JP2020004842A - Light-emitting device and method of manufacturing the same - Google Patents

Abstract

To provide a light-emitting device for joining a sealing member to a package without using an adhesive and a method of manufacturing the same.SOLUTION: The method of manufacturing a light-emitting device includes steps of: preparing a package on which a light-emitting element is mounted; arranging a liquid material covering the light-emitting element; arranging an uncured resin material covering the liquid material; curing the uncured resin material; and removing the liquid material. The package has a recess on an upper surface. The step of preparing the package includes a step of mounting the light emitting element on a bottom surface of the recess.SELECTED DRAWING: Figure 3

Description

  The present disclosure relates to a light emitting device and a method for manufacturing the light emitting device.

  Conventionally, a light emitting device including a light emitting element mounted in a package and a sealing member separated from the light emitting element has been known. For example, in Patent Document 1, a dome-shaped fluorescent layer and a sealing member are fixed to a substrate on which an LED chip is mounted with an adhesive, and a space is formed between the LED chip and the sealing member. A light emitting device in which the deterioration of the sealing member is suppressed is disclosed.

  For example, in Patent Document 2, the fluorescent layer and the housing are joined by an adhesive, and the joined light emitting device components are fixed to a base substrate on which the light emitting element is mounted, so that the phosphor layer and the housing are separated. There is disclosed a method for manufacturing a light emitting device which does not require a step of stacking.

JP 2007-49019 A JP 2012-23288 A

  However, in order to properly seal the light emitting element with a sealing member separated from the light emitting element, an adhesive for joining the sealing member to the package is separately required.

  It is an object of embodiments of the present disclosure to provide a light emitting device that joins a sealing member to a package without using an adhesive, and a method for manufacturing the light emitting device.

  A method for manufacturing a light emitting device according to an embodiment of the present disclosure includes a step of preparing a package on which a light emitting element is mounted, a step of disposing a liquid material covering the light emitting element, and an uncured resin material covering the liquid material. , A step of curing the uncured resin material, and a step of removing the liquid material.

  A light emitting device according to an embodiment of the present disclosure includes a package having a concave portion, a light emitting element mounted on the concave portion, and a space separated from the light emitting element, and sealing the concave portion by directly contacting the package. A translucent member.

  According to the method for manufacturing a light emitting device according to an embodiment of the present disclosure, a sealing member can be joined to a package without using an adhesive.

FIG. 2 is a cross-sectional perspective view schematically illustrating a configuration of the light emitting device according to the first embodiment. FIG. 2 is a plan view schematically illustrating a configuration of the light emitting device according to the first embodiment. 4 is a flowchart illustrating a procedure of a method for manufacturing a light emitting device according to the first embodiment. FIG. 4 is a cross-sectional view schematically illustrating a package preparing step and a light emitting element mounting step of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4 is a cross-sectional view schematically illustrating a liquid material disposing step of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4 is a cross-sectional view schematically illustrating a resin material disposing step of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4 is a cross-sectional view schematically illustrating a resin material curing step of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4 is a cross-sectional view schematically illustrating a liquid material removing step of the method for manufacturing a light emitting device according to the first embodiment. It is a sectional view showing typically the composition of the light emitting device manufactured by the manufacturing method of the light emitting device concerning a 1st embodiment. It is a sectional perspective view showing typically the light emitting device showing the modification of a 1st embodiment. It is a sectional perspective view showing typically the composition of the light emitting device concerning a 2nd embodiment. It is a top view showing typically composition of a light emitting device concerning a 2nd embodiment. It is sectional drawing which shows typically the package preparation process and the light emitting element mounting process of the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows typically the liquid material arrangement | positioning process of the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows typically the resin material arrangement | positioning process of the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows typically the resin material hardening process of the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows typically the liquid material removal process of the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows typically the structure of the light emitting device manufactured by the manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is sectional drawing which shows typically the light emitting device which represents the modification of 2nd Embodiment.

Hereinafter, a light emitting device according to an embodiment and a method for manufacturing the light emitting device will be described.
The drawings referred to in the following description schematically show the embodiments, and the scale, interval, positional relationship, and the like of each member are exaggerated, or some of the members are not illustrated. There are cases. Further, for example, the scale and the interval of each member may not match in the plan view and the cross-sectional view thereof. In the following description, the same names and reference numerals indicate the same or similar members in principle, and a detailed description thereof will be omitted as appropriate.

