position for the peeled cover layer, And a step of arranging the label layer.

  In the bending step, it is preferable that a spacer layer disposed on the other surface of the antenna layer is sandwiched between the antenna layers.

  In addition, the method of manufacturing an RFID tag may include, before the bending step, a full cut of the cover layer and the antenna layer according to the shape of the bent portion of the cover layer and the antenna layer bent along the half cut position. It is preferable to further include a cutting step.

  The method for manufacturing an RFID tag may further include, after the bending step, an adhesion step of adhering a part of a peripheral edge of the antenna layer facing the insertion step, an insertion step of inserting a spacer layer into a space sandwiched by the antenna layers, A sealing step of bonding and sealing the remaining periphery of the antenna layer.

  Further, the present invention is an RFID tag attached to an object, an adhesive layer, an antenna layer having one surface attached on one surface of the adhesive layer, and one surface of the adhesive layer. An IC disposed on the one side of the antenna layer and releasably in contact with one surface of the antenna layer, and a spacer layer disposed on the other surface of the antenna layer, wherein the adhesive layer, the antenna layer, and the spacer layer The present invention relates to an RFID tag having a bent structure in which the adhesive layer is bent so as to be disposed on the outermost surface.

  Further, the present invention is an RFID tag attached to an object, an adhesive layer, an antenna layer having one surface attached on one surface of the adhesive layer, and one surface of the adhesive layer. An adhesive layer, an antenna layer, and a spacer layer, comprising: an IC disposed on the one side of the antenna layer so as to be releasably in contact with one surface of the antenna layer; and a spacer layer disposed in a region sandwiched between the antenna layers. The present invention relates to an RFID tag having a bent structure in which the adhesive layer is bent so as to be disposed on the outermost surface.

  Further, it is preferable that the RFID tag further includes a label layer disposed on a surface of the other surface of the adhesive layer that is closer to the IC.

  According to another aspect of the present invention, there is provided an RFID roll holding a plurality of RFID tags, comprising: a band-shaped mount portion; and a plurality of RFID tags according to any one of the above. The present invention also relates to an RFID roll that is arranged with its opening open, its length direction is arranged along the width direction of the mount, and its width direction is arranged along the length direction of the mount.

  According to another aspect of the present invention, there is provided an RFID roll holding a plurality of RFID tags, comprising: a band-shaped mount portion; and a plurality of RFID tags according to any one of the above. The present invention relates to an RFID roll that is arranged with a gap opened, arranged in a length direction along the length direction of the mount, and arranged in a width direction along the width direction of the mount.

  Advantageous Effects of Invention According to the present invention, it is possible to provide an RFID tag, an RFID roll, and a method for manufacturing the same that can operate even when affixed to a metal and can suppress generation of cracks in an antenna.

It is a top view showing the RFID roll in which the RFID tag concerning a 1st embodiment of the present invention was arranged continuously. FIG. 2 is a sectional view taken along line AA of FIG. 1. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a plan view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a manufacturing process of the RFID tag according to the first embodiment. It is a top view showing the RFID roll in which the RFID tag concerning a 2nd embodiment of the present invention was arranged continuously. FIG. 11 is a plan view illustrating a manufacturing process of the RFID tag according to the second embodiment. It is one sectional view showing the manufacturing process of the RFID tag concerning a 2nd embodiment. FIG. 11 is a plan view illustrating a manufacturing process of the RFID tag according to the second embodiment. It is a perspective view showing a manufacturing process of an RFID tag concerning a 3rd embodiment of the present invention. It is one perspective view showing the manufacturing process of the RFID tag concerning a 3rd embodiment.

Hereinafter, an RFID tag 1, an RFID roll 100, and a method of manufacturing the same according to each embodiment of the present invention will be described with reference to FIGS.
First, an outline of the RFID tag 1 according to each embodiment will be described.

