JP2020003361A - Inspection jig, semiconductor chip inspection method, and semiconductor device manufacturing method - Google Patents

Abstract

To provide an inspection jig with which it is possible to hold a semiconductor chip in an inspectable state even under a high temperature environment where a dicing jig is unable to hold the semiconductor chip in an inspectable state, as well as a semiconductor chip inspection method using the inspection jig and a semiconductor device manufacturing method provided with the semiconductor chip inspection method.SOLUTION: An inspection jig ISJ comprises a metal frame MF, a first metal plate MP1, and a mounting unit PFC. The metal frame MF has an annular shape in a plan view. The first metal plate MP1 is arranged in an internal region enclosed by the metal frame MF in a plan view and secured to the metal frame MF. The mounting unit PFC is arranged so as to overlap a portion of the inside section in a plan view and includes a first surface SF1 on which a semiconductor chip CHP is mounted and a second surface SF2 adhered to the first metal plate MP1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an inspection jig on which a semiconductor chip is mounted for inspection, a semiconductor chip inspection method, and a semiconductor device manufacturing method.

  Conventionally, a plurality of semiconductor elements formed on a semiconductor substrate are cut into a plurality of semiconductor chips by a dicing process. In the dicing step, in order to fix the semiconductor substrate to the dicing apparatus, a dicing jig including an annular dicing frame and a dicing tape fixed to the dicing frame and to which the semiconductor substrate is attached is used. . The dicing frame is made of a metal material, and the dicing tape is made of a synthetic resin such as polyvinyl chloride and an adhesive. In the dicing step, the plurality of semiconductor chips are collected while being held by a dicing jig.

  Conventionally, a probe device for inspecting a semiconductor chip held by a dicing jig is known. Such a probe device is disclosed in, for example, JP-A-2006-154268, WO 2014/132856, JP-A-2007-95938, JP-A-2011-222851, JP-A-2005-164522, and JP-A-2005-164522. It is disclosed in 2008-027960. In the probe device, the dicing jig is used as an inspection jig for aligning the semiconductor chip with the probe.

JP-A-2006-154268 International Publication No. WO 2014/132856 JP 2007-95938 A JP 2011-222851 A JP 2005-164522 A JP 2008-027960 A

  However, the probe device as described above has not been used for an inspection performed on a semiconductor chip under a high-temperature environment heated to 150 ° C. or higher. This is because if the dicing jig is placed in a high-temperature environment, the dicing tape may be deformed, and in this case, the semiconductor chip is not maintained in an inspectable state and cannot be inspected. Other problems and novel features will be apparent from the description of this specification and the accompanying drawings.

  The inspection jig according to the present embodiment is an inspection jig on which a semiconductor chip is mounted and used for inspection. The inspection jig according to the present embodiment includes a metal frame, a metal plate, and a mounting unit. The metal frame is annular in plan view. The metal plate is arranged in an internal region surrounded by the metal frame in a plan view, and is fixed to the metal frame. The mounting portion is disposed so as to overlap a part of the inner portion in a plan view, and has a first surface on which the semiconductor chip is mounted and a second surface adhered to the metal plate.

  According to the present embodiment, an inspection jig provided for inspection using a probe device, in which a semiconductor chip can be inspected even in a high-temperature environment where a dicing jig cannot maintain the semiconductor chip in an inspectable state Jig that can be held in a semiconductor chip, an inspection method of a semiconductor chip using the inspection jig, and a method of manufacturing a semiconductor device including the inspection method of the semiconductor chip.

FIG. 2 is a cross-sectional view illustrating the inspection jig according to the first embodiment. FIG. 2 is a top view of the inspection jig shown in FIG. 1. FIG. 2 is an exploded sectional view of the inspection jig shown in FIG. 1. FIG. 2 is an exploded sectional view of a mounting portion of the inspection jig shown in FIG. 1. 4 is a flowchart of a semiconductor chip inspection method according to the first embodiment. FIG. 5 is a cross-sectional view showing one step in a step of transferring the semiconductor chip from the dicing jig to the inspection jig in the semiconductor chip inspection method according to the first embodiment. FIG. 7 is a cross-sectional view showing one step performed after the step shown in FIG. 6 in the step of transferring the semiconductor chip from the dicing jig to the inspection jig in the semiconductor chip inspection method according to the first embodiment; FIG. 8 is a cross-sectional view showing one step performed after the step shown in FIG. 7 in the step of transferring the semiconductor chip from the dicing jig to the inspection jig in the semiconductor chip inspection method according to the first embodiment; FIG. 9 is a cross-sectional view showing one step performed after the step shown in FIG. 8 in the step of transferring the semiconductor chip from the dicing jig to the inspection jig in the semiconductor chip inspection method according to the first embodiment; FIG. 10 is a cross-sectional view showing one step performed after the step shown in FIG. 9 in the step of transferring the semiconductor chip from the dicing jig to the inspection jig in the semiconductor chip inspection method according to the first embodiment; FIG. 11 is a cross-sectional view showing one step performed after the step shown in FIG. 10 in the step of transferring the semiconductor chip from the dicing jig to the inspection jig in the semiconductor chip inspection method according to the first embodiment; 4 is a flowchart of a method for manufacturing a semiconductor device according to the first embodiment. FIG. 5 is a cross-sectional view showing a step of removing the semiconductor chip from the inspection jig according to the first embodiment. FIG. 10 is a top view of the inspection jig according to the second embodiment. It is a top view of the mounting part shown in FIG. It is a bottom view of the mounting part shown in FIG. FIG. 15 is a cross-sectional view of the mounting unit shown in FIG. FIG. 15 is a top view of the metal frame and the positioning member shown in FIG. 14. It is sectional drawing seen from arrow XIX-XIX in FIG. FIG. 13 is a top view showing one step in a step of transferring a semiconductor chip from a dicing jig to an inspection jig in the semiconductor chip inspection method according to the second embodiment. FIG. 13 is a cross-sectional view of the inspection jig according to the third embodiment. FIG. 9 is a top view showing a modification of the semiconductor chip mounted on the inspection jig according to the first to third embodiments. FIG. 13 is a top view showing another modification of the semiconductor chip mounted on the inspection jig according to the first to third embodiments.