  Further, in the light emitting device and the method of manufacturing the same according to the embodiment, “up”, “down”, “left”, “right”, and the like are replaced according to the situation. In this specification, "up", "down", and the like indicate relative positions between components in the drawings referred to for description, and indicate absolute positions unless otherwise specified. Not intended.

<< 1st Embodiment >>
[Configuration of light emitting device]
The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS.
FIG. 1 is a cross-sectional perspective view schematically showing a configuration of the light emitting device according to the first embodiment, and shows a cross section taken along line IC-IC of FIG. FIG. 2 is a plan view schematically showing the configuration of the light emitting device according to the first embodiment.

  The light emitting device 100 according to the first embodiment includes a package 1 having a concave portion 23a, a light emitting element 2 mounted on a bottom surface of the concave portion 23a, and a space separated from the light emitting element 2 and directly joined to the package 1. A light-transmissive member 3 for sealing the recess 23a.

The package 1 includes a wiring electrode 110 and a support member 13 that supports the wiring electrode 110.
The package 1 has a substantially rectangular parallelepiped overall shape, and includes a concave portion 23a having an opening on the upper surface. The external shape of the package 1 may be substantially rectangular in plan view, or may be circular, elliptical, polygonal, or the like. In the case of a polygonal shape including a rectangular shape, a corner portion may have a rounded shape.

  At least a part of the wiring electrode 110 is exposed on the bottom surface of the concave portion 23a, and the light emitting element 2 is mounted on the upper surface of the wiring electrode 110 exposed on the bottom surface of the concave portion 23a. The opening shape of the concave portion 23a includes a substantially square shape with rounded corners, a circular shape, an elliptical shape, and a polygonal shape in plan view.

  The support member 13 forms an inner surface of the concave portion 23a that accommodates the light emitting element 2. The inner surface of the concave portion 23a forms an inclined surface that is inclined outward from the bottom surface 23b of the concave portion 23a toward the opening. The inner surface may be a vertical surface perpendicular to the bottom surface of the concave portion 23a, but is preferably an inclined surface inclined outward. By making the inner side surface an inclined surface inclined outward, light emitted by the light emitting element 2 mounted in the concave portion 23a and propagating in the lateral direction can be reflected in the opening direction to increase the light extraction efficiency.

  Further, it is preferable that the support member 13 has a step X on the upper part of the inner side surface. Providing the step X on the inner side surface makes it easier to arrange the uncured resin material 31 on the upper surface of the liquid material 30 in the later-described resin material arrangement step when manufacturing the light emitting device 100. That is, the light emitting device 100 can be manufactured more easily. Note that the inner side surface may have a plurality of steps in the height direction.

As the support member 13, resin or ceramics can be used. Examples of the resin material include a thermoplastic resin and a thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester and the like can be mentioned. Thus, an inexpensive package can be easily manufactured.
In the case of a thermosetting resin, for example, a silicone resin, a silicone modified resin, a silicone hybrid resin, an epoxy resin, an epoxy modified resin, a urea resin, a diallyl phthalate resin, a phenol resin, an unsaturated polyester resin, or one or more of these resins are contained. Hybrid resins and the like can be mentioned. Thereby, the package 1 having good heat resistance can be easily manufactured.
In the case of ceramics, for example, aluminum oxide, aluminum nitride, boron nitride and the like can be mentioned. Thereby, the package 1 having excellent heat dissipation properties can be obtained.

In order to reflect light efficiently on the inner surface of the support member 13, the support member 13 may contain a light-reflective substance. Examples of the light reflective substance include titanium oxide, glass filler, silica, alumina, zinc oxide, and the like.
The reflectance of the inner surface of the support member 13 with respect to visible light is preferably 70% or more, and more preferably 80% or more. In particular, the reflectance is preferably 70% or more, more preferably 80% or more in the wavelength region of light emitted from the light emitting element.
When a resin material is used as the support member 13, the content of the light reflective substance with respect to the resin material is preferably 5% by mass or more and 50% by mass or less, more preferably 10% by mass or more and 30% by mass or less. .

  The wiring electrode 110 includes, for example, positive and negative wiring electrodes 111 and 112. The wiring electrode 110 is electrically connected to the light emitting element 2 via a connection member such as the wire 4, for example.

