JP2020008319A - Inspection device, coating system, inspection method, and coating method - Google Patents

Abstract

To provide technology with which it is possible to inspect the liquid quantity of a liquid supplied to the inside of each of a plurality of openings separated by partition walls before the liquid dries.SOLUTION: Provided is an inspection device for inspecting the liquid quantity of a liquid supplied to the inside of each of a plurality of openings separated by partition walls formed on a substrate. The inspection device comprises: a light emitting unit for diagonally irradiating, with incident light, the principal surface of the substrate on which the partition walls are formed and thereby irradiating an upwardly convex liquid surface of the liquid supplied to the inside of the openings with the incident light; a light receiving unit for receiving reflected light having been diffused and reflected on the upwardly convex liquid surface; and a detection unit for detecting the liquid quantity of the liquid supplied to the inside of the openings on the basis of the received amount of light of the light receiving unit.SELECTED DRAWING: Figure 7

Description

  The present disclosure relates to an inspection device, an application system, an inspection method, and an application method.

  The appearance inspection device described in Patent Literature 1 includes an illumination unit that irradiates line illumination light to a substrate, and a line sensor camera that captures a line illumination light reflected by the substrate to obtain a macro image. The resist film formed on the film is inspected for unevenness.

JP 2011-99875 A

  One embodiment of the present disclosure provides a technique capable of inspecting a liquid amount of a liquid supplied into each of a plurality of openings separated by a partition before drying the liquid.

An inspection device according to an aspect of the present disclosure,
An inspection device for inspecting the amount of liquid supplied to each of a plurality of openings separated by a partition formed on the substrate,
By irradiating an incident light obliquely to a main surface of the substrate on which the partition walls are formed, light emitted to irradiate the incident light to an upwardly convex liquid surface of the liquid supplied into the opening. Department and
A light receiving unit that receives the light diffusely reflected by the liquid surface that is convex upward,
A detection unit configured to detect a liquid amount of the liquid supplied to the inside of the opening based on a light reception amount of the light receiving unit.

  According to an embodiment of the present disclosure, the amount of liquid supplied to each of the plurality of openings separated by the partition can be inspected before the liquid is dried.

FIG. 1 is a cross-sectional view illustrating a main part of an organic EL panel according to one embodiment. FIG. 2 is a plan view showing an example of the arrangement of the openings of the partition wall shown in FIG. FIG. 3 is a flowchart showing a method for manufacturing an organic EL device according to one embodiment. FIG. 4 is a plan view showing a substrate processing system including an inspection device and a coating device according to one embodiment. FIG. 5 is a plan view showing a coating apparatus for a hole injection layer forming block according to one embodiment. FIG. 6 is a side view showing a coating apparatus for a hole injection layer forming block according to one embodiment. FIG. 7 is a side cross-sectional view showing an inspection apparatus for a hole injection layer forming block according to one embodiment. FIG. 8 is a plan view showing an inspection apparatus for a hole injection layer forming block according to one embodiment. FIG. 9 is a plan view showing a plurality of regions set on the substrate for performing inspection by the inspection device according to the embodiment, and a voltage ratio (applied voltage / reference voltage) of the discharge nozzle in each of the plurality of regions. is there. FIG. 10 shows the relationship between the liquid amount of the liquid and the voltage ratio when one ejection nozzle sequentially supplies a different voltage ratio (applied voltage / reference voltage) to the inside of each of the plurality of openings. FIG. 11 is a plan view showing a substrate processing system including an inspection device and a coating device according to a modification.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof may be omitted.

  FIG. 1 is a cross-sectional view illustrating a main part of an organic EL panel according to one embodiment. FIG. 2 is a plan view showing an example of the arrangement of the openings of the partition wall shown in FIG.

  The organic EL panel 2 has a substrate 10 and a plurality of organic EL elements 13 formed on the substrate 10. The plurality of organic EL elements 13 are arranged in a matrix in the row direction and the column direction. Each of the plurality of organic EL elements 13 has an anode 21, a cathode 22, and an organic layer 23 formed between the anode 21 and the cathode 22. When a voltage is applied between the anode 21 and the cathode 22, light is generated in the organic layer 23.

  As the substrate 10, for example, a transparent substrate such as a glass substrate or a resin substrate is used. When the organic EL panel 2 is of a bottom emission type, light generated in the organic layer 23 passes through the substrate 10 and is extracted outside. On the other hand, when the organic EL panel 2 is of a top emission type, light generated in the organic layer 23 is extracted to the side opposite to the substrate 10. Therefore, when the organic EL panel 2 is a top emission type, the substrate 10 may be an opaque substrate.

  The anode 21 is formed of, for example, ITO (Indium Tin Oxide). When the organic EL panel 2 is of a bottom emission type, the anode 21 has only a transparent electrode formed of ITO or the like. On the other hand, when the organic EL panel 2 is of a top emission type, the anode 21 has a reflective electrode formed of aluminum (Al) or silver (Ag) in addition to a transparent electrode formed of ITO or the like. The reflection electrode reflects light from the organic layer 23 toward the organic layer 23, and is formed between the transparent electrode and the substrate 10. The anode 21 is formed individually for each organic EL element 13.

  The cathode 22 is made of, for example, aluminum or a mixture of magnesium and silver (Mg / Al). When the organic EL panel 2 is a bottom emission type, the cathode 22 is a reflective electrode that reflects light from the organic layer 23 toward the organic layer 23. On the other hand, when the organic EL panel 2 is a top emission type, the cathode 22 is a transparent electrode that transmits light from the organic layer 23. The cathode 22 is continuously formed over the plurality of organic EL elements 13, and is continuously formed over the entire display area of the organic EL panel 2.

  The organic layer 23 includes, for example, a hole injection layer 24, a hole transport layer 25, a light emitting layer 26, an electron transport layer 27, and an electron injection layer 28 from the anode 21 side to the cathode 22 side. Have in order. When a voltage is applied between the anode 21 and the cathode 22, holes are injected from the anode 21 into the hole injection layer 24, and electrons are injected from the cathode 22 into the electron injection layer 28. The holes injected into the hole injection layer 24 are transported to the light emitting layer 26 by the hole transport layer 25. The electrons injected into the electron injection layer 28 are transported to the light emitting layer 26 by the electron transport layer 27. Then, holes and electrons are recombined in the light emitting layer 26 to excite the light emitting material of the light emitting layer 26, and the light emitting layer 26 emits light.

  The hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 are individually formed for each organic EL element 13 similarly to the anode 21. Note that it is sufficient that holes can be supplied from the anode 21 to the light emitting layer 26, and the hole injection layer 24 may not be provided. Further, it is sufficient that holes can be supplied from the anode 21 to the light emitting layer 26, and the hole injection layer 24 may not be provided.