  Hereinafter, embodiments will be described with reference to the drawings. In the following drawings, the same or corresponding portions have the same reference characters allotted, and description thereof will not be repeated.

(Embodiment 1)
<Configuration of inspection jig>
As shown in FIGS. 1 to 4, the inspection jig ISJ according to the first embodiment is an inspection jig mounted with the semiconductor chip CHP and subjected to inspection. The inspection jig ISJ includes a metal frame MF, a first metal plate MP1, and a mounting portion PFC. Hereinafter, when the inspection jig ISJ is viewed in a plan view, the side on which the semiconductor chip CHP is mounted is referred to as “up” and the opposite side is referred to as “down”.

  As shown in FIG. 2, the metal frame MF is annular in plan view. In plan view, the shape of the inner peripheral end of the metal frame MF is, for example, a circular shape. In plan view, the shape of the outer peripheral end of the metal frame MF is, for example, a shape that does not have rotational symmetry with respect to the center of the metal frame MF. The material forming the metal frame MF includes a metal material, for example, stainless steel. The metal frame MF is a dicing frame. The structure and dimensions of the metal frame MF are equivalent to, for example, the structure and dimensions of a dicing frame used when a semiconductor substrate is diced into a semiconductor chip CHP mounted on an inspection jig ISJ.

  As shown in FIGS. 1 and 3, the first metal plate MP1 is fixed to the metal frame MF. As shown in FIG. 2, the first metal plate MP <b> 1 is disposed so as to overlap with the inner portion disposed inside the metal frame MF in plan view and the metal frame MF in plan view, and An outer portion arranged to surround the inner portion. The inside portion of the first metal plate MP1 is provided, for example, flat. The upper surface of the outer portion of the first metal plate MP1 is adhered to the lower surface of the metal frame MF by, for example, an adhesive portion AM. The metal frame MF and the first metal plate MP1 may be provided integrally, for example. The material forming the first metal plate MP1 includes a metal material, for example, stainless steel. The thickness of the first metal plate MP1 is smaller than the thickness of the metal frame MF, for example, not less than 20 μm and not more than 300 μm. The rate of change (deformation) of the dimensional value of the first metal plate MP1 after the first metal plate MP1 is heated to 200 ° C. with respect to the dimensional value of the first metal plate MP1 when the first metal plate MP1 is kept at room temperature. Rate) is smaller than that of the dicing tape.

  As shown in FIG. 3, the mounting portion PFC has a first surface SF1 on which a plurality of semiconductor chips CHP are mounted, and a second surface SF2 adhered to the first metal plate MP1. As shown in FIG. 2, in plan view, the mounting portion PFC is arranged so as to overlap with a part of the inner part of the first metal plate MP1, and adheres to the part. In plan view, the mounting portion PFC is arranged so as to overlap, for example, the central portion of the inside portion. In plan view, the center of the mounting portion PFC overlaps, for example, the center of the inside portion. The width W1 of the mounting portion PFC is smaller than the width of the inside portion of the first metal plate MP1. The width W1 of the mounting portion PFC is, for example, equal to the outer diameter of the semiconductor substrate. As shown in FIG. 2, the planar shape of the mounting portion PFC is, for example, a circular shape.

  As shown in FIG. 4, the mounting portion PFC includes a second metal plate MP2, a first adhesive portion DAM1 connected to the second metal plate MP2, and a first adhesive portion DAM1 disposed so as to sandwich the second metal plate MP2. 2 adhesive part DAM2. The first adhesive portion DAM1 has the first surface SF1 and a third surface SF3 opposite to the first surface SF1. The second adhesive portion DAM2 has the second surface SF2 and a fourth surface SF4 located on the opposite side to the second surface SF2. The centers of the second metal plate MP2, the first adhesive portion DAM1, and the second adhesive portion DAM2 in plan view are arranged to overlap.

  The first surface SF1, the second surface SF2, the third surface SF3, and the fourth surface SF4 have adhesiveness. The first surface SF1 is a surface to which the plurality of semiconductor chips CHP are adhered. The second surface SF2 is adhered to the upper surface of the inside portion of the first metal plate MP1. The third surface SF3 is adhered to the upper surface of the second metal plate MP2. The fourth surface SF4 is adhered to the lower surface of the second metal plate MP2.

  The adhesive force of the first surface SF1 is smaller than the adhesive force of the third surface SF3. The adhesive force of the second surface SF2 is smaller than the adhesive force of the fourth surface SF4. The adhesive strength is measured according to the method specified in JIS Z 0237: 2009.

  The ratio of the second adhesive force to the first adhesive force of each of the first adhesive portion DAM1 and the second adhesive portion DAM2 measured by the following measurement method is 50% or more.

  First, according to the method specified in JIS Z 0237: 2009, a plurality of press-bonded bodies of the first adhesive portion DAM1 or the second adhesive portion DM2 and the SUS304 steel plate are prepared. For the pressure bonding, a 2 kg roller is placed on a laminate of the first adhesive portion DAM1 or the second adhesive portion DM2 and the SUS304 steel plate, and the roller is reciprocated once between one end and the other end of the laminate in plan view. It is implemented by doing.