  Part of the upper surface of each of the positive and negative wiring electrodes 111 and 112 constitutes part of the bottom surface 23b of the concave portion 23a. Then, each of the wiring electrodes 111 and 112 extends from the bottom surface of the concave portion 23a through the support member 13 to an end of the outer surface, bends downward at the end, and extends along the outer surface of the support member 13, further. The support member 13 is formed to bend inward along the lower surface. Accordingly, the light emitting device 100 is electrically connected to the outside by using a part of each of the wiring electrodes 111 and 112 provided inwardly bent on the lower surface side of the support member 13 as an external electrode and using a conductive joining member such as solder. Can be connected to

  A part of each of the positive and negative wiring electrodes 111 and 112 is exposed to the bottom surface 23b of the concave portion 23a, and is electrically connected to the light emitting element 2 via a connecting member such as the wire 4. For example, the wiring electrode 111 can be electrically connected to the cathode electrode of the light emitting element 2, and the wiring electrode 112 can be electrically connected to the anode electrode of the light emitting element 2 via the wire 4.

The wiring electrode 110 can be formed, for example, by punching or bending an etching process or a press process on a flat metal plate. As a metal plate as a raw material, a known material can be used as a material used for a lead frame of a light emitting device. The thickness of the metal plate is appropriately selected according to the shape and size of the resin molded body, for example, a thickness of about 100 to 500 μm is used, and a thickness of 120 to 300 μm is more preferable. . Examples of the material of the metal plate include copper, iron, silver, gold, aluminum, and the like, and alloys thereof. Copper-based materials are preferred from the viewpoint of thermal conductivity and strength.
The surface of the wiring electrode 110 exposed on the bottom surface 23b of the concave portion 23a is plated with Ag, Au, or the like in order to enhance light reflectivity and / or bondability with the wire 4 and the die bonding member. You may. The metal used for the plating process may be different depending on the purpose of the plating process, in other words, depending on the region to be plated. For example, Ag may be used on the upper surface of the wiring electrode 110 mainly to increase light reflectivity, and Au may be used on the lower surface mainly to improve bonding properties of solder or the like.

The shape, size, semiconductor material and the like of the light emitting element 2 are arbitrarily selected. The emission color of the light-emitting element 2 can be selected to have any wavelength according to the application. For example, a nitride semiconductor represented by In _X Al _Y Ga _1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) having an emission wavelength in the near ultraviolet to visible light region. Light emitting element can be suitably used.

  In the light emitting device 100 of the first embodiment, one light emitting element 2 is mounted on the bottom surface 23b of the concave portion 23a, but two or more light emitting elements can be mounted. In the light emitting element 2, the positive and negative electrodes may be arranged on the same surface side, or may be arranged on different surface sides.

  The translucent member 3 is a sealing member that seals the light emitting element 2, the wire 4, the protection element, and the like mounted in the concave portion 23a of the package 1. The translucent member 3 is separated from the light emitting element 2 by a space, is bonded to the inner surface of the recess 23a, and seals the light emitting element 2, the wire 4, the protection element, and the like. The translucent member 3 protects the light emitting element 2, the wire 4, the protection element, and the like from external force, dust, moisture, and the like, and improves the heat resistance, weather resistance, and light resistance of the light emitting element 2. Is provided.

  The translucent member 3 is formed with a substantially constant thickness. The shape of the translucent member 3 is formed along the opening of the concave portion 23a in a plan view, and is substantially circular here. Further, the translucent member 3 is formed in a curved surface protruding toward the light emitting element 2 from the periphery of the opening of the concave portion 23a toward the center of the opening. The shape of the translucent member 3 may be a curved surface that is concave toward the light emitting element 2 from the periphery of the opening of the recess 23a toward the center of the opening, or may be a flat surface. The shape of the translucent member 3 can be changed depending on the amount and properties of the liquid material 30 described below, and can be appropriately adjusted according to the use of the light emitting device 100.

  As the resin material used for the translucent member 3, a material having good translucency with respect to the wavelength of light emitted from the light emitting element 2 and having good weather resistance, light resistance and heat resistance as a sealing member is used. preferable. Furthermore, it is preferable that the resin material used for the translucent member 3 is a material that does not prevent volatilization of a liquid material 30 described later. For example, when water is used as the liquid material, examples of the translucent member 3 include a silicone resin, a silicone-modified resin, and a silicone hybrid resin having excellent water vapor permeability. In addition, since the silicone resin is a thermosetting resin, volatilization of the resin material and curing of the resin material can be performed simultaneously, which is preferable.