  As the light emitting layer 26, for example, a red light emitting layer 26R that emits red light, a green light emitting layer 26G that emits green light, and a blue light emitting layer 26B that emits blue light are formed. One pixel is composed of one red light emitting layer 26R, one green light emitting layer 26G, and one blue light emitting layer 26B.

  The arrangement of the red light emitting layer 26R, the green light emitting layer 26G, and the blue light emitting layer 26B constituting one pixel is not limited to the arrangement shown in FIG. In addition, one pixel may further include a light emitting layer that emits a color other than red, green, and blue (for example, yellow).

  Like the cathode 22, the electron transport layer 27 and the electron injection layer 28 are continuously formed over the plurality of organic EL elements 13 arranged in a matrix, and are formed over the entire display area of the organic EL panel 2. It is supplied continuously. Note that it is sufficient that electrons can be supplied from the cathode 22 to the light emitting layer 26, and the electron injection layer 28 may not be provided. Further, it is sufficient that electrons can be supplied from the cathode 22 to the light emitting layer 26, and the electron transport layer 27 may not be provided.

  The organic EL panel 2 has a partition wall 40 as shown in FIG. A plurality of openings 42 are formed in the partition 40. A partition 40 separates the plurality of openings 42. As shown in FIG. 2, the plurality of openings 42 are arranged in a matrix in a row direction (X-axis direction in FIG. 2) and a column direction (Y-axis direction in FIG. 2). Each of the plurality of openings 42 is formed, for example, in a rectangular shape. In this specification, the “rectangular shape” includes a shape in which a corner is chamfered. As shown in FIG. 2, each of the plurality of openings 42 has a dimension A in the column direction longer than a dimension B in the row direction. Inside each of the plurality of openings 42, for example, the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 are formed.

  In the present embodiment, the opening 42R in which the red light emitting layer 26R is formed, the opening 42G in which the green light emitting layer 26G is formed, and the opening 42B in which the blue light emitting layer 26B is formed. The size is the same, but may be different. The opening 42R for the red light emitting layer 26R, the opening 42G for the green light emitting layer 26G, and the opening 42B for the blue light emitting layer 26B may each have a dimension A in the column direction longer than a dimension B in the row direction. .

  The arrangement of the opening 42R for the red light emitting layer 26R, the opening 42G for the green light emitting layer 26G, and the opening 42B for the blue light emitting layer 26B is not limited to the arrangement shown in FIG. The opening 42 may have a light emitting layer that emits light of a color other than red, green, and blue (for example, yellow) formed therein.

  FIG. 3 is a flowchart showing a method for manufacturing an organic EL device according to one embodiment. The method for manufacturing the organic EL element 13 includes at least a step S101 for forming the anode 21, a step S102 for forming the partition, a step S105 for forming the light emitting layer 26, and a step S108 for forming the cathode 22. Just do it.

  The method for manufacturing the organic EL element 13 includes a step S101 of forming the anode 21. The anode 21 is formed by, for example, a sputtering method or a vacuum evaporation method, and is formed in a predetermined pattern by a photolithography method and an etching method.

  The method for manufacturing the organic EL element 13 includes a step S102 of forming the partition wall 40. The partition wall 40 is formed using, for example, a photosensitive resin, and is formed in a predetermined pattern by a photolithography method. The anode 21 is exposed at the opening 42 of the partition 40.

  The method for manufacturing the organic EL element 13 includes a step S103 of forming the hole injection layer 24. The hole injection layer 24 is formed, for example, by dropping a droplet containing the material of the hole injection layer 24 into the opening 42 by an inkjet method, forming a liquid film, and drying and firing the liquid film. . The hole injection layer 24 is formed so as to be in contact with the surface of the anode 21.

  The method for manufacturing the organic EL element 13 includes a step S104 of forming the hole transport layer 25. Like the hole injection layer 24, the hole transport layer 25 forms a liquid film by dropping a droplet containing the material of the hole transport layer 25 into the opening 42 by, for example, an ink-jet method. And baking. The hole transport layer 25 is formed so as to be in contact with the hole injection layer 24.

  The method for manufacturing the organic EL element 13 includes a step S105 of forming the light emitting layer 26. Like the hole injection layer 24 and the hole transport layer 25, the light emitting layer 26 forms a liquid film by dropping a droplet containing the material of the light emitting layer 26 into the opening 42 by, for example, an inkjet method. It is formed by drying and baking.

  As the light emitting layer 26, for example, a red light emitting layer 26R, a green light emitting layer 26G, and a blue light emitting layer 26B are formed. The partition wall 40 separates the material of the red light emitting layer 26R, the material of the green light emitting layer 26G, and the material of the blue light emitting layer 26B, thereby preventing the mixing of these materials.

  The method for manufacturing the organic EL element 13 includes a step S106 of forming the electron transport layer 27. The electron transport layer 27 is formed by, for example, a vacuum deposition method, and is formed over the entire display area of the organic EL panel 2. The electron transport layer 27 is formed so as to contact not only the surface of the light emitting layer 26 but also the surface of the partition wall 40.

  The method for manufacturing the organic EL element 13 includes a step S107 of forming the electron injection layer 28. The electron injection layer 28 is formed by, for example, a vacuum deposition method, similarly to the electron transport layer 27, and is formed over the entire display area of the organic EL panel 2. The electron injection layer 28 is formed so as to be in contact with the surface of the electron transport layer 27.

  The method for manufacturing the organic EL element 13 includes a step S108 of forming the cathode 22. The cathode 22 is formed, for example, by a vacuum deposition method, similarly to the electron transport layer 27 and the electron injection layer 28, and is formed over the entire display area of the organic EL panel 2. The cathode 22 is formed so as to be in contact with the surface of the electron injection layer 28. Thus, the organic EL element 13 is manufactured.

  On the cathode 22, a sealing layer 50 is formed. The sealing layer 50 suppresses the exposure of the organic layer 23 to moisture and air, and suppresses the deterioration of the organic layer 23. When the organic EL panel 2 is of a top emission type, the sealing layer 50 transmits light generated in the light emitting layer 26. The sealing layer 50 is formed by, for example, a CVD method, and is formed over the entire display area of the organic EL panel 2. Thus, the organic EL panel 2 is manufactured.