  Next, for some of the pressure-bonded bodies, the test piece was peeled off from the test plate under the condition that the peeling angle was 180 ° and the peeling speed was 300 mm / min according to the method specified in JIS Z 0237: 2009. 1 Measure the adhesive strength.

  Further, another crimped body is heated to 200 ° C. for 2 hours. After the heating, the crimped body cooled to room temperature is subjected to a peeling angle of 180 ° and a peeling speed of 300 mm / min according to the method specified in JIS Z 0237: 2009. Then, the second adhesive force is measured. The ratio of the second adhesive force to the first adhesive force is 50% or more. Note that a tensile tester specified in JIS B 7721 or a tensile tester equivalent thereto is used for measuring the first adhesive strength and the second adhesive strength. The above ratio of the dicing tape is smaller than 50%.

  The deformation rate of each of the first adhesive portion DAM1 and the second adhesive portion DAM2 measured by the following measurement method is 10% or less.

  First, a plurality of pressure-bonded bodies of the first adhesive portion DAM1 or the second adhesive portion DM2 having a plane size of 25 mm square and the SUS304 steel plate are prepared. For the pressure bonding, a 2 kg roller is placed on a laminate of the first adhesive portion DAM1 or the second adhesive portion DM2 and the SUS304 steel plate, and the roller is reciprocated twice between one end and the other end of the laminate in plan view. It is implemented by doing.

  Next, the plane dimensions (first length and first width) and first thickness of the first adhesive portion DAM1 or the second adhesive portion DM2 are measured for some of the pressure-bonded bodies. Further, another crimped body is heated to 200 ° C. for 2 hours. After the heating, the planar size (second length and second width) and second thickness of the first adhesive portion DAM1 or the second adhesive portion DM2 are measured for the pressed body cooled to room temperature. The above-mentioned deformation rate of the dicing tape is more than 10%.

  For the measurement of the planar dimensions, a caliper with a minimum reading value of 0.05 mm specified in JIS B 7507: 2011, a steel tape measure specified in JIS B 7512: 2011, or a metal straight scale specified in JIS B 7516: 2011 is used. Used. For measuring the thickness, a dial gauge specified in JIS B7503: 2011 is used. The ratio of the absolute value of the difference between the first length and the second length to the first length, the ratio of the absolute value of the difference between the first width and the second width to the first width, and the first thickness and the first thickness The ratio of the absolute value of the difference in the second thickness, that is, the deformation rate of each of the first adhesive portion DAM1 and the second adhesive portion DAM2 due to the heating is 10% or less.

  As shown in FIGS. 1 to 3, the planar shapes of the second metal plate MP2, the first adhesive portion DAM1, and the second adhesive portion DAM2 are, for example, the same. The thickness of the second metal plate MP2 is smaller than the thickness of the metal frame MF, for example, not less than 50 μm and not more than 500 μm. The material forming the second metal plate MP2 includes a metal material, for example, stainless steel. The rate of change (deformation) of the dimensional value of the second metal plate MP2 after the second metal plate MP2 is heated to 200 ° C. with respect to the dimensional value of the second metal plate MP2 when the second metal plate MP2 is kept at room temperature. Rate) is smaller than that of the dicing tape.

The thickness of the first adhesive portion DAM1 is, for example, equal to the thickness of the second adhesive portion DM2, and is greater than the thickness of the second metal plate MP2. The thickness of the first adhesive portion DAM1 and the thickness of the second adhesive portion DM2 are, for example, not less than 185 μm and not more than 215 μm. The thickness of the mounting portion PFC, that is, the sum of the thicknesses of the second metal plate MP2, the first adhesive portion DAM1, and the second adhesive portion DAM2 is, for example, less than the sum of the thicknesses of the metal frame MF and the adhesive portion AM. The material forming the first adhesive portion DAM1 and the second adhesive portion DM2 includes a silicon-based adhesive. The first adhesive portion DAM1 and the second adhesive portion DM2 are, for example, Tacsil F20 manufactured by Taconic.
<Method of manufacturing inspection jigs>
The inspection jig ISJ can be manufactured by sticking or adhering each constituent member in an arbitrary order. For example, the metal frame MF and the first metal plate MP1 are bonded via the bonding portion AM. Further, the first adhesive portion DAM1, the second metal plate MP2, and the second adhesive portion DAM2 are adhered to form the mounting portion PFC. Next, the first metal plate MP1 fixed to the metal frame MF and the second adhesive portion DAM2 of the mounting portion PFC are adhered. Thus, the inspection jig ISJ is manufactured.
<Semiconductor chip inspection method>
The semiconductor chip inspection method according to the first embodiment is an inspection method for a semiconductor chip CHP mounted on an inspection jig ISJ. As shown in FIG. 5, in the semiconductor chip inspection method according to the first embodiment, first, a plurality of semiconductor chips CHP mounted on a dicing jig DJ (see FIG. 6) are prepared (step (S10)). The plurality of semiconductor chips CHP are formed by dicing a semiconductor substrate (not shown) mounted on a dicing jig DJ. The dicing jig DJ includes a dicing frame DF2 and a dicing tape DT fixed to the dicing frame DF2. Each semiconductor chip CHP has a fifth surface SF5 adhered to the dicing tape DT, and a sixth surface SF6 located on the opposite side to the fifth surface SF5.

  Next, of the plurality of semiconductor chips CHP mounted on the dicing jig DJ, the plurality of semiconductor chips CHP to be inspected are transferred from the dicing jig DJ to the inspection jig ISJ (step (S20)). 6 to 11 are cross-sectional views for explaining the present step (S20).