  Further, the translucent member 3 may contain a fluorescent substance (wavelength conversion substance), a light diffusing substance, or other filler in order to give the resin material a predetermined function.

  When the translucent member 3 contains a phosphor, the translucent member 3 functions as a wavelength conversion member that converts at least a part of light emitted by the light emitting element 2 into light of a different wavelength. At least a part of the light emitted from the light emitting element 2 is converted in wavelength by the phosphor contained in the translucent member 3 and emitted to the outside.

Examples of the phosphor include a yttrium aluminum garnet phosphor activated with cerium (YAG: Ce), a lutetium aluminum garnet phosphor activated with cerium (LAG: Ce), europium and / or chromium. in activated nitrogen containing calcium aluminosilicate phosphor (e.g. _{CaO-Al 2 O 3 -SiO 2} : Eu), activated silicates phosphor with europium _{((Sr, Ba) 2 SiO} 4: Eu), β Nitride-based phosphor such as sialon phosphor, CASN-based phosphor (CaAlSiN ₃ : Eu), SCASN-based phosphor ((Sr, Ca) AlSiN ₃ : Eu), KSF-based phosphor (K ₂ SiF ₆ : Mn) , sulphide phosphor composition emitting red light is _{(3.5MgO · 0.5MgF 2 · GeO 2} : Mn In Germanic acid salt represented (MGF system) phosphor, and the like quantum dot phosphor.
When the translucent member 3 contains the phosphor 5, the phosphor 5 may be arranged in a dispersed state in the translucent member 3 or may be arranged in a settled state. Good.

Further, as the light diffusing substance, specifically, a white pigment such as TiO ₂ or Al ₂ O ₃ can be used. Among them, TiO ₂ is preferable because it is relatively stable to moisture and the like, has a high refractive index, and has excellent thermal conductivity. The average particle diameter of the light diffusing substance in the light transmitting member 3 is more preferably 0.001 μm to 0.05 μm. Thereby, a high light scattering effect, that is, a Rayleigh scattering effect is obtained, and the light extraction efficiency of the light emitting device 100 can be further increased.

The wire 4 is a conductive wiring for electrically connecting electronic components such as the light emitting element 2 and the protection element to the respective wiring electrodes 111 and 112. Examples of the wire 4 include those using metals such as Au, Ag, Cu, Pt, and Al, and alloys thereof, and it is particularly preferable to use Au having excellent thermal conductivity and the like. The wire 4 has a high refractive index film formed of a material such as SiO ₂ , TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O _{3 on} the surface thereof, which hardly absorbs light. It may be provided.

  Note that a protection element may be provided to protect the light emitting element 2 from electrostatic discharge or the like. As the protection element, for example, a Zener diode can be used. Further, a varistor, a resistor, a capacitor, or the like can be used as the protection element.

  According to the light emitting device 100 according to the first embodiment, the translucent member 3 is directly bonded to the concave portion 23a of the package 1 with a space from the light emitting element 2 by its own adhesive force. Thereby, the light emitting device 100 in which the translucent member 3 is joined to the package 1 can be realized without using an adhesive. In addition, the presence of the space between the light emitting element 2 and the light transmitting member 3 can suppress the deterioration of the light transmitting member 3. Further, the load on the wire and the light emitting element 2 due to the resin pressure of the translucent member 3 can be reduced to prevent wire breakage and peeling of the light emitting element 2, thereby improving the reliability of the light emitting device 100. .

(Method of manufacturing light emitting device)
Next, a method for manufacturing the light emitting device according to the first embodiment will be described with reference to FIGS. 3 and 4A to 4F.
FIG. 3 is a flowchart illustrating a procedure of the method for manufacturing the light emitting device according to the first embodiment.
FIG. 4A is a cross-sectional view schematically showing a package preparing step (S1001) and a light emitting element mounting step (S1002) of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4B is a cross-sectional view schematically illustrating a liquid material disposing step (S1003) of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4C is a cross-sectional view schematically illustrating a resin material disposing step (S1004) of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4D is a cross-sectional view schematically illustrating a resin material curing step (S1005) of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4E is a cross-sectional view schematically showing a liquid material removing step (S1006) of the method for manufacturing a light emitting device according to the first embodiment. FIG. 4F is a cross-sectional view schematically illustrating a configuration of a light emitting device manufactured by the method for manufacturing a light emitting device according to the first embodiment.