  FIG. 4 is a plan view showing a substrate processing system including an inspection device and a coating device according to one embodiment. In FIG. 4, the spot patterns indicate the positions of the inspection devices 201 to 203. The substrate processing system 100 performs the processes corresponding to the steps S103 to S105 in FIG. 3 to form the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26 on the anode 21. The substrate processing system 100 includes a loading station 110, a processing station 120, a loading station 130, and a control device 140.

  The loading station 110 loads a cassette C accommodating a plurality of substrates 10 from the outside, and sequentially takes out the plurality of substrates 10 from the cassette C. On each substrate 10, an anode 21, a partition 40, and the like are formed.

  The loading station 110 includes a cassette mounting table 111 on which the cassette C is mounted, a transport path 112 provided between the cassette mounting table 111 and the processing station 120, and a substrate transport body 113 provided in the transport path 112. The substrate transport body 113 transports the substrate 10 between the cassette C mounted on the cassette mounting table 111 and the processing station 120.

  The processing station 120 forms a hole injection layer 24, a hole transport layer 25, and a light emitting layer 26 on the anode 21. The processing station 120 includes a hole injection layer forming block 121 for forming the hole injection layer 24, a hole transport layer forming block 122 for forming the hole transport layer 25, and a light emitting layer forming block 123 for forming the light emitting layer 26. Is provided.

  The hole injection layer forming block 121 forms the hole injection layer 24 by applying the material liquid of the hole injection layer 24 on the anode 21 to form a liquid film, and drying and firing the liquid film. I do. The material liquid of the hole injection layer 24 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by baking to form a polymer.

  The hole injection layer forming block 121 includes a coating device 121a, an inspection device 201, a buffer device 121b, a reduced-pressure drying device 121c, a heat treatment device 121d, and a temperature control device 121e. The coating device 121 a discharges a droplet of the material liquid of the hole injection layer 24 toward the opening 42 of the partition 40. The inspection device 201 inspects the amount of the material liquid of the hole injection layer 24 supplied to the inside of the opening 42. The inspection device 201 is disposed inside the coating device 121a as shown in FIG. 4, but may be disposed outside the coating device 121a as shown in FIG. 11, and in the latter case, it also serves as the buffer device 121b. Is also good. The buffer device 121b temporarily stores the substrate 10 waiting for processing. The reduced-pressure drying device 121c dries the liquid film formed by the coating device 121a under reduced pressure to remove the solvent contained in the liquid film. The heat treatment device 121d heat-treats the liquid film dried by the reduced-pressure drying device 121c. The temperature adjusting device 121e adjusts the temperature of the substrate 10 that has been heat-treated by the heat treatment device 121d to a predetermined temperature, for example, normal temperature.

  The inside of the coating device 121a, the inspection device 201, the buffer device 121b, the heat treatment device 121d, and the temperature adjustment device 121e is maintained in the atmosphere. The reduced-pressure drying device 121c switches the internal atmosphere between an air atmosphere and a reduced-pressure atmosphere.

  In the hole injection layer formation block 121, the arrangement, number, and internal atmosphere of the coating device 121a, the inspection device 201, the buffer device 121b, the reduced-pressure drying device 121c, the heat treatment device 121d, and the temperature control device 121e are arbitrarily selected. It is possible.

  Further, the hole injection layer forming block 121 includes substrate transfer devices CR1 to CR3 and delivery devices TR1 to TR3. Each of the substrate transfer devices CR1 to CR3 transfers the substrate 10 to each adjacent device. For example, the substrate transport device CR1 transports the substrate 10 to the adjacent coating device 121a and buffer device 121b. The substrate transfer device CR2 transfers the substrate 10 to the adjacent reduced-pressure drying device 121c. The substrate transfer device CR3 transfers the substrate 10 to the adjacent heat treatment device 121d and temperature adjustment device 121e. The transfer devices TR1 to TR3 are provided in order between the loading station 110 and the substrate transfer device CR1, between the substrate transfer device CR1 and the substrate transfer device CR2, and between the substrate transfer device CR2 and the substrate transfer device CR3, respectively. The substrate 10 is relayed between them. The insides of the substrate transfer devices CR1 to CR3 and the delivery devices TR1 to TR3 are maintained in the atmosphere.

  Between the substrate transport device CR3 of the hole injection layer forming block 121 and the substrate transport device CR4 of the hole transport layer forming block 122, a transfer device TR4 that relays the substrate 10 therebetween is provided. The delivery device TR4 is maintained in an air atmosphere inside.

  The hole transport layer forming block 122 forms a liquid film by coating the material liquid of the hole transport layer 25 on the hole injection layer 24, and performs drying and baking of the liquid film. 25 are formed. The material liquid of the hole transport layer 25 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by baking to form a polymer.

  The hole transport layer forming block 122 includes a coating device 122a, an inspection device 202, a buffer device 122b, a reduced-pressure drying device 122c, a heat treatment device 122d, and a temperature control device 122e. The coating device 122 a discharges a droplet of the material liquid of the hole transport layer 25 toward the opening 42 of the partition 40. The inspection device 202 inspects the amount of the material liquid of the hole transport layer 25 supplied into the opening 42. The inspection device 202 is arranged inside the coating device 122a as shown in FIG. 4, but may be arranged outside the coating device 122a as shown in FIG. 11, and in the latter case, it also serves as the buffer device 122b. Is also good. The buffer device 122b temporarily stores the substrate 10 waiting for processing. The vacuum drying device 122c vacuum-drys the liquid film formed by the coating device 122a to remove the solvent contained in the liquid film. The heat treatment device 122d heat-treats the liquid film dried by the reduced-pressure drying device 122c. The temperature adjustment device 122e adjusts the temperature of the substrate 10 that has been heat-treated by the heat treatment device 122d to a predetermined temperature, for example, normal temperature.

  The inside of the coating device 122a, the inspection device 202, and the buffer device 122b is maintained in the atmosphere. On the other hand, in the heat treatment device 122d and the temperature adjustment device 122e, the inside is maintained in a low oxygen and low dew point atmosphere in order to suppress the deterioration of the organic material of the hole transport layer 25. The reduced-pressure drying device 122c switches the internal atmosphere between a low-oxygen and low-dew-point atmosphere and a reduced-pressure atmosphere.

  Here, the low-oxygen atmosphere refers to an atmosphere having an oxygen concentration lower than that of the air, for example, an atmosphere having an oxygen concentration of 10 ppm or less. Further, the atmosphere having a low dew point means an atmosphere having a dew point temperature lower than that of the atmosphere, for example, an atmosphere having a dew point temperature of -10 ° C or lower. The atmosphere with low oxygen and low dew point is formed with an inert gas such as nitrogen gas.