  In this step (S20), first, as shown in FIG. 6, an ultraviolet curable tape UVT is prepared. The UV-curable tape UVT has a property that the adhesive strength after being irradiated with ultraviolet light is weakened. The adhesive strength of the UV-curable tape UVT that has not been irradiated with ultraviolet light is stronger than the adhesive strength of the dicing tape DT. The adhesive strength of the ultraviolet-curable tape UVT after being irradiated with ultraviolet light is weaker than the unheated first surface SF1 of the first adhesive portion DAM1.

  Next, as shown in FIG. 7, one ultraviolet curing tape UVT is adhered to each sixth surface SF6 of the plurality of semiconductor chips CHP. At this time, the ultraviolet curable tape UVT is positioned with respect to the dicing jig DJ by an arbitrary method, and is then adhered to the plurality of semiconductor chips CHP. Preferably, the UV-curable tape UVT is bonded to the plurality of semiconductor chips CHP. The pressure bonding condition is set as a condition that does not affect the characteristics of each semiconductor chip CHP.

  Next, as shown in FIG. 8, the dicing jig DJ is separated from the plurality of semiconductor chips CHP adhered to the ultraviolet curing tape UVT. For example, after the dicing tape DT is separated from the dicing frame DF2, the dicing tape DT is separated from the plurality of semiconductor chips CHP. As described above, since the adhesive force of the ultraviolet-curable tape UVT that is not irradiated with ultraviolet light is stronger than the adhesive force of the dicing tape DT, the dicing tape DT is made of a plurality of semiconductor chips CHP adhered to the ultraviolet-curable tape UVT. It is easily torn off.

  Next, as shown in FIG. 9, the fifth surfaces SF5 of the plurality of semiconductor chips CHP adhered to the ultraviolet curing tape UVT are adhered to the first surface SF1 of the mounting portion PFC of the inspection jig ISJ. At this time, the ultraviolet curable tape UVT and the plurality of semiconductor chips CHP are positioned with respect to the inspection jig ISJ by an arbitrary method, and then adhered to the mounting portion PFC. Preferably, the mounting portion PFC is pressure-bonded to the plurality of semiconductor chips CHP. The pressure bonding condition is set as a condition that does not affect the characteristics of each semiconductor chip CHP.

  Next, as shown in FIG. 10, the ultraviolet curing type tape UVT is irradiated with ultraviolet rays UV. The ultraviolet rays UV are emitted from the plurality of UV light sources UVS to the entire region of the ultraviolet-curable tape UVT that is adhered to the plurality of semiconductor chips CHP.

  Next, as shown in FIG. 11, the ultraviolet curing tape UVT is separated from the plurality of semiconductor chips CHP adhered to the mounting portion PFC. As described above, since the adhesive strength of the ultraviolet-curable tape UVT after being irradiated with ultraviolet light is weaker than the first surface SF1 of the unheated first adhesive portion DAM1, the ultraviolet-curable tape UVT is mounted on the mounting portion PFC. Can be easily peeled off from the plurality of semiconductor chips CHP adhered to the substrate. In this manner, the plurality of semiconductor chips CHP to be inspected are simultaneously and collectively transferred from the dicing jig DJ to the above-mentioned inspection jig ISJ.

  Next, as shown in FIG. 5, the plurality of semiconductor chips CHP mounted on the inspection jig ISJ are inspected (step (S30)). This step (S30) includes, for example, a step of inspecting a plurality of semiconductor chips CHP under an environment of 150 ° C. or more (S31) and a step of inspecting a plurality of semiconductor chips CHP under an environment of less than 150 ° C. (S32). Including. In the steps (S31) and (S32), the semiconductor chip CHP mounted on the inspection jig ISJ is inspected using a conventional probe device that inspects the semiconductor chip mounted on the dicing jig. The inspection performed in the above-described steps (S31) and (S32) is, for example, a sampling inspection or a 100% inspection for determining the quality of the semiconductor chip CHP, or an inspection for analyzing the failure of the semiconductor chip CHP which has been determined to be defective. is there. In the step (S31), for example, the semiconductor chip CHP is placed in an environment at 200 ° C. or higher for a plurality of hours. The above step (S31) is performed, for example, as a reliability test. The order of the step (S31) and the step (S32) is not particularly limited.

  In the step (S20), the semiconductor chip CHP may be transferred from the dicing jig DJ to the inspection jig ISJ by a method different from the above method. For example, in the step (S20), a transfer machine (tip sorter) may be used. When a transfer machine is used, only some of the semiconductor chips CHP can be extracted from the plurality of semiconductor chips CHP mounted on the dicing jig DJ and transferred to the inspection jig ISJ. In this case, traceability can be ensured by recording the position of the extracted semiconductor chip CHP on the dicing jig DJ and the position on the inspection jig ISJ.

<Semiconductor device manufacturing method>
The method of manufacturing a semiconductor device according to the first embodiment is a method of manufacturing a semiconductor device using a semiconductor chip CHP mounted on an inspection jig ISJ and inspected by the above inspection method.

  As shown in FIG. 12, in the method for manufacturing a semiconductor device according to the first embodiment, first, a semiconductor substrate on which a plurality of semiconductor elements are arranged is prepared (step (S40)). The plurality of semiconductor elements are formed by performing a film forming step, a processing step, and the like on a semiconductor substrate. Each semiconductor element may have any structure.

  Next, a plurality of semiconductor elements arranged on the semiconductor substrate are inspected (step (S50)). In this step (S50), a so-called on-wafer inspection is performed.

  Next, the inspection method of the semiconductor chip is performed. That is, the above steps (S10) to (S30) are performed using the inspection jig ISJ.

  Next, it is determined whether each semiconductor chip CHP is a non-defective product or a defective product based on the inspection result obtained in the above step (S30) (step (S60)). The criterion for determining each semiconductor chip CHP as a non-defective product or a defective product based on the inspection result is predetermined.