4A to 4F, the package 1 schematically shows only the bottom surface 23b of the concave portion 23a and the upper portion constituting the side wall.
The method for manufacturing the light emitting device 100 according to the first embodiment includes a package preparing step S1001, a light emitting element mounting step S1002, a liquid material arranging step S1003, a resin material arranging step S1004, a resin material curing step S1005, a liquid material Removing step S1006. In an actual process, a package assembly including a plurality of packages 1 is prepared, and a plurality of light emitting devices 100 are manufactured. In the present embodiment, for convenience of explanation, as shown in FIGS. A process of manufacturing one light emitting device 100 is schematically described.

  As shown in FIG. 4A, the package preparation step S1001 is a step of preparing a package 1 for mounting the light emitting element 2. In this step, the package 1 is prepared in which the wiring electrodes are arranged on the bottom surface 23b of the package 1, the support members 13 are arranged as the side walls of the package 1, and the recesses 23a are open on the upper surface side.

  As shown in FIG. 4A, the light emitting element mounting step S1002 is a step of mounting the light emitting element 2 in the concave portion 23a of the package 1. In this step, the light emitting element 2 is die-bonded on the wiring electrode 111. Then, the light emitting element 2 is electrically connected to the wiring electrodes 111 and 112 using the wires 4.

As shown in FIG. 4B, the liquid material arranging step S1003 is a step of arranging the liquid material 30 to be filled in the concave portion 23a of the package 1 on which the light emitting element 2 is mounted. That is, this step is a step of filling the concave portion 23a of the package 1 with the liquid material 30 by potting, for example, by a potting method or the like. In this step, the liquid material 30 is filled in the concave portion 23a in a state where the upper surface of the liquid material 30 has a concave curved surface curved toward the light emitting element 2 due to surface tension or the like. The curvature of the concave surface of the liquid material 30 increases as the opening of the package 1 decreases.
The liquid material 30 is preferably water, but may be an organic compound such as hexane, ethanol, and toluene. The liquid material 30 is a material having a property that does not easily mix with at least the uncured resin material, and a volatile substance in which the liquid material 30 volatilizes with respect to the uncured and / or cured resin material. Any material may be used as long as it has transmissivity. In this step, when the liquid material 30 is potted, the liquid material 30 may be used as a liquid material 30 to which a surface conditioner for adjusting the surface tension of the liquid material 30 is added in advance.

As shown in FIG. 4C, the resin material disposing step S1004 is a step of disposing the uncured resin material 31 on the upper surface of the liquid material 30. In this step, the uncured resin material 31 is disposed so as to cover the upper surface of the liquid material 30.
Specifically, this step is a step of forming an uncured resin material 31 on the upper surface of the liquid material 30 by, for example, a potting method. Since the uncured resin material 31 does not dissolve in the liquid material 30, the resin material 31 is provided along the upper surface of the liquid material 30. In the package 1, since the step X is provided on the upper part of the inner surface of the support member 13, the uncured resin material 31 is easily disposed on the upper surface of the liquid material 30 and the upper surface of the step X in this step. Becomes possible.
In this step, the uncured resin material 31 may be potted at least in the concave portion 23a of the package 1 by the dispenser 40 or the like. For this reason, in the light emitting device 100 according to the present embodiment, the positioning of the sealing member (or the lens or the like) is easier than in the conventional light emitting device in which the sealing member separated from the light emitting element is formed later. There is a merit that is.

As shown in FIGS. 4C and 4D, in the resin material curing step S1005, the uncured resin material 31 is cured by heating the uncured resin material 31 using a heating device such as a heater or an oven to form the light transmitting member 3. It is a process. In this step, the uncured resin material 31 is directly bonded to the package 1 on the upper surface side of the package 1 in the concave portion 23a by its own adhesive force. It is preferable that the resin material 31 starts curing at a temperature lower than the boiling point of the liquid material 30. As an example, by using water as the liquid material 30 and using a silicone resin or the like as the resin material 31, when the resin material 31 is cured, the liquid material 30 starts to volatilize, and the liquid material 30 is surely volatilized in the next step. Can be. The volatilized liquid material 30 passes through the translucent member 3 and is released to the outside of the package 1. That is, it is possible to cure the resin material 31 while maintaining the shape of the resin material 31.
The shape of the cured translucent member 3 is, for example, a substantially circular shape along the opening in a plan view, and is a curved surface protruding toward the light emitting element 2 from the periphery of the recess 23a toward the center (that is, the light emission of the light emitting device). Surface side has a concave curved surface). The translucent member 3 functions as a sealing member of the light emitting device, separates from the light emitting element 2, and appropriately seals the light emitting element 2, the wire 4, the protection element, and the like.