  In the hole transport layer forming block 122, the arrangement, the number, and the internal atmosphere of the coating device 122a, the inspection device 202, the buffer device 122b, the reduced-pressure drying device 122c, the heat treatment device 122d, and the temperature control device 122e are arbitrarily selected. It is possible.

  The hole transport layer forming block 122 includes substrate transfer devices CR4 to CR6 and delivery devices TR5 to TR6. The substrate transfer devices CR4 to CR6 transfer the substrate 10 to each of the adjacent devices. The transfer devices TR5 to TR6 are respectively provided between the substrate transport device CR4 and the substrate transport device CR5 and between the substrate transport device CR5 and the substrate transport device CR6, and relay the substrate 10 therebetween.

  The inside of the substrate transfer device CR4 is maintained in an air atmosphere. On the other hand, the inside of the substrate transfer devices CR5 to CR6 is maintained in an atmosphere with low oxygen and low dew point. This is because the inside of the reduced-pressure drying device 122c adjacent to the substrate transfer device CR5 can be switched between a low-oxygen and low-dew-point atmosphere and a reduced-pressure atmosphere. Further, the inside of the heat treatment device 122d and the temperature adjustment device 122e provided adjacent to the substrate transfer device CR6 is maintained in an atmosphere having low oxygen and low dew point.

  The delivery device TR5 is configured as a load lock device that switches the internal atmosphere between an air atmosphere and an atmosphere with low oxygen and low dew point. This is because the reduced-pressure drying device 122c is provided adjacent to the downstream side of the delivery device TR6. On the other hand, the inside of the delivery device TR6 is maintained in an atmosphere with low oxygen and low dew point.

  Between the substrate transport device CR6 of the hole transport layer forming block 122 and the substrate transport device CR7 of the light emitting layer forming block 123, a transfer device TR7 for relaying the substrate 10 therebetween is provided. The inside of the substrate transfer device CR6 is maintained in an atmosphere with low oxygen and a low dew point, and the inside of the substrate transfer device CR7 is maintained in an air atmosphere. Therefore, the delivery device TR7 is configured as a load lock device that switches the internal atmosphere between an atmosphere with low oxygen and a low dew point and an atmosphere.

  The light emitting layer forming block 123 forms a liquid film by applying a material liquid of the light emitting layer 26 on the hole transport layer 25, and forms the light emitting layer 26 by drying and firing the liquid film. The material liquid of the light emitting layer 26 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by baking to form a polymer.

  The light emitting layer forming block 123 includes a coating device 123a, an inspection device 203, a buffer device 123b, a reduced-pressure drying device 123c, a heat treatment device 123d, and a temperature control device 123e. The coating device 123 a discharges a droplet of the material liquid of the light emitting layer 26 toward the opening 42 of the partition 40. The inspection device 203 inspects the amount of the material liquid of the light emitting layer 26 supplied into the opening 42. The inspection device 203 is arranged inside the coating device 123a as shown in FIG. 4, but may be arranged outside the coating device 123a as shown in FIG. 11, and in the latter case, it also serves as the buffer device 123b. Is also good. The buffer device 123b temporarily stores the substrate 10 waiting for processing. The vacuum drying device 123c vacuum-drys the liquid film formed by the coating device 123a to remove the solvent contained in the liquid film. The heat treatment device 123d heat-treats the liquid film dried by the reduced-pressure drying device 123c. The temperature adjusting device 123e adjusts the temperature of the substrate 10 that has been heat-treated by the heat treatment device 123d to a predetermined temperature, for example, normal temperature.

  The interiors of the coating device 123a, the inspection device 203, and the buffer device 123b are maintained in the atmosphere. On the other hand, the heat treatment device 123d and the temperature adjustment device 123e are maintained in an atmosphere having low oxygen and a low dew point in order to suppress deterioration of the organic material of the light emitting layer 26. The reduced-pressure drying device 123c switches the internal atmosphere between a low-oxygen and low-dew-point atmosphere and a reduced-pressure atmosphere.

  In the light emitting layer forming block 123, the arrangement, number, and internal atmosphere of the coating device 123a, the inspection device 203, the buffer device 123b, the reduced-pressure drying device 123c, the heat treatment device 123d, and the temperature control device 123e can be arbitrarily selected. is there.

  The light emitting layer forming block 123 includes substrate transfer devices CR7 to CR9 and delivery devices TR8 to TR9. The substrate transfer devices CR7 to CR9 each transfer the substrate 10 to each adjacent device. The transfer devices TR8 to TR9 are respectively provided between the substrate transfer device CR7 and the substrate transfer device CR8 and between the substrate transfer device CR8 and the substrate transfer device CR9, and relay the substrate 10 therebetween.

  The inside of the substrate transfer device CR7 is maintained in an air atmosphere. On the other hand, the inside of the substrate transfer devices CR8 to CR9 is maintained in an atmosphere of low oxygen and low dew point. This is because the inside of the reduced-pressure drying device 123c adjacent to the substrate transfer device CR8 can be switched between a low-oxygen and low-dew-point atmosphere and a reduced-pressure atmosphere. Further, the inside of the heat treatment device 123d and the temperature adjustment device 123e provided adjacent to the substrate transfer device CR9 is maintained in an atmosphere having low oxygen and low dew point.

  The delivery device TR8 is configured as a load lock device that switches the internal atmosphere between an atmospheric atmosphere and an atmosphere with low oxygen and low dew point. This is because the reduced-pressure drying device 123c is provided downstream of the delivery device TR8. The inside of the delivery device TR9 is maintained in an atmosphere of low oxygen and low dew point.

  Between the substrate transfer device CR9 of the light emitting layer forming block 123 and the unloading station 130, a delivery device TR10 that relays the substrate 10 between them is provided. The inside of the substrate transfer device CR9 is maintained in an atmosphere of low oxygen and a low dew point, and the inside of the unloading station 130 is maintained in the atmosphere. Therefore, the delivery device TR7 is configured as a load lock device that switches the internal atmosphere between an atmosphere with low oxygen and a low dew point and an atmosphere.

  The unloading station 130 sequentially stores the plurality of substrates 10 in the cassette C, and unloads the cassette C to the outside. The unloading station 130 includes a cassette mounting table 131 on which the cassette C is mounted, a transport path 132 provided between the cassette mounting table 131 and the processing station 120, and a substrate transport body 133 provided in the transport path 132. The substrate transport 133 transports the substrate 10 between the processing station 120 and the cassette C mounted on the cassette mounting table 131.

  The control device 140 is composed of, for example, a computer, and has a CPU (Central Processing Unit) 141, a storage medium 142 such as a memory, an input interface, and an output interface. The control device 140 performs various controls by causing the CPU 141 to execute a program stored in the storage medium 142. The control device 140 receives a signal from the outside via the input interface, and transmits the signal to the outside via the output interface.