  Next, the semiconductor chip CHP determined to be non-defective in the above step (S60) is assembled to manufacture a semiconductor device (step (S70)). In this step (S70), first, the semiconductor chip CHP is separated from the inspection jig ISJ. The method of separating the semiconductor chip CHP from the inspection jig ISJ may be any method, and examples thereof include the following method.

  First, the mounting part PFC is separated from the first metal plate MP1 of the inspection jig ISJ. As described above, since the adhesive force of the second surface SF2 is smaller than the adhesive force of the fourth surface SF4, the mounting portion PFC is relatively easily peeled off from the first metal plate MP1. Next, as shown in FIG. 13, the mounting portion PFC is bent. As a result, a gap is formed between the semiconductor chip CHP and the first adhesive portion DAM1, so that the semiconductor chip CHP can be relatively easily detached from the mounting portion PFC.

  The semiconductor chip CHP removed from the inspection jig ISJ is assembled into a semiconductor device. The semiconductor device is, for example, a chip size package (CSP) product.

  The inspection jig ISJ from which the semiconductor chip CHP has been removed in the above step (S70) can be reused. For example, the entire inspection jig ISJ can be reused. Further, the metal frame MF, the first metal plate MP1, and the second metal plate MP2 may be reused, and the first adhesive portion DAM1 and the second adhesive portion DAM2 may be re-attached.

<Effects>
The inspection jig ISJ includes a metal frame MF, a first metal plate MP1, and a mounting portion PFC. The metal frame MF is annular in plan view. The first metal plate MP1 is fixed to the metal frame MF, and has an inner portion arranged inside the metal frame MF in plan view. The mounting portion PFC is disposed so as to overlap a part of the inner portion in plan view, and includes a first surface SF1 on which the semiconductor chip CHP is mounted, and a second surface SF2 adhered to the first metal plate MP1. Having.

  Since the metal frame MF of the inspection jig ISJ can have the same configuration as the dicing frame DF2 of the dicing jig DJ, the semiconductor chip CHP mounted on the inspection jig ISJ is the semiconductor chip CHP mounted on the dicing jig DJ. Can be inspected by a probe device.

  Further, since the material forming the first metal plate MP1 includes a metal material, after the inspection jig ISJ is heated to 200 ° C. with respect to the dimension value of the first metal plate MP1 when the inspection jig ISJ is placed at room temperature. Of the first metal plate MP1 is smaller than that of the dicing tape DT.

  Furthermore, since the mounting portion PFC is arranged so as to overlap with a part of the inner portion of the first metal plate MP1 in plan view, the occupied area of the mounting portion PFC in plan view is the same as that of the dicing tape DT in the dicing jig DJ. Smaller than that. Therefore, the deformation ratio of the mounting portion PFC is smaller than that of the dicing tape DT. Further, since the mounting portion PFC is disposed so as to overlap with a part of the inner portion of the first metal plate MP1 in a plan view, for example, in a state where the mounting portion PFC is disposed above the first metal plate MP1. The first metal plate MP1 suppresses the deformation of the mounting portion PFC.

  Thus, the inspection jig ISJ has higher heat resistance than the dicing jig DJ. Therefore, even in a high-temperature environment where the dicing jig cannot maintain the semiconductor chip in an inspectable state, the inspection jig ISJ can maintain the semiconductor chip CHP in an inspectable state. Therefore, the method of inspecting a semiconductor chip using the inspection jig ISJ can inspect the semiconductor chip in a high-temperature environment in the step (S30), so that the inspection is performed for shipping determination, or This is suitable when the inspection is performed to analyze the cause of the failure. The inspection jig ISJ and the above-described inspection method are suitable for, for example, inspection of a semiconductor chip CHP for a vehicle-mounted semiconductor device that requires reliability in a high-temperature environment.

  In the inspection jig ISJ, the mounting portion PFC includes a second metal plate MP2, a first adhesive portion DAM1 connected to the second metal plate MP2, and a second adhesive portion DAM1 and a second adhesive portion DMP1 arranged to sandwich the second metal plate MP2. DAM2. The first adhesive portion DAM1 has a first surface SF1, and the second adhesive portion DAM2 has a second surface SF2.

  The deformation ratio of the mounting portion PFC adhered to the first metal plate MP1 and including the second metal plate MP2 is much smaller than that of the dicing tape DT. Therefore, the inspection jig ISJ has extremely high heat resistance as compared with the dicing jig DJ.

  In the inspection jig ISJ, the first adhesive portion DAM1 further has a third surface SF3 which is located on the opposite side to the first surface SF1 and adheres to the second metal plate MP2. The second adhesive portion DAM2 further has a fourth surface SF4 located on the opposite side to the second surface SF2 and adhering to the second metal plate MP2. The adhesive force of the first surface SF1 is smaller than the adhesive force of the third surface SF3, and the adhesive force of the second surface SF2 is smaller than the adhesive force of the fourth surface SF4.

  With this configuration, the first adhesive portion DAM1, the second metal plate MP2, and the second adhesive portion DAM2 are attached to each other, and the mounting portion PFC is mounted from the first metal plate MP1 while maintaining the integrated state. The portion PFC can be removed, and the semiconductor chip CHP can be removed from the mounting portion PFC. Therefore, the operator can relatively easily remove the semiconductor chip CHP from the inspection jig ISJ.

  In the inspection jig ISJ, the material forming the first adhesive portion DAM1 and the second adhesive portion DAM2 includes a silicon-based adhesive. The ratio of the second adhesive force to the first adhesive force of the first adhesive portion DAM1 and the second adhesive portion DAM2 is sufficiently larger than that of the dicing tape. Therefore, the inspection jig ISJ suppresses the deformation and the decrease in the adhesive strength as compared with the dicing jig DJ, and the semiconductor chip CHP can be used even in a high-temperature environment where the dicing jig cannot hold the semiconductor chip in an inspectable state. Can be held more reliably.