As shown in FIG. 4E, in the liquid material removing step S1006, the package 1 is heated using a heating device such as a heater or an oven, so that the liquid material 30 is volatilized to the outside of the package 1 through the translucent member 3. This is a step of removing the liquid material 30.
In this step, it is preferable that the time until the liquid material 30 is completely removed from the concave portion 23a of the package 1 through the translucent member 3 is, for example, about 5 to 30 minutes.
In this step, the heating temperature is preferably lower than the boiling point of the liquid material. For example, in the case where water is used as the liquid material 30, the temperature is preferably set to 60 degrees or more and 80 degrees or less, and around 70 degrees Is more preferable. The higher the heating temperature is, the shorter the volatilization time of the liquid material 30 can be. However, if the liquid material 30 boils, voids are generated in the translucent member 3. On the other hand, the lower the temperature is, the longer the volatilization time of the liquid material 30 is, and the translucent member 3 is pulled toward the bottom surface 23b, and the translucent member 3 may come into contact with the light emitting element 2. There is. Therefore, the heating temperature needs to be maintained at an appropriate temperature.

  Although the liquid material removing step S1006 is performed after the resin material curing step S1005 in the above-described steps, the resin material curing step S1005 and the liquid material removing step S1006 can be performed simultaneously. Even at the same time, it is preferable that at least the curing temperature of the resin material 31 is lower than the boiling point of the liquid material 30. Thus, when the package 1 is heated, the resin material 31 is cured, and the liquid material 30 can be volatilized while maintaining the downwardly convex shape. Further, “simultaneously” in the present embodiment means that the resin material 31 and the liquid material 30 are heated simultaneously.

  As shown in FIG. 4F, the light emitting device 100 is manufactured by performing each of the above-described steps and further performing a singulation step and the like. Although a detailed description is omitted, the light-emitting device singulation process is a process of separating the light-emitting devices 100 along a boundary set between the light-emitting devices 100 to singulate the light-emitting devices 100.

(Modification)
In addition, as shown in FIG. 5, the light emitting device 100 may be configured to include a phosphor 5 that covers the bottom surface of the concave portion and the light emitting element 2 in the concave portion.
Such a light emitting device 100 can be easily formed by including the phosphor 5 in a liquid material. The phosphor 5 contained in the liquid material 30 moves to the bottom surface 23b side of the concave portion 23a as the liquid material 30 volatilizes, and after the liquid material 30 volatilizes, the inner surface of the concave portion 23a and the surface of the light emitting element 2 are removed. It is arranged to cover.
By disposing the five phosphors on the surface of the light emitting element 2 and on the side of the bottom surface 23b of the recess 23a, the heat generated by the phosphor 5 can be efficiently radiated to the outside.

  According to the method of manufacturing the light emitting device according to the embodiment of the present disclosure, by using the volatile liquid material 30, the package 1 is separated from the light emitting element 2 by a space without using an adhesive. The translucent member 3 to be joined to the package 1 on the upper surface side can be formed.

<< 2nd Embodiment >>
[Configuration of light emitting device]
Next, a configuration of the light emitting device 100a according to the second embodiment will be described. FIG. 6A is a cross-sectional perspective view schematically showing the configuration of the light emitting device according to the second embodiment, and shows a cross section taken along line IC-IC of FIG. 6B. FIG. 6B is a plan view schematically illustrating the configuration of the light emitting device according to the second embodiment. In addition, about the part common to 1st Embodiment mentioned above, the overlapping description is abbreviate | omitted suitably.

The configuration of the light emitting device 100a according to the second embodiment differs from the configuration of the light emitting device 100 according to the first embodiment in the shape of the translucent member 3a.
The shape of the translucent member 3a is formed along the shape of the concave portion 23a in a plan view, and is concave toward the light emitting element 2 from the periphery of the concave portion 23a toward the center (that is, on the light emitting surface side of the light emitting device). (A convex curved surface).
According to the light emitting device 100a according to the second embodiment, the translucent member 3a is directly bonded to the package 1 on the upper surface side of the package 1 in the concave portion 23a by its own adhesive force. Thereby, the light emitting device 100a in which the translucent member 3a is joined to the package 1 can be realized without using an adhesive. In addition, the translucent member 3a can serve as a convex lens by being formed on a convex curved surface.