  The program of the control device 140 is stored in the information storage medium and installed from the information storage medium. Examples of the information storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical desk (MO), and a memory card. Note that the program may be downloaded from a server via the Internet and installed.

  Next, a substrate processing method using the substrate processing system 100 having the above configuration will be described. When the cassette C accommodating the plurality of substrates 10 is placed on the cassette mounting table 111, the substrate transporter 113 sequentially takes out the substrates 10 from the cassette C on the cassette mounting table 111, and performs the hole injection layer forming block 121. Transport to

  The hole injection layer forming block 121 forms the hole injection layer 24 by applying the material liquid of the hole injection layer 24 on the anode 21 to form a liquid film, and drying and firing the liquid film. I do. The inspection device 201 inspects the amount of the material liquid of the hole injection layer 24 supplied to the inside of the opening 42 of the partition 40. This inspection is performed before the material liquid of the hole injection layer 24 is dried. The substrate 10 on which the hole injection layer 24 is formed is transferred from the hole injection layer formation block 121 to the hole transport layer formation block 122 by the transfer device TR4.

  The hole transport layer forming block 122 forms a liquid film by coating the material liquid of the hole transport layer 25 on the hole injection layer 24, and performs drying and baking of the liquid film. 25 are formed. The inspection device 202 inspects the amount of the material liquid of the hole transport layer 25 supplied to the inside of the opening 42 of the partition 40. This inspection is performed before the material liquid of the hole transport layer 25 is dried. The substrate 10 on which the hole transport layer 25 is formed is transferred from the hole transport layer forming block 122 to the light emitting layer forming block 123 by the transfer device TR7.

  The light emitting layer forming block 123 forms a liquid film by applying a material liquid of the light emitting layer 26 on the hole transport layer 25, and forms the light emitting layer 26 by drying and firing the liquid film. The inspection device 203 inspects the amount of the material liquid of the light emitting layer 26 supplied into the opening 42 of the partition 40. This inspection is performed before the material liquid of the light emitting layer 26 is dried. The substrate 10 on which the light emitting layer 26 is formed is transferred from the light emitting layer forming block 123 to the unloading station 130 by the transfer device TR10.

  The substrate transporter 133 of the unloading station 130 stores the substrate 10 received from the delivery device TR10 in a predetermined cassette C on the cassette mounting table 131. Thus, a series of processing of the substrate 10 in the substrate processing system 100 ends.

  The substrate 10 is unloaded from the unloading station 130 while being stored in the cassette C. An electron transport layer 27, an electron injection layer 28, a cathode 22, and the like are formed on the substrate 10 carried out.

  Next, the coating device 121a of the hole injection layer forming block 121 will be described with reference to FIGS. FIG. 5 is a plan view showing a coating apparatus for a hole injection layer forming block according to one embodiment. FIG. 6 is a side view showing a coating apparatus for a hole injection layer forming block according to one embodiment. Since the coating device 122a of the hole transport layer forming block 122 and the coating device 123a of the light emitting layer forming block 123 are configured in the same manner as the coating device 121a of the hole injection layer forming block 121, illustration and description are omitted. I do.

  The coating device 121a moves the landing position of the droplet of the functional liquid (for example, the material liquid of the hole injection layer 24) on the substrate 10 in the X-axis direction and the Y-axis direction, and draws a drawing pattern of the functional liquid on the substrate 10. . The coating device 121a includes, for example, a substrate holding unit 150 that holds the substrate 10, a droplet discharging unit 160 that discharges a droplet of the functional liquid onto the substrate 10 held by the substrate holding unit 150, an X-axis direction, and a Y-direction. A moving unit 170 that relatively moves the substrate holding unit 150 and the droplet discharging unit 160 in the axial direction is provided.

  The substrate holding unit 150 holds the substrate 10 horizontally with the opening 42 of the partition 40 formed on the substrate 10 facing upward. For example, a vacuum chuck is used as the substrate holding unit 150, but an electrostatic chuck or the like may be used.

  The droplet discharge unit 160 discharges a droplet of the functional liquid into the opening 42 of the partition 40 from above the substrate 10 held by the substrate holding unit 150. A plurality (for example, ten in FIG. 5) of the droplet discharge units 160 are arranged in the Y-axis direction. The plurality of droplet discharge units 160 have a plurality of discharge heads 161 arranged on the lower surface thereof at intervals in the X-axis direction.

  Each of the plurality of ejection heads 161 has, on a lower surface, a plurality of ejection nozzles 162 arranged in a line at intervals in the Y-axis direction. In FIG. 6, one ejection nozzle row composed of a plurality of ejection nozzles 162 arranged in a line at intervals in the Y-axis direction is provided for each ejection head 161, but a plurality (for example, two) may be provided. .

  Each of the plurality of ejection heads 161 simultaneously supplies a droplet of the functional liquid into the plurality of openings 42 arranged in a line at intervals in the Y-axis direction. The number of ejection nozzles 162 provided in one ejection head 161 is greater than the number of openings 42 to which one ejection head 161 simultaneously supplies droplets. A plurality of ejection nozzles 162 may supply droplets to one opening 42 at the same time.

  Each of the plurality of ejection heads 161 has a piezo element for each ejection nozzle 162. When a voltage is applied to the piezo element, the piezo element is deformed and a droplet is discharged from the discharge nozzle 162. A heater or the like may be used instead of the piezo element. When a voltage is applied to the heater, bubbles are generated, and droplets are discharged from the discharge nozzle 162 by the pressure of the generated bubbles. The discharge amount of the functional liquid discharged by the discharge nozzle 162 can be individually controlled for each discharge nozzle 162.

  In the present embodiment, the plurality of ejection heads 161 eject functional liquids of the same material, but may eject functional liquids of different materials. For example, the coating device 123a of the light emitting layer forming block 123 includes a discharge head that discharges a material liquid of the red light emitting layer 26R, a discharge head that discharges a material liquid of the green light emitting layer, and a discharge head that discharges a material liquid of the blue light emitting layer. And a head. However, the plurality of ejection nozzles 162 provided on the same ejection head 161 eject droplets of the same type of functional liquid.

  The moving unit 170 relatively moves the substrate holding unit 150 and the droplet discharging unit 160 in the X-axis direction and the Y-axis direction. For example, the moving unit 170 includes an X-axis direction moving unit 172 that moves the substrate holding unit 150 with respect to the base 171 in the X-axis direction. The X-axis direction moving unit 172 includes, for example, a pair of X-axis guides 173 laid on the base 171 and a pair of X-axis linear motors that move the substrate holding unit 150 along the pair of X-axis guides 173. The moving section 170 has a Y-axis direction moving section 174 (see FIG. 6) for moving the substrate holding section 150 in the Y-axis direction with respect to the base 171.