  The RFID tag 1 is a passive type tag. The RFID tag 1 is used by being attached to an article or the like (hereinafter, referred to as an object). The RFID tag 1 stores, for example, information on an object. The RFID tag 1 is driven by radio waves (for example, UHF band) emitted from a reader (not shown). The RFID tag 1 is configured to be able to transmit stored information as a result of driving. In each embodiment, for example, the RFID tag 1 is configured to be operable even when attached to a metal surface of an object that reflects radio waves.

[First Embodiment]
Next, an RFID tag 1, an RFID roll 100, and a method of manufacturing the RFID tag 1 according to the first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the RFID roll 100 according to the present embodiment is a combination (holding) of a plurality of RFID tags 1. The RFID roll 100 includes a mount 101 and a plurality of RFID tags 1.

  The backing part 101 is, for example, release paper, and is formed in a belt shape. The mount 101 has a length that allows a plurality of RFID tags 1 to be arranged at predetermined intervals in the length direction. Further, the mount 101 has a width in which at least one RFID tag 1 can be arranged.

  As shown in FIG. 2, a plurality of RFID tags 1 are arranged at predetermined intervals in the longitudinal direction of the mount 101. The RFID tag 1 includes an adhesive layer 10, an antenna layer 20, an IC 30, a spacer layer 40, and a label layer 50.

  The adhesive layer 10 is, for example, an elastomer adhesive sheet. The adhesive layer 10 is formed in a rectangular shape when viewed from the front. The adhesive layer 10 is formed in a U-shaped cross section in the length direction (cross section taken along the line AA in FIG. 1). The adhesive layer 10 is disposed such that one flat outer surface having a U-shaped cross section faces one surface of the mount 101. Thereby, the adhesive layer 10 adheres to the mount 101.

  The antenna layer 20 is formed in a rectangular shape when viewed from the front. The antenna layer 20 is formed in a U-shaped cross section, similarly to the adhesive layer 10. The antenna layer 20 is disposed so as to overlap with the adhesive layer 10. Specifically, the antenna layer 20 has one surface attached to one surface of the adhesive layer 10. That is, the antenna layer 20 is attached with the outer surface facing the inner surface of the adhesive layer 10. Thereby, the antenna layer 20 is arranged in a region formed by the inner surface of the adhesive layer 10. In the present embodiment, the antenna layer 20 is formed to have the same shape or substantially the same diameter as the adhesive layer 10. The antenna layer 20 includes a main body layer 21 and a film layer 22.

  The main body layer 21 is a metal layer, for example, an aluminum layer. The main body layer 21 is arranged along the inner surface of the adhesive layer 10. In other words, the main body layer 21 is arranged adjacent to the inner surface of the adhesive layer 10. Further, the main body layer 21 is arranged so as to be able to contact a pair of electrodes of the IC 30. Thereby, the main body layer 21 functions as an antenna for data communication between the IC 30 and the reader.

  The film layer 22 is disposed so as to overlap the main body layer 21. Specifically, the film layer 22 is arranged with the outer surface facing the inner surface of the main body layer 21. The film layer 22 is provided for forming the main body layer 21. The film layer 22 is, for example, PET, OPP, PE, or the like.

  The IC 30 is a chip in which information on the object is stored. The IC 30 is formed in a rectangular parallelepiped shape, and has a built-in resonance circuit. The IC 30 has an electrode (not shown) on the surface opposite to the surface bonded to the mount 101. The IC 30 is disposed on one surface of the adhesive layer 10 and contacts the one surface of the antenna layer 20 so as to be able to be separated therefrom. As a result, the IC 30 is bonded to the mount 101 using the adhesive layer 10 and comes into contact with the antenna layer 20 by the electrode. The IC 30 is formed with a sufficiently small area with respect to the areas of the adhesive layer 10 and the mount 101 in plan view. The IC 30 is formed with a thickness of, for example, 200 μm.

