JP2019533900A5 - - Google Patents

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Publication number
JP2019533900A5
JP2019533900A5 JP2019516646A JP2019516646A JP2019533900A5 JP 2019533900 A5 JP2019533900 A5 JP 2019533900A5 JP 2019516646 A JP2019516646 A JP 2019516646A JP 2019516646 A JP2019516646 A JP 2019516646A JP 2019533900 A5 JP2019533900 A5 JP 2019533900A5
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JP
Japan
Prior art keywords
test element
substrate
test
support
heater
Prior art date
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Application number
JP2019516646A
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English (en)
Japanese (ja)
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JP2019533900A (ja
JP7104029B2 (ja
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Priority claimed from PCT/EP2017/076028 external-priority patent/WO2018069429A1/en
Publication of JP2019533900A publication Critical patent/JP2019533900A/ja
Publication of JP2019533900A5 publication Critical patent/JP2019533900A5/ja
Application granted granted Critical
Publication of JP7104029B2 publication Critical patent/JP7104029B2/ja
Active legal-status Critical Current
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JP2019516646A 2016-10-14 2017-10-12 試験要素支持体 Active JP7104029B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16193896 2016-10-14
EP16193896.4 2016-10-14
PCT/EP2017/076028 WO2018069429A1 (en) 2016-10-14 2017-10-12 Test element support

Publications (3)

Publication Number Publication Date
JP2019533900A JP2019533900A (ja) 2019-11-21
JP2019533900A5 true JP2019533900A5 (https=) 2020-11-12
JP7104029B2 JP7104029B2 (ja) 2022-07-20

Family

ID=57286206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019516646A Active JP7104029B2 (ja) 2016-10-14 2017-10-12 試験要素支持体

Country Status (6)

Country Link
US (1) US11911768B2 (https=)
EP (1) EP3527051B1 (https=)
JP (1) JP7104029B2 (https=)
KR (1) KR102209470B1 (https=)
CN (1) CN109804718B (https=)
WO (1) WO2018069429A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6819163B2 (ja) * 2016-09-12 2021-01-27 株式会社デンソーウェーブ 絶縁型信号伝達装置、電子機器
GB2557592A (en) * 2016-12-09 2018-06-27 Evonetix Ltd Temperature control device
JP7604815B2 (ja) * 2020-09-10 2024-12-24 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2024201074A1 (en) * 2023-03-31 2024-10-03 Servomex Group Limited Method and apparatus for use in optical gas absorption measurements

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301412A (en) * 1979-10-29 1981-11-17 United States Surgical Corporation Liquid conductivity measuring system and sample cards therefor
JPH03296292A (ja) * 1990-04-13 1991-12-26 Taiyo Yuden Co Ltd 混成集積回路部品
US5522255A (en) 1993-08-31 1996-06-04 Boehringer Mannheim Corporation Fluid dose, flow and coagulation sensor for medical instrument
AU8761098A (en) * 1998-07-29 2000-02-21 Hemosense, Inc. Method and device for measuring blood coagulation or lysis by viscosity changes
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
CA2486451C (en) * 2002-05-31 2008-12-23 Thermo Finnigan Llc Mass spectrometer with improved mass accuracy
EP1443325A1 (en) 2003-02-01 2004-08-04 Roche Diagnostics GmbH System and method for determining a coagulation parameter
KR100577406B1 (ko) 2003-09-17 2006-05-10 박재상 Ｐｃｂ 방식을 이용한 히터 제조방법 및 히터
WO2006058324A1 (en) 2004-11-29 2006-06-01 Heetronix Corp. Thermal attach and detach methods and systems for surface-mounted components
CN101080962A (zh) * 2004-11-29 2007-11-28 希脱鲁尼克斯公司 用于表面安装元件的热附连与分离的方法与系统
EP2203725A4 (en) * 2007-10-15 2011-04-20 Bayer Healthcare Llc METHOD AND ASSEMBLY FOR DETERMINING THE TEMPERATURE OF A TEST SENSOR
DE102013211693B3 (de) * 2013-06-20 2014-07-24 I-For-T Gmbh Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip)

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