  While the moving unit 170 moves the substrate 10 in the X-axis direction, the droplet discharging unit 160 drops droplets. Thereafter, the moving unit 170 moves the substrate 10 in the Y-axis direction, and the moving unit 170 moves the substrate 10 in the X-axis direction, and the droplet discharge unit 160 drops the droplets alternately. Then, the coating apparatus 121a draws a drawing pattern of the functional liquid on the substrate 10.

  The moving unit 170 having the above configuration moves the substrate holding unit 150 in order to draw a predetermined pattern on the substrate 10. The moving unit 170 may move the droplet discharging unit 160, or may move the substrate holding unit 150 and the liquid. Both of the droplet discharge units 160 may be moved.

  An inspection device 201 is arranged inside the coating device 121a. The inspection device 201 inspects the amount of the liquid 45 supplied into each of the plurality of openings 42 separated by the partition 40 (see FIG. 7). The liquid 45 is, for example, a material liquid for the hole injection layer 24. The hole injection layer 24 is formed by drying and baking the liquid 45 supplied into the opening 42. Since the liquid amount LV of the liquid 45 supplied into the opening 42 is proportional to the thickness of the hole injection layer 24, the thickness of the hole injection layer 24 is inspected by inspecting the liquid amount LV of the liquid 45. it can.

  The inspection device 201 inspects a variation in the liquid amount LV of the liquid 45 supplied into each of the plurality of openings 42 separated by the partition wall 40. The smaller the variation in the liquid amount LV of the liquid 45, the smaller the variation in the thickness of the hole injection layer 24, and the smaller the variation in the light emission amount of a plurality of pixels when the organic EL panel 2 is turned on.

  The conventional inspection device inspects the variation in the light emission amount of a plurality of pixels when the organic EL panel 2 is actually turned on. For the inspection, the manufacturing process of the organic EL panel 2 needs to be advanced to the end. Therefore, the waiting time until the inspection result of the inspection apparatus is reflected on the adjustment of the ejection amount of the ejection nozzle 162 is long, and the cost is high.

  The inspection device 201 of the present embodiment inspects the liquid amount LV of the liquid 45 before drying and heat-treating the liquid 45 supplied into the opening 42. The inspection is performed during the manufacturing process of the organic EL panel 2. Therefore, the waiting time until the inspection result of the inspection device 201 is reflected on the adjustment of the ejection amount of the ejection nozzle 162 is short, and the cost is low.

  Next, the inspection apparatus 201 of the hole injection layer forming block 121 will be described with reference to FIGS. FIG. 7 is a side cross-sectional view showing an inspection apparatus for a hole injection layer forming block according to one embodiment. FIG. 8 is a plan view showing an inspection apparatus for a hole injection layer forming block according to one embodiment. Since the inspection device 202 for the hole transport layer formation block 122 and the inspection device 203 for the light emitting layer formation block 123 are configured in the same manner as the inspection device 201 for the hole injection layer formation block 121, illustration and description are omitted. I do.

  The inspection device 201 includes a light emitting unit 210, a light receiving unit 220, and a detection unit 230 in order to implement the inspection of the liquid amount LV of the liquid 45.

  The light emitting unit 210 irradiates the main surface 11 of the substrate 10 on which the partition wall 40 is formed with the incident light L1 obliquely, so that the liquid surface 46 of the liquid 45 supplied to the inside of the opening 42 has an upward convexity. Is irradiated with incident light L1. The optical axis 210A of the light emitting unit 210 is oblique to the main surface 11 of the substrate 10.

  The light receiving section 220 receives the reflected light L2 diffusely reflected on the liquid surface 46 that is convex upward. The reflected light L2 is not specularly reflected but diffusely reflected. That is, the incident angle θ1 of the incident light L1 emitted by the light emitting unit 210 is different from the reflection angle θ2 of the reflected light L2 received by the light receiving unit 220. The incident angle θ1 of the incident light L1 is an angle between the optical axis 210A of the light emitting unit 210 and the normal NV of the main surface 11 of the substrate 10. The reflection angle θ2 of the reflected light L2 is an angle between the optical axis 220A of the light receiving unit 220 and the normal NV of the main surface 11 of the substrate 10.

  As the liquid amount LV of the liquid 45 is larger, the liquid surface 46 bulges upward and the liquid surface 46 is not a mirror surface, so that the incident light L1 is reflected at various angles with respect to the main surface 11 of the substrate 10. . Therefore, the larger the liquid amount LV of the liquid 45, the larger the amount of reflected light L2 received by the light receiving unit 220. Therefore, the liquid amount LV of the liquid 45 can be obtained from the amount of the reflected light L2 received.

  The optical axis 220A of the light receiving section 220 may be perpendicular to the main surface 11 of the substrate 10, and the reflection angle θ2 of the reflected light L2 received by the light receiving section 220 may be 0 °. As shown, the optical axis 220A of the light receiving section 220 is inclined with respect to the main surface 11 of the substrate 10. The light receiving unit 220 receives the reflected light L <b> 2 that proceeds obliquely with respect to the main surface 11 of the substrate 10.

  When the optical axis 220 </ b> A of the light receiving unit 220 is perpendicular to the main surface 11 of the substrate 10, the light diffusely reflected by the wiring pattern (not shown) formed on the main surface 11 of the substrate 10 is reflected on the surface of the partition 40. It easily passes through discontinuous surfaces having a refractive index such as the liquid surface 41 and the liquid surface 46 of the liquid 45. Therefore, the reflected light diffusely reflected by the wiring pattern easily enters the light receiving unit 220.

  The optical axis 220A of the light receiving unit 220 is inclined with respect to the main surface 11 of the substrate 10 in order to suppress the reflected light from the wiring pattern toward the light receiving unit 220 from passing through the discontinuous surface of the refractive index. The reflected light L2 that advances obliquely to the main surface 11 of the substrate 10 is received. The influence of the wiring pattern on the amount of light received by the light receiving section 220 can be reduced, and the detection accuracy of the liquid amount LV of the liquid 45 can be improved.

  The detection unit 230 detects the liquid amount LV of the liquid 45 based on the amount of the reflected light L2 received by the light receiving unit 220. The detection unit 230 is configured by, for example, a computer, similarly to the control device 140. The relationship between the received light amount of the reflected light L2 and the liquid amount LV of the liquid 45 is obtained in advance by experiments or the like, and is stored in the storage medium of the detection unit 230 in advance.