  The width W1 of the mounting portion PFC of the inspection jig ISJ is, for example, equal to the outer diameter of the semiconductor substrate before being singulated into the semiconductor chips CHP mounted on the inspection jig ISJ. In this case, the so-called edge detection of the outer peripheral end of the mounting portion PFC can be performed by the probe device. Therefore, the semiconductor chip CHP mounted on the inspection jig ISJ can be inspected by the probe device in a sequence equivalent to the sequence executed in the on-wafer inspection. In this case, since the inspection is performed after the alignment of the plurality of semiconductor chips CHP mounted on the inspection jig ISJ by the probe device, the occurrence of inspection failure is suppressed.

  Further, in the step (S20) of the inspection method, the ultraviolet curing tape UVT is used as an adhesive member for collectively transferring the plurality of semiconductor chips CHP from the dicing jig DJ to the inspection jig ISJ. The present invention is not limited to this, and a member whose adhesive strength is reduced by any other method may be used for the adhesive member. For example, a thermosetting tape whose adhesive strength is reduced by heating may be used.

(Embodiment 2)
As shown in FIGS. 14 to 19, the inspection jig ISJ2 according to the second embodiment has basically the same configuration as the inspection jig ISJ according to the first embodiment, but includes a mounting portion with respect to the metal frame MF. The difference is that a positioning member POJ for positioning the PFC is further provided. The positioning member POJ includes a spacer portion SP and a plurality (for example, two) of arm portions AM1 and AM2.

  The spacer part SP is disposed between the metal frame MF and the mounting part PFC in plan view. That is, the spacer portion SP is disposed on a region that does not overlap with the mounting portion PFC in the inside portion of the first metal plate MP1. The spacer portion SP is provided annularly so as to surround the mounting portion PFC in a plan view, for example. The outer diameter of the spacer portion SP is smaller than the inner diameter of the metal frame MF. The inner diameter of the spacer part SP is larger than the width W1 of the mounting part PFC (see FIG. 17).

  The plurality of arms AM1 and AM2 are fixed to the spacer SP. The plurality of arms AM1 and AM2 are fitted to the metal frame MF.

  The second metal plate MP2 of the mounting portion PFC has at least a first convex portion PRT1 that projects outside the first adhesive portion DAM1 or the second adhesive portion DAM2 in plan view. Preferably, the second metal plate MP2 has a first protrusion PRT1 and a second protrusion PRT2. The second convex portion PRT2 is arranged at a distance from the first convex portion PRT1 in the circumferential direction of the mounting portion PFC in plan view. The size of the first protrusion PRT1 is, for example, equal to the size of the second protrusion PRT2.

  As shown in FIG. 17, the width W1 of the first adhesive portion DAM1 of the mounting portion PFC is equal to the width of the portion of the second metal plate MP2 where the first protrusion PRT1 and the second protrusion PRT2 are not provided. The width W2 of the second adhesive portion DAM2 is smaller than the width W1 of the first adhesive portion DAM1 of the mounting portion PFC. When the width W1 is 300 mm, a half value W3 of the difference between the width W1 and the width W2 is, for example, 2 mm. Each protrusion amount of the first convex portion PRT1 and the second convex portion PRT2 with respect to the first adhesive portion DAM1, that is, each width of the first convex portion PRT1 and the second convex portion PRT2 in the radial direction with respect to the center O exceeds the width W3. It is.

  The spacer portion SP is provided with a first concave portion CCV1 that accommodates the first convex portion PRT1 in plan view and a second concave portion CCV2 that accommodates the second convex portion PRT2 in plan view. The size of the first recess CCV1 is, for example, equal to the size of the second recess CCV2. The curvature of the inner peripheral ends of the first concave portion CCV1 and the second concave portion CCV2 is larger than the curvature of the inner peripheral end of a portion of the spacer portion SP where the first concave portion CCV1 and the second concave portion CCV2 are not provided. As shown in FIGS. 16 and 18, the first concave portion CCV1 and the second concave portion CCV2 pass, for example, through the center O of the spacer portion SP in plan view and at the midpoint between the arm portions AM1 and AM2. It is provided at a position symmetrical with respect to the passing virtual line. In this case, in a state where the first convex portion PRT1 is accommodated in the first concave portion CCV1 and the second convex portion PRT2 is accommodated in the second concave portion CCV2, the first convex portion PRT1 and the second convex portion PRT2 are, for example, flat surfaces. It is provided at a position symmetrical with respect to an imaginary line passing through the center O of the spacer part SP as viewed and passing through a midpoint between the arm part AM1 and the arm part AM2.

  Preferably, the second metal plate MP2 of the mounting portion PFC further has, for example, a third convex portion PRT3 projecting outside of the first adhesive portion DAM1 or the second adhesive portion DAM2 in plan view. The third convex portion PRT3 is arranged at an interval from each of the first convex portion PRT1 and the second convex portion PRT2 in the circumferential direction. The dimensions of the third projection PRT3 are, for example, equal to or larger than the dimensions of the first projection PRT1 and the second projection PRT2. As shown in FIGS. 16 and 18, the third convex portion PRT3 is provided, for example, at a position facing the second convex portion PRT2 with the center O interposed therebetween.

  The spacer portion SP is provided with a third concave portion CCV3 that accommodates the third convex portion PRT3 in plan view. The dimensions of the third recess CCV3 are, for example, equal to or larger than the dimensions of the first recess CCV1 and the second recess CCV2. As shown in FIGS. 16 and 18, the third concave portion CCV3 is provided at a position facing the second concave portion CCV2 with the center O interposed therebetween, for example.