  The spacer layer 40 is, for example, a dielectric. The spacer layer 40 is formed in a rectangular shape when viewed from the front. The spacer layer 40 is formed in a U-shaped cross section, similarly to the adhesive layer 10 and the antenna layer 20. The spacer layer 40 is disposed so as to overlap the adhesive layer 10 and the antenna layer 20. Specifically, the spacer layer 40 is disposed on the other surface of the antenna layer 20. That is, the spacer layer 40 is arranged with the outer surface facing the inner surface of the antenna layer 20. In other words, the spacer layer 40 is arranged with the outer surface facing the inner surface of the film layer 22. As a result, the spacer layer 40 is disposed in a region surrounded by the inner surface of the film layer 22. The thickness of the spacer layer 40 is determined based on, for example, the wavelength of a radio wave used for reading data and the wavelength of a radio wave reflected by the surface of the object. Specifically, the thickness of the spacer layer 40 is determined so that the radio wave output from the antenna layer 20 is not attenuated by the radio wave reflected on the surface of the object. Further, in the present embodiment, the spacer layer 40 has an adhesive property on an opposing surface (inner surface). Further, the spacer layer 40 preferably has a foamed base material or foamed adhesiveness.

In addition, since the spacer layer 40 is made of a dielectric, the phase of the electromagnetic wave can be shifted by the wavelength shortening effect. The thicker the spacer layer 40, the wider the phase difference can be. This makes it difficult for the phase difference to cancel.
By the way, as the thickness of the dielectric increases, the energy loss of electromagnetic waves increases. On the other hand, the air layer can be regarded as having no energy loss. Therefore, since the spacer layer 40 is a foam having bubbles inside, it is possible to suppress a decrease in the intensity of the response wave. In addition, since bending occurs at the interface between the dielectric and the air layer, a phase change in angular frequency can be generated.

  According to the adhesive layer 10, the antenna layer 20, and the spacer layer 40 described above, the adhesive layer 10 has a folded structure in which the adhesive layer 10 is bent so as to be disposed on the outermost surface. Further, each of the adhesive layer 10, the antenna layer 20, and the spacer layer 40 has a U-shaped cross section, and thus has a double structure in the thickness direction of the RFID tag 1. Further, the bending structure of each of the adhesive layer 10, the antenna layer 20, and the spacer layer 40 has an arc-shaped cross section.

  The label layer 50 is disposed on the other surface of the adhesive layer 10 on the side close to the IC 30. The label layer 50 is, for example, a printable print label.

  According to the RFID tag 1 described above, of the other surface of the adhesive layer 10, the surface on which the label layer 50 is not arranged is configured to be able to be attached to the object. By performing printing on the label layer 50, the RFID tag 1 can be attached to the object with the print surface of the label layer 50 as the surface.

  When radio waves are emitted from the reader to the RFID tag 1 for data transmission / reception, the emitted radio waves are reflected on the metal surface of the object. As a result, the reflected radio waves are shifted by half a wavelength. Therefore, the irradiated radio wave is attenuated by the reflected radio wave. Also, even if the IC 30 transmits data to the radiated radio wave via the antenna, the intensity is attenuated by the reflected radio wave. On the other hand, since the antenna layer 20 has a double structure via the spacer layer 40 in the thickness direction of the RFID tag 1, data can be transmitted to the object from two different distances. Become.

  The plurality of RFID tags 1 are arranged at predetermined intervals in the length direction of the mount 101 to form the RFID roll 100. In the present embodiment, each of the plurality of RFID tags 1 has a length direction arranged along the width direction of the mount 101 and a width direction arranged along the length direction of the mount 101. When attaching the RFID tags 1 to a plurality of objects, the RFID tags 1 can be sequentially pulled out by pulling out the mount 101. In addition, a label printer (not shown) can sequentially print on each of a plurality of RFID label papers by performing printing along the length direction of the mount 101.

Next, a method for manufacturing the RFID roll 100 and the RFID tag 1 will be described.
First, a method for manufacturing the RFID tag 1 will be described.