  As shown in FIG. 8, the plurality of openings 42 are arranged in a matrix in a row direction (X-axis direction in FIG. 8) and a column direction (Y-axis direction in FIG. 8). Each of the plurality of openings 42 has a dimension A in the column direction longer than a dimension B in the row direction. Therefore, the liquid surface 46 of the liquid 45 supplied into the opening 42 also has a dimension in the column direction longer than that in the row direction.

  The light emitting unit 210 is a linear light source that irradiates light to the main surface 11 of the substrate 10 obliquely. The linear light source has, for example, a plurality of light emitting elements arranged in a line. The light emitting element is, for example, an LED (Light Emitting Diode). The LED may emit ultraviolet light, but in the present embodiment, emits visible light in order to suppress deterioration of the organic EL element 13 due to irradiation of ultraviolet light.

  The light emitting units 210 may be arranged in parallel in the row direction (X-axis direction in FIG. 8), but in the present embodiment, as shown in FIG. 8, they are arranged in parallel in the column direction (Y-axis direction in FIG. 8). You. When the light-emitting units 210 are arranged in parallel in the column direction, the liquid surface 46 that is long in the column direction can be illuminated uniformly and elongated in the column direction. The area of the portion 47 (see FIG. 8) of the liquid surface 46 that diffuses and reflects the incident light L1 toward the light receiving section 220 can be enlarged, the amount of light received by the light receiving section 220 can be improved, and the sensitivity of the light receiving section 220 can be improved.

  The light receiving section 220 has a plurality of light receiving elements 221 that receive the reflected light L2 diffusely reflected by the liquid surface 46 that is convex upward. The light receiving element 221 is an imaging element such as a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor.

  The plurality of light receiving elements 221 are arranged in parallel in the column direction (Y-axis direction in FIG. 8), and the linear light source, which is the light emitting unit 210, is parallel in the column direction. The linear light source simultaneously illuminates the plurality of liquid surfaces 46 arranged in a line in the column direction, and the light receiving unit 220 can simultaneously receive the reflected light L2 from each of the plurality of liquid surfaces 46 simultaneously illuminated by the linear light source. Since a wide range can be inspected at the same time, the inspection speed can be improved.

  The plurality of light receiving elements 221 may be arranged in parallel in the column direction, and may be arranged in a matrix in the row direction and the column direction. In the present embodiment, the light receiving elements 221 are arranged in a line only in the column direction. That is, the light receiving unit 220 may be an area sensor, but is a line sensor in the present embodiment. The line sensor can capture a higher resolution image than the area sensor.

  The light receiving unit 220 is, for example, a line scan camera, and captures an image of the substrate 10 moving in the X-axis direction below the light receiving unit 220. The imaging range of the line scan camera is a straight line parallel to the Y-axis direction, and is, for example, the entire substrate 10 in the Y-axis direction.

  While the moving unit 170 of the coating apparatus 121a moves the substrate 10 in the X-axis direction, the line scan camera takes an image of the entire substrate 10 in the Y-axis direction. Thereby, the inspection apparatus 201 can inspect the liquid amount LV of the liquid 45 in the entire X-axis direction and the Y-axis direction of the substrate 10.

  In this embodiment, the imaging range of the line scan camera is the whole of the substrate 10 in the Y-axis direction, but may be only a part of the substrate 10 in the Y-axis direction. In this case, if the line scan camera is moved in the Y-axis direction, an image of the entire substrate 10 in the Y-axis direction can be taken. The number of line scan cameras may be one or more.

  In this embodiment, the line scan camera has a plurality of light receiving elements 221 arranged in a line in a column direction (Y axis direction), but has a plurality of light receiving elements arranged in a line in a row direction (X axis direction). Is also good. In this case, if the line scan camera is moved in the X-axis direction, an image of the entire substrate 10 in the Y-axis direction can be taken.

  When the inspection device 201 is disposed inside the coating device 121a, the coating device 121a includes the substrate holding unit 150 and the moving unit 170. However, as illustrated in FIG. 11, the inspection device 201 is disposed outside the coating device 121a. In this case, the inspection apparatus 201 includes a substrate holding unit and a moving unit. The substrate holding unit of the inspection device 201 holds the substrate 10 horizontally with the opening 42 of the partition 40 formed on the substrate 10 facing upward, similarly to the substrate holding unit 150 of the coating device 121a. The moving unit of the inspection apparatus 201 relatively moves the light emitting unit 210 and the light receiving unit 220 and the substrate holding unit, similarly to the moving unit 170 of the coating apparatus 121a, and moves the substrate 10 held by the substrate holding unit. Move the inspection range.

  FIG. 9 is a plan view showing a plurality of regions set on the substrate for performing inspection by the inspection device according to the embodiment, and a voltage ratio (applied voltage / reference voltage) of the discharge nozzle in each of the plurality of regions. is there. The voltage ratio VR is a voltage ratio (VR = V / V0) between the applied voltage V and the reference voltage V0. The reference voltage V0 is a value set individually for each ejection nozzle 162, and is a value provisionally determined so as to eject a predetermined amount of liquid droplets. The reference voltage V0 is set individually for each ejection nozzle 162 because, for example, the diameter of the ejection port is slightly different for each ejection nozzle 162. The reference voltage V0 is set based on past inspection data of the inspection device 201 and the like. The applied voltage V is a voltage applied to the discharge nozzle 162. As described above, the discharge nozzle 162 discharges a droplet having a liquid amount corresponding to the applied voltage V.

  The control device 140 changes the voltage ratio VR when one discharge nozzle 162 sequentially supplies the liquid 45 into each of the plurality of openings 42. For example, if the voltage ratio VR1 when supplying the liquid 45 to the opening 42 of the first region A1 and the voltage ratio VR2 when supplying the liquid 45 to the opening 42 of the second region A2 are different, the control device 140 Let Further, the control device 140 makes the voltage ratio VR3 when supplying the liquid 45 to the opening 42 of the third region A3 different from the above-described voltage ratios VR1 and VR2. Further, the control device 140 makes the voltage ratio VR4 when supplying the liquid 45 to the opening 42 of the fourth region A4 different from the above-described voltage ratios VR1 to VR3. The number of regions in which different voltage ratios VR are set is not particularly limited as long as it is plural.