  As shown in FIG. 14, in the reference state where the mounting portion PFC is arranged at a predetermined position with respect to the metal frame MF by the positioning member POJ, the mounting portion PFC and the positioning member POJ are located between the mounting portion PFC and the positioning member POJ. A gap is formed over the entire circumference of the PFC. That is, in the reference state, between the first convex portion PRT1 and the first concave portion CCV1, between the second convex portion PRT2 and the second concave portion CCV2, and between the third convex portion PRT3 and the third concave portion CCV3. Has a gap formed. The amount of protrusion of each of the first protrusions PRT1 and the second protrusions PRT2 with respect to the first adhesive portion DAM1, that is, the width of each of the first protrusions PRT1 and the second protrusions PRT2 in the radial direction with respect to the center O is determined by the distance The value exceeds half the difference between the inner diameter and the width W1 of the mounting portion PFC.

  Preferably, the first convex portion PRT1, the second convex portion PRT2, and the third convex portion PRT3 are on the virtual line passing through the center O and passing through a midpoint between the arm portion AM1 and the arm portion AM2, and It is not provided on each imaginary line having angles of 45 degrees, 90 degrees, and 135 degrees with respect to the imaginary line at the center O.

  As shown in FIG. 19, each of the plurality of arms AM1 and AM2 has a fourth protrusion PRT4 that protrudes below the spacer SP in a side view. The metal frame MF is provided with a fourth concave portion CCV4 that accommodates the fourth convex portion PRT4 in a side view. Each fourth convex part PRT4 is fitted into each fourth concave part CCV4. Thereby, the positioning member POJ is positioned with respect to the metal frame MF in the circumferential direction and in the radial direction with respect to the circumferential direction.

  The positioning member POJ only needs to be fitted with the metal frame MF when at least the mounting portion PFC is adhered to the first metal plate MP1. The positioning member POJ may be removed from the metal frame MF in, for example, the inspection step (S30).

  Preferably, the plurality of semiconductor chips CHP mounted on the inspection jig ISJ2 are first transferred from the dicing jig DJ to the mounting section PFC by a transfer machine so as to form a predetermined arrangement, and then the mounting section PFC is moved to the first position. It is adhered to the metal plate MP1. Preferably, as shown in FIG. 20, a second positioning member POJ2 having the same structure as the positioning member POJ is fixed to the stage ST in which the mounting portion PFC is held in the transfer machine. The stage ST of the transfer machine may be provided such that the positioning member POJ is detachable. The positioning member POJ may be provided so as to switch between a state of being fitted to the metal frame MF and a state of being fitted to the stage ST of the transfer machine.

<Effects>
Since the inspection jig ISJ2 has basically the same configuration as the inspection jig ISJ, the same effect as the inspection jig ISJ can be obtained.

  Further, since the inspection jig ISJ2 further includes the positioning member POJ, when the mounting portion PFC is adhered to the first metal plate MP1, the mounting portion PFC can be positioned with respect to the metal frame MF. Therefore, for example, when the above-described semiconductor chip inspection method is repeatedly performed while replacing the semiconductor chip CHP mounted on the inspection jig ISJ2, variation in the position of the mounting portion PFC in the inspection jig ISJ2 between inspection lots is suppressed. I have. Therefore, by using the inspection jig ISJ2, for example, a plurality of inspection lots can be executed in the same sequence.

  The positioning member POJ is easily positioned with respect to the metal frame MF and the first metal plate MP1 by fitting the arms AM1 and AM2 to the metal frame MF. Further, the first concave portion CCV1 and the second concave portion CCV2 of the spacer portion SP are concave outward in plan view, and the first convex portion PRT1 and the second convex portion PRT2 of the second metal plate MP2 project outward in plan view. ing. Therefore, when attaching the mounting portion PFC to the first metal plate MP1, the first convex portion PRT1 and the second convex portion PRT2 are easily accommodated in the first concave portion CCV1 and the second concave portion CCV2. Therefore, in the inspection jig ISJ2, the mounting portion PFC is easily positioned with respect to the metal frame MF by the positioning member POJ. According to the positioning member POJ provided with the first convex portion PRT1 and the second convex portion PRT2, the above-described positioning is easily performed as compared with the positioning member POJ provided only with the first convex portion PRT1. In addition, the positioning accuracy is improved.

  Further, in the inspection jig ISJ2, since the third convex portion PRT3 is provided at a position facing the second convex portion PRT2 across the center O, the operator removes the mounting portion PFC from the first metal plate MP1. At this time, the mounting portion PFC can be easily peeled off from the first metal plate MP1 by pinching at least one of the first protrusion PRT1, the second protrusion PRT2, and the third protrusion PRT3.

  The first convex portion PRT1, the second convex portion PRT2, and the third convex portion PRT3 are on the imaginary line passing through the center O and passing through the midpoint between the arm portions AM1 and AM2, and on the imaginary line. On the other hand, it is not provided on each imaginary line having angles of 45 degrees, 90 degrees, and 135 degrees at the center O. A general probe device performs edge detection on an outer peripheral end portion of the semiconductor substrate mounted on a dicing jig, which overlaps with each of the virtual lines. Therefore, when the above-described inspection step (S30) is performed in a sequence equivalent to that of the semiconductor substrate mounted on the dicing jig, the first convex portion PRT1, the second convex portion PRT2, and the third convex portion PRT3 include If it is provided on the line, the edge is not detected, and there is a concern that the inspection may not be performed normally. If the first convex portion PRT1, the second convex portion PRT2, and the third convex portion PRT3 are not provided on each of the imaginary lines, the above concern can be solved.