(Method of manufacturing light emitting device)
Next, a method for manufacturing the light emitting device according to the second embodiment will be described with reference to FIGS. 7A to 7F. In addition, about the part common to 1st Embodiment mentioned above, the overlapping description is abbreviate | omitted suitably.

  The manufacturing method of the light emitting device 100a according to the second embodiment is different from the manufacturing method of the light emitting device 100 according to the first embodiment in that the liquid material 30 filled in the concave portion 23a of the package 1 in the liquid material arranging step. Is arranged so that the liquid material 30 is filled in a state of having a convex curved surface curved to the opposite side to the light emitting element 2 (see FIG. 6B).

  FIG. 7A is a cross-sectional view schematically illustrating a package preparation step of the method for manufacturing a light emitting device according to the second embodiment. FIG. 7B is a cross-sectional view schematically illustrating a liquid material disposing step of the method for manufacturing a light emitting device according to the second embodiment. FIG. 7C is a cross-sectional view schematically illustrating a resin material disposing step of the method for manufacturing a light emitting device according to the second embodiment. FIG. 7D is a cross-sectional view schematically illustrating a resin material curing step of the method for manufacturing a light emitting device according to the second embodiment. FIG. 7E is a cross-sectional view schematically illustrating a liquid material removing step of the method for manufacturing a light emitting device according to the second embodiment. FIG. 7F is a cross-sectional view schematically illustrating a configuration of a light emitting device manufactured by the method for manufacturing a light emitting device according to the second embodiment. 7A to 7F, the package 1 schematically shows only the bottom surface 23b of the concave portion 23a and the upper portion constituting the side wall.

The method for manufacturing the light emitting device 100a according to the second embodiment is similar to the method for manufacturing the light emitting device 100 according to the first embodiment, and includes a package preparing step, a light emitting element mounting step, a liquid material disposing step, and a resin material disposing step. And a resin material curing step and a liquid material removing step.
As shown in FIG. 7A, the package preparation step is a step of preparing a package 1 for mounting the light emitting element 2. This step is the same as the package preparation step S1001 shown in FIG. 4A.

As shown in FIG. 7A, the light emitting element mounting step is a step of mounting the light emitting element 2 in the concave portion 23a of the package 1. This step is the same as the light emitting element mounting step S1002 indicated by the virtual line in FIG. 4A.
As shown in FIG. 7B, the liquid material disposing step is a step of disposing the liquid material 30 to be filled in the concave portion 23a of the package 1 on which the light emitting element 2 is mounted. In this step, the liquid material 30 is filled in the concave portion 23a in a state where the upper surface of the liquid material 30 has a convex curved surface curved to the opposite side to the light emitting element 2 due to surface tension or the like. Here, the liquid material 30 is filled up to the upper end of the opening of the concave portion 23a, so that the liquid material 30 rises from the concave portion 23a due to surface tension.

As shown in FIG. 7C, the resin material disposing step is a step of disposing the uncured resin material 31 on the upper surface of the liquid material 30. In this step, the uncured resin material 31 is disposed so as to cover the upper surface of the liquid material 30 and at least a part of the package 1.
Specifically, in this step, an uncured resin material 31 is formed on the upper surface of the liquid material 30 having a convex curved surface by, for example, a potting method. The uncured resin material 31 is provided along the upper surface of the liquid material 30 having a convex curved surface in order to repel the liquid material 30. Here, the joining portion is located at the periphery of the opening of the concave portion 23a. Therefore, the resin material 31 is provided in an upwardly convex shape following the raised state of the liquid material 30. In the package 1, since the step X is provided on the upper part of the inner surface of the support member 13, the uncured resin material 31 can be easily arranged on the upper surface of the liquid material 30 in this step. The shape provided on the resin material 31 can be maintained by adjusting the viscosity of the resin material 31 and the conditions in the step of removing the liquid material 31.