  The inspection device 201 inspects the liquid amount LV of the liquid 45 that one ejection nozzle 162 sequentially supplies into each of the plurality of openings 42 at a different voltage ratio VR. The liquid amount LV of the liquid 45 is individually inspected for each opening 42. The discharge of the discharge nozzle 162 and the inspection of the inspection device 201 may be performed alternately, or the inspection of the inspection device 201 may be performed collectively after the discharge of the discharge nozzle 162 is performed collectively. . It is sufficient that the liquid amount LV of the liquid 45 discharged at a different voltage ratio VR into each of the plurality of openings 42 is inspected.

  The substrate 10 used for the inspection of the inspection device 201 and the substrate 10 used for the production of the organic EL panel 2 have the same dimensions and the same shape. The partition wall 40 used for inspection by the inspection device 201 and the partition wall 40 used for production of the organic EL panel 2 have the same dimensions and the same shape. Since the same size and the same shape are used for the inspection and the product production, a desired product can be manufactured when the inspection result is fed back to the production condition.

  Note that the substrate 10 used for inspection by the inspection device 201 and the substrate 10 used for production of the organic EL panel 2 only need to have at least part of the same size and the same shape. For example, the substrate 10 used for the inspection of the inspection device 201 may be obtained by cutting a part of the substrate 10 used for the production of the organic EL panel 2.

  Similarly, the partition 40 used for the inspection of the inspection device 201 and the partition 40 used for the production of the organic EL panel 2 only need to have at least a part having the same size and the same shape. For example, the partition wall 40 used for the inspection of the inspection device 201 may be obtained by cutting a part of the partition wall 40 used for the production of the organic EL panel 2.

  The substrate 10 that has been inspected by the inspection device 201 is discarded. In the first region A1, the second region A2, the third region A3, and the fourth region A4, since the liquid amount LV of the liquid 45 supplied to the inside of the opening 42 is different, the hole injection layer 24 This is because the thickness is different and the brightness of the pixel when lit is different.

  FIG. 10 shows the relationship between the liquid amount of the liquid and the voltage ratio when one ejection nozzle sequentially supplies a different voltage ratio (applied voltage / reference voltage) to the inside of each of the plurality of openings. In FIG. 10, the plurality of openings 42 to which one discharge nozzle 162 supplies the liquid 45 may have the same size and the same shape. In FIG. 10, black circles indicate measured values, and a straight line L is a straight line obtained by approximating a plurality of measured values using the least squares method.

  The control device 140 controls the discharge amount of each of the plurality of discharge nozzles 162 based on the test result of the test device 201 (more specifically, the detection result of the detection unit 230).

  First, the control device 140 determines the applied voltage V to the ejection nozzle 162 based on, for example, the data shown in FIG. 10 so that the liquid amount LV of the liquid 45 supplied into the opening 42 becomes the target liquid amount. . The applied voltage V may be set individually for each ejection nozzle 162. This is because, for example, the diameter of the discharge port is slightly different for each discharge nozzle 162.

  Next, the control device 140 applies a predetermined applied voltage V to each of the plurality of discharge nozzles 162 and supplies the liquid 45 into each of the plurality of openings 42 when the organic EL panel 2 is produced. Variations in the liquid amount LV of the liquid 45 supplied into the opening 42 can be reduced, and variations in the thickness of the hole injection layer 24 can be reduced. Therefore, it is possible to reduce the variation in the light emission amount of the plurality of pixels when the organic EL panel 2 is turned on.

  As described above, the embodiments of the inspection apparatus, the application system, the inspection method, and the application method according to the present disclosure have been described, but the present disclosure is not limited to the above embodiments and the like. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. Of course, these also belong to the technical scope of the present disclosure.

  For example, the inspection result of the inspection device 201 (more specifically, the detection result of the detection unit 230) may be used for controlling devices other than the coating device 121a. For example, the control device 140 monitors the liquid amount LV of the liquid 45 supplied into the opening 42 during the production of the organic EL panel 2 and controls the notification device that issues an alarm based on the monitoring result. Good. The alarm is issued in the form of, for example, an image, a sound, or a buzzer. The control device 140 determines that an abnormality has occurred in the discharge nozzle 162 when the liquid amount LV of the liquid 45 supplied into the opening 42 exceeds the first threshold value or falls below the second threshold value. An alert may be issued by an alert device. Here, the second threshold is a value smaller than the first threshold.

Reference Signs List 10 substrate 13 organic EL element 21 anode 22 cathode 23 organic layer 40 partition 42 opening 45 liquid 46 liquid level 100 substrate processing system 121a, 122a, 123a coating device 140 control device 162 discharge nozzles 201, 202, 203 inspection device 210 light emitting portion 220 light receiving section 221 light receiving element 230 detecting section

Claims (7)

An inspection apparatus for inspecting a liquid amount of liquid supplied to each of a plurality of openings separated by a partition formed on a substrate,
By irradiating the main surface of the substrate on which the partition walls are formed with oblique incident light, the liquid supplied to the inside of the opening is irradiated with the incident light on an upwardly convex liquid surface. Department and
A light receiving unit that receives light reflected diffusely reflected on the liquid surface that is convex upward,
A detection unit configured to detect a liquid amount of the liquid supplied into the opening based on an amount of light received by the light receiving unit.   The inspection device according to claim 1, wherein the light receiving unit receives the reflected light that proceeds obliquely with respect to a main surface of the substrate. The plurality of openings are arranged in a matrix in a row direction and a column direction,
Each of the plurality of openings has a dimension in the column direction longer than the dimension in the row direction,
The inspection device according to claim 1, wherein the light emitting unit is a linear light source that irradiates light obliquely to the main surface of the substrate, and is parallel to the column direction. The light receiving unit has a plurality of light receiving elements that receive the reflected light diffusely reflected on the liquid surface convex upward,
The inspection device according to claim 3, wherein the plurality of light receiving elements are arranged in parallel in the column direction. An inspection device according to any one of claims 1 to 4,
A coating device having a plurality of discharge nozzles for discharging the liquid droplets inside each of the plurality of openings,
A control device that controls a discharge amount of each of the plurality of discharge nozzles based on a detection result of the detection unit. An inspection method for inspecting the amount of liquid supplied to each of a plurality of openings separated by a partition formed on a substrate,
Irradiating the incident light obliquely to the main surface of the substrate on which the partition walls are formed, thereby irradiating the incident light to an upwardly convex liquid surface of the liquid supplied into the opening. When,
A step of receiving the reflected light diffusely reflected on the liquid surface having an upward convexity by a light receiving unit,
Detecting the amount of the liquid supplied into the opening based on the amount of light received by the light receiving unit.   A coating method, comprising: controlling a discharge amount of a discharge nozzle that discharges the liquid droplet into the opening based on a test result of the test method according to claim 6.

Images