  The method for manufacturing the RFID tag 1 includes an attaching step, a half-cut step, a bending step, a peeling step, and an arrangement step. In the attaching step, one surface of the IC 30 and one surface of the antenna layer 20 are attached on one surface of the adhesive layer 10. In the present embodiment, for example, a cover layer 60 that is a release paper is attached on the other surface of the adhesive layer 10. In the attaching step, a spacer layer 40 is disposed on the other surface of the antenna layer 20, as shown in FIG. The spacer layer 40 is disposed so as to be sandwiched between the antenna layer 20 and another cover layer 70 which is a release paper.

  Next, in the half cut step, as shown in FIGS. 4 and 5, half cut is performed on the cover layer 60. In the present embodiment, the half cut is performed at a position K1 along the width direction of the RFID tag 1, which is a position that equally or substantially equally divides the length direction of the RFID tag 1. Thereby, the cover layer 60 is cut.

  Next, as shown in FIG. 6, the other cover layer 70 is removed. Thereby, the spacer layer 40 is exposed. Next, as shown in FIG. 7, in the bending step, the cover layer 60 of the RFID tag 1 sandwiches the antenna layer 20 by folding the cover layer 60 and the antenna layer 20 along the half-cut position. Specifically, the RFID tag 1 is folded in a mountain fold along the cut. Thereby, the RFID tag 1 is folded into a U-shaped cross section with the cover layer 60 exposed. That is, in the RFID tag 1, the longitudinal ends are overlapped with each other, and the central portion is bent into an arc-shaped cross section.

  Next, as shown in FIG. 8, in the peeling step, of the cover layers 60 divided by the half-cut position, the cover layer 60 close to the IC 30 is peeled. Thus, a part of the outer surface of the adhesive layer 10 is exposed. Next, as shown in FIG. 9, in a placement step, the label layer 50 is placed at the position of the cover layer 60 from which the label layer 50 has been peeled off. Thereby, the RFID tag 1 is manufactured.

Next, a method for manufacturing the RFID roll 100 will be described.
As shown in FIG. 10, the other side of the cover layer 60 of the manufactured RFID tag 1 is peeled off from the adhesive layer 10. Thereby, the adhesive layer 10 is exposed. Then, as shown in FIG. 11, the mount 101 is attached to the exposed outer surface of the adhesive layer 10. The RFID roll 100 is manufactured by arranging a plurality of RFID tags 1 at predetermined intervals in the length direction of the backing paper. In this embodiment, the RFID roll 100 is manufactured by arranging the width direction of the RFID tag 1 along the length direction of the roll.

According to the RFID tag 1, the RFID roll 100, and the method of manufacturing the same according to the first embodiment, the following effects can be obtained.
(1) A method for manufacturing an RFID tag 1 to be attached to an object, an attaching step of attaching one surface of an IC 30 and an antenna layer 20 on one surface of an adhesive layer 10 and the other of the adhesive layer 10 A half-cutting step of half-cutting the cover layer 60 pasted on the surface of the cover layer 60, and bending the cover layer 60 and the antenna layer 20 along the half-cut position to sandwich the antenna layer 20 with the cover layer 60 And a step. Thereby, the antenna layer 20 can have a double structure in the thickness direction of the RFID tag 1. The RFID tag 1 can be easily manufactured since the double structure can be obtained simply by folding. Further, by half-cutting the cover layer 60 in advance, the stress generated by bending the antenna layer 20 can be dispersed. Therefore, generation of cracks in the antenna layer 20 can be suppressed.

(2) The method of manufacturing the RFID tag 1 further includes a peeling step of peeling the cover layer 60 close to the IC 30 among the cover layers 60 divided by the half-cut position, and printing at a position of the peeled cover layer 60. And an arranging step of arranging the label layer 50 for use. This enables printing on the RFID tag 1. Further, since the label portion can be attached to the adhesive layer 10, it is possible to suppress the occurrence of unevenness in the label portion, and therefore, it is possible to easily print the label paper.