(Embodiment 3)
As shown in FIG. 21, the inspection jig ISJ3 according to the third embodiment has basically the same configuration as the inspection jig ISJ1 according to the first embodiment, but the mounting part PFC includes the third adhesive part DAM3. , The third adhesive portion DAM3 has a first surface SF1 and a second surface SF2. The material forming the third adhesive portion DAM3 includes a silicon-based adhesive. The third adhesive portion DAM3 is, for example, Tacsil F20 manufactured by Taconic.

  Preferably, the adhesive force of first surface SF1 of inspection jig ISJ3 is smaller than the adhesive force of first surface SF1 of inspection jig ISJ.

  Since the inspection jig ISJ3 has basically the same configuration as the inspection jig ISJ, the same effect as the inspection jig ISJ can be obtained.

  The inspection jigs ISJ, ISJ2, and ISJ3 according to the first to third embodiments are not limited to the semiconductor chip CHP, but may be a semiconductor substrate SUB split into a plurality of pieces as shown in FIG. 22 or a plurality of pieces as shown in FIG. Some small pieces SPS of the broken semiconductor substrate can be mounted. With this configuration, a plurality of semiconductor elements formed on the semiconductor substrate SUB or the small piece SPS on which the inspection jigs ISJ, ISJ2, and ISJ3 are mounted can be inspected in the high-temperature environment using the probe device. .

  As described above, the invention made by the inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

  ISJ, ISJ1, ISJ2, ISJ3 Inspection jig, MF metal frame, MP1 first metal plate, PFC mounting part, MP2 second metal plate, DAM1 first adhesive part, DAM2 second adhesive part, DAM3 third adhesive part, SF1 No. 1 surface, 2nd surface of SF2, 3rd surface of SF3, 4th surface of SF4, POJ positioning member, SP spacer, AM1 arm, CCV1 1st recess, CCV2 2nd recess, CCV3 3rd recess, CCV4 4th recess, PRT1 first convex portion, PRT2 second convex portion, PRT3 third convex portion, PRT4 fourth convex portion, SP2 second spacer portion, CHP semiconductor chip, SF5 fifth surface, SF6 sixth surface, DF2 dicing frame, DJ dicing Jig, DT dicing tape, UVS light source, UVT UV curing tape.

Claims (12)

An inspection jig for mounting a semiconductor chip for inspection,
An annular metal frame in plan view;
A first metal plate fixed to the metal frame and having an inner portion disposed inside the metal frame in plan view;
A first portion on which a semiconductor chip is mounted, which is disposed so as to overlap with a part of the inner portion in a plan view, and a mounting portion having a second surface adhered to the first metal plate; , Inspection jig. The mounting unit includes a second metal plate, a first adhesive unit and a second adhesive unit connected to the second metal plate and arranged to sandwich the second metal plate,
The first adhesive portion has the first surface,
The inspection jig according to claim 1, wherein the second adhesive portion has the second surface. The first adhesive portion further includes a third surface located on the opposite side to the first surface and adhered to the second metal plate,
The second adhesive portion further includes a fourth surface located on the opposite side to the second surface and adhered to the second metal plate,
The adhesive force of the first surface is smaller than the adhesive force of the third surface,
The inspection jig according to claim 2, wherein the adhesive force of the second surface is smaller than the adhesive force of the fourth surface.   The inspection jig according to claim 2, wherein a material forming the first adhesive portion and the second adhesive portion includes a silicon-based adhesive.   The inspection jig according to claim 2, further comprising a positioning member that positions the mounting portion with respect to the metal frame. The positioning member,
A spacer portion disposed between the metal frame and the mounting portion in a plan view,
An arm fixed to the spacer portion and fitted with the metal frame;
The second metal plate has a first protrusion protruding outward from the first adhesive portion or the second adhesive portion in a plan view,
The inspection jig according to claim 5, wherein the spacer portion is provided with a first concave portion that accommodates the first convex portion in a plan view. The second metal plate protrudes outward from the first adhesive portion or the second adhesive portion in plan view, and is spaced apart from the first convex portion in a circumferential direction of the mounting portion in plan view. Further comprising a second convex portion disposed;
The inspection jig according to claim 6, wherein the spacer portion further includes a second concave portion that accommodates the second convex portion in a plan view. The mounting unit includes a third adhesive unit,
The inspection jig according to claim 1, wherein the third adhesive portion has the first surface and the second surface.   The inspection jig according to claim 8, wherein the material forming the third adhesive portion includes a silicon-based adhesive. A step of preparing a semiconductor chip mounted on a dicing jig;
A step of preparing an inspection jig which is provided so as to mount the semiconductor chip and is provided for inspection;
Transferring the semiconductor chip from the dicing jig to the inspection jig,
Inspecting the semiconductor chip mounted on the inspection jig,
The inspection jig has an annular metal frame in plan view,
A first metal plate fixed to the metal frame and having an inner portion disposed inside the metal frame in plan view;
A mounting portion having a first surface on which the semiconductor chip is mounted and arranged so as to overlap with a part of the inner portion in a plan view, and a second surface adhered to the first metal plate; An inspection method for a semiconductor chip. The transferring step includes:
A step of adhering an adhesive member to a sixth surface of the semiconductor chip opposite to the fifth surface adhered to the dicing jig,
Separating the semiconductor chip and the dicing jig adhered to the adhesive member,
Fixing an inspection jig to the fifth surface of the semiconductor chip;
A step of reducing the adhesive strength of the adhesive member,
The method for inspecting a semiconductor chip according to claim 10, further comprising a step of separating the semiconductor chip fixed to the inspection jig and the adhesive member. Dicing a semiconductor substrate mounted on the dicing jig to form the semiconductor chip,
A step of inspecting the semiconductor chip by the method of inspecting a semiconductor chip according to claim 10.

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