As shown in FIGS. 7C and 7D, the resin material curing step is a step of heating the uncured resin material 31 by using a heating device such as a heater or an oven to cure the resin material 31 to form the light-transmissive member 3 a. It is. This step is the same as the resin material curing step S1005 shown in FIGS. 4C and 4D.
The shape of the cured translucent member 3a is a circular shape formed in a plan view so as to have a joining portion on the periphery of the opening of the concave portion 23a and surround the concave portion 23a and cover the outside of the package 1. Has a convex curved surface that curves from the periphery to the opposite side to the light emitting element 2. The translucent member 3a functions as a sealing member of the light emitting device, separates from the light emitting element 2, and appropriately seals the light emitting element 2, the wire 4, the protection element, and the like.

As shown in FIG. 7E, in the liquid material removing step, the package 1 is heated by using a heating device such as a heater or an oven, so that the package 1 is passed through the light transmitting member 3a or the light transmitting member 3a and the supporting member 13 are heated. In this step, the liquid material 30 is volatilized and the liquid material 30 is removed. This step is the same as the liquid material removing step S1006 shown in FIG. 4E.
Note that, similarly to the first embodiment, the resin material curing step and the liquid material removing step can be performed simultaneously.

  As shown in FIG. 7F, the light emitting device 100a is manufactured by performing the above-described respective steps, and further performing the wiring electrode bending step, the individualizing step, and the like.

(Modification)
In addition, also in the second embodiment, as shown in FIG. 8, the light emitting device 100a may have a configuration in which the phosphor is provided in the recess to cover the bottom surface of the recess and the light emitting element.

  According to the method of manufacturing the light emitting device according to the embodiment of the present disclosure, by using the volatile liquid material 30, the package 1 is separated from the light emitting element 2 by a space without using an adhesive. The translucent member 3a joined to the package 1 on the upper surface side can be formed.

  The invention according to the present disclosure is not limited to the embodiments described above, and includes various modifications. The above embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described above. Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of one embodiment can be added to the configuration of another embodiment.

  The light emitting device and the manufacturing method thereof according to the embodiment of the present disclosure can be used for a lighting device, an optical device, and the like.

DESCRIPTION OF SYMBOLS 1 Package 2 Light emitting element 3, 3a Translucent member 4 Wire 5 Phosphor 23a Depression 23b Bottom surface 30 Liquid material 31 Uncured resin material 100, 100a Light emitting device 110, 111, 112 Wiring electrode

Claims (15)

Preparing a package on which the light emitting element is mounted,
Arranging a liquid material covering the light emitting element;
Arranging an uncured resin material covering the liquid material,
Curing the uncured resin material,
Removing the liquid material. The package has a concave portion on the upper surface,
The step of preparing the package includes:
The method for manufacturing a light emitting device according to claim 1, further comprising: mounting the light emitting element on a bottom surface of the concave portion. The step of arranging the resin material,
The method for manufacturing a light emitting device according to claim 2, further comprising a step of disposing the resin material so as to cover an upper surface of the package surrounding the recess.   4. The method according to claim 1, wherein, in the step of disposing the liquid material, the liquid material is disposed such that an upper surface of the liquid material has a concave curved surface curved toward the light emitting element. 5. A method for manufacturing a light emitting device.   4. The method according to claim 1, wherein, in the step of disposing the liquid material, the liquid material is disposed such that an upper surface of the liquid material has a convex curved surface curved to a side opposite to the light emitting element. 5. The manufacturing method of the light emitting device according to the above.   The method of manufacturing a light emitting device according to claim 1, wherein in the step of removing the liquid material, the liquid material is volatilized out of the package under a temperature condition lower than a boiling point of the liquid material.   The method for manufacturing a light emitting device according to claim 1, wherein the liquid material is water.   The method for manufacturing a light emitting device according to claim 1, wherein the step of curing the resin material and the step of removing the liquid material are performed simultaneously.   The method according to any one of claims 1 to 8, wherein the resin material contains a phosphor.   The method for manufacturing a light emitting device according to claim 1, wherein the liquid material contains a phosphor. A package having a recess,
A light emitting element mounted in the recess,
A light-transmitting member that is spaced apart from the light-emitting element and that is in direct contact with the package and seals the recess.   The light emitting device according to claim 11, wherein the translucent member has a concave curved surface that curves toward the light emitting element from a periphery of the concave portion toward a center.   The light emitting device according to claim 11, wherein the translucent member has a convex curved surface that curves toward the light emitting element from a periphery of the concave portion toward a center.   The light emitting device according to claim 11, wherein the translucent member contains a phosphor.   The light emitting device according to claim 11, further comprising a phosphor that covers an inner surface of the concave portion and a surface of the light emitting element.

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