(3) In the bending step, the spacer layer 40 disposed on the other surface of the antenna layer 20 is sandwiched between the antenna layers 20. Thereby, a predetermined interval can be formed between the antenna layers 20 in the thickness direction of the RFID tag 1. Therefore, even if the object has a metal surface, the communication possibility can be improved. Further, since the spacer layer 40 is sandwiched between the antenna layers 20, it is possible to freely select, for example, acid resistance in etching. Thereby, the dielectric constant and the thickness of the spacer layer 40 can be increased. For example, the spacer layer 40 may be made of a foamable material.

(4) The RFID tag 1 attached to the object, the adhesive layer 10, the antenna layer 20 having one surface attached on one surface of the adhesive layer 10, and one surface of the adhesive layer 10. An IC 30 disposed on the one side of the antenna layer 20 so as to be able to be separated from the other, and a spacer layer 40 disposed on the other side of the antenna layer 20, and the adhesive layer 10, the antenna layer 20, and The spacer layer 40 has a bent structure in which the adhesive layer 10 is bent so as to be disposed on the outermost surface. This makes it possible to provide the RFID tag 1 that can perform data communication even when attached to an object having a metal surface. Further, since the spacer layer 40 and the antenna layer 20 are formed of different members, the material of the spacer layer 40 can be selected without being affected by the material of the antenna layer 20. For example, the material of the spacer layer 40 can be selected without being affected by the acid resistance or the like in the etching of the antenna layer 20. Thereby, the dielectric constant and the thickness of the spacer layer 40 sandwiched between the antenna layers 20 can be increased without being affected by the antenna layer 20. For example, the spacer layer 40 may be made of a foamable material.

(5) An RFID roll 100 holding a plurality of RFID tags 1, comprising a band-shaped mount 101 and the above-described plurality of RFID tags 1, and each of the plurality of RFID tags 1 It is arranged, and the length direction is arranged along the width direction of the mount, and the width direction is arranged along the length direction of the mount. Thereby, since printing can be continuously performed on a plurality of RFID tags 1, printing can be facilitated. Further, the RFID tag 1 can be easily attached to a plurality of objects.

[Second embodiment]
Next, an RFID tag 1, an RFID roll 100, and a method of manufacturing the same according to a second embodiment of the present invention will be described with reference to FIGS. In the description of the second embodiment, the same components are denoted by the same reference numerals, and the description thereof will be omitted or simplified.
In the RFID roll 100 according to the second embodiment, as shown in FIG. 12, the plurality of RFID tags 1 are arranged at predetermined intervals, and the length direction is along the length direction of the mount 101. The first embodiment differs from the first embodiment in that they are arranged along the width direction of the mount 101 in the width direction. Further, in the manufacturing method of the RFID tag 1 according to the second embodiment, before the bending step, as shown in FIG. 13, the shape K2 of the bent portion of the cover layer 60 and the antenna layer 20 bent along the half cut position is used. The third embodiment is different from the first embodiment in further including a full-cut step of fully cutting the cover layer 60 and the antenna layer 20. Further, in the method of manufacturing the RFID tag 1 according to the second embodiment, as shown in FIGS. 14 and 15, in the bending step, the adhesive layer 10, the antenna layer 20, and the spacer layer 40 of the fully cut portion are The first embodiment differs from the first embodiment in that the full-cut portions are overlapped by being folded.

According to the RFID tag 1, the RFID roll 100, and the method of manufacturing the same according to the second embodiment, the following effects can be obtained.
(6) In the manufacturing method of the RFID tag 1, before the bending step, the cover layer 60 and the antenna layer 20 are fully cut according to the shapes of the bent portions of the cover layer 60 and the antenna layer 20 that are bent along the half-cut position. The method further includes a full cut step. By doing so, the RFID tag 1 can be manufactured.

(7) An RFID roll 100 that holds a plurality of RFID tags 1 and includes a band-shaped mount 101 and the above-described plurality of RFID tags 1, and each of the plurality of RFID tags 1 is spaced apart from each other at a predetermined interval. They are arranged, the length direction is arranged along the length direction of the mount 101, and the width direction is arranged along the width direction of the mount 101. Thereby, since the length direction of the RFID tag 1 is along the length direction of the mount 101, the RFID tag 1 is easily separated from the mount 101. Therefore, the RFID tag 1 can be efficiently attached to each of the plurality of objects.

[Third embodiment]
Next, an RFID tag 1, an RFID roll 100, and a method of manufacturing the same according to a third embodiment of the present invention will be described with reference to FIGS. In the description of the fourth embodiment, the same components are denoted by the same reference numerals, and the description thereof will be omitted or simplified.
The method for manufacturing the RFID tag 1 according to the fourth embodiment includes a bonding step of bonding a part of the peripheral edge of the antenna layer 20 facing after the bending step, and a space sandwiched between the antenna layers 20 as shown in FIG. The first and second embodiments are further provided with an insertion step of inserting a spacer layer 40 into the antenna layer 20 and a sealing step of bonding and sealing the remaining periphery of the antenna layer 20 as shown in FIG. different. Further, the RFID tag 1 according to the third embodiment has the first and the second points in that the spacer layer 40 is disposed in a region sandwiched by the antenna layers 20 and that the RFID tag 1 includes a flange portion 23 disposed around the antenna layer 20. Different from the second embodiment.

  The flange 23 is, for example, an OPP film. The flange 23 is disposed around the film layer 22. Specifically, the flange portion 23 is arranged at a position protruding from the adhesive layer 10 around the film layer 22. The flange portion 23 can be thermocompression bonded, for example, and the overlapped flange portions 23 of the folded RFID tag 1 are thermocompression bonded. Thereby, the flange portion 23 is configured to be able to form a space in a portion where the film layer 22 overlaps.

Next, a method of manufacturing the RFID tag 1 and the RFID roll 100 according to the embodiment will be described.
The steps up to the folding step are the same as in the first and second embodiments. Next, as shown in FIG. 16, the opposed flange portions 23 are thermocompression-bonded to each other. At this time, thermocompression bonding is carried out except for one direction among the flanges 23 in the four directions around the film layer 22. As a result, a region surrounded by the film layer 22 (a region sandwiched between the film layers 22 has a bag shape with an opening in one direction. Next, the spacer layer 40 is inserted into the bag-shaped region from one opening. The RFID tag 1 is formed by thermocompression bonding of the flange portion 23 at the position of the opening in the direction.

According to the RFID tag 1, the RFID roll 100, and the method of manufacturing the same according to the third embodiment, the following effects can be obtained.
(8) The manufacturing method of the RFID tag 1 includes, after the bending step, an adhesive step of bonding a part of the periphery of the facing antenna layer 20 and an inserting step of inserting the spacer layer 40 into a space sandwiched by the antenna layers 20. And a sealing step of bonding and sealing the remaining peripheral edge of the antenna layer 20. Even with such a manufacturing method, the RFID tag 1 can be manufactured.

(9) The RFID tag 1 attached to the object, the adhesive layer 10, the antenna layer 20 having one surface attached on one surface of the adhesive layer 10, and one surface of the adhesive layer 10. An IC 30 disposed above and in contact with one surface of the antenna layer 20 in a releasable manner, and a spacer layer 40 disposed in a region sandwiched between the antenna layers 20. The adhesive layer 10, the antenna layer 20, The spacer layer 40 has a bent structure in which the adhesive layer 10 is bent so as to be disposed on the outermost surface. Even such an RFID tag 1 is attached to an object having a metal surface and can transmit and receive data to and from a reader. Further, since the spacer layer 40 is sandwiched between the antenna layers 20, it is not necessary to provide the adhesive layer 10 on the surface of the spacer layer, and it is possible to freely select, for example, acid resistance by etching. Thereby, the dielectric constant and the thickness of the spacer layer 40 can be increased. For example, the spacer layer 40 may be made of a foamable material.

  As described above, the preferred embodiments of the RFID tag, the RFID roll, and the method of manufacturing the same according to the present invention have been described. However, the present invention is not limited to the above-described embodiments, and can be appropriately modified.

  For example, in the above embodiment, the adhesive layer 10, the antenna layer 20, and the spacer layer 40 have been described as having a U-shaped cross section, but are not limited thereto. For example, the adhesive layer 10, the antenna layer 20, and the spacer layer 40 may have an S-shaped cross section with an increased number of bent portions. Thereby, since the plurality of antenna layers 20 can be stacked in the thickness direction of the RFID tag 1 from the surface of the object, the success rate of data transmission and reception between the reader and the IC 30 can be improved.

  Further, in the above embodiment, the spacer layer 40 has the same shape as the antenna layer 20, but is not limited thereto. For example, the spacer layer 40 may be provided in the same shape as the already folded state.

DESCRIPTION OF SYMBOLS 1 RFID tag 10 Adhesive layer 20 Antenna layer 30 IC
Reference Signs List 40 spacer layer 50 label layer 60 cover layer 100 RFID roll 101 mount part

Claims (10)

A method of manufacturing an RFID tag attached to an object,
An attaching step of attaching one surface of the IC and the antenna layer on one surface of the adhesive layer,
A half-cutting step of half-cutting the cover layer affixed on the other surface of the adhesive layer,
By bending the cover layer and the antenna layer along a half-cut position, a bending step of sandwiching the antenna layer by the cover layer,
A method for manufacturing an RFID tag comprising: A peeling step of peeling the cover layer close to the IC among the cover layers divided by a half-cut position;
At the position of the peeled cover layer, an arrangement step of arranging a label layer for printing,
The method for manufacturing an RFID tag according to claim 1, further comprising:   3. The method of manufacturing an RFID tag according to claim 1, wherein in the bending step, a spacer layer disposed on the other surface of the antenna layer is sandwiched between the antenna layers.   The method according to claim 1, further comprising, before the bending step, a full-cut step of fully cutting the cover layer and the antenna layer according to a shape of a bent portion of the cover layer and the antenna layer bent along a half-cut position. 4. The method for manufacturing an RFID tag according to any one of the above items 3. After the bending step,
A bonding step of bonding a part of the periphery of the antenna layer facing the bonding step,
An insertion step of inserting a spacer layer into a space sandwiched by the antenna layers,
A sealing step of bonding and sealing the remaining periphery of the antenna layer,
The method for manufacturing an RFID tag according to claim 1, further comprising: An RFID tag attached to an object,
An adhesive layer,
An antenna layer having one surface attached to one surface of the adhesive layer,
An IC that is disposed on one surface of the adhesive layer and that comes into contact with one surface of the antenna layer in a detachable manner;
A spacer layer disposed on the other surface of the antenna layer,
With
The RFID tag having a bent structure in which the adhesive layer, the antenna layer, and the spacer layer are bent such that the adhesive layer is disposed on an outermost surface. An RFID tag attached to an object,
An adhesive layer,
An antenna layer having one surface attached to one surface of the adhesive layer,
An IC that is disposed on one surface of the adhesive layer and that comes into contact with the one surface of the antenna layer in a detachable manner;
A spacer layer disposed in a region sandwiched by the antenna layer,
With
The RFID tag having a bent structure in which the adhesive layer, the antenna layer, and the spacer layer are bent such that the adhesive layer is disposed on an outermost surface.   The RFID tag according to claim 6, further comprising a label layer disposed on a surface of the other surface of the adhesive layer that is closer to the IC. An RFID roll holding a plurality of RFID tags,
A band-shaped backing part,
A plurality of RFID tags according to any one of claims 6 to 8,
With
Each of the plurality of RFID tags is arranged at a predetermined interval, the length direction is arranged along the width direction of the mount portion, and the width direction is arranged along the length direction of the mount portion. RFID roll. An RFID roll holding a plurality of RFID tags,
A band-shaped backing part,
A plurality of RFID tags according to any one of claims 6 to 8,
With
Each of the plurality of RFID tags is arranged at a predetermined interval, the length direction is arranged along the length direction of the mount, and the width direction is arranged along the width direction of the mount. RFID roll.

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